Optoelectronic component and method for producing an optoelectronic component

Abstract

Disclosed is an optoelectronic component having - a connection carrier (1), which comprises contact points (3) in a first housing material (2), - an electronic chip (4), which is electrically conductively connected to some of the contact points (3), a second housing material (5), which completely covers the electronic chip (2) and some of the contact points (3), and - at least one optoelectronic chip (6), which is arranged in a cavity (7) of the second housing material (5) and is electrically conductively connected to the electronic chip (4) and some of the contact points (3).

Description

[0001] Description

[0002] OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

[0003] An optoelectronic component and a method for producing an optoelectronic component are specified.

[0004] One problem to be solved is to specify an optoelectronic component that is particularly easy to manufacture.

[0005] A further problem to be solved is to provide a method for producing an optoelectronic component which can be carried out particularly cost-effectively.

[0006] According to at least one embodiment of the optoelectronic component, the optoelectronic component comprises a connection carrier which comprises contact points in a first housing material.

[0007] The connection carrier is, for example, the mechanically supporting component of the optoelectronic component on which the other components of the optoelectronic component are arranged.

[0008] The connection carrier comprises contact points that are electrically conductive. The contact points are, for example, solid metallic bodies and / or metallic layers. The contact points are embedded, at least in places, in the first housing material.

[0009] The first housing material is formed from an electrically insulating material, such as a plastic material. In this case, it is possible, for example, for all contact points of the connection carrier to be mechanically connected to one another by the first housing material. In this case, it is particularly possible for there to be no mechanical connection between the individual contact points apart from the first housing material. In particular, the contact points can then be incorporated in the housing material in an insulated manner from one another and are not directly connected to one another. The contact points are then incorporated in a floating manner in the first housing material.

[0010] According to at least one embodiment, the optoelectronic component comprises an electronic chip that is electrically connected to some of the contact points. The electronic chip can be electrically connected to some of the contact points, for example, by soldering, electrical bonding, and / or wire connections. The electronic chip is, in particular, a chip that is not optoelectronic, i.e., the electronic chip is not intended to emit or detect electromagnetic radiation, but rather, for example, to control further components of the optoelectronic component. In particular, it is possible for the optoelectronic component to comprise precisely one electronic chip.

[0011] According to at least one embodiment of the optoelectronic component, the optoelectronic component comprises a second housing material which completely covers the electronic chip and some of the contact points. The second housing material is arranged, for example, on the side of the connection carrier on which the electronic chip is connected to the contact points, and completely covers the electronic chip on the side facing away from the connection carrier. Furthermore, it is possible for the second housing material to completely cover the electronic chip on its side surfaces as well. The second housing material can, in particular, be in direct contact at some points with the electronic chip and / or with some of the contact points and / or with the first housing material.

[0012] The second housing material is formed from an electrically insulating material, for example from a plastic material. It is possible for the first housing material and the second housing material to be formed from the same material. Furthermore, it is possible for the first housing material and the second housing material to comprise the same base material and, for example, have different fillers. For example, it is possible for the first housing material to have a first color and the second housing material to have a second color that is different from the first. The first housing material can, for example, be black and the second housing material can then, for example, be white.

[0013] According to at least one embodiment of the optoelectronic component, the optoelectronic component comprises at least one optoelectronic chip, preferably two, three or more optoelectronic chips, which are arranged in a cavity of the second housing material and which are electrically conductively connected to the electronic chip and some of the contact points. The at least one optoelectronic chip can be, for example, a light-emitting semiconductor chip, such as a light-emitting diode chip. It is possible, for example, for the optoelectronic component to comprise at least one red light-emitting light-emitting diode chip, at least one blue light-emitting light-emitting diode chip and at least one green light-emitting light-emitting diode chip, which can be arranged together in the cavity. Furthermore, it is possible for the second housing material to have a plurality of cavities and for individual chips to be arranged in individual cavities.

[0014] In the region of a cavity, the connection carrier is not covered by the second housing material. Instead, the first housing material and some of the contact points at the bottom of the cavity are exposed, so that the at least one optoelectronic chip can be electrically connected to contact points there. An electrically conductive connection can then be established between the at least one optoelectronic chip and the electronic chip via some of the contact points.

[0015] According to at least one embodiment of the optoelectronic component, an optoelectronic component is specified with

[0016] - a connection carrier comprising contact points in a first housing material,

[0017] - an electronic chip that is electrically connected to some of the contact points,

[0018] - a second housing material that completely covers the electronic chip and some of the contact points, and

[0019] - at least one optoelectronic chip which is arranged in a cavity of the second housing material and is electrically connected to the electronic chip and some of the contact points. The optoelectronic component is, for example, a so-called RGB component which can emit red, green and blue light during operation. The optoelectronic component can comprise an IC chip as the electronic chip which is provided for controlling the optoelectronic chips. It is possible to use a prefabricated housing with two cavities, wherein the electronic chip and the optoelectronic chips are arranged in different cavities and are connected to one another, for example by wire connections. In this case, the cavity with the electronic chip is encapsulated in a radiation-opaque material in order to protect the electronic chip from the effects of light.The optoelectronic component described here is based, among other things, on the consideration that a manufacturing process can be simplified if one or more cavities only have to be created for the optoelectronic chips and the electronic chip can be covered without first forming a cavity. In this case, a "Molded Interconnect Substrate (MIS)" or a comparable carrier can be used as the connection carrier, which can be provided unstructured, i.e. without a cavity. This means that, for example, additive leadframe construction technology can provide more degrees of design freedom. For example, finer metal structures can be created than is the case with etched leadframe structures.

[0020] This makes it possible to provide optoelectronic components in which the mounting area for the optoelectronic components can be easily separated from the mounting area for the electronic component. This makes it possible to first mount the electronic component on the connection carrier and then to create a cavity for the optoelectronic chips in the cover for the electronic chip, i.e. the second housing material. This makes additional encapsulation for the electronic chip unnecessary, and the optoelectronic and electronic chips can be attached closer to one another, which means, for example, that wire lengths for wire contact are reduced. Furthermore, it is also possible in this way to dispense with wire contact and to design the electronic chip and / or the optoelectronic chips as flip chips.A flip-chip IC, for example, can be used as an electronic chip. Flip-chip LEDs, mini-LEDs, or even micro-LEDs can be used as optoelectronic chips.

[0021] In the component described here, the electronic chip and the optoelectronic chips can be arranged in a common plane—for example, on the top side of the connection carrier. Only the electronic chip, and not the optoelectronic chips, are covered by the second housing material.

[0022] According to at least one embodiment of the optoelectronic component, the optoelectronic component comprises a cover which completely covers the at least one optoelectronic chip and which partially covers the first housing material and the second housing material. For example, the cover can be a potting material. The potting material is then filled in particular into the cavity of the second housing material and is there in direct contact with the optoelectronic chip, the optoelectronic chips, the first housing material, the second housing material and / or some of the contact points. The potting material can in particular be radiation-permeable or transparent. The potting material is formed, for example, with a silicone or an epoxy resin, into which, for example, radiation-scattering or radiation-converting particles can also be introduced at least partially.For example, the second housing material and the potting material are flush with each other on the side facing away from the connection carrier.

[0023] Furthermore, the cover can be a plate, for example a radiation-permeable plate such as a glass plate, or an optical element such as a lens. The cover can in particular be radiation-permeable or transparent. The cover is formed, for example, from a plastic or glass, into which, for example, radiation-scattering or radiation-converting particles can be introduced at least in places. For example, the second housing material and the cover are flush with one another on their side facing away from the connection carrier.

[0024] According to at least one embodiment of the optoelectronic component, the contact points are completely covered laterally by the first and / or the second housing material. This means that in lateral directions which run, for example, parallel to a main extension plane of the optoelectronic component, the contact points are completely covered by the first and / or the second housing material, so that no contact points are exposed on the side surfaces of the optoelectronic component. The contact points are, for example, only exposed on an underside, the mounting side, of the optoelectronic component, where they form connection surfaces for the optoelectronic component. This makes it possible, for example, to fasten the optoelectronic component at the destination using a surface mounting technique and to terminate it in an electrically conductive manner.Furthermore, due to the fact that contact points are not exposed on the side surface of the optoelectronic component, the risk of damage due to electrostatic discharges before or during assembly is reduced.

[0025] According to at least one embodiment of the optoelectronic component, some of the contact points extend completely through the first housing material in the vertical direction, and some of the contact points are completely covered in the vertical direction by the first and / or second housing material. Contact points that extend completely through the first housing material can be used, for example, as vias for electrically contacting and / or controlling the optoelectronic component. Contact points that are completely covered vertically by the first and / or second housing material can be used, for example, for rewiring within the optoelectronic component. The vertical direction runs transversely or perpendicularly to the lateral directions.

[0026] According to at least one embodiment of the optoelectronic component, the electronic chip is provided for controlling the at least one optoelectronic chip. For example, the electronic chip can be connected to a bus system via contact points exposed on the mounting side of the component. The electronic chip can, for example, comprise an integrated circuit or be embodied as an IC chip. The second housing material, which covers the electronic chip, protects the electronic chip, among other things, from external influences and light that can be generated by the optoelectronic chips. As a result, the optoelectronic component described here is particularly resistant to aging.

[0027] According to at least one embodiment of the optoelectronic component, some of the contact points in the cavity are in direct contact with the cover. This is particularly possible if the cover is a potting material. This means that at the bottom surface of the cavity, some of the contact points, where they are not covered by optoelectronic chips, are exposed and can be in direct contact with the potting material. The potting material protects the electrical contact points there from external influences.

[0028] According to at least one embodiment of the optoelectronic component, some of the contact points outside the cavity are in direct contact with the second housing material. The second housing material protects these contact points from external influences.

[0029] According to at least one embodiment of the optoelectronic component, the component comprises at least one further cavity in the second housing material, which is arranged laterally spaced from the cavity, wherein the at least one further cavity comprises at least one further optoelectronic chip.

[0030] According to at least one embodiment of the optoelectronic component, the at least one optoelectronic chip is light-emitting and the at least one further optoelectronic chip is light-detecting. This means that the at least one optoelectronic chip is, for example, a light-emitting diode that, during operation, emits electromagnetic radiation in the wavelength range from infrared light to ultraviolet light. The further optoelectronic chip or the further optoelectronic chips are, for example, a photodetector that detects ambient light and / or reflected light from the at least one optoelectronic chip.The second housing material, which is arranged laterally between the cavity and the further cavity, ensures an optical decoupling between the at least one optoelectronic chip and the at least one further optoelectronic chip, so that no emitted light can reach the detecting chip directly.

[0031] According to at least one embodiment of the optoelectronic component, the first housing material and the second housing material are laterally flush with one another. This means that the two housing materials together form a flat surface, for example, on the side surface of the optoelectronic component.

[0032] Furthermore, a method for producing an optoelectronic component is specified. The method can be used, in particular, to produce an optoelectronic component as described herein. This means that all features described for the optoelectronic component are also disclosed for the method for producing an optoelectronic component, and vice versa.

[0033] According to at least one embodiment of the method, a connection carrier comprising contact points in a first housing material is first provided. The connection carrier is, for example, cuboid-shaped, and the contact points are exposed at least in places on its top and bottom sides. Laterally, the contact points can be partially or completely enclosed by the first housing material.

[0034] According to at least one further embodiment of the method, an electronic chip is electrically connected to some of the contact points. This can be done, for example, by soldering, gluing, and / or wire bonding.

[0035] According to at least one embodiment of the method, a second housing material is applied to the side of the first housing material facing the electrical chip. The second housing material can be produced, for example, by molding. During the application of the second housing material or after the application of the second housing material, a cavity is formed in the second housing material, some of the contact points being exposed in the cavity. For example, the region of the cavity is kept free by a corresponding mold during the application of the second housing material. According to at least one embodiment of the method, an electrically conductive connection of at least one optoelectronic chip is carried out to contact points that are exposed in the cavity. This can be carried out, for example, by soldering, electrically conductive gluing and / or wire bonding.

[0036] According to at least one embodiment of the method, the cavity is covered or filled with a cover.

[0037] According to at least one embodiment of the method, the method comprises the following method steps:

[0038] - Providing a connection carrier comprising contact points in a first housing material,

[0039] - electrically conductive connection of an electronic chip with some of the contact points,

[0040] - applying a second housing material to the side of the first housing material facing the electronic chip,

[0041] - forming a cavity in the second housing material, with some of the contact points in the cavity being exposed,

[0042] - electrically conductive connection of at least one optoelectronic chip with contact points exposed in the cavity,

[0043] - Covering or filling the cavity with a cover.

[0044] The method steps can in particular be carried out in the specified order, wherein the creation of the cavity can in particular take place simultaneously with the application of the second housing material.

[0045] The component described here and the method described here are explained in more detail below using exemplary embodiments and the associated figures. Figures 1A and 1B show schematic views of a connection carrier for an exemplary embodiment of an optoelectronic component described here and of a method described here.

[0046] An embodiment of a method described here is explained in more detail using the schematic representation of Figures 2A, 2B, 2C, 2D, 2E.

[0047] Exemplary embodiments of an optoelectronic component described here are explained in more detail using the schematic representation in Figures 2D, 2E, 3, 4.

[0048] The schematic representations of Figures 5A, 5B, 5C show a connection carrier for embodiments of a method described here and of an optoelectronic component described here.

[0049] An embodiment of a method described here is explained in more detail using the schematic representation of Figures 6A, 6B, 6C, 6D.

[0050] In the embodiments and figures, identical, similar or similarly acting elements can each be provided with the same reference numerals. The elements shown and their relative sizes are not to be regarded as being to scale; rather, individual elements, such as layers, components, devices and regions, can be shown exaggeratedly large for better illustration and / or better understanding. Figures 1A and 1B show schematic views of a connection carrier 1, as can be used for embodiments of optoelectronic components described here in methods described here.

[0051] The connection carrier 1 is shown schematically in Figure 1A in a plan view of its top surface and in Figure 1B in a schematic view of its bottom surface.

[0052] The connection carrier 1 comprises contact points 3 which are introduced into a first housing material 2. The first housing material 2 encloses the contact points 3 laterally, for example completely. Some of the contact points 3 penetrate the connection carrier 1 completely in the vertical direction and are formed as connection surfaces 3a on the bottom surface, compare Figure 1B. The side surfaces of the connection carrier 1 are formed completely by the first housing material 2, so that the contact points 3 are not exposed there. Individual contact points 3 of the connection carrier are mechanically connected to one another exclusively by the first housing material 2 and are not directly connected to one another, so that they are electrically insulated from one another in the connection carrier 1.

[0053] An exemplary embodiment of a method for producing an optoelectronic component is explained in more detail with reference to the schematic representation in Figures 2A to 2E. In the method, the connection carrier 1, which comprises the contact points 3 in the first housing material 2, is first provided. An electronic chip 4 is then electrically conductively connected to some of the contact points 3, see Figure 2A. The connection is made, for example, by soldering and by contact wires 9. In a next method step, Figure 2B, a second housing material 5 is applied to the side of the first housing material 2 facing the electronic chip 4, a cavity 7 being formed in the second housing material 5, in which cavity some of the contact points 3 are exposed.The second housing material 5 is applied, for example, by means of molding and is flush with the connection carrier 1 on the side surfaces, so that the latter is completely covered with the second housing material 5 on its top surface, except for the area of ​​the cavity. The second housing material 5 can be formed from the same base material as the first housing material 2, which results in particularly good adhesion between the two housing materials.

[0054] In the next process step (Figure 2C), optoelectronic chips 6, for example, light-emitting diode chips that emit red, green, and blue light during operation, are electrically connected to contact points 3 in the cavity 7. This can initially be done by soldering or electrically bonding to a common contact point 3 and then continued by corresponding wire connections 9 to other contact points 3; see Figure 2D.

[0055] Finally , the cavity 7 is covered or filled with a cover 8 , for example a potting material , which is shown in the schematic sectional view of Figure 2E , which shows the section along the line AA ' .

[0056] The cavity 7 can, for example, comprise beveled side surfaces. If the second housing material is reflective, for example, the emitted light can be reflected away from the connection carrier 1 at these beveled side surfaces of the cavity 7.

[0057] The schematic representations of Figures 2D and 2E also show a first exemplary embodiment of an optoelectronic component described here, in which the component comprises the connection carrier 1 with the contact points 3 in the first housing material 2. The electronic chip 4 is electrically conductively connected to some of the contact points 3 and is completely covered by the second housing material 5 together with some of the contact points, so that the electronic chip 4 is no longer visible from the outside. The optoelectronic chips 6 are arranged in the cavity 7 of the second housing material 5 and are electrically conductively connected to the electronic chip and some of the contact points. The cover 8, for example a potting material, completely covers the optoelectronic chips and partially covers the first housing material and the second housing material.The contact points 3 are completely covered laterally by the first and / or the second housing material and are therefore not exposed, in particular on the side surfaces of the optoelectronic component.

[0058] Some of the contact points 3 extend completely through the first housing material 2 and serve as through-contacts for contacting the optoelectronic chips and the electronic chip . Some of the contact points are completely covered vertically by the first and / or second housing material and serve for rewiring within the optoelectronic component . The electronic chip is provided for controlling the optoelectronic chips and controls them during operation of the optoelectronic component . The electronic chip is, for example, an IC chip and / or a microcontroller and / or a control unit . Some of the contact points in the cavity are in direct contact with the cover 8 or are covered by it , and some contact points are in direct contact with the second housing material .Overall, the contact points, apart from the underside of the optoelectronic component, are covered with material from the optoelectronic component and are thus particularly well protected against external influences.

[0059] A further exemplary embodiment of an optoelectronic component described here is explained in more detail with reference to the schematic sectional view in Figure 3. In contrast to the exemplary embodiment in Figure 2D, the optoelectronic chips 6 are not contacted via wire connections here, but are designed as flip chips that are directly connected to the corresponding contact points 3 via a surface-mounting technique.

[0060] The schematic representation of Figure 4 shows a further exemplary embodiment of an optoelectronic component described here. In this exemplary embodiment, the optoelectronic component comprises a further cavity 7', in which further optoelectronic chips 6' can be arranged. For example, it is possible for only a single further optoelectronic chip 6' to be arranged in the further cavity 7'. For example, the further optoelectronic chip 6' can then be a radiation-detecting chip, such as a photodiode.

[0061] A connection carrier 1 for a further embodiment of an optoelectronic component described here and of a method described here is explained in more detail with reference to the schematic representations in Figures 5A, 5B, 5C.

[0062] Figure 5A shows schematically a plan view of the top side of the connection carrier 1, Figure 5B shows a middle layer of the connection carrier, and Figure 5C shows a plan view of the bottom surface of the connection carrier, on which the contact points 3 are formed as connection surfaces 3a.

[0063] In conjunction with the schematic representations of Figures 6A, 6B, 6C and 6D, an embodiment of a method described here for producing an optoelectronic component is explained in more detail, in which the connection carrier 1 shown schematically in Figures 5A to 5C is used.

[0064] In contrast to the exemplary embodiment of Figures 2A to 2E, in this exemplary embodiment, the electronic chip 4 is electrically connected to the contact points 3 by means of a surface-mounting technique, for example, by solder balls. The remaining method steps correspond to the method steps described in connection with Figures 2A to 2E.

[0065] Both in the method described in connection with Figures 2A to 2E and in the method described in connection with Figures 6A to 6D, the optoelectronic components are manufactured in particular in a composite assembly, wherein in each of the figures mentioned only a section for the production of a single optoelectronic component is shown. After the cover 8 has been applied or introduced, the composite is separated into a plurality of identical optoelectronic components, wherein the components can be tested before or after separation.

[0066] The features and embodiments described in conjunction with the figures can be combined with one another according to further embodiments, even if not all combinations are explicitly described. Furthermore, the embodiments described in conjunction with the figures can alternatively or additionally comprise further features according to the description of the embodiments.

[0067] This patent application claims priority from German patent application 102024100710 . 9 , the disclosure of which is hereby incorporated by reference .

[0068] The invention is not limited to the embodiments described herein. Rather, the invention encompasses any novel feature and any combination of features, including, in particular, any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the claims or embodiments. List of reference symbols

[0069] 1 connection carrier

[0070] 2 first housing material 3 contact point

[0071] 3 ' additional contact point

[0072] 3a connection surface

[0073] 31 connecting surface

[0074] 4 electronic chip 5 second housing material

[0075] 6 optoelectronic chip

[0076] 6 ' additional optoelectronic chip

[0077] 7 Cavity

[0078] 7 ' further cavity 8 cover

[0079] 9 Contact wire

Claims

Patent claims 1. Optoelectronic component with - a connection carrier (1) comprising contact points (3) in a first housing material (2), - an electronic chip (4) which is electrically connected to some of the contact points (3), - a second housing material (5) which completely covers the electronic chip (2) and some of the contact points (3), and - at least one optoelectronic chip (6) which is arranged in a cavity (7) of the second housing material (5) and is electrically conductively connected to the electronic chip (4) and some of the contact points (3), wherein - some of the contact points (3) in the cavity (7) are in direct contact with a cover (8) and / or - some of the contact points (3) outside the cavity (7) are in direct contact with the second housing material (5).

2. Optoelectronic component according to the preceding claim, wherein the cover (8) completely covers the at least one optoelectronic chip (6) and the cover (8) partially covers the first housing material (2) and the second housing material (5).

3. Optoelectronic component according to one of the preceding claims, in which the contact points (3) are laterally completely covered by the first housing material (2) and / or the second housing material (5).

4. Optoelectronic component according to one of the preceding claims, in which some of the contact points (3) extend vertically completely through the first housing material (2) and some of the contact points (3) are vertically completely covered by the first housing material (2, ) and / or by the second housing material (5).

5. Optoelectronic component according to one of the preceding claims, in which the electronic chip (4) is provided for controlling the at least one optoelectronic chip (6).

6. Optoelectronic component according to one of the preceding claims, wherein the electronic chip (4) comprises an integrated circuit or is an IC chip.

7. Optoelectronic component according to one of the preceding claims, in which at least one of the contact points (3) is in direct contact with the at least one optoelectronic chip (6).

8. Optoelectronic component according to one of the preceding claims, in which the cover (8) is formed by a potting material and at least one of the contact points (3) is exposed on a bottom surface of the cavity (7), where it is not covered by the at least one optoelectronic chip (6), and is in direct contact with the potting material there.

9. Optoelectronic component according to one of the preceding claims, with a further cavity (7') in the second housing material (5), which is arranged laterally spaced from the cavity (7), wherein at least one further optoelectronic chip (6') is arranged in the further cavity (7') of the second housing material (5).

10. Optoelectronic component according to the preceding claim, wherein the at least one optoelectronic chip (6) is light-emitting and the at least one further optoelectronic chip (6') is light-detecting.

11. Optoelectronic component according to the preceding claim, wherein the first housing material (2) and the second housing material (5) are laterally flush with one another.

12. A method for producing an optoelectronic component comprising the steps: - Providing a connection carrier (1) comprising contact points (3) in a first housing material (2), - electrically conductive connection of an electronic chip (4) with some of the contact points (3), - applying a second housing material (5) to the side of the first housing material (2) facing the electronic chip (4), - forming a cavity (7) in the second housing material (5), wherein some of the contact points (3) are exposed in the cavity, - electrically conductive connection of at least one optoelectronic chip (6) to contact points (3) exposed in the cavity (7), - covering or filling the cavity (7) with a cover (8), wherein an optoelectronic component according to one of the Claims 1 to 11.

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