Integrated circuit package

Abstract

The abstract describes an integrated circuit package comprising a first package layer having a first package layer plane, at least one transmission line aligned with the first package layer plane and connected to at least one package terminal, an integrated circuit having at least one integrated circuit terminal, and an electrical connection aligned with the first package layer plane and configured to electrically connect the package terminals and the integrated circuit terminal.

Description

[0001] Integrated circuit package

[0002] Field

[0003] The technology relates to the field of integrated circuit packaging, specifically focusing on the design and implementation of multilayer packages for high-performance electronic systems.

[0004] High-frequency radiofrequency (RF) integrated circuits (ICs) are essential components in various applications, such as wireless communication systems, radar systems, and imaging systems. Packaging these RF ICs, especially at frequencies above 60 GHz, presents significant challenges due to the limitations of conventional packaging technologies. Planar packaging technologies, such as printed circuit boards (PCBs) and low-temperature co-fired ceramics (LTCC), become very lossy in this frequency range. The dimensional tolerances of the different structures in these packaging technologies limit the package performance in terms of frequency and bandwidth. Consequently, the use of planar packaging technologies at high frequencies results in decreased power efficiency, increased noise figure, increased unwanted reflections, and additional heat dissipation, among other issues.

[0005] To address these challenges, waveguide packaging is commonly used at high frequencies. CNC-milling is a typical manufacturing method for waveguide packages. However, CNC-milled waveguide packages are often heavy and bulky, making them less desirable for certain applications and increasing their cost due to the tight tolerances required for CNC-milled waveguides. Moreover, CNC-milled waveguide packages often require an intermediate planar board as an interface between the RFIC and the waveguide channel. This board provides an interface to the DC, RF, and digital terminals of the RFIC, usually via wire bonding, solder bumps, ball grid arrays, or other methods, and an interface to the waveguide channel, usually via field probes, antennas, or other types of transitions. The need for these intermediate boards increases the cost and complexity of waveguide packages, as they require additional assembly steps, integration of more technologies, or supply of more materials. Several prior art approaches have been proposed to address the challenges associated with high-frequency RFIC packaging. One approach involves mounting the RFIC on an intermediate technology, such as a PCB, which then excites a multilayer ridge gap waveguide technology. Another approach involves flip-chip mounting the RFIC on a substrate using solder bumps and transitioning to a substrate integrated waveguide formed by making vias in the substrate. However, these approaches still suffer from limitations, such as low efficiency due to excess power loss in the dielectric and conductors, and increased complexity and cost due to the need for intermediate boards and additional assembly steps.

[0006] Summary

[0007] According to a first aspect of the disclosure, an integrated circuit package is provided. This package includes a first package layer, at least one transmission line aligned with the first package layer plane and connected to at least one package terminal, an integrated circuit having at least one integrated circuit terminal, and an electrical connection aligned with the first package layer plane and configured to electrically connect the package terminals and the integrated circuit terminal. This configuration allows for efficient signal transmission and reduces losses, improving the overall performance of the integrated circuit package.

[0008] Optionally in some examples, the integrated circuit package further includes a second package layer and a third package layer, with the first package layer positioned between the second package layer and the third package layer. This multilayer structure allows for the implementation of various signal processing structures or functions, enhancing the performance and functionality of the package.

[0009] Optionally in some examples, a waveguide is integrated into the second package layer and / or the third package layer. This feature enables efficient and broadband transfer of signals between the waveguide and transmission lines, improving signal integrity and reducing losses in the transmission line connection. Optionally in some examples, the integrated circuit package further includes a package cavity formed in the second package layer and configured to house the integrated circuit. This design simplifies the packaging process and allows for a more compact and lightweight package design, making it suitable for applications where size and weight are factors.

[0010] Optionally in some examples, one or more of the first package layer, the second package layer, the third package layer, a package top surface, or a package bottom surface comprises one or more features configured to eliminate resonances in the package cavity. This feature improves the signal integrity and reduces losses, enhancing the overall performance of the integrated circuit package.

[0011] Optionally in some examples, the at least one integrated circuit terminal is aligned with the first package layer plane. This alignment simplifies the electrical connection between the package terminals and the integrated circuit terminals, reducing the complexity of the packaging process.

[0012] Optionally in some examples, the integrated circuit package further includes a transition configured to transfer a signal between the waveguide and the transmission line. This feature facilitates the integration and assembly of the package by providing a means for transitioning between different types of transmission lines, reducing the complexity and cost of the packaging process.

[0013] Optionally in some examples, the transition comprises a suspended conductor mechanically supported by an anchor point and electrically connected to the integrated circuit terminals via the electrical connection. This configuration allows for efficient signal transmission and reduces losses, improving the overall performance of the integrated circuit package.

[0014] Optionally in some examples, the anchor point is configured to provide DC and RF grounding to the transition. This feature improves the signal integrity and reduces losses, enhancing the overall performance of the integrated circuit package. Optionally in some examples, the transmission line is one or more of: a stripline, a coplanar waveguide, a microstrip, a slotline, or a coaxial transmission line. This variety of transmission lines allows for flexibility in design and application, enabling the integrated circuit package to be used in a wide range of systems and devices.

[0015] Optionally in some examples, the integrated circuit package further includes at least one input / output port configured to allow signals to be routed in and out of the package. This feature allows for efficient signal routing and enhances the functionality of the integrated circuit package.

[0016] Optionally in some examples, one or more of the first package layer, the second package layer, the third package layer, a package top surface, or a package bottom surface comprises one or more features configured to eliminate electromagnetic leakage from the at least one input / output port when the integrated circuit package is connected to an external device. This feature improves the signal integrity and reduces losses, enhancing the overall performance of the integrated circuit package.

[0017] Optionally in some examples, the input / output port is configured to be an in-plane port or an out-of-plane port. This configuration allows for flexibility in design and application, enabling the integrated circuit package to be used in a wide range of systems and devices.

[0018] Optionally in some examples, the integrated circuit package further includes a support or pedestal integrated into the first, second or third package layer and configured to support the integrated circuit. This feature simplifies the packaging process and allows for a more compact and lightweight package design, making it suitable for applications where size and weight are factors.

[0019] Optionally in some examples, the integrated circuit package further includes a second cavity formed in one of the first package layer, the second package layer, or the third package layer and configured to accommodate a printed circuit board. This feature allows for additional functionality such as DC biasing, signal sending / receiving, control, and other suitable functions, enhancing the overall performance of the integrated circuit package. Optionally in some examples, the electrical connection is one or more wire bonds. This type of connection allows for efficient signal transmission and reduces losses, improving the overall performance of the integrated circuit package.

[0020] According to a second aspect of the disclosure, a method of manufacturing an integrated circuit package is provided. This method includes integrating the waveguide and at least one transmission line connected to the waveguide in a first package layer plane of a first package layer, mounting the integrated circuit in a package cavity, and connecting at least one electrical connection between at least one integrated circuit terminal and at least one package terminal connected to the at least one transmission line, wherein the electrical connection is aligned along the first package layer plane.

[0021] Optionally in some examples, the step of integrating further includes integrating a transition connected between the waveguide and the transmission line. This feature facilitates the integration and assembly of the package by providing a means for transitioning between different types of transmission lines, reducing the complexity and cost of the manufacturing process.

[0022] Optionally in some examples, the method includes singulating at least one integrated circuit package from a larger multilayered structure. This step allows for the production of individual devices from a larger structure, increasing the efficiency and costeffectiveness of the manufacturing process.

[0023] Brief Description of the Drawings

[0024] Examples are described in more detail below with reference to the appended drawings. Figure 1 is a perspective view of an integrated circuit package according to some examples;

[0025] Figure 2 is a close up perspective view of an integrated circuit package according to some examples; and

[0026] Figure 3 is a cross-section view of an integrated circuit package according to some examples. Detailed Description

[0027] The detailed description set forth below provides information and examples of the disclosed technology with sufficient detail to enable those skilled in the art to practise the disclosure.

[0028] Figure 1 illustrates an exemplary embodiment of an integrated circuit package 100. The integrated circuit package 100 is a multilayer structure that includes a first package layer 108, a second package layer 110, and a third package layer 112. All the layers of the integrated circuit package 100 are best shown in Figure 3 which shows a crosssection of the integrated circuit package 100.

[0029] The first package layer 108 is positioned between the second package layer 110 and the third package layer 112. The integrated circuit package 100 is designed to house an integrated circuit 104 and facilitate the transmission of signals between the integrated circuit 104 and external devices. The integrated circuit package 100 also includes various features and components that are designed to improve the performance and functionality of the integrated circuit 104, as well as to simplify the integration and assembly of the package.

[0030] In one implementation, the integrated circuit package 100 includes a first package layer 108 that extends along a first package layer plane 114. The first package layer 108 is configured to support various components and features of the integrated circuit package 100, including at least one transmission line 124 and at least one package terminal 102. The transmission line 124 is aligned with the first package layer plane 114 and is electrically connected to the package terminal 102. The package terminal 102 is designed to facilitate the electrical connection 116 between the integrated circuit 104 and the transmission line 124.

[0031] The integrated circuit package 100 also includes an electrical connection 116 that is aligned with the first package layer plane 114. The electrical connection 116 is configured to electrically connect the package terminal 102 and the integrated circuit terminal 106. This configuration allows for efficient and reliable transmission of signals between the integrated circuit 104 and the transmission line 124.

[0032] In some examples, the integrated circuit 104 is positioned within a package cavity 118 that is formed in the second package layer 110. The integrated circuit 104 includes at least one integrated circuit terminal 106 that is designed to facilitate the electrical connection 116 between the integrated circuit 104 and the package terminal 102. The integrated circuit terminal 106 is optionally aligned with the first package layer plane 114, which simplifies the electrical connection 116 between the integrated circuit 104 and the package terminal 102. Whilst the integrated circuit terminal 106 is aligned with the first package layer plane 114 in some examples, in other examples, the integrated circuit terminal 106 is close to the package terminal 102. In this case the integrated circuit terminal 106 is offset from the first package layer plane 114 e.g. by a distance in a direction perpendicular to the first package layer plane 114.

[0033] The integrated circuit 104 can be any type of integrated circuit, such as a radio frequency (RF) integrated circuit, a power integrated circuit, a mixed-signal integrated circuit, a system-on-chip (SoC) integrated circuit, a microcontroller (MCU) integrated circuit, a field programmable gate array (FPGA) integrated circuit, a sensor integrated circuit, or any other suitable type of integrated circuit.

[0034] In some configurations, the first package layer 108 is a planar structure that extends along the first package layer plane 114. The first package layer 108 is designed to support various components and features of the integrated circuit package 100, including the transmission line 124 and the package terminal 102. The first package layer 108 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0035] The transmission line 124 is integrated into the first package layer 108 and is aligned with the first package layer plane 114. The transmission line 124 is electrically connected to the package terminal 102 and is configured to transmit signals between the integrated circuit 104 and external devices. The transmission line 124 can be any type of transmission line, such as a stripline, a coplanar waveguide, a microstrip, a slotline, or a coaxial transmission line. The package terminal 102 is also integrated into the first package layer 108 and is aligned with the first package layer plane 114. The package terminal 102 is electrically connected to the transmission line 124 and is designed to facilitate the electrical connection between the integrated circuit 104 and the transmission line 124.

[0036] In some examples, the integrated circuit package 100 includes an optional feature that is configured to eliminate resonances in the package cavity 118. This optional feature can be integrated into one or more of the first package layer 108, the second package layer 110, the third package layer 112, a package top surface 134, or a package bottom surface 136. The optional feature can be any type of structure or component that is capable of eliminating or reducing resonances in the package cavity 118, such as a damping material, a resonant absorber, a resonant trap, or any other suitable feature.

[0037] In some configurations, the integrated circuit package 100 includes an optional feature that is configured to eliminate electromagnetic leakage from at least one input / output port 130 when the integrated circuit package 100 is connected to an external device. This optional feature can be integrated into one or more of the first package layer 108, the second package layer 110, the third package layer 112, a package top surface 134, or a package bottom surface 136. The optional feature can be any type of structure or component that is capable of eliminating or reducing electromagnetic leakage, such as a shielding material, a leakage prevention structure, a leakage trap, or any other suitable feature.

[0038] In some examples, the integrated circuit package 100 includes a third package layer 112. The third package layer 112 is positioned above the first package layer 108 and the second package layer 110. The third package layer 112 is designed to support various components and features of the integrated circuit package 100, including a pedestal 148 that is configured to support the integrated circuit 104. The third package layer 112 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0039] In some configurations, the integrated circuit package 100 includes a transition 120 that is configured to transfer a signal between the waveguide 122 and the transmission line 124. The transition 120 can be integrated into the first package layer 108 and can be aligned with the first package layer plane 114. The transition 120 can be any type of structure or component that is capable of transferring signals between the waveguide 122 and the transmission line 124, such as a probe, a coupler, a transformer, or any other suitable transition.

[0040] In some examples, the transition 120 includes an E-field probe that is inserted into a waveguide cavity 132. The E-field probe is configured to excite the relevant mode in the waveguide 122, thereby facilitating the transfer of signals between the waveguide 122 and the transmission line 124. The E-field probe can be mechanically supported by one or more an anchor points 128 and can be electrically connected to the integrated circuit terminals 106 via the electrical connection 116.

[0041] In other examples, the transition 120 includes a waveguide back-short and a probe that is shorted to a waveguide wall. This configuration allows the probe to serve as a support for the planar transmission line suspended conductor, thereby facilitating the transfer of signals between the waveguide 122 and the transmission line 124. The waveguide back-short and the probe can be mechanically supported by an anchor point 128 and can be electrically connected to the integrated circuit terminals 106 via the electrical connection 116.

[0042] In some implementations, the integrated circuit package 100 includes a waveguide 122 that is integrated into the second package layer 110 and / or the third package layer 112. The waveguide 122 is configured to route signals to at least one input / output port 130. The waveguide 122 can be any type of waveguide 122, such as a rectangular waveguide, a circular waveguide, a ridged waveguide, a dielectric waveguide, or any other suitable type of waveguide.

[0043] In some configurations, the integrated circuit package 100 includes at least one transmission line 124 that is integrated into at least the first package layer 108 and is aligned with the first package layer plane 114. The transmission line 124 can be electrically connected to the package terminal 102 and is configured to transmit signals between the integrated circuit 104 and external devices. The transmission line 124 can be any type of transmission line, such as a stripline, a coplanar waveguide, a microstrip, a slotline, or a coaxial transmission line.

[0044] In some examples, the integrated circuit package 100 includes an anchor point 128 that is part of at least the first package layer 108 and is configured to support a suspended conductor 126. The anchor point 128 can provide DC and RF grounding for the operation of the transition 120 or can be electrically isolated. The anchor point 128 can be mechanically connected to the suspended conductor 126 and can be galvanically connected or isolated to the first package layer 108.

[0045] In some configurations, the integrated circuit package 100 includes an additional optional feature that is configured to eliminate electromagnetic leakage from the input / output port 130 when the integrated circuit package 100 is connected to an external device. This optional feature can be integrated into one or more of the first package layer 108, the second package layer 110, the third package layer 112, a package top surface 134, or a package bottom surface 136. The optional feature can be any type of structure or component that is capable of eliminating or reducing electromagnetic leakage, such as a shielding material, a leakage prevention structure, a leakage trap, or any other suitable feature.

[0046] In some examples, the integrated circuit package 100 includes yet another optional feature that is configured to eliminate resonances in the package cavity 118. This optional feature can be integrated into one or more of the first package layer 108, the second package layer 110, the third package layer 112, a package top surface 134, or a package bottom surface 136. The optional feature can be any type of structure or component that is capable of eliminating or reducing resonances in the package cavity 118, such as a damping material, a resonant absorber, a resonant trap, or any other suitable feature.

[0047] In some configurations, the integrated circuit package 100 includes a second cavity 150 that is formed in one of the first package layer 108, the second package layer 110, or the third package layer 112. The second cavity 150 serves as a space within the package that can accommodate a printed circuit board (PCB) for DC biasing of the integrated circuit 104. In some examples, the PCB is configured for one or more of DC biasing, sending receiving signals (BB, IF, etc), control (digital signals), or any other suitable function. The PCB can be positioned within the second cavity 150, which is located in one of the first package layer 108, the second package layer 110, or the third package layer 112.

[0048] Figure 2 provides a detailed view of the integrated circuit package 100, focusing on the package terminals 102 and the integrated circuit terminals 106. Figure 2 illustrates the alignment and connection of these components, as well as their relationship to other features of the integrated circuit package 100.

[0049] In some implementations, as mentioned above, the package terminals 102 are integrated into the first package layer 108 and are aligned with the first package layer plane 114. The package terminals 102 are electrically connected to the transmission lines 124, which are also aligned with the first package layer plane 114. This configuration allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices.

[0050] The package terminals 102 are designed to facilitate the electrical connection 116 between the integrated circuit 104 and the transmission lines 124. This is achieved through the use of the electrical connection 116, which is also aligned with the first package layer plane 114. The electrical connection 116 is configured to electrically connect the package terminals 102 and the integrated circuit terminal 106, thereby enabling the transmission of signals between the integrated circuit 104 and the transmission lines 124.

[0051] In some examples, the integrated circuit 104 includes at least one integrated circuit terminal 106 that is designed to facilitate the electrical connection 116 between the integrated circuit 104 and the package terminal 102. The integrated circuit terminal 106 is optionally aligned with the first package layer plane 114, which simplifies the electrical connection 116 between the integrated circuit 104 and the package terminal 102. As mentioned above, the integrated circuit terminals 106 may be offset from the first package layer plane 114. The integrated circuit terminal 106 is electrically connected to the package terminal 102 via the electrical connection 116. The electrical connection 116 is aligned with the first package layer plane 114 and is configured to electrically connect the package terminals 102 and the integrated circuit terminal 106. This configuration allows for efficient and reliable transmission of signals between the integrated circuit 104 and the transmission line 124.

[0052] In some configurations, the integrated circuit package 100 includes an electrical connection 116 that is aligned with the first package layer plane 114. The electrical connection 116 is configured to electrically connect the package terminals 102 and the integrated circuit terminal 106. This configuration allows for efficient and reliable transmission of signals between the integrated circuit 104 and the transmission line 124.

[0053] The electrical connection 116 can be implemented using various techniques, such as wire bonding, thermocompression bonding, direct connection with elastic force (no bonding), solder bump, ball grid array, or any other suitable method. The choice of the method for implementing the electrical connection 116 can depend on various factors, such as the type of the integrated circuit 104, the type of the transmission line 124, the design of the integrated circuit package 100, and the requirements of the application in which the integrated circuit package 100 is used.

[0054] In some examples, the integrated circuit package 100 includes a waveguide 122 that is integrated into the second package layer 110 and / or the third package layer 112. The waveguide 122 includes a waveguide cavity 132 that is designed to route signals to at least one input / output port 130 or to an antenna within the integrated circuit package 100. The waveguide cavity 132 can be any type of cavity that is capable of guiding the propagation of electromagnetic waves, such as a rectangular cavity, a circular cavity, a cavity with ridges, a dielectric cavity, or any other suitable type of cavity.

[0055] The waveguide 122 and the waveguide cavity 132 are designed to implement inpackage low-loss and high-performance components, matching structures, and signal routing. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0056] In some configurations, the waveguide 122 includes a waveguide wall 142 that is designed to confine the electromagnetic waves within the waveguide cavity 132. The waveguide wall 142 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0057] In some examples, the waveguide wall 142 includes a waveguide wall feature 144 that is designed to generate electrical functionality. The waveguide wall feature 144 can be any type of structure or component that is capable of generating electrical functionality, such as a signal impedance matching structure, a signal attenuating structure, a signal leakage preventing structure, a coupling structure, a filter structure, a phase shifter structure, an antenna structure, a polarisation converter structure, or any other suitable feature.

[0058] The waveguide wall feature 144 can be integrated into the waveguide wall 142 and can be designed to improve the performance and functionality of the waveguide 122. This can enhance the signal integrity and reduce losses in the transmission line connection, as well as facilitate the integration and assembly of the integrated circuit package 100.

[0059] In some configurations, the integrated circuit package 100 includes a transition 120 that is configured to transfer a signal between the waveguide 122 and the transmission line 124. The transition 120 includes a transition feature 146 that is designed to generate electrical functionality.

[0060] The transition feature 146 can be any type of structure or component that is capable of generating electrical functionality, such as a signal impedance matching structure, a signal attenuating structure, a signal leakage preventing structure, a coupling structure, a filter structure, a phase shifter structure, an antenna structure, a polarisation converter structure, or any other suitable feature. The transition feature 146 can be integrated into the transition 120 and can be designed to improve the performance and functionality of the transition 120. This can enhance the efficiency and broadband transfer of signals between the waveguide 122 and the transmission line 124, as well as improve the signal integrity and reduce losses in the transmission line connection.

[0061] Turning now to Figure 3, the integrated circuit package 100 will be discussed in more detail.

[0062] In some implementations, the transition 120 includes a suspended conductor 126 that is mechanically supported by an anchor point 128. The suspended conductor 126 is electrically connected to the integrated circuit terminals 106 via the electrical connection 116. This configuration allows for galvanic connection to the integrated circuit terminals 106, thereby facilitating the transfer of signals between the integrated circuit 104 and the transmission line 124.

[0063] The suspended conductor 126 can be made from a variety of materials, such as a conductive material, a semiconductor material, or any other suitable material.

[0064] In some configurations, the integrated circuit package 100 includes a second package layer 110. The second package layer 110 is positioned above the first package layer 108 and below the third package layer 112. The second package layer 110 is designed to support various components and features of the integrated circuit package 100, including a package cavity 118 that is configured to house the integrated circuit 104. The second package layer 110 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0065] In some examples, the second package layer 110 includes a package cavity 118 that is designed to house the integrated circuit 104. The package cavity 118 provides a space within the integrated circuit package 100 where the integrated circuit 104 can be positioned and protected. The package cavity 118 can be any type of cavity that is capable of housing the integrated circuit 104, such as a rectangular cavity, a circular cavity, a planar cavity, a dielectric cavity, or any other suitable type of cavity. In some configurations, the integrated circuit package 100 includes a support or a pedestal 148 that is integrated into the first, second or third package layer 108, 110, 112. The pedestal 148 is designed to support the integrated circuit 104. The pedestal 148 can be any type of structure or component that is capable of supporting the integrated circuit 104, such as a platform, a stand, a mount, a base, a frame, a set of beams, or any other suitable type of support.

[0066] In some examples, the integrated circuit package 100 includes at least one input / output port 130 that is designed to allow signals to be routed in and out of the package. The input / output port 130 can be configured to be an in-plane port or an out-of-plane port, depending on the design of the integrated circuit package 100 and the requirements of the application in which the integrated circuit package 100 is used.

[0067] The input / output port 130 can be any type of port that is capable of routing signals, such as a waveguide flange, a connector, a terminal, a socket, a plug, or any other suitable type of port. The input / output port 130 can be made from a variety of materials, such as a conductive material, a dielectric material, a semiconductor material, or any other suitable material.

[0068] In some configurations, the integrated circuit package 100 includes a package top surface 134 that extends in a plane parallel to the first package layer plane 114. The package top surface 134 is designed to protect the components and features of the integrated circuit package 100, as well as to provide a surface for the attachment of additional components or materials. The package top surface 134 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0069] In some examples, the integrated circuit package 100 includes a package bottom surface 136 that extends in a plane parallel to the first package layer plane 114. The package bottom surface 136 is designed to protect the components and features of the integrated circuit package 100, as well as to provide a surface for the attachment of additional components or materials. The package bottom surface 136 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0070] In some configurations, the integrated circuit package 100 includes a package first side 138 that extends in a plane perpendicular to the first package layer plane 114. The package first side 138 is designed to protect the components and features of the integrated circuit package 100, as well as to provide a surface for the attachment of additional components or materials. The package first side 138 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0071] In some examples, the integrated circuit package 100 includes a package second side 140 that extends in a plane perpendicular to the first package layer plane 114. The package second side 140 is designed to protect the components and features of the integrated circuit package 100, as well as to provide a surface for the attachment of additional components or materials. The package second side 140 can be made from a variety of materials, such as a dielectric material, a conductive material, a semiconductor material, or any other suitable material.

[0072] Whilst reference to the package first side 138, and the package second side 140 are shown in the cross section in Figure 3, the integrated circuit package 100 is a three dimensional object and can comprises other protective surfaces and sides in addition to the package first side 138, and the package second side 140. For example, the integrated circuit package 100 comprises one or more additional sides or surfaces that extend in a plane perpendicular to the first layer plane 114 which are not shown in Figure 3.

[0073] In some implementations, the integrated circuit package 100 is manufactured using various manufacturing technologies. These manufacturing technologies can include photolithography, silicon micromachining, laser etching, laser cutting, glass patterning, stamping, metal etching, CNC-machining, plastic moulding, electroplating, and other suitable manufacturing technologies. These manufacturing technologies can provide various advantages, such as low cost, large volume production, and excellent tolerances. In some examples, the method of manufacturing the integrated circuit package 100 includes integrating the waveguide 122 and at least one transmission line 124 connected to the waveguide 122 in a first package layer plane 114 of a first package layer 108. This integration can be achieved using various techniques, such as etching, applying a conductive coating, bonding, applying surface treatments, laser etching or cutting, applying a protective coating or encapsulation material, adding alignment features, implementing surface roughening or texturing, applying metallization or plating, conducting post-processing steps such as cleaning, testing, and inspection of the package, or any other suitable method.

[0074] The integration of the waveguide 122 and the transmission line 124 in the first package layer plane 114 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0075] In some implementations, the waveguide 122 and the transmission line 124 are aligned with the first package layer plane 114. This alignment can be achieved using various techniques, such as etching, applying a conductive coating, bonding, applying surface treatments, laser etching or cutting, applying a protective coating or encapsulation material, adding alignment features, implementing surface roughening or texturing, applying metallization or plating, conducting post-processing steps such as cleaning, testing, and inspection of the package, or any other suitable method.

[0076] The alignment of the waveguide 122 and the transmission line 124 with the first package layer plane 114 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0077] In some configurations, the transmission line 124 is connected to the package terminals 102. This connection can be achieved using various techniques, such as building the transmission line and package terminals out of the same substrate material, bonding, soldering, welding, crimping, press-fitting, or any other suitable method.

[0078] The connection of the transmission line 124 to the package terminals 102 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0079] In some examples, the method of manufacturing the integrated circuit package 100 includes mounting the integrated circuit 104 in a package cavity 118. This mounting can be achieved using various techniques, such as thermo-compression bonding, ultrasonic bonding, soldering, welding, adhesive bonding, press-fitting, or any other suitable method.

[0080] The mounting of the integrated circuit 104 in the package cavity 118 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0081] In some configurations, the integrated circuit 104 is placed in the package cavity 118. This placement can be achieved using various techniques, such as manual placement, robotic placement, or any other suitable method.

[0082] The placement of the integrated circuit 104 in the package cavity 118 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0083] In some examples, the method of manufacturing the integrated circuit package 100 includes connecting an electrical connection 116 between the integrated circuit terminals 106 and the package terminals 102. This connection can be achieved using various techniques. The connection of the electrical connection 116 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0084] In some configurations, the electrical connection 116 is aligned with the first package layer plane 114. This alignment can be achieved using various techniques, such as etching, applying a conductive coating, bonding, applying surface treatments, laser etching or cutting, applying a protective coating or encapsulation material, adding alignment features, implementing surface roughening or texturing, applying metallization or plating, conducting post-processing steps such as cleaning, testing, and inspection of the package, or any other suitable method.

[0085] The alignment of the electrical connection 116 with the first package layer plane 114 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0086] In some examples, the method of manufacturing the integrated circuit package 100 includes connecting the integrated circuit terminals 106 to the package terminals 102. This connection can be achieved using various techniques, such as soldering, welding, crimping, press-fitting, or any other suitable method.

[0087] The connection of the integrated circuit terminals 106 to the package terminals 102 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0088] In some configurations, the method of manufacturing the integrated circuit package 100 includes integrating a transition 120 into the first package layer 108. The transition 120 is designed to transfer a signal between the waveguide 122 and the transmission line 124. This integration can be achieved using various techniques, such as etching, applying a conductive coating, bonding, applying surface treatments, laser etching or cutting, applying a protective coating or encapsulation material, adding alignment features, implementing surface roughening or texturing, applying metallization or plating, conducting post-processing steps such as cleaning, testing, and inspection of the package, or any other suitable method.

[0089] The integration of the transition 120 into the first package layer 108 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0090] In some implementations, the transition 120 is connected between the waveguide 122 and the transmission line 124. This connection can be achieved using various techniques, such as soldering, welding, crimping, press-fitting, or any other suitable method.

[0091] The connection of the transition 120 between the waveguide 122 and the transmission line 124 allows for efficient and reliable transmission of signals between the integrated circuit 104 and external devices. This can improve the performance and functionality of the integrated circuit package 100, as well as simplify the integration and assembly of the package.

[0092] In some examples, the method of manufacturing the integrated circuit package 100 includes singulating at least one integrated circuit package 100 from a larger multilayered structure. This singulation can be achieved using various techniques, such as cutting, dicing, drilling, sawing, breaking, or any other suitable method.

[0093] The singulation of the integrated circuit package 100 allows for the production of individual devices from a larger multilayered structure. This can improve the efficiency and cost-effectiveness of the manufacturing process, as well as facilitate the distribution and use of the individual devices. In some configurations, the integrated circuit package 100 is singulated from a larger multilayered structure. This singulation can be achieved using various techniques, such as cutting, dicing, drilling, sawing, breaking, or any other suitable method.

[0094] The singulation of the integrated circuit package 100 from a larger multilayered structure allows for the production of individual devices from a larger structure. This can improve the efficiency and cost-effectiveness of the manufacturing process, as well as facilitate the distribution and use of the individual devices.

[0095] In some examples, the method of manufacturing the integrated circuit package 100 includes determining the desired dimensions and shape of the singulated devices. This determination can be based on various factors, such as the design of the integrated circuit package 100, the requirements of the application in which the integrated circuit package 100 is used, or any other suitable factors.

[0096] The determination of the desired dimensions and shape of the singulated devices allows for the production of devices that meet specific requirements or specifications. This can improve the performance and functionality of the integrated circuit package 100, as well as facilitate the integration and assembly of the package.

[0097] In some configurations, the method of manufacturing the integrated circuit package 100 includes selecting a suitable singulation method based on the package material and desired precision. This selection can be based on various factors, such as the type of the package material, the desired precision of the singulation, the design of the integrated circuit package 100, the requirements of the application in which the integrated circuit package 100 is used, or any other suitable factors.

[0098] The selection of a suitable singulation method allows for the efficient and precise singulation of the integrated circuit package 100. This can improve the performance and functionality of the integrated circuit package 100, as well as facilitate the integration and assembly of the package.

[0099] In some examples, the method of manufacturing the integrated circuit package 100 includes inspecting the singulated devices for any defects or irregularities. This inspection can be performed using various techniques, such as visual inspection, mechanical inspection, electrical inspection, or any other suitable method.

[0100] The inspection of the singulated devices allows for the detection and correction of any defects or irregularities in the devices. This can improve the quality and reliability of the integrated circuit package 100, as well as facilitate the distribution and use of the individual devices.

[0101] In some implementations, the integrated circuit package 100 is manufactured using various manufacturing technologies that allow for low cost, large volume production. These manufacturing technologies can include photolithography, silicon micromachining, laser etching, laser cutting, glass patterning, stamping, metal etching, plastic moulding, electroplating, and other suitable manufacturing technologies.

[0102] The use of these manufacturing technologies allows for the efficient and cost-effective production of a large volume of integrated circuit packages 100. This can improve the performance and functionality of the integrated circuit package 100, as well as facilitate the distribution and use of the individual devices.

[0103] In some configurations, the manufacturing technologies used to produce the integrated circuit package 100 are capable of achieving excellent tolerances. These manufacturing technologies can include photolithography, silicon micromachining, laser etching, laser cutting, glass patterning, stamping, metal etching, plastic moulding, electroplating, and other suitable manufacturing technologies.

[0104] The use of these manufacturing technologies allows for the production of integrated circuit packages 100 with precise dimensions and shapes, which can improve the performance and functionality of the integrated circuit package 100. This can also facilitate the integration and assembly of the package, as well as the connection of the package to external devices.

[0105] In some examples, specific manufacturing techniques are used to produce the integrated circuit package 100. These manufacturing techniques can include etching the layers to create cavities for the waveguide 122 structures, applying a conductive coating to the layers to create the planar transmission lines 124, bonding the layers together using an adhesive or other bonding method, applying surface treatments to improve conductivity or surface roughness, laser etching or cutting the layers to create openings for the input / output ports, applying a protective coating or encapsulation material to the package surfaces, adding alignment features to ensure accurate alignment of the layers during assembly, implementing surface roughening or texturing to improve bonding strength between the layers, applying metallization or plating to create electrical connections 116 between the layers and the integrated circuit terminals 106, and conducting post-processing steps such as cleaning, testing, and inspection of the package.

[0106] The use of these specific manufacturing techniques allows for the efficient and precise production of the integrated circuit package 100. This can improve the performance and functionality of the integrated circuit package 100, as well as facilitate the integration and assembly of the package.

[0107] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises," "comprising," "includes," and / or "including" when used herein specify the presence of stated features, integers, actions, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, actions, steps, operations, elements, components, and / or groups thereof.

[0108] It will be understood that, although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element without departing from the scope of the present disclosure. Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe a relationship of one element to another element as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0109] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0110] It is to be understood that the present disclosure is not limited to the aspects described above and illustrated in the drawings; rather, the skilled person will recognize that many changes and modifications may be made within the scope of the present disclosure and appended claims. In the drawings and specification, there have been disclosed aspects for purposes of illustration only and not for purposes of limitation, the scope of the disclosure being set forth in the following claims.

Claims

Claims1. An integrated circuit package (100) comprising: a first package layer (108) having a first package layer plane (114); at least one transmission line (124) aligned with the first package layer plane (114) and connected to at least one package terminal (102); an integrated circuit (104) having at least one integrated circuit terminal (106); and an electrical connection (116) aligned with the first package layer plane (114) and configured to electrically connect the package terminals (102) and the integrated circuit terminal (106).

2. The integrated circuit package (100) according to claim 1 , further comprising a second package layer (110) and a third package layer (112), wherein the first package layer (108) is positioned between the second package layer (110) and the third package layer (112).

3. The integrated circuit package (100) according to claim 2 wherein a waveguide (122) is integrated into the second package layer (110) and I or the third package layer (112).

4. The integrated circuit package (100) according to claims 2 or 3, further comprising a package cavity (118) formed in the second package layer (110) and configured to house the integrated circuit (104).

5. The integrated circuit package (100) according to any of claims 3 or 4 wherein the one or more of the first package layer (108), the second package layer (110), the third package layer (112), a package top surface (134), or a package bottom surface (136) comprises one or more features configured to eliminate resonances in the package cavity (118).

6. The integrated circuit package (100) according to any of claims 1 to 5 wherein the at least one integrated circuit terminal (106) is aligned with the first package layer plane (114).

7. The integrated circuit package (100) according to any one of claims 1 to 6, further comprising a transition (120) configured to transfer a signal between the waveguide (122) and the transmission line (124).

8. The integrated circuit package (100) according to claim 7, wherein the transition (120) comprises a suspended conductor (126) mechanically supported by an anchor point (128) and electrically connected to the integrated circuit terminals (106) via the electrical connection (116).

9. The integrated circuit package (100) according to claim 8, wherein the anchor point (128) is configured to provide DC and RF grounding to the transition (120).

10. The integrated circuit package (100) according to any one of claims 1 to 9, wherein the transmission line (124) is one or more of: a stripline, a coplanar waveguide, a microstrip, a slotline, or a coaxial transmission line.11 . The integrated circuit package (100) according to any one of claims 1 to 10, further comprising at least one input / output port (130) configured to allow signals to be routed in and out of the package.

12. The integrated circuit package (100) according to claim 11 wherein the one or more of the first package layer (108), the second package layer (110), the third package layer (112), a package top surface (134), or a package bottom surface (136) comprises one or more features configured to eliminate electromagnetic leakage from the at least one input / output port (130) when the integrated circuit package (100) is connected to an external device.

13. The integrated circuit package (100) according to claims 11 or 12, wherein the input / output port (130) is configured to be an in-plane port or an out-of-plane port.

14. The integrated circuit package (100) according to any one of claims 1 to 13, further comprising a support or a pedestal (148) integrated into the first, second, or third package layer (112) and configured to support the integrated circuit (104).

15. The integrated circuit package (100) according to any one of claims 1 to 14, further comprising a second cavity (150) formed in one of the first package layer (108), the second package layer (110), or the third package layer (112) and configured to accommodate a printed circuit board (PCB).

16. The integrated circuit package (100) according to any one of claims 1 to 15 wherein the electrical connection (116) is one or more wire bonds.

17. A method of manufacturing an integrated circuit package (100) comprising: integrating the waveguide (122) and at least one transmission line (124) connected to the waveguide (122) in a first package layer plane (114) of a first package layer (108); mounting the integrated circuit (104) in a package cavity (118); and connecting at least one electrical connection (116) between at least one integrated circuit terminal (106) and at least one package terminal (102) connected to the at least one transmission line, wherein the electrical connection (116) is aligned along the first package layer plane (114).

18. The method according to claim 17 wherein the step of integrating further comprises integrating a transition (120) connected between the waveguide (122) and the transmission line (124).

19. The method according to claims 17 or 18 wherein the method comprises singulating at least one integrated circuit package (100) from a larger multilayered structure.

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