Shielding structure and electronic apparatus

Abstract

Embodiments of the present application relate to the technical field of electronic apparatuses, and provide a shielding structure and an electronic apparatus. The electronic apparatus comprises a circuit board, a shielding frame, a first shielding layer, and at least one second shielding layer. A plurality of electronic devices are provided on the surface of the circuit board. The shielding frame is connected to the surface of the circuit board. The first shielding layer covers and is connected to the side of the shielding frame distant from the circuit board. The circuit board, the first shielding layer and the shielding frame define a first shielding cavity. The plurality of electronic devices are arranged in the first shielding cavity. The at least one second shielding layer and the first shielding layer are stacked. The at least one second shielding layer is arranged in the first shielding cavity and disposed on the side of at least one electronic device distant from the circuit board. The second shielding layer is coupled to the circuit board. According to the embodiments of the present application, the shielding capability against electromagnetic interference can be improved without increasing the planar design space of the circuit board.

Description

Shielding structures and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on January 16, 2024, with application number 202410066099.9 and application name “Shielding Structure and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to a shielding structure and electronic equipment. Background Art

[0003] With the rapid development of electronic technology, electronic devices have more and more functions, and the integration of electronic devices in electronic devices is getting higher and higher.

[0004] In order to ensure smooth data transmission in electronic devices, it is necessary to improve electromagnetic interference in the environment in which the electronic devices are located, for example, it is necessary to reduce mutual interference between electronic devices.

[0005] As the integration of electronic devices gradually increases, the interference problem between electronic devices in electronic equipment needs to be solved urgently.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a shielding structure and an electronic device, the purpose of which is to improve the shielding capability of the electronic device against electromagnetic interference without increasing the planar design space.

[0008] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0009] In a first aspect, an electronic device is provided. The electronic device includes a circuit board, a shielding frame, a first shielding layer, and at least one second shielding layer.

[0010] A plurality of electronic devices are provided on the surface of the circuit board. A shielding frame is connected to the surface of the circuit board. A first shielding layer covers and is connected to a side of the shielding frame away from the circuit board, wherein the circuit board, the first shielding layer, and the shielding frame enclose a first shielding cavity; the plurality of electronic devices are located within the first shielding cavity. At least one second shielding layer is stacked on the first shielding layer; at least one second shielding layer is disposed within the first shielding cavity, the second shielding layer being disposed on a side of at least one electronic device away from the circuit board, and an orthographic projection of the first shielding layer on the circuit board at least partially overlaps with an orthographic projection of the at least one electronic device on the circuit board; and the second shielding layer is coupled to the circuit board.

[0011] In the electronic device provided in the embodiment of the present application, by arranging at least one second shielding layer in the first shielding cavity, at least one second shielding cavity with a smaller volume can be formed in the first shielding cavity. On the one hand, adding a second shielding cavity with a smaller volume can increase the cutoff frequency of the electronic device and improve the shielding effect of the electronic device. On the other hand, interference signals such as electromagnetic waves can be greatly attenuated during transmission in multiple cavities (including the first shielding cavity and the second shielding cavity), which can also effectively improve the shielding effect of the electronic device against interference signals such as electromagnetic waves.

[0012] In addition, the second shielding layer, which is grounded and has a smaller area, has a better suppression effect on lower-frequency electromagnetic interference. That is, on the basis of the first shielding cavity shielding the overall multiple electronic devices, the second shielding layer can additionally increase the shielding effect on low-frequency electromagnetic interference. When the integration of electronic devices becomes higher and higher and the low-frequency interference signals generated by electronic devices increase, the embodiment of the present application can shield low-frequency electromagnetic interference, which is conducive to achieving shielding of electromagnetic waves in the entire frequency band, thereby greatly improving the overall shielding effect of electronic equipment against electromagnetic interference.

[0013] In addition, in the electronic device provided in the embodiment of the present application, the technical means of providing at least one second shielding layer to improve the shielding effect of the electronic device does not increase the design space occupied by the second shielding layer in the direction parallel to the surface of the circuit board, thereby avoiding squeezing out the design space for other structures such as electronic devices on the circuit board, which is conducive to the miniaturization design of the electronic device.

[0014] In a possible implementation of the first aspect, the second shielding layer includes a plurality of first sublayers spaced apart in a first direction; the first direction is parallel to the circuit board; the first sublayer is arranged on a side of at least one electronic device away from the circuit board, and the orthographic projection of the first sublayer on the circuit board at least partially overlaps with the orthographic projection of at least one electronic device on the circuit board, and each first sublayer is coupled to the circuit board.

[0015] By providing a plurality of first sub-layers, the second shielding cavity can be further divided into a plurality of shielding cavities with smaller volumes, thereby further increasing the cutoff frequency and optimizing the shielding effect of the electronic device.

[0016] In a possible implementation of the first aspect, at least two adjacent first sub-layers are electrically connected to each other, thereby solving the resonance problem between the two adjacent first sub-layers and improving the reliability of the electronic device.

[0017] In a possible implementation of the first aspect, at least a portion of a side edge of the second shielding layer contacts the shielding frame. By providing direct contact between the second shielding layer and the shielding frame, an electrical connection between the second shielding layer and the circuit board can be achieved through the shielding frame. That is, direct contact with the shielding frame enables grounding of the second shielding layer, eliminating the need for a separate grounding structure and reducing the difficulty of manufacturing the electronic device.

[0018] In a possible implementation of the first aspect, the electronic device further includes a first connecting portion. One end of the first connecting portion is electrically connected to the second shielding layer, and the other end is electrically connected to the circuit board. That is, the second shielding layer can be electrically connected to the circuit board via the first connecting portion to achieve grounding.

[0019] In a possible implementation of the first aspect, the electronic device further includes a second connecting portion, one end of the second connecting portion being electrically connected to the second shielding layer, and the other end being electrically connected to the shielding frame. That is, the second shielding layer passes through the second connecting portion and the shielding frame, and is then electrically connected to the circuit board for grounding.

[0020] In a possible implementation of the first aspect, the second shielding layer includes at least one connection point, which is the portion of the second shielding layer that connects to the circuit board. If the second shielding layer includes multiple connection points, the multiple connection points are located on either side of the electronic device covered by the second shielding layer in a first direction parallel to the circuit board. This allows the second shielding cavity formed by the second shielding layer to cover the electronic device corresponding to the electromagnetic interference to be shielded.

[0021] In possible implementations of the first aspect, the first shielding layer is spaced apart from at least one second shielding layer; and / or, if the electronic device includes multiple second shielding layers, at least two adjacent second shielding layers are spaced apart. This allows the first shielding cavity and the second shielding cavity to be independent of each other, i.e., each of the first shielding cavity and the second shielding cavity can independently perform a shielding function, maximizing the use of their respective shielding functions and further improving the overall electromagnetic shielding effectiveness of the electronic device.

[0022] In a possible implementation of the first aspect, the electronic device further includes a first insulating layer. The first insulating layer is provided between the second shielding layer and the first shielding layer.

[0023] That is, the first shielding layer and the second shielding layer are insulated, so that the first shielding cavity and the second shielding cavity are independent of each other, that is, the first shielding cavity and the second shielding cavity each play a shielding role independently, thereby maximizing the utilization of their respective shielding functions and further improving the overall electromagnetic shielding effect of the electronic equipment.

[0024] In a possible implementation of the first aspect, when the shielding structure includes multiple second shielding layers, the electronic device further includes a fourth insulating layer, where the fourth insulating layer is disposed between at least two adjacent second shielding layers. The effect of the fourth insulating layer insulating the two adjacent second shielding layers is similar to that of the first insulating layer in the aforementioned embodiment.

[0025] In a possible implementation of the first aspect, the electronic device further includes a third shielding layer and a second insulating layer. The third shielding layer is disposed on one side of the second shielding layer, and the third shielding layer and the second shielding layer at least partially overlap in a direction perpendicular to the circuit board. The third shielding layer is electrically connected to the circuit board. The second insulating layer is disposed between the second shielding layer and the third shielding layer.

[0026] By setting a third shielding layer and setting the second shielding layer to achieve capacitive coupling connection with the circuit board through the third shielding layer, the capacitance of the capacitor structure formed by the second shielding layer and the third shielding layer can be adjusted by adjusting the area of ​​the third shielding layer, thereby forming a frequency selection effect, and shielding and suppressing electromagnetic interference of a specific frequency, so that electronic equipment can be flexibly used in different scenarios.

[0027] In a possible implementation of the first aspect, when the second shielding layer includes multiple first sublayers: each first sublayer at least partially overlaps with the third shielding layer in a direction perpendicular to the circuit board; or, the third shielding layer includes multiple second sublayers spaced apart in the first direction, and the first sublayers at least partially overlap with the corresponding second sublayers in a direction perpendicular to the circuit board; the first direction is parallel to the circuit board.

[0028] That is, multiple first sub-layers can respectively correspond to separate second sub-layers, thereby forming multiple independent capacitor structures, avoiding mutual influence during the frequency selection process, and further improving the flexibility of frequency selection of electronic equipment.

[0029] In a possible implementation of the first aspect, the shielding frame includes a first bracket; the first bracket is disposed around a plurality of electronic components; a first side of the first bracket is connected to a surface of a circuit board, and a second side of the first bracket is electrically connected to a first shielding layer; the first side and the second side are disposed opposite each other. The first bracket is provided with at least one first window, the first window extending through the first bracket in a direction parallel to the circuit board and disconnecting the first side of the first bracket.

[0030] That is, the surface of the first bracket facing the circuit board is not entirely in contact with the circuit board, wherein part of the surface is recessed in the direction away from the circuit board to form a first window, thereby exposing part of the circuit board, thereby reducing the board design space of the circuit board occupied by the shielding frame, so that more components can be arranged on the circuit board, which is conducive to the miniaturization design of the circuit board and even the electronic equipment.

[0031] In a possible implementation of the first aspect, the shielding frame further includes a second bracket, the second bracket is connected to the second side of the first bracket, and the first bracket is connected to the first shielding layer through the second bracket.

[0032] In a possible implementation of the first aspect, a ratio of a sum of dimensions of at least one first window along the extension path of the first bracket to a dimension of the first bracket along the extension path is greater than or equal to 0.7 and less than 1.

[0033] That is, the first window in the first bracket occupies 70% or more of the annular area enclosed by the first bracket, thereby significantly reducing the design space of the circuit board occupied by the shielding frame.

[0034] In a possible implementation of the first aspect, the area of ​​the second shielding layer is less than or equal to half the area of ​​the first shielding layer.

[0035] In a possible implementation manner of the first aspect, the conductivity of the second shielding layer is greater than the conductivity of the first shielding layer.

[0036] In a possible implementation of the first aspect, the conductivity of the second shielding layer is greater than or equal to 5×10 5 S / m; and / or, the conductivity of the first shielding layer is 0.06×10 5 S / m~5×10 5 S / m.

[0037] That is, the material of the first shielding layer located on the outer layer can be set to a high-loss material, and the inner second shielding layer can be set to a high-conductivity material. On the one hand, the first shielding layer with high loss characteristics can suppress the occurrence of resonance problems. On the other hand, when the electromagnetic interference generated by the electronic device reaches the second shielding layer, the second shielding layer with high conductivity can block most of the electromagnetic interference. The remaining electromagnetic interference leaks into the first shielding layer and can be dissipated during the transmission process in the high-loss first shielding layer. Under the joint action of the high-loss first shielding layer and the highly conductive second shielding layer, the shielding effect of electromagnetic interference in electronic equipment is greatly improved.

[0038] In a possible implementation of the first aspect, the thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

[0039] In a possible implementation of the first aspect, the thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer is greater than or equal to 50 W / (m×K). This achieves both good electromagnetic shielding and good heat dissipation in the electronic device, achieving a balance between the two.

[0040] In a possible implementation of the first aspect, the material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbon (nitride) compounds. This allows the first shielding layer to have both high electrical loss and good heat dissipation.

[0041] In a second aspect, a shielding structure is provided, comprising a first shielding layer and at least one second shielding layer, wherein the at least one second shielding layer is stacked and connected to the first shielding layer, and the area of ​​the second shielding layer is smaller than that of the first shielding layer.

[0042] In one embodiment, a shielding structure is applied to an electronic device, wherein the electronic device includes a circuit board and a shielding frame, a plurality of electronic devices are provided on the surface of the circuit board; the shielding frame is connected to the surface of the circuit board; the first shielding layer is used to cover and be connected to a side of the shielding frame away from the circuit board, and the first shielding layer can be used to enclose a first shielding cavity with the circuit board and the shielding frame; the plurality of electronic devices are located in the first shielding cavity.

[0043] In one embodiment, at least one second shielding layer is arranged in the first shielding cavity.

[0044] In one embodiment, the second shielding layer is disposed on a side of at least one electronic device away from the circuit board, with the orthographic projection of the second shielding layer on the circuit board at least partially overlapping the orthographic projection of the at least one electronic device on the circuit board; the second shielding layer is coupled to the circuit board. In a possible implementation of the second aspect, the second shielding layer includes a plurality of first sublayers spaced apart in a first direction; the first direction is parallel to the first shielding layer; and the first sublayers are stacked and connected to the first shielding layer.

[0045] In a possible implementation manner of the second aspect, at least two adjacent first sub-layers are electrically connected.

[0046] In a possible implementation of the second aspect, the area of ​​the second shielding layer is less than or equal to half the area of ​​the first shielding layer.

[0047] In a possible implementation of the second aspect, the conductivity of the second shielding layer is greater than the conductivity of the first shielding layer.

[0048] In a possible implementation of the second aspect, the conductivity of the second shielding layer is greater than or equal to 5×10 5 S / m; and / or, the conductivity of the first shielding layer is 0.06×10 5 S / m~5×10 5 S / m.

[0049] In a possible implementation of the second aspect, the thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

[0050] In a possible implementation manner of the second aspect, the thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer is greater than or equal to 50 W / (m×K).

[0051] In a possible implementation manner of the second aspect, the material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbon (nitride).

[0052] The technical effects brought about by the shielding structure provided in any one of the second aspects can be referred to the technical effects brought about by the design method of the electronic device in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0054] FIG2 is a cross-sectional view taken along the section line AA′ in FIG1 ;

[0055] FIG3 is an exploded view of the structure of an electronic device provided in an embodiment of the present application;

[0056] FIG4 is a structural assembly diagram of an electronic device provided in an embodiment of the present application;

[0057] FIG5 is a cross-sectional view taken along the section line BB' in FIG4;

[0058] FIG6 is another schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0059] FIG7 is another schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0060] FIG8 is another schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0061] FIG9 is another schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0062] FIG10 is another schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0063] FIG11 is another schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0064] FIG12 is another cross-sectional view taken along the section line BB′ in FIG4 ;

[0065] FIG13 is another schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0066] FIG14 is another schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0067] FIG15 is another schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0068] FIG16 is a cross-sectional view taken along the section line CC' in FIG13;

[0069] FIG17 is another schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0070] FIG18 is a schematic diagram of the orthographic projection of the first bracket in the shielding frame on the circuit board. DETAILED DESCRIPTION

[0071] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the embodiments described are only some embodiments of the present application, not all embodiments. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0072] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0073] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to." In the description of the specification, the terms "one embodiment," "some embodiments," "exemplary embodiments," "exemplarily," or "some examples" are intended to indicate that specific features, structures, materials, or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0074] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0075] Connection / connected: can refer to a mechanical connection relationship or a physical connection relationship, that is, A and B are connected or A and B are connected, which can mean that there is a fastening component (such as a screw, bolt, rivet, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate, wherein A and B can be fixedly connected, detachably connected, or integrated; can be directly connected, or indirectly connected through an intermediate medium.

[0076] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupling connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection", which is understood as the direct or indirect physical contact and electrical conduction between components, such as the connection between different components in the circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gap between two conductive parts.

[0077] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0078] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0079] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0080] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0081] In addition, the scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. A person of ordinary skill in the art will know that with the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0082] The embodiments of the present application provide an electronic device, which may be, for example, a mobile phone, a tablet computer, a personal digital assistant (PDA), a television, a smart wearable product (e.g., a smart watch, a smart bracelet), a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a rechargeable small household appliance (e.g., a soymilk maker, a robot vacuum), an unmanned aerial vehicle (UAV), a radar, an aerospace equipment, an on-board device, a vehicle, or other different types of user devices or terminal devices; the electronic device may also be a network device such as a base station. The embodiments of the present application do not impose any particular restrictions on the specific form of the electronic device.

[0083] For the sake of convenience, the following description uses a mobile phone as an example, which is not to be considered as a specific limitation on the structural form of the electronic device. FIG1 is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application, and FIG2 is a cross-sectional view along the section line AA' in FIG1.

[0084] In some embodiments, as shown in Figure 1, the electronic device 100 may include a cover plate 1, a display screen 2, a middle frame 3 and a back shell 4. The display screen 2 has a light-emitting side and a non-light-emitting side opposite to each other. The light-emitting side refers to the side where the display surface of the display screen 2 is located (for example, the left side of the display screen 2 in Figure 1), and the non-light-emitting side refers to the side opposite to the light-emitting side (for example, the right side of the display screen 2 in Figure 1). The above-mentioned cover plate 1 is arranged on the light-emitting side of the display screen 2 and is fitted with the display screen 2. The middle frame 3 and the back shell 4 are arranged on the non-light-emitting side of the display screen 2, and the back shell 4 and the display screen 2 are respectively located on both sides of the middle frame 3, and the middle frame 3 and the display screen 2 are arranged in the back shell 4.

[0085] 1 , the middle frame 3 may include a carrier plate and a frame surrounding the carrier plate. The electronic device 100 may also include a battery, a camera, and other structures disposed on the carrier plate.

[0086] As shown in FIG. 1 , the electronic device 100 may further include a circuit board 5 .

[0087] 1 , the circuit board 5 may be located on the non-light-emitting side of the display screen 2. For example, the circuit board 5 may be located between the carrier plate and the rear housing 4.

[0088] As shown in FIG. 1 and FIG. 2 , a plurality of electronic components 6 are arranged on the circuit board 5 .

[0089] Exemplarily, multiple electronic devices 6 can be set on one side of the circuit board 5, or electronic devices 6 can be set on both sides of the circuit board 5. Figure 2 only uses the example of setting electronic devices 6 on one side of the circuit board 5 for schematic illustration, and does not limit the specific setting position of the electronic devices 6.

[0090] Exemplarily, the circuit board 5 includes a main circuit board and a sub-circuit board. A plurality of electronic devices 6 are arranged on the main circuit board and / or the sub-circuit board.

[0091] For example, the main circuit board in the circuit board 5 can be used to integrate electronic devices 6 such as a control chip. The control chip includes but is not limited to a system on chip (SOC), a charging management chip, a power management unit (PMU), a radio frequency chip (RF), a display chip, an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), and a universal flash storage (UFS). Among them, the radio frequency chip can also be called a radio frequency power amplifier chip (RF PA). Exemplarily, the main circuit board is electrically connected to the display screen 2, and the main circuit board is used to control the display screen 2 to display images or videos.

[0092] The main circuit board can be a printed circuit board (PCB). Of course, the main circuit board can also be a flexible circuit board, a rigid-flexible circuit board, etc. Optionally, the main circuit board can be fixed between the middle frame 3 and the rear case 4 by means of threaded connection, clamping, gluing, etc.

[0093] For example, a sub-circuit board of circuit board 5 may integrate electronic components 6, such as universal serial bus (USB) devices. The USB devices may be USB type-C, USB type-A, USB type Micro-B, or USB type-B. A socket is provided on the frame at a location corresponding to the USB device. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device via the socket to enable power, signal, and data transmission.

[0094] The secondary circuit board can be a printed circuit board. Of course, the primary circuit board can also be a flexible circuit board, a rigid-flexible circuit board, or the like. The secondary circuit board can also be secured between the middle frame 3 and the rear housing 4 by threaded connection, snap-fit ​​connection, gluing, or welding. The secondary circuit board is spaced apart from the primary circuit board and electrically connected to it.

[0095] During the operation of electronic device 100, electronic components 6 on circuit board 5 (e.g., the main circuit board and / or the auxiliary circuit board) generate a large amount of electromagnetic interference (as indicated by the arrows in FIG. 2 ), thereby affecting the normal functioning of other structures (e.g., display screen 2) of electronic device 100. Furthermore, the environment surrounding electronic component 6 also contains a large amount of electromagnetic interference (as indicated by the lightning icon in FIG. 2 ), which can easily affect electronic component 6, resulting in poor functioning of electronic component 6 (e.g., signal transmission deviation), and even causing electronic device 100 to malfunction.

[0096] In order to ensure the normal operation of the electronic device 6 in the electronic device 100 , the aforementioned electromagnetic interference needs to be shielded by a shielding structure.

[0097] In some embodiments, the shielding structure includes a shielding frame and a shielding cover. The shielding frame is welded on the circuit board 5, and the side of the shielding frame away from the circuit board 5 is buckled with the shielding cover to form a shielding cavity with a Faraday shielding effect.

[0098] The shielding structure is used to cover the electronic devices 6 installed on the circuit board 5. For example, all the electronic devices 6 on the same side of the circuit board 5 are covered in the shielding cavity, so as to shield the electromagnetic interference in the external environment on the one hand, and prevent the external electromagnetic interference from being transmitted to the electronic devices 6 covered by the shielding cavity, thereby avoiding affecting the normal operation of the electronic devices 6. On the other hand, it shields the electromagnetic interference generated by the electronic devices 6, and blocks the electromagnetic interference generated by the electronic devices 6 covered by the shielding cavity within the shielding cavity, thereby avoiding affecting the functional realization of external devices.

[0099] However, as the integration of electronic devices 6 gradually increases, the electromagnetic interference generated by the electronic devices 6 on the circuit board 5 gradually increases. With the development of electronic technology, the sources of electromagnetic interference (i.e., noise sources) in the external environment of the electronic devices 6 also gradually increase, and the frequencies of the electromagnetic waves from the above two sources also gradually diversify, resulting in more and more electromagnetic interference leaking from the shielding cavity. The shielding effect of the shielding structure in this embodiment gradually cannot meet the shielding requirements, thereby reducing the reliability of the electronic device 100.

[0100] To solve the above technical problems, as shown in FIG3 , the present application provides a shielding structure 200 , comprising a first shielding layer 10 and at least one second shielding layer 20 .

[0101] As shown in FIG. 3 or FIG. 4 , at least one second shielding layer 20 is stacked and connected to the first shielding layer 10 ; wherein the area of ​​the second shielding layer 20 is smaller than that of the first shielding layer 10 .

[0102] In one embodiment, the shielding structure 200 provided in this application can be applied to an electronic device 100 , wherein the electronic device 100 includes a circuit board 5 and a shielding frame 40 . The surface of the circuit board 5 is provided with multiple electronic devices 6 ; the shielding frame 40 is connected to the surface of the circuit board 5 .

[0103] The first shielding layer 10 of the shielding structure 200 can be used to cover and connect to the side of the shielding frame 40 away from the circuit board 5, and the first shielding layer 10 can be used to enclose a first shielding cavity with the circuit board 5 and the shielding frame 40; multiple electronic devices 6 are located in the first shielding cavity Q1.

[0104] The at least one second shielding layer 20 of the shielding structure 200 is configured to be disposed in the first shielding cavity Q1 .

[0105] In one embodiment, the second shielding layer 20 is disposed on a side of the at least one electronic device 6 that is away from the circuit board 5, and the orthographic projection of the second shielding layer 20 on the circuit board 5 at least partially overlaps with the orthographic projection of the at least one electronic device 6 on the circuit board 5. The second shielding layer 20 is coupled to the circuit board 5.

[0106] The present application also provides an electronic device 100 .

[0107] FIG3 is an exploded view of the structure of the electronic device 100 provided in an embodiment of the present application, and FIG4 is an assembled view of the structure of the electronic device 100 provided in an embodiment of the present application.

[0108] As shown in FIG. 3 and FIG. 4 , the electronic device 100 includes a shielding frame 40 , a first shielding layer 10 and at least one second shielding layer 20 .

[0109] The shielding frame 40 , the first shielding layer 10 and the at least one second shielding layer 20 are used to cover the surface of the circuit board 5 and cover the multiple electronic devices 6 on the circuit board 5 .

[0110] 3 and 4 , the shielding frame 40 is connected to the surface of the circuit board 5 .

[0111] For example, referring to Figures 3 and 4, the shielding frame 40 has a roughly annular shape (i.e., a hollow frame structure) so as to surround multiple electronic devices 6 and reduce the probability of electromagnetic interference generated by the electronic devices 6 leaking out in a direction parallel to the circuit board 5.

[0112] Exemplarily, the shielding frame 40 may be in the shape of a circular ring, a square ring, or may be in the shape of a ring of other shapes according to the surface design of the circuit board 5 , and this application does not impose any limitation thereto.

[0113] FIG. 5 is a cross-sectional view taken along the section line BB′ in FIG. 4 .

[0114] Exemplarily, the shielding frame 40 can be welded on the surface of the circuit board 5, or can be fixed to the circuit board 5 by other connection methods, such as snap connection, bolt connection or bonding, etc., which is not limited in this application.

[0115] It can be understood that the shielding frame 40 is electrically connected to the circuit board 5, for example, it is electrically connected to the position of the circuit board 5 where no electronic devices and signal lines are set, so as to facilitate the grounding of the shielding frame 40, the first shielding layer 10 and at least one second shielding layer 20, thereby eliminating electromagnetic interference and realizing the electromagnetic shielding and static electricity elimination functions of the electronic device 100.

[0116] Exemplarily, the material of the shielding frame 40 may include a conductive material, for example, a metal material, for example, a metal material such as copper or silver, for example, nickel silver or stainless steel.

[0117] Exemplarily, referring to FIG. 5 , the shielding frame 40 may include a first bracket 41 and a second bracket 42 .

[0118] The first bracket 41 is used for fixed connection with the circuit board 5 , and the second bracket 42 is used for fixed connection with the first shielding layer 10 .

[0119] Exemplarily, the first bracket 41 and the second bracket 42 may both be arranged in a ring shape.

[0120] For example, referring to FIG5 , the plane in which the first bracket 41 and the plane in which the second bracket 42 are located intersect, for example, and are perpendicular to each other. For example, referring to FIG5 , the first bracket 41 can be perpendicular to the surface of the circuit board 5 to provide a certain height for the electronic device 100 to avoid direct contact between the first shielding layer 10 and the electronic device 6. The second bracket 42 can be parallel to the surface of the circuit board 5 to facilitate connection (for example, electrical connection) between the shielding frame 40 and the first shielding layer 10.

[0121] Exemplarily, the width of the second bracket 42 may be greater than or equal to 0.4 mm.

[0122] Exemplarily, referring to FIG. 3 and FIG. 4 , the shielding frame 40 may further include an intermediate bracket 43 . The intermediate bracket 43 may be disposed between two adjacent electronic devices 6 to achieve mutual shielding between the two adjacent electronic devices 6 .

[0123] Exemplarily, the intermediate bracket 43 may be provided at the same level as the second bracket 42 .

[0124] Exemplarily, the first bracket 41 , the second bracket 42 and the intermediate bracket 43 may be integrally provided.

[0125] 3, 4, and 5, the first shielding layer 10 covers and connects to the side of the shielding frame 40 away from the circuit board 5. Specifically, the first shielding layer 10 is buckled onto an opening on one side of the shielding frame 40, so that the first shielding layer 10, the circuit board 5, and the shielding frame 40 enclose a first shielding cavity Q1 (see FIG. 5).

[0126] 4 and 5 , a plurality of electronic devices 6 are located in a first shielding cavity Q1 enclosed by a shielding frame 40 and a first shielding layer 10 , so that the electromagnetic interference generated by the plurality of electronic devices 6 is blocked in the first shielding cavity Q1 , and electromagnetic interference in the external environment is also blocked from being transmitted to the plurality of electronic devices 6 , thereby achieving an electromagnetic shielding effect.

[0127] In addition, the first shielding cavity Q1 can also eliminate static electricity in the electronic device 100 , thereby improving the reliability of the electronic device 100 .

[0128] It is understandable that, with the support of the shielding frame 40 , there is a distance between the first shielding layer 10 and the electronic device 6 , thereby preventing the first shielding layer 10 from contacting the electronic device 6 and causing problems such as short circuits.

[0129] Exemplarily, an insulating layer can also be set between the first shielding layer 10 and the electronic device 6 to avoid electrical connection between the two. For example, a thermal conductive glue (not shown in the figure) can be set between the first shielding layer 10 and the electronic device 6 to achieve heat dissipation while achieving insulation between the two.

[0130] For example, referring to FIG. 4 , the shape of the first shielding layer 10 may match the shape of the shielding frame 40 to facilitate connection between the two.

[0131] Exemplarily, the first shielding layer 10 and the shielding frame 40 can be integrally provided, or the two can be assembled and connected. For example, a folding piece (not shown in the figure) can be provided on the edge of the first shielding layer 10 to facilitate plugging with the shielding frame 40.

[0132] 3 , 4 and 5 , at least one second shielding layer 20 is stacked with the first shielding layer 10 .

[0133] It can be understood that in the embodiment of the present application, the electronic device 100 may include one or more layers of the second shielding layer 20. For example, referring to Figure 5, the electronic device 100 may include a layer of the second shielding layer 20, and the second shielding layer 20 is stacked with the first shielding layer 10, or, for example, referring to the subsequent Figure 12, the electronic device 100 may include multiple layers of the second shielding layer 20 (Figure 12 uses two layers of the second shielding layer 20 as an example for illustration), and the multiple layers of the second shielding layer 20 are stacked with each other and stacked together with the first shielding layer 10.

[0134] 3 , 4 and 5 , the at least one second shielding layer 20 is disposed in the first shielding cavity Q1 , that is, the area of ​​the second shielding layer 20 is smaller than that of the first shielding layer 10 , and the second shielding layer 20 is disposed on a side of the first shielding layer 10 close to the circuit board 5 .

[0135] Exemplarily, referring to FIG. 4 , the area of ​​the second shielding layer 20 is less than half the area of ​​the first shielding layer 10 .

[0136] For example, the ratio of the area of ​​the second shielding layer 20 to the area of ​​the first shielding layer 10 can be 0.0625 to 0.5. For example, the ratio can be 0.0625, 0.1, 0.175, or 0.5. For example, the first shielding layer 10 and the second shielding layer 20 can both be square, with the side length of the first shielding layer 10 being 4 cm and the side length of the second shielding layer 20 being 1 cm.

[0137] For example, the second shielding layer 20 may be spaced apart from and stacked with the first shielding layer 10 .

[0138] For example, an air gap may be present between the second shielding layer 20 and the first shielding layer 10 .

[0139] Alternatively, for example, the second shielding layer 20 may be spaced apart from the first shielding layer 10 by an insulating material or other materials.

[0140] Exemplarily, the second shielding layer 20 may be connected to the first shielding layer 10 .

[0141] For example, an adhesive may be provided between the second shielding layer 20 and the first shielding layer 10 to connect the two, or the two may be provided integrally, or the two may be directly adhered, which is not limited in the present application.

[0142] 3 , 4 and 5 , the second shielding layer 20 is further disposed on a side of the at least one electronic device 6 away from the circuit board 5 , and the orthographic projection of the second shielding layer 20 on the circuit board 5 at least partially overlaps with the orthographic projection of the at least one electronic device 6 on the circuit board 5 .

[0143] That is, when the circuit board 5 includes multiple electronic devices 6, the second shielding layer 20 can cover one or more of the multiple electronic devices 6. Alternatively, it can be understood that the second shielding layer 20 is provided above the surface of at least one electronic device 6 away from the circuit board 5. For example, the second shielding layer 20 can be suspended on the surface of the electronic device 6 away from the circuit board 5, or can be insulated and attached to the surface of the electronic device 6 away from the circuit board 5.

[0144] For example, the second shielding layer 20 may cover (including covering in a suspended manner or by insulating and attaching) an electronic device 6 with relatively strong electromagnetic interference among the multiple electronic devices 6. For example, the second shielding layer 20 may cover a surface of at least one of a system on chip (SOC), a power management chip (PMU), a charging chip, and a radio frequency chip that is away from the circuit board 5.

[0145] It is understandable that the area of ​​the second shielding layer 20 may depend on the area and number of the electronic devices 6 to be covered, and the shape of the second shielding layer 20 also depends on the location of the electronic devices 6 to be covered.

[0146] Exemplarily, the second shielding layer 20 can be set on the surface-insulated electronic device 6 by spraying, electroplating or sputtering, or the second shielding layer 20 can be adsorbed on the surface-insulated electronic device 6 by negative pressure exhaust, or it can be suspended or stacked on the electronic device 6, or the second shielding layer 20 can be set integrally with the first shielding layer 10, and the area of ​​the second shielding layer 20 can be smaller than the area of ​​the first shielding layer 10 by cutting.

[0147] Exemplarily, the at least one second shielding layer 20 is insulated from the electronic device 6 .

[0148] For example, the at least one second shielding layer 20 can be spaced apart from the electronic device 6. For example, the at least one second shielding layer 20 can be connected to the first shielding layer 10, so that the second shielding layer 20 can be suspended by being fixed with the first shielding layer 10, avoiding direct contact between the second shielding layer 20 and the electronic device 6, which may cause problems such as short circuits.

[0149] Or for example, the at least one second shielding layer 20 and the electronic device 6 may be insulated by providing an insulating layer.

[0150] Referring to Figure 5, the second shielding layer 20 arranged between the circuit board 5 and the first shielding layer 10 can form at least one smaller second shielding cavity Q2 in the first shielding cavity Q1 (for example, two second shielding cavities Q2 are formed in Figure 12). The second shielding cavity Q2 surrounds some of the multiple electronic devices 6, thereby achieving electromagnetic shielding or electrostatic dissipation for these electronic devices 6.

[0151] Referring to Figure 5, the second shielding layer 20 is coupled to the circuit board 5. For example, the second shielding layer 20 and the circuit board 5 are directly coupled, such as electrically connected, or they can be indirectly coupled, such as capacitively coupled, so as to achieve grounding of the second shielding layer 20 to dissipate electromagnetic or static interference in the second shielding cavity Q2.

[0152] In the electronic device 100 provided in the embodiment of the present application, by arranging at least one second shielding layer 20 in the first shielding cavity Q1, at least one second shielding cavity Q2 with a smaller volume can be formed in the first shielding cavity Q1. On the one hand, adding the second shielding cavity Q2 with a smaller volume can increase the cutoff frequency of the electronic device 100 and improve the shielding effect of the electronic device 100. On the other hand, interference signals such as electromagnetic waves can be greatly attenuated during the transmission process in multiple cavities (including the first shielding cavity Q1 and the second shielding cavity Q2), which can also effectively improve the shielding effect of the electronic device 100 against interference signals such as electromagnetic waves.

[0153] In addition, the second shielding layer 20, which is grounded and has a smaller area, has a better suppression effect on lower-frequency electromagnetic interference. That is, on the basis of the first shielding cavity Q1 shielding the overall multiple electronic devices 6, the second shielding layer 20 can additionally increase the shielding effect on low-frequency electromagnetic interference. When the integration of electronic devices 6 becomes higher and higher and the low-frequency interference signals generated by electronic devices 100 increase, the embodiment of the present application can shield low-frequency electromagnetic interference, which is conducive to achieving shielding of electromagnetic waves across the entire frequency band, thereby greatly improving the overall shielding effect of the electronic device 100 against electromagnetic interference.

[0154] In addition, referring to Figures 4 and 5, in the electronic device 100 provided in the embodiment of the present application, the technical means of providing at least one second shielding layer 20 to improve the shielding effect of the electronic device 100 does not increase the design space occupied by the second shielding layer 20 in the direction parallel to the surface of the circuit board 5, thereby avoiding squeezing out the design space for other structures such as electronic devices 6 on the circuit board 5, which is conducive to realizing the miniaturization design of the electronic device 100.

[0155] In summary, the electronic device 100 provided in the embodiment of the present application can enhance the shielding effect of the electronic device 100 without increasing the design space of the electronic device 100, which is conducive to the continued evolution of electronic technology.

[0156] The second shielding layer 20 can be electrically connected to the circuit board 5 in a variety of ways, that is, the second shielding layer 20 can be grounded in a variety of ways. The grounding methods of the second shielding layer 20 are exemplified below with reference to some embodiments.

[0157] 6 to 11 are some structural diagrams of the electronic device 100 provided in an embodiment of the present application. It is understandable that in order to avoid obstruction, the first shielding layer 10 is not drawn in FIG6 to FIG11 , but this cannot be understood as the first shielding layer 10 does not exist.

[0158] In some embodiments, as shown in FIG. 6 , at least a portion of a side of the second shielding layer 20 is in contact with the shielding frame 40 .

[0159] 6 , the side of the second shielding layer 20 closest to the shielding frame 40 contacts the shielding frame 40 . For example, referring to FIG5 and FIG6 , the right side of the second shielding layer 20 may contact the shielding frame 40 .

[0160] Here, “contacting” can be understood as the second shielding layer 20 abutting against the shielding frame 40 , or can also be understood as the side of the second shielding layer 20 being fixedly connected to the shielding frame 40 , for example, by welding, or other connection methods.

[0161] By setting the second shielding layer 20 in direct contact with the shielding frame 40, the second shielding layer 20 and the circuit board 5 can be electrically connected through the shielding frame 40. That is, the second shielding layer 20 can be grounded by directly contacting the shielding frame 40, without the need to design a separate grounding structure, thereby reducing the difficulty of preparing the electronic device 100.

[0162] In some embodiments, as shown in FIG. 7 , the electronic device 100 may further include a first connecting portion 51 .

[0163] 7 , one end of the first connecting portion 51 is electrically connected to the second shielding layer 20 , and the other end is electrically connected to the circuit board 5 .

[0164] That is, the second shielding layer 20 can be electrically connected to the circuit board 5 through the first connecting portion 51 to achieve grounding.

[0165] Illustratively, the first connecting portion 51 may be solder, conductive adhesive, or a metal folded piece integrally formed with the second shielding layer 20. Alternatively, the first connecting portion 51 may be a wire electrically connecting the second shielding layer 20 to the circuit board 5. In other words, the first connecting portion 51 may be any structure capable of electrically connecting the second shielding layer 20 to the circuit board 5. The embodiments of the present application do not limit the specific structure, material, etc. of the first connecting portion 51.

[0166] In some embodiments, as shown in FIG. 8 and FIG. 9 , the electronic device 100 may further include a second connecting portion 52 .

[0167] 8 and 9 , one end of the second connecting portion 52 is electrically connected to the second shielding layer 20 , and the other end is electrically connected to the shielding frame 40 .

[0168] That is, the second shielding layer 20 is overlapped onto the shielding frame 40 through the second connecting portion 52, and is electrically connected to the circuit board 5 through the shielding frame 40. That is, the second shielding layer 20 passes through the second connecting portion 52 and the shielding frame 40 in sequence, and is connected to the circuit board 5 to achieve grounding.

[0169] For example, the structure or material setting of the second connection portion 52 can refer to the description of the first connection portion 51 in the aforementioned embodiment, and will not be repeated here.

[0170] For example, referring to Figures 8 and 9, the setting position and design method of the second connecting part 52 can be changed (the same applies to the first connecting part 51). For example, referring to Figure 8, the electronic device 100 may include two second connecting parts 52, and the two second connecting parts 52 can be arranged above and below the left side of the second shielding layer 20, or, for example, referring to Figure 9, the second connecting part 52 can be electrically connected to the entire side of the left side of the second shielding layer 20.

[0171] For example, the setting position of the second connecting part 52 can be changed according to the frequency of the electromagnetic interference generated by the electronic device 6 covered by the second shielding layer 20, so as to control the size and shape of the second shielding cavity Q2 formed by the second shielding layer 20, the second connecting part 52 and the shielding frame 40, so as to shield the electromagnetic interference in a specific range (the setting position of the first connecting part 51 is the same).

[0172] It can be understood that the embodiments of the present application do not limit the setting position and setting shape of the first connection part 51 and the second connection part 52. Any setting method of the first connection part 51 and the second connection part 52 that can enable the second shielding layer 20 to be grounded is within the protection scope of the embodiments of the present application.

[0173] In some embodiments, the electrical connection between the second shielding layer 20 and the circuit board 5 may include any one or more of the aforementioned connection methods. For example, referring to FIG6 , the second shielding layer 20 may be grounded only by contacting the shield frame 40 on its right side. Alternatively, referring to FIG9 , the left side of the second shielding layer 20 may be electrically connected to the shield frame 40 via the second connection portion 52, while the right side may be directly in contact with the shield frame 40.

[0174] In some embodiments, the second shielding layer 20 includes at least one connection point, which is the portion of the second shielding layer 20 connected to the circuit board 5. That is, the connection point is the grounding position of the second shielding layer 20. For example, referring to FIG5 , the connection point is the right side of the second shielding layer 20. For example, referring to FIG6 , the connection points include the right side of the second shielding layer 20 and the position where the left side is connected to the first connecting portion 51.

[0175] In the case where the second shielding layer 20 includes a plurality of connection points, the plurality of connection points are located on both sides of the electronic device 6 covered by the second shielding layer 20 in the first direction.

[0176] The first direction is any direction parallel to the circuit board 5 .

[0177] For example, referring to Figure 9, the left side of the second shielding layer 20 is overlapped to the shielding frame 40 through the second connecting portion 52 and then grounded, and the right side is in contact with the shielding frame 40 and then grounded, that is, the left side and the right side of the second shielding layer 20 serve as connection points respectively, and the two connection points are arranged relative to each other, so that the second shielding cavity Q2 formed by the second shielding layer 20 can cover the electronic device 6 corresponding to the electromagnetic interference to be shielded.

[0178] In some embodiments, as shown in Figure 10, each second shielding layer 20 includes a plurality of first sub-layers 21 spaced apart in a first direction, the first sub-layer 21 is arranged on a side of at least one electronic device 6 away from the circuit board 5, and the orthographic projection of the first sub-layer 21 on the circuit board 5 at least partially overlaps with the orthographic projection of at least one electronic device 6 on the circuit board 5.

[0179] For example, the first sublayer 21 is suspended on the surface of the electronic device 6 away from the circuit board 5 , or is insulated and attached to the surface of the electronic device 6 away from the circuit board 5 so as to cover the at least one electronic device 6 .

[0180] 10 , each first sub-layer 21 is coupled to the circuit board 5. For example, each first sub-layer 21 is electrically connected to the circuit board 5 (directly coupled), or indirectly coupled, so as to achieve grounding of the first sub-layer 21.

[0181] By providing a plurality of first sub-layers 21 , the second shielding cavity Q2 can be further divided into a plurality of shielding cavities with smaller volumes, thereby further increasing the cutoff frequency and optimizing the shielding effect of the electronic device 100 .

[0182] Exemplarily, the areas of different first sub-layers 21 may be different, so that electromagnetic interference of different frequencies can be shielded respectively, and leakage of electromagnetic interference in some frequency bands can be avoided.

[0183] For example, the area of ​​the first sub-layer 21 may be adjusted, or the grounding position of the first sub-layer 21 may be adjusted according to the frequency of electromagnetic interference generated by the electronic device 6 covered by the first sub-layer 21 .

[0184] Exemplarily, the connection method between the first sub-layer 21 and the circuit board 5 can refer to the description of the connection method between the second shielding layer 20 and the circuit board 5 in the aforementioned embodiment. For example, the first sub-layer 21 can also be in contact with the shielding frame 40 to achieve grounding, or can be grounded through the first connecting part 51 and / or the second connecting part 52, which will not be repeated here.

[0185] Exemplarily, the distance between two adjacent first sub-layers 21 may be less than or equal to 1 cm.

[0186] In some embodiments, different first sub-layers 21 can be grounded independently of each other. For example, referring to Figure 10, two first sub-layers 21 can be respectively connected to the shielding frame 40 through different second connection parts 52 and then grounded, thereby forming independent shielding cavities and enhancing the shielding effect against electromagnetic interference.

[0187] In some embodiments, as shown in FIG11 , two adjacent first sub-layers 21 may be electrically connected. For example, referring to FIG11 , two adjacent first sub-layers 21 may be electrically connected via a third connection portion 53 .

[0188] A resonance problem may occur between two adjacent first sub-layers 21 . By providing an electrical connection between the two adjacent first sub-layers 21 , the resonance problem can be solved, thereby improving the reliability of the electronic device 100 .

[0189] By way of example, the aforementioned resonance problem can also be solved through other means. For example, the spacing between two adjacent first sub-layers 21 can be increased to reduce interference between them and avoid the occurrence of resonance. Alternatively, for example, the grounding points of the first sub-layers 21 can be adjusted so that the frequencies of the electromagnetic interference shielded by different first sub-layers 21 match, which can also avoid the occurrence of resonance problems.

[0190] 11 , after different first sub-layers 21 are electrically connected, grounding can be achieved through one of the first sub-layers 21. That is, the grounding method of the first sub-layer 21 can be flexibly changed according to the application scenario, and the embodiment of the present application does not limit this.

[0191] FIG. 12 is another cross-sectional view along the section line BB′ in FIG. 4 .

[0192] In some embodiments, as shown in FIG. 12 , when the electronic device 100 includes multiple layers of second shielding layers 20 , two adjacent layers of the second shielding layers 20 are electrically connected.

[0193] Alternatively, referring to FIG. 5 , the first shielding layer 10 is electrically connected to the second shielding layer 20 closest to the first shielding layer 10 .

[0194] For example, multiple layers of second shielding layers 20 and the second shielding layer 20 and the first shielding layer 10 are directly bonded to achieve electrical connection. Alternatively, electrical connection can be achieved by conductive glue, conductive paste, punching and filling, punching and electroplating, and other connection methods.

[0195] In this embodiment, a shielding cavity can be added to enhance the shielding effect of the electronic device 100 , while simplifying the preparation process of the electronic device 100 , eliminating the need to add process steps for preparing an insulating layer, thereby reducing the difficulty of preparing the electronic device 100 .

[0196] In other embodiments, when the electronic device 100 includes multiple layers of second shielding layers 20, at least two adjacent layers of second shielding layers 20 are spaced apart, for example, with air or insulating material therebetween.

[0197] Alternatively, the first shielding layer 10 is spaced apart from at least one second shielding layer 20 (eg, the second shielding layer 20 closest to the first shielding layer 10 ), for example, with air or insulating material spaced therebetween.

[0198] By providing an interval between the first shielding layer 10 and the second shielding layer 20, or providing an interval between two adjacent second shielding layers 20, the first shielding cavity Q1 and the second shielding cavity Q2 are made independent of each other. That is, the first shielding cavity Q1 and the second shielding cavity Q2 each play a shielding role independently, thereby maximizing the utilization of their respective shielding functions and further improving the overall electromagnetic shielding effect of the electronic device 1000.

[0199] In some embodiments, as shown in FIG. 12 , the electronic device 100 may further include a first insulating layer 61 .

[0200] 12 , the first insulating layer 61 may be disposed between the second shielding layer 20 and the first shielding layer 10 .

[0201] That is, the first shielding layer 10 and the second shielding layer 20 are insulated and spaced apart by the first insulating layer 61, so that the first shielding cavity Q1 and the second shielding cavity Q2 are independent of each other, that is, the first shielding cavity Q1 and the second shielding cavity Q2 each play a shielding role independently, thereby maximizing the utilization of their respective shielding functions and further improving the overall electromagnetic shielding effect of the electronic device 100.

[0202] For example, when an insulation is set between the first shielding layer 10 and the second shielding layer 20, after the electromagnetic wave is transmitted to the second shielding layer 20, most of the electromagnetic wave will be directly transmitted along the second shielding layer 20 to the grounding position and dissipated. Due to the insulation between the first shielding layer 10 and the second shielding layer 20, the difficulty of the electromagnetic wave being transmitted from the second shielding layer 20 to the first shielding layer 10 is increased, thereby reducing electromagnetic leakage and improving the electromagnetic shielding effect.

[0203] In some embodiments, as shown in FIG. 12 , when the electronic device 100 includes multiple layers of second shielding layers 20 , the electronic device 100 may further include a fourth insulating layer 64 .

[0204] The fourth insulating layer 64 is disposed between at least two adjacent second shielding layers 20. Similar to the description in the aforementioned embodiment, the plurality of second shielding cavities Q2 formed by the plurality of second shielding layers 20 can also be made independent of each other, thereby reducing the probability of electromagnetic wave leakage and further improving the overall electromagnetic shielding effect of the electronic device 100.

[0205] For example, the thickness of the first insulating layer 61 and / or the fourth insulating layer 64 may be 1 μm to 100 μm.

[0206] For example, the material of the first insulating layer 61 and / or the fourth insulating layer 64 may include polyethylene glycol terephthalate (PET) or polyimide (PI).

[0207] Exemplarily, the material of the first insulating layer 61 and / or the fourth insulating layer 64 can be a high magnetic loss material (e.g., an absorbing material, e.g., a magnetic permeability greater than or equal to 1), a high electric loss material (e.g., a dielectric constant greater than or equal to 1) or an ultra-low electrical conductivity material (e.g., less than or equal to 1 S / m).

[0208] 13 , 14 and 15 are schematic diagrams of other structures after the electronic device 100 is arranged on the circuit board 5 , and FIG. 16 is a cross-sectional view along the section line CC′ in FIG. 13 .

[0209] It is understandable that in order to avoid obstruction, the first shielding layer 10 is not drawn in Figures 13, 14 and 15. This cannot be understood as the first shielding layer 10 does not exist. As shown in Figure 16, the first shielding layer 10 still exists on the side of the second shielding layer 20 away from the circuit board 5.

[0210] In some embodiments, as shown in FIG. 13 to FIG. 16 , the electronic device 100 may further include a third shielding layer 30 and a second insulating layer 62 .

[0211] 16 , the third shielding layer 30 is disposed on one side of the second shielding layer 20 .

[0212] Exemplarily, the third shielding layer 30 can be arranged on the side of the second shielding layer 20 close to the circuit board 5, or it can be arranged on the side of the second shielding layer 20 close to the first shielding layer 10 (see Figure 16), or it can be arranged on both the side of the second shielding layer 20 close to the circuit board 5 and the side close to the first shielding layer 10.

[0213] 13 , 14 and 15 , the third shielding layer 30 and the second shielding layer 20 at least partially overlap in a direction perpendicular to the circuit board 5 . Referring to FIG. 16 , the second insulating layer 62 is disposed between the second shielding layer 20 and the third shielding layer 30 .

[0214] That is, a capacitor structure may be formed between the third shielding layer 30 , the second insulating layer 62 and the second shielding layer 20 .

[0215] It should be noted that “at least partially overlap” here means that there is a facing area (i.e., an effective capacitance area) between the third shielding layer 30 and the second shielding layer 20. For example, on the orthographic projection of the circuit board 5, the orthographic projection of the third shielding layer 30 and the orthographic projection of the second shielding layer 20 at least partially overlap to form a capacitor structure.

[0216] 16 , the third shielding layer 30 is electrically connected to the circuit board 5 .

[0217] That is, the third shielding layer 30 is used to electrically connect with the circuit board 5, and a capacitor structure is formed between the second shielding layer 20 and the third shielding layer 30, so that the second shielding layer 20 can achieve a capacitive coupling connection with the circuit board 5 through the third shielding layer 30, that is, the coupling grounding of the second shielding layer 20 can be achieved through the third shielding layer 30.

[0218] Illustratively, the third shielding layer 30 and the circuit board 5 may be directly electrically connected (not shown in the figures, and reference may be made to the description of the first connecting portion 51 in the foregoing embodiment).

[0219] Alternatively, illustratively, the third shielding layer 30 may also be overlapped on the shielding frame 40 so as to achieve electrical connection with the circuit board 5 through the shielding frame 40. For example, referring to Figures 13 and 14, the third shielding layer 30 may be directly overlapped on the shielding frame 40, or, for example, referring to Figure 15, the third shielding layer 30 may be electrically connected to the shielding frame 40 via a connecting portion (similar to the second connecting portion 52 in the aforementioned embodiment, which will not be described again here), and the embodiments of the present application are not limited to this.

[0220] For example, referring to FIG. 13 and FIG. 14 , the frequency range of electromagnetic interference that can be shielded by the second shielding layer 20 can be adjusted by changing the overlapping position of the third shielding layer 30 and the shielding frame 40 .

[0221] For example, referring to Figure 13, the right side of the second shielding layer 20 contacts the shielding frame 40 to form a connection point (i.e., a grounding point), the left side of the second shielding layer 20 is coupled and connected to the third shielding layer 30, and the left side of the third shielding layer 30 overlaps the shielding frame 40, so that another grounding point of the second shielding layer 20 can extend to the left side frame of the shielding frame 40. The distance between the two connection points (grounding points) of the second shielding layer 20 is large, so that the second shielding cavity Q2 formed by the second shielding layer 20 can shield electromagnetic interference with a higher frequency.

[0222] Or for example, referring to Figure 14, the third shielding layer 30 can also overlap with the lower side frame of the shielding frame 40, or with the middle bracket 43 of the shielding frame 40, so as to reduce the difficulty of electrically connecting the third shielding layer 30 with the circuit board 5, or the frequency range of electromagnetic interference that can be shielded by the second shielding cavity Q2 formed by the second shielding layer 20 can be adjusted.

[0223] In the electronic device 100 provided in the embodiment of the present application, by setting a third shielding layer 30, and setting the second shielding layer 20 to achieve capacitive coupling connection with the circuit board 5 through the third shielding layer 30 (i.e., coupling to ground), the area of ​​the third shielding layer 30 can be adjusted to achieve the capacitance of the capacitor structure formed by the second shielding layer 20 and the third shielding layer 30, thereby forming a frequency selection effect, and can shield and suppress electromagnetic interference of a specific frequency, so that the electronic device 100 can be flexibly used in different scenarios.

[0224] For example, referring to FIG. 16 , the third shielding layer 30 may also be disposed in the first shielding cavity Q1 to form a capacitor structure with the second shielding layer 20 while avoiding occupying excessive design space of the circuit board 5 .

[0225] Exemplarily, referring to FIG. 16 , when the third shielding layer 30 is disposed between the first shielding layer 10 and the second shielding layer 20 , the third shielding layer 30 is connected to the first shielding layer 10 .

[0226] For example, the third shielding layer 30 and the first shielding layer 10 can be directly bonded, or the two can be bonded by adhesive, or, for example, referring to Figure 16, the electronic device 100 can also include a third insulating layer 63, which is arranged between the first shielding layer 10 and the third shielding layer 30 to achieve electrical insulation between the two.

[0227] In some embodiments, when the second shielding layer 20 includes multiple first sub-layers 21 , as shown in FIG. 13 and FIG. 14 , each first sub-layer 21 at least partially overlaps with the third shielding layer 30 in a direction perpendicular to the circuit board 5 .

[0228] That is, the multiple first sub-layers 21 can share one third shielding layer 30 , and the multiple first sub-layers 21 can form a capacitor structure with the same third shielding layer 30 , thereby simplifying the structure of the electronic device 100 and reducing its manufacturing difficulty.

[0229] Alternatively, as shown in Figure 15, the third shielding layer 30 may also include a plurality of second sub-layers 31 spaced apart along a first direction (any direction parallel to the circuit board 5), and the first sub-layer 21 and the corresponding second sub-layer 31 at least partially overlap in a direction perpendicular to the circuit board 5.

[0230] That is, the multiple first sub-layers 21 can respectively correspond to separate second sub-layers 31 , thereby forming multiple independent capacitor structures to avoid mutual influence during the frequency selection process, thereby further improving the flexibility of the frequency selection of the electronic device 100 .

[0231] FIG17 is a structural diagram of the electronic device 100 provided in an embodiment of the present application and some corresponding partial enlarged views, and FIG18 is a schematic diagram of the orthographic projection of the first bracket 41 of the shielding frame 40 on the circuit board 5.

[0232] In some embodiments, the shielding structure only includes a shielding frame and a shielding cover. In order to ensure the shielding effect, more than 90% of the area of ​​the surface of the shielding frame facing the circuit board 5 is connected (for example, welded) to the circuit board, which occupies a larger board design space of the circuit board and is not conducive to the miniaturization design of the electronic device 100.

[0233] In some embodiments provided in the present application, as shown in FIG. 17 , the shielding frame 40 includes a first bracket 41 .

[0234] Referring to Figure 17, the first bracket 41 is arranged around multiple electronic devices 6, the first side of the first bracket 41 (the side close to the circuit board 5) is connected to the surface of the circuit board 5, and the second side of the first bracket 41 (the side away from the circuit board 5, that is, the first side and the second side are arranged opposite to each other) is electrically connected to the first shielding layer 10.

[0235] The first bracket 41 is provided with at least one first window K spaced apart from each other. The first window K penetrates the first bracket 41 in a direction parallel to the circuit board 5 , and the first window K disconnects the first side of the first bracket 41 .

[0236] That is, the surface of the first bracket 41 facing the circuit board 5 is not entirely in contact with the circuit board 5, wherein part of the surface is recessed in the direction away from the circuit board 5 to form a first window K, thereby exposing part of the circuit board 5, thereby reducing the board design space of the circuit board 5 occupied by the shielding frame 40, so that more components can be arranged on the circuit board 5. For example, referring to Figure 17, a pin P (or other electronic components that can meet the avoidance requirements) can be set at the position of the circuit board 5 corresponding to the first window K, which is conducive to the miniaturization design of the circuit board 5 and even the electronic device 100.

[0237] Exemplarily, the ratio of the sum of the dimensions of at least one first window K (for example, multiple first windows K) along the extension path of the first bracket 41 to the dimension of the first bracket 41 along the extension path is greater than or equal to 0.7 and less than 1.

[0238] For example, referring to Figure 18, multiple first windows K can divide the first bracket 41 into multiple parts 41', the size of each first window K on the extension path of the first bracket 41 is the distance d1 between two adjacent parts 41', the sum of the sizes of the multiple first windows K on the extension path of the first bracket 41 is the sum of the multiple distances d1, and the size of the first bracket 41 on the extension path is the sum of the lengths d2 of the multiple parts 41' in their extension direction.

[0239] That is, the first window K in the first bracket 41 occupies 70% or more of the annular area enclosed by the first bracket 41 , thereby significantly reducing the design space of the circuit board 5 occupied by the shielding frame 40 .

[0240] Exemplarily, the length d2 of each component 41 ′ in the extending direction thereof may be less than or equal to 20 mm.

[0241] In the electronic device 100 provided in the embodiment of the present application, by providing a second shielding layer 20, most of the electromagnetic interference generated by the electronic device 6 can be grounded and eliminated by the second shielding layer 20, thereby greatly reducing the electromagnetic interference transmitted to the first shielding layer 10. Therefore, a larger space is reserved for opening the first window K in the shielding frame 40 connected to the first shielding layer 10. Since the electromagnetic interference in the first shielding cavity Q1 formed by the first shielding layer 10 and the shielding frame 40 has been mostly blocked by the second shielding layer 20, even if the first window K of the shielding frame 40 is enlarged, the shielding effect can still be enhanced, taking into account both the improvement of the shielding effect of the electronic device 100 and the reduction of the occupied design space.

[0242] Exemplarily, as shown in FIG17 , the shielding frame 40 further includes a second bracket 42 , which is connected (eg, electrically connected) to the second side of the first bracket 41 , and the first bracket 41 is connected to the first shielding layer 10 via the second bracket 42 .

[0243] Exemplarily, the first bracket 41 is perpendicular to the circuit board 5 , and the second bracket 42 is parallel to the circuit board 5 .

[0244] In some embodiments, the material of the first shielding layer 10 and / or the second shielding layer 20 may include a conductive material, for example, a metal material, for example, a metal material such as copper or silver, for example, nickel silver or stainless steel.

[0245] For example, the material selection of the first shielding layer 10 and the second shielding layer 20 in the aforementioned embodiment may follow the following rules:

[0246] In some embodiments, the electrical conductivity of the second shielding layer 20 is greater than the electrical conductivity of the first shielding layer 10 .

[0247] For example, when the electronic device 100 includes multiple layers of the second shielding layer 20 , the conductivity of the second shielding layer 20 gradually decreases in a direction away from the circuit board 5 .

[0248] For example, the conductivity of the second shielding layer 20 is greater than or equal to 5×10 5 S / m; and / or, the conductivity of the first shielding layer 10 is 0.06× 10 5S / m~5×10 5 S / m.

[0249] For example, when the thickness of the first shielding layer 10 and the second shielding layer 20 is less than or equal to 0.15 mm, the conductivity of the second shielding layer 20 is greater than or equal to 5×10 5 S / m, the conductivity of the first shielding layer 10 is 0.06×10 5 S / m~5×10 5 S / m.

[0250] For example, the conductivity of the second shielding layer 20 may be 5×10 5 S / m, 7.5×10 5 S / m or 11×10 6 S / m, etc. For example, the conductivity of the first shielding layer 10 can be 0.06×10 5 S / m, 1.053×10 5 S / m, 2.3×10 5 S / m, 2.57×10 5 S / m or 5×10 5 S / m, etc.

[0251] That is, the material of the first shielding layer 10 located on the outer layer can be set to a high-loss material (i.e., low electrical conductivity), and the material of the second shielding layer 20 on the inner layer can be set to a high-conductivity material (i.e., high electrical conductivity). On the one hand, the first shielding layer 10 with high loss characteristics can suppress the occurrence of resonance problems. On the other hand, when the electromagnetic interference generated by the electronic device 6 reaches the second shielding layer 20, the second shielding layer 20 with high conductivity can block most of the electromagnetic interference. The remaining part of the electromagnetic interference leaks into the first shielding layer 10 and can be dissipated during the transmission process in the high-loss first shielding layer 10. Under the joint action of the high-loss first shielding layer 10 and the highly conductive second shielding layer 20, the shielding effect of electromagnetic interference in the electronic device 100 is greatly improved.

[0252] For example, when the material of the first shielding layer 10 is a high-loss material and the material of the second shielding layer 20 is a high-conductivity material, the size of the first window K of the first bracket 41 in the shielding frame 40 can be further increased, thereby further reducing the design space of the circuit board 5 occupied by the shielding frame 40.

[0253] For example, when the material of the first shielding layer 10 is a high-loss material and the material of the second shielding layer 20 is a high-conductivity material, the first shielding layer 10 and the second shielding layer 20 can be directly bonded together. When the electromagnetic wave is transmitted to the second shielding layer 20, since the conductivity of the second shielding layer 20 is much greater than the conductivity of the first shielding layer 10, the electromagnetic wave will still be transmitted along the second shielding layer 20 with higher conductivity, and will be transmitted to the circuit board 5 through the grounding position of the second shielding layer 20 to dissipate, and will not leak into the first shielding layer 10.

[0254] In some embodiments, the thickness of the second shielding layer 20 and / or the thickness of the third shielding layer 30 can be less than or equal to 0.15 mm. For example, the thickness of the second shielding layer 20 and / or the thickness of the third shielding layer 30 is 0.001 mm to 0.15 mm, for example, 0.001 mm, 0.015 mm, 0.08 mm or 0.15 mm.

[0255] In some embodiments, the thermal conductivity of the second shielding layer 20 and / or the thermal conductivity of the third shielding layer 30 is greater than or equal to 50 W / (m×K). This achieves a good electromagnetic shielding effect in the electronic device 100 while also providing a good heat dissipation effect, achieving a balance between the two.

[0256] In some embodiments, the material of the first shielding layer 10 includes at least one of carbon nanotubes (CNTs), graphene, carbon black, and two-dimensional transition metal carbonitride (MXene). This allows the first shielding layer 10 to have high electrical loss and good heat dissipation, while also reducing the weight of the electronic device 100.

[0257] In the electronic device 100 provided in the aforementioned embodiment of the present application, the electromagnetic shielding effectiveness can reach more than 60dB, the design area of ​​the circuit board 5 occupied by the shielding frame 40 can be reduced by more than 70%, the temperature can be greatly reduced (for example, it can be reduced to 52°C), and the overall weight of the electronic device 100 can be reduced by more than 50%, which has relatively significant beneficial effects.

[0258] As shown in FIG. 3 , FIG. 5 and FIG. 17 , an embodiment of the present application further provides a shielding structure 200 , which includes a first shielding layer 10 and at least one second shielding layer 20 .

[0259] The first shielding layer 10 is used to be connected to the shielding frame 40 and enclose a first shielding cavity Q1 .

[0260] As shown in Figures 3, 5 and 17, at least one second shielding layer 20 is stacked and connected to the first shielding layer 10, for example, the two are directly adhered and electrically connected, or are bonded by adhesive, or are connected through an insulating layer, thereby achieving fixation between the second shielding layer 20 and the first shielding layer 10.

[0261] As shown in Figures 3, 5 and 17, the area of ​​the second shielding layer 20 is smaller than that of the first shielding layer 10. Thus, the second shielding layer 20 can form a second shielding cavity Q2 with a smaller volume than the first shielding cavity Q1, thereby improving the shielding effect against electromagnetic interference.

[0262] It should be noted that the specific configuration of the first shielding layer 10 , the second shielding layer 20 , the shielding frame 40 , the first shielding cavity Q1 and the second shielding cavity Q2 in this embodiment can refer to any of the aforementioned embodiments and will not be repeated here.

[0263] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this disclosure should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that, Comprising: A circuit board, on the surface of which there are a plurality of electronic devices; A shielding frame, connected to the surface of the circuit board; A first shielding layer, covering and connected to the side of the shielding frame away from the circuit board, wherein the circuit board, the first shielding layer and the shielding frame enclose a first shielding cavity; the plurality of electronic devices are located in the first shielding cavity; At least one layer of second shielding layer, stacked with the first shielding layer; the at least one layer of second shielding layer is arranged in the first shielding cavity, the second shielding layer is arranged on the side of at least one electronic device away from the circuit board, and the orthographic projection of the second shielding layer on the circuit board at least partially overlaps with the orthographic projection of the at least one electronic device on the circuit board; the second shielding layer is coupled to the circuit board.

2. The electronic device according to claim 1, wherein The second shielding layer includes a plurality of first sub-layers spaced apart in a first direction; the first direction is parallel to the circuit board; the first sub-layer is arranged on the side of at least one electronic device away from the circuit board, and the orthographic projection of the first sub-layer on the circuit board at least partially overlaps with the orthographic projection of at least one electronic device on the circuit board, and each first sub-layer is coupled to the circuit board.

3. The electronic device according to claim 2, wherein At least two adjacent first sub-layers are electrically connected.

4. The electronic device according to any one of claims 1 to 3, characterized in that At least part of the side of the second shielding layer is in contact with the shielding frame.

5. The electronic device according to any one of claims 1 to 4, characterized in that, Further comprising: A first connection part, one end of which is electrically connected to the second shielding layer and the other end is electrically connected to the circuit board.

6. The electronic device according to any one of claims 1 to 5, characterized in that, Further comprising: A second connection part, one end of which is electrically connected to the second shielding layer and the other end is electrically connected to the shielding frame.

7. The electronic device according to any one of claims 1 to 6, characterized in that, The second shielding layer includes at least one connection point, and the connection point is the part of the second shielding layer connected to the circuit board; In the case where the second shielding layer includes a plurality of connection points, the plurality of connection points are respectively arranged on both sides of the electronic device covered by the second shielding layer in the first direction; the first direction is parallel to the circuit board.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The first shielding layer is spaced apart from the at least one layer of second shielding layer; and / or, In the case where the electronic device includes multiple layers of second shielding layers, at least two adjacent second shielding layers are spaced apart.

9. The electronic device according to claim 8, wherein Further comprising: A first insulating layer, which is arranged between the second shielding layer and the first shielding layer.

10. The electronic device according to claim 9, wherein In the case where the electronic device includes multiple layers of second shielding layers, the electronic device further includes: a fourth insulating layer, which is arranged between at least two adjacent second shielding layers.

11. The electronic device according to any one of claims 1 to 10, characterized in that, Further comprising: A third shielding layer, arranged on one side of the second shielding layer, and the third shielding layer at least partially overlaps with the second shielding layer in the direction perpendicular to the circuit board; The third shielding layer is electrically connected to the circuit board; A second insulating layer, arranged between the second shielding layer and the third shielding layer.

12. The electronic device according to claim 11, wherein In the case where the second shielding layer includes a plurality of first sub-layers: Each first sub-layer at least partially overlaps with the third shielding layer in the direction perpendicular to the circuit board; or, The third shielding layer includes a plurality of second sub-layers spaced apart in a first direction, and the first sub-layer and the corresponding second sub-layer overlap at least partially in a direction perpendicular to the circuit board; the first direction is parallel to the circuit board.

13. The electronic device according to any one of claims 1 to 12, characterized in that, The shielding frame includes a first bracket; the first bracket surrounds the plurality of electronic devices; a first side of the first bracket is connected to the surface of the circuit board, and a second side of the first bracket is electrically connected to the first shielding layer; Wherein, at least one first opening is provided on the first bracket, the first opening penetrates the first bracket along a direction parallel to the circuit board, and the first opening disconnects the first side of the first bracket.

14. The electronic device according to claim 13, wherein The shielding frame further includes a second bracket, the second bracket is connected to the second side of the first bracket, and the first bracket is connected to the first shielding layer through the second bracket.

15. The electronic device according to claim 13 or 14, characterized in that, The sum of the sizes of the at least one first opening on the extension path of the first bracket and the size of the extension path of the first bracket is greater than or equal to 0.7 and less than 1.

16. The electronic device according to any one of claims 1 to 15, characterized in that, The area of the second shielding layer is less than or equal to half of the area of the first shielding layer.

17. The electronic device according to any one of claims 1 to 16, characterized in that, The conductivity of the second shielding layer is greater than the conductivity of the first shielding layer.

18. The electronic device according to any one of claims 1 to 17, characterized in that, The conductivity of the second shielding layer is greater than or equal to 5×10 5 S / m; and / or, The conductivity of the first shielding layer is 0.06×10 5 S / m to 5×10 5 S / m.

19. The electronic device according to any one of claims 1 to 18, characterized in that, The thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

20. The electronic device according to any one of claims 1 to 19, characterized in that, The thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer is greater than or equal to 50 W / (m×K).

21. The electronic device according to any one of claims 1 to 20, characterized in that, The material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbides (nitrides).

22. A shielding structure, characterized in that, Comprising: A first shielding layer; At least one second shielding layer, stacked and connected with the first shielding layer; The area of the second shielding layer is less than the area of the first shielding layer.

23. The shielding structure according to claim 22, wherein The second shielding layer includes a plurality of first sub-layers spaced apart in a first direction; the first direction is parallel to the first shielding layer; the first sub-layer is stacked and connected with the first shielding layer.

24. The shielding structure according to claim 23, wherein At least two adjacent first sub-layers are electrically connected.

25. The shielding structure according to any one of claims 22 to 24, characterized in that, The area of the second shielding layer is less than or equal to half of the area of the first shielding layer.

26. The shielding structure according to any one of claims 22 to 25, wherein The conductivity of the second shielding layer is greater than the conductivity of the first shielding layer.

27. The shielding structure according to any one of claims 22 to 26, characterized in that, The conductivity of the second shielding layer is greater than or equal to 5×10 5 S / m; and / or, The conductivity of the first shielding layer is 0.06×10 5 S / m to 5×10 5 S / m.

28. The shielding structure according to any one of claims 22 to 27, characterized in that, The thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

29. The shielding structure according to any one of claims 22 to 28, wherein The thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer is greater than or equal to 50 W / (m×K).

30. The shielding structure according to any one of claims 22 to 29, characterized in that, The material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbides (nitrides).

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