Electrochemical device and electric apparatus

Abstract

An electrochemical device (100) and an electric apparatus (1000). The electrochemical device (100) comprises a housing (10), an electrode assembly (20), and a first bonding component (30). The electrode assembly (20) is arranged in the housing (10), and the electrode assembly (20) comprises: a first side face (21) and a second side face (22), which are opposite each other in a first direction, and a third side face (23) and a fourth side face (24), which are opposite each other in a second direction, the second direction being perpendicular to the first direction. The first bonding component (30) comprises a first side portion (31) and a second side portion (32), which are opposite each other, wherein the first side portion (31) comprises a first bonding area (311), a first non-bonding area (312) and a second bonding area (313), which are sequentially arranged, the first bonding area (311) being bonded to the first side face (21), and the second bonding area (313) being bonded to the second side face (22); and the second side portion (32) comprises a third bonding area (321), the third bonding area (321) being bonded to the housing (10). In the second direction, a projection of the first non-bonding area (312) overlaps the third side face (23), and a projection of the third bonding area (321) overlaps the third side face (23). The first non-bonding area (312) of the first bonding component (30) is not bonded to the third side face (23), which is beneficial to reducing the risk that the electrode assembly (20) is damaged.

Description

Electrochemical devices and electrical equipment Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to an electrochemical device and electrical equipment. Background Art

[0002] When a battery or an electrical device equipped with a battery is subjected to impact such as falling, there is a risk that the electrode assembly inside the battery will move. The movement of the electrode assembly can easily cause battery failure. To improve the problem of battery failure, a double-sided adhesive layer is usually provided between the electrode assembly and the shell of the electrochemical device, with one side bonded to the shell and the other side bonded to the electrode assembly.

[0003] When the battery is impacted, if the viscosity of the glue layer is too low, it will easily detach from the electrode assembly or the shell, causing the electrode assembly to move relative to the shell, which may lead to battery cell failure; if the viscosity of the glue layer is too high, the glue layer will transfer the impact force to the outer foil of the electrode assembly, which may easily cause the outer foil of the electrode assembly to tear. Summary of the Invention

[0004] In view of this, the present application provides an electrochemical device and an electrical equipment, aiming to reduce the risk of the electrode assembly moving relative to the housing and the risk of damage to the outer foil of the electrode assembly.

[0005] In a first aspect, the present application provides an electrochemical device comprising a housing, an electrode assembly, and a first adhesive component. The electrode assembly is disposed within the housing and includes a first side surface, a second side surface, a third side surface, and a fourth side surface. The first side surface and the second side surface are disposed opposite each other along a first direction, and the third side surface and the fourth side surface are disposed opposite each other along a second direction. The third side surface and the fourth side surface are located between the first side surface and the second side surface. The first direction is perpendicular to the second direction. The first adhesive component is disposed between the housing and the electrode assembly and includes a first side portion and a second side portion that are opposed to each other. The first side portion includes a first adhesive area, a first non-adhesive area, and a second adhesive area disposed in sequence. The first adhesive area is bonded to the first side surface, and the second adhesive area is bonded to the second side surface. The second side portion includes a third adhesive area, and the third adhesive area is bonded to the housing. In the second direction, the projection of the first non-adhesive area overlaps with the third side surface, and the projection of the third adhesive area overlaps with the third side surface.

[0006] The electrode assembly is connected to the shell via the first bonding area, the second bonding area, and the third bonding area of ​​the first bonding component, which helps limit the relative movement of the electrode assembly and the shell, thereby helping to reduce the risk of the electrode assembly moving inside the shell when the electrochemical device is impacted. The first bonding component is provided with a first non-bonding area that is not bonded to the first side surface, which helps to reduce the impact force transmitted to the electrode assembly by the first bonding component when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring electrode piece of the electrode assembly. In addition, the first bonding area is bonded to the first side surface, and the second bonding area is bonded to the second side surface, which disperses the impact force transmitted to the electrode assembly by the first bonding component, which helps to further reduce the risk of the electrode assembly moving inside the shell when the electrochemical device is impacted, and further helps to further reduce the risk of damage to the outer ring electrode piece of the electrode assembly.

[0007] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly.

[0008] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly, so that the first adhesive component is bonded to the side of the electrode assembly in the width direction or the length direction, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly. In addition, when the second direction is the thickness direction of the electrode assembly, it is also beneficial to increase the bonding area between the first adhesive component and the housing, which is beneficial to improving the bonding strength of the first adhesive component and the housing.

[0009] In any of the above optional embodiments, the first non-adhesive area includes a first sub-non-adhesive area and a second sub-non-adhesive area, and the second sub-non-adhesive area is located between the first adhesive area and the first sub-non-adhesive area. Along the second direction, the projection of the first sub-non-adhesive area covers the third side surface, and along the first direction, the projection of the second sub-non-adhesive area overlaps with the first side surface. This arrangement facilitates extending the first non-adhesive area to one side of the first side surface, thereby reducing the impact force transmitted to the electrode assembly by the first adhesive component and further reducing the pulling force of the first adhesive component on the first side surface, thereby reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0010] In any of the above optional embodiments, the first non-adhesive area includes a first sub-non-adhesive area and a third sub-non-adhesive area, and the third sub-non-adhesive area is located between the second adhesive area and the first sub-non-adhesive area. Along the second direction, the projection of the first sub-non-adhesive area covers the third side surface, and along the first direction, the projection of the third sub-non-adhesive area overlaps with the second side surface. This arrangement facilitates extending the first non-adhesive area to one side of the second side surface, thereby reducing the impact force transmitted to the electrode assembly by the first adhesive component and further reducing the pulling force of the first adhesive component on the second side surface, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly.

[0011] In any of the above optional embodiments, the shell includes a first side wall and a second side wall opposite to each other along a first direction and a third side wall and a fourth side wall opposite to each other along a second direction; the first side surface is adjacent to the first side wall, the second side surface is adjacent to the second side wall, and the third side surface is adjacent to the third side wall.

[0012] In any of the above optional embodiments, along the second direction, the projection of the third bonding area covers the third side surface, which is beneficial to improving the firmness of the bonding between the shell and the first bonding component and reducing the risk of the first bonding component detaching from the shell, thereby helping to suppress the movement of the electrode assembly.

[0013] In any of the above optional embodiments, the third bonding area includes a first sub-bonding area and a second sub-bonding area, the first sub-bonding area being located between the third side surface and the third sidewall, and the second sub-bonding area being located between the first side surface and the first sidewall. This arrangement helps to enhance the bond strength between the housing and the first bonding component, reduces the risk of the first bonding component detaching from the housing, and thus helps to suppress movement of the electrode assembly.

[0014] In any of the above optional embodiments, along the first direction, the projection of the third bonding area has no overlap with the first side surface. Such a setting is conducive to reducing or eliminating the local area where the first bonding component is bonded to both the shell and the electrode assembly, and is conducive to making it easier for the first bonding component to absorb the force transmitted by the shell through deformation dissipation when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0015] In any of the above optional embodiments, the third bonding area includes a first sub-bonding area and a third sub-bonding area, the first sub-bonding area being located between the third side surface and the third sidewall, and the third sub-bonding area being located between the second side surface and the second sidewall. This arrangement helps to enhance the bond strength between the housing and the first bonding component, reduces the risk of the first bonding component detaching from the housing, and thus helps to suppress movement of the electrode assembly.

[0016] In any of the above optional embodiments, along the first direction, the projection of the third bonding area has no overlap with the second side surface. Such a setting is conducive to reducing or eliminating the local area where the first bonding component is bonded to both the shell and the electrode assembly, and is conducive to making it easier for the first bonding component to absorb the force transmitted by the shell through deformation dissipation when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0017] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly, and the first bonding area includes a fourth sub-bonding area and a fifth sub-bonding area, with the fourth sub-bonding area being located between the first side surface and the first sidewall, and the fifth sub-bonding area being located between the third side surface and the third sidewall. This arrangement allows the first bonding component to bond to a portion of the third side surface, increasing the bonding area between the first bonding component and the electrode assembly and broadening the distribution of the bonding area, thereby facilitating enhanced bonding strength between the first bonding component and the third side surface and suppressing movement of the electrode assembly.

[0018] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly, and the second bonding area includes a sixth sub-bonding area and a seventh sub-bonding area, with the sixth sub-bonding area being located between the second side surface and the second sidewall, and the seventh sub-bonding area being located between the third side surface and the third sidewall. This arrangement allows the first bonding component to bond to a portion of the third side surface, increasing the bonding area between the first bonding component and the electrode assembly and broadening the distribution of the bonding area, thereby facilitating enhanced bonding strength between the first bonding component and the third side surface and suppressing movement of the electrode assembly.

[0019] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly, along the first direction, the thickness of the electrode assembly is T, along the second direction, the width of the electrode assembly is W, and the length of the projection of the third bonding area along the second direction in the first direction is T1, satisfying 0.5T≤T1≤T. This is beneficial for the first bonding component to suppress the movement of the electrode assembly and reduce the risk of damage to the outer ring electrode of the electrode assembly.

[0020] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly, and the length of the projection of the first bonding area along the first direction in the second direction is W1, satisfying 0.1W≤W1≤0.5W. This is beneficial for the first bonding component to suppress the movement of the electrode assembly and reduce the risk of damage to the outer ring electrode of the electrode assembly.

[0021] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly, and the length of the projection of the second bonding area along the first direction in the second direction is W2, satisfying 0.1W≤W2≤0.5W. This is beneficial for the first bonding component to suppress the movement of the electrode assembly and reduce the risk of damage to the outer ring electrode of the electrode assembly.

[0022] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly, and along the second direction, the distance between the third bonding area and the first bonding area is h1, and h1≤0.25T.

[0023] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly, and along the second direction, the distance between the third bonding area and the second bonding area is h2, and h2≤0.25T.

[0024] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly, along the second direction, the thickness of the electrode assembly is T, along the first direction, the width of the electrode assembly is W, and the length of the projection of the third bonding area along the second direction in the first direction is L1, satisfying 0.5W≤L1≤W.

[0025] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly, and the length of the projection of the first bonding area along the first direction in the second direction is L2, satisfying 0.5T≤L2≤T.

[0026] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly, and the length of the projection of the second bonding area along the first direction in the second direction is L3, satisfying 0.5T≤L3≤T.

[0027] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly, and along the first direction, the distance between the third bonding area and the first bonding area is h3, and h3≤0.25W.

[0028] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly, and along the first direction, the distance between the third bonding area and the second bonding area is h4, and h4≤0.25W.

[0029] In any of the above optional embodiments, the first adhesive component includes a first substrate layer, a first adhesive layer, a second adhesive layer, and a third adhesive layer. The first substrate layer is disposed between the housing and the electrode assembly, the first adhesive layer is disposed on the surface of the first substrate layer facing the first side surface, the second adhesive layer is disposed on the surface of the first substrate layer facing the second side surface, and the third adhesive layer is disposed on the surface of the first substrate layer facing the housing. With this arrangement, the first adhesive component is formed by a single piece of tape having double-sided adhesive layers. Compared to a bonding structure formed by bonding multiple pieces of tape, this structure helps reduce the overall thickness of the electrochemical device and improves the energy density of the electrochemical device.

[0030] In any of the above optional embodiments, the electrochemical device further includes a second adhesive component, the second adhesive component being disposed between the housing and the electrode assembly. The second adhesive component includes opposing third and fourth side portions. The third side portion includes a fourth adhesive area, a second non-adhesive area, and a fifth adhesive area, which are sequentially arranged. The fourth adhesive area is bonded to the first side surface, and the fifth adhesive area is bonded to the second side surface. The fourth side portion includes a sixth adhesive area, and the sixth adhesive area is bonded to the housing. Along the second direction, the projection of the second non-adhesive area overlaps with the fourth side surface, and the projection of the sixth adhesive area overlaps with the fourth side surface. In this manner, the first and second adhesive components are connected to the housing, which helps reduce the risk of the electrode assembly moving within the housing when the electrochemical device is impacted. The first and second adhesive components also transfer the impact force of the housing to both sides of the electrode assembly in the second direction, which helps disperse the impact force on the electrode assembly and further reduces the risk of damage to the outer electrode plates of the electrode assembly.

[0031] In a second aspect of the present application, an electrical device is provided, comprising the electrochemical device of any one of the above embodiments. The risk of the electrochemical device vibrating during a drop test and the risk of damage to the electrode assembly are reduced, thereby improving the reliability of the electrical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG1 is a schematic structural diagram of an electrochemical device provided in one embodiment of the present application.

[0033] FIG2 is an exploded schematic diagram of the electrochemical device in FIG1 .

[0034] FIG3 is a simplified cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0035] FIG4 is a simplified cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0036] FIG5 is a simplified cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0037] FIG6 is a simplified cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0038] FIG7 is a simplified cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0039] FIG8 is a simplified cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0040] FIG9 is a schematic partial cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0041] FIG10 is a side view of a first adhesive component provided in yet another embodiment of the present application.

[0042] FIG11 is a schematic partial cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0043] FIG12 is a side view of a first adhesive component provided in yet another embodiment of the present application.

[0044] FIG13 is a schematic diagram of an electrical device provided in an embodiment of the present application.

[0045] DESCRIPTION OF KEY EMBODIMENTS Electrochemical device 100 Housing 10 First sidewall 11 Second sidewall 12 Third sidewall 13 Fourth sidewall 14 Fifth sidewall 15 Sixth sidewall 16 Electrode assembly 20 First side surface 21 First region 211 Second region 212 Third region 213 Second side surface 22 Third side surface 23 Fourth side surface 24 Fifth side surface 25 Sixth side surface 26 First adhesive member 30 First side portion 31 First adhesive region 311 Fourth sub-adhesive region 311a Fifth sub-adhesive region 311b First adhesive layer 3111 First non-adhesive region 312 First sub-non-adhesive region 3121 Second sub-non-adhesive region 3122 Third sub-non-adhesive region 3123 First non-adhesive layer 312a Second adhesive region 313Sixth sub-adhesive region 313a Seventh sub-adhesive region 313b Second adhesive layer 3131 Second side portion 32 Third adhesive region 321 First sub-adhesive region 321a Second sub-adhesive region 321b Third sub-adhesive region 321c Third adhesive layer 3211 Fourth adhesive layer 3212 Fifth adhesive layer 3213 Third non-adhesive region 322 Third non-adhesive layer 322a Fourth non-adhesive region 323 Fourth non-adhesive layer 323a Base material layer 301 Second adhesive component 40 Third side portion 41 Fourth adhesive region 411 Second non-adhesive region 412 Fifth adhesive region 413 Fourth side portion 42 Sixth adhesive region 421 Tab 50 Device body 200 Electrical device 1000 First direction X Second direction Y Third direction Z

[0046] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be described below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0048] It should be noted that, in this application, the center of a region refers to the center of gravity of the planar shape of the region when the region is a continuous entity. It is understood that the center of gravity of a planar shape can be determined by the hanging method: suspend the planar shape with a thin wire, draw a straight line vertically from the starting point of the thin wire, suspend the planar shape again with a different endpoint from the first, and draw another straight line using the same method. The intersection of the two straight lines is the center of gravity of the planar shape. When the region is composed of multiple discrete regions, the center of the region is the center of the minimum circumscribed circle containing the multiple discrete regions. It is understood that the minimum circumscribed circle is the circle with the smallest radius that contains the multiple discrete regions.

[0049] It will be understood that when a component is referred to as being "connected to" another component, it may be directly connected to the other component or there may be an intervening component. When a component is referred to as being "disposed on" another component, it may be directly disposed on the other component or there may be an intervening component. The terms "top," "bottom," and similar expressions used herein are for illustrative purposes only.

[0050] The terms "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implying the quantity, specific order or primary and secondary relationship of the technical features indicated.

[0051] The term "perpendicular" is used to describe an ideal relationship between two components. In actual production or use, two components can be approximately perpendicular to each other. The two components described as "perpendicular" do not necessarily need to be absolutely straight lines or planes; they can be roughly straight lines or planes. From a macroscopic perspective, a component is considered "straight" or "planar" if its overall extension is a straight line or plane.

[0052] It should be understood that the sizes and thicknesses of the components shown in the drawings are for better understanding and more convenient description, and the present application is not limited to the sizes and thicknesses shown in the drawings.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0054] The following will describe some embodiments of the present application in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0055] 1 and 2 , an embodiment of the present application provides an electrochemical device 100 , which includes a housing 10 , an electrode assembly 20 , and a first adhesive component 30 . The electrode assembly 20 is disposed within the housing 10 , and the first adhesive component 30 is disposed between the housing 10 and the electrode assembly 20 , bonding the housing 10 and the electrode assembly 20 .

[0056] In some embodiments, referring to FIG. 1 and FIG. 3 , the housing 10 includes a first side wall 11 and a second side wall 12 oppositely disposed along a first direction X, and the electrode assembly 20 is located between the first side wall 11 and the second side wall 12 .

[0057] In some embodiments, referring to Figures 1 and 3 , the housing 10 further includes a third sidewall 13, a fourth sidewall 14, a fifth sidewall 15, and a sixth sidewall 16. The third sidewall 13 and the fourth sidewall 14 are disposed opposite each other along a second direction Y, and the fifth sidewall 15 and the sixth sidewall 16 are disposed opposite each other along a third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. The first sidewall 11, the second sidewall 12, the third sidewall 13, the fourth sidewall 14, the fifth sidewall 15, and the sixth sidewall 16 enclose a space for accommodating the electrode assembly 20.

[0058] In some embodiments, the electrochemical device 100 is a soft-pack battery, and the housing 10 is an aluminum-plastic film. In other embodiments, the electrochemical device 100 is a steel-cased battery, and the housing 10 is a steel casing.

[0059] In some embodiments, the electrode assembly 20 includes a positive electrode sheet, a negative electrode sheet and a separator. The positive electrode sheet, the negative electrode sheet and the separator can be stacked to form a laminated structure, or the positive electrode sheet, the negative electrode sheet and the separator can be stacked and wound to form a wound structure.

[0060] In some embodiments, the positive electrode sheet includes a positive electrode current collector and a positive electrode active material layer disposed on the positive electrode current collector; the negative electrode sheet includes a negative electrode current collector and a negative electrode active material layer disposed on the negative electrode current collector.

[0061] In some embodiments, a portion of the positive electrode collector is provided with a positive electrode active material layer, and a portion of the positive electrode collector is not provided with a positive electrode active material layer; a portion of the negative electrode collector is provided with a negative electrode active material layer, and a portion of the negative electrode collector is not provided with a negative electrode active material layer.

[0062] Among them, the positive electrode current collector and the negative electrode current collector can be a metal layer. As an illustrative example, the positive electrode current collector can be a metal layer including at least one of aluminum, nickel, tantalum, and titanium, such as aluminum foil. The positive electrode active material layer includes a positive electrode active material, and the positive electrode active material can include at least one of lithium cobalt oxide, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide, lithium iron phosphate, lithium manganese iron phosphate, or lithium manganese oxide. The negative electrode current collector can be a metal layer including at least one of copper, nickel, tantalum, and titanium, such as copper foil. The negative electrode active material layer includes a negative electrode active material, and the negative electrode active material can include at least one of graphite, hard carbon, soft carbon, silicon, silicon-oxygen material, and silicon-carbon material.

[0063] In some embodiments, the outermost ring of the electrode assembly 20 has a positive electrode current collector layer without a positive electrode active material layer, and the positive electrode current collector is aluminum foil.

[0064] 3 , the electrode assembly 20 includes a first side surface 21, a second side surface 22, and a third side surface 23. Along a first direction X, the first side surface 21 and the second side surface 22 are oppositely disposed, and the third side surface 23 is located between the first side surface 21 and the second side surface 22.

[0065] In some embodiments, referring to FIG. 3 , the first side surface 21 is adjacent to the first side wall 11 relative to the second side wall 12. The first side surface 21 is disposed opposite the first side wall 11, and the second side surface 22 faces away from the first side wall 11. The second side surface 22 is adjacent to the second side wall 12 relative to the first side wall 11, and the third side surface 23 is adjacent to the third side wall 13 relative to the fourth side wall 14.

[0066] In some embodiments, referring to FIG. 3 , the first side surface 21 includes a first region 211 , a second region 212 , and a third region 213 . Along the second direction Y, the second region 212 is located between the first region 211 and the third region 213 .

[0067] In some embodiments, referring to FIG. 3 , the electrode assembly 20 further includes a fourth side surface 24 , which is located between the first side surface 21 and the second side surface 22 . The third side surface 23 and the fourth side surface 24 are disposed opposite each other along the second direction Y. The fourth side surface 24 is adjacent to the fourth side surface 14 relative to the third side surface 13 .

[0068] In some embodiments, the electrode assembly 20 is a wound structure, and the third side surface 23 and the fourth side surface 24 are arc-shaped side surfaces.

[0069] In some embodiments, referring to FIG. 2 , the electrode assembly 20 further includes a fifth side surface 25 and a sixth side surface 26 , and the fifth side surface 25 and the sixth side surface 26 are disposed opposite to each other along the third direction Z.

[0070] In some embodiments, referring to Figures 1 and 2 , the electrochemical device 100 further includes a tab 50 , which is connected to the electrode assembly 20 . The tab 50 extends out of the housing 10 along the third direction Z, from the fifth side surface 25 or the sixth side surface 26 of the electrode assembly 20 , to direct the polarity of the electrode assembly 20 . When the tab 50 is connected to the positive electrode tab of the electrode assembly 20 , it is a positive electrode tab 50 ; when the tab 50 is connected to the negative electrode tab of the electrode assembly 20 , it is a negative electrode tab 50 . The tab 50 can be made of copper or aluminum, without specific limitation herein.

[0071] In some embodiments, referring to FIG. 3 , the first adhesive component 30 includes a first side portion 31 and a second side portion 32 disposed opposite each other. The first side portion 31 is adjacent to the electrode assembly 20 relative to the second side portion 32. The first side portion 31 includes a first adhesive region 311, a first non-adhesive region 312, and a second adhesive region 313, which are sequentially disposed. The first adhesive region 311 is bonded to the first side surface 21, and the second adhesive region 313 is bonded to the second side surface 22. The second side portion 32 includes a third adhesive region 321, which is bonded to the housing 10. Along the second direction Y, the projection of the first non-adhesive region 312 overlaps with the third side surface 23, and the projection of the third adhesive region 321 overlaps with the third side surface 23. The second direction Y is perpendicular to the first direction X.

[0072] The electrode assembly 20 is connected to the housing 10 via the first bonding area 311, the second bonding area 313, and the third bonding area 321 of the first bonding member 30. This helps limit relative movement between the electrode assembly 20 and the housing 10, thereby reducing the risk of the electrode assembly 20 moving within the housing 10 when the electrochemical device 100 is impacted. The first bonding member 30 is provided with a first non-bonding area 312 that is not bonded to the first side surface 21. This helps reduce the impact force transmitted from the first bonding member 30 to the electrode assembly 20 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer electrode sheets of the electrode assembly 20. Furthermore, the first bonding area 311 is bonded to the first side surface 21, while the second bonding area 313 is bonded to the second side surface 22. This disperses the impact force transmitted from the first bonding member 30 to the electrode assembly 20, further reducing the risk of movement of the electrode assembly 20 within the housing 10 when the electrochemical device 100 is impacted, and further reducing the risk of damage to the outer electrode sheets of the electrode assembly 20.

[0073] 3 is a simplified cross-sectional view of the electrochemical device 100 . To make the drawing clearer, the electrode assembly 20 in the drawing of the present application omits the detailed structure of the electrode stacking or winding.

[0074] In some embodiments, referring to FIG. 3 , the electrochemical device 100 further includes a second adhesive component 40 disposed between the housing 10 and the electrode assembly 20. The second adhesive component 40 includes opposing third and fourth side portions 41 and 42. The third side portion 41 includes a fourth adhesive region 411, a second non-adhesive region 412, and a fifth adhesive region 413, arranged in sequence. The fourth adhesive region 411 is bonded to the first side 21, and the fifth adhesive region 413 is bonded to the second side 22. The fourth side portion 42 includes a sixth adhesive region 421, which is bonded to the housing 10. Along the second direction Y, the projection of the second non-adhesive region 412 overlaps with the fourth side 24, and the projection of the sixth adhesive region 421 overlaps with the fourth side 24. The second non-adhesive region 412 helps reduce the impact force transmitted from the second adhesive component 40 to the electrode assembly 20 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer electrode plates of the electrode assembly 20. In addition, the fourth bonding area 411 is bonded to the first side surface 21, and the fifth bonding area 413 is bonded to the second side surface 22, which disperses the impact force transmitted from the second bonding component 40 to the electrode assembly 20, and helps to further reduce the risk of the electrode assembly 20 moving inside the shell 10 when the electrochemical device 100 is impacted, and also helps to further reduce the risk of damage to the outer ring electrode of the electrode assembly 20.

[0075] The electrode assembly 20 in the above embodiment is connected to the shell 10 through the first adhesive component 30 and the second adhesive component 40, which is beneficial to reducing the risk of the electrode assembly 20 moving inside the shell 10 when the electrochemical device 100 is impacted. The first adhesive component 30 and the second adhesive component 40 transfer the impact force of the shell 10 to both sides of the electrode assembly 20 in the second direction Y, which is beneficial to dispersing the impact force on the electrode assembly 20 and further reducing the risk of damage to the outer ring electrode of the electrode assembly 20.

[0076] In some embodiments, referring to FIG3 , the first region 211 is connected to the third side surface 23, and the third region 213 is connected to the fourth side surface 24. The first bonding area 311 is bonded to the first region 211, and the fourth bonding area 411 is bonded to the third region 213. This facilitates the first bonding member 30 and the second bonding member 40 to disperse the impact force to the regions at both ends of the electrode assembly 20 along the second direction Y, thereby further reducing the risk of damage to the outer electrode sheets of the electrode assembly 20.

[0077] The following describes an embodiment of the first adhesive member 30 . For clarity, the distances between components that are close to each other are exaggerated in the drawings. The embodiment of the second adhesive member 40 can refer to the embodiment of the first adhesive member 30 .

[0078] In some embodiments, referring to FIG. 3 , the first direction X is the thickness direction of the electrode assembly 20 .

[0079] In some embodiments, referring to FIG. 4 , the second direction Y is the thickness direction of the electrode assembly 20. This configuration allows the first adhesive component 30 to adhere to the side surfaces of the electrode assembly 20 in the width or length direction, thereby reducing the risk of damage to the outer electrode sheets of the electrode assembly 20. Furthermore, when the second direction Y is the thickness direction of the electrode assembly 20, it is also beneficial to increase the bonding area between the first adhesive component 30 and the housing 10, thereby improving the bond strength between the first adhesive component 30 and the housing 10.

[0080] In some embodiments, referring to FIG. 5 , the first non-adhesive region 312 includes a first sub-non-adhesive region 3121 and a second sub-non-adhesive region 3122, with the second sub-non-adhesive region 3122 located between the first adhesive region 311 and the first sub-non-adhesive region 3121. Along the second direction Y, the projection of the first sub-non-adhesive region 3121 overlaps the third side surface 23, while along the first direction X, the projection of the second sub-non-adhesive region 3122 overlaps the first side surface 21. This arrangement facilitates extending the first non-adhesive region 312 to one side of the first side surface 21, thereby reducing the impact force transmitted from the first adhesive component 30 to the electrode assembly 20 and further reducing the pulling force of the first adhesive component 30 on the first side surface 21, thereby reducing the risk of damage to the outer electrode plates of the electrode assembly 20.

[0081] In some embodiments, as shown in FIG5 , the first non-adhesive region 312 includes a first sub-non-adhesive region 3121 and a third sub-non-adhesive region 3123. The third sub-non-adhesive region 3123 is located between the second adhesive region 313 and the first sub-non-adhesive region 3121. Along the second direction Y, the projection of the first sub-non-adhesive region 3121 covers the third side surface 23. Along the first direction X, the projection of the third sub-non-adhesive region 3123 overlaps the second side surface 22. This arrangement facilitates extending the first non-adhesive region 312 to one side of the second side surface 22, thereby reducing the impact force transmitted from the first adhesive component 30 to the electrode assembly 20 and further reducing the pulling force of the first adhesive component 30 on the second side surface 22, thereby reducing the risk of damage to the outer electrode sheet of the electrode assembly 20.

[0082] In some embodiments, referring to FIG. 5 , the second side portion 32 further includes a third non-adhesive region 322 and a fourth non-adhesive region 323, with the third non-adhesive region 321 being located between the third non-adhesive region 322 and the fourth non-adhesive region 323. Along the first direction X, the projection of the third non-adhesive region 322 overlaps with the first adhesive region 311, and the projection of the fourth non-adhesive region 323 overlaps with the second adhesive region 313. Along the second direction Y, the projection of the third adhesive region 321 is located within the projection of the first non-adhesive region 312, so the third non-adhesive region 322 overlaps with the first non-adhesive region 312, and the fourth non-adhesive region 323 overlaps with the first non-adhesive region 312.

[0083] In the above embodiment, the first adhesive component 30 has a part that is neither bonded to the shell 10 nor to the electrode assembly 20. When the electrochemical device 100 is impacted, the force of the shell 10 is transmitted to the electrode assembly 20 and is absorbed by the local deformation dissipation of the first adhesive component 30. While suppressing the relative position movement of the electrode assembly 20 and the shell 10, the force transmitted to the electrode assembly 20 by the first adhesive component 30 is further reduced, thereby reducing the risk of damage to the outer ring electrode of the electrode assembly 20.

[0084] In some embodiments, referring to FIG6 , along the second direction Y, the projection of the third bonding area 321 covers the third side surface 23 , which is beneficial to increasing the bonding area between the shell 10 and the first bonding component 30 , and is beneficial to improving the bonding firmness between the shell 10 and the first bonding component 30 , and reducing the risk of the first bonding component 30 detaching from the shell 10 , thereby helping to suppress the movement of the electrode assembly 20 .

[0085] In some embodiments, referring to FIG6 , the third bonding area 321 includes a first sub-bonding area 321a and a second sub-bonding area 321b . The first sub-bonding area 321a is located between the third side surface 23 and the third side wall 13 , and the second sub-bonding area 321b is located between the first side surface 21 and the first side wall 11 , which is beneficial to increasing the bonding area between the shell 10 and the first bonding component 30 , and is beneficial to increasing the bonding firmness between the shell 10 and the first bonding component 30 , and reducing the risk of the first bonding component 30 detaching from the shell 10 , thereby helping to suppress the movement of the electrode assembly 20 .

[0086] In some embodiments, referring to FIG6 , the third bonding area 321 includes a first sub-bonding area 321a and a third sub-bonding area 321c. The first sub-bonding area 321a is located between the third side surface 23 and the third side wall 13, and the third sub-bonding area 321c is located between the second side surface 22 and the second side wall 12. This is beneficial to increasing the bonding area between the shell 10 and the first bonding component 30, and is beneficial to increasing the bonding firmness between the shell 10 and the first bonding component 30, and reducing the risk of the first bonding component 30 detaching from the shell 10, thereby helping to suppress the movement of the electrode assembly 20.

[0087] In some embodiments, referring to FIG5 , along the first direction X, the projection of the third bonding area 321 does not overlap with the first side surface 21 . This arrangement is beneficial for reducing or eliminating the local area where the first bonding component 30 is bonded to both the shell 10 and the electrode assembly 20 . This is beneficial for making it easier for the first bonding component 30 to absorb the force transmitted by the shell 10 through deformation dissipation when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer ring electrode of the electrode assembly 20 .

[0088] In some embodiments, referring to FIG5 , along the first direction X, the projection of the third bonding area 321 does not overlap with the second side surface 22 . This arrangement is beneficial for reducing or eliminating the local area where the first bonding component 30 is bonded to both the shell 10 and the electrode assembly 20 . This is beneficial for making it easier for the first bonding component 30 to absorb the force transmitted by the shell 10 through deformation dissipation when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer ring electrode of the electrode assembly 20 .

[0089] In some embodiments, referring to FIG. 7 , the first direction X is the thickness direction of the electrode assembly 20. The first bonding area 311 includes a fourth sub-bonding area 311a and a fifth sub-bonding area 311b. The fourth sub-bonding area 311a is located between the first side surface 21 and the first sidewall 11, and the fifth sub-bonding area 311b is located between the third side surface 23 and the third sidewall 13. This arrangement allows the first bonding component 30 to bond to a portion of the third side surface 23, increasing the bonding area between the first bonding component 30 and the electrode assembly 20 and broadening the distribution of the bonding area. This helps to enhance the bond strength between the first bonding component 30 and the third side surface 23 and prevent movement of the electrode assembly 20.

[0090] In some embodiments, referring to FIG. 7 , the first direction X is the thickness direction of the electrode assembly 20. The second bonding area 313 includes a sixth sub-bonding area 313a and a seventh sub-bonding area 313b. The sixth sub-bonding area 313a is located between the second side surface 22 and the second sidewall 12, and the seventh sub-bonding area 313b is located between the third side surface 23 and the third sidewall 13. This arrangement allows the first bonding component 30 to bond to a portion of the third side surface 23, increasing the bonding area between the first bonding component 30 and the electrode assembly 20 and broadening the distribution of the bonding area. This helps to enhance the bond strength between the first bonding component 30 and the third side surface 23 and prevent movement of the electrode assembly 20.

[0091] In some embodiments, referring to FIG8 , the first direction X is the thickness direction of the electrode assembly 20. Along the first direction X, the thickness of the electrode assembly 20 is T, and along the second direction Y, the width of the electrode assembly 20 is W. The projection of the third bonding area 321 along the second direction Y onto the first direction X has a length T1, satisfying 0.5T≤T1≤T. This helps the first bonding member 30 suppress movement of the electrode assembly 20 and reduces the risk of damage to the outer electrode plates of the electrode assembly 20.

[0092] In some embodiments, referring to FIG8 , the first direction X is the thickness direction of the electrode assembly 20. The projection of the first bonding area 311 along the first direction X onto the second direction Y has a length W1, satisfying 0.1W≤W1≤0.5W. This helps the first bonding member 30 inhibit movement of the electrode assembly 20 and reduces the risk of damage to the outer electrode plates of the electrode assembly 20.

[0093] In some embodiments, referring to FIG8 , the first direction X is the thickness direction of the electrode assembly 20. The projection of the second bonding area 313 along the first direction X onto the second direction Y has a length W2, satisfying 0.1W≤W2≤0.5W. This helps the first bonding member 30 inhibit movement of the electrode assembly 20 and reduces the risk of damage to the outer electrode plates of the electrode assembly 20.

[0094] In some embodiments, referring to FIG8 , the first direction X is the thickness direction of the electrode assembly 20. Along the second direction Y, the distance between the third bonding area 321 and the first bonding area 311 is h1, where h1 ≤ 0.25 T. This helps shorten the distance between the bonding areas on both sides of the first bonding member 30, helps the first bonding member 30 suppress movement of the electrode assembly 20, and reduces the risk of damage to the outer electrode plates of the electrode assembly 20.

[0095] In some embodiments, referring to FIG8 , the first direction X is the thickness direction of the electrode assembly 20. Along the second direction Y, the distance between the third bonding area 321 and the second bonding area 313 is h2, where h2 ≤ 0.25 T. This helps shorten the distance between the bonding areas on both sides of the first bonding member 30, helps the first bonding member 30 suppress movement of the electrode assembly 20, and reduces the risk of damage to the outer electrode plates of the electrode assembly 20.

[0096] In some embodiments, referring to FIG4 , the second direction Y is the thickness direction of the electrode assembly 20. Along the second direction Y, the thickness of the electrode assembly 20 is T, and along the first direction X, the width of the electrode assembly 20 is W. The projection of the third bonding area 321 along the second direction Y onto the first direction X has a length L1, satisfying 0.5W ≤ L1 ≤ W. Meeting this condition helps reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer electrode plates of the electrode assembly 20.

[0097] In some embodiments, referring to FIG4 , the second direction Y is the thickness direction of the electrode assembly 20, and the length L2 of the projection of the first bonding area 311 along the first direction X onto the second direction Y satisfies 0.5T≤L2≤T. Meeting this condition helps reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer electrode plates of the electrode assembly 20.

[0098] In some embodiments, referring to FIG4 , the second direction Y is the thickness direction of the electrode assembly 20, and the length L3 of the projection of the second bonding area 313 along the first direction X onto the second direction Y satisfies 0.5T≤L3≤T. Meeting this condition helps reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode pieces of the electrode assembly 20.

[0099] In some embodiments, referring to FIG. 4 , the second direction Y is the thickness direction of the electrode assembly 20. Along the first direction X, the distance between the third bonding area 321 and the first bonding area 311 is h3, where h3 ≤ 0.25 W. This helps shorten the distance between the bonding areas on both sides of the first bonding member 30, helps the first bonding member 30 suppress movement of the electrode assembly 20, and reduces the risk of damage to the outer electrode plates of the electrode assembly 20.

[0100] In some embodiments, referring to FIG. 4 , the second direction Y is the thickness direction of the electrode assembly 20. Along the first direction X, the distance between the third bonding area 321 and the second bonding area 313 is h4, where h4 ≤ 0.25 W. This helps shorten the distance between the bonding areas on both sides of the first bonding member 30, helps the first bonding member 30 suppress movement of the electrode assembly 20, and reduces the risk of damage to the outer electrode plates of the electrode assembly 20.

[0101] In order to verify the effect of each bonding area of ​​the first bonding member 30 on the electrochemical device 100, the following drop test was conducted:

[0102] Lithium-ion soft-pack batteries with a rectangular maximum projection surface were selected for drop pass rate comparison. Twenty batteries were selected from each group for the drop pass rate comparison experiment. The batteries were dropped from six sides and four corners, with a drop height of 1.8 meters. After the drop, the shell 10 was observed to see if it was punctured or leaking, and the number of batteries with punctures or leaks was counted. If the shell 10 was not punctured or leaking, the lithium-ion soft-pack batteries were disassembled and the outer ring of the electrode assembly 20 was observed to see if there were any tears or damage to the outer ring of the electrode assembly. The number of batteries with punctures or damage to the outer ring of the electrode assembly was counted. If the shell 10 was not punctured or leaking, and the outer ring of the electrode assembly was not torn or damaged, the battery was judged to have passed the test; otherwise, the battery was judged to have failed the test. Pass rate = number of passes / 20 × 100%.

[0103] In the above test, the first direction X is the thickness direction of the electrode assembly 20. The thickness T of the electrode assembly 20 along the first direction X is 4.8 mm (millimeters). The width W of the electrode assembly 20 along the second direction Y is 64 mm. The length L of the electrode assembly 20 along the third direction Z is 87 mm. In Example 16, referring to FIG. 6 , the third bonding area 321 includes a first sub-bonding area 321 a, a second sub-bonding area 321 b, and a third sub-bonding area 321 c. The first sub-bonding area 321 a is located between the third side surface 23 and the third sidewall 13, the second sub-bonding area 321 b is located between the first side surface 21 and the first sidewall 11, and the third sub-bonding area 321 c is located between the second side surface 22 and the second sidewall 12. The length T1 of the first sub-bonding area 321 a in the first direction X is 4.8 mm, the length of the second sub-bonding area 321 b in the second direction Y is 12.8 mm, and the length of the third sub-bonding area 321 c in the second direction Y is 12.8 mm. In Example 17, please refer to Figure 7, the first bonding area 311 includes a fourth sub-bonding area 311a and a fifth sub-bonding area 311b, the second bonding area 313 includes a sixth sub-bonding area 313a and a seventh sub-bonding area 313b, the fourth sub-bonding area 311a is located between the first side surface 21 and the first side wall 11, the fifth sub-bonding area 311b is located between the third side surface 23 and the third side wall 13, the sixth sub-bonding area 313a is located between the second side surface 22 and the second side wall 12, and the seventh sub-bonding area 313b is located between the third side surface 23 and the third side wall 13, the lengths of the fourth sub-bonding area 311a and the sixth sub-bonding area 313a in the second direction Y are both 10.8 mm, and the lengths of the fifth sub-bonding area 311b and the seventh sub-bonding area 313b in the first direction X are both 2 mm.

[0104] In the comparative example, a double-sided tape with a length of 60.9 mm and a width of 38 mm was used to bond the first side wall 11 to the first side surface 21. Table 1 below shows the dimensional data of each bonding area of ​​the first bonding component 30 and the test results in the above test.

[0105] Table 1: Test results of dimensional changes of each bonding area in the first bonding component 30

[0106] Referring to the contents of Table 1 above, it can be seen that when at least one of the conditions of 0.5T≤T1≤T, 0.1W≤W1≤0.5W, 0.1W≤W2≤0.5W, h1≤0.25T and h2≤0.25T is met, the pass rate of the battery drop test is better, which is beneficial to reducing the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode of the electrode assembly 20.

[0107] In order to verify the influence of each bonding area of ​​the first bonding component 30 on the electrochemical device 100, a drop test as recorded in Table 2 was also conducted. The difference between this test and the drop test recorded in Table 1 is that the first direction X of the test in Table 2 is the width direction of the electrode assembly 20, the width W of the electrode assembly 20 along the first direction X is 64 mm, the thickness T of the electrode assembly 20 along the second direction Y is 4.8 mm, and the length L of the electrode assembly 20 along the third direction Z is 87 mm.

[0108] In the comparative example in Table 2, a double-sided tape with a length of 60.9 mm and a width of 38 mm was used to bond the first side wall 11 to the first side surface 21. Table 2 below shows the dimensional data of each bonding area of ​​the first bonding component 30 in the above test and the test results.

[0109] Table 2: Test results of dimensional changes of each bonding area in the first bonding component 30

[0110] Referring to the contents of Table 2 above, it can be seen that when at least one of the conditions of 0.5W≤L1≤W, 0.5T≤L2≤T, 0.5T≤L3≤T, h3≤0.25W and h4≤0.25W is met, the pass rate of the battery drop test is better, which is beneficial to reducing the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode of the electrode assembly 20.

[0111] In some embodiments, referring to Figures 9 and 10 , the first adhesive component 30 includes a first substrate layer 301, a first adhesive layer 3111, a second adhesive layer 3131, and a third adhesive layer 3211. The first substrate layer 301 is disposed between the housing 10 and the electrode assembly 20. The first adhesive layer 3111 is disposed on the surface of the first substrate layer 301 facing the first side surface 21. The second adhesive layer 3131 is disposed on the surface of the first substrate layer 301 facing the second side surface 22. The third adhesive layer 3211 is disposed on the surface of the first substrate layer 301 facing the housing 10. In this embodiment, the first adhesive component 30 is formed of a single piece of tape having double-sided adhesive layers. Compared to a bonding structure formed by bonding multiple pieces of tape, this structure helps reduce the overall thickness of the electrochemical device 100 and improves the energy density of the electrochemical device 100.

[0112] In some embodiments, referring to FIG. 11 , the first adhesive component 30 further includes a fourth adhesive layer 3212. The fourth adhesive layer 3212 is disposed on the surface of the first substrate layer 301 facing the housing 10. The fourth adhesive layer 3212 is bonded to the first sidewall 11 of the housing 10. The fourth adhesive layer 3212 helps to enhance the bond strength between the housing 10 and the first adhesive component 30, reduces the risk of the first adhesive component 30 detaching from the housing 10, and thereby helps to suppress movement of the electrode assembly 20.

[0113] It can be understood that the fourth adhesive layer 3212 and the third adhesive layer 3211 can be two independent adhesive layers; the third adhesive layer 3211 and the fourth adhesive layer 3212 can also be adhesive layers of an integrated structure, for example, the integrated adhesive layer at different positions is divided into the third adhesive layer 3211 and the fourth adhesive layer 3212.

[0114] In some embodiments, referring to FIG. 11 , the first adhesive component 30 further includes a fifth adhesive layer 3213. The fifth adhesive layer 3213 is disposed on the surface of the first substrate layer 301 facing the housing 10. The fifth adhesive layer 3213 is bonded to the second sidewall 12 of the housing 10. The fifth adhesive layer 3213 helps to enhance the bond strength between the housing 10 and the first adhesive component 30, reduces the risk of the first adhesive component 30 detaching from the housing 10, and thereby helps to suppress movement of the electrode assembly 20.

[0115] It can be understood that the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 can be three independent adhesive layers; the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 can also be adhesive layers of an integrated structure, for example, the integrated adhesive layers at different positions are divided into the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213.

[0116] It should be noted that when the first adhesive component 30 is composed of the first substrate layer 301, the first adhesive layer 3111, and the second adhesive layer 3131, the first adhesive layer 3111 forms the first adhesive region 311, the second adhesive layer 3131 forms the second adhesive region 313, and the third adhesive layer 3211 forms the third adhesive region 321. When the first adhesive component 30 is composed of the first substrate layer 301, the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213, the first adhesive layer 3111 forms the first adhesive region 311, the second adhesive layer 3131 forms the second adhesive region 313, and the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 collectively form the third adhesive region 321.

[0117] In some embodiments, referring to FIG5 , a portion of the surface of the substrate layer 301 facing the electrode assembly 20 is exposed to form a first non-adhesive region 312, a portion of the surface of the substrate layer 301 facing the housing 10 is exposed to form a third non-adhesive region 322, and a portion of the surface of the substrate layer 301 facing the housing 10 is exposed to form a fourth non-adhesive region 323. This arrangement eliminates the need for multiple tapes to achieve partial non-adhesion between the first adhesive component 30 and the housing 10, and partial non-adhesion between the first adhesive component 30 and the electrode assembly 20, thereby reducing the overall thickness of the electrochemical device 100 and improving the energy density of the electrochemical device 100.

[0118] In some embodiments, the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212 and the fifth adhesive layer 3213 can be adhesive substances that are sticky at room temperature without activation; the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212 and the fifth adhesive layer 3213 can also be adhesive substances that are not sticky at room temperature but are activated after a hot pressing process.

[0119] It can be understood that the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212 and the fifth adhesive layer 3213 can be formed by coating an adhesive on a preset area of ​​the substrate layer 301; or the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212 and the fifth adhesive layer 3213 can be formed by coating an adhesive on both sides of the substrate layer 301 and then removing excess adhesive locally.

[0120] In some embodiments, the material of the substrate layer 301 can be any one of PET (polyethylene terephthalate), PVC (polyvinyl chloride) or PI (polyimide).

[0121] In some embodiments, the material of the first adhesive layer 3111 includes at least one of polymethyl methacrylate, polypropylene, polyethylene, polyamide, styrene-butadiene rubber, nitrile rubber, butadiene rubber, isoprene rubber, ethylene-propylene rubber, and chloroprene rubber. The materials of the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 may be the same as or different from the material of the first adhesive layer 3111.

[0122] In some other embodiments, please refer to Figure 12, the first adhesive component 30 also includes a first non-adhesive layer 312a, a third non-adhesive layer 322a and a fourth non-adhesive layer 323a, the first non-adhesive layer 312a is bonded to the surface of the first adhesive layer 3111 and / or the second adhesive layer 3131 to form a first non-adhesive area 312; the third non-adhesive layer 322a is bonded to the surface of the third adhesive layer 3211 to form a third non-adhesive area 322; the fourth non-adhesive layer 323a is bonded to the surface of the third adhesive layer 3211 to form a fourth non-adhesive area 323. In this way, after the first adhesive layer 3111, the second adhesive layer 3131 and the third adhesive layer 3211 are directly coated on the base material layer 301, the first non-adhesive layer 312a, the third non-adhesive layer 322a and the fourth non-adhesive layer 323a are bonded on the first adhesive layer 3111, the second adhesive layer 3131 and the third adhesive layer 3211 to form the first non-adhesive area 312, the third non-adhesive area 322 and the fourth non-adhesive area 323. By adjusting the area and setting position of the first non-adhesive layer 312a, the third non-adhesive layer 322a and the fourth non-adhesive layer 323a, the area and position of the first non-adhesive area 312, the third non-adhesive area 322 and the fourth non-adhesive area 323 can be adjusted, so that the formation method and adjustment method of the non-adhesive area have the advantages of simple operation, high efficiency and low cost.

[0123] It is understood that the first non-adhesive layer 312a, the third non-adhesive layer 322a, and the fourth non-adhesive layer 323a can be layers without adhesive on both sides, or layers with adhesive on one side and no adhesive on the other side. As an example, the base material layer 301, the first adhesive layer 3111, and the second adhesive layer 3131 form a double-sided tape, and the first non-adhesive layer 312a, the third non-adhesive layer 322a, and the fourth non-adhesive layer 323a are single-sided tape, and the first adhesive component 30 is composed of multiple tapes stacked together.

[0124] Please refer to FIG. 13 . An embodiment of the present application further provides an electrical device 1000 . The electrical device 1000 includes the electrochemical device 100 described above.

[0125] In some embodiments, referring to FIG. 13 , the power-consuming device 1000 further includes a device body 200 , and the electrochemical device 100 is installed in the device body 200 to supply power to the device body 200 .

[0126] In some embodiments, the electric device 1000 may be a mobile phone, a laptop computer, a tablet computer, etc., which are not listed here one by one.

[0127] Since the electrical equipment 1000 adopts the technical solution of any embodiment of the electrochemical device 100, it at least has the beneficial effects brought by the technical solution of any embodiment of the electrochemical device 100, which will not be described in detail here.

[0128] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not used to limit the present application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An electrochemical device, characterized in that, Comprising: A housing; An electrode assembly disposed within the housing, the electrode assembly including a first side, a second side, a third side, and a fourth side. Along a first direction, the first side and the second side are oppositely disposed. Along a second direction, the third side and the fourth side are oppositely disposed, and the third side and the fourth side are located between the first side and the second side, with the first direction perpendicular to the second direction; A first bonding member disposed between the housing and the electrode assembly, the first bonding member including opposite first and second side portions. The first side portion includes a first bonding region, a first non-bonding region, and a second bonding region arranged in sequence. The first bonding region is bonded to the first side, the second bonding region is bonded to the second side, and the second side portion includes a third bonding region bonded to the housing; Along the second direction, the projection of the first non-bonding region overlaps with the third side, and the projection of the third bonding region overlaps with the third side.

2. The electrochemical device according to claim 1, wherein Meeting any one of the following conditions: (1) The first direction is the thickness direction of the electrode assembly; (2) The second direction is the thickness direction of the electrode assembly.

3. The electrochemical device according to claim 1, characterized in that, The first bonding member meets at least one of the following conditions: (1) The first non-bonding region includes a first sub-non-bonding region and a second sub-non-bonding region, with the second sub-non-bonding region located between the first bonding region and the first sub-non-bonding region; along the second direction, the projection of the first sub-non-bonding region covers the third side; along the first direction, the projection of the second sub-non-bonding region overlaps with the first side; (2) The first non-bonding region includes a first sub-non-bonding region and a third sub-non-bonding region, with the third sub-non-bonding region located between the second bonding region and the first sub-non-bonding region; along the second direction, the projection of the first sub-non-bonding region covers the third side; along the first direction, the projection of the third sub-non-bonding region overlaps with the second side.

4. The electrochemical device according to claim 1, characterized in that, The housing includes a first side wall and a second side wall opposite along the first direction, and a third side wall and a fourth side wall opposite along the second direction; the first side is adjacent to the first side wall, the second side is adjacent to the second side wall, the third side is adjacent to the third side wall, and the electrochemical device meets at least one of the following conditions: (1) Along the second direction, the projection of the third bonding region covers the third side; (2) The third bonding region includes a first sub-bonding region and a second sub-bonding region, with the first sub-bonding region located between the third side and the third side wall, and the second sub-bonding region located between the first side and the first side wall; (3) The third bonding region includes a first sub-bonding region and a third sub-bonding region, with the first sub-bonding region located between the third side and the third side wall, and the third sub-bonding region located between the second side and the second side wall.

5. The electrochemical device according to claim 1, characterized in that, The housing includes a first side wall and a second side wall opposite to each other in a first direction, and a third side wall and a fourth side wall opposite to each other in a second direction; the first side surface is adjacent to the first side wall, the second side surface is adjacent to the second side wall, the third side surface is adjacent to the third side wall, and the electrochemical device satisfies at least one of the following conditions: (1) In the first direction, the projection of the third bonding area does not overlap with the first side surface; (2) In the first direction, the projection of the third bonding area does not overlap with the second side surface.

6. The electrochemical device according to claim 1, wherein, The first direction is the thickness direction of the electrode assembly. The housing includes a first side wall and a second side wall opposite to each other in a first direction, and a third side wall and a fourth side wall opposite to each other in a second direction; the first side surface is adjacent to the first side wall, the second side surface is adjacent to the second side wall, the third side surface is adjacent to the third side wall, and the electrochemical device satisfies at least one of the following conditions: (1) The first bonding area includes a fourth sub-bonding area and a fifth sub-bonding area. The fourth sub-bonding area is located between the first side surface and the first side wall, and the fifth sub-bonding area is located between the third side surface and the third side wall; (2) The second bonding area includes a sixth sub-bonding area and a seventh sub-bonding area. The sixth sub-bonding area is located between the second side surface and the second side wall, and the seventh sub-bonding area is located between the third side surface and the third side wall.

7. The electrochemical device according to claim 1, characterized in that, The first direction is the thickness direction of the electrode assembly; in the first direction, the thickness of the electrode assembly is T, and in the second direction, the width of the electrode assembly is W. The first bonding member satisfies at least one of the following conditions: (1) The length of the projection of the third bonding area in the first direction along the second direction is T1, and 0.5T ≤ T1 ≤ T; (2) The length of the projection of the first bonding area in the second direction along the first direction is W1, and 0.1W ≤ W1 ≤ 0.5W; (3) The length of the projection of the second bonding area in the second direction along the first direction is W2, and 0.1W ≤ W2 ≤ 0.5W; (4) In the second direction, the distance between the third bonding area and the first bonding area is h1, and h1 ≤ 0.25T; (5) In the second direction, the distance between the third bonding area and the second bonding area is h2, and h2 ≤ 0.25T.

8. The electrochemical device according to claim 1, characterized in that, The second direction is the thickness direction of the electrode assembly; in the second direction, the thickness of the electrode assembly is T, and in the first direction, the width of the electrode assembly is W. The first bonding member satisfies at least one of the following conditions: (1) The length of the projection of the third bonding area in the first direction along the second direction is L1, and 0.5W ≤ L1 ≤ W; (2) The length of the projection of the first bonding area in the second direction along the first direction is L2, and 0.5T ≤ L2 ≤ T; (3) The length of the projection of the second bonding area in the second direction along the first direction is L3, and 0.5T ≤ L3 ≤ T; (4) Along the first direction, the distance between the third bonding region and the first bonding region is h3, and h3 ≤ 0.25W; (5) Along the first direction, the distance between the third bonding region and the second bonding region is h4, and h4 ≤ 0.25W.

9. The electrochemical device according to claim 1, wherein The first bonding member includes a first base layer, a first bonding layer, a second bonding layer, and a third bonding layer. The first base layer is disposed between the housing and the electrode assembly. The first bonding layer is disposed on the surface of the first base layer facing the first side surface. The second bonding layer is disposed on the surface of the first base layer facing the second side surface. The third bonding layer is disposed on the surface of the first base layer facing the housing.

10. The electrochemical device according to any one of claims 1 to 9, characterized in that, The electrochemical device further includes a second bonding member disposed between the housing and the electrode assembly. The second bonding member includes an opposite third side portion and a fourth side portion. The third side portion includes a fourth bonding region, a second non-bonding region, and a fifth bonding region arranged in sequence. The fourth bonding region is bonded to the first side surface. The fifth bonding region is bonded to the second side surface. The fourth side portion includes a sixth bonding region, and the sixth bonding region is bonded to the housing; Along the second direction, the projection of the second non-bonding region overlaps with the fourth side surface, and the projection of the sixth bonding region overlaps with the fourth side surface.

11. An electrical device, characterized in that, Comprising the electrochemical device according to any one of claims 1 to 10.

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