Log data processing device, machining system, and measurement system

Abstract

This log data processing device is configured to comprise: a machining device that performs machining on a plurality of machining targets one by one; and a processing circuit that is configured so as to be capable of respectively identifying, from log data including time-series values pertaining to at least one of the plurality of machining targets to be machined, first partial log data pertaining to machining with respect to a first machining target among the plurality of machining targets, and second partial log data pertaining to machining with respect to a second machining target that is different from the first machining target among the plurality of machining targets.

Description

Log data processing device, processing system, and measurement system

[0001] The present disclosure relates to a log data information device, a processing system, and a measurement system for processing log data in processing a plurality of processing objects.

[0002] An example of a processing device that processes an object is described in Patent Document 1. One of the technical challenges of such a processing device is to appropriately acquire log data.

[0003] US Patent Application Publication No. 2015 / 0034266

[0004] The log data processing device according to the present disclosure includes a processing circuit configured to be able to identify first partial log data relating to the processing of a first processing object among the multiple processing objects, and second partial log data relating to the processing of a second processing object among the multiple processing objects that is different from the first processing object, from log data including time series values ​​relating to a processing device that processes multiple processing objects in sequence and at least one of the multiple processing objects to be processed.

[0005] The log data processing device according to the present disclosure includes a processing circuit configured to identify a plurality of processed portion log data corresponding to processing of any of a plurality of processing objects from log data including time series values ​​relating to a processing device that processes a plurality of processing objects in sequence and at least one of the plurality of processing objects to be processed.

[0006] The log data processing device according to the present disclosure includes a processing circuit configured to output, from log data including time series values ​​relating to a processing device that processes multiple processing objects in sequence and at least one of the multiple processing objects to be processed, first partial log data relating to processing of a first processing object among the multiple processing objects, and second partial log data relating to processing of a second processing object among the multiple processing objects that is different from the first processing object.

[0007] A log data processing device according to the present disclosure processes data sequentially output from a processing device that sequentially processes multiple processing objects held by a holder. The log data processing device according to the present disclosure includes a processing circuit configured to output, as first partial log data and second partial log data, a first portion of the data related to processing a first processing object among the multiple processing objects and a second portion of the data related to processing a second processing object different from the first processing object among the multiple processing objects.

[0008] FIG. 1 is a schematic diagram showing the overall configuration of a machining system. FIG. 2 is a schematic diagram showing the general configuration of a log data processing device. FIG. 3 is a block diagram showing the configuration of a machining device included in the machining system. FIG. 4 is a schematic diagram explaining an example of machining by the machining device. FIG. 5 is a schematic diagram showing an example of the arrangement of a machining target in the machining device. FIG. 6A is a schematic diagram showing a first state in a first example of movement of a machining head. FIG. 6B is a schematic diagram showing a second state in the first example of movement of the machining head. FIG. 6C is a schematic diagram showing a third state in the first example of movement of the machining head. FIG. 7A is a schematic diagram showing a first state in a second example of movement of the machining head. FIG. 7B is a schematic diagram showing a second state in the second example of movement of the machining head. FIG. 8 is a diagram showing an example of time-series values ​​included in log data. FIG. 9 is a schematic diagram showing the general configuration of a log data processing device. FIG. 10 is a diagram showing an example of information included in a machining report output by the log data processing device. FIG. 11 is a flowchart of log data processing. Fig. 12 is a flowchart showing the flow of the weld pool feedback control operation, Fig. 13 is a diagram showing a weld pool image, and Fig. 14 is a diagram showing multiple weld pool images and an additive image acquired as time-series data.

[0009] Hereinafter, a log data processing device, a processing system, and a measurement system according to the present disclosure will be described in detail with reference to the drawings.

[0010] FIG. 1 is a schematic diagram showing the overall configuration of a processing system 100.

[0011] In this embodiment, the processing system 100 includes a processing device 1, a measuring device 2, a control device 3, and a log data processing device 4. The processing device 1, the measuring device 2, the control device 3, and the log data processing device 4 are communicatively connected via a communication network NW. The communication network NW includes a wired local area network. The communication network NW may include a wireless local area network, a wireless wide area network, or other communication networks. The number of each of the processing device 1, the measuring device 2, the control device 3, and the log data processing device 4 included in the processing system 100 is not limited to one, and may be two or more. Furthermore, the number of each of these devices does not have to be the same.

[0012] The processing device 1 can perform processing on each of a plurality of processing targets included in the workpiece W. The processing device 1 may be configured to perform at least one of various processes on the processing targets, including cutting, welding, screwing, polishing, and painting.

[0013] The processing apparatus 1 of this embodiment performs additive processing on a processing target, which is a workpiece W. That is, the processing apparatus 1 adds material to the processing target on the surface of the workpiece W to form a structure on the workpiece W. The structure formed on the surface of the workpiece W by the processing apparatus 1 may be, for example, a three-dimensional structure ST having a size in all three-dimensional directions. The three-dimensional structure ST may be integrated with the workpiece W or may be separable from the workpiece W.

[0014] The processing apparatus 1 may perform additive processing using any additive processing method capable of forming a shaped object. Examples of additive processing methods include laser metal deposition (LMD), powder bed fusion (PBB) methods such as selective laser sintering (SLS), binder jetting, material jetting, stereolithography, and laser metal fusion (LMF). Note that laser metal deposition may also be referred to as directed energy deposition (DED).

[0015] The processing device 1 may be configured to perform subtractive processing on the workpiece W in addition to or instead of performing additive processing. That is, the processing device 1 may be capable of performing subtractive processing to remove a portion of the workpiece W. Note that the processing device 1 may perform subtractive processing on a shaped object formed on the workpiece W by the processing device 1 in addition to or instead of performing subtractive processing on the workpiece W. The processing device 1 may also repair a workpiece W that needs repair by performing subtractive processing. The processing device 1 may perform repair by subtractive processing in combination with repair by additive processing.

[0016] The processing apparatus 1 has a chamber space 1A capable of accommodating a workpiece W for processing. The workpiece W is accommodated in the chamber space 1A prior to processing, and is removed from the chamber space 1A after processing is completed.

[0017] The workpiece W has a plurality of processing targets to be processed. The processing device 1 processes the plurality of processing targets of the workpiece W in sequence. The plurality of processing targets may be included in a plurality of processing targets, or may be a plurality of different parts of a single processing target. In this case, each of the plurality of different parts may have a common function. Furthermore, the plurality of processing targets may be parts of each of the plurality of processing targets. Each of the plurality of processing targets may be a plurality of items of the same type (for example, turbine blades, propeller blades of a windmill or electric fan, thrusters).

[0018] The measuring device 2 measures the workpiece W before the processing device 1 starts processing the workpiece W. In this embodiment, the measuring device 2 measures the three-dimensional shape of the workpiece W. The measuring device 2 has a measurement space (not shown) that can accommodate the workpiece W for measurement. The workpiece W is accommodated in the measurement space prior to measurement. Note that by measuring the three-dimensional shape of the workpiece W, the measuring device 2 can identify the position of the workpiece W (e.g., the position of the surface of the workpiece W) in three-dimensional space in the measurement coordinate system of the measuring device 2. For this reason, measuring the three-dimensional shape of the workpiece W can be said to be essentially equivalent to measuring the position of the workpiece W.

[0019] The measuring device 2 further generates processing control information. The processing control information is control information used to control the processing device 1 to process the workpiece W. For example, the processing control information may include processing path information. The processing path information may indicate a target movement path, which is a path to a target irradiation position along which the processing light EL should be irradiated to process the workpiece W. This target movement path may be referred to as a processing path or a tool path. In this case, the measuring device 2 may generate a G-code indicating the processing path or tool path as the processing control information. The measuring device 2 may generate a data file with an extension such as gcode or gco as the processing control information. The processing control information generated by the measuring device 2 is transmitted from the measuring device 2 to the processing device 1 via the communication network NW.

[0020] The processing device 1 receives (i.e., acquires) processing control information transmitted from the measuring device 2. The processing device 1, which has received the processing path information, processes the workpiece W based on the received processing control information. Therefore, after the measuring device 2 measures the three-dimensional shape of the workpiece W, the workpiece W is transported from the measuring device 2 to the processing device 1. Specifically, the workpiece W is removed from the measurement space of the measuring device 2, and the removed workpiece W is transported to the processing device 1. For example, the workpiece W may be transported from the measuring device 2 to the processing device 1 by a transport device (not shown). Note that the workpiece W may be transported from the measuring device 2 to the processing device 1 by a user of the processing system 100 (in other words, by means other than the transport device). In other words, the processing system 100 does not need to be equipped with a transport device. The workpiece W transported to the processing device 1 is placed (in other words, placed or attached) in the chamber space 1A of the processing device 1. As a result, the processing device 1 can process the workpiece W.

[0021] 1, the processing system 100 includes a processing apparatus 1 and a measuring apparatus 2, which are separate devices. However, the processing system 100 may include an apparatus in which the processing apparatus 1 and the measuring apparatus 2 are integrated. In other words, the processing apparatus 1 and the measuring apparatus 2 may be integrated. In this case, at least a part of the measurement space and the chamber space 1A are shared.

[0022] The control device 3 controls the operation of the entire processing system 100. For example, the control device 3 may control the operation of the processing device 1. The control device 3 may also control the operation of the measuring device 2.

[0023] The control device 3 is a computer having a communication interface 31, a memory 32, and a processor 33. The processor 33 executes a computer program 320 stored in the memory 32, causing the control device 3 to perform a predetermined operation, such as transmitting a signal to the processing device 1 via the communication interface 31 and the communication network NW.

[0024] The control device 3 may be configured as an edge server. In this case, the control device 3 is communicatively connected to at least one of the processing device 1 and the measuring device 2 via a communication network NW. The control device 3 may also be configured as a cloud server. In this case, the control device 3 is communicatively connected to at least one of the processing device 1 and the measuring device 2 via the communication network NW and the Internet (not shown).

[0025] FIG. 2 is a block diagram showing the configuration of the processing device 1 included in the processing system 100, and FIG. 3 is a schematic diagram illustrating an example of processing performed by the processing device 1.

[0026] The processing device 1 included in the processing system 100 of this embodiment, which will be described below, is a processing device that performs additional processing using a laser build-up welding method.

[0027] In the following description, the positional relationships of the various components constituting the processing apparatus 1 will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes as the processing coordinate system. For ease of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0028] The processing device 1 performs additive processing on the workpiece W by processing a modeling material M using the processing light EL. The modeling material M is a material that can be melted by irradiation with the processing light EL exceeding a predetermined intensity. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powder or granular material. In other words, the modeling material M is a powder or granular material. However, the modeling material M does not have to be a powder or granular material. For example, at least one of a wire-like material and a gaseous material may be used as the modeling material M. In additive processing based on the DED method, the processing device 1 supplies the modeling material M near the focal point of the processing light EL and adheres the melted modeling material M to the workpiece by irradiation with the processing light EL, or supplies the modeling material M to a molten pool formed on the workpiece by the processing light EL, melts the modeling material M, and then cools and solidifies it. In this way, a shaped object is formed on the workpiece W.

[0029] The processing apparatus 1 uses a laser build-up welding method to sequentially form multiple structural layers, thereby forming a three-dimensional structure ST in which multiple structural layers are stacked. The processing apparatus 1 first sets the surface of the workpiece W as the building surface on which the object will actually be built, and builds a first structural layer on that building surface. The processing apparatus 1 then sets the surface of the first structural layer as a new building surface, and builds a second structural layer on that building surface. Thereafter, the processing apparatus 1 repeats the same operations to build a three-dimensional structure in which multiple structural layers are stacked.

[0030] The processing apparatus 1 includes a material supply source 11, a gas supply source 12, a mixing unit 13, a processing unit 14, a stage unit 15, a light source 16, and a control unit 18. The processing apparatus 1 also includes a housing 17 having a chamber space 1A therein. The processing unit 14 and the stage unit 15 are housed in the chamber space 1A. At least one of the processing unit 14 and the stage unit 15 does not have to be housed in the chamber space 1A. The processing unit 14 may be attached to the tip of a robot arm.

[0031] The material supply source 11 supplies the modeling material M required for the processing unit 14 to perform additive processing. The material supply source 11 supplies a predetermined amount of modeling material M to the mixing unit 13 (described later) in accordance with the amount required per unit time for the additive processing so that the processing unit 14 can supply the amount of modeling material M required per unit time for the additive processing.

[0032] The gas supply source 12 supplies an inert gas such as nitrogen or argon. The inert gas supplied by the gas supply source 12 is supplied to the mixing unit 13 via a supply pipe 121, mixed with the modeling material supplied from the material supply source 11, and supplied to the processing unit 14. The inert gas supplied by the gas supply source 12 is also supplied to the chamber space 1A via a supply pipe 122 connecting the gas supply source 12 to a supply port 172 formed in the housing 17. As a result, the chamber space 1A becomes a space filled with the inert gas. The inert gas supplied by the gas supply source 12 is used to purge the chamber space 1A, and therefore can also be called a purge gas. The inert gas supplied to the chamber space 1A may be discharged from an exhaust port (not shown) formed in the housing 17. The gas supply source 12 is a gas cylinder containing the inert gas. When the inert gas is nitrogen gas, the gas supply source 12 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0033] The mixing unit 13 mixes the modeling material M supplied from the material supply source 11 with the inert gas supplied from the gas supply source 12 as a conveying gas (which may also be referred to as a pressurized gas), and pressure-feeds the mixed gas to the processing unit 14 via the supply pipe 131. The pressure-feed gas may be a gas supplied from a gas supply source different from the gas supply source 12. Note that the modeling material M may be supplied directly from the material supply source 11 to the processing unit 14 without being mixed with the pressure-feed gas. In this case, the processing apparatus 1 does not need to have the mixing unit 13.

[0034] The processing unit 14 processes the modeling material supplied from the material supply source 11 to perform additional processing to form a model on the workpiece W. To perform additional processing, the processing unit 14 includes a processing head 141 and a head drive system 142. The processing head 141 further includes an irradiation optical system 1411 and a material nozzle 1412. In the example shown in FIGS. 2 and 3 , the processing head 141 includes a single irradiation optical system 1411, but the processing head 141 may also include multiple irradiation optical systems 1411. In the example shown in FIGS. 2 and 3 , the processing head 141 includes a single material nozzle 1412, but the processing head 141 may also include multiple material nozzles 1412.

[0035] The irradiation optical system 1411 is an optical system (e.g., a focusing optical system) for emitting the processing light EL. Specifically, the irradiation optical system 1411 is optically connected to the light source 16 that emits the processing light EL via a light transmission member 161 such as an optical fiber or a light pipe. The irradiation optical system 1411 emits the processing light EL propagated from the light source 16 via the light transmission member 161. The irradiation optical system 1411 irradiates the processing light EL downward from the irradiation optical system 1411 (i.e., toward the −Z side).

[0036] A stage 151 is disposed below the irradiation optical system 1411. When a workpiece W is placed on the stage 151, the irradiation optical system 1411 irradiates the workpiece W with the processing light EL. Specifically, the irradiation optical system 1411 can irradiate the processing light EL onto a target irradiation area EA that is set on or near the workpiece W as an area to be irradiated (typically, focused) with the processing light EL. Furthermore, under the control of the control unit 18, the state of the irradiation optical system 1411 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA.

[0037] The material nozzle 1412 supplies (e.g., ejects, jets, or sprays) the building material M. The material nozzle 1412 is physically connected to the material supply source 11, which is a source of the building material M, via the supply pipe 131 and the mixing unit 13. The material nozzle 1412 supplies the building material M supplied from the material supply source 11. The building material M from the material supply source 11 may be mixed with a pressurized gas by the mixing unit 13 and then pressurized to the material nozzle 1412 via the supply pipe 131. In this case, the material nozzle 1412 supplies the building material M together with the pressurized gas. The pressurized gas may be a purge gas supplied from the gas supply source 12 to purge the chamber space 1A.

[0038] The material nozzle 1412 supplies the modeling material M downward (i.e., toward the −Z side) from the material nozzle 1412. The stage 151 is disposed below the material nozzle 1412. When the workpiece W is placed on the stage 151, the material nozzle 1412 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W.

[0039] In the processing apparatus 1 of this embodiment, the material nozzle 1412 supplies the modeling material M to the irradiation position of the processing light EL (i.e., the target irradiation area EA irradiated with the processing light EL from the irradiation optical system 1411). For this reason, the material nozzle 1412 and the irradiation optical system 1411 are aligned so that a target supply area MA, which is set on or near the workpiece W as the area to which the material nozzle 1412 supplies the modeling material M, coincides with (or at least partially overlaps with) the target irradiation area EA. In this case, the modeling material M supplied from the material nozzle 1412 is irradiated with the processing light EL emitted by the irradiation optical system 1411. As a result, the modeling material M supplied from the material nozzle 1412 melts, and a molten pool MP containing the molten modeling material M is formed on the workpiece W.

[0040] The material nozzle 1412 may supply the modeling material M to a molten pool MP formed by the processing light EL emitted by the irradiation optical system 1411. For example, the processing device 1 may supply the modeling material M to a molten pool MP formed by irradiating the workpiece W with the processing light EL to melt a material on the surface of the workpiece W. In addition, the processing device 1 may melt the modeling material M supplied from the material nozzle 1412 with the processing light EL before the modeling material M reaches the workpiece W, and adhere the molten modeling material M to the workpiece W.

[0041] The irradiation optical system 1411 of the processing head 141 can be said to supply processing light EL for processing the workpiece W. The material nozzle 1412 of the processing head 141 can be said to supply the modeling material M for processing the workpiece W. The material nozzle 1412 can also be said to supply pressurized gas for processing the workpiece W. Therefore, the processing head 141 can supply at least one of the processing light EL, the modeling material M, and the pressurized gas for processing the workpiece W.

[0042] The head drive system 142 moves the machining head 141 under the control of the control unit 18. That is, the head drive system 142 moves the irradiation optical system 1411 and the material nozzle 1412 under the control of the control unit 18. The head drive system 142 moves the machining head 141, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the head drive system 142 moves the machining head 141, the relative positions of the machining head 141, the stage 151, and the workpiece W placed on the stage 151 change. As a result, the target irradiation area EA and the target supply area MA (and further the molten pool MP) move relative to the workpiece W.

[0043] The head drive system 142 may move the machining head 141 to a height higher than the height at which machining is performed on the machining target (i.e., to the +Z side) between machining one machining target and machining another machining target on the workpiece W. By the head drive system 142 moving the machining head 141 in this way, it is possible to avoid interference between the machining head 141 and the workpiece W or the object formed on the workpiece W when the machining head 141 moves from a machining position where one machining target is machined to a machining position where another machining target is machined.

[0044] The stage unit 15 includes a stage 151 and a stage drive system 152 .

[0045] The workpiece W is placed on the stage 151. When placing the workpiece W, it is preferable that the upper surface (which can also be called the installation surface) of the stage 151 is horizontal. The stage 151 is capable of supporting the workpiece W placed on it. The stage 151 may also be capable of holding the workpiece W placed on it. In this case, the stage 151 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, etc. to hold the workpiece W. Alternatively, the stage 151 may not be capable of holding the workpiece W placed on it. In this case, the workpiece W may be placed on the stage 151 in a clampless manner. The workpiece W may also be held by a holding device such as a jig, or a holding device attached to the workpiece W may be placed, supported, or held on the stage 151. The stage 151 may also have a gripping unit that grips the workpiece W. In this case, multiple gripping units may be provided so as to grip at least two of the multiple processing objects included in the workpiece W. The workpiece W does not have to be placed on the stage 151, but may be placed on the floor, for example.

[0046] The stage drive system 152 moves the stage 151 under the control of the control unit 18. The stage drive system 152 moves the stage 151, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the stage drive system 152 moves the stage 151, the relative positions of the stage 151 and the workpiece W placed on the stage 151, and the machining head 141 change. As a result, the target irradiation area EA and the target supply area MA (and further the molten pool MP) move relative to the workpiece W.

[0047] When the stage drive system 152 moves the stage 151 along at least one of the θX direction, the θY direction, and the θZ direction, the installation surface may be tilted from the horizontal. In this disclosure, the term "installation surface" used without any particular explanation of the tilt refers to the installation surface (typically in a horizontal state) on which the workpiece W is placed.

[0048] The light source 16 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. The light source 16 may also emit other types of light as the processing light EL. The processing light EL can also be called a beam. The processing light EL may include at least one pulsed light. The processing light EL may also include at least one continuous light (CW: Continuous Wave). The processing light EL may be laser light. In this case, the light source 16 may be, for example, a semiconductor laser such as a laser diode (LD: Laser Diode), a fiber laser, a CO ２ The light source 16 may include a laser light source such as a laser, a YAG laser, or an excimer laser. The processing light EL does not have to be laser light. The light source 16 may include any light source such as an LED (Light Emitting Diode) or a discharge lamp.

[0049] The housing 17 has a chamber space 1A therein that can accommodate the processing unit 14 and the stage unit 15. The housing 17 has a sensor 171 inside the chamber space 1A. The sensor 171 may include at least one of a workpiece temperature sensor 171A, a light intensity sensor 171B, an internal temperature sensor 171C, and an oxygen concentration sensor 171D. The sensor 171 is an example of a sensor possessed by the processing system. The sensor 171 outputs values ​​related to at least one of the processing device 1 and the workpiece W in chronological order. The output of values ​​related to at least one of the processing device 1 and the workpiece W by the sensor 171 can also be considered as measurement of at least one of the processing device 1 and the workpiece W by the sensor 171. The output of values ​​by the sensor 171 may be intermittent or continuous.

[0050] The sensor 171 may be provided on the machining head 141, or may be provided at an appropriate location on the housing 17. The appropriate location on the housing 17 may be the stage 151. When the sensor 171 is provided on the machining head 141, the sensor 171 moves along with the movement of the machining head 141. When the sensor 171 is provided at an appropriate location on the housing 17, the sensor 171 may be provided so as to be movable by a sensor movement system to an appropriate position according to the position of the machining head 141. When the sensor 171 is moved in accordance with the movement of the machining head 141, the position to which the sensor 171 is moved may be the position to which the machining head 141 is moved, or may be the position before the movement of the machining head 141, or may be a position different from these.

[0051] The sensor 171 may output, as a value related to the workpiece W, a value representing a characteristic related to processing by irradiating the workpiece W with a beam. The sensor 171 may be, for example, a workpiece temperature sensor 171A that outputs a value indicating the temperature of the workpiece W. The sensor 171 may also be, for example, a sensor that outputs a value indicating the supply amount of the modeling material M or the supply amount of the inert gas.

[0052] The sensor 171 may include a sensor capable of acquiring data for calculating the area of ​​the molten pool MP. By calculating the area of ​​the molten pool MP, the sensor 171 can be said to indirectly output the light intensity of the processing light EL. In this case, the sensor may be configured to observe the molten pool from an oblique angle, thereby measuring the height of the three-dimensional structure ST to be added to the workpiece W.

[0053] The sensor 171 may output a value representing a characteristic related to the processing light EL irradiated onto the workpiece W. The sensor 171 may be, for example, a light intensity sensor 171B that outputs a value indicating the light intensity of the processing light EL emitted from the irradiation optical system 1411. The light intensity sensor may output a value indicating the light intensity of light branched from the processing light EL by a light path branching member included in the irradiation optical system 1411.

[0054] The light quantity sensor 171B may be a sensor that measures the quantity of light reflected and returning from the workpiece W, or may be a sensor that measures the light quantity of the processing laser itself. The sensor that measures the light quantity of the processing laser itself may be provided near the exit of the light source 16.

[0055] The sensor 171 may output a value related to the environment inside the processing apparatus 1 as a value related to the processing apparatus 1. The value related to the environment inside the processing apparatus 1 may be a value related to the environment inside the chamber space 1A of the processing apparatus 1. The sensor 171 may output a value related to the gas inside the chamber space 1A of the processing apparatus 1. The housing sensor 171 may be, for example, an internal temperature sensor 171C that outputs a value indicating the temperature inside the chamber space 1A. The housing sensor 171 may be, for example, an oxygen concentration sensor 171D that outputs a value indicating the oxygen concentration inside the chamber space 1A.

[0056] When the sensor 171 provided on the machining head 141 intermittently outputs a value, the head drive system 142 may move the machining head 141 so that the sensor 171 outputs a value when the machining head 141 is at a height higher than the height at which the machining target is machined (i.e., on the +Z side). It can also be said that the head drive system 142 moves the sensor 171 in a direction increasing the distance from the workpiece W before machining by the machining head 141. By moving the machining head 141 in this manner, the distance between the measurement target and the sensor 171 during measurement can be set to an appropriate distance. It is preferable that the height at which the machining head 141 is moved when the sensor 171 outputs a value be lower (i.e., on the -Z side) than the height at which the machining head 141 is moved to move the machining head from a machining position where one machining target is machined to a machining position where another machining target is machined.

[0057] FIG. 4 is a schematic diagram showing an example of the arrangement of processing targets in the processing device 1. In the example of FIG. 4, the workpiece W includes processing targets W1-4. The processing targets W1-4 can also be referred to as multiple processing targets. Each of the processing targets W1-4 may be multiple items of the same type. Three-dimensional structures ST1-4 are formed on each of the processing targets W1-4.

[0058] The processing target W1-4 may be a workpiece W that has a missing portion and needs to be repaired. In this case, the processing device 1 may perform repair processing to repair (in other words, restore) the item that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the processing device 1 may include additional processing to add a three-dimensional structure ST corresponding to the shaped object to fill the missing portion to the workpiece W. An example of an item that has a missing portion and needs to be repaired is a worn turbine blade.

[0059] The processing target W1-4 may be a workpiece W that is a base for forming a three-dimensional structure ST. In this case, the processing device 1 may manufacture (in other words, newly create) the three-dimensional structure ST from scratch by performing additional processing to form the three-dimensional structure ST on the workpiece W. As an example, the processing device 1 may newly create a turbine blade by performing additional processing to form a three-dimensional structure ST corresponding to a turbine blade on the workpiece W.

[0060] The processing objects W1-4 may be workpieces W, which are intermediate products manufactured in the process of forming a three-dimensional structure ST. In this case, the processing device 1 may manufacture the three-dimensional structure ST from the intermediate product by performing additional processing on the workpiece W, which is an intermediate product of the three-dimensional structure ST, to complete the three-dimensional structure ST. As an example, the processing device 1 may manufacture a finished turbine blade from the intermediate turbine blade by performing additional processing on the workpiece W, which is an intermediate turbine blade, to complete the turbine blade.

[0061] Each of the workpieces W1-4 is placed on a stage 151 inside the chamber space 1A. The stage 151 is provided with holders SM11-14, SM21-24, and SM31-32 configured to hold the workpieces W1-4, respectively.

[0062] Each of the holders SM11-14 has a support bottom surface portion that supports each of the workpieces W1-4 on the upper surface of the stage 151, and a pair of gripping portions that grip each of the workpieces W1-4 on the upper surface of the support bottom surface to prevent it from falling sideways. The gripping portion of the holder SM11 is an example of a first gripping portion, and the gripping portion of the holder SM12 is an example of a second gripping portion.

[0063] Each of the holders SM21-24 has a first height (size in the Z-axis direction) on the upper surface of the stage 151. Each of the holders SM31-32 connects a pair of holders among the holders SM21-24 to each other at a second height that is lower than the first height. A pair of holders may be selected such that the holders SM31-32 intersect with each other. By being connected to the holders SM21-24, the holders SM31-32 can restrict the range of movement of each of the workpieces W1-4 placed on the stage 151 and hold the workpieces W1-4.

[0064] In the chamber space 1A, after processing of the workpiece W1 held by the holder SM11 and the workpiece W2 held by the holder SM12 is completed, the holder SM11 and the holder SM12 may each hold another workpiece for processing.

[0065] The machining head 141 moves at least in the X-axis direction and the Y-axis direction, for example, to machine the workpiece W2 after machining the workpiece W1. The machining head 141 may move in the Z-axis direction in addition to the X-axis direction and the Y-axis direction, for example, to machine the workpiece W2 after machining the workpiece W1.

[0066] The processing device 1 may start processing, for example, with the processing object W1, and after forming a three-dimensional structure ST1 on the processing object W1, start processing the processing object W2. Furthermore, the processing device 1 may start processing, for example, the lowest (-Z side) position of processing objects W1-4 as the processing object, and after processing of a certain height of the processing object is completed, move to another processing object and process that height, and increase the height of the processing object (+Z side) while moving between the processing objects. In this case, it can be said that the processing device 1 processes a processing surface located at a predetermined height from the upper surface (i.e., the installation surface) of the stage 151 on which the processing object is placed.

[0067] 6A to 6C are schematic diagrams showing a state in a first example of movement of the machining head 141, and FIGS. 7A and 7B are schematic diagrams showing a state in a second example of movement of the machining head 141.

[0068] In a first example of movement of the machining head 141, the sensor 171 is fixed at a predetermined position within the housing 17. The first state shown in FIG. 6A corresponds to a state in which the machining head 141 is machining the workpiece W1. The second state shown in FIG. 6B corresponds to a state in which measurement is being performed by the sensor 171. The sensor 171 measures, for example, the temperature of the workpiece W1. In the second state, no machining is being performed by the machining head 141. The third state shown in FIG. 6C corresponds to a state in which the machining head 141 is repositioned to machine a workpiece different from the workpiece W1. In the third state, no machining is being performed by the machining head 141.

[0069] In the second state, the processing head 141 is moved upward (in the +Z direction) so as not to interfere with measurement by the sensor 171. Furthermore, in the third state, the processing head 141 is moved upward (in the +Z direction) so as not to come into contact with objects in the chamber space 1A, such as holders or other processing objects. The amount by which the processing head 141 is moved upward (in the +Z direction) in the second state may be less than the amount by which the processing head 141 is moved upward (in the +Z direction) in the third state. When processing of the processing object W1 is performed layer by layer and measurement by the sensor 171 is similarly performed layer by layer, the movement amount of the processing head 141 in the second state may be smaller than the movement amount in the third state, thereby reducing the movement distance and shortening the processing time. In this case, because the frequency of movement in the third state is less than the frequency of movement in the second state, the processing apparatus 1 may be operated more safely by moving the processing head 141 further upward (in the +Z direction).

[0070] In a second example of movement of the machining head 141, the sensor 171 is movably installed at a predetermined position within the housing 17. The first state shown in FIG. 7A corresponds to a state in which the machining head 141 is machining the workpiece W1. The second state shown in FIG. 7B corresponds to a state in which measurement is being performed by the sensor 171. The sensor 171 measures, for example, the temperature of the workpiece W1. In the second state, the machining head 141 moves upward (in the +Z direction) and to the right (in the +X direction). The direction of movement at this time is not limited to the +X direction, as long as the machining head 141 moves away from its position on the XY plane when machining the workpiece W1. The sensor 171 moves to a position on the XY plane from which the machining head 141 is displaced and performs measurement.

[0071] The control unit 18 controls the operation of the processing device 1. For example, the control unit 18 may control the processing unit 14 (e.g., at least one of the processing head 141 and the head drive system 142) so as to process each of the multiple processing targets on the workpiece W. The control unit 18 may also control the stage unit 15 (e.g., the stage drive system 152) so that each of the multiple processing targets on the workpiece W can be processed by the processing unit 14.

[0072] The control unit 18 outputs processing control information to control the operation of the processing device 1. The processing control information may be received from the control device 3. The processing device 1 performs processing on the workpiece W in accordance with the processing control information. For example, the processing device 1 processes the second processing object after processing the first processing object in accordance with the processing control information. Furthermore, for example, the processing device 1 further processes the first processing object after processing the second processing object in accordance with the processing control information.

[0073] The control unit 18 may include, for example, a memory 181 and a processor 182. The processor 182 includes, for example, a CPU (Central Processing Unit). The processor 182 may further include a GPU (Graphics Processing Unit). The memory 181 includes, for example, a memory. The control unit 18 functions as a unit that controls the operation of the machining apparatus 1 by the processor 182 executing a computer program. This computer program is a computer program that causes the processor 182 to perform (i.e., execute) the operations that the control unit 18 should perform to control the operation of the machining apparatus 1. In other words, this computer program is a computer program that causes the control unit 18 to function so as to cause the machining apparatus 1 to perform operations for machining the workpiece W. The computer program executed by the processor 182 may be stored in a storage device (i.e., a storage medium) included in the control unit 18, or may be stored in any storage medium (e.g., a hard disk drive or semiconductor memory) that is built into the control unit 18 or that can be externally attached to the control unit 18. Alternatively, the processor 182 may download the computer program to be executed from a device external to the control unit 18 via a communication interface provided in the control unit 18 .

[0074] The control unit 18 may control the emission mode of the processing light EL by the irradiation optical system 1411. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes at least one pulsed light, the emission mode may include, for example, at least one of the emission duration of each pulsed light, the emission cycle of each pulsed light, and the ratio of the emission duration of each pulsed light to the emission cycle (so-called duty ratio). The control unit 18 may also control the movement mode of the processing head 141 by the head drive system 142. The control unit 18 may also control the movement mode of the stage 151 by the stage drive system 152. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). The control unit 18 may also control the supply mode of the modeling material M by the material nozzle 1412. The supply mode may include, for example, at least one of the supply amount of the modeling material M (particularly, the supply amount per unit time) and the supply timing (supply time).

[0075] The control unit 18 can output log data including time-series values ​​related to at least one of the machining device 1 and the workpiece W. For example, the control unit 18 may have a communication interface and transmit the log data to a device external to the machining device 1 via the communication interface. The device external to the machining device 1 may be the control device 3 or the log data processing device 4 communicatively connected to the machining device 1 via the communication network NW, or may be other devices. For example, the control unit 18 may have an input / output device and store the log data in a storage medium via the input / output device. By reading the storage medium in which the log data is stored with the input / output device of a device other than the machining device 1, the log data can be used in that device.

[0076] The log data output by the control unit 18 may include intermittent time-series values ​​or may include continuous time-series values. The intermittent time-series values ​​may be values ​​acquired, for example, for each predetermined time unit of the machining time for the workpiece W by the machining unit 14, for each height of the three-dimensional structure ST formed by machining, for each machining layer including at least one machining surface to be machined, or for each progress stage of the machining path.

[0077] The control unit 18 may output, as a single log data, time-series values ​​related to machining from the start of machining on the multiple machining targets of the workpiece W until machining on all of the multiple machining targets is completed. In this case, the control unit 18 may output all of the time-series values ​​related to machining as log data after the machining is completed, or may output the time-series values ​​sequentially as they are generated. For example, when the machining device 1 performs machining on a machining surface located at a predetermined height from the installation surface as described above, the log data may include time-series values ​​for each machining layer including the machining surface, or for each machining surface. The log data may include a mixture of time-series values ​​related to machining on each of the multiple machining targets.

[0078] The control unit 18 does not have to be provided inside the processing apparatus 1. For example, the control unit 18 may be provided outside the processing apparatus 1 as a server or the like. In this case, the control unit 18 and the processing apparatus 1 are communicatively connected via a wired and / or wireless communication network (or a data bus and / or a communication line). The wired communication network may be a network using a communication standard conforming to Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless communication network may be a communication network using radio waves. Examples of communication networks using radio waves include communication standards conforming to IEEE802.11 (e.g., wireless LAN) and Bluetooth (registered trademark). The wireless communication network may be a communication network using infrared rays or a communication network using optical communication. The wired data bus may be a serial bus-type data bus, such as at least one of IEEE1394, RS-232, RS-422, RS-423, RS-485, and USB. The wired data bus may be a parallel bus type data bus, the wired communication line may be an optical network, or the wireless communication line may be a wide area wireless communication network such as 4G or 5G.

[0079] The control unit 18 provided outside the processing device 1 is configured to be able to transmit information such as commands and control parameters to the processing device 1 via a communication network. The processing device 1 may include a receiving unit capable of receiving information such as commands and control parameters from the control unit 18 via the communication network. The processing device 1 may also include a transmitting device that transmits information such as commands and control parameters to the control unit 18 via the communication network (i.e., an output device that outputs information to the control unit 18). Alternatively, a first control unit that performs part of the processing performed by the control unit 18 may be provided inside the processing device 1, and a second control unit that performs another part of the processing performed by the control unit 18 may be provided outside the processing device 1.

[0080] The control unit 18 may be implemented with a computational model that can be constructed by machine learning. The computational model can be implemented by a computing device executing a predetermined computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning the computational model may include learning parameters of the neural network (e.g., at least one of weights and biases). The control unit 18 may control the operation of the processing device 1 using the computational model. That is, the operation of controlling the operation of the processing device 1 may include the operation of controlling the operation of the processing device 1 using the computational model. The control unit 18 may be implemented with a computational model that has been constructed by offline machine learning using training data. The computational model implemented in the control unit 18 may be updated by online machine learning in the control unit 18. Alternatively, the control unit 18 may control the operation of the processing device 1 using a computational model implemented in a device external to the control unit 18 (i.e., a device provided outside the processing device 1) in addition to or instead of the computational model implemented in the control unit 18.

[0081] The storage medium for storing the computer program executed by the control unit 18 may be at least one of optical disks such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), magneto-optical disks such as MO, magnetic media such as flexible disks (floppy disks) or magnetic tapes, semiconductor memory such as USB memory, and other non-transitory computer-readable media. The storage medium may include a device capable of storing a computer program (for example, a general-purpose device or a dedicated device on which a computer program is implemented in an executable state in the form of at least one of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control unit 18 when the control unit 18 (i.e., the computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA: Field Programmable Gate Array, ASIC: Application Specific Integrated Circuit) provided in the control unit 18, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0082] 8 is a diagram showing an example of time-series values ​​included in log data. The log data output by the control unit 18 may include time-series values ​​represented in a table 181. Note that the log data may be data in a tabular format, or may be data in another format such as text data or binary data.

[0083] Table 181 shows (time series) values ​​for each time T of the head position PH, which represents the three-dimensional position of the processing head 141; the beam light intensity VEL, which represents the light intensity of the processing light EL irradiated onto the workpiece W from the irradiation optical system 1411 of the processing head 141; the material flow rate FM, which represents the amount of modeling material M supplied per unit time from the material nozzle 1412 of the processing head; the workpiece temperature TW, which represents the temperature of the target irradiation area EA of the workpiece W; the chamber temperature TC, which represents the temperature inside the chamber space 1A; and the oxygen concentration DO, which represents the oxygen concentration inside the chamber space 1A.

[0084] The head position PH is an example of a value that represents at least one of the position and movement of the machining head 141 relative to the workpiece W. The head position PH may include the position (X value and Y value) in a plane parallel to the stage 151 (i.e., the installation surface) on which the workpiece W is placed for machining, and the distance from the reference position of the workpiece W in a direction perpendicular to the installation surface (calculated from the machining head height, Z value). The position of the machining head 141 in a plane parallel to the installation surface can also be referred to as the machining head position. The amount of movement of the machining head 141 in a plane parallel to the installation surface can be obtained by calculating the difference between the head position PH at a certain time and the head position PH at the immediately previous time. The amount of movement of the machining head 141 may also be included in the log data.

[0085] In the example of Table 181, the workpiece temperature TW is measured with the machining head 141 moved higher (towards the +Z side) than during machining. Therefore, the workpiece temperature TW during machining (time T=00:04:40, 00:04:42, 00:04:44) is not included in Table 181. In addition, the height of the machining head 141 (Z value of the head position PH) at time T=00:04:41 when the workpiece temperature TW was measured is 300, which is larger than the height of the machining head during machining, 100.

[0086] In the example of Table 181, the planar position of the machining head 141 (X and Y values ​​of the head position PH) at time T=00:04:40-00:04:43 is different from the planar position of the machining head 141 at time T=00:04:44. Therefore, in Table 181, it can be seen that the machining target represented by the time series values ​​corresponding to time T=00:04:40-00:04:43 is different from the machining target represented by the time series values ​​corresponding to time T=00:04:44. Furthermore, in the example of Table 181, when the planar position of the machining head 141 is changed, the machining head 141 is moved upward (toward the +Z side). Therefore, at time T=00:04:43 when the planar position of the machining head 141 is changed, the height of the machining head 141 (Z value of the head position PH) is 350, which is greater than the height of the machining head during machining, 100. In the example of Table 181, the height of the machining head 141 moved to change its position on the plane is higher (closer to the +Z side) than the height of the machining head 141 moved to measure the workpiece temperature TW. The machining device 1 may suspend machining of the workpiece W when the workpiece temperature TW exceeds a predetermined temperature threshold. Furthermore, the machining device 1 may resume machining of the workpiece W when the workpiece temperature TW falls below the temperature threshold.

[0087] Table 181 is an example of time-series values ​​included in the log data, and the log data may include other time-series values. For example, the log data may include information about what is supplied for processing from the processing head 141 provided in the processing device 1. For example, the log data may include at least one of information about the modeling material M, information about the spot size of the processing light EL, and information about the flow rate of the pressurized gas supplied from the material nozzle together with the modeling material M. Furthermore, if the head sensor 1413 is provided separately from the processing head 141, the log data may further include the position of the head sensor 1413.

[0088] 9 is a schematic diagram showing the overall configuration of the log data processing device 4. The log data processing device 4 is capable of identifying first partial log data corresponding to processing of a first processing object among the plurality of processing objects and second partial log data related to processing of a second processing object among the plurality of processing objects from log data related to processing of the plurality of processing objects in the processing device 1. The log data processing device 4 is a computer having a communication interface 41, a memory 42, and a processor 43.

[0089] The communication interface 41 is an example of a communication unit, and has an interface circuit for accepting data to be processed by the log data processing device 4 or outputting data processed by the log data processing device 4. The communication interface 41 includes, for example, a communication interface circuit for connecting the log data processing device 4 to the communication network NW.

[0090] The memory 42 is an example of a storage unit and includes a volatile semiconductor memory and a non-volatile semiconductor memory. The memory 42 stores various data used in processing by the processor 43, such as log data acquired from the processing device 1. The memory 42 also stores various computer programs 420, such as a log data processing computer program that processes the log data. The computer program 420 provides logic and routines that enable the execution of the processing described below.

[0091] The processor 43 is an example of a control unit and includes one or more processors and their peripheral circuits. The processor 43 may further include other arithmetic circuits, such as a logic operation unit, a numerical operation unit, or a graphics processing unit. The processor 43 may also be referred to as a processing circuit. The processor 43 executes the computer program 420 stored in the memory 42, causing the log data processing device 4 to perform various processes described in this embodiment. As a result, logical functional blocks for executing the operations to be performed by the log data processing device 4 may be realized within the processor 43. In this way, the processor 43 can function as a controller for realizing the logical functional blocks for executing the operations to be performed by the log data processing device 4. In this case, any device (typically, a computer) that executes the computer program 420 can function as the log data processing device 4. At least one of the memory 42 and the processor 43 may be referred to as a control circuit (or circuit).

[0092] The processor 43 enables identification of first partial log data related to processing of a first processing object and second partial log data related to processing of a second processing object from the log data. The log data is data including time-series values ​​related to the processing device 1 sequentially processing multiple processing objects and at least one of the multiple processing objects to be processed. The first processing object and the second processing object are included in the multiple processing objects, and the second processing object is different from the first processing object. Here, "making the log data identifiable" includes enabling a user of the log data processing device 4 to identify log data related to the first processing object and the second processing object. In other words, the identification may be performed by the user of the log data processing device 4 rather than by the log data processing device 4. Furthermore, performing the process of making the log data identifiable includes setting a separator between the first partial log data and the second partial log data from the log data. Setting the separator includes identifying one preparation partial log data from the log data. Making the log data identifiable may be inseparable from the identification.

[0093] The time series values ​​contained in the log data can be considered to be measurement results obtained in time series using a measuring instrument with a sensor, or monitoring results obtained in time series using a monitoring device with a sensor.

[0094] The processor 43 may identify, from the log data, a plurality of pieces of processed portion log data corresponding to processing of any of a plurality of processing objects. In this case, the processor 43 does not need to identify the correspondence between the plurality of pieces of processed portion log data and the plurality of processing objects. In this case, the user of the log data processing device 4 can identify first partial log data related to processing of the first processing object and second partial log data related to processing of the second processing object, for example, based on a comparison between the content of processing of each of the plurality of processing objects and the content of the identified plurality of processing portion log data.

[0095] The processor 43 may identify at least one preparatory portion log data corresponding to a preparatory operation for processing each processing object from the log data. In this case, the log data is divided into at least two processed portion log data based on the identified at least one preparatory portion log data. The at least one preparatory portion log data and the at least two processed portion log data are examples of multiple portion log data. The identification unit 431 enables the at least two processed portion log data to be identified as first portion log data or second portion log data. In other words, by identifying at least two processed portion log data, the processor 43 may enable the user of the log data processing device 4 to identify one of the at least two processed portion log data as the first portion log data and the other of the at least two processed portion log data as the second portion log data.

[0096] The processor 43 may be capable of identifying the first partial log data and the second partial log data from portions of the log data corresponding to times when conditions related to at least one of the processing device 1 and the processing target satisfy a first condition. Here, the first condition may include conditions related to at least one of the processing amount of the processing device 1, the movement of the processing head 141 of the processing device 1, and the processing time.

[0097] The processing amount of the processing device 1 can be represented by at least one of the beam light intensity VE and the material flow rate FM. For example, the processor 43 can determine that the processing amount of the processing device 1 is not 0, i.e., that processing is being performed, at a time when the beam light intensity VE corresponds to a light intensity less than a predetermined light intensity threshold (e.g., 1).

[0098] The processor 43 may be able to identify the first partial log data and the second partial log data from the log data based on the machining head position PH, which is related to a position in a plane parallel to the installation surface on which the workpiece W is installed. For example, the processor 43 may be able to identify, as the preparation partial log data, the log data at the time when the machining head position is included in a preparation region corresponding to the preparation operation for machining. Furthermore, the processor 43 may be able to identify, as the first partial log data and the second partial log data, the log data at the time when the machining head position is included in a first region and a second region corresponding to the first machining target and the second machining target, respectively.

[0099] The movement of the machining head 141 of the machining device 1 can be represented by the head position PH. The log data may include a machining head movement amount related to the movement amount in a plane parallel to the installation surface. The processor 43 may be able to identify first and second portion log data from the log data based on the machining head movement amount. For example, the processor 43 may be able to identify log data at a time when the machining head movement amount is greater than a predetermined movement threshold as preparation portion log data. Furthermore, the processor 43 may be able to identify one of at least two machining portion log data partitioned into the preparation portion log data identified based on the machining head movement amount as the first portion log data and the other as the second portion log data.

[0100] The head position PH may include a machining head height related to the distance from a reference position of the workpiece W in a direction (Z-axis direction) perpendicular to the installation surface on which the workpiece W is placed. For example, the processor 43 may be able to determine that the log data at the time when the machining head height exceeds a predetermined height threshold is preparation time log data corresponding to a time when the machining device 1 is acquiring a value from the head sensor 1413 or when the machining head 141 is moving from one machining target to another machining target and no machining is being performed.

[0101] The processing time can be represented by the time T at which at least one of the beam light intensity VE and the material flow rate FM satisfies a predetermined condition. For example, the identifying unit 431 can determine that the time at which the beam light intensity VE corresponds to a light intensity less than a predetermined light intensity threshold (e.g., 1) is a processing time during which the processing amount of the processing device 1 is not 0, i.e., processing is being performed.

[0102] The processor 43 can identify the preparation portion log data from a portion of the log data corresponding to a time that satisfies a first condition corresponding to the preparatory operation for processing each processing object in the processing device 1, and can identify the processing portion log data separated by the preparation portion log data. Furthermore, the processor 43 can identify the processing portion log data from a portion of the log data corresponding to a time that satisfies a first condition corresponding to the processing operation for each processing object in the processing device 1.

[0103] The log data may include time-series values ​​for processing for each processing layer or each processing surface. The processor 43 may be able to identify partial log data from the log data that aggregates the time-series values ​​for each processing layer or each processing surface for each processing object.

[0104] In processing such as additive processing and subtractive processing, it is common to store and process a plurality of processing objects in the processing device 1. In this case, a method is used in which the plurality of processing objects are held in holders SM, and a plurality of processing objects are placed in the processing device 1 for each holder SM.

[0105] In this case, the log data relating to the machining in the machining device 1 can only be acquired for each workpiece including the plurality of machining objects, that is, it may not be possible to acquire the log data for each machining object.

[0106] For example, if the processing control information is output on a workpiece-by-workpiece basis, the log data based on the processing control information may also be output on a workpiece-by-workpiece basis. For example, if the processing control information cannot be input for each processing object due to the performance of the control unit 18 of the processing device 1, it may not be possible to acquire log data for each processing object. Also, even if multiple processing objects are processed in the order of the first processing object, the second processing object, the third processing object, the first processing object, and so on, log data may only be acquired on a workpiece-by-workpiece basis.

[0107] The log data may include, in chronological order, first element data, second element data, third element data, and fourth element data. The first element data and third element data may be processed portion log data related to processing of a first processing object. Furthermore, the second element data and fourth element data may be processed portion log data related to processing of a second processing object. That is, such log data may correspond to processing performed in the following order: first processing object, second processing object, first processing object, second processing object. The first and second processing of the first processing object and second processing object may each have different processing layers or processing surfaces.

[0108] The processor 43 may be able to identify first partial log data by combining first element data and third element data of such log data. The processor 43 may be able to identify second partial log data by combining second element data and fourth element data of the log data. The processor 43 may be able to identify the first partial log data based on processing control information. In this case, the processing control information may be information for processing the first processing object, the second processing object, the first processing object, and the second processing object in this order.

[0109] The log data may include first log data, which is a time series of values ​​for a first attribute related to processing, and second log data, which is a time series of values ​​for a second attribute different from the first attribute related to processing. The first attribute may represent, for example, at least one of the position and movement of the processing head 141 relative to the workpiece W. The second attribute may be, for example, at least one of a value related to the processing light EL, a value related to the modeling material M, a value related to the workpiece W, such as the temperature of the workpiece W to be processed, and a value related to the gas inside the chamber space 1A. The identification unit 431 may be capable of identifying the first partial log data and the second partial log data from the second log data based on the first log data.

[0110] The log data may include first partial log data and second partial log data related to the machining of the workpiece W1 (first machining object) held by the holder SM11 and the workpiece W2 (second machining object) held by the holder SM12 on the stage 151 of the machining device 1, and may also include machining portion log data related to the machining of workpieces (third machining object and fourth machining object, respectively) different from the workpiece W1 and workpiece W2 held by the holder SM11 and the holder SM12, respectively, after the machining of the workpiece W1 and the workpiece W2 has been completed. The processor 43 may be able to identify third partial log data related to the machining performed on the third machining object and fourth partial log data for the machining performed on the fourth machining object from portions of such log data different from the portions identified by the first partial log data and the second partial log data.

[0111] The log data may be data that is output sequentially in accordance with the generation of time-series values ​​in the processing device 1. In this case, the processor 43 may output, of the data, a first portion related to processing of the first processing object and a second portion related to processing of the second processing object as first partial log data and second partial log data, respectively.

[0112] The log data may be time-series values ​​relating to at least one of a processing device that sequentially processes a plurality of workpieces held by a holder and the plurality of workpieces to be processed.

[0113] The processor 43 associates at least one of the identified plurality of partial log data with one of the plurality of processing targets. The processor 43 associates the first partial log data with the first processing target, for example, based on a comparison between the processing content of each of the plurality of processing targets and the content of the identified plurality of processed partial log data. The processor 43 also associates the second partial log data with the second processing target. In other words, the associating unit 432 associates each of the first partial log data and the second partial log data with one of the plurality of processing targets.

[0114] When the multiple processing targets of the workpiece W are parts of multiple processing objects, the processor 43 may associate at least two pieces of processed portion log data with any of the multiple processing objects. For example, when the first processing object is included in the first processing object and the second processing object is included in a second processing object different from the first processing object, the processor 43 may associate the first portion log data and the second portion log data with the first processing object and the second processing object, respectively.

[0115] The processor 43 records the partial log data including the identified first partial log data and second partial log data in the memory 42. Recording in the memory 42 can also be referred to as storing or saving by the memory 42.

[0116] When recording the partial log data in the memory 42, the processor 43 may record the partial log data in association with any of a plurality of processing targets. For example, the processor 43 may record the first partial log data in association with the first processing target, and may record the second partial log data in association with the second processing target.

[0117] When the log data includes intermittent time series values, the processor 43 can store the first partial log data in association with the first processing object as an intermittent time series value, and can store the second partial log data in association with the second processing object as an intermittent time series value.When the log data includes continuous time series values, the processor 43 can store the first partial log data in association with the first processing object as an intermittent time series value, and can store the second partial log data in association with the second processing object as an intermittent time series value.

[0118] The processor 43 outputs processed portion log data including the first and second partial log data from the log data. Here, "output" may include at least one of recording to a storage medium, output to another device via a communication interface, display on a display, and sound output through a speaker. Displaying the processed portion log data including the first and second partial log data on a display can also be considered as visually outputting the processed portion log data including the first and second partial log data. The processor 43 may output the first and second partial log data together with associations with the first and second processing targets, respectively.

[0119] The processor 43 may output the first partial log data and the second partial log data as separated data. The processor 43 may also output partial identification information for identifying the first partial log data and the second partial log data in the log data. The processor 43 may output the partial identification information by including it in the log data. Such partial identification information allows a user of the log data processing device 4 to distinguish the first partial log data and the second partial log data from the log data. It is sufficient for the partial identification information to distinguish the processed partial log data, such as the first partial log data and the second partial log data, from the remaining parts of the log data. When the output is recorded on a storage medium or output to another device via a communication interface, the partial identification information may be a specific code sequence indicating a data division. When the output is displayed on a display, the partial identification information may be a specific character or graphic indicating a data division, or may be a color different from that of other processed partial log data. When the output is sounded through a speaker, the partial identification information may be a specific sound indicating a data division.

[0120] The processor 43 may identify partial log data from the log data, and may output a processing report regarding processing of each processing object based on the identified partial log data.

[0121] 10 is a diagram showing an example of information included in a processing report output by the log data processing device 4. The processing report may include information shown in table 200. The processing report may be data in a tabular format, or may be print data for printing a tabular report, or image data.

[0122] The processor 43 acquires values ​​corresponding to the items shown in table 200 from the partial log data identified for each processing object, and determines the value of each item in the processing report by processing appropriate for each item. For example, the processor 43 may use at least one of statistically representative values ​​such as the average, maximum, minimum, and median of the values ​​of the beam light intensity VEL included in the partial log data as the laser power value in the processing report.

[0123] Each item shown in table 200 may be classified into values ​​relating to what is supplied for processing from the processing head 141, values ​​relating to the processing environment in the processing device, and values ​​relating to the object to be processed. Furthermore, the values ​​relating to the object to be processed may be further classified into values ​​relating to the object to be processed that is being processed and values ​​relating to the object to be processed that is not being processed.

[0124] The processor 43 may output a processing report for each layer processed in the processing object. In this case, the processing report includes a layer identifier as an item. The statistical representative value for each item may be a statistical representative value for each layer.

[0125] In this way, by specifying the divisions for each processing object and outputting the associated data, it is possible to easily output information on the conditions under which each processing object was processed. This information can also be called information on quality assurance. In other words, the log data processing device 4 can improve the traceability of processing in the processing system 100.

[0126] 8 is a flowchart of log data processing by the processor 43 of the log data processing device 4. The processor 43 of the log data processing device 4 processes the log data according to the following flowchart. The log data processing may be started, for example, when the processing device 1 starts processing the processing object. Alternatively, the log data processing may be started when the user instructs the processing device 1 to process the processing object. Alternatively, the log data processing may be started when the user instructs the acquisition of log data for each processing object.

[0127] The processor 43 of the log data processing device 4 acquires log data (step S11). The log data includes time-series values ​​related to at least one of the processing device 1 that sequentially processes multiple processing objects and the multiple processing objects being processed. The log data is output from the control unit 18 of the processing device 1 included in the processing system 100. The processor 43 may acquire the log data by reading the log data from a storage medium that stores the log data output from the control unit 18. Alternatively, the processor 43 may acquire the log data by receiving the log data transmitted from the control unit 18 via a communication network. The processor 43 may acquire the log data while the processing objects are being processed or after the processing is completed.

[0128] Next, the processor 43 identifies first and second partial log data from the log data (step S12). The first partial log data relates to processing performed on a first processing object among multiple processing objects in processing by the processing device 1. The second partial log data relates to processing performed on a second processing object among the multiple processing objects, which is different from the first processing object. In step S12, the processor 43 may be able to identify the first and second partial log data from the log data. In this case, the flowchart of the log data processing may include, following step S12, a step in which the processor 43 or a user of the log data processing device 4 identifies the first and second partial log data from the log data.

[0129] Next, the processor 43 associates the identified first partial log data and second partial log data with any of a plurality of processing targets (step S13).

[0130] The processor 43 then outputs the associated first and second partial log data (step S14), and ends the log data processing. Here, "output" may mean outputting data for display. The processor 43 may also display the output partial log data.

[0131] Between step S13 and step S14, the processor 43 may execute a step of recording the associated first partial log data and second partial log data.

[0132] In the flowchart of the log data processing, step S13 can be omitted. Furthermore, the process corresponding to step S13 may be performed by the user of the log data processing device 4.

[0133] By performing the log data processing in this manner, the log data processing device 4 can identify first partial log data corresponding to processing of a first processing object among the multiple processing objects and second partial log data related to processing of a second processing object among the multiple processing objects from the log data related to processing of the multiple processing objects in the processing device 1. This allows the user of the log data processing device 4 to manage the processing history for each processing object, even if partial log data for each processing object included in the multiple processing objects is mixed in the log data.

[0134] The measuring device 2 may have a measurement sensor (not shown), a measurement stage (not shown), and a measurement control unit (not shown) to measure multiple measurement targets on the workpiece W accommodated inside the measurement space. The measurement sensor sequentially measures the multiple measurement targets on the workpiece W placed on the measurement stage. The measurement stage may be equipped with a holder capable of holding the workpiece W. The measuring device 2 may further have a measurement sensor drive system that moves the measurement sensor under the control of the measurement control unit, and a measurement stage drive system that moves the measurement stage under the control of the measurement control unit. The measurement control unit can output measurement log data including time-series values ​​related to at least one of the measuring device 2 and the multiple measurement targets.

[0135] The log data processing device 4 may process as log data the measurement log data output by the measurement device 2. That is, the log data processing device 4 may be capable of identifying, from the measurement log data, first partial log data relating to measurement of a first measurement target among the multiple measurement targets, and second partial log data relating to measurement of a second measurement target among the multiple measurement targets that is different from the first measurement target.

[0136] The log data processing device 4, which processes the measurement log data output by the measuring device 2 as log data, may identify, from the measurement log data, a plurality of pieces of processed portion log data corresponding to processing on any of a plurality of processing objects.

[0137] The log data processing device 4, which processes the measurement log data output by the measurement device 2 as log data, may output first partial log data and second partial log data relating to measurements on the first measurement object from the measurement log data.

[0138] The measurement device 2 may sequentially measure the multiple measurement targets held by the holder and sequentially output the data. Of the data sequentially output from the measurement device 2, the log data processing device 4 may output a first portion related to the measurement of the first measurement target and a second portion related to the measurement of the second measurement target as first partial log data and second partial log data, respectively.

[0139] The processing system 100 can also be called a measurement system including the measurement device 2 and the log data processing device 4. Note that the log data processing device 4 does not necessarily have to be included in the processing system 100.

[0140] The machining system 100 may perform a weld pool feedback control operation based on the weld pool image generated by the imaging unit 171 in parallel with the above-described additional machining operation. That is, the machining system 100 may perform a weld pool feedback control operation during at least a portion of the period during which the above-described additional machining operation is being performed. The weld pool feedback control operation is an operation for controlling the machining unit 14 based on the weld pool image so that the size of the weld pool area MPA in the weld pool image becomes a target size. The weld pool area MPA will be described in detail later.

[0141] The flow of the molten pool feedback control operation will be described below with reference to Fig. 12. Fig. 12 is a flowchart showing the flow of the molten pool feedback control operation.

[0142] 12, the control unit 18 acquires a molten pool image IMG from the imaging unit 171 (step S21). Specifically, the imaging unit 171 captures an image of the workpiece W or the structural layer SL on which molten pools MP#1 and MP#2 are formed. That is, the imaging unit 171 captures images of the molten pools MP#1 and MP#2. As a result, the imaging unit 171 generates a molten pool image IMG in which the molten pools MP#1 and MP#2 are captured. The imaging unit 171 outputs the generated molten pool image IMG to the control unit 18. As a result, the control unit 18 acquires the molten pool image IMG.

[0143] The imaging unit 171 images the molten pools MP#1 and MP#2 so that they fall within the imaging range of the imaging unit 171. Specifically, the imaging unit 171 may be aligned with the workpiece W or the structural layer SL on which the molten pools MP#1 and MP#2 are formed so that the molten pools MP#1 and MP#2 fall within the imaging range of the imaging unit 171. The imaging unit 171 may be aligned with the machining head 21 so that the molten pools MP#1 and MP#2 formed on the build surface MS by the machining head 21 fall within the imaging range of the imaging unit 171. As a result, the imaging unit can properly image the molten pools MP#1 and MP#2.

[0144] The imaging unit 171 may repeatedly capture images of the workpiece W or the structural layer SL on which the molten pool MP is formed at a predetermined imaging rate. That is, the imaging unit may capture images of the workpiece W or the structural layer SL on which the molten pool MP is formed multiple times consecutively at the predetermined imaging rate. The imaging rate may be an index value indicating the number of times the imaging unit 171 captures images of the workpiece W or the structural layer SL per unit time (e.g., per second). In other words, the imaging unit 171 may repeatedly capture images of the workpiece W or the structural layer SL each time a predetermined imaging cycle elapses. For example, the imaging unit 171 may capture an image of the workpiece W or the structural layer SL at a first time, and then capture the image of the workpiece W or the structural layer SL at a second time, a predetermined imaging cycle after the first time. The imaging cycle may be the reciprocal of the imaging rate. In this case, the imaging unit 171 may generate multiple molten pool images IMG as time-series data. The control unit 18 may acquire multiple molten pool images IMG as time-series data.

[0145] Note that, when the imaging unit 171 repeatedly captures images of the workpiece W or the structural layer SL, the imaging unit 171 may be considered to expose the imaging element to light from the workpiece W or the structural layer SL multiple times. In this case, multiple exposures in a single imaging session to capture one image of the imaging element may be referred to as multiple exposures. That is, the imaging unit 171 may generate multiple molten pool images IMG as time-series data by performing multiple exposures of the imaging element. In other words, the imaging unit 171 may generate multiple molten pool images IMG as time-series data by performing multiple exposures of the molten pool MP using the imaging element. That is, the imaging unit 171 may generate multiple molten pool images IMG as a result of the multiple exposures by performing multiple exposures of the molten pool MP using the imaging element.

[0146] Thereafter, the control unit 18 generates weld pool image information MPI based on at least one weld pool image IMG acquired in step S21 (step S22). The weld pool image information MPI is information about the weld pools MP#1 and MP#2 that appear in the weld pool image IMG.

[0147] The control unit 18 may generate information related to the weld pool area MPA as an example of the weld pool image information MPI. The weld pool area MPA may include an area in the weld pool image IMG where the weld pools MP#1 and MP#2 are captured, as shown in FIG.

[0148] To generate information about the weld pool area MPA, the control unit 18 may use at least two of the multiple weld pool images IMG acquired as time-series data in step S21. In other words, the control unit 18 may generate information about the weld pool area MPA using multiple weld pool images IMG corresponding to at least some of the multiple weld pool images IMG acquired as time-series data in step S21.

[0149] Specifically, the left side of Figure 14 shows multiple weld pool images IMG acquired as time-series data. As shown on the left side of Figure 14, if the weld pool MP#1 is moving due to irradiation with the processing light EL, the position at which the weld pool MP#1 is captured may change among the multiple weld pool images IMG. This is because, as described above, if the weld pool MP#1 is moving due to irradiation with the processing light EL, the imaging unit 171 may capture the weld pool MP#1 formed at a first position on the build surface MS at a first time, and then capture the weld pool MP#1 formed at a second position on the build surface MS different from the first position at a second time different from the first time. In particular, if the exposure time of the imaging unit 171 is shorter than a certain time, the position at which the weld pool MP#1 is captured may change among the multiple weld pool images IMG. For the same reason, if the weld pool MP#2 is moving due to irradiation with the processing light EL, the position at which the weld pool MP#2 is captured may change among the multiple weld pool images IMG.

[0150] In this case, the control unit 18 may generate an added image IMG_C by adding at least two consecutive weld pool images IMG out of the multiple weld pool images IMG acquired in step S21 to generate information about the weld pool area MPA, as shown in Fig. 14. In other words, the control unit 18 may generate an added image IMG_C by combining at least two consecutive weld pool images IMG. The added image IMG_C may also be referred to as a composite image.

[0151] Specifically, the control unit 18 may add at least two successive weld pool images IMG in pixel units. For example, the control unit 18 may add the signal values ​​of at least two successive weld pool images IMG in pixel units. An example of the signal value of the weld pool image IMG is a value related to brightness (i.e., brightness value). The number of weld pool images IMG to be added may be set in advance. The number of weld pool images IMG to be added may be set as appropriate by the control unit 18. The number of weld pool images IMG to be added may be set as appropriate by the user of the machining system 100.

[0152] In this case, the additive image IMG_C may be an image in which the signal value of each pixel in the additive image IMG_C is the sum of the signal values ​​of each pixel in the at least two added weld pool images IMG. Specifically, the additive image IMG_C may be an image in which the signal value of the pixel in the xth row and yth column of the additive image IMG_C is the sum of the signal values ​​of the pixel in the xth row and yth column of the at least two added weld pool images IMG. Note that x is a variable that is 1 or greater and indicates an integer that is equal to or less than the total number of horizontal pixels in the additive image IMG_C and the weld pool image IMG. y is a variable that is 1 or greater and indicates an integer that is equal to or less than the total number of vertical pixels in the additive image IMG_C and the weld pool image IMG.

[0153] The control unit 18 typically acquires the weld pool image IMG represented by a digital signal from the imaging unit. In this case, the control unit 18 may add together the multiple weld pool images IMG by adding together multiple digital signals representing the multiple weld pool images IMG. For example, the control unit 18 may add together the multiple digital signals using an adder (i.e., a hardware adder) that adds input digital signals. For example, the control unit 18 may add together the multiple weld pool images IMG by storing the digital signals in a buffer and then adding the digital signals stored in the buffer (i.e., adding the digital signals as software processing). Alternatively, the control unit 18 may add together the multiple weld pool images IMG by performing predetermined image processing on the multiple weld pool images IMG and then adding together multiple digital signals representing the multiple weld pool images IMG that have undergone the predetermined image processing. Examples of the predetermined signal processing include at least one of gamma processing, noise reduction processing, and HDR (High Dynamic Range) processing.

[0154] Alternatively, the control unit 18 may acquire the weld pool image IMG represented by an analog signal from the imaging unit. In this case, the control unit 18 may add together the multiple weld pool images IMG by adding together multiple analog signals representing the multiple weld pool images IMG. Alternatively, the control unit 18 may convert the analog signal into a digital signal. Thereafter, the control unit 18 may add together the multiple weld pool images IMG by adding together multiple digital signals representing the multiple weld pool images IMG, similar to the case where the control unit 18 acquires the weld pool image IMG represented by a digital signal from the imaging unit.

[0155] Thereafter, the control unit 18 may detect the weld pool area MPA in the additive image IMG_C, in which the weld pools MP#1 and MP#2 are reflected. Specifically, as shown on the left side of FIG. 14 , the signal value of the area in the weld pool image IMG where the weld pool MP is reflected is different from the signal value of the area in which the weld pool MP is not reflected. This is because the weld pool MP emits strong light. Therefore, the luminance value of the area in the weld pool image IMG where the weld pool MP is reflected is different from the luminance value of the area in which the weld pool MP is not reflected. Typically, the luminance value of the area in the weld pool image IMG where the weld pool MP is reflected is higher than the luminance value of the area in which the weld pool MP is not reflected. Therefore, as shown on the right side of FIG. 14 , the signal value of the area in the additive image IMG_C where the weld pool MP is reflected is different from the signal value of the area in which the weld pool MP is not reflected. In other words, the signal value of the weld pool area MPA in the additive image IMG_C is different from the signal value of the area other than the weld pool area MPA. Typically, the brightness value of the weld pool region MPA is higher than the brightness value of regions other than the weld pool region MPA. Therefore, the control unit 18 may detect the weld pool region MPA in the additive image IMG_C by comparing the signal value (e.g., brightness value) of each pixel in the additive image IMG_C with a predetermined binarization threshold. For example, the control unit 18 may detect pixels in the additive image IMG_C that have a signal value (e.g., brightness value) greater than the predetermined binarization threshold. In other words, the control unit 18 may detect pixels in the additive image IMG_C whose added signal value (e.g., brightness value) is greater than the predetermined binarization threshold. In this case, the control unit 18 may detect the region including the detected pixel as the weld pool region MPA.

[0156] The binarization threshold may be set to an appropriate value that allows the weld pool area MPA and an area other than the weld pool area MPA to be distinguished from each other based on the signal value (e.g., brightness value). The binarization threshold may be set in advance. The binarization threshold may be set as appropriate by the control unit 18. The binarization threshold may be set as appropriate by the user of the machining system 100.

[0157] The weld pool area MPA detected in the additive image IMG_C may be considered to be substantially equivalent to the area through which the weld pools MP#1 and MP#2 moved. In particular, the weld pool area MPA detected in the additive image IMG_C may be considered to be substantially equivalent to the area through which the weld pools MP#1 and MP#2 moved during the period when the at least two weld pool images IMG used to generate the additive image IMG_C were captured. Therefore, the weld pool area MPA may refer to the area through which the weld pools MP#1 and MP#2 moved.

[0158] The molten pool area MPA detected in the additive image IMG_C may be considered to be substantially equivalent to the area where the processing system 100 successively forms the molten pools MP#1 and MP#2 at different positions. Therefore, the molten pool area MPA may refer to the area where the processing system 100 successively forms the molten pools MP#1 and MP#2 at different positions.

[0159] The control unit 18 may then generate information about the weld pool region MPA as weld pool image information MPI based on the detection result of the weld pool region MPA. For example, the control unit 18 may generate information about the size of the weld pool region MPA as an example of the information about the weld pool region MPA. As an example, the control unit 18 may calculate the area of ​​the weld pool region MPA and generate information about the calculated area of ​​the weld pool region MPA as information about the size of the weld pool region MPA. In this case, the control unit 18 may calculate the number of pixels constituting the weld pool region MPA as the area of ​​the weld pool region MPA. That is, the control unit 18 may generate information about the size of the weld pool region MPA by calculating the number of pixels having a signal value (e.g., brightness value) greater than a predetermined binarization threshold based on the additive image IMG_C.

[0160] However, instead of using multiple weld pool images IMG, the control unit 18 may generate information about the weld pool area MPA using a single weld pool image IMG. Specifically, the control unit 18 may detect the weld pool area MPA in the weld pool image IMG by comparing the signal value (e.g., brightness value) of each pixel in the weld pool image IMG with a predetermined binarization threshold. For example, the control unit 18 may detect pixels in the weld pool image IMG that have a signal value (e.g., brightness value) greater than the predetermined binarization threshold. In this case, the control unit 18 may detect the area including the detected pixel as the weld pool area MPA. Then, the control unit 18 may generate information about the weld pool area MPA as weld pool image information MPI based on the detection result of the weld pool area MPA.

[0161] Alternatively, when the exposure time of the imaging unit is longer than a certain time, there is a high possibility that a weld pool area MPA similar to the weld pool area MPA reflected in the additive image IMG_C will be reflected in one weld pool image IMG. For example, when the exposure time of the imaging unit is longer than a certain time determined according to the period of the periodic movement of the weld pools MP#1 and MP#2, there is a high possibility that a weld pool area MPA similar to the weld pool area MPA reflected in the additive image IMG_C will be reflected in one weld pool image IMG. As an example, when the exposure time of the imaging unit is longer than one period of the periodic movement of the weld pools MP#1 and MP#2, there is a high possibility that a weld pool area MPA similar to the weld pool area MPA reflected in the additive image IMG_C will be reflected in one weld pool image IMG. For this reason, when the exposure time of the imaging unit is longer than a certain time, the control unit 18 may generate weld pool image information MPI without using multiple weld pool images IMG. The control unit 18 may generate the weld pool image information MPI using a single weld pool image IMG that includes the weld pool area MPA.

[0162] The exposure time of the imaging unit may refer to the time during which the imaging element of the imaging unit is exposed to light. For example, if the imaging unit has a mechanical shutter, the exposure time of the imaging unit may refer to the time during which the mechanical shutter is in an open state. In other words, the exposure time of the imaging unit may refer to the time from when the mechanical shutter is switched to an open state to when the mechanical shutter is switched to a closed state. The open state may refer to the state in which the mechanical shutter is open. The closed state may refer to the state in which the mechanical shutter is closed. Alternatively, if the imaging unit has an electronic shutter, the exposure time of the imaging unit may refer to the time during which the electronic shutter is in an on state. In other words, the exposure time of the imaging unit may refer to the time from when the electronic shutter is switched to an on state to when the electronic shutter is switched to an off state. The on state may refer to the state in which the electronic shutter is on. The state in which the electronic shutter is on may refer to a state in which each pixel of the image sensor is exposed to light in one image capture and each pixel of the image sensor can accumulate electric charge based on the amount of light.

[0163] Alternatively, if the imaging unit is equipped with a mechanical shutter, the imaging unit may open and close the mechanical shutter multiple times at timing synchronized with the imaging rate. Even in this case, the imaging unit may be considered to be performing multiple exposures. The imaging unit may then read out the charges accumulated in each pixel of the imaging element. Even in this case, there is a high possibility that a single weld pool image IMG generated by the imaging unit will include a weld pool area MPA similar to the weld pool area MPA captured in the additive image IMG_C. Therefore, the control unit 18 may generate the weld pool image information MPI using a single weld pool image IMG that includes the weld pool area MPA.

[0164] Even if the imaging unit is equipped with an electronic shutter, the imaging unit may turn the electronic shutter on and off multiple times in synchronization with the imaging rate. In this case, the imaging unit may be considered to be performing multiple exposures. The imaging unit may then read out the charges accumulated in each pixel of the imaging element. Even in this case, there is a high possibility that a single weld pool image IMG generated by the imaging unit will include a weld pool area MPA similar to the weld pool area MPA captured in the additive image IMG_C. Therefore, the control unit 18 may generate the weld pool image information MPI using a single weld pool image IMG that includes the weld pool area MPA. However, the imaging unit may also read out the charges accumulated in each pixel of the imaging element each time the electronic shutter is turned on and off. In this case, the imaging unit may be considered to be essentially generating multiple weld pool images IMG as time-series data.

[0165] 12, the control unit 18 then controls the machining system 100 based on the molten pool image information MPI generated in step S22 (step S23). For example, as shown in FIG. 12, the control unit 18 controls the machining system 100 based on the molten pool image information MPI so that the size of the molten pool area MPA becomes a predetermined target size.

[0166] As an example, the control unit 18 may control the intensity of the processing light emitted by the light source so that the size of the weld pool area MPA becomes a predetermined target size. That is, the control unit 18 may perform DC modulation control, which controls the DC component of the intensity of the processing light EL. That is, when the intensity of the processing light EL changes, the size of the weld pool MP#1 changes. For example, the higher the intensity of the processing light EL, the greater the amount of the building material M (or the material that constitutes the building surface MS) melted by the processing light EL. Therefore, the higher the intensity of the processing light EL, the larger the size of the weld pool MP. When the sizes of the weld pools MP#1 and MP#2 change, the size of the weld pool area MPA reflected in the weld pool image IMG or the added image IMG_C changes.

[0167] As another example, the control unit 18 may control the galvanometer mirrors provided in the irradiation optical system to move each of the weld pools MP#1 and MP#2 so that the size of the weld pool area MPA becomes a predetermined target size. When the range over which the galvanometer mirror moves the weld pool MP#1 changes, the size of the weld pool area MPA reflected in the weld pool image IMG or the added image IMG_C changes. Similarly, when the range over which the galvanometer mirror 2156 moves the weld pool MP#2 changes, the size of the weld pool area MPA reflected in the weld pool image IMG or the added image IMG_C changes. Therefore, the control unit 18 can control the size of the weld pool area MPA by controlling the galvanometer mirrors.

[0168] The operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the difference between the size of the weld pool region MPA and the target size becomes smaller. In other words, the operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes closer to the target size. Furthermore, the operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the difference between the size of the weld pool region MPA and the target size becomes zero. In other words, the operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes the target size may include an operation of controlling the processing system 100 so that the size of the weld pool region MPA becomes equal to the target size. In either case, the control unit 18 may be considered to be performing feedback control of the processing system 100 based on the size of the weld pool region MPA.

[0169] As a result, the size of the weld pool area MPA is maintained at the target size. As described above, the weld pool area MPA corresponds to the area through which the weld pools MP#1 and MP#2 move. Therefore, the size of the weld pool area MPA is essentially correlated with the sizes of the machining unit areas BSA#1 and BSA#2 through which the weld pools MP#1 and MP#2 move, respectively. Therefore, when the size of the weld pool area MPA is maintained at the target size, the sizes of the machining unit areas BSA#1 and BSA#2 are also maintained at sizes corresponding to the target sizes. As a result, the size (typically, width) of a linear object formed by moving the machining unit areas BSA#1 and BSA#2 on the building surface MS is also maintained at a size corresponding to the target size. This is because the size of the linear object is correlated with the sizes of the machining unit areas BSA#1 and BSA#2. Therefore, by performing the weld pool feedback control operation, the machining system 100 can form a linear object having a desired size (typically, a desired width). In other words, by performing the molten pool feedback control operation, the machining system 100 reduces the possibility of erroneously forming a linear object having a size different from the desired size, and therefore the machining system 100 can form an object with high forming accuracy.

[0170] In the above description, the control unit 18 generates the molten pool image information MPI that correlates with the sizes of the machining unit areas BSA#1 and BSA#2 by adding together at least two molten pool images IMG. However, the control unit 18 may calculate an index value that correlates with the sizes of the machining unit areas BSA#1 and BSA#2 (i.e., the sizes of the areas through which the molten pools MP#1 and MP#2 move) from at least two molten pool images IMG without adding together at least two molten pool images IMG. In this case, the control unit 18 may control the machining system 100 in step S23 of FIG. 12 so that the calculated index value becomes the above-mentioned target size (or a value corresponding to the target size).

[0171] As an example, the control unit 18 may calculate the sizes of at least two weld pools MP that appear in at least two weld pool images IMG. For example, the control unit 18 may calculate the size of the weld pool MP that appears in the first weld pool image IMG, and also calculate the sizes of weld pools MP#1 and MP#2 that appear in a second weld pool image IMG that is different from the first weld pool image IMG. The control unit 18 may then add together the calculated sizes of at least two weld pools MP. For example, the control unit 18 may add together the sizes of the weld pools MP#1 and MP#2 that appear in the first weld pool image IMG and the sizes of the weld pools MP#1 and MP#2 that appear in the second weld pool image IMG. In this case, the value obtained by adding together the sizes of the at least two weld pools MP may be used as an index value that correlates with the sizes of the machining unit areas BSA#1 and BSA#2 (i.e., the size of the area through which the weld pools MP#1 and MP#2 move).

[0172] As another example, the control unit 18 may calculate the positions of at least two weld pools MP that appear in at least two weld pool images IMG. For example, the control unit 18 may calculate the positions of weld pools MP#1 and MP#2 that appear in a first weld pool image IMG, and also calculate the positions of weld pools MP#1 and MP#2 that appear in a second weld pool image IMG that is different from the first weld pool image IMG. The control unit 18 may then calculate the sizes of the machining unit areas BSA#1 and BSA#2 (i.e., the sizes of the areas through which weld pools MP#1 and MP#2 move) based on the calculated positions of at least two weld pools MP. For example, as described above, because the target irradiation area EA#1 periodically moves along one direction within the machining unit area BSA#1, the weld pool MP#1 also periodically moves along one direction. In this case, the control unit 18 may calculate the positions of both ends in one direction of the area through which the weld pool MP#1 moves based on the calculated position of the weld pool MP#1. For example, the control unit 18 may calculate the position where the coordinate indicating the position of the molten pool MP#1 is maximum and the position where the coordinate indicating the position of the molten pool MP#1 is minimum as the positions of both ends in one direction of the area through which the molten pool MP#1 moves. Then, the control unit 18 may calculate the distance between the calculated positions of both ends as an index value correlating with the size of the machining unit areas BSA#1 and BSA#2 (i.e., the size of the area through which the molten pools MP#1 and MP#2 move). In this case, the control unit 18 may control the machining system 100 in step S23 of FIG. 12 so that the calculated index value becomes a distance corresponding to the above-mentioned target size.

[0173] The following additional notes are provided regarding the above-described embodiment.

[0174] [Supplementary Note 1] A log data processing method including: making it possible to identify, from log data including time series values ​​related to a processing device that processes multiple processing objects in sequence and at least one of the multiple processing objects to be processed, first partial log data related to processing of a first processing object among the multiple processing objects, and second partial log data related to processing of a second processing object different from the first processing object among the multiple processing objects.

[0175] [Supplementary Note 2] A log data processing method including: identifying a plurality of processed portion log data corresponding to processing of any of a plurality of processing objects from log data including time series values ​​related to a processing device that processes a plurality of processing objects in sequence and at least one of the plurality of processing objects to be processed.

[0176] [Supplementary Note 3] A log data processing method including: outputting, from log data including time series values ​​related to a processing device that processes multiple processing objects in sequence and at least one of the multiple processing objects to be processed, first partial log data related to processing of a first processing object among the multiple processing objects, and second partial log data related to processing of a second processing object different from the first processing object among the multiple processing objects.

[0177] [Supplementary Note 4] A log data processing method including, in processing data sequentially output from a processing device that processes a plurality of processing objects held by a holder in sequence, outputting a first portion of the data relating to processing of a first processing object among the plurality of processing objects, and a second portion of the data relating to processing of a second processing object different from the first processing object among the plurality of processing objects, as first partial log data and second partial log data, respectively.

[0178] [Supplementary Note 5] A computer program for processing log data that causes a computer to execute processing including: making it possible to identify, from log data including time series values ​​related to a processing device that processes multiple processing objects in sequence and at least one of the multiple processing objects to be processed, first partial log data related to processing of a first processing object among the multiple processing objects, and second partial log data related to processing of a second processing object different from the first processing object among the multiple processing objects.

[0179] [Supplementary Note 6] A computer program for processing log data that causes a computer to execute processing including identifying, from log data including time-series values ​​related to a processing device that processes a plurality of processing objects in sequence and at least one of the plurality of processing objects to be processed, a plurality of processing portion log data corresponding to processing of any of the plurality of processing objects.

[0180] [Supplementary Note 7] A computer program for processing log data that causes a computer to execute a process including: outputting, from log data including time-series values ​​related to a processing device that processes a plurality of processing objects in sequence and at least one of the plurality of processing objects to be processed, first partial log data related to processing of a first processing object among the plurality of processing objects, and second partial log data related to processing of a second processing object different from the first processing object among the plurality of processing objects.

[0181] [Supplementary Note 8] A computer program for processing log data that causes a computer to execute a process including, in processing data sequentially output from a processing device that processes a plurality of processing objects held by a holder in sequence, outputting, as first partial log data and second partial log data, a first portion of the data related to processing a first processing object among the plurality of processing objects, and a second portion of the data related to processing a second processing object different from the first processing object among the plurality of processing objects.

[0182] [Supplementary Note 9] A log data processing device including: a measurement device that measures a plurality of measurement objects in sequence; and a processing circuit configured to identify a plurality of measurement portion log data corresponding to measurements on any one of the plurality of measurement objects from log data including time-series values ​​for at least one of the plurality of measurement objects being measured.

[0183] [Supplementary Note 10] A log data processing device including a measurement device that measures a plurality of measurement objects in sequence and a processing circuit configured to output, from log data including time-series values ​​for at least one of the plurality of measurement objects being measured, first partial log data relating to measurements on a first measurement object among the plurality of measurement objects and second partial log data relating to measurements on a second measurement object different from the first measurement object among the plurality of measurement objects.

[0184] [Supplementary Note 11] A log data processing device that processes data sequentially output from a measurement device that sequentially measures a plurality of measurement objects held by a holder, the log data processing device comprising a processing circuit configured to output, as first partial log data and second partial log data, a first portion of the data relating to measurement of a first measurement object among the plurality of measurement objects, and a second portion of the data relating to measurement of a second measurement object different from the first measurement object among the plurality of measurement objects.

[0185] [Supplementary Note 12] A log data processing method comprising: making it possible to identify, from log data including a measurement device that sequentially measures a plurality of measurement objects and time-series values ​​related to at least one of the plurality of measurement objects being measured, first partial log data related to measurements on a first measurement object among the plurality of measurement objects, and second partial log data related to measurements on a second measurement object different from the first measurement object among the plurality of measurement objects.

[0186] [Supplementary Note 13] A log data processing method including: identifying, from log data including a measurement device that sequentially measures a plurality of measurement objects and time-series values ​​related to at least one of the plurality of measurement objects being measured, a plurality of measurement portion log data corresponding to measurements on any of the plurality of measurement objects.

[0187] [Supplementary Note 14] A log data processing method including: outputting, from log data including a measurement device that sequentially measures a plurality of measurement objects and time-series values ​​related to at least one of the plurality of measurement objects being measured, first partial log data related to measurements on a first measurement object among the plurality of measurement objects, and second partial log data related to measurements on a second measurement object different from the first measurement object among the plurality of measurement objects.

[0188] [Supplementary Note 15] A log data processing method including, in processing data sequentially output from a measurement device that sequentially measures a plurality of measurement objects held by a holder, outputting a first portion of the data relating to measurement of a first measurement object among the plurality of measurement objects, and a second portion of the data relating to measurement of a second measurement object different from the first measurement object, as first partial log data and second partial log data, respectively.

[0189] [Supplementary Note 16] A computer program for processing log data that causes a computer to execute a process including: making it possible to identify, from log data that includes a measurement device that measures a plurality of measurement objects in sequence and time-series values ​​related to at least one of the plurality of measurement objects, first partial log data related to measurements on a first measurement object among the plurality of measurement objects, and second partial log data related to measurements on a second measurement object different from the first measurement object among the plurality of measurement objects.

[0190] [Supplementary Note 17] A computer program for processing log data that causes a computer to execute a process including: identifying, from log data that includes a measurement device that sequentially measures a plurality of measurement objects and time-series values ​​related to at least one of the plurality of measurement objects being measured, a plurality of measurement portion log data corresponding to measurements on any of the plurality of measurement objects.

[0191] [Supplementary Note 18] A computer program for processing log data that causes a computer to execute a process including: outputting, from log data that includes a measurement device that measures a plurality of measurement objects in sequence and time-series values ​​related to at least one of the plurality of measurement objects being measured, first partial log data related to measurements on a first measurement object among the plurality of measurement objects, and second partial log data related to measurements on a second measurement object different from the first measurement object among the plurality of measurement objects.

[0192] [Supplementary Note 19] A computer program for processing log data that causes a computer to execute a process including: processing data sequentially output from a measurement device that sequentially measures a plurality of measurement targets held by a holder; outputting, as first partial log data and second partial log data, a first portion of the data related to measurement of a first measurement target among the plurality of measurement targets, and a second portion of the data related to measurement of a second measurement target different from the first measurement target among the plurality of measurement targets.

[0193] At least some of the components of the above-described embodiments can be appropriately combined with at least some of the components of the above-described embodiments. Some of the components of the above-described embodiments may not be used. It should be understood that those skilled in the art can make various changes, substitutions, and alterations to the present disclosure without departing from the spirit and scope of the present disclosure.

[0194] 100 Machining system 1 Machining device 2 Measuring device 3 Control device 4 Log data processing device

Claims

1. A log data processing apparatus comprising a processing circuit configured to be able to specify, from log data including time-series values regarding at least one of a plurality of workpieces to be processed in order and the plurality of workpieces to be processed, first partial log data regarding processing of a first workpiece among the plurality of workpieces and second partial log data regarding processing of a second workpiece different from the first workpiece among the plurality of workpieces.

2. The log data processing apparatus according to claim 1, wherein the processing circuit is further configured to associate each of the first partial log data and the second partial log data with any one of the plurality of workpieces.

3. The log data processing apparatus according to claim 2, wherein in the specifying, the processing circuit specifies at least one preparation partial log data corresponding to a preparation operation for processing each workpiece from the log data, divides the log data into a plurality of partial log data including the at least one preparation partial log data and at least two processing partial log data separated by the at least one preparation partial log data, and makes the at least two processing partial log data specifiable as the first partial log data or the second partial log data.

4. The log data processing apparatus according to any one of claims 1 to 3, wherein the log data includes intermittent time-series values.

5. The log data processing apparatus according to any one of claims 1 to 4, wherein the log data includes continuous time-series values.

6. The log data processing apparatus according to any one of claims 1 to 5, wherein the processing circuit is further configured to record the first partial log data in association with the first workpiece.

7. The log data processing apparatus according to any one of claims 1 to 6, wherein the processing circuit is further configured to record the second partial log data in association with the second workpiece.

8. The log data processing apparatus according to claim 6, wherein in the recording, the processing circuit records the first partial log data as intermittent time-series values in association with the first workpiece.

9. The log data processing apparatus according to claim 6, wherein in the recording, the processing circuit records the first partial log data as continuous time-series values in association with the first workpiece.

10. The log data processing apparatus according to claim 7, wherein in the recording, the processing circuit records the second partial log data in association with the second processing target as intermittent time-series values.

11. The log data processing apparatus according to claim 7, wherein in the recording, the processing circuit records the second partial log data in association with the second processing target as continuous time-series values.

12. The log data processing apparatus according to any one of claims 6 - 11, wherein in the recording, the processing circuit records the first partial log data in association with the first processing target when at least one of the conditions regarding the processing apparatus and the processing target satisfies a first condition.

13. The log data processing apparatus according to claim 12, wherein the first condition includes a condition regarding at least one of the processing amount of the processing apparatus, the movement of the processing head of the processing apparatus, and the processing time.

14. The log data processing apparatus according to any one of claims 1 - 13, wherein in the specifying, the processing circuit can specify the first partial log data and the second partial log data from a part corresponding to the time when at least one of the conditions regarding the processing apparatus and the processing target in the log data satisfies the first condition.

15. The log data processing apparatus according to claim 14, wherein the first condition includes a condition regarding at least one of the processing amount of the processing apparatus, the movement of the processing head of the processing apparatus, and the processing time.

16. The processing head includes a sensor for acquiring the time-series values, and before the acquisition of the time-series values by the sensor, the processing head moves in a direction away from a workpiece including the plurality of processing targets. The log data processing apparatus according to claim 15.

17. Before the processing by the processing head, the processing head moves in a direction approaching the workpiece. The log data processing apparatus according to claim 16.

18. The processing head includes a sensor for acquiring the time-series values, and the position of the processing head when the time-series values are acquired by the sensor is farther from the workpiece including the plurality of processing targets than the position of the processing head when processing is performed on any of the plurality of processing targets. The log data processing apparatus according to claim 15.

19. The processing head is located above the workpiece. The log data processing apparatus according to any one of claims 16 - 18.

20. The sensor for acquiring the time-series values is a log data processing device according to claim 15, which moves in a direction approaching a workpiece including the plurality of objects to be processed.

21. Before the processing by the processing head, the sensor is a log data processing device according to claim 20, which moves in a direction away from the sensor and the workpiece.

22. The sensor is a log data processing device according to claim 20 or 21, which is located above the workpiece.

23. The processing device performs processing on a processing surface located at a predetermined height from an installation surface on which a workpiece including the plurality of objects to be processed is installed for the processing. In the specific case, the processing circuit can specify the first partial log data and the second partial log data from the log data for each processing layer including the processing surface or for the processing for each processing surface. The log data processing device according to any one of claims 1 to 22.

24. In the specific case, the processing circuit can respectively specify the first partial log data and the second partial log data from the log data acquired for each processing layer including the processing surface on which the processing is performed or for each processing surface. The log data processing device according to any one of claims 1 to 23.

25. The log data includes, as the time-series values, values related to the gas in the processing device. The log data processing device according to any one of claims 1 to 24.

26. The values related to the gas in the processing device include at least one of a value related to the oxygen concentration in the processing device and a value related to the temperature in the processing device. The log data processing device according to claim 25.

27. The log data includes, as the time-series values, values representing characteristics related to processing in which a beam is irradiated to each of the plurality of objects to be processed. The log data processing device according to any one of claims 1 to 26.

28. The log data includes, as values representing characteristics related to processing in which the beam is irradiated, values representing characteristics related to the beam irradiated to each of the plurality of objects to be processed. The log data processing device according to claim 27.

29. The log data includes, as values of characteristics regarding the beam, values representing the amount of light of the beam irradiated on each of the plurality of objects to be processed, and in the specific determination, the processing circuit can specify the first partial log data and the second partial log data based on the amount of light of the beam. The log data processing apparatus according to claim 28.

30. In the specific determination, the processing circuit divides the log data into a plurality of partial log data including at least one preparatory partial log data corresponding to the amount of light less than a predetermined light amount threshold value and at least two processing partial log data separated by the at least one preparatory partial log data, specifies one of the at least two processing partial log data as the first partial log data, and specifies the other one as the second partial log data. The log data processing apparatus according to claim 29.

31. The log data includes, as the time-series values, values representing characteristics regarding processing of supplying a material to each of the plurality of objects to be processed and irradiating a beam. The log data processing apparatus according to any one of claims 1 - 30.

32. The log data includes, as the time-series values, information regarding the material supplied to each of the plurality of objects to be processed. The log data processing apparatus according to claim 31.

33. The log data includes, as the time-series values, values regarding what is supplied from a processing head provided in the processing apparatus for the processing. The log data processing apparatus according to any one of claims 1 to 32.

34. The log data includes, as the time-series values, values regarding the environment within the processing apparatus. The log data processing apparatus according to any one of claims 1 to 33.

35. The log data includes, as the time-series values, values regarding the object to be processed. The log data processing apparatus according to any one of claims 1 to 34.

36. The log data includes, as the time-series values, values representing at least one of the position and movement of a processing head for processing the plurality of objects to be processed with respect to the plurality of objects to be processed. The log data processing apparatus according to any one of claims 1 - 35.

37. The log data includes, as a value related to the position of the machining head, at least one of a position in a plane parallel to the installation surface on which the workpiece including the plurality of machining targets is installed for the machining, an amount of movement in a plane parallel to the installation surface, and a distance from a predetermined reference position of the plurality of machining targets in a direction orthogonal to the installation surface. The log data processing apparatus according to claim 36.

38. The log data includes, as a value related to the position of the machining head, a value representing the machining head height related to the distance from the reference position of the plurality of machining targets in a direction orthogonal to the installation surface on which the workpiece is installed for the machining. In the specification, the processing circuit specifies the first partial log data and the second partial log data based on the machining head height. The log data processing apparatus according to claim 37.

39. In the specification, the processing circuit divides the log data into a plurality of partial log data including at least one preparation partial log data corresponding to a machining head height higher than a predetermined height threshold and at least two machining partial log data separated by the at least one preparation partial log data. One of the at least two machining partial log data is specified as the first partial log data, and the other one is specified as the second partial log data. The log data processing apparatus according to claim 38.

40. The log data includes, as the time-series value, a value related to the temperature of the plurality of machining targets. The machining head moves in a direction away from the workpiece before the measurement of the temperature. The log data processing apparatus according to claim 38 or 39.

41. The log data includes, as a value related to the position of the machining head, a value representing the machining head position related to the position in a plane parallel to the installation surface on which the plurality of machining targets are installed for the machining. In the specification, the processing circuit can specify the first partial log data and the second partial log data from the log data based on the machining head position. The log data processing apparatus according to any one of claims 38 - 40.

42. The processing circuit can identify, in the specific case, partial log data corresponding to the machining head positions included in the first region among the log data as the first partial log data, and can identify partial log data corresponding to the machining head positions included in a second region different from the first region as the second partial log data. The log data processing apparatus according to claim 41.

43. The log data includes, as a value representing the position of the machining head, a value representing the machining head movement amount related to the movement amount in a plane parallel to the installation surface. The processing circuit can identify, in the specific case, the first partial log data and the second partial log data from the log data based on the machining head movement amount. The log data processing apparatus according to any one of claims 37 - 42.

44. The processing circuit divides, in the specific case, the log data into a plurality of partial log data including at least one preparatory partial log data corresponding to a machining head movement amount greater than a predetermined movement threshold value and at least two machining partial log data separated by the at least one preparatory partial log data, and can identify one of the at least two machining partial log data as the first partial log data and the other one as the second partial log data. The log data processing apparatus according to claim 43.

45. The processing circuit performs the identification based on machining control information for controlling the machining. The log data processing apparatus according to any one of claims 1 - 44.

46. The machining control information is information for machining the second machining target after machining the first machining target. The log data processing apparatus according to claim 45.

47. The machining control information is information for machining the first machining target further after machining the second machining target. The log data processing apparatus according to claim 46.

48. The processing circuit performs the identification for the first partial log data and the second partial log data after the machining of the first machining target and the second machining target is completed. The log data processing apparatus according to any one of claims 1 - 47.

49. The processing circuit performs the identification of the first partial log data after the processing of the first processing target and before the processing of the second processing target, for the log data processing apparatus according to any one of claims 1 - 48.

50. The log data includes, in chronological order, first element data, second element data, third element data, and fourth element data. The processing circuit can identify the first partial log data by combining the first element data and the third element data in the identification, for the log data processing apparatus according to any one of claims 1 - 49.

51. The log data includes first log data that is a chronological value of a first attribute related to the processing, and second log data that is a chronological value of a second attribute different from the first attribute related to the processing. The processing circuit can identify the first partial log data and the second partial log data from the second log data based on the first log data in the identification, for the log data processing apparatus according to any one of claims 1 - 50.

52. The first attribute represents at least one of the position and movement of the processing head for processing the plurality of processing targets with respect to the plurality of processing targets, for the log data processing apparatus according to claim 51.

53. The second attribute represents at least one of the temperature of the plurality of processing targets and the gas in the processing apparatus, for the log data processing apparatus according to claim 51 or 52.

54. The processing circuit is further configured to output each of the first partial log data and the second partial log data associated with any one of the plurality of processing targets as separated data, for the log data processing apparatus according to claim 2.

55. The processing circuit is further configured to output partial identification information for identifying each of the first partial log data and the second partial log data associated with any one of the plurality of processing targets in the log data, for the log data processing apparatus according to any one of claims 2 or 54.

56. The processing circuit includes the partial identification information in the log data and outputs it in the output, for the log data processing apparatus according to claim 55.

57. The log data processing apparatus according to any one of claims 54 - 56, wherein the processing circuit visually outputs the first partial log data and the second partial log data in the output.

58. The log data processing apparatus according to any one of claims 1 - 57, wherein the processing is the creation of the plurality of objects to be processed.

59. The log data processing apparatus according to any one of claims 1 - 58, wherein the processing is the repair of the plurality of objects to be processed.

60. The log data processing apparatus according to any one of claims 1 - 59, wherein the first object to be processed is gripped by a first gripping part, and the second object to be processed is gripped by a second gripping part different from the first gripping part.

61. When the processing of the first object to be processed and the second object to be processed is completed, a third object to be processed different from the first object to be processed and the second object to be processed among the plurality of objects to be processed is gripped by the first gripping part, and a fourth object to be processed different from the first object to be processed, the second object to be processed, and the third object to be processed among the plurality of objects to be processed is gripped by the second gripping part. The processing circuit can specify third partial log data regarding the processing performed on the third object to be processed and fourth partial log data regarding the processing performed on the fourth object to be processed in the specification. The log data processing apparatus according to claim 60.

62. The log data processing apparatus according to claim 61, wherein the processing circuit can specify the third partial log data and the fourth partial log data from a part different from the part where the first partial log data and the second partial log data in the log data are specified in the specification.

63. The first object to be processed is included in a first object to be processed, and the second object to be processed is included in a second object to be processed different from the first object to be processed. The processing circuit is further configured to associate each of the first partial log data and the second partial log data with either the first object to be processed or the second object to be processed. The log data processing apparatus according to claim 62.

64. The log data processing apparatus according to any one of claims 1 - 63, wherein the first object to be processed is a first part of an object to be processed including the plurality of objects to be processed, and the second object to be processed is a second part different from the first part of the object to be processed.

65. The log data processing apparatus according to claim 64, wherein the first part and the second part have a common function.

66. The log data processing apparatus according to any one of claims 1 - 65, wherein the plurality of objects to be processed are a plurality of articles of the same type.

67. The log data processing apparatus according to claim 66, wherein the plurality of articles of the same type are a plurality of turbine blades.

68. A log data processing apparatus comprising a processing circuit configured to identify a plurality of partial processing log data corresponding to the processing of any one of the plurality of objects to be processed from log data including time - series values related to at least one of a processing apparatus that sequentially processes a plurality of objects to be processed and the plurality of objects to be processed.

69. The log data processing apparatus according to claim 3, wherein the processing circuit is further configured to associate each of the first partial log data and the second partial log data different from the first partial log data among the at least two partial processing log data with any one of the plurality of objects to be processed.

70. A log data processing apparatus comprising a processing circuit configured to output, respectively, first partial log data related to the processing of a first object to be processed, associated with the first object to be processed among the plurality of objects to be processed, and second partial log data related to the processing of a second object to be processed, associated with the second object to be processed different from the first object to be processed among the plurality of objects to be processed, from log data including time - series values related to at least one of a processing apparatus that sequentially processes a plurality of objects to be processed and the plurality of objects to be processed.

71. A log data processing apparatus that processes data sequentially output from a processing apparatus that sequentially processes a plurality of objects to be processed held by a fixture, the processing circuit being configured to output, as first partial log data and second partial log data, respectively, a first part related to the processing of a first object to be processed among the plurality of objects to be processed and a second part related to the processing of a second object to be processed different from the first object to be processed among the plurality of objects to be processed.

72. A log data processing apparatus comprising a processing circuit configured to be able to specify first partial log data regarding measurement of a first measurement target among the plurality of measurement targets, and second partial log data regarding measurement of a second measurement target different from the first measurement target among the plurality of measurement targets, from log data including time-series values regarding at least one of the plurality of measurement targets to be measured in order by a measurement apparatus.

73. A processing system comprising the processing apparatus and the log data processing apparatus according to any one of claims 1-71.

74. A measurement system comprising the measurement apparatus and the log data processing apparatus according to claim 72.

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