Electronic device

Abstract

The present disclosure relates to an electronic device. This electronic device may comprise: a front frame to which a light-transmitting display unit is coupled; and temples which extend lengthwise and are hinge-connected to the front frame. The front frame comprises: a PCB built-into the front frame and extending from the front frame toward the temples; and display panels built-into in the front frame at one side of display units and electrically connected to the PCB. Each temple comprises: a plurality of heat dissipation holes formed on the upper side and the lower side of the temple and extending in a direction that intersects the direction going from the upper side of the temple to the lower side of the temple; and a heat dissipation member coupled to at least one of the plurality of heat dissipation holes, wherein the heat dissipation member can be fixed to the inside of at least one of the plurality of heat dissipation holes.

Description

electronic devices

[0001] The present disclosure relates to electronic devices. More specifically, it relates to electronic devices used in virtual reality (VR), augmented reality (AR), mixed reality (MR), extended reality (XR), and the like.

[0002] Virtual Reality (VR) refers to a specific environment or situation, or the technology itself, that is similar to reality but not real, created by artificial technology using computing power.

[0003] Augmented Reality (AR) is a technology that synthesizes virtual objects or information into the real environment to make them appear as objects that exist in the original environment.

[0004] Mixed reality (MR) or hybrid reality refers to the creation of new environments or information by merging virtual and real worlds. In particular, it refers to real-time interaction between real and virtual worlds.

[0005] Extended Reality (XR) encompasses virtual reality (VR), augmented reality (AR), and mixed reality (MR).

[0006] Created virtual environments and situations stimulate the user's five senses, allowing them to experience spatial and temporal experiences similar to reality, freely blurring the boundaries between reality and imagination. Users not only immerse themselves in these environments, but can also interact with the objects embodied within them, using real devices to control and command them.

[0007] Recently, research on gear used in these technical fields has been actively conducted.

[0008] The present disclosure aims to solve the above-mentioned and other problems.

[0009] Another purpose may be to provide electronic devices used in Virtual Reality (VR), Augmented Reality (AR), Mixed Reality (MR), and eXtended Reality (XR).

[0010] Another purpose may be to provide a structure for electronic devices used in Augmented Reality (AR).

[0011] Another purpose may be to provide an ergonomic structure for electronic devices used in Augmented Reality (AR).

[0012] Another purpose may be to provide an ergonomic weight distribution structure for electronic devices used in Augmented Reality (AR).

[0013] Another purpose may be to provide a user-worn structure for electronic devices used in Augmented Reality (AR).

[0014] Another purpose may be to provide a temple hinge structure for electronic devices used in Augmented Reality (AR).

[0015] Another purpose may be to provide a heat dissipation structure for electronic devices used in Augmented Reality (AR).

[0016] According to one aspect of the present disclosure for achieving the above or other purposes, an electronic device includes: a front frame to which a light-transmitting display unit is coupled; and a temple that is elongated and hingedly connected to the front frame, wherein the front frame includes: a PCB built into the front frame and extending from the front frame toward the temple; and a display panel built into the front frame at one side of the display unit and electrically connected to the PCB, wherein the temple includes: a plurality of heat dissipation holes formed on an upper side of the temple and a lower side of the temple and extending in a direction intersecting a direction from an upper side of the temple to a lower side; and a heat dissipation member coupled to at least one of the plurality of heat dissipation holes, wherein the heat dissipation member can be fixed to the inside of at least one of the plurality of heat dissipation holes.

[0017] The effects of the electronic device according to the present disclosure are described as follows.

[0018] According to at least one of the embodiments of the present disclosure, an electronic device used in VR (Virtual Reality), AR (Augmented Reality), MR (Mixed Reality), etc. can be provided.

[0019] According to at least one of the embodiments of the present disclosure, a structure of an electronic device used for AR (Augmented Reality) can be provided.

[0020] According to at least one of the embodiments of the present disclosure, an ergonomic structure of an electronic device used in AR (Augmented Reality) can be provided.

[0021] According to at least one of the embodiments of the present disclosure, an ergonomic weight distribution structure of an electronic device used in AR (Augmented Reality) can be provided.

[0022] According to at least one of the embodiments of the present disclosure, a user-worn structure of an electronic device used in AR (Augmented Reality) can be provided.

[0023] According to at least one of the embodiments of the present disclosure, a temple hinge structure of an electronic device used in AR (Augmented Reality) can be provided.

[0024] According to at least one of the embodiments of the present disclosure, a heat dissipation structure of an electronic device used in AR (Augmented Reality) can be provided.

[0025] Further scope of the applicability of the present disclosure will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present disclosure will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present disclosure, are given by way of example only.

[0026] FIGS. 1 to 22 are drawings illustrating examples of electronic devices according to embodiments of the present disclosure.

[0027] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components are given the same reference numbers and redundant descriptions thereof will be omitted.

[0028] The suffixes "module" and "part" used for components in the following description are given or used interchangeably only for the convenience of writing specifications, and do not have distinct meanings or roles in themselves.

[0029] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of a related known technology may obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of the present disclosure.

[0030] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0031] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0032] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0033] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0034]

[0035] Referring to FIG. 1, the electronic device (100) may have an overall shape of glasses or goggles. The electronic device (100) may include a frame (110, 120) and a display unit (130).

[0036] The frame (110, 120) may include a front frame (110), a side frame (120), and a nose support (115). The front frame (110) may include a plurality of rims (111, 112), a bridge (113), and an end piece (116, 117). The bridge (113) may connect the first rim (111) and the second rim (112).

[0037] The shape of the opening of the rim (111, 112) may correspond to the shape of the display unit (130). For example, the display unit (130) may be coupled or fixed to the opening of the rim (111, 112). The first end piece (117) may face the bridge (113) with respect to the first rim (111), and the second end piece (116) may face the bridge (113) with respect to the second rim (112). The front frame (110) may be symmetrical left and right with respect to the bridge (113).

[0038] The side frame (120) may be coupled to the front frame (110). The side frame (120) may be hinge-coupled to the end pieces (116, 117). For example, the first side frame (120a) may be hinge-coupled to the first end piece (117), and the second side frame (120b) may be hinge-coupled to the second end piece (116). The side frame (120) may include temples (121a, 121b) and temple tips (122a, 122b). The temples (121a, 121b) may be hinge-coupled to the end pieces (116, 117). Temple tips (122a, 122b) can be connected to the temples (121a, 121b) facing the end pieces (116, 117) of the temples (121a, 121b).

[0039] The nose pads (115a, 115b) may be coupled to the bridge (113) or the rims (111, 112). For example, the first nose pad (115a) may be coupled to the first rim (111) or the bridge (113), and the second nose pad (115b) may be coupled to the second rim (112) or the bridge (113). Depending on the structure of the frame (110, 120), the nose pads (115a, 115b) may be omitted or formed integrally with the front frame (110). The nose pads (115a, 115b) may be movable up and down.

[0040]

[0041] Referring to FIG. 2 together with FIG. 1, the electronic device (100) may include a main PCB (142) and a sub PCB (141). For example, the main PCB (142) and / or the sub PCB (141) may be a flexible circuit board (F-PCB). The sub PCB (141) may be elongated and may be built into a frame (110, 120). For example, the sub PCB (141) may be built into a front frame (110), a second end piece (116), and / or a second side frame (120b). As another example, the sub PCB (141) may be built into a front frame (110), a first end piece (117), a second end piece (116), a first side frame (120a), and / or a second side frame (120b).

[0042] The main PCB (142) can be built into the frame (110, 120) and electrically connected to the sub PCB (141). For example, the main PCB (142) can be built into the first side frame (120a) and connected to the sub PCB (141).

[0043] The first battery (146a) is electrically connected to the main PCB (142) and can supply power to the main PCB (142). The second battery (146b) is electrically connected to the sub PCB (141) and can supply power to the sub PCB (141). The first speaker (145a) is electrically connected to the main PCB (142) and can receive a signal from the main PCB (142) and output sound. The second speaker (145b) is electrically connected to the sub PCB (141) and can receive a signal from the sub PCB (141) and output sound.

[0044] The first display engine (143a) and / or the second display engine (143b) may be electrically connected to the sub PCB (141). The first display panel (144a) and / or the second display panel (144b) may be electrically connected to the sub PCB (141). The first display engine (143a) may provide an image signal, a video signal, or a text signal to the first display panel (144a), and the second display engine (143b) may provide an image signal, a video signal, or a text signal to the second display panel (144b). For example, the display panels (144a, 144b) may be micro LEDs, OLEDs, or OLEDos (OLED on silicon). The display engine (143) and the display panel (144) may be referred to as an imaging module (143, 144) or an imaging engine (143, 144) or an image generator (143, 144) or a display module (143, 144).

[0045] The first display engine (143a) may be built into the first end piece (117), and the first display panel (144a) may be built into the first rim (111). The second display engine (143b) may be built into the second end piece (116), and the second display panel (144b) may be built into the second rim (112). The main camera (148) may be electrically connected to the sub PCB (141) and mounted on the front frame (110). The main camera (148) may also be built into the first end piece (117) and / or the second end piece (116).

[0046] The main camera (148) may include an image camera (148a) and depth of field (DoF) cameras (148b, 148c). The image camera (148a) may acquire external image information through an imaging element. The depth cameras (148b, 148c) may sense the depth of a subject required for determining the focal length of the image camera (148a) to improve the quality of the image information acquired by the image camera (148a). There may be a plurality of depth cameras (148b, 148c). The first depth camera (148b) may be mounted on the first end piece (117) and / or the front frame (110), and the second depth camera (148c) may be mounted on the second end piece (116) and / or the front frame (110). The image camera (148a) can obtain accurate image information by means of the dual depth cameras (148b, 148c).

[0047]

[0048] Referring to FIG. 3 together with FIG. 2, the sub PCB (141) may include a main line (141a), a first display connector (141b), a camera module connector (141d), a first display board (141c), a main board connector (141e), a second display connector (141f), a second display board (141g), and / or a sensor connector (141m).

[0049] The main line (141a) may be elongated and have a width smaller than the width of the rims (111, 112) of the front frame (110, see FIG. 1). The first display connector (141b) may be connected to the main line (141a). The first display panel (144a) may be connected to the first display connector (141b). A first display engine (143a) including electronic components for image generation may be mounted on the first display board (141c). For example, an image processing processor, a T-CON board, etc. may be mounted on the first display board (141c).

[0050] The main camera (148) can be connected to the camera module connector (141d). The main board connector (141e) can extend from the first display board (141c) or the main line (141a). The main PCB (142) can be connected to the main board connector (141e).

[0051] A second display connector (141f) may be connected to the main line (141a). A second display panel (144b) may be connected to the second display connector (141f). A second display engine (143b) including electronic components for image generation may be mounted on the second display board (141g). For example, an image processing processor, a T-CON board, etc. may be mounted on the second display board (141g).

[0052] The sensor connector (141m) can be connected to the main line (141a). Sensors that detect the external environment can be connected to the sensor connector (141m). For example, the sensor (149) can be a light sensor.

[0053] The main board connector (141e) can be connected to the main line (141a) by the first hinge FPCB (141v).

[0054] The first display unit (131) may include a first upper frame (131c) and a first display lens (131a). The first display lens (131a) may be inserted into and fixed to the first opening (111a, see FIG. 1) of the first rim (111, see FIG. 1) in a shape corresponding to the first opening (111a, see FIG. 1). The first upper frame (131c) may cover the upper surface of the first display lens (131a) and may be fixed to the first display lens (131a). The first upper frame (131c) may be coupled to the first rim (111).

[0055] The second display unit (132) may include a second upper frame (132c) and a second display lens (132a). The second display lens (132a) may be inserted into and fixed to the second opening (112a, see FIG. 1) of the second rim (112, see FIG. 1) in a shape corresponding to the second opening (112a, see FIG. 1). The second upper frame (132c) may cover the upper surface of the second display lens (132a) and may be fixed to the second display lens (132a). The second upper frame (132c) may be coupled to the second rim (112).

[0056] The first display panel (144a) is mounted on the first upper frame (131c) and can provide image light to the first display lens (131a). The first display panel cable (144ca) can be connected to the first display panel (144a).

[0057] The second display panel (144b) is mounted on the second upper frame (132c) and can provide image light to the second display lens (132a). The second display panel cable (144cb) can be connected to the second display panel (144b).

[0058] Below, the description of the first display unit (131) can be equally applied to the second display unit (132).

[0059]

[0060] Referring to FIG. 4, the front frame (110) may include a rear cover (110R), a middle cover (110M), and a front cover (110F). A sub PCB (141) may be built into the rear cover (110R). The sub PCB (141) may be coupled to the upper side of the first rim (111R) and the upper side of the second rim (112R) of the rear cover (110R). The sub PCB (141) may be mounted to the first rim (111R) and the second rim (112R) via the bridge (113R) of the rear cover (110R). The sub PCB (141) can be mounted on the upper side of the first rim (111R) of the rear cover (110R) and the first end piece (117R), and can be mounted on the upper side of the second rim (112R) of the rear cover (110R) and the second end piece (116R).

[0061] The middle cover (110M) may be coupled or fixed to the rear cover (110R). The middle cover (110M) may face the rear cover (110R) with respect to the first display unit (131) and / or the second display unit (132). The middle cover (110M) may fix the first display unit (131) and the second display unit (132) to the rear cover (110R).

[0062] The camera module (148a) of the main camera (148) can be fixed to the camera module connector (141d), and the middle cover (110M) can cover the camera module (148a) while being coupled to the rear cover (110R). The lens of the camera module (148a) can be exposed to the outside through the lens hole (CH) of the middle cover (110M) and the front cover (110F). The front cover (110F) can be coupled to or fixed to the middle cover (110M).

[0063] The first display unit (131) can be coupled to the first rims (111F, 111M, 111R) of the front cover (110F), the middle cover (110M), and the rear cover (110R), and the second display unit (132) can be coupled to the second rims (112F, 112M, 112R) of the front cover (110F), the middle cover (110M), and the rear cover (110R). The bridge (113F) of the front cover (110F), the bridge (113M) of the middle cover (110M), and / or the bridge (113R) of the rear cover (110R) can connect the first display unit (131) and the second display unit (132).

[0064]

[0065] Referring to FIG. 5, the leveling module (115) may be coupled to or built into the bridge (113R) and / or the rim (111R, 112R) of the rear cover (110R). The nose arm (115c) may be connected to the leveling module (115), and the nose pads (115a, 115b) may be connected to the nose arm (115c). The leveling module (115) may move the nose arm (115c) and / or the nose pads (115a, 115b) up and down.

[0066] The hinge module (200) can be connected or coupled to the end pieces (116R, 117R). The first hinge module (200a) can be connected or coupled to the first end piece (117R), and the second hinge module (200b) can be connected or coupled to the second end piece (116R).

[0067]

[0068] Referring to FIGS. 6 and 7, the main PCB (142) may be embedded in the temple (121a) of the first side frame (120a). The first side frame (120a) may be hinge-connected to the first end piece (117, see FIG. 4). The first switch (152) may be exposed to the outside through the temple (121a) of the first side frame (120a). For example, the first switch (152) may be a camera shutter. The main PCB (142) may be referred to as a first main board (142).

[0069] The first speaker (145a) is electrically connected to the main PCB (142) and can be built into the temple (121a) of the first side frame (120a). The first battery (146a) can be built into the temple tip (122a) of the first side frame (120a). The first battery (146a) can be electrically connected to the main PCB (142) by a wire (146w). The first battery (146a) can supply power to the main PCB (142).

[0070] The side frames (120a, 120b) may be provided with ear portions (123a, 123b) that connect the temples (121a, 121b) and the temple tips (122a, 122b). The wire (146w) may electrically connect the first battery (146a) and the main PCB (142) within the temple (121a) of the first side frame (120a), the ear portion (123a), and the temple tip (122a).

[0071] The weight of the battery (146a) may be relatively heavy due to other electronic components. The battery (146a) may be built into the temple tip (122a), and other electronic components may be built into the front frame (110, see FIG. 4) and the temple (121a).

[0072] The terminal board (141n) may be built into the temple tip (122a). An electrode (EL) may be formed on one surface of the terminal board (141n). There may be a plurality of electrodes (EL). The plurality of electrodes (EL) may be arranged in a row. For example, the terminal board (141n) may be a PCB. As another example, the terminal board (141n) may be an F-PCB. The terminal board (141n) may include a connection board (141w). The terminal board (141n) may be connected to the main PCB (142) by the connection board (141w). A terminal hole (EH) may be formed in the temple tip (122a). The terminal hole (EH) may be exposed to the outside of the temple tip (122a). There may be a plurality of terminal holes (EH), and the plurality of terminal holes (EH) may correspond to a plurality of electrodes (EL).

[0073] The magnetic body (M) can be embedded in the temple tip (122a). The magnetic body (M) is positioned around the terminal hole (EH) and can be fixed to the inner surface of the temple tip (122a). The magnetic body (M) can be positioned on both sides of a plurality of terminal holes (EH).

[0074] A heat dissipation hole may be formed on the upper and / or lower side of the temple (121a). The heat dissipation hole (121v) may be referred to as a heat dissipation slot (121v), a heat dissipation opening (121v), or an air path opening (121v). An air filter (121c) may cover the heat dissipation hole (121v). The air filter (121c) may be referred to as a heat dissipation cover (121c) or an opening cover (121c).

[0075] The touch pad (151) may be connected to the main PCB (142). The touch pad (151a) may include a touch panel (151a) and a panel electrode (151b). The touch panel (151a) may be located on the outer surface of the main PCB (142) and may face the outer surface of the main PCB (142). For example, the touch panel (151a) may be an electrostatic sensitive panel. As another example, the touch panel (151a) may be a pressure sensitive panel. The panel electrode (151b) may electrically connect the main PCB (142) and the touch panel (151a).

[0076] The flat board (141s) can be built into the temple (121b) of the second side frame (120b). The flat board (141s) can be referred to as a second main board (141s).

[0077] The temple (121b) of the second side frame (120b) can be hinge-connected to the second end piece (116, see FIG. 4) by a hinge (200b, see FIG. 4). The second hinge (200b) can hinge-connect the second side frame (120b) to the second end piece (116).

[0078] The second speaker (145b) may be built into the temple (121b) of the second side frame (120b). The second battery (146b) may be built into the temple tip (122b) of the second side frame (120b). A wire (146w) may electrically connect the second battery (146b) to the flat board (141s). For example, the wire (146w) may be built into the second temple tip (122b), the ear portion (123b) and / or the second temple (121b) and electrically connect the second battery (146b) to the flat board (141s).

[0079] The weight of the battery (146b) may be relatively heavy due to other electronic components. The battery (146b) may be built into the temple tip (122b), and other electronic components may be built into the front frame (110) and the temple (121b).

[0080]

[0081] Referring to FIG. 8, the hinge module (200) may be referred to as a hinge assembly (200) or a hinge unit (200). The hinge module (200) may include a first body (210), a second body (220), a cap (240), and a slider (250).

[0082] The cap (240) can be coupled to the first body (210). The first body (210) can be inserted into the cap (240). The cap (240) can cover the outer surface of the first body (210). The second body (220) can be coupled to the first body (210). The second body (220) can rotate with respect to the first body (210).

[0083] The slider (250) can be coupled to the second body (220). The slider (250) can move in a straight line while sliding with respect to the second body (220).

[0084] The hinge module (200) may include an inner cover assembly (270). The inner cover assembly (270) may be coupled or fixed to the first body (210) and / or the second body (220). The inner cover assembly (270) may include a front bracket (271), a rear bracket (272), and a middle seat (273). The front bracket (271) may be coupled or fixed to the first body (210), and the rear bracket (272) may be coupled or fixed to the slider (250). The middle seat (273) may be coupled or fixed to the front bracket (271) and / or the rear bracket (272) while connecting the front bracket (271) and the rear bracket (272). The inner cover assembly (270) may cover the first body (210) and / or the second body (220). The inner cover assembly (270) can cover the slider (250). The middle sheet (273) can have an opening (273P). The opening (273P) can be located between the front bracket (271) and / or the rear bracket (272).

[0085]

[0086] Referring to FIG. 9, the first body (210) may include sidewalls (211, 212), a rotating drum (213), a rotating guide (215, 216), a coupling portion (217), and a fixed gate (218). The sidewalls (211, 212) may form both sides of the first body (210). The coupling portion (217) may be located between the first sidewall (211) and the second sidewall (212).

[0087] The rotary drum (213) may be adjacent to the joint (217) and positioned between the first sidewall (211) and the second sidewall (212). The first sidewall (211) and the second sidewall (212) may form opposite ends of the rotary drum (213). For example, the rotary drum (213) may have a half-pipe shape.

[0088] The rotation guides (215, 216) may be formed on the inner side of the side walls (211, 212) adjacent to the rotation drum (213). The first rotation guide (215) may be formed on the inner side of the first side wall (211), and the second rotation guide (216) may be formed on the inner side of the second side wall (212). The first rotation guide (215) may face the second rotation guide (216). For example, the rotation guides (215, 216) may have a semicircular ring shape. The curvature of the rotation guides (215, 216) may be the same as the curvature of the rotation drum (213, 214).

[0089] The fixed gate (218) may be a slot connected to the joint (217). The fixed gate (218) may be a rectangular frame overall. The fixed gate (218) may be connected to or fixed to the end piece (116, 117).

[0090] An elastic member (230) may be coupled to the first body (210). The elastic member (230) may include a fixed plate (231) and an arc plate (232). For example, the elastic member (230) may be a plate spring. The fixed plate (231) may be coupled to a joint portion (217) of the first body (210) by a fastening member (f).

[0091] The arc plate (232) may extend and bend from the fixed plate (231). The arc plate (232) may have a semicircular shape. The curvature of the arc plate (232) may be the same as the curvature of the rotating drum (213). The arc plate (232) may include a friction portion (234) and a slit (233). A plurality of slits (233) may be formed on both sides of the friction portion (234). The plurality of slits (233) may be formed by penetrating the arc plate (232). The first slit (233a) may face the second slit (233b) with respect to the friction portion (234). The friction portion (234) may be formed by being pressed so as to protrude from the arc plate (232). The curvature of the friction portion (234) may be the same as the curvature of the arc plate (232). The friction portion (234) can form a step that increases from the arc plate (232).

[0092] The cap (240) may include an outer cover (241) and bridges (242, 243). The outer cover (241) may cover the rotating drum (213) of the first body (210) and / or the first sidewall (211) and / or the second sidewall (212). The bridges (242, 243) may extend from the outer cover (241). There may be a plurality of bridges (242, 243). The first bridge (242) may be spaced apart from the second bridge (243). The bridges (242, 243) may include a fastening groove (240c). The fastening member (f) can be inserted or fixed into the fastening groove (240c) of the bridge (242, 243) by penetrating the elastic member (230) and / or the fixing member (217) of the first body (210).

[0093]

[0094] Referring to FIG. 10, the second body (220) can be rotatably or pivotally coupled to the first body (210, see FIG. 8). The rotary head (223) of the second body (220) can be positioned on the rotary drum (213, see FIG. 9) of the first body (210). The outer surface of the rotary head (223) of the second body (220) can contact the inner surface of the rotary drum (213) of the first body (210) and / or the inner surface of the friction portion (234) of the elastic member (230, see FIG. 9).

[0095] The rotation guide (215, 216, see FIG. 9) of the first body (210) can be inserted into the rotation slot (223a, 223b) of the rotation head (223) of the second body (220). The rotation guide (215, 216) can move frictionally in the rotation slot (223a, 223b).

[0096] The slider (250) can face the sliding body (221) of the second body (220). The slider (250) can move linearly in the second body (220). The guide pole (262) can be installed in the sliding body (221). The first guide pole (262a) can be installed in the sliding body (221) in parallel with the second guide pole (262b). The first guide pole (262a) can be inserted into the first coil spring (261a), and the second guide pole (262b) can be inserted into the second coil spring (261b). The slider (250) can move reciprocally in the guide pole (262). The guide pole (262) can be inserted into the slider (250). The coil spring (261) can provide elasticity to the slider (250). When the slider (250) moves in a straight line on the sliding body (221), the coil spring (261) can restore the position of the slider (250).

[0097] When the second body (220) rotates or pivots with respect to the first body (210, see FIG. 8), the rotation slots (223a, 223b) of the rotation head (223) can move in the rotation guides (215, 216, see FIG. 9) of the rotation drum (213, see FIG. 9). The rotation head (223) can rotate in the rotation drum (213) and / or the arc plate (232, see FIG. 9) while contacting the friction portion (234, see FIG. 9) of the elastic member (230, see FIG. 9). When the friction portion (234) of the elastic member (230) comes into close contact with the outer surface of the rotation head (223), and the second body (220) stops rotating or pivoting with respect to the first body (210), the second body (220) can maintain a constant rotation angle with respect to the first body (210).

[0098]

[0099] With reference to FIG. 11, the description of the first end piece (117) and the first hinge module (200a) can be applied to the second end piece (200b, see FIG. 4) and the second hinge module (116, see FIG. 4). The first end piece (117) can include a hinge gate (119).

[0100] The hinge gate (119) may have a square frame shape that opens in the front-back direction of the front frame (110). The hinge gate (119) may form a rear slot (119s2) in the center. The hinge gate (119) may have a support (119a). The support (119a) may be formed on the inner side of the hinge gate (119). The support (119a) may form a front slot (119s1). The length of the rear slot (119s2) may correspond to the length of the front slot (119s1). The width of the rear slot (119s2) may be greater than the width of the front slot (119s1).

[0101] The hinge gate (119) may have a hinge fixing portion (119c). The hinge fixing portion (119c) may be formed on an outer wall (119b) of the hinge gate (119). The hinge fixing portion (119c) may form a step inward from the outer wall (119b) of the hinge gate (119). The hinge fixing portion (119c) may include a fastening hole (h).

[0102] The fixed gate (218) of the first body (210) of the first hinge module (200a) can be inserted into the hinge gate (119) of the first end piece (117). The slot (218s) of the fixed gate (218) of the first hinge module (200a) can face the front slot (119s1) of the hinge gate (119). The fixed gate (218) of the first hinge module (200a) can be supported by or in contact with the support (119a) of the hinge gate (119) of the first end piece (117). The hinge fixing portion (119c) of the first end piece (117) can be located between the bridges (242, 243) of the first hinge module (200a). The fastening hole (h) formed in the joint portion (217) of the first hinge module (200a) can be aligned with the fastening hole (h) formed in the hinge fixing portion (119c) of the hinge gate (119).

[0103]

[0104] Referring to FIGS. 12 and 13, the sealing member (141R) can be inserted or pressed into the front slot (119s1, see FIG. 11) of the hinge gate (119) and / or the fixed gate (218). The outer surface of the sealing member (141R) can contact the inner surface of the front slot (119s1) of the hinge gate (119) and / or the inner surface of the fixed gate (218). For example, the sealing member (141R) can be formed integrally with the fixed gate (218) by insert injection.

[0105] The sealing member (141R) may have an FPCB slot (141RS), and the main board connector (141e) and / or the first hinge FPCB (141v) may be inserted into the FPCB slot (141RS) of the sealing member (141R). For example, the sealing member (141R) may be rubber. When the main board connector (141e) is inserted into the FPCB slot (141RS) of the sealing member (141R), the sealing member (141R) may be extended, and when the first hinge FPCB (141v) is inserted into the FPCB slot (141RS) of the sealing member (141R), the sealing member (141R) may be restored.

[0106] The main board connector (141e) and the first hinge FPCB (141v) can pass through an opening (273P) formed in the middle sheet (273) of the inner cover assembly (270). The main board connector (141e) and the first hinge FPCB (141v) that pass through the opening (273P) of the middle sheet (273) can face or come into contact with the inner cover assembly (270).

[0107]

[0108] Referring to FIGS. 14 and 15 together with FIG. 12, the fixed gate (218) of the hinge module (200a, 200, see FIG. 12) is inserted into the hinge gate (119), and the fastening member (f) is screw-connected to the fastening hole (h) of the hinge fixing portion (119c) and the fastening hole (h) formed in the joining portion (217) of the hinge module (200a, 200), so that the fixed gate (218) of the hinge module (200a, 200) can be fixed to the hinge gate (119). Accordingly, the rigidity with which the hinge module (200) is coupled to the end piece (116, 117) of the front frame (110) can be improved. By improving the joint rigidity with which the hinge module (200) is fixed to the front frame (110), the alignment of the main camera (148, see FIG. 1), for example, the image camera (148a) and / or the depth camera (148b, 148c) mounted on the front frame (110) can be prevented from being misaligned.

[0109] The first hinge FPCB (141v) is inserted into the sealing member (141R), and the sealing member (141R) fills the space between the fixed gate (218) and the first hinge FPCB (141v), thereby preventing external foreign substances from entering and improving the dustproof and moistureproof function.

[0110] The first hinge FPCB (141v) passing through the hinge module (200a, 200) is built into the temple (121a) of the side frame (120a), and the middle sheet (273) of the inner cover assembly (270) is positioned between the end piece (117) and the temple (121a), thereby preventing the first hinge FPCB (141v) from being damaged or exposed to the outside by the gap formed between the end piece (117) and the temple (121a). Damage to an electronic device that may occur when the side frame (120a) repeatedly pivots with respect to the hinge module (200a, 200) can be improved.

[0111]

[0112] Referring to FIG. 16, the temple (121a) may include an inner case (121a2) and an outer case (121a1). The description of the temple (121a) of the first side frame (120a, see FIG. 6) may also be applied to the temple (121b, see FIG. 7) of the second side frame (120b, see FIG. 7).

[0113] The outer case (121a1) may form the outer surface, upper surface, and / or lower surface of the temple (121a). The inner case (121a2) may be coupled to the outer case (121a1). The inner case (121a2) may be coupled to or fixed to the upper surface and / or lower surface of the outer case (121a1). The inner case (121a2) may come into contact with the user's skin.

[0114] The heat dissipation hole (121v) may be formed on the upper surface and / or the lower surface of the outer case (121a1). The upper and lower sides of the temple (121a) may be connected to the outside by the heat dissipation hole (121v).

[0115] The heat dissipation member (125) can be coupled to the heat dissipation hole (121v). The heat dissipation member (125) can include metal. For example, the heat dissipation member (125) can be coupled to the outer case (121a1) when the outer case (121a1) is insert-molded. The heat dissipation member (125) can narrow the area of ​​the heat dissipation hole (121v). The heat dissipation member (125) can be provided with a flow slot or a flow hole.

[0116] The touch pad (151, see also FIG. 6) may face the inner surface of the outer case (121a1) or be supported by the inner surface of the outer case (121a1). For example, the touch panel (151a, see also FIG. 6) may be supported by the inner surface of the outer case (121a1) or may come into contact with the inner surface of the outer case (121a1).

[0117] The heat dissipation sheet (126) may face the outer case (121a1) with respect to the touch panel (151a). The heat dissipation sheet (126) may be in contact with the touch panel (151a). For example, the heat dissipation sheet (126) may be a graphite sheet.

[0118] The vapor chamber (127a) may be in contact with the heat dissipation sheet (126). The vapor chamber (127a) may cool the heat source by vaporization and / or condensation of a fluid. The insulating layer (127b) may face the heat dissipation sheet (126) with respect to the vapor chamber (127a). The insulating layer (127b) may be in contact with the vapor chamber (127a).

[0119] A high-performance integrated circuit (AP) may be mounted on the main PCB (142). For example, the integrated circuit (AP) may be a microprocessor or an application processor. The integrated circuit (AP) may be spaced apart from a heat dissipation sheet (126).

[0120] Heat generated from the main PCB (142) and / or the integrated component (AP) is cooled by air current flowing in from the lower heat dissipation hole (121v), and the air current that has absorbed the heat can be naturally convected through the upper heat dissipation hole (121v). The heat generated by the main PCB (142) and / or the integrated component (AP) is not only diffused and dissipated by the heat dissipation sheet (126) and / or the vapor chamber (127a), but is also air-cooled by natural convection, thereby reducing the heat sensation of the inner case (121a2) that comes into contact with the user.

[0121]

[0122] Referring to Fig. 17, the heat dissipation member (125) may be referred to as a heat dissipation bracket (125), an insert bracket (125), or an insert frame (125). The heat dissipation member (125) may include a first heat dissipation member (125a) and a second heat dissipation member (125b). The first heat dissipation member (125a) may be referred to as an insert top bracket (125a), and the second heat dissipation member (125b) may be referred to as an insert bottom bracket (125b).

[0123] The heat dissipation member (1255) may include a center bracket (1251), a side bracket (1252), and an arm (1253). The center bracket (1251) may have a long, ring-shaped shape. The center bracket (1251) may form a closed loop. The side bracket (1252) may be formed at one or both ends of the center bracket (1251). The side bracket (1252) may be connected to the center frame (1252) in an overall rectangular or U-shaped shape. The arm (1253) may extend from the side bracket (1252) in the longitudinal direction of the center bracket (1251). The arm (1253) may be singular or plural. The heat dissipation member (125) can be aligned with the heat dissipation hole (121v) and joined or fixed to the outer cover (121a1) of the temple (121a).

[0124]

[0125] Referring to FIGS. 18 and 19, the outer cover (121a1) of the temple (121a) can be formed by insert-molding the heat dissipation member (125). The heat dissipation hole (121v) can be formed surrounding the center bracket (1251), side bracket (1252), and / or arm (1253) of the heat dissipation member (125). The heat dissipation hole (121v) can correspond to the outline of the heat dissipation member (125).

[0126] The outer cover (121a1) may include a female fixing member (1211, 1212) and a center rib (1213). The female fixing member (1211, 1212) may be hooked onto the female fixing member (1253) of the heat dissipation member (125). There may be a plurality of female fixing members (1211, 1212). Part of the center rib (1213) may cover one side of the center bracket (1251), and part of the center rib may be inserted into the central opening of the center bracket (1251).

[0127] The center rib (1213) may include a first rib (1213a) and a second rib (1213b). The first rib (1213a) may cover or hold one side of the center bracket (1251). The second rib (1213b) may form a step from the first rib (1213a) and may be inserted into the central opening of the center bracket (1251).

[0128] Accordingly, after the heat dissipation member (125) is inserted into the outer cover (121a1) of the temple (121a), it can be prevented from being detached or separated from the outer cover (121a1). The first rib (1213a) can prevent the heat dissipation member (125) from being detached or separated from the heat dissipation hole (121v), and the second rib (1213b) can prevent the heat dissipation member (125) from being pushed when the outer cover (121a1) is insert-molded together with the heat dissipation member (125).

[0129]

[0130] Referring to Fig. 20, the outer cover (121a1) may have a chamfered portion (121a1c) formed on the inner surface of the heat dissipation hole (121v). The chamfered portion (121a1c) may be formed at the bottom of the heat dissipation hole (121v). The chamfered portion (121a1c) may form an obtuse angle with respect to the side wall of the heat dissipation hole (121v). Due to the chamfered portion (121a1c), the heat dissipation hole (121v) may have a width or length that gradually narrows.

[0131] The heat dissipation member (125) can be placed on the chamfered portion (121a1c). The heat dissipation member (125) can be formed into an outer cover (121a1) by insert injection molding together with the chamfered portion (121a1c). The chamfered portion (121a1c) can prevent the heat dissipation member (125) from being detached or separated from the inside of the temple (121a).

[0132]

[0133] Referring to FIGS. 21 and 22, an air filter (121c) may be coupled to a heat dissipation hole (121v) to cover the heat dissipation hole (121v). The air filter (121c) may be referred to as a heat dissipation cap (121c) or a hole cover (121c). For example, the air filter (121c) may include metal. Airflow holes for airflow may be formed in the air filter (121c).

[0134] The temple (121a) may include an inner case (121a2) and an outer case (121a1). The description of the temple (121a) of the first side frame (120a, see FIG. 6) may also be applied to the temple (121b, see FIG. 7) of the second side frame (120b, see FIG. 7).

[0135] The outer case (121a1) may form the outer surface, upper surface, and / or lower surface of the temple (121a). The inner case (121a2) may be coupled to the outer case (121a1) while covering the internal accommodation space provided by the outer case (121a1). The inner case (121a2) may be coupled or fixed to the upper surface and / or lower surface of the outer case (121a1). The inner case (121a2) may come into contact with the user's skin.

[0136] The heat dissipation hole (121v) may be formed on the upper surface and / or the lower surface of the outer case (121a1). The upper and lower sides of the temple (121a) may be connected to the outside by the heat dissipation hole (121v).

[0137] The heat dissipation member (125) can be coupled to the heat dissipation hole (121v). The heat dissipation member (125) can include metal. For example, the heat dissipation member (125) can be coupled to the outer case (121a1) when the outer case (121a1) is insert-molded. The heat dissipation member (125) can narrow the area of ​​the heat dissipation hole (121v). The heat dissipation member (125) can be provided with a flow slot or a flow hole.

[0138] The touch pad (151, see also FIG. 6) may face the inner surface of the outer case (121a1) or be supported by the inner surface of the outer case (121a1). For example, the touch panel (151a, see also FIG. 6) may be supported by the inner surface of the outer case (121a1) or may come into contact with the inner surface of the outer case (121a1).

[0139] The heat dissipation sheet (126) may face the outer case (121a1) with respect to the touch panel (151a). The heat dissipation sheet (126) may be in contact with the touch panel (151a). For example, the heat dissipation sheet (126) may be a graphite sheet.

[0140] The vapor chamber (127a) may be in contact with the heat dissipation sheet (126). The vapor chamber (127a) may cool the heat source by vaporization and / or condensation of a fluid. The insulating layer (127b) may face the heat dissipation sheet (126) with respect to the vapor chamber (127a). The insulating layer (127b) may be in contact with the vapor chamber (127a).

[0141] A high-performance integrated component (AP) may be mounted on the main PCB (142). For example, the integrated component (AP) may be a microprocessor or an application processor. The integrated component (AP) may be spaced apart from a heat dissipation sheet (126). Air may flow into the spaced apart space.

[0142] Electronic components (EC) may be mounted on the main PCB (142). The electronic components (EC) may be positioned adjacent to or adjacent to the integrated component (AP). The electronic components (EC) may face the integrated component (AP) with respect to the main PCB (142).

[0143] An insulating sheet (128) may be bonded to the inner case (121a2) between the inner case (121a2) and the main PCB (142). The insulating sheet (128) may be positioned between the inner case (121a2) and the electronic components (EC). For example, the insulating sheet (128) may be adhered to the inner surface of the inner case (121a2).

[0144] Thermal grease (129) may be applied between the electronic components (EC) and the insulating sheet (128). The thermal grease (129) may extend from the electronic components (EC) and the insulating sheet (128) and be connected to a heat dissipation member (125). The thermal grease (129) may transfer heat generated from the main PCB (142) or the electronic components (EC) to the heat dissipation member (125). The thermal grease (129) may be applied between the integrated components (AP) and the heat dissipation sheet (126). The thermal grease (129) may extend from the integrated components (AP) and the heat dissipation sheet (126) and be connected to the heat dissipation member (125). The thermal grease (129) may be connected to the electronic components (EC). Thermal grease (129) can transfer heat generated from integrated components (AP) or electronic components (EC) to a heat dissipation member (125).

[0145] Heat generated inside the temple (121a) can be transferred to the heat dissipation member (125) and discharged to the outside of the temple (121a) through the air filter (121c). Heat generated inside the temple (121a) can be transferred to the outside of the temple (121a) and / or cooled by heat transfer. Accordingly, the heat sensation of the inner case (121a2) of the temple (121a) that the user comes into contact with can be reduced, and the performance of the electronic device can be prevented from deteriorating.

[0146]

[0147] Referring to FIGS. 1 to 22, an electronic device includes: a front frame to which a light-transmitting display unit is coupled; and a temple that is elongated and hingedly connected to the front frame, wherein the front frame includes: a PCB built into the front frame and extending from the front frame toward the temple; and a display panel built into the front frame at one side of the display unit and electrically connected to the PCB, wherein the temple includes: a plurality of heat dissipation holes formed on an upper side of the temple and a lower side of the temple and extending in a direction intersecting a direction from an upper side of the temple to a lower side; and a heat dissipation member coupled to at least one of the plurality of heat dissipation holes, wherein the heat dissipation member can be fixed to the inside of at least one of the plurality of heat dissipation holes.

[0148] The heat dissipation member includes: a center bracket forming a slot; and a side bracket formed at one end of the center bracket in the longitudinal direction of the slot, and at least one of the center bracket and the side bracket can be fixed to the inner surface of the temple.

[0149] The heat dissipation member comprises: a center bracket forming a slot; and an arm extending from the center bracket in the longitudinal direction of the slot, wherein at least one of the center bracket and the arm can be fixed to the inner surface of the temple.

[0150] The heat dissipation member includes: a center bracket forming a slot; a side bracket formed at one end of the center bracket in the longitudinal direction of the slot; and an arm extending from the side bracket in the longitudinal direction of the slot, wherein at least one of the center bracket, the side bracket, or the arm can be fixed to the inner surface of the temple.

[0151] The device may further include a main board accommodated on the inside of the temple and electrically connected to the PCB; an integrated device positioned between the main board and the inner surface of the temple and mounted on the main board; a touch pad positioned between the integrated device and the inner surface of the temple; and a heat dissipation sheet positioned between the touch pad and the integrated device.

[0152] The above temple includes: a plurality of heat dissipation members, each of which is coupled to a respective one of the plurality of heat dissipation holes, and airflow flowing from the outside of the temple into the inside of the temple through the heat dissipation holes and heat dissipation members formed on the lower side of the temple can flow out from the inside of the temple to the outside of the temple through the heat dissipation holes and heat dissipation members formed on the upper side of the temple.

[0153] The above temple may include: an air filter covering at least one of the plurality of heat dissipation holes.

[0154] The above air filter can be supported by the heat dissipation member.

[0155] The device may further include a main board accommodated inside the temple and electrically connected to the PCB; an integrated device positioned between the main board and the inner surface of the temple and mounted on the main board; a touch pad positioned between the integrated device and the inner surface of the temple; a heat dissipation sheet positioned between the integrated device and the touch pad; and a vapor chamber in contact with the heat dissipation sheet.

[0156] An insulating layer covering the vapor chamber; and further comprising thermal grease connecting the integrated device and the heat dissipation member, wherein the thermal grease can be in contact with the insulating layer.

[0157] Information provided by the above display panel can be displayed on the light transmission path of the above display unit.

[0158]

[0159] Any or all of the embodiments of the present disclosure described above are not mutually exclusive or distinct. Any or all of the embodiments of the present disclosure described above may have their respective components or functions combined or used together.

[0160] For example, it means that a configuration A described in a particular embodiment and / or drawing can be combined with a configuration B described in another embodiment and / or drawing. That is, even if a combination between configurations is not directly described, it means that a combination is possible, except in cases where a combination is described as impossible.

[0161] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are intended to be included within the scope of the present invention.

Claims

1. A front frame to which a light-transmitting display portion is combined; and, comprising a temple that is elongated and hinged to the front frame; The above front frame: A PCB built into the front frame and extending from the front frame toward the temple; and A display panel is included on one side of the display section and is built into the front frame and electrically connected to the PCB. The above temple is: A plurality of heat dissipation holes formed on the upper side of the temple and the lower side of the temple and extending in a direction intersecting the direction from the upper side to the lower side of the temple; and, Including a heat dissipation member coupled to at least one of the plurality of heat dissipation holes, The above heat dissipation member is, An electronic device secured to the inside of at least one of the plurality of heat dissipation holes.

2. In paragraph 1, The above heat dissipation member: a center bracket forming a slot; and, Including a side bracket formed at one end of the center bracket in the longitudinal direction of the above slot, An electronic device wherein at least one of the center bracket or the side bracket is secured to the inner surface of the temple.

3. In paragraph 1, The above heat dissipation member: a center bracket forming a slot; and, Including an arm extending from the center bracket in the longitudinal direction of the slot; An electronic device wherein at least one of the center bracket or the arm is secured to the inner surface of the temple.

4. In paragraph 1, The above heat dissipation member: Center bracket forming a slot; A side bracket formed at one end of the center bracket in the longitudinal direction of the above slot; comprising an arm extending from the side bracket in the longitudinal direction of the slot; An electronic device wherein at least one of the center bracket or the side bracket or the arm is secured to the inner surface of the temple.

5. In paragraph 4, A main board accommodated inside the temple and electrically connected to the PCB; An integrated device positioned between the main board and the inner surface of the temple, and mounted on the main board; A touch pad positioned between the integrated element and the inner surface of the temple; and, An electronic device further comprising a heat dissipation sheet positioned between the touch pad and the integrated device.

6. In paragraph 5, The above temple is: Each of the plurality of heat dissipation members comprises a plurality of heat dissipation members coupled to each of the plurality of heat dissipation holes, The airflow flowing from the outside of the temple into the inside of the temple through the heat dissipation hole and heat dissipation member formed on the lower side of the temple is An electronic device that discharges heat from the inside of the temple to the outside of the temple through a heat dissipation hole and heat dissipation member formed on the upper side of the temple.

7. In paragraph 6, The above temple is: An electronic device comprising an air filter covering at least one of the plurality of heat dissipation holes.

8. In paragraph 7, The above air filter, An electronic device supported by the above heat dissipation member.

9. In paragraph 4, A main board accommodated inside the temple and electrically connected to the PCB; An integrated device positioned between the main board and the inner surface of the temple, and mounted on the main board; A touch pad positioned between the integrated element and the inner surface of the temple; A heat dissipation sheet positioned between the above integrated device and the above touch pad; and, An electronic device further comprising a vapor chamber in contact with the heat dissipation sheet.

10. In paragraph 9, An insulating layer covering the above vapor chamber; and, Further comprising thermal grease connecting the above integrated device and the above heat dissipation member, The above thermal grease, An electronic device in contact with the above insulating layer.

11. In paragraph 1, An electronic device in which information provided by the display panel is displayed on the light transmission path of the display unit.

Images