Optical communication assembly, socket, and optical communication device

Abstract

The present application relates to the technical field of optical communications. Disclosed is an optical communication assembly comprising an optoelectronic device and a socket. The optoelectronic device comprises a printed circuit board; a first end of the printed circuit board is provided with an electrically conductive contact assembly; the electrically conductive contact assembly comprises signal sending conductive contacts and signal receiving conductive contacts. The printed circuit board is also provided with a first isolating element extending in the length direction of the printed circuit board; the signal sending conductive contacts and the signal receiving conductive contacts are located on the two sides of the first isolating element in the width direction of the printed circuit board. A slot is arranged on the socket, and an isolating rib is disposed inside the slot. When the electrically conductive contact assembly is inserted into the slot, the isolating rib engages with the first isolating element, forming a first isolating section which isolates the signal sending conductive contacts from the signal receiving conductive contacts. The present application reduces crosstalk between signal receiving channels and signal sending channels in optoelectronic devices, thereby improving optoelectronic device performance. The present application also discloses a socket and an optical communication device.

Description

Optical communication components, sockets and optical communication equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 23, 2024, with application number 202410094712.8 and application name “Optical communication components, sockets and optical communication equipment”. The entire contents of the above application are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optical communication technology, and in particular to an optical communication component, a socket, and an optical communication device. Background Art

[0003] In optical communications, optoelectronic devices (also known as optical modules) are tools for converting optical and electrical signals and are key components in optical communications equipment. Optoelectronic devices plug into the socket of communications equipment to establish an electrical connection. They contain both a signal receiving channel and a signal transmitting channel. The signal receiving channel converts external optical signals into electrical signals and transmits them to the communications equipment through the socket. The signal transmitting channel converts electrical signals from the socket into optical signals and transmits them to the outside.

[0004] In the prior art, the isolation between the signal receiving channel and the signal transmitting channel is not effectively controlled, which may cause signal crosstalk between the signal receiving channel and the signal transmitting channel, seriously affecting the overall performance of the optoelectronic device.

[0005] Summary of the Invention

[0006] The present application provides an optical communication component, a socket and an optical communication device, which can reduce the crosstalk between the signal receiving channel and the signal transmitting channel in the optoelectronic device, thereby improving the performance of the optoelectronic device.

[0007] In a first aspect, the present application provides an optical communication assembly, comprising an optoelectronic device and a socket, wherein one end of the optoelectronic device can input / output an optical signal, and the other end can output / input an electrical signal corresponding to the optical signal.

[0008] The optoelectronic device includes a printed circuit board (PCB) having two ends along its length: a first end and a second end. A conductive contact assembly is provided at the first end of the PCB for electrically connecting to terminals within a socket into which the optoelectronic device is inserted. The conductive contact assembly includes a signal-transmitting conductive contact and a signal-receiving conductive contact. The PCB also has a first isolation strip extending along its length. The signal-transmitting conductive contact and the signal-receiving conductive contact are located on either side of the first isolation strip along its width.

[0009] The socket is provided with a socket capable of accepting the conductive contact assembly, and an isolation rib is provided in the socket. When the conductive contact assembly is inserted into the socket, the isolation rib can cooperate with the first isolation strip to form a first isolation portion that isolates the signal-transmitting conductive contact from the signal-receiving conductive contact.

[0010] By providing a first isolation zone on the printed circuit board and isolation ribs within the socket, this invention allows the first isolation zone to overlap with the isolation ribs within the socket to form a first isolation portion when the conductive contact assembly is inserted into the socket. The first isolation portion can separate the signal transmitting conductive contact and the signal receiving conductive contact into different isolation chambers, thereby achieving physical isolation between the signal transmitting conductive contact and the signal receiving conductive contact, reducing crosstalk between the transmitted and received signals, and improving the performance of the optoelectronic device.

[0011] This application does not limit the specific structure of the first isolation zone. Any structure that can cooperate with the isolation ribs in the socket to isolate the signal sending conductive contacts from the signal receiving conductive contacts falls within the protection scope of this application.

[0012] In some implementations of the present application, the first isolation zone is a dividing groove, and a first isolation rib is provided within the socket, the width of which matches the first isolation rib. Furthermore, when the conductive contact assembly is inserted into the socket, the first isolation rib inserts into the dividing groove, forming a first isolation portion, thereby separating the signal-transmitting conductive contact and the signal-receiving conductive contact into different isolation spaces. A conductive layer connected to the ground is provided on the sidewalls of the dividing groove. The first isolation rib is made of a conductive material and is connected to the ground. When the first isolation rib is inserted into the dividing groove, the first isolation rib contacts the conductive layer.

[0013] In some implementations of the present application, a first isolation zone is located on a printed circuit board, is made of a conductive material, and is connected to the ground. Furthermore, a pair of second isolation ribs are provided in the socket corresponding to the position of the first isolation zone. The pair of second isolation ribs are made of a conductive material and are connected to the ground. A first opening corresponding to the thickness of the first isolation zone is provided between the pair of second isolation ribs. When the conductive contact assembly is inserted into the socket, the first isolation zone is inserted into the first opening, and a pair of second isolation ribs overlap the first isolation zone from both sides of the plane where the printed circuit board is located to form a first isolation portion. The first isolation portion can separate the signal-transmitting conductive contact and the signal-receiving conductive contact into different isolation spaces.

[0014] The present application can enhance the signal isolation effect between the signal sending conductive contact and the signal receiving conductive contact by grounding the first isolation zone and the isolation ribs in the socket.

[0015] In some implementations of the present application, the optoelectronic device further includes a structural member and an optical device, wherein a cavity is provided inside the structural member, a printed circuit board is provided in the cavity, and the optical device is provided at the second end of the printed circuit board.

[0016] In some implementations of the present application, a second isolation zone extending along the width direction of the printed circuit board is provided on the printed circuit board, and the conductive contact assembly and the optical device are located on both sides of the second isolation zone along the length direction of the printed circuit board. The second isolation zone is used to cooperate with the isolation ribs in the structural member to form a second isolation portion that isolates the conductive contact assembly.

[0017] The present application provides a second isolation tape on the printed circuit board, so that the second isolation tape can overlap with the isolation ribs in the structural member to form a second isolation portion. The second isolation portion can isolate the area where the conductive contact assembly is located from other areas, so that the conductive contact assembly and other components on the printed circuit board (such as optical devices) are separated in different isolation chambers, thereby achieving physical isolation between the conductive contact assembly and other components, reducing crosstalk between the conductive contact assembly and other components, and improving the performance of the optoelectronic device.

[0018] In some implementations of the present application, a second isolation zone is located on the printed circuit board, is made of a conductive material, and is connected to the ground. Furthermore, a pair of third isolation ribs are provided within the cavity of the structural member, corresponding to the position of the second isolation zone. The pair of third isolation ribs are also made of a conductive material and are connected to the ground. A second opening corresponding to the thickness of the second isolation zone is defined between the pair of third isolation ribs. The printed circuit board is inserted into the second opening, and the pair of third isolation ribs overlap the second isolation zone on either side of the plane where the printed circuit board resides, forming a second isolation portion. The second isolation portion can separate the conductive contact assembly and other components on the printed circuit board into different isolation spaces.

[0019] The present application can enhance the signal isolation effect between the conductive contact assembly and the optical device by grounding the second isolation belt and the isolation ribs in the structural member.

[0020] In some implementations of the present application, conductive adhesive is provided between a pair of third isolation ribs and both sides of the plane where the printed circuit board is located. By providing the conductive adhesive, the present application can enhance the sealing performance, thereby ensuring tight isolation.

[0021] In some implementations of the present application, the optoelectronic device provided by the present application further includes a flexible circuit board, a signal transmitting line, and a signal receiving line. The flexible circuit board is provided between the optical device and the printed circuit board, and the flexible circuit board is used to connect the optical device and the printed circuit board. The signal transmitting line extends along the length direction of the printed circuit board, one end of the signal transmitting line is electrically connected to the signal transmitting conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence, and the signal transmitting line is used to transmit the signal emitted by the signal transmitting conductive contact to the optical device. The signal receiving line extends along the length direction of the printed circuit board, one end of the signal receiving line is electrically connected to the signal receiving conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence, and the signal receiving line is used to transmit the signal emitted by the optical device to the signal receiving conductive contact.

[0022] When the socket sends a signal, the electrical signal is transmitted through the signal-transmitting conductive contacts and the signal-transmitting wire to the optical device. The optical device then converts the electrical signal into an optical signal and transmits it outward. When an optical signal is received from the outside, the optical device converts the optical signal into an electrical signal. This electrical signal is then transmitted through the signal-receiving wire and the signal-receiving conductive contacts to the socket, allowing it to receive the signal.

[0023] In some implementations of the present application, a second conductive area is provided on the flexible circuit board, the second conductive area is connected to the ground, a first protrusion corresponding to the position of the second conductive area is provided in the cavity of the structural member, the first protrusion is made of a conductive material and is connected to the ground, and the first protrusion is in contact with the second conductive area.

[0024] The inventors discovered that the impedance discontinuity at the connection between the optical device and the flexible circuit board makes it prone to outward electromagnetic radiation. Furthermore, due to the limited space within the optoelectronic device, the connection between the optical device and the flexible circuit board is difficult to fully shield, which can result in the coupling of radiated signals. This application enhances the radiation resistance of the optical device and the flexible circuit board by providing a second conductive region connected to the ground on the flexible circuit board and overlapping the second conductive region with the grounded first protrusion, while reducing outward radiation and improving isolation.

[0025] In some implementations of the present application, an extension plate is provided on the flexible circuit board, a second conductive area is provided on the extension plate, a second protrusion is provided in the cavity of the structural member and is opposite to the first protrusion, a third opening is provided between the first protrusion and the second protrusion, the extension plate is provided in the third opening, the first protrusion and the second protrusion contact the extension plate from both sides of the plane where the extension plate is located to clamp the extension plate in the third opening, so that the second conductive area can be in close contact with the first protrusion, thereby enhancing the reliability of the device.

[0026] In some implementations of the present application, both the signal transmission and signal reception lines are routed within the inner layer of the flexible circuit board. This design can enhance the isolation between the signal transmission and signal reception lines, reduce interference between the signal transmission and signal reception lines, and prevent the signal transmission and signal reception lines from interfering with other channels or being interfered with by other channels.

[0027] In some implementations of the present application, the signal transmitting line and the signal receiving line are routed on the surface of the flexible printed circuit board, and a ground wire is provided on each side of the signal transmitting line and / or the signal receiving line along the width direction of the printed circuit board, and the ground wire extends along the length direction of the printed circuit board. Since the radiation signal generated by the signal transmitting line is higher than that of the signal receiving line, the signal transmitting line is likely to interfere with the signal receiving line. By providing a ground wire on each side of the signal transmitting line, the present application can constrain the electromagnetic radiation of the signal transmitting line to the signal receiving line. By providing a ground wire on each side of the signal receiving line, the radiation resistance of the signal receiving line can be enhanced.

[0028] In some implementations of the present application, a printed circuit board includes multiple inner layers. When a signal transmission line and a signal reception line are routed on the same printed circuit board, the signal transmission line and the signal reception line are routed on different inner layers of the same printed circuit board. When there are two printed circuit boards, the signal transmission line and the signal reception line are routed on the inner layers of two printed circuit boards, respectively. This design can enhance the isolation between the signal transmission line and the signal reception line, thereby reducing interference between the signal transmission line and the signal reception line.

[0029] In a second aspect, the present application provides a socket having a receptacle with an isolation rib disposed therein. The receptacle is capable of inserting an optoelectronic device such as that in the optical communication assembly of the first aspect. When the optoelectronic device is inserted into the receptacle, the isolation rib cooperates with a first isolation strip on the optoelectronic device to form a first isolation portion that isolates a signal transmitting conductive contact from a signal receiving conductive contact.

[0030] In a third aspect, the present application provides an optical communication device, comprising the optical communication component according to the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1 shows a schematic structural diagram of a wireless base station system;

[0032] FIG2 shows a block diagram of the structure of a wireless base station system;

[0033] FIG3 shows a schematic diagram of an optical communication component in the prior art;

[0034] FIG4 shows an exploded schematic diagram of FIG3 ;

[0035] Figure 5 shows a block diagram of the digital optical module SFP+;

[0036] FIG6 shows a block diagram of a single-channel optoelectronic device;

[0037] FIG7 shows a block diagram of a multi-channel optoelectronic device;

[0038] FIG8 shows a schematic structural diagram of a single-channel optoelectronic device provided with a barrier;

[0039] FIG9 shows a schematic structural diagram of a multi-channel optoelectronic device provided with a barrier;

[0040] FIG10 shows a schematic structural diagram of a multi-channel optoelectronic device provided with an absorbing material;

[0041] FIG11 shows an exploded view of an optical communication component in a separated state in some embodiments of the present application;

[0042] FIG12 shows an exploded view of an optical communication component in a plugged-in state in some embodiments of the present application;

[0043] FIG13 shows a first schematic diagram of a printed circuit board in some embodiments of the present application;

[0044] FIG14 shows a second exploded view of an optical communication component in a separated state in some other embodiments of the present application;

[0045] FIG15 shows a schematic diagram of a socket in some other embodiments of the present application;

[0046] FIG16 shows a second exploded view of an optical communication component in a plugged-in state in some other embodiments of the present application;

[0047] FIG17 shows a second schematic diagram of a printed circuit board in some other embodiments of the present application;

[0048] FIG18 shows a side view of the printed circuit board and the socket of FIG16;

[0049] FIG19 shows a cross-sectional view taken along line AA in FIG18 ;

[0050] FIG20 shows a third exploded view of an optical communication component in a separated state in some other embodiments of the present application;

[0051] FIG21 shows a third schematic diagram of a printed circuit board in some other embodiments of the present application;

[0052] FIG22 shows a cross-sectional schematic diagram 1 of an optoelectronic device in some other embodiments of the present application;

[0053] FIG23 shows a second cross-sectional schematic diagram of an optoelectronic device in some other embodiments of the present application;

[0054] FIG24 shows a partial enlarged view of portion B in FIG23 ;

[0055] FIG25 is a schematic diagram showing a partial structure of an optoelectronic device in some other embodiments of the present application;

[0056] FIG26 shows a fourth schematic diagram of a printed circuit board in some other embodiments of the present application;

[0057] FIG27 shows a first schematic diagram of a flexible circuit board in some embodiments of the present application;

[0058] FIG28 shows a cross-sectional schematic diagram of a flexible circuit board in some embodiments of the present application;

[0059] FIG29 shows a second schematic diagram of a flexible circuit board in some other embodiments of the present application;

[0060] FIG30 shows a cross-sectional schematic diagram of a printed circuit board in some other embodiments of the present application;

[0061] FIG31 shows a comparison diagram of the isolation effect of the present application and the prior art.

[0062] Description of reference numerals:

[0063] 1-Structural member; 11-Cavity; 12-Third isolation rib; 121-Third upper isolation rib; 122-Third lower isolation rib; 13-Second opening; 14-Conductive adhesive; 15-First protrusion; 16-Second protrusion; 17-Third opening;

[0064] 2-printed circuit board; 21-first isolation zone; 211-dividing groove; 22-second isolation zone;

[0065] 3-conductive contact assembly; 31-signal sending conductive contact; 32-signal receiving conductive contact;

[0066] 4-optical device; 41-pin foot;

[0067] 5-flexible circuit board; 51-second conductive area; 52-extension plate; 53-through hole;

[0068] 6-Signal sending line;

[0069] 7-Signal receiving line;

[0070] 8-Ground wire;

[0071] 9-socket; 91-socket; 92-first isolation rib; 93-second isolation rib; 931-second upper isolation rib; 932-second lower isolation rib; 94-first opening;

[0072] 10- barrier;

[0073] 20-wave absorbing material;

[0074] 100- optoelectronic devices;

[0075] 200-fiber optic. DETAILED DESCRIPTION

[0076] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0077] The present invention provides an optical communication assembly, including an optoelectronic device and a socket. In the field of optical communications, optoelectronic devices (also known as optical modules) are tools for converting optical and electrical signals and are key components of optical communication equipment. Optoelectronic devices can be inserted into a socket on a communication device, electrically connected to the device, and used to transmit and receive signals.

[0078] In this application, the optical communication components can be applied to wireless transmission scenarios, such as routers, switches, and wireless base stations, etc., which are not limited in this application. The following is an example of applying the optical communication components to a wireless base station system.

[0079] Figure 1 shows a schematic diagram of the structure of the wireless base station system. Referring to Figure 1, the wireless base station system includes pRRU (Pico Remote Radio Unit), RHUB (Radio HUB) and BBU (baseband unit). Among them, pRRU is used to implement RF signal processing. pRRU can modulate the baseband signal to the transmission frequency band, and after filtering and amplification, transmit it through the antenna. pRRU can also receive RF signals from the antenna, and after filtering and amplification, down-convert the RF signals and send them to RHUB for processing. RHUB is used in conjunction with pRRU and BBU to support indoor coverage, and to receive downlink data sent by BBU and forward it to each pRRU, and forward uplink data of multiple pRRUs to BBU. BBU is used to provide communication with transmission equipment, RF modules, USB a The external interface for connecting equipment, external clock sources, LMT or MAE realizes signal transmission, automatic base station software upgrade, clock reception, and BBU maintenance on LMT or MAE. It can also centrally manage the entire base station system and complete the functions of uplink and downlink data processing, signaling processing, resource management and operation and maintenance.

[0080] Figure 2 shows a block diagram of the wireless base station system. Referring to Figure 2 , both the pRRU and RHUB are equipped with sockets into which optoelectronic devices 100 (as shown in Figure 3 ) can be inserted, electrically connecting the optoelectronic devices 100 to the pRRU or RHUB. Optoelectronic devices 100 inserted into the pRRU and RHUB sockets can transmit signals via optical fiber.

[0081] Further, referring to Figure 4, the optoelectronic device 100 includes a structural member 1 and a printed circuit board 2 (PCB board) provided within the structural member. The printed circuit board 2 is provided with a conductive contact assembly 3, an optical device 4, and a functional circuit (not shown). The conductive contact assembly 3 and the optical device 4 are electrically connected through the functional circuit. Exemplarily, the conductive contact assembly 3 can be a gold finger assembly. During the use of the optoelectronic device 100, the optical fiber 200 is inserted into the optical device 4, and the conductive contact assembly 3 is inserted into the socket 91 of the socket 9 of the pRRU or RHUB. The conductive contact assembly 3 can contact the terminal in the socket 9 to achieve electrical connection. Specifically, the conductive contact assembly 3 includes a signal-transmitting conductive contact 31 and a signal-receiving conductive contact 32. Among them, the signal-transmitting conductive contact 31 can be a signal-transmitting gold finger, and the signal-receiving conductive contact 32 can be a signal-receiving gold finger. The signal-transmitting conductive contact 31 and the signal-receiving conductive contact 32 are respectively electrically connected to the optical device 4 through the functional circuit.

[0082] 2 and 4 , when the optical communication device (pRRU or RHUB) into which the optoelectronic device 100 is inserted transmits a signal, the electrical signal from the optical communication device is sequentially transmitted through the socket 9, the signal-transmitting conductive contact 31, and the functional circuit to the optical device 4. The optical device 4 then converts the electrical signal from the optical communication device into an optical signal and transmits the converted optical signal outward through the optical fiber 200. When the optical communication device into which the optoelectronic device 100 is inserted receives a signal, the optical signal is transmitted through the optical fiber 200 to the optical device 4. The optical device 4 converts the optical signal into an electrical signal. The electrical signal is then sequentially transmitted through the functional circuit, the signal-receiving conductive contact 32, and the socket 9 to the optical communication device.

[0083] In practical applications, whether it is a traditional optoelectronic device, such as a digital optical module SFP+ (as shown in Figure 5) or QSFP, or an analog optoelectronic device, such as a ROF optical module, if the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 are not effectively isolated, signal crosstalk will occur between the signal transmitting conductive contact 31 and the signal receiving conductive contact 32, affecting the overall performance of the optoelectronic device. In addition, as the amount of transmitted data continues to grow, optoelectronic devices have evolved from the early single-channel (as shown in Figure 6) to multi-channel (as shown in Figure 7). Crosstalk between different channels will have a greater impact on the optoelectronic device.

[0084] To solve the above technical problems, in some embodiments, referring to Figures 8 and 9, a barrier 10 is provided on the printed circuit board. The barrier 10 extends along the extension direction of the signal channel, and each signal channel is separated into different areas by the barrier 10. This technical solution can reduce the crosstalk between the signal channels to a certain extent, but due to structural limitations, it can only isolate part of the area, and cannot isolate the signal sending conductive contact 31 and the signal receiving conductive contact 32 inserted into the socket 9 in Figure 4. Therefore, the isolation is low, and the performance of the optoelectronic device will still be affected. In other embodiments, referring to Figure 10, signal radiation can also be reduced and crosstalk can be reduced by covering part of the circuit with absorbing material 20. However, the absorbing material 20 will affect the transmission performance of the signal and bring certain negative effects.

[0085] 11 and 14 , the present application provides an optical communication assembly, which includes an optoelectronic device 100 and a socket 9. One end of the optoelectronic device 100 can input / output optical signals, and the other end can output / input electrical signals corresponding to the optical signals.

[0086] Furthermore, the optoelectronic device 100 includes a printed circuit board 2 having a first end and a second end along its length (the X-direction shown in Figures 11 and 14 ). A conductive contact assembly 3 is provided at the first end of the printed circuit board 2. The conductive contact assembly 3 is configured to electrically connect to terminals within a socket 9 into which the optoelectronic device 100 is inserted. The conductive contact assembly 3 includes a signal-transmitting conductive contact 31 and a signal-receiving conductive contact 32. The printed circuit board 2 is also provided with a first isolation strip 21 extending along the length of the printed circuit board 2. The signal-transmitting conductive contact 31 and the signal-receiving conductive contact 32 are located on either side of the first isolation strip 21 along the width of the printed circuit board 2 (the Y-direction shown in Figures 11 and 14 ).

[0087] The socket 9 is provided with a socket 91 that allows the conductive contact assembly 3 to be inserted. A separation rib is provided within the socket 91. The separation rib may be a first separation rib 92 shown in FIG. 11 or a pair of second separation ribs 93 shown in FIG. 14 . When the conductive contact assembly 3 is inserted into the socket 91 (as shown in FIG. 12 and FIG. 16 ), the separation rib cooperates with the first separation strip 21 to form a first separation portion that separates the signal-transmitting conductive contact 31 from the signal-receiving conductive contact 32.

[0088] The present application provides a first isolation zone 21 on the printed circuit board 2 and isolation ribs in the socket 9. When the conductive contact assembly 3 is inserted into the socket 9, the first isolation zone 21 on the printed circuit board 2 can overlap with the isolation ribs in the socket 9 to form a first isolation portion. The first isolation portion can separate the signal sending conductive contact 31 and the signal receiving conductive contact 32 into different isolation chambers, thereby achieving physical isolation between the signal sending conductive contact 31 and the signal receiving conductive contact 32, and reducing crosstalk between the transmitted signal and the received signal.

[0089] In addition, the present application forms a first isolation portion by overlapping the first isolation strip 21 on the printed circuit board 2 with the isolation ribs in the socket 9, which can isolate the signal sending conductive contact 31 and the signal receiving conductive contact 32 inserted into the socket 9, thereby enhancing the isolation and avoiding the problem of low isolation in the technical solutions shown in Figures 8 and 9, as well as the problem of affecting the signal transmission performance in the technical solution shown in Figure 10.

[0090] The present application does not limit the specific structure of the first isolation zone 21. Any structure that can cooperate with the isolation ribs in the socket 9 to isolate the signal sending conductive contact 31 and the signal receiving conductive contact 32 falls within the protection scope of the present application.

[0091] In some implementations of the present application with reference to Figures 11 to 13, as shown in Figures 11 and 13, the first isolation zone 21 is a dividing groove 211, and a first isolation rib 92 extending along the thickness direction of the socket 91 (such as the Z direction as shown in Figure 11) is provided in the socket 91 of the socket 9. The two ends of the first isolation rib 92 along the Z direction are respectively connected to the top and bottom surfaces of the socket 91, and the width of the dividing groove 211 matches the first isolation rib 92.

[0092] When the conductive contact assembly 3 is inserted into the socket 9, as shown in FIG12 , the first isolation rib 92 is inserted into the dividing groove 211 to form a first isolation portion to separate the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 into different isolation spaces.

[0093] In some implementations of the present application, a conductive layer connected to the ground is provided on the sidewalls of the dividing groove 211. The first isolation rib 92 is made of a conductive material and is connected to the ground. When the first isolation rib 92 is inserted into the dividing groove 211, the first isolation rib 92 contacts the conductive layer. Exemplarily, both the first isolation rib 92 and the conductive layer are made of a metal material, and the conductive layer covers the entire sidewalls of the dividing groove 211.

[0094] In some other implementations of the present application, as shown in Figures 14 to 19 , a first isolation strip 21 is located on the printed circuit board 2 and is made of a conductive material and is connected to the ground. Furthermore, a pair of second isolation ribs 93 are provided within the socket 91 of the receptacle 9 , corresponding to the positions of the first isolation strip 21.

[0095] Specifically, as shown in the schematic detailed view of the socket in Figure 15 , a pair of second isolation ribs 93 includes a second upper isolation rib 931 and a second lower isolation rib 932. Both second upper isolation rib 931 and second lower isolation rib 932 are made of conductive material and are grounded. Second upper isolation rib 931 is connected to the top surface of socket 91, while second lower isolation rib 932 is connected to the bottom surface of socket 91. A first opening 94 corresponding to the thickness of first isolation zone 21 is defined between second upper isolation rib 931 and second lower isolation rib 932.

[0096] When the conductive contact assembly 3 is inserted into the socket 9, as shown in Figures 16, 18, and 19, the first isolation strip 21 is inserted into the first opening 94. A pair of second isolation ribs 93 overlap the first isolation strip 21 from the upper and lower sides of the plane where the printed circuit board 2 is located. That is, as shown in Figure 19, the second upper isolation rib 931 contacts the upper surface of the first isolation strip 21, and the second lower isolation rib 932 contacts the lower surface of the first isolation strip 21, forming a first isolation portion. The first isolation portion can separate the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 into different isolation spaces.

[0097] In the present application, the signal isolation effect between the signal sending conductive contact 31 and the signal receiving conductive contact 32 can be enhanced by grounding the first isolation zone 21 and the isolation ribs in the socket 9 .

[0098] 11 and 14 , in some implementations of the present application, an optoelectronic device 100 further includes a structural member 1 and an optical device 4. The structural member 1 has a cavity 11 disposed therein, a printed circuit board 2 disposed within the cavity 11, and the optical device 4 disposed at a second end of the printed circuit board 2.

[0099] In some implementations of the present application, referring to Figures 20 to 22, a second isolation tape 22 extending along the width direction of the printed circuit board 2 is further provided on the printed circuit board 2, and the conductive contact assembly 3 and the optical device 4 are located on both sides of the second isolation tape 22 along the length direction of the printed circuit board 2. Isolation ribs are provided in the structural member 1, and the second isolation tape 22 is used to cooperate with the isolation ribs in the structural member 1 to form a second isolation portion for isolating the conductive contact assembly 3.

[0100] In this application, by setting a second isolation tape 22 on the printed circuit board 2, the second isolation tape 22 can overlap with the isolation ribs in the structural member 1 to form a second isolation portion. The second isolation portion can separate the conductive contact assembly 3 and other components on the printed circuit board 2 (such as the optical device 4) into different isolation chambers, thereby achieving physical isolation between the conductive contact assembly 3 and other components, reducing crosstalk between the conductive contact assembly 3 and other components, and improving the performance of the optoelectronic device.

[0101] In some implementations of the present application, referring to FIG21 , the second isolation zone 22 is located on the printed circuit board 2, is made of a conductive material and is connected to the ground. Referring to FIG20 , a pair of third isolation ribs 12 corresponding to the position of the second isolation zone 22 is provided in the cavity 11 of the structural member 1. Specifically, as shown in FIG22 , the pair of third isolation ribs 12 includes a third upper isolation rib 121 and a third lower isolation rib 122, and the third upper isolation rib 121 and the third lower isolation rib 122 are both made of a conductive material and are connected to the ground. The third upper isolation rib 121 is connected to the top surface of the cavity 11, and the third lower isolation rib 122 is connected to the bottom surface of the cavity 11. A second opening 13 corresponding to the thickness of the second isolation zone 22 is provided between the third upper isolation rib 121 and the third lower isolation rib 122. The printed circuit board 2 is inserted into the second opening 13. A pair of third isolation ribs 12 overlap the second isolation strip 22 on either side of the plane where the printed circuit board 2 resides. Specifically, the third upper isolation rib 121 contacts the upper surface of the second isolation strip 22, and the third lower isolation rib 122 contacts the lower surface of the second isolation strip 22, forming a second isolation portion. The second isolation portion can separate the conductive contact assembly 3 from other components on the printed circuit board 2 into separate isolation spaces.

[0102] In the present application, the signal isolation effect between the conductive contact assembly 3 and the optical device 4 can be enhanced by grounding the second isolation tape 22 and the isolation ribs in the structural member 1 .

[0103] In some implementations of the present application, referring to Figures 23 and 24 , conductive adhesive 14 is provided between the third upper isolation rib 121 and the printed circuit board 2, and between the third lower isolation rib 122 and the printed circuit board 2. By providing conductive adhesive 14, the present application can enhance the sealing of the isolation chamber, thereby ensuring tight isolation.

[0104] In some implementations of the present application, referring to Figures 25 and 26 , the optoelectronic device provided herein further includes a flexible printed circuit board 5 (FPC board), a signal transmission line 6, and a signal reception line 7. The flexible printed circuit board 5 is disposed between the optical device 4 and the printed circuit board 2, and is used to connect the optical device 4 and the printed circuit board 2. The signal transmission line 6 extends along the length of the printed circuit board 2. One end of the signal transmission line 6 is electrically connected to the signal transmission conductive contact 31, and the other end passes through the printed circuit board 2 and the flexible printed circuit board 5 in sequence before being electrically connected to the optical device 4. The signal transmission line 6 is used to transmit the signal emitted by the signal transmission conductive contact 31 to the optical device 4. The signal reception line 7 extends along the length of the printed circuit board 2. One end of the signal reception line 7 is electrically connected to the signal reception conductive contact 32, and the other end passes through the printed circuit board 2 and the flexible printed circuit board 5 in sequence before being electrically connected to the optical device 4. The signal reception line 7 is used to transmit the signal emitted by the optical device 4 to the signal reception conductive contact 32.

[0105] When the socket 9 transmits a signal, the electrical signal is transmitted from the socket 9 through the signal transmission conductive contact 31 and the signal transmission line 6 to the optical device 4. The optical device 4 then converts the electrical signal from the socket 9 into an optical signal and transmits the optical signal outward. When an optical signal is received from the outside, the optical device 4 converts the optical signal into an electrical signal. The electrical signal is then transmitted to the socket 9 through the signal reception line 7 and the signal reception conductive contact 32, so that the socket 9 receives the signal.

[0106] Exemplarily, referring to FIG. 27 , a through hole 53 is provided on the flexible circuit board 5 , and a PIN pin 41 is provided on the optical device 4 . The PIN pin 41 is inserted into the through hole 53 to achieve connection between the optical device 4 and the flexible circuit board 5 .

[0107] In some implementations of the present application, referring to FIG27 , a second conductive region 51 is provided on the flexible circuit board 5 , and the second conductive region 51 is connected to the ground. Referring to FIG28 , a first protrusion 15 is provided within the cavity 11 of the structural member 1 , corresponding to the position of the second conductive region 51 . The first protrusion 15 is made of a conductive material and is connected to the ground, and the first protrusion 15 is in contact with the second conductive region 51 .

[0108] The inventors discovered that the impedance discontinuity at the connection between the optical device 4 and the flexible circuit board 5 makes it prone to outward electromagnetic radiation. Furthermore, due to the limited space within the optoelectronic device, the connection between the optical device 4 and the flexible circuit board 5 is difficult to fully shield, which can result in the coupling of radiated signals. This invention enhances the radiation resistance of the optical device 4 and the flexible circuit board 5 by providing a second conductive region 51 connected to the ground on the flexible circuit board 5 and bridging the second conductive region 51 with the grounded first protrusion 15, while reducing outward radiation and improving isolation.

[0109] In some implementations of the present application, referring to Figures 27 and 28, an extension plate 52 is provided on the flexible circuit board 5, and the second conductive area 51 is provided on the extension plate 52. The cavity 11 of the structural member 1 has a second protrusion 16 arranged opposite to the first protrusion 15, and a third opening 17 is provided between the first protrusion 15 and the second protrusion 16. The extension plate 52 is provided in the third opening 17, and the first protrusion 15 and the second protrusion 16 contact the extension plate 52 from both sides of the plane where the extension plate 52 is located to clamp the extension plate 52 in the third opening 17, so that the second conductive area 51 can be in close contact with the first protrusion 15, thereby enhancing the reliability of the device.

[0110] In some implementations of the present application, the flexible circuit board 5 has an upper surface layer, a lower surface layer, and an inner layer. The inner layer is disposed between the upper and lower surface layers, and both the signal transmission line 6 and the signal reception line 7 are routed within the inner layer of the flexible circuit board 5. This design can enhance the isolation between the signal transmission line 6 and the signal reception line 7, reduce interference between the signal transmission line 6 and the signal reception line 7, and prevent the signal transmission line 6 and the signal reception line 7 from interfering with other channels or being interfered with by other channels.

[0111] In some implementations of the present application, referring to FIG29 , the signal transmitting line 6 and the signal receiving line 7 are routed on the surface of the flexible circuit board 5, and a ground wire 8 is provided on each side of the signal transmitting line 6 and / or the signal receiving line 7 along the width direction of the printed circuit board 2 (as shown in the Y direction in FIG29 ), and the ground wire 8 extends along the extension direction of the signal transmitting line 6 and the signal receiving line 7 (i.e., as shown in the X direction in FIG29 ). Since the radiation signal generated by the signal transmitting line 6 is higher than that of the signal receiving line 7, the signal transmitting line 6 is likely to interfere with the signal receiving line 7. By providing a ground wire 8 on each side of the signal transmitting line 6, the present application can constrain the electromagnetic radiation of the signal transmitting line 6 to the signal receiving line 7. By providing a ground wire 8 on each side of the signal receiving line 7, the radiation resistance of the signal receiving line 7 can be enhanced.

[0112] In some implementations of the present application, referring to FIG30 , a printed circuit board 2 includes an upper surface layer, a lower surface layer, and multiple inner layers. When the signal transmission line 6 and the signal reception line 7 are routed on the same printed circuit board 2, the signal transmission line 6 and the signal reception line 7 are routed on different inner layers of the same printed circuit board 2. When there are two printed circuit boards 2, the signal transmission line 6 and the signal reception line 7 are routed on the inner layers of two printed circuit boards 2, respectively. This design can enhance the isolation between the signal transmission line 6 and the signal reception line 7, thereby reducing interference between the signal transmission line 6 and the signal reception line 7.

[0113] Figure 31 is a comparison chart of the isolation effect of the present application and the prior art. In Figure 31, line L1 represents the isolation between the signal receiving channel and the signal transmitting channel in the prior art, and line L2 represents the isolation between the signal receiving channel and the signal transmitting channel after the implementation of the present application. Experiments have shown that without the implementation of the present application, the isolation between the signal receiving channel and the signal transmitting channel is poor, only around -40dB. After the implementation of the present application, the isolation between the signal receiving channel and the signal transmitting channel is significantly improved, reaching above -55dB.

[0114] The present application also provides a socket. Referring to Figures 11 and 14 , the socket 9 is provided with a socket 91 that allows insertion of any of the optoelectronic devices described in conjunction with Figures 11-30 in the aforementioned embodiments. Socket 91 is provided with isolation ribs, which may be the first isolation rib 92 shown in Figure 11 or the pair of second isolation ribs 93 shown in Figure 14 . When the optoelectronic device 100 is inserted into the socket 91 , the isolation ribs within the socket 91 cooperate with the first isolation strip 21 on the optoelectronic device 100 to form a first isolation portion that isolates the signal-transmitting conductive contact 31 from the signal-receiving conductive contact 32 .

[0115] The present application also provides an optical communication device, comprising any one of the optical communication components described in conjunction with FIG. 11 to FIG. 30 in the aforementioned embodiments.

[0116] The above describes the implementation methods of the present application by means of specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation methods. On the contrary, the purpose of introducing the application in conjunction with the implementation methods is to cover other options or modifications that may be extended based on the claims of the present application. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details are omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.

[0117] In the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," or "third" may explicitly or implicitly include one or more of the features.

[0118] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0119] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0120] In the description of this application, it should be noted that the terms "upper", "lower", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0121] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "dispose," "install," "connect," and "fit" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0122] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. An optical communication component, comprising an optoelectronic device and a socket, characterized in that, the optoelectronic device includes a printed circuit board, two ends of the printed circuit board along its length direction are respectively a first end and a second end, a conductive contact assembly is provided at the first end of the printed circuit board, and the conductive contact assembly includes a signal transmitting conductive contact and a signal receiving conductive contact; a first isolation strip extending along the length direction of the printed circuit board is further provided on the printed circuit board, and the signal transmitting conductive contact and the signal receiving conductive contact are located on both sides of the first isolation strip along the width direction of the printed circuit board; the socket is provided with a socket opening, the socket opening can allow the conductive contact assembly to be inserted, and an isolation rib is provided in the socket opening; when the conductive contact assembly is inserted into the socket opening, the isolation rib can cooperate with the first isolation strip to form the first isolation part for isolating the signal transmitting conductive contact and the signal receiving conductive contact.

2. The optical communication component according to claim 1, characterized in that, The first isolation strip is a split groove, a first isolation rib is provided in the socket, the width of the split groove matches the first isolation rib, and, when the conductive contact assembly is inserted into the socket, the first isolation rib is inserted into the split groove to form the first isolation part, so as to separate the signal transmitting conductive contact and the signal receiving conductive contact in different isolation spaces.

3. The optical communication component according to claim 2, wherein A conductive layer connected to the ground is provided on the side wall of the split groove, the first isolation rib is made of a conductive material and connected to the ground, and when the first isolation rib is inserted into the split groove, the first isolation rib contacts the conductive layer.

4. The optical communication component according to claim 1, characterized in that, the first isolation strip is located on the printed circuit board, made of a conductive material and connected to the ground, and, a pair of second isolation ribs corresponding to the position of the first isolation strip are provided in the socket, the pair of second isolation ribs are made of a conductive material and connected to the ground, and a first opening corresponding to the thickness of the first isolation strip is provided between the pair of second isolation ribs; when the conductive contact assembly is inserted into the socket, the first isolation strip is inserted into the first opening, and the pair of second isolation ribs respectively overlap with the first isolation strip from both sides of the plane where the printed circuit board is located to form the first isolation part, and the first isolation part can separate the signal transmitting conductive contact and the signal receiving conductive contact in different isolation spaces.

5. The optical communication component according to claim 1, characterized in that, The optoelectronic device further includes: a structural member, a cavity is provided inside the structural member, and the printed circuit board is arranged in the cavity; an optical device, arranged at the second end of the printed circuit board.

6. The optical communication component according to claim 5, characterized in that, A second isolation strip extending along the width direction of the printed circuit board is provided on the printed circuit board, the conductive contact assembly and the optical device are located on both sides of the second isolation strip along the length direction of the printed circuit board, an isolation rib is provided in the structural member, and the second isolation strip is used to cooperate with the isolation rib in the structural member to form a second isolation part for isolating the conductive contact assembly and the optical device.

7. The optical communication component according to claim 6, characterized in that, The second isolation strip is located on the printed circuit board, made of a conductive material and connected to the ground, and, a pair of third isolation ribs corresponding to the position of the second isolation strip are provided in the cavity of the structural member, the pair of third isolation ribs are made of a conductive material and connected to the ground, and a second opening corresponding to the thickness of the second isolation strip is provided between the pair of third isolation ribs; The printed circuit board is inserted into the second opening, and the pair of third isolation ribs are respectively lapped with the second isolation strip from both sides of the plane where the printed circuit board is located, so as to form the second isolation part for isolating the conductive contact assembly.

8. The optical communication component according to claim 7, characterized in that, Conductive adhesives are respectively provided between the pair of third isolation ribs and both sides of the plane where the printed circuit board is located.

9. The optical communication component according to claim 5, wherein, It further includes: a flexible circuit board, arranged between the optical device and the printed circuit board, and the flexible circuit board is used for connecting the optical device and the printed circuit board; a signal transmission line, extending along the length direction of the printed circuit board, one end of the signal transmission line is electrically connected to the signal transmission conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence, and the signal transmission line is used for transmitting the signal sent by the signal transmission conductive contact to the optical device; a signal reception line, extending along the length direction of the printed circuit board, one end of the signal reception line is electrically connected to the signal reception conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence, and the signal reception line is used for transmitting the signal sent by the optical device to the signal reception conductive contact.

10. The optical communication component according to claim 9, wherein A second conductive area is provided on the flexible circuit board, the second conductive area is connected to the ground, a first protrusion corresponding to the position of the second conductive area is provided in the cavity of the structural member, the first protrusion is made of a conductive material and connected to the ground, and the first protrusion is in contact with the second conductive area.

11. The optical communication component according to claim 10, characterized in that, An extension board is provided on the flexible circuit board, the second conductive area is arranged on the extension board, a second protrusion opposite to the first protrusion is provided in the cavity of the structural member, a third opening is provided between the first protrusion and the second protrusion, the extension board is arranged in the third opening, and the first protrusion and the second protrusion are in contact with the extension board from both sides of the plane where the extension board is located.

12. The optical communication component according to claim 9, characterized in that, Both the signal transmission line and the signal reception line are routed in the inner layer of the flexible circuit board.

13. The optical communication component according to claim 9, characterized in that, The signal transmission line and the signal reception line are routed on the surface layer of the flexible circuit board, and a ground wire is provided on each of both sides of the signal transmission line and / or the signal reception line along the width direction of the printed circuit board, and the ground wire extends along the length direction of the printed circuit board.

14. The optical communication component according to claim 9, wherein The printed circuit board includes a plurality of inner layers, and the signal transmission line and the signal reception line are respectively routed in different inner layers of the same printed circuit board.

15. The optical communication component according to claim 9, characterized in that, The number of the printed circuit boards is two, and the signal transmission line and the signal reception line are respectively routed in the inner layers of the two printed circuit boards.

16. A socket, characterized in that, It is provided with a socket, and isolation ribs are arranged in the socket. The socket can allow the optoelectronic device in the optical communication component according to any one of claims 1 to 15 to be inserted. When the optoelectronic device is inserted into the socket, the isolation ribs can cooperate with the first isolation strip on the optoelectronic device to form the first isolation part for isolating the signal transmission conductive contact piece and the signal reception conductive contact piece.

17. An optical communication device, characterized in that, It includes the optical communication component according to any one of claims 1 to 15.

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