Display panel and manufacturing method therefor, display apparatus and titled display apparatus

Abstract

A display panel, comprising a display substrate, a plurality of binding electrodes, a bearing substrate, a plurality of wires, a partition structure and a connecting layer. The display panel is provided with a display surface, a non-display surface and a plurality of side surfaces; the display surface is provided with a first binding area, and the plurality of binding electrodes are arranged in the first binding area at intervals; the bearing substrate is attached to the non-display surface, and the bearing substrate is provided with a second binding area; the plurality of wires are arranged on the bearing surface at intervals, and one end of each of the plurality of wires extends into the second binding area; the partition structure covers part of the plurality of wires, and the partition structure is provided with a plurality of partition recesses; the connecting layer comprises a redundant part and a plurality of connecting wires.

Description

Display panel and manufacturing method thereof, display device, and spliced ​​display device

[0001] This application claims priority to Chinese patent application No. 202410108544.3, filed on January 25, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, a display device, and a spliced ​​display device. Background Art

[0003] Currently, in the application of LED (Light-Emitting Diode), large-size LED display panels need to be spliced ​​together by small screens. Summary of the Invention

[0004] In one aspect, a display panel is provided. The display panel includes a display substrate, multiple binding electrodes, a carrier substrate, multiple wires, a partition structure, and a connecting layer. The display substrate has a display surface, a non-display surface, and multiple side surfaces connecting the display and non-display surfaces, at least one of which is a selected side surface. The display surface has a first binding area proximate to the selected side surface. The multiple binding electrodes are sequentially spaced along a first direction within the first binding area. The first direction is parallel to the selected side surface proximate to the first binding area. The carrier substrate is attached to the non-display surface. The side of the carrier substrate facing away from the display substrate is a carrier surface, which has a second binding area proximate to the selected side surface. The multiple wires are sequentially spaced along the first direction on the carrier surface. One end of the multiple wires extends into the second binding area. The partition structure is located on the carrier surface and covers a portion of the multiple wires. The portion of the partition structure extending into the second binding area is defined by multiple partition grooves, each of which exposes one end of the multiple wires extending into the second binding area. The orthographic projection of the top of each partition groove on the bearing surface is located within the orthographic projection range of the bottom wall of the partition groove on the bearing surface. The connection layer includes a redundant portion and a plurality of connecting lines. The redundant portion covers the portion of the partition structure extending into the second binding area. Each connecting line includes a first sub-portion, a second sub-portion, and a third sub-portion connected in sequence, the first sub-portion being located in the first binding area and in contact with a binding electrode, the second sub-portion being located on the selected side, and the third sub-portion being located in the partition groove and in contact with the conductive wire. The partition groove separates the redundant portion and the conductive wire.

[0005] In some embodiments, the partition structure is integrally formed.

[0006] In some embodiments, a cross-sectional shape of the partition groove comprises a regular trapezoid; the cross-section is parallel to the selected side surface.

[0007] In some embodiments, the material of the partition structure includes negative photoresist.

[0008] In some embodiments, the supporting surface further comprises a third binding region, the third binding region being spaced apart from the second binding region. A portion of the partition structure located within the third binding region is provided with a plurality of first openings, each of which exposes a portion of the plurality of wires located within the third binding region to serve as a plurality of binding pins. The display panel further comprises a circuit board electrically connected to the plurality of binding pins.

[0009] In some embodiments, a cross-sectional shape of the plurality of first openings is the same as a cross-sectional shape of the partition groove.

[0010] In some embodiments, the partition structure includes a support layer and a partition layer, wherein the partition layer is located on a side of the support layer away from the bearing surface. The orthographic projection of the portion of the support layer extending into the second binding region on the bearing surface is within the orthographic projection range of the portion of the partition layer extending into the second binding region on the bearing surface.

[0011] In some embodiments, the partition groove has a cross-sectional shape including an inverted T. The cross-sectional shape is parallel to the selected side surface.

[0012] In some embodiments, the support layer is made of a positive photoresist and / or the barrier layer is made of an inorganic material.

[0013] In some embodiments, the bearing surface further comprises a third binding region, the third binding region being spaced apart from the second binding region. The supporting layer is positioned outside the third binding region, and a portion of the isolation layer within the third binding region is provided with a plurality of second openings, each of which exposes a portion of the plurality of wires within the third binding region to serve as a plurality of binding pins. The display panel further comprises a circuit board electrically connected to the plurality of binding pins.

[0014] In some embodiments, a surface of one side of the carrier substrate covered with the second sub-portion is flush with the selected side surface.

[0015] On the other hand, a display device is provided, comprising the display panel provided by any one of the above embodiments.

[0016] On the other hand, a spliced ​​display device is provided, comprising the display device provided by any of the above embodiments.

[0017] In another aspect, a method for manufacturing a display panel is provided, comprising: providing a display substrate; the display substrate having a display surface and a non-display surface opposite each other, and multiple side surfaces connecting the display and non-display surfaces, wherein at least one side surface is a selected side surface; the display surface having a first binding region proximate to the selected side surface; forming multiple binding electrodes within the first binding region; the multiple binding electrodes are sequentially spaced along a first direction parallel to the selected side surface proximate to the first binding region; providing a carrier substrate; the carrier substrate having a carrier surface, the carrier surface having a second binding region; forming multiple conductive lines on the carrier surface; the multiple conductive lines are sequentially spaced along the first direction on the carrier surface, with one end of the multiple conductive lines extending into the second binding region; forming a partition structure on the carrier surface to cover a portion of the multiple conductive lines; the portion of the partition structure extending into the second binding region having multiple partition grooves, each of the partition grooves exposing one end of the multiple conductive lines extending into the second binding region; the orthographic projection of the top of each partition groove on the carrier surface is within the orthographic projection of the bottom wall of the partition groove on the carrier surface; and attaching the carrier substrate to the non-display surface. A connection layer is formed; the connection layer includes a redundant portion and a plurality of connection lines; the redundant portion covers the portion of the partition structure extending into the second binding area; each connection line includes a first sub-portion, a second sub-portion and a third sub-portion connected in sequence, the first sub-portion is located in the first binding area and in contact with a binding electrode, the second sub-portion is located on the selected side, and the third sub-portion is located in the partition groove and in contact with the conductive wire; the partition groove separates the redundant portion and the conductive wire.

[0018] In some embodiments, forming a partition structure on the supporting surface that covers a portion of the plurality of conductive lines includes: forming a first partition film on the supporting surface; the partition film covers a portion of the plurality of conductive lines, and a portion of the partition film extends into the second binding area; and etching the portion of the first partition film that extends into the second binding area to form the partition groove.

[0019] In some embodiments, the material of the first partition film comprises a negative photoresist. Etching the portion of the first partition film extending into the second binding region comprises: placing a first mask on the first partition film; the first mask having a plurality of third openings located within the second binding region, the plurality of third openings exposing at least the portion of the partition film located between two adjacent conductive lines. Using the first mask, the portion of the first partition film extending into the second binding region and located between two adjacent conductive lines is exposed, developed, and removed to form the plurality of partition grooves.

[0020] In some embodiments, the supporting surface further has a third binding area, and the third binding area is spaced apart from the second binding area; in the process of etching the portion of the first partition film extending into the second binding area, the portion of the first partition film located in the third binding area is also etched to form a plurality of first openings; the plurality of first openings respectively expose the portions of the plurality of wires located in the third binding area to serve as a plurality of binding pins.

[0021] In some embodiments, the partition structure formed on the supporting surface to cover a portion of the plurality of wires includes: forming a second partition film on the supporting surface; the second partition film covers a portion of the plurality of wires, and a portion of the second partition film extends into the second binding area. Etching the portion of the second partition film extending into the second binding area to expose one end of the plurality of wires extending into the second binding area. Forming a third partition film to cover the second partition film and the plurality of wires. Etching the portion of the third partition film extending into the second binding area to expose one end of the plurality of wires extending into the second binding area. Based on the etched third partition film, etching the second partition film to form the partition groove.

[0022] In some embodiments, the support surface further comprises a third binding region spaced apart from the second binding region; the second partition film is located outside the second binding region. During the etching of the portion of the third partition film extending into the second binding region, the portion of the third partition film located within the third binding region is also etched to form a plurality of second openings; the plurality of second openings respectively expose the portions of the plurality of wires located within the third binding region to serve as a plurality of binding pins.

[0023] In some embodiments, forming the connection layer includes forming a connection film within the first binding region, on the selected side surface, and within the second binding region; the portion of the connection film located within the second binding region is separated by the plurality of separation grooves to form the redundant portion and the plurality of third sub-portions; and laser etching is performed on the portion of the connection film located on the selected side surface and within the first binding region to form the second sub-portions and the first sub-portions, which are sequentially connected to each of the third sub-portions, thereby forming the plurality of connection lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, etc. involved in the embodiments of the present disclosure.

[0025] FIG1 is a top view of a display panel according to some embodiments;

[0026] FIG2 is a cross-sectional view of the display panel shown in FIG1 along a second direction;

[0027] FIG3 is a bottom view of the display panel shown in FIG1 ;

[0028] FIG4 is a cross-sectional view of a display panel along a second direction according to some embodiments;

[0029] FIG5 is a side view of a display panel according to some embodiments;

[0030] FIG6 is a cross-sectional view of a display panel along a first direction according to some embodiments;

[0031] FIG7 is a bottom view of a display panel according to some embodiments;

[0032] FIG8 is a cross-sectional view of another display panel along a second direction according to some embodiments;

[0033] FIG9 is a side view of another display panel according to some embodiments;

[0034] FIG10 is a cross-sectional view of another display panel along a first direction according to some embodiments;

[0035] FIG11 is a bottom view of another display panel according to some embodiments;

[0036] FIG12 is a structural diagram of a display panel according to some embodiments;

[0037] FIG13 is a structural diagram of a spliced ​​display device according to some embodiments;

[0038] FIG14 is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0039] 15a to 151 are structural diagrams corresponding to some steps of a method for manufacturing a display panel according to some embodiments;

[0040] 16a to 16b are structural diagrams corresponding to other steps of a method for manufacturing a display panel according to some embodiments;

[0041] 17a to 17b are structural diagrams corresponding to further steps of a method for manufacturing a display panel according to some embodiments;

[0042] 18a to 18h are structural diagrams corresponding to further steps of a method for manufacturing a display panel according to some embodiments. DETAILED DESCRIPTION

[0043] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0044] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0045] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0046] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0047] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0048] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B. The use of "suitable for" or "configured to" herein is meant to be open and inclusive language that does not exclude devices that are suitable for or configured to perform additional tasks or steps.

[0049] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0050] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0051] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0052] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0053] In order to improve product reliability and reduce transportation and maintenance costs, a large-size display device can be assembled by splicing multiple small-size display devices.

[0054] To avoid the sense of fragmentation in the display caused by splicing, it is necessary to reduce the bezel size of a single small-sized display device and the width of the splicing seam. The small-sized display device includes a display panel. For example, side wiring can be used to connect the wiring located on the display surface side of the display panel to a circuit board (such as a flexible circuit board) provided on the non-display surface side of the display panel. Therefore, when multiple small-sized display devices are spliced ​​together to form a larger large-sized display device, the spacing between adjacent small-sized display devices can be reduced, thereby improving the display quality of the large-sized display device formed by splicing multiple small-sized display devices.

[0055] FIG1 schematically illustrates a top view structure of a display panel 10 , FIG2 schematically illustrates a cross-sectional view structure of the display panel 10 , and FIG3 schematically illustrates a bottom view structure of the display panel 10 .

[0056] As shown in Figures 1 and 2, the display panel 10 includes a display substrate 1 having a display surface 1a, a non-display surface 1b, and multiple side surfaces 1c. The display surface 1a and the non-display surface 1b are disposed opposite each other, and the multiple side surfaces 1c are connected end to end and located between the display surface 1a and the non-display surface 1b, thereby connecting the display surface 1a and the non-display surface 1b. The display surface 1a refers to the surface of the display substrate 1 used for image display.

[0057] As shown in Figures 1 and 2, the display substrate 1 has a display area AA. The display substrate 1 includes: a backplane 11 and a plurality of light-emitting devices 12 located on the backplane 11. The backplane 11 includes a driving circuit layer 111 located in the display area AA, and the plurality of light-emitting devices 12 are located in the display area AA, and are located on the driving circuit layer 111, and are electrically connected to the driving circuit layer 111. The driving circuit layer 111 is used to transmit electrical signals and generate driving signals to the plurality of light-emitting devices 12 to drive the plurality of light-emitting devices 12 to emit light, thereby realizing image display. For example, the light-emitting device 12 can be an LED, a Mini LED (Mini Light Emitting Diode Display) or a Micro LED (Micro Light Emitting Diode).

[0058] As shown in Figure 1, at least one of the multiple side surfaces 1c is a selected side surface 1c1. Optionally, the number of selected side surfaces 1c1 can be one, two, three or even more. The display substrate 1 also has a first binding area B1, which is located on the side of the display area AA close to the selected side surface 1c1. The first binding area B1 is arranged in a one-to-one correspondence with the selected side surfaces 1c1, that is, the number of the first binding area B1 and the selected side surfaces 1c1 is equal, and a first binding area B1 is provided at each selected side surface 1c1. Figure 1 is illustrated by taking the example that the number of the selected side surface 1c1 and the first binding area B1 are both one.

[0059] As shown in Figures 1 and 2, the display panel 10 further includes a plurality of binding electrodes 2, which are arranged at intervals along a first direction X in the first binding area B1. Each binding electrode 2 extends, for example, in a direction perpendicular to the first direction X (i.e., a second direction Y). The first direction X is parallel to the selected side surface 1c1 to which the first binding area B1 is close. For example, the plurality of binding electrodes 2 are electrically connected to the corresponding signal lines in the drive circuit layer 111 to transmit electrical signals to the corresponding signal lines. Of course, the plurality of binding electrodes 2 can be integrated with the corresponding signal lines, that is, the signal lines in the drive circuit layer 111 can extend into the first binding area B1, and the portion extending into the first binding area B1 can constitute the plurality of binding electrodes 2.

[0060] As shown in Figures 2 and 3, the display panel 10 further includes a plurality of wires 3 located on the non-display surface 1b. These wires 3 are sequentially spaced and arranged along a first direction X. Each wire 3 extends, for example, perpendicular to the first direction X, with one end of each wire 3 extending to a location on the selected side surface 1c1. The wires 3 are used to bind to the circuit board 7 to receive electrical signals from the circuit board 7.

[0061] As shown in Figures 1, 2, and 3, the display panel 10 further includes a plurality of connecting wires 4. The number of the plurality of connecting wires 4, the number of the plurality of wires 3, and the number of the plurality of binding electrodes 2 are, for example, equal, and the connecting wires 4, the wires 3, and the binding electrodes 2 are, for example, arranged in a one-to-one correspondence. Each connecting wire 4 includes a first sub-portion 41, a second sub-portion 42, and a third sub-portion 43, which are sequentially connected. The first sub-portion 41 is located on the display surface 1a and within the first binding area B1, and contacts a corresponding binding electrode 2 to form an electrical connection; the second sub-portion 42 is located on the selected side surface 1c1; and the third sub-portion 43 is located on the non-display surface 1b and contacts a corresponding wire 3 to form an electrical connection. In this way, the electrical signals of the circuit board can be transmitted to the corresponding signal lines in the driving circuit layer 111 via the wires 3, the connecting wires 4, and the binding electrodes 2 in sequence.

[0062] In the related art, there are two main ways to prepare the above-mentioned conductive wires 3 and connecting wires 4:

[0063] In a first possible implementation, after the drive circuit layer 111 and the plurality of conductive lines 3 are prepared, a metal film is formed within the first binding region B1, on the selected side surface 1c1, and on the plurality of conductive lines 3. This metal film is then etched using a laser etching process to form the plurality of connecting lines 4. However, this method can easily scratch the pattern in the drive circuit layer 111. Furthermore, during the preparation of the plurality of conductive lines 3, the pattern in the drive circuit layer 111 can easily contaminate related equipment, increasing the need for repairs or the risk of downtime, thereby increasing costs.

[0064] In a second possible implementation, after the drive circuit layer 111 is prepared, a metal film is formed within the first binding area B1, on the selected side surface 1c1, and on the non-display surface 1b, as shown in FIG2 . This metal film is then etched using a laser process to form the plurality of connecting lines 4 and the plurality of conductive lines 3. However, the portion of the metal film located on the non-display surface 1b has a relatively large area. Therefore, during the laser etching process to form the third subsection 43 of the connecting line 4 and the conductive lines 3, the laser may penetrate the backplane 11 and enter the display area AA of the display surface 1a. As shown in FIG2 , the laser is irradiated toward the display substrate 1 along the indicated laser directions. Because the third subsection 43 of the connecting line 4 and the conductive lines 3 overlap with the area corresponding to the display area AA, some of the laser energy may pass through the backplane 11 and reach the display area AA, potentially damaging the drive circuit layer 111 and the components within this area, thereby reducing the yield and reliability of the display panel 10.

[0065] Based on this, some embodiments of the present disclosure provide display panels. FIG4 illustrates a cross-sectional structure of a display panel 10, FIG5 illustrates a side view structure of another display panel 10, FIG6 illustrates a cross-sectional structure of a display panel 10, and FIG7 illustrates a bottom view structure of a display panel 10. FIG7 omits the redundant portion 4aa to clearly illustrate the various structures.

[0066] As shown in FIG. 4 , FIG. 5 , FIG. 6 and FIG. 7 , the display panel 10 further includes a carrier substrate 5 , a partition structure 6 , and a connection layer 4 a .

[0067] The materials of the carrier substrate 5 include, but are not limited to, polyimide (PI), glass, and the like. As shown in Figures 4 to 7 , the carrier substrate 5 is attached to the non-display surface 1b of the display substrate 1. The carrier substrate 5 and the non-display surface 1b are bonded together, for example, using a high-temperature-resistant, easily curable, and securely adhesive adhesive. The area of ​​the carrier substrate 5 is smaller than that of the display substrate 1.

[0068] The surface of the carrier substrate 5 facing away from the display substrate 1 is a carrier surface 51. The plurality of conductors 3 are located on the carrier surface 51. For example, the carrier substrate 5 may be a plate-shaped structure. Alternatively, the carrier substrate 5 may include a plurality of strip-shaped sub-sections spaced apart from each other, each strip-shaped sub-section being provided with at least one conductor.

[0069] That is, in the embodiment of the present disclosure, the plurality of conductive lines 3 are formed separately on the carrying surface 51 of the carrying substrate 5, rather than on the non-display surface 1b of the display substrate 1. Thus, in forming the display panel 10, the plurality of conductive lines 3 can be formed on the carrying surface 51 of the carrying substrate 5 first, and then the carrying substrate 5 with the plurality of conductive lines 3 formed thereon can be attached to the non-display surface 1b of the display substrate 1.

[0070] As shown in Figures 4 and 7 , the support surface 51 has a second binding region B2 adjacent to the selected side surface 1c1. Of the multiple wires 3 located on the support surface 51, one end of each wire 3 extends into the second binding region B2, while the remainder of the wire 3 is located outside the second binding region B2. The end of each wire 3 that extends into the second binding region B2 can also be referred to as a first binding end.

[0071] Figure 7 illustrates a layout of the conductors 3. For example, as shown in Figure 7, each conductor 3 is linear. Alternatively, each conductor 3 may be zigzag-shaped; the area occupied by the plurality of conductors 3 gradually decreases in size as it moves away from the selected side surface 1c1 and perpendicular to the first direction X.

[0072] As shown in Figures 4 to 7 , the partition structure 6 is located on the support surface 51 and covers a portion of the plurality of wires 3. For example, a portion of the partition structure 6 is located between any two adjacent wires 3 to provide electrical insulation between the two adjacent wires 3; another portion of the partition structure 6 is located on the side of each wire 3 away from the support substrate 5, covering and protecting a portion of each wire 3.

[0073] Exemplarily, as shown in Figures 4 and 7, the partition structure 6 exposes the portion of each wire 3 extending into the second binding area B2. Specifically, the portion of the partition structure 6 extending into the second binding area B2 is provided with a plurality of partition grooves 61, and the plurality of partition grooves 61 respectively expose one end of the plurality of wires 3 extending into the second binding area B2. For example, the plurality of partition grooves 61 all extend in a direction perpendicular to the first direction X and are arranged in a one-to-one correspondence with the plurality of wires 3, with one partition groove 61 exposing one end of a wire 3 extending into the second binding area B2. This facilitates the connection between the end of the wire 3 extending into the second binding area B2 and the third sub-portion 43 of the connecting line 4.

[0074] As shown in Figures 4, 5, and 6, the orthographic projection of the top of each partition groove 61 on the bearing surface 51 is located within the orthographic projection of the bottom wall of the partition groove 61 on the bearing surface 51. In other words, the area of ​​the notch of each partition groove 61 is smaller than the area of ​​the bottom wall of the partition groove 61.

[0075] In other words, as shown in Figures 6 and 7, the portion of the partition structure 6 extending into the second binding area B2 includes a plurality of partition portions 62 arranged at intervals, and the partial area between two adjacent partition portions 62 constitutes the above-mentioned partition groove 61. The area of ​​the side surface of each partition portion 62 away from the supporting substrate 5 (which can also be called the top surface) is larger than the area of ​​the side surface close to the supporting substrate 5 (which can also be called the bottom surface). The top surface of the partition portion 62 protrudes from its bottom surface. As shown in Figures 5 and 6, in the first direction X, the line connecting the top surface and the bottom surface of the partition portion 62 forms an acute angle with the supporting surface 51; as shown in Figure 4, in the second direction Y, the line connecting the top surface and the bottom surface of the partition portion 62 also forms an acute angle with the supporting surface 51. The second direction Y is, for example, perpendicular to the first direction X.

[0076] As shown in Figures 4 and 5, the above-mentioned connection layer 4a includes a redundant portion 4aa and a plurality of connection lines 4. The redundant portion 4aa covers the portion of the partition structure 6 extending into the second binding area B2. Specifically, in conjunction with Figures 4 and 7, in the second binding area B2, the redundant portion 4aa covers the top surface of the above-mentioned multiple partition portions 62. The third sub-portion 43 of the connection line 4 is located in the partition groove 61 and is in contact with the wire 3 exposed by the partition groove 61. In other words, the above-mentioned multiple partition grooves 61 or multiple partition portions 62 can isolate the portion of the connection layer 4a located in the second binding area B2.

[0077] Furthermore, as shown in FIG. 4 , in the second direction Y, the partition portion 62 may further partition the third sub-portion 43 of the connecting line 4 from a portion of the connecting layer 4 a located outside the second binding area B2 .

[0078] In this way, in the process of preparing the above-mentioned multiple connecting lines 4, part of the metal film located in the second binding area B2 can be naturally separated by the above-mentioned multiple partition grooves 61 or multiple partition parts 62 into mutually separated redundant parts 4aa and the third sub-part 43 of the multiple connecting lines 4, without the need to use laser etching process to etch the part of the metal film located in the second binding area B2.

[0079] Therefore, the display panel 10 provided by some embodiments of the present disclosure, by attaching a carrier substrate 5 provided with multiple wires 3 on the non-display surface 1b of the display substrate 1, and providing a partition structure 6 with multiple partition grooves 61 on the carrier substrate 5, can utilize the partitioning effect of the partition grooves 61 to isolate the part of the connecting layer 4a located in the second binding area B2, so that the third sub-portions 43 of the multiple connecting wires 4 in the connecting layer 4a that are in contact with the multiple wires 3 can naturally fall into the multiple partition grooves 61 respectively, electrically contact with the corresponding wires 3, and avoid contact between two adjacent connecting wires 4 to cause a short circuit, thereby ensuring that the multiple connecting wires 4 can normally connect the multiple binding electrodes 2 and the multiple wires 3.

[0080] Due to the isolation effect of the above-mentioned partition structure 6 on the connecting layer 4a, in the process of preparing the above-mentioned display panel, only part of the connecting layer 4a on the selected side 1c1 can be laser etched, avoiding laser etching of the part of the connecting layer 4a located in the second binding area B2, thereby avoiding part of the laser energy from passing through the non-display surface 1b of the display substrate 1 to damage or even destroy the driving circuit layer 111 and devices of the display substrate 1, thereby improving product yield and reliability.

[0081] In some embodiments, as shown in FIG8 , the surface of the carrier substrate 5 covered with the second sub-portion 42 is flush with the selected side surface 1c1. In other words, along a direction perpendicular to the carrier surface 51, the surface of the carrier substrate 5 covered with the second sub-portion 42 and the selected side surface 1c1 are located in the same plane, with no misalignment between them.

[0082] The arrangement facilitates the formation of the connecting layer 4a on the selected side surface 1c1 and one side surface of the carrier substrate 5, which is beneficial to improving the continuity and structural stability of the second sub-section 42 of the connecting line 4 and avoiding disconnection of the second sub-section 42 of the connecting line 4.

[0083] The partition structure 6 can be configured in various ways, and can be selected based on actual needs, as long as it can partition the connecting layer 4a.

[0084] In a possible embodiment, as shown in FIG. 4 to FIG. 7 , the partition structure 6 is integrally formed.

[0085] For example, the partition structure 6 is formed of a single-layer thin film. During the process of forming the partition structure 6, etching can be completed in one process step.

[0086] By providing the partition structure 6 as an integrally formed structure, the structure of the partition structure 6 can be simplified, the manufacturing process of the partition structure 6 can be simplified, and the cost of the display panel 10 can be reduced.

[0087] In some embodiments, the partition structure 6 is made of a negative photoresist, which undergoes a photocuring reaction after exposure.

[0088] In this way, during the process of manufacturing the partition structure 6 , the partition structure 6 can be formed only by exposure and development, without the need for an additional etching process, which facilitates operation, simplifies the process steps, and helps reduce costs.

[0089] In some embodiments, as shown in FIG6 , the cross-sectional shape of the partition groove 61 comprises a regular trapezoid, with the cross-section being parallel to the selected side surface 1c1. Accordingly, the interface shape of the partition portion 62 comprises an inverted trapezoid or a shape similar to an inverted trapezoid. The term "similar to an inverted trapezoid" refers to a shape whose top corners are rounded or similar to rounded corners, or whose sides are not strictly straight lines.

[0090] By configuring the isolation groove 61 in the above manner, the isolation groove 61 can ensure that it has a good isolation effect on the connection layer 4a. In this way, during the formation of the connection layer 4a, the redundant portion 4aa of the connection layer 4a can be prevented from connecting with the connection line 4 on the sidewall of the isolation groove 61. This further prevents the connection line 4 from contacting the redundant portion 4aa and causing a short circuit, thereby improving the reliability of the display panel 10.

[0091] In some embodiments, as shown in Figures 4 and 7, the bearing surface 51 further comprises a third binding area B3, which is spaced apart from the second binding area B2. That is, the third binding area B3 is further away from the selected side surface 1c1 than the second binding area B2.

[0092] In the partition structure 6, a plurality of first openings K1 are provided in the portion located in the third binding area B3. The plurality of first openings K1 extend in a direction perpendicular to the first direction X (i.e., the second direction Y) and are spaced apart along the first direction X. The plurality of first openings K1 respectively expose the portions of the plurality of wires 3 located in the third binding area B3 as a plurality of binding pins 31. In other words, the plurality of first openings K1 are provided in a one-to-one correspondence with the portions of the plurality of wires 3 located in the third binding area B3, and the orthographic projection of the first opening K1 on the bearing surface 51 at least partially overlaps with the orthographic projection of the portion of the corresponding wire 3 located in the third binding area B3 on the bearing surface 51.

[0093] 4 and 7 , the display panel 10 further includes a circuit board 7 electrically connected to the plurality of binding pins 31. The circuit board 7 is, for example, a flexible circuit board.

[0094] By providing a third binding area B3 spaced apart from the second binding area B2 on the bearing surface 51, and arranging the portion of the partition structure 6 within the third binding area B3 according to the above-described structure, the portion of the plurality of wires 3 within the third binding area B3 can be exposed, serving as binding pins 31 for connecting to the circuit board 7. In this way, the circuit board 7 can be connected to the plurality of wires 3 via the binding pins 31. Because the portion of the plurality of wires 3 within the second binding area B2 is connected to the plurality of binding electrodes 2 within the first binding area B1 via the connecting layer 4a, the circuit board 7 is connected to the plurality of binding electrodes 2 within the first binding area B1 via the plurality of wires 3, thereby being able to transmit electrical signals to the drive circuit layer 111 of the display substrate 1, enabling the display panel 10 to display images.

[0095] In some embodiments, referring to Figures 4, 5, and 7, the cross-sectional shape of the plurality of first openings K1 is the same as the cross-sectional shape of the partitioning groove 61, where the cross-sectional shape is parallel to the selected side surface 1c1. That is, when the cross-sectional shape of the partitioning groove 61 is a regular trapezoid, the cross-sectional shape of the plurality of first openings K1 is also a regular trapezoid.

[0096] In this way, during the process of preparing and forming the partition grooves 61 , the plurality of first openings K1 can be prepared and formed simultaneously, which is beneficial to reducing process steps and improving production efficiency.

[0097] In another possible embodiment, the partition structure 6 is formed by stacking multiple films.

[0098] As shown in Figures 8, 9, 10, and 11, the partition structure 6 includes a support layer 63 and a partition layer 64. The partition layer 64 is located on the side of the support layer 63 away from the bearing surface 51. In other words, the support layer 63 is located between the bearing surface 51 and the partition layer 64, and the partition layer 64 covers the support layer 63.

[0099] Exemplarily, the thickness of the support layer 63 is greater than the thickness of the conductive wire 3. The isolation layer 64 is spaced apart from the conductive wire 3, and there is no direct contact between the isolation layer 64 and the conductive wire 3.

[0100] Furthermore, in conjunction with Figures 8, 9, and 11, the orthographic projection of the portion of the support layer 63 extending into the second binding area B2 on the support surface 51 is within the orthographic projection of the portion of the barrier layer 64 extending into the second binding area B2 on the support surface 51. In other words, the area of ​​the orthographic projection of the portion of the support layer 63 extending into the second binding area B2 on the support surface 51 is smaller than the area of ​​the orthographic projection of the portion of the barrier layer 64 extending into the second binding area B2 on the support surface 51. The barrier layer 64 protrudes from the side of the support layer 63 facing away from the support substrate 5.

[0101] By adopting the above-mentioned configuration, the isolation layer 64 can be made more prominent than the supporting layer 63, thereby improving the isolation effect of the isolation structure 6. In the process of forming the connecting layer 4a on the partition structure 6 in the second binding area B2, the redundant part 4aa of the connecting layer 4a and the multiple connecting lines 4 can be avoided from forming a connection on the side wall of the supporting layer 63, thereby avoiding the formation of a short circuit between the multiple connecting lines 4.

[0102] In some embodiments, as shown in Figure 10 , the cross-sectional shape of the partitioning groove 61 comprises an inverted T-shape. This cross-section is parallel to the selected side surface 1c1. Specifically, in the cross-sectional view of the partitioning groove 61, the distance between the portions of the partitioning layer 64 on either side of the partitioning groove 61 is smaller than the distance between the portions of the supporting layer 63 on either side of the partitioning groove 61. In this case, the cross-sectional shape of the partitioning groove 61 also resembles a "convex" shape. The cross-sectional shape of the partition portion 62 comprises a T-shape.

[0103] By arranging the partition groove 61 according to the above structure, it is possible to further prevent the redundant portion 4aa in the connection layer 4a from being connected to the connection line 4 located in the partition groove 61 on the side wall of the partition groove 61, thereby preventing short circuits between multiple connection lines 4.

[0104] In some embodiments, the material of the support layer 63 includes positive photoresist. The characteristic of positive photoresist is that the exposed positive photoresist will dissolve after exposure. Optionally, the material of the blocking layer 64 is an inorganic material, such as silicon nitride.

[0105] By using a positive photoresist as the material for the support layer 63, the desired shape and structure can be formed by simply exposing and developing the support layer 63, simplifying the process. By using an inorganic material as the material for the barrier layer 64, the material for the barrier layer 64 is easily available, thus reducing production costs.

[0106] When the partition structure 6 includes a support layer 63 and a partition layer 64, as shown in Figures 8 and 11, the bearing surface 51 further includes a third binding area B3. Here, the third binding area B3 is also spaced apart from the second binding area B2. Compared to the second binding area B2, the third binding area B3 is further away from the selected side surface 1c1.

[0107] Furthermore, as shown in Figures 8 and 11, the support layer 63 is located outside the third binding area B3, that is, the support layer 63 is located within the second binding area B2, and within a partial area between the second binding area B2 and the third binding area B3. A plurality of second openings K2 are provided in the portion of the isolation layer 64 located within the third binding area B3. The plurality of first openings K2 extend in a direction perpendicular to the first direction X (i.e., the second direction Y) and are arranged at intervals along the first direction X. The plurality of second openings K2 respectively expose the portions of the plurality of wires 3 located within the third binding area B3 as a plurality of binding pins 31. That is, the plurality of second openings K2 are arranged in a one-to-one correspondence with the portions of the plurality of wires 3 located in the third binding area B3, and the orthographic projections of the plurality of second openings K2 on the bearing surface 51 at least partially overlap with the orthographic projections of the portions of the plurality of wires 3 located in the third binding area B3 on the bearing surface 51.

[0108] 8 and 11 , the display panel 10 further includes a circuit board 7 electrically connected to the plurality of binding pins 31. The circuit board 7 is, for example, a flexible circuit board.

[0109] By providing a third binding area B3 spaced apart from the second binding area B2 on the bearing surface 51, and arranging the support layer 63 and the isolation layer 64 according to the above-described structure, the portion of the plurality of wires 3 located within the third binding area B3 can be exposed, serving as the binding pins 31 for connecting to the circuit board 7. In this way, the circuit board 7 can be connected to the plurality of wires 3 via the binding pins 31. Because the portion of the plurality of wires 3 within the second binding area B2 is connected to the plurality of binding electrodes 2 within the first binding area B1 via the connecting layer 4a, the circuit board 7 is connected to the plurality of binding electrodes 2 within the first binding area B1 via the plurality of wires 3, thereby being able to transmit electrical signals to the drive circuit layer 111 of the display substrate 1, enabling the display panel 10 to display images.

[0110] On the other hand, as shown in FIG12 , some embodiments of the present disclosure provide a display device 100 , which includes the display panel 10 described in any of the above embodiments. The beneficial effects thereof are the same as those of the above display panel 10 and are not described in detail here.

[0111] The display device 100 can be any device that displays images, whether in motion (e.g., video), stationary (e.g., still images), text, or images. More specifically, it is contemplated that the embodiments described herein can be implemented in or associated with a variety of electronic devices, such as, but not limited to, mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., speedometer displays), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), and the like.

[0112] For example, the display device 100 may further include a frame and other electronic components, etc. The display panel 10 may be disposed within the frame, for example.

[0113] On the other hand, as shown in FIG13 , some embodiments of the present disclosure provide a spliced ​​display device 1000 , which includes a plurality of the above-mentioned display devices 100 . The beneficial effects thereof are the same as those of the above-mentioned display devices 100 and are not described in detail here.

[0114] Exemplarily, the multiple display devices 100 in the spliced ​​display device 1000 are arranged in an array.

[0115] Exemplarily, as shown in FIG13 , the display device 100 is, for example, rectangular.

[0116] In another aspect, some embodiments of the present disclosure provide a method for manufacturing a display panel, which is used, for example, to manufacture the display panel 10 described in any of the above embodiments. FIG. 14 illustrates a flow chart of a method for manufacturing a display panel. It should be understood that the steps shown in FIG. 14 are not exclusive, and other steps may be performed before, after, or between any of the steps shown in FIG. 14. Furthermore, some of the steps may be performed simultaneously or in a different order than that shown in FIG. 14.

[0117] Illustratively, as shown in FIG14 , the preparation method includes: S100 to S700.

[0118] S100, as shown in FIG15a, provides a display substrate 1. The display substrate 1 has a display surface 1a, a non-display surface 1b, and a plurality of side surfaces 1c connecting the display surface 1a and the non-display surface 1b. At least one side surface 1c is a selected side surface 1c1. The display surface 1a has a first binding area B1 adjacent to the selected side surface 1c1.

[0119] Here, the structure of the display substrate 1 can refer to the description of the structure of the display substrate 1 in some of the above embodiments, and will not be described in detail here.

[0120] S200, as shown in FIG15b, a plurality of binding electrodes 2 are formed in the first binding area B1. The plurality of binding electrodes 2 are sequentially spaced apart along a first direction X, which is parallel to the selected side surface 1c1 to which the first binding area B1 is close.

[0121] Here, the specific arrangement of the plurality of binding electrodes 2 can refer to the description of the arrangement of the plurality of binding electrodes 2 in some of the above embodiments, and will not be described in detail here.

[0122] S300, as shown in FIG15c, provides a carrier substrate 5. The carrier substrate 5 has a carrier surface 51. The carrier surface 51 has a second binding area B2.

[0123] Here, the structure and materials of the carrier substrate 5 may refer to the description of the structure and materials of the carrier substrate 5 in some of the above embodiments, and will not be described in detail here.

[0124] S400, as shown in Figures 15d to 15g, a plurality of wires 3 are formed on the carrying surface 51. The plurality of wires 3 are sequentially arranged on the carrying surface 51 along the first direction X. One end of the plurality of wires 3 extends into the second binding area B2.

[0125] For example, the plurality of conductive lines 3 extend in a direction perpendicular to the first direction X.

[0126] Exemplarily, the method for forming the above-mentioned multiple wires 3 includes: as shown in Figure 15d, depositing metal material on the carrying surface 51 to form a metal film 3a; as shown in Figure 15e, then forming a photoresist layer PR on the metal film 3a, and setting a fourth mask plate M on the photoresist layer, and the material of the photoresist layer PR is, for example, positive photoresist; as shown in Figure 15f, exposing and developing the photoresist PR based on the fourth mask plate M to obtain a patterned photoresist layer PR; as shown in Figure 15g, etching the metal film 3a based on the patterned photoresist layer PR to obtain the above-mentioned multiple wires 3.

[0127] At step S500, as shown in FIG15h , a partition structure 6 is formed on the support surface 51 to cover a portion of the plurality of wires 3. The portion of the partition structure 6 extending into the second binding area B2 is defined by a plurality of partition slots 61. Each of the partition slots 61 exposes one end of the plurality of wires 3 extending into the second binding area B2. The orthographic projection of the top of each partition slot 61 on the support surface 51 is within the orthographic projection of the bottom wall of the partition slot 61 on the support surface 51.

[0128] The specific structure of the partition structure 6 can be found in the description of the partition structure 6 in the above embodiments, and will not be described in detail here. FIG15h(b) is a cross-sectional view of FIG15h(a) along the first direction X, and FIG15h(c) is a cross-sectional view of FIG15h(a) along the first direction Y.

[0129] S600, as shown in FIG15i, attaching the carrier substrate 5 onto the non-display surface 1b.

[0130] For example, the method for attaching the carrier substrate 5 to the non-display surface 1b is to apply adhesive to the surface of the carrier substrate 5 opposite the carrier surface 51 or the non-display surface 1b, and then attach the two together using the adhesive. The adhesive used here is, for example, high-temperature resistant, easy to cure, and has strong adhesion after bonding.

[0131] S700, combining Figures 15j, 15k, and 15l, to form a connection layer 4a. As shown in Figure 15l, the connection layer 4a includes a redundant portion 4aa and a plurality of connection lines 4. The redundant portion 4aa covers the portion of the partition structure 6 that extends into the second binding area B2. Each connection line 4 includes a first sub-portion 41, a second sub-portion 42, and a third sub-portion 43 that are connected in sequence. The first sub-portion 41 is located in the first binding area and contacts a binding electrode 2; the second sub-portion 42 is located on the selected side 1c1; and the third sub-portion 43 is located in the partition groove 61 and contacts the wire 3. The partition groove 61 separates the redundant portion 4aa from the wire 3.

[0132] The specific structure of the connecting layer 4a can be referred to the description of the structure of the connecting layer 4a in some of the above embodiments, and will not be described in detail here. FIG15j(b) is a cross-sectional view of FIG15j(a) along the first direction X, and FIG15l(b) is a cross-sectional view of FIG15l(a) along the first direction X.

[0133] Therefore, the method for preparing a display panel provided in the embodiment of the present disclosure forms a plurality of binding electrodes 2 in the first binding area B1 of the display substrate 1; then, a carrier substrate 5 is provided, and a plurality of wires 3 are formed on the carrier surface 51 of the carrier substrate 5; then, a partition structure 6 having a plurality of partition grooves 61 is formed on the carrier surface 51 of the carrier substrate 5, and the plurality of wires 3 located in the second binding area B2 of the carrier substrate 5 are exposed through the plurality of partition grooves 61; then, the carrier substrate 5 is attached to the non-display surface 1b of the display substrate 1, and finally, a connecting layer 4a is formed. Because the aforementioned plurality of conductive lines 3 are formed on the carrying surface 51 of the carrier substrate 5, rather than on the non-display surface 1b, and because of the provision of the partition structure 6, during the process of forming the connection layer 4a, the portion of the connection layer 4a located within the second binding area B2 can, based on the partitioning effect of the partition structure 6, be naturally partitioned into the redundant portion 4aa located on the partition structure 6 and the third sub-portion 43 of the connection line 4 that falls into the partition groove 61 and contacts the conductive lines 3 exposed by the partition groove 61. This means that, during the process of preparing the connection layer 4a connecting the display surface 1a of the display substrate 1 and the carrying surface 51 of the carrier substrate 5, the portion of the connection layer 4a located within the second binding area B2 does not need to undergo laser etching. Simply through the action of the partition structure 6, the redundant portion 4aa and the plurality of connection lines 4 with spaces therebetween can be formed, thereby achieving connection between the display surface 1a and the carrying surface 51. By adopting the above preparation method, it is possible to avoid using laser etching to process part of the connection layer 4a in the second binding area B2, thereby avoiding laser etching from causing damage or even destruction to the driving circuit layer 111 and devices in the display substrate 1, thereby improving the yield and reliability of the prepared display panel 10.

[0134] In some embodiments, in the above S700 , forming the connection layer 4 a includes: S710 to S720 .

[0135] S710, as shown in Figure 15j, a connecting film 4b is formed in the first binding area B1, on the selected side surface 1c1, and in the second binding area B2. The portion of the connecting film 4b located in the second binding area B2 is partitioned by a plurality of partitioning grooves 61, forming a redundant portion 4aa and a plurality of third sub-portions 43.

[0136] For example, as shown in (a) of FIG15j , the embodiment of the present disclosure can use a metal sputtering process to form the connecting film 4b. The material of the connecting film 4b includes a metal material. During the sputtering of the metal material, as shown in (b) of FIG15j , due to the partitioning effect of the partition structure 6, part of the metal material is sputtered onto the surface of the side of the partition structure 6 away from the carrier substrate 5, forming the redundant portion 4aa; part of the metal material is naturally sputtered into the partition groove 61, forming the third sub-portion 43. No metal material is sputtered on the side wall of the partition groove 61, so that the redundant portion 4aa and the third sub-portion 43 are naturally separated.

[0137] S720, in combination with Figure 15k and Figure 15l, a laser etching process (Laser) is used to etch the portion of the connecting film 4b located on the selected side 1c1 and within the first binding area B1, forming a second sub-section 42 and a first sub-section 41 that are sequentially connected to each third sub-section 43, and obtaining multiple connecting lines 4.

[0138] In the process of forming the above-mentioned multiple connecting lines 4, due to the setting of the partition structure 6, there is no need to use a laser etching process to etch the third sub-portion 43 of the connecting line 4, thereby reducing the impact of laser etching on the driving circuit layer 111 and devices in the display substrate 1, and avoiding laser etching damage or even destruction of the driving circuit layer 111 and devices in the display substrate 1.

[0139] The partition structure 6 can be of various types. Correspondingly, in step S500 , there are various methods for forming the partition structure 6 . Two methods for forming the partition structure 6 are schematically described below with reference to the accompanying drawings.

[0140] In a possible embodiment, the partition structure 6 is formed of a single-layer film.

[0141] Based on this, in some examples, in the above S500 , forming the partition structure 6 covering a portion of the plurality of conductive lines 3 on the bearing surface 51 includes: S510 a to S520 a .

[0142] S510, as shown in FIG16a, a first partition film 6a is formed on the carrying surface 51. The first partition film 6a covers the plurality of wires 3, and a portion of the first partition film 6a extends into the second binding area B2.

[0143] For example, the embodiment of the present disclosure can form the first partition film 6a on the bearing surface 51 through a coating process. The first partition film 6a is provided as a whole layer, covering at least a portion of the bearing surface 51 and forming a relatively complete coverage for the plurality of wires 3.

[0144] S520 , as shown in FIG16 b , the portion of the first partition film 6 a extending into the second binding area B2 is etched to form the partition groove 61 .

[0145] Here, the cross-sectional shape of the partition groove 61 is, for example, an inverted trapezoid, and the cross-sectional shape is parallel to the selected side surface 1c1.

[0146] Through the above S510 and S520 , the first partition film 6 a is formed on the carrying surface 51 , and the first partition film 6 a is then etched to form the partition groove 61 . The process steps are simple, which is beneficial to improving the manufacturing efficiency of the display panel 10 .

[0147] In some embodiments, the material of the first partition film 6a comprises a negative photoresist. In this case, in the above S520, etching the portion of the first partition film 6a extending into the second binding area B2 includes: S521a to S522a.

[0148] S521a, as shown in FIG17a, a first mask plate 8 is placed on the first partition film 6a. The first mask plate 8 has a plurality of third openings K3 located in the second binding area B2. The plurality of third openings K3 at least expose the portion of the first partition film 6a between two adjacent wires 3.

[0149] The plurality of third openings K3 are, for example, in the shape of elongated strips. The plurality of openings K3 extend in a direction perpendicular to the first direction X and are spaced apart along the first direction X. The first mask 8 covers at least the portion of each wire 3 located in the second binding area B2, thereby covering the portion of the first blocking film 6a located above the portion of the wire 3.

[0150] S522a, in combination with FIG. 17b , FIG. 16b and FIG. 15h (a), based on the first mask plate 8, the portion of the first partition film 6a extending into the second binding area B2 is exposed, developed, and removed to form the above-mentioned multiple partition grooves 61.

[0151] Specifically, after the portion of the first partition film 6a extending into the second binding area B2 is exposed based on the first mask plate 8, since the material of the first partition film 6a is a negative photoresist, the portion of the first partition film 6a exposed by the above-mentioned multiple third openings K3 will undergo a photocuring reaction; and the portion of the first partition film 6a covered by the first mask plate 8 will be removed by the developer, and the area occupied by the removed portion of the first partition film 6a corresponds to a plurality of partition grooves 61.

[0152] Based on the characteristics of exposure, the cross-sectional shape of the removed portion of the first barrier film 6 a is a regular trapezoid.

[0153] The first partition film 6 a is formed using a negative photoresist, so that the first partition film 6 a can be developed, exposed, and removed to form a plurality of partition grooves 61 . The process steps are simple, and the shape and size of the partition grooves 61 can be easily controlled.

[0154] In some embodiments, as shown in FIG15h(a) and FIG15h(c), the support surface 51 further includes a third binding area B3, which is spaced apart from the second binding area B2. In other words, the third binding area B3 is further away from the selected side surface 1c1 than the second binding area B2.

[0155] In S520 , while etching the portion of the first barrier film 6 a extending into the second binding region B2 , the portion of the first barrier film 6 a located within the third binding region B3 is also etched to form a plurality of first openings K1 . The plurality of first openings K1 respectively expose portions of the plurality of wires 3 located within the third binding region B3 to serve as a plurality of binding pins 31 .

[0156] Here, the structure and arrangement of the plurality of first openings K1 may refer to the description of the structure and arrangement of the plurality of first openings K1 in some of the above embodiments, and will not be described in detail here.

[0157] In the embodiment of the present application, a plurality of partition grooves 61 and a plurality of first openings K1 are simultaneously formed in one etching process, which is beneficial for simplifying the manufacturing process of the display panel 10 and improving the manufacturing efficiency of the display panel 10 .

[0158] In another possible embodiment, the partition structure 6 is formed by stacking multiple films.

[0159] Based on this, in some examples, in the above S500 , forming the partition structure 6 covering a portion of the plurality of conductive lines 3 on the bearing surface 51 includes: S510 b to S550 b .

[0160] S510b, as shown in FIG18a, a second partition film 6b is formed on the carrying surface 51. The second partition film 6b covers the plurality of wires 3, and a portion of the second partition film 6b extends into the second binding area B2.

[0161] For example, the embodiment of the present disclosure can form the second partition film 6b on the bearing surface 51 through a coating process. The second partition film 6b is provided as a whole layer, covers at least a portion of the bearing surface 51, and forms a relatively complete coverage for the plurality of wires 3.

[0162] S520b, as shown in FIG. 18b and FIG. 18c, the portion of the second partition film 6b extending into the second binding area B2 is etched to expose ends of the plurality of wires 3 extending into the second binding area B2.

[0163] Exemplarily, the material of the second partition film 6b includes positive photoresist. A method for etching the portion of the second partition film 6b extending into the second binding region B2 includes, for example, the following: as shown in FIG18b , a second mask plate 9 is disposed above the second partition film 6b, the second mask plate 9 having a plurality of fourth openings K4 located within the second binding region B2, the plurality of fourth openings K4 exposing at least the portion of the second partition film 6b corresponding to the plurality of wires 3; in conjunction with FIG18b and FIG18c , the second partition film 6b is exposed, developed, and removed using the second mask plate 9, thereby removing the portion of the second partition film 6b corresponding to the plurality of wires 3 and exposing one end of the plurality of wires 3 extending into the second binding region B2.

[0164] Of course, the second partition film 6b may also be made of other insulating materials.

[0165] S530b, as shown in FIG18d, a third partition film 6c is formed to cover the second partition film 6b and the plurality of conductive lines 3.

[0166] For example, the material of the third partition film 6c includes silicon nitride. In the embodiment of the present disclosure, for example, a deposition process is used to form the third partition film 6c.

[0167] S540b, as shown in FIG. 18e and FIG. 18f, the portion of the third partition film 6c extending into the second binding area B2 is etched to expose ends of the plurality of wires 3 extending into the second binding area B2.

[0168] Exemplarily, the method for etching the third partition film 6c is as follows: as shown in Figure 18e, a positive photoresist is coated on the third partition film 6c to form a photoresist layer; then a third mask plate is set on the photoresist layer, and the third mask plate has a plurality of fifth openings K5 located in the second binding area B2, and the plurality of fifth openings K5 at least expose the portion of the photoresist layer corresponding to the plurality of wires 3; in combination with Figure 18e and Figure 18f, the photoresist layer is exposed, developed, and removed based on the third mask plate to obtain a patterned photoresist layer; then, using the patterned photoresist layer as a mask, the portion of the third partition film 6c corresponding to the plurality of wires 3 is etched, so that one end of the plurality of wires 3 extending into the second binding area B2 is exposed, and an isolation layer 64 is obtained.

[0169] Optionally, the third mask plate 14 is the same mask plate as the second mask plate 9. This helps to reduce the number of mask plates and lower costs.

[0170] S550b, as shown in FIG. 18g and FIG. 18h, based on the etched third partition film (ie, the partition layer 64), the second partition film 6b is etched to form a partition groove 61.

[0171] Here, the second partition film 6b is etched by, for example, plasma etching. The cross-sectional shape of the partition groove 61 is similar to a "convex" shape.

[0172] Through S510b to S550b, another partition structure 6 having partition grooves 61 can be formed in the second binding area B2, so that multiple wires 3 can fall into the multiple partition grooves 61 respectively, facilitating the subsequent connection of the connecting wires 4.

[0173] In some embodiments, the support surface 51 further includes a third binding area B3, which is spaced apart from the second binding area B2. That is, the third binding area B3 is further away from the selected side surface 1c1 than the second binding area B2. The second partition film 6b is located outside the second binding area B2.

[0174] In this case, in S550b, while etching the portion of the third barrier film 6c extending into the second binding region B2, the portion of the third barrier film 6c located within the third binding region B3 is also etched to form a plurality of second openings K2. The plurality of second openings K2 respectively expose the portions of the plurality of wires 3 located within the third binding region B3 to serve as a plurality of binding pins 31.

[0175] The structure and arrangement of the plurality of second openings K2 here can refer to the description of the structure and arrangement of the plurality of second openings K2 in some of the above embodiments, and will not be described in detail here.

[0176] In the embodiment of the present application, a plurality of partition grooves 61 and a plurality of second openings K2 are simultaneously formed in one etching process, which is beneficial for simplifying the manufacturing process of the display panel 10 and improving the manufacturing efficiency of the display panel 10 .

[0177] Optionally, in the above S520b, during the process of etching the portion of the second partition film 6b extending into the second binding area B2, the portion of the second partition film 6b extending into the third binding area B3 may also be removed simultaneously.

[0178] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display panel, comprising: A display substrate having opposite display surface, non-display surface, and a plurality of side surfaces connecting the display surface and the non-display surface, wherein at least one side surface is a selected side surface; the display surface has a first bonding region near the selected side surface; A plurality of bonding electrodes arranged at intervals in sequence in the first direction in the first bonding region; the first direction is parallel to the selected side surface close to the first bonding region; A carrier substrate attached to the non-display surface; a surface of the carrier substrate away from the display substrate is a carrier surface, and the carrier surface has a second bonding region near the selected side surface; A plurality of wires arranged at intervals in sequence in the first direction on the carrier surface; one ends of the plurality of wires extend into the second bonding region; A partition structure located on the carrier surface and covering a part of the plurality of wires; a plurality of partition slots are formed in a part of the partition structure extending into the second bonding region, and one ends of the plurality of wires extending into the second bonding region are respectively exposed by the plurality of partition slots; a positive projection of the top end of each partition slot on the carrier surface is within a positive projection range of the bottom wall of the partition slot on the carrier surface; A connection layer including a redundant portion and a plurality of connection lines; the redundant portion covers a part of the partition structure extending into the second bonding region; each connection line includes a first sub-portion, a second sub-portion, and a third sub-portion connected in sequence, the first sub-portion is located in the first bonding region and is in contact with a bonding electrode, the second sub-portion is located on the selected side surface, and the third sub-portion is located in the partition slot and is in contact with the wire; the partition slot separates the redundant portion and the wire.

2. The display panel according to claim 1, wherein, The partition structure is integrally formed.

3. The display panel according to claim 2, wherein, The cross-sectional shape of the partition slot includes a regular trapezoid; the cross-section is parallel to the selected side surface.

4. The display panel according to claim 2 or 3, wherein, The material of the partition structure includes a negative photoresist.

5. The display panel according to any one of claims 2 to 4, wherein, The carrier surface further has a third bonding region, and the third bonding region is spaced from the second bonding region; A plurality of first openings are formed in a part of the partition structure located in the third bonding region, and parts of the plurality of wires located in the third bonding region are respectively exposed by the plurality of first openings to serve as a plurality of bonding pins; The display panel further includes: a circuit board electrically connected to the plurality of bonding pins.

6. The display panel according to claim 5, wherein, The cross-sectional shape of the plurality of first openings is the same as the cross-sectional shape of the partition slot.

7. The display panel according to claim 1, wherein, The partition structure includes a support layer and a partition layer, and the partition layer is located on a side of the support layer away from the carrier surface; A positive projection of a part of the support layer extending into the second bonding region on the carrier surface is within a positive projection range of a part of the partition layer extending into the second bonding region on the carrier surface.

8. The display panel according to claim 7, wherein, The cross-sectional shape of the partition slot includes an inverted T shape; the cross-section is parallel to the selected side surface.

9. The display panel according to claim 7 or 8, wherein, The material of the support layer includes a positive photoresist; and / or, the material of the partition layer includes an inorganic material.

10. The display panel according to any one of claims 7 to 9, wherein, The carrier surface further has a third bonding region, and the third bonding region is spaced from the second bonding region; The support layer is located outside the third bonding region. Multiple second openings are formed in the portion of the partition layer located within the third bonding region, and the portions of the multiple wires located within the third bonding region are respectively exposed through the multiple second openings to serve as multiple bonding pins. The display panel further includes: a circuit board electrically connected to the multiple bonding pins.

11. The display panel according to any one of claims 1 to 10, wherein, One side surface of the carrier substrate covering the second sub - portion is flush with the selected side surface.

12. A display device, including the display panel according to any one of claims 1 - 11.

13. A tiled display device, including multiple display devices according to claim 12.

14. A method for manufacturing a display panel, including: Providing a display substrate; The display substrate has an opposite display surface, a non - display surface, and multiple side surfaces connecting the display surface and the non - display surface, where at least one side surface is a selected side surface; the display surface has a first bonding region adjacent to the selected side surface. Forming multiple bonding electrodes within the first bonding region; the multiple bonding electrodes are arranged at intervals in a first direction in sequence, and the first direction is parallel to the selected side surface adjacent to the first bonding region. Providing a carrier substrate; the carrier substrate has a bearing surface, and the bearing surface has a second bonding region. Forming multiple wires on the bearing surface; the multiple wires are arranged at intervals in the first direction on the bearing surface, and one end of each of the multiple wires extends into the second bonding region. Forming a partition structure covering a part of the multiple wires on the bearing surface; multiple partition grooves are formed in the portion of the partition structure extending into the second bonding region, and the ends of the multiple wires extending into the second bonding region are respectively exposed through the multiple partition grooves; the orthographic projection of the top end of each partition groove on the bearing surface is within the orthographic projection range of the bottom wall of the partition groove on the bearing surface. Attaching the carrier substrate to the non - display surface. Forming a connection layer; the connection layer includes a redundant portion and multiple connection lines; the redundant portion covers the portion of the partition structure extending into the second bonding region; each connection line includes a first sub - portion, a second sub - portion, and a third sub - portion connected in sequence, the first sub - portion is located within the first bonding region and is in contact with a bonding electrode, the second sub - portion is located on the selected side surface, and the third sub - portion is located within the partition groove and is in contact with the wire; the partition groove separates the redundant portion and the wire.

15. The preparation method according to claim 14, wherein The forming a partition structure covering a part of the multiple wires on the bearing surface includes: Forming a first partition film on the bearing surface; the partition film covers the multiple wires, and a part of the partition film extends into the second bonding region. Etching the portion of the first partition film extending into the second bonding region to form the partition groove.

16. The preparation method according to claim 15, wherein, The material of the first partition film includes a negative photoresist. The etching the portion of the first partition film extending into the second bonding region includes: A first mask plate is disposed on the first partition film; the first mask plate has a plurality of third openings located in the second bonding area, and the plurality of third openings at least expose a portion of the partition film between adjacent two wires. Based on the first mask plate, the portion of the first partition film extending into the second bonding area is exposed, developed, and removed to form the plurality of partition grooves.

17. The preparation method according to claim 15 or 16, wherein, The bearing surface further has a third bonding area, and the third bonding area is spaced apart from the second bonding area. During the etching of the portion of the first partition film extending into the second bonding area, the portion of the first partition film located in the third bonding area is also etched to form a plurality of first openings; the plurality of first openings respectively expose the portions of the plurality of wires located in the third bonding area to serve as a plurality of bonding pins.

18. The preparation method according to claim 14, wherein The forming of the partition structure covering a part of the plurality of wires on the bearing surface includes: A second partition film is formed on the bearing surface; the second partition film covers the plurality of wires, and a part of the second partition film extends into the second bonding area. The portion of the second partition film extending into the second bonding area is etched to expose one end of the plurality of wires extending into the second bonding area. A third partition film covering the second partition film and the plurality of wires is formed. The portion of the third partition film extending into the second bonding area is etched to expose one end of the plurality of wires extending into the second bonding area. Based on the etched third partition film, the second partition film is etched to form the partition grooves.

19. The preparation method according to claim 18, wherein, The bearing surface further has a third bonding area, and the third bonding area is spaced apart from the second bonding area; the second partition film is located outside the second bonding area. During the etching of the portion of the third partition film extending into the second bonding area, the portion of the third partition film located in the third bonding area is also etched to form a plurality of second openings; the plurality of second openings respectively expose the portions of the plurality of wires located in the third bonding area to serve as a plurality of bonding pins.

20. The preparation method according to any one of claims 11 to 19, wherein The forming of the connection layer includes: A connection film is formed in the first bonding area, on the selected side surface, and in the second bonding area; the portion of the connection film located in the second bonding area is partitioned by the plurality of partition grooves to form the redundant portion and the plurality of third sub-portions. Using a laser etching process, the portion of the connection film located on the selected side surface and in the first bonding area is etched to form the second sub-portion and the first sub-portion sequentially connected to each of the third sub-portions, obtaining a plurality of the connection lines.

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