Chassis and computing device

Abstract

The present application relates to the technical field of chassis, and provides a chassis and a computing device. The chassis comprises: a main chassis body; and an interface baffle arranged inside the main chassis body, the interface baffle dividing the interior of the main chassis body into a main cavity and a wire cavity, the interface baffle being provided with a plurality of terminal ports, and the main cavity being communicated with the wire cavity by means of the terminal ports; wherein the main chassis body is provided with a wire outlet communicated with the wire cavity. The computing device comprises the main chassis body in the foregoing solution and a motherboard module, wherein the motherboard module is arranged in the main cavity. According to the chassis and the computing device, the main chassis body of the chassis is divided into the main cavity and the wire cavity by means of the interface board, the main cavity is used for accommodating main functional modules such as a motherboard, and the wire cavity is used for accommodating wires. In this way, plugs of the external wires can be hidden in the wire cavity, the plugs of the external wires cannot be seen from the appearance of the chassis, and the wire cavity can achieve a certain wire management function.

Description

Chassis and computing device

[0001] Description This application claims priority to the Chinese patent application filed with the China Patent Office on January 23, 2024, with application number 202420172507.4 and invention name “A chassis and computing device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of chassis, and in particular to a chassis and a computer. Background Art

[0003] In the related art, a computer chassis, such as an industrial computer, has one side of its chassis used as an I / O panel. The I / O panel has multiple sockets that expose the terminals inside the chassis. External device connectors are plugged into the I / O panel sockets to connect the external device terminals to the computer terminals, thereby achieving docking between the external device and the computer. However, when a computer is connected to multiple external devices, the I / O panel has multiple plugs of varying sizes and shapes, which can create a cluttered appearance. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a chassis and a computing device that have both the function of hiding external wiring plugs and the function of wire management.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A chassis, comprising:

[0007] main box;

[0008] The interface baffle is provided inside the main box; the interface baffle divides the interior of the main box into a main cavity and a wire cavity; the interface baffle is provided with a plurality of terminal ports, and the main cavity and the wire cavity are connected through the terminal ports;

[0009] The main case is equipped with a cable outlet that is connected to the cable cavity. The chassis integrates the main cavity for accommodating the motherboard module and the cable cavity for accommodating the cables, which can hide the external cable plugs and also has a cable management function.

[0010] Optionally, the main housing includes a wire outlet plate with a plurality of wire outlets; the interface baffle and the wire outlet plate are located on opposite sides of the wire cavity. Wires are routed through the wire outlet plate on the side opposite the interface baffle, ensuring smooth, unbending wires and protecting the wires.

[0011] Optionally, the main box body includes a top shell, a first lower cover, and a second lower cover; the top shell includes a top plate and side plates surrounding the sides of the top plate; the top plate and the side plates are combined to form a receiving groove, and the interface baffle is arranged in the receiving groove;

[0012] The first lower cover connects to the top case, with the main cavity formed between the top case, the interface baffle, and the first lower cover. The second lower cover connects to the top case, with the cable cavity formed between the top case, the interface baffle, and the second lower cover. The chassis adopts a flip-up stacking configuration, which ensures a well-organized appearance after assembly.

[0013] Optionally, the chassis includes a bottom support member, with bottom supports provided on both the side of the first lower cover facing away from the top plate and the side of the second lower cover facing away from the top plate. The first lower cover is provided with a first heat dissipation vent communicating with the main cavity, and the side panel is provided with a second heat dissipation vent communicating with the main cavity. The first heat dissipation vent is for air intake, and the second heat dissipation vent is for air exhaust. Hot air flowing out of the second heat dissipation vent is not easily re-inhaled into the chassis, thereby improving heat dissipation efficiency.

[0014] Optionally, the interface baffle divides the accommodating groove into a first groove portion and a second groove portion;

[0015] The chassis consists of a sheet metal top cover and a sheet metal bottom cover. The sheet metal top cover is embedded in the inner wall of the first groove, while the sheet metal bottom cover covers the notch of the first groove. The first bottom cover covers the side of the sheet metal bottom cover facing away from the first groove. The main body is made of plastic. The core area of ​​the chassis is covered with plastic, which combines aesthetics with a pleasant touch and high structural reliability.

[0016] Optionally, the sheet metal top cover or top shell is provided with a first connecting portion, the sheet metal lower cover is provided with a second connecting portion, the second connecting portion is slidably connected to the first connecting portion, and the sheet metal lower cover is connected to the sheet metal top cover or the top shell via fasteners;

[0017] The first lower cover is connected to the sheet metal lower cover through fasteners.

[0018] Optionally, one side of the second lower cover can be flipped and engaged with the interface baffle; the second lower cover is buckled and connected to the main box body.

[0019] Optionally, the interface baffle is provided with a plurality of mutually spaced slots, and one side of the second lower cover is provided with a plurality of mutually spaced first hooks, the first hooks are L-shaped hooks, and the first hooks are engaged with the slots.

[0020] A computing device comprising:

[0021] A chassis as described in the above solution;

[0022] The mainboard module is arranged in the main cavity.

[0023] Optionally, a wire clamp seat is included, the wire clamp seat is arranged in the wire cavity, and the wire clamp seat is connected to the main box; the wire clamp seat is provided with a plurality of wire clamping holes, and the wire clamping holes are used for the wires to pass through;

[0024] The wire clamp seat includes a first clamp seat and a second clamp seat, the first clamp seat and the second clamp seat are detachably connected, and the wire clamp hole is formed between the first clamp seat and the second clamp seat. The computing device has a reliable wire pulling prevention function, and the plug is not easy to loosen.

[0025] Optionally, a hand screw is included; the first clamping base is mounted on the main box body, and the second clamping base is connected to the first clamping base via the hand screw. In this way, the second clamping base can be quickly installed and removed from the first clamping base, making it convenient to quickly clamp and remove the wires.

[0026] The beneficial effects of this application are as follows: the chassis and computing device are divided into a main cavity and a wire cavity by the main body of the interface board chassis. The main cavity is used to accommodate main functional modules such as the motherboard, and the wire cavity is used to accommodate wires. In this way, the plug of the external wire can be hidden in the wire cavity, and the external wire plug cannot be seen from the outside of the chassis. The wire cavity can also play a certain role in wire management. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present application is further described in detail below with reference to the accompanying drawings and examples.

[0028] FIG1 is an exploded view of the structure of a computing device according to an embodiment of the present application;

[0029] FIG2 is a schematic diagram of the overall structure of the computing device according to an embodiment of the present application;

[0030] FIG3 is an enlarged view of portion A in FIG2 ;

[0031] FIG4 is a schematic diagram of the structure of the chassis according to an embodiment of the present application (the sheet metal top cover and sheet metal bottom cover are not shown in the figure);

[0032] FIG5 is a diagram showing an assembly process of a computing device according to an embodiment of the present application;

[0033] FIG6 is a second diagram of the assembly process of the computing device according to an embodiment of the present application;

[0034] FIG7 is an enlarged view of portion B in FIG6 ;

[0035] FIG8 is a third diagram of the assembly process of the computing device according to an embodiment of the present application;

[0036] FIG9 is an enlarged view of portion C in FIG8 ;

[0037] FIG10 is a fourth diagram of the assembly process of the computing device according to an embodiment of the present application;

[0038] FIG11 is a fifth diagram of the assembly process of the computing device according to an embodiment of the present application;

[0039] FIG12 is an enlarged view of portion D in FIG11 ;

[0040] FIG13 is an enlarged view of portion F in FIG11 .

[0041] In the figure: 10. Main box body; 101. Main cavity; 102. Wire cavity; 103. First slot; 104. Second slot; 11. Top shell; 112. Side panel; 1121. Second heat dissipation vent; 1122. First buckle; 113. Wire outlet plate; 1131. Wire outlet; 12. First lower cover; 121. First heat dissipation vent; 13. Second lower cover; 131. First hook; 132. Second buckle; 14. Bottom support member; 20. Interface baffle; 21. Terminal port; 22. Buckle; 31. Sheet metal top cover; 311. First connecting part; 32. Sheet metal lower cover; 321. Second connecting part; 40. Motherboard module; 41. Connecting terminal; 50. Wire clamp seat; 51. First clamp seat; 52. Second clamp seat; 501. Wire hole; 80. Thumb screw; 90. Fastener DETAILED DESCRIPTION

[0042] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of this application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0043] In the description of this application, unless otherwise specified or limited, the terms "connected" and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0044] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0045] In the related art, the IO panel of the chassis of the computing device provides a location for external wiring material plugs, but there are the following problems: First, it does not have the function of hiding the external wiring material plugs at the IO panel. When the computing device is in use, the plugs are of different sizes and lengths, which will be messy and affect the appearance; Second, it does not have a wire management function, or has a wire management function but directly adds a wire management function module outside the chassis body, resulting in poor product integrity.

[0046] Taking the chassis of a mini-computer as an example, a mini-computer has its main modules directly installed inside the chassis. One of the chassis' panels serves as an I / O panel, with multiple sockets exposing the internal terminals. By plugging the connectors of external devices into the sockets on the IO panel, the external device terminals can be connected to the computer terminals, thereby achieving docking between the external device and the computer. However, when a computer is connected to multiple external devices, the IO panel has multiple plugs of inconsistent sizes and shapes, which can appear cluttered. Furthermore, the chassis of a mini-computer only has the functional components of the PC itself and lacks cable management capabilities.

[0047] Among them, mini computing devices are also called micro PCs, microcomputers, microcomputers, mini computers, etc.; IO panel refers to the input and output interface panel.

[0048] Based on this, the present application provides a chassis that serves as the housing for a computing device. The chassis incorporates an interface board within the main housing, which divides the main housing into two chambers: a main cavity and a wire cavity. The main cavity is used to house the motherboard and other major functional modules, while the wire cavity is used to house wires. This allows external wiring plugs to be hidden within the wire cavity, making them invisible from the outside of the chassis. The wire cavity also serves a specific wire management function, and the main housing's wire outlet has a wire limiter function to prevent wires from loosening.

[0049] The present application also provides a computing device comprising the aforementioned chassis. While maintaining the core functions of a conventional PC, the computing device also features shielding and concealing peripheral cable plugs, as well as cable management, without disrupting the overall chassis design. The computing device of the present application may be, but is not limited to, a microcomputer, such as an industrial computer.

[0050] 1 to 13 , the structure of the chassis and the computing device will be described below.

[0051] The computing device includes a chassis and a motherboard module 40 .

[0052] The chassis includes a main housing 10 and an interface baffle 20. The interface baffle 20 is located inside the main housing 10 and divides the interior of the main housing 10 into two chambers: a main chamber 101 and a cable chamber 102. The main chamber 101 is used to accommodate the computing device's main functional modules, such as the motherboard module 40, while the cable chamber 102 is used to accommodate external cables. In this embodiment, the main chamber 101 is larger than the cable chamber 102. In other embodiments, the position of the interface baffle 20 can be adjusted to adjust the size of the two chambers according to actual needs.

[0053] The motherboard module 40 is installed in the main cavity 101. A plurality of connection terminals 41 are provided on the motherboard module 40. The connection terminals 41 may be, but are not limited to, HDMI terminals, VGA terminals, serial ports, LAN ports, and the like.

[0054] The interface baffle 20 is provided with a plurality of terminal openings 21. The size, shape, and position of the plurality of terminal openings 21 correspond to the plurality of connection terminals 41 on the mainboard module 40. The connection terminals 41 of the mainboard module 40 are exposed through the terminal openings 21 on the interface baffle 20, so as to facilitate the connection of external wire plugs with the corresponding connection terminals 41. In other words, the terminal openings 21 of the interface baffle 20 connect the main cavity 101 with the wire cavity 102. In order to allow external wires to enter the wire cavity 102 of the main housing 10, the main housing 10 is also provided with a wire outlet 1131 connected to the wire cavity 102. The wire outlet 1131 is located on one side wall of the wire cavity 102.

[0055] When the computing device is connected to an external device, for example, when the computing device is connected to a display screen, one end of the external connection line with a connector is extended into the wire cavity 102 of the chassis through the chassis outlet 1131, and the connector of the connection line is inserted into the terminal port 21 corresponding to the interface baffle 20, so that the plug of the connection line is plugged into the connection terminal 41 corresponding to the mainboard module 40. In this way, when there are multiple external wiring materials, the plugs of the multiple external wiring materials are respectively inserted into different positions of the interface baffle 20, and the plugs can be hidden in the wire cavity 102. The main case 10 can play the role of shielding multiple plugs in the wire cavity 102, and the integrity is good. In addition, the external wiring materials are limited by the outlet 1131, and the chassis has a certain wire management function. There is no need to add an independent wire management module outside the chassis, and the integrity is good.

[0056] The chassis and computing equipment of the present application, while taking into account the core functions of a conventional PC, also have the functions of shielding and hiding peripheral wire plugs and wire management functions, and have strong integrity.

[0057] 1 to 5 , the main housing 10 is provided with a plurality of wire outlets 1131 , which are used to allow multiple wires to pass through, thereby organizing the wires and preventing them from getting tangled. In other embodiments, the main housing 10 may also be provided with only one wire outlet 1131 .

[0058] Continuing with Figures 1 to 5 , the main housing 10 includes a cable outlet plate 113 , with a cable outlet 1131 disposed therein. The interface baffle 20 and cable outlet plate 113 are located on opposite sides of the cable cavity 102 , thereby reducing bending and protecting the cables. In other embodiments, the cable outlet 1131 may also be located on a side adjacent to the interface baffle 20 .

[0059] Referring to Figures 1, 3, 5, 6, and 8, in order to provide a better wire management function, the computing device also includes a wire clamp seat 50, which is used to provide a certain limit to the wire so that the wire is not easily pulled loose. The wire clamp seat 50 is arranged in the wire cavity, and the wire clamp seat 50 is provided with a plurality of wire clamping holes, which are used to clamp the wires. The wire clamp seat 50 includes a first clamp seat 51 and a second clamp seat 52, and the first clamp seat 51 and the second clamp seat 52 are detachably connected, and the wire clamping hole is formed between the first clamp seat 51 and the second clamp seat 52. Referring to Figures 1 and 3, the first clamp seat 51 is provided with a plurality of first clamping grooves, and the second clamp seat 52 is provided with a plurality of second clamping grooves. The second clamp seat 52 and the first clamp seat 51 have a closed state (as shown in Figure 3) and an open state (as shown in Figure 1), and when in the closed state. The second clamp seat 52 is connected to the first clamp seat 51, and a plurality of first clamping grooves correspond to a plurality of second clamping grooves, and the first clamping grooves and the second clamping grooves form a wire clamping hole.

[0060] Based on the setting of the wire clamp seat 50, when the computing device is connected to an external wire, the plug of the external wire is inserted into the terminal port 21 of the interface baffle 20, and the wire extends outward from the plug, passes through the wire clamping hole of the wire clamp seat 50, and then passes through the wire outlet 1131 of the main box body 10 to extend out of the wire cavity 102 of the main box body 10. In this way, the wire clamp seat 50 applies a certain clamping force to the wire. When the external wire is subjected to accidental pulling external force, the plug is not easy to loosen, thereby ensuring the reliable connection between the external wire and the motherboard module 40.

[0061] In one embodiment, the first clamping seat 51 is connected to the main housing 10 by fastening with fasteners 90, snap-fitting, welding, hot-melt fixing, integral molding, etc., and the second clamping seat 52 is detachably connected to the first clamping seat 51 by fastening with fasteners 90, snap-fitting, etc. For example, when wiring, first insert the plug of the external wire into the wire cavity 102, insert the plug into the corresponding terminal port 21, then open the second clamping seat 52 from the first clamping seat 51, put the wire in the wire cavity 102 into the first clamping groove, then cover the second clamping seat 52 on the first clamping seat 51, and then lock the two clamping seats to clamp the wire in the wire hole 501, and the wire passes through the outlet 1131 and extends out of the chassis.

[0062] In one embodiment, a thumb screw 80 is included. The first clamping base 51 is mounted on the main housing 10, and the second clamping base 52 is connected to the first clamping base 51 via the thumb screw 80. The thumb screw 80, also known as a thumb screw, has a head portion that provides a user with a convenient grip for rotation, thereby facilitating manual tightening or removal of the second clamping base 52, making cable clamping more convenient and quicker.

[0063] Referring to Figure 1 , the chassis is configured in an inverted stacking configuration to provide a clean, streamlined appearance on the largest visible front surface of the chassis. The main housing 10 includes a top shell 11, a first lower cover 12, and a second lower cover 13. The top shell 11 includes a top plate and side panels 112 surrounding the sides of the top plate. The top plate and side panels 112 together form a receiving slot with an opening at the bottom. An interface baffle 20 is disposed within the receiving slot, dividing the receiving slot into a first slot portion 103 and a second slot portion 104. Continuing with Figure 1 , the first lower cover 12 is disposed below the first slot portion 103 and is connected to the top shell 11. The main cavity 101 is formed between the top shell 11, the interface baffle 20, and the first lower cover 12. The second lower cover 13 is disposed below the second slot portion 104 and is connected to the top shell 11. The wire cavity 102 is formed between the top shell 11, the interface baffle 20, and the second lower cover 13. In this way, during assembly, the top shell 11 can be turned upside down first, the mainboard module 40 and the like can be installed into the main cavity 101, and then the first lower cover 12 and the second lower cover 13 can be locked respectively. After the assembly is completed, the entire computing device can be turned over so that the first lower cover 12 and the second lower cover 13 are facing downward. In this way, the first lower cover 12 and the second lower cover 13 are not visible from the outside, nor are the fastening components used to fasten the sheet metal lower cover 32, the first lower cover 12, and the second lower cover 13. The top shell 11 visible from the outside is an integrally formed structure with good structural integrity.

[0064] Taking the computing device as a mini computing device, and the computing device as a PC host for an interactive tablet as an example, the computing device of the present application can be mounted on the back of the interactive tablet. When mounted, the first lower cover 12 and the second lower cover 13 of the computing device face the back panel or rear shell of the interactive tablet. In this way, the computing device has a strong overall appearance. In other embodiments, the computing device can also be used as a projector host or other device host that can be placed on a desktop for use, with the first lower cover 12 and the second lower cover 13 of the computing device facing the desktop. In this way, the computing device has a strong overall appearance.

[0065] In the related art, the heat dissipation design of the chassis is unreasonable, and the heat dissipation efficiency of the mainboard module in the main cavity 101 is low.

[0066] In the present application, referring to Figures 1 and 2, a first heat dissipation vent 121 is provided on the side of the first lower cover 12 facing away from the top plate, and second heat dissipation vents 1121 are provided on the plurality of side panels 112. Furthermore, the chassis includes a bottom support member 14, with bottom supports 14 provided on both the side of the first lower cover 12 facing away from the top plate and the side of the second lower cover 13 facing away from the top plate. Thus, when the computing device is placed on a flat surface, the bottom support member 14 contacts the placement surface, and a certain gap exists between the first lower cover 12 and the second lower cover 13 and the flat surface. When the computing device is in operation, heat is primarily generated by the motherboard module 40 within the main cavity 101. Low-temperature gas is drawn in through the first heat dissipation vent 121 at the bottom. The low-temperature gas passes through the heat source components within the main cavity 101 and removes the heat from the components. The heated gas is then discharged from the second heat dissipation vent 1121 on the side and rises and diffuses into the surrounding environment. Since hot air tends to rise, and the air inlet is located at the bottom of the first lower cover 12, this design prevents the heated gas from being re-absorbed into the main cavity 101, resulting in high heat dissipation efficiency. A heat dissipation fan may be provided in the main cavity 101 .

[0067] In one embodiment, the top case 11 includes four side panels 112, one of which serves as a cable outlet 113. The other three side panels 112 are each provided with a second heat dissipation vent 1121, that is, the three side walls of the main cavity 101 are each provided with a second heat dissipation vent 1121. It is understood that when the inner wall of the main cavity 101 is covered with a sheet metal shell, the sheet metal shell also has corresponding heat dissipation vents.

[0068] In the related art, the chassis body is generally a sheet metal structure, but the sheet metal structure has an unpleasant appearance and is uncomfortable to touch, with a poor tactile feel, resulting in a poor user experience. In order to improve the appearance and tactile feel of the chassis, and to ensure the overall structural strength of the chassis, in this application, the chassis also includes a sheet metal shell, which covers the inner wall of the main cavity 101. The sheet metal shell refers to a shell formed from metal material through sheet metal processing; the main box body 10 is a plastic box body.

[0069] In other words, the core functional area of ​​the PC, i.e., the main cavity 101, is entirely designed using plastic-clad sheet metal. The outer layer of the main cavity 101 is a plastic structure, which has a delicate touch and can be processed and designed in a variety of colors for a beautiful appearance. The inner layer of the main cavity 101 is a sheet metal structure. The high structural strength of the sheet metal structure can improve the structural reliability of the main cavity 101 shell and reliably protect the electrical performance of the motherboard module 40 and other electronic device modules within the main cavity 101. In this embodiment, no sheet metal housing is provided within the wire cavity 102 to reduce overall weight and cost.

[0070] The following provides a configuration for a sheet metal housing: Referring to Figures 1, 6, 7, and 10 to 13, the sheet metal housing includes a separate sheet metal top cover 31 and a sheet metal bottom cover 32. The sheet metal top cover 31 is embedded in the inner wall of the first groove 103. It is understood that the sheet metal top cover 31 can be installed later into the first groove 103 of the top shell 11 of the main housing 10, or it can be integrally formed with the main housing 10. The sheet metal bottom cover 32 covers and locks to the notch of the first groove 103. The first bottom cover 12 covers and locks to the side of the sheet metal bottom cover 32 facing away from the first groove 103, thereby shielding the sheet metal bottom cover 32.

[0071] In one embodiment, the sheet metal top cover 31 or top shell 11 is provided with a first connecting portion 311, and the sheet metal lower cover 32 is provided with a second connecting portion 321. The second connecting portion 321 is slidably connected to the first connecting portion 311 to achieve initial installation and positioning of the sheet metal lower cover 32. Furthermore, the sheet metal lower cover 32 is connected to the sheet metal top cover 31 or the top shell 11 via fasteners 90 to achieve installation and fixation of the sheet metal lower cover 32. In Figures 11 to 13, the first connecting portion 311 can be a bent hook to provide a sliding groove, and the second connecting portion 321 can be a straight hook to snap into the sliding groove of the first connecting portion 311. The sheet metal lower cover 32 can be pushed sideways to allow the outer second connecting portion 321 to engage with the first connecting portion 311 on the outer edge of the sheet metal top cover 31, and then locked with fasteners 90. The sheet metal lower cover 32 of this embodiment is installed conveniently and quickly by sliding in and screwing it in.

[0072] In other embodiments, the second connection portion 321 and the first connection portion 311 may also be configured to be snap-fitted.

[0073] In one embodiment, the first lower cover 12 can be firstly engaged with the top shell 11 or the sheet metal top cover 31 by hooks, and then the first lower cover 12 can be locked to the sheet metal top cover 31 by fasteners 90 .

[0074] In one embodiment, one side of the second lower cover 13 is reversibly engaged with the interface baffle 20, and the other side of the second lower cover 13 is snap-fitted to the inner wall of the main housing 10. It is understood that the reversible snap-fitting of one side of the second lower cover 13 to the interface baffle 20 means that when the second lower cover 13 is disengaged from the snap-fitting connection with the main housing 10, the second lower cover 13 can be flipped with the side closest to the interface baffle 20 as the flipping center while remaining snap-fitted to the interface baffle 20, so as to open the wire cavity 102, facilitate the plugging and unplugging of wires in the wire cavity 102, or open and close the wire clamp seat 50 in the wire cavity 102, and facilitate flipping and opening the second lower cover 13 when it is necessary to adjust the external wiring.

[0075] 5, 8, and 9, the interface baffle 20 is provided with a plurality of spaced-apart snap-in notches 22, and one side of the second lower cover 13 is provided with a plurality of spaced-apart first hooks 131, each first hook 131 corresponding to each snap-in notch 22. The first hook 131 is an L-shaped hook that snaps into the buckle. When assembling the second lower cover 13, as shown in FIG8, first tilt the second lower cover 13 by 45 degrees or a certain angle, align it with the top shell 11, and allow the first hook 131 on one side of the second lower cover 13 to snap into the snap-in notch 22 of the interface baffle 20. Then, flip and flatten the other side of the second lower cover 13, as shown in FIG10 and FIG11, so that the other side of the second lower cover 13 is snapped into the main case 10.

[0076] 1 and 8 , the main housing 10 includes a first buckle 1122 disposed on the inner wall of the wire cavity 102 , and the second lower cover 13 includes a second buckle 132 , which is engaged with the first buckle 1122 .

[0077] In other embodiments, the main box 10 may also be a sheet metal box without a separate sheet metal shell. In other embodiments, the main box 10 may also be a plastic box without a separate sheet metal shell.

[0078] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0079] Throughout this specification, references to terms such as "an embodiment" or "example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0080] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0081] The technical principles of the present application have been described above in conjunction with specific embodiments. These descriptions are intended solely to explain the principles of the present application and are not to be construed in any way as limiting the scope of protection of the present application. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present application without inventive effort, and such implementations will fall within the scope of protection of the present application.

Claims

1. A chassis, wherein, include: Main box(10); An interface baffle (20) is arranged inside the main box (10); The interface baffle (20) divides the interior of the main box (10) into a main cavity (101) and a wire cavity (102); the interface baffle (20) is provided with a plurality of terminal openings (21), and the main cavity (101) and the wire cavity (102) are communicated through the terminal openings (21); Wherein, the main box (10) is provided with a wire outlet (1131) connected to the wire cavity (102).

2. The chassis according to claim 1, wherein The main box (10) comprises a wire outlet plate (113), and the wire outlet plate (113) is provided with a plurality of wire outlets (1131); the interface baffle (20) and the wire outlet plate (113) are located on opposite sides of the wire cavity (102).

3. The chassis according to claim 1 or 2, wherein, The main box body (10) comprises a top shell (11), a first lower cover (12) and a second lower cover (13); the top shell (11) comprises a top plate and a side plate (112); the top plate and the side plate (112) are combined to form a receiving groove, and the interface baffle (20) is arranged in the receiving groove; The first lower cover (12) is connected to the top shell (11), and the main cavity (101) is formed between the top shell (11), the interface baffle (20) and the first lower cover (12); the second lower cover (13) is connected to the top shell (11), and the wire cavity (102) is formed between the top shell (11), the interface baffle (20) and the second lower cover (13).

4. The chassis according to claim 3, wherein, The chassis comprises a bottom support member (14), and the bottom support member (14) is provided on a side of the first lower cover (12) facing away from the top plate and a side of the second lower cover (13) facing away from the top plate; the first lower cover (12) is provided with a first heat dissipation port (121) in communication with the main cavity (101), and the side plate (112) is provided with a second heat dissipation port (1121) in communication with the main cavity (101).

5. The chassis according to claim 3, wherein, The interface baffle (20) divides the accommodating groove into a first groove portion (103) and a second groove portion (104); The chassis includes a sheet metal top cover (31) and a sheet metal lower cover (32), wherein the sheet metal top cover (31) is embedded in the inner wall of the first groove portion (103), the sheet metal lower cover (32) covers the notch of the first groove portion (103), and the first lower cover (12) covers the side of the sheet metal lower cover (32) facing away from the first groove portion (103); the main box body (10) is a plastic box body.

6. The chassis according to claim 5, wherein, The sheet metal top cover (31) or the top shell (11) is provided with a first connecting portion (311), the sheet metal lower cover (32) is provided with a second connecting portion (321), the second connecting portion (321) is slidably connected to the first connecting portion (311), and the sheet metal lower cover (32) is connected to the sheet metal top cover (31) or the top shell (11) via a fastener (90); The first lower cover (12) is connected to the sheet metal lower cover (32) via a fastener (90).

7. The chassis according to claim 3, wherein, One side of the second lower cover (13) is flip - connectable and snap - engaged with the interface baffle (20); the second lower cover (13) is snap - connected to the main box body (10).

8. The chassis according to claim 7, wherein, The interface baffle (20) is provided with a plurality of spaced - apart bayonets (22), and one side of the second lower cover (13) is provided with a plurality of spaced - apart first hooks (131). The first hooks (131) are L - shaped hooks, and the first hooks (131) are snapped into the bayonets (22).

9. A computing device, wherein, Comprising: The chassis according to any one of claims 1 - 8; A main board module (40) is disposed within the main cavity (101).

10. The computing device according to claim 9, wherein, Comprising a wire clip seat (50). The wire clip seat (50) is disposed within the wire cavity (102), and the wire clip seat (50) is connected to the main box body (10). The wire clip seat (50) is provided with a plurality of wire - clamping holes for wires to pass through; The wire clip seat (50) includes a first clip seat (51) and a second clip seat (52). The first clip seat (51) and the second clip seat (52) are detachably connected, and the wire - clamping holes are formed between the first clip seat (51) and the second clip seat (52).

11. The computing device according to claim 10, wherein, Comprising a hand - tightened screw (80); the first clip seat (51) is installed on the main box body (10), and the second clip seat (52) is connected to the first clip seat (51) by the hand - tightened screw (80).

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