Automated circuit board feeding device and method having film coating function

Abstract

An automated circuit board feeding device and method having a film coating function. The device comprises a film coating mechanism (4) and a palletizer (5), which are arranged on the table top of a workbench (3) from left to right. The film coating mechanism comprises a portal frame (6) fixedly arranged on the workbench, a guide base (7) welded in the portal frame, and a cutting assembly arranged in the portal frame and located on the right side of the guide base. A downward-facing U-shaped thermally-conductive member (12) is welded to the bottom surface of an electric heating plate (11). The device further comprises a feeding mechanism (14) arranged right below the U-shaped thermally-conductive member, the feeding mechanism comprising a pushing air cylinder (15) fixedly arranged on the table top of the workbench, and a mounting plate (16) fixedly arranged on an acting end of a piston rod of the pushing air cylinder. An enclosure frame (17) located right below the U-shaped thermally-conductive member is fixedly provided on the mounting plate, a plurality of rollers (18) being rotatably mounted within the enclosure frame from left to right. Thus, the present invention reduces the labor intensity of workers and improves the feeding efficiency of circuit boards.

Description

Automatic circuit board placement device and method with laminating function

[0001] This application claims priority to the Chinese patent application filed with the Patent Office of China on January 23, 2024, with application number 202410092314.2 and invention name “A device and method for automatically placing circuit boards with laminating function”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the technical field of coating a circuit board surface with adhesive film and placing the coated circuit board, in particular to an automatic circuit board placing device and method with a coating function. Background Art

[0003] After a certain type of circuit board is produced, a layer of adhesive film 2 needs to be covered on the outer surface of each circuit board 1. After covering, the structure of the circuit board 1 is as shown in Figure 1; then the worker puts the circuit board 1 covered with the adhesive film 2 into the palletizer, and the palletizer stacks multiple circuit boards together.

[0004] The method for covering the outer surface of the circuit board 1 with a film and placing the coated circuit board 1 in the workshop is:

[0005] S1. A worker takes out a circuit board 1 and places it flat on a workbench. The worker then covers the top surface of the circuit board 1 with a layer of adhesive film 2, as shown in FIG2 . Finally, the left and right outer edges of the adhesive film 2 are folded downward to the left and right sides of the circuit board 1.

[0006] S2. The worker places the circuit board 1 covered with the adhesive film 2 into the drying tunnel. After the adhesive film 2 is heated by the heat in the drying tunnel, the adhesive film 2 shrinks on the circuit board 1, thereby covering the circuit board 1 with a layer of adhesive film 2, as shown in Figure 1. After the adhesive film is covered, the worker takes the circuit board 1 out of the drying tunnel.

[0007] S3, the worker repeats the operations of steps S1 to S2 to cover multiple circuit boards 1 with a layer of adhesive film 2;

[0008] S4. The worker puts the multiple circuit boards 1 covered with the adhesive film 2 into the palletizing station of the palletizer one by one, and the mechanical arm in the palletizer neatly stacks the circuit boards 1 at the designated position.

[0009] However, although the method in the workshop can achieve the goal of covering the outer surface of the circuit board 1 with a film and simultaneously placing the circuit board covered with the film into the palletizer, in actual operation, the following technical defects still exist:

[0010] I. In steps S1 to S2, it is necessary to manually fold the left and right outer edges of the adhesive film 2 downward, and it is not necessary to manually place the circuit board 1 covered with the adhesive film 2 into the drying tunnel to complete the lamination of the circuit board 1. The entire lamination operation is completed manually, which not only increases the workload of the workers.

[0011] II. In step S4, multiple circuit boards 1 covered with adhesive films 2 need to be manually placed one by one into the palletizing station of the palletizer, which undoubtedly increases the time for placing the circuit boards 1, thereby reducing the efficiency of placing the circuit boards and further reducing the efficiency of stacking the circuit boards 1.

[0012] Therefore, there is an urgent need for an automatic circuit board placement device and method with a laminating function that can reduce the workload of workers and improve the efficiency of circuit board placement. Summary of the Invention

[0013] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an automatic circuit board placement device and method with a laminating function, which can reduce the workload of workers and improve the efficiency of circuit board placement.

[0014] The object of the present invention is achieved through the following technical solutions: an automatic circuit board feeding device with a laminating function, which includes a laminating mechanism and a stacker arranged on the workbench surface from left to right, the laminating mechanism including a gantry fixedly mounted on the workbench, a guide seat welded in the gantry, a cutting assembly arranged in the gantry and located on the right side of the guide seat, a guide groove penetrating the left and right end surfaces thereof is provided in the guide seat, a connecting plate extending rightward to the right side of the gantry is welded on the top surface of the gantry crossbeam, a pressing cylinder is fixedly provided on the top surface of the connecting plate, a piston rod of the pressing cylinder penetrates the connecting plate, and an electric heating plate is fixedly provided on the extending end, and a U-shaped heat conducting member with an opening facing downward is welded on the bottom surface of the electric heating plate; the laminating mechanism also includes an unwinding assembly arranged on the workbench, and the unwinding assembly is arranged on the left side of the gantry;

[0015] The device also includes a delivery mechanism arranged directly below the U-shaped heat conductor, the delivery mechanism includes a pushing cylinder fixedly mounted on the workbench surface, a mounting plate fixedly mounted on the effective end of the piston rod of the pushing cylinder, a frame fixedly mounted directly below the U-shaped heat conductor on the mounting plate, and a plurality of rollers are mounted in the frame for rotation from left to right.

[0016] The bottom of the workbench is fixed to a plurality of supporting legs supported on the ground.

[0017] A switch is connected between the connection head of the electric heating plate and the power supply.

[0018] The cutting assembly includes an upper cutting mechanism and a lower cutting mechanism arranged in the gantry. The upper cutting mechanism includes a fixed plate welded in the gantry and a cutting cylinder fixed on the top surface of the fixed plate. The piston rod of the cutting cylinder passes through the fixed plate, and a cutting knife is fixed on the extending end.

[0019] The upper cutting mechanism and the lower cutting mechanism are symmetrically arranged in the upper and lower parts.

[0020] The unwinding assembly includes a frame fixed on a workbench and an unwinding drum rotatably installed in the frame. Multiple turns of continuous film are wound on the unwinding drum, and the head end of the continuous film passes through the guide groove of the guide seat.

[0021] The device also includes a controller, which is electrically connected to the cutting cylinder, the pushing cylinder and the pressing cylinder via a signal line.

[0022] A method for automatically placing a circuit board with a laminating function, comprising the following steps:

[0023] S1. A worker takes out a circuit board to be coated and places it flat on the roller from right to left. The worker then adjusts the position of the circuit board so that it is directly below the U-shaped heat conductor. The roller protects the circuit board by preventing the bottom surface of the circuit board from being scratched during the adjustment.

[0024] S2. The worker pulls the leading end of the continuous film to the right, and the continuous film is pulled to the right from the unwinding drum. When the leading end of the continuous film is positioned on the top surface of the circuit board, the worker stops pulling the continuous film to the right.

[0025] S3. The piston rods of the cutting cylinders of the upper and lower cutting mechanisms are controlled to extend. The piston rods of the two cutting cylinders drive the cutters to move in opposite directions. The two cutters cut the continuous film, and the film is positioned on the top surface of the circuit board.

[0026] S4. The worker controls the piston rod of the pressing cylinder to extend downward, which drives the electric heating plate downward. The electric heating plate drives the U-shaped heat conductor downward. The U-shaped heat conductor moves toward the film. When the piston rod of the pressing cylinder is fully extended, the U-shaped heat conductor is fastened to the circuit board and the left and right outer edges of the film are folded downward.

[0027] S5. The worker turns on the switch between the electric heating plate and the power supply. The power supply energizes the electric heating plate, generating heat on the electric heating plate. The heat is transferred to the U-shaped heat conductive member, which transfers the heat to the adhesive film. After being heated, the adhesive film shrinks on the circuit board, thereby achieving a layer of adhesive film covering the circuit board.

[0028] S6. After the lamination is completed, the worker controls the piston rod of the pressing cylinder to retract upward, and the piston rod drives the electric heating plate to move upward, and the electric heating plate drives the U-shaped heat conducting member to move upward, and the U-shaped heat conducting member is separated from the film;

[0029] S7. Release of the film-covered circuit board: The piston rod of the push cylinder is controlled to extend to the right. The piston rod drives the mounting plate to move to the right. The mounting plate drives the frame to move to the right. The frame drives the film-covered circuit board to move to the right. The circuit board moves toward the palletizer. When the piston rod of the push cylinder is fully extended, the circuit board just enters the palletizer. The robotic arm in the palletizer neatly stacks the circuit board at the designated position, thus completing the stacking of the first film-covered circuit board.

[0030] S8. Repeat steps S1 to S7 to continuously stack multiple circuit boards covered with adhesive films at designated locations.

[0031] The present invention has the following advantages: reducing the workload of workers and improving the efficiency of circuit board placement. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG1 is a schematic structural diagram of a circuit board covered with an adhesive film;

[0033] Figure 2 is a schematic diagram of covering the top surface of the circuit board with a layer of film

[0034] FIG3 is a schematic structural diagram of the present invention;

[0035] Figure 4 is a schematic diagram of the connection between the gantry and the guide seat;

[0036] FIG5 is a left side view of FIG4;

[0037] Figure 6 is a schematic structural diagram of the upper cutting mechanism;

[0038] Figure 7 is a schematic diagram of the connection between the frame and the drum;

[0039] FIG8 is a top view of FIG7;

[0040] FIG9 is a schematic diagram of positioning a circuit board directly below a U-shaped heat conducting member;

[0041] FIG10 is a schematic diagram of positioning the head end portion of the continuous adhesive film on the top surface of the circuit board;

[0042] FIG11 is a schematic diagram of two cutters cutting a continuous film;

[0043] FIG12 is a schematic diagram of a U-shaped heat conducting member fastened to a circuit board;

[0044] FIG13 is a schematic diagram of a circuit board covered with an adhesive film entering a palletizer;

[0045] In the figure, 1-circuit board, 2-film, 3-workbench, 4-laminating mechanism, 5-palletizer, 6-gantry, 7-guide seat, 8-guide groove, 9-connecting plate, 10-pressing cylinder, 11-electric heating plate, 12-U-shaped heat conductor, 13-unwinding assembly, 14-dispensing mechanism, 15-pushing cylinder, 16-mounting plate, 17-frame, 18-roller, 19-upper cutting mechanism, 20-lower cutting mechanism, 21-fixed plate, 22-cutting cylinder, 23-cutter, 24-unwinding drum, 25-continuous film. DETAILED DESCRIPTION

[0046] The present invention will be further described below with reference to the accompanying drawings, and the protection scope of the present invention is not limited to the following:

[0047] As shown in Figures 3 to 8, an automatic circuit board feeding device with a laminating function includes a laminating mechanism 4 and a stacker 5 arranged on the surface of a workbench 3 from left to right. The bottom of the workbench 3 is fixed to a plurality of support legs supported on the ground. The laminating mechanism 4 includes a gantry 6 fixed to the workbench 3, a guide seat 7 welded in the gantry 6, and a cutting assembly arranged in the gantry 6 and located on the right side of the guide seat 7. A guide groove 8 is provided in the guide seat 7 that runs through its left and right end faces. A connecting plate 9 extending rightward to the right of the gantry 6 is welded on the top surface of the crossbeam of the gantry 6, and a connecting plate 9 is fixed on the top surface of the connecting plate 9. A pressing cylinder 10, the piston rod of the pressing cylinder 10 passes through the connecting plate 9, and an electric heating plate 11 is fixedly provided on the extending end, a switch is connected between the terminal end of the electric heating plate 11 and the power supply, and a U-shaped heat conductor 12 with an opening facing downward is welded on the bottom surface of the electric heating plate 11; the laminating mechanism 4 also includes a unwinding assembly 13 arranged on the workbench 3, and the unwinding assembly 13 is arranged on the left side of the gantry 6, and the unwinding assembly includes a frame fixed on the workbench 3 and a unwinding drum 24 rotatably installed in the frame, and multiple turns of continuous film 25 are wound on the unwinding drum 24, and the head end of the continuous film 25 passes through the guide groove 8 of the guide seat 7.

[0048] The device also includes a delivery mechanism 14 arranged directly below the U-shaped heat conductor 12. The delivery mechanism 14 includes a pushing cylinder 15 fixedly mounted on the surface of the workbench 3 and a mounting plate 16 fixedly mounted on the effective end of the piston rod of the pushing cylinder 15. A frame 17 located directly below the U-shaped heat conductor 12 is fixedly mounted on the mounting plate 16. A plurality of rollers 18 are mounted in the frame 17 so as to rotate from left to right.

[0049] The cutting assembly includes an upper cutting mechanism 19 and a lower cutting mechanism 20 arranged in the gantry 6. The upper cutting mechanism 19 and the lower cutting mechanism 20 are symmetrically arranged up and down. The upper cutting mechanism 19 includes a fixed plate 21 welded to the gantry 6 and a cutting cylinder 22 fixed on the top surface of the fixed plate 21. The piston rod of the cutting cylinder 22 passes through the fixed plate 21, and a cutter 23 is fixed on the extended end.

[0050] The device also includes a controller, which is electrically connected to the cutting cylinder 22, the pushing cylinder 15 and the pressing cylinder 10 via a signal line. Workers can use the controller to control the extension or retraction of the piston rods of the cutting cylinder 22, the pushing cylinder 15 and the pressing cylinder 10, which facilitates the workers' operation and has a high degree of automation.

[0051] A method for automatically placing a circuit board with a laminating function, comprising the following steps:

[0052] S1. A worker takes out a circuit board 1 to be coated and places it flat on roller 18 from right to left. The worker then adjusts the position of the circuit board 1 so that it is directly below the U-shaped heat conductor 12, as shown in FIG9 . The roller 18 protects the circuit board 1 by preventing the bottom surface of the circuit board 1 from being scratched when adjusting its position.

[0053] S2. The worker pulls the leading end of the continuous adhesive film 25 to the right. The continuous adhesive film 25 is pulled to the right from the unwinding drum 24. When the leading end of the continuous adhesive film 25 is positioned on the top surface of the circuit board 1, as shown in FIG10 , the worker stops pulling the continuous adhesive film 25 to the right.

[0054] S3. The piston rods of the cutting cylinders 22 of the upper cutting mechanism 19 and the lower cutting mechanism 20 are controlled to extend. The piston rods of the two cutting cylinders 22 drive the cutters 23 to move in opposite directions. The two cutters 23 cut the continuous adhesive film 25, as shown in FIG11 . At this time, the adhesive film 2 is positioned on the top surface of the circuit board 1, as shown in FIG2 .

[0055] S4. The worker controls the piston rod of the pressing cylinder 10 to extend downward, which drives the electric heating plate 11 downward. The electric heating plate 11 drives the U-shaped heat conductive member 12 downward. The U-shaped heat conductive member 12 moves toward the adhesive film 2. When the piston rod of the pressing cylinder 10 is fully extended, the U-shaped heat conductive member 12 is fastened to the circuit board 1, as shown in FIG12, and the left and right outer edges of the adhesive film 2 are folded downward.

[0056] S5. The worker turns on the switch between the electric heating plate 11 and the power supply. The power supply energizes the electric heating plate 11, generating heat on the electric heating plate 11. The heat is transferred to the U-shaped heat conducting member 12. The U-shaped heat conducting member 12 transfers the heat to the adhesive film 2. After being heated, the adhesive film 2 shrinks onto the circuit board 1, thereby achieving a layer of adhesive film 2 covering the circuit board 1. The structure of the circuit board 1 covered with the adhesive film 2 is shown in FIG1 .

[0057] Among them, it can be seen from steps S1 to S5 that the device only needs to control the downward extension of the piston rod of the pressing cylinder 10 to make the U-shaped heat conductor 12 cooperate with the circuit board 1, and then energize the electric heating plate 11 to heat-shrink the film 2 on the circuit board 1, thereby automatically covering the circuit board 1 with the film 2. There is no need to manually fold the left and right outer edges of the film 2 downward, nor is there any need to manually place the circuit board 1 covered with the film 2 into the drying tunnel, thereby greatly reducing the workload of workers.

[0058] S6. After lamination is completed, the worker controls the piston rod of the pressing cylinder 10 to retract upward, and the piston rod drives the electric heating plate 11 to move upward, and the electric heating plate 11 drives the U-shaped heat conducting member 12 to move upward, and the U-shaped heat conducting member 12 is separated from the film 2;

[0059] S7. Release of the circuit board 1 covered with the adhesive film 2: The piston rod of the pushing cylinder 15 is controlled to extend rightward. The piston rod drives the mounting plate 16 to move rightward. The mounting plate 16 drives the surrounding frame 17 to move rightward. The surrounding frame 17 drives the circuit board 1 covered with the adhesive film 2 to move rightward. The circuit board 1 moves toward the palletizer 5. When the piston rod of the pushing cylinder 15 is fully extended, the circuit board 1 just enters the palletizer 5. As shown in FIG13 , the robotic arm in the palletizer 5 neatly stacks the circuit boards 1 at the designated position, thereby completing the stacking of the first circuit board 1 covered with the adhesive film 2.

[0060] S8. Repeat steps S1 to S7 to continuously stack multiple circuit boards 1 covered with adhesive films 2 at designated locations.

[0061] Among them, it can be seen from step S7 that the present device can put the circuit board 1 covered with the film 2 into the palletizing station of the palletizer 5 by controlling the extension of the piston rod of the pushing cylinder 15, so that the circuit board 1 is immediately put into the palletizer 5 after the film 2 is covered on the circuit board 1. Therefore, there is no need to manually put multiple circuit boards 1 covered with the film 2 into the palletizing station of the palletizer one by one, thereby greatly shortening the time used for putting the circuit boards 1, thereby greatly improving the putting efficiency of the circuit boards, and further improving the stacking efficiency of the circuit boards 1.

[0062] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An automatic circuit board feeding device with a film covering function, characterized in that: It includes a film laminating mechanism (4) and a palletizer (5) arranged on the workbench (3) from left to right. The film laminating mechanism (4) includes a gantry (6) fixed on the workbench (3), a guide seat (7) welded inside the gantry (6), and a cutting assembly arranged inside the gantry (6) and on the right side of the guide seat (7). A guide groove (8) penetrating through its left and right end faces is formed in the guide seat (7). A connecting plate (9) extending to the right of the gantry (6) is welded on the top surface of the cross beam of the gantry (6). A pressing cylinder (10) is fixed on the top surface of the connecting plate (9). The piston rod of the pressing cylinder (10) penetrates through the connecting plate (9), and an electric heating plate (11) is fixed on the extending end. A U-shaped heat conducting member (12) with an opening facing down is welded on the bottom surface of the electric heating plate (11). The film laminating mechanism (4) further includes a film unwinding assembly (13) arranged on the workbench (3), and the film unwinding assembly (13) is arranged on the left side of the gantry (6). The device further includes a feeding mechanism (14) arranged directly below the U-shaped heat conducting member (12). The feeding mechanism (14) includes a pushing cylinder (15) fixed on the workbench (3) surface, and a mounting plate (16) fixed on the acting end of the piston rod of the pushing cylinder (15). A surrounding frame (17) located directly below the U-shaped heat conducting member (12) is fixed on the mounting plate (16). A plurality of rollers (18) are rotatably installed in the surrounding frame (17) from left to right.

2. The automatic circuit board feeding device with a film covering function according to claim 1, characterized in that: The bottom of the workbench (3) is fixed to multiple support legs that support on the ground.

3. The automatic circuit board feeding device with a film covering function according to claim 2, characterized in that: A switch is connected between the terminal of the electric heating plate (11) and the power supply.

4. The automatic circuit board feeding device with a film covering function according to claim 3, characterized in that: The cutting assembly includes an upper cutting mechanism (19) and a lower cutting mechanism (20) arranged inside the gantry (6). The upper cutting mechanism (19) includes a fixing plate (21) welded inside the gantry (6), and a cutting cylinder (22) fixed on the top surface of the fixing plate (21). The piston rod of the cutting cylinder (22) penetrates through the fixing plate (21), and a cutting knife (23) is fixed on the extending end.

5. The automatic circuit board feeding device with a film covering function according to claim 4, wherein: The upper cutting mechanism (19) and the lower cutting mechanism (20) are symmetrically arranged up and down.

6. The automatic circuit board feeding device with a film covering function according to claim 5, characterized in that: The film unwinding assembly includes a frame fixed on the workbench (3), and a film unwinding cylinder (24) rotatably installed inside the frame. A plurality of turns of continuous adhesive film (25) are wound on the film unwinding cylinder (24), and the leading end of the continuous adhesive film (25) passes through the guide groove (8) of the guide seat (7).

7. The automatic circuit board feeding device with a film covering function according to claim 6, characterized in that: The device further includes a controller, and the controller is electrically connected to the cutting cylinder (22), the pushing cylinder (15), and the pressing cylinder (10) through signal lines.

8. An automatic board feeding method for a circuit board with a film laminating function, which uses the automatic board feeding device for a circuit board with a film laminating function described in claim 7, is characterized in that: It includes the following steps: S1. The worker takes out a circuit board (1) to be laminated, places the circuit board (1) flat on the rollers (18) from right to left, and then adjusts the position of the circuit board (1) so that the circuit board (1) is positioned directly below the U-shaped heat conducting member (12). Among them, the function of the rollers (18) is to prevent the bottom surface of the circuit board (1) from being scratched when adjusting the position of the circuit board (1), playing a role in protecting the circuit board (1). S2. The worker pulls the leading end of the continuous adhesive film (25) to the right, and the continuous adhesive film (25) is drawn out to the right from the unwinding reel (24). When the leading end of the continuous adhesive film (25) is positioned on the top surface of the circuit board (1), the worker stops pulling the continuous adhesive film (25) to the right; S3. Control the piston rods of the cutting cylinders (22) of the upper cutting mechanism (19) and the lower cutting mechanism (20) to extend. The piston rods of the two cutting cylinders (22) drive the cutting knives (23) to move in opposite directions, and the two cutting knives (23) cut the continuous adhesive film (25). At this time, the adhesive film (2) positioned on the top surface of the circuit board (1) is obtained; S4. The worker controls the piston rod of the pressing cylinder (10) to extend downward. The piston rod drives the electric heating plate (11) to move downward, and the electric heating plate (11) drives the U-shaped heat conducting member (12) to move downward. The U-shaped heat conducting member (12) moves towards the adhesive film (2). When the piston rod of the pressing cylinder (10) is fully extended, the U-shaped heat conducting member (12) is buckled on the circuit board (1), and the left and right outer edges of the adhesive film (2) are folded downward; S5. The worker turns on the switch between the electric heating plate (11) and the power supply. The power supply energizes the electric heating plate (11), and heat is generated on the electric heating plate (11). The heat is conducted to the U-shaped heat conducting member (12), and the U-shaped heat conducting member (12) conducts the heat to the adhesive film (2). After the adhesive film (2) is heated, it shrinks onto the circuit board (1), thereby realizing the covering of a layer of adhesive film (2) on the circuit board (1); S6. When the film covering is completed, the worker controls the piston rod of the pressing cylinder (10) to retract upward. The piston rod drives the electric heating plate (11) to move upward, and the electric heating plate (11) drives the U-shaped heat conducting member (12) to move upward. The U-shaped heat conducting member (12) is separated from the adhesive film (2); S7. Delivery of the circuit board (1) covered with the adhesive film (2): Control the piston rod of the pushing cylinder (15) to extend to the right. The piston rod drives the mounting plate (16) to move to the right, the mounting plate (16) drives the surrounding frame (17) to move to the right, and the surrounding frame (17) drives the circuit board (1) covered with the adhesive film (2) on it to move to the right. The circuit board (1) moves towards the palletizer (5). When the piston rod of the pushing cylinder (15) is fully extended, the circuit board (1) just enters the palletizer (5), and the robotic arm in the palletizer (5) neatly stacks the circuit boards (1) at the designated position, thereby realizing the stacking of the first circuit board (1) covered with the adhesive film (2); S8. By repeating the operations in steps S1 - S7 in this way, multiple circuit boards (1) covered with the adhesive film (2) can be continuously stacked at the designated position.

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