Arrangement for providing a die element, die element for an arrangement of this type, bearing device for an arrangement of this type, system for an arrangement of this type, and method for producing and handling an arrangement of this type

Abstract

The invention relates to an arrangement for providing a die element (1) which, when it is used, is intended to leave structuring in an embossing material (10), comprising: - a profile element (4) which, when the die element (1) is used, acts on the embossing material (10), the profile element (4) preferably being configured in the form of a soft die, and - a supporting element (3) which supports the profile element (4) and, in particular when the die element (3) is used, serves as an abutment, the profile element (4) and the supporting element (3) being arranged for transport on and / or at a carrier substrate (2).

Description

[0001] Arrangement for providing a stamping element, stamping element for such an arrangement, storage device for such an arrangement, system for such an arrangement and method for producing and handling such an arrangement

[0002] The present invention relates to an arrangement for providing a stamping element, a stamping element for such an arrangement, a storage device and a system for such an arrangement as well as a method for producing and a method for handling such an arrangement.

[0003] One of the most important technologies in the field of electronic component manufacturing, especially for patterning, in recent years has been imprint lithography, which is increasingly replacing or at least expanding traditional photolithography. With the help of imprint lithography, feature sizes in the nanometer range can already be produced using HVM (high-volume manufacturing) processes.

[0004] The advantages of imprint lithography are its throughput, low costs, and the quality and reproducibility of the structures. Conventional photolithography devices, which are designed to produce feature sizes in the nanometer range, are becoming increasingly expensive. Furthermore, mask production is complex and expensive.

[0005] In imprint lithography, however, a manufactured stamp is used that can be used multiple times. A distinction is made between hard and soft stamps. Hard stamps are made from materials that are difficult to deform, primarily metals or metal alloys, and rarely ceramics or glass. They are dimensionally stable, but like all tools, they wear out over time. Since the production of hard stamps is very expensive, wear and tear is a serious problem. Soft stamps are often used as an alternative. These stamps are a negative impression of a previously produced hard stamp. This hard stamp is also called a master stamp or simply a master. The material for the soft stamp is usually a polymer. Soft stamps also wear out over time, but can be re-molded from the master stamp very quickly and cost-effectively.

[0006] It has been shown that producing a high-quality, expensive master stamp and several soft stamps molded from the master stamp is not only economically worthwhile but also offers technical advantages. The embossed structures of the soft stamp, which represent the negative of the structures to be created in an embossing compound, are flexible due to the use of a soft polymer as the soft stamp material. This flexibility allows them to be more easily demolded from the embossing compound. Furthermore, soft stamps are usually transparent to the electromagnetic radiation used, which is primarily used to cure an embossing compound.

[0007] In the prior art, soft stamps are usually provided on a support element. In the field of imprint lithography, the support element is sometimes referred to as a backplane. The support element should be stiff enough to transport and handle the soft stamp, but thin enough to still be elastic and flexible. In most cases, the thickness of the support elements is very small, preferably in the millimeter or submillimeter range.

[0008] They must also meet certain chemical and physical properties, particularly with regard to cleaning properties. The soft stamp, which is manufactured on a support element, must be easily removed from the support element after a certain number of uses.

[0009] The problem is that the support elements are usually made of brittle material, preferably glass, silicon, or another material frequently used in the semiconductor industry and as inexpensive as possible. At the same time, the support elements are difficult to handle. Therefore, it is an object of the invention to provide a functional stamping element that is comparatively simple and inexpensive to manufacture and provide. The stamping element should also be easy to handle, for example, it should be as straightforward as possible to use in a stamping device, especially an imprinting device.

[0010] The present invention solves this problem with an arrangement according to claim 1, a stamping element according to claim 10, a bearing device according to claim 11, a system according to claim 13, a method for handling the arrangement, and a method for manufacturing the arrangement according to claim 15. The scope of the invention also includes all combinations of at least two features specified in the description, the claims, and / or the drawings. For specified value ranges, values ​​within the stated limits are also to be considered disclosed as limit values ​​and can be claimed in any combination.

[0011] According to a first aspect of the present invention, an arrangement for providing a stamping element which is intended to leave a structuring in a stamping compound when used is provided, comprising:

[0012] - a profile element which acts on the embossing mass when the stamping element is used, wherein the profile element is preferably designed in the form of a soft stamping element, and

[0013] - a support element which supports the profile element and serves as an abutment in particular when using the stamping element, wherein the profile element and the support element are arranged on and / or at a carrier substrate for transport.

[0014] In contrast to the prior art, it is provided that the stamping element is provided, in particular transported, by means of a carrier substrate. In particular, it is provided that - unlike in the prior art - a functional separation takes place, in which the carrier device can ensure that the support element and the profile element can be transported for handling the stamping element. The main function of the support element is to serve as an abutment, in particular during the stamping process, i.e. when the stamping element is in use, in order to initiate the desired embossing function by means of the profile element in the embossing compound. This advantageously makes it possible to remove the need for the support element to have the function of ensuring the transportability of the entire stamping element.In other words, it is possible to enable a functional separation in the arrangement, in which the support element has the task of serving as an abutment in the stamping process, and the carrier device has the transport function in order to be able to properly place and / or exchange the stamping element in a stamping device. This, in turn, proves to be advantageous because it increases the flexibility in the design of the support element, for example with regard to material selection and / or geometry. In particular, this also allows for easier influencing of the stamping element during the stamping process, since, for example, increased elasticity of the support element, e.g., through a thinner support element, local deformations within the entire stamping element or in the support element can be induced more easily. Such deformations can have a corresponding corrective effect in the stamping process.In addition, the nature of the stamping element can contribute to the soft stamping element or profile part and support element being easier to separate from one another in a later process. The carrier substrate, which is preferably larger than the stamping element in the lateral direction or in a direction parallel to the main extension plane, is preferably designed in such a way that it allows the stamping element to be transported, and in particular also enables the stamping element to be arranged in a corresponding stamping device. It is conceivable that the carrier substrate is removed from the support element again after the transport process or that it also becomes part of the stamping device. It is not absolutely necessary for the support element and the profile element to be arranged on the same side of the carrier substrate, in particular stacked one on top of the other.It is also conceivable that the profile element and the support element are arranged on opposite sides of the carrier substrate. Particularly preferably, the profile element and the support element are arranged on only one side of the carrier substrate. Alternatively, only one support element and only one profile element are arranged on opposite sides of the carrier substrate.

[0015] In particular, the support element and the profile element are arranged one above the other, in particular stacked, along a direction perpendicular to the main extension plane. The stamping element comprises the profile element and the support element.

[0016] In a special embodiment, however, the support element and profile element are located on opposite sides of the carrier substrate. In this specific case, the profile element is created directly on the carrier substrate, and the support element stabilizes the carrier substrate and the profile element from the back of the carrier substrate or serves as an abutment, in particular by acting on the profile element via the carrier substrate.

[0017] The support element, in particular as a support substrate, is preferably a wafer, in particular a silicon wafer. Silicon wafers are easily available and handleable, inexpensive, and the most researched. Their physical and chemical properties are well known. The task of the support element is to give the soft stamp a desired, precisely adjustable stability and formability. In the present case, this is preferably understood as the abutment capacity of the support element. In particular, the abutment function of the support element is to be understood as follows: When the stamping element is in use, forces emanating from the stamping compound act back or on the stamping element, in particular on the side of the profile element facing the stamping compound, both in a direction perpendicular to the main extension plane and parallel to the main extension plane.The abutment function serves to ensure that sections of the profile element remain stationary and / or oriented. In other words, the aim is to prevent sections and profile elements from being shifted or realigned, particularly as a result of the stamping process, in order to ensure reproducibility of the produced structure. Preferably, the arrangement, in particular the support element, the carrier substrate, and / or the profile element, has at least one alignment mark. In a preferred embodiment, the support element has at least one alignment mark. Due to the rigidity of the support element, the alignment marks can be applied with very high precision. Alignment marks serve the particular purpose of simplifying alignment. On a film as a carrier substrate or on the profile element, alignment marks could only be produced very imprecisely, if at all.The possibility of aligning the profile element connected to the support element to a structure to be embossed would be correspondingly poor.

[0018] The rigidity of the support element also contributes significantly to ensuring that the profile element remains dimensionally stable before, during, and after the stamping process. This enables very good overlay accuracies, which is a further advantage compared to the state of the art.

[0019] A key advantage of the support element is that countless processes known in the semiconductor industry can be performed on the support element to adjust the corresponding physical and / or chemical properties, particularly with respect to the profile element. Such adjustments are not always possible on carrier substrates, especially on films. For example, the deposition of layers, hydrophilization or hydrophobization, the creation of alignment marks, etc., are difficult or even impossible on a film made of a polymer.

[0020] The profile element, in particular in the form of a soft stamp element, is produced from a soft stamp embossing compound, preferably by embossing with the aid of a master stamp. The soft stamp preferably consists of at least one of the following material classes:

[0021] • Carbon-based polymer o Perfluoropolyether (PFPE) o II rethanacry lat

[0022] • Silicone-based polymer o Polydimethylsiloxane (PDMS) o Polyhedral oligomeric silsesquioxane (POSS) o Tetraethyl orthosilicate (TEOS) o Poly(organo)siloxane (silicone)

[0023] • Thermoplastic

[0024] • Duroplast

[0025] • Elastomer

[0026] The soft stamp material is generally a multi-component material.

[0027] Due to its soft-stamp embossed surface structures, the thickness of the profile element can only be specified as an average value. However, the thickness can also influence the deformation behavior and is therefore explicitly disclosed. The thickness of the profile element is between 100 nm and 1 mm, preferably between 500 nm and 500 pm, even more preferably between 750 nm and 250 pm, most preferably between 1 pm and 200 pm, and most preferably between 2 pm and 100 pm.

[0028] The size of the soft stamp imprinted structures ranges from 1 nm to 500 pm. Using imprint lithography, both the smallest structures in the nanometer range, for example, for the production of functional units, as well as structures in the micrometer range, for example, for the production of microlenses, can be imprinted. The size of the soft stamp imprinted structures therefore depends on the structure to be imprinted.

[0029] The profile element is preferably detachable from the support element. This allows the reuse of the support element and carrier substrate. In this case, the profile element would be removed from the support element, the support element and / or the carrier element would be cleaned, and then a new profile element would be imprinted on the support element again using an imprinting process. The detachment of the profile element from the support element preferably occurs using at least one of the following methods:

[0030] • Physical distance

[0031] • Plasma o mechanical separation by

[0032] ■ Blade

[0033] ■ Wire

[0034] • Chemical removal

[0035] solvent

[0036] acid

[0037] base

[0038] The separation of the profile element from the support element preferably begins at the edge. Therefore, it is particularly advantageous if the support element can be easily bent, especially at the edge of the profile element, i.e., has low bending resistance. The support element can be manufactured such that the bending resistance about an axis parallel to the support element surface is a function of location. The support element could therefore have high bending resistance in the center and low bending resistance at the edge. The production of such physical properties would not be possible in the prior art using a pure carrier substrate, in particular a film.

[0039] In particular, it is also conceivable that the Young's modulus of the support element can be adjusted vertically and / or horizontally, preferably as a function of location. This is possible by depositing different layers and masking them.

[0040] In particular, the adhesive strength (more precisely, the tensile strength) between the carrier substrate and the support element should be 1.1 times, preferably 1.5 times, more preferably 2.0 times, most preferably 5.0 times, most preferably 10.0 times greater than the adhesive strength between the support element and the profile element. The tensile strength could, for example, be determined according to the standard

[0041] DIN EN ISO 4624. The unit of tensile bond strength is Newton per square meter. Tensile bond strength represents the force in Newtons that must be applied per area in square meters to separate two bonded surfaces. In the semiconductor industry, particularly when characterizing two bonded surfaces, the value is given in Joules per square meter, i.e. the amount of energy that must be used to separate two surfaces. The relative ranges of values ​​for tensile bond strength therefore also apply to other physical quantities that can be used to describe the adhesion of two surfaces to one another. Both methods are familiar to those skilled in the art.

[0042] It is particularly preferred if the carrier substrate is designed as a film at least partially, preferably completely, particularly preferably more than 50%, more than 70% and particularly preferably more than 80%. In a particularly preferred embodiment, the carrier substrate is a simple film, in particular a film that is used to fix substrates for dicing. This type of film is most commonly found in the semiconductor industry; it is cost-effective, useful and capable of fixing other substrates. Due to its frequent use, it is also referred to as dicing tape. In principle, other films can also be used. The films are preferably stretched or laminated on a frame. If the film is a dicing film, the frame on which it is stretched is referred to as a dicing frame.The frame can be made of plastic or metal. In the following, these two technical terms, cutting film and cutting frame, will be used synonymously for all types of films and film clamps. The preferred method for attaching the support element to the film is adhesive. Most films are already delivered with an adhesive layer. Alternatively, an adhesive layer can be applied to the support element and / or the carrier substrate using a process known in the semiconductor industry.

[0043] It is also conceivable for the carrier substrate to be formed, at least partially or entirely, from a plurality of crossed belts and / or bands. The carrier substrate can also be, at least partially or entirely, a wafer and / or a plate. The plate can, in particular, be a metal plate or a ceramic plate. In particular, the carrier substrate is designed such that the support element fixed thereon can be transported, in particular in a standardized manner, using the soft stamp. While the carrier substrate can also have a supporting effect on the support element and the profile element, the transport effect is the primary function.

[0044] In particular, it is provided that the carrier substrate is designed in such a way that the stamping element remains dimensionally stable in the arrangement during transport, in particular even when it itself is dimensionally unstable, i.e. without a support element. This particularly simplifies and improves the alignment and positioning of the stamping element in the stamping device. Alternatively, it is conceivable that, for example, the carrier substrate together with the support element is partially controllably deformable, for example forming a curvature and / or being partially rolled. Controlled deformability is to be understood in particular as meaning that the support element is contacted or gripped under at a plurality of points by means of the carrier substrate, whereby controlled deformability is possible.In particular, contacting at a plurality of points or areas, preferably at more than three or four points, enables dimensionally stable transport of the stamping element. This can also simplify handling, particularly during the placement process in the stamping device.

[0045] Preferably, the support element is detachably attached to the carrier substrate. This advantageously allows the carrier substrate to be removed again during or after insertion of the support element. This exposes the back of the support element and allows it to be influenced, for example, by mechanical means. This also allows the support element to be manipulated to influence the stamping process.

[0046] It is preferably provided that the film is fixed at least in sections in or on a frame. In particular, it is provided that the film is clamped in the frame in order to ensure the necessary stability during transport. The frame preferably comprises opposing frame components, between which at least part of the film and / or the carrier substrate is clamped. For example, the carrier substrate, in particular if it is designed as a film, can be clamped by the spacing of the frame elements in order, for example, to be able to transport the stamping element as planar as possible or to apply the necessary pressure when inserting it into a stamping device. It is preferably provided that the frame element is designed to be at least partially circumferential, for example U-shaped and / or square.

[0047] Preferably, a tensioning device is provided with which a tension of the carrier substrate, in particular a film tension in the case of a film, can be adjusted or ensured.

[0048] Preferably, the film is designed as an endless belt, in particular to provide a plurality of stamping elements on this carrier substrate provided as an endless belt. The stamping elements or hybrid stamps are then mass-produced on the endless belt and can be separated as needed. It is also conceivable that only the support elements are initially applied in series on the endless belt. Only when a carrier substrate-supporting element combination is required to form a soft stamp is such a part separated from the endless belt.

[0049] It is preferably provided that the carrier substrate is designed in such a way that lateral offset of the stamping element, i.e. of the support element and / or the profile element, is prevented. For this purpose, it is provided, for example, that the carrier substrate, in particular the film, has a coating which preferably has an adhesive effect. It is also conceivable that the carrier substrate has corresponding stops and / or a clamping device and / or a fixing device which are provided for laterally fixing the stamping element to be transported in order to prevent slipping during transport. It is also conceivable that the carrier substrate, in particular the film, is locally deep-drawn in order to ensure, for example, that the support element is not offset during transport.

[0050] It is also conceivable for the transport element to have a reference marking, for example, to enable an automation process with which the substrate element is integrated into a stamping device. This advantageously makes it possible to avoid the need for a corresponding reference marking to be embedded or required on the support element. For example, this could be a barcode or QR code that identifies the respective stamping element. The reference marking primarily serves to identify the transport element.

[0051] Preferably, the support element is transparent, for example, to allow the embossing compound to harden through light transmitted through the support element. If the carrier substrate is removed after the stamp element has been installed in a printing device, there is more flexibility in the choice of material for the carrier substrate, as it no longer necessarily needs to be transparent. If the carrier substrate remains on the stamp element or on the support element and profile element, the carrier substrate is preferably also transparent to allow exposure from the back of the stamp element, first through the carrier substrate and support element, and then through the profile element, provided the support element and profile element are arranged on the same side of the carrier substrate.

[0052] The support element preferably comprises a material from the following material classes • Metal o Cu, AI, Fe, Ni, Co, W, Cr, Ti, Ta

[0053] • Metal alloy or steel

[0054] • Semiconductors o Element semiconductors

[0055] ■ Si, Ge o compound semiconductors

[0056] ■ GaAs, GaNlnP, InxGal -xN ,lnSb, InAs, GaSb, AIN, InN, GaP, BeTe, ZnO, CulnGaSe2, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, Hg(1 - x)Cd(x)Te, BeSe, HgS, AlxGa1 -xAs, GaS, GaSe, GaTe, InS, InSe, InTe, CulnSe2, CulnS2, CulnGaS2, SiC, SiGe

[0057] • Ceramic or nitride ceramic

[0058] ■ Si3N4

[0059] • Glass

[0060] • Plastic

[0061] It is conceivable for the carrier substrate to have cutouts. For example, it is conceivable that targeted cutouts, in particular a plurality of cutouts, are provided to allow an influence on the support element. It is conceivable, for example, that cutouts are provided in the carrier substrate to enable light to pass through the support element to the embossing compound, where it can lead to curing, in particular partial curing, when the carrier substrate remains attached to the support element in the stamping device. It is also conceivable that targeted cutouts are provided to exert a mechanical influence on the support element when the arrangement with the carrier substrate is arranged in the stamping device.For example, it is conceivable that a grid-like and / or checkerboard-like arrangement of recesses is provided in the carrier substrate in order to be able to act specifically in defined areas to cause a deformation of the support element, which in turn is transferred to the profile element, allowing a corresponding corrective effect on the alignment of the profile element during the stamping process and / or before the stamping process. It would also be conceivable that acting on the support element could simplify the separation between the carrier substrate and the support element.

[0062] It is also conceivable for the carrier substrate to have a circular recess, particularly a central one, whose diameter is slightly smaller than the diameter of the support element. This allows the support element to be held peripherally by the carrier substrate, but can be directly illuminated through the recess, allowing the use of non-transparent carrier substrates. A disadvantage of this embodiment is that the stability of the entire stamping element is reduced.

[0063] It is also conceivable that LEDs were created on the surface of the carrier substrate toward the profile element, serving as a direct light source for exposing the embossing compound. In this case, the carrier substrate no longer needs to be transparent, as it itself becomes the light source. If a film is used as the carrier substrate, OLEDs could be used. If the carrier substrate is a semiconductor material, corresponding inorganic LEDs are created.

[0064] Preferably, the film thickness is between 10 pm and 500 pm, more preferably between 50 pm and 400 pm, even more preferably between 100 pm and 350 pm, most preferably between 150 pm and 300 pm, and most preferably between 180 pm and 250 pm. If the carrier substrate is not a film but a wafer, the thickness starts at the maximum SEMI standard thickness of 525 pm. Otherwise, the preferred value ranges are similar.

[0065] In particular, it is provided that the support element is made of an elastic material and / or a thickness of the support element is between 10 nm and 525 pm, preferably between 100 nm and 525 pm, even more preferably between 500 nm and 525 pm, most preferably between 1 pm and 525 pm, most preferably between 1 pm and 525 pm, most preferably between 10 pm and 525 pm. Such thin support elements are generally not dimensionally stable during transport. Furthermore, they are easier to deform locally.

[0066] The support element is preferably brought to its desired thickness by thinning and grinding processes while it is already fixed to the carrier substrate.

[0067] In general, the following process steps, which are particularly used for surface treatment, can be carried out. These include, in particular:

[0068] • Thin

[0069] • Grind

[0070] • Plasma treatment

[0071] • Hydrophilization

[0072] • Hydrophobization

[0073] • Deposition of layers

[0074] • Generation, in particular deposition, of alignment marks

[0075] • Photolithographic structuring of a layer, in particular creation of shadow masks

[0076] • Etching

[0077] • Roughening the substrate surface

[0078] In particular, the creation of alignment marks on the support element represents a significant improvement over the prior art. Due to the rigidity of the support element, alignment marks can be created, particularly deposited, with high accuracy and precision, which can be observed through the profile element and / or the support element and the carrier substrate. In the prior art, the focus is primarily on the soft stamp embossed structures of the profile element, or alignment marks are created directly on the profile element, which is disadvantageous for several reasons. Preferably, the alignment marks are created on the surface where the profile element is located. However, it is also conceivable to create the alignment marks on the surface of the carrier substrate. The creation of shadow masks on the support element allows the definition of exposure areas.This allows exposure masks to be created that ensure that only the desired areas of the embossing material are later exposed.

[0079] After the support element surface has been prepared, the profile element can be manufactured on it, in particular by molding from the master stamp.

[0080] In this case, it is particularly preferred that the material from which the support element is formed has a strength or rigidity that is greater than that of the profile element. This ensures, in particular, that the support element serves as an abutment to prevent parts or sections of the profile element from shifting when engaging the embossing compound.

[0081] A further subject of the present invention is a stamping element for an arrangement according to the invention, wherein the stamping element comprises the profile element and the support element, and wherein the stamping element is dimensionally unstable.

[0082] The term “shape-unstable” is preferably understood to mean that when the support element is contacted at a specific point, the stamping element bends, in particular due to the shape-unstable design of the support element, at least partially due to the acting gravitational force, and in particular is not bent in a dimensionally stable manner. One-sided handling without bending is therefore not possible. Bending is understood to mean a deviation from a horizontal course that is greater than 2°, preferably greater than 5° and particularly preferably greater than 10°. In this case, the furthest outer edge of the stamping element in relation to the contact point, through which the imaginary horizontal plane runs as a reference, is used in particular as a reference. In particular, it is provided that the support element is not designed for the independent transport of the stamping element.For example, the support element lacks the dimensional stability required to ensure it can be transported on its own. For example, the support element is too thin or made of a very elastic or deformable material, which would result in the support element not having the stability required for transport.

[0083] A further advantage is that the stamping element can be placed without the support element or profile element having to be contacted by an object or handling device, thus preventing the stamping element from being damaged and / or contaminated, for example, by the handling device. Instead, contact is made via the easy-to-clean and, in particular, easily replaceable carrier substrates with which the contact is realized.

[0084] A further subject matter of the present invention is a storage device for storing a plurality of assemblies according to the invention. All of the advantages and properties described for the assembly can be applied analogously to the storage device. In particular, it is conceivable for the assembly, particularly with frames, to be arranged one above the other in the storage device. In this case, it is preferably provided that insertion areas are formed into which the respective assemblies can be inserted. In this case, it is preferably provided that the assemblies are spaced apart in the storage device. It is also conceivable, for example, that the frame elements are designed to be so thick that the assembly can be arranged one above the other, with the frame elements touching one another without the profile elements touching the support element above them. This prevents damage to the profile elements.

[0085] Preferably, the storage device is designed to be movable or mobile. This makes it possible, for example, to transport multiple assemblies simultaneously, for example, if the respective stamping elements are to be used in a different stamping device.

[0086] A further subject of the device is a system, in particular a stamping device or imprinting system, with an arrangement according to the invention. All described properties and advantages of the arrangement can be applied analogously to the device. It is particularly preferred if the system is designed to receive the arrangement or to handle it. For example, the system comprises a handling device, such as a robot, which receives the arrangement, transports it, and, for example, places it at a destination. For this purpose, it could, for example, use appropriate referencing on the carrier substrate. It is preferably provided that the system comprises a clean room.

[0087] A further subject of the present invention is a method for handling a stamping element, wherein the stamping element comprises a profile element and a support element, wherein the stamping element is supported by a carrier substrate, wherein the carrier substrate is preferably formed as a film. All advantages and properties described for the arrangement can be applied analogously to the method for handling the stamping element, and vice versa.

[0088] Furthermore, a method for manufacturing an arrangement according to the invention is provided. All advantages and properties described for the arrangement can be applied analogously to the manufacturing method, and vice versa. The manufacturing preferably comprises:

[0089] Providing a carrier substrate

[0090] Attaching a support element to the carrier substrate and

[0091] Connecting the profile element to the support element and / or to the carrier substrate. It is conceivable that the profile element is connected to the support element if the support element is in turn connected to the carrier substrate, or that the support element and profile element are connected to the carrier substrate on opposite sides. A process for producing a hybrid stamp or stamp element is described further in this text.

[0092] In a first process step, a carrier substrate is provided. The carrier substrate is preferably a carrier film stretched over a carrier film frame. The carrier substrate preferably has an adhesive layer. The carrier substrate can be fixed to a substrate holder, in particular by means of fixing devices.

[0093] In a second process step, the support element is positioned relative to the carrier substrate and, if necessary, at least roughly aligned. If a carrier film or carrier substrate frame is available, the support element could be positioned and aligned as centrally as possible to the carrier film frame.

[0094] In a third process step, the support element is connected to the carrier substrate. The support element and carrier substrate approach each other. Preferably, the carrier substrate, especially if it is a carrier film, is fixed to a substrate holder, while the support element is placed on the carrier substrate, preferably from above.

[0095] In a further, optional process step, the support element is thinned back. This thinning process allows the bending ability of the support element to be precisely adjusted. However, unlike the prior art, the support element is already attached to the carrier substrate and is therefore mechanically stabilized by it, allowing it to be thinned to a relatively small thickness.

[0096] In a further, optional process step, the support element surface is polished to adjust the surface properties for the deposition of the stamping compound from which the soft stamp is produced.

[0097] In a further, optional process step, the support element surface is treated with plasma. In a further, optional process step, the support element surface is hydrophilized or hydrophobized.

[0098] In a further, optional process step, layers can be deposited on the support element surface using known deposition techniques. These layers can perform so many functions that they cannot be fully discussed here. Some of the functions would be to improve the adhesion between the support element and the soft stamp, to serve as a release layer to facilitate the removal of the soft stamp from the support element after wear, and to serve as a heating layer heated by an alternating electromagnetic field, thus heating the soft stamp and thus the embossing compound.

[0099] In a further, optional, but particularly preferred process step, alignment marks can be applied to the support element. These serve to align the profile element in subsequent process steps. If the alignment marks are to be created on the surface facing the carrier substrate, they must be created between the first and second process steps.

[0100] In a further process step, an embossing compound is deposited on the support element. Deposition is preferably carried out by droplet dispensing, but other processes are also conceivable.

[0101] In a further process step, the profile element is molded onto the support element using a master stamp, which is preferably a hard stamp.

[0102] In a further process step, the profile element is cured on the support element before the master stamp is removed. Curing is preferably carried out electromagnetically. Thermal or chemical curing is also possible, but more complicated and expensive. Further advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the drawings. These show:

[0103] Fig. 1 an arrangement for providing a stamp element

[0104] Fig. 2 shows a storage device according to an exemplary embodiment of the present invention

[0105] Fig. 3 shows a stamping device, in particular an imprinting device, according to an exemplary embodiment of the present invention and

[0106] Fig. 4 shows an alternative arrangement for providing a stamping element according to an exemplary embodiment of the present invention.

[0107] In the figures, identical components or components with the same function are identified by the same reference numerals. The figures are not to scale. In particular, the thickness ratios of the individual components are incorrect. They are generally shown larger to increase clarity and clarity of representation.

[0108] Figure 1 shows an arrangement according to an exemplary embodiment of the present invention, wherein the arrangement comprises a carrier substrate 2 and a stamp element or a hybrid stamp, i.e. a support element 3 and a soft stamp as a profile element 4. In the present case, the carrier substrate 2 comprises a film 2f, an adhesive layer 2k, and a frame 2r on which the film 2f has been stretched. This type of carrier substrate 2 has the advantage of being standardized and easily transportable. The profile element 4 has soft stamp embossed structures 4p. A support element surface 3s can be treated in a variety of ways before the deposition of the soft stamp. In particular, the production of alignment marks 11 on the support element 3, in particular on the support element surface 3s, is possible and preferred.The use of a film 2f stretched over a frame 2r enables the efficient storage and transport of the stamping element 1. The frames 2r are preferably standardized and therefore fit into corresponding storage devices, in particular transport boxes. In this way, they can be easily fixed by robots and transported over short distances and clamped into devices. It is therefore no longer necessary to handle the profile element 4 with or without the support element 3; instead, handling takes place via a standardized carrier substrate 2, while the functionality of the stamping element 1 lies in the profile element 4 and / or the support element 3. This separates functionality from transportability.

[0109] Figure 2 shows a storage device 5, in particular a transport box 5 (without a lid) in which several stamp elements 1 can be stored. The transport box 5 can be transported between different modules or even between different countries.

[0110] Figure 3 shows a schematic representation of an imprinting device 6, represented by fixing elements 7 and a substrate holder 9, on which a product substrate 8 has been fixed. The carrier substrate 2 and thus the stamp element 1 are fixed by the fixing elements 7. An embossing compound 10 has already been deposited on the product substrate 8. It can be seen that the stamp element 1 is subjected to a force F from the back. The force F can be applied by a deformation element such as a pin. It is also conceivable to generate an overpressure or underpressure behind the carrier substrate. The carrier substrate should preferably be able to withstand a pressure difference from the atmosphere of at least one bar without being destroyed. This would be one possibility for pressing the soft stamp or the profile element 4 into the embossing compound 10.A relative approach of the soft stamp and the product substrate 8 to each other, or a combination of both processes, would also be conceivable. The advantage is that the stamp element 1 as a whole can be easily fixed via the carrier substrate 2 in an imprinting device 6. It is conceivable that a robot (not shown) removes a stamp element 1 from the transport box 5 (see Figure 2) and loads it directly into the imprinting device 6. There, it can then be used directly.

[0111] Figure 4 shows an arrangement according to an exemplary further embodiment of the present invention, which differs from the first embodiment of Figure 1 in that the support element 3 and the profile element 4 are located on opposite sides of the carrier substrate 2. The support element 3 can still serve to mechanically stabilize the profile element 4 or to form an abutment for the profile element 4. In this embodiment, it is advantageous if a fixation is provided between the carrier substrate 2 and the support element 3 in order to prevent the support element 3 from separating from the carrier substrate 2. In addition, the support element 3 has alignment marks 11, which serve to align the profile element 4.

[0112] List of reference symbols

[0113] 1, 1' stamp element

[0114] 2 Carrier substrate

[0115] 2f film 2k adhesive layer

[0116] 2r frame

[0117] 3 Support element

[0118] 4 profile element

[0119] 4p soft stamp embossed structures 5 transport box

[0120] 6 Imprint device

[0121] 7 fixing elements

[0122] 8 Product substrate

[0123] 9 Substrate holder 10 Embossing compound

[0124] 11 alignment marks

Claims

Claims 1 . Arrangement for providing a stamp element (1) which, when used, is intended to leave a structure in a stamping compound (10), comprising: - a profile element (4) which acts on the stamping mass (10) when the stamping element (1) is used, the profile element (4) preferably being designed in the form of a soft stamp, and - a support element (3) which supports the profile element (4) and serves as an abutment in particular when using the stamp element (3), wherein the profile element (4) and the support element (3) are arranged on and / or at a carrier substrate (2) for transport.

2. Arrangement according to claim 1, wherein the carrier substrate (2) is at least partially formed as a film (2f).

3. Arrangement according to claim 2, wherein the carrier substrate (2) is fixed at least in sections in a frame (2r).

4. Arrangement according to claim 2 or 3, wherein a tensioning device is provided for adjusting a film tension.

5. Arrangement according to one of claims 2 to 4, wherein the film (2f) is designed as an endless belt.

6. Arrangement according to one of the preceding claims, wherein the carrier substrate (2) is designed in such a way that a lateral offset of the stamp element (1) is prevented, wherein the carrier substrate (2), in particular the film (2f), preferably for preventing the lateral offset, a coating, for example an adhesive layer (2k), an impact and / or a fixing device, for example a clamping device, and / or is locally deep-drawn.

7. Arrangement according to one of the preceding claims, wherein the carrier substrate (2) has a thickness which assumes a value which lies between 10 pm and 500 pm, preferably between 50 pm and 400 pm, more preferably between 100 pm and 350 pm, most preferably between 150 pm and 300 pm or even between 180 pm and 250 pm.

8. Arrangement according to one of the preceding claims, wherein the arrangement, in particular the support element (3), the carrier substrate (2) and / or the profile element (4), has at least one alignment mark (11).

9. Arrangement according to one of the preceding claims, wherein a thickness of the support element (3) is between 10 nm and 525 pm, preferably between 100 nm and 525 pm, more preferably between 500 nm and 525 pm, most preferably between 1 pm and 525 pm, most preferably between 10 pm and 525 pm 10. Stamp element (1) for an arrangement according to one of the preceding claims, wherein the stamp element (1) comprises the profile element (4) and the support element (3), and wherein the stamp element (1) is dimensionally unstable.

11. Stamp element (1) according to claim 10, wherein the support element (3) has at least its alignment mark (11).

12. Storage device for storing a plurality of arrangements according to one of the preceding claims, wherein the storage device is preferably designed to be mobile, for example as a transport box (5).

13. System, in particular stamping device, for example imprinting device (6), with an arrangement according to one of claims 1 to 9 or a stamping element of claim 10.

14. Method for handling a stamping element (1), wherein the stamping element (1) has a profile element (4) and a supporting element (3), wherein the stamping element (1) is carried by a carrier substrate (2), preferably at least partially formed as a film (2f), in an arrangement according to one of claims 1 to 9.

15. A method for producing the arrangement according to one of claims 1 to 10, preferably comprising: Providing a carrier substrate (2) Connecting a support element (3) to the carrier substrate (2) and - connecting the profile element (4) to the support element (3) and / or to the carrier substrate (2).

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