Printing control device, printing machine, and printing control method

Abstract

This printing control device comprises a trial part and an acquisition part. The trial part prints solder on a substrate according to a control parameter for printing a trial amount of solder smaller than a target amount of the solder to be printed on the substrate. The acquisition unit acquires a control parameter for printing the target amount of solder when the printed amount of the solder printed on the substrate reaches the target amount by at least one printing of solder by the trial unit.

Description

Printing control device, printing machine, and printing control method

[0001] This specification discloses techniques relating to a print control device, a printing machine, and a print control method.

[0002] The screen printing device described in Patent Document 1 first performs a squeegeeing operation using an initial value of printing pressure and inspects the solder filling state using a laser measurement device. Next, if the inspection result is NG, the screen printing device changes the printing pressure at a predetermined increment and repeats the same process until a good inspection result is obtained. The screen printing device then sets the final value of the printing pressure obtained by the above process as a parameter for executing the printing operation.

[0003] Japanese Patent Application Laid-Open No. 2004-351624

[0004] It is assumed that the control parameters for printing solder are changed based on the printing state of solder printed on one board, and the control parameters are adjusted by repeating test printing to print solder on other boards using the changed control parameters. In this case, the more control parameter adjustments are repeated, the more test printing is performed, and the more boards required for adjusting the control parameters may be required.

[0005] In view of the above circumstances, this specification discloses a print control device, a printer, and a print control method that can reduce the number of boards required to adjust control parameters for printing solder.

[0006] This specification discloses a printing control device including a trial unit and an acquisition unit. The trial unit prints solder on a board using control parameters for printing a trial amount of solder that is smaller than a target amount of solder to be printed on the board. The acquisition unit acquires the control parameters for printing the target amount of solder when the amount of solder printed on the board by at least one solder printing by the trial unit becomes the target amount.

[0007] This specification also discloses a printer equipped with the above-mentioned print control device. Furthermore, this specification discloses a print control method including a trial process and an acquisition process. The trial process prints the solder on the board using control parameters for printing a trial amount of solder that is smaller than a target amount of solder to be printed on the board. The acquisition process acquires the control parameters for printing the target amount of solder when the amount of solder printed on the board by at least one solder printing in the trial process reaches the target amount.

[0008] This specification discloses the technical idea of ​​changing "the print control device according to claim 1" to "the print control device according to any one of claims 1 to 4" in claim 5 of the claims originally attached to the application (hereinafter referred to as "initial claims"). Also, this specification discloses the technical idea of ​​changing "the print control device according to claim 1" to "the print control device according to any one of claims 1 to 5" in claim 6 of the initial claims.

[0009] Furthermore, this specification discloses the technical idea of ​​changing "the print control device according to claim 1" to "the print control device according to any one of claims 1 to 6" in claim 7 originally claimed. Also, this specification discloses the technical idea of ​​changing "the print control device according to claim 1" to "the print control device according to any one of claims 1 to 7" in claim 8 originally claimed. Furthermore, this specification discloses the technical idea of ​​changing "the print control device according to claim 1" to "the print control device according to any one of claims 1 to 8" in claim 9 originally claimed.

[0010] According to the above-described printing control device, a trial amount of solder less than the target amount of solder to be printed on the board is printed, and when the amount of solder printed on the board reaches the target amount, control parameters for printing the target amount of solder are obtained. Therefore, the control parameters can be obtained using a minimum of one board, and the number of boards required for adjusting the control parameters can be reduced. What has been described above about the printing control device can also be applied to the printing machine and the printing control method.

[0011] It is a block diagram showing an example of the configuration of a substrate-related work line. It is a partial cross-sectional view showing an example of the configuration of a printing press. It is a block diagram showing an example of a control block of a print control device. It is a flowchart showing an example of a control procedure by the print control device.

[0012] 1. Embodiment 1-1. Configuration Example of Substrate-Related Work Line WML In the substrate-related work line WML, a substrate-related work machine WM0 performs a predetermined substrate-related work on a substrate 90 to produce a product substrate 900. The substrate-related work line WML of the embodiment only needs to include a printer WM1, and the type and number of substrate-related work machines WM0 that make up the substrate-related work line WML are not limited. As shown in Figure 1, the substrate-related work line WML of the embodiment includes multiple (five) substrate-related work machines WM0: a printer WM1, a print inspection machine WM2, a component placement machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0013] The printer WM1 prints solder 80 at the mounting positions of multiple components on the board 90. The print inspection machine WM2 inspects the printing condition of the solder 80 printed by the printer WM1. The component mounting machine WM3 mounts multiple components on the board 90 on which the solder 80 has been printed by the printer WM1. There may be one or more component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the mounting work of multiple components.

[0014] The reflow furnace WM4 heats the board 90 on which multiple components have been mounted by the component mounting machine WM3, melting the solder 80 and performing soldering. The visual inspection machine WM5 inspects the mounting state of the multiple components mounted by the component mounting machine WM3. In this way, the board-related work line WML uses multiple (five) board-related work machines WM0 to sequentially transport the boards 90 and perform production processes including inspection processes to produce the product board 900. Note that the board-related work line WML can also be equipped with other board-related work machines WM0 as needed, such as a function inspection machine, a buffer device, a board supply device, a board inverting device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device.

[0015] The plurality (five) of substrate-related performing machines WM0 and the control device WMC that make up the substrate-related performing line WML are communicatively connected by a communication unit LC0. The communication unit LC0 may perform communication via a wired connection or wirelessly. Various communication methods are possible. In this embodiment, the plurality (five) of substrate-related performing machines WM0 and the control device WMC form a local area network (LAN). This allows the plurality (five) of substrate-related performing machines WM0 to communicate with each other via the communication unit LC0. Furthermore, the plurality (five) of substrate-related performing machines WM0 can communicate with the control device WMC via the communication unit LC0.

[0016] The management device WMC controls the plurality (five) of substrate-related performing machines WM0 that make up the substrate-related performing line WML and monitors the operating status of the substrate-related performing line WML. The management device WMC stores various control data for controlling the plurality (five) substrate-related performing machines WM0. The management device WMC transmits the control data to each of the plurality (five) substrate-related performing machines WM0. Furthermore, each of the plurality (five) substrate-related performing machines WM0 transmits its operating status and production status to the management device WMC.

[0017] The management device WMC may be provided with a data server DSV. The data server DSV may store, for example, acquired data acquired by the substrate-related performing machine WM0 regarding substrate-related performing operations. For example, the acquired data may include various image data captured by the substrate-related performing machine WM0. The acquired data may also include records (log data) of the operating status acquired by the substrate-related performing machine WM0.

[0018] The data server DSV can also store various production information related to the production of the board 90. For example, component data such as information on the shape of each component type, information on electrical characteristics, and information on how to handle the components are included in the production information. Furthermore, the inspection results obtained by inspection machines such as the print inspection machine WM2 and the appearance inspection machine WM5 are included in the acquired data as well as in the production information.

[0019] 1-2. Configuration Example of Printer WM1 In the printer WM1 of this embodiment, the squeegee 34 slides over the stencil 70 to print solder 80 onto the substrate 90 through the openings 71 in the stencil 70. As shown in FIG. 2 , the printer WM1 of this embodiment includes a substrate transport device 10, a stencil support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (the direction perpendicular to the paper surface of FIG. 2 ) is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-axis direction in the horizontal plane (XY plane) (the front-to-rear direction of the printer WM1, the left-to-right direction on the paper surface of FIG. 2 ) is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the X-axis direction and the Y-axis direction (the up-to-down direction on the paper surface of FIG. 2 ) is defined as the Z-axis direction.

[0020] The board transfer device 10 transfers a board 90 to be printed. The board 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, and magnetic circuits are formed. The board transfer device 10 is provided on a base BS1 of the printing machine WM1. The board transfer device 10 transfers the board 90, for example, by a belt conveyor extending in the X-axis direction.

[0021] The substrate transport device 10 includes a substrate holding unit 11 that holds the substrate 90 that has been carried into the printing machine WM1. The substrate holding unit 11 is provided below the stencil 70 and is configured to be able to move up and down in the Z-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 with the upper surface of the substrate 90 in close contact with the lower surface of the stencil 70.

[0022] The stencil support device 20 is provided above the substrate transfer device 10. The stencil support device 20 supports the stencil 70 using a pair of support tables. The pair of support tables are arranged on the left side (the far side of the paper in FIG. 2 and shown in the figure) and the right side (the near side of the paper in FIG. 2 and not shown in the figure) of the printing machine WM1 when viewed from the front, and are formed to extend along the Y-axis direction.

[0023] 2 is a partial cross-sectional view of the printer WM1 taken along the Y-axis direction, and schematically shows the interior of the printer WM1 as viewed from the side, as well as cross sections of the stencil 70 and the substrate 90. The stencil 70 has openings 71 formed therethrough at predetermined positions on the wiring pattern of the substrate 90. The stencil 70 is supported by the stencil support device 20, for example, via a frame member provided on the outer periphery.

[0024] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the stencil 70 (Z-axis direction), and moves the squeegee 34 in the Y-axis direction on the top surface of the stencil 70. The squeegee moving device 30 includes a head driving device 31, a squeegee head 32, a pair of lifting devices 33, 33, and a pair of squeegees 34, 34. The head driving device 31 is disposed on the upper side of the printing machine WM1. The head driving device 31 can move the squeegee head 32 in the Y-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism.

[0025] The squeegee head 32 is clamped and fixed to a moving body that constitutes the linear motion mechanism of the head drive device 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator such as an air cylinder to raise and lower the squeegee 34 that it holds.

[0026] The squeegee 34 slides over the upper surface of the stencil 70, moving the solder 80 supplied to the upper surface of the stencil 70 along the stencil 70. Cream solder (solder paste) can be used as the solder 80. The solder 80 is imprinted onto the substrate 90 through the openings 71 in the stencil 70, and the solder 80 is printed on the substrate 90 arranged on the lower surface side of the stencil 70. In this embodiment, each of the pair of squeegees 34, 34 is a plate-like member formed to extend along a width direction (X-axis direction) perpendicular to the printing direction (Y-axis direction) in a horizontal plane (XY plane).

[0027] The front squeegee 34 (on the left side of FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the front side to the rear side, with the direction from the front side to the rear side of the printer WM1 being the traveling direction. The rear squeegee 34 (on the right side of FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the rear side to the front side, with the direction from the rear side to the front side of the printer WM1 being the traveling direction. Furthermore, for both squeegees 34, the direction opposite to the traveling direction is the retreating direction.

[0028] Each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the front portion located on the traveling direction side faces downward. In other words, each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the back portion located on the retreating direction side faces upward. The inclination angle of each of the pair of squeegees 34, 34 can also be adjusted by an adjustment mechanism provided at the bottom of the lifting device 33, for example.

[0029] The control device 40 includes a known arithmetic unit and storage device, and forms a control circuit. The control device 40 is communicably connected to the management device WMC via the communication unit LC0 shown in FIG. 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, stencil support device 20, squeegee moving device 30, and display device 41 based on the production program, detection results of various sensors, etc.

[0030] As shown in Figure 3, the control device 40 is provided with a storage device 60. The storage device 60 can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device 60 stores a production program for driving the printing press WM1, etc. The control device 40 acquires various pieces of information stored in the storage device 60 and detection results of various sensors provided in the printing press WM1.

[0031] The control device 40, for example, drives and controls the squeegee moving device 30. The control device 40 sends a control signal to the squeegee moving device 30 based on the above-mentioned various information and detection results, etc. This controls the Y-axis position, Z-axis position (height), and movement speed of the pair of squeegees 34, 34 held by the squeegee head 32. Then, as described above, the pair of squeegees 34, 34 are driven and controlled, and solder 80 is printed on the substrate 90 arranged on the underside of the stencil 70.

[0032] As shown in Figures 2 and 3, the control device 40 is provided with a display device 41. The display device 41 can display the operating status of the printing press WM1. The display device 41 is also configured as a touch panel and functions as an input device that accepts various operations by the operator. The operator can learn the operating status of the printing press WM1 via the display device 41. The operator can also set the printing press WM1, give instructions to the printing press WM1, and so on via the display device 41.

[0033] 1-3. Configuration Example of Printing Control Device 50 To improve print quality, it is necessary to adjust the control parameters for printing the solder 80. For example, it is conceivable that the control parameters for printing the solder 80 are changed based on the printing state of the solder 80 printed on one board 90, and the control parameters are adjusted by repeatedly performing test printing in which the changed control parameters are used to print the solder 80 on another board 90. In this case, the more the control parameter adjustments are repeated, the more test printings are performed, and the number of boards 90 required for adjusting the control parameters may increase. In addition, the appropriate control parameters may change due to manufacturing errors in the boards 90, the temperature and humidity inside the printer WM1, and the like.

[0034] Therefore, the substrate-related work line WML of this embodiment is provided with a print control device 50. The print control device 50 prints a trial amount of solder 80 that is less than the target amount of solder 80 to be printed on the board 90, and when the amount of solder 80 printed on the board 90 reaches the target amount, the print control device 50 obtains a control parameter P for printing the target amount of solder 80. Thus, the print control device 50 can obtain the control parameter P using at least one board 90, thereby reducing the number of boards 90 required to adjust the control parameter P.

[0035] Specifically, when considered as a control block, the print control device 50 includes a trial unit 51 and an acquisition unit 52. The print control device 50 can also include a confirmation unit 53. As shown in Fig. 3, the print control device 50 of the embodiment includes the trial unit 51, the acquisition unit 52, and the confirmation unit 53. The trial unit 51, the acquisition unit 52, and the confirmation unit 53 can be provided in various control devices such as the control device of the substrate-related performing machine WM0, and various management devices such as the management device WMC.

[0036] For example, at least one of the trial unit 51, the acquisition unit 52, and the confirmation unit 53 can be provided in the control device 40 of the printing machine WM1. At least one of the trial unit 51, the acquisition unit 52, and the confirmation unit 53 can also be provided in the management device WMC. At least one of the trial unit 51, the acquisition unit 52, and the confirmation unit 53 can also be formed on the cloud. The trial unit 51, the acquisition unit 52, and the confirmation unit 53 can also be distributed and arranged in various control devices, various management devices, on the cloud, etc.

[0037] As shown in FIG. 3 , in the print control device 50 of this embodiment, a trial unit 51, an acquisition unit 52, and a confirmation unit 53 are provided in the control device 40 of the printing machine WM1. The print control device 50 can also execute control according to the flowchart shown in FIG. 4 . The trial unit 51 performs the process shown in step S11. The acquisition unit 52 makes the judgments and performs the processes shown in steps S12 and S13. The confirmation unit 53 performs the process shown in step S14. The matters described in this specification can be selected and applied as appropriate. The matters described in this specification can also be combined as appropriate.

[0038] First, the print control device 50 sets a tentative control parameter P0. The tentative control parameter P0 is a control parameter aimed at printing a target amount of solder 80 to be printed on the board 90. The tentative control parameter P0 may be, for example, a control parameter suggested by a known print control parameter suggesting device that outputs print parameters based on input conditions as a print parameter expected to enable printing the target amount of solder 80 on the board 90, or it may be a control parameter input by an operator based on experience, etc.

[0039] 1-3-1. Trial Unit 51 The trial unit 51 prints solder 80 on the board 90 using a control parameter P1 that prints a trial amount of solder 80 that is smaller than the target amount of solder 80 to be printed on the board 90 (step S11 shown in FIG. 4). The control parameter P1 refers to a control parameter obtained by adjusting the tentative control parameter P0 with the aim of printing a trial amount of solder 80 that is smaller than the target amount of solder 80 to be printed on the board 90. The target amount of solder 80 is the amount of solder 80 to be printed on the target land SL0, and can be set arbitrarily. Furthermore, the trial amount can be set arbitrarily as long as it is smaller than the target amount.

[0040] The target amount and trial amount of solder 80 can be set, for example, using the tolerance range (upper and lower tolerance limits) of the inspection by the print inspection machine WM2. Specifically, the target amount of solder 80 can be set within the tolerance range of the inspection by the print inspection machine WM2 (for example, the median (average) of the upper and lower tolerance limits). Furthermore, the trial amount of solder 80 can be set within the tolerance range of the inspection by the print inspection machine WM2 (for example, less than the median (average) of the upper and lower tolerance limits), or can be set outside the tolerance range of the inspection (less than the lower tolerance limit).

[0041] The target amount of solder 80 can also be set using, for example, a recommended value from the manufacturer of the printer WM1. In this case, the trial amount of solder 80 can be set to be less than the recommended value. The target amount of solder 80 can also be estimated by simulation, prior verification using an actual machine, or the like, based on physical information (e.g., dimensions, material information) regarding the substrate 90, stencil 70, and squeegee 34, and characteristic information (e.g., viscosity, thixotropy ratio information) regarding the properties of the solder 80. In this case, the trial amount of solder 80 can be set to be less than the estimated value.

[0042] The control parameters refer to parameters used when driving and controlling the printer WM1 that prints the solder 80 on the substrate 90. The control parameters are not limited as long as they relate to the amount of solder 80 printed. For example, the printer WM1 of the embodiment slides the squeegee 34 over the stencil 70 to print the solder 80 on the substrate 90 through the openings 71 of the stencil 70. In this case, if the printing pressure is lowered compared to when a target amount of solder 80 is printed, the amount of solder 80 printed on the substrate 90 is likely to be less than the target amount.

[0043] Furthermore, compared to when printing a target amount of solder 80, if the printing speed is increased, the amount of solder 80 printed on the board 90 is likely to be less than the target amount. Furthermore, compared to when printing a target amount of solder 80, if the angle of the squeegee 34 relative to the stencil 70 (squeegee angle) is increased, the amount of solder 80 printed on the board 90 is likely to be less than the target amount. Furthermore, if the speed pattern is different from the speed pattern of the stencil separation speed when printing the target amount of solder 80, the solder 80 will have difficulty coming out of the openings 71 of the stencil 70, and the amount of solder 80 printed on the board 90 will likely be less than the target amount.

[0044] Therefore, the control parameter may be at least one of the printing pressure, printing speed, angle of the squeegee 34 relative to the stencil 70, and plate removal speed when the squeegee 34 is slid over the stencil 70 to print the solder 80 onto the substrate 90 through the openings 71 in the stencil 70. The trial unit 51 changes the at least one control parameter set as the tentative control parameter P0 as described above and sets the changed parameter as the control parameter P1, thereby making it possible to print a trial amount of solder 80 that is smaller than the target amount onto the substrate 90.

[0045] The trial unit 51 performs a first printing run using the control parameter P1. Next, the acquisition unit 52, which will be described later, acquires, via an acquisition device FC0, which will be described later, the printed amount of solder 80 to be inspected from the solder 80 printed on the substrate 90. Because the trial unit 51 prints a trial amount of solder 80 that is smaller than the target amount, it is highly likely that the amount of solder 80 printed on the substrate 90 in the first printing run will not be the target amount. Therefore, the trial unit 51 may perform multiple printing runs in which the squeegee 34 slides multiple times over the stencil 70 to print the solder 80 on the substrate 90 through the openings 71 in the stencil 70, thereby printing the target amount of solder 80 on the substrate 90.

[0046] For example, the multiple printing may be reciprocating printing in which the printing process is performed by moving the solder 80 using both of the pair of squeegees 34, 34 shown in Fig. 2, or unidirectional printing in which the printing process is performed by moving the solder 80 using one of the pair of squeegees 34, 34. In reciprocating printing, for example, after a printing process is performed in which the solder 80 is moved from the front side to the rear side using the squeegee 34 on the front side (left side of the paper in Fig. 2), a printing process is performed in which the solder 80 is moved from the rear side to the front side using the squeegee 34 on the rear side (right side of the paper in Fig. 2).

[0047] In unidirectional printing, for example, a printing process is performed in which the solder 80 is moved from the front side to the rear side using the squeegee 34 on the front side (left side of the paper in FIG. 2 ), followed by a printing process in which the solder 80 is collected using a solder recovery plate and then moved again from the front side to the rear side using the front squeegee 34. In unidirectional printing, a printing process is performed in which the solder 80 is moved from the rear side to the front side using the squeegee 34 on the rear side (right side of the paper in FIG. 2 ), followed by a printing process in which the solder 80 is collected using a solder recovery plate and then moved again from the rear side to the front side using the rear squeegee 34. Note that reciprocating printing can also move the solder 80 using a single squeegee 34. Furthermore, multiple printing can be performed using both reciprocating printing and unidirectional printing.

[0048] The trial unit 51 can use the same control parameter P1 in each of the multiple printings to print a trial amount of solder 80 on the board 90. The trial unit 51 can also set a control parameter P2 obtained by changing the control parameter P1 in at least one of the multiple printings to print a trial amount of solder 80 on the board 90. For example, the trial unit 51 performs the first printing of the multiple printings using the control parameter P1 that prints a trial amount of solder 80 that is slightly smaller than the target amount (for example, 90% of the target amount).

[0049] Then, in the second or subsequent printing of the multiple printings, the trial unit 51 can also perform the second or subsequent printing using a control parameter P2 that prints a trial amount of solder 80 that is sufficiently smaller than that in the first printing (for example, several percent of the target amount). The smaller the trial amount in the second or subsequent printing, the easier it is to adjust the amount of solder 80 printed on the board 90. Furthermore, as described above, since the trial unit 51 prints a trial amount of solder 80 that is smaller than the target amount, there is a high possibility that the amount of solder 80 printed on the board 90 in the first printing will not be the target amount.

[0050] However, even for the same type of substrate 90, the depth from the printing surface PS0 of the solder 80 to the land SL0 may vary depending on the lot. As shown in FIG. 2 , the printing surface PS0 of the solder 80 refers to the surface of the substrate 90 on which the solder 80 is printed, that is, the surface facing the stencil 70. For example, the amount of warping of the substrate 90 may vary depending on the lot, and the depth from the printing surface PS0 of the solder 80 to the land SL0 may vary. Furthermore, the height of the land SL0 may vary depending on the lot, and the depth from the printing surface PS0 of the solder 80 to the land SL0 may vary. If the depth from the printing surface PS0 of the solder 80 to the land SL0 is shallower than normal (e.g., a design value) in a given lot, even if a control parameter P1 that prints a trial amount of solder 80 smaller than the target amount is used, it may be possible to print the target amount of solder 80 on the substrate 90 for that lot.

[0051] Furthermore, for example, the higher the atmospheric humidity inside the machine that prints the solder 80 on the substrate 90, the better the fluidity of the solder 80. As a result, even if the control parameter P1 that prints a trial amount of solder 80 that is smaller than the target amount is used, in the above environment, it may be possible to print the target amount of solder 80 on the substrate 90. In this way, the trial unit 51 can print the target amount of solder 80 on the substrate 90 in a single printing run.

[0052] 1-3-2. Acquisition Unit 52 When the amount of solder 80 printed on the board 90 by at least one printing of solder 80 by the trial unit 51 reaches the target amount, the acquisition unit 52 acquires the control parameter P for printing the target amount of solder 80 (if Yes in step S12 and step S13 shown in FIG. 4). Also, when the amount of solder 80 printed on the board 90 does not reach the target amount, the trial unit 51 repeats printing the trial amount of solder 80 until the amount of solder 80 reaches the target amount (if No in step S12 and step S11).

[0053] However, if the acquisition unit 52 determines that the printed amount of solder 80 to be inspected in the first printing of solder 80 using the control parameter P1 by the trial unit 51 is approximately equal to the trial amount set for the first printing, the acquisition unit 52 may set the provisional control parameter P0 as the control parameter P for printing a target amount of solder 80. In this case, the trial unit 51 prints the solder 80 on the board 90 using the control parameter P1 obtained by adjusting the provisional control parameter P0 so that the printed amount of solder 80 printed on the board 90 becomes the trial amount set for the first printing. As the acquisition unit determines the above, it is assumed that if the solder 80 is printed on the board 90 using the provisional control parameter P0, the printed amount of solder 80 printed on the board 90 will become the target amount.

[0054] The term "printing volume approximately equal to the trial volume" refers to a printing volume within a predetermined range, which defines an upper and lower limit for the trial volume by setting an arbitrary tolerance range. The predetermined range can be preset in the print control device 50, for example. However, in order for a board 90 determined to have a printing volume approximately equal to the trial volume set for the first printing performed by the trial unit 51 using the control parameter P1 to be considered a product board 900, a target amount of solder 80 must be printed on the board 90. Therefore, the trial unit 51 repeats printing on the board 90 until the target amount of solder 80 is reached. On the other hand, if the acquisition unit 52 determines that the amount of solder 80 to be inspected in a single printing of solder 80 performed by the trial unit 51 using the control parameter P1 does not fall within the predetermined range, the trial unit repeats printing the trial amount of solder 80 until the target amount of solder 80 is reached, and then acquires the control parameter P.

[0055] As described above, the acquisition unit 52 may take various forms as long as it is able to acquire the control parameter P for printing the target amount of solder 80. For example, the acquisition unit 52 may acquire an inspection target, which is at least one of the volume, area, and height of the solder 80 printed on the substrate 90, and determine whether the inspection target has reached the target amount. When the inspection target has reached the target amount, this includes when the inspection target is equal to the target amount and when the inspection target has exceeded the target amount.

[0056] For example, the smaller the trial amount of solder 80 that the trial unit 51 uses, the more effectively the test object can be prevented from exceeding the target amount. Therefore, even if the test object exceeds the target amount, the excess amount is more likely to fall within an allowable range (for example, the allowable range for inspection by the print inspection machine WM2 described above) (making it less likely to result in a defective board), thereby reducing the number of boards 90 required to adjust the control parameter P. The acquisition unit 52 can determine whether the test object has reached the target amount using a known acquisition device FC0 capable of acquiring the test object.

[0057] For example, the acquisition device FC0 can irradiate the solder 80 printed on the substrate 90 with moiré fringe light, capture the reflected light with an imaging device, and acquire the above-mentioned inspection object based on the phase difference of the reflected light (phase shift method). The acquisition device FC0 can also capture the solder 80 printed on the substrate 90 from multiple directions with an imaging device, reproducing a three-dimensional shape from the captured parallax images, and acquire the above-mentioned inspection object (stereo camera method). Furthermore, the acquisition device FC0 can irradiate the solder 80 printed on the substrate 90 with laser light, reproducing a three-dimensional shape, and acquire the above-mentioned inspection object (light section method).

[0058] The acquisition device FC0 can also acquire a two-dimensional or three-dimensional shape profile. For example, the acquisition unit 52 can acquire an inspection object including the volume of the solder 80 using the acquisition device FC0, which is a three-dimensional profile sensor that can acquire at least the volume of the solder 80 printed on the substrate 90. The acquisition unit 52 can also acquire an inspection object including the area of ​​the solder 80 using the acquisition device FC0, which is a three-dimensional profile sensor. The acquisition unit 52 can also acquire an inspection object including the height of the solder 80 using the acquisition device FC0, which is a three-dimensional profile sensor.

[0059] The acquisition unit 52 can also acquire the area of ​​the solder 80, etc., using an imaging device capable of acquiring two-dimensional images instead of the acquisition device FC0 of the three-dimensional profile sensor. For example, the acquisition unit 52 can acquire the area of ​​the solder 80 by image processing an image of the solder 80 captured by the imaging device. In the embodiment, the acquisition device FC0 or the imaging device is provided in the printing machine WM1. Therefore, the acquisition unit 52 can acquire the above-mentioned inspection target within the same printing machine WM1 without removing the board 90 on which the trial amount of printing has been performed from the printing machine WM1, and the printing machine WM1 can perform printing multiple times within the same machine as necessary.

[0060] 2, the acquisition device FC0 is provided below the stencil 70 and can be moved in the X-axis direction and the Y-axis direction, for example, by an XY table. This allows the acquisition device FC0 to move linearly above the substrate 90 on which the solder 80 is printed to acquire the inspection target. Specifically, after the first trial amount of printing is performed, the acquisition unit 52 lowers the substrate holding unit 11 to move the substrate 90 on which the solder 80 is printed downward in the vertical direction (Z-axis direction).

[0061] The acquisition unit 52 can acquire the test object by linearly moving the acquisition device FC0 while the substrate 90 is moving downward in the vertical direction (Z-axis direction). If the test object does not reach the target amount (if the test object is smaller than the target amount), the trial unit 51 performs printing multiple times. In this case, the acquisition unit 52 raises the substrate holding unit 11 together with the substrate 90, and causes the substrate holding unit 11 to hold the substrate 90 with the upper surface of the substrate 90 in close contact with the lower surface of the stencil 70. The trial unit 51 can then perform multiple printings (second and subsequent printings) on the substrate 90 held by the substrate holding unit 11. The above-described method for driving the acquisition device FC0 can also be applied to an imaging device capable of acquiring two-dimensional images.

[0062] When the amount of solder 80 printed on the substrate 90 reaches the target amount (when the test object reaches the target amount), the acquisition unit 52 acquires the control parameter P for printing the target amount of solder 80. For example, if the amount of solder 80 printed the first time using the control parameter P1 by the trial unit 51 is outside a predetermined range, the control parameter P1 when the trial unit 51 prints the first solder 80 is set as the first control parameter, and the control parameter when the trial unit 51 prints the second solder 80 is set as the second control parameter. Similarly, the control parameter when the trial unit 51 prints the third solder 80 is set as the third control parameter, and the control parameter when the trial unit 51 prints the fourth solder 80 is set as the fourth control parameter. It is then assumed that the amount of solder 80 printed on the substrate 90 by the fourth solder 80 printing reaches the target amount.

[0063] In the above example, the acquisition unit 52 acquires a first control parameter, a second control parameter, a third control parameter, and a fourth control parameter. The printer WM1 can print a target amount of solder 80 on a verification board 90c, which is a board 90 of the same type as the adjustment board 90t, which is a board 90 on which solder 80 has been printed by the trial unit 51, by directly using the control parameters P acquired by the acquisition unit 52. In the example described above, the printer WM1 can perform four multiple printings on the verification board 90c by sequentially using the first control parameter, the second control parameter, the third control parameter, and the fourth control parameter.

[0064] The printer WM1 can also print a target amount of solder 80 on the confirmation board 90c using the control parameter P' acquired and corrected by the acquisition unit 52. For example, the more multiple printings are performed, the longer the cycle time and the more likely production efficiency will decrease. Therefore, the acquisition unit 52 can acquire a control parameter P' that will result in the target amount of printed solder 80 through a fewer number of printings than the number of multiple printings, based on the control parameter P acquired through multiple printings performed by the trial unit 51. The acquisition unit 52 can also acquire a control parameter P' that will result in the target amount of printed solder 80 through a single printing of solder 80.

[0065] In the example described above, the acquisition unit 52 corrects the control parameters P (first control parameter, second control parameter, third control parameter, and fourth control parameter) acquired by the trial unit 51 performing four multiple printings. The acquisition unit 52 then acquires a control parameter P' (corrected control parameter P') that will result in a target amount of printed solder 80 when printed a number of times (for example, one time) less than the number of multiple printings (four times in this case). For example, if the first to fourth control parameters are the same, the acquisition unit 52 can acquire, as the printing pressure of the corrected control parameter P', a printing pressure that is four times the printing pressure of one of the first to fourth control parameters.

[0066] Furthermore, for example, if the printing pressures of the second to fourth control parameters are 1 / 10 of the printing pressure of the first control parameter, the acquisition unit 52 can acquire a printing pressure that is 1.3 times the printing pressure of the first control parameter as the printing pressure of the corrected control parameter P'. Note that the acquisition unit 52 can similarly acquire the corrected control parameter P' for control parameters P other than the printing pressure. The acquisition unit 52 can also acquire the corrected control parameter P' in the same way when the number of times multiple printings are performed is different. Furthermore, the acquisition unit 52 can also acquire the corrected control parameter P' in the same way when the number of times printing is reduced is different from the number of times multiple printings are performed.

[0067] As described above, for example, even for the same type of substrate 90, the depth from the printing surface PS0 of the solder 80 to the land SL0 may differ depending on the lot. If the depth from the printing surface PS0 of the solder 80 to the land SL0 differs, the amount of solder 80 printed on the substrate 90 may vary even if the control parameter P is the same. Therefore, the acquisition unit 52 can acquire the control parameter P for each lot of the substrate 90. Note that the control parameter P may be the control parameter P before correction, or may be the control parameter P' after correction (corrected control parameter P').

[0068] Furthermore, if the atmospheric humidity inside the machine that prints the solder 80 on the substrate 90 varies, the fluidity of the solder 80 may change, and even if the control parameter P is the same, the amount of solder 80 printed on the substrate 90 may vary. Therefore, the acquisition unit 52 can acquire the control parameter P for each atmospheric humidity inside the machine that prints the solder 80 on the substrate 90. Note that the control parameter P may be the control parameter P before correction, or may be the control parameter P' after correction (corrected control parameter P'). Furthermore, what has been said above about the atmospheric humidity also applies to the atmospheric temperature. Therefore, the acquisition unit 52 can also acquire the control parameter P for each atmospheric temperature inside the machine that prints the solder 80 on the substrate 90.

[0069] 1-3-3. Confirmation Unit 53 Once the acquisition unit 52 has acquired the control parameters P for printing the target amount of solder 80, the second and subsequent boards 90 are printed using the control parameters P acquired by the acquisition unit 52, thereby printing the target amount of solder 80. Therefore, confirmation that the target amount of solder 80 is printed can be omitted. However, from the perspective of ensuring print quality, it is preferable for the print control device 50 to confirm that the target amount of solder 80 is printed. Therefore, the print control device 50 of this embodiment is equipped with a confirmation unit 53.

[0070] The confirmation unit 53 confirms that the target amount of solder 80 is printed on a confirmation board 90c, which is a board 90 of the same type as the adjusted board 90t, which is a board 90 on which the solder 80 has been printed by the trial unit 51, using the control parameter P acquired by the acquisition unit 52 (step S14 shown in FIG. 4). The control parameter P may be the control parameter P before correction or the control parameter P' after correction (corrected control parameter P'). Furthermore, when components are mounted on the adjusted board 90t by the component mounting machine WM3 and the board passes inspection by the visual inspection machine WM5, the adjusted board 90t is included in the product board 900. Similarly, when components are mounted on the confirmation board 90c by the component mounting machine WM3 and the board passes inspection by the visual inspection machine WM5, the confirmation board 90c is included in the product board 900.

[0071] The confirmation unit 53 may take various forms as long as it can confirm that the target amount of solder 80 is printed using the control parameter P acquired by the acquisition unit 52. For example, the confirmation unit 53 may confirm that the target amount of solder 80 is printed on at least one confirmation board 90c of a predetermined number of product boards 900 to be produced, or on at least one confirmation board 90c for each specified number of product boards 900 produced. The predetermined number and the specified number may be set arbitrarily. Furthermore, the above confirmation may be performed at any timing. For example, when starting production of the product boards 900, the confirmation unit 53 may confirm that the target amount of solder 80 is printed on at least the first confirmation board 90c.

[0072] Furthermore, the confirmation unit 53 can also confirm that the target amount of solder 80 is printed on at least the first confirmation board 90c each time a specified number of product boards 900 are produced. In either case, the acquisition unit 52 can use the acquired control parameter P to confirm that the target amount of solder 80 is printed, in the same way as when determining whether the amount of solder 80 printed on the board 90 has reached the target amount (whether the inspection target has reached the target amount).

[0073] When it is confirmed that the target amount of solder 80 will be printed using the acquired control parameter P, the acquisition unit 52 can acquire the control parameter P using at least one board 90. Furthermore, when it is not confirmed that the target amount of solder 80 will be printed, the acquisition unit 52 can also re-acquire the control parameter P for printing the target amount of solder 80. In other words, when it is not confirmed that the target amount of solder 80 will be printed, the print control device 50 can readjust the control parameter P for printing the target amount of solder 80. The readjustment of the control parameter P can be performed by the trial unit 51 and the acquisition unit 52 in the same manner as described above.

[0074] 2. Printing Machine WM1 As already described, the trial unit 51, acquisition unit 52, and confirmation unit 53 can be located in various control devices, various management devices, on the cloud, etc. As shown in FIG. 3 , the printing control device 50 of the embodiment is provided in the printing machine WM1. In other words, the printing machine WM1 can be equipped with the printing control device 50. Note that the printing control device 50 may take any of the forms already described. The printing machine WM1 can be equipped with the printing control device 50 that includes at least the trial unit 51 and the acquisition unit 52 of the trial unit 51, acquisition unit 52, and confirmation unit 53. Duplicate explanations will be omitted in this specification.

[0075] 3. Printing Control Method What has already been described about the printing control device 50 also applies to the printing control method. Specifically, the printing control method includes a trial process and an acquisition process. The trial process corresponds to the control performed by the trial unit 51. The acquisition process corresponds to the control performed by the acquisition unit 52. The printing control method may also include a confirmation process. The confirmation process corresponds to the control performed by the confirmation unit 53. Note that duplicated explanations will be omitted in this specification.

[0076] 4. Example of Effect of the Embodiment According to the print control device 50, a trial amount of solder 80 that is smaller than the target amount of solder 80 to be printed on the board 90 is printed, and when the amount of solder 80 printed on the board 90 reaches the target amount, a control parameter P for printing the target amount of solder 80 is obtained. Therefore, the control parameter P can be obtained using a minimum of one board 90, and the number of boards 90 required to adjust the control parameter P can be reduced. What has been described above about the print control device 50 also applies to the printer WM1 and the print control method.

[0077] 34: Squeegee, 50: Printing control device, 51: Trial unit, 52: Acquisition unit, 53: Confirmation unit, 70: Stencil, 71: Opening, 90: Substrate, 90t: Adjustment substrate, 90c: Confirmation substrate, 900: Product substrate, WM1: Printing machine.

Claims

1. A printing control device comprising: a trial unit that prints solder on a board using control parameters for printing a trial amount of solder that is smaller than a target amount of solder to be printed on the board; and an acquisition unit that acquires the control parameters for printing the target amount of solder when the amount of solder printed on the board by at least one printing of the solder by the trial unit becomes the target amount.

2. The printing control device according to claim 1, wherein the trial unit performs multiple printings by sliding a squeegee over a stencil multiple times to print the solder onto the substrate through openings in the stencil, thereby printing the target amount of solder onto the substrate.

3. A printing control device as described in claim 2, wherein the acquisition unit acquires the control parameters that will result in the target amount of printed solder being achieved by a number of printings that is less than the number of times the multiple printings are performed, based on the control parameters acquired by the trial unit performing the multiple printings.

4. The print control device according to claim 3, wherein the acquisition unit acquires the control parameters such that the printed amount of solder becomes the target amount in one printing of the solder.

5. A printing control device as described in claim 1, wherein the acquisition unit acquires an inspection object, which is at least one of the volume, area, and height of the solder printed on the board, and determines whether the inspection object has reached the target amount.

6. The print control device according to claim 1, wherein the acquisition unit acquires the control parameters for each lot of the substrate.

7. The print control device according to claim 1, wherein the acquisition unit acquires the control parameters for each atmospheric humidity in a machine that prints the solder on the board.

8. A printing control device as described in claim 1, wherein the control parameter is at least one of the printing pressure, printing speed, angle of the squeegee relative to the stencil, and plate release speed when sliding a squeegee over a stencil to print the solder onto the board through the openings in the stencil.

9. A printing control device as described in claim 1, further comprising a confirmation unit that uses the control parameters acquired by the acquisition unit to confirm that the target amount of solder is printed on a confirmation board, which is a board of the same type but different from the adjustment board, which is the board on which the solder is printed by the trial unit.

10. A printing control device as described in claim 9, wherein the confirmation unit confirms that the target amount of solder is printed on at least one of the confirmation boards out of a predetermined number of product boards to be produced, or on at least one of the confirmation boards for each specified number of product boards produced.

11. A printing machine equipped with a print control device according to any one of claims 1 to 10.

12. A printing control method comprising: a trial process of printing the solder on the board using control parameters for printing a trial amount of the solder that is smaller than a target amount of the solder to be printed on the board; and an acquisition process of acquiring the control parameters for printing the target amount of the solder when the amount of the solder printed on the board by at least one printing of the solder in the trial process reaches the target amount.

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