Inspection socket

Abstract

Provided is a socket equipped with a pressing member that is free from wobbling or capable of minimizing wobbling during movement. In a first section where a cover member (120) moves upward by a prescribed distance from a proximity position, the movement of a latch member (150) is regulated by a link mechanism so as to move upward of a placement surface (113a) from a release position by turning about the axis along the depth direction. In a second section where the cover member (120) moves further upward to reach a separation position, the movement of the latch member (150) is regulated by the link mechanism so as to move to a pressing position by moving only downward.

Description

Inspection Socket

[0001] The present invention relates to an inspection socket.

[0002] For example, a test socket used in a burn-in test for a semiconductor package is provided with a member (pressure member) that presses down on the package to prevent the package from lifting off the mounting surface. Conventionally, this pressure member has been configured to rotate to a position where it presses against the top surface of the package in conjunction with the lifting of the test socket cover. However, if the pressure member is in contact with the top surface of the package as it rotates, the horizontal movement of the rotating pressure member can cause the pressure member to scrape against and damage the top surface of the package.

[0003] Patent Document 1 describes a socket for a semiconductor device in which a pressing member moves so as not to scrape the top surface of the package. In the socket of Patent Document 1, the pressing member is rotated by the legs of the pressing member coming into contact with a protruding piece or a guide wall surface.

[0004] Patent No. 4495200

[0005] However, in the configuration of Patent Document 1, a state may occur in which the leg of the pressing member is not in contact with either the protrusion or the guide wall surface, and in such a state, it is expected that the pressing member will wobble / its movement will become unstable.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an inspection socket equipped with a pressing member that does not wobble or can suppress wobbling when moved.

[0007] In order to solve the above problems, the testing socket of the present invention employs the following means: The testing socket according to a first aspect of the present invention comprises a base member having a mounting surface on which a semiconductor package is placed, a cover member attached to the base member and moving in a vertical direction perpendicular to the mounting surface between a proximity position where the cover member is closest to the base member and a remote position where the cover member is farthest from the base member, at least one pressing member moving between an open position that opens the top of the mounting surface so that the semiconductor package can be placed thereon and a pressing position that presses the top surface of the semiconductor package placed on the mounting surface, and a pressing member that moves along the vertical direction. and a link mechanism that moves the pressing member between the open position and the pressing position in response to a movement of the pressing member. In a first section in which the cover member moves upward a predetermined distance from the close position, the movement of the pressing member is restricted by the link mechanism to move from the open position to above the placement surface by rotating about an axis along a first orthogonal direction that is orthogonal to the up-down direction, and in a second section in which the cover member moves further upward to reach the separated position, the movement of the pressing member is restricted by the link mechanism to move only downward to the pressing position.

[0008] According to the testing socket of this aspect, the link mechanism restricts the pressure member's movement from the open position to above the mounting surface by rotating about an axis along the first orthogonal direction during a first section in which the cover member moves upward a predetermined distance from the approach position. During a second section in which the cover member further moves upward to the separated position, the link mechanism restricts the pressure member's movement to move only downward to the pressing position. Therefore, when or immediately before the pressure member presses the semiconductor package, the pressure member moves only downward and not horizontally. This prevents the pressure member from moving horizontally across the top surface of the semiconductor package placed on the mounting surface and scratching the top surface. Furthermore, the movement of the pressure member is constantly restricted by the link mechanism throughout its movement from the open position to the pressing position. Therefore, the pressure member does not wobble or is suppressed from wobbling, preventing damage to the semiconductor package due to the wobbling of the pressure member.

[0009] In the inspection socket according to the second aspect of the present invention, in the first aspect, the link mechanism has a transmission member, a first connecting shaft, a second connecting shaft, and a rotating shaft, the first connecting shaft, the second connecting shaft, and the rotating shaft extend in the first orthogonal direction, the transmission member is connected to the cover member by the first connecting shaft, and to the pressing member by the second connecting shaft, and when a direction orthogonal to the up-down direction and the first orthogonal direction is defined as a second orthogonal direction, the transmission member is connected to the base member by the rotating shaft located between the first connecting shaft and the second connecting shaft in the second orthogonal direction, and by rotating around the rotating shaft, upward movement of the cover member is converted into downward movement of the pressing member, and the movement of the second connecting shaft is restricted so as to move only in the up-down direction.

[0010] In the inspection socket of this embodiment, the transmission member rotates around the pivot shaft, converting the upward movement of the cover member into downward movement of the pressing member, and since the movement of the second connecting shaft is restricted so that it moves only in the vertical direction, the transmission member can impart a component to the pressing member that causes it to move only upward.

[0011] In the inspection socket according to a third aspect of the present invention, in addition to the second aspect, the second connecting shaft portion is located laterally in the second orthogonal direction in a lower region of the placement surface.

[0012] In the inspection socket according to this aspect, the second connecting shaft is located to the side of the lower region of the mounting surface in the second orthogonal direction, making it easier to arrange the pressing member, whose rotation center is the second connecting shaft, in the lateral region of the mounting surface. This reduces the rotation angle (opening / closing angle) of the pressing member required to open the upper portion of the mounting surface. In other words, in an inspection socket with size restrictions, the movable range of the pressing member required to open the upper portion of the mounting surface can be reduced, thereby efficiently opening the upper portion of the mounting surface.

[0013] In the inspection socket according to a fourth aspect of the present invention, in the second or third aspect, the link mechanism has a contact portion, which is provided on the cover member and applies a force to the pressing member to rotate the pressing member around the second connecting shaft portion in the first section.

[0014] According to the inspection socket of this aspect, the link mechanism has a contact portion that is provided on the cover member and that applies a force to the pressing member in the first section to rotate the pressing member around the second connecting shaft portion, so that the pressing member can be reliably rotated by the contact portion.

[0015] An inspection socket according to a fifth aspect of the present invention is configured as the fourth aspect, wherein the link mechanism has a slide shaft portion and a slide groove, the slide shaft portion is provided on the cover member and is located between the first connecting shaft portion and the second connecting shaft portion in the second orthogonal direction, and the slide groove is provided on the pressing member and is configured to allow the slide shaft portion to slide.

[0016] In the inspection socket according to this aspect, the sliding shaft is provided on the cover member and is located between the first connecting shaft and the second connecting shaft in the second orthogonal direction, and the sliding groove is provided on the pressing member and is configured so that the sliding shaft slides, so that the posture of the pressing member is stabilized by the two shafts, the sliding shaft and the second connecting shaft.

[0017] In a sixth aspect of the present invention, in the inspection socket of the fifth aspect, the slide shaft portion is the contact portion, and when the slide shaft portion contacts the slide groove, the pressing member rotates around the second connecting shaft portion.

[0018] According to the inspection socket of this embodiment, the slide shaft portion is the contact portion, and when the slide shaft portion comes into contact with the slide groove, the pressing member rotates around the second connecting shaft portion, so the pressing member can be rotated by utilizing the slide shaft portion and the slide groove, which stabilize the posture of the pressing member.

[0019] In the inspection socket according to a seventh aspect of the present invention, in the second or third aspect, the link mechanism has a contact portion, which is provided on the base member and applies a force to the pressing member to rotate the pressing member around the second connecting shaft portion in the first section.

[0020] According to the inspection socket of this aspect, the link mechanism has a contact portion that is provided on the base member, and in the first section, a force is applied to the pressing member to rotate the pressing member around the second connecting shaft portion, thereby ensuring that the pressing member can be rotated.

[0021] An inspection socket according to an eighth aspect of the present invention is the seventh aspect, wherein the link mechanism has a slide shaft portion and a slide groove, the slide shaft portion is provided on the pressing member and is located above the second connecting shaft portion, and the slide groove is provided on the base member, and the second connecting shaft portion and the slide shaft portion are configured to slide.

[0022] According to the inspection socket of this aspect, the slide shaft is provided on the pressing member and is located above the second connecting shaft, and the slide groove is provided on the base member so that the second connecting shaft and the slide shaft can slide, and therefore the posture of the pressing member is stabilized by the two shafts, the slide shaft and the second connecting shaft.

[0023] A ninth aspect of the present invention is an inspection socket according to the eighth aspect, wherein the slide groove is the contact portion, and the pressing member rotates around the second connecting shaft portion when the slide shaft portion contacts the slide groove.

[0024] According to the inspection socket of this embodiment, the slide groove is the contact portion, and when the slide shaft portion comes into contact with the slide groove, the pressing member rotates around the second connecting shaft portion, so that the pressing member can be rotated by utilizing the slide shaft portion and slide groove, which stabilize the posture of the pressing member.

[0025] The inspection socket according to a tenth aspect of the present invention is the ninth aspect, wherein in the first section, the second connecting shaft portion slides in the slide groove in the up-down direction, and the slide shaft portion slides in the slide groove in the up-down direction and the second direction.

[0026] According to the inspection socket of this aspect, in the first section, the second connecting shaft slides up and down in the slide groove, and the slide shaft slides up and down and in the second direction in the slide groove, so that the pressing member can be rotated around the second connecting shaft by the slide shaft.

[0027] According to the present invention, it is possible to provide a socket equipped with a pressing member that does not wobble or can suppress wobbling when moved.

[0028] 1 is a perspective view of a test socket according to a first embodiment of the present invention (semiconductor package: absent, cover member: distant position). FIG. 2 is a perspective view of a test socket according to a first embodiment of the present invention (semiconductor package: present, cover member: distant position). FIG. 3 is a perspective view of a test socket according to a first embodiment of the present invention (semiconductor package: absent, cover member: close position). FIG. 4 is a perspective view of a test socket according to a first embodiment of the present invention (semiconductor package: present, cover member: close position). FIG. 5 is an exploded perspective view of a test socket according to a first embodiment of the present invention. FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 2 (latch member omitted). FIG. 7 is a cross-sectional view taken along line VI-VI of FIG. 2 (latch member and lever member omitted). FIG. 8 is a perspective view of an installation portion of a base member. FIG. 9 is a perspective view of a lever member. FIG. 10 is a perspective view of a latch member. FIG. 11 is a plan view of a test socket with the latch member in an open position. FIG. 12 is a cross-sectional view taken along line A-A of FIG. 12 (latch member omitted). FIG. 13 is a cross-sectional view taken along line B-B of FIG. 12 (latch member omitted). 12A and 12B are cross-sectional views taken along line A-A of FIG. 12A (latch member and lever member omitted). 12B are cross-sectional views taken along line B-B of FIG. 12A (latch member and lever member omitted). 12C are cross-sectional views of the inspection socket with the latch member in a position between the open position and the upper position. 19C are cross-sectional views taken along line A-A of FIG. 19A (latch member omitted). 19C are cross-sectional views taken along line B-B of FIG. 19A (latch member omitted). ... and lever member omitted). 19C are cross-sectional views taken along line B-B of FIG. 19A (latch member and lever member omitted). 19C are cross-sectional views of the inspection socket when the latch member is moved from the open position to the upper position. 26C are cross-sectional views taken along line A-A of FIG. 26A (latch member omitted). 26C are cross-sectional views taken along line B-B of FIG. 26A (latch member omitted). 27 is a cross-sectional view taken along line AA in FIG. 26 (the latch member and the lever member are omitted).26 (latch member and lever member omitted). FIG. 41 is a cross-sectional view taken along line A-A of FIG. 33. FIG. 42 is a cross-sectional view taken along line B-B of FIG. 33. FIG. 43 is a cross-sectional view taken along line A-A of FIG. 33 (latch member omitted). FIG. 44 is a cross-sectional view taken along line B-B of FIG. 33 (latch member omitted). FIG. 45 is a cross-sectional view taken along line A-A of FIG. 33 (latch member omitted). FIG. 46 is a cross-sectional view taken along line B-B of FIG. 33 (latch member omitted). FIG. 45 is a cross-sectional view taken along line A-A of FIG. 33 (latch member and lever member omitted). FIG. 46 is a cross-sectional view taken along line B-B of FIG. 33 (latch member omitted). FIG. 45 is a cross-sectional view taken along line XLIV-XLIV of FIG. 41. 51. A cross-sectional view taken along line XLV-XLV of FIG. 41. A perspective view of a lever member and a latch member. A perspective view of a latch member. A plan view of the inspection socket with the latch member in the open position. A cross-sectional view taken along line A-A of FIG. 48. A cross-sectional view taken along line B-B of FIG. 48. A plan view of the inspection socket with the latch member in a position between the open position and the upper position. A cross-sectional view taken along line A-A of FIG. 51. A cross-sectional view taken along line B-B of FIG. 51. A plan view of the inspection socket when the latch member is in the upper position from the open position. A cross-sectional view taken along line A-A of FIG. 54. A cross-sectional view taken along line B-B of FIG. 54. A plan view of the inspection socket when the latch member is in the pressed position. A cross-sectional view taken along line A-A of FIG. 57. A cross-sectional view taken along line B-B of FIG. 57.

[0029] First Embodiment An inspection socket according to a first embodiment of the present invention will now be described with reference to Figures 1 to 39. Note that the "up-down direction," "width direction," and "depth direction" used in the following description are generally perpendicular to one another. However, these terms are used for ease of understanding and do not limit the orientation of the inspection socket during use.

[0030] <Configuration of Inspection Socket> The configuration of the inspection socket 100 will be described.

[0031] 1 and 2 , the inspection socket 100 is a device on which a semiconductor package 181 is placed when a burn-in test is performed on the semiconductor package 181. The burn-in test is performed in a state in which the semiconductor package 181, which is placed on the mounting surface 113 a of the pedestal portion 113 of the base member 110, is pressed down by a latch member (pressing member) 150.

[0032] 1 and 2 and 3 and 4 , the latch member 150 is configured to move and rotate in conjunction with the downward movement / upward movement of the cover member 120. Specifically, by moving the cover member 120 from above downward, the latch member 150 moves and rotates to the open position, allowing the semiconductor package 181 to be placed on the mounting surface 113a (the space above the mounting surface 113a is opened, making the mounting surface 113a accessible). Conversely, by moving the cover member 120 from below upward, the latch member 150 rotates and moves to the pressing position, and the latch member 150 presses down the semiconductor package 181 placed on the mounting surface 113a.

[0033] The configuration of the inspection socket 100 will be described in detail below. As shown in Fig. 5, the inspection socket 100 includes a base member 110, a cover member 120, a plurality of lever members (transmission members) 140, and a plurality of latch members 150. The inspection socket 100 also includes a link mechanism that connects two or more of the base member 110, the cover member 120, the lever members 140, and the latch members 150. However, the link mechanism may be included in the configuration of the base member 110, the cover member 120, the lever members 140, and the latch members 150.

[0034] 1 and 5, the base member 110 is a component that is fixed to a substrate (not shown), accommodates the contact pins 171, and has the semiconductor package 181 mounted thereon. The base member 110 constitutes, for example, the lower part of the inspection socket 100. The base member 110 is made of an insulating material (for example, resin).

[0035] As shown in FIGS. 6, 7, and 8, the base member 110 includes, for example, a mounting portion 111, a pin receiving portion 112, and a pedestal portion 113.

[0036] The installation portion 111 is a portion fixed to a substrate (not shown), and constitutes the lower portion of the base member 110. As shown in Fig. 5, a space is formed in the center of the base member 110 in the depth direction (first orthogonal direction) and width direction (second orthogonal direction), and as shown in Figs. 6, 7, and 8, the pin housing portion 112 and the pedestal portion 113 are housed in this space.

[0037] The pin housing 112 is a portion that houses and holds a plurality of contact pins 171. The contact pins 171 are pin-shaped components that extend in the vertical direction and are made of a conductive material (e.g., metal). The upper ends of the contact pins 171 housed and held in the pin housing 112 come into contact with solder balls of the semiconductor package 181.

[0038] The base 113 has a mounting surface 113a on which the semiconductor package 181 is mounted. The mounting surface 113a corresponds to the upper surface of the base 113. The base 113 is attached to the upper part of the pin housing portion 112.

[0039] The base member 110 is formed with a plurality of horizontal grooves 111a (link mechanism) and a plurality of vertical grooves 114 (link mechanism).

[0040] As shown in Fig. 9, the lateral grooves 111a are grooves extending in the width direction and are formed, for example, in the installation portion 111. As shown in Figs. 7, 8, and 9, the lateral grooves 111a are formed in pairs on both sides in the width direction. As shown in Fig. 9, the two lateral grooves 111a constituting one pair face each other in the depth direction. As shown in Fig. 7, protrusions (pivot shafts) 143 protruding in the depth direction of the lever member 140 (link mechanism) are inserted into these lateral grooves 111a. The movement of the protrusions 143 inserted into the lateral grooves 111a is restricted so that they slide only in the width direction.

[0041] As shown in FIG. 8 , the vertical grooves 114 are grooves extending in the vertical direction and are formed in pairs not in the lower region of the mounting surface 113a of the base portion 113 but on both sides of the lower region in the width direction (hereinafter referred to as “side regions”). In this embodiment, the vertical grooves 114 are, for example, gaps defined between the installation portion 111 and the pin accommodating portion 112. The two vertical grooves 114 constituting one pair face each other in the depth direction. Both ends of the second connecting shaft 162 (link mechanism) extending in the depth direction are inserted into these vertical grooves 114. Therefore, the second connecting shaft 162 is located in the side region rather than the lower region of the mounting surface 113a. The second connecting shaft 162 inserted into the vertical grooves 114 is restricted to sliding only in the vertical direction. Although FIG. 8 only shows two vertical grooves 114 located at the back in the depth direction, two vertical grooves 114 are actually also located at the front in the depth direction.

[0042] The base member 110 configured as described above may include parts other than the installation section 111, the pin accommodating section 112, and the pedestal section 113, or at least one of the installation section 111, the pin accommodating section 112, and the pedestal section 113 may be divided into multiple parts, or the multiple parts that make up the base member 110 may be integrated as appropriate.

[0043] 1 and 5, as well as 6, 7, and 8, the cover member 120 is a component that covers the base member 110 from above. The cover member 120 constitutes, for example, the upper part of the inspection socket 100. The cover member 120 is made of an insulating material (for example, resin). A through opening 121 is formed in the center of the cover member 120 in the depth and width directions, and is configured to allow access to the base member 110 (more specifically, the mounting surface 113a of the pedestal portion 113) from the through opening 121.

[0044] As shown in Figures 6, 7, and 8, the cover member 120 is formed with multiple shaft holders 123. The shaft holders 123 are portions that protrude downward from the lower end of both widthwise sides of the cover member 120, with two shaft holders 123 formed on each side (four in total). The two shaft holders 123 on the same side face each other with a gap between them in the depth direction. A lever member 140 fits into the gap between the two shaft holders 123 facing each other in the depth direction. A single first connecting shaft 161 (link mechanism) extending in the depth direction is inserted along the depth direction into the two shaft holders 123 facing each other in the depth direction. At this time, both ends of the first connecting shaft 161 are held by the shaft holders 123. The lever member 140 that fits into the gap between the two shaft holders 123 facing each other in the depth direction is pivotally supported by the first connecting shaft 161 inserted into the shaft holders 123.

[0045] As shown in Figures 5, 6, 7, and 8, the cover member 120 is formed with a plurality of arm portions 122. The arm portions 122 are portions that protrude diagonally downward toward the inside from the inner peripheral walls that face each other in the width direction of the cover member 120, and one arm portion 122 is formed on each of the facing inner peripheral walls at approximately the center in the depth direction (two in total). The arm portions 122 are formed with through holes 122a. The through holes 122a are circular holes formed at the tips of the arm portions 122. A slide shaft portion 163 (link mechanism) extending in the depth direction is inserted into the through holes 122a along the depth direction. The through holes 122a are located more inward in the width direction than the shaft holders 123.

[0046] 5, a plurality of springs 130 that expand and contract in the vertical direction are provided between the cover member 120 and the base member 110. These springs 130 bias the cover member 120 in the vertical direction (upward) so that the cover member 120 moves away from the base member 110. However, the inspection socket 100 is equipped with a mechanism that restricts the movable range of the cover member 120 so that the upward force applied by the springs 130 does not cause the cover member 120 to come off the base member 110.

[0047] When no external force is applied to the cover member 120 (when the cover member 120 is not being pushed in), the force of the spring 130 causes the cover member 120 to wait at a position where it is separated as far as possible from the base member 110 in the vertical direction (hereinafter referred to as the "separate position"). On the other hand, by pressing the cover member 120 toward the base member 110 against the force of the spring 130, the cover member 120 moves to a position where it is as close as possible to the base member 110 in the vertical direction (hereinafter referred to as the "proximate position"). It goes without saying that the separated position varies depending on whether or not a semiconductor package 181 is present and the thickness of the semiconductor package 181.

[0048] It should be noted that any part other than the spring 130 may be used as long as it can bias the cover member 120 upward.

[0049] 6, 7, and 10, the lever member 140 is a component provided in a lateral region of the base member 110. The lever member 140 is made of an insulating material (e.g., resin). The lever member 140 converts the upward movement (hereinafter also referred to as "upward movement") / downward movement (hereinafter also referred to as "downward movement") of the cover member 120 into downward movement / upward movement of the second connecting shaft portion 162 / latch member 150 and transmits the movement.

[0050] Each lever member 140 is formed with a through hole 141 , a long through hole 142 , and a plurality of protrusions (rotation shaft portions) 143 .

[0051] The through-hole 141 is a circular hole formed in the outer portion of the lever member 140 in the width direction. The first connecting shaft 161 inserted into the shaft holding portion 123 of the cover member 120 is inserted into this through-hole 141 along the depth direction. This causes the lever member 140 to be connected to the cover member 120 via the first connecting shaft 161.

[0052] The elongated through-hole 142 is an elongated hole formed in the widthwise inner portion of the lever member 140. The second connecting shaft portion 162 is inserted into this elongated through-hole 142 along the depth direction.

[0053] The protrusions 143 are convex portions formed in the widthwise portion between the through-holes 141 and the elongated through-holes 142. The protrusions 143 protrude outward from both sides in the depthwise direction. That is, there are two protrusions 143, one at the front and one at the back. These protrusions 143 are inserted into the lateral grooves 111a of the base member 110. This connects the lever member 140 to the base member 110.

[0054] The lever member 140 configured as described above functions like a lever / seesaw, with the protrusion 143 as the fulcrum (rotation fulcrum), the first connecting shaft 161 as the force point, and the second connecting shaft 162 as the point of action. That is, by moving the cover member 120 connected to the first connecting shaft 161 up or down, the lever member 140 rotates around the protrusion 143, and the second connecting shaft 162, which is located opposite the first connecting shaft 161 with respect to the protrusion 143, moves up or down. At this time, the second connecting shaft 162 slides only in the up and down direction because its movement is restricted by the vertical groove 114. Furthermore, the protrusion 143 slides only in the width direction (moves while rotating) because its movement is restricted by the horizontal groove 111a.

[0055] 6, 7, and 11, the latch member 150 is, for example, a hook-shaped component provided on a side region of the base member 110. The latch member 150 is made of an insulating material (for example, resin). The latch member 150 presses against the top surface of the semiconductor package 181 placed on the mounting surface 113a and opens the top of the mounting surface 113a so that the semiconductor package 181 can be placed thereon.

[0056] Each latch member 150 is formed with a through hole 151 , at least one slide groove 152 (link mechanism), and a pressing surface 153 .

[0057] The pressing surface 153 is a surface that faces (is substantially parallel to) the mounting surface 113a and / or the top surface of the semiconductor package 181 when the cover member 120 is in the separated position, and is located more inward in the width direction than the second connecting shaft portion 162. Hereinafter, the position of the latch member 150 where the pressing surface 153 presses against (contacts with) the top surface of the semiconductor package 181 will be referred to as the "pressing position." Furthermore, the position of the latch member 150 where the latch member 150 opens the area above the mounting surface 113a so that the semiconductor package 181 can be placed, i.e., the position of the latch member 150 where the pressing surface 153 is located outside the upper region of the mounting surface 113a, will be referred to as the "open position." Furthermore, the position of the latch member 150 where the pressing surface 153 faces the top surface of the semiconductor package 181 but is above the semiconductor package 181 and does not press against (is not in contact with) the semiconductor package 181 will be referred to as the "upper position."

[0058] The through hole 151 is a circular hole formed on the inside in the width direction. The second connecting shaft 162, which is inserted into the elongated through hole 142 of the lever member 140 and into the vertical groove 114 of the base member 110, is inserted into the through hole 151 along the depth direction. As a result, the latch member 150 is connected to the lever member 140 via the second connecting shaft 162, whose movement is restricted by the vertical groove 114.

[0059] The slide groove 152 is a groove formed outside the through hole 151 in the width direction. The slide groove 152 extends in the vertical direction when the latch member 150 is in the pressed position or the upper position. The width dimension of the slide groove 152 is approximately equal to or slightly larger than the diameter of the slide shaft portion 163. The slide shaft portion 163, which is inserted into the arm portion 122 of the cover member 120, is inserted into this slide groove 152 along the depth direction. This connects the latch member 150 to the cover member 120 via the slide shaft portion 163. The slide shaft portion 163 slides while always in contact with some portion of the inner circumferential surface of the slide groove 152.

[0060] In this embodiment, two slide grooves 152 are provided for each latch member 150. The two slide grooves 152 (more specifically, the portions where the slide grooves 152 are formed) face each other with a gap between them in the depth direction. The arm portion 122 of the cover member 120 fits into the gap between the two slide grooves 152 facing each other in the depth direction.

[0061] As shown in FIG. 6 , a connection portion 154 is formed at an end of the latch member 150 (the end opposite the pressing surface 153, the lower end in FIG. 6 ). The connection portion 154 is located between the two portions where the slide groove 152 is formed and is connected to these two portions. In other words, the connection portion 154 connects the two portions where the slide groove 152 is formed. An arm-facing surface 154a is formed on the connection portion 154. The arm-facing surface 154a is a surface that faces the arm portion 122 of the cover member 120. The arm-facing surface 154a faces upward, for example, when the latch member 150 is in the pressing position or the upper position.

[0062] The latch member 150 configured as described above moves between an open position, an upper position, and a pressed position. At this time, the latch member 150 is pivotally supported by the second connecting shaft 162 inserted into the through hole 151, and the slide shaft 163 inserted into the arm 122 of the cover member 120 is always in contact with the slide groove 152, so that the movement of the latch member 150 is restricted and the wobbling of its posture is suppressed.

[0063] <Movement of the Inspection Socket> The movement of the latch member 150 when it moves from the release position to the pressing position after the semiconductor package 181 is placed on the base portion 113 will be described.

[0064] Fig. 12 shows a plan view of the inspection socket 100 viewed from above with the latch member 150 in the open position. Cross-sectional views taken along lines A-A and B-B in Fig. 12 are shown in Figs. 13 and 14. Cross-sectional views taken along lines A-A and B-B in Fig. 12 are shown in Figs. 15 and 16 (the latch member 150 is omitted). Cross-sectional views taken along lines A-A and B-B in Fig. 12 are shown in Figs. 17 and 18 (the lever member 140 and the latch member 150 are omitted).

[0065] 13 to 18, when the cover member 120 is in the close position, the latch member 150 is in the open position. The first connecting shaft 161 is located at the lowest position within its movable range. The second connecting shaft 162 is located at the highest position within its movable range. The slide groove 152 of the latch member 150 is inclined to correspond to the inclination of the latch member 150.

[0066] Fig. 19 shows a plan view of the inspection socket 100 viewed from above, with the latch member 150 in a position between the open position and the upper position. Also, cross-sectional views taken along lines A-A and B-B in Fig. 19 are shown in Figs. 20 and 21. Also, cross-sectional views taken along lines A-A and B-B in Fig. 19 are shown in Figs. 22 and 23 (the latch member 150 is omitted). Also, cross-sectional views taken along lines A-A and B-B in Fig. 19 are shown in Figs. 24 and 25 (the lever member 140 and the latch member 150 are omitted).

[0067] As shown in Figures 20 to 25, when the cover member 120 moves upward from the close position (but has not yet reached the distant position), the latch member 150 is positioned between the open position and the upper position. Specifically, as the latch member 150 rotates around the second connecting shaft 162, the pressing surface 153 moves inward in the width direction (the latch member 150 closes). However, the pressing surface 153 does not face the top surface of the semiconductor package 181. This movement will be described in detail below. Specifically, when the cover member 120 moves upward from the close position, the first connecting shaft 161 provided on the cover member 120 moves upward. When the first connecting shaft 161 moves upward, the second connecting shaft 162 moves downward due to the function of the lever member 140, which rotates around the protrusion 143. When the second connecting shaft 162 moves downward, the latch member 150 connected to the second connecting shaft 162 moves downward. At this time, the slide shaft portion 163 serving as a contact portion provided on the cover member 120 comes into contact with the inner circumferential surface of the slide groove 152 formed in the latch member 150, and applies a force to the latch member 150 (slide groove 152) to rotate the latch member 150 about the second connecting shaft portion 162. This causes the latch member 150 to rotate about the second connecting shaft portion 162. In Figure 21, the contact point between the slide shaft portion 163 and the slide groove 152 is indicated by a black circle, and the force that rotates the latch member 150 about the second connecting shaft portion 162 is indicated by a black arrow.

[0068] Fig. 26 shows a plan view of the inspection socket 100 as viewed from above when the latch member 150 is in the upper position from the open position. Also, cross-sectional views taken along the lines A-A and B-B in Fig. 26 are shown in Figs. 27 and 28. Also, cross-sectional views taken along the lines A-A and B-B in Fig. 26 are shown in Figs. 29 and 30 (the latch member 150 is omitted). Also, cross-sectional views taken along the lines A-A and B-B in Fig. 26 are shown in Figs. 31 and 32 (the lever member 140 and the latch member 150 are omitted).

[0069] As shown in Figures 27 to 32, when the cover member 120 moves further upward (not yet to the separated position), the latch member 150 moves from the open position to the upper position. Specifically, as the latch member 150 further rotates about the second connecting shaft 162, the pressing surface 153 moves further inward in the width direction, so that the pressing surface 153 faces (but does not contact) the top surface of the semiconductor package 181. This movement will be described in detail below. That is, as the cover member 120 moves further upward, the first connecting shaft 161 provided on the cover member 120 moves further upward. As the first connecting shaft 161 moves further upward, the second connecting shaft 162 moves further downward due to the function of the lever member 140, which rotates about the protrusion 143. As the second connecting shaft 162 moves further downward, the latch member 150 connected to the second connecting shaft 162 moves further downward. At this time, the slide shaft portion 163, which serves as a contact portion provided on the cover member 120, comes into contact with the inner circumferential surface of the slide groove 152 formed in the latch member 150, applying a force to the latch member 150 (slide groove 152) to rotate the latch member 150 about the second connecting shaft portion 162. When the latch member 150 moves downward and rotates about the second connecting shaft portion 162 so that the extending direction of the slide groove 152 is substantially aligned with the vertical direction, the slide shaft portion 163, which moves only vertically, simply slides vertically in the slide groove 152 and no longer applies a force to the latch member 150 (slide groove 152) to rotate the latch member 150 about the second connecting shaft portion 162. This completes the rotation of the latch member 150. That is, the latch member 150 moves from the open position to the upper position, and the pressing surface 153 faces (but does not contact) the top surface of the semiconductor package 181.

[0070] The section in which the cover member 120 moves upward by a predetermined distance from the close position while the latch member 150 moves from the open position to the upper position is referred to as the "first section."

[0071] Fig. 33 shows a plan view of the inspection socket 100 as viewed from above when the latch member 150 is in the pressing position. Also, cross-sectional views taken along the lines A-A and B-B in Fig. 33 are shown in Figs. 34 and 35. Also, cross-sectional views taken along the lines A-A and B-B in Fig. 33 are shown in Figs. 36 and 37 (the latch member 150 is omitted). Also, cross-sectional views taken along the lines A-A and B-B in Fig. 33 are shown in Figs. 38 and 39 (the lever member 140 and the latch member 150 are omitted).

[0072] As shown in Figures 34 to 39, when the cover member 120 moves further upward and reaches the separated position, the latch member 150 moves from the upper position to the pressing position. Specifically, as the latch member 150 moves downward, the pressing surface 153 comes into contact with the upper surface of the semiconductor package 181 and presses the semiconductor package 181. This movement will be described in detail below. That is, as the cover member 120 moves further upward, the first connecting shaft 161 provided on the cover member 120 moves further upward. As the first connecting shaft 161 moves further upward, the second connecting shaft 162 moves further downward due to the function of the lever member 140, which rotates about the protrusion 143. As the second connecting shaft 162 moves further downward, the latch member 150 connected to the second connecting shaft 162 moves further downward. As described above, the slide shaft 163 provided on the cover member 120 is already in a state in which it does not apply a force to the latch member 150 (slide groove 152) that would rotate the latch member 150. Therefore, the latch member 150 simply moves downward. However, the slide shaft 163 is in contact with the slide groove 152, which prevents the latch member 150 from wobbling. As the latch member 150 moves further downward, the pressing surface 153 eventually comes into contact with the top surface of the semiconductor package 181 and presses the semiconductor package 181. In other words, the latch member 150 is positioned in the pressing position.

[0073] The section in which the cover member 120 moves further upward and reaches the remote position while the latch member 150 moves from the upper position to the pressing position is referred to as the “second section.” In other words, the section from the end of the first section to the remote position is referred to as the “second section.”

[0074] While the latch member 150 moves from the upper position to the pressing position, the latch member 150 moves only downward in the vertical direction, and does not move in the width or depth directions. Therefore, the pressing surface 153 that contacts the top surface of the semiconductor package 181 does not move in the width or depth directions, and the pressing surface 153 does not rub against and scratch the top surface of the semiconductor package 181. Furthermore, by appropriately ensuring the distance that the latch member 150 moves from the upper position to the pressing position (i.e., the distance that it moves only in the vertical direction), the inspection socket 100 can be adapted to the specifications of semiconductor packages 181 having various thicknesses.

[0075] When the latch member 150 is moved from the pressed position to the released position, the cover member 120, which is in the separated position, is pushed toward the base member 110. At this time, the cover member 120 moves from the separated position through the second section and the first section to reach the close position. When the cover member 120 moves through the first section toward the close position, the slide shaft portion 163 serving as a contact portion provided on the cover member 120 comes into contact with the lower portion of the inner circumferential surface of the slide groove 152 formed in the latch member 150, applying a force to the latch member 150 (slide groove 152) to rotate the latch member 150 about the second connecting shaft portion 162. Then, as the latch member 150 rotates about the second connecting shaft portion 162, the pressing surface 153 moves outward in the width direction (the latch member 150 opens). As shown in FIG. 11 , an inclined surface 152a may be formed on the lower portion of the inner circumferential surface of the slide groove 152, which contacts the slide shaft portion 163 when the latch member 150 opens. The inclined surface 152a is a flat surface that slopes diagonally downward from the outer side toward the inner side in the width direction. When the slide shaft portion 163 contacts this inclined surface 152a, downward and outward forces (forces that rotate the latch member 150 around the second connecting shaft portion 162) are applied to the slide groove 152, thereby ensuring reliable rotation of the latch member 150. However, the lower portion of the inner circumferential surface of the slide groove 152 does not have to be the inclined surface 152a. For example, as shown by the two-dot chain line in FIG. 11 , it may be a simple circumferential surface. Even in this case, the slide shaft portion 163, which serves as a contact portion, can contact the lower end of the inner circumferential surface of the slide groove 152 and apply a downward force (force that rotates the latch member 150 around the second connecting shaft portion 162) to the slide groove 152. Furthermore, when the cover member 120 moves through the first section toward the close position, the lower end of the arm portion 122 serving as a contact portion provided on the cover member 120 can be brought into contact with the arm opposing surface 154a (see Figure 6) formed on the latch member 150, thereby applying a force to the latch member 150 (arm opposing surface 154a) to rotate the latch member 150 around the second connecting shaft portion 162.

[0076] <Modification 1> First connecting shaft 161 was a component separate from cover member 120 and lever member 140, but it may be formed integrally with cover member 120 or lever member 140. Additionally, second connecting shaft 162 was a component separate from latch member 150, but it may be formed integrally with latch member 150. Additionally, slide shaft 163 was a component separate from cover member 120, but it may be formed integrally with cover member 120. Additionally, protrusion 143 was formed integrally with lever member 140, but it may be replaced with a shaft-shaped component separate from lever member 140 that is inserted into lever member 140.

[0077] <Modification 2> Although the latch member 150 is rotated by bringing the slide shaft portion 163 into contact with the slide groove 152, the mechanism for applying a force to the latch member 150 to rotate the latch member 150 is not limited to the combination of these parts. For example, a force to rotate the latch member 150 may be applied to the latch member 150 by bringing the arm portion 122 of the cover member 120 into contact with any part of the latch member 150. Furthermore, a force to rotate the latch member 150 may be applied to the latch member 150 by appropriately setting the center of gravity position of the latch member 150.

[0078] <Modification 3> The inspection socket 100 described so far has two latch members 150 facing each other in the width direction. However, if the size of the semiconductor package 181 is large, for example, the inspection socket 100 may have two other latch members 150 facing each other in the depth direction. In this case, the total number of shaft holding portions 123 formed on the cover member 120 will be eight.

[0079] Advantages of the Present Embodiment When the cover member 120 is in the first section, the movement of the latch member 150 is restricted by the link mechanism to move from the open position to the upper position by rotating about the second connecting shaft 162 along the depth direction, and when the cover member 120 is in the second section, the movement of the latch member 150 is restricted by the link mechanism to move only downward from the upper position to the pressing position. Therefore, when / just before the latch member 150 presses the semiconductor package 181, the latch member 150 moves only downward and does not move horizontally (in the depth direction or width direction). Therefore, the latch member 150 does not move horizontally on the top surface of the semiconductor package 181 placed on the mounting surface 113 a, thereby rubbing against and damaging the top surface of the semiconductor package 181. Furthermore, the movement of the latch member 150 is constantly restricted by the link mechanism while moving from the open position to the pressing position. Therefore, the latch member 150 does not wobble or the wobbling of the latch member 150 is suppressed, so that the semiconductor package 181 is not damaged due to the wobbling of the latch member 150.

[0080] Because the second connecting shaft 162 is located to the side (side region) in the width direction of the lower region of the mounting surface 113a, the latch member 150, which rotates around the second connecting shaft 162, can be easily disposed in the side region. This makes it possible to reduce the rotation angle (opening / closing angle) of the latch member 150 required to open the upper portion of the mounting surface 113a compared to when the rotation center of the latch member 150 (second connecting shaft 162) is located in the lower region of the mounting surface 113a. In other words, in an inspection socket 100 with size restrictions, the movable range of the latch member 150 required to open the upper portion of the mounting surface 113a can be reduced, thereby enabling the upper portion of the mounting surface 113a to be opened efficiently.

[0081] The link mechanism has a slide shaft portion 163 as a contact portion, and the slide shaft portion 163 is provided on the cover member 120. When the cover member 120 is in the first section, the slide shaft portion 163 applies a force to the latch member 150 to rotate the latch member 150 around the second connecting shaft portion 162, thereby enabling the latch member 150 to rotate reliably.

[0082] Second Embodiment An inspection socket according to a second embodiment of the present invention will now be described with reference to Figures 40 to 59. Note that the "up-down direction," "width direction," and "depth direction" used in the following description are generally perpendicular to one another. However, these terms are used for ease of understanding and do not limit the orientation of the inspection socket during use.

[0083] <Configuration of Inspection Socket> The configuration of the inspection socket 200 will be described.

[0084] 40 and 41 , the inspection socket 200 is a device on which a semiconductor package 281 is placed when a burn-in test is performed on the semiconductor package 281. The burn-in test is performed in a state in which the semiconductor package 281 placed on the mounting surface 213 a of the pedestal portion 213 of the base member 210 is pressed down by a latch member (pressing member) 250.

[0085] 40 and 41, 42 and 43, the latch member 250 is configured to move and rotate in conjunction with the downward movement / upward movement of the cover member 220. Specifically, by moving the cover member 220 from above downward, the latch member 250 moves and rotates to the open position, allowing the semiconductor package 281 to be placed on the mounting surface 213a (the space above the mounting surface 213a is opened, making the mounting surface 213a accessible). Conversely, by moving the cover member 220 from below upward, the latch member 250 rotates and moves to the pressing position, and the latch member 250 presses down the semiconductor package 281 placed on the mounting surface 213a.

[0086] The configuration of the inspection socket 200 will be described in detail below. As shown in Figures 40, 41, and 44, the inspection socket 200 includes a base member 210, a cover member 220, a plurality of lever members (transmission members) 240, and a plurality of latch members 250. The inspection socket 200 also includes a link mechanism that connects two or more of the base member 210, the cover member 220, the lever members 240, and the latch members 250. However, the link mechanism may be included in the configuration of the base member 210, the cover member 220, the lever members 240, and the latch members 250.

[0087] The base member 210 is a component that is fixed to a substrate (not shown), accommodates the contact pins 271, and has the semiconductor package 281 mounted thereon. The base member 210 constitutes, for example, the lower part of the inspection socket 200. The base member 210 is made of an insulating material (for example, resin).

[0088] As shown in FIGS. 44 and 45, the base member 210 includes, for example, a pin receiving portion 212 and a pedestal portion 213 .

[0089] The pin housing portion 212 is fixed to a substrate (not shown) and is a portion that houses and holds a plurality of contact pins 271, and constitutes the lower portion of the base member 210. The contact pins 271 are pin-shaped components that extend in the vertical direction and are made of a conductive material (e.g., metal). The upper ends of the contact pins 271 housed and held in the pin housing portion 212 come into contact with solder balls of the semiconductor package 281.

[0090] The base 213 has a mounting surface 213a on which the semiconductor package 281 is mounted. The mounting surface 213a corresponds to the upper surface of the base 213. The base 213 is attached to the upper part of the pin housing portion 212.

[0091] The base member 210 is formed with a plurality of slide grooves 212a (link mechanisms) and through holes 212b.

[0092] As shown in FIG. 45 , the slide groove 212a includes a lower groove portion 212a1 extending vertically and an upper groove portion 212a2 connecting to the upper end of the lower groove portion 212a1 and extending diagonally upward toward the outside in the width direction. The slide groove 212a is formed, for example, in the pin housing portion 212. The width of the slide groove 212a is approximately equal to or slightly larger than the diameter of the second connecting shaft portion 262 and the slide shaft portion 263. The slide grooves 212a are formed in pairs not in the lower region of the mounting surface 213a of the base portion 213, but on both sides in the width direction of the lower region (hereinafter referred to as "side regions"). The two slide grooves 212a constituting one pair face each other in the depth direction. The two ends of the second connecting shaft portion 262 (link mechanism) extending in the depth direction and the two ends of the slide shaft portion 263 (link mechanism) extending in the depth direction are inserted into these slide grooves 212a. Therefore, the second connecting shaft 262 and the slide shaft 263 are located in a lateral region rather than a lower region of the mounting surface 213a. The second connecting shaft 262 and the slide shaft 263 inserted into the slide groove 212a are restricted in movement so as to slide along the slide groove 212a.

[0093] The through hole 212b is a circular hole formed outside the lower groove portion 212a1 of the slide groove 212a in the width direction. A rotation shaft portion 264 (link mechanism) extending in the depth direction is inserted into the through hole 212b along the depth direction.

[0094] The base member 210 configured as described above may include parts other than the pin accommodating portion 212 and the pedestal portion 213, or at least one of the pin accommodating portion 212 and the pedestal portion 213 may be divided into multiple parts, or the multiple parts that make up the base member 210 may be integrated as appropriate.

[0095] 40 and 41 , as well as 44 and 45 , the cover member 220 is a component that covers the base member 210 from above. The cover member 220 constitutes, for example, the upper part of the inspection socket 200. The cover member 220 is made of an insulating material (for example, resin). A through opening 221 is formed in the center of the cover member 220 in the depth and width directions, and is configured to allow access to the base member 210 (more specifically, the mounting surface 213 a of the pedestal portion 213) from the through opening 221.

[0096] The cover member 220 is formed with a plurality of shaft holders 223. The shaft holders 223 are portions that protrude downward from the lower end of both sides of the cover member 220 in the width direction, with two shaft holders 223 formed on each side (four in total). Two shaft holders 223 on the same side face each other with a gap between them in the depth direction. A single first connecting shaft 261 (link mechanism) extending in the depth direction is inserted into the two opposing shaft holders 223 along the depth direction. At this time, both ends of the first connecting shaft 261 are held by the respective shaft holders 223.

[0097] 40 and 41 , a slit 223a is formed in each shaft holding portion 223. The slit 223a is a slit (long, narrow gap) that extends upward from the lower end of the shaft holding portion 223. The lever member 240 fits into this slit 223a. At this time, the lever member 240 that fits into the slit 223a is pivotally supported by the first connecting shaft portion 261 inserted into the shaft holding portion 223.

[0098] Springs 230 that expand and contract in the vertical direction are provided between the cover member 220 and the base member 210. These springs 230 bias the cover member 220 in the vertical direction (upward) so that the cover member 220 moves away from the base member 210. However, the inspection socket 200 is equipped with a mechanism that restricts the movable range of the cover member 220 so that the upward force applied by the springs 230 does not cause the cover member 220 to come off the base member 210.

[0099] When no external force is applied to the cover member 220 (when the cover member 220 is not being pushed in), the force of the spring 230 causes the cover member 220 to wait at a position where it is separated as far as possible from the base member 210 in the vertical direction (hereinafter referred to as the "separated position"). On the other hand, by pressing the cover member 220 toward the base member 210 against the force of the spring 230, the cover member 220 moves to a position where it is as close as possible to the base member 210 in the vertical direction (hereinafter referred to as the "proximal position"). It goes without saying that the separated position varies depending on whether or not a semiconductor package 281 is present and the thickness of the semiconductor package 281.

[0100] It should be noted that any part other than the spring 230 may be used as long as it can bias the cover member 220 upward.

[0101] 44, 45, and 46, the lever member 240 is a component provided in a side region of the base member 210. The lever member 240 is formed from, for example, metal or resin. The lever member 240 converts the upward movement (hereinafter also referred to as "upward movement") / downward movement (hereinafter also referred to as "downward movement") of the cover member 220 into downward movement / upward movement of the second connecting shaft portion 262 / latch member 250 and transmits the movement.

[0102] Each lever member 240 is formed with a long through hole 241 , a tip groove 242 and a through hole 243 .

[0103] The elongated through-hole 241 is an elongated hole formed in the outer portion of the lever member 240 in the width direction. The first connecting shaft 261 inserted into the shaft holding portion 223 of the cover member 220 is inserted into this elongated through-hole 241 along the depth direction. This causes the lever member 240 to be connected to the cover member 220 via the first connecting shaft 261.

[0104] The tip groove 242 is a groove formed in an inner portion in the width direction of the lever member 240. The tip groove 242 is formed, for example, by bifurcating the tip of the lever member 240. The second connecting shaft portion 262 is inserted into this tip groove 242.

[0105] The through hole 243 is a circular hole formed in the width direction between the elongated through hole 241 and the tip groove 242. The pivot shaft 264 inserted into the through hole 212b of the base member 210 is inserted into the through hole 243 along the depth direction. This connects the lever member 240 to the base member 210 via the pivot shaft 264.

[0106] The lever member 240 configured as described above functions like a lever / seesaw, with the pivot shaft 264 as the fulcrum (rotation fulcrum), the first connecting shaft 261 as the force point, and the second connecting shaft 262 as the point of action. That is, by moving the cover member 220 connected to the first connecting shaft 261 up or down, the lever member 240 rotates around the pivot shaft 264, and the second connecting shaft 262, which is located opposite the first connecting shaft 261 relative to the pivot shaft 264, moves up or down. At this time, the movement of the second connecting shaft 262 is restricted by the lower groove portion 212a1 of the slide groove 212a, so it slides only in the up and down direction. Note that the second connecting shaft 262 does not reach the upper groove portion 212a2 of the slide groove 212a.

[0107] 44 and 45, 46 and 47, the latch member 250 is a component provided in a side region of the base member 210. The latch member 250 presses the upper surface of the semiconductor package 281 placed on the mounting surface 213a, and also opens the upper side of the mounting surface 213a so that the semiconductor package 281 can be placed thereon.

[0108] The latch member 250 has a main body portion 251 and a pressing portion 252 .

[0109] The main body portion 251 is, for example, a hook-shaped component provided in a side region of the base member 210. The main body portion 251 is made of an insulating material (for example, resin).

[0110] The pressing portion 252 is a member pivotally supported at the tip of the main body portion 251. The pressing portion 252 is made of an insulating material (e.g., resin). As shown in Fig. 47, each pressing portion 252 is formed with a pressing surface 252a and a protrusion 252b.

[0111] The pressing surface 252a is a surface that faces (is substantially parallel to) the mounting surface 213a and / or the upper surface of the semiconductor package 281 when the cover member 220 is in the separated position, and is located more inward in the width direction than the second connecting shaft portion 262. Hereinafter, the position of the latch member 250 where the pressing surface 252a presses against (contacts with) the upper surface of the semiconductor package 281 will be referred to as the "pressing position." Furthermore, the position of the latch member 250 where the latch member 250 opens the area above the mounting surface 213a so that the semiconductor package 281 can be placed, i.e., the position of the latch member 250 where the pressing surface 252a is located outside the upper region of the mounting surface 213a, will be referred to as the "release position." In addition, the position of the latch member 250 in which the pressing surface 252a faces the upper surface of the semiconductor package 281 but is above the semiconductor package 281 and does not press the semiconductor package 281 (is not in contact with the upper surface) is called the "upper position."

[0112] The protrusions 252b are convex portions formed above the pressing surface 252a. The protrusions 252b protrude inward from both sides in the depth direction. That is, there are two protrusions 252b, one at the front and one at the back. These protrusions 252b are fitted into recesses 251c formed at the tip of the main body 251. Details will be described later.

[0113] As shown in FIGS. 46 and 47, each main body portion 251 is formed with a lower through-hole 251a, an upper through-hole 251b, and a recess 251c.

[0114] The depressions 251c are recessed portions formed at the tip of the main body portion 251. The depressions 251c are recessed inward from both sides in the depth direction. The protrusions 252b of the pressing portion 252 are fitted into these depressions 251c from the outside. This allows the pressing portion 252 to be rotatably connected to the main body portion 251. A gap is formed between the outer peripheral surface of the protrusions 252b and the inner peripheral surface of the depressions 251c, allowing the pressing portion 252 to swing like a pendulum relative to the main body portion 251. This makes it easier for the pressing surface 252a to come into surface contact with the upper surface of the semiconductor package 281. However, the main body portion 251 and / or the pressing portion 252 may be provided with a mechanism for restricting the rotation range of the pressing portion 252 so that the pressing portion 252 does not swing more than necessary relative to the main body portion 251.

[0115] The lower through-hole 251a is a circular hole. The second connecting shaft 262, which is inserted into the tip groove 242 of the lever member 240 and into the lower groove portion 212a1 of the slide groove 212a of the base member 210, is inserted into this lower through-hole 251a along the depth direction. This connects the latch member 250 to the lever member 240 via the second connecting shaft 262.

[0116] The upper through-hole 251b is a circular hole formed directly above the lower through-hole 251a when the latch member 250 is in the pressed position or the upper position. The slide shaft 263 inserted into the slide groove 212a of the base member 210 is inserted into this upper through-hole 251b along the depth direction. This connects the latch member 250 to the base member 210 via the slide shaft 263. The slide shaft 263 slides while constantly contacting some part of the inner surface of the slide groove 212a.

[0117] The latch member 250 configured as described above moves between an open position, an upper position, and a pressed position. At this time, the two shafts of the latch member 250, the second connecting shaft 262 inserted in the lower through-hole 251 a and the slide shaft 263 inserted in the upper through-hole 251 b, are always in contact with the slide groove 212 a of the base member 210, so that the movement of the latch member 250 is restricted and the wobbling of its posture is suppressed.

[0118] <Movement of the Inspection Socket> The movement of the latch member 250 when it moves from the release position to the pressing position after the semiconductor package 281 is placed on the base portion 213 will be described.

[0119] Fig. 48 shows a plan view of the inspection socket 200 viewed from above when the latch member 250 is in the open position. Figs. 49 and 50 show cross-sectional views taken along line AA and line BB in Fig. 48.

[0120] 49 and 50 , when the cover member 220 is in the close position, the latch member 250 is in the open position. The first connecting shaft 261 is located at the lowest position within its movable range. The second connecting shaft 262 is located at the highest position within its movable range (for example, near the upper end of the lower groove portion 212a1 of the slide groove 212a formed in the base member 210). The slide shaft 263 is located at the highest and outermost position within its movable range (for example, near the upper end of the upper groove portion 212a2 of the slide groove 212a formed in the base member 210).

[0121] Fig. 51 shows a plan view of the inspection socket 200 viewed from above with the latch member 250 in a position between the open position and the upper position. Figs. 52 and 53 show cross-sectional views taken along the line A-A and the line B-B in Fig. 51.

[0122] As shown in Figures 52 and 53, when the cover member 220 moves upward from the close position (but has not yet reached the distant position), the latch member 250 is positioned between the open position and the upper position. Specifically, as the latch member 250 rotates around the second connecting shaft 262, the pressing portion 252 moves inward in the width direction (the latch member 250 closes). However, the pressing surface 252a of the pressing portion 252 does not face the top surface of the semiconductor package 281. This movement is described in detail below. Specifically, when the cover member 220 moves upward from the close position, the first connecting shaft 261 provided on the cover member 220 moves upward. When the first connecting shaft 261 moves upward, the second connecting shaft 262 moves downward due to the function of the lever member 240, which rotates around the pivot shaft 264. When the second connecting shaft 262 moves downward, the latch member 250 connected to the second connecting shaft 262 also moves downward. At this time, the slide shaft 263 provided on the latch member 250 slides up and down and widthwise along the upper groove portion 212a2 of the slide groove 212a serving as a contact portion formed in the base member 210 while making contact with the inner surface of the upper groove portion 212a2. When the slide shaft 263 slides, the upper groove portion 212a2 of the slide groove 212a serving as a contact portion applies a force to the latch member 250 (slide shaft 263) that rotates the latch member 250 about the second connecting shaft 262. As a result, the latch member 250 rotates about the second connecting shaft 262. In Figure 53, the contact point between the slide shaft portion 263 and the slide groove 212a is indicated by a black circle, and the force that rotates the latch member 250 around the second connecting shaft portion 262 is indicated by a black arrow.

[0123] Fig. 54 shows a plan view of the inspection socket 200 as viewed from above when the latch member 250 is moved from the open position to the upper position. Figs. 55 and 56 show cross-sectional views taken along the line A-A and the line B-B in Fig. 54.

[0124] As shown in Figures 55 and 56, when the cover member 220 moves further upward (not yet to the separated position), the latch member 250 moves from the open position to the upper position. Specifically, as the latch member 250 further rotates about the second connecting shaft 262, the pressing portion 252 moves further inward in the width direction, and the pressing surface 252a faces (but does not contact) the top surface of the semiconductor package 281. This movement will be described in detail below. That is, as the cover member 220 moves further upward, the first connecting shaft 261 provided on the cover member 220 moves further upward. As the first connecting shaft 261 moves further upward, the second connecting shaft 262 moves further downward due to the function of the lever member 240, which rotates about the pivot shaft 264. As the second connecting shaft 262 moves further downward, the latch member 250 connected to the second connecting shaft 262 moves further downward. At this time, the slide shaft portion 263 provided on the latch member 250 slides up and down and in the width direction along the upper groove portion 212a2 while making contact with the inner surface of the upper groove portion 212a2 of the slide groove 212a, which serves as a contact portion, formed in the base member 210. When the slide shaft portion 263 slides, the upper groove portion 212a2 of the slide groove 212a, which serves as a contact portion, applies a force to the latch member 250 (slide shaft portion 263) to rotate the latch member 250 about the second connecting shaft portion 262. When the latch member 250 moves downward and rotates about the second connecting shaft portion 262 and the slide shaft portion 263 reaches the lower groove portion 212a1 of the slide groove 212a, the slide shaft portion 263 simply slides up and down along the lower groove portion 212a1 of the slide groove 212a, and no force is applied to rotate the latch member 250 about the second connecting shaft portion 262. At this time, the slide shaft portion 263 is positioned directly above the second connecting shaft portion 262. This completes the rotation of the latch member 250. That is, the latch member 250 moves from the open position to the upper position, and the pressing surface 252a of the pressing portion 252 faces (but does not contact) the upper surface of the semiconductor package 281.

[0125] The section in which the cover member 220 moves upward by a predetermined distance from the close position while the latch member 250 moves from the open position to the upper position is referred to as the "first section."

[0126] Fig. 57 shows a plan view of the inspection socket 200 viewed from above when the latch member 250 is in the pressing position. Figs. 58 and 59 show cross-sectional views taken along line A-A and line B-B in Fig. 57.

[0127] As shown in Figures 58 and 59, when the cover member 220 moves further upward and reaches the separated position, the latch member 250 moves from the upper position to the pressing position. Specifically, as the latch member 250 moves downward, the pressing surface 252a of the pressing portion 252 comes into contact with the upper surface of the semiconductor package 281 and presses the semiconductor package 281. This movement will be described in detail below. That is, as the cover member 220 moves further upward, the first connecting shaft 261 provided on the cover member 220 moves further upward. As the first connecting shaft 261 moves further upward, the second connecting shaft 262 moves further downward due to the function of the lever member 240, which rotates about the pivot shaft 264. As the second connecting shaft 262 moves further downward, the latch member 250 connected to the second connecting shaft 262 moves further downward. As described above, the slide groove 212a of the base member 210 is already in a state where it does not apply a force to the latch member 250 (slide shaft portion 263) that would rotate the latch member 250. Therefore, the latch member 250 simply moves downward. However, the slide shaft portion 263 is in contact with the slide groove 212a (lower groove portion 212a1), which prevents the latch member 250 from wobbling. As the latch member 250 moves further downward, the pressing surface 252a of the pressing portion 252 eventually comes into contact with the upper surface of the semiconductor package 281 and presses the semiconductor package 281. In other words, the latch member 250 is positioned in the pressing position.

[0128] The section in which the cover member 220 moves further upward and reaches the remote position while the latch member 250 moves from the upper position to the pressing position is referred to as the “second section.” In other words, the section from the end of the first section to the remote position is referred to as the “second section.”

[0129] While the latch member 250 moves from the upper position to the pressing position, the latch member 250 moves only downward in the vertical direction, and does not move in the width or depth directions. Therefore, the pressing surface 252a of the pressing portion 252 that contacts the top surface of the semiconductor package 281 does not move in the width or depth directions, and the pressing surface 252a does not rub against and damage the top surface of the semiconductor package 281. Furthermore, by appropriately ensuring the distance over which the latch member 250 moves from the upper position to the pressing position (i.e., the distance over which it moves only in the vertical direction), the inspection socket 200 can be adapted to the specifications of semiconductor packages 281 having various thicknesses.

[0130] When the latch member 250 is moved from the pressed position to the released position, the cover member 220, which is in the remote position, is pushed toward the base member 210. At this time, the cover member 220 moves from the remote position through the second and first sections to reach the close position. When the cover member 220 moves through the first section toward the close position, the slide shaft 263 serving as a contact portion provided on the latch member 250 slides vertically and widthwise along the upper groove portion 212a2 while contacting the inner surface of the upper groove portion 212a2 of the slide groove 212a serving as a contact portion formed in the base member 210. When the slide shaft 263 slides, the upper groove portion 212a2 of the slide groove 212a serving as a contact portion applies a force to the latch member 250 (slide shaft 263) that rotates the latch member 250 about the second connecting shaft 262. Then, as the latch member 250 rotates around the second connecting shaft 262, the pressing portion 252 moves outward in the width direction (the latch member 250 opens). For example, as shown in Figure 56, the inner surface of the upper groove 212a2 includes an upper surface and a lower surface that face each other, and the surface that applies force to the slide shaft 263 when the latch member 250 is opened is the upper surface of the upper groove 212a2 (the surface that faces downward, i.e., the surface that applies a downward force). Conversely, the surface that applies force to the slide shaft 263 when the latch member 250 is closed is the lower surface of the upper groove 212a2 (the surface that faces upward, i.e., the surface that applies an upward force).

[0131] <Modification 4> Although the first connecting shaft 261 was a component separate from the cover member 220, it may be formed integrally with the cover member 220. Furthermore, the second connecting shaft 262 was a component separate from the latch member 250, but it may be formed integrally with the latch member 250. Furthermore, the slide shaft 263 was a component separate from the latch member 250, but it may be formed integrally with the latch member 250. Furthermore, the pivot shaft 264 was a component separate from the base member 210 and the lever member 240, but it may be formed integrally with the base member 210 or the lever member 240.

[0132] <Variation 5> The protrusion 252b of the pressing portion 252 of the latch member 250 was formed integrally with the pressing portion 252, but the protrusion 252b may be replaced by inserting an axial part separate from the pressing portion 252 into the pressing portion 252 and the main body portion 251.

[0133] <Variation 6> The inspection socket 200 described so far has two latch members 250 facing each other in the width direction. However, if the size of the semiconductor package 281 is large, for example, the inspection socket 200 may have two other latch members 250 facing each other in the depth direction. In this case, the total number of shaft holding portions 223 formed on the cover member 220 will be eight.

[0134] Advantages of the Present Embodiment When the cover member 220 is in the first section, the movement of the latch member 250 is restricted by the link mechanism to move from the open position to the upper position by rotating about the second connecting shaft 262 along the depth direction, and when the cover member 220 is in the second section, the movement of the latch member 250 is restricted by the link mechanism to move only downward from the upper position to the pressing position. Therefore, when / just before the latch member 250 presses the semiconductor package 281, the latch member 250 moves only downward and does not move horizontally (in the depth direction or width direction). Therefore, the latch member 250 does not move horizontally on the top surface of the semiconductor package 281 placed on the mounting surface 213 a, thereby rubbing against and damaging the top surface of the semiconductor package 281. Furthermore, the movement of the latch member 250 is constantly restricted by the link mechanism while moving from the open position to the pressing position. Therefore, the latch member 250 does not wobble or the wobbling of the latch member 250 is suppressed, so that the semiconductor package 281 is not damaged due to the wobbling of the latch member 250.

[0135] Because the second connecting shaft 262 is located laterally (in the lateral region) in the width direction of the lower region of the mounting surface 213a, the latch member 250, which rotates around the second connecting shaft 262, can be easily disposed in the lateral region. This makes it possible to reduce the rotation angle (opening / closing angle) of the latch member 250 required to open the upper portion of the mounting surface 213a, compared to when the rotation center of the latch member 250 (the second connecting shaft 262) is located in the lower region of the mounting surface 213a. In other words, in an inspection socket 200 with size restrictions, the movable range of the latch member 250 required to open the upper portion of the mounting surface 213a can be reduced, thereby enabling the upper portion of the mounting surface 213a to be opened efficiently.

[0136] The link mechanism has a slide groove 212a as a contact portion, and the slide groove 212a is provided on the base member 210. When the cover member 220 is in the first section, the slide groove 212a applies a force to the latch member 250 to rotate the latch member 250 around the second connecting shaft portion 262, thereby enabling the latch member 250 to rotate reliably.

[0137] 100 Inspection socket 110 Base member 111 Installation portion 111a Horizontal groove (link mechanism) 112 Pin accommodating portion 113 Base portion 113a Mounting surface 114 Vertical groove (link mechanism) 120 Cover member 121 Through opening 122 Arm portion 122a Through hole 123 Shaft holding portion 130 Spring 140 Lever member (transmission member, link mechanism) 141 Through hole 142 Elongated through hole 143 Protrusion 150 Latch member (pressing member) 151 Through hole 152 Slide groove (link mechanism) 152a Inclined surface 153 Pressing surface 154 Connection portion 154a Arm-facing surface 161 First connecting shaft portion (link mechanism) 162 Second connecting shaft portion (link mechanism) 163 REFERENCE SIGNS LIST Slide shaft portion (link mechanism, contact portion) 171 Contact pin 181 Semiconductor package 200 Inspection socket 210 Base member 212 Pin accommodating portion 212a Slide groove (link mechanism) 212a1 Lower groove portion 212a2 Upper groove portion 212b Through hole 213 Pedestal portion 213a Mounting surface 220 Cover member 221 Through opening 223 Shaft holding portion 223a Slit 230 Spring 240 Lever member (transmission member, link mechanism) 241 Elongated through hole 242 Tip groove 243 Through hole 250 Latch member (pressing member) 251 Main body portion 251a Lower through hole 251b Upper through hole 251c Recess 252 Pressing portion 252a Pressing surface 252b Protrusion 261 First connecting shaft portion (link mechanism) 262 Second connecting shaft portion (link mechanism) 263 Slide shaft portion (link mechanism) 264 Rotating shaft portion (link mechanism) 271 Contact pin 281 Semiconductor package

Claims

1. A device comprising: a base member having a mounting surface on which a semiconductor package is placed; a cover member attached to the base member and moving in a vertical direction perpendicular to the mounting surface between a close position close to the base member and a remote position away from the base member; at least one pressing member moving between an open position that opens up the top of the mounting surface so that the semiconductor package can be placed thereon, and a pressing position that presses the top surface of the semiconductor package placed on the mounting surface; and a link mechanism that moves the pressing member between the open position and the pressing position in accordance with movement of the cover member along the vertical direction, wherein in a first section in which the cover member moves upward by a predetermined distance from the close position, the movement of the pressing member is restricted by the link mechanism to move from the open position to above the mounting surface by rotating about an axis along a first orthogonal direction perpendicular to the vertical direction, In a second section in which the cover member further moves upward to reach the separated position, the link mechanism restricts the cover member's movement to move only downward to reach the pressing position.

2. The inspection socket according to claim 1, wherein the link mechanism has a transmission member, a first connecting shaft, a second connecting shaft, and a rotating shaft, the first connecting shaft, the second connecting shaft, and the rotating shaft extending in the first orthogonal direction, the transmission member being connected to the cover member by the first connecting shaft, and connected to the pressing member by the second connecting shaft, and when a direction orthogonal to the up-down direction and the first orthogonal direction is defined as a second orthogonal direction, the transmission member is connected to the base member by the rotating shaft located between the first connecting shaft and the second connecting shaft in the second orthogonal direction, and by rotating around the rotating shaft, converts upward movement of the cover member into downward movement of the pressing member, and the movement of the second connecting shaft is restricted so as to move only in the up-down direction.

3. The inspection socket according to claim 2, wherein the second connecting shaft portion is located to the side in the second orthogonal direction in the lower region of the placement surface.

4. The inspection socket according to claim 2, wherein the link mechanism has a contact portion that is provided on the cover member and that applies a force to the pressing member that rotates the pressing member around the second connecting shaft portion in the first section.

5. An inspection socket as described in claim 4, wherein the link mechanism has a slide shaft portion and a slide groove, the slide shaft portion is provided on the cover member and is located between the first connecting shaft portion and the second connecting shaft portion in the second orthogonal direction, and the slide groove is provided on the pressing member and is configured so that the slide shaft portion slides.

6. The inspection socket according to claim 5, wherein the slide shaft portion is the contact portion, and the pressing member rotates around the second connecting shaft portion when the slide shaft portion comes into contact with the slide groove.

7. The inspection socket according to claim 2, wherein the link mechanism has a contact portion that is provided on the base member and that applies a force to the pressing member that rotates the pressing member around the second connecting shaft portion in the first section.

8. An inspection socket as described in claim 7, wherein the link mechanism has a slide shaft portion and a slide groove, the slide shaft portion is provided on the pressing member and is located above the second connecting shaft portion, and the slide groove is provided on the base member, and is configured so that the second connecting shaft portion and the slide shaft portion slide.

9. The inspection socket according to claim 8, wherein the slide groove is the contact portion, and the pressing member rotates around the second connecting shaft portion when the slide shaft portion comes into contact with the slide groove.

10. The inspection socket according to claim 9, wherein in the first section, the second connecting shaft portion slides in the slide groove in the vertical direction, and the slide shaft portion slides in the slide groove in the vertical direction and the second orthogonal direction.

Images