Stuffed noodle strip food for microwave cooking and method for producing same

Abstract

The purpose of the present invention is to provide, for example, a stuffed noodle strip food which, even when microwaved prior to eating, has a good texture of wrapper seam, and in which remnants of the wrapper in the mouth are reduced.　The present invention relates to, for example, a stuffed noodle strip food for microwave heating that comprises a wrapper in which a seam is formed, wherein (i) the dielectric loss tangent of the wrapper at an applied frequency of 2.45 GHz is 0.4-0.7 and (ii) stress measured by using a texture analyzer to compress the seam on the wrapper by 20 mm, at 25°C, via a spherical plunger which has a diameter of 5 mm, at a compression speed of 1 mm / sec is 50-250 gf.

Description

Encased noodle food for microwave heating and manufacturing method thereof

[0001] The present invention relates to an enrobed noodle sheet food product for microwave heating and a method for producing the same, more particularly to an enrobed noodle sheet food product for microwave heating with improved texture at the seam of the wrapper and improved mouthfeel of the wrapper, and a method for producing the same.The present invention also relates to a method for improving the texture at the seam of the wrapper of an enrobed noodle sheet food product for microwave heating.

[0002] It is known that when filled noodle foods such as gyoza are heated in a microwave oven, the noodle skin (skin) can dry out and harden, and the seams of the skin (such as the ears of gyoza) tend to harden in particular, resulting in a deterioration in texture (Patent Document 1).

[0003] To address the above-mentioned problems, Patent Document 1 proposes treating the surface of gyoza with an aqueous solution of a starch hydrolysate. It also proposes incorporating 3 to 20% trehalose and 1 to 20% oil / fat, based on the mass ratio of the raw material flour, into the gyoza skin (Patent Document 2). However, it is difficult to say that the above-mentioned problems have been fully solved, and the development of new technologies has been desired.

[0004] Meanwhile, in the production of filled foods using noodle skins, it has been proposed to use oil- or fat-processed starch in noodle skins with the aim of improving workability while maintaining the desired texture (e.g., chewy texture) and appearance (e.g., transparency) (Patent Document 3). Furthermore, it has been proposed to use a noodle raw material flour-oil / fat mixture composition containing wheat flour and an oil / fat composition containing edible oil / fat in the preparation of noodle dough with the aim of easily producing noodles with a soft texture and good melt-in-the-mouth properties, regardless of thickness, using common ingredients and common mechanical noodle-making equipment (Patent Document 4). It has also been proposed to incorporate into noodle dough an oil-in-water emulsion composition containing specific amounts of oil / fat, polyhydric alcohol, water, a specific polyglycerol fatty acid ester, and phospholipids with the aim of enriching the flavor of noodle sheets and producing noodle sheets that are soft yet chewy and resilient to the bite (Patent Document 5). In addition, it has been proposed to mix dietary fiber powder into the dough of foods (such as Chinese steamed buns) made from grains as the main ingredient, kneaded with water and oils as a secondary ingredient, in order to prevent the surface from hardening when heated in a microwave oven (Patent Document 6).

[0005] JP 2005-65533 A JP 2004-141026 A JP 2019-115319 A JP 2020-120614 A JP 2014-158464 A JP 3-22941 A

[0006] The present invention has been made in view of the above circumstances, and one of the problems it aims to solve is to provide an enrobed noodle sheet food product that has a good texture at the seam of the skin even when heated in a microwave oven before eating, a method for producing the same, and a method for improving the texture of the seam of the skin of an enrobed noodle sheet food product. Another object of the present invention is, in one aspect, to provide an enrobed noodle sheet food product that suppresses the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating, a method for producing the same, and a method for suppressing the occurrence of a skin that remains in the mouth of an enrobed noodle sheet food product. Another object of the present invention is, in one aspect, to provide an enrobed noodle sheet food product that has a good texture at the seam of the skin and suppresses the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating, a method for producing the same, and a method for improving the texture of the seam of the skin of an enrobed noodle sheet food product and suppressing the occurrence of a skin that remains in the mouth.

[0007] The inventors conducted extensive research to solve the above-mentioned problems and found that an enveloped noodle sheet food product having a dielectric loss tangent at an applied frequency of 2.45 GHz within a specific range and a stress at the seam of the envelope measured at 25°C using a texture analyzer within a specific range maintains a good texture at the seam of the envelope even when heated in a microwave oven before eating. They also found that the enveloped noodle sheet food product reduces the occurrence of a residue in the mouth from the envelope even when heated in a microwave oven before eating. Based on these findings, the inventors conducted further research and completed the present invention. Specifically, the present invention is as follows:

[0008] [1] An enrobed bean paste noodle sheet food for microwave cooking, comprising a skin having a seam formed therein, (i) the dielectric dissipation factor of the skin at an applied frequency of 2.45 GHz is 0.4 to 0.7, and (ii) the stress measured at 25°C by compressing the seam of the skin by 20 mm using a texture analyzer with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec is 50 to 250 gf. [2] The enrobed bean paste noodle sheet food of [1], wherein the dielectric dissipation factor is 0.43 to 0.65. [3] The enrobed bean paste noodle sheet food of [1] or [2], wherein the dielectric dissipation factor is 0.45 to 0.6. [4] The enrobed bean paste noodle sheet food of any one of [1] to [3], wherein the stress is 70 to 220 gf. [5] The enrobed bean paste noodle sheet food of any one of [1] to [4], wherein the stress is 80 to 200 gf. [6] The enrobed bean paste noodle sheet food according to any one of [1] to [5], wherein the stress is 90 to 180 gf. [7] The enrobed bean paste noodle sheet food according to any one of [1] to [6], wherein the skin contains (A) starch sodium octenylsuccinate, and / or (B) a grain flour other than wheat flour and rice flour. [8] The enrobed bean paste noodle sheet food according to [7], wherein (B) is at least one selected from the group consisting of corn flour and almond flour. [9] The enrobed bean paste noodle sheet food according to [7] or [8], wherein the skin contains (A), and the content of (A) in the skin is 1 to 30% by weight.

[10] The enrobed bean paste noodle sheet food according to any one of [7] to [9], wherein the skin contains (A), and the content of (A) in the skin is 2 to 28% by weight.

[11] The bean-jam filled noodle sheet food according to any one of [7] to

[10] , wherein the skin contains (A), and the content of (A) in the skin is 2.5 to 26% by weight.

[12] The bean-jam filled noodle sheet food according to any one of [7] to

[11] , wherein the skin contains (B), and the content of (B) in the skin is 1 to 30% by weight.

[13] The bean-jam filled noodle sheet food according to any one of [7] to

[12] , wherein the skin contains (B), and the content of (B) in the skin is 3 to 20% by weight.

[14] The bean-jam filled noodle sheet food according to any one of [7] to

[13] , wherein the skin contains (B), and the content of (B) in the skin is 5 to 15% by weight.

[15] The bean paste-filled noodle sheet food according to any one of [7] to

[14] , wherein the skin further contains (C) an oil or fat.

[16] The bean paste-filled noodle sheet food according to

[15] , wherein the content of (C) in the skin is 3 to 20% by weight.

[17] The bean paste-filled noodle sheet food according to

[15] or

[16] , wherein the content of (C) in the skin is 4 to 18% by weight.

[18] The bean paste-filled noodle sheet food according to any one of

[15] to

[17] , wherein the content of (C) in the skin is 5 to 15% by weight.

[19] The bean paste-filled noodle sheet food according to any one of [7] to

[18] , wherein the proportion of water in the total amount of the skin ingredients is 15 to 35% by weight.

[20] The bean paste-filled noodle sheet food according to any one of [7] to

[19] , wherein the proportion of water in the total amount of the skin ingredients is 20 to 30% by weight.

[21] The bean paste filled noodle sheet food according to any one of [1] to

[20] , wherein the bean paste filled noodle sheet food is a baked bean paste filled noodle sheet food.

[22] The bean paste filled noodle sheet food according to any one of [1] to

[21] , wherein the bean paste filled noodle sheet food is frozen.

[23] The bean paste filled noodle sheet food according to any one of [1] to

[22] , wherein the bean paste filled noodle sheet food is a dumpling.

[24] A method for producing an enrobed bean paste filled noodle sheet food for microwave cooking, comprising a wrapper having a seam formed therein, the method comprising: (i) adjusting the dielectric tangent of the wrapper at an applied frequency of 2.45 GHz to 0.4 to 0.7; and (ii) adjusting the stress of the wrapper at 25°C using a texture analyzer to 50 to 250 gf, as measured by compressing the seam of the wrapper by 20 mm with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec.

[25] The manufacturing method according to

[24] , wherein the dielectric dissipation factor is adjusted to 0.43 to 0.65.

[26] The manufacturing method according to

[24] or

[25] , wherein the dielectric dissipation factor is adjusted to 0.45 to 0.6.

[27] The manufacturing method according to any one of

[24] to

[26] , wherein the stress is adjusted to 70 to 220 gf.

[28] The manufacturing method according to any one of

[24] to

[27] , wherein the stress is adjusted to 80 to 200 gf.

[29] The manufacturing method according to any one of

[24] to

[28] , wherein the stress is adjusted to 90 to 180 gf.

[30] The manufacturing method according to any one of

[24] to

[29] , wherein the skin contains (A) starch sodium octenylsuccinate and / or (B) a grain flour other than wheat flour and rice flour.

[31] The manufacturing method according to

[30] , wherein (B) is at least one selected from the group consisting of corn flour and almond flour.

[32] The manufacturing method according to

[30] or

[31] , wherein the skin contains (A), and the content of (A) in the skin is 1 to 30% by weight.

[33] The manufacturing method according to any one of

[30] to

[32] , wherein the skin contains (A), and the content of (A) in the skin is 2 to 28% by weight.

[34] The manufacturing method according to any one of

[30] to

[33] , wherein the skin contains (A), and the content of (A) in the skin is 2.5 to 26% by weight.

[35] The manufacturing method according to any one of

[30] to

[34] , wherein the skin contains (B), and the content of (B) in the skin is 1 to 30% by weight.

[36] The manufacturing method according to any one of

[30] to

[35] , wherein the skin contains (B), and the content of (B) in the skin is 3 to 20% by weight.

[37] The manufacturing method according to any one of

[30] to

[36] , wherein the skin contains (B), and the content of (B) in the skin is 5 to 15% by weight.

[38] The manufacturing method according to any one of

[30] to

[37] , wherein the skin further contains (C) oils and fats.

[39] The manufacturing method according to

[38] , wherein the content of (C) in the skin is 3 to 20% by weight.

[40] The manufacturing method according to

[38] or

[39] , wherein the content of (C) in the skin is 4 to 18% by weight.

[41] The manufacturing method according to any one of

[38] to

[40] , wherein the content of (C) in the wrapper is 5 to 15% by weight.

[42] The manufacturing method according to any one of

[30] to

[41] , wherein the proportion of water in the total amount of the wrapper ingredients is 15 to 35% by weight.

[43] The manufacturing method according to any one of

[30] to

[42] , wherein the proportion of water in the total amount of the wrapper ingredients is 20 to 30% by weight.

[44] The manufacturing method according to any one of

[24] to

[43] , wherein the bean paste-encrusted noodle sheet food is a baked bean paste-encrusted noodle sheet food.

[45] The manufacturing method according to any one of

[24] to

[44] , wherein the bean paste-filled noodle sheet food is frozen.

[46] The manufacturing method according to any one of

[24] to

[45] , wherein the bean paste-filled noodle sheet food is a dumpling.

[47] A method for improving the texture of a wrapper seam of an enrobed noodle sheet food to be heated in a microwave oven, the wrapper having a seam formed therein, the method comprising: (i) adjusting the dielectric tangent of the wrapper at an applied frequency of 2.45 GHz to 0.4 to 0.7, and (ii) adjusting the stress of the wrapper seam, measured at 25°C using a texture analyzer by compressing it 20 mm with a spherical plunger having a diameter of 5 mm at a compression speed of 1 mm / sec, to 50 to 250 gf.

[48] ​​A method for reducing the amount of dough remaining in the mouth of a dough-encased noodle food product to be heated in a microwave oven, the dough having a dough seam, comprising: (i) adjusting the dielectric dissipation factor of the dough at an applied frequency of 2.45 GHz to 0.4 to 0.7; and (ii) adjusting the stress measured by compressing the dough seam by 20 mm at 25°C with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec using a texture analyzer to 50 to 250 gf.

[49] The method according to

[47] or

[48] , wherein the dielectric dissipation factor is adjusted to 0.43 to 0.65.

[50] The method according to any one of

[47] to

[49] , wherein the dielectric dissipation factor is adjusted to 0.45 to 0.6.

[51] The method according to any one of

[47] to

[50] , wherein the stress is adjusted to 70 to 220 gf.

[52] The method according to any one of

[47] to

[51] , wherein the stress is adjusted to 80 to 200 gf.

[53] The method according to any one of

[47] to

[52] , wherein the stress is adjusted to 90 to 180 gf.

[54] The method according to any one of

[47] to

[53] , wherein the skin contains (A) starch sodium octenyl succinate, and / or (B) a grain flour other than wheat flour and rice flour.

[55] The method according to

[54] , wherein (B) is at least one selected from the group consisting of corn flour and almond flour.

[56] The method according to

[54] or

[55] , wherein the skin contains (A), and the content of (A) in the skin is 1 to 30% by weight.

[57] The method according to any one of

[54] to

[56] , wherein the skin contains (A) and the content of (A) in the skin is 2 to 28% by weight.

[58] The method according to any one of

[54] to

[57] , wherein the skin contains (A) and the content of (A) in the skin is 2.5 to 26% by weight.

[59] The method according to any one of

[54] to

[58] , wherein the skin contains (B) and the content of (B) in the skin is 1 to 30% by weight.

[60] The method according to any one of

[54] to

[59] , wherein the skin contains (B) and the content of (B) in the skin is 3 to 20% by weight.

[61] The method according to any one of

[54] to

[60] , wherein the skin contains (B) and the content of (B) in the skin is 5 to 15% by weight.

[62] The method according to any one of

[54] to

[61] , wherein the wrapper further contains (C) an oil or fat.

[63] The method according to

[62] , wherein the content of (C) in the wrapper is 3 to 20% by weight.

[64] The method according to

[62] or

[63] , wherein the content of (C) in the wrapper is 4 to 18% by weight.

[65] The method according to any one of

[62] to

[64] , wherein the content of (C) in the wrapper is 5 to 15% by weight.

[66] The method according to any one of

[54] to

[65] , wherein the proportion of water in the total amount of the wrapper ingredients is 15 to 35% by weight.

[67] The method according to any one of

[54] to

[66] , wherein the proportion of water in the total amount of the wrapper ingredients is 20 to 30% by weight.

[68] The method according to any one of

[47] to

[67] , wherein the bean paste-encrusted noodle sheet food is a baked bean paste-encrusted noodle sheet food.

[69] The method according to any one of

[47] to

[68] , wherein the filled noodle food is frozen.

[70] The method according to any one of

[47] to

[69] , wherein the filled noodle food is a dumpling.

[0009] The present invention provides an encrusted noodle sheet food that has a good texture at the seam of the skin even when heated in a microwave oven before eating. The present invention also provides a method for producing the encrusted noodle sheet food. The present invention further provides a method for improving the texture of the seam of the skin of an encrusted noodle sheet food. The present invention also provides an encrusted noodle sheet food that suppresses the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating. The present invention also provides a method for producing the encrusted noodle sheet food. The present invention also provides a method for suppressing the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating. The present invention also provides an encrusted noodle sheet food that has a good texture at the seam of the skin and suppresses the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating. The present invention also provides a method for producing the encrusted noodle sheet food. The present invention also provides a method for improving the texture of the seam of the skin of an encrusted noodle sheet food and suppressing the occurrence of a skin that remains in the mouth.

[0010] FIG. 1 is a diagram schematically illustrating a typical shape of a dumpling. FIG. 1(a) is a perspective view of a dumpling having a typical shape (semicircular). FIG. 1(b) is a diagram schematically illustrating the side shape of the dumpling shown in FIG. 1(a) as viewed in the direction of arrow X10 in the same figure, in a simple semicircular shape. FIG. 1(c) is a diagram illustrating a cross-sectional view of the dumpling shown in FIG. 1(b) taken along line Y10-Y10. In FIG. 1(c), the filling is not shown, and the cross section is hatched.

[0011] The encased noodle food for microwave cooking provided by the present invention and the method for producing the same will be described below.

[0012] In the present invention, "encased noodle sheet food" refers to a food comprising at least a filling (generally referred to as "filling" or "stuffing") and a noodle sheet (generally referred to as "skin" or "noodle skin") that encases (covers) part or all of the filling. In this specification, the "filling" and "noodle sheet" of an encased noodle sheet food may be referred to as "filling" and "skin," respectively. Here, a food "comprising" at least a filling (filling) and a skin (noodle sheet) is synonymous with a food "having" at least a filling and a skin, or a food "including" a filling and a skin, and may be expressed in other ways. In an encased noodle sheet food, the number of skins that encase (encase) the filling may be one or two or more. Specific examples of encased noodle sheet foods include, but are not limited to, dumplings, wontons, baozi, ravioli, spring rolls, shumai, and xiaolongbao.

[0013] The bean-jam-filled noodle sheet food of the present invention may be one that has been subjected to a heat treatment (sometimes referred to as a "cooked bean-jam-filled noodle sheet food" in the present invention), or one that has been produced by covering the filling with a skin and has not yet been subjected to a heat treatment (sometimes referred to as a "fresh bean-jam-filled noodle sheet food" in the present invention). In other words, the "bean-jam-filled noodle sheet food" of the present invention is a general term for cooked bean-jam-filled noodle sheet foods and fresh bean-jam-filled noodle sheet foods, and means both or either one of these unless otherwise specified. The bean-jam-filled noodle sheet food of the present invention also includes frozen bean-jam-filled noodle sheet foods (frozen bean-jam-filled noodle sheet foods) and refrigerated bean-jam-filled noodle sheet foods (chilled bean-jam-filled noodle sheet foods).

[0014] The wrapper constituting the bean-filled noodle food of the present invention has a wrapper seam (in other words, a wrapper with a wrapper seam). In the present invention, the "skin seam" refers to the portion formed by overlapping and joining the wrapper. In gyoza, a type of bean-filled noodle food, the wrapper seam is generally also referred to as an "ear" or "ear portion." In one embodiment, the wrapper seam may be formed by joining two different portions (such as edges) of a single wrapper, or by joining two or more wrappers. In one embodiment, the wrapper seam may be formed around the filling (preferably near the outer periphery or edge of the wrapper encasing the filling) to prevent the filling from spilling out or spilling out. While the wrapper seam generally has pleats (i.e., overlapping portions formed by folding in portions of the wrapper), the wrapper seam of the present invention may be pleated or not, i.e., it may have pleats or not.

[0015] One of the features of the bean-jam-filled noodle sheet food of the present invention is that the dielectric loss tangent of the wrapper at an applied frequency of 2.45 GHz is within a specific range. This dielectric loss tangent within the specific range prevents the wrapper from being overheated when heated in a microwave oven, and reduces drying and hardening of the seam and other parts of the wrapper. For ease of explanation, the dielectric loss tangent of the wrapper of the bean-jam-filled noodle sheet food at an applied frequency of 2.45 GHz may be referred to simply as the "dielectric loss tangent of the wrapper."

[0016] In the present invention, the dielectric loss tangent of the wrapper can be calculated from the dielectric constant and dielectric loss measured by the coaxial probe method at an applied frequency of 2.45 GHz using the following formula: Dielectric loss tangent (tan δ) = Dielectric loss (ε") / Dielectric constant (ε'). The dielectric constant and dielectric loss can be measured using a slice of the wrapper of an enrobed noodle food as a sample. Specifically, the sample (slice of the wrapper of an enrobed noodle food) for measuring the dielectric constant and dielectric loss can be prepared by leaving the enrobed noodle food at room temperature until its core temperature reaches 25°C, and then cutting out a portion of the wrapper with scissors or the like. The dielectric constant and dielectric loss measurement system (instruments, etc.) can be composed of a vector network analyzer, a high-temperature probe, cables, a computer, analysis software, etc. Specifically, the vector network analyzer can be an "Agilent E5071C ENA Network Analyzer" manufactured by Agilent Technologies, Inc. Furthermore, the analysis software included with the vector network analyzer can be used. The real and imaginary parts of the complex permittivity of the skin, which can be read by the above measurement system, represent the permittivity and dielectric loss, respectively.

[0017] The dielectric loss tangent of the wrapper of the bean-jam filled noodle food of the present invention (at an applied frequency of 2.45 GHz) is preferably 0.4 or more, more preferably 0.43 or more, and particularly preferably 0.45 or more. The dielectric loss tangent of the wrapper of the bean-jam filled noodle food of the present invention (at an applied frequency of 2.45 GHz) is preferably 0.7 or less, more preferably 0.65 or less, and particularly preferably 0.6 or less.

[0018] In the present invention, the method for adjusting the dielectric tangent of the skin of the filled noodle food product is not particularly limited, and it may be adjusted by a method known per se or a method equivalent thereto, for example, by changing the blending ratio of the materials used as raw materials for the skin (more specifically, by changing the blending ratio of materials with different polarities).

[0019] One of the features of the enrobed noodle sheet food of the present invention is that the stress measured at the seam of the wrapper at 25°C using a texture analyzer with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec is within a specific range. Because the stress is within the specific range, when the dielectric dissipation factor of the wrapper is within the specific range, the enrobed noodle sheet food of the present invention has a good texture at the seam of the wrapper and can suppress the occurrence of residual residue in the mouth, even when heated in a microwave oven before consumption. For convenience of explanation, the stress measured at the seam of the wrapper of an enrobed noodle sheet food at 25°C using a texture analyzer with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec is sometimes simply referred to as the "stress at the seam of the wrapper."

[0020] In the present invention, the texture analyzer used to measure the stress at the seam of the pastry wrapper is specifically a "Texture Analyzer TA.XT plusC" manufactured by Stable Micro Systems. The measurement sample can be an enveloped noodle food product that has been left at room temperature until the core temperature reaches 25°C. The maximum stress (maximum stress) measured when the seam of the pastry wrapper of the sample is compressed with a spherical plunger having a diameter of 5 mm is taken as the stress at the seam of the pastry wrapper. The compression speed when compressing the seam of the pastry wrapper with the plunger is 1 mm / sec, and the compression distance is 20 mm.

[0021] The specific settings of the texture analyzer when measuring the stress at the seam of the wrapper of a stuffed noodle food product are as follows: [Texture analyzer settings] Test Mode: Compression Speed ​​Pre Speed: 5 mm / sec Test Speed: 1 mm / sec Post Speed: 5 mm / sec Target Mode: Distance Distance: 20 mm

[0022] As described above, the wrapped noodle sheet food of the present invention may have pleats at the seam of the wrapper, in which case the stress at the seam of the wrapper is measured for the overlapping portion of the wrapper other than the pleats. Furthermore, when measuring the stress at the seam of the wrapped noodle sheet food, the filling of the wrapped noodle sheet food may be removed in advance.

[0023] The stress at the seam of the wrapper of the enrobed noodle sheet food of the present invention is preferably 50 gf or more, more preferably 70 gf or more, even more preferably 80 gf or more, and particularly preferably 90 gf or more. The stress at the seam of the wrapper of the enrobed noodle sheet food of the present invention is preferably 250 gf or less, more preferably 220 gf or less, even more preferably 200 gf or less, and particularly preferably 180 gf or less.

[0024] In the present invention, the stress at the seam of the wrapper of an encased noodle sheet food can be adjusted, for example, by the methods described below, but the method for adjusting the stress at the seam of the wrapper is not limited to these, and in the present invention, the stress at the seam of the wrapper may be adjusted by a method known per se or a method equivalent thereto. [Method for adjusting the stress at the seam of the wrapper of an encased noodle sheet food] - When preparing the wrapper of an encased noodle sheet food, the blending ratio of the materials used as the raw materials for the wrapper is changed. - When preparing the wrapper of an encased noodle sheet food, the thickness of the wrapper is varied. - When the encased noodle sheet food is one that has been heat-treated (i.e., a heated encased noodle sheet food), water is applied or sprayed onto the wrapper of the encased noodle sheet food during the heat treatment. - When the encased noodle sheet food is one that has been heat-treated (i.e., a heated encased noodle sheet food), the type of heat treatment or heating conditions applied to the encased noodle sheet food are changed. The stress at the seam of the wrapper of the filled noodle food may be adjusted by appropriately combining the above-mentioned method with a method known per se or a method equivalent thereto.

[0025] The method for producing the wrapper of the bean-jam-encased noodle sheet food of the present invention is not particularly limited as long as the dielectric loss tangent of the wrapper and the stress at the seam of the wrapper are within the respective specific ranges, and may be produced using conventional raw materials and by conventional methods for the wrapper of bean-jam-encased noodle sheet food. The method for producing the wrapper of the bean-jam-encased noodle sheet food of the present invention may, if necessary, include a step for adjusting the dielectric loss tangent of the wrapper and / or the stress at the seam of the wrapper.

[0026] Specific examples of ingredients for the skin of the enrobed noodle food of the present invention include, but are not limited to, water, grain flour (wheat flour, rice flour, other grain flours), starches (raw starch, modified starch such as starch sodium octenylsuccinate), oils and fats (edible vegetable oils and fats, edible animal oils and fats), salt, sugars, eggs (e.g., liquid egg, egg yolk powder, egg white powder, whole egg powder, etc.), skim milk powder, dietary fiber, gluten, amino acids, vitamins, minerals, extracts, emulsifiers, preservatives, antioxidants, pH adjusters, seasonings, spices, flavorings, colorings, etc. These ingredients may be used alone or in combination of two or more.

[0027] Starch sodium octenylsuccinate may be used as a raw material for the wrapper of the bean-paste-encrusted noodle food of the present invention; that is, in one embodiment, the wrapper of the bean-paste-encrusted noodle food of the present invention may contain starch sodium octenylsuccinate. Here, starch sodium octenylsuccinate refers to starch esterified with octenylsuccinic anhydride. The starch sodium octenylsuccinate that can be used in the present invention may be produced by a method known per se or a method similar thereto. The starch (raw material starch) that can be used to produce starch sodium octenylsuccinate is not particularly limited, and examples thereof include wheat starch, corn starch, waxy corn starch, potato starch, tapioca starch, etc. As for starch sodium octenyl succinate, starch may be subjected to processing treatments other than octenyl succination treatment (physical treatment, chemical treatment, enzymatic treatment, etc.) as long as the object of the present invention is not impaired.

[0028] The raw material for the wrapper of the bean-jam-encrusted noodle food of the present invention may be a grain flour other than wheat flour or rice flour. In other words, in one embodiment, the wrapper of the bean-jam-encrusted noodle food of the present invention may contain a grain flour other than wheat flour or rice flour. In the present invention, "grain flour" refers to a food material obtained by milling grains. Specific examples of grain flour other than wheat flour and rice flour include, but are not limited to, corn flour, barley flour, rye flour, soy flour, adzuki bean flour, pea flour, almond flour, acorn flour, tapioca flour, potato flour, etc. These grain flours may be used alone or in combination of two or more. The grain flour other than wheat flour and rice flour that may be contained in the wrapper of the bean-jam-encrusted noodle food of the present invention preferably includes at least one selected from the group consisting of corn flour and almond flour, or is at least one selected from the group consisting of corn flour and almond flour. In one embodiment, when the skin of the bean-jam-filled noodle food of the present invention contains a grain flour other than wheat flour and rice flour, the skin may further contain wheat flour and / or rice flour in addition to the grain flour other than wheat flour and rice flour. The grain flour (wheat flour, rice flour, or other grain flour) used as a raw material for the skin of the bean-jam-filled noodle food of the present invention may be subjected to processing (e.g., gelatinization treatment, etc.) as long as it does not impair the object of the present invention.

[0029] In one embodiment, the skin of the bean-jam-filled noodle food of the present invention may contain (A) starch sodium octenyl succinate and / or (B) cereal flour other than wheat flour and rice flour. In this specification, for convenience of explanation, "starch sodium octenyl succinate" and "cereal flour other than wheat flour and rice flour" may be simply referred to as "(A)" and "(B)," respectively.

[0030] When the wrapper of the stuffed noodle food of the present invention contains (A) (i.e., starch sodium octenylsuccinate), the content of (A) is preferably 1% by weight or more, more preferably 2% by weight or more, and particularly preferably 2.5% by weight or more, based on the total amount of the raw materials for the wrapper, from the viewpoints of effectively improving the texture of the seam of the wrapper and effectively suppressing the occurrence of residue in the mouth. In this case, the content of (A) is preferably 30% by weight or less, more preferably 28% by weight or less, and particularly preferably 26% by weight or less, based on the total amount of the raw materials for the wrapper, from the viewpoints of effectively improving the texture of the seam of the wrapper and effectively suppressing the occurrence of residue in the mouth.

[0031] When the skin of the enrobed noodle food of the present invention contains (B) (i.e., cereal flour other than wheat flour and rice flour), the content of (B) is preferably 1% by weight or more, more preferably 3% by weight or more, and particularly preferably 5% by weight or more, based on the total amount of the raw materials for the skin, from the viewpoint of effectively improving the texture of the seam of the skin and effectively suppressing the occurrence of a residue in the mouth. In this case, the content of (B) is preferably 30% by weight or less, more preferably 20% by weight or less, and particularly preferably 15% by weight or less, based on the total amount of the raw materials for the skin, from the viewpoint of effectively improving the texture of the seam of the skin and effectively suppressing the occurrence of a residue in the mouth.

[0032] In one embodiment, the wrapper of the bean-jam-filled noodle food of the present invention may contain (C) fats and oils. In the present invention, "fat and oil" refers to a substance primarily composed of acylglycerol (e.g., triglyceride, diglyceride, monoglyceride). Generally, those that are fluid at room temperature are referred to as "oils" and those that are not fluid are referred to as "fats," but the concept encompasses both. The fat and oil contained in the wrapper of the bean-jam-filled noodle food of the present invention is not particularly limited as long as it is edible (i.e., edible fat and oil). Examples include vegetable edible fats such as rapeseed oil (including canola oil), corn oil, soybean oil, sesame oil, rice bran oil, safflower oil, coconut oil, palm oil, palm kernel oil, sunflower oil, perilla oil, linseed oil, olive oil, grapeseed oil, and medium-chain fatty acid oils; and animal edible fats such as lard, beef tallow, chicken oil, mutton tallow, horse fat, fish oil, and whale oil. In addition, interesterified oils obtained by interesterifying the above-mentioned fats and oils, hardened oils obtained by hydrogenating the above-mentioned fats and oils, etc. can also be used. The above-mentioned fats and oils may be refined (e.g., salad oil, etc.). These fats and oils may be used alone or in combination of two or more. In this specification, for convenience of explanation, "fat and oil" may be simply referred to as "(C)".

[0033] When the skin of the stuffed noodle food of the present invention contains (C) (i.e., fats and oils), the content of (C) is preferably 3% by weight or more, more preferably 4% by weight or more, and particularly preferably 5% by weight or more, based on the total amount of the raw materials for the skin, from the viewpoint of effectively improving the texture of the seam of the skin and effectively suppressing the occurrence of residue in the mouth. In this case, the content of (C) is preferably 20% by weight or less, more preferably 18% by weight or less, and particularly preferably 15% by weight or less, based on the total amount of the raw materials for the skin, from the viewpoint of effectively improving the texture of the seam of the skin and effectively suppressing the occurrence of residue in the mouth.

[0034] The raw material for the wrapper of the enrobed noodle food of the present invention is typically water. Examples of water that can be used for the wrapper include, but are not limited to, purified water such as distilled water and ion-exchanged water, tap water, and alkaline electrolyzed water. Any water suitable for food manufacturing can be used. The proportion of water in the total amount of the wrapper raw material for the enrobed noodle food of the present invention is typically 15 to 35% by weight, and preferably 20 to 30% by weight.

[0035] The wrapper for the bean-jam-filled noodle sheet food of the present invention can be produced, for example, by the following procedures (1) to (3), but is not limited to these and may be produced by known procedures or procedures equivalent thereto. (1) The raw materials for the wrapper are kneaded to obtain a dough. (2) The dough obtained in (1) above is rolled using a rolling machine (e.g., a roll-type noodle machine) or the like to obtain a noodle sheet. The thickness of the noodle sheet can be set appropriately depending on the type and size of the bean-jam-filled noodle sheet food, but is usually 0.1 to 5 mm, preferably 0.2 to 2 mm, and more preferably 0.3 to 1.5 mm. (3) The noodle sheet obtained in (2) above is cut into a desired shape (e.g., circle, oval, semicircle, polygon, etc.) or punched out using a die or the like of the desired shape.

[0036] The filling (paste) of the bean-paste-encrusted noodle food of the present invention can be prepared by a conventional method using typical ingredients for fillings of bean-paste-encrusted noodle food. Specific examples of ingredients for the filling of the bean-paste-encrusted noodle food of the present invention include, but are not limited to, meat (e.g., chicken, pork, beef, etc.), seafood (e.g., shrimp, crab, etc.), vegetables (e.g., cabbage, onion, Chinese cabbage, chives, garlic, shiitake mushrooms, etc.), edible oils and fats (vegetable oils and fats, animal oils and fats), salt, sugars, amino acids, vitamins, minerals, extracts, preservatives, antioxidants, pH adjusters, seasonings, spices, flavorings, etc. These ingredients may be used alone or in combination of two or more. The filling of the bean-paste-encrusted noodle food of the present invention can be prepared, for example, by shredding the ingredients as needed and mixing them, but the preparation method is not limited thereto and may be prepared by a known method or a method equivalent thereto. The filling material to be used as the filling of the bean-jam-filled noodle food of the present invention may be cooked with heat as necessary before being wrapped in the skin.

[0037] The bean-jam-filled noodle food of the present invention can be produced by a method known per se or a method equivalent thereto depending on the type of food, etc., but the method of producing the bean-jam-filled noodle food of the present invention typically involves wrapping (covering) the filling material in a skin. In the present invention, the wrapping method (covering method) when wrapping (covering) the filling material in a skin is not particularly limited except for forming a seam in the skin, and can be performed by a method known per se or a method equivalent thereto depending on the type of bean-jam-filled noodle food, etc. Taking gyoza, a type of bean-jam-filled noodle food, as an example, the filling material is placed as a mass in the center of one side of a circular or oval skin, the skin is then folded over to sandwich the filling material, and the opposing skins are then pressed together around the filling material to form a seam in the skin, thereby wrapping the filling material in the skin (i.e., obtaining raw gyoza), but the wrapping method is not limited thereto.

[0038] Gyoza, a type of noodle-filled food, will be described in detail using a semicircular gyoza, which is one of the typical shapes (however, this gyoza is merely an example and the present invention is not limited thereto). As shown in FIG. 1, a semicircular gyoza 100 has a skin seam 101 and a bottom surface 102. FIGS. 1(b) and 1(c) show simplified schematic views of the shape of a semicircular gyoza as viewed from the side and the cross-sectional shape, respectively. Note that FIGS. 1(a) to 1(c) are conceptual diagrams, and the size, shape, scale, etc. of the gyoza may differ from the actual size, shape, scale, etc.

[0039] In one embodiment, the bean-paste-encrusted noodle food of the present invention may have a food material attached to part or all of its surface (the outer surface of the wrapper). That is, in one embodiment, the method for producing the bean-paste-encrusted noodle food of the present invention may include attaching a food material to part or all of the surface of the bean-paste-encrusted noodle food. The food material that can be attached to the surface of the bean-paste-encrusted noodle food of the present invention is not particularly limited as long as it does not impair the object of the present invention. Taking gyoza, a type of bean-paste-encrusted noodle food, as an example, food materials that can be attached to the surface (bottom, etc.) of the gyoza include, for example, batter, a burr-forming agent, a browning agent, etc.

[0040] In one embodiment, the bean-filled noodle sheet food of the present invention may be one that has been heat-treated (heated bean-filled noodle sheet food), and in this case, the method for producing the bean-filled noodle sheet food of the present invention may include, in addition to wrapping the filling ingredients in the skin, heat-treating the uncooked bean-filled noodle sheet food thus obtained (raw bean-filled noodle sheet food).

[0041] The type of heat treatment that can be applied to an enrobed noodle sheet food to obtain a cooked enrobed noodle sheet food is not particularly limited as long as it is one that can generally be applied to an enrobed noodle sheet food, but examples include baking, moist heating (e.g., boiling, steaming, etc.), deep-frying, hot air heating, infrared heating, microwave heating, etc. Among these, the heat treatment that can be applied to an enrobed noodle sheet food to obtain a cooked enrobed noodle sheet food preferably includes baking. In the present invention, "baking" refers to a process in which the enrobed noodle sheet food is heated by contacting it with a baking device (e.g., a frying pan, a griddle, a hot plate, a gyoza grill, etc.). The enrobed noodle sheet food and the baking device may come into contact via a food material (e.g., batter, etc.) that can be adhered to the surface of the enrobed noodle sheet food.

[0042] The heating conditions (heating temperature, heating time) of the heat treatment that can be performed on the bean-filled noodle sheet food to obtain a cooked bean-filled noodle sheet food can be set appropriately depending on the type of heating method, etc., and are not particularly limited. For example, the heating temperature for baking heating is usually 180 to 280°C (preferably 200 to 250°C), and the heating time is usually 0.5 to 15 minutes (preferably 1 to 10 minutes).

[0043] When the bean-jam-filled noodle sheet food of the present invention is a heated bean-jam-filled noodle sheet food, the heat treatment applied to the bean-jam-filled noodle sheet food in the manufacturing method thereof may include baking, in other words, the bean-jam-filled noodle sheet food (heated bean-jam-filled noodle sheet food) of the present invention may be a baked bean-jam-filled noodle sheet food in one embodiment. In the present invention, the term "baked bean-jam-filled noodle sheet food" refers to a heated bean-jam-filled noodle sheet food obtained by at least baking an encased bean-jam-filled noodle sheet food, and is a concept that encompasses not only "a heated bean-jam-filled noodle sheet food obtained by only baking an encased bean-jam-filled noodle sheet food," but also "a heated bean-jam-filled noodle sheet food obtained by baking an encased bean-jam-filled noodle sheet food and other heat treatments (e.g., wet heating, etc.)."

[0044] When the heat treatment applied to the bean-jam filled noodle sheet food to obtain a baked bean-jam filled noodle sheet food includes, in addition to baking, other heat treatments (e.g., wet heating), the order in which these heat treatments are applied to the bean-jam filled noodle sheet food is not particularly limited. For example, when the bean-jam filled noodle sheet food is subjected to steaming in addition to baking, the bean-jam filled noodle sheet food may be first steamed and then baked, or the bean-jam filled noodle sheet food may be baked and steamed simultaneously, as in so-called "steaming."

[0045] In one embodiment, the bean-jam wrapped noodle sheet food of the present invention may be one that has been subjected to a freezing process, i.e., the bean-jam wrapped noodle sheet food of the present invention may be frozen. In the present invention, an encased bean-jam wrapped noodle sheet food that has been subjected to a freezing process and frozen may be referred to as a "frozen encased bean-jam wrapped noodle sheet food." In one embodiment, the frozen encased bean-jam wrapped noodle sheet food may be an uncooked encased bean-jam wrapped noodle sheet food (raw encased bean-jam wrapped noodle sheet food) that has been subjected to a freezing process, or may be a cooked encased bean-jam wrapped noodle sheet food (e.g., baked encased bean-jam wrapped noodle sheet food, etc.) that has been subjected to a freezing process. In other words, in the present invention, the "frozen encased bean-jam wrapped noodle sheet food" is a general term for a frozen raw encased bean-jam wrapped noodle sheet food (frozen raw encased bean-jam wrapped noodle sheet food) and a frozen cooked encased bean-jam wrapped noodle sheet food (frozen cooked encased bean-jam wrapped noodle sheet food), and means both or either of these unless otherwise specified.

[0046] In one embodiment, when the bean-jam-filled noodle sheet food of the present invention is one that has been subjected to a freezing process and is frozen (frozen bean-jam-filled noodle sheet food), the method of freezing is not particularly limited as long as the bean-jam-filled noodle sheet food can be frozen, and may be carried out by a method known per se or a method similar thereto.

[0047] In one embodiment, when the bean-jam wrapped noodle sheet food of the present invention is frozen (frozen bean-jam wrapped noodle sheet food), the dielectric constant and dielectric loss for calculating the dielectric loss tangent of the wrapper of the bean-jam wrapped noodle sheet food can be measured by thawing the frozen bean-jam wrapped noodle sheet food by leaving it to stand at room temperature until the core temperature reaches 25°C, and then measuring a slice of the thawed bean-jam wrapped noodle sheet food wrapper as a sample. Alternatively, the sample for measuring the dielectric constant and dielectric loss (slice of bean-jam wrapped noodle sheet food wrapper) can be prepared by cutting out a portion of the wrapper of the bean-jam wrapped noodle sheet food with scissors or the like before freezing and leaving it to stand at room temperature until it reaches 25°C. Therefore, if a stuffed bean paste noodle sheet food is frozen, the frozen stuffed bean paste noodle sheet food is thawed by leaving it to stand at room temperature until the core temperature reaches 25°C, and then a slice of the wrapper of the thawed stuffed bean paste noodle sheet food is used as a sample to measure the dielectric constant and dielectric loss at an applied frequency of 2.45 GHz, and if the dielectric dissipation factor calculated from the dielectric constant and dielectric loss is within a specific range, the frozen stuffed bean paste noodle sheet food can be said to have a dielectric dissipation factor of the wrapper within a specific range.Furthermore, if a stuffed bean paste noodle sheet food is frozen, the dielectric constant and dielectric loss of a slice of the wrapper of the stuffed bean paste noodle sheet food before freezing is used as a sample to measure the dielectric constant and dielectric loss at an applied frequency of 2.45 GHz, and if the dielectric dissipation factor calculated from the dielectric constant and dielectric loss is within a specific range, the frozen stuffed bean paste noodle sheet food can be said to have a dielectric dissipation factor of the wrapper within a specific range.

[0048] In one embodiment, when the bean-jam wrapped noodle sheet food of the present invention is frozen (frozen bean-jam wrapped noodle sheet food), the stress at the seam of the wrapper of the bean-jam wrapped noodle sheet food can be measured as described above using a texture analyzer after the frozen bean-jam wrapped noodle sheet food has been left to thaw at room temperature until the core temperature reaches 25° C. Therefore, when the bean-jam wrapped noodle sheet food is frozen, if the stress at the seam of the wrapper measured using a texture analyzer after the frozen bean-jam wrapped noodle sheet food has been left to thaw at room temperature until the core temperature reaches 25° C. is within a specific range, it can be said that the stress at the seam of the wrapper of the frozen bean-jam wrapped noodle sheet food is within a specific range.

[0049] The bean-jam-filled noodle sheet food of the present invention is suitable for use as a bean-jam-filled noodle sheet food for microwave heating. In the present invention, a "microwave-heatable" bean-jam-filled noodle sheet food refers to a bean-jam-filled noodle sheet food that is heated in a microwave oven before being eaten (preferably immediately before being eaten). In other words, it refers to a bean-jam-filled noodle sheet food that can be eaten in a state that has been heated in a microwave oven.

[0050] In the present invention, "microwave heating" refers to a heating process performed using a microwave oven, and more specifically, a heating process in which microwaves are applied to an object to be heated (an-encrusted noodle sheet foods). In the present invention, the various conditions for microwave heating (e.g., microwave output, heating time, etc.) can be appropriately set depending on the type, amount, size, condition, etc. of the object to be heated (an-encrusted noodle sheet foods) and are not particularly limited. However, the microwave output (rated high-frequency output according to the measurement method specified in Japanese Industrial Standard C9250 (Microwave Oven)) is typically 100 to 3000 W, preferably 300 to 1500 W, and more preferably 400 to 700 W. The heating time (microwave irradiation time) can be appropriately adjusted depending on the microwave output and the type, amount, size, condition, etc. of the object to be heated (an-encrusted noodle sheet foods). For example, when heating five an-encrusted noodle sheet foods at 600 W, the heating time is typically 0.5 to 3 minutes (preferably 1 to 2 minutes).

[0051] In the present invention, the microwave-heated encased noodle sheet food has a dielectric loss tangent of the wrapper and a stress at the seam of the wrapper that are within specific ranges before being heated in a microwave oven. In one embodiment, the encased noodle sheet food of the present invention may be a pre-heated encased noodle sheet food for microwave heating (e.g., a baked encased noodle sheet food for microwave heating), in which case the pre-heated encased noodle sheet food (e.g., a baked encased noodle sheet food) has a dielectric loss tangent of the wrapper and a stress at the seam of the wrapper that are within specific ranges. In another embodiment, the encased noodle sheet food of the present invention may be a frozen encased noodle sheet food for microwave heating, in which case the frozen encased noodle sheet food has a dielectric loss tangent of the wrapper and a stress at the seam of the wrapper that are within specific ranges before being heated in a microwave oven.

[0052] In one embodiment, the bean paste-filled noodle sheet food of the present invention may be a heated bean paste-filled noodle sheet food for microwave heating or a frozen and heated bean paste-filled noodle sheet food for microwave heating, in which case the heat treatment applied to the bean paste-filled noodle sheet food to obtain the heated bean paste-filled noodle sheet food may be, for example, baking, wet heating (e.g., boiling, steaming, etc.), frying, hot air heating, infrared heating, microwave heating, etc. In other words, heated bean paste-filled noodle sheet foods for microwave heating include, for example, baked bean paste-filled noodle sheet foods for microwave heating, and frozen and heated bean paste-filled noodle sheet foods for microwave heating include, for example, frozen and baked bean paste-filled noodle sheet foods for microwave heating.

[0053] The bean-jam wrapped noodle sheet food of the present invention can have a good texture at the seam of the wrapper even when heated in a microwave oven before eating. In the present invention, the texture of the seam of the wrapper of the bean-jam wrapped noodle sheet food can be evaluated, for example, by sensory evaluation by a specialist panel. The texture of the seam of the wrapper of the bean-jam wrapped noodle sheet food can be judged as good if it has a moderate softness. On the other hand, the harder the texture of the seam of the wrapper of the bean-jam wrapped noodle sheet food, the less desirable it tends to be. Furthermore, the texture of the seam of the wrapper of the bean-jam wrapped noodle sheet food can be judged as good if it has a supple elasticity. On the other hand, the texture of the seam of the wrapper of the bean-jam wrapped noodle sheet food tends to be perceived as undesirable if it lacks a supple elasticity or if no supple elasticity is felt.

[0054] The bean-jam wrapped noodle food of the present invention can suppress the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating. In the present invention, the "skin that remains in the mouth" of an bean-jam wrapped noodle food refers to the sensation that, when the skin and other parts (such as the filling) of the bean-jam wrapped noodle food are held in the mouth without being separated and chewed, the skin is not crisp and remains in the mouth even after the filling has disappeared from the mouth. The presence or absence and degree of the occurrence of a skin that remains in the mouth of an bean-jam wrapped noodle food can be evaluated, for example, by sensory evaluation by a specialist panel.

[0055] The present invention also provides a method for improving the texture of the seam of a wrapper in a bean-jam-encased noodle sheet food to be heated in a microwave oven (sometimes referred to herein as the "improvement method of the present invention"). The present invention also provides a method for suppressing the occurrence of residual food in the mouth of a wrapper in a bean-jam-encased noodle sheet food to be heated in a microwave oven (sometimes referred to herein as the "suppression method of the present invention"). The improvement method and suppression method of the present invention are described below. In the present specification, the improvement method and suppression method of the present invention are sometimes collectively referred to as the "method of the present invention."

[0056] The bean-paste-encrusted noodle sheet foods for which the method of the present invention can be used may be fresh bean-paste-encrusted noodle sheet foods or cooked bean-paste-encrusted noodle sheet foods (e.g., baked bean-paste-encrusted noodle sheet foods, etc.). Furthermore, the bean-paste-encrusted noodle sheet foods for which the method of the present invention can be used may be frozen (frozen bean-paste-encrusted noodle sheet foods). That is, the improvement method of the present invention may be a method for improving the texture of the wrapper seam of a fresh bean-paste-encrusted noodle sheet food for microwave heating; a method for improving the texture of the wrapper seam of a cooked bean-paste-encrusted noodle sheet food for microwave heating (e.g., baked bean-paste-encrusted noodle sheet foods, etc.); a method for improving the texture of the wrapper seam of a frozen fresh bean-paste-encrusted noodle sheet food for microwave heating; or a method for improving the texture of the wrapper seam of a frozen and cooked bean-paste-encrusted noodle sheet food for microwave heating (e.g., frozen baked bean-paste-encrusted noodle sheet foods, etc.). Furthermore, the suppression method of the present invention may be a method for suppressing the remaining of a skin in the mouth of a freshly-encased noodle sheet food for microwave heating; a method for suppressing the remaining of a skin in the mouth of a cooked encased noodle sheet food for microwave heating (e.g., baked encased noodle sheet food, etc.); a method for suppressing the remaining of a skin in the mouth of a frozen freshly-encased noodle sheet food for microwave heating; a method for suppressing the remaining of a skin in the mouth of a frozen and cooked encased noodle sheet food for microwave heating (e.g., frozen baked encased noodle sheet food, etc.), etc.

[0057] There are no particular limitations on the method for producing the filled noodle food product that can be produced using the method of the present invention, but for example, it can be produced using the same ingredients and by the same production method as the filled noodle food product of the present invention described above.

[0058] The method of the present invention includes adjusting the dielectric loss tangent of the wrapper of the bean-jam-filled noodle sheet food. Specifically, the dielectric loss tangent of the wrapper can be adjusted to fall within a specific range similar to the dielectric loss tangent of the wrapper of the bean-jam-filled noodle sheet food of the present invention described above. The dielectric loss tangent of the wrapper can be measured in the same manner as the method of measuring the dielectric loss tangent of the wrapper of the bean-jam-filled noodle sheet food of the present invention described above.

[0059] In the method of the present invention, the dielectric loss tangent of the wrapper of the bean-jam-filled noodle food can be adjusted in the same manner as in the above-mentioned method of adjusting the dielectric loss tangent of the wrapper of the bean-jam-filled noodle food of the present invention.

[0060] The method of the present invention includes adjusting the stress at the seam of the wrapper of the encased noodle sheet food. Specifically, the stress at the seam of the wrapper can be adjusted to be within a specific range similar to the stress at the seam of the wrapper of the encased noodle sheet food of the present invention described above. The stress at the seam of the wrapper can be measured in the same manner as the method of measuring the stress at the seam of the wrapper of the encased noodle sheet food of the present invention described above.

[0061] In the method of the present invention, the stress at the seam of the wrapper of the encased noodle sheet food can be adjusted in the same manner as in the above-mentioned method of adjusting the stress at the seam of the wrapper of the encased noodle sheet food of the present invention.

[0062] The method of the present invention may include other steps in addition to the steps of adjusting the dielectric loss tangent of the skin and adjusting the stress at the seam of the skin. The steps other than the steps of adjusting the dielectric loss tangent of the skin and adjusting the stress at the seam of the skin are not particularly limited as long as they do not impair the object of the present invention. For example, the method of the present invention may include subjecting the stuffed noodle sheet food to a freezing treatment after adjusting the dielectric loss tangent of the skin and the stress at the seam of the skin.

[0063] According to the method of the present invention, the texture of the seam of the wrapper of a microwave-safe, bean-jam-filled noodle sheet food can be improved, and the bean-jam-filled noodle sheet food can maintain a good texture at the seam of the wrapper even when heated in a microwave oven before eating.Furthermore, according to the method of the present invention, the occurrence of a residue in the wrapper can be suppressed even when heated in a microwave oven before eating.

[0064] The present invention will be described in more detail in the following examples, but the present invention is not limited to these examples. Unless otherwise specified, all raw materials used in the following examples are commercially available food-grade materials.

[0065] [Test Example 1] <Preparation of frozen baked dumplings of Example 1> Frozen baked dumplings (frozen products obtained by freezing baked dumplings) were prepared according to the following steps (1) to (7) (hereinafter also referred to as "frozen baked dumplings of Example 1").

[0066] (1) Preparation of gyoza wrappers Wheat flour, oil, starch sodium octenylsuccinate, and water were kneaded together in the proportions shown in Table 1 below to prepare a dough, which was then rolled to a thickness of approximately 0.7 mm using a roll-type noodle making machine to prepare a noodle sheet. The noodle sheet was then cut into oval shapes (major axis: 90 mm, minor axis: 80 mm) to prepare gyoza wrappers (weight per sheet: 5 g).

[0067] (2) Preparation of filling for gyoza Minced meat, chopped vegetables, seasonings, etc. were mixed to prepare filling for gyoza.

[0068] (3) Preparation of raw dumplings 12 g of the filling (filling material) prepared in (2) above was wrapped in the skin prepared in (1) above to prepare semicircular raw dumplings with a seam (ear) of the skin formed around the filling (i.e., raw dumplings with a skin with a seam formed). When the filling material was wrapped in the skin, a pleat was made at the seam of the skin.

[0069] (4) Preparation of Batter Sugar, amino acids, starch and starch hydrolysate were dissolved in water, and then mixed with oils and fats in which an emulsifier and a thickener had been dispersed to prepare a batter.

[0070] (5) Adhesion of batter The batter prepared in (4) above was collected in a container, and the raw dumplings prepared in (3) above were dipped in the batter, so that approximately 1 g of the batter was adhered to the surface (bottom) of the raw dumplings that would be cooked.

[0071] (6) Heat treatment of raw gyoza (preparation of baked gyoza) The raw gyoza to which the batter was applied in (5) above were steamed and baked in that order to prepare baked gyoza. Steaming was performed for 6 minutes using a gas stove and a steamer. Baking was performed for 4 minutes at 230°C using a hot plate.

[0072] (7) Freezing process of baked dumplings (preparation of frozen baked dumplings) The baked dumplings prepared in (6) above (i.e., baked dumplings with skins with seams formed) were placed on trays (number of dumplings per tray: 5), and then rapidly frozen at -35°C to obtain frozen baked dumplings.

[0073] <Preparation of frozen baked dumplings of Examples 2 to 4> Frozen baked dumplings were prepared using the same procedure as in Example 1, except that in the preparation procedure (1) of Example 1, the blending ratios of wheat flour, oil, starch sodium octenyl succinate, and water were changed to the ratios shown in Table 1 below to prepare the dough (hereinafter, also referred to as "frozen baked dumplings of Example 2" to "frozen baked dumplings of Example 4", respectively).

[0074] <Preparation of frozen baked dumplings of Comparative Example 1> Frozen baked dumplings were prepared using the same procedure as in Example 1, except that in the preparation procedure (1) of Example 1, wheat flour, oil, water, and salt were mixed in the proportions shown in Table 1 below to prepare the dough (hereinafter also referred to as "frozen baked dumplings of Comparative Example 1").

[0075] <Preparation of frozen baked dumplings of Comparative Example 2> Frozen baked dumplings were prepared using the same procedure as in Example 1, except that in preparation procedure (1) of Example 1, wheat flour, starch sodium octenyl succinate, and water were kneaded together in the proportions shown in Table 1 below to prepare the dough (hereinafter also referred to as "frozen baked dumplings of Comparative Example 2").

[0076] <Preparation of frozen baked dumplings of Comparative Example 3> Frozen baked dumplings were prepared using the same procedure as in Example 1, except that in the preparation procedure (1) of Example 1, wheat flour, oil, water, salt and emulsifier were mixed in the proportions shown in Table 1 below to prepare the dough (hereinafter also referred to as "frozen baked dumplings of Comparative Example 3").

[0077] <Preparation of frozen baked dumplings of Comparative Example 4> Frozen baked dumplings were prepared using the same procedure as in Example 1, except that in the preparation procedure (1) of Example 1, wheat flour, oil, water, and starch acetate were kneaded in the proportions shown in Table 1 below to prepare the dough (hereinafter also referred to as "frozen baked dumplings of Comparative Example 4").

[0078] <Preparation of frozen baked dumplings of Comparative Example 5> Frozen baked dumplings were prepared using the same procedure as in Example 1, except that in the preparation procedure (1) of Example 1, wheat flour, oil, water, and oil-processed starch were kneaded in the proportions shown in Table 1 below to prepare the dough (hereinafter also referred to as "frozen baked dumplings of Comparative Example 5").

[0079]

[0080] <Measurement of the dielectric constant (ε') and dielectric loss (ε") of frozen, baked gyoza wrappers, and calculation of the dielectric loss tangent (tan δ)> The frozen, baked gyoza of Examples 1 to 4 and Comparative Examples 1 to 5 were removed from the tray, arranged on plates, and covered with plastic wrap. These were then left to stand at room temperature in this state until the core temperature reached 25°C, allowing each frozen, baked gyoza to thaw naturally. Next, a portion of the wrapper of each of the thawed baked gyoza of Examples 1 to 4 and Comparative Examples 1 to 5 was cut out with scissors, and these (slices of wrapper) were used as samples to measure the dielectric constant (ε') and dielectric loss (ε") at an applied frequency of 2.45 GHz by the coaxial probe method. The measurement system (instruments, etc.) consisted of a vector network analyzer, a high-temperature probe, cables, a computer, analysis software, etc. The vector network analyzer used was an "Agilent E5071C ENA Network Analyzer" manufactured by Agilent Technologies, Inc., and the analysis software included with the vector network analyzer was used. The dielectric constant and dielectric loss were measured by bringing the probe into sufficient contact with the sample placed on the sample stage and reading the real part (dielectric constant) and imaginary part (dielectric loss) of the complex dielectric constant of the sample using analysis software. The instrument used for the measurements was calibrated in advance. Specifically, the instrument was started and the frequency range was set so that 2.45 GHz could be measured. Based on this, the probe was calibrated with air, a standard dielectric, and deionized water (at a known temperature). The dielectric constant and dielectric loss were measured three times in parallel for a single sample, and the average of the three measurements was calculated. This average was used to calculate the dielectric loss tangent (tan δ). The dielectric loss tangent was calculated using the following formula: Dielectric loss tangent (tan δ) = Dielectric loss (ε") / Dielectric constant (ε')

[0081] The dielectric loss tangents (unitless) of the frozen baked gyoza wrappers of Examples 1 to 4 and Comparative Examples 1 to 5 are shown in Table 2 below.

[0082] <Measurement of Seam Stress of Frozen Baked Gyoza Wrappers> The frozen baked gyoza of Examples 1 to 4 and Comparative Examples 1 to 5 were removed from the tray, arranged on plates, and wrapped in plastic wrap. The gyoza were then left to stand at room temperature until the core temperature reached 25°C, allowing each frozen baked gyoza to naturally thaw. Next, the seam of the thawed baked gyoza wrapper of each of Examples 1 to 4 and Comparative Examples 1 to 5 was measured at 25°C using a texture analyzer (Texture Analyzer TA.XT plusC, manufactured by Stable Micro Systems) to measure the stress when compressed 20 mm with a 5 mm diameter spherical plunger at a compression speed of 1 mm / sec. The maximum value (maximum stress) was taken as the stress of the wrapper seam. Compression of the wrapper seam was performed on the overlapping portion of the wrapper other than the pleats. Furthermore, the filling of the baked gyoza was removed beforehand when compressing the wrapper seam. The texture analyzer was set as follows during the measurements. [Texture analyzer settings] Test Mode: Compression Speed ​​Pre Speed: 5 mm / sec Test Speed: 1 mm / sec Post Speed: 5 mm / sec Target Mode: Distance Distance: 20 mm

[0083] The measurement results of the stress at the seams of the frozen baked gyoza wrappers of Examples 1 to 4 and Comparative Examples 1 to 5 are shown in Table 2 below. The units of the numerical values ​​for "stress at the seam of the wrapper" shown in Table 2 are gf.

[0084] <Sensory Evaluation> Each tray containing the frozen baked gyoza of Examples 1 to 4 or Comparative Examples 1 to 5 was covered with plastic wrap and heated in a microwave oven (500 W) for 1 minute 30 seconds. A sensory evaluation was conducted on the texture of the seam (ear) of the gyoza wrapper and the remaining texture in the mouth of each gyoza after microwave heating. The sensory evaluation of the texture of the seam of the gyoza wrapper and the remaining texture in the mouth of the gyoza wrapper after microwave heating was conducted by a trained expert panel using a scoring method. Specifically, the expert panel ate each of the gyoza of Examples 1 to 4 and Comparative Examples 1 to 5 after microwave heating and jointly assigned a score in increments of 1 point according to the following scale. The gyoza were eaten by cutting each gyoza in half after microwave heating and chewing the whole cut gyoza in one go (so that the gyoza wrapper and filling did not separate). The expert panel consisted of six panelists with three or more years of experience in the research and development of gyoza. The panelists shared an understanding of the evaluation scales for the texture of the seam of the skin and the texture of the skin. They had been trained in advance to reach a consensus among the panelists on the extent to which the hardness (softness), suppleness, elasticity and crispness of the skin, the crispness and texture of the skin, etc. should change in order to result in a one-point change in the score on each evaluation scale.

[0085] (Evaluation scale for the texture of the skin seam) 5 points: The skin seam is soft and has a supple elasticity. 4 points: The skin seam is somewhat soft and has a supple elasticity. 3 points: The skin seam is somewhat hard and slightly lacks a supple elasticity. 2 points: The skin seam is somewhat hard and lacks a supple elasticity. 1 point: The skin seam is hard and does not have a supple elasticity.

[0086] (Evaluation scale for skin remaining in the mouth) 5 points: Skin is crisp and does not leave any residue in the mouth. 4 points: Skin is slightly rough to the touch, but does not leave any residue in the mouth. 3 points: Skin is slightly rough to the touch, leaves some residue in the mouth. 2 points: Skin is not crisp and leaves some residue in the mouth. 1 point: Skin is not crisp and leaves some residue in the mouth.

[0087] The results of the sensory evaluation of the frozen baked gyoza of Examples 1 to 4 and Comparative Examples 1 to 5 are shown in Table 2 below. The "overall evaluation" shown in Table 2 was determined by assigning an "x" to a case where either or both of the evaluation results for the texture of the seam of the skin and the remaining texture in the mouth of the skin were 3 points or less, and by assigning an "o" to a case where both of the evaluation results for the texture of the seam of the skin and the remaining texture in the mouth of the skin were more than 3 points.

[0088]

[0089] As shown in Table 2, the frozen baked gyoza of Examples 1 to 4, in which the dielectric dissipation factor of the skin was 0.48 to 0.54 and the stress at the seam of the skin was 95 to 133 gf, all had a good texture at the seam of the skin and also reduced the occurrence of skin that remained in the mouth. On the other hand, the frozen baked gyoza of Comparative Examples 1 to 5 all had a hard texture at the seam of the skin and the skin remained in the mouth.

[0090] [Test Example 2] <Preparation of frozen baked dumplings of Example 5> Frozen baked dumplings were prepared in the same procedure as in Example 1, except that in the preparation procedure (1) of Example 1 of Test Example 1, wheat flour, oil, almond flour and water were kneaded in the proportions shown in Table 3 below to prepare the dough (hereinafter also referred to as "frozen baked dumplings of Example 5").

[0091] <Preparation of frozen baked dumplings of Example 6> Frozen baked dumplings were prepared using the same procedure as in Example 1, except that in the preparation procedure (1) of Example 1 of Test Example 1, wheat flour, oil, corn flour and water were kneaded in the proportions shown in Table 3 below to prepare the dough (hereinafter also referred to as "frozen baked dumplings of Example 6").

[0092]

[0093] <Measurement of dielectric constant (ε') and dielectric loss (ε") of frozen baked gyoza wrappers, and calculation of dielectric loss tangent (tanδ)> The frozen baked gyoza of Examples 5 and 6 were removed from the tray, arranged on plates, covered with plastic wrap, and left to stand at room temperature in this state until the core temperature reached 25°C, thereby naturally thawing each of the frozen baked gyoza. Next, for each of the thawed baked gyoza of Examples 5 and 6, the dielectric constant (ε') and dielectric loss (ε") were measured in the same manner as in Test Example 1, and the dielectric loss tangent (tanδ) was calculated. The dielectric loss tangent (unitless) of the frozen baked gyoza wrappers of Examples 5 and 6 is shown in Table 4 below.

[0094] <Measurement of seam stress of frozen baked gyoza wrappers> The frozen baked gyoza of Examples 5 and 6 were removed from the tray, arranged on plates and covered with plastic wrap, and left to stand at room temperature in this state until the core temperature reached 25°C, allowing each frozen baked gyoza to thaw naturally. Next, the stress of the seam of the wrapper was measured for each of the thawed baked gyoza of Examples 5 and 6 in the same manner as in Test Example 1. The measurement results for the stress of the seam of the wrapper of the frozen baked gyoza of Examples 5 and 6 are shown in Table 4 below. The units for each value of "skin seam stress" shown in Table 4 are gf.

[0095] <Sensory evaluation> Each tray containing the frozen baked gyoza of Example 5 or 6 was covered with plastic wrap and heated in a microwave oven (500 W) for 1 minute 30 seconds. After microwave heating, a sensory evaluation was performed in the same manner as in Test Example 1 regarding the texture of the seam (ear) of the gyoza wrapper and the remaining quality of the wrapper in the mouth.

[0096] The results of the sensory evaluation of the frozen baked gyoza of Examples 5 and 6 are shown in Table 4 below. The "overall evaluation" shown in Table 4 was determined in the same manner as the overall evaluation shown in Table 2.

[0097]

[0098] As shown in Table 4, the frozen baked dumplings of Examples 5 and 6, in which the dielectric tangent of the skin was 0.46 or 0.49 and the stress at the seam of the skin was 118 gf or 175 gf, both had a good texture at the seam of the skin and also reduced the occurrence of skin residue in the mouth.

[0099] [Test Example 3] <Preparation of frozen baked dumplings of Example 7> Frozen baked dumplings were prepared in the same procedure as in Example 1, except that in preparation procedure (1) of Example 1 of Test Example 1, rice flour, pregelatinized rice flour, oil, starch sodium octenyl succinate, and water were kneaded together in the proportions shown in Table 5 below to prepare dough (hereinafter also referred to as "frozen baked dumplings of Example 7").

[0100] <Preparation of frozen baked dumplings of Comparative Example 6> Frozen baked dumplings were prepared in the same procedure as in Example 1 of Test Example 1, except that in preparation procedure (1) of Example 1 of Test Example 1, rice flour, pregelatinized rice flour, and water were mixed in the blending ratios shown in Table 5 below to prepare dough (hereinafter also referred to as "frozen baked dumplings of Comparative Example 6").

[0101]

[0102] <Measurement of dielectric constant (ε') and dielectric loss (ε") of frozen baked gyoza wrappers, and calculation of dielectric loss tangent (tanδ)> The frozen baked gyoza of Example 7 and Comparative Example 6 were removed from the tray, arranged on plates, covered with plastic wrap, and left to stand at room temperature in this state until the core temperature reached 25°C, thereby naturally thawing each of the frozen baked gyoza. Next, for each of the thawed baked gyoza of Example 7 and Comparative Example 6, the dielectric constant (ε') and dielectric loss (ε") were measured in the same manner as in Test Example 1, and the dielectric loss tangent (tanδ) was calculated. The dielectric loss tangent (unitless) of the frozen baked gyoza wrappers of Example 7 and Comparative Example 6 is shown in Table 6 below.

[0103] <Measurement of seam stress of frozen baked gyoza wrappers> The frozen baked gyoza of Example 7 and Comparative Example 6 were removed from the tray, arranged on plates and covered with plastic wrap, and left to stand at room temperature in this state until the core temperature reached 25°C, allowing each frozen baked gyoza to thaw naturally. Next, the stress of the seam of the wrapper was measured for each of the thawed baked gyoza of Example 7 and Comparative Example 6 in the same manner as in Test Example 1. The measurement results of the stress of the seam of the wrapper of the frozen baked gyoza of Example 7 and Comparative Example 6 are shown in Table 6 below. The units of each value for "skin seam stress" shown in Table 6 are gf.

[0104] <Sensory evaluation> Each tray containing the frozen baked gyoza of Example 7 and Comparative Example 6 was covered with plastic wrap and heated in a microwave oven (500 W) for 1 minute 30 seconds. After microwave heating, a sensory evaluation was performed in the same manner as in Test Example 1 regarding the texture of the seam (ear) of the gyoza wrapper and the remaining quality of the wrapper in the mouth.

[0105] The results of the sensory evaluation of the frozen baked gyoza of Example 7 and Comparative Example 6 are shown in Table 6 below. The "overall evaluation" shown in Table 6 was determined in the same manner as the overall evaluation shown in Table 2.

[0106]

[0107] As shown in Table 6, the frozen baked gyoza of Example 7, in which the dielectric tangent of the skin was 0.46 and the stress at the seam of the skin was 178 gf, had a good texture at the seam of the skin and also reduced the occurrence of skin that remained in the mouth. On the other hand, the frozen baked gyoza of Comparative Example 6 had a hard texture at the seam of the skin and the skin remained in the mouth.

[0108] The results of Test Examples 1 to 3 above suggest that a stuffed noodle food product in which the dielectric tangent of the skin is within a specific range and the stress at the seam of the skin is within a specific range will have a good texture at the seam of the skin and will be less likely to leave a residue in the mouth, even if heated in a microwave oven before eating.

[0109] The present invention provides an encrusted noodle sheet food that has a good texture at the seam of the skin even when heated in a microwave oven before eating. The present invention also provides a method for producing the encrusted noodle sheet food. The present invention further provides a method for improving the texture of the seam of the skin of an encrusted noodle sheet food. The present invention also provides an encrusted noodle sheet food that suppresses the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating. The present invention also provides a method for producing the encrusted noodle sheet food. The present invention also provides a method for suppressing the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating. The present invention also provides an encrusted noodle sheet food that has a good texture at the seam of the skin and suppresses the occurrence of a skin that remains in the mouth even when heated in a microwave oven before eating. The present invention also provides a method for producing the encrusted noodle sheet food. The present invention also provides a method for improving the texture of the seam of the skin of an encrusted noodle sheet food and suppressing the occurrence of a skin that remains in the mouth.

[0110] This application is based on patent application No. 2024-013516 filed in Japan (filing date: January 31, 2024), the contents of which are incorporated in their entirety herein.

[0111] 100 Semicircular dumpling 101 Seam of skin (ear) 102 Bottom 103 Skin

Claims

1. A stuffed noodle sheet food product for microwave cooking, comprising a wrapper having a wrapper seam formed therein, (i) the dielectric loss tangent of the wrapper at an applied frequency of 2.45 GHz is 0.4 to 0.7, and (ii) the stress of the wrapper seam measured at 25°C using a texture analyzer by compressing it 20 mm with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec is 50 to 250 gf.

2. The bean-filled noodle food product according to claim 1, wherein the skin contains (A) starch sodium octenyl succinate, and / or (B) cereal flour other than wheat flour and rice flour.

3. The filled noodle food product according to claim 2, wherein (B) is at least one selected from the group consisting of corn flour and almond flour.

4. The bean-filled noodle food according to claim 2, wherein the wrapper contains (A) and the content of (A) in the wrapper is 1 to 30% by weight.

5. The bean-filled noodle food according to claim 2, wherein the wrapper contains (B), and the content of (B) in the wrapper is 1 to 30% by weight.

6. The filled noodle food product according to claim 2, wherein the wrapper further contains (C) oil or fat.

7. The filled noodle food according to claim 6, wherein the content of said (C) in said skin is 3 to 20% by weight.

8. The bean-jam-filled noodle food according to claim 1, wherein the bean-jam-filled noodle food is a baked bean-jam-filled noodle food.

9. The filled noodle food according to claim 1, wherein the filled noodle food is frozen.

10. The filled noodle food according to claim 1, wherein the filled noodle food is a dumpling.

11. A method for producing a microwave-cooked, stuffed noodle sheet food product having a wrapper with a seam formed therein, comprising: (i) adjusting the dielectric tangent of the wrapper at an applied frequency of 2.45 GHz to 0.4 to 0.7; and (ii) adjusting the stress of the wrapper, measured at 25°C using a texture analyzer by compressing the seam by 20 mm with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec, to 50 to 250 gf.

12. A method for improving the texture of a seam of a wrapper in a microwave-heated, encased noodle food product having a wrapper with a seam formed therein, the method comprising: (i) adjusting the dielectric tangent of the wrapper at an applied frequency of 2.45 GHz to 0.4 to 0.7; and (ii) adjusting the stress of the wrapper, measured at 25°C using a texture analyzer by compressing the seam by 20 mm with a 5 mm diameter spherical plunger at a compression rate of 1 mm / sec, to 50 to 250 gf.

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