Vapor chamber, heat dissipation structure, and intelligent device

Abstract

The present application relates to the technical field of heat dissipation, and specifically provides a vapor chamber, a heat dissipation structure, and an intelligent device. The vapor chamber comprises: a first shell and a second shell, wherein an internal space formed therebetween comprises a vapor channel, a condensation area and a vaporization area; a supporting portion, arranged between the first shell and the second shell, wherein the supporting portion, the first shell and the second shell form a plurality of vapor channels; a capillary structure, arranged between the first shell and the second shell; and at least one expansion mechanism, wherein the expansion mechanism comprises an expansion main body, at least a part of the expansion main body is made of a material having a negative temperature coefficient, and at least one of the plurality of vapor channels is provided with the expansion mechanism. By means of such configuration, an expanded state of the expansion mechanism is changed along with a temperature change, so as to change a communication state of the vapor channels, thereby distributing the heat dissipation efficiency as accurately as possible.

Description

Vapor chamber, heat dissipation structure, smart device Cross-references to related documents

[0001] This application claims priority to Chinese patent application No. 202410178139.9 filed on February 8, 2024, with the invention name “Heat spreader, heat dissipation structure, and smart device.” The entire contents of the above Chinese patent application are incorporated into this application by reference. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and specifically provides a heat sink, a heat dissipation structure, and an intelligent device. Background Art

[0003] VC (Vapor Chamber), also known as a soaking plate or a temperature soaking plate, is an iterative product of heat pipes. It has the ability to conduct heat in more directions, so it can achieve a good temperature uniformity effect. For example, soaking plates are currently widely used to dissipate heat for smart terminals such as mobile phones and computers. Taking mobile phones as an example, compared with heat pipes, the probability of local hot spots appearing on the surface of the mobile phone is significantly reduced on the basis of the use of a soaking plate, making the surface temperature of the mobile phone more uniform.

[0004] However, the heat dissipation capacity and heat flow direction of each heat dissipation channel in the current heat spreader structure are relatively fixed. As a result, when the heat spreader performs its heat dissipation function for the mobile phone, it may experience insufficient heat dissipation efficiency or excessive heat dissipation capacity when the heat spreader is in different power states. Specifically, since the heat dissipation capacity and heat flow direction are relatively fixed, the heat spreader may not be able to accurately allocate heat dissipation power to the current heat dissipation needs. For example, the heat spreader and the heat dissipation object may still experience localized overtemperature problems under high-power conditions, while under low-power conditions, the heat spreader may have insufficient heat dissipation capacity (insufficient steam pressure). Summary of the Invention

[0005] The present application aims to at least partially solve the above-mentioned technical problems. Specifically, it provides a heat spreader so that the heat dissipation efficiency can be more accurately distributed when a smart terminal such as a mobile phone is in a high-power working condition, and the heat spreader can be ensured to have sufficient heat dissipation capacity when the mobile phone is in a low-power working condition.

[0006] In a first aspect, the present application provides a heat spreader, which includes: a base, which includes a first shell and a second shell, the internal space formed between the first shell and the second shell includes a steam channel, a condensation zone and an evaporation zone, and the condensation zone and the evaporation zone are respectively located at both ends of the steam channel; a support portion, which is arranged between the first shell and the second shell, and forms a plurality of steam channels with the first shell and the second shell; a capillary structure, which is arranged between the first shell and the second shell; and at least one expansion mechanism, the expansion mechanism includes an expansion body, at least a portion of the expansion body is made of a material with a negative temperature coefficient, and at least one of the plurality of steam channels is configured with the expansion mechanism.

[0007] With this configuration, it is possible to change the communication state of the steam passage by changing the expansion state of the expansion mechanism accompanying temperature changes, thereby allocating the heat dissipation efficiency as accurately as possible.

[0008] It is understood that those skilled in the art may determine the structure, material, and specific method of forming the base of the first and second shells based on actual needs. For example, the first and second shells may be plate-shaped or shell-shaped, and the first and second shells may be integrally formed or fixedly connected. Furthermore, the structure and material of the first and second shells may be the same or different.

[0009] It is understood that those skilled in the art can determine the structural form and number of the support portion, the number of steam passages formed by the support portion and the first / second shell, and the specific form of each steam passage based on actual needs. For example, the support portion includes a support component A and a support component B. One support component A cooperates with the first / second shell to form one steam passage, and two support components B cooperate with the first / second shell to form one steam passage.

[0010] It is understood that those skilled in the art can determine the distribution area of ​​the capillary structure in the space between the first shell and the second shell, the distribution density between different local areas, etc. based on actual needs. The primary function of the capillary structure is to promote the flow of the liquid working medium through the capillary penetration force it generates. For example, the capillary structure can be distributed in the aforementioned steam channel, condensation zone, and evaporation zone, and the distribution density of the capillary structure in the steam channel, condensation zone, and evaporation zone can be the same or different.

[0011] It should be noted that the expansion mechanism mainly utilizes the negative temperature coefficient material property of the expansion body, so that the expansion mechanism can realize the function of switching the steam channel in a passive manner with the help of its own properties as the temperature changes.

[0012] It is understandable that those skilled in the art can determine the specific material of the expansion body, the specific manner in which the expansion body constitutes the expansion mechanism, the specific manner in which the expansion mechanism is fixed to the steam passage, etc. based on actual needs. For example, it may include but is not limited to: in terms of material, the expansion body includes material A and material B, and only one of the materials may be a material with a negative temperature coefficient or both materials may be materials with a negative temperature coefficient; in terms of volume, the expansion body includes a first portion and a second portion, and only one of the portions may be a portion with a material having a negative temperature coefficient or both portions may be portions with a material having a negative temperature coefficient; the expansion mechanism may include a carrier, the expansion body is fixed to the carrier, the carrier is fixed to the steam passage, or the expansion body itself directly constitutes the expansion mechanism.

[0013] For the above-mentioned heat spreader, in a possible embodiment, the plurality of steam channels include a first steam channel group and a second steam channel group, the first steam channel group includes at least one first steam channel, and the second steam channel group includes at least one second steam channel, wherein at least a portion of the second steam channels is configured with the expansion mechanism, the refrigerant is located in the internal space, and the flow resistance of the refrigerant in the first steam channel is not greater than the flow resistance of the second steam channel.

[0014] This configuration ensures heat dissipation capacity in low-power conditions by centrally utilizing the first steam channel for heat dissipation. Heat dissipation capacity is ensured by utilizing the first steam channel group, and heat dissipation power is better distributed in high-power conditions by utilizing the combined heat dissipation of the first and second steam channel groups.

[0015] It is understandable that those skilled in the art can construct differentiating flow resistances based on actual needs, such as by adjusting the streamlines, cross-sectional areas, and distribution of expansion mechanisms in the steam channels. For example, both the first and second steam channel groups may include steam channels with non-straight streamlines, but the non-straight streamlines in the second steam channel group may produce greater flow resistance. For example, the streamlines in the first steam channel may be gentle, large waves, while the streamlines in the second steam channel may include multiple waves.

[0016] It is understandable that those skilled in the art can determine the specific position, number, and relative position of the first steam channel group and the second steam channel group according to the specific situation of the heat dissipation object.

[0017] For the above-mentioned vapor chamber, in a possible implementation manner, the expansion mechanism is disposed at a position close to the evaporation region on the first steam channel or the second steam channel.

[0018] This configuration provides a possible arrangement of the expansion mechanism in the steam channel.

[0019] Regarding the above-mentioned vapor chamber, in a possible implementation manner, regarding the above-mentioned vapor chamber, in a possible implementation manner, at least a portion of the first steam channel is configured with the expansion mechanism.

[0020] This configuration provides a possible combination of the first and second steam channels, that is, if necessary, an expansion mechanism can also be configured for the first steam channel.

[0021] For the above-mentioned heat spreader, in a possible embodiment, the plurality of steam channels include a first steam channel group and a second steam channel group, the first steam channel group includes at least one first steam channel, the second steam channel group includes at least one second steam channel, the streamline of the first steam channel is a straight line extending between the evaporation zone and the condensation zone, and the area of ​​at least a portion of the first steam channel along its cross-section is greater than or equal to the area of ​​the cross-section of at least a portion of the second steam channel.

[0022] Through such a structure, a possible implementation method for differentially designing the heat dissipation capabilities of the first steam channel and the second steam channel is given. Assuming that the first steam channel A1 and the second steam channel A2 each include multiple ones, then "the area of ​​the cross section of at least a portion of the first steam channel along its radial section is not less than the area of ​​the cross section of at least a portion of the second steam channel along its radial section" may include but is not limited to the following situations: all A1 is greater than all A2, part of A1 is greater than all A2, there is a situation in A1 that is approximately the same as or smaller than (part of) A2, all A1 is approximately the same as all A2 (the difference between the two is mainly reflected in the streamline).

[0023] For the above-mentioned heat sink, in a possible embodiment, at least a portion of the streamlines of the second steam channel along the first direction include a portion having an angle with the first direction, wherein the first direction is a direction extending from the evaporation zone to the condensation zone.

[0024] This configuration provides a possible implementation method for achieving a higher flow resistance in the second steam channel. For example, the portion having an angle with the first direction can include one or more segments. For example, the angles between each segment and the first direction can be the same or different. For example, the first direction is substantially aligned with the length of the phone.

[0025] For the above-mentioned vapor chamber, in a possible implementation, when there are multiple second steam channels, the streamlines, cross-sectional shapes and / or cross-sectional areas of the multiple second steam channels are the same.

[0026] For the above-mentioned vapor chamber, in a possible implementation, when there are multiple second steam channels, the streamlines, cross-sectional shapes and / or cross-sectional areas of the multiple second steam channels are different.

[0027] This configuration provides a possible structural form of the second steam channel group.

[0028] For the above-mentioned vapor chamber, in a possible implementation, the second steam channel includes a first portion and a second portion, the first portion and the second portion form an L-shaped structure, wherein the second portion has an angle with the first direction.

[0029] This configuration provides a possible structural form of the second steam channel and a possible placement position thereof in the space between the first shell and the second shell.

[0030] For the above-mentioned vapor chamber, in a possible implementation manner, the second portion and the first direction are perpendicular to each other, and the first portion and the first direction are parallel to each other.

[0031] Through such a configuration, a specific structural form of the second steam channel is provided.

[0032] For the above-mentioned vapor chamber, in a possible implementation manner, the expansion mechanism is disposed at a position of the second portion close to a side of the evaporation region.

[0033] This configuration provides a possible arrangement of the expansion mechanism in the steam channel.

[0034] For the above-mentioned heat spreader, in a possible embodiment, the multiple steam channels include a first steam channel group and a second steam channel group, the second steam channel group includes at least one second steam channel, and when the second steam channel includes multiple ones, the expansion coefficients, shapes and / or volumes of the expansion bodies corresponding to different second steam channels are the same.

[0035] For the above-mentioned heat spreader, in one possible embodiment, the multiple steam channels include a first steam channel group and a second steam channel group, the second steam channel group includes at least one second steam channel, and when the second steam channel includes multiple ones, the expansion coefficients, shapes and / or volumes of the expansion bodies corresponding to different second steam channels are different.

[0036] This configuration provides a possible arrangement of the expansion body in each second steam channel. This allows for more versatile adjustments to the connectivity of the second steam channels, thereby collaborating with the first steam channels to create a heat dissipation capacity and heat flow direction that better suits current heat dissipation needs.

[0037] Regarding the above-mentioned vapor chamber, in a possible implementation manner, the expansion mechanism is provided in the first shell or the second shell in an integrally formed manner or in a fixedly connected manner.

[0038] This configuration provides a specific arrangement of the expansion mechanism in the steam channel. For example, the expansion mechanism includes a carrier, the expansion body is fixedly mounted on the carrier, and the carrier is integrally formed on the evaporation plate of the vapor chamber.

[0039] Regarding the above-mentioned vapor chamber, in a possible implementation manner, the expansion mechanism is fixed to the first shell or the second shell by sintering.

[0040] Through such a structure, a specific arrangement mode of the expansion mechanism in the steam channel is provided.

[0041] For the above-mentioned vapor chamber, in a possible implementation manner, the support portion includes a plurality of support structures, and adjacent support structures, the first shell, and the second shell form the steam channel.

[0042] Through such a structure, a specific way of forming the steam channel is provided.

[0043] In a second aspect, the present application provides a heat dissipation structure, which includes a heating element and a vapor chamber as described in any one of the above items, wherein the evaporation area of ​​the vapor chamber is arranged corresponding to the heating element.

[0044] It is understood that the heat dissipation structure has all the technical effects of any of the aforementioned heat dissipation plates, which will not be described in detail here. For example, the heat dissipation structure can include but is not limited to electronic components, motherboards, and hard drives that have heat dissipation requirements.

[0045] In a third aspect, the present application provides a smart device comprising the aforementioned heat dissipation structure.

[0046] It is understood that the smart device has all the technical effects of the heat dissipation structure described in any of the above items, and no further details are given here. Smart devices may include: mobile phones, tablet computers, laptop computers, PDAs, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks or personal digital assistants (PDAs), network attached storage (NAS), personal computers (PCs), televisions, ATMs or self-service machines, etc., and this application does not limit them. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The following describes a preferred embodiment of the present application by taking a mobile phone as an example and referring to the accompanying drawings, in which:

[0048] FIG1 shows a schematic structural diagram of a vapor chamber according to an embodiment of the present application;

[0049] FIG2 shows a second structural schematic diagram of a vapor chamber according to an embodiment of the present application, in which the condensation zone / evaporation zone / steam channel capillary structure is omitted;

[0050] FIG3 shows a schematic diagram of a state of a vapor chamber according to an embodiment of the present application;

[0051] FIG4 shows a second schematic diagram of a vapor chamber according to an embodiment of the present application; and

[0052] FIG5 shows a third schematic diagram of the state of a vapor chamber according to an embodiment of the present application.

[0053] List of reference numerals:

[0054] 100. Vapor chamber;

[0055] 1. Condensation area;

[0056] 2. Evaporation zone;

[0057] 3. Evaporation channel;

[0058] 41. First group of support structures; 42. Second group of support structures; 43. Third group of support structures;

[0059] 51. Capillary structure of condensation zone; 52. Capillary structure of evaporation zone; 53. Capillary structure of steam channel;

[0060] 6. Capillary expansion valve;

[0061] 200. Mobile phone. DETAILED DESCRIPTION

[0062] The preferred embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application.

[0063] It should be noted that in the description of this application, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the device or element must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, it should not be understood as limiting this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0064] Furthermore, it should be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "installed," "set," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0065] In addition, to better illustrate the present application, numerous specific details are provided in the following detailed description. Those skilled in the art will appreciate that the present application can be implemented without certain specific details. In some instances, detailed descriptions of capillary structures, vapor chambers (VCs), and the principles of expansion achieved by materials with negative temperature coefficients, which are well known to those skilled in the art, are omitted in order to highlight the main purpose of the present application.

[0066] Referring primarily to Figures 1 and 2 , in one possible embodiment, a vapor chamber 100 primarily comprises a condenser plate (first housing), an evaporator plate (second housing) disposed opposite each other, a support portion, a capillary structure, and at least one expansion mechanism. The evaporator plate is positioned adjacent to a mobile phone to distribute cold air to the phone, thereby cooling the phone's surface. The support portion is disposed between the condenser plate and the evaporator plate to form multiple independent steam channels 3 between the two plates. Different steam channels correspond to different localized surfaces of the mobile phone, with the ends of the steam channels communicating with the condensation zone 1 and evaporation zone 2, respectively, between the condenser plate and the evaporator plate. The capillary structure primarily facilitates the return of liquid working fluid from the condensation zone 1 between the two plates to the evaporation zone 2. The expansion mechanism primarily regulates the connectivity of the steam channels, which can include full connectivity, partial connectivity, and disconnection. In this application, the expansion mechanism includes an expansion body, at least a portion of which is made of a material with a negative temperature coefficient. At least one of the multiple steam channels is equipped with the expansion mechanism. For example, the expansion mechanism is sintered onto the evaporator plate.

[0067] It should be noted that in the present application, the expansion mechanism realizes its switching function of the steam channel based on the material with a negative temperature coefficient contained therein. Therefore, it can be called an expansion valve. Compared with electronic expansion valves, the expansion mechanism is a passive expansion valve. Still taking the aforementioned expansion mechanism arranged on the evaporation plate by sintering as an example, on this basis, if the expansion volume is too large, it may cause the expansion body to fall off from the expansion mechanism or the expansion mechanism to fall off from the evaporation plate. In addition, combined with the small size of the VC itself, the expansion volume of the passive expansion valve is small, so it can be called a capillary (small expansion volume) passive (expansion is achieved based on the material properties of the expansion body) expansion valve, hereinafter referred to as a capillary expansion valve.

[0068] In one possible embodiment, the support portion primarily includes multiple support structures, such as support bars and support columns. The support structures provide support within the vapor chamber, and an independent steam channel 3 can be formed between adjacent support columns. For example, the support structures can be made of copper, aluminum, or an alloy. For example, the support structures are support columns, one side of which, along the thickness of the vapor chamber, can be formed on the evaporator / condenser plate by etching or stamping, and the other side can be connected to the condenser / evaporator plate by sintering or other processes.

[0069] As in this example, the support structures include three groups, namely a first group of support structures located in the middle area, and a second group of support structures 42 and a third group of support structures 43 located on both sides of the first group of support structures 41. The support structures are generally strip-shaped structures.

[0070] In one possible embodiment, the first group of support structures corresponds to the core heat dissipation area of ​​the mobile phone (corresponding to the location of the first steam channel group), and the second group of support structures 42 and the third group of support structures 43 on both sides correspond to the areas near the mobile phone frame on both sides along the width direction of the mobile phone (such as non-core heat dissipation areas, corresponding to the location of the second steam channel group). For ease of description, the first steam channel of the first steam channel group and the second steam channel of the second steam channel group are both described using a combination of steam channel and number.

[0071] In this example, the first steam channel group corresponding to the core heat dissipation zone includes three steam channels. The flow directions of these three steam channels are generally straight, and the cross-sectional areas of the steam channels are relatively large. In comparison, the streamlines of the steam channels corresponding to the non-core heat dissipation zone are L-shaped (the leftmost steam channel is U-shaped), with a certain flow resistance (capillary resistance), and some steam channels have smaller cross-sectional areas. This ensures that, even when all steam channels are fully open, the working fluid will preferentially circulate within the steam channels corresponding to the core heat dissipation zone (where capillary resistance is low and steam pressure is high). Taking the L-shaped structure as an example, the horizontal portion of the L-shaped structure is generally perpendicular to the vertical portion. The vertical portion is generally parallel to the first direction. For example, the first direction can be defined as the direction extending from the evaporation zone to the condensation zone. For example, it can extend from a point selected within the evaporation zone to a point selected within the condensation zone. In this example, the first direction is generally the direction corresponding to the line extending from the center point of the evaporation zone to the center point of the condensation zone. That is, it is generally a direction extending in the vertical direction. Obviously, those skilled in the art can adjust this direction appropriately based on actual needs.

[0072] For example, the streamlined shape of the steam channel corresponding to the non-core heat dissipation area is roughly L-shaped. Obviously, this is only an exemplary description, and those skilled in the art can adjust it according to actual needs, such as a wavy structure. In addition, those skilled in the art can determine the shape, area, etc. of different steam channel cross-sections (a surface cut along the radial direction of the steam channel, taking the L-shaped steam channel shown in the figure as an example, a radial section of the steam channel is roughly a horizontal section of the L-shaped structure cut along the vertical direction) according to actual needs.

[0073] In this example, the first group of support structures 41, the second group of support structures 42, and the third group of support structures 43 each include four support columns. Accordingly, there are 11 steam channels, which are sequentially recorded as steam channels (1) to (11) from left to right according to the orientation in Figures 1 and 2. Steam channels (5) to (7) correspond to the core heat dissipation area in the middle (the first steam channel group), and steam channels (1) to (4) and steam channels (8) to (11) correspond to the non-core heat dissipation areas on both sides (the second steam channel group).

[0074] In one possible embodiment, the capillary structure primarily includes a condensation zone capillary structure 51 corresponding to condensation zone 1, an evaporation zone capillary structure 52 corresponding to evaporation zone 2, and a steam channel capillary structure 53 located within steam channel 3. The primary function of the evaporation zone / condensation zone / steam channel capillary structure is to drive the liquid working medium from the condensation zone back to the evaporation zone through the capillary penetration force generated by the capillary structure. For example, the capillary structure may be a metal mesh, metal rope, or metal powder-based supercapillary structure. For example, the evaporation zone / condensation zone capillary structure may be solidified by high-temperature sintering to the end of the condensation plate corresponding to the steam channel.

[0075] In this example, all steam channels (the second steam channel group) corresponding to the non-core heat dissipation zones on both sides, i.e., steam channels (1)-(4), (8)-(11)) are equipped with a capillary expansion valve 6. For example, the expansion body of the capillary expansion valve is made of a negative temperature expansion material, and the capillary expansion valve is fixed to the position of the steam channel near the evaporation zone by sintering. For example, the expansion body can be made of one or more metals or alloy compounds such as antimony, bismuth, gallium, nickel sulfide, etc. Based on this, the volume of the capillary expansion valve will shrink as the temperature rises. In this way, when the temperature is relatively low (such as room temperature or low temperature), the capillary expansion valve can block (or partially block) the corresponding steam channel, and when the temperature is relatively high (such as heated or heated), the corresponding steam channel is opened due to the shrinkage of the capillary expansion valve. Obviously, it is also possible to configure a capillary expansion valve only for some steam channels in some non-core heat dissipation zones. Of course, if necessary, a capillary expansion valve can also be configured for the steam channels in the core heat dissipation zone. For example, a capillary expansion valve is also configured for the steam channels near both sides of the core heat dissipation zone.

[0076] In the case of cooling a mobile phone, when the steam channel is at room temperature or low temperature, the capillary expansion valve expands, thereby blocking or partially blocking the corresponding steam channel. As the temperature and heat loss increase, the volume of the capillary expansion valve located in the steam channel decreases, and the blocked or partially blocked steam channel is opened to a certain extent. This can include situations such as the blocked steam channel being fully opened, the blocked steam channel being partially opened, the partially blocked steam channel being fully opened, and the partially blocked steam channel being opened more fully.

[0077] For example, the material (such as adjusting the type of the aforementioned material, and when there are multiple types, also adjusting the various material components and ratios), volume, shape, etc. of the capillary expansion valve can be adjusted to determine whether the steam channel is in a connected, partially connected or blocked state under the corresponding temperature state.

[0078] In this way, for two steam channels (referred to as steam channel A and steam channel B respectively), 1) assuming that the capillary expansion valves have the same shape / material, the volume of the capillary expansion valve configured in steam channel A is larger than that of steam channel B, and assuming that steam channel B is partially connected at room temperature, steam channel A can be in a blocked state. 2) assuming that the capillary expansion valves have the same shape / volume, the expansion coefficient of the material of the capillary expansion valve configured in steam channel A is greater than that of steam channel B (e.g., a larger expansion coefficient indicates an easier expansion under the same conditions). Assuming that steam channels A and B are both blocked at room temperature, as the temperature increases, steam channel A will switch to a connected state faster than steam channel B, or even in a partially connected state, the opening of steam channel A will be larger than that of steam channel B. Furthermore, by adjusting the cross-sectional shape and / or cross-sectional area of ​​the steam channels, the degree to which multiple steam channels are opened and the order in which they are opened can be achieved under different circumstances.

[0079] The effects of the heat sink of the present application are described below with reference to three specific examples.

[0080] Referring to FIG3 , in one possible embodiment, the mobile phone 200 is in a high-power state. In this case, the corresponding steam channels (1)-(4) and (8)-(11) are all in the maximum open state (e.g., fully connected). In this way, the steam channels (1)-(11) are all in a connected state. Accordingly, the thermal resistance of the non-core heat dissipation areas on both sides of the core heat dissipation area in the steam channel is smaller, so the heat dissipation efficiency corresponding to the core heat dissipation area is higher. In this way, the core heat dissipation area and the non-core heat dissipation area of ​​the mobile phone can be cooled with different degrees of intensity while maintaining the heat distribution as evenly as possible.

[0081] For example, the heat dissipation effect obtained by the mobile phone is as follows: the temperature of the left area corresponding to the steam channels (1)-(4) is 43°C, the temperature of the right area corresponding to the steam channels (8)-(11) is 43°C, the temperature of the middle area corresponding to the steam channels (5)-(7) is 48°C, and the temperature near the condensation area below is 40°C.

[0082] Referring to FIG4 , in a possible embodiment, the mobile phone 200 in this state is in a low-power state. In this case, the capillary expansion valves corresponding to the steam channels (1)-(4) and (8)-(11) are all in an expanded state. In this example, the steam channels (1)-(4) and (8)-(11) are therefore blocked, that is, the steam channels (1)-(4) and (8)-(11) equipped with the capillary expansion valves are all in a non-connected state. In this way, only the steam channels (5)-(7) in a constant connected state are in a working state. In this state, the steam pressure in the steam channels (5)-(7) is more than three times that of the situation shown in FIG2 . Accordingly, the steam flow rate in the steam channel along the Y direction (vertical direction) is more than two times that of the situation shown in FIG2 . Therefore, the heat dissipation efficiency of the heat spreader along the Y direction is higher, while it is in a high thermal resistance state in the X direction. In this way, the core heat dissipation area of ​​the mobile phone can be cooled while ensuring the steam pressure.

[0083] For example, the heat dissipation effect obtained by the mobile phone is as follows: the temperature of the left area corresponding to the steam channels (1)-(4) is 42.1°C, the temperature of the right area corresponding to the steam channels (8)-(11) is 42.1°C, the temperature of the middle area corresponding to the steam channels (5)-(7) is 46.8°C, and the temperature near the condensation area below is 43.1°C.

[0084] Referring to FIG5 , in a possible embodiment, the mobile phone 200 is in an intermediate power state. In this case, the capillary expansion valve contracts to a certain extent on the basis of the expansion state. Accordingly, the steam channels (1)-(4) on the left and the steam channels (8)-(11) on the right are in a partially / fully open state. Since the steam channels (5)-(7) are in a constant connection state, the steam channels (1)-(11) are in a partially / fully connected state. In this way, the heat flow direction can be adjusted in the corresponding heat consumption and temperature state according to the design of the parameters such as the structure and cross-sectional area of ​​the steam channel and the material, shape, volume and other parameters of the capillary expansion valve during the design stage.

[0085] As shown in one of the examples, the heat dissipation effect of the mobile phone is shown in Figure 4. It can be seen that on the basis of adopting the heat sink of the present application, the composition of the heat flow can be adjusted more flexibly, and it is expected to allocate the heat dissipation power more accurately according to the actual heat dissipation needs, thereby obtaining the expected heat dissipation effect.

[0086] It can be seen that in a preferred embodiment of the present application, on the basis of constructing multiple steam channels, by configuring capillary expansion valves for some of the steam channels, it is possible to seek to adjust the direction of heat flow according to the size of the heat consumption. By flexibly combining the structural parameters of the steam channels, the number of steam channels, the combination method between multiple steam channels, the configuration and non-configuration of capillary expansion valves in multiple steam channels, etc., it is expected that the heat spreader will obtain richer adjustment capabilities. On this basis, by adjusting the material, volume, shape and other parameters of the expansion body of the capillary expansion valve, it is expected to more flexibly adjust the heat dissipation capacity of the steam channel equipped with the capillary expansion valve. In summary, on the basis of adopting the heat spreader of the present application, it is expected to obtain sufficient heat dissipation capacity by adjusting the connectivity of the heat dissipation channel, and to accurately match the heat dissipation power to the heat dissipation object according to different heat dissipation requirements.

[0087] Thus far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present application.

Claims

1. A heat sink, characterized in that: The vapor chamber comprises: a base body comprising a first shell and a second shell, wherein an internal space formed between the first shell and the second shell comprises a steam channel, a condensation zone, and an evaporation zone, wherein the condensation zone and the evaporation zone are respectively located at two ends of the steam channel; a supporting portion, which is disposed between the first shell and the second shell and forms a plurality of the steam channels with the first shell and the second shell; a capillary structure disposed between the first shell and the second shell; and At least one expansion mechanism includes an expansion body, at least a portion of the expansion body is made of a material with a negative temperature coefficient, and at least one of the plurality of steam channels is equipped with the expansion mechanism.

2. The vapor chamber according to claim 1, wherein: The plurality of steam channels include a first steam channel group and a second steam channel group, wherein the first steam channel group includes at least one first steam channel and the second steam channel group includes at least one second steam channel. At least a portion of the second steam channel is provided with the expansion mechanism, the refrigerant is located in the internal space, and the flow resistance of the refrigerant in the first steam channel is not greater than the flow resistance of the second steam channel.

3. The vapor chamber according to claim 2, wherein: The expansion mechanism is disposed in at least a portion of the first steam passage.

4. The vapor chamber according to claim 2 or 3, wherein: The expansion mechanism is disposed on a side of the first steam channel or the second steam channel close to the evaporation region.

5. The vapor chamber according to any one of claims 1 to 4, characterized in that: The plurality of steam channels include a first steam channel group and a second steam channel group, the first steam channel group includes at least one first steam channel, the second steam channel group includes at least one second steam channel, and the streamline of the first steam channel is a straight line extending between the evaporation area and the condensation area. The cross-sectional area of at least a portion of the first steam channel is greater than or equal to the cross-sectional area of at least a portion of the second steam channel.

6. The vapor chamber according to claim 5, wherein: At least a portion of the streamlines of the second steam channel along the first direction include a portion having an angle with the first direction, The first direction is a direction extending from the evaporation region to the condensation region.

7. The vapor chamber according to claim 6, wherein: In the case that there are a plurality of second steam channels, the plurality of second steam channels have the same streamlines, cross-sectional shapes and / or cross-sectional areas.

8. The vapor chamber according to claim 6, wherein: In the case that there are a plurality of second steam channels, the plurality of second steam channels have different streamlines, cross-sectional shapes and / or cross-sectional areas.

9. The vapor chamber according to claim 6, wherein: The second steam channel includes a first portion and a second portion, the first portion and the second portion form an L-shaped structure, wherein an angle is formed between the second portion and the first direction.

10. The vapor chamber according to claim 9, wherein: The second portion is perpendicular to the first direction, and the first portion is parallel to the first direction.

11. The vapor chamber according to claim 10, wherein: The expansion mechanism is arranged at a position of the second portion close to a side of the evaporation region.

12. The vapor chamber according to any one of claims 2 to 11, wherein: In the case that the second steam passage comprises a plurality of expansion bodies, the expansion coefficients, shapes and / or volumes of the expansion bodies in different second steam passages are the same.

13. The vapor chamber according to any one of claims 2 to 11, characterized in that: In the case that the second steam passage comprises a plurality of second steam passages, the expansion coefficients, shapes and / or volumes of the expansion bodies in different second steam passages are different.

14. The vapor chamber according to any one of claims 1 to 13, wherein: The expansion mechanism is provided on the first shell or the second shell in an integrally formed or fixedly connected manner.

15. The vapor chamber according to claim 14, wherein: The expansion mechanism is fixed to the first shell or the second shell by sintering.

16. The vapor chamber according to any one of claims 1 to 15, characterized in that: The support portion includes a plurality of support structures, and adjacent support structures, the first shell, and the second shell form the steam channel.

17. A heat dissipation structure, characterized in that: The heat sink comprises a heating element and the heat sink according to any one of claims 1 to 16, wherein the evaporation area of the heat sink is arranged corresponding to the heating element.

18. A smart device, characterized in that: The smart device includes the heat dissipation structure according to claim 17.

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