Circuit board and electronic device

Abstract

A circuit board and an electronic device. The circuit board (10) comprises a bottom plate (11), a reinforcing plate (13) and a plurality of pads (15). The reinforcing plate (13) is made of an insulating material, is fixedly connected to the bottom plate (11), and is provided with a plurality of clearance slots (133) arranged spaced apart from each other, the clearance slots (133) penetrating through the reinforcing plate (13) in a thickness direction, and each clearance slot (133) being provided with a slot opening (137) passing through an edge of the reinforcing plate (13) and being configured to allow a corresponding wire core (20) to be inserted; in the inserting direction of the wire core (20), each clearance slot (133) comprises an accommodating section (134) and a limiting section (135) which are in communication with each other; each accommodating section (134) is provided with a slot opening (137); the width of the accommodating section (134) is greater than the width of the limiting section (135); and the plurality of pads (15) are arranged at intervals on the bottom plate (11), and each pad (15) is accommodated in the corresponding accommodating section (134), wherein each limiting section (135) is configured to clamp and limit the wire core (20) inserted into the corresponding clearance slot (133) via the corresponding slot opening (137).

Description

Circuit boards and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on February 5, 2024, with application number 202420279969.6, and invention name “Circuit Board and Electronic Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a circuit board and an electronic device using the circuit board. Background Art

[0003] In electronic devices, based on signal control and other needs, it is usually necessary to electrically connect some different functional module electronic components to the circuit board through wire cores. In some scenarios, multiple wire cores need to be soldered to corresponding pads on the circuit board.

[0004] In the related art, welding methods may include manual welding or equipment welding. However, since the wire core is small in diameter and soft and difficult to fix, during the manual welding process, the operator needs to use tweezers with one hand to clamp the wire core head and align it with the corresponding pad, and use the other hand to perform welding with a soldering iron. Problems with manual welding: low welding efficiency, poor consistency, and welding often has poor tin connection or tin slag residue, resulting in short circuit defects. Equipment welding operations require the use of a jig to make grooves corresponding to the wire diameter for pre-fixing the wire core, and then align the wire head with a specific pad, and finally use the welding equipment to perform one-time hot pressing to complete the tin melting welding. In this method, due to the softness of the wire core, it is difficult to align multiple wire cores with multiple corresponding pads at one time, and it is also difficult to completely attach the wire core to the pad, resulting in rolling and dislocation of the wire core during the equipment hot pressing welding process, resulting in short circuits and core wire floating defects after welding is completed.

[0005] Therefore, for the welding of multiple wire cores, new design solutions are urgently needed to improve the welding quality. Summary of the Invention

[0006] The present application provides a circuit board and an electronic device, which can improve the yield of multi-core welding operations.

[0007] In a first aspect, an embodiment of the present application provides a circuit board comprising a base plate, a reinforcement plate, and a plurality of solder pads. The reinforcement plate is made of an insulating material and is fixedly connected to the base plate. The reinforcement plate is provided with a plurality of spaced-apart air-avoidance grooves, which penetrate the reinforcement plate in the thickness direction and have notches extending through the edges of the reinforcement plate and are configured to accommodate the insertion of wire cores. In the direction of insertion of the wire core, the air-avoidance groove comprises a connected receiving section and a limiting section, wherein the width of the receiving section is greater than the width of the limiting section. The limiting section is configured to clamp and limit the wire core. The plurality of solder pads are spaced-apart on the base plate, and each solder pad is accommodated in a corresponding receiving section.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, which includes the above-mentioned circuit board.

[0009] Based on the circuit board and electronic device of the embodiment of the present application, an air avoidance groove is formed at the position of the reinforcement plate corresponding to the pad, and the air avoidance groove is divided into a receiving section and a limiting section. The receiving section is configured to accommodate the pad, and the limiting section is configured to clamp and limit the wire core. Therefore, during the welding operation, the wire core can extend from the notch of the air avoidance groove and contact the pad in the receiving section, and the wire end of the wire core can also be pre-fixed by clamping the limiting section for subsequent welding. The setting of the air avoidance groove, on the one hand, makes it more convenient to align and pre-fix the wire core. On the other hand, because of the setting of the air avoidance groove, when the welding equipment is welding, the air avoidance groove can also be configured to hold solder, quantify the solder, and limit the solder to the pad position. In this way, after the welding is completed, the welding effect at each pad is highly consistent, and due to the limiting effect of the air avoidance groove, during the welding process, the wire core is better pressed in the air avoidance groove, and it is not easy for the wire core to move away from the pad. In this way, the effective wrapping of the solder on the wire core can be ensured, thereby greatly improving the welding yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG1 is a schematic diagram of the three-dimensional structure of an embodiment of a circuit board of the present application;

[0011] FIG2 is a front view of the circuit board in FIG1 ;

[0012] Figure 3 is an enlarged view of point A in Figure 2;

[0013] FIG4 is a schematic diagram of the circuit board and the wire core of the present application before assembly;

[0014] FIG5 is a schematic diagram of the assembled circuit board and wire core of the present application;

[0015] FIG6 is a side view of the assembled circuit board and wire core of the present application.

[0016] Figure numerals: 10, circuit board; 11, bottom plate; 13, reinforcement plate; 131, first part; 132, second part; 133, air avoidance groove; 134, accommodation section; 135, limiting section; 136, guide section; 137, notch; 138, groove side wall; 1381, first section; 1382, second section; 1383, third section; 15, soldering pad; 20, wire core; L, interval. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of this application clearer, the following part will further describe the embodiments of this application in detail with reference to the accompanying drawings.

[0018] When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application, as detailed in the appended claims.

[0019] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances. In addition, in the description of this application, unless otherwise specified, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0021] There are many types of electronic devices. To achieve functions such as power supply and signal control, electronic components in these electronic devices need to be connected to circuit boards through wire cores. Some wire cores have multiple wire cores, which are relatively soft. However, existing welding methods, such as manual welding and machine welding, have the problem that the wire core 20 is easily moved relative to the pads on the circuit board 10 during the welding process. Therefore, the welding yield of current welding methods needs to be improved.

[0022] To solve the above problems, please refer to Figures 1 to 3. The first aspect of the present application proposes a circuit board 10, wherein the circuit board 10 can be a radio frequency (RF) board or an application processor (AP) board. The RF board can be configured to carry, but is not limited to, a radio frequency integrated circuit 12a (RFIC), a radio frequency power amplifier (RFPA), and a wireless fidelity (WIFI) chip, etc. The application processor board can be configured to carry, but is not limited to, system-on-chip (SOC) components, double data rate (DDR) memory, a main power management chip (PMU), and an auxiliary power management chip, etc.

[0023] The circuit board 10 can also be a single-sided board or a double-sided board. A single-sided board refers to a board with components arranged on one side, and a double-sided board refers to a board with components arranged on both sides. Among them, the components arranged on the circuit board 10 include chips, resistors, capacitors and other components.

[0024] In the embodiment of the present application, the circuit board 10 includes a base plate 11 , a reinforcement plate 13 , and a plurality of solder pads 15 .

[0025] The base plate 11 typically includes an insulating layer, a conductive pattern layer, and other components. The reinforcing plate 13 is made of an insulating material, such as an epoxy board (FR4) or a polyimide board (PI). The reinforcing plate 13 is fixedly connected to the base plate 11 and may be integrally formed with the base plate 11 during the manufacturing process through hot pressing. It is understood that, in the circuit board 10, reinforcement may be provided in only a portion of the base plate 11. Furthermore, the reinforcing plate 13 may be provided in different areas of the base plate 11, or may be provided in multiple pieces.

[0026] The reinforcing plate 13 comprises a first portion 131 and a second portion 132, connected to each other. The first portion 131 is positioned to one side of the plurality of solder pads 15 and primarily serves to reinforce the area of ​​the base plate 11 outside the region where the solder pads 15 are located. The relative sizes of the first and second portions 131, 132 are not specifically limited in this application. The second portion 132 extends to the region of the base plate 11 corresponding to the region where the solder pads 15 are located. The second portion 132 is provided with a plurality of spaced-apart airtight slots 133, which extend through the thickness of the reinforcing plate 13 and have slots 137 extending through the edge of the reinforcing plate 13. Specifically, the side of the second portion 132 facing away from the first portion 131 includes slots 137 for the airtight slots 133. The solder pads 15 and the reinforcing plate 13 are attached to the same surface of the base plate 11. The plurality of solder pads 15 are spaced apart on the surface of the base plate 11, and each solder pad 15 is accommodated within a receiving section 134.

[0027] Please refer to Figures 4 to 6. During the welding operation, the wire core 20 can be first extended into the air-avoiding groove 133 through the notch 137. At this time, a small amount of glue can be injected into the air-avoiding groove 133 to pre-fix the wire core 20 and the groove wall of the air-avoiding groove 133. Of course, the pre-fixing method can also be welding or the like. Then, the pre-fixed wire core 20 can be batch-welded with the welding pad 15 using welding equipment.

[0028] Therefore, based on the circuit board 10 of the embodiment of the present application, an air-avoidance groove 133 is formed at the position of the reinforcement plate 13 corresponding to the pad 15, and the pad 15 is accommodated in the air-avoidance groove 133, so that the wire core 20 can extend from the notch 137 of the air-avoidance groove 133 and contact the pad 15 for subsequent welding. The setting of the air-avoidance groove 133, on the one hand, provides a positioning function for the wire core 20 to align with its corresponding pad 15, making the alignment more convenient. On the other hand, it is conducive to pre-fixing the wire core 20 and the pad 15 by injecting pre-fixed glue or solder into the air-avoidance groove 133, thereby This can facilitate subsequent batch welding operations through welding equipment. Moreover, due to the setting of the air-avoidance groove 133, when the welding equipment is performing welding, the air-avoidance groove 133 can also be configured to hold solder and quantify the solder. In this way, after the soldering is completed, the welding effect at each pad 15 is highly consistent. Moreover, due to the restrictive effect of the air-avoidance groove 133, during the welding process, the wire core 20 is better pressed in the air-avoidance groove 133, and it is not easy for the wire core 20 to move away from the pad 15. In this way, the effective wrapping of the wire core 20 by the solder can be ensured, thereby greatly improving the welding yield.

[0029] In one embodiment, the thickness of the reinforcing plate 13 is the same as the diameter of the wire core 20; alternatively, the thickness of the reinforcing plate 13 is less than the diameter of the wire core 20, and the difference between the thickness of the reinforcing plate 13 and the diameter of the wire core 20 is no more than 0.1 mm. In this embodiment, when the thickness of the reinforcing plate 13 is approximately the same as the diameter of the wire core 20, the depth of the air avoidance groove 133 is also approximately the same as that of the wire core 20. In this way, after the wire core 20 is inserted into the air avoidance groove 133, on the one hand, the height of the wire core 20 protruding from the reinforcing plate 13 can be used to easily determine whether the wire core 20 has achieved stable contact with the solder pad 15. On the other hand, when the depth of the air avoidance groove 133 is approximately the same as that of the wire core 20, the amount of solder used during the soldering process is also relatively appropriate while ensuring the soldering effect.

[0030] Referring again to FIG. 3 , the air-avoidance groove 133 includes two oppositely disposed groove sidewalls 138 extending from the notch 137 toward the interior of the second portion 132 . The solder pad 15 is disposed between the two groove sidewalls 138 , and opposite sides of the solder pad 15 in the width direction abut against the two groove sidewalls 138 . In this embodiment, by abutting the solder pad 15 against the groove sidewalls 138 , it is possible to ensure that the solder covers the entire solder pad 15 while using relatively little solder. Furthermore, the air-avoidance groove 133 can effectively limit the wire core 20 , confining the soft and relatively small wire core 20 to the surface of the solder pad 15 , thereby ensuring a secure connection between the wire core 20 and the solder pad 15 .

[0031] To ensure a good soldering effect, a gap can also be provided in the avoidance groove 133 between the pad 15 and the notch 137 in the direction of insertion of the wire core 20. Specifically, referring to FIG3 , the gap is L. As will be appreciated, after soldering, the solder will partially solidify on the side of the pad 15 facing the notch 137, thereby increasing the bonding area between the solder and the pad 15 and further enhancing soldering strength.

[0032] Specifically, the interval is 0.3 mm to 0.5 mm. If the value of the interval is too small, there is less solder on the side of the pad 15 facing the notch 137, and the firmness is relatively weakened. If the value of the interval is too large, more solder is required to fill the interval, which increases the cost of solder. Therefore, the interval of the present application can be set to a value such as 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc., so that the material cost can be reduced while ensuring firmness.

[0033] In this embodiment, the end face of the reinforcement plate 13 having the notch 137 is flush with the side surface of the base plate 11. In this way, the insulating portion of the conductive wire having multiple cores 20, which covers the core 20, is located outside the air-avoidance groove 133, which facilitates clamping during the welding operation. In addition, when the core 20 is inserted into the air-avoidance groove 133, it passes through the side surface of the base plate 11 from the outside and directly enters the air-avoidance groove 133. In this way, there is less obstruction during the insertion of the core 20, and the operation is easier.

[0034] Furthermore, in the insertion direction of the wire core 20, the air avoidance groove 133 includes a connected receiving section 134 and a limiting section 135, the receiving section 134 is provided with a notch 137, and the width of the receiving section 134 is greater than the width of the limiting section 135, and the limiting section 135 is configured to clamp and limit the wire core 20; wherein, the groove side wall 138 includes a first section 1381 and a second section 1382 corresponding to the receiving section 134 and the limiting section 135 respectively, the soldering pad 15 is located between the first section 1381 of the two groove side walls 138 and abuts against the first section 1381, and the third section 1383 of the two groove side walls 138 is configured to cooperate in clamping to limit the wire core 20.

[0035] In this embodiment, the spacing dimension between the two third sections 1383 can be set to be slightly larger than the diameter of the wire core 20, that is, the width of the limiting section 135 is slightly larger than the diameter of the wire core 20. Specifically, the ratio of the width of the limiting section 135 to the diameter of the wire core 20 can be set to 1:(0.7~0.9). With this setting, on the one hand, the limiting section 135 reserves a certain redundant space for the wire core 20 to be smoothly inserted. On the other hand, since the wire core 20 is relatively soft, its certain deformation characteristics can also be utilized while reserving a certain spacing to achieve a clamping and fixing effect.

[0036] Furthermore, the air avoidance groove 133 also includes a guide section 136 connected between the receiving section 134 and the limiting section 135, and the groove side wall 138 also includes a third section 1383 corresponding to the guide section 136 and connected between the first section 1381 and the second section 1382; the distance between the third sections 1383 of the two groove side walls 138 is set to decrease in the direction from the receiving section 134 to the limiting section 135.

[0037] In this embodiment, the wire ends of the wire core 20 can be smoothly guided into the limiting section 135 by the provision of the guide section 136. Since the soldering pad 15 of the present application is provided in the receiving section 134, the guide section 136 can also be configured to achieve the pre-fixing effect of the wire core 20 by dispensing glue, welding, etc. between the third section 1383 and the wire core 20 during the pre-fixing process of the wire core 20. In this way, there is a certain difference between the position of the pre-fixing and the final welding soldering pad 15, without affecting the welding effect. In order to further enhance the guiding effect, the distance between the third sections 1383 of the two groove side walls 138 is gradually reduced in the direction from the receiving section 134 to the limiting section 135. This arrangement makes the process of the wire core 20 entering the limiting section 135 smoother.

[0038] In one embodiment, a metal coating may be provided on the groove sidewall 138. The metal coating may be formed through a PTH process and may be a copper coating. The provision of the metal coating facilitates the aforementioned soldering pre-fixing of the wire core 20 via the third section 1383. Furthermore, when the metal coating is provided, the solder will adhere to the metal coating during the soldering process, resulting in a better soldering effect. This ensures that the wire core 20 is securely wrapped by the solder, thereby firmly securing it to the solder pad 15 as a whole. This facilitates soldering operations and improves soldering quality.

[0039] The present application also proposes an electronic device, which includes the above-mentioned circuit board 10. The specific structure of the circuit board 10 refers to the above-mentioned embodiment. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0040] Among them, the electronic equipment of this application includes but is not limited to voice equipment (such as headphones), sweepers, security equipment, automotive electronic equipment, etc.

[0041] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "up", "down", "left", "right", etc. indicate directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0042] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A circuit board, wherein: include: base plate; A reinforcing plate, made of insulating material and fixedly connected to the bottom plate, the reinforcing plate being provided with a plurality of spaced-apart air-avoidance grooves, the air-avoidance grooves penetrating the reinforcing plate in the thickness direction and having notches penetrating the edges of the reinforcing plate, configured for insertion of wire cores; in the insertion direction of the wire cores, the air-avoidance grooves comprising a communicating receiving section and a limiting section, the width of the receiving section being greater than the width of the limiting section, the limiting section being configured to clamp and limit the wire cores; and A plurality of solder pads are arranged at intervals on the bottom plate, and each of the solder pads is accommodated in a corresponding receiving section.

2. The circuit board according to claim 1, wherein The thickness of the reinforcing plate is the same as the diameter of the wire core; or, the thickness of the reinforcing plate is smaller than the diameter of the wire core, and the difference between the thickness of the reinforcing plate and the diameter of the wire core is not greater than 0.1 mm.

3. The circuit board according to claim 1, wherein The air-avoiding groove comprises two oppositely arranged groove side walls, the groove side walls comprising a first section and a second section corresponding to the receiving section and the limiting section respectively, and the welding pad is located between the first sections of the two groove side walls; The pad is in contact with two of the first sections at two opposite sides in the width direction.

4. The circuit board according to claim 3, wherein: The end surface of the reinforcing plate having the notch is flush with the side surface of the bottom plate.

5. The circuit board according to claim 3, wherein: The air avoidance groove further includes a guide section connected between the receiving section and the limiting section, and the groove side wall further includes a third section corresponding to the guide section and connected between the first section and the second section; The distance between the third sections of the two groove side walls is arranged to decrease in the direction from the receiving section to the limiting section.

6. The circuit board according to claim 3, wherein: The side walls of the groove are also provided with a metal plating layer.

7. The circuit board according to claim 1, wherein The ratio of the width of the limiting section to the diameter of the wire core is 1:(0.7-0.9).

8. The circuit board according to claim 1, wherein In the inserting direction of the wire core, a space is provided between the pad and the notch.

9. The circuit board according to claim 8, wherein: The interval is 0.3 mm to 0.5 mm.

10. An electronic device comprising a circuit board, wherein: The circuit board comprises: base plate; A reinforcing plate, made of insulating material and fixedly connected to the bottom plate, the reinforcing plate being provided with a plurality of spaced-apart air-avoidance grooves, the air-avoidance grooves penetrating the reinforcing plate in the thickness direction and having notches penetrating the edges of the reinforcing plate, configured for insertion of wire cores; in the insertion direction of the wire cores, the air-avoidance grooves comprising a communicating receiving section and a limiting section, the width of the receiving section being greater than the width of the limiting section, the limiting section being configured to clamp and limit the wire cores; and A plurality of solder pads are arranged at intervals on the bottom plate, and each of the solder pads is accommodated in a corresponding receiving section.

11. The electronic device according to claim 10, wherein: The thickness of the reinforcing plate is the same as the diameter of the wire core; or, the thickness of the reinforcing plate is smaller than the diameter of the wire core, and the difference between the thickness of the reinforcing plate and the diameter of the wire core is not greater than 0.1 mm.

12. The electronic device according to claim 10, wherein: The air-avoiding groove comprises two oppositely arranged groove side walls, the groove side walls comprising a first section and a second section corresponding to the receiving section and the limiting section respectively, and the welding pad is located between the first sections of the two groove side walls; The pad is in contact with two of the first sections at two opposite sides in the width direction.

13. The electronic device according to claim 12, wherein: The end surface of the reinforcing plate having the notch is flush with the side surface of the bottom plate.

14. The electronic device according to claim 12, wherein: The air avoidance groove further includes a guide section connected between the receiving section and the limiting section, and the groove side wall further includes a third section corresponding to the guide section and connected between the first section and the second section; The distance between the third sections of the two groove side walls is arranged to decrease in the direction from the receiving section to the limiting section.

15. The electronic device according to claim 12, wherein The side walls of the groove are also provided with a metal plating layer.

16. The electronic device according to claim 10, wherein: The ratio of the width of the limiting section to the diameter of the wire core is 1:(0.7-0.9).

17. The electronic device according to claim 10, wherein: In the inserting direction of the wire core, a space is provided between the pad and the notch.

18. The electronic device according to claim 17, wherein: The interval is 0.3 mm to 0.5 mm.

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