Focused temperature regulation unit

Abstract

The invention relates to a multi-duct heat exchanger for temperature regulation of one or more components, said heat exchanger comprises a contact surface thermally connected to walls, defining a first duct and second ducts, and to a part of the component. Energy is transferred via thermal conduction between the first part of the 5 component and the walls. In the first ducts circulation of a first fluid if facilitated. Via thermal convection, transfer of energy between the walls and the first fluid is provided. In the second ducts is second fluid circulated through the heat exchanger.

Description

FOCUSED TEMPERATURE REGUEATION UNITField of the invention

[0001] The invention relates to a focused temperature regulation unit in the form of a multi-duct heat exchanger and a temperature regulation system with such heat exchanger.Background of the invention

[0002] In the art heat exchangers may be fabricated by a three-dimensional fabrication apparatus with a non-uniform gyroid structure portion. Such heat exchanger is exemplified as a heat sink having an enhanced thermal performance in EP4180151. Here a heat sink is illustrated having a water supply port, a channel, a gyroid structure portion and a water discharge port. A fluid enters the heat sink body through the water supply port. The fluid flows in a channel through the gyroid structure portion. The fluid supplied from the water supply port is discharged from the water discharge port. This prior art discloses to utilize the internal gyroid structure of a heat exchanger.

[0003] Another example of a heat exchanger in the art is found in EP3904818. Here a power transformer is disclosed having a casing comprising a clockwise flow of oil to remove heat from an electrical component such as windings of the transformer. This document discloses several different implementations of a heat exchanger which may have a three-dimensional lattice cell structure. The circulated oil is cooled in the heat exchanger by blowing air from fans through the heat exchanger. A problem with this prior art is that the oil has to be contained in the casing with the windings to cool them.Summary of the invention

[0004] The inventors have identified the above-mentioned problems and challenges related to temperature regulation including cooling of components or parts of components and solved these problems by the present invention as described below.

[0005] In an aspect, the invention relates to a multi-duct heat exchanger configured for temperature regulation of one or more components, said heat exchanger comprises an enclosure having a contact surface and an internal structure comprising walls defining a plurality of first ducts and a plurality of second ducts, wherein said contact surface is thermally connected to at least one of said walls thereby allowing a transfer of energy therebetween, and wherein said contact surface is thermally connectable to a first part of said one or more components, wherein said plurality of first ducts is configured for guiding a first fluid from a first fluid inlet of said enclosure to a first fluid outlet of said enclosure, and wherein said plurality of second ducts are configured for guiding a second fluid from a second fluid inlet of said enclosure to a second fluid outlet of said enclosure.

[0006] According to an embodiment of the invention, the design of said contact surface and said at least one wall allow transfer of energy from said first part of said one or more components and said at least one wall when said first part of said one or more components are thermally connected to said contact surface.

[0007] According to an embodiment of the invention, said energy is configured for being transferred between said first part of said one or more components and said at least one wall by thermal conduction.

[0008] According to an embodiment of the invention, said energy is configured for being transferred from said at least one wall to said first fluid by thermal convection.

[0009] According to an embodiment of the invention, said first fluid is configured for transferring said energy out of said enclosure via said first fluid outlet.

[0010] Such a multi-duct heat exchanger is advantageous in that it has the effect that by building, e.g. monolithically, the contact surface together with part of the walls, anenergy transfer, via thermal conduction, from the contact surface to the walls is established. From the walls the energy transfer is, via thermal convection, continued to the first fluid in the first duct and by the first fluid out of the enclosure, preferably to another heat exchanger. In this way, when the contact surface is thermally connected (e.g. monolithically, via physical contact, via thermal paste, or the like) to a part of a heat generating component, energy from that part can be transported, via thermal conduction from component to walls, via the contact surface and via thermal convection from walls to the first fluid and then via the first fluid in the first ducts out of the enclosure and away from the component. In such external heat exchanger, the temperature of the first fluid may be reduced and thus enter the first duct inlet with a temperature lower than it left the first duct outlet.

[0011] It should be mentioned that energy transfer may also be the other way around i.e. from the first fluid to the component part depending on which of the component part and of the first fluid has the highest. Thus, the first fluid may in one configuration increase the temperature of the component part and in a second configuration decrease the temperature of the component part hence, the term temperature regulation. Accordingly, when one configuration is described in this document it is with the knowledge that the other configuration may also be possible.

[0012] According to an embodiment of the invention, said second fluid outlet is configured for guiding said second fluid towards a second part of said one or more components (2CO).

[0013] According to an embodiment of the invention, said second fluid is configured for transferring energy from said second part of said one or more components (2CO) by thermal convection.

[0014] Furthermore, such a multi-duct heat exchanger is advantageous in that at the same time as the first fluid in the first ducts is guiding energy / heat away from the part of the component, the second fluid guided by the second duct may, by thermal conduction, transport energy to the walls separating the first and second ducts. In thisway, the first fluid may, via thermal conduction, obtain energy from the second fluid via the walls and thus, reduce the temperature of the second fluid inside the enclosure.

[0015] It should be mentioned that the way of energy transfer depends on configuration and thus, energy may also go from the first fluid to the second fluid thereby reducing the temperature of the first fluid. This is advantageous in that both of the first and second fluids are assisting each other in regulating (such as cooling) the temperature of the component part.

[0016] According to an embodiment of the invention, said walls defining said first and second ducts are configured for transferring of energy between said first fluid and said second fluid.

[0017] The direction of energy transfer from first to second or from second to first depend on temperature of the two fluids. Typically, the warmer fluid will transfer energy via the walls to the colder fluid.

[0018] According to an embodiment of the invention, said energy is transferred from said second fluid to said first fluid.

[0019] In some implementations of the invention, the first fluid is a liquid which is colder than the second fluid which in some implementations is a gaseous fluid such as air. The liquid may be used to transport energy (heat) out of the heat exchanger thus, the temperature of the first liquid is typically lower than the component to be, in this example, cooled and colder than the second fluid. In this example, the second fluid would also be cooled by the first fluid.

[0020] The energy can be transferred either directly from the contact surface or from the walls to the first fluid or to the second fluid via thermal convection.

[0021] The temperature regulation includes cooling or heating of the component and is facilitated by the energy transfer. Being able to regulate the temperature of a component may include maintaining a desired temperature, reduce a current temperature or increase a current temperature. Maintaining a temperature may beachieved either by cooling or heating. Hence, the energy transfer results in a temperature regulation of the component.

[0022] Such heat exchanger is advantages in that it benefits from the use of the first fluid for both regulating the temperature of the component via the contact surface and regulating the temperature of the flow of fluid in the second duct and thus the temperature of the component to which the flow is guided. Accordingly, the heat exchanger is optimized for regulating temperature of two predetermined areas / parts of one component or one area / part of two different components. The first area of a component is temperature regulated via the contact surface (i.e. via thermal conduction, thermal convection or a combination thereof). The second area of the component, or a first area of another component is temperature regulated via the flow of the second fluid guided thereto (i.e. via thermal convection).

[0023] Such two-spot temperature regulating heat exchanger is advantageous in that the two spots of the one or more components can be temperature regulated simultaneously.

[0024] Further, such temperature regulating heat exchanger facilitating focused regulation of two areas is advantageous in that the footprint of the heat exchanger can be reduced without reducing (cooling / heating) efficiency. In fact, two independent heat exchangers may be replaced by one of the multi-duct heat exchanger according to the present invention. Multi-duct may also be referred to as multi-channel.

[0025] Defining ducts from walls that are structural, such as monolithic formed with the contact surface, is advantageous in that heat (or cold) is transported from the contact surface throughout the internal structure and thus fluid of the first ducts can remove this heat (or cold) also if the first fluid is not guided in a duct partly defined by the contact surface.

[0026] A heat exchanger in the context of the present invention should be understood as a heat exchanger that is able to regulate the temperature of two pre-defined areas on one or more components. In an embodiment, one area is temperature regulated via conduction-based energy transfer and one area is temperature regulated viaconvection-based energy transfer. The temperature regulation is provided via energy transfer to and / or from the first and / or second fluid. In an embodiment, the heat exchanger may be referred to as bifunctional in that it could be said to have two functions. In fact it may be referred to as multi-functional in that it could be said to have more than two functions. A first and main function is to exchange energy between a component part and the first fluid (by conduction via contact surface and walls, then by convection to the first fluid). A second function that may be facilitated by the heat exchanger is energy exchange between a component part and the second fluid (by convection via flow of second fluid directed to the component part). A third function that may be facilitated by the heat exchanger is energy exchange between a component part and the second fluid (by conduction in case the heat exchanger comprises additional contact surface for transfer energy from component thereto and to walls connected to the additional surface and by convection from such walls to the second fluid). A third function is energy transfer between the first and second fluids (by convection via the walls). Accordingly, such bifunctional / multi-functional may additionally or alternatively be understood as the use of two (e.g. two different) fluids and / or the fact that a focused cooling of two different part (e.g. of two different components or of the same component) may be provided. Focused may here be understood as predetermined i.e. temperature regulating a predetermined part or spot of one or more components.

[0027] A spot heat exchanger should be understood as a heat exchanger that is designed / optimized to cool or heat a particular area / part / spot of a component i.e. to regulate temperature hereof. In the same way, a two-spot heat exchanger should be understood as a heat exchanger that is designed / optimized to regulate temperature of two spots of one component or one spot of two components. With this said, the flow guides may be designed to guide the second fluid to various spots of a component thereby making the heat exchanger a multi-spot heat exchanger. An advantage of a spot heat exchanger is that the heat generating component is cooled before such heat spreads to the enclosure comprising the component. If heat spread in an enclosure, the capacity and footprint of a heat exchanger that is needed to reduce the temperature of that enclosure (such enclosure may be an electric cabinet), need to be increased.

[0028] In an example of cooling, it can be said that the combined cooling capacity of the focused heat exchanger ideally should be calculated to be higher than the heat (energy) generated by the component to be cooled. The combined cooling capacity include both the energy transfer established via thermal conductor and thermal convection and to both the first and to the second fluids. This methodology can also be applied to a group of components. Compared to known heat exchangers, the required footprint of a heat exchanger according to the present invention is reduced for obtaining the same cooling capacity. Both because of the focused / spot cooling and because of the use of both of the first and second fluids to remove heat from the heat exchanger.

[0029] The thermal connection between the surface of the first part of the component and the surface of the contact surface may be established directly via thermal conduction between the two surfaces. Alternatively, a thermal pasta or other material may be provided between the two surfaces to establish an optimal thermal conduction of energy. In yet another alternative, at least part of the energy is transferred or removed via thermal convection. Thus, the energy removal / transfer may be performed by thermal convection, thermal conduction or a combination thereof. It should be noted that a stand-alone heat exchanger according to the invention may be thermally connectable to one or more components or part(s) hereof via one or more contact surfaces.

[0030] The transfer of energy obtained between the second part of the one or more components and the second fluid may result in an increase of the temperature of the second component part towards the temperature of the second fluid measure at the second fluid outlet. This would typically also be a temperature increase compared to the ambient temperature. It may also decrease the temperature of the second component part towards the temperature of the second fluid measure at the second fluid outlet. This would typically reduce the delta temperature between the second component part and the ambient temperature.

[0031] Transfer or transport of energy should be understood as energy moving in a mechanical structure or from one mechanical structure to the other mechanicalstructure where the two structures are physically in contact e.g. with a thermal paste therebetween. This way of energy transfer is typically referred to as thermal conduction. When energy is transferred from one mechanical structure to another medium such as a fluid (gaseous or liquid) exemplified by energy transfer from a wall to a fluid, this is referred to as thermal convection.Energy transfer may be exemplified by heat transfer. Hence, energy may be obtained by the second fluid via convection energy from a part of a component. More specifically this means that heat from the component is heating up the second fluid when the second fluid is passing by the component. In this way, as the second fluid continues its path e.g. out of the heat exchanger enclosure it is passing by the component and there, by thermal convection, is transferring energy away from the component.

[0032] According to an embodiment of the invention, a first side of one of said walls is partly defining at least part of one of said plurality of first ducts and a second side of said one of said walls is partly defining at least part of one of said plurality of second ducts.

[0033] This is advantageous in that it has the effect, that the design of the internal structure can be made compact. Further, this is advantageous in that heat / cold can be exchanged both between fluids of the first and second ducts and between the contact surface and the fluid of at least one of the first and second ducts or in both ducts.

[0034] According to an embodiment of the invention, said first side and / or said second side comprise one or more fins.

[0035] Fins, such as protrusions from the wall side, are advantageous in that it has the effect, that it creates a swirling effect in the flow of fluid and thereby optimising / increasing efficiency of the heat exchange between the fluid and the first / second wall sides.

[0036] According to an embodiment of the invention, at least part of said first duct and / or said second duct is defined by an outer wall of said heat exchanger.

[0037] Partly defining the second duct (but also possibly part of the first ducts) by the outer walls of the heat exchanger is advantageous in that it has the effect, that the heat exchanger design can be made compact using the outer walls as part of the heat exchanging elements / walls. This may lead to a higher efficiency of the heat exchanger per square centimetre of footprint. One or more outer walls may define a heat exchanger enclosure.

[0038] Preferably, it is the second ducts that are defined by the outer wall of the heat exchanger in that then the first fluid only has to exchange heat with the heat generating element via the contact surface and with the second fluid via the walls defining the first and second ducts respectively.

[0039] In the embodiment where the outer wall partly defines the second duct, the heat exchanger could be said to have two spot cooling features (the convection and conduction cooling) and one non-focused cooling feature in the form of the outer wall of the heat exchanger in the situation where the outer walls thereof have a lower temperature than the enclosure in which it is located. The same could be said regarding heating if the outer wall have a higher temperature than the enclosure.

[0040] According to an embodiment of the invention, said internal structure is designed as a triply periodic minimal surface.This is advantageous in that it has the effect that the internal structure is optimized with respect to material consumption to establish the first and second ducts. None- limiting examples of a triply periodic minimal surface may be a gyroid structure, a lidinoid structure, etc.

[0041] According to an embodiment of the invention, said internal structure is designed as adjacent pipes located side-by-side altematingly defining a first duct and a second duct.

[0042] According to an embodiment of the invention, said internal structure is designed as adjacent sheets located side-by-side altematingly defining a first duct and a second ducts.

[0043] An internal structure of pipes, which may be parallel to each other, and internal structure of sheets, which may be stacked on top one another, is advantageous in that manufacturing of such internal structure do not require additive manufacturing. A heat exchanger with such internal structure is, however, not as efficient as one with e.g. a gyroid internal structure, in that the gyroid structure is optimized with respect to surface of the walls.

[0044] Common for heat exchangers with stacked sheets or adjacent piping are that at the ends the ducts defined by the pipe / sheets are shot circuited thereby allowing fluid from one first duct meet with fluid from a second first duct and similarly with the fluid of the second duct.

[0045] According to an embodiment of the invention, said plurality of first ducts is a closed duct system.

[0046] A closed duct system is advantageous in that it has the effect, that the first fluid (such as a temperature regulating medium referred to as a refrigerant or a coolant, typically, but not limited to a liquid medium) is maintained in a closed loop. This mean that in the embodiment where the first fluid is a cooling fluid, it can be circulated through the multiple of first sub-ducts from one inlet to one outlet and further to a heat exchanger located where heat from the cooling fluid is removed. Note that there may be more than one inlet and / or more than one outlet to the first duct system.

[0047] According to an embodiment of the invention, at least one of said plurality of first ducts is blinded.

[0048] Blinding a duct and especially blinding a duct by part of the contact surface is advantageous in that it has the effect, that the first fluid may be forces into the dead end of one of the plurality of ducts and thereby in contact with the contact surface and thereby ensuring cooling / heating of that part of the contact surface. Hence, blinded here should be understood as one or more parts of, in this case, the first duct lead to the blind duct and one or more parts of the first duct lead away from the blind duct to be able to keep providing flow of first fluid to the blind duct.

[0049] A blind duct may also be referred to as a finger extending from the enclosure or main body of the heat exchanger. Such finger may have a geometry allowing a contact surface or finger enclosure to reach component parts that are not otherwise available for energy transfer by conduction.

[0050] According to an embodiment of the invention, at least part of at least one of said plurality of first ducts are shaped by the curvature of a fin.

[0051] This is advantageous in that fluid can be conducted as close to the part of the enclosure of the heat exchanger receiving / exchanging energy from a heat source such as an electric conductor. Thereby increasing efficiency of the heat exchanger and thereby of the removal of heat i.e. more heat can be removed without increasing footprint of heat exchanger.

[0052] According to an embodiment of the invention, said heat exchanger comprises more than one contact surface.

[0053] This is advantageous in that it has the effect, that more than one part of the component or a larger part of the component or maybe part of two different components can be cooled / heated via the contact surface.

[0054] According to an embodiment of the invention, said contact surface is a non- uniform surface.

[0055] A non-uniform contact surface is advantageous in that it has the effect that optimal thermal connection is possible to obtain even with heat generating elements that has a non-uniform surface. An example of a non-uniform contact surface is a curved surface matching a curved surface of a component to be cooled / heated. Note that non-uniform surface should be understood as a surface which is different from a uniform surface such as a planer surface.

[0056] A uniform surface is advantageous if the surface of the component that need to be temperature regulated is also uniform. Note a thermal paste may be used to handle minor tolerances and minor non-uniformities.

[0057] According to an embodiment of the invention, said non-uniform surface has a sawtooth geometry, preferably a truncated sawtooth geometry.

[0058] A sawtooth geometry is advantageous in that it has the effect, that the contact area between contact surface and components in increased. When truncated, it has the effect, that the force used for connecting is mainly distributed through the sides of the sawtooth geometry and not mainly through the tips of the tooths which is the case if these are not truncated.

[0059] According to an embodiment of the invention, said contact surface is thermally connected to said of one or more components via an electric insulating material.

[0060] This is advantageous in that it has the effect that optimal thermal connection is obtained even though the surface of the component and the surface of the contact surface are not completely plane.

[0061] According to an embodiment of the invention, said second duct is an open duct system.

[0062] An open duct system in combination with a closed first duct system is advantageous is advantageous in that a second fluid can be circulated through multiple of second sub-ducts. Second sub-ducts which may be considered established by the walls of the multiple of first sub-ducts. The second fluid is preferably a fluid in gaseous form such as the air surrounding the heat generating components.

[0063] Hence, in an embodiment the second ducts system would guide second fluid so that the second fluid is cooled by the first fluid of the first ducts system. If the second fluid is ambient temperature air which is then cooled by the first fluid in the enclosure of the heat exchanger. Subsequently e.g. when the second fluid is leaving the enclosure it is colder than ambient air and would thus be able to cool the component or part hereof towards which it is directed.

[0064] According to an embodiment of the invention, said second fluid inlet is covered by a fan.

[0065] Accordingly, the second fluid inlet is larger than the inlet to the first duct system. A fan is mounted to preferably cover the second fluid inlet completely. If not completely covering the inlet efficiency of the convection-based cooling / heating is reduced. The second fluid inlet may also be referred to as a second duct inlet.

[0066] A fan blowing air through the second duct system will not only facilitate e.g. cooling of the first fluid in the first duct system, but also facilitate cooling of the component / part at which the flow is directed to focused on when leaving the second duct outlet.

[0067] According to an embodiment of the invention, a funnel is positioned between said fan and said second fluid inlet, wherein the diameter of said funnel is larger towards the end said fan than towards the end of said second duct inlet.

[0068] A funnel between the fan and the inlet is advantageous in that it has the effect, that air flow is increase thereby the effect of the second fluid for cooling is increased.

[0069] According to an embodiment of the invention, the cross-sectional area of said second duct is varying.

[0070] Varying the cross-sectional area is advantageous in that it has the effect, that in this way a substantially uniform pressure drop or a pressure drop approaching uniform can be provided in the second duct. This is desired in order to exploit the temperature regulating surface area of the second ducts best possible and because pressure drop can then better be tailored to specific requirements. Further, it should be noted that the material thickness of the walls defining the second duct may also vary. It should be noted that that this may also be true for the first duct.

[0071] According to an embodiment of the invention, said multi-duct heat exchanger comprises flow guides, wherein said flow guides are configured to guide said second fluid, after said second fluid has left said second fluid outlet, towards said second part of said one or more components.

[0072] The flow guide should be understood as a structure suitable for guiding a fluid such as air from a forced airflow eg from a fan in a predetermine direction.Accordingly, outlets of one or more a second ducts may be formed to guide air in a predetermined direction. Preferably, if the temperature of such component is higher than the air out of the second duct, the direction is towards a heat generating component. In the opposite situation the air out of the second duct may be guided away from the heat generating component.

[0073] According to an embodiment of the invention, said flow guide is formed by one or more outer walls of said heat exchanger.

[0074] According to an embodiment of the invention, said flow guide is releasable mounted to said heat exchanger.

[0075] This is advantageous in that flow guides may be fragile of design in that they are only used to direct a flow of air in a given direction. Thus, transporting them separately mitigate risk of damage during transportation. Further, the footprint of the heat exchanger during transportation is reduced. Further, mounting of the heat exchanger adjacent or on the component may be easier without flow guides on the heat exchanger.

[0076] According to an embodiment of the invention, wherein said flow guide is implemented as one or more tubes.

[0077] One or more tubes and especially one or more flexible tubes are advantageous as flow guides for guiding the second fluid such as air from the outlet of the second duct to the spot where e.g. the cooling capacity is optimally exploited.

[0078] According to an embodiment of the invention, said heat exchanger comprises more than one set of flow guides.

[0079] This is advantageous in that it has the effect, that more than one part of the component or a larger part of the component or maybe part of two different components can e.g. be cooled via the convection -based temperature regulation.

[0080] According to an embodiment of the invention, a flow speed of said first fluid through said plurality of first ducts is controlled by a controller based on feedback from a first temperature sensor.

[0081] According to an embodiment of the invention, a rotational speed of said fan is controlled by a controller based on feedback from a second temperature sensor.

[0082] Having one or more controllers such as an industrial programmable logic controller controlling flow speed of fluids in the two duct systems is advantageous in that it has the effect, that such control may be interrelated. Interrelated control should be understood as if higher heating / cooling capacity is required by the conductionbased cooling, then flow speed of first fluid can be increased and / or flow speed of the second fluid can be reduced and vice versa if higher heating / cooling capacity is required by the convection-based cooling. The effect of the convection is improved by higher speed of flow of fluid and turbulence in the fluid.

[0083] According to an embodiment of the invention, at least part of said walls is isolated.

[0084] According to an embodiment of the invention, at least part of said walls comprises a first and a second side defining a wall enclosure.

[0085] Both the isolation applied to the wall and the wall enclosure defined in the interior of a wall has the effect of ensuring to maintain temperature regulating capacity in the fluid until the fluid passes by walls that are not isolated. In this way the internal structure of the heat exchanger is designed to focus its temperature regulating capacity in a certain area or part of the heat exchanger.

[0086] According to an embodiment of the invention, said enclosure is at least partly made of a plastic material wherein said internal structure is made in aluminium.

[0087] This is advantageous in that it has the effect, that only where conduction based thermal energy transfer is needed, the material with the best properties for this purpose (heat transfer) is used. The material could be aluminium. Where energy transfer is notrequired, the choice of material may reflect this and a type of plastic may be used to reduce price and cost.

[0088] According to an embodiment of the invention, said thermal connection is configured for electrically isolating said heat exchanger from said one or more components.

[0089] This is advantages in that it has the effect the heat exchanger can be used in a wider range of applications including electrically conducting components. An example where electric isolation could be necessary, could be terminals of a power module for a power converter. This is because the risk of transferring an electric potential of the component to be cooled to the heat exchanger and thus to the cooling fluid is reduced.

[0090] According to an embodiment of the invention, said thermal connection is provided as a physical contact between said contact surface and said one or more components.

[0091] According to an embodiment of the invention, said heat exchanger is a standalone device configured for being thermally coupled to said one or more components.

[0092] According to an embodiment of the invention, said internal structure is monolithically manufactured by an additive manufacturing process.

[0093] According to an embodiment of the invention, said heat exchanger comprises a first heat exchanger part comprising a first part of said first duct system and a second heat exchanger part comprising a second part of said first duct system, wherein said first duct system is completed when said first and second heat exchanger parts, are physically connected.

[0094] According to an embodiment of the invention, each of said first and second heat exchanger parts comprising a second duct system.

[0095] This is advantageous in that it has the effect, that the temperature of two sides of one component can be regulated by either one or both of the conduction andconvection-based principles. In this implementation first and second fluid inlet may be provided in one of the first and second heat exchanger parts and the first and second fluid outlets may be provided in one of the first and second heat exchanger parts.

[0096] It should be noted that the first and second heat exchanger parts facilitates mechanical suspension. One of the parts comprising a threated part and the other part comprising a hole through which a bolt can pass and engage with the threated part of the opposite part. Further, it should be noted that the two parts each comprise half of a liquid connection which when connected is completing the first duct.

[0097] If possible, it is preferred that the second fluid inlet is provided near to the first fluid inlet to benefit the most from the heat exchange with the first fluid, when the first fluid has the lowest temperature.

[0098] Further, it should be mentioned that each of the heat exchanger parts may comprise the complete first duct i.e. having both inlet and outlet.

[0099] According to an embodiment of the invention, said first heat exchanger part comprises a first fluid inlet and said second heat exchanger part comprises a first fluid outlet, and wherein both of said first and second heat exchanger parts comprises both a second fluid inlet and a second fluid outlet.

[0100] This is advantageous in that it has the effect, that e.g. the cooling capacity of the heat exchanger is further increased by an additional fan and thereby an increased flow of second fluid through the heat exchanger to the one or more components / spots of components(s). Further, a lager surface area / spot of the component(s) can be cooled by the heat exchanger. This is especially advantageous in case the heat generating component to be cooled is a busbar, inductor, etc. in that high cooling capacity from low footprint heat exchanger is provided.

[0101] According to an embodiment of the invention, said one or more components is an electric heat generating component.

[0102] Examples of electric heat generating components include various designs of electric conductors such as busbars, winding and cables, power modules comprising semiconductor switches for use in power conversion, etc.

[0103] Cooling the source of the heat generation is advantageous in that it is possible reduce the ambient temperature in the room or enclosure in which the component is located. In this way other components of the enclosure may be operating in a reduced temperature which may extend lifetime of these components.

[0104] According to an embodiment of the invention, said one or more components is a first component and a second component, wherein said first component is a power module and said second component is a busbar.

[0105] As an example could be mentioned a power module connected to busbar. The busbar may have a tendency to heat up at the terminals and the power module may have a tendency to heat up in the areas where the semiconductor switches are located. As the temperature increase from the semiconductors is higher than from the terminals, the conduction-based cooling is applied to the to the power module whereas the convection-based cooling is applied to the terminals of the busbar.

[0106] According to an embodiment of the invention, said one or more components is a first component and a second component, wherein said first component is an inductor core IC and said second component is inductor windings.

[0107] This is advantageous in that two components are cooled simultaneously. Alternatively, it could be formulated as one component is cooled and the electric connection between that one component and a second component is cooled.

[0108] According to an embodiment of the invention, said heat generating component is at least partly surrounded by said heat exchanger.

[0109] Hence, at heat generating component such as a busbar may be passing through the heat exchanger. Accordingly, the heat exchanger may in such embodiment be circular with a hole in the middle. Alternatively, part of one, two, or three sides of such busbar may be covered by the heat exchanger.

[0110] According to an embodiment of the invention, said contact surface is part of said heat generating component.

[0111] Especially, if the contact surface and the rest of the enclosure is of different materials, this is advantageous in that footprint is reduced. Further, in that thermal conduction of energy is avoided from the heat generating component. Instead, energy is transferred directly via thermal convection between the contact surface i.e. the component and the fluid flowing in a duct partly shaped by the contact surface.

[0112] In an aspect, the invention relates to a temperature regulation system for regulating the temperature of one or more components, comprising a first and a second multi-duct heat exchanger part each of said heat exchanger parts comprises: an internal structure comprising walls defining a first duct system and a second duct system. Wherein a plurality of said walls is thermally connected to a contact surface, thereby allowing a thermal connection between a first fluid comprised by said first duct system and a first part of said one or more components. Wherein said second duct system is configured to guide a second fluid from a second fluid inlet to a second fluid outlet and towards a second part of said one or more components.

[0113] According to an embodiment, a first duct fluid outlet of said first multi-duct heat exchanger part is fluidly connected to a first duct fluid inlet of said second multiduct heat exchanger part.

[0114] This is advantageous in that it has the effect, that the cooling capacity of the heat exchanger of such system is further increased by an additional fan and thereby an increased flow of second fluid through the heat exchanger to the one or more components / spots of components(s). Further, a lager surface area / spot of the component(s) can be cooled by the heat exchanger.

[0115] According to an embodiment of the invention, the contact surface is part of the enclosure of the first or second heat exchanger.

[0116] The contact surface may in addition form part of the component to be temperature regulated. This is advantageous in that it has the effect, that footprint of the heat exchangers and component may be reduced.

[0117] According to an embodiment of the invention, said temperature regulation system comprise a pump and a controller configured to establish a circulating flow of said first fluid from a first fluid inlet of said first multi-duct heat exchanger part, via a first duct of said first multi-duct heat exchanger part, via said first fluid outlet of said first multi-duct heat exchanger part, via said first duct fluid inlet of said second multiduct heat exchanger part, via a first duct in said second multi-duct heat exchanger part to a first fluid outlet of said second multi-duct heat exchanger part.

[0118] According to an embodiment of the invention, said temperature regulation system furthermore comprises an external heat exchanger configured to exchange heat between said first fluid and an external fluid.

[0119] This is advantageous in that in this way, the temperature of the first fluid is being regulated such as being cooled. The external fluid may be air from around the external heat exchanger, which may be located outside the enclosure comprising the first and / or second multi-duct heat exchanger parts. Alternatively, the external fluid may be a fluid in liquid form. Such external heat exchanger may be known by a person skilled in that art and therefore not explained in further details.

[0120] According to an embodiment of the invention, the temperature regulation system is a temperature regulation system described in any of the paragraphs

[0112] -

[0119] implementing a multi-duct heat exchanger according to any of the paragraphs

[0004] -

[0111] ,

[0121] In an aspect, the invention relates to a method of regulating a temperature of a first component part and of a second component part by a multi-duct heat exchanger, the multi-duct heat exchanger comprises an internal structure comprising walls defining a first duct system and a second duct system, wherein a plurality of said walls is thermally connected to a contact surface of said multi-duct heat exchanger, wherein said second duct system is configured to guide a second fluid from a second fluid inletto a second fluid outlet, the method comprises the steps of: physically connecting said multi-duct heat exchanger and said first component part so that an energy exchange, via thermal conduction, is established between said first component part and said contact surface, an energy exchange, via thermal conduction, is established between said contact surface and said walls defining said first duct system, and an energy exchange, via thermal convection, is established between said walls defining said first ducts system and a first fluid guided in said first duct system, and so that said second fluid leaving said second fluid outlet is guided towards said second component part, thereby establishing an energy exchange, via thermal convection, between said second component part and said second fluid by a controller, control the temperature of said first fluid, by controlling a flow of said first fluid through an external heat exchanger, and control the flow speed of said second fluid, by controlling a fan.

[0122] A method according to the paragraph

[0121] implementing a multi-duct heat exchanger according to any in any of the paragraphs

[0004] -

[0111] ,The drawings

[0123] For a more complete understanding of this disclosure, reference is now made to the following brief description, taken in connection with the accompanying drawings and detailed description, wherein like reference numerals represent like parts. The drawings illustrate embodiments of the invention and elements of different drawings can be combined within the scope of the invention:Fig. la illustrates a focused cooling unit according to an embodiment of the invention,Fig. lb illustrates a focused cooling unit according to an embodiment of the invention having flow guides,Fig. 1c illustrates a cross-sectional view of the cooling unit illustrated in fig. la at lb,Fig. 2a illustrates a front view of an embodiment of the focused cooling unit according to an embodiment of the invention,Fig. 2b illustrates a perspective view from the back of the focused cooling unit of fig- 2a,Fig. 2c illustrates flow guides specific to the embodiment illustrated in fig. 2a and 2b,Fig. 3 illustrates a cross-sectional view of two interconnected heat exchangers of the type illustrated in fig. 2a and 2b,Fig. 4 illustrates an exploded view of two heat exchangers mutually connected for temperature regulation of a reactor, andFig. 5 illustrates the two heat exchangers mutually connected to a reactor with a closed first duct system.Detailed description

[0124] The present invention is described in view of exemplary embodiments only intended to illustrate the principles and implementation of the present invention. The skilled person will be able to provide several embodiments within the scope of the claims.

[0125] Fig. la-lc (together referred to as fig. 1) illustrates a multi-duct heat exchanger HEX (also referred to as bifunctional multi-duct heat exchanger, multifunctional multi-duct heat exchanger or simply as a heat exchanger) according to an embodiment of the invention. The heat exchanger HEX is thermally connected to a component CO such as a heat generating busbar, semiconductor power module, etc. Thermally connected should be understood as allowing a controlled exchange of heat between the heat exchanger and the component such a directly e.g. via a thermal paste or indirectly e.g. via a flow of air.

[0126] Fig. la illustrates a heat exchanger without flow guides FG. Fig. lb illustrates a heat exchange with flow guides FG that is directing flow of second fluid towards second part of component. As illustrated the second part may either be of the same component comprising the first part ICO, but it may also be part of a second component. Fig. 1c illustrates a cross-sectional view of the heat exchanger at line lb of fig. lb. The internal structure illustrated in fig. 1c may have various geometries (an example in 3D is illustrated in fig. 2d) and of course fill out the enclosure of the heat exchanger contrary to the illustrated.

[0127] It should be noted that a contact surface may also, by thermal convection, facilitate temperature regulation of an around a component / the component even if there is no contact made between the contact surface and the component.

[0128] The busbar component CO has a fist part ICO and a second part 2CO. The first part ICO could be referred to as the conducting part of the busbar and the second part 2CO could be referred to as terminals (also conducting). In this embodiment, the first part ICO is thermally connected to the first ducts ID of the heat exchanger via an outer wall of the heat exchanger. This part of the outer wall is referred to as a contactsurface CS and it is via this contact surface that the first part of the component is temperature regulated. Most often, the temperature regulation is a regulation of the temperature of the component downwards i.e. a cooling of the component. This contact-based way of regulating temperature e.g. downwards is also referred to as conduction-based regulation / cooling. It should be noted, that the first part of the component ICO may also form part of the enclosure of the heat exchanger.

[0129] At least part of the contact surface of the heat exchanger is in contact with part of the component to be cooled. In an embodiment of the invention the part of the heat (energy) that is removed from the component via the contact surface and thereby by conduction, is more than what is removed by convection between the component and the second fluid. It is preferred to design the heat exchanger so that more than 50% of the total part of heat removed by the heat exchanger is via the first fluid. In embodiments it is more that 75% such as more that 85%. This because, the heat removed by the first fluid can be transported away from the component such as away from the enclosure comprising the component.

[0130] As illustrated, the component CO also comprises a second part 2CO. In fig. 1, the second part is the part of the busbar component comprising terminals / connection points CP to other components such as to other busbars (not illustrated). The second part 2CO is located a distance from the heat exchanger i.e. with no direct physical contact therebetween. Accordingly, the heat exchanger is able to temperature regulate such as cool the second part by guiding a flow of air (or other gases or liquid) towards it. The airflow is generated by a fan FA blowing air which may be ambient to the heat exchanger through the second ducts 2D. When this flow of air leaves the second ducts 2D it is in the direction of the second part 2CO. This direction is determined by the direction of the opening(s) of the second ducts and may additionally be guided or concentrated by one or more flow guides FG which may be an integrated part of the design of the heat exchanger. Alternatively, the flow guides are mounted on the heat exchanger or on the component.

[0131] It should be noted that that part of the component may be an integral part of the heat exchanger (or vice versa) i.e. the enclosure of the heat exchanger may be apart of the component. In this embodiment, the internal structure of the heat exchanger may still be physically connected to the contact surface and energy may still be transferred via thermal conduction to the walls of the inner structure and thereby further to the fluid via thermal convection.

[0132] The contact between the component and the contact surface may, be provided with a matching structure to increase the contact surface and thereby increase efficiency of the energy transfer. A matching structure, beside the normal plane surfaces, may be comprise a sawtooth structure or similar. In this way, the total area of contact is significantly increased compared to planer surfaces.

[0133] If both the component and the heat exchanger has matching sawtooth structures, the ends of the tooths of the structure may be truncated. This would be to ensure that the force used to connect the parts are distributed along the surfaces and not mainly in the direction of the force which would typically be through the tips of the tooths of the structure. Other structures such as pyramids and similar non-planer geometries may also be used.

[0134] If the tooths are truncated i.e. having a planer area angled to the sides of the saw tooth, a duct is created between the contact surface and the component. This duct may serve at one or part of one of the first and second ducts. Alternatively, it may define a third duct which may be independent from the first and second ducts. Such duct or ducts between the contact surface and the component may facilitate guidance of liquid or gaseous fluids as describe in this document with respect to the first and second fluids.

[0135] Inside the heat exchanger, a plurality of walls WA defines the first and second ducts. These ducts are provided in structures that may be referred to as triply periodic minimal structure. One wall may on one side form part of a first duct ID and on the other side form part of a second duct 2D. The wall may terminate at the outer wall defining the enclosure of the heat exchanger. Part of this outer surface may as mentioned be referred to as a contact surface CS and thus the walls may, via the contact surface act as heat transferring elements between the component and the fluids of theducts inside the heat exchanger. In this way not only fluid flowing directly along the contact surface part of the outer wall exchange heat with the component.

[0136] It should be noted that the heat exchanger may comprise both a first and a second contact surface. The first contact surface may as mentioned e.g. be monolithic with a first part of the walls allowing energy transfer via thermal convection between a first component / part of the first component, the first contact surface and the first part of the walls. Similarly, a second contact surface may e.g. be monolithic with a second part of the walls allowing energy transfer via thermal convection between the first component / part of the first component, between a second component / part of a second component, between a second part of the first component, etc., the second contact surface and the second part of the walls. By such design, the heat exchanger may be sandwiched between two components.

[0137] Accordingly, the first fluid may be a liquid such as e.g. water glycol, oil or the like which may be circulated in a closed temperature regulating system. In an embodiment, the first fluid is circulated through an external heat exchanger EHEX where the temperature is increased or decreased. In the case it is decreased, then when guided back through the first ducts, it exchanges heat both with the second fluid of the second ducts via the walls WA separating the first and second ducts. Further, the first fluid exchange heat with the component via the walls / contact surface. Note that energy is always transferred from the hotter medium / fluid / wall to the cooler medium / fluid / wall.

[0138] It should be noted that when referring to a contact surface a reference is made to the part of the enclosure of the heat exchanger that is in contact with the component, i.e. a reference to a contact surface refers to both the inner and outer side of the enclosure part constituting the contact surface.

[0139] The enclosure of the heat exchanger may be made of a plastic or other materials with bad heat transfer capacities. This has the effect that material costs can be reduced in that e.g. plastic is cheaper than aluminium. Further, it may be easier to manufacture in that it may be moulded, casted or manufactured by additivemanufacturing. Further, a plastic material is advantage in that heat radiation from the enclosure is avoided. Thereby, better control of temperature regulation is possible in that all (or at least a waste majority) energy is removed via the first and / or second fluid and therefore the amount of energy heating up the surroundings of the heat exchanger is reduced when radiation is avoided. Thereby, heating up of the heat exchanger enclosure is reduced and heating up of other components via radiation is avoided. As is the risk of burning if the heat exchanger enclosure is touch by hand.

[0140] Preferably, the part of the enclosure of the heat exchanger forming the contact surface is of a material with high thermal conductivity such as aluminium.

[0141] Accordingly, a plurality of first and second ducts are established through the heat exchanger. The first ducts ID are all fluidly connected to a first fluid inlet 1FI and a first fluid outlet 1FO thereby facilitating guidance of the first fluid IF through the first ducts of the heat exchanger. In the same way, the second ducts 2D are fluidly connected to a second fluid inlet 2FI and a second fluid outlet 2FO thereby facilitating guidance of the second fluid 2F through the second ducts of the heat exchanger.

[0142] The second fluid inlet may be implemented simply as one or more openings of one or more openings of the second ducts. However, to guide flow of air through the second ducts it is preferred that the second fluid inlet is a funnel like inlet, or a hex enclosure has one opening (which then could be referred to as second fluid inlet) to which the fan could be connected and thereby all air flow from the fan is directed to openings of the second ducts 2D.

[0143] In the same way, the second fluid outlet 2FO may simply be implemented as openings of one or more second ducts. Again, if the heat exchanger is provided in an enclosure, the second fluid output may be the output of the enclosure. Such enclosure output may have a funnel like design focusing the air from in one stream towards the second part of the component. As illustrated, the heat exchanger may include or guide the flow of the second fluid towards flow guides FG which may focus or guide the flow of second fluid in a certain direction.

[0144] It should be mentioned that the walls may comprise internal fins that may be designed to modify i.e. increase or decrease the flow resistance of the fluid flowing in the ducts. The flow resistance is depending on geometry of such internal fins and the flow speed. It is typically desired to maintain as low a flow resistance as possible. Internal fins may be used to provide turbulence or prevent turbulence. Internal fins may be defined and located in a computer aided design program where simulations of effects of changes may be determined. In case a heat exchanger with internal fins on the walls are used in a larger cooling system, then the larger cooling system can be balances by designing heat exchangers with internal fins that e.g. is increasing the pressure drop / flow resistance in one or both of the ducts.

[0145] The walls may have a varying cross-sectional area. Where the walls are connected to the contact surface, the wall may be thicker that a distance away from the contact surface. This is because more heat is to be conducts in the wall the closer the wall is to the contact surface. Typically, the walls are desired to be as thin as possible to increase efficiency of the heat exchanger. However, thicker walls may be desired to enable some degree of inertia in the walls i.e. the walls may in this way act as kind of an energy storage for storing heat and as structural support. On the other hand, thinner walls are desired to optimize thermal conduction hence, to better facilitate thermal conduction, the walls may be desired to have a thickness as small as possible. Accordingly, the walls are designed with respect to the above and if only thermal conduction is the issue, a wall thickness of 0,1mm to 2mm may be desired such as 0,5mm, 1mm or 1,5mm. Walls thinner than e.g. 3-5mm allow a high degree of heat transfer between the first and second fluid.

[0146] At least one of the walls are preferably physically connected to the contact surface i.e. connected with no air gap between. Such connection may be established by welding, soldering, additive manufacturing, etc.

[0147] It should be mentioned that the walls may be at least partly covered with an insolating material. Partly may in this context include isolating walls closer to an inlet / outlet and not isolating walls most far from inlet / outlet. In this way, it is possible to maintain highest e.g. cooling capacity of the fluid through the first part of the wayof the fluid through the duct of the heat exchanger. This is advantageous if e.g. highest cooling capacity is required on the side of the heat exchanger where fluid exits the heat exchanger.

[0148] It should be noted that isolating material may be applied during manufacturing of the ducts / walls, that only one side of the walls may be isolated and that walls of any area of the internal structure may be isolated.

[0149] Finally, it should be mentioned that the isolating effect may also be obtained by designing and manufacturing the wall as double-sided walls i.e. with an enclosure between such two wall sides. The enclosure may thus be filled with air which acts as isolator between fluids of the ducts separated by such wall.

[0150] A multi-channel heat exchanger of the present invention is typically tailor made to the component / components it is to temperature regulate. Thus, a first initial step of a method of temperature regulating a component is to design the contact surface i.e. typically a part of the enclosure of the heat exchanger HEX so that it is aligned with a surface of the first component part. The better alignment, the better physical contact and thereby the better energy transfer by thermal conduction. Filling pieces or thermal pasta may be used to facilitate the physical connection if structural alignment between contact surface and component part is not satisfactory.

[0151] A second step is to manufacture the heat exchanger HEX. Typically, a computer program is used to make a three-dimensional model of the heat exchanger which can be used to simulate its effect. Such computer program can change geometry, dimensions, etc. of the heat exchanger to optimize the temperature regulation effect. Input the to computer program may include information related to available footprint of the heat exchanger, expected ambient temperature, expected component temperatures, maximum flow speed of first and second fluids, materials of both heat exchanger and component, type of fluid used as first and second fluids, etc.

[0152] Once the heat exchanger is manufactured it the method include a third step of mounting it. Mounting may typically include physical contact between the component and the contact surface. It should be noted that the component may have a plurality offirst component parts and the heat exchanger may similarly have a plurality of the contact surfaces.

[0153] The mounting of the heat exchanger to the component may be done by clamping, adhesive, soldering, welding, bolting, etc. Typically, it will be possible to use a bolt to connect e.g. a bracket of the heat exchanger to the component. Alternatively, a clamp may be used. Alternatively, two heat exchangers may be connected to each other with the component to be cooled therebetween (see fig. 5). bracket. . . The mounting should ensure that the flow of second fluid out of the heat exchanger is directed to the component part that, in addition to the first part, need to be temperature regulated.

[0154] It should be noted that no matter how the component and the heat exchanger are connected thermal paste may be used to ensure that no airgaps are between the two.

[0155] Once mounted, the method includes a fourth step of controlling the flow and thereby temperature of the first and second fluids. The temperature of the first fluid is controlled by a controller controlling a pump. Such pump may be generating a circulation of first fluid in a closed circuit. This closed circuit may include valves and sensors and an external heat exchanger. The controller may control these parts based on a temperature reference provided by the user. Such temperature reference could be in the range of 50°C and 140°C. As a role of thumb, the lower temperature, the longer lifetime of the component. With this said, components may be designed to operate in a certain temperature range. Typically, it is desired to keep the component temperature and / or ambient temperature blow 90°C -100°C.

[0156] In the same way, the controller may control the rotation speed of the fans guiding e.g. air surrounding the heat exchanger through the second duct system. The fan speed may be controlled according to a parameter input derived from a desired temperature of the second component part, knowledge of the temperature of the first fluid and knowledge of efficiency of the thermal convection between the first and second fluids. Thus, the control of both the fan speed and circulation speed of first fluid may be made according to feedback control principles. Thus, the temperature ofthe second fluid leaving the heat exchanger and / or of the second component part may be provided as feedback to the controller.

[0157] Note that a first component part ICO may be a first part of a first component. A second component part 2CO may be a second part of the first component or a first part of the second component.

[0158] Fig 2a-2C illustrates a multi-duct heat exchanger HEX according to an embodiment of the invention, where fig. 2a in a front view, fig. 2b from the back and fig. 2C illustrates an external flow guide FG according to an embodiment of the invention. This particular embodiment is designed to cool an electric winding as illustrated in fig. 4 and 5. Thus, it should be noted, that component specific heat exchangers may be designed to fit a wide variety of not disclosed component designs according to the principles described in this document.

[0159] The heat exchanger HEX illustrated in fig. 2a comprises a circular enclosure EN having an opening which is configured for being covered by a fan (the second fluid inlet / outlet 2FI / 2FO). Note that through this opening there is only fluid access to one of the ducts ID, 2D to ensure that fluids do not mix between the ducts. Access to the other duct is via the first fluid inlet / outlet 1FI / FO. In an embodiment, the first duct is closed for flow of fluid from one side and the second duct is closed for flow of fluid from the other side. In this way, the flow of the first fluid in the first duct is e.g. vertical while the flow of the second fluid in the second duct is horizontal. An example of an internal structure is illustrated in fig. 2d. In the illustrated structure, the first duct is completely closed on the three illustrated sides indicating that this first duct is filled with first fluid. Typically, it would not be desired to have a complete closed first / second duct, a duct would typically have one or more openings. These openings may be on the same side or as typically is the case on two opposite sides. An opening may be implemented as one or more openings as illustrated by the stipulated circles OP or a first / second duct may be completely opened at one side (opposite to what is illustrated in fig. 2d with completely closed side). It should be noted that the closure of a duct may be facilitated by the enclosures of the heat exchanger.

[0160] The fan may be connected by screws / bolts via the four illustrated holes. Alternative, the fastening may be made by other means such as rivets, adhesives, welding, soldering and the like. Thus, this opening may be referred to as the second fluid inlet 2FI through which the second fluid is guided into the second ducts 2D. Part of the internal structure comprising the walls WA defining the plurality of first ducts ID and the plurality of second ducts 2D are illustrated through the opening. Further, a first fluid inlet (or outlet depending on direction of flow) is illustrated as a tubular protrusion in the notch of the outer periphery of the enclosure EN. It is this tube that may be connected to a closed loop cooling system.

[0161] Fig 2b illustrates a view of the heat exchanger in a back / side view. The back part comprises two minor holes on each side for a larger hole. These holes are optional in that they are only used if a first heat exchanger have to be fluid and mechanically connected with a second heat exchanger (as illustrated in fig. 3). The two minor holes may be holes with threaded parts for receiving the threaded part of bolts for mechanically connecting the two heat exchanger. The larger hole is a first duct fluid outlet 1FO (or first duct fluid inlet 1FI depending on direction of flow of the first fluid) via which a fluid connection of the first ducts of the two heat exchangers is established.

[0162] As illustrated, the enclosure EN is forming the contact surface CS with a non- uniform geometry / design. The non-uniform contact surface is in this embodiment illustrated with curvatures / notches. The curvatures in this embodiment are separated by six fins FI forming five complete geometries when seen in a view from the back of the heat exchanger. The curves in this embodiment is shaped to fit to a cylindrical electric conductor i.e. to establish thermal connection between the electric conductor and the curvatures.. One geometry starts where another stop. The peak / fin FI is thereby formed by the two curvature parts one having a steeper slope than the other. In additional there are to non-complete geometries at the ’’bottom” of the illustrated enclosure i.e. towards the end where the first fluid inlet 1FI is illustrated.

[0163] The geometries of the curvatures are designed to establish a conduction-based heat transfer with a matching geometry of an electric conductor (see fig. 4). A conduction-based heat transfer should in this context be understood as heat transferbetween heat exchanger and electric conductor where there is no air gap therebetween. Put in another way, the heat gets transferred via thermal conduction as there is no air between the parts exchanging energy. As a 100% conduction-based heat transfer is difficult to obtain at least along a long and curved electric conductor, part of the energy transfer between electric conductor and heat exchanger may be transferred according to thermal convection principles. This is also simply referred to as convection and should be understood as the process of heat transfer with the motion of molecules in fluids like liquids and gases. Hence, the heat transfer starts via conduction between conductor / heat exchanger enclosure. Then the bulk heat transfer occurs with the movement of the fluid in the heat exchanger i.e. the convection-based thermal energy transfer. Hence, the energy transfer may be established by convection principles and / or conduction principles but most of the energy is transferred via a combination thereof. The thermal convection may be controlled by controlling flow speed and turbulence.

[0164] Hence, the fins FI are part of the enclosure EN and shapes the enclosure according to the design of the component that the heat exchanger is to temperature regulate. Accordingly, the fins FI are becoming part of the contact surface of the enclosure i.e. of the heat exchanger.

[0165] It should be noted that the first duct system / one or more first ducts may include first ducts partly defined by the shape of the fins. In this way a wall of a first duct is shaped according to the geometry of the component that it is to temperature regulate. This leads to a non-uniform first duct the geometry of which starts as an acute angle and widens out towards the center of the enclosure EN. Such non-uniform first duct can be imagined if the enclosure forming the fins FI each representing a first duct, is used as enclosure of the internal heat exchanger structure illustrated in fig. 1. The first ducts in the fins may of course also be divided in walls. However, the point is that a flow of first fluid is provided all the way to the exterior of the enclosure thereby increasing the area of the enclosure where flow of first fluid is guided along the inner side of the contact surface.

[0166] The enclosure EN illustrated in fig. 2b also comprises flow guides FG. These flow guides serve to establish second fluid outlets 2FO and to mechanically connectthe front part of the enclosure EN (illustrated in fig. 2a) with the back part of the enclosure (illustrated in fig. 2b). In fact, it could be said that the front part of the enclosure together with the flow guides and the back part of the enclosure are forming the second fluid outlets 2FO. Thus, the illustrated flow guides could be categorized as internal flow guides contrary to the flow guide illustrated in fig. 2c which could be categorized as external flow guides (flow guide module).

[0167] No matter if flow guides are part of the heat exchanger, releasable mounted or external the flow guide FG is configured to guide the second fluid 2F, after the second fluid 2F has left said second fluid outlet 2FO, at least towards the second part of the one or more components 2CO (but maybe also towards the first part or a third part / second or third component) thereby facilitating a convection-based temperature regulation of the part the second fluid is directed towards.

[0168] Fig. 2c illustrates a flow guide FG, more specific an external flow guide i.e. a flow guide that is not mechanically connected to the heat exchanger. The flow guide FG is partly formed according to the shape of the component that is to be cooled. In the specific example, the geometry of the inner part of the blades of the flow guide has a curvature that fits the center part of the conductor / winding illustrated in fig. 4.

[0169] The opening in the center part of the flow guid has a super elliptic form. This is to allow it to be mounted between the first and second heat exchangers and thus allow the bolts and fluid connections there between. In this embodiment, the flow guide is sandwiched between the two heat exchangers and thereby fixed in a desired position.

[0170] The blades of the flow guide serve two purposes. One is to guide the flow or air from the second fluid outlets 2FO (see fig. 2b) from the center of the winding (component see fig. 4) which is referred to as first component part ICO and to the outer part of the winding which is referred to as second compartment part 2CO. The second purpose is to galvanically separate the windings from each other i.e. ensure that no current can be conducted from one winding (second compartment part 2CO) to an adjacent winding (an adjacent second compartment 2CO).

[0171] In fig. 3 is illustrated a cross-sectional view of a first heat exchanger 1HEX connected with a second heat exchanger 2HEX. The cross-sectional view is in the plane A illustrated in fig. 4. Note that fig. 3 is a cross-sectional view of two connected heat exchangers i.e. not the exploded view illustrated in fig. 4. Further, note that the component is not illustrated.

[0172] Fig. 3 illustrate one bolt BO fastened from the first heat exchanger to the threaded part of the second heat exchanger and one bolt BO fastened from the second heat exchanger to the threaded part of the first heat exchanger. The bolts BO are passing through the inner structure of the heat exchangers in bolt passages BP. Depending on the size of the heat exchangers more than one bolt from each heat exchanger part may be needed.

[0173] Note, that in the embodiment, where only one heat exchanger is connected to a component such as illustrated in fig. 1, one heat exchanger may comprise two bolt passages BP and the component may comprise the threaded part for receiving the blot and thereby fastening the heat exchanger to the component.

[0174] Both heat exchangers comprise an inner structure IS in a triply periodic minimal design having walls WA with first and second wall sides defining first and second ducts for conducting first fluid IF (solid line) and second fluid 2F (stipulated line). It is difficult to see the ducts on the internal structure illustrated in fig. 3, So only the flow directions of the first and second fluids are illustrated knowing that these lines are not following the ducts. The ducts are easier to see in the example of an internal structure in fig. 2d, which illustrates an example of a triply periodic minimal design in a 3D view. It is noted, that the two heat exchangers may be completely identical or at least almost identical. Difference may occur due to physical connections of parts such as other heat exchangers, pipes or similar. It should be noted, that in other embodiment, two or more heat exchanger parts may have different geometry. They both comprise fans FA which in this example is also the second fluid inlets 2FI i.e. inlet for the second fluid 2F. Hence, each of the heat exchangers has one second fluid inlet 2FI and a plurality of second fluid outlets 2FO (see fig 2b) of which two is illustrated (one second fluid outlet upwards and one downwards).

[0175] The first heat exchangers have a first fluid inlet 1FI (not illustrated) and the other has a second fluid inlet 2FI. Hence, the first ducts ID of the first heat exchanger is supplied with first fluid IF that distributes in the first ducts / first duct system in the first heat exchanger. Via the fluid connection (first fluid inlet / outlet 1F1, 1FO) between the two heat exchangers the first fluid distributes in the first ducts / first duct system of the second heat exchanger and exits through a first fluid outlet 1FO (not illustrated) of the second heat exchanger. The duct fluid inlet / outlet may include a non-illustrated tube and gasket for facilitating the fluid connection. Alternatively, one heat exchanger is manufactured with a tube and one with a hole which together establishes the fluid connection. As an example, one heat exchanger may have a hole and a second heat exchanger may have a connecting pipe that fits the hole. The connecting pipe may comprise a recess facilitating the positioning of a gasket preventing leakage of fluid in the connection of the two heat exchangers / heat exchanger parts.

[0176] As illustrated, the first fluid flows in a first duct defined by the outer wall / enclosure EN and a first wall side 1 S (solid line), thereby facilitating an optimal heat exchange between the first fluid IF and the enclosure part which may define a contact surface CS. In this way conduction-based temperature regulation is allowed between the first part of the component that is to be temperature regulated to the contact surface and finally via convection-based temperature regulation to the first fluid. In addition, conduction-based temperature regulation happens between the first part of component and the contact surface and further on to walls connected to the contact surface and via convection-based temperature regulation to the first fluid. It should be noted, that from these walls, via convection-based temperature regulation from the walls heat transfer may be provided also to the second fluid as the walls separate the first and second fluids / establish a thermal contact between the two fluids.

[0177] Further, as mentioned, there is also an optimal exchange of heat between the first fluid IF of the first duct ID i.e. on one side of the wall 1 S and the second fluid 2F of the second duct 2D on the second side of the wall 2S. In this way convection-basedtemperature regulation is allowed between the first fluidsecond fluidsecond part of component.

[0178] The optimal heat exchange is in the illustrated embodiment a transport of heat from the component to the first fluid and from the second fluid to the first fluid reducing temperature of the second fluid before it is guided towards the second part of the component. This is because the first fluid is guided in a cooling system with an external heat exchanger where the temperature of the first fluid is reduced before circulated in the first and second heat exchangers again.

[0179] The flow guide FG illustrated in fig. 2c is only partly illustrated in fig. 3. It’s inner part is illustrated sandwiched between the two heat exchangers. In fig. 5, the flow guides of the two heat exchangers are illustrated when these are assembled with the heat exchangers. At least one of the flow guides may comprise an alignment tap to ensure correct relative positioning of the two flow guides when mounted.

[0180] Fig. 4 illustrates an exploded view of the two heat exchangers illustrated in fig. 3. Fig. 4 also illustrates the flow guides of fig. 2c and the component, which in this embodiment is an electric winding having an inner core (inductor core IC) referred to as the first part of the component 1 CO and an outer part (inductor winding IW) referred to as the second part of the component 2CO. In addition, feet’s are illustrated which is connectable to the heat exchanges for support. The feet’s may be mounted to the hole next to the first fluid inlet illustrated in fig 2a.

[0181] Fig. 5 illustrates the first and second heat exchangers 1HEX, 2HEX of fig. 4 when these are connected (such as illustrated in fig. 3). An external heat exchanger EHEX is illustrated in a closed cooling loop in which first fluid is circulated, the cooling loop also includes the first and second heat exchangers 1HEX, 2HEX. The solid line not passing directly through the heat exchanges indicate that the first fluid is traveling through individual first ducts the first ducts system. Note that the individual ducts may ensure that first fluid is guides to every “corner” of the heat exchangers and that the first fluid exits the first heat exchanger and enters the second heat exchanger via the connected inlets / outlets (see fig. 2b).

[0182] A controller CTRL is illustrated as communicating with the external heat exchanger for control the temperature regulation of the first fluid and thereby of the component. The controller is also communicating with first and second temperature sensors ITS, 2TS. Based on input from these and maybe also other not illustrated sensors, the controller is able to control the temperature of the first fluid and thereby also of the second fluid and the component. The controller also communicates with the fans FA or at least the power supply to the fans FA is controlled by the controller. In the embodiment illustrated in fig. 5, the first sensor ITS provides temperature feedback of temperature of the first fluid. It is illustrated as positioned in the fluid loop of the first fluid but could also be located on or at the component the temperature of which is to be regulated such as at the inductor core IC. Similarly, the second temperature sensor 2TS may be located on or at the component the temperature of which is to be regulated such as the inductor winding IW. Hence, rotation speed of the fan(s) and thereby speed of the second fluid is regulated at least partly based on feedback from the second temperature sensor 2TS. In the same way, flow speed of the first fluid in the fluid loop and / or external heat exchanger EHEX and / or other external systems may be controlled at least partly based on feedback from the first temperature sensor ITS.

[0183] Accordingly, non-illustrated pumps and valves may be used to control flow of first fluid from the first and or second heat exchanger 1HEX, 2HEX and to the external heat exchanger EHEX. Furthermore, it should be noted that the external heat exchanger may be part of a standard cooling system. The external heat exchanger is preferably located outside the enclosure (such as an electric cabinet) in which the component(s) to be cooled is / are located.

[0184] The embodiments illustrated in fig. 1 and figs. 2a-5 are only two of a plurality of different components that can be temperature regulated and two implementations of the heat exchanger. Other components such transformers, reactors, power modules (e.g. modules comprising semiconductor switches such as IGBTs), microprocessors, engines, motors, etc. may also be temperature regulated by one or more heat exchangers according to the present invention.

[0185] In some embodiments, the material of the heat exchanger is a non-electric conductive material. It may however also be of an electric conductive material as long as the most important properties are fulfilled which are high thermal conductivity and high thermal transfer (such as heat transfer). In the same way, the internal structure of the heat exchanger may be of an electric conductive material. However, in some embodiment, this would require a non-electric conductive first fluid 1 to avoid short circuits between elements of such system. A few examples could be an electrical conductor made of either copper, aluminium or any current conducting material or alloys thereof.

[0186] The enclosure but also the internal structure may be manufactured in various materials such as polymers (such as plastic), composite, metal (such as steel, aluminium, cobber, etc.). In an embodiment, the enclosure, but also the internal structure may be manufactured by an additive manufacturing method.

[0187] It should be noted that only one of the heat exchangers HEX1, HEX2 may comprise a fan. In this embodiment air may enter the fan of the first heat exchanger and exit the heat exchangers as illustrated in fig. 5 by stipulated lines and via the second heat exchanger e.g. where the fan is illustrated.

[0188] The system illustrated in fig. 5 is only one example of a heat source adapted heat exchanger, more specific of a heat exchanger that is adapted to the geometry of the heat source which in the illustrated example is a reactor.

[0189] A power module could be used as another example of a heat source generating heat that is required to be removed efficiently. Hence, a heat exchanger having a contact surface aligned with the location of the power module (e.g. for use in a power converter of the electric drive train of a wind turbine) where the semiconductor switches are generating and radiating heat. In this example the heat exchanger may be rectangular to be able to extend along the outer surface of the power module enclosure. Flow guides may be provided to guide air towards the terminals where electric conductors are connected to the power module.

[0190] An electrical busbar is another example of a heat generating source. If a busbar extends through various areas of an electric cabinet it may be relevant to cool part of the busbar. Such parts could be where the busbar branch off or is connected to components such as other busbars. To cool a busbar the heat exchanger may be much longer than wide e.g. in a relationship where length is 2-5 or even more times the width. In such situation, the more that one fan may be provided along the length of the heat exchanger. Also in this example, flow guides may be provided to guide a flow of fluid towards selected and specific locations of either the busbar or other components located close to the busbar similar to what is described above.

[0191] Thus, in an embodiment, heat transferred by conduction via sandwiched surfaces / planes of e.g. component and contact surface is transported away by the first fluid which is typically a liquid. The second fluid, cooled by the first fluid is used as an additional cooling of the elements of the component or of neighbouring components which do not have connection allowing heat transfer by conduction.

[0192] The diameter / cross-sectional area of the first and second ducts may vary if measured two different places in the heat exchanger. In this way the cooling capacity can be intensified or the opposite. If more capacity is needed, the duct diameter / cross- sectional area may be increased to allow a larger amount of fluid circulate that way. In fact, the inlet of e.g. the first fluid ducts and the first duct system in general may be designed especially to guide a larger amount of liquid to one area inside the heat exchanger than towards another area. Typically, such area would be towards the contact surface.

[0193] By varying the cross-sectional area, it is possible to control pressure over a limited (or hole) part of the duct from inlet to outlet. Thereby intensify the cooling effect in some areas and the opposite in other areas of the heat exchanger.

[0194] In case the heat exchanger of the present invention is to be used to cool components of a three phased system it may be required that the cooling circuitries are galvanic isolated between the phases. One way of doing so is to use separate cooling loops e.g. for the first and / or second fluids for each of the different phases to avoide.g. the first fluid from short circuiting two phases. The same cooling loop may be used to cool components of the same phase. If the second fluid is air in an electric cabinet, this air may be used to cool components of all three phase.

[0195] Note that fins of the internal structure or outside may be used for guiding the respective fluid towards a predetermined area of a component. The internal structure and / or fins may be designed to increase the flow speed or to facilitate turbulence which will increase cooling effect of the fluid.

[0196] The second fluid may, even though it is air, by guided in a closed duct system as the first fluid when this is liquid. Heat fins of a component to be cooled may extent into such duct system. To increase efficiency, a gasket may surround the heat sink so that no air is leaving the duct system. Alternatively, the heat sink may be monolithic with the duct system or part hereof. The heat sink may in addition or instead be monolithic with the component. In fact, the component may constitute part of the closed ducts system i.e. part of one side of e.g. a rectangular duct part.

[0197] If such closed duct system is implemented in a three phased system, it may require three separate systems to avoid short circuiting the phases. Alternatively, one or more fans may be connected to the same manifold or duct of non-conductive material having air inlet for the one or more fans and air outlets for the components to be cooled of the individual phases.

[0198] A closed ducts system for the second fluid may be more efficient in that the air pressure (in this case) is maintained in the duct system and thereby higher air flow can be achieved inside closed system. High air flow is preferred in that it leads to higher cooling capacity. This is contrary to the implementation where the air is simply guided to pass a component in an open system. A closed system circulating a first fluid may be implemented to remove heat from the closed air system.

[0199] Exemplified by heat exchanger of fig. 4 and 5, To ensure high air flow a funnel may be connected between the second air inlet and the fan. In this way a larger fan can be used and thereby a higher air flow can be generated. Typically, it is the footprint in the cabinet that would determine the location and type of fan (e.g. axial,centrifugal, radial, etc.) and the geometry of the funnel. The funnel may also guide air from where it is possible to positioning a fan to the inlet of the second ducts system.

[0200] A non-illustrated way of designing and implementing the heat exchanger of the present invention is to include one or more legs having contact surface(s). at least the first ducts system should extent into the legs. The contact surface(s) of such legs may provide spot cooling or targeted cooling on a specific parts of a component. As non-limiting examples such implementation could be useful in case a processor, power module / IGBT, electric connection, etc. is generating heat that need to be cooled. In the described way, only heat generating area is cooled i.e. the cooling is made more effective where it is needed. Thereby, ambient temperature and neighbouring components / parts are not heated which is essential to keep equipment (such as components) running at peak performance, reduce energy consumption and prolong lifetime.

[0201] Common for the different implementations of the heat exchanger of the present invention is that it is efficiently dissipating heat from a device and thereby facilitate control the temperature in a specific area or piece of equipment. In addition to the implementations described above, a heat exchanger of the present invention may be used e.g. in technology such as grid boxes and transformers, it can also be used to cool hi-tech fab or analysis equipment, audio and video systems, etc.

[0202] When mentioned materials, then the heat exchanger or parts hereof may be manufactured in a non-electrically conductive material. This is advantageous in the material used for manufacturing the electrical conductor is cheaper, lighter or faster. The heat exchanger or part hereof could be coated / painted with a non-conductive material it has been manufactured in an electrically conductive material.

[0203] Note that, the heat exchanger or parts hereof may be coated or painted with insulating material or coated or painted with an electrically conductive material. This is advantageous in that the process for making the heat exchanger or parts hereof may be faster or cheaper when coated or printed afterwards with another material. It couldalso be advantageous when the heat exchanger is applied in e.g., an electrical cabinet to apply an additional insulating material to avoid arcs to other electrical components.

[0204] In embodiment, the heat exchanger enclosure may be made of a first material and the internal structure may be made of a second material. The enclosure may be made of plastic e.g. with aluminium parts at the contact surfaces whereas the internal structure may be made of aluminium. In this way, optimum between weight, price, and thermal energy transfer can be achieved, benefitting from the strength of the plastic and the thermal heat transfer capacities of the aluminium.

[0205] The manufacturing of the heat exchanger or part hereof may be done by an additive manufacturing process. Such manufacturing process may be based on, but not limited to, one of the following additive manufacturing processes: 3D printing, layer by layer printing, Wire Arc Additive Manufacturing, Fused Deposition Modeling FDM, Direct Energy Deposition, Direct Metal Deposition, sintering based processes, laser based processes, for example Powder Bed Fusion PBF, such as selective laser melting SLM or selective laser sintering SLS, cold spray additive manufacturing CSAM, binder jetting or binder jet 3D printing, etc.

[0206] The main step for machining a heat exchanger or part hereof according to an embodiment of the invention may include manufacturing both enclosure and internal structure in one process. The additive manufacturing may be along the longitudinal direction of the heat exchanger, transversal heat exchanger or the additive manufacturing is radial, or even arbitrary, to the heat exchangers longitudinal direction, for example using cold spraying CSAM or Fused Deposition Modeling FDM while rotating or freely moving either the heat exchanger being built or the nozzle, or both. Preferably, the mentioned segments are manufactured in one process, e.g. as one segment is manufactured, the next segment is being manufactured.

[0154] It should also be mentioned that the method could in some embodiments comprise manufacturing the enclosure and afterwards connect internal structure to the enclosure e.g. with an additive manufacturing paste or glue after being made. Theinternal structure could also be welded, glued or connected in any other way to the enclosure, e.g. by cold spraying CSAM.

[0155] A monolithic heat exchanger according to the present invention is made from one material. One or more additional materials may be used e.g. in this case the heat exchanger may be referred to as a polylithic heat exchanger. No matter the number of materials, a heat exchanger produced by additive manufacturing is produced bit-by-bit starting at a first spatial coordinate (x, y, z) and ending at a second spatial coordinate. At least when the heat exchanger is finished the first and second spatial coordinates are electrically / mechanically connected. As mentioned, several methods of manufacturing a heat exchanger exists all including some kind of material depositing, joining or soldering to manufacture a conductor in one monolithic form.

[0156] In this document a heat exchanger may be referred to as being manufactured layer-by-layer no matter the additive manufacturing method used. Hence, if a heat exchanger is sliced (no matter in which orientation) and one is looking at the crosssection of the heat exchanger it is easy to imagen that the heat exchanger is manufactured starting with material in first point, then with material in a second point and so on. Since the heat exchanger is volumetric i.e. has a three dimensional geometry the first point is different from the second and subsequent points at least in one of the spatial X, Y and Z directions / plans. Thus, with reference to the spatial X, Y and Z planes a heat exchanger could be said to be built from a plurality of subsequent layers even though when manufactured all material in one plane such as X=1 and Y=0 and Z=0 is not provided as a one layer or in one layer before material in a next layer (e.g. an X=2 layer) is provided.

[0157] Hence, no matter which of the processes of manufacturing a three- dimensional object such as a heat exchanger that is used, it can be said that the heat exchanger is manufactured layer-by-layer even though some of these manufacturing processes are based on deposited, joined or solidified with material being added together in areas, lines, pointwise, etc. This is because no matter the additive manufacturing process the heat exchanger is manufactured one point after the other. A plurality of points in the same plan (e.g. X=3) is considered one layer also if they arenot physically connected in this plane. And when all points of this layer are added, points of the next layer (e.g. X=4) is added to the points in the X=3 layer. As mentioned, a layer may be defined in any of the planes of a spatial Cartesian coordinate system.

[0158] In a first step of this particular method, considering additively manufacturing a heat exchanger in its longitudinal direction from a first end towards a second end.

[0159] The step of monolithically forming heat exchanger may be implemented using various methods, for example methods such as additive manufacturing such as 3D printing, casting, and simply removing of material, via machining, from a bulk metal slab to form e.g. the enclosure of the heat exchanger.

[0160] An optional, additional step of the method of manufacturing the heat exchanger of the invention comprises a step prior to the step of additive manufacturing the heat exchanger. The step prior to manufacturing the heat exchanger is a step where a digital representation of the heat exchanger is designed in a software program, e.g. a 3D CAD software. The step of designing the digital representation of heat exchanger in a software program includes taking the electrical, mechanical, structural, geometry and other aspects of the physical heat exchanger into account. Thus, based on these inputs, e.g. provided by a user of the 3D CAD software, a digital representation of the heat exchanger is provided by the 3D CAD software. When the digital representation of the heat exchanger is complete the additive manufacturing process can be started.

[0161] It should be mentioned that the heat exchanger may be manufactured in two or more resolutions. In case of additive manufacturing resolution may be defined by thickness of the layers of which the heat exchanger is built (another word for machined and processed). A first resolution that is finer i.e. having thinner layer size than a second resolution may be used.

[0162] Summing up, a designer is designing a digital representation of the heat exchanger according to electrical, mechanical, structural, etc. requirements in e.g. a 3D CAD software such as Solidworks. Files (digital representation) from such 3Ddeveloping tool is exported to e.g. a 3D printer, where the heat exchanger is printed according to the CAD files.

[0163] The term monolithic is in this description used to describe the geometry or structure of an heat exchanger according to the present invention. Such heat exchanger is preferably manufactured by an additive manufacturing process and thereby, it is manufactured as a single piece, unit or block from one end to the. Such heat exchanger may thus be formed from a single material as a single piece, unit or block where its one or more ends are monolithically formed with a middle segment connecting the one or more ends i.e. monolithically united or formed should be understood as made in one continuous process with no need for additionally adding one part to another I.e. one or more ends / parts are manufactured together as one unit with no connections such as welding, soldering, or by any clamping or fastening means, except for the type of micro binding intrinsic to the particular additive manufacturing technology utilized, such as, e.g., layer-by-layer melting, sintering, liquid binding, spraying, etc.

[0164] It should be mentioned that the heat exchanger may be manufactured from more than one type of material. In this situation, the heat exchanger could be said to be polylithic. The term polylithic should in this context be understood as a geometry or structure of a heat exchanger that is manufactured in one piece as a monolithic structure, as described above, where the heat exchanger is manufactured from two or more materials. Hence, a polylithic heat exchanger of the present invention is a heat exchanger resulting from a process forming the heat exchanger in one structure where the process is using two or more different materials.

[0207] In an aspect, the multi-duct heat exchanger for temperature regulation of one or more components is designed so that the heat exchanger comprises an enclosure EN having a contact surface CS and an internal structure IS comprising walls WA defining a plurality of first ducts ID and a plurality of second ducts 2D. The contact surface CS is thermally connected to at least one of the walls and to a first part of the one or more components ICO. The contact surface CS and the walls are designed to establish an energy transfer, via thermal conduction, of energy between the first part of the one or more components ICO and the walls. The plurality of first ducts ID is configured forcirculating the first fluid IF from a first fluid inlet 1FI to a first fluid outlet 1FO of the heat exchanger HEX, thereby facilitating, via thermal convection, transfer of the energy between the at least one of the walls and the first fluid. The plurality of second ducts is configured to guide a second fluid 2F from a second fluid inlet 2FI of the heat exchanger HEX to a second fluid outlet 2FO of the heat exchanger HEX and towards a second part of the one or more components 2CO, thereby facilitating transfer of energy between the second part of the one or more components 2CO and the second fluid 2F via thermal convection.

[0165] From the above it is now clear that the invention relates to a multi-duct heat exchanger. The internal structure of the heat exchanger is divided in first and second ducts (duct systems) configured to guide the first and second fluids respectively. This heat exchanger comprises inlet to the first duct system for a first fluid such as a liquid and an inlet to the second duct system for a second fluid such as air. The first fluid may cool down the internal structure, enclosure of the heat exchanger and the second fluid. The enclosure of the heat exchanger may thus cool a component to which it is directly connected. The second fluid may thus cool another part (or the same part) or another component by a flow of air controlled by air guides.

[0166] The energy obtained by the first fluid may be guided away from the component to be cooled and from the heat exchanger in a closed pipe system. Such closed pipe system may comprise an external heat exchanger outside the cabinet in which the component and the heat exchanger of the present invention may be located.

[0167] Contrary, the second fluid may be guided in an open system. The second fluid may be ambient air e.g. of a cabinet comprising the component to be cooled and the heat exchanger of the present invention. Hence, if the second fluid is air inside the cabinet, is forced e.g. by a fan into the second ducts and out again e.g. towards a component to be cooled, it may end in the cabinet and thus in principle again be forces into the second ducts.

[0168] The invention has been exemplified above with the purpose of illustration rather than limitation with reference to specific embodiments. Details of specificembodiment have been provided in order to understand the aim of the invention and can be combined where appropriate. Please note, that detailed descriptions of well- known systems, devices, circuits, and methods have been omitted so as to not obscure the description of the invention with unnecessary details.ListBO. BoltBP. Bolt PassageCP. Coupling pointCS. Contact SurfaceEN. EnclosureFG. Flow GuideFI. FinsFA. FanHEX. ((Bifunctional) multi-duct) Heat ExchangerOP OpeningIS Internal StructureCO. ComponentICO. F irst Part of Component2CO. Second Part of ComponentIW. Inductor WindingIC. Inductor CoreWA. WallIS. First Side of Wall2S. Second Side of WallID. First Duct2D. Second DuctIF. First Fluid1FI. First Fluid Inlet1FO. First Fluid outlet2F. Second Fluid2FI. Second Fluid Inlet2FO. Second Fluid OutletITS. First Temperature Sensor2TS. Second Temperature SensorTRS. Temperature Regulation SystemCTRL. ControllerPU. PumpEHEX. External Heat ExchangerIT, 2T First and second temperature sensor

Claims

Patent claims1. A multi-duct heat exchanger (HEX) configured for temperature regulation of one or more components (CO), said heat exchanger comprises an enclosure (EN) having a contact surface (CS) and an internal structure (IS) comprising walls (WA) defining a plurality of first ducts (ID) and a plurality of second ducts (2D), wherein said contact surface (CS) is thermally connected to at least one of said walls thereby allowing a transfer of energy therebetween, and wherein said contact surface (CS) is thermally connectable to a first part of said one or more components (ICO), wherein said plurality of first ducts (ID) is configured for guiding a first fluid (IF) from a first fluid inlet (1FI) of said enclosure (EN) to a first fluid outlet (1FO) of said enclosure (EN), and wherein said plurality of second ducts are configured for guiding a second fluid (2F) from a second fluid inlet (2FI) of said enclosure (EN) to a second fluid outlet (2FO) of said enclosure (EN).

2. A multi-duct heat exchanger according to claim 1, wherein the design of said contact surface and said at least one wall allow transfer of energy from said first part of said one or more components and said at least one wall when said first part of said one or more components are thermally connected to said contact surface.

3. A multi-duct heat exchanger according to claim 2, wherein said energy is configured for being transferred between said first part of said one or more components and said at least one wall by thermal conduction.

4. A multi-duct heat exchanger according to any of the preceding claims, wherein said energy is configured for being transferred from said at least one wall to said first fluid by thermal convection.

5. A multi-duct heat exchanger according to claim 4, wherein said first fluid is configured for transferring said energy out of said enclosure via said first fluid outlet.

6. A multi-duct heat exchanger according to any of the preceding claims, wherein said second fluid outlet is configured for guiding said second fluid towards a second part of said one or more components (2CO).

7. A multi-duct heat exchanger according to claim 6, wherein said second fluid is configured for transferring energy from said second part of said one or more components (2CO) by thermal convection.

8. A multi-duct heat exchanger according to any of the preceding claims, wherein said walls defining said first and second ducts are configured for transferring of energy between said first fluid and said second fluid.

9. A multi-duct heat exchanger according to claim 8, wherein said energy is transferred from said second fluid to said first fluid.

10. A heat exchanger (HEX) according to any of the preceding claims, wherein a first side (IS) of one of said walls (WA) is partly defining at least part of one of said plurality of first ducts (ID) and a second side (2S) of said one of said walls (WA) is partly defining at least part of one of said plurality of second ducts (2D).

11. A heat exchanger (HEX) according to claim 10, wherein said first side (IS) and / or said second side (2S) comprise one or more fins (FI).

12. A heat exchanger (HEX) according to any of the preceding claims, wherein at least part of said first duct (ID) and / or said second duct (2D) is defined by an outer wall of said heat exchanger (HEX).

13. A heat exchanger (HEX) according to any of the preceding claims, wherein said internal structure (IS) is designed as a triply periodic minimal surface.

14. A heat exchanger according to any of the preceding claims, wherein said internal structure is designed as adjacent pipes located side-by-side alternatingly defining a first duct and a second duct.

15. A heat exchanger according to any of the preceding claims, wherein said internal structure is designed as adjacent sheets located side-by-side alternatingly defining a first duct and a second ducts.

16. A heat exchanger (HEX) according to any of the preceding claims, wherein said plurality of first ducts (ID) is a closed duct system.

17. A heat exchanger (HEX) according to any of the preceding claims, wherein at least one of said plurality of first ducts (ID) is blinded.

18. A heat exchanger (HEX) according to any of the preceding claims, wherein at least part of at least one of said plurality of first ducts (ID) are shaped by the curvature of a fin (FI).

19. A heat exchanger (HEX) according to any of the preceding claims, wherein said heat exchanger (HEX) comprises more than one contact surface (CS).

20. A heat exchanger (HEX) according to any of the preceding claims, wherein said contact surface (CS) is a non-uniform surface.

21. A heat exchanger (HEX) according to any of the preceding claims, wherein said non-uniform surface has a sawtooth geometry, preferably a truncated sawtooth geometry.

22. A heat exchanger (HEX) according to any of the preceding claims, wherein said contact surface (CF) is thermally connected to said of one or more components (CO) via an electric insulating material.

23. A heat exchanger (HEX) according to any of the preceding claims, wherein said second duct (2D) is an open duct system.

24. A heat exchanger (HEX) according to any of the preceding claims, wherein said second fluid inlet (2FI) is covered by a fan (FA).

25. A heat exchanger according to any of the preceding claims, wherein a funnel is positioned between said fan and said second fluid inlet, wherein the diameter of said funnel is larger towards the end said fan than towards the end of said second duct inlet.

26. A heat exchanger (HEX) according to any of the preceding claims, wherein a cross- sectional area of said second duct (2D) is varying.

27. A heat exchanger (HEX) according to any of the preceding claims, wherein said multi-duct heat exchanger (HEX) comprises flow guides (FG), wherein said flow guides (FG) are configured to guide said second fluid (2F), after said second fluid (2F) has left said second fluid outlet (2FO), towards said second part of said one or more components (2CO).

28. A heat exchanger (HEX) according to any of the preceding claims, wherein said flow guide (FG) is formed by one or more outer walls of said heat exchanger HEX.

29. A heat exchanger (HEX) according to any of the preceding claims, wherein said flow guide (FG) is releasable mounted to said heat exchanger (HEX).

30. A heat exchanger (HEX) according to any of the preceding claims, wherein said flow guide (FG) is implemented as one or more tubes.3 E A heat exchanger (HEX) according to any of the preceding claims, wherein said heat exchanger (HEX) comprises more than one set of flow guides (FG).

32. A heat exchanger (HEX) according to any of the preceding claims, wherein a flow speed of said first fluid (IF) through said plurality of first ducts (ID) is controlled by a controller (CTRL) based on feedback from a first temperature sensor (ITS).

33. A heat exchanger (HEX) according to any of the preceding claims, wherein a rotational speed of said fan (FA) is controlled by a controller (CTRL) based on feedback from a second temperature sensor (2TS).

34. A heat exchanger (HEX) according to any of the preceding claims, wherein at least part of said walls (WA) is isolated.

35. A heat exchanger (HEX) according to any of the preceding claims, wherein at least part of said walls (WA) comprises a first and a second side defining a wall enclosure.

36. A heat exchanger (HEX) according to any of the preceding claims, wherein said enclosure (EN) is at least partly made of a plastic material wherein said internal structure (IS) is made in aluminium.

37. A heat exchanger (HEX) according to any of the preceding claims, wherein said thermal connection is configured for electrically isolating said heat exchanger (HEX) from said one or more components (CO).

38. A heat exchanger (HEX) according to any of the preceding claims, wherein said thermal connection is provided as a physical contact between said contact surface (CS) and said one or more components (CO).

39. A heat exchanger (HEX) according to any of the preceding claims, wherein said heat exchanger (HEX) is a standalone device configured for being thermally coupled to said one or more components (CO).

40. A heat exchanger (HEX) according to any of the preceding claims, wherein said internal structure (IS) is monolithically manufactured by an additive manufacturing process.

41. A heat exchanger (HEX) according to any of the preceding claims, wherein said heat exchanger (HE)X comprises a first heat exchanger part (1HEX) comprising a first part of said first duct system (ID) and a second heat exchanger part (2HEX) comprising a second part of said first duct system (ID), wherein said first duct system (ID) is completed when said first and second heat exchanger parts (1HEX, 2HEX) are physically connected.

42. A heat exchanger (HEX) according to any of the preceding claims, wherein each of said first and second heat exchanger parts (1HEX, 2HEX) comprising a second duct system (2D).

43. A heat exchanger (HEX) according to any of the preceding claims, wherein said first heat exchanger part (1HEX) comprises a first fluid inlet (1FI) and said second heat exchanger part (2HEX) comprises a first fluid outlet (1FO), and wherein both of said first and second heat exchanger parts (1HEX, 2HEX) comprises both a second fluid inlet (2FI) and a second fluid outlet (2FO).

44. A heat exchanger (HEX) according to any of the preceding claims, wherein said one or more components (CO) is an electric heat generating component.

45. A heat exchanger (HEX) according to any of the preceding claims, wherein said one or more components (CO) is a first component (ICO) and a second component (2CO), wherein said first component (ICO) is a power module and said second component (2CO) is a busbar.

46. A heat exchanger (HEX) according to any of the preceding claims, wherein said one or more components (CO) is a first component (ICO) and a second component (2CO), wherein said first component (ICO) is an inductor core (IC) and said second component (2CO) is inductor windings (IW).

47. A heat exchanger (HEX) according to any of the preceding claims, wherein said heat generating component is at least partly surrounded by said heat exchanger (HEX).

48. A heat exchanger (HEX) according to any of the preceding claims, wherein said contact surface (CS) is part of said heat generating component.

49. A temperature regulation system (TRS) for regulating the temperature of one or more components (CO), comprising a first and a second multi-duct heat exchanger part (1HEX, 2HEX), each of said heat exchanger parts (1HEX, 2HEX) comprises:an internal structure (IS) comprising walls (WA) defining a first duct system (ID) and a second duct system (2D), wherein a plurality of said walls (WA) is thermally connected to a contact surface (CS), thereby allowing a thermal connection between a first fluid (IF) comprised by said first duct system (ID) and a first part of said one or more components (ICO), wherein said second duct system (2D) is configured to guide a second fluid (2F) from a second fluid inlet (2FI) to a second fluid outlet (2FO) and towards a second part of said one or more components (2CO).

50. A system according to claim 49, wherein a first fluid outlet (1FO) of said first multi-duct heat exchanger part (1HEX) is fluidly connected to a first fluid inlet (1FI) of said second multi-duct heat exchanger part (2HEX).

51. A temperature regulation system (TRS) according to claims 49 or 50, wherein the contact surface (CS) is part of an enclosure (EN) of the first or second heat exchanger part (1HEX, 2HEX).52 Temperature regulation system (TRS) according to any one of the preceding claims 49-51, wherein said temperature regulation system (TRS) comprise a pump (PU) and a controller (CTRL) configured to establish a circulating flow of said first fluid (IF) from a first fluid inlet (1FI) of said first multi-duct heat exchanger part (1HEX), via a first duct (ID) of said first multi-duct heat exchanger part (1HEX), via said first fluid outlet 1FO of said first multi-duct heat exchanger part (1HEX), via said first fluid inlet 1FI of said second multi-duct heat exchanger part (2HEX), via a first duct (ID) in said second multi-duct heat exchanger part (2HEX) to a first fluid outlet (1FO) of said second multi-duct heat exchanger part (2HEX).

53. Temperature regulation system (TRS) according to any one of the preceding claims 49-52, wherein said temperature regulation system (TRS) furthermore comprises an external heat exchanger (EHEX) configured to exchange heat between said first fluid (IF) and an external fluid.

54. Temperature regulation system (TRS) according to any one of the preceding claims 49-53 implementing a multi-duct heat exchanger (HEX) according to any one of the preceding claims 1-48.

55. A method of regulating a temperature of a first component part and of a second component part by a multi-duct heat exchanger, the multi-duct heat exchanger comprises an internal structure (IS) comprising walls (WA) defining a first duct system (ID) and a second duct system (2D), wherein a plurality of said walls (WA) is thermally connected to a contact surface (CS) of said multi-duct heat exchanger, wherein said second duct system (2D) is configured to guide a second fluid (2F) from a second fluid inlet (2FI) to a second fluid outlet (2FO), the method comprises the steps of: physically connecting said multi-duct heat exchanger and said first component part (ICO) so that o an energy exchange, via thermal conduction, is established between said first component part (ICO) and said contact surface (CS), o an energy exchange, via thermal conduction, is established between said contact surface (CS) and said walls defining said first duct system (ID), and o an energy exchange, via thermal convection, is established between said walls defining said first ducts system (ID) and a first fluid (IF) guided in said first duct system (ID), and so that o said second fluid leaving said second fluid outlet (2FO) is guided towards said second component part (2CO), thereby establishing an energy exchange, via thermal convection, between said second component part (2CO) and said second fluid (2F), by a controller (CTRL),o control the temperature of said first fluid (IF), by controlling a flow of said first fluid (IF) through an external heat exchanger (EHEX), and o control the flow speed of said second fluid (2F), by controlling a fan (FA).

56. A method according to claim 55 implementing a multi-duct heat exchanger according to any one of the claims 1-48.

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