Assembly and method for producing an assembly

Abstract

The present invention relates to an assembly (1) comprising: a component arrangement (2), the component arrangement (2) having at least one component (3), the component arrangement (2) having a dry side (16), and the at least one component (3) being arranged on the dry side (16); a cooling structure arrangement (8), the cooling structure arrangement (8) being applied to a cooling side (15) of the component arrangement (2) by primary shaping; a trough arrangement (20), the trough arrangement (20) sealing the cooling structure arrangement (8) of the component arrangement (2) such that a fluid chamber (11) is formed, through which a cooling fluid can flow; and an insert part (10) which is arranged in the fluid chamber (11) and is designed to influence the flow of the cooling fluid. The present invention also relates to a method for producing an assembly (1).

Description

[0001] Description

[0002] title

[0003] Assembly and method for producing an assembly

[0004] State of the art

[0005] The present invention relates to an assembly and a method for producing an assembly.

[0006] In many applications, especially in electronics and electrical engineering, there is a constant need to efficiently cool components such as power modules. Inadequate cooling can lead to overheating, reduced service life, and, in the worst case, component failure. Traditional cooling methods often cannot keep up with the high thermal requirements of modern components, especially when the components are used in compact or integrated systems. Therefore, there is a need for new solutions that are both efficient and cost-effective.

[0007] DE 10 2021 209 482 A1 describes an electronic module with at least one power semiconductor, which is electrically connected to a contacting arrangement, and with at least one cooling element for at least indirectly cooling the at least one power semiconductor.

[0008] Disclosure of the invention

[0009] The present invention provides an assembly having the features of claim 1, and a method for producing an assembly having the features of claim 15. Advantageous or preferred embodiments of the invention emerge from the subclaims, the following description and the attached figures.

[0010] Accordingly, it is provided:

[0011] An assembly with a component arrangement, wherein the component arrangement has at least one component, wherein the component arrangement has a dry side, wherein the at least one component is arranged on the dry side; with a cooling structure arrangement, wherein the cooling structure arrangement is applied to a cooling side of the component arrangement, preferably applied by primary molding, with a trough arrangement, wherein the trough arrangement seals the cooling structure arrangement so that a fluid space is formed through which a cooling fluid can flow, and with an insert part which is arranged in the fluid space and is designed to influence the flow of the cooling fluid.

[0012] Furthermore, a method for producing an assembly is provided with the following method steps: a) providing a component arrangement with at least one component, b) arranging the at least one component on a dry side of the component arrangement, c) applying, in particular primary forming, a cooling structure arrangement on a cooling side of the component arrangement, d) forming an insert, e) arranging the insert in a tray arrangement, and f) sealing the cooling structure arrangement of the component arrangement with the tray arrangement in order to form a fluid space.

[0013] The described assembly represents an advanced thermal management solution, specifically designed for applications where precise and effective heat dissipation is critical. With a component arrangement that clearly distinguishes between a dry side and a cool side, the assembly provides targeted heat dissipation that protects critical components from overheating and can thus extend their service life. A significant advantage of this design is the integration of the cooling structure assembly directly on the cool side of the component arrangement using a primary forming process, such as 3D printing. This approach improves the thermal connection between the heat-generating components and the cooling structure assembly, thereby maximizing heat transfer efficiency. By avoiding additional thermally conductive materials, manufacturing costs are reduced and the production process is streamlined.

[0014] Furthermore, the tray arrangement, which surrounds and seals the cooling structure, ensures the formation of a closed fluid chamber. Cooling fluid can flow through this chamber, dissipating heat. The seal prevents liquids from penetrating sensitive areas and protects the components from harmful influences, ensuring the system operates reliably even under demanding operating conditions.

[0015] A crucial element within this fluid space is the insert, which is designed specifically to influence the flow of the cooling fluid. The insert is configured to change the direction and / or velocity of the cooling fluid flow. This component allows the cooling power to be concentrated precisely where it is needed most and helps prevent energy waste due to excessive cooling of less heat-intensive areas. Precise flow control, particularly through the flow control areas formed on the insert, leads to optimized temperature distribution and increases the overall efficiency of the cooling fluid circuit.

[0016] This assembly is also characterized by its modular and flexible design, which allows the system to be adapted to different component configurations without the need for extensive redesign. This adaptability is particularly advantageous in terms of cost and time efficiency in the development of new products.

[0017] Last but not least, the design of the assembly is also advantageous in terms of maintenance and serviceability. If the insert is accessible and replaceable, this would facilitate repairs and maintenance work, thus contributing to the longevity and reducing operating costs of the overall system.

[0018] Overall, the assembly combines innovative heat dissipation techniques with a sophisticated design that is optimized for both performance and ease of maintenance. This solution promises reliable and efficient cooling for a wide range of industrial applications.

[0019] The process for manufacturing an assembly offers technical advantages that can be significant, especially in areas where precise thermal management systems are critical. The first step involves preparing a component layout, which provides a flexible basis for system configuration. Arranging the components on the dry side creates a clear separation between the thermally active and passive areas of the assembly, enabling selective cooling.

[0020] The primary application of the cooling structure assembly to the cooling side of the component assembly, for example, using a 3D printing process and / or selective laser sintering and / or SLM, creates technical advantages in terms of thermal contact area and thermal conductivity. This application ensures that heat is efficiently and directly dissipated from the heat sources, without unnecessary thermal resistance that can typically occur with composite heat sinks.

[0021] Sealing the cooling structure assembly with the tray assembly is another crucial step, resulting in the creation of a fluid chamber through which a cooling fluid can flow safely and effectively. This seal not only prevents leaks but also protects the components from corrosion and other environmental influences, increasing the reliability and longevity of the entire system.

[0022] Placing the insert within this fluid space allows for precise control over the flow behavior of the cooling fluid. This process is crucial for adapting the cooling performance to specific component requirements and leads to optimized cooling by directing the fluid precisely where it's needed.

[0023] In summary, the assembly manufacturing process enables the development of a highly integrated, efficient thermal management system that can be tailored for a wide range of applications. It promotes system reliability, optimizes thermal efficiency, and supports component longevity, while reducing the complexity and potential costs of thermal design.

[0024] According to a preferred embodiment, the cooling structure arrangement is positioned exclusively in areas with higher heat dissipation. This embodiment, in which the cooling structure arrangement is positioned exclusively in areas with higher heat dissipation, achieves targeted cooling. For example, in power transformers or electric motors, where hot spots can occur, this embodiment enables more direct and thus more effective heat dissipation, reduces thermal stress, and improves the performance and service life of the components.

[0025] According to a further preferred embodiment, the insert serves to control the flow behavior of cooling fluids and / or the insert is designed to control the flow behavior of the cooling fluids. The use of an insert to control the flow behavior of cooling fluids finds application in systems such as water cooling circuits in computers, cooling systems in electric vehicles, or liquid cooling in industry. This configuration optimizes the flow of the cooling fluid, improves heat transfer, and ensures uniform cooling, which increases the overall efficiency of the system.

[0026] According to a further preferred embodiment, the insert is made of plastic, in particular of a recycled plastic. If the insert is made of plastic, in particular of a recycled plastic, one benefits not only from the reduced environmental impact through recycling, but also from the weight savings and corrosion resistance offered by plastics. This is particularly advantageous in applications such as mobile electronics or in vehicles, where every saved gram contributes to efficiency and energy savings. The insert is made, for example, from polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC) and / or ABS (acrylonitrile butadiene styrene).

[0027] According to a further preferred embodiment, the cooling structure arrangement is formed from a highly thermally conductive material. For example, the cooling structure arrangement is formed from an aluminum alloy, a copper alloy, a stainless steel alloy, a titanium alloy, a nickel-based alloy, a cobalt-chromium alloy, or a tool steel alloy. However, the cooling structure arrangement can also be formed from a carbon fiber reinforced plastic or a ceramic. Forming the cooling structure arrangement from a highly thermally conductive material utilizes the excellent thermal conduction properties of these materials. These are used, for example, in heat exchangers, cooling systems for power LEDs, or in the cooling of battery cells in electric vehicles. Such materials enable rapid and effective heat dissipation, which leads to improved performance and reliability of the overall system.

[0028] According to a further preferred embodiment, the fluid chamber is sealed between the tray assembly and the cover by a welding process, a soldering process, and / or an adhesive process. Sealing the fluid chamber by a joining process ensures a permanent and leak-free seal. This is essential in systems where leakage of the cooling fluid could lead to damage or safety risks.

[0029] According to a further preferred embodiment, the insert has the same external dimensions as the internal dimensions of the tray. An insert that has the same external dimensions as the internal dimensions of the tray assembly ensures a precise fit and easy assembly. This property is particularly useful in highly automated manufacturing environments, such as the mass production of electronic devices, where fast and error-free assembly is essential. According to a preferred embodiment, the insert has recesses configured to accommodate the cooling structure assembly. The special design of an insert with precisely defined recesses for accommodating a cooling structure assembly represents an intelligent solution for improving the efficiency and effectiveness of cooling mechanisms in technical systems.This design concept offers several significant technical advantages that can be beneficial for a range of applications.

[0030] First, the precise fit of the cooling structure assembly within the insert's recesses enables optimized heat transfer. Because the cooling structure assemblies are in direct physical contact with the insert, thermal contact is maximized, enabling faster and more efficient heat dissipation. This is especially important in high-performance systems where effective heat dissipation is critical to maintaining functionality and performance.

[0031] Mechanical stability is also improved by this design. The cooling structure assembly, which sits firmly in the recesses, is better protected against external influences such as vibrations and shocks. This is particularly relevant in mobile applications or industrial environments, where the cooling structure assembly is frequently exposed to dynamic forces. The additional mechanical support extends the service life of the cooling structure assembly and ensures consistent cooling performance throughout its entire service life.

[0032] Furthermore, the precise manufacturing of the recesses simplifies assembly. The individual parts can be assembled quickly and accurately, saving time and reducing assembly errors. In mass production, where time and precision are crucial, this can lead to significant cost savings.

[0033] In summary, the design of the insert with specific recesses for the cooling structure arrangement provides not only technical advantages in terms of cooling performance and mechanical robustness, but also advantages in manufacturing efficiency. By integrating such intelligent design features, engineers can develop more powerful and durable cooling systems that can be used in a variety of industries and applications.

[0034] According to a further preferred embodiment, the assembly with the cooling structure arrangement or the component arrangement is fixed to the tray arrangement by a joining process, such as welding and / or soldering and / or gluing, providing a secure and permanent connection. In applications such as power electronics or LED lighting, this ensures effective heat dissipation and mechanical stability.

[0035] According to a further preferred embodiment, a variable geometry of the fluid space is formed by the separate manufacture of the cooling structure assembly and the insert. Finally, a variable geometry of the fluid space by the separate manufacture of the cooling structure assembly and the insert, which may in particular have flow-guiding regions, enables customized adaptation to different cooling requirements. This flexibility is particularly advantageous in areas such as customized computer hardware or in specialized industrial cooling systems, where a standard solution would be inadequate or too inefficient.

[0036] According to another preferred embodiment, the cooling structure arrangement is applied using an additive 3D printing process and / or selective laser sintering and / or selective laser melting (SLM). The use of these advanced technologies enables the highly precise creation of a complex cooling structure arrangement that would be difficult to realize using conventional methods. Such a cooling structure arrangement significantly improves heat dissipation through optimized surface geometries, such as finely branched cooling fins, and / or cooling pins and / or internal channels. The direct, seamless application of the cooling structure arrangement to the power module reduces thermal resistance and increases heat transfer efficiency by eliminating the need for bonding materials that could otherwise impair conductivity.

[0037] The flexibility of additive manufacturing allows the cooling structure arrangement to be placed exactly where heat dissipation is highest, resulting in resource efficiency through material savings and weight reduction. This is particularly advantageous in mobile applications and contributes to economic efficiency by minimizing waste and using materials in a targeted manner.

[0038] Additive manufacturing enables multi-material construction by, for example, combining highly thermally conductive materials with less costly materials. This enables a cost-optimized production method that takes into account the thermal and mechanical requirements of the respective areas of the assembly.

[0039] The significant design freedom offered by additive manufacturing leads to an optimized overall design that enhances cooling system performance and enables high adaptability to diverse operating conditions. Using these techniques can shorten the development time for new products, as prototypes and final products can be produced more quickly and without the traditional tool and mold manufacturing effort, accelerating the innovation cycle and promoting rapid time to market.

[0040] According to a further preferred embodiment, the insert has flow-guiding regions, wherein the flow-guiding regions protrude into the fluid space. By introducing flow-guiding regions that protrude into the fluid space, the cooling fluid can be directed in a targeted manner along critical hotspots of the components to be cooled. The flow-guiding regions comprise, for example, cooling pins and / or finely branched cooling fins and / or internal channels. This controlled flow behavior increases heat transfer efficiency by maximizing the heat exchange between the cooling fluid and the cooling structure arrangements of the components. This targeted control of the cooling fluid flow means that the cooling system is less dependent on random flow dynamics and can instead rely on a structural distribution that optimizes heat dissipation.

[0041] The design of the flow guidance areas also supports the creation of a more uniform temperature profile throughout the entire cooling system. This prevents local overheating and contributes to the longevity and reliability of the cooled components. Furthermore, this orderly flow guidance enables a reduction in dead zones in the fluid space, i.e., areas where the cooling fluid stagnates and does not effectively contribute to cooling.

[0042] Another advantage is the potential reduction in pressure loss in the cooling system. The flow guide areas can be designed to minimize resistance to the cooling fluid movement, which in turn improves cooling fluid circulation.

[0043] Furthermore, the integration of flow guides into the insert allows for greater flexibility in the design of the cooling system. The components can be tailored to specific applications, allowing for better adaptation to different operating conditions and the requirements of the electronics to be cooled.

[0044] Overall, this embodiment increases the overall performance and efficiency of the cooling system, offers potential for operating cost savings through lower energy consumption, and supports the requirements for precise temperature control in critical electronic applications.

[0045] According to another preferred embodiment, the flow guide areas interact with the cooling structure arrangement. This interaction also enables more precise control over the flow dynamics within the cooling system. The design of the flow guide areas in combination with the cooling structure arrangement allows for a homogeneous flow distribution, which reduces turbulence and promotes the formation of flow paths that direct the cooling fluids directly through the system without detours. This not only prevents ineffective distribution of the cooling fluid but also ensures that all components are cooled evenly.

[0046] Another significant advantage is the ability to reduce cooling fluid volume and / or pump power. Because the flow is more efficient, a smaller volume of cooling fluid can be used to achieve the same or even improved cooling performance. Furthermore, this close coordination between the flow control areas and the cooling structure arrangement enables a more compact cooling system design. This is particularly advantageous in applications where space is limited, such as mobile devices or automotive electronics cooling. Improved integration allows the overall volume of the cooling system to be reduced, resulting in a reduction in size and potentially also in weight.

[0047] Overall, this embodiment provides a sophisticated method for fine-tuning the cooling system, not only improving thermal performance but also resulting in energy and space savings. It demonstrates an expanded understanding of how the interaction between different elements of a cooling system can influence its overall performance.

[0048] According to a further preferred embodiment, the at least one component is designed as a high-performance switching element and / or the assembly is designed as an inverter assembly for an electric drive of a vehicle.

[0049] One of the key features of a high-power switching element is its ability to switch large currents while minimizing energy loss. When used as part of an inverter assembly for vehicle powertrains, this element contributes significantly to the efficiency of the overall system. Losses during the switching process are reduced, resulting in less heat generation and thus lowering the thermal stress on the assembly. This is crucial, as excessive heat generation can significantly shorten the lifespan of electronic components.

[0050] Furthermore, the integration of a high-performance switching element into the inverter assembly enables more precise control of the electric motor. This results in improved response time and finer modulation of motor power, which, especially in electric vehicles, leads to better vehicle control and more efficient energy consumption. The ability to respond quickly and precisely to driver commands is of great importance for the performance and driving experience in electromobility. Another technical advantage arises from the miniaturization of electronic components. The use of high-performance switching elements can help reduce the size of the inverter assembly without compromising performance. A compact inverter assembly is easier to integrate and enables more flexible vehicle layout design.This can lead to better use of space in the vehicle while reducing weight, which in turn increases the efficiency and range of the electric vehicle.

[0051] Finally, this design facilitates maintenance and repair. High-performance switching elements incorporated into a modular inverter assembly can be designed for easy access and replacement, reducing maintenance costs and increasing vehicle availability.

[0052] In summary, the use of high-performance switching elements in an inverter assembly for a vehicle's electric drive leads to increased system efficiency, improved vehicle dynamics, reduced space and weight, and improved maintainability. These factors are all crucial for the further development and acceptance of electric vehicles in the mass market.

[0053] Further features, effects, and advantages of the invention will become apparent from the following description of a preferred embodiment of the invention and the accompanying figures. These show:

[0054] Figure 1 is a schematic diagram of an embodiment of an assembly according to the invention;

[0055] Figure 2 is a schematic sectional view of an embodiment of an assembly according to the invention;

[0056] Figure 3 shows a schematic diagram of an embodiment of an assembly according to the invention; and Figure 4 shows a schematic flow diagram of an embodiment of a method according to the invention.

[0057] Corresponding or identical components are provided with corresponding or identical reference numerals.

[0058] Figures 1 to 3 show schematic diagrams of embodiments of an assembly 1 according to the invention. The assembly 1 represents an innovative configuration for thermal management solutions, particularly suitable for electronic components such as high-performance switching elements or inverter assemblies that can be used in electric drives of vehicles.

[0059] The described assembly 1 comprises a component arrangement 2, which includes at least one component 3, which is arranged on a dry side 16 of the component arrangement

[0060] 2. This arrangement ensures that the sensitive components

[0061] 3 must be kept away from moisture, which is crucial for its service life and functionality. Furthermore, the component assembly 2 comprises a cover 9. The cover 9 has at least one cover recess, with the at least one component 3 being arranged in the cover recess of the cover 9.

[0062] In addition, the assembly 1 has a cooling structure arrangement 8, which is applied to the opposite cooling side 15 of the component arrangement 2 by primary molding. The positioning of the cooling structure arrangement 8 can be provided exclusively in areas of higher heat dissipation, which ensures efficient dissipation of the generated heat. The material of the cooling structure arrangement 8 is made, in particular, from a highly thermally conductive material in order to achieve optimal cooling properties. In the illustrated embodiment, the cooling structure arrangement 8 has cooling pins that protrude into the recesses 7 of the insert 10. However, the cooling structure arrangement 8 can also be formed by finely branched cooling fins and / or internal channels.

[0063] An essential element of the assembly 1 is the tray arrangement 20, which encloses and seals the cooling structure arrangement 8 of the component arrangement 2, thus creating a fluid chamber 11. The fluid chamber 11 is formed by a connection of the tray arrangement 20 to the cover 9 of the component arrangement 2. This fluid chamber 11 is designed for the flow of a cooling fluid, with the tightness being ensured, for example, by a welding process and / or soldering process and / or adhesive process between the tray arrangement 20 and the cover 9. Such a seal prevents leaks and ensures a continuous cooling fluid circulation.

[0064] Located within the fluid chamber 11 is an insert 10 designed to influence the flow of the cooling fluid within the fluid chamber 11 and to control the flow behavior. The insert 10 is made, for example, of plastic, with particular emphasis on the use of recycled plastic to promote sustainability and environmental compatibility. The insert 10 preferably has the same external dimensions as the internal dimensions of the tray assembly 20 and can additionally be provided with recesses 7 that serve to accommodate the cooling structure assembly 8. This fit enables precise and efficient flow guidance within the fluid chamber 11.

[0065] The assembly 1 is constructed using joining methods such as soldering or gluing such that the cooling structure assembly 8 of the component assembly 2 is fixed to the tray assembly 20 and / or the insert 10, ensuring additional stability and durability of the assembly. The separate manufacture of the cooling structure assembly 8 and the insert 10 results in a variable geometry of the fluid chamber 11, which ensures flexible adaptation to different cooling conditions and component geometries.

[0066] The cooling structure arrangement 8 can be manufactured using advanced techniques such as additive 3D printing, and / or selective laser sintering and / or SLM, which enables precise and material-saving production. Furthermore, flow-guiding regions 17 can be integrated into the insert 10. These flow-guiding regions extend into the fluid space 11 and interact with the cooling structure arrangement 8 to achieve optimized flow guidance of the cooling fluid in the fluid space 11 and thus improved cooling performance. The flow-guiding regions comprise, for example, cooling pins and / or finely branched cooling fins and / or internal channels. Finally, the at least one component 3 is designed, for example, as a high-performance switching element, and the entire assembly 1 can be used as part of an inverter assembly for the electric drive of a vehicle.By combining these features, assembly 1 meets the highest requirements for efficiency, reliability and environmental compatibility in modern applications.

[0067] Figure 4 shows a schematic flow diagram of an embodiment of a method according to the invention. The method for producing an assembly

[0068] 1 begins with step a by providing a component arrangement 2 comprising at least one component 3. In a second step b, this component 3 is carefully placed on a surface of the component arrangement referred to as the dry side 16

[0069] 2. Positioning on the dry side 16 is crucial to protect the sensitive electronic components 3 from moisture.

[0070] After the component 3 is correctly positioned, the third step c follows: the primary application of a cooling structure arrangement 8 on the opposite side of the component arrangement, referred to as the cooling side 15. This process is advantageous for ensuring the thermal management function of the assembly 1. The cooling structure arrangement 8 is preferably precisely placed in areas of higher heat dissipation to achieve optimal heat dissipation.

[0071] The next step in the manufacturing process is the formation of an insert 10. This insert 10 is specifically designed to influence the flow of the cooling fluid within the assembly later in the process, for example, through flow guide areas 17. It is manufactured from materials that exhibit good compatibility with the cooling fluid and the necessary strength to ensure long-term functionality.

[0072] Once the insert 10 is formed, it is arranged in a tray assembly 20 in step e. This assembly serves to receive the insert 10 and correctly position it so that it can fulfill its function within the later created fluid space 11. The final step f of the process is the sealing of the cooling structure assembly 8 of the component assembly 2 using the tray assembly 20. This step is of utmost importance because it hermetically seals the fluid space 11 so that the cooling fluid can flow through the fluid space 11 without escaping. Sealing is achieved using techniques such as welding and / or soldering and / or gluing and / or other suitable joining methods to ensure a permanent and leak-free connection between the cooling structure assembly 8 of the component assembly 2 and the tray assembly.

[0073] With the completion of these steps, the production of assembly 1 is complete and is now ready for use in applications that require efficient heat dissipation, such as in the electronics industry or in automotive engineering, especially in high-performance electronics and inverter assemblies for electric drive systems.

Claims

Claims 1. An assembly (1) comprising a component arrangement (2), the component arrangement (2) having at least one component (3), the component arrangement (2) having a dry side (16), the at least one component (3) being arranged on the dry side (16); a cooling structure arrangement (8), the cooling structure arrangement (8) being applied to a cooling side (15) of the component arrangement (2); a trough arrangement (20), the trough arrangement (20) sealing the cooling structure arrangement (8) of the component arrangement (2) so that a fluid space (11) is formed through which a cooling fluid can flow; and an insert part (10) which is arranged in the fluid space (11) and is designed to influence the flow of the cooling fluid.

2. Assembly (1) according to claim 1, characterized in that the cooling structure arrangement (8) is positioned exclusively in areas with higher heat dissipation.

3. Assembly (1) according to claim 1 or 2, characterized in that the insert (10) serves to control the flow behavior of cooling fluids.

4. Assembly (1) according to one of the preceding claims, characterized in that the insert part (10) is made of plastic, in particular of a recycled plastic.

5. Assembly (1) according to one of the preceding claims, characterized in that the cooling structure arrangement (8) is formed from a highly thermally conductive material.

6. Assembly (1) according to one of the preceding claims, characterized in that the fluid space (11) is sealed by a welding process and / or soldering process and / or adhesive process.

7. Assembly (1) according to one of the preceding claims, characterized in that the insert part (10) has the same external dimensions as the internal dimensions of the tray arrangement (20).

8. Assembly (1) according to one of the preceding claims, characterized in that the insert part (10) has recesses (7) which are designed to receive the cooling structure arrangement (8).

9. Assembly (1) according to one of the preceding claims, characterized in that the component arrangement (2) with the cooling structure arrangement (8) is fixed to the trough arrangement (20) by a joining process.

10. Assembly (1) according to one of the preceding claims, characterized in that a variable geometry of the fluid space (11) is formed by the separate production of the cooling structure arrangement (8) and the insert part (10).

11. Assembly (1) according to claim one of the preceding claims, characterized in that the cooling structure arrangement (8) is applied by an additive 3D printing process and / or selective laser sintering and / or selective laser beam melting.

12. Assembly (1) according to one of the preceding claims, characterized in that the insert part (10) has flow guiding regions (17), wherein the flow guiding regions (17) protrude into the fluid space (11).

13. Assembly (1) according to claim 12, characterized in that the flow guiding regions (17) interact with the cooling structure arrangement (8).

14. Assembly (1) according to one of the preceding claims, characterized in that the at least one component (3) is designed as a High-performance switching element and / or the assembly is designed as an inverter assembly for an electric drive of a vehicle.

15. A method for producing an assembly (1), comprising the following steps: a) providing a component arrangement (2) with at least one component (3), b) arranging the at least one component (3) on a dry side (16) of the component arrangement (2), c) applying a cooling structure arrangement (8) on a cooling side (15) of the component arrangement (2), d) forming an insert part (10), e) arranging the insert part (10) in a trough arrangement (20), and f) sealing the cooling structure arrangement (8) of the component arrangement (2) with the trough arrangement (20) in order to form a fluid space (11).

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