Component mounting device and type switching method in component mounting device

Abstract

This component mounting device 1 for mounting a component E on a substrate P comprises: a plurality of mounting stages 30 arranged side-by-side in a conveyance direction of the substrate P; a plurality of mounting portions 40 which are associated with mutually differing mounting stages 30, and which mount the component E on the substrate P carried into the associated mounting stage 30; and a control unit 50. When the mounting stage 30 is defined as an upstream-side mounting stage 30A provided that another mounting stage 30 is present on the downstream side in the conveyance direction, the control unit 50 starts type switching processing of the upstream-side mounting stage 30A without waiting for the end of the mounting of the component E at a downstream-side mounting stage 30B when the mounting of the component E at the upstream-side mounting stage 30A has ended for the substrate P to be produced at the end of one type of the substrate P.

Description

Component mounting device and product type switching method in component mounting device

[0001] The technology disclosed in this specification relates to a component mounting apparatus and a method for changing product types in the component mounting apparatus.

[0002] BACKGROUND ART Conventionally, component mounting apparatuses that mount components such as electronic components on boards printed with circuit patterns are known. When the type of board to be produced is changed, the component mounting apparatuses execute a process for switching the type (production type switching process) (see, for example, Patent Document 1).

[0003] Specifically, the background art of Patent Document 1 describes a method for performing a changeover (corresponding to a process for changing product types) in a continuous changeover production mode on a mounting line where multiple mounting machines that mount components on boards are lined up, when production of one type of board is completed and the type of board to be produced changes. The continuous changeover production mode is a mode in which a changeover from production of a first type of board to production of a second type of board is performed on an upstream mounting machine in parallel with production of the first type of board on a downstream mounting machine. The job changeover method described in Patent Document 1 is primarily intended to perform job changeover as efficiently as possible, even when continuous changeover is not possible on all mounting machines that make up the mounting line.

[0004] International Publication No. 2023 / 105575

[0005] However, there are also known component mounting devices that are equipped with multiple mounting stages, and these mounting stages are arranged side by side in the conveyance direction of the board. The job switching method described in Patent Document 1 is primarily intended to switch jobs as efficiently as possible in a mounting line where multiple mounting machines are lined up, and has not considered improving the product type switching process in a component mounting device where multiple mounting stages are arranged side by side in the conveyance direction of the board.

[0006] One aspect of the present invention discloses a technology that, in a component mounting device in which multiple mounting stages are arranged side by side in the transport direction of a board, after production of one type of board is completed on an upstream mounting stage, allows production of the next type of board to be started early on the upstream mounting stage.

[0007] The component mounting device according to the present disclosure is a component mounting device that mounts components onto a board, and includes a plurality of mounting stages arranged side by side in a transport direction of the board, a plurality of mounting units that are associated with different mounting stages and that mount the components onto the board that has been brought into the associated mounting stage, and a control unit, wherein when a mounting stage with another mounting stage located downstream in the transport direction is defined as an upstream mounting stage, the control unit, when mounting of the components on the upstream mounting stage for the last board produced of one variety of the board is completed, starts a variety switching process for the upstream mounting stage without waiting for mounting of the components on the downstream mounting stage to be completed.

[0008] According to the above configuration, in a component mounting device having a plurality of mounting stages arranged side by side in the transport direction of the board, after production of one type of board is completed on an upstream mounting stage, production of the next type of board on the upstream mounting stage can be started early.

[0009] FIG. 1 is a top view showing the general configuration of a component mounting apparatus according to the first embodiment;

[0010] [Outline of the Present Embodiment] First, an outline of the present disclosure will be listed and described.

[0011] (1) A component mounting device according to the present disclosure includes a plurality of mounting stages arranged side by side in a transport direction of the board, a plurality of mounting units that are associated with different mounting stages and that mount the components on the board carried into the associated mounting stage, and a control unit. When a mounting stage with another mounting stage downstream in the transport direction is defined as an upstream mounting stage, the control unit, when mounting of the components on the upstream mounting stage for the last board produced for one variety of the board is completed, starts a variety switching process for the upstream mounting stage without waiting for mounting of the components on the downstream mounting stage to be completed.

[0012] In a conventional component mounting apparatus equipped with multiple mounting stages arranged in the board transport direction, when component mounting on the upstream mounting stage for the last board of a particular type to be produced is completed, the upstream mounting stage remains in a standby state until component mounting on the downstream mounting stage is completed. Then, once component mounting on the downstream mounting stage is completed, a type change process is initiated for the upstream and downstream mounting stages to produce the next type of board. In other words, the type change process on the upstream mounting stage is initiated only after component mounting on the downstream mounting stage is completed. In other words, in a conventional component mounting apparatus equipped with multiple mounting stages, a time loss of one board (or more) occurs on the upstream mounting stage when switching the type of board to be produced.

[0013] In contrast, in the component mounting apparatus described in (1) above, when component mounting on the upstream mounting stage is completed for the last board produced of one type, the type switching process on the upstream mounting stage is started without waiting for component mounting on the downstream mounting stage to be completed. Therefore, the type switching process on the upstream mounting stage is completed earlier than when the type switching process is started after component mounting on the downstream mounting stage is completed. Therefore, according to the component mounting apparatus described in (1) above, in a component mounting apparatus having multiple mounting stages arranged side by side in the board transport direction, after production of one type of board is completed on the upstream mounting stage, production of the next type of board can be started earlier on the upstream mounting stage.

[0014] (2) In the component mounting device described in (1) above, when one reciprocating operation in which the components supplied by the component supply device are mounted on the board by the mounting unit is defined as a sequence and data representing the sequence is defined as sequence data, the control unit may independently secure a memory area into which sequence data is read for each mounting stage on a main memory device provided in the control unit, and the product type switching process may include a process of reading the sequence data of the sequence executed at the mounting stage that is the target of the product type switching process into the memory area for that mounting stage.

[0015] In the component mounting device described in (2) above, the product type switching process is performed independently for each mounting stage. When the product type switching process is performed for an upstream mounting stage, the mounting stage that is the target of the product type switching process is the upstream mounting stage, and when the product type switching process is performed for a downstream mounting stage, the mounting stage that is the target of the product type switching process is the downstream mounting stage.

[0016] In the past, each component mounting device had one storage area into which sequence data was loaded, and both the sequence data for the sequence executed in the upstream mounting stage and the sequence data for the sequence executed in the downstream mounting stage were loaded into one storage area. The loaded sequence data was then allocated to the upstream mounting stage and the downstream mounting stage. Therefore, even after component mounting in the upstream mounting stage was completed, the sequence data for producing the new board type could not be loaded into the storage area until component mounting in the downstream mounting stage was completed.

[0017] In contrast, with the component mounting device described in (2) above, since an independent storage area is secured for each mounting stage, it is possible to start the process of loading sequence data for the sequence executed at the upstream mounting stage into the storage area for the upstream mounting stage before component mounting at the downstream mounting stage is completed. Therefore, with the component mounting device described in (2) above, it is possible to start production of the next type of board at the upstream mounting stage earlier than when loading of the sequence data for the upstream mounting stage is started after component mounting at the downstream mounting stage is completed.

[0018] (3) In the component mounting device described in (1) or (2) above, the mounting stage has a transport unit that transports the board in the transport direction, and the transport unit has two conveyor belts arranged parallel to each other and a change mechanism that changes the distance between the two conveyor belts, and the product type switching process may include a process of changing the distance between the two conveyor belts of the mounting stage that is the target of the product type switching process to a distance that corresponds to the product type of the board after switching using the change mechanism.

[0019] According to the component mounting device described in (3) above, it is possible to start changing the spacing between the two conveyor belts on the upstream mounting stage without waiting for component mounting on the downstream mounting stage to be completed, so that production of the next type of board can be started early on the upstream mounting stage.

[0020] (4) In the component mounting device described in any one of (1) to (3) above, the mounting stage may have a plurality of backup pins that support the substrate from below and a backup plate on which the backup pins are erected, and the product type switching process may include a process of moving the backup pins of the mounting stage that is the target of the product type switching process to a position corresponding to the product type of the substrate after switching, by the mounting unit associated with the mounting stage.

[0021] According to the component mounting device described in (4) above, it is possible to start changing the arrangement of the backup pins on the upstream mounting stage without waiting for the completion of component mounting on the downstream mounting stage, so that the production of the next type of board can be started early in the upstream mounting section.

[0022] (5) In the component mounting device described in (2) above, the mounting stage has a plurality of backup pins that support the board from below and a backup plate on which the backup pins are erected, and the product type switching process includes a process of moving the backup pins of the mounting stage that is the target of the product type switching process to positions corresponding to the product type of the board after switching by the mounting unit associated with the mounting stage, and the control unit may execute the process of reading sequence data and the process of moving the backup pins in parallel.

[0023] According to the component mounting device described in (5) above, the product type change process on the upstream mounting stage is completed earlier than when the process of reading the sequence data and the process of moving the backup pins are executed in that order, which allows the production of the next type of board to start earlier on the upstream mounting stage.

[0024] (6) In the component mounting device described in any one of (1) to (5) above, the control unit may independently execute a control program that controls the mounting of the component for each pair of the mounting stage and the mounting unit associated with that mounting stage.

[0025] According to the component mounting device described in (6) above, by executing a control program for each pair of a mounting stage and a mounting unit, it is possible to control multiple pairs of mounting stages and mounting units as if multiple component mounting devices were lined up in series. This type of control makes it easy to execute the product type change process independently for each mounting stage, which makes it easier to complete the product type change of the upstream mounting stage earlier than when the control program is not independent for each mounting stage.

[0026] (7) A product type switching method according to the present disclosure is a product type switching method in a component mounting device that mounts components on a board, the component mounting device including: a plurality of mounting stages arranged side by side in a transport direction of the board; a plurality of mounting units that are associated with different mounting stages and that mount the components on the board carried into the associated mounting stage; and a control unit, wherein when a mounting stage with another mounting stage located downstream in the transport direction is defined as an upstream mounting stage, the control unit starts a product type switching process for the upstream mounting stage for the last board produced of one type of the board, when mounting of the components on the upstream mounting stage is completed, without waiting for mounting of the components on the downstream mounting stage to be completed.

[0027] According to the product type switching method described in (7) above, in a component mounting device having a plurality of mounting stages arranged side by side in the conveying direction of the board, after the production of one type of board is completed on the upstream mounting stage, the production of the next type of board can be started early on the upstream mounting stage.

[0028] [Details of the Embodiments of the Present Disclosure] Details of the embodiments of the present disclosure are described below. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. The embodiments of the present disclosure can be realized in various forms, such as an apparatus, a system, a method, a computer program for implementing the functions of these apparatus, systems, or methods, and a recording medium on which the computer program is recorded.

[0029] <Embodiment 1> Embodiment 1 will be described with reference to Figures 1 to 10. In the following description, the left-right direction shown in Figure 1 is referred to as the X direction, the front-rear direction as the Y direction, and the up-down direction shown in Figure 2 as the Z axis direction. In addition, in the following description, the right side shown in Figure 1 is referred to as the upstream side, and the left side as the downstream side. In the following description, the reference numerals in the drawings may be omitted for the same components, with some exceptions.

[0030] (1) Configuration of the Component Mounting Apparatus The configuration of a component mounting apparatus 1 according to the first embodiment will be described with reference to Fig. 1. The component mounting apparatus 1 is an apparatus that mounts components E, such as electronic components, on a substrate P on which a circuit pattern is printed. The component mounting apparatus 1 is equipped with two mounting stages 30 (30A and 30B), which are arranged side by side in the transport direction of the substrate P (here, the X direction). Such a component mounting apparatus 1 is sometimes referred to as a dual-stage component mounting apparatus 1.

[0031] The component mounting apparatus 1 includes a base 10, four component supply devices 20, two mounting stages 30 (30A, 30B), two mounting units 40, a control unit 50 (see FIG. 4), an operation panel 60 (see FIG. 4), and the like.

[0032] The base 10 has a rectangular shape in a plan view. The four component supply devices 20 are arranged in four locations, two on each side of the base 10 in the Y direction, side by side in the X direction. In Figure 1, a tape component supply device is shown as the component supply device 20. The tape component supply device has multiple feeders 61 attached to it, aligned horizontally in the X direction. Each feeder 61 is a so-called tape feeder, and includes a reel around which a component tape containing multiple components E is wound, and an electric tape feeding device that unwinds the component tape from the reel, and supplies the components E one by one.

[0033] The component supply device 20 is not limited to a tape component supply device and may be, for example, a tray component supply device that supplies trays on which components E are placed. The number of component supply devices 20 is not limited to four and can be determined as appropriate. Two mounting stages 30 (30A, 30B) are arranged side by side in the transport direction (left-right direction) of the substrate P. The upstream mounting stage 30A (on the right side in FIG. 1 ) is an example of a mounting stage in which another mounting stage exists downstream in the transport direction. The mounting stage 30 includes a standby conveyor 31, a transport conveyor 32 (an example of a transport unit), a belt spacing change mechanism (an example of a change mechanism) not shown, a backup mechanism 33 (see FIG. 2 ), and a stage movement mechanism not shown. The upstream mounting stage 30A has a standby conveyor 31 arranged upstream of the transport conveyor 32, and the downstream mounting stage 30B has a standby conveyor 31 arranged downstream of the transport conveyor 32. The following description will be given using the upstream mounting stage 30A as an example.

[0034] The standby conveyor 31 is a conveyor on which the substrate P that has been carried out from the upstream device (in the case of the downstream standby conveyor 31, the downstream mounting stage 30B) waits. The standby conveyor 31 has two conveyor belts 31A that are driven to circulate in the X direction, and a conveyor drive motor that drives these conveyor belts 31A. At least one of the two conveyor belts 31A is movable in the Y direction. The standby conveyor 31 does not necessarily have to be provided. In that case, the transport conveyor 32 is extended upstream to receive the substrate P from the upstream device.

[0035] The transport conveyor 32 transports the board P transported from the standby conveyor 31 (or the transport conveyor 32 of the upstream mounting stage 30A in the case of the downstream mounting stage 30B) to a work position on the mounting stage 30, and transports the board P on which components E have been mounted at the work position downstream. The transport conveyor 32 has two conveyor belts 32A that are driven to circulate in the X direction, and a conveyor drive motor 32B (see FIG. 4) that drives the conveyor belts 32A. At least one of the two conveyor belts 32A is movable in the Y direction.

[0036] The belt spacing change mechanism is a mechanism that changes the spacing between the two conveyor belts 32A by moving at least one conveyor belt 32A of the transport conveyor 32 in the Y direction. The belt spacing change mechanism has a motor for moving the conveyor belt 32A in the Y direction, and a conversion mechanism that converts the rotation of the motor into movement of the conveyor belt in the Y direction. The belt spacing change mechanism according to the first embodiment also changes the spacing of at least one conveyor belt 31A of the standby conveyor 31.

[0037] The backup mechanism 33 (see FIG. 2) is disposed below the transport conveyor 32. The backup mechanism 33 is a mechanism that backs up, from below, the substrate P that has been carried into the work position by the transport conveyor 32. The backup mechanism 33 will be described later. The stage movement mechanism is a mechanism that moves the transport conveyor 32 and the backup mechanism 33 in the Y direction while maintaining the gap between the two conveyor belts 32A of the transport conveyor 32. The stage movement mechanism has a motor for moving the transport conveyor 32 and the backup mechanism 33 in the Y direction, and a conversion mechanism that converts the rotation of the motor into movement of the transport conveyor 32 and the backup mechanism 33 in the Y direction, etc. The stage movement mechanism does not necessarily have to be provided.

[0038] The mounting section 40 (40A and 40B) includes a head unit 70, a head moving section 71, a component imaging camera 72, and a board imaging camera 73. The head unit 70 includes a plurality of (here, five) mounting heads 70A that pick up and release components E. The head unit 70 will be described later.

[0039] The head moving section 71 moves the head unit 70 in the X and Y directions within a predetermined movable range. The head moving section 71 includes a beam 71A that supports the head unit 70 so that it can move back and forth in the X direction, a pair of Y-axis guide rails 71B that support the beam 71A so that it can move back and forth in the Y direction, an X-axis motor 71C (see FIG. 4) that moves the head unit 70 back and forth in the X direction, and a Y-axis motor 71D (see FIG. 4) that moves the beam 71A back and forth in the Y direction. The pair of Y-axis guide rails 71B are shared by the two mounting sections 40.

[0040] The component imaging camera 72 is provided between two component supply devices 20 lined up in the X direction. The component imaging camera 72 is provided on the base 10, and images the component E sucked onto the mounting head 70A from below. The board imaging camera 73 is provided on the head unit 70, and moves together with the head unit 70. The board imaging camera 73 is used to capture images of fiducial marks affixed to the board P. The board imaging camera 73 is also used to determine whether the mounting position and mounting angle of the component E mounted on the board P are good or bad.

[0041] The two mounting units 40 are associated with different mounting stages 30, and mount components E on a substrate P carried into the associated mounting stage 30. In the first embodiment, the front mounting unit 40 is associated with the upstream mounting stage 30A, and the rear mounting unit 40 is associated with the downstream mounting stage 30B. The rear mounting unit 40 may be associated with the upstream mounting stage 30A, and the front mounting unit 40 may be associated with the downstream mounting stage 30B.

[0042] In addition, the component mounting apparatus 1 also includes a nozzle station (not shown). The nozzle station is a mechanism for automatically replacing the suction nozzles 70C (see FIG. 2) attached to the mounting head 70A. The nozzle station stores a plurality of suction nozzles 70C.

[0043] 2, the head unit 70 according to the first embodiment is a so-called in-line type, in which a plurality of mounting heads 70A are arranged side by side in the X direction. The head unit 70 is provided with a Z-axis motor 70D (see FIG. 4) that individually raises and lowers these mounting heads 70A, an R-axis motor 70E (see FIG. 4) that simultaneously rotates these mounting heads 70A around their axes, and the like.

[0044] Each mounting head 70A is used to pick up and release components E, and has a cylindrical nozzle shaft 70B and a suction nozzle 70C that is detachably attached to the lower end of the nozzle shaft 70B. Negative and positive pressures are supplied to the suction nozzle 70C from an air supply device (not shown) via the nozzle shaft 70B. The suction nozzle 70C picks up components E when negative pressure is supplied, and releases the components E when positive pressure is supplied.

[0045] Here, an in-line type head unit 70 has been described as an example of the head unit 70, but the head unit 70 may also be, for example, a so-called rotary head in which a plurality of mounting heads 70A are arranged on the circumference.

[0046] (1-2) Backup Mechanism As shown in Figure 2, the backup mechanism 33 includes a plurality of backup pins 33A that support the substrate P from below, an upper plate 33B (an example of a backup plate) on which the backup pins 33A are erected, a lower plate 33C that is disposed below the upper plate 33B, and an elevating mechanism 33D that raises and lowers the lower plate 33C. The backup mechanism 33 also includes a mechanism that positions the substrate P at the work position and a mechanism that holds down the edges of the substrate P on both sides in the X direction from above, but a description of these mechanisms will be omitted here. The backup mechanism 33 does not have to include the lower plate 33C.

[0047] 3, a plurality of through holes 33E in which backup pins 33A are erected are formed in a matrix on the upper plate 33B. The arrangement of the backup pins 33A is changed depending on the type of substrate P. As will be described in detail later, the arrangement of the backup pins 33A is changed using a head unit 70 and a head movement unit 71.

[0048] (2) Electrical Configuration of the Component Mounting Device As shown in Fig. 4, the component mounting device 1 includes a control unit 50 and an operation panel 60. The control unit 50 includes an arithmetic processing unit 50A, a motor control unit 50B, a memory unit 50C, an image processing unit 50D, an external input / output unit 50E, a feeder communication unit 50F, a communication unit 50G, and the like.

[0049] The arithmetic processing unit 50A includes a CPU, ROM, RAM (an example of a main storage device), etc., and executes a control program stored in the ROM to control each unit of the component mounting apparatus 1. Under the control of the arithmetic processing unit 50A, the motor control unit 50B controls the operation, stopping, and rotation speed of each motor, such as the X-axis motor 71C, the Y-axis motor 71D, the Z-axis motor 70D, and the R-axis motor 70E.

[0050] The memory unit 50C is an auxiliary storage device having a nonvolatile rewritable storage medium such as a hard disk or flash memory. The memory unit 50C stores control programs executed by the control unit 50 and various data. The image processing unit 50D receives image data transmitted from the component imaging camera 72 and the board imaging camera 73 and stores the received image data in the RAM of the arithmetic processing unit 50A. The external input / output unit 50E is a so-called interface, and is configured to receive detection signals output from various sensors 81 provided in the main body of the component mounting apparatus 1. The external input / output unit 50E is also configured to control the operation of various actuators 82 based on control signals output from the arithmetic processing unit 50A. The various actuators 82 include an air supply device, a mounting stage 30, and the like.

[0051] The feeder communication unit 50F is connected to the feeder 61 and controls the feeder 61 in an integrated manner. The communication unit 50G is a communication circuit that enables the control unit 50 to communicate with other devices (for example, an external control device that manages the production of the board P) via a communication network. The operation panel 60 is equipped with a display unit such as a liquid crystal display and an input unit such as a touch panel or keyboard. An operator can operate the operation panel 60 to make various settings and give instructions for operations to the component mounting device 1.

[0052] (3) Board Production Data The board production data used in the production of boards will be explained. The board production data includes board data, backup pin data, and a mounting program, which will be explained next. Board production data is created for each type of board P. In the case of a mounting line in which multiple component mounting devices are arranged in a row, a mounting program is created for each type of board P and for each component mounting device. As will be explained in more detail later, in the component mounting device 1, a mounting program is created for each mounting stage 30. Each piece of data will be explained below.

[0053] The board data is data that includes information such as the shape and size of the board P. The backup pin data is data that includes information such as the number of backup pins 33A and the erect positions of the backup pins 33A. The mounting program is data that is made up of multiple pieces of sequence data. Here, a sequence is defined as one round trip operation in which a component E supplied by the component supply device 20 is picked up by the suction nozzle 70C and mounted on the board P, and data that represents a sequence is defined as sequence data.

[0054] A conventional mounting program will be described with reference to Fig. 5. A conventional mounting program includes the mounting order of components E, mounting coordinates, component ID, sequence number, mounting stage number, etc. The sequence is defined by the sequence number. Data with the same sequence number constitutes one sequence data. If there are five mounting heads 70A, the maximum number of components E that can be mounted on the board P in one sequence is five.

[0055] The mounting stage number is information unique to the dual-stage component mounting apparatus 1, and the number of the mounting stage 30 that executes the sequence is set. Here, the upstream mounting stage 30A is numbered 1, and the downstream mounting stage 30B is numbered 2. As shown in Fig. 5 above, conventionally, there is one mounting program for one component mounting apparatus 1, and the sequence data for the sequence executed by the upstream mounting stage 30A and the sequence data for the sequence executed by the downstream mounting stage 30B are included in one mounting program.

[0056] The mounting program according to the first embodiment will be described with reference to Fig. 6. The mounting program according to the first embodiment is a conventional mounting program divided into a mounting program for the upstream mounting stage 30A (upstream mounting program) and a mounting program for the downstream mounting stage 30B (downstream mounting program). Which mounting stage 30 the mounting program is for can be determined from the mounting stage number. If it is possible to identify whether it is an upstream mounting program or a downstream mounting program from information added to the mounting program, the mounting program does not need to include a mounting stage number.

[0057] The above-mentioned board production data (board data, backup pin data, and mounting program) is registered in an external database. The component mounting device 1 acquires board production data corresponding to the type of board P to be produced from the database and reads it into a memory area reserved in RAM. The board production data may be acquired from an external database and stored in the memory unit 50C. The control unit 50 may then read the board production data stored in the memory unit 50C into RAM.

[0058] (4) Mounting Control The following describes mounting control executed by the control unit 50. Mounting control is performed by the control unit 50, which executes a control program. Mounting control includes various types of control, but here we will explain the following four types (a) to (d) as examples.

[0059] (a) Component Mounting Control Component mounting control is control for mounting components E on the board P based on board production data. Specifically, component mounting control includes the following controls. Suction Control Suction control is control of the operation of suctioning components E supplied by the component supply device 20 with the suction nozzle 70C. Recognition Control Recognition control is control for capturing images of the components E and the board P using various cameras such as the component imaging camera 72 and the board imaging camera 73, recognizing the position and angle of the board P, determining whether the component shape is good or bad, and determining whether the mounting position and mounting angle of the component E are good or bad. Placement Control Placement control is control for the operation of mounting the component E picked up by the suction nozzle 70C at the mounting position on the board P. Disposal Control Disposal control is control for disposing of components E whose shape is determined to be bad in the recognition control into a disposal box (not shown) provided in the component mounting device 1.

[0060] (b) Control for Changing the Position of Backup Pins Control for changing the position of backup pins 33A is control for changing the position of backup pins 33A to the position indicated by the backup pin data. The nozzle station also stores a dedicated suction nozzle 70C for suctioning the backup pins 33A. The control unit 50 controls the head unit 70 and the head moving unit 71 to attach the dedicated suction nozzle 70C to the mounting head 70A. The control unit 50 then uses the suction nozzle 70C to suction the backup pins 33A erected on the upper plate 33B, and moves the picked-up backup pins 33A to an erect position appropriate for the type of board P being produced. This changes the position of the backup pins 33A. Changing the position of the backup pins 33A is sometimes referred to as changing the setup of the backup pins 33A.

[0061] (c) Control of change of the gap between the two conveyor belts Control of change of the gap between the two conveyor belts is control that controls the belt gap change mechanism described above to change the gap between the two conveyor belts 32A in accordance with the size of the substrate P to be produced. Changing the gap between the two conveyor belts 32A is sometimes referred to as changing the setup of the conveyor belts 32A.

[0062] (d) Transport control of substrate The transport control of the substrate P is a control to control the transport conveyor 32 to transport the substrate P that has been transported from the upstream device (the upstream mounting stage 30A in the case of the downstream mounting stage 30B) into a working position on the mounting stage 30A, and a control to transport the substrate P that has completed mounting to the downstream mounting stage 30B (the downstream device in the case of the downstream mounting stage 30B).

[0063] (5) Differences Between Conventional Mounting Control and Mounting Control According to the First Embodiment The differences between conventional mounting control and mounting control according to the first embodiment will be conceptually described with reference to FIG.

[0064] Conventionally, one control program was executed per component mounting apparatus 1. As described above, conventionally, one mounting program was also executed per component mounting apparatus 1. One storage area into which the mounting program was loaded was reserved in the RAM, and one mounting program was loaded into that storage area. The single control program then performed mounting control of the upstream mounting stage 30A and mounting control of the downstream mounting stage 30B based on the mounting program loaded into the storage area.

[0065] In contrast, in the mounting control according to the first embodiment, there are two control programs: a control program for controlling mounting on the upstream mounting stage 30A (a control program for the upstream side), and a control program for controlling mounting on the downstream mounting stage 30B (a control program for the downstream side), and these control programs are executed in a multitasking manner.

[0066] As described above, the implementation program according to the first embodiment is divided into an implementation program for the upstream side and an implementation program for the downstream side. The upstream control program and the downstream control program secure independent storage areas on RAM into which the implementation programs are loaded. In the following description, the storage area into which the upstream implementation program is loaded is referred to as the upstream storage area, and the storage area into which the downstream implementation program is loaded is referred to as the downstream storage area.

[0067] The control program for the upstream side reads the mounting program for the upstream side into the storage area for the upstream side and controls the mounting of the upstream mounting stage 30A, and the control program for the downstream side reads the mounting program for the downstream side into the storage area for the downstream side and controls the mounting of the downstream mounting stage 30B.

[0068] The upstream control program and the downstream control program operate in conjunction with each other. For example, when the downstream control program has finished mounting components E on one board P and unloaded the board P onto the downstream standby conveyor 31, it requests the upstream control program for the next board P. Upon receiving this request, the upstream control program unloads the board P on which components E have been mounted on the upstream mounting stage 30A to the downstream mounting stage 30B.

[0069] (6) Product Type Switching As described above, two control programs are executed in the component mounting apparatus 1. That is, in the component mounting apparatus 1, the above-described mounting control is performed independently for each mounting stage 30. Therefore, the component mounting apparatus 1 can control the upstream mounting stage 30A and the downstream mounting stage 30B as if two component mounting apparatuses 1 were arranged in series.

[0070] Controlling the upstream mounting stage 30A and the downstream mounting stage 30B in this manner makes it easier to complete product type switching for the upstream mounting stage 30A earlier than when control programs are not independent for each mounting stage 30. Product type switching according to the first embodiment will be described below in comparison with conventional product type switching. In the following description, the processes (product type switching processes) executed by the control unit 50 during product type switching will be described using, as examples, a process for switching mounting programs, a process for changing the spacing between two conveyor belts, and a process for changing the arrangement of backup pins.

[0071] Conventional product type switching will be described with reference to Fig. 8. At time T1, components E are mounted on the last two boards P of product type A. In the example shown in Fig. 8, the device upstream of component mounting device 1 is in a state where it can transport the first board P of the next product type B to component mounting device 1, and the first board P of product type B is waiting at the exit of the upstream device.

[0072] At time T2, mounting of components E has been completed on the two mounting stages 30 of the component mounting device 1, and the two boards P are being transported downstream. At time T3, components E have been mounted on the last board P of type A on the downstream mounting stage 30B. At time T3, production of board P of type A has been completed on the upstream mounting stage 30A, but because component E is being mounted on the downstream mounting stage 30B, product change cannot be started.

[0073] At time T4, the downstream mounting stage 30B has finished mounting components E on the last board P of type A, and the last board P of type A is being transported to the downstream device. At time T4, the downstream mounting stage 30B is currently transporting the board P of type A, so the upstream mounting stage 30A cannot start switching types. At time T5, the board P of type A is transported from the downstream mounting stage 30B, and type switching is performed between the upstream mounting stage 30A and the downstream mounting stage 30B. Specifically, at time T5, the mounting program for the board P of type B is loaded into the memory area.

[0074] Product type switching is also performed at time T6. At time T6, after loading of the mounting program is completed, the arrangement of the backup pins 33A is changed. Product type switching is also performed at time T7. At time T7, after changing the arrangement of the backup pins 33A is completed, the spacing between the two conveyor belts 32A is changed. Time T8 is the time when product type switching is completed. The product type B board P that has been waiting at the exit of the upstream device is carried out to the component mounting device 1 at time T8.

[0075] 9, a description will be given of product type switching in embodiment 1. In product type switching in embodiment 1, when mounting of components E on the upstream mounting stage 30A is completed for the last-produced board P of one product type (product type A in this case), the control program starts product type switching processing on the upstream mounting stage 30A without waiting for mounting of components E on the downstream mounting stage 30B to be completed.

[0076] The explanation of points T1 and T2 is omitted as they are the same as in the conventional method. At point T3, component E is mounted on the last board P of type A on the downstream mounting stage 30B. At point T3, type switching begins on the upstream mounting stage 30A. Specifically, at point T3, the upstream mounting program for board P of type B is loaded into the upstream storage area.

[0077] At time T4, components E are still being mounted on the last board P of type A on the downstream mounting stage 30B. At time T4, the upstream mounting stage 30A has finished loading the mounting program, and the arrangement of the backup pins 33A is being changed. At time T5, the downstream mounting stage 30B has finished mounting components E on the last board P of type A, and the last board P of type A is being carried out to the downstream device. At time T5, the upstream mounting stage 30A has finished changing the arrangement of the backup pins 33A, and the distance between the two conveyor belts 32A is being changed.

[0078] At time T6, the downstream mounting stage 30 is loading the downstream mounting program. At time T6, the product type change at the upstream mounting stage 30A is completed, and the first board P of product type B, which had been waiting at the exit of the upstream device, begins to be carried in. At time T7, the downstream mounting stage 30B is changing the arrangement of the backup pins 33A and changing the spacing between the two conveyor belts 32A. At the upstream mounting stage 30A, components E are being mounted on the first board P of product type B. At time T8, the product type change at the downstream mounting stage 30B is completed, and the first board P of product type B, on which components E have been mounted at the upstream mounting stage 30A, is carried out to the downstream mounting stage 30B.

[0079] 8 and 9 described above, whereas in the conventional method, product type changeover on the upstream mounting stage 30A starts at time T5, in the first embodiment, it starts at time T3. Therefore, product type changeover on the upstream mounting stage 30A finishes earlier than in the conventional method. This allows production of the next product type B board P to start earlier on the upstream mounting stage 30A.

[0080] 9 described above is an example, and the timing at which each process is executed may differ from the timing shown in Fig. 9. For example, mounting of component E onto the last board P of type A on the downstream mounting stage 30B and mounting of component E onto the first board P of type B on the upstream mounting stage 30A may be performed simultaneously. Alternatively, type switching on the upstream mounting stage 30A may be completed some time after mounting of component E onto the last board P of type A on the downstream mounting stage 30B is completed.

[0081] (7) Product Type Switching Process The product type switching process according to the first embodiment will be described with reference to FIG. 10 . The product type switching process is executed by the control unit 50, which executes a control program. This process is initiated when production of one product type of board P is completed on one mounting stage 30. In the case of the upstream mounting stage 30A, this process is initiated before mounting of components E on the downstream mounting stage 30B is completed (time T3 shown in FIG. 9 ). The product type switching process for the upstream mounting stage 30A and the product type switching process for the downstream mounting stage 30B are substantially the same, so the upstream mounting stage 30A will be used as an example for description here. The upstream mounting stage 30A is an example of a mounting stage that is subject to the product type switching process.

[0082] In S101, the control unit 50 obtains from the database a mounting program for the upstream side of the next type of board P to be produced, and loads it into the upstream storage area. S101 is an example of a process for loading sequence data into a storage area. In S102, the control unit 50 performs a data check of the loaded mounting program. The data check is a process for checking whether there are any errors in the loaded mounting program. For example, it is checked whether all necessary information is included in the mounting program.

[0083] In S103, the control unit 50 checks the component setup. The component setup check is a process of checking whether the component tape containing the components E to be mounted on the next type of board P to be produced is set in the component supply device 20. In S104, the control unit 50 reads the backup pin data for the next type of board P to be produced.

[0084] In S105, the control unit 50 maximizes the gap between the two conveyor belts 32A. In S106, the control unit 50 changes the position of the backup pins 33A. S105 and S106 are an example of a process for moving the backup pins to positions appropriate for the type of board after switching.

[0085] In S107, control unit 50 changes the distance between two conveyor belts 32A to a distance that corresponds to the type of board P to be produced next. S107 is an example of processing that changes the distance between two conveyor belts to a distance that corresponds to the type of board P after switching.

[0086] (8) Effects of the Embodiment In the component mounting apparatus 1 according to the first embodiment, when mounting of components E on the upstream mounting stage 30A is completed for the last board P of one type to be produced, the type switching process for the upstream mounting stage 30A is started without waiting for mounting of components E on the downstream mounting stage 30B to be completed. Therefore, compared to starting the type switching process after mounting of components E on the downstream mounting stage 30B is completed, the upstream mounting stage 30A can start production of the next type of board earlier. Therefore, according to the component mounting apparatus 1, in a component mounting apparatus 1 including multiple mounting stages 30 arranged side by side in the transport direction of the board P, after production of one type of board P is completed on the upstream mounting stage 30A, production of the next type of board P can be started earlier on the upstream mounting stage 30A.

[0087] According to the component mounting apparatus 1, an independent storage area is secured for each mounting stage 30, so that before the mounting of component E is completed on the downstream mounting stage 30B, it is possible to start processing to read the mounting program (sequence data) for producing the new variety, which is to be executed on the upstream mounting stage 30A, into the upstream storage area. Therefore, according to the component mounting apparatus 1, it is possible to start production of the next variety of board P on the upstream mounting stage 30A earlier than when the loading of the mounting program for the upstream mounting stage 30A is started after the mounting of component E on the downstream mounting stage 30B is completed.

[0088] According to the component mounting device 1, it is possible to start changing the interval between the two conveyor belts 32A on the upstream mounting stage 30A without waiting for the completion of mounting of the component E on the downstream mounting stage 30B, so that production of the next type of board P can be started early on the upstream mounting stage 30A.

[0089] According to the component mounting device 1, it is possible to start changing the arrangement of the backup pins 33A on the upstream mounting stage 30A without waiting for the completion of mounting of the component E on the downstream mounting stage 30B, so that production of the next type of substrate P can be started early on the upstream mounting stage 30A.

[0090] According to the component mounting apparatus 1, by executing a control program for each pair of a mounting stage 30 and a mounting unit 40, it is possible to control the multiple pairs of mounting stages 30 and mounting units 40 as if they were arranged in series. This type of control allows the product type switching process to be executed independently for each mounting stage 30, making it easier to complete the product type switching of the upstream mounting stage 30A earlier than when the control program is not independent for each mounting stage 30.

[0091] Second Embodiment A second embodiment will be described with reference to Fig. 11. As shown in Fig. 11, in the product type switching process according to the second embodiment, switching of the mounting program (S101 to S103) and changing of the backup pin arrangement (S104 to S106) are executed in parallel.

[0092] With the component mounting apparatus 1 according to the second embodiment, the product type change process for the upstream mounting stage 30A is completed earlier than when the loading of the mounting program (sequence data) and the changing of the arrangement of the backup pins 33A are executed in sequence, and therefore the production of the next product type of board P can be started earlier on the upstream mounting stage 30A.

[0093] <Other Embodiments> The technology disclosed in this specification is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed in this specification.

[0094] (1) In the above embodiment, the product type change was described using examples of switching the mounting program, changing the spacing between the two conveyor belts 32A, and changing the arrangement of the backup pins 33A. However, the product type change is not limited to these examples and can be determined appropriately as needed. Product type change does not necessarily involve switching the mounting program, changing the spacing between the two conveyor belts 32A, and changing the arrangement of the backup pins 33A. For example, if changing the spacing between the two conveyor belts 32A is not necessary, changing the spacing between the two conveyor belts 32A may be excluded from the product type change. Alternatively, if changing the arrangement of the backup pins 33A is not necessary in single-sided mounting, changing the arrangement of the backup pins 33A may be excluded from the product type change.

[0095] (2) In the first embodiment described above, an example was given in which the mounting program is divided into an upstream mounting program and a downstream mounting program in advance. However, as in the past, sequence data for a sequence executed by the upstream mounting stage 30A and sequence data for a sequence executed by the downstream mounting stage 30B may be included in a single mounting program. In this case, of the sequence data included in the mounting program, the sequence data for the sequence executed by the upstream mounting stage 30A is loaded into the upstream storage area, and the sequence data for the sequence executed by the downstream mounting stage 30B is loaded into the downstream storage area.

[0096] (3) In the above embodiment, a storage area for an upstream mounting stage and a storage area for a downstream mounting stage are allocated in one RAM, but a RAM for the upstream mounting stage and a RAM for the downstream mounting stage may be provided separately. The mounting program for the upstream mounting stage may be loaded into the storage area allocated in the RAM for the upstream mounting stage, and the mounting program for the downstream mounting stage may be loaded into the storage area allocated in the RAM for the downstream mounting stage.

[0097] (4) In the above embodiment, the component mounting apparatus 1 includes two mounting stages 30, but the number of mounting stages 30 may be three or more.

[0098] (5) In the above-described second embodiment, the product type switching process shown in Fig. 11 is performed by a component mounting apparatus 1 having two mounting stages 30. However, the product type switching process shown in Fig. 11 can also be applied to a component mounting apparatus having only one mounting stage 30.

[0099] (6) In the above embodiment, the arrangement of the backup pins 33A is changed by the head unit 70 and the head moving unit 71. However, the arrangement of the backup pins 33A may be changed manually by an operator.

[0100] (7) In the above embodiment, an example was given of a case where a control program is executed for each mounting stage 30. However, only one control program may be provided for each component mounting apparatus 1. Furthermore, one control program may control a pair of an upstream mounting stage 30A and a mounting unit 40 and a pair of a downstream mounting stage 30A and a mounting unit 40.

[0101] 1: Component mounting device 30: Mounting stage 30A: Upstream mounting stage 30B: Downstream mounting stage 32: Transport conveyor (an example of a transport section) 32A: Conveyor belt 33A: Backup pin 33B: Upper plate (an example of a backup plate) 40: Mounting section 50: Control section

Claims

1. A component mounting device that mounts components on a board, comprising: a plurality of mounting stages arranged side by side in a transport direction of the board; a plurality of mounting units that are associated with different mounting stages and that mount the components on the board carried into the associated mounting stage; and a control unit, wherein when a mounting stage with another mounting stage located downstream in the transport direction is defined as an upstream mounting stage, the control unit, for the last board to be produced of one variety of the board, when mounting of the components on the upstream mounting stage is completed, starts a product type change process for the upstream mounting stage without waiting for mounting of the components on the downstream mounting stage to be completed.

2. A component mounting device as defined in claim 1, wherein, when a sequence is defined as one round trip operation in which the mounting unit mounts the components supplied by the component supply device onto the board, and data representing the sequence is defined as sequence data, the control unit independently reserves a memory area in a main memory device provided in the control unit for each mounting stage into which sequence data is read, and the product type switching process includes a process of reading the sequence data of the sequence executed in the mounting stage that is the target of the product type switching process into the memory area for that mounting stage.

3. A component mounting device as set forth in claim 1 or claim 2, wherein the mounting stage has a transport section that transports the board in the transport direction, the transport section having two conveyor belts arranged parallel to each other, and a change mechanism that changes the distance between the two conveyor belts, and the product type switching process includes a process in which the change mechanism changes the distance between the two conveyor belts of the mounting stage that is the target of the product type switching process to a distance that corresponds to the product type of the board after switching.

4. A component mounting device according to claim 1 or claim 2, wherein the mounting stage has a plurality of backup pins that support the board from below, and a backup plate on which the backup pins are erected, and the product type switching process includes a process of moving the backup pins of the mounting stage that is the target of the product type switching process to a position corresponding to the product type of the board after switching, by the mounting unit associated with that mounting stage.

5. A component mounting device according to claim 2, wherein the mounting stage has a plurality of backup pins that support the board from below, and a backup plate on which the backup pins are erected, and the product type switching process includes a process of moving the backup pins of the mounting stage that is the target of the product type switching process, by the mounting unit associated with that mounting stage, to positions according to the product type of the board after switching, and the control unit executes the process of reading sequence data and the process of moving the backup pins in parallel.

6. A component mounting device according to claim 1 or 2, wherein the control unit independently executes a control program for controlling the mounting of the components for each pair of the mounting stage and the mounting unit associated with that mounting stage.

7. A product type switching method in a component mounting device that mounts components on a board, the component mounting device comprising: a plurality of mounting stages arranged side by side in a transport direction of the board; a plurality of mounting units that are associated with different mounting stages and that mount the components on the board carried into the associated mounting stage; and a control unit, wherein when a mounting stage with another mounting stage located downstream in the transport direction is defined as an upstream mounting stage, the product type switching method comprises the control unit starting product type switching processing for the upstream mounting stage for the last board produced of one product type of the board, when mounting of the components on the upstream mounting stage is completed, without waiting for mounting of the components on the downstream mounting stage to be completed.

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