Insulation film and window structure

Abstract

An insulation film according to embodiments of the present invention includes a unit cell formed by arranging a plurality of sub-unit cells, wherein a sub-unit cell includes: conductive patterns having different shapes; and a separation part for separating the conductive patterns from each other. Sub-unit cells disposed adjacent to each other among the plurality of sub-unit cells have shapes symmetrical to each other.

Description

Insulating films and window structures

[0001] The present invention relates to an insulating film and a window structure. More particularly, it relates to an insulating film and a window structure comprising a plurality of patterns.

[0002]

[0003] Recently, to improve heating and cooling efficiency and energy efficiency, low-emissivity (L-E) glass with high insulation properties has been used in building exterior walls, windows, and vehicle windows. However, because low-E glass contains a metallic coating formed on the glass surface, it can hinder and block the movement of radio waves, increasing radio wave loss.

[0004] For example, as the information society develops, wireless communication technologies such as Wi-Fi and Bluetooth are being applied or built into display devices, electronic devices, buildings, the Internet of Things (IoT), and autonomous vehicles. Furthermore, with the recent advancement of mobile communication technology, antennas for high-frequency and ultra-high-frequency communication are being widely applied. For example, along with Wi-Fi, which operates in bands such as 2.4 GHz and 5 GHz, and Bluetooth, which operates in the 2.45 GHz band, 5G (5th-generation) communication systems, which operate in high-frequency bands (e.g., 28 GHz or higher), are being commercialized.

[0005] However, electromagnetic waves in the high-frequency or ultra-high-frequency bands have high transmission speeds and short wavelengths, and can be lost, attenuated, or dissipated when passing through windows or car glass. Consequently, the antenna's signal efficiency and coverage may be reduced. Installing or forming an electromagnetic wave-transmitting area in low-E glass to compensate for signal loss may also reduce insulation.

[0006] Therefore, there is a need to design an insulating film that ensures thermal insulation while suppressing the loss of electromagnetic waves emitted from antennas, radars, etc. For example, Korean Patent Publication No. 10-2013-0048132 discloses an insulating film, but does not consider electromagnetic wave transmittance.

[0007]

[0008] One object of the present invention is to provide an insulating film having improved radio wave transmittance and insulating properties.

[0009] An object of the present invention is to provide a window structure having improved radio wave transmittance and thermal insulation.

[0010]

[0011] 1. It includes a unit cell formed by arranging multiple sub-unit cells,

[0012] The above sub-unit cell includes conductive patterns having different shapes and a separator that separates the conductive patterns from each other,

[0013] An insulating film, wherein sub-unit cells arranged adjacent to each other among the plurality of sub-unit cells have shapes that are symmetrical to each other.

[0014] 2. An insulating film in the above 1, wherein the conductive patterns have an island pattern shape physically spaced apart from each other within the sub-unit cell.

[0015] 3. An insulating film in the above 1, wherein the sub-unit cell includes three or more of the conductive patterns, and the same pattern shape is not repeated within the sub-unit cell.

[0016] 4. In the above 1, the unit cell includes a first sub-unit cell and a second sub-unit cell arranged in the row direction,

[0017] An insulating film wherein the second sub-unit cell has a shape in which the first sub-unit cell is flipped along the row direction.

[0018] 5. In the above 4, the insulating film further includes a third sub-unit cell arranged in the column direction with respect to the first sub-unit cell, and a fourth sub-unit cell arranged in the column direction with respect to the second sub-unit cell.

[0019] 6. In the above 5, the third sub-unit cell and the fourth sub-unit cell are insulating films in which the first sub-unit cell and the second sub-unit cell have a shape flipped along the thermal direction, respectively.

[0020] 7. In the above 5, the third sub-unit cell and the fourth sub-unit cell are adjacent in the row direction,

[0021] An insulating film wherein the fourth sub-unit cell has a shape in which the third sub-unit cell is flipped along the row direction.

[0022] 8. In the above 1, the unit cell is an insulating film including isolated patterns formed by connecting a pair of conductive patterns included in a pair of adjacent sub-unit cells.

[0023] 9. An insulating film in which four conductive patterns are connected in the central region of the unit cell to form an isolation pattern in the above 8.

[0024] 10. In the above 8, the insulating film is surrounded by a separating portion, wherein the insulating pattern is.

[0025] 11. In the above 8, the length of the conductive patterns and the isolation patterns is 300㎛ or less, an insulating film.

[0026] 12. In the above 1, the sub-unit cells have a square shape, an insulating film.

[0027] 13. In the above 1, the insulating film in which all the separating parts included in the unit cell are connected.

[0028] 14. In the above 1, the insulating film has a square shape.

[0029] 15. In the above 14, the conductive patterns included in one sub-unit cell all have different areas or sizes, an insulating film.

[0030] 16. An insulating film comprising a plurality of unit cells arranged periodically in the above 1.

[0031] 17. In the above 1, an insulating film in which the area of ​​the separation portion is 20% or less of the total area of ​​the unit cell in the plane direction.

[0032] 18. In the above 1, the conductive patterns have a solid structure, an insulating film.

[0033] 19. Lower substrate;

[0034] an upper substrate spaced apart from the lower substrate; and

[0035] A window structure comprising an insulating film according to 1 above, which is disposed on the lower substrate.

[0036]

[0037] An insulating film according to embodiments of the present invention may include an insulating layer formed by arranging a plurality of sub-unit cells. The sub-unit cells may include a plurality of irregularly arranged conductive patterns and separations between the conductive patterns. Accordingly, moiré and light scattering phenomena caused by periodic and regular pattern arrangements can be suppressed.

[0038] Adjacent sub-unit cells can have symmetrical shapes. Accordingly, all conductive patterns within the insulating film can have island shapes, and electromagnetic wave transmission characteristics can be improved.

[0039] The area of ​​the separation portion among the above sub-unit cells can be adjusted within a predetermined range. Accordingly, the thermal resistance and insulation properties of the insulating film can be improved while simultaneously enhancing the electromagnetic wave transmission properties.

[0040]

[0041] FIG. 1 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0042] FIG. 2 is a schematic plan view illustrating a unit cell according to exemplary embodiments.

[0043] FIG. 3 is a schematic plan view illustrating a sub-unit cell according to exemplary embodiments.

[0044] Figure 4 is a schematic plan view illustrating a unit cell according to an example.

[0045] Figure 5 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0046] Figure 6 is a schematic plan view showing a unit cell according to exemplary embodiments.

[0047] Figure 7 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0048] Figure 8 is a schematic cross-sectional view showing an insulating film according to exemplary embodiments.

[0049] FIGS. 9 and 10 are schematic cross-sectional views each showing a window structure according to exemplary embodiments.

[0050] Figure 11 is a graph showing radio wave transmittance according to examples and comparative examples.

[0051] Fig. 12 is a schematic plan view showing an insulating film according to Comparative Example 3.

[0052] Figures 13a to 13c are photographic images of light sources observed through window structures of the embodiments and comparative examples, respectively.

[0053]

[0054]

[0055] Embodiments of the present invention provide an insulating film including a conductive pattern.

[0056] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the contents of the invention described above, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as being limited to the matters described in such drawings.

[0057] The terms “upper”, “lower”, “top surface”, “bottom surface”, etc. used in the present invention indicate the relative positions of each component and do not imply an absolute superior-subordinate relationship.

[0058] FIG. 1 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0059] Referring to FIG. 1, the insulating film may include an insulating layer (105) including conductive patterns (121).

[0060] In some embodiments, the insulating film may further include a substrate layer (100) on which an insulating layer (105) is disposed. The insulating layer (105) may be disposed so as to be in direct contact with the upper surface of the substrate layer (100).

[0061] The substrate layer (100) may include, for example, a resin material. For example, the substrate layer (100) may include a polyester resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate resin; an acrylic resin such as polymethyl (meth)acrylate or polyethyl (meth)acrylate; a styrene resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin resin such as polyethylene, polypropylene, a polyolefin having a cyclo- or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride resin; an amide resin such as nylon or an aromatic polyamide; an imide resin; a polyethersulfone resin; a sulfone resin; a polyetheretherketone resin; a sulfated polyphenylene resin; a vinyl alcohol resin; It may include vinylidene chloride resin; vinyl butyral resin; allylate resin; polyoxymethylene resin; epoxy resin; urethane or acrylic urethane resin; silicone resin, etc. These may be used alone or in combination of two or more.

[0062] In some embodiments, the substrate layer (100) may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0063] The insulating layer (105) may include a plurality of unit cells (UC). For example, the plurality of unit cells (UC) may be arranged periodically adjacent to each other.

[0064] FIG. 2 is a schematic plan view illustrating a unit cell according to exemplary embodiments.

[0065] Referring to FIG. 2, a unit cell (UC) may include a plurality of sub-unit cells (SU).

[0066] For example, a unit cell (UC) may be defined by arranging a plurality of sub-unit cells (SU) adjacent to each other. The sub-unit cells (SU) may be arranged in a row direction and / or a column direction parallel to the upper surface of the substrate layer (100). The row direction (first direction) and the column direction (second direction) may be perpendicular to each other.

[0067] In some embodiments, a unit cell (UC) may include a first sub-unit cell (SU1) and a second sub-unit cell (SU2) arranged adjacently in a first direction.

[0068] In some embodiments, the unit cell (UC) may further include sub-unit cells arranged in the second direction. For example, the unit cell (UC) may include a third sub-unit cell (SU3) arranged adjacent to the first sub-unit cell (SU1) in the second direction, and a fourth sub-unit cell (SU4) arranged adjacent to the second sub-unit cell (SU2) in the second direction.

[0069] Adjacent sub-unit cells (SU) may be arranged so as to be in contact with each other. For example, the edges of adjacent sub-unit cells may contact each other in the planar direction (third direction). No empty space or spaced area may be formed between adjacent sub-unit cells (SU).

[0070] FIG. 3 is a schematic plan view illustrating a sub-unit cell according to exemplary embodiments.

[0071] Referring to FIG. 3, the sub-unit cells (SU) may include a plurality of conductive patterns (121) and a separation portion (125) between the conductive patterns (121).

[0072] Within one sub-unit cell (SU), the conductive patterns (121) may be physically separated from each other. For example, the conductive patterns (121) may have an island pattern shape that is physically separated from each other.

[0073] Accordingly, a separating portion (125) may be formed between the conductive patterns (121) to separate the conductive patterns (121) from each other. For example, the separating portion (125) may define an area between adjacent conductive patterns (121).

[0074] A separation portion (125) is formed between the challenging patterns (121), so that the transmittance of electromagnetic waves can increase.

[0075] For example, as electromagnetic waves pass through a metal layer, absorption or reflection of the waves due to the metal component may increase. Furthermore, in high-frequency or ultra-high-frequency bands such as 4G / 5G, the wavelength of electromagnetic waves is short and diffraction is difficult, which can further increase electromagnetic wave loss.

[0076] According to exemplary embodiments, the separation unit (125) can reduce the extinction and reflection of electromagnetic waves and increase the transmittance. Accordingly, transmission loss and attenuation can be prevented even in high frequency bands, and signal intensity can be increased.

[0077] Within a single sub-unit cell (SU), conductive patterns (121) may have different shapes. For example, a sub-unit cell (SU) may have randomness in which the same pattern shape is not repeated. The fact that the patterns have different shapes means that the shapes, areas, sizes, inclinations, etc. of the patterns are different from each other, so that each pattern is morphologically clearly distinguishable when observed in a planar direction.

[0078] For example, when patterns are arranged in a regular and repetitive manner, interference patterns may appear due to the overlapping of periodic patterns. Furthermore, if adjacent patterns have identical and uniform shapes, optical properties may be distorted and light scattering may increase.

[0079] According to exemplary embodiments, since the sub-unit cells (SU) have randomness in which the same pattern shape is not repeated, the visibility of the pattern is further suppressed and light scattering phenomena such as the Moire phenomenon and starburst can be suppressed.

[0080] Within a single sub-unit cell (SU), conductive patterns (121) may be arranged irregularly. For example, the conductive patterns (121) may not be arranged continuously and periodically along the first and second directions, but may be arranged randomly within the sub-unit cell (SU).

[0081] In some embodiments, the conductive patterns (121) may have a polygonal shape such as a triangle, a square, a rhombus, a parallelogram, a pentagon, or a hexagon.

[0082] In some embodiments, a sub-unit cell (SU) may include three or more conductive patterns (121). Accordingly, the unit cell (UC) may have a desired degree of randomness, thereby further improving optical properties.

[0083] For example, a sub-unit cell (SU) may include 5 or more, 7 or more, or 9 or more conductive patterns (121). For example, a sub-unit cell (SU) may include 20 or fewer, 15 or fewer, or 13 or fewer conductive patterns (121). Within the above range, the randomness of the unit cell (UC) can be appropriately controlled so that both electromagnetic wave transmission characteristics and optical characteristics can be improved.

[0084] Among the sub-unit cells (SU) included in a unit cell (UC), adjacent sub-unit cells (SU) may have symmetrical shapes. For example, adjacent sub-unit cells (SU) may have mirror images of each other.

[0085] For example, the second sub-unit cell (SU2) may have a shape in which the first sub-unit cell (SU1) is flipped along the first direction.

[0086] For example, the third sub-unit cell (SU3) may have a shape in which the first sub-unit cell (SU1) is flipped along the second direction, and the fourth sub-unit cell (SU4) may have a shape in which the second sub-unit cell (SU2) is flipped along the second direction.

[0087] In some embodiments, the third sub-unit cell (SU3) and the fourth sub-unit cell (SU4) may also be adjacent in the first direction, and the fourth sub-unit cell (SU4) may have a shape in which the third sub-unit cell (SU3) is flipped along the first direction.

[0088] As adjacent sub-unit cells (SU) have shapes that are symmetrical to each other, the insulating properties of the insulating film can be improved, and the electromagnetic wave transmitting properties can be further enhanced.

[0089] For example, as the sub-unit cells (SU) are symmetrically adjacent, the separation portions (125) of adjacent sub-unit cells (SU) may be connected to each other. Accordingly, the conductive patterns (121) may have an isolated pattern shape in the form of an island divided by the separation portions (125). The isolated pattern (122) may mean a pattern formed by connecting conductive patterns (121) included in different sub-unit cells (SU) as one body and surrounded by the separation portions (125).

[0090] In some embodiments, a pair of conductive patterns (121) included in a pair of adjacent sub-unit cells (SU) may be connected to each other to form an isolation pattern (122).

[0091] In one embodiment, four conductive patterns (121) may be connected in the central region of a unit cell (UC) to form an isolation pattern (122).

[0092] The thermal transmittance and radio wave transmission loss of the insulating film can be reduced due to the interaction between the conductive patterns (121) and the separating portion (125) that divides the conductive patterns (121).

[0093] However, when adjacent sub-unit cells (SU) are arranged asymmetrically, the conductive patterns (121) may not be connected to each other, and thus an isolation pattern (122) partitioned by a separator (125) may not be formed. Accordingly, both the insulation properties and electromagnetic wave transmission properties of the insulation film may be degraded.

[0094] Figure 4 is a schematic plan view illustrating a unit cell according to an example.

[0095] Referring to FIG. 4, sub-unit cells (SU) can be arranged asymmetrically within a unit cell (UC).

[0096] When the sub-unit cells (SU) are arranged asymmetrically, for example, as indicated by the dotted circles in FIG. 4, the separation portions (125) included in adjacent sub-unit cells (SU) may be misaligned with each other.

[0097] In this case, the separation portions (125) of adjacent sub-unit cells (SU) are not connected to each other, so that the conductive patterns (121) can be continuously connected. Accordingly, an isolation pattern (122) is not substantially formed within the unit cell (UC), and all of the conductive patterns (121) within the unit cell (UC) are connected, so that, for example, the entire unit cell can be electrically connected.

[0098] Therefore, the electromagnetic properties of the insulating film may be distorted, increasing radio wave transmission loss, and heat transfer and radiation may increase due to the conductive patterns (121) that are connected integrally. In addition, excessive increase in randomness may actually worsen the moiré phenomenon.

[0099] According to exemplary embodiments, as described through FIG. 2, independence of the conductive pattern (121) can be secured due to symmetry between adjacent sub-unit cells (SU).

[0100] In some embodiments, all of the separators (125) included in a unit cell (UC) may be connected. For example, the separators (125) may be connected to each other within the unit cell (UC) to form an overall net or mesh shape.

[0101] According to exemplary embodiments, the area of ​​the separating portion (125) may be 20% or less of the total area of ​​the unit cell (UC) in the planar direction (third direction). For example, the total area of ​​the conductive patterns (121) may be 80% or more of the total area of ​​the unit cell (UC).

[0102] Within the above range, the electromagnetic wave transmittance of the insulating film can be increased while the insulating properties can be further improved. For example, when the area of ​​the separating portion (125) exceeds 20%, the thermal energy passing through the separating portion (125) can increase, and the thermal resistance and insulating properties of the insulating layer (105) can be reduced.

[0103] The area of ​​the separator (125) may exceed 3% of the total area of ​​the unit cell (UC). If the area of ​​the separator (125) is less than 3%, the electromagnetic wave transmittance may be reduced.

[0104] In some embodiments, the area of ​​the separator (125) may be 5% to 20%, 5% to 15%, or 5% to 10% of the total area of ​​the unit cell (UC). Within this range, electromagnetic wave transmittance through the separator (125) may be increased while heat transfer and radiation may be reduced. Accordingly, the radio wave transmittance and thermal insulation properties of the insulating film may be further improved.

[0105] In some embodiments, the width (D1) of the conductive patterns and the width (D2) of the isolated patterns (122) may be 300 μm or less. The width refers to the length of the longest portion of the pattern.

[0106] For example, the width of the largest pattern among the patterns within a unit cell (UC) may be 300 μm or less. Accordingly, the visibility of the pattern can be further suppressed, and the electromagnetic wave transparency of a desired frequency band can be further improved.

[0107] In one embodiment, the width of the conductive pattern (121) may be 250 μm or less, 200 μm or less, 10 μm or more, 50 μm or more, or 100 μm or more. Within the above range, radiation in the infrared or far infrared region may be blocked, while the transmittance of electromagnetic waves in the high frequency or ultra-high frequency band may increase.

[0108] In some embodiments, the width of the separator (125) may be 2.5 μm or more, or 5 μm or more, and 20 μm or less, or 10 μm or less. Accordingly, the electromagnetic wave transmittance may be increased by suppressing reflection and destructive interference of electromagnetic waves while suppressing heat flow and transfer through the separator (125).

[0109] For example, if the width of the separation portion (125) is excessively narrow, etching defects due to the fine pitch may occur, and the conductive patterns (121) may be electrically connected, causing electromagnetic interference. If the width of the separation portion (125) is excessively wide, the pattern may be visible, and the optical characteristics and insulation may deteriorate.

[0110] According to exemplary embodiments, the sub-unit cells (SU) may have a rectangular shape. Accordingly, the sub-unit cells (SU) may be arranged so as to be adjacent to each other without any spaced-out regions. Accordingly, the separation regions of adjacent sub-unit cells (SU) may be connected to each other to form isolation patterns (122), thereby improving insulation properties, electromagnetic wave transmission performance, and optical properties.

[0111] In some embodiments, the unit cell (UC) may have a rectangular shape. For example, sub-unit cells (SU) having a rectangular shape may be arranged in the row and column directions to form a unit cell (UC) having a rectangular shape.

[0112] In some embodiments, the width and length of the unit cell (UC) can each be adjusted to 20 mm or less. The width refers to the length of the unit cell (UC) in the first direction, and the length refers to the length of the unit cell (UC) in the second direction.

[0113] Figure 5 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0114] Referring to FIG. 5, a plurality of unit cells (UC) can be arranged adjacent to each other and periodically.

[0115] In some embodiments, adjacent unit cells (UC) may be arranged symmetrically with respect to one another. For example, adjacent unit cells (UC) may be mirror images of one another. Accordingly, the separating portions (125) within the insulating film may be connected as a whole, forming a mesh-shaped or net-shaped separating region.

[0116] The conductive patterns (121) are arranged irregularly and randomly within the sub-unit cell (SU), thereby improving optical properties, while the sub-unit cells (SU) and unit cells (UC) are arranged symmetrically, thereby improving radio wave transmission properties and insulation properties.

[0117] Fig. 6 is a schematic plan view illustrating a unit cell according to exemplary embodiments. Fig. 7 is a schematic plan view illustrating an insulating film according to exemplary embodiments.

[0118] Referring to FIGS. 6 and 7, all of the conductive patterns (121) may have a rectangular shape.

[0119] The conductive patterns (121) included in one sub-unit cell (SU) may all have different areas or sizes. For example, a sub-unit cell (SU) may not include patterns having the same size.

[0120] Accordingly, the sub-unit cells (SU) can have randomness, and the moire phenomenon or light scattering phenomenon can be suppressed.

[0121] Within the unit cell (UC), the separating portions (125) may extend along two directions that are perpendicular to each other. For example, the separating portions (125) may have a line shape extending along the first direction and the second direction. The etching and etching processes for forming the separating portions (125) may be facilitated, and the unit cell (UC) may be manufactured through a simple design and process.

[0122] In some embodiments, the conductive pattern (121) may include a solid structure. Accordingly, the thermal resistance of the conductive pattern (121) may be increased, and the open area within the insulating film may be controlled so that the insulating film may have low thermal emissivity and thermal transmittance.

[0123] Figure 8 is a schematic cross-sectional view showing an insulating film according to exemplary embodiments.

[0124] Referring to FIG. 8, the insulation layer (105) may include an electrode layer (120). The electrode layer (120) may include unit cells according to the embodiments described above.

[0125] In some embodiments, the electrode layer (120) may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more thereof.

[0126] In one embodiment, the electrode layer (120) may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy).

[0127] In some embodiments, the electrode layer (120) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), zinc oxide (ZnOx), indium oxide (InOx), tin oxide (SnOx), cadmium tin oxide (CTO), gallium-doped zinc oxide (GZO), zinc tin oxide (ZTO), or indium gallium oxide (IGO).

[0128] In some embodiments, the electrode layer (120) may include a laminated structure of a transparent conductive oxide layer and a metal layer, and may have, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer.

[0129] The metal layer may include the metal or alloy described above. The transparent conductive oxide layer may include the transparent conductive oxide described above. The metal layer may improve thermal insulation properties, and the transparent conductive oxide layer may improve corrosion resistance and transparency.

[0130] In some embodiments, the insulation layer (105) may further include a lower insulation layer (130) disposed between the substrate layer (100) and the electrode layer (120) and / or an upper insulation layer (140) disposed on the electrode layer (120).

[0131] The lower insulating layer (130) may be provided as a base layer or buffer layer of the electrode layer (120). The mechanical properties and stability, such as crack resistance, of the electrode layer (120) may be improved by the lower insulating layer (130).

[0132] The upper insulating layer (140) may be provided as a passivation layer or a protective film. The upper insulating layer (140) may prevent oxidation and corrosion of the metal or metal oxide included in the electrode layer (120).

[0133] In one embodiment, the lower insulating layer (130) and the upper insulating layer (140) may include an organic insulating material such as an epoxy resin, an acrylic resin, an imide-based resin, or an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0134] In one embodiment, a transparent insulating resin may be provided as the lower insulating layer (130) and the upper insulating layer (140). For example, the transparent insulating resin may be a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose-based resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate-based resin; an acrylic-based resin such as polymethyl (meth)acrylate or polyethyl (meth)acrylate; a styrene-based resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin-based resin such as polyethylene, polypropylene, a polyolefin having a cyclo-based or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride-based resin; an amide-based resin such as nylon or an aromatic polyamide; an imide-based resin; a polyethersulfone-based resin; a sulfone-based resin; a polyetheretherketone-based resin; It may include sulfated polyphenylene resin; vinyl alcohol resin; vinylidene chloride resin; vinyl butyral resin; allylate resin; polyoxymethylene resin; epoxy resin; urethane or acrylic urethane resin, etc. These may be used alone or in combination of two or more.

[0135] In some embodiments, the dielectric constants of the lower insulating layer (130) and the upper insulating layer (140) can be adjusted to a range of about 2 to 12, respectively. Within this range, transmission loss due to refraction and reflection of electromagnetic waves can be suppressed.

[0136] According to exemplary embodiments, the insulating layer (105) may further include a point-of-contact adhesive layer (110). The point-of-contact adhesive layer (110) may be formed on one surface of the insulating layer (105) that is in contact with the substrate layer (100).

[0137] In some embodiments, the adhesive layer (110) may include an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0138] In some embodiments, the insulating film may be manufactured by the method described below.

[0139] A preliminary electrode layer can be formed on the upper surface of the substrate layer (100). For example, the preliminary electrode layer can be formed by a vacuum deposition method, a physical deposition method, a chemical deposition method, a plasma deposition method, a plasma polymerization method, a thermal deposition method, a thermal oxidation method, an anodic oxidation method, a cluster ion beam deposition method, a screen printing method, a gravure printing method, a flexographic printing method, an offset printing method, an inkjet coating method, a dispenser printing method, a photolithography method, or the like.

[0140] In one embodiment, the preliminary electrode layer can be formed through a plasma deposition method, for example, a sputtering process.

[0141] In one embodiment, before forming the preliminary electrode layer, a lower insulating layer (130) and / or a point-of-contact adhesive layer (110) may be first formed on the substrate layer (100). For example, an insulating resin may be coated on the upper surface of the substrate layer (100) to form the lower insulating layer (130) and / or the point-of-contact adhesive layer (110).

[0142] In some embodiments, the preliminary electrode layer (120) may be formed by laser etching the preliminary electrode layer. For example, the preliminary electrode layer may be etched by irradiating a high-power laser beam along the profile of a pre-designed separator (125). Accordingly, the separator (125) and conductive patterns (121) defined by the separator (125) may be formed.

[0143] In some embodiments, dry etching using a gas or wet etching using an etchant may be performed on the preliminary electrode layer.

[0144] For example, a photoresist layer can be formed by applying a photoresist composition on the upper surface of the preliminary electrode layer. The photoresist layer can be exposed to light to form an exposed portion and a non-exposed portion. A mask can be placed on the non-exposed portion before exposing the photoresist layer.

[0145] In one embodiment, a photoresist pattern can be formed by selectively removing either an exposed portion or an unexposed portion through a development process. For example, when the photoresist composition has a positive type, the exposed portion can be removed through a development process, and the unexposed portion can remain, thereby forming a photoresist pattern. For example, when the photoresist composition has a negative type, the unexposed portion can be removed through a development process, and the exposed portion can remain, thereby forming a photoresist pattern.

[0146] In one embodiment, the developing process may be performed using a developer having strong basicity. For example, the developer may include an ammonium-based solution such as tetramethylammonium hydroxide (TMAH).

[0147] The preliminary electrode layer can be etched using the photoresist pattern as a mask. The photoresist pattern can have the same shape as the conductive patterns (121). By etching the preliminary electrode layer, an electrode layer (120) including the conductive patterns (121) and a separator (125) can be formed.

[0148] In one embodiment, the etching process for the preliminary electrode layer can be performed using a dry etching process such as plasma etching, sputtering, or reactive ion etching (RIE).

[0149] In one embodiment, for example, the etching process for the preliminary electrode layer may be performed through a wet etching process using an etchant solution or the like. The etchant solution may include an acidic solution, for example, phosphoric acid, nitric acid, hydrochloric acid, hydrogen peroxide, and / or acetic acid.

[0150] In some embodiments, the photoresist remaining on the electrode layer (120) can be removed through a strip process or an ashing process.

[0151] In one embodiment, an upper insulating layer (140) may be formed by applying and curing an insulating resin on the upper surface of the electrode layer (120).

[0152] According to exemplary embodiments, the electrode layer (120) may be manufactured in the form of a single unit cell (UC). For example, the preliminary electrode layer may be etched to form an electrode pattern having the form of a single unit cell (UC). A plurality of the electrode patterns may be arranged on a substrate to form an insulating film.

[0153] In some embodiments, the electrode layer (120) may be fabricated in the form of a single sub-unit cell (SU). For example, the preliminary electrode layer may be etched to form a sub-electrode pattern in the form of a single sub-unit cell (SU). The sub-electrode patterns may be symmetrically arranged to fabricate an electrode pattern in the form of a single unit cell (UC). A plurality of the electrode patterns may be arranged on a substrate to form an insulating film.

[0154] A large-area insulating film can be manufactured simply by symmetrically arranging electrode patterns having unit cell or sub-unit cell shapes on a substrate or a base layer, thereby increasing process convenience.

[0155] Additionally, for example, forming an insulating film on a substrate through a single etching process may require a large-area mask and processing equipment. According to the embodiments described above, the electrode layer (120) can be manufactured in a size corresponding to a unit cell or sub-unit cell, thereby simplifying the processing equipment and reducing costs.

[0156] FIGS. 9 and 10 are schematic cross-sectional views each showing a window structure according to exemplary embodiments.

[0157] Referring to FIGS. 9 and 10, the window structure may include a substrate (90) and an insulating film or insulating layer (105) disposed on the substrate (90).

[0158] For example, the insulation layer (105) can be separated from the base layer (100) of the above-mentioned insulation film. The insulation layer (105) separated from the base layer (100) can be attached to the substrate (90) via the adhesive layer (110).

[0159] The substrate (90) may include, for example, glass and / or a transparent flexible polymer material. Examples of the transparent flexible polymer include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), etc.

[0160] In one embodiment, a glass substrate may be provided as a substrate (90) of a window structure. For example, a glass substrate of an object to which the window structure is applied may be provided as the substrate (90). The glass substrate may include, for example, glass such as a window of a building's exterior wall, a window included in an appliance, or automobile glass.

[0161] In one embodiment, the thickness of the glass substrate may be 2t to 10t, but is not limited thereto, and may be appropriately adjusted depending on the design purpose and target object.

[0162] The location and size of the area where the insulating layer (105) is formed on the substrate (90) can be designed or adjusted in consideration of the surrounding environment or the operating conditions of the antenna. For example, indoor and outdoor temperature, humidity, thickness and permittivity of the substrate, surrounding structures, permittivity and physical properties of the structures, height and signal transmission path of the window structure, frequency of electromagnetic waves, angle of incidence, and transmission distance, etc. can be taken into consideration.

[0163] Thermal energy such as thermal radiation passing through the window structure can be blocked by the insulating layer (105), thereby improving the insulating properties of the window structure. In addition, since the insulating layer (105) has high electromagnetic wave permeability, transmission loss due to the insulating layer (105) can be suppressed.

[0164] In one embodiment, the thermal transmittance of the window structure is 3.90 kcal / m based on single-layer glass (thickness 5t). 2 h℃ or less. The thermal transmittance of the above window structure is 3.70 kcal / m based on single-layer glass. 2 h℃ or less, for example, 3.40 kcal / m 2 h℃ to 3.70 kcal / m 2 h℃, or 3.50 kcal / m 2 h℃ to 3.60 kcal / m 2 It could be h℃.

[0165] In some embodiments, the window structure may further include an upper substrate (92). The upper substrate (92) may be disposed spaced apart from the substrate (90). For example, the window structure may have a pair glass form.

[0166] In one embodiment, the window structure may further include a spacer formed between the substrate (90) and the upper substrate (92). The spacer may maintain a gap between the substrate (90) and the upper substrate (92).

[0167] In one embodiment, an air layer (200) may be formed between the substrate (90) and the upper substrate (92). The air layer (200) may include air or argon (Ar) gas. The air layer (200) may further suppress heat flow through conduction and convection.

[0168] The insulating layer (105) may be formed on one surface of the substrate (90) facing the air layer (200). In one embodiment, the insulating layer (105) may be formed on the opposite surface of the surface of the substrate (90) facing the air layer (200).

[0169] In one embodiment, an insulating resin may be filled between the substrate (90) and the upper substrate (92). For example, the window structure may further include an interlayer insulating layer (300) sandwiched or embedded between the substrate (90) and the upper substrate (92).

[0170] The organic insulating material and / or inorganic insulating material described above may be used as the insulating resin, and a transparent insulating film may be used as the interlayer insulating layer (300).

[0171] The above window structure can be applied to various structures and objects, such as windows of public transportation such as buses and subways, buildings, windows, vehicles, decorative sculptures, and guidance signs (e.g., directional signs, emergency exit signs, emergency lights), etc. The above window structure can improve insulation and energy efficiency, thereby increasing the signal efficiency of an antenna or radar.

[0172]

[0173] Hereinafter, preferred embodiments are presented to help understand the present invention, but these embodiments are only illustrative of the present invention and do not limit the scope of the appended claims. It is obvious to those skilled in the art that various changes and modifications to the embodiments are possible within the scope and technical idea of ​​the present invention, and it is also natural that such changes and modifications fall within the scope of the appended claims.

[0174]

[0175] Experimental Example 1

[0176] Example

[0177] A glass substrate with an insulating film attached was used as a window structure. The thickness of the glass substrate was 4.8 t, and the insulating film was manufactured to have a shape as shown in Fig. 5. Specifically, the insulating film was formed by periodically arranging unit cells having a shape as shown in Fig. 2. The width and width of the unit cell were each set to 20 mm, the width of the separator was set to 2.5 ㎛, and the area of ​​the separator was set to 20% of the total area of ​​the unit cell.

[0178] The above insulating film was formed with a three-layer structure of a lower insulating layer - an electrode layer (IZO / APC / IZO) - an upper insulating layer. The above insulating film was bonded to a glass substrate via OCA (5 μm thick).

[0179]

[0180] Comparative Example 1

[0181] A glass substrate (4.8t thick) without an insulating film attached was used as the window structure.

[0182] Comparative Example 2

[0183] A window structure was manufactured in the same manner as in the embodiment except that the unit cell had a shape similar to that in Fig. 4.

[0184]

[0185] Radio transmission loss assessment

[0186] Radio transmittance was measured as a relative value to the transmittance in air in the frequency range of 26.5 GHz to 40.5 GHz (n257 5G).

[0187] Figure 11 is a graph showing radio wave transmittance according to examples and comparative examples.

[0188] Referring to Fig. 11, in the window structure of the embodiment, the sub-unit cells have a symmetrical shape, thereby exhibiting low transmission loss. The transmission loss of radio waves was found to be substantially similar to that of a glass substrate.

[0189] However, in the window structure of Comparative Example 2, the sub-unit cells were arranged asymmetrically, which increased the transmission loss in the ultra-high frequency band.

[0190]

[0191] Experimental Example 2

[0192] Comparative Example 3

[0193] Fig. 12 is a schematic plan view showing an insulating film according to Comparative Example 3.

[0194] The window structure was manufactured in the same manner as in the example, except that the insulating film was manufactured to have a shape as shown in Fig. 12.

[0195] In Comparative Example 3, conductive patterns (21) having a square shape were periodically arranged, the width (W) of the conductive pattern (21) was set to 300 μm, the width of the separating portion (25) was set to 2.5 μm, and the area of ​​the separating portion (25) was set to 20% of the total area of ​​the insulating film.

[0196]

[0197] Starburst Evaluation

[0198] The light scattering phenomenon was evaluated by observing the light source through the window structures of Examples 1 and 3.

[0199] Fig. 13a is a photographic image of a light source observed through a window structure of an embodiment. Fig. 13b is a photographic image of a light source observed through a window structure of Comparative Example 1. Fig. 13c is a photographic image of a light source observed through a window structure of Comparative Example 3.

[0200] Referring to FIGS. 13a to 13c, in the window structure of the embodiment, almost no light scattering phenomenon occurred, and a light source was observed that was substantially similar to a glass substrate.

[0201] In the window structure of Comparative Example 3, as patterns of the same shape are periodically arranged, scattering and spreading of light increased during the process of passing through the window structure.

Claims

1. Contains a unit cell formed by arranging multiple sub-unit cells, The above sub-unit cell includes conductive patterns having different shapes and a separator that separates the conductive patterns from each other, An insulating film, wherein sub-unit cells arranged adjacent to each other among the plurality of sub-unit cells have shapes that are symmetrical to each other.

2. An insulating film according to claim 1, wherein the conductive patterns have an island pattern shape physically spaced apart from each other within the sub-unit cell.

3. An insulating film according to claim 1, wherein the sub-unit cell includes three or more of the conductive patterns, and the same pattern shape is not repeated within the sub-unit cell.

4. In claim 1, the unit cell includes a first sub-unit cell and a second sub-unit cell arranged in a row direction, An insulating film wherein the second sub-unit cell has a shape in which the first sub-unit cell is flipped along the row direction.

5. An insulating film according to claim 4, wherein the unit cell further includes a third sub-unit cell arranged in the column direction with respect to the first sub-unit cell, and a fourth sub-unit cell arranged in the column direction with respect to the second sub-unit cell.

6. In claim 5, the third sub-unit cell and the fourth sub-unit cell are each an insulating film having a shape in which the first sub-unit cell and the second sub-unit cell are flipped along the thermal direction.

7. In claim 5, the third sub-unit cell and the fourth sub-unit cell are adjacent in the row direction, An insulating film wherein the fourth sub-unit cell has a shape in which the third sub-unit cell is flipped along the row direction.

8. An insulating film according to claim 1, wherein the unit cell comprises isolated patterns formed by connecting a pair of conductive patterns included in a pair of adjacent sub-unit cells.

9. An insulating film according to claim 8, wherein four conductive patterns are connected in the central region of the unit cell to form an isolation pattern.

10. In claim 8, the insulating film, wherein the isolation pattern is surrounded by the separation portion.

11. In claim 8, the insulating film, wherein the conductive patterns and the isolation patterns each have a length of 300 μm or less.

12. An insulating film according to claim 1, wherein the sub-unit cells have a square shape.

13. An insulating film according to claim 1, wherein all of the separating parts included in the unit cell are connected.

14. An insulating film according to claim 1, wherein the conductive patterns have a rectangular shape.

15. An insulating film according to claim 14, wherein the conductive patterns included in one sub-unit cell all have different areas or sizes.

16. An insulating film comprising a plurality of unit cells arranged periodically according to claim 1.

17. An insulating film according to claim 1, wherein the area of the separating portion is 20% or less of the total area of the unit cell in the plane direction.

18. An insulating film according to claim 1, wherein the conductive patterns have a solid structure.

19. Lower substrate; an upper substrate spaced apart from the lower substrate; and A window structure comprising an insulating film according to claim 1 disposed on the lower substrate.

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