Test socket

Abstract

The present invention relates to a test socket capable of effectively dissipating heat generated when testing an element to be tested (for example, a semiconductor device). A test socket according to an embodiment comprises: a lower insulation sheet having a through-hole formed therethrough, the through-hole being formed at every position corresponding to a pad of a test device; a conductive part array in which a plurality of conductive parts are arranged in a plurality of conductive part rows and a plurality of conductive part columns, the conductive parts being formed in the through-holes of the lower insulation sheet, respectively; insulating parts arranged between the plurality of conductive parts forming the conductive part array to support the conductive part array; and a heat dissipating member which is disposed within an insulation part positioned between two adjacent conductive part columns among the conductive part array and in parallel with the conductive part columns, to collect heat generated in the two adjacent conductive part columns.

Description

test socket

[0001] The present invention relates to a test socket, and more particularly, to a test socket capable of effectively dissipating heat generated when testing a device under test (e.g., a semiconductor device).

[0002] Since semiconductor devices are manufactured through multiple process steps, semiconductor inspection is essential to ensure proper operation. To inspect semiconductor devices, a test socket is required to electrically connect the test device to the semiconductor device. Test sockets serve as a means of transmitting signals from the test device to the semiconductor device, and are often in sheet form. Therefore, test sockets require both mechanical and stable electrical contact. Mechanical contact ensures that individual semiconductor devices move to the correct position and make precise contact with the test device. Stable electrical contact minimizes signal distortion at the contact point during signal transmission.

[0003] Test sockets formed of silicone rubber are widely used as test sockets for semiconductor device inspection due to their advantages of being able to achieve dense electrical connections without using arbitrary means such as soldering or mechanical bonding, and being able to absorb mechanical shock or deformation to enable flexible connections.

[0004] Fig. 1 is a perspective view of a test socket according to the prior art, Fig. 2 is an exploded perspective view of the test socket of Fig. 1, and Fig. 3 is a cross-sectional view taken along line AA of the test socket of Fig. 1. A test socket according to the prior art will be described with reference to Figs. 1 to 3.

[0005] A test socket according to the prior art is composed of a lower insulating sheet (11), a frame (12), a conductive portion (13), an insulating portion (14), and an upper insulating sheet (15). The lower insulating sheet (11) is placed on the side of a test device (not shown), and the upper insulating sheet (15) is placed on the side of a semiconductor device (not shown). The conductive portion (13) is placed between the lower insulating sheet (11) and the upper insulating sheet (15), and the lower insulating sheet (11) and the upper insulating sheet (15) fix and support the position of the conductive portion (13) from above and below.

[0006] The lower insulating sheet (11) and the upper insulating sheet (15) may each be composed of a synthetic resin material. The conductive portion (13) may be composed of a plurality of conductive particles arranged in the thickness direction and distributed within an insulating elastic material. Here, the conductive particles may be composed of nickel core-gold plated particles, and the insulating elastic material may be composed of silicone rubber. The insulating portion (14) is disposed between the conductive portions (13) to support the conductive portions (13) and may be composed of silicone rubber.

[0007] The frame (12) is configured by being laminated on top of the lower insulating sheet (11), and protects the test socket from physical impact or external environment at the outer periphery of the conductive portion (13) and the insulating portion (14). An opening (12a) through which the conductive portion (13) and the insulating portion (14) pass is formed in the frame (12).

[0008] A plurality of conductive portions (13) are formed between the lower insulating sheet (11) and the upper insulating sheet (15) and extend in the thickness direction at positions corresponding to each terminal of the semiconductor device. A plurality of through holes (11a) are formed at corresponding positions in the lower insulating sheet (11) and the upper insulating sheet (15) so that the conductive portions (13) can be extended to the outer surfaces of the lower insulating sheet (11) and the upper insulating sheet (15).

[0009] A test socket is mounted on a test device having multiple pads and used. When each pad of the test device is placed so that it is in contact with the lower surface of the conductive portion (13), the terminal of the semiconductor device, which is the device to be tested, is brought into contact with the upper surface of the conductive portion (13) and pressurized, and then a predetermined electrical signal is applied from the test device. As the electrical signal is transmitted from the pad of the test device through the conductive portion (13) to the terminal of the semiconductor device, a predetermined electrical test can be performed.

[0010] Specifically, the lower surface of the conductive portion (13) is brought into contact with the pad of the inspection device, and the semiconductor device is lowered above the test socket so that each terminal is brought into contact with the upper surface of the conductive portion (13). In this state, when the semiconductor device is further lowered, the conductive portion (13) is compressed in the thickness direction, and the conductive particles of the conductive portion (13) come into contact with each other to form an electrical path, thereby entering an electrically conductive state. In this state, the inspection device performs an electrical inspection by applying a predetermined electric signal to the semiconductor device via the conductive portion (13).

[0011] As the performance of semiconductor devices increases, the number of semiconductor test items increases, leading to increased test times. As test times increase, so does the heat generated in the test socket. Temperature is a critical test condition in semiconductor device performance testing, and to ensure reliable test results, the test socket must maintain an appropriate temperature range. However, conventional test sockets do not include heat dissipation mechanisms, preventing the heat generated within the socket during testing from being efficiently dissipated to the outside.

[0012] Figure 4 is a diagram illustrating the heating state of the conductive parts of a test socket when testing a semiconductor device using a conventional test socket. While the temperatures of the conductive parts located on the periphery of the test socket remain within an appropriate range, the heat generated from the conductive parts located in the center cannot be dissipated to the outside, resulting in a very high temperature rise in the conductive parts located in the center.

[0013] In this way, if the temperature of the conductive part of the test socket goes beyond the appropriate temperature range, the electrical and mechanical characteristics of the test socket deteriorate, which lowers the reliability of the test results and shortens the lifespan of the test socket.

[0014] Various embodiments of the present invention have been created to solve the above-described problems, and an object of the present invention is to provide a test socket having a heat dissipation means disposed inside an insulating portion of the test socket, capable of collecting heat generated from a conductive portion and dissipating it to the outside.

[0015] The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0016] According to an embodiment of the present invention for achieving the above-described object, a test socket includes a lower insulating sheet having through holes formed at each position corresponding to a pad of a test device, a conductive portion array in which a plurality of conductive portions formed at each through hole of the lower insulating sheet are arranged in a plurality of conductive portion rows and a plurality of conductive portion columns, an insulating portion disposed between a plurality of conductive portions constituting the conductive portion array to support the conductive portion array, and a heat dissipation member disposed parallel to the conductive portion rows inside the insulating portion located between two adjacent conductive portion rows among the conductive portion array to collect heat generated from the two adjacent conductive portion rows.

[0017] Preferably, the heat dissipation member is positioned parallel to the conductive member rows and inserted within an insulating member positioned between two adjacent conductive member rows, and includes a cooling member extending to the periphery of the conductive member array.

[0018] More preferably, the heat dissipation member further includes a cooling member inserted and arranged parallel to the conductive row within an insulating member positioned between two adjacent conductive row rows among the conductive array and extending to the periphery of the conductive array.

[0019] More preferably, the cooling member is cooled by air cooling.

[0020] More preferably, the cooling member is at least one of a hollow metal pipe and a metal rod.

[0021] More preferably, the cooling member is one of copper, aluminum, silver, gold and alloys thereof.

[0022] Preferably, the present invention further includes a frame laminated on a lower insulating sheet and having an opening formed through which a conductive array and an insulating portion pass.

[0023] More preferably, the heat dissipation member comprises a heat sink laminated on a frame and having a plurality of openings formed therein through which a plurality of rows of conductive elements of the conductive element array pass, the heat sink comprising a plurality of cooling fins protruding into an insulator positioned between two adjacent rows of conductive elements of the conductive element array and arranged parallel to the rows of conductive elements, the plurality of cooling fins extending to the periphery of the frame.

[0024] More preferably, the heat sink is cooled by air cooling.

[0025] More preferably, the heat sink extends into the socket guide and contacts the socket guide so that heat collected in the heat sink is conducted to the socket guide.

[0026] More preferably, the socket guide is cooled by either an air-cooled cooling device or a water-cooled cooling device.

[0027] More preferably, the plurality of cooling fins do not contact two adjacent conductive rows.

[0028] More preferably, the plurality of cooling fins are insulated and are in contact with two adjacent conductive rows.

[0029] More preferably, the heat sink is made of copper, aluminum, silver, gold, or any of their alloys.

[0030] More preferably, the heat sink is a composite sheet containing metal particles.

[0031] More preferably, the mixed sheet is a sheet in which any one of copper, aluminum, and iron oxide is mixed with silicone rubber.

[0032] More preferably, the heat sink is a composite sheet containing a carbon-based heat-dissipating material.

[0033] More preferably, the mixed sheet is a sheet in which any one of carbon nanotubes (CNT), graphene, and graphite is mixed with silicone rubber.

[0034] More preferably, the height of the cooling fins is 30% to 60% of the height of the insulation.

[0035] The means for solving the technical problem to be solved by the present invention are not limited to the means for solving the problem mentioned above, and other means for solving the problem that are not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0036] According to various embodiments of the present invention, a heat dissipation means is arranged inside an insulating portion of a test socket to collect heat generated from a conductive portion and release it to the outside, thereby allowing the temperature of the conductive portion located at the center of the test socket to be maintained within an appropriate temperature range.

[0037] In addition, according to the present invention, since the test socket performs the test while maintaining an appropriate temperature range, the reliability of the test result can be improved and the life of the test socket can be extended.

[0038] In addition, according to the present invention, by connecting a heat sink to a socket guide, heat collected in the heat sink is released through the socket guide, and static electricity is discharged at the same time, thereby improving test stability.

[0039] The effects to be achieved by the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0040] Embodiments of the present invention will be described below with reference to the accompanying drawings, wherein like reference numerals represent similar elements, but are not limited thereto.

[0041] Figure 1 is a perspective view of a test socket according to the prior art.

[0042] Figure 2 is an exploded perspective view of the test socket of Figure 1.

[0043] Figure 3 is a cross-sectional view taken along line AA of the test socket of Figure 1.

[0044] FIG. 4 is a drawing showing the heating state of a conductive part of a test socket when testing a semiconductor device using a test socket of the prior art.

[0045] Figure 5 is a perspective view of a test socket according to a first embodiment of the present invention.

[0046] Figure 6 is an exploded perspective view of the test socket of Figure 5.

[0047] Fig. 7 is an example of a cross-sectional view along line AA of the test socket of Fig. 5.

[0048] Fig. 8 is another example of a cross-sectional view along line AA of the test socket of Fig. 5.

[0049] FIG. 9 is a drawing showing the heating state of a conductive part of a test socket when testing a semiconductor device using a test socket according to the first embodiment of the present invention.

[0050] Fig. 10 is a perspective view of a test socket according to a second embodiment of the present invention.

[0051] Figure 11 is an exploded perspective view of the test socket of Figure 10.

[0052] Fig. 12 is an example of a cross-sectional view taken along line AA of the test socket of Fig. 10.

[0053] Fig. 13 is another example of a cross-sectional view taken along line AA of the test socket of Fig. 10.

[0054] FIG. 14 is a drawing showing the heating state of a conductive part of a test socket when testing a semiconductor device using a test socket according to a second embodiment of the present invention.

[0055] [Explanation of symbols]

[0056] 21, 31: Lower insulation sheet 22, 32: Frame

[0057] 23, 34: Conductive array 24, 35: Insulator

[0058] 25: Cooling member 33: Heat sink

[0059] The terms used in this specification will be briefly explained, and the present invention will be described in detail.

[0060] The terms used in this detailed description have been selected from widely used, current terms, taking into account the functions of the present invention. However, these terms may vary depending on the intentions of engineers in the technical field to which the present invention pertains, precedents, the emergence of new technologies, etc. Furthermore, in certain cases, terms may be arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the relevant description of the invention. Therefore, the terms used in the present invention should not be defined simply as names of terms, but rather based on their inherent meanings and the overall content of the present invention.

[0061] When a part of a specification is said to "include" a component, this does not mean that it excludes other components, but rather that it may include other components, unless otherwise stated.

[0062] Below, with reference to the attached drawings, embodiments of the present invention are described in detail so that those skilled in the art can easily practice the invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments described herein. In addition, in the drawings, parts irrelevant to the description are omitted to clearly explain the present invention, and similar parts are designated with similar reference numerals throughout the specification.

[0063] Fig. 5 is a perspective view of a test socket according to a first embodiment of the present invention, Fig. 6 is an exploded perspective view of the test socket of Fig. 5, and Figs. 7 and 8 are cross-sectional views taken along line AA of the test socket of Fig. 5. The test socket according to the first embodiment of the present invention will be described with reference to Figs. 5 to 8.

[0064] A test socket according to a first embodiment of the present invention comprises a lower insulating sheet (21) having through holes formed at each position corresponding to a pad of a test device, a conductive part array (23) in which a plurality of conductive parts (23a) formed at each through hole of the lower insulating sheet (21) are arranged in a plurality of conductive part rows and a plurality of conductive part columns, an insulating part (24) disposed between the plurality of conductive parts (23a) constituting the conductive part array (23) to support the conductive part array (23), a frame (22) laminated on the lower insulating sheet (21) and having openings (22a) formed therein through which the conductive part array (23) and the insulating part (24) pass, and a heat dissipation member disposed parallel to the conductive part rows inside the insulating part (24) located between two adjacent conductive part rows to collect heat generated in the two adjacent conductive part rows.

[0065] The heat dissipation member is inserted and arranged parallel to the conductive section rows within the insulating section (24) positioned between two adjacent conductive section rows and includes a cooling member (25) extending to the periphery of the conductive section array. The cooling member (25) may be arranged to penetrate the insulating section (24) between two adjacent conductive section rows.

[0066] The heat dissipation member may further include a cooling member (25') that is inserted and arranged parallel to the conductive member rows within the insulating member (24) positioned between two adjacent conductive member rows and extends to the periphery of the conductive member array (23). The cooling member (25') may be arranged to penetrate the insulating member (24) between two adjacent conductive member rows.

[0067] The cooling member (25) may be arranged in a line on one of the insulating members (24) between two adjacent conductive rows and between two adjacent conductive rows, or may be arranged in a checkerboard pattern on the insulating members (24) between two adjacent conductive rows and between two adjacent conductive rows.

[0068] The cooling member (25, 25') has the function of collecting heat generated from two adjacent conductive column and / or two adjacent conductive row. Since the cooling member (25, 25') can be arranged adjacent to a conductive member located at the center of the conductive member array (23), it can collect heat generated from the conductive member located at the center of the conductive member array (23) and discharge the collected heat to the periphery of the conductive member array (23).

[0069] A ventilation device (not shown) for cooling the heat collected in the cooling member (25, 25') may be placed outside the test socket. The heat collected in the cooling member (25, 25') may be smoothly discharged to the outside by this ventilation device. In other words, the cooling member (25, 25') may be cooled by air cooling.

[0070] The cooling member (25, 25') may be a hollow metal pipe (25a) as shown in Fig. 7, or may be a metal rod (25b) as shown in Fig. 8. A metal with high thermal conductivity may be used as the cooling member (25, 25'). As the metal with high thermal conductivity, copper, aluminum, silver, gold, and alloys thereof may be used.

[0071] The test socket faces the lower insulating sheet (21) and may further include an upper insulating sheet (26) having through holes formed at positions corresponding to terminals of the semiconductor device. The lower insulating sheet (21) and the upper insulating sheet (26) perform the function of supporting the position of the conductive portion (23a).

[0072] The frame (22) is configured by being laminated on top of the lower insulating sheet (21), and protects the test socket from physical impact or external environment at the outer periphery of the conductive array (23) and the insulating portion (24).

[0073] The material of the lower insulating sheet (21) and the upper insulating sheet (26) is not particularly limited as long as it has insulation and flexibility, and polyimide, polyethylene, ethylene propylene copolymer, ethylene butene copolymer, ethylene octene copolymer, liquid crystal polymer, or a composite material thereof can be used.

[0074] The upper and lower surfaces of the conductive portion (23a) can be exposed to the outside through the through-hole (21a) of the lower insulating sheet (21) and the through-hole of the upper insulating sheet (26). The conductive portion (23a) can be formed by densely packing a plurality of conductive particles within an elastic insulating material. A polymer material having a cross-linked structure can be used as the elastic insulating material. As polymer materials, for example, conjugated diene rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, block copolymer rubbers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer and hydrogenated products thereof, chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like can be used, and silicone rubber can be preferably used.

[0075] The conductive particles in the conductive portion (23a) can be made of a magnetic material. Examples of the conductive particles include particles of a magnetic metal such as iron, cobalt, or nickel, or particles of an alloy thereof, or particles containing these metals, or particles using these particles as core particles and plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, or rhodium, or non-magnetic particles or inorganic particles such as glass beads, or polymer particles as core particles and plating the surface of the core particles with a conductive magnetic metal such as nickel or cobalt.

[0076] A test socket according to a first embodiment of the present invention can be manufactured by manufacturing a test socket in the same manner as in the prior art, then forming a hole through the insulation between two adjacent conductive section rows (and / or two adjacent conductive section rows) in a center parallel to the conductive section row (and / or conductive section row) to form a hole through the insulation, and then inserting a cooling member into the hole through the insulation.

[0077] Fig. 9 is a drawing illustrating the heating state of the conductive portion of a test socket when testing a semiconductor device using the test socket according to the first embodiment of the present invention. Compared to the heating state of the conductive portion of the test socket according to the prior art of Fig. 4, it can be confirmed that the temperature of the conductive portions located at the center of the test socket according to the first embodiment of the present invention rises less.

[0078] Fig. 10 is a perspective view of a test socket according to a second embodiment of the present invention, Fig. 11 is an exploded perspective view of the test socket of Fig. 10, and Figs. 12 and 13 are cross-sectional views taken along line AA of the test socket of Fig. 10. A test socket according to a second embodiment of the present invention will be described with reference to Figs. 10 to 13.

[0079] A test socket according to a second embodiment of the present invention comprises a lower insulating sheet (31) having through holes (31a) formed at each position corresponding to a pad of a test device, a conductive part array (34) in which a plurality of conductive parts (34a) formed at each through hole (31a) of the lower insulating sheet (31) are arranged in a plurality of conductive part rows and a plurality of conductive part columns, an insulating part (35) disposed between the plurality of conductive parts (34a) constituting the conductive part array (34) to support the conductive part array (34), a frame (32) laminated on the lower insulating sheet (31) and having openings (32a) formed therein through which the conductive part array (34) and the insulating part (35) pass, and a heat dissipation member disposed parallel to the conductive part rows inside the insulating part located between two adjacent conductive part rows to collect heat generated in the two adjacent conductive part rows.

[0080] The heat dissipation member is laminated on a frame (32) and includes a heat sink (33) having a plurality of openings (33a) formed therein through which a plurality of conductive rows each pass. The heat sink (33) includes a plurality of cooling fins (33b) that protrude into an insulating member (35) positioned between two adjacent conductive rows and are arranged parallel to the conductive rows. The plurality of cooling fins (33b) extend to the outside of the frame (32).

[0081] A plurality of cooling fins (33b) of the heat sink (33) protrude into the insulation and function to collect heat generated from two adjacent conductive part rows. Since the cooling fins (33b) can be arranged adjacent to the conductive part located at the center of the conductive part array (34), the heat generated from the conductive part located at the center of the conductive part array (34) can be collected and the collected heat can be discharged to the periphery of the conductive part array (34).

[0082] A ventilation device (not shown) may be placed outside the test socket to cool the heat collected from the cooling fins (33b) of the heat sink (33). This ventilation device allows the heat sink (33) to be cooled by air cooling, so that the heat collected from the conductive array (34) can be smoothly released to the outside.

[0083] The heat sink (33) can extend to the socket guide (not shown) and come into contact with the socket guide, and the heat collected in the heat sink (33) can be conducted to the socket guide. The socket guide may further include an air-cooling cooling device and a water-cooling cooling device. Through this, the heat collected in the cooling fin (33b) can be conducted to the socket guide and cooled by an external cooling device.

[0084] The plurality of cooling fins (33b) may not be in contact with adjacent conductive portions (34a) as shown in Fig. 12. The plurality of cooling fins (33b) may be in contact with adjacent conductive portions (34a) as shown in Fig. 13, and when the cooling fins (33b) and the conductive portions (34a) are in contact, it is preferable that the cooling fins (33b) be coated with an insulating material.

[0085] The heat sink (33) may be made of a metal having high thermal conductivity. As the metal having high thermal conductivity, copper, aluminum, silver, gold, and alloys thereof may be used. Alternatively, the heat sink (33) may be made of a mixed sheet containing metal particles or a mixed sheet containing a carbon-based heat-dissipating material. As the mixed sheet containing metal particles, a sheet in which any one of copper, aluminum, and iron oxide is mixed with silicone rubber may be used. As the mixed sheet in which any one of carbon nanotubes (CNT), graphene, and graphite is mixed with silicone rubber may be used.

[0086] Since the surface area of ​​the cooling fin (33b) must be large to absorb more heat from the conductive part (34a), a high height (h1) of the cooling fin (33b) is advantageous for heat dissipation. However, if the height of the cooling fin (33b) is too high, the repulsive force may increase when pressurizing for testing, which may deteriorate the operability. Therefore, it is necessary to design the height (h1) of the cooling fin (33b) while considering both heat dissipation efficiency and operability.

[0087] Table 1 is a table comparing the resistance value of the conductive part and the test socket temperature when the same pressure is applied when testing a semiconductor device using a test socket of the ratio of the height of the cooling fin (h1) to the height of the insulating part (h2).

[0088] Ratio of cooling fin height to insulation height Resistance of conductive part (mΩ) Socket temperature (℃) 10 % 26.1 10 8.5 20 % 26.7 10 2.830 % 29.6 8 9.840 % 35.6 8 6.250 % 46.1 8 5.860 % 69.6 8 5.270 % 111.9 8 2.780 % 223.2 8 1.890 % 342.9 8 0.4

[0089] When the same pressure is applied during testing, a high resistance of the conductive part means that the conductive particles that make up the conductive part are not sufficiently in contact. In this case, higher pressure must be applied to ensure sufficient contact between the conductive particles, resulting in poor operability. During testing, the socket must be properly pressed against the upper pressure to narrow the gap between the conductive particles, which can result in low resistance of the conductive part. A high socket temperature means that the cooling efficiency of the cooling fins is not high. The height of the cooling fins should be increased to prevent the socket temperature from rising significantly.

[0090] In the present invention, when designing the height of the cooling fin, both the operability and the cooling temperature are taken into consideration and the height is determined within a range that satisfies the criteria of a conductive part resistance value of 100 mΩ or less and a socket temperature of 90°C or less. Accordingly, the height (h1) of the cooling fin (33b) is preferably 30% to 60% of the height (h2) of the insulating part (35).

[0091] The test socket faces the lower insulating sheet (31) and may further include an upper insulating sheet (36) having through holes formed at positions corresponding to terminals of the semiconductor device. The lower insulating sheet (31) and the upper insulating sheet (36) perform the function of supporting the position of the conductive portion (34a).

[0092] The frame (32) is configured by being laminated on top of the lower insulating sheet (31), and protects the test socket from physical impact or external environment at the outer periphery of the conductive array (34) and the insulating portion (35).

[0093] The material of the lower insulating sheet (31) and the upper insulating sheet (36) is not particularly limited as long as it has insulation and flexibility, and polyimide, polyethylene, ethylene propylene copolymer, ethylene butene copolymer, ethylene octene copolymer, liquid crystal polymer, or a composite material thereof can be used.

[0094] The upper and lower surfaces of the conductive portion (34a) can be exposed to the outside through the through-hole (31a) of the lower insulating sheet (31) and the through-hole of the upper insulating sheet (36). The conductive portion (34a) can be formed by densely packing a plurality of conductive particles within an elastic insulating material. A polymer material having a cross-linked structure can be used as the elastic insulating material. As polymer materials, for example, conjugated diene rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, block copolymer rubbers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer and hydrogenated products thereof, chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like can be used, and silicone rubber can be preferably used.

[0095] The conductive particles in the conductive portion (34a) can be made of a magnetic material. Examples of the conductive particles include particles of a magnetic metal such as iron, cobalt, or nickel, or particles of an alloy thereof, or particles containing these metals, or particles using these particles as core particles and plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, or rhodium, or non-magnetic particles or inorganic particles such as glass beads, or polymer particles as core particles and plating the surface of the core particles with a conductive magnetic metal such as nickel or cobalt.

[0096] A test socket according to a second embodiment of the present invention is configured by stacking a lower insulating sheet (31), a frame (32), and a heat sink (33). At this time, the opening (31a) of the lower insulating sheet (31), the opening (32a) of the frame (32), and the opening (33a) of the heat sink (33) are aligned. The cooling fins of the heat sink can be insulated and coated. A liquid conductive material is injected into the upper side of the heat sink, and a magnetic field is applied to the opening (31a) of the lower insulating sheet (31) to form a conductive portion (34a) aligned with the opening (31a) of the lower insulating sheet (31), and an insulating portion (35) is formed in the remaining area. By manufacturing in this manner, a heat sink in which cooling fins are arranged inside the insulating portion can be manufactured.

[0097] Fig. 14 is a diagram illustrating the heating state of the conductive portion of a test socket when testing a semiconductor device using the test socket according to the second embodiment of the present invention. Compared to the heating state of the conductive portion of the test socket according to the prior art of Fig. 4, it can be confirmed that the temperature of the conductive portions located at the center of the test socket according to the second embodiment of the present invention hardly increases.

[0098] The above description is provided for illustrative purposes only, and those skilled in the art will readily appreciate that the present invention can be readily modified into other specific forms without altering the technical spirit or essential characteristics of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as integral may be implemented as separate components, and similarly, components described as integral may be implemented as integral components.

[0099] The scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

Claims

1. A test socket placed between a semiconductor device and a test device to conduct electricity between a terminal of the semiconductor device and a pad of the test device. A lower insulating sheet having through holes formed at each position corresponding to the pad of the above inspection device, A conductive part array in which a plurality of conductive parts formed in each through-hole of the lower insulating sheet are arranged in a plurality of conductive part rows and a plurality of conductive part columns, An insulating member that is disposed between a plurality of conductive members constituting the conductive member array and supports the conductive member array, and A heat dissipation member is disposed parallel to the conductive section rows inside an insulating member located between two adjacent conductive section rows among the conductive section arrays, and collects heat generated from the two adjacent conductive section rows. Test socket.

2. In paragraph 1, The heat dissipation member is inserted and arranged parallel to the conductive section row inside the insulating member located between the two adjacent conductive section rows, and includes a cooling member extending to the periphery of the conductive section array. Test socket.

3. In paragraph 2, The heat dissipation member is inserted and arranged parallel to the conductive row inside the insulating member located between two adjacent conductive row rows among the conductive row array, and further includes a cooling member extending to the outside of the conductive row array. Test socket.

4. In paragraph 2 or 3, The above cooling member is cooled by air cooling, Test socket.

5. In paragraph 2 or 3, The above cooling member is at least one of a hollow metal pipe and a metal rod, Test socket.

6. In paragraph 5, The above cooling member is one of copper, aluminum, silver, gold and alloys thereof. Test socket.

7. In paragraph 1, Further comprising a frame laminated on the lower insulating sheet and having an opening formed through which the conductive member array and the insulating member pass. Test socket.

8. In paragraph 7, The heat dissipation member includes a heat sink laminated on the frame and having a plurality of openings formed through which a plurality of conductive member rows of the conductive member array pass, The heat sink includes a plurality of cooling fins protruding into the interior of an insulating portion positioned between two adjacent conductive portion rows of the conductive portion array and arranged parallel to the conductive portion rows, The above plurality of cooling fins extend to the periphery of the frame, Test socket.

9. In paragraph 8, The above heat sink is cooled by air cooling, Test socket.

10. In paragraph 8, The heat sink extends to the socket guide and contacts the socket guide so that heat collected from the heat sink is conducted to the socket guide. Test socket.

11. In paragraph 10, The above socket guide is cooled by either an air-cooled cooling device or a water-cooled cooling device. Test socket.

12. In paragraph 8, The above plurality of cooling fins do not come into contact with the two adjacent conductive rows, Test socket.

13. In paragraph 8, The above plurality of cooling fins are insulated and coated and come into contact with the two adjacent conductive rows. Test socket.

14. In paragraph 8, The above heat sink is made of any one of copper, aluminum, silver, gold and alloys thereof. Test socket.

15. In paragraph 8, The above heat sink is a mixed sheet containing metal particles, Test socket.

16. In paragraph 15, The above mixed sheet is a sheet in which any one of copper, aluminum, and iron oxide is mixed with silicone rubber. Test socket.

17. In paragraph 8, The above heat sink is a mixed sheet containing a carbon-based heat-dissipating material. Test socket.

18. In paragraph 17, The above mixed sheet is a sheet in which one of carbon nanotubes (CNT), graphene, and graphite is mixed with silicone rubber. Test socket.

19. In paragraph 8, The height of the above cooling fin is 30% to 60% of the height of the above insulation, Test socket.

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