Silicone resin pad for manufacturing semiconductor having pattern structure

Abstract

Provided is a silicone resin pad having excellent uniformity, in which patterns are formed on the silicone resin pad. The silicone resin pad according to the present invention has very excellent uniformity when pressed, even over a large area, by means of a pattern structure, and furthermore, by combination of a pattern with a weight-average molecular weight, may obtain excellent uniformity even when pressed across a large area (at least 50 cm or more).

Description

Silicon resin pad for semiconductor manufacturing with pattern structure

[0001] The present invention relates to a silicon resin pad for semiconductor manufacturing having a pattern structure, and more specifically, to a silicon resin pad for semiconductor manufacturing having a pattern structure capable of mounting electronic devices such as semiconductor chips by pressing them with excellent uniformity.

[0002] As semiconductor line widths continue to shrink, various packaging technologies are being developed. However, these packaging processes require the technology to stack chips in multiple layers, and this requires the use of rubber-based pads, such as silicone resin.

[0003] However, as these silicone resin pads expand in size, they suffer from a problem of poor uniformity across the entire surface area when pressurized for mounting electronic components such as chips. Therefore, the development of a new silicone resin pad that can address this issue is necessary.

[0004] Therefore, the problem to be solved by the present invention is to provide a silicone resin pad having excellent uniformity and a method for manufacturing the same.

[0005] In order to solve the singeing problem, the present invention provides a silicone resin pad having excellent uniformity, characterized in that a pattern is formed on the silicone resin pad.

[0006] In one embodiment of the present invention, the pattern is rectangular, and the length of the pattern is 0.20 to 0.21 mm.

[0007] Additionally, the width / length ratio of the pattern is 1.00 to 1.02, and the weight average molecular weight of the silicone resin pad is 20,000 to 70,000.

[0008] The present invention also manufactures the silicone resin pad described above by injecting it into a mold and then curing it, and a corresponding pattern for obtaining the pattern is formed on the mold surface of the mold.

[0009] The silicone resin pad according to the present invention has excellent uniformity when pressed despite its large area through a pattern structure.

[0010] FIG. 1 is a pattern photograph of a pad (example) according to one embodiment of the present invention, and FIG. 2 is a pattern photograph of a pad (comparative example 1) having different shapes and numbers of patterns.

[0011] Figures 3 and 4 show the results of a pressure test according to Example 1 and Comparative Example 1.

[0012] Figure 5 shows the results of measuring the uniformity of the silicone resin pads of Example 1 and Comparative Examples 2, 3, and 4, respectively, at a force of 9 kgf / cm2.

[0013] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0014] Before describing the present invention in detail, it should be noted that the terms or words used in this specification should not be interpreted as being unconditionally limited to their usual or dictionary meanings, and the inventor of the present invention may appropriately define and use the concepts of various terms in order to describe his or her invention in the best possible manner.

[0015] Furthermore, it should be noted that these terms and words should be interpreted with meanings and concepts that are consistent with the technical idea of ​​the present invention.

[0016] That is, the terms used in this specification are only used to describe preferred embodiments of the present invention, and are not intended to specifically limit the contents of the present invention.

[0017] It should be noted that these terms are defined taking into account the various possibilities of the present invention.

[0018] Additionally, in this specification, a singular expression may include a plural expression unless the context clearly indicates a different meaning.

[0019] Also, it should be noted that even if similarly expressed in plural, it can contain singular meaning.

[0020] Throughout this specification, whenever a component is described as "including" another component, it may mean that the component may further include any other component, rather than excluding any other component, unless specifically stated otherwise.

[0021] A silicone resin pad according to one embodiment of the present invention provides a pad that prevents over-compression in a specific area when pressurized through a predetermined pattern, and also discharges air bubbles and the like to the outside, thereby achieving excellent uniformity. In one embodiment of the present invention, the predetermined pattern has a square shape, but its shape can be freely changed through a mold as described below.

[0022] In this specification, “pattern” means a curved structure having a certain repeatability and in which a negative-positive shape is formed on a surface.

[0023] FIG. 1 is a pattern photograph of a pad (example) according to one embodiment of the present invention, and FIG. 2 is a pattern photograph of a pad (comparative example 1) having different shapes and numbers of patterns.

[0024] Table 1 below is a table that summarizes the dimensions of the patterns of the silicone resin pads of FIGS. 1 and 2 and the number of patterns per unit length in width / height.

[0025] Pattern classification length (mm) Number of patterns 10 mm ÷ length 6 15 mm ÷ length Comparison example 1A 0.246 154 0.62 49 8.5 B 0.22 419 4 4.62 74 3.2 Example A 0.20 27 44 9.33 0 3.4 B 0.20 625 48.5 29 8 1.8

[0026] Referring to the above results, it can be seen that in the case of the present invention, the square pattern has a uniform length-to-width ratio compared to Comparative Example 1, and is relatively smaller than Comparative Example 1.

[0027] In particular, the present invention, in which the width-to-height ratio (C=A / B) is at the level of 1.01, shows a significant difference in the width-to-height ratio when compared to Comparative Example 1, in which C is at the level of 0.98. Therefore, the width-to-height ratio (C) of the pattern is preferably 1.00 to 1.02.

[0028] Figures 3 and 4 show the results of a pressure test according to Example 1 and Comparative Example 1.

[0029] Referring to FIGS. 3 and 4, it can be confirmed that the silicone resin pad according to the present invention can prevent over-compression in a specific area when pressurized through a predetermined pattern, and can also discharge bubbles and the like to the outside, thereby achieving excellent uniformity. In particular, it can be seen that there is a problem in discharging bubbles and the like to the outside when pressurizing when the pattern is larger than 0.21 mm or when there is a difference in the width / height ratio.

[0030] The mold pattern can be transferred to the pad by forming such a pattern in the mold during the process of manufacturing the pad using the injection molding method according to the present invention. In this case, the pad pattern can be obtained by bonding the mold itself or a separate layer having such a pattern shape to the mold.

[0031] The present invention further focuses on the fact that the combination of the radius of curvature and molecular weight significantly affects the pressure uniformity of a large-area silicone resin pad.

[0032] In one embodiment of the present invention, liquid silicone rubber (LSR) was cured at a temperature of 100 degrees Celsius to a size of 100 x 100 cm and a thickness of 20 mm based on the above embodiment. As a comparative example, HCR (High Constency Rubber, Shin-Etsu, Japan), a commercialized silicone rubber resin, was manufactured in the same pattern as Example 1.

[0033] Table 2 below shows the molecular weight measurement results.

[0034] Example Comparative Example 2 Comparative Example 3 Comparative Example 4 Number average molecular weight 1540 1520 1660 1341 Weight average molecular weight 510 309 123 1056 10490-

[0035] The above molecular weight measurement is a method using GPC, and the molecular weight and distribution are calculated by setting the baseline close to 0 or the lowest point as the end point. Referring to the above results, it can be seen that there is a large difference in the weight average molecular weight between the examples and comparative examples.

[0036] Figure 5 shows the results of measuring the uniformity of the silicone resin pads of Example 1 and Comparative Examples 2, 3, and 4, respectively, at a force of 9 kgf / cm2.

[0037] Referring to Figure 5, it can be seen that even with the same pattern, uniformity is greatly affected by molecular weight, especially the weight average molecular weight.

[0038] It is noteworthy that when the weight average molecular weight, rather than the number average molecular weight, is 20,000 to 70,000, more preferably 40,000 to 60,000, it affects the uniformity when pressing a large area (at least 50 cm) of the silicone resin pad.

[0039] A silicone resin pad according to one embodiment of the present invention is manufactured by injecting liquid silicone rubber (LSR) into a mold and then curing it.

[0040] To this end, a silicone resin pad according to one embodiment of the present invention is manufactured by a method including a step of injecting liquid silicone rubber (LSR) into a mold; and a step of curing the injected liquid silicone rubber (LSR), wherein a corresponding pattern for obtaining the above-described pattern is formed on the surface of the mold.

[0041] As described above, the silicone resin pad according to the present invention exhibits excellent uniformity when pressurized despite its large surface area through its pattern structure. Furthermore, excellent uniformity can be achieved even when pressurizing a large surface area (at least 50 cm ) by combining the pattern with the weight-average molecular weight.

[0042] The present invention relates to a silicone resin pad for semiconductor manufacturing having a pattern structure, and has industrial applicability.

Claims

1. As a silicone resin pad with excellent uniformity, A silicone resin pad characterized in that a pattern is formed on the silicone resin pad.

2. In paragraph 1, A silicone resin pad characterized in that the above pattern is square.

3. In paragraph 2, A silicone resin pad characterized in that the length of the above pattern is 0.20 to 0.21 mm.

4. In paragraph 3, A silicone resin pad characterized in that the width / height ratio of the above pattern is 1.00 to 1.

02.

5. In any one of paragraphs 1 to 4, A silicone resin pad, characterized in that the weight average molecular weight of the silicone resin pad is 20,000 to 70,000.

6. A silicone resin pad according to any one of claims 1 to 4, characterized in that it is manufactured by injecting liquid silicone rubber (LSR) into a mold and then curing it.

7. In paragraph 6, A silicone resin pad characterized in that a corresponding pattern for obtaining the pattern is formed on the mold surface of the mold.

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