Electric apparatus

Abstract

The purpose of the present invention is to further improve the heat dissipation properties of a heat-generating component within an electric apparatus This electric apparatus comprises: a housing; a mounting board that includes a base board and a heat-generating component mounted on the base board; and a heat transfer member that is located over the heat-generating component. The housing comprises: a heat dissipation surface that faces the inside of the housing; and a confirmation window that penetrates between the inside and outside of the housing in a region where the heat dissipation surface is formed. In a state in which the mounting board is accommodated within the housing, the heat transfer member is inserted between the heat-generating component and the heat dissipation surface.

Description

Electrical Equipment

[0001] The present disclosure relates to electrical equipment.

[0002] Patent Document 1 discloses an in-vehicle control device that includes a circuit board on which electronic components are mounted and a housing that houses the circuit board, the housing having a first opening that takes in air flowing in a first direction and a second opening that takes in air flowing in a second direction perpendicular to the first direction.

[0003] JP 2014-143232 A

[0004] In this regard, it is desirable to further improve the heat dissipation performance of heat-generating components in electrical equipment.

[0005] Therefore, an object of the present disclosure is to further improve the heat dissipation performance of heat-generating components in electrical equipment.

[0006] The electrical device disclosed herein comprises an exterior part, a mounting board including a substrate and a heat-generating component mounted on the substrate, and a heat-conducting member located on the heat-generating component, wherein the exterior part has a heat-dissipation target surface facing the interior of the exterior part and an inspection window portion penetrating the interior and exterior of the exterior part in the area where the heat-dissipation target surface is formed, and wherein when the mounting board is housed within the exterior part, the heat-conducting member is sandwiched between the heat-generating component and the heat-dissipation target surface.

[0007] According to the present disclosure, it is possible to further improve the heat dissipation performance of heat-generating components in electrical equipment.

[0008] FIG. 1 is a perspective view showing an electric device according to an embodiment. FIG. 2 is an exploded perspective view showing the electric device. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1. FIG. 4 is a perspective view showing the inside of a housing main body. FIG. 5 is a cross-sectional view showing the electric device in a manufacturing process. FIG. 6 is a cross-sectional view showing another electric device in a manufacturing process. FIG. 7 is a cross-sectional view showing yet another electric device in a manufacturing process. FIG. 8 is a perspective view showing an electric device according to a second embodiment. FIG. 9 is a perspective view showing an electric device according to the second embodiment. FIG. 10 is a partially exploded view of the electric device. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 9. FIG. 12 is a plan view showing the electric device. FIG. 13 is a cross-sectional view showing an electric device according to a third embodiment.

[0009] [Description of Embodiments of the Present Disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] The electrical device of the present disclosure is as follows.

[0011] (1) An electrical device comprising: an exterior part; a mounting board including a substrate and a heat-generating component mounted on the substrate; and a heat-conducting member located on the heat-generating component; wherein the exterior part has a heat-dissipation target surface facing the interior of the exterior part and an inspection window portion penetrating the interior and exterior of the exterior part in the area where the heat-dissipation target surface is formed; and wherein, when the mounting board is housed within the exterior part, the heat-conducting member is sandwiched between the heat-generating component and the heat-dissipation target surface.

[0012] According to the present disclosure, the state of the heat-conducting member between the heat-generating component and the heat-dissipating surface can be confirmed through the inspection window, which facilitates the establishment of a state in which heat from the heat-generating component is easily transferred to the exterior part via the heat-conducting member and dissipated, thereby further improving the heat dissipation performance of the heat-generating component in the electrical device.

[0013] (2) In the electrical device of (1), the exterior part may include a housing that covers the mounting board from all four sides and both sides, and the housing may have the heat dissipation target surface and the confirmation window part.

[0014] This allows the heat from the heat-generating components to be efficiently transferred to the housing and dissipated.

[0015] (3) In the electrical device of (1), the exterior part may include a housing that covers the mounting board from all four sides and both sides, and a heat dissipation part that is externally attached to the housing, the heat dissipation part having the heat dissipation surface and the inspection window, an opening formed in the housing at a position facing the heat-generating component, the heat dissipation part being externally attached to the housing so that the heat dissipation surface is positioned outside the opening, and the heat-conducting member may be sandwiched between the heat-generating component and the heat dissipation surface through the opening.

[0016] This allows the heat from the heat generating components to be efficiently transferred to the heat dissipating components outside the housing and dissipated.

[0017] (4) In the electrical device of (3), the heat dissipation section may include a fixing section that is fixed to a support object of the housing.

[0018] This allows the housing to be fixed to the support object via the fixing portion of the heat dissipation portion.

[0019] (5) In any one of the electrical devices (2) to (4), the housing may have a housing body having an opening and a lid that closes the opening, and the housing body may have a guide portion that guides the board from the opening side toward the back side of the housing body.

[0020] This allows the board to be assembled to the housing body by simply moving the board to the rear side of the housing body while being guided by the guide portion, thereby reducing the number of steps required for assembling the board.

[0021] (6) In any one of the electrical devices (2) to (4), the housing may be divided into a first part including a part facing one main surface of the substrate, and a second part including a part facing the other main surface of the substrate.

[0022] This allows the first and second portions to have large openings, making it easy to incorporate the substrate into the first or second portion.

[0023] (7) In the electrical device of any one of (1) to (6), the heat conducting member may be provided with a position recognition mark.

[0024] This makes it easy to recognize the position of the heat conducting member relative to the heat generating component using the position recognition mark as a clue.

[0025] [Details of the embodiments of the present disclosure] Specific examples of the electrical device of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0026] First Embodiment An electrical device according to a first embodiment will be described below.

[0027] <Overall Configuration> The overall configuration of the electrical device 10 will be described. Fig. 1 is a perspective view showing the electrical device 10. Fig. 2 is an exploded perspective view showing the electrical device 10. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1.

[0028] The electrical device 10 includes a housing 21 as an exterior part, a mounting board 40 , and a heat conducting member 18 .

[0029] The housing 21 is formed in a shape that surrounds the mounting board 40 from all four sides and both sides, and in this case, is formed in a flat box shape.

[0030] The housing 21 includes a housing body 22 and a lid 30 .

[0031] The housing body 22 is a case having an opening 22h. A space capable of accommodating the mounting board 40 is formed inside the housing body 22. In this embodiment, the housing body 22 is formed in the shape of a flat rectangular parallelepiped with one side open.

[0032] More specifically, the housing main body 22 includes a bottom plate 22a, a ceiling plate 22b, a pair of side plates 22c, and a rear plate 22d. The bottom plate 22a is formed in a rectangular shape. A pair of side plates 22c extend from two opposing edges of the bottom plate 22a. A rear plate 22d extends from one edge connecting the two opposing edges of the bottom plate 22a. The ceiling plate 22b is connected to the pair of side plates 22c and the upper edges of the rear plate 22d. This forms an accommodation space surrounded by the pair of side plates 22c and the rear plate 22d between the bottom plate 22a and the ceiling plate 22b. The bottom plate 22a covers the lower surface of the mounting board 40, the ceiling plate 22b covers the upper surface of the mounting board 40, and the pair of side plates 22c and the rear plate 22d surround the mounting board 40 on three sides.

[0033] The opening 22h is open on the opposite side of the back plate 22d. The mounting board 40 is accommodated in the accommodation space through the opening 22h.

[0034] The ceiling plate 22b has a recess 22bg that is partially recessed. For example, the recess 22bg is formed by recessing a portion of the ceiling plate 22b near the rear plate 22d and between the pair of side plates 22c. By partially recessing the ceiling plate 22b, the recess 22bg can be easily positioned close to the mounting board 40, and other portions of the ceiling plate 22b can easily secure space to accommodate components mounted on the mounting board 40. Furthermore, when inserting the mounting board 40 into the housing main body 22, the heat conduction member 18 is less likely to come into contact with the inside of the housing main body 22 on the front side of the recess 22bg, which also helps prevent the heat conduction member 18 from shifting out of position.

[0035] The housing body 22 may be made of metal or resin.

[0036] The opening 22h is closed by the lid 30. For example, the lid 30 includes a lid main body 32 and a locking fixing portion 34.

[0037] The lid body 32 is formed into a shape that fits into the opening of the housing body 22. The lid body 32 may be formed with a connector opening 32h for exposing the connector 46 mounted on the mounting board 40 to the outside.

[0038] The locking and fixing portions 34 are portions for supporting the lid 30 in a state where it is attached to the housing body 22. For example, locking protrusions 22ca are formed on the outer surfaces of the pair of side plates 22c of the housing body 22, near the opening 22h. Furthermore, a pair of locking and fixing portions 34 extend from both side portions of the lid body 32 toward the outer surfaces of the pair of side plates 22c. Locking recesses 34g into which the locking protrusions 22ca fit are formed in the locking and fixing portions 34.

[0039] With the lid body 32 fitted into the opening 22h, the pair of locking fixing portions 34 are disposed on the outer surfaces of the pair of side plates 22c, and the pair of locking protrusions 22ca are locked into the pair of locking recesses 34g. As a result, the lid body 32 fitted into the opening 22h is fixed to the housing body 22.

[0040] The configuration for fixing the lid 30 to the housing body 22 is not limited to the above example. For example, the lid may be fixed to the housing body by screws, caulking, etc. The housing body 22 and the lid 30 may be understood to constitute the housing.

[0041] The mounting board 40 includes a substrate 42 and a heat-generating component 44 .

[0042] The substrate 42 is, for example, a circuit board, which includes an insulating plate and a circuit pattern formed of copper foil or the like.

[0043] The heat-generating component 44 is mounted on the substrate 42 by soldering or the like. The heat-generating component 44 is an element that generates heat in an electric circuit, such as an electromagnetic relay, a semiconductor switch, a fuse, or an IC (Integrated Circuit).

[0044] The number and positions of the heat-generating components 44 on the substrate 42 are arbitrary. In this embodiment, a plurality of heat-generating components 44 (two in the figure) are mounted and fixed at intervals on the substrate 42. The heat-generating components 44 are located in a portion of the substrate 42 facing the recess 22bg.

[0045] In this embodiment, a connector 46 is mounted on the board 42. For example, the connector 46 is mounted on a portion of the board 42 closer to the opening 22h. In this embodiment, three connectors 46 are mounted on the board 42. The lid main body 32 is formed with rectangular connector openings 32h corresponding to the positions of the three connectors 46. Note that the outline of the connector 46 is shown in each drawing.

[0046] Other electrical components may be mounted on the substrate 42 .

[0047] <Heat Dissipation Structure> The electric device 10 has the following heat dissipation structure for dissipating heat generated by the heat-generating components 44 to the outside.

[0048] That is, the electric device 10 includes a thermally conductive member 18 located on the heat-generating component 44. The thermally conductive member 18 is a thermal interface material (TIM). The thermally conductive member 18 has better thermal conductivity than air. The thermally conductive member 18 is formed to be the same size as the upper surface of the heat-generating component 44 or to extend larger than the upper surface.

[0049] The thermally conductive member 18 is, for example, a thermally conductive sheet. The thermally conductive sheet is, for example, a resin sheet filled with a filler having good thermal conductivity. The thermally conductive member 18 may be thermally conductive rubber, ceramics, or thermally conductive grease. The thermally conductive member 18 may be a laminate of a hard material such as a thermally conductive sheet and an easily deformable material such as thermally conductive grease.

[0050] The housing 21, which serves as an exterior part, has a heat dissipation target surface 22bf. In this embodiment, the housing main body 22 has the heat dissipation target surface 22bf. More specifically, when the mounting board 40 is housed in the housing main body 22, the heat-generating component 44 faces the inner surface of the recess 22bg. The inner surface of the recess 22bg is the heat dissipation target surface 22bf.

[0051] With the mounting board 40 housed in the housing body 22, the heat conduction member 18 is sandwiched between the heat-generating component 44 and the heat dissipation target surface 22bf. In this state, the lower surface of the heat conduction member 18 is in surface contact with the upper surface of the heat-generating component 44, and the upper surface of the heat conduction member 18 is in surface contact with the heat dissipation target surface 22bf. This makes it easy for heat from the heat-generating component 44 to be conducted to the housing body 22 via the heat conduction member 18. The heat conducted to the housing body 22 is dissipated from the housing body 22 to the outside.

[0052] The housing 21, which serves as an exterior part, has a confirmation window 22bh that penetrates the housing 21 from the inside to the outside in the region where the heat dissipation target surface 22bf is formed. The confirmation window 22bh is partially open in the region where the heat dissipation target surface 22bf extends. In this embodiment, the confirmation window 22bh is formed in a portion of the recess 22bg that is located above each heat-generating component 44. The confirmation window 22bh is formed as an opening that is smaller than the top surface of the heat-generating component 44. Therefore, a portion of the top surface of the heat conduction member 18 is exposed within the confirmation window 22bh. In this embodiment, the confirmation window 22bh is a rectangular opening. The confirmation window 22bh may also have another shape, such as a circular or polygonal opening.

[0053] The position of the heat conduction member 18 can be confirmed through the confirmation window 22bh. For example, if the confirmation window 22bh is entirely covered by the heat conduction member 18, it can be confirmed that the heat conduction member 18 is disposed in a position suitable for heat dissipation relative to the heat-generating component 44. For example, if the heat conduction member 18 cannot be seen within the confirmation window 22bh or if the edge of the heat conduction member 18 is visible, it can be confirmed that the heat conduction member 18 is displaced from a position suitable for heat dissipation relative to the heat-generating component 44.

[0054] <Guide Configuration> Fig. 4 is a perspective view showing the inside of the housing main body 22. As shown in Figs. 1 to 4, the mounting board 40 is housed in the housing main body 22 through the opening 22h. Inside the housing main body 22, the mounting board 40 is held on the bottom plate 22a in a position along the bottom plate 22a.

[0055] In order to hold the mounting board 40 in the housing body 22 in the above-mentioned position, the housing body 22 has a guide portion 24 that guides the board 42 from the opening 22h side toward the back side of the housing body 22.

[0056] When the mounting board 40 is guided by the guide portion 24, the heat conduction member 18 on the heat-generating component 44 moves inside the heat dissipation target surface 22bf and is then pressed against the heat dissipation target surface 22bf. If the heat conduction member 18 comes into contact with the heat dissipation target surface 22bf while moving inside the heat dissipation target surface 22bf, the heat conduction member 18 may become misaligned from the heat-generating component 44. If the heat conduction member 18 becomes misaligned from the heat-generating component 44, the contact area between the heat-generating component 44 and the heat conduction member 18 may decrease.

[0057] When the mounting board 40 is guided by the guide portion 24, the following configuration is employed to prevent the heat conduction member 18 from being displaced due to contact between the heat conduction member 18 and the heat dissipation target surface 22bf.

[0058] In other words, the guide portion 24 is configured to guide the substrate 42 so as to reduce the distance between the heat dissipation target surface 22bf and the heat-generating component 44 in a direction perpendicular to the heat dissipation target surface 22bf as the substrate 42 moves from the opening 22h side toward the rear of the housing main body 22.

[0059] More specifically, a pair of guide portions 24 are formed on the inner sides of the pair of side plates 22 c of the housing body 22 .

[0060] The guide portion 24 has a guide inclined surface 25 and an opposite guide surface 26 .

[0061] The guide inclined surface 25 is a surface that faces the heat dissipation target surface 22bf in a direction perpendicular to the heat dissipation target surface 22bf. The opposite guide surface 26 is a surface that faces the guide inclined surface 25.

[0062] The guide slope 25 and the opposite guide surface 26 are elongated rectangular surfaces that extend from the opening 22h side toward the back side of the housing body 22 on the inner side of the side plate 22c.

[0063] The guide slope 25 and the opposite guide surface 26 may extend from the opening 22h of the housing body 22 toward the rear side of the housing body 22 as a starting point, or may extend from a position spaced apart inward from the opening 22h of the housing body 22 as a starting point toward the rear side of the housing body 22. The guide slope 25 and the opposite guide surface 26 may reach the rear plate 22d of the housing body 22, or may end at a position just before the rear plate 22d.

[0064] In this embodiment, the guide slope 25 and the opposite guide surface 26 start from a position spaced inward from the opening 22h of the housing body 22 and extend toward the rear side of the housing body 22 to reach the rear plate 22d.

[0065] The guide slope 25 extends such that the distance from the heat dissipation target surface 22bf in a direction perpendicular to the heat dissipation target surface 22bf gradually decreases from the opening 22h side toward the back side of the housing body 22. In this embodiment, the guide slope 25 is a surface that inclines so as to approach the heat dissipation target surface 22bf as it extends from the opening 22h side toward the back side.

[0066] It should be noted that it is not essential for the guide portion 24 to have the guide slope 25, which is a slope that extends in a plane. The guide portion may have, for example, a curved guide surface or a guide surface that has a step.

[0067] The opposite guide surface 26 extends parallel to the heat dissipation target surface 22bf. Therefore, the distance between the guide slope 25 and the opposite guide surface 26 is larger on the opening 22h side than on the rear side of the housing main body 22. Here, the distance between the guide slope 25 and the opposite guide surface 26 gradually decreases from the opening 22h side toward the rear side. The distance between the guide slope 25 and the opposite guide surface 26 on the rear side of the housing main body 22 may be set to be approximately the same as the thickness of the board 42 or to a size large enough to allow the board 42 to be press-fitted.

[0068] A guide groove is formed between the guide slope 25 and the opposite guide surface 26, with the guide slope 25 and the opposite guide surface 26 as a pair of side surfaces and the inward surface of the side plate 22 c as a bottom surface. This guide groove guides the side edge of the substrate 42.

[0069] As each of the side edges of the substrate 42 moves within the guide groove, the guide slopes 25 gradually move the side edges of the substrate 42 toward the heat dissipation target surface 22bf. As a result, as the heat-generating component 44 and the heat conduction member 18 move toward the heat dissipation target surface 22bf, they approach the heat dissipation target surface 22bf as they move toward the back of the housing main body 22. Therefore, when the heat-generating component 44 and the heat conduction member 18 are positioned closer to the opening 22h than the heat dissipation target surface 22bf within the housing main body 22, the heat conduction member 18 can be positioned away from the heat dissipation target surface 22bf. Then, when the heat-generating component 44 and the heat conduction member 18 reach the inside of the heat dissipation target surface 22bf within the housing main body 22, the heat conduction member 18 can come into contact with the heat dissipation target surface 22bf.

[0070] The opposite guide surface 26 may be omitted.

[0071] The front or back side of the guide slope 25 may be continuous with a surface parallel to the heat dissipation target surface 22bf or a surface that is more inclined than the guide slope 25. The front or back side of the opposite guide surface 26 may be continuous with a surface that is more inclined than the opposite guide surface 26.

[0072] The housing body 22 may have a rear support surface 27af located at the rear of the housing body 22. The rear support surface 27af faces the heat dissipation target surface 22bf in a direction perpendicular to the heat dissipation target surface 22bf and is parallel to the heat dissipation target surface 22bf. Note that "parallel" includes "parallel within a tolerance range," for example, including parallelism within a range in which the parallelism provides an advantageous effect. For example, "the rear support surface 27af being parallel to the heat dissipation target surface 22bf" includes parallelism to the extent that the heat conduction member 18 can be in surface contact with the heat dissipation target surface 22bf. In this embodiment, support protrusions 27 are formed at positions inside both side edges of the rear plate 22d. In this embodiment, two support protrusions 27 are formed spaced apart in the width direction of the rear plate 22d.

[0073] The support protrusion 27 is a protruding portion that extends between the bottom plate 22a and the ceiling plate 22b on the inward-facing portion of the rear plate 22d. A partial recess is formed in the middle of the extension direction of the support protrusion 27. A rear support surface 27af is formed on the bottom plate 22a side of the recess. As described above, the rear support surface 27af is parallel to the heat dissipation target surface 22bf. Therefore, the rear end of the substrate 42 is supported on the rear support surface 27af, which makes it easy to maintain the substrate 42 in a position parallel to the heat dissipation target surface 22bf.

[0074] An opposing support surface 27bf is formed on the support protrusion 27 on the ceiling plate 22b side of the recess. The opposing support surface 27bf faces the rear support surface 27af with a gap therebetween. The opposing support surface 27bf is parallel to the heat dissipation target surface 22bf. A gap large enough to allow the rear end of the substrate 42 to be press-fitted is formed between the opposing support surface 27bf and the rear support surface 27af. In other words, a gap slightly smaller than the thickness of the rear end of the substrate 42 is formed between the opposing support surface 27bf and the rear support surface 27af, allowing the rear end to be press-fitted.

[0075] Guide surfaces 27afg, 27bfg that gradually increase the distance between the recesses may be formed on the opening 22h side of the rear support surface 27af and the opposing support surface 27bf, respectively, so that the rear end of the substrate 42 is smoothly guided between the rear support surface 27af and the opposing support surface 27bf by the guide surfaces 27afg, 27bfg.

[0076] The support protrusion 27 can function as a press-fit support portion into which the rear end of the substrate 42 is press-fitted at the rear side of the housing body 22 .

[0077] The rear support surface may be continuous with the rear side of the guide slope 25 .

[0078] Furthermore, a press-fit support portion may be formed on the rear side of the guide portion 24. For example, the rear support surface may be continuous with the rear side of the guide slope 25, and the opposing support surface may be continuous with the rear side of the opposite guide surface 26, so that the press-fit support portion is formed on the rear side of the guide portion 24. The press-fit support portion may be formed by setting the distance on the rear side between the guide slope and the opposite guide surface to be smaller than the thickness of the substrate 42.

[0079] The rear plate 22d may have a protrusion restricting piece 28 that restricts the rear end of the substrate 42 from the heat dissipation target surface 22bf side. In this embodiment, the protrusion restricting piece 28 is formed on the outer side of the support protrusion 27.

[0080] <Support Structure Using Lid> The portion of the substrate 42 that is disposed on the rear side of the housing body 22 is held close to the heat dissipation target surface 22bf by the guide portion 24 and the rear support surface 27af.

[0081] When the mounting board 40 is housed deep inside the housing body 22, the surface of the board 42 opposite to the heat dissipation target surface 22bf is supported by the lid 30 from the opening 22h side.

[0082] More specifically, a board support wall 36 is formed on a portion of the lid body 32 of the lid 30 that faces the inside of the housing body 22. The board support wall 36 is formed, for example, between the connector openings 32h. The board support wall 36 is formed in a plate shape that is perpendicular to the direction connecting the pair of side plates 22c.

[0083] A slit 36s is formed at the tip of the substrate support wall 36, into which the end of the substrate 42 on the opening 22h side can be inserted. The surface located on the bottom plate 22a side of the slit 36s is a back surface support surface 36f that supports the surface of the substrate 42 opposite the heat dissipation target surface 22bf. The back surface support surface 36f is formed on an extension of the rear support surface 27af. Therefore, the surface of the substrate 42 opposite the heat dissipation target surface 22bf is supported by the back surface support surface 36f and the rear support surface 27af in a constant position parallel to the bottom plate 22a.

[0084] In the direction perpendicular to the heat dissipation target surface 22bf, the distance between the rear support surface 36f (or the rear support surface 27af) and the heat dissipation target surface 22bf is set to be equal to but smaller than the sum of the thickness of the substrate 42, the mounting height of the heat-generating component 44, and the thickness of the heat conduction member 18. For example, if the heat conduction member 18 is compressible and deformable, the distance may be smaller than the sum.

[0085] When the mounting board 40 is housed deep inside the housing body 22, the surface of the board 42 opposite the heat dissipation target surface 22bf is supported by the back support surface 36f and the rear support surface 27af, so that the heat conduction member 18 is supported so as to be in surface contact with the heat dissipation target surface 22bf.

[0086] The opening of the slit 36 ​​s may be formed to widen toward the tip of the slit 36 ​​s. The surface of the opening of the slit 36 ​​s located on the bottom plate 22 a side is a lid-side guide surface 36 g that moves away from the back surface as it moves from the back surface support surface 36 f toward the back side of the housing main body 22.

[0087] In this embodiment, the lid 30 serves as an opening-side support member that supports the surface of the substrate 42 opposite the heat dissipation target surface 22bf from the opening 22h side when the mounting substrate 40 is housed deep within the housing main body 22. A member other than the lid 30 may serve as the opening-side support member. For example, a wedge-shaped opening-side support member may be inserted between the opposite guide surface 26 and the side of the substrate 42.

[0088] The configuration for supporting the substrate is not limited to the above example. For example, the guide slope 25 may be a guide surface that is parallel to the heat dissipation target surface 22bf.

[0089] <Example of Manufacturing Method> An example of a manufacturing method for the electrical device 10 will be described.

[0090] As shown in Figure 5, a mounting board 40 is prepared with a heat-conducting member 18 placed on a heat-generating component 44. Then, the rear end of the board 42 of the mounting board 40, opposite the connector 46, is inserted into the opening 22h of the housing main body 22. Then, both sides of the rear end of the board 42 are inserted into the opening 22h side of the guide part 24. At the end of the opening 22h side of the guide part 24, the guide slope 25 and the opposite guide surface 26 are widely separated, so that both sides of the rear end of the board 42 can be easily inserted between the guide slope 25 and the opposite guide surface 26.

[0091] 6 , the mounting board 40 is inserted into the rear side of the housing main body 22 while both sides of the rear end of the board 42 are guided by the guide slopes 25. While the mounting board 40 is moving toward the rear side of the housing main body 22, both sides of the rear end of the board 42 are guided by the middle parts in the extending direction of the guide slopes 25. Because the middle parts in the extending direction of the guide slopes 25 are relatively far away from the heat dissipation target surface 22bf, the heat conduction member 18 is unlikely to come into contact with the heat dissipation target surface 22bf.

[0092] Furthermore, even when the mounting board 40 is moved to the rear side of the housing body 22, the mounting board 40 is inclined along the guide slope 25. Therefore, if the heat conduction member 18 is positioned closer to the opening 22h than the rear side of the guide slope 25, the heat conduction member 18 is unlikely to come into contact with the heat dissipation target surface 22bf even when the mounting board 40 is moved to the rear side of the housing body 22.

[0093] 7, when the mounting board 40 is pushed further into the housing body 22, the rear end of the board 42 is press-fitted and supported between the rear support surface 27af and the opposing support surface 27bf. Preferably, the portion of the mounting board 40 on the opening 22h side is lifted, and the board 42 approaches a position parallel to the heat dissipation target surface 22bf.

[0094] 3 and 7, the lid 30 is attached to the housing body 22 so as to close the opening 22h. At this time, the end of the substrate 42 on the opening 22h side is inserted into the slit 36s and supported on the back support surface 36f. This keeps the substrate 42 parallel to the heat dissipation target surface 22bf. Then, the heat conduction member 18 comes into surface contact with the heat dissipation target surface 22bf.

[0095] When the end of the substrate 42 on the opening 22h side is inserted into the slit 36s, the end comes into contact with the lid side guide surface 36g, and is smoothly guided between the back support surface 36f and the opposing support surface 27bf.

[0096] In this state, it is confirmed through the confirmation window 22bh that the confirmation window 22bh is completely blocked by the heat conduction member 18, that there is no gap between the heat dissipation target surface 22bf and the heat conduction member 18, etc. This makes it possible to confirm whether the heat conduction member 18 is interposed between the heat-generating component 44 and the heat dissipation target surface 22bf in the intended state.

[0097] The lid 30 may be fixed to the mounting substrate 40 in advance.

[0098] <Effects, etc.> With the electric device 10 configured as described above, the state of the heat conduction member 18 between the heat-generating component 44 and the heat dissipation target surface 22bf can be confirmed through the confirmation window 22bh. For example, it can be confirmed whether all or most of the surface of the heat conduction member 18 facing the heat-generating component 44 is in contact with the heat-generating component 44. It can also be confirmed whether there is a gap between the heat conduction member 18 and the heat dissipation target surface 22bf, or whether the heat conduction member 18 is pressed strongly against the heat dissipation target surface 22bf. This makes it easier to establish a state in which heat from the heat-generating component 44 is easily transferred to the housing 21 via the heat conduction member 18 and dissipated, thereby further improving the heat dissipation performance of the heat-generating component 44 in the electric device 10.

[0099] Furthermore, since the housing 21 is formed with the heat dissipation target surface 22bf and the confirmation window 22bh, it is possible to easily realize a configuration that can efficiently transfer and dissipate heat from the heat-generating component 44 to the housing 21.

[0100] Furthermore, the housing body 22 has a guide portion 24 that guides the circuit board 42 from the opening 22h toward the rear of the housing body 22. Therefore, by guiding the circuit board 42 along the guide portion 24 and moving it toward the rear of the housing body 22, the circuit board 42 can be assembled to the housing body 22. This reduces the number of steps required to assemble the circuit board 42. When the circuit board 42 is slid, the heat conduction member 18 placed on the heat-generating component 44 may come into contact with the inner surface of the housing body 22, potentially causing it to become misaligned with respect to the heat-generating component 44. It is convenient that the position of the heat conduction member 18 can be confirmed through the confirmation window 22bh when the circuit board 42 is inserted deep into the housing body 22.

[0101] [Embodiment 2] An electric device 110 according to embodiment 2 will be described. Figures 8 and 9 are perspective views showing the electric device 110 according to embodiment 2. Figure 10 is a partially exploded view of the electric device 110. Figure 11 is a cross-sectional view taken along line XI-XI in Figure 9. Figure 12 is a plan view showing the electric device 110. In the description of embodiment 2, the same components as those described in embodiment 1 will be assigned the same reference numerals and their description will be omitted, and the description will focus on the differences from embodiment 1.

[0102] In this embodiment, the exterior part 110A includes a housing 121 and a bracket 150 as a heat dissipation part. That is, in this embodiment, the bracket 150 is added to the first embodiment.

[0103] The housing 121, like the housing 21, covers the four sides and both sides of the mounting board 40. The housing 121 includes a housing body 122 and a lid 30.

[0104] The housing body 122 differs from the housing body 22 in the following respects: the heat dissipation target surface 22bf and the confirmation window 22bh are omitted from the housing body 122. Instead, an opening 123h is formed in the housing body 122 at a position facing the heat-generating component 44.

[0105] It is preferable that the opening 123h is an opening that is larger than the heat-generating component 44. If the opening 123h is larger than the heat-generating component 44, the heat-conducting member 18 arranged on the heat-generating component 44 can be easily exposed to the outside through the opening 123h from inside the housing main body 122. Exposing the heat-conducting member 18 to the outside makes it easier to bring the heat-conducting member 18 into contact with the bracket 150.

[0106] In this embodiment, a plurality of (here, two) heat-generating components 44 are mounted on the mounting board 40. The opening 123h is formed to be larger than the arrangement area of ​​the plurality of heat-generating components 44. Therefore, the plurality of heat-conducting members 18 arranged on the plurality of heat-generating components 44 can be exposed to the outside of the housing main body 122 through the single common opening 123h.

[0107] In plan view, it is preferable, but not essential, that the heat conducting member 18 extend over the same area as the heat generating component 44. It is preferable that the opening 123h extend wider than the heat conducting member 18.

[0108] The bracket 150 is attached to the outside of the housing 121. The bracket 150 has a heat dissipation target surface 153bf and a confirmation window 153bh.

[0109] For example, the bracket 150 is formed by pressing a metal plate. The bracket may also be a resin molded product.

[0110] The bracket 150 includes a pressing portion 151 , legs 156 a , 156 a , and 157 , and a fastening portion 159 .

[0111] The pressing portion 151 is a portion that presses down the ceiling plate 22b. For example, the pressing portion 151 includes a pressing body portion 152 that extends along the width direction of the ceiling plate 22b, and an additional pressing portion 153 that presses down the recessed portion 22bg.

[0112] The additional pressing portion 153 curves in a stepped manner from the longitudinal middle of the pressing body portion 152 and extends along the outward surface of the recess 22bg. The portion of the additional pressing portion 153 that faces outward from the recess 22bg and is positioned outside the opening 123h is the heat dissipation target surface 153bf. The hole of the additional pressing portion 153 that penetrates the inside and outside of the bracket 150 on the heat dissipation target surface 153bf is the confirmation window portion 153bh.

[0113] The additional pressing portion 153 preferably extends wider than the opening 123h and entirely covers the opening 123h, thereby covering the mounting board 40 so that it is not exposed to the outside of the exterior portion 110A.

[0114] In plan view, the confirmation window 153bh is preferably set in the same region with respect to the heat-generating component 44 as the confirmation window 22bh.

[0115] A pair of legs 156a, 156a are provided on both ends of the presser body 152. The pair of legs 156a extend from the ceiling plate 22b toward the bottom plate 22a along the outer surfaces of the pair of side plates 22c of the housing body 122.

[0116] A leg 157 is provided at the tip of the additional pressing portion 153. The leg 157 extends along the outer surface of the back plate 22d of the housing body 122 from the ceiling plate 22b toward the bottom plate 22a.

[0117] Embracing portions 155a that embrace both side edges of the legs 156a, 156a, and 157 may be formed on the outer surfaces of the pair of side plates 22c and the outer surface of the rear plate 22d. The embracing portions 155a can also be said to be portions that form grooves on the outer surfaces of the pair of side plates 22c and the outer surface of the rear plate 22d, into which both side edges of the legs 156a, 156a, and 157 are fitted.

[0118] Positioning holes 156ah, 156ah, 157h may be formed in the legs 156a, 156a, 157, respectively, and positioning protrusions 155b that fit into the positioning holes 156ah, 156ah, 157h may be formed on the outer surfaces of the pair of side plates 22c and the outer surface of the rear plate 22d, respectively.

[0119] A fastening portion 159 is formed from the tip of each of the legs 156 a, 156 a, 157 so as to extend toward the outside of the housing 121. The fastening portion 159 has a hole formed therein through which a fastener such as a screw or a rivet is inserted.

[0120] With the electrical device 110 placed on the target surface, the fastening part 159 is placed on the target surface. In this state, a fastener is inserted through the hole in the fastening part 159 and fastened to the target surface. In this way, the electrical device 110 is fixed to the target surface.

[0121] Furthermore, the heat-conducting member 18 on the heat-generating component 44 is exposed to the outside of the housing body 122 through the opening 123h. By fixing the electrical device 110 to the fixing target surface with the bracket 150, the bracket 150 is externally attached to the housing 121 so that the heat-dissipation target surface 153bf is positioned outside the opening 123h. This causes the heat-dissipation target surface 153bf to be pressed against the heat-conducting member 18 exposed through the opening 123h. In other words, the heat-conducting member 18 is sandwiched between the heat-generating component 44 and the heat-dissipation target surface 153bf through the opening 123h. This allows heat from the heat-generating component 44 to be transferred to the heat-dissipation target surface 153bf via the heat-conducting member 18. The heat is dissipated by being released to the outside from the bracket 150 or transferred to the fixing target surface.

[0122] The heat conduction member 18 is set to a thickness that allows it to be in surface contact with both the heat-generating component 44 and the heat dissipation target surface 153bf. The heat conduction member 18 may also be set to a thickness that allows it to be sandwiched in a compressed state between the heat-generating component 44 and the bracket 150.

[0123] The heat dissipation component does not need to be configured as the bracket 150 having a fastening portion. The heat dissipation component may be a heat sink solely for the purpose of heat dissipation, and may be configured to be fixed to the housing with screws, double-sided tape, or adhesive.

[0124] According to this electric device 110, by providing the confirmation window 153bh, the state of the heat conducting member 18 between the heat generating component 44 and the heat dissipation target surface 153bf can be confirmed through the confirmation window 153bh, as in the first embodiment. This facilitates establishing a state in which heat from the heat generating component 44 is easily transferred to the exterior portion via the heat conducting member 18 and dissipated, thereby further improving the heat dissipation performance of the heat generating component 44 in the electric device 110. For example, if the heat conducting member 18 indicated by the two-dot chain line in FIG. 12 is displaced from its position on the heat generating component 44, the edge of the heat conducting member 18 can be seen through the confirmation window 153bh. This allows the displacement of the heat conducting member 18 to be recognized.

[0125] Furthermore, by attaching the bracket 150 to the housing 121 so that the heat dissipation target surface 153bf is positioned outside the opening 123h, the heat conduction member 18 is sandwiched between the heat-generating component 44 and the heat dissipation target surface 153bf through the opening 123h. Therefore, the heat from the heat-generating component 44 can be efficiently transferred to the bracket 150 outside the housing 121 and dissipated.

[0126] Furthermore, since the heat dissipation target surface 153bf includes a fastening fixing portion as a fixing portion that is fixed to a support object of the housing 121, heat dissipation can be easily achieved by utilizing the structure that fixes the housing 121.

[0127] 10 and 12, a position recognition mark 18M may be provided on the heat conduction member 18. The position recognition mark 18M is, for example, a mark that can be recognized from the outside, and may be provided with ink, may be provided by modification using a laser or the like, or may be a three-dimensional mark.

[0128] The position recognition mark 18M may be a cross-shaped mark, a polygonal or circular mark, a mark applied over the entire area, or a grid-shaped or multiple concentric circle-shaped mark.

[0129] By checking the positional relationship between the confirmation window 153bh and the position recognition mark 18M, the position of the heat conduction member 18 relative to the confirmation window 153bh can be ascertained. Since the mounting board 40 is supported at a fixed position relative to the housing 121, by checking the position of the heat conduction member 18 relative to the confirmation window 153bh, the position of the heat conduction member 18 relative to the heat-generating component 44 can also be confirmed.

[0130] The position recognition mark 18M may be applied to the first embodiment and the third embodiment described later.

[0131] [Embodiment 3] An electric device 210 according to embodiment 3 will be described. Fig. 13 is a cross-sectional view showing the electric device 210 according to embodiment 3. In the description of embodiment 3, the same components as those described in embodiment 1 or 2 will be assigned the same reference numerals and description thereof will be omitted.

[0132] Electric device 210 includes housing 221. Housing 221 is divided into first portion 221A including a portion facing one main surface of substrate 42, and second portion 221B including a portion facing the other main surface of substrate 42. For example, electric device 210 has a structure in which a flat rectangular parallelepiped case is divided into two.

[0133] The first portion 221A and the second portion 221B are held together by screws, a fitting structure, adhesive, or the like. The housing 221 that houses the mounting board 40 is configured when the first portion 221A and the second portion 221B are combined. That is, in the first and second embodiments, the configuration in which the mounting board 40 is housed in the exterior portion by a sliding system has been described. In this embodiment, the mounting board 40 can be fixed to the first portion 221A or the second portion 221B, which have a large opening, by screws or the like, rather than by a sliding system.

[0134] An opening 220Bh corresponding to the opening 123h is formed in the second portion 221B.

[0135] A bracket 250 corresponding to the bracket 150 is externally attached to the housing 221. A heat dissipation target surface 252bf corresponding to the heat dissipation target surface 153bf and a confirmation window 252bh corresponding to the confirmation window 153bh are formed in the bracket 250. When the bracket 250 is externally attached to the housing 221, it covers the opening 220Bh of the bracket 250. In addition, the heat conduction member 18 on the heat-generating component 44 is exposed through the opening 220Bh. The heat conduction member 18 is sandwiched between the heat dissipation target surface 252bf of the bracket 250 and the heat-generating component 44. As a result, heat from the heat-generating component 44 is transferred to the bracket 250 via the heat conduction member 18, resulting in efficient heat dissipation.

[0136] At this time, by checking the position of the heat conduction member 18 through the confirmation window 252bh, it is easy to establish a state in which the heat from the heat-generating component 44 is efficiently transferred to the bracket 250 via the heat conduction member 18. For example, in Figure 13, if the heat conduction member 18 is misaligned to the position indicated by the two-dot chain line, the edge of the heat conduction member 18 can be seen through the confirmation window 252bh, and the misalignment of the heat conduction member 18 can be confirmed.

[0137] As described in this embodiment, even when the mounting board 40 is housed between the first part 221A and the second part 221B of the housing 221, it is effective to check the position of the heat conduction member 18 using the confirmation window portion 252bh.

[0138] Furthermore, according to this embodiment, the first portion 221A and the second portion 221B can be opened widely, so that the substrate can be easily incorporated into the first portion 221A and the second portion 221B.

[0139] The bracket 250 may be omitted from the third embodiment. In this case, the housing 221 may be provided with a heat dissipation target surface and a confirmation window portion instead of the opening 220Bh.

[0140] [Modifications] The configurations described in the above embodiments and modifications can be combined as appropriate as long as they are not mutually contradictory.

[0141] 10, 110, 210 Electrical equipment 18 Heat conduction member 18M Position recognition mark 21, 121, 221 Housing 22, 122 Housing body 22a Bottom plate 22b Ceiling plate 22bf, 153bf, 252bf Heat dissipation target surface 22bg Recessed portion 22bh, 153bh, 252bh Confirmation window portion 22c Side plate 22ca Latching protrusion 22d Back plate 22h Opening 24 Guide portion 25 Guide inclined surface 26 Opposite guide surface 27 Support protrusion 27af Back side support surface 27afg, 27bfg Guide surface 27bf Opposite support surface 28 Protrusion restriction piece 30 Lid 32 Lid body 32h Connector opening 34 Latching fixing portion 34g Locking recess 36 Board support wall 36f Back surface support surface 36g Lid side guide surface 36s Slit 40 Mounting board 42 Board 44 Heat-generating component 46 Connector 110A Exterior part 123h, 220Bh Opening 150, 250 Bracket 151 Pressing part 152 Pressing main body part 153 Additional pressing part 155a Holding part 155b Positioning protrusion 156a, 157 Leg part 156ah, 157h Positioning hole 159 Fastening fixing part 221A First part 221B Second part

Claims

1. An electrical device comprising: an exterior part; a mounting board including a substrate and a heat-generating component mounted on the substrate; and a heat-conducting member located on the heat-generating component, wherein the exterior part has a heat-dissipating surface facing the interior of the exterior part and an inspection window that penetrates the interior and exterior of the exterior part in the area where the heat-dissipating surface is formed, and wherein the heat-conducting member is sandwiched between the heat-generating component and the heat-dissipating surface when the mounting board is housed within the exterior part.

2. An electrical device according to claim 1, wherein the exterior part comprises a housing that covers the mounting board from all four sides and both sides, and the housing has the heat dissipation surface and the confirmation window.

3. An electrical device as claimed in claim 1, wherein the exterior part comprises a housing that covers the mounting board from all four sides and both sides, and a heat dissipation part attached externally to the housing, the heat dissipation part having the heat dissipation surface and the inspection window, an opening is formed in the housing at a position facing the heat-generating component, the heat dissipation part is attached externally to the housing so that the heat-generating surface is positioned outside the opening, and the heat-conducting member is sandwiched between the heat-generating component and the heat-dissipation surface through the opening.

4. An electrical device according to claim 3, wherein the heat dissipation section includes a fixing section that is fixed to a support object of the housing.

5. An electrical device according to any one of claims 2 to 4, wherein the housing has a housing body with an opening and a lid that closes the opening, and the housing body has a guide part that guides the board from the opening side toward the back side of the housing body.

6. An electrical device according to any one of claims 2 to 4, wherein the housing is divided into a first part including a part facing one main surface of the substrate, and a second part including a part facing the other main surface of the substrate.

7. An electrical device according to any one of claims 1 to 4, wherein the heat conducting member is provided with a position recognition mark.

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