Electric device

Abstract

The purpose of the present invention is to further improve heat dissipation of a heat-generating component in an electric device. This electric device comprises: a housing body having an opening; a mounting substrate including a substrate and a heat-generating component mounted on the substrate; and a heat conduction member positioned on the heat-generating component. The housing body has a heat dissipation-designated surface, and the heat conduction member is sandwiched between the heat-generating component and the heat dissipation-designated surface in a state in which the mounting substrate is accommodated in the housing body. The housing body includes a guide portion for guiding the substrate from the opening side toward the back side of the housing body. The guide portion guides the substrate such that the distance between the heat dissipation-designated surface and the heat-generating component in a direction orthogonal to the heat dissipation-designated surface decreases as the substrate advances toward the back side of the housing body from the opening side.

Description

Electrical Equipment

[0001] The present disclosure relates to electrical equipment.

[0002] Patent Document 1 discloses an in-vehicle control device that includes a circuit board on which electronic components are mounted and a housing that houses the circuit board, the housing having a first opening that takes in air flowing in a first direction and a second opening that takes in air flowing in a second direction perpendicular to the first direction.

[0003] JP 2014-143232 A

[0004] In this regard, it is desirable to further improve the heat dissipation performance of heat-generating components in electrical equipment.

[0005] Therefore, an object of the present disclosure is to further improve the heat dissipation performance of heat-generating components in electrical equipment.

[0006] The electrical device disclosed herein comprises a housing main body having an opening, a mounting board including a substrate and a heat-generating component mounted on the substrate, and a heat-conducting member located on the heat-generating component, wherein the housing main body has a surface to be dissipated, and when the mounting board is housed within the housing main body, the heat-conducting member is sandwiched between the heat-generating component and the heat-dissipating surface, the housing main body includes a guide portion that guides the substrate from the opening side toward the back side of the housing main body, and the guide portion guides the substrate so as to reduce the distance between the heat-dissipating surface and the heat-generating component in a direction perpendicular to the heat-dissipating surface as the substrate moves from the opening side toward the back side of the housing main body.

[0007] According to the present disclosure, the heat dissipation performance of heat-generating components in electrical equipment can be further improved.

[0008] Fig. 1 is a perspective view showing an electric device according to an embodiment. Fig. 2 is an exploded perspective view showing the electric device. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 4 is a perspective view showing the inside of a housing main body. Fig. 5 is a cross-sectional view showing the electric device in a manufacturing process. Fig. 6 is a cross-sectional view showing another electric device in a manufacturing process. Fig. 7 is a cross-sectional view showing yet another electric device in a manufacturing process.

[0009] [Description of Embodiments of the Present Disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] The electrical device of the present disclosure is as follows.

[0011] (1) An electrical device comprising: a housing body having an opening; a mounting board including a substrate and a heat-generating component mounted on the substrate; and a heat-conducting member located on the heat-generating component; wherein the housing body has a surface to be dissipated heat; when the mounting board is housed within the housing body, the heat-conducting member is sandwiched between the heat-generating component and the heat-dissipating surface; and the housing body includes a guide portion that guides the substrate from the opening side toward the back side of the housing body, and the guide portion guides the substrate so as to reduce the distance between the heat-dissipating surface and the heat-generating component in a direction perpendicular to the heat-dissipating surface as the substrate moves from the opening side toward the back side of the housing body.

[0012] In this electrical device, the guide portion guides the board so as to reduce the distance between the heat dissipation target surface and the heat-generating component in a direction perpendicular to the heat dissipation target surface as the board moves from the opening side toward the rear of the housing body. This makes it difficult for the thermally conductive member to come into contact with the inner surface of the housing body during the process of inserting the mounting board into the housing body. This makes it easier to maintain the thermally conductive member in a constant position suitable for heat dissipation relative to the heat-generating component. Furthermore, when the mounting board is inserted into the rear of the housing body, the thermally conductive member is sandwiched between the heat-generating component and the heat dissipation target surface, so that heat from the heat-generating component is efficiently transferred to the heat dissipation target surface via the thermally conductive member. This further improves the heat dissipation performance of the heat-generating component in the electrical device.

[0013] (2) In the electrical device of (1), the housing body has a rear support surface located at the rear side of the housing body, and the rear support surface may face the heat dissipation target surface in a direction perpendicular to the heat dissipation target surface and be parallel to the heat dissipation target surface.

[0014] In this case, when the mounting board is housed deep inside the housing body, the board is supported by a rear support surface that is parallel to the heat dissipation surface. This makes it easier for the board to be stably supported in a parallel position to the heat dissipation surface. This also makes it easier for the heat conduction members on the heat-generating components to be supported in a position that makes stable surface contact with the heat dissipation surface.

[0015] (3) In the electrical device of (1) or (2), the housing body may have a press-fit support portion at the rear side of the housing body into which a rear end of the board is press-fitted.

[0016] This securely fixes the substrate within the housing body.

[0017] (4) In any one of the electrical devices (1) to (3), the guide portion may have a guide slope that faces the heat dissipation surface in a direction perpendicular to the heat dissipation surface, and whose distance to the heat dissipation surface in the direction perpendicular to the heat dissipation surface gradually decreases as the guide portion moves from the opening side toward the back side of the housing body.

[0018] In this case, the guide slope smoothly guides the substrate and the heat conducting member so that they gradually approach the heat dissipation target surface.

[0019] (5) In the electrical device of (4), the guide portion may have an opposite guide surface facing the guide inclined surface, and the distance between the guide inclined surface and the opposite guide surface may be larger on the opening side than on the rear side of the housing body.

[0020] This allows the board to be guided between the guide slope and the opposite guide surface. Also, since the gap between the guide slope and the opposite guide surface is larger on the opening side than on the back side of the housing body, the board can be easily inserted between the guide slope and the opposite guide surface.

[0021] (6) The electrical device according to (1) to (5) may further include an opening-side support member that supports the back surface of the board, opposite the heat dissipation surface, from the opening side when the mounting board is housed deep within the housing body.

[0022] As a result, the back surface of the mounting board is supported by the opening-side support member while the mounting board is housed deep inside the housing body, bringing the opening-side portion of the board closer to the heat dissipation surface, and supporting the heat conduction member so that it comes into contact with a wider area of ​​the heat dissipation surface, thereby further improving heat dissipation.

[0023] (7) In the electrical device of (6), the opening-side support member may be a lid that covers the opening.

[0024] This allows the lid to support the opening side of the substrate.

[0025] (8) In the electrical device of (7), the lid may have a back surface support surface that supports the back surface of the board, and a lid-side guide surface that moves away from the back surface as it moves from the back surface support surface toward the back side of the housing body.

[0026] As a result, when the opening is closed with the lid, the end of the substrate on the opening side is smoothly guided by the lid-side guide surface and stably supported by the back surface support surface.

[0027] (9) In the electrical device of any one of (1) to (8), the housing body may have a confirmation window that is partially open in an area where the heat dissipation target surface extends.

[0028] This allows the position of the heat conducting member to be confirmed through the confirmation window.

[0029] [Details of the embodiments of the present disclosure] Specific examples of the electrical device of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0030] [Embodiment] Electrical devices according to embodiments will be described below.

[0031] <Overall Configuration> The overall configuration of the electric device 10 will be described. Fig. 1 is a perspective view showing the electric device 10. Fig. 2 is an exploded perspective view showing the electric device 10. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1.

[0032] The electrical device 10 includes a housing body 22 , a mounting board 40 , and a thermally conductive member 18 .

[0033] The housing body 22 is a case having an opening 22h. A space capable of accommodating the mounting board 40 is formed inside the housing body 22. In this embodiment, the housing body 22 is formed in the shape of a flat rectangular parallelepiped with one side open.

[0034] More specifically, the housing main body 22 includes a bottom plate 22a, a ceiling plate 22b, a pair of side plates 22c, and a rear plate 22d. The bottom plate 22a is formed in a rectangular shape. A pair of side plates 22c extend from two opposing edges of the bottom plate 22a. A rear plate 22d extends from one edge connecting the two opposing edges of the bottom plate 22a. The ceiling plate 22b is connected to the pair of side plates 22c and the upper edges of the rear plate 22d. This forms a storage space surrounded by the pair of side plates 22c and the rear plate 22d between the bottom plate 22a and the ceiling plate 22b.

[0035] The opening 22h is open on the opposite side of the back plate 22d. The mounting board 40 is accommodated in the accommodation space through the opening 22h.

[0036] The ceiling plate 22b has a recess 22bg that is partially recessed. For example, the recess 22bg is formed by recessing a portion of the ceiling plate 22b near the rear plate 22d and between the pair of side plates 22c. By partially recessing the ceiling plate 22b, the recess 22bg can be easily positioned close to the mounting board 40, and other portions of the ceiling plate 22b can easily secure space to accommodate components mounted on the mounting board 40. Furthermore, when inserting the mounting board 40 into the housing main body 22, the heat conduction member 18 is less likely to come into contact with the inside of the housing main body 22 on the front side of the recess 22bg, which also helps prevent the heat conduction member 18 from shifting out of position.

[0037] The housing body 22 may be made of metal or resin.

[0038] The opening 22h is closed by the lid 30. For example, the lid 30 includes a lid main body 32 and a locking fixing portion 34.

[0039] The lid body 32 is formed into a shape that fits into the opening of the housing body 22. The lid body 32 may be formed with a connector opening 32h for exposing the connector 46 mounted on the mounting board 40 to the outside.

[0040] The locking and fixing portions 34 are portions for supporting the lid 30 in a state where it is attached to the housing body 22. For example, locking protrusions 22ca are formed on the outer surfaces of the pair of side plates 22c of the housing body 22, near the opening 22h. Furthermore, a pair of locking and fixing portions 34 extend from both side portions of the lid body 32 toward the outer surfaces of the pair of side plates 22c. Locking recesses 34g into which the locking protrusions 22ca fit are formed in the locking and fixing portions 34.

[0041] With the lid body 32 fitted into the opening 22h, the pair of locking fixing portions 34 are disposed on the outer surfaces of the pair of side plates 22c, and the pair of locking protrusions 22ca are locked into the pair of locking recesses 34g. As a result, the lid body 32 fitted into the opening 22h is fixed to the housing body 22.

[0042] The configuration for fixing the lid 30 to the housing body 22 is not limited to the above example. For example, the lid may be fixed to the housing body by screws, caulking, etc. The housing body 22 and the lid 30 may be understood to constitute the housing.

[0043] The mounting board 40 includes a substrate 42 and a heat-generating component 44 .

[0044] The substrate 42 is, for example, a circuit board, which includes an insulating plate and a circuit pattern formed of copper foil or the like.

[0045] The heat-generating component 44 is mounted on the substrate 42 by soldering or the like. The heat-generating component 44 is an element that generates heat in an electric circuit, such as an electromagnetic relay, a semiconductor switch, a fuse, or an IC (Integrated Circuit).

[0046] The number and positions of the heat-generating components 44 on the substrate 42 are arbitrary. In this embodiment, a plurality of heat-generating components 44 (two in the figure) are mounted and fixed at intervals on the substrate 42. The heat-generating components 44 are located in a portion of the substrate 42 facing the recess 22bg.

[0047] In this embodiment, a connector 46 is mounted on the board 42. For example, the connector 46 is mounted on a portion of the board 42 closer to the opening 22h. In this embodiment, three connectors 46 are mounted on the board 42. The lid main body 32 is formed with rectangular connector openings 32h corresponding to the positions of the three connectors 46. Note that the outline of the connector 46 is shown in each drawing.

[0048] Other electrical components may be mounted on the substrate 42 .

[0049] <Heat Dissipation Structure> The electric device 10 has the following heat dissipation structure for dissipating heat generated by the heat-generating components 44 to the outside.

[0050] That is, the electric device 10 includes a thermally conductive member 18 located on the heat-generating component 44. The thermally conductive member 18 is a thermal interface material (TIM). The thermally conductive member 18 has better thermal conductivity than air. The thermally conductive member 18 is formed to be the same size as the upper surface of the heat-generating component 44 or to extend larger than the upper surface.

[0051] The thermally conductive member 18 is, for example, a thermally conductive sheet. The thermally conductive sheet is, for example, a resin sheet filled with a filler having good thermal conductivity. The thermally conductive member 18 may be thermally conductive rubber, ceramics, or thermally conductive grease. The thermally conductive member 18 may be a laminate of a hard material such as a thermally conductive sheet and an easily deformable material such as thermally conductive grease.

[0052] The housing body 22 has a heat dissipation target surface 22bf. In this embodiment, the heat-generating component 44 faces the inner surface of the recess 22bg when the mounting board 40 is housed in the housing body 22. The inner surface of the recess 22bg is the heat dissipation target surface 22bf.

[0053] With the mounting board 40 housed in the housing body 22, the heat conduction member 18 is sandwiched between the heat-generating component 44 and the heat dissipation target surface 22bf. In this state, the lower surface of the heat conduction member 18 is in surface contact with the upper surface of the heat-generating component 44, and the upper surface of the heat conduction member 18 is in surface contact with the heat dissipation target surface 22bf. This makes it easy for heat from the heat-generating component 44 to be conducted to the housing body 22 via the heat conduction member 18. The heat conducted to the housing body 22 is dissipated from the housing body 22 to the outside.

[0054] The housing body 22 may have a confirmation window 22bh that is partially open in the area where the heat dissipation target surface 22bf extends. In this embodiment, the confirmation window 22bh is formed in the portion of the recess 22bg that is located above each heat-generating component 44. The confirmation window 22bh is formed as an opening that is smaller than the upper surface of the heat-generating component 44. Therefore, a portion of the upper surface of the heat conduction member 18 is exposed within the confirmation window 22bh. In this embodiment, the confirmation window 22bh is a rectangular opening. The confirmation window 22bh may also be an opening of another shape, for example, a circular or polygonal shape.

[0055] The position of the heat conduction member 18 can be confirmed through the confirmation window 22bh. For example, if the confirmation window 22bh is entirely covered by the heat conduction member 18, it can be confirmed that the heat conduction member 18 is disposed in a position suitable for heat dissipation relative to the heat-generating component 44. For example, if the heat conduction member 18 cannot be seen within the confirmation window 22bh or if the edge of the heat conduction member 18 is visible, it can be confirmed that the heat conduction member 18 is displaced from a position suitable for heat dissipation relative to the heat-generating component 44.

[0056] It is not essential that the heat dissipation surface has the above-described configuration. For example, the housing body may incorporate a separate component suitable for heat dissipation, such as a heat sink, and the inner surface of the heat sink may be the heat dissipation surface.

[0057] The confirmation window 22bh may be omitted.

[0058] <Guide Configuration> Fig. 4 is a perspective view showing the inside of the housing main body 22. As shown in Figs. 1 to 4, the mounting board 40 is housed in the housing main body 22 through the opening 22h. Inside the housing main body 22, the mounting board 40 is held on the bottom plate 22a in a position along the bottom plate 22a.

[0059] In order to hold the mounting board 40 in the housing body 22 in the above-mentioned position, the housing body 22 has a guide portion 24 that guides the board 42 from the opening 22h side toward the back side of the housing body 22.

[0060] When the mounting board 40 is guided by the guide portion 24, the heat conduction member 18 on the heat-generating component 44 moves inside the heat dissipation target surface 22bf and is then pressed against the heat dissipation target surface 22bf. If the heat conduction member 18 comes into contact with the heat dissipation target surface 22bf while moving inside the heat dissipation target surface 22bf, the heat conduction member 18 may become misaligned from the heat-generating component 44. If the heat conduction member 18 becomes misaligned from the heat-generating component 44, the contact area between the heat-generating component 44 and the heat conduction member 18 may decrease.

[0061] When the mounting board 40 is guided by the guide portion 24, the following configuration is employed to prevent the heat conduction member 18 from being displaced due to contact between the heat conduction member 18 and the heat dissipation target surface 22bf.

[0062] In other words, the guide portion 24 is configured to guide the substrate 42 so as to reduce the distance between the heat dissipation target surface 22bf and the heat-generating component 44 in a direction perpendicular to the heat dissipation target surface 22bf as the substrate 42 moves from the opening 22h side toward the rear of the housing main body 22.

[0063] More specifically, a pair of guide portions 24 are formed on the inner sides of the pair of side plates 22 c of the housing body 22 .

[0064] The guide portion 24 has a guide inclined surface 25 and an opposite guide surface 26 .

[0065] The guide inclined surface 25 is a surface that faces the heat dissipation target surface 22bf in a direction perpendicular to the heat dissipation target surface 22bf. The opposite guide surface 26 is a surface that faces the guide inclined surface 25.

[0066] The guide slope 25 and the opposite guide surface 26 are elongated rectangular surfaces that extend from the opening 22h side toward the back of the housing body 22 on the inner side of the side plate 22c.

[0067] The guide slope 25 and the opposite guide surface 26 may extend from the opening 22h of the housing body 22 toward the rear side of the housing body 22 as a starting point, or may extend from a position spaced apart inward from the opening 22h of the housing body 22 as a starting point toward the rear side of the housing body 22. The guide slope 25 and the opposite guide surface 26 may reach the rear plate 22d of the housing body 22, or may end at a position just before the rear plate 22d.

[0068] In this embodiment, the guide slope 25 and the opposite guide surface 26 start from a position spaced inward from the opening 22h of the housing body 22 and extend toward the rear side of the housing body 22 to reach the rear plate 22d.

[0069] The guide slope 25 extends such that the distance from the heat dissipation target surface 22bf in a direction perpendicular to the heat dissipation target surface 22bf gradually decreases from the opening 22h side toward the back side of the housing body 22. In this embodiment, the guide slope 25 is a surface that inclines so as to approach the heat dissipation target surface 22bf as it extends from the opening 22h side toward the back side.

[0070] It should be noted that it is not essential for the guide portion 24 to have the guide slope 25, which is a slope that extends in a plane. The guide portion may have, for example, a curved guide surface or a guide surface that has a step.

[0071] The opposite guide surface 26 extends parallel to the heat dissipation target surface 22bf. Therefore, the distance between the guide slope 25 and the opposite guide surface 26 is larger on the opening 22h side than on the rear side of the housing main body 22. Here, the distance between the guide slope 25 and the opposite guide surface 26 gradually decreases from the opening 22h side toward the rear side. The distance between the guide slope 25 and the opposite guide surface 26 on the rear side of the housing main body 22 may be set to be approximately the same as the thickness of the board 42 or to a size large enough to allow the board 42 to be press-fitted.

[0072] A guide groove is formed between the guide slope 25 and the opposite guide surface 26, with the guide slope 25 and the opposite guide surface 26 as a pair of side surfaces and the inward surface of the side plate 22 c as a bottom surface. This guide groove guides the side edge of the substrate 42.

[0073] As each of the side edges of the substrate 42 moves within the guide groove, the guide slopes 25 gradually move the side edges of the substrate 42 toward the heat dissipation target surface 22bf. As a result, as the heat-generating component 44 and the heat conduction member 18 move toward the heat dissipation target surface 22bf, they approach the heat dissipation target surface 22bf as they move toward the back of the housing main body 22. Therefore, when the heat-generating component 44 and the heat conduction member 18 are positioned closer to the opening 22h than the heat dissipation target surface 22bf within the housing main body 22, the heat conduction member 18 can be positioned away from the heat dissipation target surface 22bf. Then, when the heat-generating component 44 and the heat conduction member 18 reach the inside of the heat dissipation target surface 22bf within the housing main body 22, the heat conduction member 18 can come into contact with the heat dissipation target surface 22bf.

[0074] The opposite guide surface 26 may be omitted.

[0075] The front or back side of the guide slope 25 may be continuous with a surface parallel to the heat dissipation target surface 22bf or a surface that is more inclined than the guide slope 25. The front or back side of the opposite guide surface 26 may be continuous with a surface that is more inclined than the opposite guide surface 26.

[0076] The housing body 22 may have a rear support surface 27af located at the rear of the housing body 22. The rear support surface 27af faces the heat dissipation target surface 22bf in a direction perpendicular to the heat dissipation target surface 22bf and is parallel to the heat dissipation target surface 22bf. Note that "parallel" includes "parallel within a tolerance range," for example, including parallelism within a range in which the parallelism provides an advantageous effect. For example, "the rear support surface 27af being parallel to the heat dissipation target surface 22bf" includes parallelism to the extent that the heat conduction member 18 can be in surface contact with the heat dissipation target surface 22bf. In this embodiment, support protrusions 27 are formed at positions inside both side edges of the rear plate 22d. In this embodiment, two support protrusions 27 are formed spaced apart in the width direction of the rear plate 22d.

[0077] The support protrusion 27 is a protruding portion that extends between the bottom plate 22a and the ceiling plate 22b on the inward-facing portion of the rear plate 22d. A partial recess is formed in the middle of the extension direction of the support protrusion 27. A rear support surface 27af is formed on the bottom plate 22a side of the recess. As described above, the rear support surface 27af is parallel to the heat dissipation target surface 22bf. Therefore, the rear end of the substrate 42 is supported on the rear support surface 27af, which makes it easy to maintain the substrate 42 in a position parallel to the heat dissipation target surface 22bf.

[0078] An opposing support surface 27bf is formed on the support protrusion 27 on the ceiling plate 22b side of the recess. The opposing support surface 27bf faces the rear support surface 27af with a gap therebetween. The opposing support surface 27bf is parallel to the heat dissipation target surface 22bf. A gap large enough to allow the rear end of the substrate 42 to be press-fitted is formed between the opposing support surface 27bf and the rear support surface 27af. In other words, a gap slightly smaller than the thickness of the rear end of the substrate 42 is formed between the opposing support surface 27bf and the rear support surface 27af, allowing the rear end to be press-fitted.

[0079] Guide surfaces 27afg, 27bfg that gradually increase the distance between the recesses may be formed on the opening 22h side of the rear support surface 27af and the opposing support surface 27bf, respectively, so that the rear end of the substrate 42 is smoothly guided between the rear support surface 27af and the opposing support surface 27bf by the guide surfaces 27afg, 27bfg.

[0080] The support protrusion 27 can function as a press-fit support portion into which the rear end of the substrate 42 is press-fitted at the rear side of the housing body 22 .

[0081] The rear support surface may be continuous with the rear side of the guide slope 25 .

[0082] Furthermore, a press-fit support portion may be formed on the rear side of the guide portion 24. For example, the rear support surface may be continuous with the rear side of the guide slope 25, and the opposing support surface may be continuous with the rear side of the opposite guide surface 26, so that the press-fit support portion is formed on the rear side of the guide portion 24. The press-fit support portion may be formed by setting the distance on the rear side between the guide slope and the opposite guide surface to be smaller than the thickness of the substrate 42.

[0083] The rear plate 22d may have a protrusion restricting piece 28 that restricts the rear end of the substrate 42 from the heat dissipation target surface 22bf side. In this embodiment, the protrusion restricting piece 28 is formed on the outer side of the support protrusion 27.

[0084] <Support Structure Using Lid> The portion of the substrate 42 that is disposed on the rear side of the housing body 22 is held close to the heat dissipation target surface 22bf by the guide portion 24 and the rear support surface 27af.

[0085] When the mounting board 40 is housed deep inside the housing body 22, the surface of the board 42 opposite to the heat dissipation target surface 22bf is supported by the lid 30 from the opening 22h side.

[0086] More specifically, a board support wall 36 is formed on a portion of the lid body 32 of the lid 30 that faces the inside of the housing body 22. The board support wall 36 is formed, for example, between the connector openings 32h. The board support wall 36 is formed in a plate shape that is perpendicular to the direction connecting the pair of side plates 22c.

[0087] A slit 36s is formed at the tip of the substrate support wall 36, into which the end of the substrate 42 on the opening 22h side can be inserted. The surface located on the bottom plate 22a side of the slit 36s is a back surface support surface 36f that supports the surface of the substrate 42 opposite the heat dissipation target surface 22bf. The back surface support surface 36f is formed on an extension of the rear support surface 27af. Therefore, the surface of the substrate 42 opposite the heat dissipation target surface 22bf is supported by the back surface support surface 36f and the rear support surface 27af in a constant position parallel to the bottom plate 22a.

[0088] In the direction perpendicular to the heat dissipation target surface 22bf, the distance between the rear support surface 36f (or the rear support surface 27af) and the heat dissipation target surface 22bf is set to be equal to but smaller than the sum of the thickness of the substrate 42, the mounting height of the heat-generating component 44, and the thickness of the heat conduction member 18. For example, if the heat conduction member 18 is compressible and deformable, the distance may be smaller than the sum.

[0089] When the mounting board 40 is housed deep inside the housing body 22, the surface of the board 42 opposite the heat dissipation target surface 22bf is supported by the back support surface 36f and the rear support surface 27af, so that the heat conduction member 18 is supported so as to be in surface contact with the heat dissipation target surface 22bf.

[0090] The opening of the slit 36 ​​s may be formed to widen toward the tip of the slit 36 ​​s. The surface of the opening of the slit 36 ​​s located on the bottom plate 22 a side is a lid-side guide surface 36 g that moves away from the back surface as it moves from the back surface support surface 36 f toward the back side of the housing main body 22.

[0091] In this embodiment, the lid 30 serves as an opening-side support member that supports the surface of the substrate 42 opposite the heat dissipation target surface 22bf from the opening 22h side when the mounting substrate 40 is housed deep within the housing main body 22. A member other than the lid 30 may serve as the opening-side support member. For example, a wedge-shaped opening-side support member may be inserted between the opposite guide surface 26 and the side of the substrate 42.

[0092] <Example of Manufacturing Method> An example of a manufacturing method for the electrical device 10 will be described.

[0093] As shown in Figure 5, a mounting board 40 is prepared with a heat-conducting member 18 placed on a heat-generating component 44. Then, the rear end of the board 42 of the mounting board 40, opposite the connector 46, is inserted into the opening 22h of the housing main body 22. Then, both sides of the rear end of the board 42 are inserted into the opening 22h side of the guide part 24. At the end of the opening 22h side of the guide part 24, the guide slope 25 and the opposite guide surface 26 are widely separated, so that both sides of the rear end of the board 42 can be easily inserted between the guide slope 25 and the opposite guide surface 26.

[0094] 6 , the mounting board 40 is inserted into the rear side of the housing main body 22 while both sides of the rear end of the board 42 are guided by the guide slopes 25. While the mounting board 40 is moving toward the rear side of the housing main body 22, both sides of the rear end of the board 42 are guided by the middle parts in the extending direction of the guide slopes 25. Because the middle parts in the extending direction of the guide slopes 25 are relatively far away from the heat dissipation target surface 22bf, the heat conduction member 18 is unlikely to come into contact with the heat dissipation target surface 22bf.

[0095] Furthermore, even when the mounting board 40 is moved to the rear side of the housing body 22, the mounting board 40 is inclined along the guide slope 25. Therefore, if the heat conduction member 18 is positioned closer to the opening 22h than the rear side of the guide slope 25, the heat conduction member 18 is unlikely to come into contact with the heat dissipation target surface 22bf even when the mounting board 40 is moved to the rear side of the housing body 22.

[0096] 7, when the mounting board 40 is pushed further into the housing body 22, the rear end of the board 42 is press-fitted and supported between the rear support surface 27af and the opposing support surface 27bf. Preferably, the portion of the mounting board 40 on the opening 22h side is lifted, and the board 42 approaches a position parallel to the heat dissipation target surface 22bf.

[0097] 3 and 7, the lid 30 is attached to the housing body 22 so as to close the opening 22h. At this time, the end of the substrate 42 on the opening 22h side is inserted into the slit 36s and supported on the back support surface 36f. This keeps the substrate 42 parallel to the heat dissipation target surface 22bf. Then, the heat conduction member 18 comes into surface contact with the heat dissipation target surface 22bf.

[0098] When the end of the substrate 42 on the opening 22h side is inserted into the slit 36s, the end comes into contact with the lid side guide surface 36g, and is smoothly guided between the back support surface 36f and the opposing support surface 27bf.

[0099] In this state, it is confirmed through the confirmation window 22bh that the confirmation window 22bh is completely blocked by the heat conduction member 18, that there is no gap between the heat dissipation target surface 22bf and the heat conduction member 18, etc. This makes it possible to confirm whether the heat conduction member 18 is interposed between the heat-generating component 44 and the heat dissipation target surface 22bf in the intended state.

[0100] The lid 30 may be fixed to the mounting substrate 40 in advance.

[0101] <Effects, etc.> In the electrical device 10 configured as described above, the guide portion 24 guides the board 42 so as to reduce the distance between the heat dissipation target surface 22bf and the heat-generating component 44 in a direction perpendicular to the heat dissipation target surface 22bf as the board 42 moves from the opening 22h toward the rear of the housing body 22. This reduces the likelihood of the thermally conductive member 18 coming into contact with the inner surface of the housing body 22 during the process of inserting the mounting board 40 into the housing body 22. This makes it easier to maintain the thermally conductive member 18 in a constant position suitable for heat dissipation relative to the heat-generating component 44. Furthermore, when the mounting board 40 is inserted into the rear of the housing body 22, the thermally conductive member 18 is sandwiched between the heat-generating component 44 and the heat dissipation target surface 22bf, allowing heat from the heat-generating component 44 to be efficiently transferred to the heat dissipation target surface 22bf via the thermally conductive member 18. This further improves the heat dissipation performance of the heat-generating component 44 within the electrical device 10.

[0102] Furthermore, since the mounting board 40 can be incorporated into the housing body 22 by sliding the mounting board 40, the electrical device 10 can be manufactured easily.

[0103] Furthermore, when the mounting board 40 is housed in the back of the housing body 22, the board 42 is supported by the back support surface 27af, which is parallel to the heat dissipation target surface 22bf. This makes it easy for the board 42 to be stably supported in a position parallel to the heat dissipation target surface 22bf. This also makes it easy for the heat conduction member 18 on the heat-generating component 44 to be supported in a position that makes it easy for it to be in stable surface contact with the heat dissipation target surface 22bf.

[0104] Furthermore, the rear end of the substrate 42 is press-fit and supported between the rear support surface 27af and the opposing support surface 27bf at the rear side of the housing body 22. This allows the substrate 42 to be firmly fixed without rattle within the housing body 22. Furthermore, after the mounting substrate 40 is accommodated within the housing body 22 and before the lid 30 is fixed to the housing body 22, the mounting substrate 40 is unlikely to fall off from the housing body 22. This press-fit structure makes it possible to suppress rattle of the mounting substrate 40 without using a separate part to eliminate rattle.

[0105] Furthermore, the guide portion 24 has the guide slope 25 on the opening 22h side, so that the substrate 42, the heat-generating component 44, and the heat conduction member 18 are smoothly guided so as to gradually approach the heat dissipation target surface 22bf.

[0106] Furthermore, because the guide portion 24 has an opposite guide surface 26, the board 42 can be guided between the guide slope 25 and the opposite guide surface 26. This makes it difficult for mounted components on the mounting board 40 to come into contact with the inner surface of the housing main body 22 while the mounting board 40 is being inserted. Furthermore, because the distance between the guide slope 25 and the opposite guide surface 26 is larger on the opening 22h side than on the back side of the housing main body 22, the board 42 can be easily inserted between the guide slope 25 and the opposite guide surface 26.

[0107] Furthermore, when the mounting board 40 is housed deep within the housing body 22, the back surface of the board 42 is supported by the back surface support surface 36f. Therefore, by bringing the portion of the board 42 on the opening 22h side closer to the heat dissipation target surface 22bf, the heat conduction member 18 is supported so as to be in contact with the heat dissipation target surface 22bf over a wider area, thereby further improving heat dissipation.

[0108] Furthermore, because the back surface support surface 36f is provided on the lid 30, the end of the substrate 42 on the opening 22h side can be supported by attaching the lid 30 to the housing body 22. By supporting the back surface of the substrate 42 with this back surface support surface 36f and pressing the heat conduction member 18 against the heat dissipation target surface 22bf, rattle of the mounting substrate 40 can be suppressed without using a separate part to eliminate rattle.

[0109] Furthermore, since the lid 30 has a back support surface 36f and a lid-side guide surface 36g, the end of the substrate 42 on the opening 22h side is smoothly guided by the lid-side guide surface 36g toward the back support surface 36f.

[0110] Furthermore, the housing body 22 has a confirmation window 22bh that is partially open in the area where the heat dissipation target surface 22bf extends, so that the position of the heat conduction member 18 can be confirmed through the confirmation window 22bh. This makes it easy to establish a state in which heat is effectively transferred from the heat-generating component 44 to the heat dissipation target surface 22bf via the heat conduction member 18.

[0111] [Modifications] The configurations described in the above embodiment and modifications can be combined as appropriate as long as they are not mutually contradictory.

[0112] 10 Electrical equipment 18 Heat conduction member 22 Housing body 22a Bottom plate 22b Ceiling plate 22bf Heat dissipation target surface 22bg Recessed portion 22bh Confirmation window portion 22c Side plate 22ca Locking protrusion 22d Back plate 22h Opening 24 Guide portion 25 Guide inclined surface 26 Opposite guide surface 27 Support protrusion 27af Back side support surface 27afg, 27bfg Guide surface 27bf Opposite support surface 28 Protrusion restriction piece 30 Lid 32 Lid body 32h Connector opening 34 Locking fixing portion 34g Locking recessed portion 36 Board support wall 36f Back side support surface 36g Lid side guide surface 36s Slit 40 Mounting board 42 Board 44 Heat-generating component 46 Connector

Claims

1. An electrical device comprising: a housing body having an opening; a mounting board including a substrate and a heat-generating component mounted on the substrate; and a heat-conducting member located on the heat-generating component, wherein the housing body has a surface to be dissipated, and when the mounting board is housed within the housing body, the heat-conducting member is sandwiched between the heat-generating component and the heat-dissipating surface, and the housing body includes a guide section that guides the substrate from the opening side toward the back side of the housing body, and the guide section guides the substrate so as to reduce the distance between the heat-dissipating surface and the heat-generating component in a direction perpendicular to the heat-dissipating surface as the substrate moves from the opening side toward the back side of the housing body.

2. An electrical device according to claim 1, wherein the housing body has a rear support surface located at the rear side of the housing body, and the rear support surface faces the heat dissipation target surface in a direction perpendicular to the heat dissipation target surface and is parallel to the heat dissipation target surface.

3. An electrical device according to claim 1 or 2, wherein the housing body has a press-fit support portion at the rear side of the housing body into which the rear end of the substrate is press-fitted.

4. An electrical device as claimed in claim 1 or claim 2, wherein the guide portion faces the heat dissipation surface in a direction perpendicular to the heat dissipation surface, and has a guide slope in which the distance from the heat dissipation surface in the direction perpendicular to the heat dissipation surface gradually decreases from the opening side toward the back side of the housing body.

5. An electrical device according to claim 4, wherein the guide portion has an opposite guide surface facing the guide inclination, and the distance between the guide inclination and the opposite guide surface is larger on the opening side than on the inner side of the housing body.

6. An electrical device according to claim 1 or claim 2, further comprising an opening-side support member that supports the back surface of the board opposite the surface to be heat dissipated from the opening side when the mounting board is housed deep within the housing body.

7. An electrical device according to claim 6, wherein the opening-side support member is a lid that closes the opening.

8. An electrical device according to claim 7, wherein the lid has a back surface support surface that supports the back surface of the board, and a lid-side guide surface that moves away from the back surface as it moves from the back surface support surface toward the back side of the housing body.

9. An electrical device according to claim 1 or 2, wherein the housing body has a confirmation window that is partially open in the area where the heat dissipation surface extends.

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