Temperature regulation system and method for controlling temperature regulation system

Abstract

This temperature regulation system is for cooling a member in a plasma processing chamber and includes a tank, a cooling mechanism, an outflow path, an inflow path, and a pump. The tank is configured to store a gaseous temperature-regulating medium at room temperature and normal pressure. The cooling mechanism is configured to liquefy the temperature-regulating medium stored in the tank. The outflow path is connected to an outflow port of the tank and is configured so that the temperature-regulating medium flows out to a temperature regulation section for cooling the member through heat exchange with the temperature-regulating medium. The inflow path is connected to an inflow port of the tank and is configured so that the temperature-regulating medium after heat exchange flows in from the temperature regulation section. The pump is provided in the outflow path and is configured to pump out the temperature-regulating medium stored in the tank.

Description

Temperature control system and method for controlling the temperature control system

[0001] The present disclosure relates to a temperature adjustment system and a method for controlling a temperature adjustment system.

[0002] The temperature control medium processing device disclosed in Patent Document 1 is a temperature control medium processing device that recovers or replenishes a temperature control medium for a module that uses the temperature control medium, and includes a tank for storing the temperature control medium, a first inlet flow path connected to a first inlet of the tank and through which the temperature control medium flows, an inlet connection portion that connects the first inlet flow path to a flow path from the module, an outlet flow path connected to an outlet of the tank and through which the temperature control medium flows out, an outlet connection portion that connects the outlet flow path to the flow path to the module, and a pump provided in the outlet flow path that discharges the temperature control medium stored in the tank.

[0003] Japanese Patent Application Laid-Open No. 2021-136372

[0004] The present disclosure provides a temperature regulation system and a method for controlling a temperature regulation system that can be used in low temperature regions.

[0005] A temperature control system according to one aspect of the present disclosure is a temperature control system for cooling components in a plasma processing chamber, and includes a tank, a cooling mechanism, an outlet flow path, an inlet flow path, and a pump. The tank is configured to store a gaseous temperature control medium at room temperature and pressure. The cooling mechanism is configured to liquefy the temperature control medium stored in the tank. The outlet flow path is connected to the outlet of the tank and configured to allow the temperature control medium to flow out to a temperature control unit that cools the components by heat exchange with the temperature control medium. The inlet flow path is connected to the inlet of the tank and configured to allow the temperature control medium to flow in from the temperature control unit after heat exchange. The pump is provided in the outlet flow path and configured to send out the temperature control medium stored in the tank.

[0006] According to the present disclosure, it can be used in low temperature ranges.

[0007] FIG. 1 is a diagram showing an example of a temperature control system according to an embodiment of the present disclosure. FIG. 2 is a diagram showing an example of a state in which a temperature control medium is stored in a tank. FIG. 3 is a diagram showing an example of a state in which the temperature control system is in operation. FIG. 4 is a diagram showing an example of a state in which the temperature control medium in the piping on the temperature control unit side is exhausted. FIG. 5 is a graph showing an example of the P-H characteristics of the temperature control medium. FIG. 6 is a graph showing an example of a change in flow rate due to pressure on the temperature control medium. FIG. 7 is a flowchart showing an example of a method for controlling the temperature control system during storage and circulation in this embodiment. FIG. 8 is a flowchart showing an example of a method for controlling the temperature control system during exhaust in this embodiment.

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the disclosed temperature adjustment system and control method for the temperature adjustment system will be described in detail with reference to the accompanying drawings. Note that the disclosed technology is not limited to the following embodiments.

[0009] Conventional chillers use a temperature-controlling medium with low volatility at room temperature and pressure. Because such temperature-controlling mediums have been recognized as harmless to the environment, operations that allow the temperature-controlling medium to be released into the atmosphere have become mainstream. However, in recent years, environmental pollution caused by PFAS (perfluoroalkyl and polyfluoroalkyl compounds) has come to be pointed out, and it is expected that the configuration and operation of the temperature-controlling medium and chillers will be reviewed. Therefore, it is expected that supplying the temperature-controlling medium in an airtight state will suppress atmospheric release and expand the usable temperature range of the temperature-controlling medium. In other words, it is expected that temperature-control systems will be used in low-temperature regions.

[0010] [Configuration of Temperature Control System] Fig. 1 is a diagram illustrating an example of a temperature control system according to an embodiment of the present disclosure. As shown in Fig. 1, the temperature control system 1 includes a chiller unit 2 and a control unit 3. The chiller unit 2 includes a tank 30, a cooling mechanism 31 provided within the tank 30, a pump 34, a supply mechanism 50, a pressing mechanism 53, a purging mechanism 56, and a detoxification mechanism 60. That is, the temperature control system 1 cools components within a plasma processing chamber 10 and includes the tank 30, the cooling mechanism 31, outlet flow paths (pipes 32 and 37), inlet flow paths (pipes 33 and 38), and the pump 34. The temperature control system 1 may be included in a plasma processing apparatus equipped with the plasma processing chamber 10.

[0011] Tank 30 liquefies and stores the gaseous temperature control medium at room temperature and normal pressure supplied from supply mechanism 50 via piping 51 and valve 52 using cooling mechanism 31. That is, tank 30 is configured to store the gaseous temperature control medium at room temperature and normal pressure. Tank 30 is, for example, an airtight reserve tank. Tank 30 has an outlet connected to piping 32, which is an outflow flow path, and an inlet connected to piping 33, which is an inflow flow path.

[0012] The pipe 32 is connected to the pipe 58 and, as the pipe 37, is connected to the temperature control unit 11 in the plasma processing chamber 10. That is, the pipes 32 and 37, which are examples of outflow paths, are connected to the outlet of the tank 30 and are configured so that the temperature control medium flows into the temperature control unit 11, which cools components by heat exchange with the temperature control medium. The temperature control unit 11 is provided in a component that is subjected to a thermal load, such as a substrate support or an upper electrode, and the component is cooled by heat exchange when the temperature control medium flows through the internal flow path. The pipe 32 is provided with a pump 34 and a valve 35. The pipe 58 is connected to the purge mechanism 56 via a valve 57. The pipe 33 is connected to the pipes 39 and 41 and, as the pipe 38, is connected to the temperature control unit 11 in the plasma processing chamber 10. That is, the pipes 33 and 38, which are examples of inflow paths, are connected to the inlet of the tank 30 and are configured so that the temperature control medium flows in from the temperature control unit 11 after heat exchange. The pipe 33 is provided with a valve 36. A pressure gauge 43 and a thermometer 44 are provided on the pipe 38. The pipe 39 is connected to the top of the tank 30 via a valve 40. The pipe 41 is connected to the abatement mechanism 60 via a valve 42. That is, the temperature control medium flowing out of the tank 30 is circulated through the pipes 32 and 37, the temperature control unit 11, and the pipes 38 and 33. That is, the pipes 32 and 37 are an example of an outflow flow path, and the pipes 33 and 38 are an example of an inflow flow path. The pipe 41 is an example of an exhaust flow path. That is, the exhaust flow path (pipe 41) is connected to the tank 30 and the inflow flow paths (pipes 32 and 37) and is configured to exhaust the temperature control medium. The valve 35 is an example of a first valve, and the valve 36 is an example of a second valve.

[0013] The cooling mechanism 31 is controlled to liquefy the gaseous temperature-control medium supplied to the tank 30 at room temperature and pressure. That is, the cooling mechanism 31 is configured to liquefy the temperature-control medium stored in the tank 30. The cooling mechanism 31 liquefies the temperature-control medium by, for example, cooling the temperature-control medium to a predetermined temperature below its boiling point using a heat exchanger or the like. The cooling mechanism 31 may further cool the temperature-control medium using a refrigerant such as liquid nitrogen or liquid helium in a heat exchanger. The predetermined temperature may be, for example, a temperature in the range of +20°C to -120°C. The cooling mechanism 31 may be provided separately from the tank 30, for example, in the piping 33. That is, the cooling mechanism 31 is provided in the tank 30 or in the inlet flow path (piping 33). The cooling mechanism 31 may also be a cooling mechanism of another type as long as it is capable of cooling to the predetermined temperature.

[0014] The pump 34 is provided in the piping 32 of the tank 30, and sends the liquefied temperature control medium stored in the tank 30 to the temperature control unit 11 in the plasma processing chamber 10 to circulate the medium. That is, the pump 34 is provided in the outflow flow path, and is configured to send out the temperature control medium stored in the tank 30.

[0015] The pressure gauge 43 is a sensor that measures the pressure inside the pipe 38. The thermometer 44 is a sensor that measures the temperature inside the pipe 38. That is, at least one of the pressure gauge 43 and the thermometer 44 is provided in the inlet flow path (pipe 38). The measurement results of the pressure gauge 43 and the thermometer 44 are output to the control unit 3. The measurement results of the pressure gauge 43 and the thermometer 44 make it possible to determine the gas-liquid state of the temperature control medium inside the pipe 38. For example, the pressure gauge 43 and the thermometer 44 can be used to detect that the temperature control medium has been exhausted from inside the pipe 38.

[0016] The heaters 45 and 46 are provided in the pipes 37 and 38, respectively. That is, a heater (heater 45, 46) is provided in at least one of the outflow flow path (pipe 37) and the inflow flow path (pipe 38). The heaters 45 and 46 heat the pipes 37 and 38 to vaporize the temperature control medium when purging the pipes 37 and 38 and the temperature control unit 11. Note that only one of the heaters 45 and 46 may be provided. Furthermore, the output of the heaters 45 and 46 may be controlled based on the measurement results of the pressure gauge 43 and the thermometer 44.

[0017] The supply mechanism 50 is connected to the tank 30 via piping 51 and a valve 52 and is controlled to supply a gaseous temperature control medium. The supply mechanism 50 supplies a gas, such as C3F8 or C3H2F4, as a temperature control medium to the tank 30, as indicated by arrow 61. That is, the supply mechanism 50 is connected to the tank 30 and is configured to supply a gaseous temperature control medium. The temperature control medium includes at least one of C3F8 and C3H2F4. The supply mechanism 50 may also serve as a connection to the factory equipment (power utility) in which the temperature control system 1 is installed. In this case, the control unit 3 controlling the opening and closing of the valve 52 corresponds to controlling the supply mechanism 50.

[0018] The pressing mechanism 53 is connected to the tank 30 via a pipe 54 and a valve 55 and is controlled to supply a pressing gas. The pressing mechanism 53 supplies, for example, nitrogen gas (e.g., N2 gas) as the pressing gas to the tank 30, as indicated by arrow 62. The pressing gas may be any other gas as long as it has a lower boiling point than the temperature control medium and does not react with the temperature control medium. The pressing mechanism 53 presses the liquid temperature control medium by supplying the pressing gas into the tank 30. That is, the pressing mechanism 53 is configured to press the liquid temperature control medium stored in the tank 30. In other words, the pressing mechanism 53 presses the temperature control medium by supplying the pressing gas into the tank 30. In other words, the pressing gas is a gas with a lower boiling point than the temperature control medium. The pressing mechanism 53 may also press the liquid temperature control medium using a mechanical component such as a piston. That is, the pressing mechanism 53 may be configured to press the temperature control medium using a piston. The pressing mechanism 53 may also be configured to press the temperature control medium to a pressure equal to or greater than the vapor pressure of the temperature control medium. The pressing mechanism 53 may also be a connection to the factory equipment (power usage) in which the temperature control system 1 is installed. In this case, the control unit 3 controlling the opening and closing of the valve 55 corresponds to controlling the pressing mechanism 53.

[0019] The purge mechanism 56 is connected to the pipe 37 via a pipe 58 and a valve 57 and is controlled to supply a purge gas (hereinafter simply referred to as a purge gas) into the temperature adjustment unit 11. The purge mechanism 56 supplies, for example, nitrogen gas as a purge gas into the temperature adjustment unit 11 via the pipe 37, as indicated by arrow 63. That is, the purge mechanism 56 is connected to the outflow passage (pipe 37) and is configured to be able to supply the purge gas into the temperature adjustment unit 11. The purge gas supplied into the temperature adjustment unit 11 is exhausted to the abatement mechanism 60 via the pipes 38 and 41. The purge mechanism 56 may also be a connection to the factory equipment (power utility) in which the temperature adjustment system 1 is installed. In this case, the control unit 3 controlling the opening and closing of the valve 57 corresponds to controlling the purge mechanism 56.

[0020] The detoxification mechanism 60 is controlled to detoxify the exhausted temperature control medium using, for example, plasma detoxification. The detoxification mechanism 60 is connected to the pipe 38 via the pipe 41 and the valve 42, and to the tank 30 via the pipe 47 and the valve 48. The detoxification mechanism 60 includes, for example, a vacuum pump, and is controlled to evacuate the pipes 41 and 47 as indicated by arrows 64 and 65, thereby purging the temperature control unit 11 or the tank 30 and each pipe together with the purge mechanism 56. That is, the detoxification mechanism 60 is controlled to detoxify the temperature control medium purged from the pipes 37 and 38 and the temperature control unit 11 by the purge mechanism 56, and the temperature control medium purged from the tank 30 during maintenance of the tank 30, for example. The tank 30 can be purged using, for example, the gas used to press the pressing mechanism 53. The detoxification mechanism 60 may also be connected to the factory equipment (power utility) in which the temperature control system 1 is installed. In this case, the control unit 3 controlling the opening and closing of the valves 42 and 48 corresponds to controlling the abatement mechanism 60 .

[0021] The control unit 3 processes computer-executable instructions that cause the chiller unit 2 to perform the various processes described in this disclosure. The control unit 3 may be configured to control each element of the chiller unit 2 to perform the various processes described herein. In one embodiment, part or all of the control unit 3 may be included in the chiller unit 2. The control unit 3 may include a processing unit 3a1, a storage unit 3a2, and a communication interface 3a3. The control unit 3 may be realized, for example, by a computer 3a. The processing unit 3a1 may be configured to read a program from the storage unit 3a2 and execute the read program to perform various control operations. This program may be stored in the storage unit 3a2 in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit 3a2 and read from the storage unit 3a2 by the processing unit 3a1 for execution. The medium may be various storage media readable by the computer 3a, or may be a communication line connected to the communication interface 3a3. The processing unit 3a1 may be a CPU (Central Processing Unit). The storage unit 3a2 may include a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 3a3 may communicate with the chiller unit 2 via a communication line such as a local area network (LAN).

[0022] [Operation of Temperature Control System] Next, the operation of the temperature control system 1 will be described using FIGS. 2 to 4. In FIGS. 2 to 4, valves in the open state are indicated by white outlines, and valves in the closed state are indicated by black outlines. FIG. 2 is a diagram showing an example of a state in which a temperature control medium is stored in a tank. As shown in FIG. 2, when a temperature control medium is stored in the tank 30, valves 35, 36, 40, 42, 48, 55, and 57 are controlled to be closed, and valve 52 is controlled to be open. The supply mechanism 50 is controlled to supply a gaseous temperature control medium, as indicated by arrow 61, and the gaseous temperature control medium is stored in the tank 30. In other words, the temperature control medium is supplied from the supply mechanism 50 to the tank 30 without being exposed to the atmosphere. The temperature control medium is then cooled and liquefied by the cooling mechanism 31. 2 , valve 57 is opened to fill the inside of pipes 37, 38 and temperature adjustment unit 11 with purge gas, and the pressure is measured with pressure gauge 43, thereby making it possible to perform an airtightness test on pipes 37, 38 and temperature adjustment unit 11. The airtightness test can also be performed when starting up the apparatus after replacing parts on the plasma processing chamber 10 (temperature adjustment unit 11) side.

[0023] FIG. 3 illustrates an example of the operating state of the temperature control system 1. As shown in FIG. 3, during operation of the temperature control system 1, valves 42, 48, 52, and 57 are controlled to be closed, and valves 35, 36, 40, and 55 are controlled to be open. The pressing mechanism 53 is controlled to supply a pressing gas, as indicated by arrow 62. The pressed temperature control medium is circulated by the pump 34 through the pipes 32 and 37, the temperature control unit 11, and the pipes 38 and 33. The temperature control medium vaporized during circulation is returned to the top of the tank 30 via the pipe 39. The temperature control medium is pressurized by the pressing mechanism 53, thereby reducing dryout in the temperature control unit 11. Furthermore, by pressing the temperature control medium, the pressure is added to the head of the pump 34 (by suppressing pressure loss), thereby reducing the load on the pump 34. Furthermore, the flow rate of the circulating temperature control medium is increased, thereby improving cooling performance.

[0024] FIG. 4 illustrates an example of a state in which the temperature control medium in the piping on the temperature control unit side is exhausted. As shown in FIG. 4 , when exhausting the temperature control medium remaining in the piping 37, 38 and the temperature control unit 11, the valves 35, 36, 40, 48, 52, and 55 are controlled to be closed, and the valves 42 and 57 are controlled to be open. The purge mechanism 56 is controlled to supply purge gas into the temperature control unit 11, as indicated by arrow 63, and the detoxification mechanism 60 is controlled to evacuate the piping 41, thereby purging and exhausting the piping 37, 38 and the temperature control unit 11. The piping 37, 38 are heated by the heaters 45, 46. In other words, the temperature control medium is exhausted to the detoxification mechanism 60 without being exposed to the atmosphere. The purge mechanism 56 and the detoxification mechanism 60 may perform a cycle purge. After the cycle purge is completed, parts on the plasma processing chamber 10 (temperature control unit 11) side can be replaced. The pipes 37 and 38 may have a connection that can be separated from the plasma processing chamber 10. When performing maintenance on the tank 30 and the cooling mechanism 31, the tank 30 can be purged using the pressing gas of the pressing mechanism 53 by closing the valves 35, 36, 40, 42, 52, and 57 and opening the valves 48 and 55. In this case, the abatement mechanism 60 is controlled to evacuate the pipe 47.

[0025] [Pressure of Temperature Control Medium] Next, using FIGS. 5 and 6, the P-H characteristics and changes in flow rate when a liquid temperature control medium is pressed will be described. Note that FIGS. 5 and 6 show a case where C3F8 is used as the temperature control medium and nitrogen gas is used as the pressing gas. FIG. 5 is a graph showing an example of the P-H characteristics of a temperature control medium. As shown in FIG. 5, a P-H diagram 100 shows the P-H characteristics of the temperature control medium in the temperature control system 1. In the P-H diagram 100, the vertical axis represents pressure P [MPa] and the horizontal axis represents specific enthalpy H [kJ / kg]. Cycle 101 is a cycle with pressure by nitrogen gas. On the other hand, cycle 102 is a cycle without pressure by nitrogen gas. Furthermore, the region 104 to the right of the saturated liquid line 103 on the P-H diagram 100 is a gas-liquid mixed (dry-out) region. The temperature of the temperature control medium in cycles 101 and 102 is represented by an isotherm 105. Cycles 101 and 102 each have a cooling step 111, a pressurizing step 112, a heat load step 113, and a return step 114. In cycle 101, the cooling step 111 and the return step 114 are farther from the saturated liquid line 103 than in cycle 102, and therefore it can be seen that the margin against dryout is wider when pressure is applied by nitrogen gas.

[0026] 6 is a graph showing an example of a change in flow rate due to pressure of the temperature control medium. In FIG. 6, the vertical axis represents the flow rate [m ３ 6 shows the relationship between the flow rate of the temperature control medium and the rotation frequency of the pump 34 when nitrogen gas pressure is applied, and graph 121 shows the relationship between the flow rate of the temperature control medium and the rotation frequency of the pump 34 when nitrogen gas pressure is not applied. A comparison of graphs 120 and 121 reveals that when nitrogen gas pressure is applied, the flow rate of the temperature control medium increases even when the rotation frequency of the pump 34 is the same.

[0027] [Control Method of Temperature Regulation System] Next, a control method of the temperature regulation system in this embodiment will be described. Fig. 7 is a flowchart showing an example of a control method of the temperature regulation system during storage and circulation in this embodiment.

[0028] When the temperature control medium starts to be stored and circulated, the control unit 3 controls valves 35, 36, 40, 42, 48, 55, and 57 to close and valve 52 to open. The control unit 3 controls the supply mechanism 50 to supply and store the gaseous temperature control medium at room temperature and normal pressure in the tank 30 (step S1). That is, step S1 is an example of a process of storing the gaseous temperature control medium at room temperature and normal pressure in the tank 30. The control unit 3 controls the cooling mechanism 31 to liquefy the temperature control medium stored in the tank 30 (step S2). That is, step S2 is an example of a process of liquefying the temperature control medium stored in the tank 30.

[0029] The control unit 3 controls the valve 52 to close and the valves 35, 36, 40, and 55 to open. The control unit 3 controls the pressing mechanism 53 to start supplying the pressing gas to the tank 30. The control unit 3 controls the pump 34 to start circulating the pressed temperature-controlling medium through the pipes 32 and 37, the temperature control unit 11, and the pipes 38 and 33 (step S3). That is, the control unit 3 controls each unit to pressurize the liquefied temperature-controlling medium and circulate it through the temperature control unit 11 that cools the member. In other words, step S3 is an example of a process of pressurizing the liquefied temperature-controlling medium and circulating it through the temperature control unit 11 that cools the member. This allows the temperature control system 1 to supply the temperature-controlling medium in an airtight state, thereby suppressing atmospheric release. That is, the temperature control system 1 can expand the usable temperature range of the temperature-controlling medium, allowing it to be used in low-temperature regions. Furthermore, the temperature control system 1 can widen the margin against dryout and increase the flow rate of the temperature-controlling medium.

[0030] FIG. 8 is a flowchart showing an example of a control method for the temperature adjustment system during exhaust in this embodiment.

[0031] During exhaust of the temperature control medium, the control unit 3 controls the pressing mechanism 53 to stop the supply of the pressing gas to the tank 30. The control unit 3 also controls the pump 34 to stop the circulation of the temperature control medium (step S11). That is, step S11 is an example of a process of stopping the circulation of the temperature control medium to the temperature control unit 11. The control unit 3 controls the valves 35, 36, 40, 48, 52, and 55 to close and the valves 42 and 57 to open. That is, the control unit 3 switches each valve to exhaust the temperature control medium (step S12). In other words, step S12 is an example of a process of closing a first valve (valve 35) provided in the outlet flow path on the side where the temperature control medium flows from the tank 30 to the temperature control unit 11 and a second valve (valve 36) provided in the inlet flow path on the side where the temperature control medium flows from the temperature control unit 11 to the tank 30. The control unit 3 controls the heaters 45 and 46 to heat the pipes 37 and 38, thereby increasing the temperature inside the flow paths of the pipe 37, the temperature adjustment unit 11, and the pipe 38 (step S13). That is, step S13 is an example of a process of increasing the temperature inside the flow paths using a heater provided in at least one of the outlet flow path and the inflow flow path. At this time, the control unit 3 preferably controls the flow paths of the pipe 37, the temperature adjustment unit 11, and the pipe 38 to increase the temperature to a temperature equal to or higher than the boiling point of the temperature adjustment medium. The control unit 3 also controls the opening of a third valve (valve 40) provided in a flow path (pipe 39) that branches off from the inflow flow path (pipe 38) and is connected to the top of the tank 30, thereby returning the vaporized temperature adjustment medium to the tank 30.

[0032] The controller 3 controls the purge mechanism 56 and the abatement mechanism 60 to start supplying and exhausting purge gas to and from the flow paths of the pipe 37, the temperature adjustment unit 11, and the pipe 38 (step S14). That is, step S14 is an example of a process in which the purge mechanism 56, connected to the temperature adjustment unit 11 side of the outflow path relative to the first valve, supplies purge gas to the outflow path, the temperature adjustment unit 11, and the inflow path, and exhausts the purge gas to the exhaust path connected to the temperature adjustment unit side of the inflow path relative to the second valve. The controller 3 detects that the temperature adjustment medium has been exhausted from the pipe 38 based on the measurement results input from the pressure gauge 43 and the thermometer 44. For example, the controller 3 detects that the temperature adjustment medium has been exhausted from the pipe 38 (inflow path) based on the criteria that the temperature measured by the thermometer 44 is equal to or higher than the boiling point of the temperature adjustment medium and that the pressure measured by the pressure gauge 43 is equal to or lower than the vapor pressure at the measured temperature. That is, since the pipe 38 is downstream of the flow path during exhaust, it is possible to detect that the temperature control medium has been exhausted from the flow path including the pipe 37, the temperature adjustment unit 11, and the pipe 38 based on the measurement results of the pressure gauge 43 and the thermometer 44 provided in the pipe 38. When the control unit 3 detects that the temperature control medium has been exhausted from the pipe 38, it controls the purge mechanism 56 and the detoxification mechanism 60 to stop the supply of purge gas to the flow path including the pipe 37, the temperature adjustment unit 11, and the pipe 38 and the exhaust (step S15). That is, step S15 is an example of stopping the exhaust when it is detected that the temperature control medium has been exhausted from the inlet flow path based on the value measured by at least one of the pressure gauge 43 and the thermometer 44 provided in the inlet flow path. Note that, when exhaust is stopped, the control unit 3 preferably controls the purge mechanism 56 and the detoxification mechanism 60 based on the measurement result of the pressure gauge 43 so that the flow path including the pipe 37, the temperature adjustment unit 11, and the pipe 38 is at normal pressure (atmospheric pressure). The control unit 3 controls the valves 42 and 57 to close. This allows the temperature adjustment system 1 to exhaust the temperature adjustment medium to the detoxification mechanism 60 without exposing it to the atmosphere. Furthermore, because the temperature adjustment system 1 does not expose the temperature adjustment medium to the atmosphere, it is possible to increase the types of temperature adjustment medium that can be used.

[0033] As described above, according to this embodiment, the temperature control system 1 cools components in a plasma processing chamber 10 and includes a tank 30, a cooling mechanism 31, an outlet flow path (pipes 32 and 37), an inlet flow path (pipes 33 and 38), and a pump 34. The tank 30 is configured to store a gaseous temperature control medium at room temperature and normal pressure. The cooling mechanism 31 is configured to liquefy the temperature control medium stored in the tank 30. The outlet flow path is connected to the outlet of the tank 30 and configured to allow the temperature control medium to flow into the temperature control unit 11, which cools components by heat exchange with the temperature control medium. The inlet flow path is connected to the inlet of the tank 30 and configured to allow the temperature control medium to flow in from the temperature control unit 11 after heat exchange. The pump 34 is provided in the outlet flow path and configured to pump the temperature control medium stored in the tank 30. As a result, it is possible to suppress release of the temperature control medium into the atmosphere and to expand the usable temperature range of the temperature control medium. That is, the temperature adjustment system 1 can be used in a low temperature range.

[0034] Furthermore, according to this embodiment, the temperature adjustment system 1 further includes a supply mechanism 50 that is connected to the tank 30 and configured to supply a gaseous temperature adjustment medium. As a result, the temperature adjustment medium can be supplied to the tank 30 without being exposed to the atmosphere.

[0035] Furthermore, according to this embodiment, the temperature adjustment medium contains at least one of C3F8 and C3H2F4, and as a result, the temperature adjustment system 1 can be used in low temperature ranges.

[0036] Moreover, according to this embodiment, the device further includes a pressing mechanism 53 configured to press the liquid temperature control medium stored in the tank 30. As a result, it is possible to widen the margin for dryout and increase the flow rate of the temperature control medium.

[0037] Furthermore, according to this embodiment, the pressing mechanism 53 presses the temperature control medium by supplying a pressing gas into the tank 30. As a result, it is possible to widen the margin for dryout and increase the flow rate of the temperature control medium.

[0038] Furthermore, according to this embodiment, the pressing gas has a boiling point lower than that of the temperature control medium, so that the gas can press the temperature control medium even in a low-temperature region where the temperature control medium liquefies.

[0039] Furthermore, according to this embodiment, the pressing mechanism 53 presses the temperature control medium with a piston, so that the temperature control medium can be pressed even if the gas for pressing cannot be prepared from the factory equipment (power usage) in which the temperature control system 1 is installed.

[0040] Furthermore, according to this embodiment, the pressing mechanism 53 presses the temperature control medium to a pressure equal to or greater than the vapor pressure of the temperature control medium, thereby widening the margin for dryout and increasing the flow rate of the temperature control medium.

[0041] According to the present embodiment, at least one of the outflow flow path and the inflow flow path is provided with a heater (heater 45, 46). As a result, the temperature control medium can be vaporized in the pipes 37, 38 and the temperature control unit 11.

[0042] Furthermore, according to this embodiment, the inlet flow path is provided with at least one of the pressure gauge 43 and the thermometer 44. As a result, it is possible to detect that the temperature control medium has been exhausted from the pipes 37, 38 and the temperature control unit 11.

[0043] Furthermore, according to this embodiment, the system further includes an exhaust flow path (piping 41) that is connected to the tank 30 and the inflow flow path and is configured to exhaust the temperature control medium. As a result, the temperature control medium can be exhausted to the detoxification mechanism 60 without being exposed to the atmosphere.

[0044] Furthermore, according to this embodiment, the cooling mechanism 31 is provided in the tank 30 or in the inlet flow path, so that the temperature control medium can be liquefied.

[0045] Moreover, according to this embodiment, the system further includes a purge mechanism 56 that is connected to the outflow passage and configured to be able to supply a purge gas into the temperature adjustment unit 11. As a result, the pipes 37, 38 and the inside of the temperature adjustment unit 11 can be purged.

[0046] Furthermore, according to this embodiment, the control method of the temperature control system 1 is a method for controlling the temperature control system 1 that cools components in the plasma processing chamber 10, and includes the steps of storing a gaseous temperature control medium in the tank 30 at room temperature and pressure, liquefying the temperature control medium stored in the tank 30, and circulating the liquefied temperature control medium while pressing it through the temperature control unit 11 that cools the components. As a result, it is possible to suppress the temperature control medium from being released into the atmosphere and to expand the usable temperature range of the temperature control medium. In other words, the temperature control system 1 can be used in low-temperature regions.

[0047] Furthermore, according to this embodiment, the control method of the temperature adjustment system 1 further includes the steps of: stopping the circulation of the temperature adjustment medium to the temperature adjustment unit 11; closing a first valve (valve 35) provided in the outlet flow path (pipes 32, 37) through which the temperature adjustment medium flows from the tank 30 to the temperature adjustment unit 11; and closing a second valve (valve 36) provided in the inlet flow path (pipes 33, 38) through which the temperature adjustment medium flows from the temperature adjustment unit 11 to the tank 30. Also, supplying a purge gas from a purge mechanism 56 connected to the outlet flow path closer to the temperature adjustment unit 11 than the first valve to the temperature adjustment unit 11, the temperature adjustment unit 11, and the inlet flow path, and exhausting the purge gas to an exhaust flow path (pipe 41) connected to the inlet flow path closer to the temperature adjustment unit than the second valve. As a result, the temperature adjustment medium can be exhausted to the abatement mechanism 60 without being exposed to the atmosphere.

[0048] Furthermore, according to this embodiment, the method further includes a step of increasing the temperature inside the flow path by a heater (heater 45, 46) provided in at least one of the outflow flow path and the inflow flow path before the exhaust step, so that the temperature control medium can be vaporized in the pipes 37, 38 and the temperature control unit 11.

[0049] Furthermore, according to the present embodiment, the temperature in the flow path is increased to a temperature equal to or higher than the boiling point of the temperature control medium in the temperature increasing step, which allows the temperature control medium to be vaporized more effectively in the pipes 37, 38 and the temperature adjustment unit 11.

[0050] Furthermore, according to this embodiment, the temperature increasing step involves opening a third valve (valve 40) provided in a flow path (piping 39) that branches off from the inlet flow path and is connected to the top of the tank 30, thereby returning the vaporized temperature control medium to the tank 30. As a result, the amount of temperature control medium that can be recovered in the tank 30 can be increased.

[0051] Furthermore, in this embodiment, the exhaust process stops when it is detected that the temperature control medium has been exhausted from the inlet flow path based on a value measured by at least one of the pressure gauge 43 and the thermometer 44 provided in the inlet flow path. As a result, maintenance such as part replacement can be performed on the plasma processing chamber 10 side.

[0052] Furthermore, according to this embodiment, the exhausting step detects that the temperature control medium has been exhausted from the inlet flow path based on the criteria that the temperature measured by the thermometer 44 is equal to or higher than the boiling point of the temperature control medium and that the pressure measured by the pressure gauge 43 is equal to or lower than the vapor pressure at the measured temperature. As a result, it is possible to more accurately detect the completion of exhausting the temperature control medium from the inlet flow path.

[0053] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and various omissions, substitutions, and modifications may be made to the above-described embodiments without departing from the spirit and scope of the appended claims.

[0054] In the above embodiment, the temperature adjustment system 1 is connected to a plasma processing apparatus including the plasma processing chamber 10 and cools components inside the plasma processing chamber 10, but the present invention is not limited to this. For example, the present invention may be applied to components to be cooled, such as components included in a modifying apparatus that performs annealing or the like, or a cleaning apparatus that cleans substrates.

[0055] The present disclosure may also be configured as follows: (1) A temperature control system for cooling a member in a plasma processing chamber, comprising: a tank configured to store a gaseous temperature control medium at room temperature and pressure; a cooling mechanism configured to liquefy the temperature control medium stored in the tank; an outlet flow path connected to an outlet of the tank and configured to allow the temperature control medium to flow out to a temperature control unit that cools the member by heat exchange with the temperature control medium; an inlet flow path connected to an inlet of the tank and configured to allow the temperature control medium to flow in from the temperature control unit after heat exchange; and a pump provided in the outlet flow path and configured to pump the temperature control medium stored in the tank. (2) The temperature control system according to (1), further comprising a supply mechanism connected to the tank and configured to supply the gaseous temperature control medium. (3) The temperature control system according to (1) or (2), wherein the temperature control medium includes at least one of C3F8 and C3H2F4. (4) The temperature control system according to any one of (1) to (3), further comprising a pressing mechanism configured to press the liquid temperature control medium stored in the tank. (5) The temperature control system according to (4), wherein the pressing mechanism supplies a pressing gas into the tank to press the temperature control medium. (6) The temperature control system according to (5), wherein the pressing gas has a boiling point lower than that of the temperature control medium. (7) The temperature control system according to (4), wherein the pressing mechanism presses the temperature control medium with a piston. (8) The temperature control system according to any one of (4) to (7), wherein the pressing mechanism presses the temperature control medium to a pressure equal to or greater than the vapor pressure of the temperature control medium. (9) The temperature control system according to any one of (1) to (8), wherein a heater is provided in at least one of the outflow channel and the inflow channel. (10) The temperature control system according to any one of (1) to (9), wherein the inlet flow path is provided with at least one of a pressure gauge and a thermometer.(11) The temperature control system according to any one of (1) to (10), further comprising an exhaust flow path connected to the tank and the inflow flow path and configured to exhaust the temperature control medium. (12) The temperature control system according to any one of (1) to (11), further comprising: a cooling mechanism provided in the tank or in the inflow flow path. (13) The temperature control system according to any one of (1) to (12), further comprising a purge mechanism connected to the outflow flow path and configured to be able to supply a purge gas into the temperature control unit. (14) A method for controlling a temperature control system that cools a member in a plasma processing chamber, comprising: a step of storing a gaseous temperature control medium in a tank at room temperature and normal pressure; a step of liquefying the temperature control medium stored in the tank; and a step of circulating the liquefied temperature control medium to a temperature control unit that cools the member while pressing the temperature control medium. (15) The method for controlling a temperature control system according to (14), further comprising the steps of: stopping the circulation of the temperature control medium to the temperature control unit; closing a first valve provided in an outlet flow path on a side where the temperature control medium flows out from the tank to the temperature control unit and a second valve provided in an inlet flow path on a side where the temperature control medium flows into the tank from the temperature control unit; supplying a purging gas to the outlet flow path, the temperature control unit, and the inlet flow path from a purge mechanism connected to the outlet flow path on the temperature control unit side of the first valve, and exhausting the purging gas to an exhaust flow path connected to the inlet flow path on the temperature control unit side of the second valve. (16) The method for controlling a temperature control system according to (15), further comprising the steps of: raising the temperature inside the flow path by a heater provided in at least one of the outlet flow path and the inlet flow path before the exhausting step. (17) The control method for a temperature control system according to (16), wherein the temperature increasing step increases the temperature inside the flow path to a temperature equal to or higher than the boiling point of the temperature control medium. (18) The control method for a temperature control system according to (17), wherein the temperature increasing step returns the vaporized temperature control medium to the tank by opening a third valve provided in a flow path branching from the inlet flow path and connected to an upper part of the tank.(19) The control method for a temperature control system according to any one of (15) to (18), wherein the exhausting step stops the exhausting when it is detected that the temperature control medium has been exhausted from the inflow flow path based on a value measured by at least one of a pressure gauge and a thermometer provided in the inflow flow path. (20) The control method for a temperature control system according to (19), wherein the exhausting step detects that the temperature control medium has been exhausted from the inflow flow path based on the criteria that the temperature measured by the thermometer is equal to or higher than the boiling point of the temperature control medium and that the pressure measured by the pressure gauge is equal to or lower than the vapor pressure at the measured temperature.

[0056] REFERENCE SIGNS LIST 1 Temperature control system 2 Chiller unit 3 Control unit 10 Plasma processing chamber 11 Temperature control unit 30 Tank 31 Cooling mechanism 32, 33, 37, 38, 39, 41, 47, 51, 54, 58 Piping 34 Pump 35, 36, 40, 42, 48, 52, 55, 57 Valve 43 Pressure gauge 44 Thermometer 45, 46 Heater 50 Supply mechanism 53 Pressing mechanism 56 Purge mechanism 60 Detoxification mechanism

Claims

1. A temperature control system for cooling components in a plasma processing chamber, comprising: a tank configured to store a gaseous temperature control medium at room temperature and pressure; a cooling mechanism configured to liquefy the temperature control medium stored in the tank; an outlet flow path connected to the outlet of the tank and configured to allow the temperature control medium to flow out to a temperature control unit that cools the components by heat exchange with the temperature control medium; an inlet flow path connected to the inlet of the tank and configured to allow the temperature control medium to flow in from the temperature control unit after heat exchange; and a pump provided in the outlet flow path and configured to pump out the temperature control medium stored in the tank.

2. The temperature control system according to claim 1, further comprising a supply mechanism connected to the tank and configured to supply the temperature control medium in gaseous form.

3. The temperature control system according to claim 1 or 2, wherein the temperature control medium contains at least one of C3F8 and C3H2F4.

4. The temperature control system according to claim 1 or 2, further comprising a pressing mechanism configured to press the liquid temperature control medium stored in the tank.

5. The temperature control system according to claim 4, wherein the pressing mechanism supplies a pressing gas into the tank to press the temperature control medium.

6. The temperature control system according to claim 5, wherein the pressing gas has a boiling point lower than that of the temperature control medium.

7. The temperature control system according to claim 4, wherein the pressing mechanism presses the temperature control medium with a piston.

8. The temperature control system according to claim 4, wherein the pressing mechanism presses the temperature control medium to a pressure equal to or greater than the vapor pressure of the temperature control medium.

9. The temperature control system according to claim 1 or 2, wherein a heater is provided in at least one of the outlet flow path and the inlet flow path.

10. The temperature control system according to claim 1 or 2, wherein at least one of a pressure gauge and a thermometer is provided in the inlet flow path.

11. The temperature control system according to claim 1 or 2, further comprising an exhaust flow path connected to the tank and the inlet flow path and configured to exhaust the temperature control medium.

12. The temperature control system according to claim 1 or 2, wherein the cooling mechanism is provided in the tank or in the inlet flow path.

13. The temperature control system according to claim 1 or 2, further comprising a purge mechanism connected to the outlet flow path and configured to be able to supply a purge gas into the temperature control unit.

14. A method for controlling a temperature control system that cools components in a plasma processing chamber, comprising the steps of: storing a gaseous temperature control medium in a tank at room temperature and pressure; liquefying the temperature control medium stored in the tank; and circulating the liquefied temperature control medium while pressing it to a temperature control unit that cools the components.

15. A control method for a temperature control system as described in claim 14, further comprising the steps of: stopping the circulation of the temperature control medium to the temperature control unit; closing a first valve provided in an outlet flow path on the side where the temperature control medium flows out from the tank to the temperature control unit, and a second valve provided in an inlet flow path on the side where the temperature control medium flows into the tank from the temperature control unit; and supplying a purge gas to the outlet flow path, the temperature control unit, and the inlet flow path from a purge mechanism connected to the outlet flow path on the temperature control unit side of the first valve, and exhausting the purge gas to an exhaust flow path connected to the inlet flow path on the temperature control unit side of the second valve.

16. The method for controlling a temperature adjustment system according to claim 15, further comprising, before the exhausting step, a step of raising the temperature inside the flow path by a heater provided in at least one of the outflow flow path and the inflow flow path.

17. The method for controlling a temperature adjustment system according to claim 16, wherein the temperature increasing step increases the temperature inside the flow path to a temperature equal to or higher than the boiling point of the temperature adjustment medium.

18. A method for controlling a temperature control system as described in claim 17, wherein the temperature raising step includes opening a third valve provided in a flow path that branches off from the inlet flow path and is connected to the top of the tank, and returning the vaporized temperature control medium to the tank.

19. A control method for a temperature control system according to any one of claims 15 to 18, wherein the exhausting step stops the exhausting when it is detected that the temperature control medium has been exhausted from the inlet flow path based on a value measured by at least one of a pressure gauge and a thermometer provided in the inlet flow path.

20. A control method for a temperature control system as described in claim 19, wherein the exhausting step detects that the temperature control medium has been exhausted from the inlet flow path based on the criteria that the temperature measured by the thermometer is equal to or higher than the boiling point of the temperature control medium and that the pressure measured by the pressure gauge is equal to or lower than the vapor pressure at the measured temperature.

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