Electronic device including structure for heat dissipation

Abstract

According to an embodiment, an electronic device may comprise: a heat-generating component; and a vapor chamber disposed above the heat-generating component. The vapor chamber may include an enclosure, a fluid within the enclosure, and a wick structure within the enclosure. The wick structure may include a first portion at least partially disposed on the heat-generating component, a second portion configured to absorb the fluid in a liquid state, and a third portion disposed between the first portion and the second portion. The width of the enclosure surrounding the third portion may be smaller than the width of the enclosure surrounding the second portion. The second portion may include one or more stem portions extending from the third portion, and multiple of branch portions extending from the one or more stem portions. The number of the multiple branch portions of the second portion may be greater than the number of the one or more stem portions.

Description

Electronic device including a structure for heat dissipation

[0001] The present disclosure relates to an electronic device including a structure for heat dissipation.

[0002] Electronic devices may include various electronic components to meet user needs. The electronic devices may be miniaturized to be wearable or portable. As the electronic components within the electronic devices perform operations to respond to user requests, heat may be generated within the miniaturized electronic devices. The electronic devices may include structures for dissipating heat within the electronic devices.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] An electronic device is disclosed. According to one embodiment, the electronic device may include a heat-generating component and a vapor chamber disposed over the heat-generating component. The vapor chamber may include an enclosure, a fluid within the enclosure, and a wick structure within the enclosure. The wick structure may include a first portion disposed at least partially over the heat-generating component. The state of the fluid located within the first portion may change from a liquid state to a gaseous state by heat transferred from the heat-generating component to the first portion. The gaseous fluid may diffuse into an internal space of the enclosure. The wick structure may include a second portion configured to absorb the fluid in a liquid state that has changed from the gaseous state within the internal space of the enclosure. The wick structure may include a third portion disposed between the first portion and the second portion. The liquid fluid absorbed by the second portion may move to the first portion through the third portion. A width of a portion of the interior space of the enclosure surrounding the third portion may be smaller than a width of the interior space of the enclosure surrounding the second portion. The third portion may include one or more elongated stem portions extending from the first portion. The second portion may include one or more elongated stem portions extending from the one or more elongated stem portions of the third portion. The second portion may include a plurality of branches extending from the one or more elongated stem portions of the second portion. The plurality of branches may be spaced apart from each other. The number of the plurality of branches of the second portion may be greater than the number of the one or more elongated stem portions of the third portion.

[0005] An electronic device is disclosed. According to one embodiment, the electronic device may include a heat-generating component and a vapor chamber. The vapor chamber may include an enclosure defining an internal space disposed above the heat-generating component and including a first plate and a second plate coupled to the first plate to seal the internal space. The vapor chamber may include a fluid within the internal space for cooling the heat-generating component, and a wick structure within the internal space. The internal space may include a first space disposed at least partially above the heat-generating component for vaporizing the fluid by receiving heat emitted from the heat-generating component. The internal space may include a second space spaced apart from the first space for condensing the fluid. The internal space may include a third space connecting the first space and the second space and having a smaller width than the second space. The wick structure may include a first portion disposed within the first space and through which the fluid within the first space changes from a liquid state to a gaseous state. The wick structure may include a second portion including one or more stem portions extending from the first portion across the third space to the second space, and a plurality of branch portions branching from the one or more stem portions to increase absorption of the liquid fluid condensed within the second space. The first portion may be attached to the first plate within the internal space and spaced apart from the second plate. The second portion may be interposed between the first plate and the second plate within the internal space.

[0006] An electronic device is disclosed. In one embodiment, the electronic device may include an electronic component, an enclosure defining a space for a fluid on the electronic component, and a vapor chamber including a wick structure disposed within the space. The enclosure may include a first region at least partially disposed above the electronic component to receive heat emitted from the electronic component, a second region spaced apart from the first region, and a third region connecting the first region and the second region and having an internal volume smaller than that of the second region. The wick structure may include a first portion disposed within the first region and a second portion extending from the first portion across the third region to the second region. The number of first ends of the second portion disposed within the second region may be greater than the number of second ends of the second portion connected to the first portion disposed within the first region to absorb the fluid within the second region.

[0007] An electronic device is disclosed. According to one embodiment, the electronic device may include an electronic component. The electronic device may include a vapor chamber including a first plate, a second plate coupled to the first plate, and an enclosure including a space for fluid on the electronic component between the first plate and the second plate, and a wick structure disposed within the space. The enclosure may define a first region at least partially disposed above the electronic component to receive heat emitted from the electronic component, a second region spaced apart from the first region, and a third region connecting the first region and the second region and having an internal volume smaller than that of the second region. The wick structure may include a first portion disposed within the first region, one or more stem portions extending from the first portion across the third region to the second region, and a second portion including a plurality of branches each branching from the one or more stem portions within the second region. The first portion may be spaced apart from the second plate by being attached to the first plate within the space. The second portion may be interposed between the first plate and the second plate so as to be attached to the first plate and the second plate within the space.

[0008] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0011] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0012] Figure 3a illustrates a portion of an exemplary electronic device.

[0013] FIG. 3b illustrates a portion of a vapor chamber of an exemplary electronic device.

[0014] Figure 4a is an exploded perspective view of a vapor chamber of an exemplary electronic device.

[0015] FIG. 4b illustrates a portion of a vapor chamber of an exemplary electronic device.

[0016] Figures 5a, 5b, and 5c illustrate portions of the wick structure of an exemplary vapor chamber.

[0017] FIGS. 6A and 6B are partial cross-sectional views of an exemplary vapor chamber taken along line A-A' of FIG. 4B.

[0018] FIG. 6c is a cross-sectional view of an exemplary vapor chamber taken along line B-B' of FIG. 4b.

[0019] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0020] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0044] Referring to FIG. 2A, an electronic device (101) according to one embodiment may include a housing assembly (210) forming an exterior of the electronic device (101). For example, the housing assembly (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing assembly (210) may also refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0045] An electronic device (101) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, but is not limited to, a glass plate including various coating layers or a polymer plate.

[0046] An electronic device (101) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0047] An electronic device (101) according to one embodiment may include a frame (or side bezel structure) (218). According to one embodiment, the frame (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a side surface (200C) of the electronic device (101). For example, the frame (218) may form the entire side surface (200C) of the electronic device (101), or, for another example, the frame (218) may form the side surface (200C) of the electronic device (101) together with the front plate (202) and / or the rear plate (211).

[0048] Unlike the illustrated embodiment, when the side surface (200C) of the electronic device (101) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that is curved and extends seamlessly from its edge part toward the rear plate (211) and / or the front plate (202). The extending region of the front plate (202) and / or the rear plate (211) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

[0049] In one embodiment, the frame (218) may comprise metal and / or polymer. In one embodiment, the back plate (211) and the frame (218) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the frame (218) may be formed as separate components and / or may comprise different materials.

[0050] According to one embodiment, the electronic device (101) may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light emitting element (not shown)) or may additionally include other components.

[0051] In one embodiment, the display (201) (e.g., the display module (160) of FIG. 1) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0052] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0053] According to one embodiment, the display (201) (or the front surface (200A) of the electronic device (101)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the front surface (200A) and spaced apart from the outer edge of the front surface (200A), but is not limited thereto. In another embodiment, when the front surface (200A) is viewed from the front, at least a portion of an edge part of the screen display area (201A) may substantially coincide with an edge part of the front surface (200A) (or the front plate (202)).

[0054] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0055] According to one embodiment, the display (201) may include an area where a first camera (205) (e.g., the camera module (180) of FIG. 1) is positioned. According to one embodiment, an opening is formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge part of the opening. According to one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to a direction facing the front (200A) through the area of ​​the display (201).

[0056] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0057] According to one embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and a speaker hole (207).

[0058] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones so as to detect the direction of the sound.

[0059] According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0060] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (101). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, with reference to the illustration in FIG. 2A, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed in a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or display (201)) and the frame (218).

[0061] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and / or a call receiver hole (not shown).

[0062] According to one embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0063] According to one embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera (205) positioned to face the front (200A) of the electronic device (101), a second camera (212) positioned to face the rear (200B), and a flash (213).

[0064] In one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0065] According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and / or image signal processors.

[0066] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0067] According to one embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be positioned on a side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0068] According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0069] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (200A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include a light emitting diode (LED), an IR LED, and / or a xenon lamp.

[0070] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0071] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0072] Referring to FIG. 2B, an electronic device (101) according to one embodiment may include a frame (218), a bracket (243), a printed circuit board (250), a cover plate (260), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251), which is a main board, and a second printed circuit board (252), which is a sub board.

[0073] An electronic device (101) according to one embodiment may include a frame (218) forming an exterior of the electronic device (101) (e.g., a side surface (200C) of FIG. 2A) and a bracket (243) extending inwardly from the frame (218). According to one embodiment, the frame (218) and the bracket (243) may be disposed between the display (201) and the rear plate (211). For example, the frame (218) may surround a space between the rear plate (211) and the front plate (202) (and / or the display (201)). For example, the bracket (243) may extend from the frame (218) within the space.

[0074] In one embodiment, the bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the bracket (243) facing one direction (e.g., +z direction), and the display (201) may be supported by a support portion of the bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the bracket (243) facing the opposite direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may be respectively seated in recesses defined by the frame (218) and / or the bracket (243).

[0075] According to one embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly disposed on the bracket (243) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed on the bracket (243) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0076] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (251) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (251). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0077] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (251). Through this, the cover plate (260) may protect the first printed circuit board (251) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (251).

[0078] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (251) via a joining member (e.g., a screw), or may be coupled to the bracket (243) together with the first printed circuit board (251) via the joining member.

[0079] In one embodiment, the display (201) may be positioned between a bracket (243) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +z direction) of the display (201), and the bracket (243) may be positioned on the other side (e.g., in the -z direction).

[0080] According to one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0081] According to one embodiment, the front plate (202) may be coupled to the frame (218). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the front plate (202) and the frame (218). However, the present invention is not limited to the above-described example.

[0082] According to one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory (e.g., volatile memory (132) of FIG. 1) or a non-volatile memory (e.g., non-volatile memory (134) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. In one embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0083] In one embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0084] An electronic device (101) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to one embodiment, the antenna module may be disposed between a rear plate (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0085] In one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a bracket (243) such that the lens can receive external light through a portion (e.g., a camera area (237)) of the front plate (202) (e.g., the front (200A) of FIG. 2A).

[0086] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the bracket (243) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (101).

[0087] According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and according to one embodiment, the camera area (284) may form a plane substantially coextensive with the surface of the rear plate (211).

[0088] According to one embodiment, the housing assembly (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (202), the frame (218), the bracket (243), and / or the rear plate (211) that form the exterior of the electronic device (101) may be referred to as the housing assembly (210) of the electronic device (101).

[0089] Figure 3a illustrates a portion of an exemplary electronic device. Figure 3b illustrates a portion of a vapor chamber of the exemplary electronic device.

[0090] Referring to FIGS. 3A and 3B, an electronic device (101) may include an electronic component (30) (or a heat-generating component) and a vapor chamber (300). The vapor chamber (300) may include an enclosure (310) defining a space (S) for a fluid (hereinafter, the fluid may be referred to as a substance and / or a cooling substance) positioned at least partially on or above the electronic component (30), and a wick structure (320) (hereinafter, the wick structure (320) may be referred to as a transport medium or a fluid transfer element) disposed within the space (S). When referring to the enclosure (310) on or above the electronic component (30), it may be understood that when these elements are viewed from above (or in a particular direction), the enclosure (310) blocks the view of the electronic component (30) (or a covered portion thereof).

[0091] According to one embodiment, the vapor chamber (300) may be configured to receive at least a portion of the heat emitted from the electronic component (30). For example, the vapor chamber (300) and the electronic component (30) may be disposed within the electronic device (101). The vapor chamber (300) may be surrounded by a frame (218) forming, for example, at least a portion of a side surface (e.g., side surface (200C) of FIG. 2A) of the electronic device (101). For example, the vapor chamber (300) may be disposed around the electronic component (30) to receive the heat emitted from the electronic component (30). For example, at least a portion of the vapor chamber (300) may at least partially overlap the electronic component (30) when the electronic component (30) is viewed from above (e.g., when viewed in the +z direction). For example, at least a portion of the vapor chamber (300) may face the electronic component (30). For example, at least a portion of the vapor chamber (300) may come into contact with the electronic component (30).

[0092] For example, the electronic component (30) may be mounted on a printed circuit board (e.g., the first printed circuit board (251) or the second printed circuit board (252) of FIG. 2B) within the electronic device (101). At least a portion of the vapor chamber (300) may face at least a portion of the printed circuit board on which the electronic component (30) is disposed. For example, the vapor chamber (300) may be mounted on a bracket (243) within the housing assembly (210) of the electronic device (101) facing the printed circuit board in order to transfer at least a portion of the heat generated from the electronic component (30) disposed on the printed circuit board (e.g., the first printed circuit board (251) or the second printed circuit board (252)). For example, the vapor chamber (300) may be disposed on one side of the bracket (243) facing the display of the housing assembly (210) (e.g., the display (201) of FIG. 2A). For example, at least a portion of the bracket (243) may be disposed between the electronic component (30) and the vapor chamber (300). The vapor chamber (300) may be configured to receive at least a portion of the heat generated from the electronic component (30) through the bracket (243). The at least a portion of the bracket (243) disposed between the electronic component (30) and the vapor chamber (300) may include, but is not limited to, metal.

[0093] For example, the electronic component (30) may be a processor of an electronic device (101) having a relatively high amount of heat generation (e.g., the processor (120) of FIG. 1). The electronic component (30) may be disposed, for example, on one surface of a printed circuit board (e.g., the first printed circuit board (251) or the second printed circuit board (252) of FIG. 2B) facing the vapor chamber (300). The electronic component (30) may perform data processing or calculations as the electronic device (101) operates. The electronic component (30) may emit heat as it performs data processing or calculations. The vapor chamber (300) may reduce damage to the electronic component (30) and / or at least one other electronic component around the electronic component (30) due to the heat by receiving at least a portion of the heat emitted from the electronic component (30). The electronic component (30) may be referred to as a heat generating component or heat generating body of the electronic device (101) in that it is an element that generates heat, but is not limited thereto.

[0094] In one embodiment, the enclosure (310) may include a first plate (311), and a second plate (312) coupled to the first plate (311) to seal a space (S) for a fluid in the enclosure (310). The fluid in the space (S) may be referred to as a cooling material or refrigeration material or a heat transfer material in that it is configured to cool or change the temperature of the electronic component (30) through a phase change. For example, the enclosure (310) may form the outer appearance of the vapor chamber (300). The enclosure (310) may include, but is not limited to, a metal having relatively high thermal conductivity. For example, the first plate (311) may be a plate supported by or attached to the housing assembly (210) (or bracket (243)) of the electronic device (101). The first plate (311) may be a plate that receives heat from the electronic component (30). For example, the second plate (312) may be placed on the first plate (311). The second plate (312) may be a plate facing the display (201) of the electronic device (101). For example, the second plate (312) may be fastened to the first plate (311). The second plate (312) may provide a space (S) for the fluid of the vapor chamber (300) together with the first plate (311). For example, the second plate (312) may define regions (300a, 300b, 300c) of the vapor chamber (300) and / or the enclosure (310) together with the first plate (311). For example, the second plate (312) may have a shape that overlaps the first plate (311) when looking at the vapor chamber (300) from above (e.g., when looking in the +z direction), but is not limited thereto.

[0095] For example, the first plate (311) may include a base (311a) for supporting the wick structure (320), and a side wall (311b) that is disposed along an edge of the base (311a) and protrudes from the base (311a) to be coupled with a second plate (312). The side wall (311b) may be configured to support the second plate (312), thereby forming a space (S) between the base (311a) and the second plate (312) or surrounding the space (S). The height of the space (S) of the enclosure (310) may be provided by the side wall (311b). However, the above-described embodiment is exemplary, and the side wall (311b) that provides the height to the space (S) may extend, for example, from the second plate (312) toward the first plate (311). For example, the side wall (311b) may be considered as a part of the second plate (312) or may be considered to be separate from the first plate (311) and the second plate (312).

[0096] According to one embodiment, the enclosure (310) may include a first region (300a) (or first portion) at least partially disposed over the electronic component (30) to receive heat emitted from the electronic component (30), a second region (300b) (or second portion) spaced apart from the first region (300a), and a third region (300c) (or third portion) connecting the first region (300a) and the second region (300b). The third region (300c) may have an internal volume smaller than that of the second region (300b). For example, the vapor chamber (300) and / or the enclosure (310) may define or form the regions (300a, 300b, 300c). For example, the vapor chamber (300) may include a fluid within a space (S) of the enclosure (310) to disperse heat transferred from the electronic component (30) to the vapor chamber (300). The fluid may be vaporized by heat transferred from the electronic component (30) to the vapor chamber (300). The fluid may be liquefied as heat is released from the vapor chamber (300). The fluid may be, for example, water, but is not limited thereto. For example, the regions (300a, 300b, 300c) may form a space (S) to diffuse heat released from the electronic component (30) or cool the electronic component (30) by utilizing a phase change of the fluid within the vapor chamber (300).

[0097] For example, the first region (300a) may be a region that at least partially overlaps with the electronic component (30) when the vapor chamber (300) is viewed from above (e.g., when viewed in the +z direction). The first region (300a) may be a region that receives heat from the electronic component (30). For example, the first region (300a) may receive more heat than the second and third regions (300b, 300c). For example, the first region (300a) may be a region that faces the electronic component (30) or is in contact with the electronic component (30). For example, the first region (300a) may be faced away from the electronic component (30). For example, the first region (300a) may be a region separated from the electronic component (30) by an internal structure of the electronic device (101) (e.g., bracket (243)). For example, at least a portion of the liquid fluid within the first region (300a) may be vaporized by heat transferred from the electronic component (30) to the first region (300a). The first region (300a) may be configured to diffuse the heat emitted from the electronic component (30) through the third region (300c) and the second region (300b) or to cool the electronic component (30) by vaporizing the liquid fluid within the first region (300a). The above first region (300a) may be referred to as an evaporation portion and / or heat source of the vapor chamber (300) in that it is a region where a liquid fluid within the space (S) of the enclosure (310) is vaporized by heat emitted from the electronic component (30), but is not limited thereto.

[0098] For example, the second region (300b) may be a region configured to have a lower temperature than the first region (300a) that receives heat from the electronic component (30) by being spaced apart from the first region (300a) (or by being spaced apart from the electronic component (30). For example, the second region (300b) may be a region in which a gaseous fluid that has moved from the first region (300a) to the second region (300b) through the third region (300c) releases heat. By releasing heat (e.g., from the gaseous fluid), the temperature of the second region (300b) may decrease to be lower than the temperature of the first region (300a). The gaseous fluid within the second region (300b) may be liquefied by releasing heat to the outside of the vapor chamber (300) within the second region (300b). For example, the gaseous fluid in the second region (300b) can heat the walls of the second region (300b) (e.g., a part of the enclosure (310) corresponding to the second region (300b)) and liquefy the fluid in the second region (300b) through the walls that release heat to the outside of the vapor chamber (300). The second region (300b) may be referred to as a condensation portion of the vapor chamber (300) in that it is a region where the gaseous fluid in the space (S) of the enclosure (310) is liquefied (or condensed), but is not limited thereto.

[0099] For example, the third region (300c) may be a region that provides a path for fluid movement between the first region (300a) and the second region (300b). The third region (300c) may be positioned between the first region (300a) and the second region (300b). For example, the third region (300c) may extend from the first region (300a) to the second region (300b). For example, the third region (300c) may provide a passage (e.g., the second channels (452) of FIG. 4b) for a gaseous fluid to move from the first region (300a) to the second region (300b) by connecting the internal space of the first region (300a) and the internal space of the third region (300b), or may provide a passage for a liquid fluid to pass through the wick structure (320) so as to move from the second region (300b) to the first region (300a) through the wick structure (320). The third region (300c) may be referred to as a neck portion or a joining portion of the vapor chamber (300) in that it is a region connecting the first region (300a) and the second region (300b), but is not limited thereto.

[0100] For example, the internal volume of the third region (300c) may be smaller than the internal volume of the second region (300b). In other words, the third region (300c) may define a volume of the space of the vapor chamber (300) that is smaller than the volume of the space defined by the second region (300b). For example, the electronic device (101) may require a structure in which the first region (300a) and the third region (300b) of the vapor chamber (300) disposed on the bracket (243) are tilted with respect to each other due to internal components (or structures) of the electronic device (101) mounted on the bracket (243) of the housing assembly (210), and / or the size of the third region (300c) is relatively small. For example, the first region (300a) may be arranged to be inclined in a direction parallel to the x-axis with respect to the second region (300b) by one or more cameras (305) mounted on the bracket (243). For example, the first region (300a) may be offset with respect to the y-axis with respect to the second region (300b) by one or more cameras (305) arranged around the first region (300a). For example, the center point of the first region (300a) may be offset from the center point of the second region (300b) by one or more cameras (305) when looking at the vapor chamber (300) from above (e.g., when looking in the +z direction). The virtual line connecting the center point of the first region (300a) and the center point of the second region (300b) may not be parallel to the x-axis, for example. For example, the third region (300c) may have a smaller size than the first region (300a) and / or the second region (300b) in order to connect the first region (300a) and the second region (300b) by one or more cameras (305).For example, because one or more cameras (305) are arranged with respect to a specified width of a frame (218) of the electronic device (101), and / or due to the arrangement of the one or more cameras (305) within the electronic device (101), the width (w2) of the third region (300c) may be smaller than the width (w1) of the second region (300b). However, the present invention is not limited thereto, and the enclosure (310) may include a third region (300c) formed to impede the movement of fluid within the enclosure (310) by including an irregular shape in which the first region (300a) is offset with respect to the second region (300b). The third region (300c) may be referred to as a bottle neck section of the enclosure (310), but is not limited thereto.

[0101] According to one embodiment, the wick structure (320) may include a first portion (321) disposed within a first region (300a) and a second portion (322) extending from the first portion (321) across a third region (300c) to a second region (300b). For example, the wick structure (320) may be wrapped or surrounded by an enclosure (310). The wick structure (320) may be disposed between a first plate (311) and a second plate (312) of the enclosure (310). For example, the wick structure (320) may include a porous structure and / or a capillary structure for absorbing a liquid fluid within the vapor chamber (300). The above wick structure (320) may include, but is not limited to, at least one of a mesh wick for absorbing a liquid fluid and a sintering wick.

[0102] For example, the first portion (321) may be a portion that overlaps the first region (300a) when looking at the vapor chamber (300) from above among the wick structure (320). The first portion (321) may be attached to the first plate (311) within a space (S) defined by the enclosure (310). The first portion (321) may be spaced apart from the second plate (312) by being attached to the base (311a) of the first plate (311) within the first region (300a). A flow path (e.g., the first channel (451) of FIG. 4b) for a gaseous fluid may be formed on the first portion (321) due to the height of the side wall (311b) of the first plate (311). The liquid fluid within the first portion (321) may be vaporized by heat emitted from the electronic component (30) and moved to the passage for the gaseous fluid between the first portion (321) and the second plate (312). In other words, the passage may correspond to the space of the first region (300a) or the enclosure (310) above or around the first portion (321) where the fluid is vaporized or evaporated to become a gaseous form.

[0103] For example, the second portion (322) may be a portion disposed within or across the second region (300b) and the third region (300c) of the wick structure (320). For example, the second portion (322) may contact the first plate (311) and the second plate (312) within the second region (300b) and the third region (300c). The second portion (322) may extend from the first plate (311) to the second plate (312), thereby forming or defining a flow path (e.g., the second channels (452) of FIG. 4b) for a gaseous fluid between the second portion (322) and / or the enclosure (310). In other words, the passage may correspond to the second region (300b), the third region (300c), and / or the space within the enclosure (310) above or around the second portion (322) through which the gaseous fluid can move. The second portion (322) may pass through the third region (300c) to move the liquid fluid from the second region (300b) to the first portion (321) within the first region (300a) through the third region (300c).

[0104] The second portion (322) of the wick structure (320) may have a lower absorption rate of the liquid fluid within the second region (300b) by passing through the third region (300c) having a relatively small width (w2) by internal structures and / or components (e.g., one or more cameras (305)) of the electronic device (101). For example, the second region (300b) may be arranged to be inclined in a direction parallel to the y-axis with respect to the first region (300a) by the one or more cameras (305) (e.g., by the position of the one or more cameras (305) with respect to the vapor chamber (300) within the electronic device (101). The third region (300c) may have an internal volume smaller than that of the second region (300b) in order to connect the first region (300a) and the second region (300b) by the one or more cameras (305). For example, the width (w2) of the third region (300c) may be configured to be smaller than the width (w1) of the second region (300b), so that the absorption rate of the liquid fluid within the second region (300b) of the second portion (322) extending across the third region (300c) to the second region (300b) may be reduced. For example, since the volume of the extra regions (350a, 350b) in which the second part (322) is not disposed within the second region (300b) increases due to the third region (300c) having a relatively small internal volume, the absorption rate of the liquid-state fluid within the second region (300b) absorbed by the second part (322) may decrease. The vapor chamber (300) may require a wick structure (320) to improve the performance of the vapor chamber (300) by increasing the absorption rate of the liquid-state fluid within the second region (300b). The structure of the second part (322) to improve the performance of the vapor chamber (300) is described and illustrated through FIGS. 4A and 4B.

[0105] Figure 4a is an exploded perspective view of a vapor chamber of an exemplary electronic device. Figure 4b illustrates a portion of a vapor chamber of an exemplary electronic device.

[0106] Referring to FIGS. 4A and 4B, an electronic device (e.g., the electronic device (101) of FIG. 1) may include an electronic component (30) and a vapor chamber (300). The vapor chamber (300) may include an enclosure (310) defining a space (S) for a fluid on the electronic component (30) and a wick structure (320) disposed within the space (S). The enclosure (310) may include a first region (300a) at least partially disposed on the electronic component (30) to receive heat emitted from the electronic component (30), a second region (300b) spaced apart from the first region (300a), and a third region (300c) connecting the first region (300a) and the second region (300b) and having an internal volume smaller than that of the second region (300b). For example, the third region (300c) may form a bottle neck between the first region (300a) and the second region (300b), and the third region (300c) may have a cross-section that is smaller than the cross-section of the second region (300b) in at least one dimension (e.g., along the x-axis of FIG. 4b). The wick structure (320) may include a first portion (321) disposed within the first region (300a) and a second portion (322) extending from the first portion (321) across the third region (300c) to the second region (300b). In one embodiment, the enclosure (310) may include a first plate (311) and a second plate (312) coupled on the first plate (311) to seal the space (S). It should be noted that the description of features in FIG. 3a or FIG. 3b may apply to similar features in FIG. 4a or FIG. 4b, and that FIGS. 4a and 4b also describe new and / or modified features of the features in FIGS. 3a and 3b.However, the description of FIGS. 3a and 3b should not be considered to limit the examples of FIGS. 4a and 4b or to imply limitations to the examples of FIGS. 4a and 4b.

[0107] According to one embodiment, the number (e.g., a counted number or a predetermined number) of first ends (410) of the second portion (322) disposed within the second region (300b) may be greater than the number (e.g., a counted number or a predetermined number) of second ends (420) of the second portion (322) connected to the first portion (321) disposed within the first region (300a) to absorb fluid within the second region (300b). Here, the first ends (410) may be referred to as first extensions. Here, the second ends (420) may be referred to as second extensions. By way of example, one or more second ends (420) are provided, and a greater number of first ends (410) are provided.

[0108] For example, the second portion (322) may extend from the second ends (420) across the third region (300b) to the first ends (410) within the second region (300b). For example, the first ends (410) may be ends of the second portion (322) configured to absorb a liquid fluid within the second region (300b). The first ends (410) may increase the surface area of ​​the second portion (322) for absorbing the liquid fluid within the second region (300b). For example, the second ends (420) may be portions through which a liquid fluid moves from the second portion (322) to the first portion (321), or through which a liquid fluid moves from the first portion (321) to the second portion (322). For example, the second ends (420) may be ends of the second portion (322) that are in contact with or adjacent to the first portion (321). For example, the second ends (420) may be located at the boundary of the first region (300a) and the third region (300c), but are not limited thereto. The second portion (322) of the wick structure (320) is configured such that the number of the first ends (410) located in the second region (300b) is greater than the number of the second ends (420) connected to the first portion (321), thereby increasing the absorption rate of the liquid fluid in the second region (300b) to move the liquid fluid in the second region (300b) through the third region (300c) having a relatively small internal volume.

[0109] According to one embodiment, the second portion (322) may include one or more stem portions (or sub portions) extending from the first portion (321) across the third region (300c) to the second region (300b) thereby defining second ends (420). The second portion (322) may include a plurality of branches (440) each branching from the one or more stem portions (430) within the second region (300b) thereby defining at least a portion of the first ends (410). That is, each of the branches (440) extends from one of the stem portions (430) of the second region (300b).

[0110] For example, one or more stem portions (430) may extend from the first portion (321) through the third portion (300c) to the second portion (300b), thereby providing a path for a liquid fluid to move from the second portion (300b) to the first portion (321). For example, one or more stem portions (430) may be a portion of the second portion (322) that includes the second ends (420). The one or more stem portions (430) may be a portion that extends from the second ends (420) and penetrates the third portion (300c) having a relatively small internal volume. For example, the one or more stem portions (430) may include a plurality of stem portions (431, 432, 433). Each of the plurality of stem portions (431, 432, 433) may provide flow paths for a liquid fluid extending from the first portion (421) across the third portion (300c) to the second portion (300b). Each of the plurality of stem portions (431, 432, 433) may include end portions (431b, 432b, 433b) connected to the first portion (421). The end portions (431b, 432b, 433b) may correspond to second ends (420) of the second portion (322) to which the second portion (322) and the first portion (321) are connected. The number of the second ends (420) may correspond to the number of the one or more stem parts (430) and / or the number of ends (431b, 432b, 433b) of the one or more stem parts (430) to which the one or more stem parts (430) and the first part (321) are connected, but is not limited thereto.

[0111] For example, a plurality of branch portions (440) may extend from one or more stem portions (430) located within the second region (300b). The plurality of branch portions (440) may each branch from one or more stem portions (430) within the second region (300b) to provide additional ends or extensions / protrusions to the second portion (322) for absorbing a liquid fluid within the second region (300b). For example, the one or more stem portions (430) may include a plurality of stem portions (431, 432, 433). The plurality of branch parts (440) may extend from each of the plurality of stem parts (431, 432, 433) within the second region (300b) to provide first ends (410) of the second portion (322) within the second region (300b) together with the plurality of stem parts (431, 432, 433). Since the plurality of branch parts (440) provide additional ends of the second portion (322) disposed within the second region (300b) in addition to the ends provided by the plurality of stem parts (431, 432, 433), the number of the first ends (410) of the second portion (322) disposed within the second region (300b) may be greater than the number of the second ends (420) of the second portion (321) connected to the first portion (321). Since the number of the first ends (410) is greater than the number of the second ends (420), the second portion (322) can increase the absorption rate of the liquid fluid within the second region (300b). For example, a greater number of the first ends (410) means that the excess area in the second region (300b) where the second portion (322) is not arranged can be less or smaller.

[0112] For example, the first ends (410) may include third ends (411) defined by one or more stem parts (430), and fourth ends (412) defined by a plurality of branch parts (440). The plurality of branch parts (440) may extend from respective portions of the one or more stem parts (430) connecting the second ends (420) defined by the one or more stem parts (430) and the third ends (411). For example, the one or more stem parts (430) may include a plurality of stem parts (431, 432, 433). Among the first ends (410), the third ends (411) may correspond to ends (431a, 432a, 433a) arranged in the second region (300b) of each of the plurality of stem parts (431, 432, 433). The second ends (420) may correspond to other ends (431b, 432b, 433b) connected to the first portion (321) of each of the plurality of stem parts (431, 432, 433).

[0113] For example, the fourth ends (412) of the first ends (410) may be additional ends defined by a plurality of branches (440) within the second region (300b). For example, the plurality of branches (440) may include a first set of branches (441) branching from a first stem (431), a second set of branches (442) branching from a second stem (432), and a third set of branches (443) branching from a third stem (433). The first set of branches (441) may include ends (441a', 441b', 441c') defined by each of the branches (441a, 441b, 441c) included in the first set of branches (441). The second set of branches (442) may include end portions (442a', 442b', 442c', 442d', 442e') defined by each of the branches (442a, 442b, 442c, 442d, 442e) included in the second set of branches (442). The third set of branches (443) may include end portions (443a', 443b', 443c') defined by each of the branches (443a, 443b, 443c) included in the third set of branches (443).The number of second ends (420) of the second part (322) corresponds to the number of third ends (411) defined by each of the plurality of stem parts (430), and since the first ends (410) include additional ends (441a', 441b', 441c', 442a', 442b', 442c', 442d', 442e', 443a', 443b', 443c') provided by the plurality of branch parts (440) in addition to the third ends (411), the second part (322) includes the plurality of branch parts (440) and / or the additional ends (441a', 441b', 441c', 442a', 442b', The absorption rate of the liquid fluid in the second region (300b) can be increased through (442c', 442d', 442e', 443a', 443b', 443c').

[0114] For example, the first set of branches (441) may each extend from a side portion of the first stem portion (431) between the opposite ends (431a, 431b) of the first stem portion (431). The second set of branches (442) may each extend from a side portion of the second stem portion (432) between the opposite ends (432a, 432b) of the second stem portion (432). The third set of branches (443) may each extend from a side portion of the third stem portion (433) between the opposite ends (433a, 433b) of the third stem portion (433). The plurality of branches (440) can extend from the side of one or more stems (430), thereby reducing the length of each of the second channels (452) (or flow path(s)) for the gaseous fluid and increasing the absorption rate of the liquid fluid.

[0115] For example, the branches (441) of the first set may be arranged to face the branches (442a, 442b) of the second set of branches (442). Each of the ends (441a', 441b', 441c') defined by each of the branches (441) of the first set may be spaced apart from the ends (442a', 442b') defined by each of the branches (442a, 442b) for a channel (452b) between the first stem (431) and the second stem (432). For example, the branches (442c, 442d, 442e) of the branches (442) of the second set may be arranged to face the branches (443) of the third set. The ends (442c', 442d', 442e') defined by each of the branches (442c, 442d, 442e) may be spaced apart from the ends (443a', 443b', 443c') defined by each of the branches (443) of the third set for a channel (452c) between the second stem (432) and the third stem (433). The first ends (410) of the second portion (322) within the second region (300b) may be spaced apart from each other to provide second channels (452) for a gaseous fluid.

[0116] According to one embodiment, the second portion (322) of the wick structure (320) may have a leaf-vein fractal shape by the first ends (410) within the second region (300b). However, the above-described embodiment is exemplary, and the structure of the second portion (322) may include various structures in which the number of the first ends (410) within the second region (300b) for absorption of a liquid fluid is greater than the number of the second ends (420) connected to the first portion (321) within the first region (300a).

[0117] In one embodiment, the thickness of the second portion (322) may be greater than the thickness of the first portion (321). For example, the second portion (322) may extend from the base (311a) of the first plate (311) to the second plate (312), thereby contacting the base (311a) and the second plate (312). The thickness of the first portion (321) may correspond to, for example, the height of the side wall (311b) of the first plate (311), but is not limited thereto. For example, the first portion (321) may be spaced from the second plate (312) by contacting the first plate (311). The thickness of the first plate (311) may be, for example, less than the height of the side wall (311b) of the first plate (311).

[0118] For example, the first portion (321) may be attached to the first plate (311) so as to be spaced apart from the second plate (312) within the space (S) of the enclosure (310). The second portion (322) may be interposed between the first plate (311) and the second plate (312) so as to be attached to the first plate (311) and the second plate (312) within the space (S). The structure of the second portion (322) interposed between the first plate (311) and the second plate (312) may be referred to as a center-filled wick structure to improve the performance of the vapor chamber (300) by reducing the pressure drop of the fluid within the second region (300b) and the third region (300c), but is not limited thereto.

[0119] According to one embodiment, the first portion (321) of the wick structure (320) can fill the internal volume of the first region (300a) when the vapor chamber (300) is viewed from above. The second portion (322) of the wick structure (320) can include a first layer (322a) attached on the first plate (311) and a second layer (322b) overlapping the first layer (322a) and interposed between the first layer (322a) and the second plate (312) when the vapor chamber (300) is viewed from above (e.g., in the +z direction of FIG. 4b).

[0120] For example, the first portion (321) may cover the base (311a) of the first plate (311) within the first region (300a). The first portion (321) may increase the area for receiving heat from the electronic component (30) by covering the base (311a) within the first region (300a). The first portion (321) may be configured to be spaced apart from the second plate (312) to form a first channel (451) for a gaseous fluid formed between the first portion (321) and the second plate (312). The vapor chamber (300) may have improved performance through the first portion (321) covering the base (311a) within the first region (300a) and forming the first channel (451).

[0121] For example, the first layer (322a) of the second portion (322) may be a layer that is attached to the first plate (311) (or the base (311a) of the first plate (311)) together with the first portion (321). The second layer (322b) may be a layer that is attached to the first layer (322a) and thus comes into contact with the second plate (312). For example, the second layer (322b) may be interposed between the first layer (322a) and the second plate (312) and thus form second channels (452) (or flow path(s)) for the flow of a gaseous fluid in combination with the first layer (322a). For example, the shape of the second layer (322b) may have substantially the same shape as the first layer (322a), but is not limited thereto, to form one or more stem portions (430) of the second portion (322) together with the first layer (322a) or a portion thereof and a plurality of branches (440) branching from the one or more stem portions (430). For example, the second layer (322b) may have a different shape than the first layer (322a) within the second region (300b), thereby providing additional ends that are different from the ends of the first layer (322a).

[0122] According to one embodiment, the space (S) of the enclosure (310) may include a first channel (451) formed by a first portion (321) of a wick structure (320), and second channels (452) formed by a second portion (322) of the wick structure (320) and connected to the first channel (451). The first ends (410) of the second portions (322) may be spaced apart from each other to allow gaseous fluid to move through the second channels (452) to the first channel (451). For example, the space (S) defined by the enclosure (310) may include a plurality of channels (450) for movement of gaseous fluid formed by the enclosure (310) and the wick structure (320) disposed in the space (S). For example, the first channel (451) may be defined as a portion of a space (S) formed between the first portion (321) and the second plate (312) within the first region (300a). Fluid vaporized from the first portion (321) through heat emitted from the electronic component (30) may move to the first channel (451). For example, the second channels (452) may be defined as a portion of a space (S) formed between the second portion (322) and / or the second portion (322) and the enclosure (310). Each of the second channels (452) may be connected to or opened to the first channel (451). The fluid moved to the first channel (451) can move from the first region (300a) to the third region (300c) and the second region (300b) through the second channels (452) connected to the first channel (451).

[0123] For example, the second channels (452) may be defined by one or more stem portions (430) of the second portion (322). For example, the second channels (452) may include a channel (452a) formed between the enclosure (310) and the first stem portion (431), a channel (452b) formed between the first stem portion (431) and the second stem portion (432), a channel (452c) formed between the second stem portion (432) and the third stem portion (433), and a channel (452d) formed between the third stem portion (433) and the enclosure (310). Through each of the above channels (452a, 452b, 452c, 452d), the gaseous fluid within the first region (300a) can move to the second region (300b) through the third region (300c).

[0124] According to one embodiment, the width of each of the second channels (452) in the second region (300b) may be greater than the width of each of the second channels (452) in the third region (300c). For example, the second channels (452) formed by one or more stem portions (430) may have a structure of the vapor chamber (300) in which the internal volume (or width) of the third region (300c) is smaller than the internal volume (or width) of the second region (300b), so that the width of each of the second channels (452) in the third region (300c) may be smaller than the width of each of the second channels (452) in the second region (300b). The second channels (452) may have a relatively large width within the second region (300b), thereby providing additional space for a plurality of branches (440) branching from one or more of the stems (430) (or the first ends (410) of the second portion (322)).

[0125] In one embodiment, the second plate (312) may include a plurality of pillars (460) protruding toward the first plate (311) within the space (S) of the enclosure (310). For example, the plurality of pillars (460) may be configured to support the wick structure (320) and / or the first plate (311) within the enclosure (310), thereby reducing damage to the enclosure (310) due to external impact. In one embodiment, the enclosure (310) may be required to have a structure to reduce damage to the enclosure (310) that may be caused by solidification or freezing of a liquid fluid within the vapor chamber (300) in a gap between the plurality of pillars (460) and the first plate (311) and / or the wick structure (320). The structure of the enclosure (310) and / or the plurality of pillars (460) to reduce damage to the enclosure (310) will be described below through illustrations and descriptions in FIGS. 6a to 6c.

[0126] According to the above-described embodiment, the wick structure (320) of the vapor chamber (300) can improve the performance of the vapor chamber (300) by including a second portion (322) in which the number of first ends (410) disposed within the second region (300b) is greater than the number of second ends (420) connected to the first portions (321) within the first region (300a). The second portion (322) can increase the surface area of ​​the second portion (322) of the wick structure (320) for absorbing a liquid-state fluid within the second region (300b) by including a plurality of branches (440) branched from one or more stems (430) defining the second ends (420) within the second region (300b).

[0127] Figures 5a, 5b, and 5c illustrate portions of the wick structure of an exemplary vapor chamber.

[0128] Referring to FIGS. 5A, 5B, and 5C, an electronic device (e.g., the electronic device (101) of FIG. 1) may include an electronic component (e.g., the electronic component (30) of FIG. 3A) and a vapor chamber (e.g., the vapor chamber (300) of FIG. 3A). The vapor chamber (300) may include a housing (e.g., an enclosure (310) of FIG. 3A) defining a space for a fluid (e.g., the space (S) of FIG. 3B) on the electronic component (30) and a wick structure (e.g., the wick structure (320) of FIG. 4B) disposed within the space (S). The enclosure (310) may include a first region (e.g., a first region (300a) of FIG. 3A) that is at least partially disposed on the electronic component (30) to receive heat emitted from the electronic component (30), a second region (e.g., a second region (300b) of FIG. 3A) spaced apart from the first region (300a), and a third region (e.g., a third region (300c) of FIG. 3A) that connects the first region (300a) and the second region (300b) and has an internal volume smaller than that of the second region (300b). The wick structure (320) may include a first portion (e.g., the first portion (321) of FIG. 3b) disposed within the first region (300a) and a second portion (322) extending from the first portion (321) across the third region (300c) to the second region (300b). The number of first ends (e.g., the first ends (410) of FIG. 4b) of the second portion (322) disposed within the second region (300b) may be greater than the number of second ends (e.g., the second ends (420) of FIG. 4b) of the second portion (322) connected to the first portion (321) disposed within the first region (300a) so as to absorb the fluid within the second region (300b).For example, the second portion (322) may include one or more stem portions (430) extending from the first portion (321) across the third region (300c) to the second region (300b) thereby defining second ends (420), and a plurality of branches (440) branching from the one or more stem portions (430) within the second region (300b) thereby defining at least a portion of the first ends (410). That is, according to one embodiment, a plurality of pieces extending from the first portion (321) of the first region (300a) are divided into a greater number of pieces in the second region (300b) and terminated therein; wherein these pieces are collectively included in the second portion (322).

[0129] In the following, redundant descriptions of configurations having the same reference numerals as those described in FIGS. 4a and 4b are omitted.

[0130] Referring to FIG. 5A, the angles between one or more stem parts (430) and the plurality of branches (440) may each have a designated angle (a1). For example, the second portion (322) may include one or more stem parts (430) and first branches (510) branching from the one or more stem parts (430). The first branches (510) may each include a first branch part (511) extending from one side of the one or more stem parts (430) at an angle (a1) and a second branch part (512) extending from the other side of the one or more stem parts (430) opposite to the one side at the angle (a1). The above-mentioned embodiments are exemplary and are not limited thereto.

[0131] Referring to FIG. 5B, the angles between one or more stem portions (430) and at least some of the plurality of branches (440) may be different. For example, the second portion (322) may include one or more stem portions (430) and first branches (510) branching off from the one or more stem portions (430). The first branches (510) may include a first branch portion (511) extending from one side of the one or more stem portions (430) at an angle (a2) and a second branch portion (512) extending from the other side of the one or more stem portions (430) opposite to the one side at an angle (a3) ​​different from the angle (a2). The above-mentioned embodiments are exemplary and are not limited thereto. For example, at least some of the plurality of branch portions (440) extending from one or more stem portions (430) and the angle between the one or more stem portions (430), the length of each of the plurality of branch portions (440), and the shape of each of the plurality of branch portions (440) may be different from each other. The second portion (322) may increase the absorption rate of the liquid fluid within the second region (300b) by including a plurality of branch portions (440) extending from one or more stem portions (430) and each having a different shape.

[0132] Referring to FIG. 5C, the plurality of branches (440) may include first branches (510) extending from one or more stems (430), and second branches (520) extending from the first branches (510). For example, the second portion (322) may include one or more stems (430), and first branches (510) branching from the one or more stems (430). The first branches (510) may each include a first branch (511) extending from one side of the one or more stems (430), and a second branch (512) extending from the other side of the one or more stems (430) opposite the one side. The second portion (322) may include second branches (520) branching from each of the first branches (510). The second branches (520) may include a third branch (521) extending from the first branch (511) and a fourth branch (522) extending from the second branch (512). However, the embodiment is not limited thereto, and for example, the plurality of branches (440) may include branches branching from the second branches (520). The second portion (322) may increase the absorption rate of the liquid fluid in the second region (300b) by including other branches branching from each of the plurality of branches (440) branching from one or more stem portions (430).

[0133] According to the above-described embodiment, the wick structure (320) of the vapor chamber (300) can improve the performance of the vapor chamber (300) by including a second portion (322) in which the number of first ends (410) disposed within the second region (300b) is greater than the number of second ends (420) connected to the first portions (321) within the first region (300a). The second portion (322) can have an increased surface area for absorbing a liquid fluid within the second region (300b) by including a plurality of branches (440) branched from one or more stems (430) defining the second ends (420) within the second region (300b). The second part (322) can increase the absorption rate of the liquid fluid in the second region (300b) by including various shapes in the plurality of branches (440).

[0134] Figures 6a and 6b are partial cross-sectional views of an exemplary vapor chamber taken along line A-A' of Figure 4b. Figure 6c is a cross-sectional view of an exemplary vapor chamber taken along line B-B' of Figure 4b.

[0135] Referring to FIGS. 6A, 6B, and 6C, an electronic device (e.g., the electronic device (101) of FIG. 1) may include an electronic component (e.g., the electronic component (30) of FIG. 3A) and a vapor chamber (300). The vapor chamber (300) may include an enclosure (310) defining a space (S) for a fluid on the electronic component (30) and a wick structure (320) disposed within the space (S). The enclosure (310) may include a first region (e.g., a first region (300a) of FIG. 3A) that is at least partially disposed on the electronic component (30) to receive heat emitted from the electronic component (30), a second region (e.g., a second region (300b) of FIG. 3A) spaced apart from the first region (300a), and a third region (e.g., a third region (300c) of FIG. 3A) that connects the first region (300a) and the second region (300b) and has an internal volume smaller than that of the second region (300b). The wick structure (320) may include a first portion (e.g., the first portion (321) of FIG. 3b) disposed within the first region (300a) and a second portion (322) extending from the first portion (321) across the third region (300c) to the second region (300b). The enclosure (310) may include a first plate (311), and a second plate (312) that includes a plurality of posts (460) (which may be referred to as protrusions, irregular portions, indentations, extending portions, etc.) coupled to the first plate (311) to seal the space (S) and protruding toward the first plate (311) within the space (S).

[0136] According to one embodiment, the plurality of pillars (460) may include first pillars (461) each having a curvature to form first points (610) that contact a first portion (321) of a wick structure (320) within a first region (300a), and second pillars (462) each having a curvature to form second points (620) that contact the first plate (311). For example, the first pillars (461) may face the first portion (321) of the wick structure (320) within the first region (300a). The first pillars (461) may be disposed within a first channel (451) formed by the enclosure (310) and the first portion (321). The first pillars (461) may include points (611, 612, 613) configured to be in contact with the first portion (321) by each having a curved surface so as to come into point contact with the first portion (321). The first pillars (461) may be configured such that the area in contact with the first portion (321) is reduced or minimized (e.g., by providing a curved surface at the point of contact), thereby reducing the risk of the gaseous fluid in the first channel (451) freezing between the first portion (321) and the first pillars (461) and causing damage to the enclosure (310). For example, the second pillars (462) may face the base (311a) of the first plate (311) within the second region (300b) and the third region (300c). The second pillars (462) may be positioned within the second channels (452) formed by the enclosure (310) and the second portion (322). The second pillars (462) may include points (621, 622) configured to contact the base (311a) by each having a curved surface so as to come into point contact with the base (311a).The second pillars (462) are configured such that the area in contact with the base (311a) is reduced or minimized (e.g., by having a curved surface at the point of contact), thereby reducing damage to the enclosure (310) due to freezing of the gaseous fluid within the second channels (452) between the base (311a) and the second pillars (462). For example, compared to a case where pillars having flat surfaces are provided at the point of contact with the first portion (321) of the first plate (311) or the base (311a), by providing the first pillars (461) and the second pillars (462) having the aforementioned curved surfaces instead, damage (due to freezing) to the enclosure (310) can be reduced.

[0137] Referring to FIG. 6a, the length (h2) of each of the second columns (462) may be greater than the length (h1) of each of the first columns (461). For example, the plurality of columns (460) may extend from the second plate (312) toward the base (311a) (e.g., in the -z direction). Since a step structure is formed within the space (S) of the enclosure (310) by the first portion (321) within the first region (300a), the length (h2) of each of the second columns (462) may be greater than the length (h1) of the first columns (461) facing the first portion (321).

[0138] For example, referring to FIG. 6B, the length (h2) of each of the second columns (462) may correspond to the length (h1) of each of the first columns (461). The first plate (311) may include third columns (630) that protrude from the first plate (311) toward the second plate (312) so as to face each of the second columns (462). For example, each of the third columns (630) may be formed at a position of the first plate (311) corresponding to a position where each of the second columns (462) of the second plate (312) is formed. The length (h3) of each of the third columns (630) may correspond to the thickness of the first portion (321) configured to be in contact with the first columns (461) within the first region (300a). The above third columns (630) may have a curved surface at the point of contact with the corresponding second columns (462).

[0139] According to one embodiment, the vapor chamber (300) may include a hydrophobic substance (650) attached to the first plate (311) such that it is at least partially disposed between the second posts (462) and the first plate (311). For example, referring to FIG. 6C, the hydrophobic substance (650) may be disposed within the second channels (452) so as to face each of the plurality of posts (460). For example, the hydrophobic substance (650) may be applied to a portion of each of the plurality of posts (460) facing the first plate (311), and / or may be applied on a portion of the first plate (311) facing each of the plurality of posts (460). However, the above-described embodiment is exemplary, and although not illustrated, referring to FIGS. 6A and 6B together, the hydrophobic material (650) may be at least partially disposed between the first portion (321) and the plurality of pillars (460) within the first region (300a). The vapor chamber (300) may reduce fluid interposition between the plurality of pillars (460) and the first plate (311) by including the hydrophobic material (650) configured to face each of the plurality of pillars (460).

[0140] According to the above-described embodiment, the enclosure (310) of the vapor chamber (300) includes a plurality of pillars (460) configured to reduce or minimize the area of ​​contact between the first plate (311) and / or the first portion (321) of the wick structure (320) on the second plate (312), thereby reducing damage to the enclosure (310) by frozen gaseous fluid between the first plate (311) and the second pillars (462). The vapor chamber (300) can reduce damage to the enclosure (310) by frozen gaseous fluid between the first plate (311) and the second pillars (462) by including the third pillars (630) of the first plate (311) facing each of the plurality of pillars (460) and / or the hydrophobic material (650) facing each of the plurality of pillars (460).

[0141] According to the above-described embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a heat-generating component (e.g., processor (120) of FIG. 1, electronic component (30) of FIG. 3A), and a vapor chamber (e.g., vapor chamber (300) of FIG. 3A) disposed on the heat-generating component. The vapor chamber may include an enclosure (e.g., enclosure (310) of FIG. 3A), a fluid within the enclosure, and a wick structure (e.g., wick structure (320) of FIG. 3B) within the enclosure. The wick structure may include a first portion (e.g., first portion (321) of FIG. 3B) disposed at least partially on the heat-generating component. A state of the fluid positioned within the first portion may be changed from a liquid state to a gaseous state by heat transferred from the heat-generating component to the first portion. The fluid in the gaseous state can diffuse into the internal space of the enclosure (e.g., the space (S) of FIG. 3b). The wick structure may include a second portion (e.g., a second portion (322) disposed within the second region (300c) of FIG. 3b) configured to absorb the fluid in the liquid state changed from the gaseous state within the internal space of the enclosure. The wick structure may include a third portion (e.g., a second portion (322) disposed within the third region (300c) of FIG. 3b) disposed between the first portion and the second portion. The fluid in the liquid state absorbed by the second portion can move to the first portion through the third portion. A width of a portion of the interior space of the enclosure surrounding the third portion (e.g., w2 in FIG. 3A) may be smaller than a width of the interior space of the enclosure surrounding the second portion (e.g., w1 in FIG. 3A). The third portion may include one or more elongated stem portions extending from the first portion (e.g., one or more stem portions (430) arranged within the third region (300c) in FIG. 4B).The second portion may include one or more elongated stem portions extending from the one or more elongated stem portions of the third portion (e.g., one or more stem portions (430) arranged within the second region (300b) of FIG. 4b). The second portion may include a plurality of branches extending from the one or more elongated stem portions of the second portion (e.g., a plurality of branches (440) of FIG. 4b). The plurality of branches may be spaced apart from each other. The number of the plurality of branches of the second portion may be greater than the number of the one or more elongated stem portions of the third portion.

[0142] For example, a portion of the interior space of the enclosure surrounding the first portion may be offset relative to a portion of the interior space of the enclosure surrounding the second portion.

[0143] For example, the angles between the one or more elongated stem portions of the second portion and at least some of the plurality of branch portions connected to the one or more elongated stem portions of the second portion may be different from each other.

[0144] For example, the plurality of branches may include first branches extending from the one or more elongated stem portions of the second portion, and second branches extending from the first branches.

[0145] For example, the enclosure may include a first section (e.g., a first region (300a) of FIG. 3A) surrounding the first portion of the wick structure and positioned above the heat-generating component to vaporize the fluid by receiving heat emitted from the heat-generating component. The enclosure may include a second section (e.g., a second region (300b) of FIG. 3A) surrounding the second portion of the wick structure and spaced apart from the first section to condense the fluid. The enclosure may include a third section (e.g., a third region (300c) of FIG. 3A) surrounding the third portion of the wick structure by connecting the first and second sections and having an internal volume smaller than the first and second sections. The number of said plurality of branches of said second portion surrounded by said second section may be greater than the number of said one or more elongated stems of said third portion surrounded by said third section, in order to increase absorption of said fluid in a liquid state.

[0146] For example, the internal space may include a first channel formed by the first portion (e.g., the first channel (451) of FIG. 4B). The internal space may include second channels formed by the second portion and the third portion and connected to the first channel to move the fluid in a gaseous state from the first section across the third section to the second section (e.g., the second channels (452) of FIG. 4B). The plurality of branches of the second portion may be spaced apart from each other to move the fluid in a gaseous state to the first channel through the second channels.

[0147] For example, the width of each of the second channels within the second section may be greater than the width of each of the second channels within the third section.

[0148] For example, the thickness of the second portion and the thickness of the third portion may be greater than the thickness of the first portion.

[0149] For example, the enclosure may include a first plate (e.g., the first plate (311) of FIG. 3B) and a second plate (e.g., the second plate (312) of FIG. 3A) coupled to the first plate to seal the interior space. The first portion may be attached to the first plate within the interior space and spaced apart from the second plate. The second portion and the third portion may be interposed between the first plate and the second plate within the interior space.

[0150] For example, the wick structure may further include a first layer defined by the second portion and the third portion and attached to the first plate. The wick structure may further include a second layer defined by the second portion and the third portion and interposed between the first layer and the second plate so as to overlap the first layer when the vapor chamber is viewed from above.

[0151] For example, the second portion may have a leaf-vein fractal shape by the plurality of branches.

[0152] For example, the enclosure may further include a first plate, and a second plate coupled to the first plate to seal the interior space and including a plurality of posts (e.g., a plurality of posts (460) of FIG. 4A) protruding toward the first plate within the interior space. The plurality of posts may include first posts (e.g., first posts (461) of FIG. 6A) each having a curvature to form first points of contact with the first portion of the wick structure. The plurality of posts may include second posts (e.g., second posts (462) of FIG. 6A) each having a curvature to form second points of contact with the first plate.

[0153] For example, the length of each of the second columns (e.g., h2 in FIG. 6a) may be greater than the length of each of the first columns (e.g., h1 in FIG. 6a).

[0154] For example, the length of each of the first columns may correspond to the length of each of the second columns. The first plate may include third columns (e.g., third columns (640) of FIG. 6B) that protrude from the first plate toward the second plate so as to face each of the second columns.

[0155] For example, the vapor chamber may further include a hydrophobic substance (e.g., hydrophobic substance (650) of FIG. 6c) attached to the first plate so as to be at least partially disposed between the second pillars and the first plate.

[0156] In one embodiment, an electronic device may include a heat-generating component and a vapor chamber. The vapor chamber may include an enclosure defining an internal space disposed above the heat-generating component and including a first plate and a second plate coupled to the first plate to seal the internal space. The vapor chamber may include a fluid within the internal space for cooling the heat-generating component, and a wick structure within the internal space. The internal space may include a first space disposed at least partially above the heat-generating component to vaporize the fluid by receiving heat emitted from the heat-generating component. The internal space may include a second space spaced apart from the first space to condense the fluid. The internal space may include a third space connecting the first space and the second space and having a smaller width than the second space. The wick structure may include a first portion (e.g., the first portion (321) of FIG. 3B) disposed within the first space, where the fluid within the first space changes from a liquid state to a gaseous state. The wick structure may include one or more stem portions (e.g., one or more stem portions (430) of FIG. 4B) extending from the first portion across the third space to the second space, and a second portion (e.g., the second portion (322) of FIG. 3B) including a plurality of branches (e.g., a plurality of branches (440) of FIG. 4B) branching from the one or more stem portions to increase absorption of the condensed liquid fluid within the second space. The first portion may be attached to the first plate within the internal space and spaced apart from the second plate. The second portion may be interposed between the first plate and the second plate within the internal space.

[0157] For example, the plurality of branches may include first branches extending from the one or more stems, and second branches extending from the first branches.

[0158] For example, the first portion may fill the first space when the vapor chamber is viewed from above. The second portion may include a first layer attached to the first plate. The second portion may include a second layer overlapping the first layer and interposed between the first layer and the second plate when the vapor chamber is viewed from above.

[0159] For example, the second plate may include a plurality of columns, each of which has a curvature to form first points of contact with the first portion within the space, and each of which has a curvature to form second points of contact with the first plate. The length of each of the second columns may be greater than the length of each of the first columns.

[0160] For example, the second portion may have a leaf vein fracture shape by the plurality of branches.

[0161] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include an electronic component (e.g., processor (120) of FIG. 1, electronic component (30) of FIG. 3A), and a vapor chamber (e.g., vapor chamber (300) of FIG. 3A) including an enclosure (e.g., enclosure (310) of FIG. 3A) defining a space for fluid on the electronic component (e.g., space (S) of FIG. 3B) and a wick structure (e.g., wick structure (320) of FIG. 3B) disposed within the space. The enclosure may include a first region (e.g., a first region (300a) of FIG. 3A) at least partially disposed over the electronic component to transfer heat emitted from the electronic component, a second region (e.g., a second region (300b) of FIG. 3A) spaced apart from the first region, and a third region (e.g., a third region (300c) of FIG. 3A) connecting the first region and the second region and having an internal volume smaller than that of the second region. The wick structure may include a first portion (e.g., a first portion (321) of FIG. 3B) disposed within the first region and a second portion (e.g., a second portion (322) of FIG. 3B) extending from the first portion across the third region to the second region. The number of first ends of the second portion (e.g., first ends (410) of FIG. 4b) disposed within the second region may be greater than the number of second ends of the second portion (e.g., second ends (420) of FIG. 4b) connected to the first portion disposed within the first region to absorb the fluid within the second region.

[0162] For example, the second portion may include one or more stem portions (e.g., one or more stem portions (430) of FIG. 4B) extending from the first portion across the third region to the second region, thereby defining the second ends. The second portion may include a plurality of branches (e.g., a plurality of branches (440) of FIG. 4B) branching from the one or more stem portions within the second region, thereby defining at least some of the first ends.

[0163] For example, the first ends may include third ends defined by the one or more stem parts (e.g., third ends (411) of FIG. 4B), and fourth ends defined by the plurality of branches (e.g., fourth ends (412) of FIG. 4B). The plurality of branches may each extend from portions connecting the second ends and the third ends of the one or more stem parts.

[0164] For example, the angle between the one or more stem portions and at least some of the plurality of branch portions may be different.

[0165] For example, the plurality of branches may include first branches extending from the one or more stems (e.g., first branches (510) of FIG. 5c), and second branches extending from the first branches (e.g., second branches (520) of FIG. 5c).

[0166] For example, the space may include a first channel formed by the first portion (e.g., the first channel (451) of FIG. 4B), and second channels formed by the second portion and connected to the first channel (e.g., the second channels (452) of FIG. 4B). The first ends may be spaced apart from each other to allow the fluid in a gaseous state to move to the first channel through the second channels.

[0167] For example, the width of each of the second channels within the second region may be greater than the width of each of the second channels within the third region.

[0168] For example, the thickness of the second portion may be smaller than the thickness of the first portion.

[0169] For example, the enclosure may further include a first plate (e.g., the first plate (311) of FIG. 3B) and a second plate (e.g., the second plate (312) of FIG. 3A) coupled to the first plate to seal the space. The first portion may be attached to the first plate so as to be spaced apart from the second plate within the space. The second portion may be interposed between the first plate and the second plate so as to be attached to the first plate and the second plate within the space.

[0170] For example, the first portion may fill the internal volume of the first region when the vapor chamber is viewed from above. The second portion may include a first layer attached to the first plate, and a second layer overlapping the first layer and interposed between the first layer and the second plate when the vapor chamber is viewed from above.

[0171] For example, the second portion may have a leaf-vein fractal shape by the first ends within the second region.

[0172] For example, the enclosure may further include a first plate, and a second plate coupled to the first plate to seal the space and including a plurality of posts (e.g., a plurality of posts (460) of FIG. 4A) protruding toward the first plate within the space. The plurality of posts may include first posts (e.g., first posts (461) of FIG. 6A) each having a curvature to form first points of contact with the first portion of the wick structure within the first region. The plurality of posts may include second posts (e.g., second posts (462) of FIG. 6A) each having a curvature to form second points of contact with the first plate.

[0173] For example, the length of each of the second columns (e.g., length (h2) in FIG. 6a) may be greater than the length of each of the first columns (e.g., length (h1) in FIG. 6a).

[0174] For example, the length of each of the first columns may correspond to the length of each of the second columns. The first plate may include third columns (e.g., third columns (640) of FIG. 6B) that protrude from the first plate toward the second plate so as to face each of the second columns.

[0175] For example, the vapor chamber may further include a hydrophobic substance (e.g., hydrophobic substance (650) of FIG. 6c) attached to the first plate so as to be at least partially disposed between the second pillars and the first plate.

[0176] In one embodiment, an electronic device may include an electronic component. The electronic device may include a vapor chamber including a first plate, a second plate coupled to the first plate, and an enclosure including a space for fluid on the electronic component between the first plate and the second plate, and a wick structure disposed within the space. The enclosure may define a first region at least partially disposed above the electronic component to receive heat emitted from the electronic component, a second region spaced apart from the first region, and a third region connecting the first region and the second region and having an internal volume smaller than that of the second region. The wick structure may include a first portion disposed within the first region, one or more stem portions extending from the first portion across the third region to the second region, and a second portion including a plurality of branches each branching from the one or more stem portions within the second region. The first portion may be spaced apart from the second plate by being attached to the first plate within the space. The second portion may be interposed between the first plate and the second plate so as to be attached to the first plate and the second plate within the space.

[0177] For example, the plurality of branches may include first branches extending from the one or more stems, and second branches extending from the first branches.

[0178] For example, the first portion may fill the internal volume of the first region when the vapor chamber is viewed from above. The second portion may include a first layer attached to the first plate, and a second layer overlapping the first layer and interposed between the first layer and the second plate when the vapor chamber is viewed from above.

[0179] For example, the second plate may include a plurality of columns, each of which has a curvature to form first points of contact with the first portion within the space, and each of which has a curvature to form second points of contact with the first plate. The length of each of the second columns may be greater than the length of each of the first columns.

[0180] For example, the second portion may have a leaf vein fracture shape by the branches within the second region.

[0181] It will be appreciated that various other examples of the present disclosure provide wick structures designed separately from the electronic devices, heat generating components, enclosures, and fluids described above. For example, a wick structure for a vapor chamber may be provided, the wick structure comprising: a first portion, wherein a state of a fluid located within the first portion is changed from a liquid state to a gaseous state by heat transferred from an external source to the first portion, wherein the gaseous fluid diffuses into a space surrounding the first portion; a first portion configured to absorb the liquid fluid, wherein the gaseous fluid diffuses from a space surrounding the first portion to a space surrounding the second portion, wherein the gaseous fluid changes into a liquid state in the space surrounding the second portion; and a third portion disposed between the first portion and the second portion, wherein the liquid fluid absorbed by the second portion moves into the first portion through the third portion. Wherein the third portion comprises one or more first stem portions extending from the first portion, and wherein the second portion comprises: one or more second stem portions each extending from one of the one or more first stem portions, and a plurality of branch portions each extending from one of the one or more second stem portions, wherein the plurality of branch portions are spaced apart from one another, and the number of the plurality of branch portions is greater than the number of the one or more first stem portions. For example, a cross-sectional width of a space surrounding the third portion may be smaller than a cross-sectional width of a space surrounding the second portion. In another example, it will be appreciated that such a wick structure may be modified to include any of the additional features or details described above. For example, the plurality of branch portions may comprise: first branch portions extending from the one or more second stem portions; and second branch portions extending from the first branch portions.

[0182] The present disclosure also includes the following numbered examples:

[0183] According to a first example, an electronic device is provided, comprising: a heat generating component; and a vapor chamber comprising: an enclosure; a fluid within the enclosure; and a wick structure within the enclosure, the wick structure comprising: a first portion, wherein a state of the fluid positioned within the first portion is changed from a liquid state to a gaseous state by heat from the heat generating component, wherein the gaseous fluid diffuses from the first portion into an internal space of the enclosure; a second portion configured to absorb the liquid fluid, wherein the state of the gaseous fluid is changed into a liquid state within the internal space of the enclosure; And a third part disposed between the first part and the second part and configured to transfer the liquid-state fluid absorbed by the second part to the first part, wherein a width of a portion of the interior space surrounding the third part is smaller than a width of a portion of the interior space of the enclosure surrounding the second part, wherein the third part includes one or more first stem portions extending from the first part, and wherein the second part includes: one or more second stem portions each extending from one of the one or more first stem portions, and a plurality of branch portions each extending from one of the one or more second stem portions, the plurality of branch portions being spaced apart from each other, and the number of the plurality of branch portions being greater than the number of the one or more first stem portions.

[0184] According to a second example, an electronic device according to the first example is provided, wherein a portion of the interior space of the enclosure surrounding the first portion is offset with respect to a portion of the interior space of the enclosure surrounding the second portion.

[0185] According to a third example, an electronic device according to the first example is provided, wherein each of at least two of the plurality of branches is configured to extend at different angles with respect to at least two other branches of the plurality of branches.

[0186] According to a fourth example, an electronic device according to any one of the first to third examples is provided, wherein the plurality of branches include: one or more first branches extending from the one or more second stems; and one or more second branches extending from the one or more first branches.

[0187] According to a fifth example, an electronic device according to any one of the first to fourth examples is provided, wherein the enclosure comprises: a first section disposed above the heat-generating component and surrounding the first portion of the wick structure and configured to receive the gaseous fluid vaporized by heat emitted from the heat-generating component; a second section spaced apart from the first section and surrounding the second portion of the wick structure and configured to condense the gaseous fluid; and a third section connecting the first section and the second section to surround the third portion of the wick structure and having a smaller volume than the first section or the second section.

[0188] According to a sixth example, the internal space of the enclosure includes: a first channel formed by the first portion; and second channels formed by the second portion and the third portion, connected to the first channel, and through which the gaseous fluid moves from the first section across the third section to the second section, wherein the second channels are spaced apart from each other according to the plurality of branch portions, wherein the electronic device according to the fifth example is provided.

[0189] According to a seventh example, an electronic device according to the sixth example is provided, wherein the width of each of the second channels within the second section is smaller than the width of each of the second channels within the third section.

[0190] According to an eighth example, an electronic device according to any one of the first to seventh examples is provided, wherein the thickness of the second portion and the thickness of the third portion are greater than the thickness of the first portion.

[0191] According to a ninth example, an electronic device according to any one of the first to eighth examples is provided, wherein the enclosure comprises: a first plate; and a second plate coupled to the first plate to seal the interior space, wherein the first portion is attached to the first plate and spaced apart from the second plate within the interior space, and wherein the second portion and the third portion are interposed between the first plate and the second plate within the interior space.

[0192] According to a tenth example, an electronic device according to the ninth example is provided, wherein the wick structure further comprises: a first layer defined by the second portion and the third portion, the first layer attached on the first plate; and a second layer defined by the second portion and the third portion, the second layer interposed between the first layer and the second plate so as to overlap the first layer when the vapor chamber is viewed from above.

[0193] According to an eleventh example, an electronic device according to any one of the first to tenth examples is provided, wherein the plurality of branches form a vein fracture shape within the second portion.

[0194] According to a twelfth example, the enclosure further comprises: a first plate; and a second plate comprising a plurality of posts joined to the first plate and protruding toward the first plate within the interior space to seal the interior space, the plurality of posts each having a curvature to form first points contacting the first portion of the wick structure; and one or more second posts each having a curvature to form second points contacting the first plate, wherein an electronic device according to any one of the first to eleventh examples is provided.

[0195] According to a thirteenth example, an electronic device according to the twelfth example is provided, wherein each of the lengths of the one or more second columns is longer than each of the lengths of the one or more first columns.

[0196] According to a fourteenth example, an electronic device according to the twelfth example is provided, wherein each of the one or more first posts has a length equal to a length of each of the one or more second posts, and wherein the first plate includes third posts each protruding from the first plate toward the second plate and facing a corresponding one of the one or more second posts.

[0197] According to a fifteenth example, an electronic device according to any one of the twelfth to fourteenth examples is provided, wherein the vapor chamber further includes a hydrophobic material provided on the first plate so as to be at least partially disposed between the second pillars and the first plate. The electronic device according to various embodiments disclosed in the present document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, an electronic device, or a home appliance device. The electronic device according to the embodiments of the present document is not limited to the above-described devices.

[0198] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled," "connected," or "attached" to another component (e.g., a second) with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., by wire), wirelessly, or via a third component (e.g., by an indirect coupling or attachment).

[0199] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0200] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0201] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0202] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), Heating component (30); and It includes a vapor chamber (300), and the vapor chamber (300) enclosure (310); Fluid within the enclosure (310); and A wick structure (320) is included within the enclosure (310), and the wick structure (320) comprises: The first part (321) includes a state of the fluid located within the first part (321), and the state of the fluid is changed from a liquid state to a gaseous state by heat emitted from the heat generating component (30), and the fluid in the gaseous state is diffused from the first part (321) into the internal space (S) of the enclosure (310); A second part (322) configured to absorb the fluid in the liquid state changed from the gaseous state, the state of the fluid in the gaseous state being changed into the liquid state within the internal space (S) of the enclosure (310); and A third part (323) is disposed between the first part (321) and the second part (322), and is configured to move the liquid-state fluid absorbed by the second part (322) to the first part (321). The width of a part of the internal space (S) of the enclosure (310) surrounding the third part (323) is smaller than the width of a part of the internal space (S) of the enclosure (310) surrounding the second part, The above third part (323) is, comprising one or more first stem portions extending from the first portion (321); The above second part (322) is, one or more second stem portions extending from said one or more first stem portions; and It comprises a plurality of branches (440) extending from the one or more second stems, and the plurality of branches (440) are spaced apart from each other, The number of the above plurality of branches (440) is greater than the number of the one or more first stems. Electronic device (101).

2. In paragraph 1, A part of the inner space (S) of the enclosure (310) surrounding the first part (321) is offset with respect to a part of the inner space (S) of the enclosure (310) surrounding the second part. Electronic device (101).

3. In paragraph 1 or 2, At least two of the above plurality of branches (440) are configured to extend at different angles with respect to at least two other branches of the above plurality of branches (440). Electronic device (101).

4. In any one of paragraphs 1 to 3, The above multiple branches (440) are, First branches (510) extending from the one or more second stems; and Including second branches (520) extending from the first branches (510), Electronic device (101).

5. In any one of paragraphs 1 to 4, The above enclosure (310) is A first section (300a) surrounding the first part (321) of the wick structure (320) and positioned above the heat generating component (30) to vaporize the fluid by receiving heat emitted from the heat generating component (30); A second section (300b) surrounding the second part of the wick structure (320) and spaced apart from the first section (300a) to condense the fluid; and A third section (300c) surrounding the third part of the wick structure (320) by connecting the first section (300a) and the second section (300b) and having an internal volume smaller than that of the first section (300a) and the second section (300b), The number of the plurality of branches (440) of the second part surrounded by the second section (300b) is greater than the number of the one or more elongated stems of the third part surrounded by the third section (300c) in order to increase the absorption of the fluid in the liquid state. Electronic device (101).

6. In paragraph 5, The above internal space (S) is A first channel (451) formed by the first part (321); and It is formed by the second part and the third part, and includes second channels (452) connected to the first channel (451) to move the fluid in the gaseous state from the first section (300a) across the third section (300c) to the second section (300b), The above plurality of branches (440) of the above second part, In order to move the fluid in the gaseous state through the second channels (452) to the first channel (451), which are spaced apart from each other, Electronic device (101).

7. In paragraph 6, The width of each of the second channels (452) within the second section (300b) is Larger than the width of each of the second channels (452) within the third section (300c), Electronic device (101).

8. In any one of paragraphs 1 to 7, The thickness of the second part and the thickness of the third part are, Greater than the thickness of the above first part (321), Electronic device (101).

9. In any one of paragraphs 1 to 8, The above enclosure (310) is first plate (311); and A second plate (312) is included that is joined to the first plate (311) to seal the internal space (S), The first part (321) is attached to the first plate (311) within the internal space (S) and is spaced apart from the second plate (312). The second part and the third part are interposed between the first plate (311) and the second plate (312) within the internal space (S). Electronic device (101).

10. In paragraph 9, The above wick structure (320) is A first layer (322a) defined by the second part and the third part and attached on the first plate (311); and A second layer (322b) defined by the second part and the third part, and interposed between the first layer (322a) and the second plate (312), thereby overlapping the first layer (322a) when looking at the vapor chamber (300) from above, Electronic device (101).

11. In any one of paragraphs 1 to 10, The second part above is, Having a leaf-vein fractal shape by the above multiple branches (440), Electronic device (101).

12. In any one of paragraphs 1 to 11, The above enclosure (310) is first plate (311); and Further comprising a second plate (312) coupled to the first plate (311) to seal the internal space (S) and including a plurality of pillars (460) protruding toward the first plate (311) within the internal space (S), The above plurality of pillars (460) are, First columns (461) each having a curvature to form first points (610) that come into contact with the first part (321) of the wick structure (320); and Including second pillars (462) each having a curvature to form second points (620) that come into contact with the first plate (311). Electronic device (101).

13. In paragraph 12, The length (h2) of each of the above second pillars (462) is Greater than the length (h1) of each of the above first pillars (461), Electronic device (101).

14. In paragraph 12, The length (h1) of each of the above first pillars (461) is Corresponding to the length (h2) of each of the above second pillars (462), The above first plate (311) is Including third pillars (630) protruding from the first plate (311) toward the second plate (312) so as to face each of the second pillars (462). Electronic device (101).

15. In any one of paragraphs 12 to 14, The above vapor chamber (300) is Further comprising a hydrophobic substance (650) attached to the first plate (311) so as to be at least partially disposed between the second pillars (462) and the first plate (311). Electronic device (101).

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