Electronic device

Abstract

This electronic device comprises: a display panel including pads arranged along a first direction; and a circuit board facing the display panel in a second direction intersecting the first direction and including a wiring board electrically connected to the pads and an electronic component mounted on the wiring board. The wiring board includes: a body part which has a first thickness and on which the electronic component is mounted; and a protrusion part having a second thickness smaller than the first thickness, protruding from the body part toward the display panel to at least partially overlap the display panel on a plane, and providing a terminal part connected to the pads, wherein at least one notch is defined on a side of the wiring board facing the display panel.

Description

electronic devices

[0001] The present invention relates to electronic devices, and more particularly, to electronic devices with reduced bezels.

[0002] Electronic devices display images or detect external input. These devices can be controlled through electrical signals. Consequently, they inevitably include circuit boards with various electronic components mounted on them. As electronic devices evolve to display high-resolution images or incorporate diverse functions, the complexity of the various electronic components and signal wiring increases, leading to increased costs associated with circuit boards. Furthermore, if the circuit board size increases or is assembled with a warped shape, the thickness of the electronic device can increase.

[0003] Accordingly, the present invention aims to provide an electronic device with a reduced bezel and thickness and reduced process cost.

[0004] An electronic device according to one embodiment of the present invention includes a display panel including pads arranged along a first direction, and a circuit board including a wiring board facing the display panel in a second direction intersecting the first direction and electrically connected to the pads and an electronic component mounted on the wiring board, wherein the wiring board includes a body portion having a first thickness and on which the electronic component is mounted, and a protrusion portion having a second thickness smaller than the first thickness and protruding from the body portion toward the display panel so that at least a portion overlaps the display panel in a plane and provides a terminal portion connected to the pads, and at least one notch is defined on a side of the wiring board facing the display panel.

[0005] The above notch may be defined in an area adjacent to the protrusion among the side of the body portion facing the display panel.

[0006] The above notch may be defined on a side of the above protrusion facing the display panel.

[0007] The protrusions may be provided in plurality along the first direction, and the notch may be defined between the protrusions on a side of the body portion facing the display panel.

[0008] The body portion includes two insulating cover layers, at least one first insulating layer disposed between the two cover layers, at least one second insulating layer disposed between the two cover layers and being more flexible than the first insulating layer, at least one conductive wiring layer disposed between the two cover layers, and a via layer penetrating at least one of the first insulating layer and the second insulating layer and electrically connecting the at least one wiring layer to the electronic component and the terminal portion, and the protrusion may be formed by removing at least a portion of a component of the body portion.

[0009] The protrusion comprises a single wiring layer, and the single wiring layer can extend from any one of the wiring layers of the body portion.

[0010] The above first insulating layer may include a film.

[0011] The second insulating layer may include a prepreg.

[0012] The protrusion further includes a stepped portion having a thickness smaller than the first thickness and different from the second thickness, and the stepped portion can be arranged between the body portion and the portion having the first thickness in the second direction.

[0013] The above-mentioned step portion may have an integral shape with the portion having the first thickness.

[0014] The circuit board further includes a dummy terminal portion arranged on the protrusion and electrically insulated from the terminal portion, and the dummy terminal portion may be arranged to be adjacent to the outside of the protrusion portion more than the terminal portion in the first direction.

[0015] The above dummy terminal portion may have a shape inclined with respect to the first direction and the second direction on a plane.

[0016] An electronic device according to one embodiment of the present invention further includes a case that accommodates the circuit board, and the accommodation space can be provided in the second direction with respect to the display panel.

[0017] An electronic device according to one embodiment of the present invention includes a display panel including pads arranged along a first direction, a wiring board facing the display panel in a second direction intersecting the first direction and including terminal portions connected to the pads, and a circuit board including an electronic component mounted on the wiring board, wherein the wiring board includes a plurality of wiring layers, at least one of the wiring layers includes a body portion connected to the electronic component, and a protrusion portion having an integral shape with the body portion and including a single wiring layer extending from one of the wiring layers, and a first notch recessed in a direction away from the display panel is defined between the body portion and the protrusion portion on a side of the wiring board facing the display panel.

[0018] The protrusion includes a first portion having a first thickness, and a second portion having a thickness greater than that of the first portion and positioned between the first portion and the body portion in a second direction, wherein the first portion may have an integral shape with at least a portion of the second portion.

[0019] The length of the second portion in the second direction may correspond to the sunken depth of the first notch.

[0020] The circuit board further includes a dummy terminal portion disposed on the protrusion and electrically insulated from the terminal portion, wherein the dummy terminal portion can be disposed between the first notch and the terminal portion in the first direction.

[0021] The terminal portion may extend in an inclined direction with respect to the first direction and the second direction.

[0022] The circuit board may further include a second notch defined on a side of the protrusion facing the display panel.

[0023] The protrusions may be provided in a plurality spaced apart along the first direction, and may further include a third notch defined in the body portion and arranged between the plurality of protrusions.

[0024] According to the present invention, the problem of poor electrical connection due to deformation of the circuit board that may occur during the bonding process can be improved.

[0025] Additionally, according to the present invention, process costs can be reduced.

[0026] Additionally, according to the present invention, an electronic device with a reduced bezel and reduced thickness can be provided.

[0027] Figure 1a is a perspective view of a combined display device according to one embodiment of the present invention.

[0028] Figure 1b is an exploded perspective view of a display device according to one embodiment of the present invention.

[0029] FIG. 2a is a plan view of a display module according to one embodiment of the present invention.

[0030] Figure 2b is an exploded plan view of the display module.

[0031] Figure 3 is a cross-sectional view of an electronic device according to one embodiment of the present invention.

[0032] FIG. 4 is a cross-sectional view of an electronic device according to one embodiment of the present invention and an electronic device according to a comparative embodiment.

[0033] Figure 5 is a plan view of a circuit board according to one embodiment of the present invention.

[0034] Figures 6a to 6c are cross-sectional views of a circuit board according to one embodiment of the present invention.

[0035] FIGS. 7A to 7C are cross-sectional views of a circuit board according to one embodiment of the present invention.

[0036] FIGS. 8A and 8B are cross-sectional views of a circuit board according to one embodiment of the present invention.

[0037] FIGS. 9A and 9B are cross-sectional views of display modules according to one embodiment of the present invention.

[0038] Figures 10a to 10d are plan views illustrating a portion of a circuit board.

[0039] FIGS. 11A and 11B are plan views illustrating a portion of a display module according to one embodiment of the present invention.

[0040] In this specification, when it is said that a component (or region, layer, portion, etc.) is “on,” “connected to,” or “coupled to” another component, it means that it can be directly disposed / connected / coupled to the other component, or a third component may be disposed between them.

[0041] Identical drawing numbers indicate identical components. Furthermore, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the purpose of effectively illustrating the technical content.

[0042] “And / or” includes any combination of one or more of the associated constructs that can be defined.

[0043] While terms such as "first" and "second" may be used to describe various components, these components should not be limited by these terms. These terms are used solely to distinguish one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a "second component," and similarly, a second component may also be referred to as a "first component." Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0044] Additionally, terms such as "below," "lower," "above," and "upper" are used to describe the relationships between components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technical context, and may be explicitly defined herein, unless interpreted in an idealized or overly formal sense.

[0046] Terms such as "include" or "have" should be understood to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0047] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0048] FIG. 1A is a perspective view of a display device according to one embodiment of the present invention, and FIG. 1B is an exploded perspective view of the display device according to one embodiment of the present invention. Hereinafter, the present invention will be described with reference to FIGS. 1A and 1B.

[0049] An electronic device (1000) provides a user with an image (IM). The IM may include both dynamic images and still images, such as images. The electronic device (1000) may include at least one display surface on which the IM is displayed. The user can obtain information or operate the electronic device (1000) through the IM.

[0050] An electronic device (1000) may include a display module (10), an upper cover (HS1), and a lower cover (HS2). The display module (10) may include a display panel (100) and a circuit board (200) that are electrically connected to each other.

[0051] The display panel (100) provides a front surface (100-IS), and the front surface (100-IS) may include a display area (DA) and a peripheral area (NDA). The display area (DA) may be a substantial area where an image (IM) is displayed, and the peripheral area (NDA) may be an area where the image (IM) is not displayed. The peripheral area (NDA) may be an area adjacent to the display area (DA). In the present embodiment, the peripheral area (NDA) is illustrated as a frame shape surrounding the edge of the display area (DA), but the planar shape of the peripheral area (NDA) is not limited thereto.

[0052] An upper cover (HS1) is disposed on the upper side of the display panel (100) to protect the display panel (100). The upper cover (HS1) provides an opening (OP) that exposes at least a portion of the display surface (100-IS). The opening (OP) can be formed to have a size corresponding at least to the display area (DA). The opening (OP) overlaps the display area (DA), and an image (IM) displayed in the display area (DA) can be viewed from the outside through the opening (OP).

[0053] The lower cover (HS2) is disposed on the lower side of the display panel (100) to protect the display panel (100). The lower cover (HS2) provides a receiving space (SP), and the display panel (100) can be received in the receiving space (SP). The lower cover (HS2) can be combined with the upper cover (HS1) to form the exterior of the electronic device (1000). However, this is merely an example, and the electronic device (1000) may further include a power supply such as a battery, other electronic components, or an additional protective member covering the upper cover (HS1) and the lower cover (HS2), and is not limited to any one embodiment.

[0054] Meanwhile, in the present embodiment, the circuit board (200) can be accommodated in the internal space (SP) in an unfolded state. That is, the display panel (100) and the circuit board (200) can each be assembled in a state parallel to a plane defined by the first direction (DR1) and the second direction (DR2). Except for the portion of the circuit board (200) connected to the display panel (100), the remaining portion is assembled in a state of not overlapping with the display panel (100) in a plane. Accordingly, the upper cover (HS1) may cover not only the peripheral area (NDA) of the display panel (100), but also the entire circuit board (200).

[0055] According to the present invention, the circuit board (200) may not be provided with a separate folding area for folding. Accordingly, a separate flexible film, etc. connecting the circuit board (200) and the display panel (100) for folding may be omitted, thereby reducing costs and simplifying the assembly process.

[0056] FIG. 2a is a plan view of a display module according to one embodiment of the present invention. FIG. 2b is an exploded plan view of the display module. The present invention will be described with reference to FIGS. 2a and 2b.

[0057] As illustrated in FIGS. 2a and 2b, the display module (10) may be formed by physically and electrically connecting a display panel (100), a circuit board (200), and a connecting member (CM).

[0058] The display panel (100) may include a plurality of pixels (PX). Each pixel (PX) may display light. The lights displayed by the pixels (PX) constitute the image (IM) described above.

[0059] The display panel (100) may be divided into a display area (DA), a peripheral area (NDA), and a pad area (PA) on a plane. As described above, the display area (DA) may be an area where an image is displayed. A plurality of pixels (PX) that implement an image may be arranged in the display area (DA). Specifically, configurations that generate or display light among the pixels (PX) may be arranged in the display area (DA). The pixels (PX) may be arranged in a matrix shape along a second direction (DR2) and a first direction (DR1). The display panel (100) displays various images by controlling the pixels (PX).

[0060] Each pixel (PX) may include a display element and a driving element. The display element may include various embodiments. For example, the display element may be at least one of a liquid crystal capacitor, an organic light-emitting element, an electrophoretic element, and an electrowetting element. However, this is described as an example, and the display element may include various embodiments as long as it can implement an image according to an electrical signal and is not limited to any one embodiment. The driving element controls the driving of each display element of each pixel (PX). The driving element may include a thin film transistor. The display panel (100) according to an embodiment of the present invention may be driven by an active method that can be independently controlled for each pixel (PX).

[0061] The peripheral area (NDA) is adjacent to the display area (DA). Signal lines connected to pixels (PX) may be arranged in the peripheral area (NDA). The peripheral area (NDA) may include an edge area (BA) and a pad area (PA). In the present embodiment, the edge area (BA) may have a frame shape surrounding the display area (DA). However, this is merely an example, and the edge area (BA) may have various shapes as long as it is adjacent to the display area (DA), and is not limited to any one embodiment.

[0062] The pad area (PA) may be spaced apart from the display area (DA) and adjacent to the edge area (BA). In the present embodiment, the pad area (PA) is illustrated as being spaced apart from the display area (DA) in the second direction (DR2), but is not limited thereto. The pad area (PA) may be defined in an area spaced apart from the display area (DA) in the first direction (DR1), or may be defined in both areas, and is not limited to any one embodiment.

[0063] The pad area (PA) may be an area coupled to the circuit board (200). In the present embodiment, the pad area (PA) is illustrated as having two pad portions (PD1, PD2), but the number of pad portions is not limited thereto. Each of the pad portions (PD1, PD2) may include a plurality of pads for electrically connecting to the circuit board (200).

[0064] The circuit board (200) overlaps at least partially with the pad area (PA). The circuit board (200) provides image data, control signals, power voltage, etc. to the display panel (100). Meanwhile, this is described as an example, and when the display panel (100) detects an external input such as a touch, pen, or light applied from the outside, the circuit board (200) may also provide a driving signal for detecting the external input to the display panel (100).

[0065] The circuit board (200) may be physically and electrically connected to the display panel (100). The circuit board (200) may include a wiring board (210) and a plurality of electronic components (220) mounted thereon.

[0066] The wiring board (210) may be a printed circuit board (PCB) and may be rigid. The wiring board (210) may include at least one insulating layer and at least one wiring layer. Each of the electronic components may be connected to the wiring layer and electrically connected to each other. A portion of the wiring layer may be a terminal portion (TM). The terminal portion (TM) is connected to a corresponding pad among the pads.

[0067] Electronic components (220) may include active components and passive components. Specifically, electronic components (220) may include chip-related components, network-related components, and other components.

[0068] Chip-related components may include at least one of memory, processor, and logic circuits. For example, memory may include volatile memory, non-volatile memory, flash memory, etc. Processors may include application processors such as graphics processors (GPUs), central processors (CPUs), digital signal processors, cryptographic processors, microprocessors, and microcontrollers. Furthermore, logic circuits may include non-memory semiconductors such as analog-to-digital converters (ADCs) and application-specific integrated circuits (ASICs). Meanwhile, chip-related components may be provided in chip form or package form.

[0069] Network-related components may include wireless protocols and / or wired protocols. Other components may include inductors, EMI filters, etc.

[0070] A connecting member (CM) is disposed in a pad area (PA). The connecting member (CM) electrically connects the circuit board (200) and the display panel (100). The connecting member (CM) is electrically conductive and may have adhesive properties. The connecting member (CM) may include a thermosetting or photocurable material. For example, the connecting member (CM) may include an anisotropic conductive film (ACF).

[0071] In this embodiment, the circuit board (200) may include a terminal portion (TM) connected to the pad portions (PD1, PD2) of the display panel (100). Since the circuit board (200) including various electronic components (220) is directly connected to the display panel (100), a separate flexible film or wiring film for connecting the circuit board (200) and the display panel (100) may be omitted. Accordingly, the process cost may be reduced and the assembly process may be simplified.

[0072] Fig. 3 is a cross-sectional view of an electronic device according to one embodiment of the present invention. Fig. 3 illustrates a cross-sectional view of an electronic device (1000-1) with a case (CSS) coupled thereto.

[0073] The display module (10) may be protected by being inserted at least partially into a case (CSS). In the present embodiment, the case (CSS) provides an area in which the circuit board (200) is accommodated among the components of the display module (10), and can stably protect the circuit board (200).

[0074] The display panel (100) may include a first lower member (LM1), a second lower member (LM2), a lower substrate (LPL), an upper substrate (UPL), and an optical layer (OPL) that are laminated along a third direction (DR3) in a cross-section.

[0075] Each of the first lower member (LM1) and the second lower member (LM2) may include components that protect or improve the reliability of the display panel (100). For example, each of the first lower member (LM1) and the second lower member (LM2) may include a light blocking film, a heat dissipation member, a shock absorption member, a support member, a shielding member, etc., but is not limited to any one embodiment.

[0076] Additionally, each of the first lower member (LM1) and the second lower member (LM2) may include a separate functional member. For example, each of the first lower member (LM1) and the second lower member (LM2) may include a touch sensor, a light sensor, a digitizer, a pressure sensor, a battery, etc., but is not limited to any one embodiment.

[0077] The lower substrate (LPL) may be a base layer on which pixels (PX) are arranged. The lower substrate (LPL) may be a single layer or may include multiple insulating layers. The lower substrate (LPL) may be at least one of a glass substrate, a plastic substrate, a film, and a laminate including multiple organic and / or inorganic films, but is not limited to any one embodiment.

[0078] Each of the pixels (PX) may include a driving circuit and a display element that are electrically connected to each other. The driving circuit may include at least one transistor. For example, the driving circuit may include a transistor and a capacitor. Meanwhile, although not shown, the lower substrate (LPL) may include signal wiring, etc. that connect the pixels (PX). Accordingly, the lower substrate (LPL) may include a stacked structure of a plurality of conductive layers and a plurality of organic and / or inorganic films.

[0079] The display element displays light. For example, when the display panel (100) is an organic light-emitting display panel, each of the pixels (PX) may include an organic light-emitting element as a display element. The display element is not limited thereto, and may have various embodiments as long as it can display light according to an electrical signal received from a driving circuit, such as a liquid crystal capacitor, an LED, an n-LED, an m-LED, a quantum dot light-emitting element, an electrowetting element, an electrophoretic element, etc., and is not limited to any one embodiment.

[0080] An upper substrate (UPL) is disposed on a lower substrate (LPL) and covers pixels (PX). The upper substrate (UPL) protects the pixels (PX). The upper substrate (UPL) may include at least one of an encapsulation layer, an encapsulation substrate, and a window. When the upper substrate (UPL) includes an encapsulation layer, the upper substrate (UPL) may have a laminated structure in which at least one inorganic film and at least one organic film are laminated. When the upper substrate (UPL) includes an encapsulation substrate or a window, the upper substrate (UPL) may include glass or plastic.

[0081] Meanwhile, the upper substrate (UPL) may further include a touch sensor or digitizer. In this case, the display panel (100) may be a touch screen panel capable of displaying images and detecting external inputs. Meanwhile, the touch sensor or digitizer may be disposed on the lower substrate (LPL) or on the lower side of the lower substrate (LPL), and is not limited to any one embodiment.

[0082] An optical layer (OPL) is disposed on the upper substrate (UPL). The optical layer (OPL) can improve the display characteristics of an image. For example, the optical layer (OPL) can be an anti-reflection layer, a color filter, a polarizing film, or an anti-fingerprint layer. Alternatively, the optical layer (OPL) can be a protective film or layer that protects the upper substrate (UPL). Meanwhile, in the display panel (100) according to the present embodiment, the optical layer (OPL) may be omitted or provided as an integral part with the upper substrate (UPL), and is not limited to any one embodiment.

[0083] The circuit board (200) includes a wiring board (210) and electronic components (220). The circuit board (200) may be accommodated in a case (CSS). The case (CSS) may be formed of a material having higher rigidity than the circuit board (200), such as metal, alloy, or plastic. The case (CSS) has a shape that surrounds the circuit board (200) and may protect the circuit board (200) from external impact, etc. In the present embodiment, the case (CSS) is illustrated as covering not only the circuit board (200) but also the driving unit (DRV) of the display panel (100). Accordingly, the case (CSS) may stably protect not only the circuit board (200) but also the driving unit (DRV). Meanwhile, in the electronic device (1000-1) according to an embodiment of the present invention, the case (CSS) may be omitted and is not limited to any one embodiment.

[0084] The wiring board (210) includes a body portion (R1) and a protrusion portion (R2). The body portion (R1) may be a portion where an electronic component (220) is mounted. The body portion (R1) includes a plurality of conductive layers. The conductive layers may be wiring layers that include various signal wirings that are electrically connected to the electronic component (220). A detailed description thereof will be provided later.

[0085] The protrusion (R2) may be a portion connected to the display panel (100). The connecting member (CM) may facilitate physical / electrical coupling between the protrusion (R2) and the display panel (100). The protrusion (R2) has a relatively lower thickness than the body portion (R1). The protrusion (R2) may be formed by removing at least a portion of the body portion (R1). The protrusion (R2) may include at least a terminal portion (TM, see FIG. 2b). The terminal portion (TM) may be electrically connected to the display panel (100) by being coupled to pad portions (PD1, PD2, see FIG. 2b) of the display panel (100).

[0086] The terminal portion (TM) may be formed by extending from one of the conductive layers of the body portion (R1). The display panel (100) may be electrically connected to the circuit board (200) through the terminal portion (TM) and may be electrically connected to the electronic component (200) through signal wires formed in the body portion (R1).

[0087] Meanwhile, the protrusion (R2) may include a single conductive layer (or wiring layer). In other words, in the circuit board (200), the body portion (R1) may include multiple wiring layers, and the protrusion (R2) may include a single wiring layer. The single wiring layer arranged on the protrusion (R2) may be a layer that provides the terminal portion (TM). A detailed description thereof will be provided later.

[0088] The electronic component (220) is mounted on the body portion (R1). The body portion (R1) may have a relatively large size and high rigidity compared to the protrusion portion (R2). The body portion (R1) may be more rigid than the protrusion portion (R2). Accordingly, the electronic component (220) may be stably mounted on the body portion (R1).

[0089] Meanwhile, the electronic device (1000-1) according to the present invention may further include a cover layer (CVL). The cover layer (CVL) may be disposed between the protrusion (R2) and the body (R1) and may be in contact with the side surface of the lower substrate (LPL). The cover layer (CVL) may be a coating layer that is provided in a liquid state and hardened, but is not limited thereto. The cover layer (CVL) may prevent the protrusion (R2) from being bent or the connection between the protrusion (R2) and the display panel (100) from being peeled off due to this.

[0090] As illustrated in FIG. 3, in the electronic device (1000-1) according to one embodiment of the present invention, the circuit board (200) can be assembled in a state in which it defines the same plane as the display panel (100) without bending in a cross-section. The case (CSS) can be combined with the display panel (100) to prevent sagging of the circuit board (200), etc. The electronic device (1000-1) can have a reduced thickness by including the circuit board (200) that is assembled without bending. In addition, the electronic device (1000-1) can minimize the width of the protrusion (R2) connected to the display panel (100) in the second direction (DR2), and can simultaneously provide the protrusion (R2) connected to the display panel (100) and the body (R1) on which the electronic component (220) is mounted through a single printed circuit board, thereby reducing the material cost for manufacturing the electronic device and improving the degree of freedom in design.

[0091] FIG. 4 is a cross-sectional view of an electronic device according to an embodiment of the present invention and an electronic device according to a comparative embodiment. For ease of explanation, FIG. 4 illustrates a display module (10, 10-C) of the electronic device (1000-1, see FIG. 3) illustrated in FIG. 3, excluding a case (CSS, see FIG. 3), and illustrates a display panel (100) including a lower substrate (LPL), an upper substrate (UPL), and an optical layer (OPL), and a circuit board (200, 200-C) connected thereto. Hereinafter, the present invention will be described with reference to FIG. 4.

[0092] As illustrated in FIG. 4, a display module (10) according to one embodiment of the present invention may include a display panel (100) and a circuit board (200). The display module (10) illustrated in FIG. 4 may substantially correspond to the configurations of the display module (10) illustrated in FIG. 3, and thus, a duplicate description will be omitted.

[0093] A display module (10-C, hereinafter referred to as Comparative Example) according to a comparative example may include a display panel (100), a circuit board (200-C), and a flexible film (FP). The circuit board (200-C) may include a wiring board (210-C) and an electronic component (220). That is, the comparative example (10-C) may be formed by further including a flexible film (FP) compared to the display module (10, hereinafter referred to as First Example) of the present invention. The flexible film (FP) may be relatively flexible compared to the wiring board (210-C). The flexible film (FP) may be an insulating film on which a wiring layer is mounted, and may be, for example, a tape carrier package (TCP) or a chip-on-film (COF). Although not shown, a film connection member (CM-1) for electrical coupling between the flexible film (FP) and the wiring board (210-C) may be further included, and the film connection member (CM-1) may be, for example, an anisotropic conductive film (ACF).

[0094] According to the first embodiment (10) and the comparative embodiment (10-C), the size of the lower part of the display panel (100) may be the same in the first embodiment (10) and the comparative embodiment (10-C), based on the width defined along the second direction (DR2) in which the circuit boards (200, 200-C) are connected. That is, the distance (a0, hereinafter referred to as zero distance) between the pixels (PX) and the end of the upper substrate (UPL), the distance (a1, hereinafter referred to as first distance) between the end of the upper substrate (UPL) and the driver (DRV), the width (a2, hereinafter referred to as second distance) of the driver (DRV), the distance (a3, hereinafter referred to as third distance) between the end of the driver (DRV) and the connection member (CM), the width (a4, hereinafter referred to as fourth distance) of the connection member (CM), and the distance (a5, hereinafter referred to as fifth distance) between the end of the connection member (CM) and the end of the lower substrate (LPL) may be substantially the same in the first embodiment (10) and the comparative embodiment (10-C). Here, the connection member (CM) may substantially correspond to an area where the pad portions (PD1, PD2) of the display panel (100) are arranged. Accordingly, the third distance (a3) ​​may correspond to the gap between the driving unit (DRV) and the pad parts (PD1, PD2), the fourth distance (a4) may substantially correspond to the length of each of the pad parts (PD1, PD2) in the second direction (DR2), and the fifth distance (a5) may correspond to the gap between the pad parts (PD1, PD2) and the end of the lower substrate (LPL). The zero distance (a0) and the first to fifth distances (a1, a2, a3, a4, a5) are numerical values ​​that determine the size of the lower portion of the display panel (100), and may be numerical values ​​determined through the design of the display panel (100). Therefore, the zero distance (a0) and the first to fifth distances (a1, a2, a3, a4, a5) may be numerical values ​​that are not affected by the difference in the circuit boards (200, 200-C) to be connected.

[0095] According to the first embodiment (10) and the comparative embodiment (10-C), the size between the end of the display panel (100) and the end of the circuit board (200, 200-C) (hereinafter, the size of the lower outer portion of the display panel) may be different based on the width defined along the second direction (DR2) in which the circuit board (200, 200-C) is connected. That is, according to the comparative example (10-C), the distance (a6, hereinafter referred to as the sixth distance) between the end of the lower substrate (LPL) and the rigid wiring board (210-C), measured along the second direction (DR2), the distance (a7, hereinafter referred to as the seventh distance) between the end of the wiring board (210-C) and the film connecting member (CM-1), the width (a8, hereinafter referred to as the eighth distance) of the film connecting member (CM-1), and the width (a9, hereinafter referred to as the ninth distance) of the wiring board (210-C) in the second direction (DR2) may be distances measured at the lower outer portion of the display panel (100). Here, the film connecting member (CM-1) may substantially correspond to an area where a terminal portion connected to the flexible film (FP) of the wiring board (210-C) is arranged. Accordingly, the seventh distance (a7) may correspond to the gap between the terminal portion and the end of the wiring board (210-C), and the eighth distance (a8) may substantially correspond to the length of the terminal portion in the second direction (DR2).

[0096] In contrast, according to the present invention (10), since the flexible film (FP) is omitted, the body portion (R1) of the wiring board (210) which is relatively rigid and has the same configuration as the wiring board (210-C) of the comparative example (10-C) may correspond to the rigid wiring board (210-C) of the comparative example (10-C), and the relatively flexible protrusion portion (R2) may correspond to the flexible film (FP) of the comparative example (10-C). Accordingly, the sixth distance (a6) may correspond to the gap between the lower substrate (LPL) and the end of the body portion (R1), and the ninth distance (a9) may correspond to the width of the wiring board (210) including the body portion (R1) and the protrusion portion (R2) in the second direction (DR2).

[0097] In the comparative example (10-C), since the flexible film (FP) must be connected to each of the display panel (100) and the wiring board (210-C), it is necessary to provide a size that includes a portion overlapping the display panel (100), a portion overlapping the wiring board (210-C), and a portion connecting them. That is, the flexible film (FP) is provided in a size that has a width that includes at least a fourth distance (a4) to an eighth distance (a8) along the second direction (DR2).

[0098] In contrast, according to the present invention (10), the flexible film (FP) is omitted and a portion of the integrated wiring board (210) is formed as a protrusion (R2) for connection with the display panel (100), so that the area for connection with the body portion (R1) can be omitted. Accordingly, the seventh distance (a7) and the eighth distance (a8) overlapping with the body portion (R1) may not exist in the present invention (10). In addition, according to the present invention (10), since the circuit board (200) is assembled without bending and the protrusion (R2) having the terminal portion is formed integrally with the body portion (R1), the sixth distance (a6) for connection can be minimized. The sixth distance (a6) may substantially correspond to the gap between the end of the lower substrate (LPL) and the end of the rigid substrate (210-C, R1). Accordingly, the distance (a10, hereinafter referred to as the 10th distance) between the end of the wiring board (210), which is a rigid portion, and one end of the connecting member (CM) can be reduced. The wiring board (210) can be placed closer to the end of the lower substrate (LPL) compared to the wiring board (210) of the comparative example (10-C).

[0099] When viewed from the back of the display panel (100), the width of the rigid substrate (210-C, R2) in the second direction (DR2) can be determined by the distance (a11, hereinafter referred to as the eleventh distance) between the electronic component (220) and one end of the rigid substrate (210-C, R1), the width (a12, hereinafter referred to as the twelfth distance) of the electronic component (220) in the second direction (DR2), and the distance (a13, hereinafter referred to as the thirteenth distance) between the electronic component (220) and the other end of the rigid substrate (210-C, R2). According to the present invention (10), since the flexible film (FP) is omitted, the seventh distance (a7) and the eighth distance (a8) overlapping the body portion (R1) do not exist, and the connection between the wiring board (210-C, 210) and the display panel (100) is made at the protrusion (R2), the eleventh distance (a11), which is the distance between the electronic component (220) and the end of the rigid board (210-C, R1), can be reduced compared to the comparative example (10-C).

[0100] When providing wiring boards (210-C, 210) of the same size as those of the comparative example (10-C) and the present invention (10), a predetermined gap (DSG) can be measured between the end of the wiring board (210) of the present invention (10) and the end of the wiring board (210-C) of the comparative example (10-C). The gap (DSG) may be 10% to 30% of the ninth distance (a9), but is not limited thereto.

[0101] In addition, according to the present invention (10), since the body part (R1) and the protrusion part (R2) are formed integrally and the connection between the flexible film (FP) and the body part (R1) is not necessary, the wiring structure of the body part (R1) can be relatively simplified compared to the wiring board (210-C) of the comparative example (10-C). Accordingly, the thickness of the body part (R1) can be smaller than the thickness of the wiring board (210-C) of the comparative example (10-C). Since the flexible film (FP) is omitted and the protrusion part (R2) and the display panel (100) are connected, the body part (R1) can have a thickness that is reduced by about 10% to 20% compared to the thickness of the existing wiring board (210-C), but is not limited thereto.

[0102] According to the present invention, a display module (10) according to one embodiment of the present invention includes a circuit board (200) including an integrated body portion (R1) and a protrusion portion (R2), so that a display module (10) having a reduced thickness and a reduced size of an outer portion of a display panel (200) can be provided. In addition, the display module (10) can minimize the width of the protrusion portion (R2) connected to the display panel (100) in the second direction (DR2), and can simultaneously provide the protrusion portion (R2) connected to the display panel (100) and the body portion (R1) on which the electronic component (220) is mounted through a single printed circuit board, so that the material cost for manufacturing an electronic device can be reduced and the degree of freedom in design can be improved.

[0103] Figure 5 is a plan view of a circuit board according to one embodiment of the present invention. For ease of explanation, electronic components are omitted in Figure 5, and only the wiring board is illustrated. The present invention will now be described with reference to Figure 5.

[0104] The wiring board (210) may include an upper side (1L) extending along a first direction (DR1) and facing the display panel (100, see FIG. 2A), a lower side (2L) opposite thereto, a left side (1S) and a right side (2S) extending along a second direction (DR2) and opposite each other. As described above, the wiring board (210) may be divided into a body portion (R1) and a protrusion portion (R2) on a plane. The body portion (R1) may be a portion having a rectangular shape including the lower side (2L), the left side (1S), and the right side (2S).

[0105] In the present embodiment, the body portion (R1) may include a first sub-body portion (R1-L1) and a second sub-body portion (R1-L2) that are separated along the first direction (DR1). A predetermined notch (N3) may be formed between the first sub-body portion (R1-L1) and the second sub-body portion (R1-L2). This will be described later.

[0106] The protrusion (R2) may be a portion protruding from the body portion (R1) toward the display panel (100). The protrusion (R2) may be a portion of the wiring board (210) that includes a terminal portion (TM). The terminal portion (TM) may be a portion electrically connected to the display panel (100). The terminal portion (TM) is in contact with a connecting member (CM, see FIG. 3b). The terminal portion (TM) may be connected to a pad portion (PD1, PD2, see FIG. 3b) of the display panel (100) through the connecting member (CM).

[0107] In the present embodiment, the protrusion (R2) may be formed by protruding from each of the first sub-body portion (R1-L1) and the second sub-body portion (R1-L2). The protrusion (R2) protruding from the first sub-body portion (R1-L1) may include a first sub-protrusion (R2a) and a second sub-protrusion (R2b) which are distinguished along the first direction (DR1). A predetermined notch (N2) may be formed between the first sub-protrusion (R2a) and the second sub-protrusion (R2b). This will be described later. The first sub-body portion (R1-L1) may include a first portion (R1-La) and a second portion (R1-Lb) which are spaced apart in the first direction (DR1) with the protrusion (R2) therebetween.

[0108] The protrusion (R2) protruding from the second sub-body portion (R1-L2) may include a third sub-protrusion (R2c) and a fourth sub-protrusion (R2d) that are separated along the first direction (DR1). A predetermined notch (N2) may be formed between the third sub-protrusion (R2c) and the fourth sub-protrusion (R2d). This will be described later. The second sub-body portion (R1-L2) may include a third portion (R1-Lc) and a fourth portion (R1-Ld) that are spaced apart in the first direction (DR1) with the protrusion (R2) interposed therebetween.

[0109] A circuit board (200) according to one embodiment of the present invention may include a notch (NT) formed on a wiring board (210). The notch (NT) may be formed on an upper side (1L) of the wiring board and may be formed at a boundary portion of each part. The notch (NT) may include at least one of a first notch (N1), a second notch (N2), and a third notch (N3).

[0110] For example, the first notch (N1) may be formed in an area adjacent to the protrusion (R2) among the first to fourth portions (R1-La, R1-Lb, R1-Lc, R1-Ld). In the present embodiment, the first notch (N1) may be formed in an area connected to the left side of the protrusion (R2) among the first portion (R1-La), and an area connected to the right side of the protrusion (R2) among the second portion (R1-Lb). In addition, the first notch (N1) may be formed in an area connected to the left side of the protrusion (R2) among the third portion (R1-Lc), and an area connected to the right side of the protrusion (R2) among the fourth portion (R1-Ld). The first notch (N1) may serve to partially disconnect the physical connection between the body portion (R1) and the protrusion (R2). The upper side (L1a) of the first portion (R1-La) and the upper side (L1b) of the second portion (R1-Lb) can be spaced apart from the protrusion (R2) by the first notch (N1). Similarly, the upper side (L1c) of the third portion (R1-Lc) and the upper side (L1d) of the fourth portion (R1-Ld) can be spaced apart from the protrusion (R2) by the first notch (N1). Accordingly, when elongation of the protrusion (R2) occurs along the first direction (DR1), it is possible to prevent it from being transmitted to the body portion (R1), and deformation of the body portion (R1) can be reduced.

[0111] Or, for example, the second notch (N2) may be formed within the protrusion (R2). The second notch (N2) may be formed on the upper side of the protrusion (R2). The upper side (L2a) of the first sub-protrusion (R2a) and the upper side (L2b) of the second sub-protrusion (R2b) may be spaced apart in the first direction (DR1) with the notch (N2) therebetween. Accordingly, the elongation of the first sub-protrusion (R2a) occurring along the first direction (DR1) and the elongation of the second sub-protrusion (R2b) occurring along the first direction (DR1) may be performed independently of each other. In addition, since the elongation occurring along the first direction (DR1) of the protrusion (R2) can be separated into elongation of the first sub-protrusion (R2a) and elongation of the second sub-protrusion (R2b), the actual deformation of the protrusion (R2) can be reduced.

[0112] According to the present invention, the second notch (N2) can also be formed in the second sub-body portion (R1-L2). The upper side (L2c) of the third sub-protrusion (R2c) and the upper side (L2d) of the fourth sub-protrusion (R2d) can be spaced apart in the first direction (DR1) with the notch (N2) therebetween. Accordingly, the elongation of the third sub-protrusion (R2c) occurring along the first direction (DR1) and the elongation of the fourth sub-protrusion (R2d) occurring along the first direction (DR1) can occur independently of each other. In addition, the elongation of the protrusion (R2) occurring along the first direction (DR1) can be separated into the elongation of the third sub-protrusion (R2c) and the elongation of the fourth sub-protrusion (R2d), so that the actual deformation of the protrusion (R2) can be reduced.

[0113] Alternatively, for example, a third notch (N3) may be formed between the sub-body parts (R1-L1, R1-L2). The third notch (N3) may be formed in a region between the first sub-body part (R1-L1) and the second sub-body part (R1-L2) where they are connected. The third notch (N3) may serve to separate the upper side of the body part (R1). Due to the third notch (N3), the upper side (L1b) of the second part (R1-Lb) of the first sub-body part (R1-L1) and the upper side (L1c) of the third part (R1-Lc) of the second sub-body part (R1-L2) may be spaced apart from each other along the first direction (DR1). Accordingly, the elongation of the first sub-body portion (R1-L1) occurring along the first direction (DR1) and the elongation of the second sub-body portion (R1-L2) occurring along the first direction (DR1) can be performed independently of each other. In addition, the elongation of the body portion (R1) occurring along the first direction (DR1) can be performed separately as the elongation of the first sub-body portion (R1-L1) and the elongation of the second sub-body portion (R1-L2), so that the actual deformation of the body portion (R1) can be reduced.

[0114] A circuit board (200) according to one embodiment of the present invention may include at least one notch (NT) formed in a wiring board (210). The notch (NT) is formed on an upper side (1L) of the wiring board (210) that is connected to the display panel (100) and may be formed by removing at least a portion of the upper side (1L). The shape of the notch (NT) on a plane is illustrated as a U-shape, but is not limited thereto. As long as adjacent upper sides can be spatially separated / spaced apart, it may be formed in various shapes such as a square shape, a V-shape, a semicircle shape, a semi-ellipse shape, etc., and is not limited to any one embodiment. In addition, although FIG. 5 illustrates four first notches (N1), two second notches (N2), and one third notch (N3), this is merely an example, and the number of each of the first to third notches (N1, N2, N3) is not limited, and only one type of the first to third notches (N1, N2, N3) may be present. The circuit board (200) according to one embodiment of the present invention forms at least one notch (NT) on the wiring board (210), thereby distributing the amount of deformation, such as elongation / contraction in the first direction (DR1) that may occur during bonding of the wiring board (210), thereby preventing local concentration of deformation. Accordingly, an electronic device with improved electrical reliability can be provided.

[0115] Figures 6a to 6c are cross-sectional views of a circuit board according to one embodiment of the present invention. Figures 7a to 7c are cross-sectional views of a circuit board according to one embodiment of the present invention. Hereinafter, the present invention will be described with reference to Figures 6a to 7c.

[0116] Referring to FIGS. 6A to 7C, the body portion (R1) may include a plurality of layers. For example, the body portion (R1) may include a plurality of insulating layers (201, 202), a plurality of wiring layers (203), a plurality of via layers (204), and a plurality of cover layers (205).

[0117] The insulating layers (201, 202) may include a first insulating layer (201) and a second insulating layer (202) having different elastic moduli. The first insulating layer (201) may have a relatively lower elastic modulus than the second insulating layer (202). That is, the first insulating layer (201) may be a layer having a relatively rigid property compared to the second insulating layer (202). For example, the first insulating layer (201) may include polyimide, and the second insulating layer (202) may include prepreg or ABF. However, the present invention is not limited thereto, and each of the first insulating layer (201) and the second insulating layer (202) may include a material including a thermosetting resin, a thermoplastic resin, glass fiber, or an inorganic filler, and various combinations of materials may be selected as long as the relationship of the first insulating layer (201) having a lower elastic modulus than the second insulating layer (202) is satisfied.

[0118] Meanwhile, in the circuit board (200) according to the present embodiment, the body portion (R1) is illustrated as having a structure in which the first insulating layer (201) and the second insulating layer (202) are partially alternately laminated, but is not limited thereto. The first insulating layer (201) and the second insulating layer (202) may be alternately laminated entirely, or may have a structure in which only the first insulating layer (201) is laminated, or only the second insulating layer (202) is laminated, and is not limited to any one embodiment.

[0119] The wiring layers (203) may be respectively disposed on the insulating layers (201, 202). Each of the wiring layers (203) may have conductivity. For example, each of the wiring layers (203) may include a metal. Specifically, each of the wiring layers (203) may include copper, aluminum, silver, tin, gold, nickel, lead, titanium, or an alloy thereof. Each of the wiring layers (203) may be formed by a plating process and may also include an electrolytic plating layer.

[0120] The via layers (204) electrically connect the adjacent wiring layers (203) in the thickness direction. The via layers (204) may be formed by penetrating the insulating layers (201, 202), respectively. The via layers (204) may completely fill the interior of the via hole penetrating the insulating layers (201, 202), or may be formed along the wall surface of the via hole. Each of the via layers (204) may penetrate at least one of the insulating layers (201, 202). Some of the via layers (204) may penetrate a plurality of layers of the insulating layers (201, 202), and may penetrate only the first insulating layers (201), only the second insulating layers (202), or both the first insulating layer (201) and the second insulating layer (202), and are not limited to any one embodiment.

[0121] Each of the via layers (204) may have conductivity. For example, each of the via layers (204) may include metal. Each of the via layers (204) may be formed of the same material as the wiring layers (203). However, this is merely an example, and the via layers (204) may be formed of a different material from the wiring layers (203), and are not limited to any one embodiment.

[0122] The cover layer (205) is disposed on each of the upper and lower sides of the wiring board (210). The cover layer (205) can form the upper and lower surfaces of the wiring board (210), respectively. The cover layer (205) can protect the internal structure of the circuit board (200), specifically, the insulating layers (201, 202), the wiring layer (203), and the via layer (204). The cover layer (205) can be formed of an insulating material. For example, the cover layer (205) can be ABF including a thermosetting resin and an inorganic filler, or a solder resist layer. However, this is described as an example, and the cover layer (205) can be formed of various materials as long as it can protect the internal structure of the circuit board (200), such as a known photosensitive insulating layer, and is not limited to any one embodiment. In addition, the cover layer (205) may be formed using different materials or different processes on the upper and lower sides of the circuit board (200), or may be formed identically, and is not limited to any one embodiment.

[0123] The protrusion (R2) may have a thickness smaller than that of the body (R1). The protrusion (R2) has an integral shape with the body (R1). That is, the protrusion (R2) may have a layer structure in which at least one layer among the layers constituting the body (R1) is omitted. Meanwhile, the protrusion (R2) may include at least one first insulating layer (201) and a single wiring layer (203). The wiring layer (203) of the protrusion (R2) may be a terminal portion (TM) of the circuit board (200). The terminal portion (TM) may be formed by extending from any one of the wiring layers (203) arranged in the body (R1). According to the present invention, by forming only a single wiring layer (203) in the protrusion (R2), the number of insulating layers required for the protrusion (R2) may be reduced. Accordingly, the thickness of the protrusion (R2) can be reduced compared to the body portion (R1), so that the protrusion (R2) having higher ductility compared to the body portion (R1) can be provided. As the ductility of the protrusion (R2) where the terminal portion (TM) is arranged increases, the stress when connecting the display panel and the circuit board can be reduced, and a stable electrical connection can be achieved.

[0124] According to the present invention, the layer structure constituting the body portion (R1) and the protrusion portion (R2) can be provided in various embodiments.

[0125] For example, referring to FIG. 6A, the body portion (R1) may include three first insulating layers (201), four second insulating layers (202), and six wiring layers (203). The circuit board (200) may correspond to a structure including two copper clad layers (CCL). In this regard, the protrusion portion (R2) may include one first insulating layer (201-R2, hereinafter referred to as a protruding first insulating layer) and a terminal portion (TM). The protruding first insulating layer (201-R2) and the terminal portion (TM) may extend from the body portion (R1) and be integral with the body portion (R1). Among the three first insulating layers (201) arranged on the body portion (R1), only one first insulating layer (201) extends to the second portion (R2) as the protruding first insulating layer (201-R2), and the remaining two first insulating layers (201) can be removed at the protrusion (R2). Accordingly, two etching steps (e.g., laser etching steps) for removing each of the two first insulating layers (201) can be included in the manufacturing process of the circuit board (200). Accordingly, a protrusion (R2) that is thinner and more flexible than the body portion (R1) can be formed.

[0126] Meanwhile, protective layers (206) may be further added to the upper and lower surfaces of the protrusion (R2). The protective layer (206) supports one surface of the insulating layer (201-R2) and prevents excessive exposure of the terminal portion (TM), thereby protecting the terminal portion (TM) from external moisture or contamination and preventing electrical short circuits with external components.

[0127] Alternatively, for example, referring to FIG. 6b, the body portion (R1) may include two second insulating layers (201), four second insulating layers (202), and six wiring layers (203). That is, the body portion (R1) may have a layer structure in which one first insulating layer (201) is omitted compared to the body portion (R1) illustrated in FIG. 6a. The circuit board (200) illustrated in FIG. 6b may correspond to a structure including one CCL. The first insulating layer (201) may be relatively thicker than the second insulating layer (202) and may be provided in a film form. Accordingly, the body portion (R1) illustrated in FIG. 6b may have a reduced thickness compared to the body portion (R1) illustrated in FIG. 6a, while reducing the number of etching steps (laser etching) for removing a portion of the first insulating layer (210) to form the protrusion (R2). Therefore, the process can be simplified and process costs can be reduced.

[0128] The protrusion (R2) can be formed by removing one first insulating layer (201), two first insulating layers (202), and one cover layer (205) from the body portion (R1). That is, the protrusion (R2) can include one insulating layer (201-R2, hereinafter referred to as the protruding first insulating layer), two second insulating layers (202-R2, hereinafter referred to as the protruding second insulating layer), one cover layer (205-R2, hereinafter referred to as the protruding cover layer), and a terminal portion (TM). The protruding first insulating layer (201-R2), the protruding second insulating layer (202-R2), the protruding cover layer (205-R2), and the terminal portion (TM) can extend from the body portion (R1) and be integral with the body portion (R1). According to the present invention, the protruding second insulating layer (202-R2) and the protruding cover layer (205-R2) can support the protruding first insulating layer (201-R1), and the number of protective layers (206) required for the protrusion (R2) can be reduced compared to the circuit board illustrated in FIG. 6A.

[0129] Alternatively, for example, referring to FIG. 6c, the body portion (R1) may have the same layer structure as FIG. 6b, and the protrusion (R2) may have the same layer structure as the protrusion (R2) illustrated in FIG. 6a. Since the protrusion (R2) illustrated in FIG. 6c has the protruding second insulating layers removed compared to the protrusion (R2) illustrated in FIG. 6b, the number of required protective layers (206) may be further increased.

[0130] Alternatively, for example, as illustrated in FIG. 7A, the circuit board (200) may include a protrusion (R2) in which only one cover layer (206) of the configurations of the body portion (R1) is removed. The protrusion (R2) may include a protruding first insulating layer (201-R2) in which the first insulating layer (201) of the body portion (R1) is extended, protruding second insulating layers (202-R2) in which the second insulating layers (202) of the body portion (R1) are extended, and a protruding cover layer (205-R2) in which one of the cover layers (205) of the body portion (R1) is extended. The circuit board (200) according to the present invention includes a protrusion (R2) including configurations substantially similar to those of the body portion (R1), thereby forming a protrusion (R2) that is thicker than the circuit boards illustrated in FIGS. 6A to 6C. Accordingly, the shrinkage stress of the protrusion (R2) may be reduced. The deformation of the protrusion (R2) due to deterioration, etc. during the connection process to the display panel can be reduced, thereby preventing problems such as misalignment due to stretching. Accordingly, a more stable electrical connection process can be achieved.

[0131] Or, for example, as illustrated in FIG. 7B, the circuit board (200) may include rigid second insulating layers (2021). The second insulating layers (2021) may be formed of a rigid prepreg compared to the second insulating layer (202) illustrated in FIG. 7A. The protrusion (R2) may include protruding rigid second insulating layers (2021-R2) that extend from the body (R1). The circuit board (200) according to the present invention may be provided with a protrusion (R2) having high rigidity by including rigid insulating layers. Accordingly, the dimensional stability of the circuit board (200) may be improved, and the amount of deformation due to deterioration, etc. during the connection process to the display panel may be reduced, thereby preventing problems such as misalignment due to stretching. Accordingly, a more stable electrical connection process may be achieved.

[0132] Alternatively, for example, as illustrated in FIG. 7c, the circuit board (200) may include a body portion (R1) having the same layer structure as FIG. 7a and a protrusion (R2) having a lower thickness than the protrusion (R2) of FIG. 7a. The protrusion (R2) may include protruding second insulating layers (202-R2) interposed between the terminal portion (TM) and the protruding first insulating layer (201-R1). Accordingly, a circuit board (200) having a reduced thickness and reduced process / material costs compared to the circuit board (200) illustrated in FIG. 7a can be provided.

[0133] Figures 8a and 8b are cross-sectional views of a circuit board according to one embodiment of the present invention. For ease of explanation, Figures 8a and 8b illustrate regions corresponding to those illustrated in Figure 6a. Hereinafter, the present invention will be described with reference to Figures 8a and 8b. Components identical to those described in Figures 1a to 7c will be given the same reference numerals, and redundant descriptions will be omitted.

[0134] Referring to FIGS. 8A and 8B, at least a portion of the body portion (R1) may be removed and formed. For example, as illustrated in FIG. 8A, the circuit board (200) may be formed by removing a portion of the body portion (R1) of the circuit board (200) illustrated in FIG. 6A. In addition, as illustrated in FIG. 8B, the circuit board (200) may be formed by removing a portion of the circuit board (200) illustrated in FIG. 6C.

[0135] The protective layer (206) disposed on the protrusion (R2) can extend to a portion of the body portion (R1) to prevent exposure of a wiring layer having an integral shape with the terminal portion (TM). A portion of the back surface of the body portion (R1) on which the terminal portion (TM) is formed can be removed. Accordingly, interference between the end of the display panel (100: see FIG. 2B) connected to the terminal portion (TM) and the body portion (R1) can be prevented. Even if the circuit board (200) does not extend the length of the protrusion (R2), it can prevent contact between the end of the display panel (100) and the body portion (R1) by providing a stepped portion, which is a recessed area in the body portion (R1).

[0136] FIGS. 9A and 9B are cross-sectional views of display modules according to one embodiment of the present invention. For ease of explanation, FIGS. 9A and 9B illustrate cross-sectional views at a stage where a display panel (100) and a circuit board (200) are connected, and the layer configurations of the display panel (100) and the circuit board (200) are simply illustrated. Meanwhile, among the layer configurations of the wiring board (210), the wiring layer is hatched to distinguish it. Hereinafter, the present invention will be described with reference to FIGS. 9A and 9B. Meanwhile, the same reference numerals are given to the same configurations as those described in FIGS. 1A to 8B, and duplicate descriptions are omitted.

[0137] Referring to FIGS. 9A and 9B , the hatched layer is disclosed as a single layer in the protrusion (R2) and as multiple layers in the body portion (R1). That is, the protrusion (R2) includes a single wiring layer, and the body portion (R1) includes multiple wiring layers. The wiring layer included in the protrusion (R2) may be formed by extending any one of the wiring layers of the body portion (R1). The wiring layer included in the protrusion (R2) may provide a terminal portion (TM) of the wiring board (210).

[0138] The protruding section (c1) of the protrusion (R2) may include a first section (c1a) and a second section (c1b). The wiring layer included in the protrusion (R2) may be exposed to the outside in the first section (c1a) to form a terminal portion (TM). The wiring layer included in the protrusion (R2) may be covered by another layer, such as an insulating layer, and may not be exposed to the outside in the second section (c1b).

[0139] A terminal portion (TM) is exposed in the first section (c1a) of the protrusion (R2) and can be connected to the display panel (100). An end of an insulating layer exposing the terminal portion (TM) and covering the second section (c1b) is located at the boundary between the first section (c1a) and the second section (c1b) and can be spaced apart from the electronic component (220) by a predetermined distance (d1). According to the present invention, since the terminal portion (TM) is formed at a position spaced apart from the electronic component (220) by a predetermined distance (d1), a sufficient distance (b1) between the electronic component (220) and the lower substrate (LPL) can be secured. Accordingly, interference (e.g., physical collision, etc.) of the electronic component (220) can be prevented when connecting between the display panel (100) and the terminal portion (TM), and thus the stability of the connection between the display panel (100) and the circuit board (200) can be improved.

[0140] As described above, at least some of the plurality of layers constituting the body portion (R1) may be removed to form the protrusion portion (R2). Accordingly, the protrusion portion (R2) has a relatively lower thickness than the body portion (R1). Among the plurality of wiring layers constituting the body portion (R1), except for one wiring layer forming the terminal portion (TM), the remaining wiring layers do not extend to the protrusion portion (R2). Accordingly, the ends of the remaining wiring layers may be positioned at the boundary between the body portion (R1) and the protrusion portion (R2).

[0141] Some of the plurality of insulating layers constituting the protrusion (R2) may extend only to a portion (d3) of the body portion (R1). Accordingly, some of the plurality of insulating layers constituting the protrusion (R2) may exist only in a portion (d3) and not in the remaining areas.

[0142] Meanwhile, the upper / lower surface of the first section (c1a) may have a flat surface, and the second section (c1b) may have at least one step on the upper or lower surface compared to the first section (c1a). That is, the first section (c1a) may have a constant thickness, and the second section (c1b) may include regions having at least two different thicknesses. The step formed in the second section (c1b) may be formed between the insulating layers by removing some of the insulating layers covering the wiring layer of the protrusion (R2). Accordingly, some sections (d2) of the second section (C1b) may have a greater thickness. That is, the second section (C1b) may further include a predetermined stepped portion (d2).

[0143] The stepped portion (d2) may be provided in various forms. For example, referring to FIG. 9A, the stepped portion (d2) may be formed on the upper and lower surfaces of the second section (c1b), respectively. Alternatively, referring to FIG. 9B, the stepped portion (d2) may be formed only on the lower surface of the second section (c1b). The circuit board (200) according to one embodiment of the present invention may include a protrusion including a single wiring layer constituting the terminal portion (TM), and the protrusion (R2) may include a second section (c1b) in which the terminal portion (TM) is covered and not exposed. The second section (c1b) may include a terminal-protruding portion (d2), and may be provided in various shapes and is not limited to any one embodiment.

[0144] FIGS. 10A to 10D are plan views illustrating portions of circuit boards. For ease of explanation, FIG. 10A illustrates a comparative embodiment of the present invention, and FIGS. 10B to 10D illustrate circuit boards according to one embodiment of the present invention. In FIGS. 10A to 10D, the size of the protrusion (R2), the configuration of the terminal portion (TM), and the alignment mark (ATM) are illustrated in the same manner. Hereinafter, the present invention will be described with reference to FIGS. 10A to 10D.

[0145] Referring to Fig. 10a, a protrusion (R2) protrudes from a body portion (R1). In a comparative embodiment, the protrusion (R2) may have a width of the first section (e1). In the comparative embodiment, a notch may not be formed. In addition to the terminal portion (TM), an alignment mark (ATM) and a dummy terminal portion (DTM) may be further arranged on the protrusion (R2). The alignment mark (ATM) is illustrated as having an integral shape connected to the terminal portion (TM), but is not limited thereto, and the position or shape of the alignment mark (ATM) may be variously changed as long as it can be used for alignment between the circuit board and the display panel. The dummy terminal portion (DTM) may be arranged spaced apart from the terminal portion (TM). A plurality of dummy terminal portions (DTM) may be provided and may be electrically insulated from the terminal portion (TM).

[0146] Referring to FIG. 10b, a circuit board according to one embodiment may have a predetermined notch (NT) formed therein. The notch (NT) may be formed in an area adjacent to a protrusion (R2) of a body portion (R1). That is, in the present embodiment, the notch (NT) is exemplarily illustrated as the first notch (N1, see FIG. 5) described above, but is not limited thereto. The notch (NT) may have a depth (e2) defined along the second direction (DR2) and a width (e3) defined along the first direction (DR1). According to the present invention, by including the notch (NT), the design of the second section (c1b) can be easily achieved, so that interference between electronic components and a display panel can be prevented without increasing the size of the wiring board.

[0147] Referring to FIG. 10c, in the circuit board according to one embodiment, the number of dummy terminal portions (DTM) may be variously changed. FIG. 10c illustrates an embodiment in which a greater number of dummy terminal portions (DTM) are formed than in the embodiment illustrated in FIG. 10b. As the number of dummy terminal portions (DTM) increases, the distance at which the terminal portions (TM) are spaced from the left end of the protrusion (R2) may increase. During bonding, shrinkage stress may be generated relatively largely at the edge of the protrusion (R2). Accordingly, even if peeling occurs between the circuit board (200) and the display panel (100) due to stretching / shrinkage during the bonding process, it may be difficult for the shrinkage stress to be transmitted to the terminal portions (TM) that are spaced far from the end of the protrusion (R2). Therefore, the occurrence of electrical connection failure can be reduced.

[0148] Meanwhile, the embodiment illustrated in FIG. 10c may correspond to the third embodiment illustrated in FIG. 9c. That is, as the number of dummy terminal portions (DTM) increases, the position of the terminal portions (TM) is spaced further away from the notch (NT) in the first direction (DR1), and accordingly, the position of the electronic component (220) is arranged further away in the second direction (DR2), thereby facilitating the design of the wiring layer. Accordingly, occurrence of collisions, etc., between the electronic component and the display panel can be prevented.

[0149] Referring to FIG. 10d, in a circuit board according to one embodiment, the dummy terminal portion (DTM) may have an inclined shape with respect to the first direction (DR1) and the second direction (DR2). Meanwhile, in the present embodiment, the dummy terminal portion (DTM) is illustrated as having a different shape from the terminal portion (TM), but this is not limited thereto, and the terminal portion (TM) may also have an inclined shape.

[0150] In the present embodiment, the inclined direction of the dummy terminal portion (DTM) may be a direction in which the distance from the terminal portion (TM) increases as it gets closer to the body portion (R1). According to the present invention, since the dummy terminal portion (DTM) has an inclined shape, the size of the area occupied by the dummy terminal portion (DTM) can be increased compared to FIG. 10c designed with the same number, and the density of the dummy terminal portion (DTM) in the area adjacent to the terminal portion (TM) can be reduced. Accordingly, the influence of shrinkage stress on the terminal portion (TM) can be reduced, and the occurrence of electrical connection failure can be reduced.

[0151] Figures 11a and 11b are plan views illustrating portions of a display module according to one embodiment of the present invention. For ease of explanation, Figures 11a and 11b illustrate identical regions, and illustrate regions where notches (NTs) are formed. The present invention will now be described with reference to Figures 11a and 11b.

[0152] As illustrated in FIG. 11a, in a display module according to one embodiment of the present invention, a notch (NT) may be formed on an upper side of a body portion (R1) facing a display panel (100) and may be formed in contact with a protrusion (R2).

[0153] Alternatively, as illustrated in FIG. 11b, the notch (NT) may be formed at a position spaced apart from the protrusion (R2) by a predetermined distance (DSS). In this case, the notch (NT) may serve to spatially separate a portion of the body portion (R1) from another portion. That is, the distance (DSS) according to the present embodiment may be designed to be 0 (zero) or a predetermined value. The distance (DSS) may be designed to have various values ​​as long as the shrinkage stress of the protrusion (R2) does not affect the body portion (R1), and is not limited to any one embodiment.

[0154] An electronic device according to one embodiment of the present invention may include a circuit board having at least one notch defined therein. The notch may be defined on a side of the wiring board facing a display panel and may be formed by being recessed into the display panel to a predetermined depth. The notch may serve to spatially separate the wiring board extending along a first direction (DR1) at predetermined intervals. Accordingly, shrinkage stress due to stretching, etc. occurring during bonding may be continuously blocked from being transmitted along the first direction (DR1). Accordingly, the electrical reliability and process reliability of the electronic device may be improved.

[0155] Furthermore, according to the present invention, by removing some layers of the rigid circuit board, a protrusion for connection to the display panel can be provided. Therefore, separate wiring films, such as flexible films, can be omitted, reducing material costs, process costs, and shortening process times. Furthermore, the bezel of the electronic device can be reduced and its thickness reduced.

[0156] While the present invention has been described above with reference to preferred embodiments, it will be understood by those skilled in the art or those with ordinary knowledge in the art that various modifications and changes can be made to the present invention without departing from the spirit and technical scope of the present invention as set forth in the claims below. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

[0157] According to the present invention, electronic device processing costs can be reduced and processing times can be shortened. Therefore, it has industrial applicability.

Claims

1. A display panel including pads arranged along a first direction; and A circuit board including a wiring board facing the display panel in a second direction intersecting the first direction and electrically connected to the pads and an electronic component mounted on the wiring board, The above wiring board is, A body portion having a first thickness and on which the electronic component is mounted; and A protrusion having a second thickness smaller than the first thickness, protruding from the body toward the display panel so that at least a portion overlaps the display panel on a plane, and providing a terminal portion connected to the pads, An electronic device having at least one notch defined on a side of the wiring board facing the display panel.

2. In paragraph 1, An electronic device in which the notch is defined in an area adjacent to the protrusion on the side of the body facing the display panel.

3. In paragraph 1, An electronic device wherein the notch is defined on a side of the protrusion facing the display panel.

4. In paragraph 1, The above protrusions are provided in plurality along the first direction, An electronic device in which the notch is defined between the protrusions on the side of the body facing the display panel.

5. In paragraph 1, The above body part, Two insulating cover layers; At least one first insulating layer disposed between the two cover layers; At least one second insulating layer disposed between the two cover layers and being more flexible than the first insulating layer; At least one wiring layer having conductivity and disposed between the two cover layers; and A via layer penetrating at least one of the first insulating layer and the second insulating layer and electrically connecting the at least one wiring layer with the electronic component and the terminal portion, An electronic device in which the protrusion has an integral shape with at least one part of the configuration of the body portion.

6. In paragraph 5, The above protrusion comprises a single wiring layer, An electronic device wherein the single wiring layer extends from one of the wiring layers of the body portion.

7. In paragraph 5 An electronic device wherein the first insulating layer comprises a film.

8. In paragraph 7, An electronic device wherein the second insulating layer comprises a prepreg.

9. In paragraph 1, The protrusion further includes a stepped portion having a thickness smaller than the first thickness and different from the second thickness, An electronic device in which the step portion is disposed between the body portion and the portion having the second thickness in the second direction.

10. In paragraph 9, An electronic device in which the step portion has an integral shape with the portion having the second thickness.

11. In paragraph 1, The circuit board further includes a dummy terminal portion disposed on the protrusion portion and electrically insulated from the terminal portion, An electronic device in which the dummy terminal portion is positioned closer to the outside of the protrusion portion than the terminal portion in the first direction.

12. In paragraph 11, An electronic device in which the dummy terminal portion has a shape inclined with respect to the first direction and the second direction on a plane.

13. In paragraph 1, Further comprising a case providing space for accommodating the circuit board; The above space is an electronic device provided in the second direction with respect to the above display panel.

14. A display panel including pads arranged along a first direction; and A circuit board including a wiring board that faces the display panel in a second direction intersecting the first direction and includes a terminal portion connected to the pads and an electronic component mounted on the wiring board, The above wiring board is, A body portion comprising a plurality of wiring layers, at least one of the wiring layers being connected to the electronic component; and A protrusion having an integral shape with the body portion and including a single wiring layer extending from one of the wiring layers, An electronic device in which a first notch is defined between the body portion and the protrusion portion on a side of the wiring board facing the display panel, and is sunken in a direction away from the display panel.

15. In paragraph 14, The above protrusion is, a first portion having a first thickness; and A second part having a thickness greater than the first thickness and disposed between the first part and the body part in the second direction, An electronic device wherein the first part has an integral shape with at least a part of the second part.

16. In paragraph 15, An electronic device wherein the length of the second portion in the second direction corresponds to the sunken depth of the first notch.

17. In paragraph 15, The circuit board further includes a dummy terminal portion disposed on the protrusion portion and electrically insulated from the terminal portion, An electronic device wherein the dummy terminal portion is disposed between the first notch and the terminal portion in the first direction.

18. In paragraph 17, An electronic device in which the terminal portion extends in an inclined direction with respect to the first direction and the second direction.

19. In paragraph 14, An electronic device wherein the circuit board further includes a second notch defined on a side of the protrusion facing the display panel.

20. In paragraph 19, The above protrusions are provided in multiples spaced apart along the first direction, An electronic device further comprising a third notch defined in the body portion and positioned between the plurality of protrusions.

21. In paragraph 14, an upper cover disposed on the above display panel; and Further comprising a lower cover disposed on the lower side of the display panel and coupled with the upper cover, An electronic device in which the display panel and the circuit board are accommodated between the upper cover and the lower cover.

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