Power module and manufacturing method therefor

Abstract

Provided in the present disclosure are a power module and a manufacturing method therefor. The power module is used for driving an electric motor and an electric heater, and comprises an electric-motor control portion and an electric-heater control portion, wherein a plurality of power chips of the electric-motor control portion and a plurality of power chips of the electric-heater control portion are integrated in the power module.

Description

Power module and manufacturing method thereof

[0001] Related applications

[0002] This disclosure claims priority to Chinese patent application number 202410224095.9, filed on February 29, 2024, entitled “Power module driven by integrated motor and electric heater and its manufacturing method,” the entire text of which is hereby incorporated by reference. Technical Field

[0003] The present disclosure relates to the field of power electronics technology, and in particular to a power module integrated with a motor and an electric heater drive and a manufacturing method thereof. Background Art

[0004] Currently, two-in-one controllers for automotive electric compressors and electric heaters require the mixed use of multiple IGBTs, which are distributed and installed within the controller. Multiple IGBTs occupy a large space, hindering product miniaturization. IGBTs require thermal insulation fabric or ceramic sheets for insulation and heat conduction. Thermal insulation fabric has low thermal conductivity, hindering heat dissipation, while ceramic sheets are fragile and difficult to assemble. Furthermore, IGBTs use external temperature sensors to detect IGBT temperature. Due to the influence of ambient temperature and thermal resistance, these external temperature sensors cannot accurately detect IGBT temperature, making the IGBT prone to overheating and failure.

[0005] Summary of the Invention

[0006] In view of this, the present disclosure provides a power module and a method for manufacturing the same.

[0007] In a first aspect, the present disclosure provides a power module, comprising:

[0008] The motor control section includes multiple power chips for driving the motor;

[0009] The electric heater control section includes a plurality of power chips for driving the electric heater;

[0010] A plurality of power chips of the motor control part and a plurality of power chips of the electric heater control part are integrated into the power module.

[0011] Optionally, the power chip of the motor control part includes at least one of an IGBT chip, a SiC chip, a MOSFET chip and a GaN chip.

[0012] Optionally, the multiple power chips of the electric heater control part include at least one of an IGBT chip, a SiC chip, a MOSFET chip and a GaN chip.

[0013] Optionally, the plurality of power chips of the motor control part include a first chip unit, a second chip unit, a third chip unit, a fourth chip unit, a fifth chip unit and a sixth chip unit.

[0014] Optionally, the first chip unit, the second chip unit, the third chip unit, the fourth chip unit, the fifth chip unit, and the sixth chip unit all include IGBT chips.

[0015] Optionally, the plurality of power chips of the electric heater control part include a seventh chip unit, an eighth chip unit and a ninth chip unit.

[0016] Optionally, the seventh chip unit, the eighth chip unit, and the ninth chip unit are all IGBT chips.

[0017] Optionally, each of the power chips is a chip including a first port, a second port and a third port, wherein the first port is a gate; the second port is a collector; and the third port is an emitter.

[0018] Optionally, the first port of the first chip unit is connected to the first pin of the power module;

[0019] The second port of the first chip unit is respectively connected to the second port of the second chip unit, the second port of the third chip unit, the second port of the seventh chip unit and the eighteenth pin of the power module;

[0020] The third port of the first chip unit is connected to the second pin of the power module, the second port of the fourth chip unit and the nineteenth pin of the power module respectively;

[0021] The first port of the second chip unit is connected to the third pin of the power module;

[0022] The third port of the second chip unit is respectively connected to the fourth pin of the power module, the second port of the fifth chip unit and the twentieth pin of the power module;

[0023] The first port of the third chip unit is connected to the fifth pin of the power module;

[0024] The third port of the third chip unit is respectively connected to the sixth pin of the power module, the second port of the sixth chip unit and the twenty-first pin of the power module;

[0025] The first port of the fourth chip unit is connected to the seventh pin of the power module;

[0026] The third port of the fourth chip unit is connected to the eighth pin of the power module and the twenty-second pin of the power module respectively;

[0027] The first port of the fifth chip unit is connected to the ninth pin of the power module;

[0028] The third port of the fifth chip unit is connected to the tenth pin of the power module and the twenty-third pin of the power module respectively;

[0029] The first port of the sixth chip unit is connected to the eleventh pin of the power module;

[0030] The third port of the sixth chip unit is connected to the twelfth pin of the power module and the twenty-fourth pin of the power module respectively.

[0031] Optionally, the first pin is pin GUH; the second pin is pin KUH; the third pin is pin GVH; the fourth pin is pin KVH; the fifth pin is pin GWH; the sixth pin is pin KWH; the seventh pin is pin GUL; the eighth pin is pin KUL; the ninth pin is pin GVL; the tenth pin is pin KVL; the eleventh pin is pin GWL; the twelfth pin is pin KWL; the eighteenth pin is pin P; the nineteenth pin is pin U; ​​the twentieth pin is pin V; the twenty-first pin is pin W; the twenty-second pin is pin NU; the twenty-third pin is pin NV; and the twenty-fourth pin is pin NW.

[0032] Optionally, the first port of the seventh chip unit is connected to the thirteenth pin of the power module;

[0033] The transmitting stage of the seventh chip unit is respectively connected to the fourteenth pin of the power module and the twenty-fifth pin of the power module;

[0034] The first port of the eighth chip unit is connected to the fifteenth pin of the power module;

[0035] The second port of the eighth chip unit is connected to the twenty-sixth pin of the power module;

[0036] The third port of the eighth chip unit is connected to the third port of the ninth chip unit, the seventeenth pin of the power module, and the twenty-eighth pin of the power module respectively;

[0037] The first port of the ninth chip unit is connected to the sixteenth pin of the power module;

[0038] The second port of the ninth chip unit is connected to the twenty-seventh pin of the power module.

[0039] Optionally, the thirteenth pin is pin G1; the fourteenth pin is pin K1; the fifteenth pin is pin G2; the sixteenth pin is pin G3; the seventeenth pin is pin K23; the twenty-fifth pin is pin E1; the twenty-sixth pin is pin C2; the twenty-seventh pin is pin C3; and the twenty-eighth pin is pin E23.

[0040] Optionally, the power module further includes:

[0041] A copper-clad ceramic substrate is provided on which the plurality of power chips of the motor control part and the plurality of power chips of the electric heater control part are mounted.

[0042] Optionally, it also includes:

[0043] A plurality of temperature sensors are used to detect the temperatures of the plurality of power chips of the motor control part and the temperatures of the plurality of power chips of the electric heater control part.

[0044] Optionally, the plurality of temperature sensors include a first temperature sensor and a second temperature sensor;

[0045] One end of the first temperature sensor is connected to the twenty-ninth pin of the power module;

[0046] The other end of the first temperature sensor is connected to the 30th pin of the power module;

[0047] One end of the second temperature sensor is connected to the thirty-first pin of the power module;

[0048] The other end of the second temperature sensor is connected to the thirty-second pin of the power module;

[0049] The twenty-ninth pin is pin T1-1, the thirtieth pin is pin T1-2, the thirty-first pin is pin T2-1, and the thirty-second pin is pin T2-2.

[0050] In a second aspect, the present disclosure provides a method for manufacturing a power module, by integrating multiple power chips for driving a motor and multiple power chips for driving an electric heater on a copper-clad ceramic substrate through a process including reflow soldering and ultrasonic bonding of aluminum wires to form a power module.

[0051] Optionally, the plurality of temperature sensors are packaged together with the plurality of power chips for driving the motor and the plurality of power chips for driving the electric heater in the power module by adopting a process including reflow soldering and aluminum wire ultrasonic bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0053] FIG1 is a schematic structural diagram of a power module according to one or more embodiments of the present disclosure.

[0054] FIG2 is a schematic structural diagram of a power module according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION

[0055] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0056] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0057] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present disclosure. The illustrations only show components related to the present disclosure and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0058] Additionally, in the following description, details are provided to facilitate a thorough understanding of the examples, however, one skilled in the art will appreciate that the examples can be practiced without these specific details.

[0059] In-depth research into power modules, including those driving motors and electric heaters, revealed that two-in-one controllers for automotive electric compressors and heaters typically utilize eight to ten IGBTs (Insulated-Gate Bipolar Transistors). Six of these IGBTs form a three-way H-bridge to control the motor, while two to four IGBTs control the electric heater. Multiple IGBTs are distributed within the controller. Each IGBT requires an external temperature sensor to monitor its temperature for thermal protection, and thermally conductive insulating gaskets for insulation and heat dissipation.

[0060] However, in the related art two-in-one controller for automotive electric compressors and electric heaters, multiple IGBT single tubes occupy a large space, which is not conducive to product miniaturization. The IGBT single tube needs to use thermally conductive insulating cloth or ceramic sheets to achieve insulation and thermal conductivity. The thermally conductive insulating cloth has low thermal conductivity, which is not conducive to heat dissipation, and the ceramic sheet is fragile and difficult to assemble. The IGBT single tube uses an external temperature sensor to detect the IGBT temperature. Affected by the ambient temperature and thermal resistance, the external temperature sensor cannot accurately detect the IGBT temperature, and the IGBT is prone to overheating and failure. In addition, the related art two-in-one controller for automotive electric compressors and electric heaters requires multiple discrete IGBT devices to be installed on the radiator, which has low installation efficiency and low heat dissipation efficiency.

[0061] Based on this, the technical solutions provided by various embodiments of the present disclosure are described below in conjunction with Figures 1 and 2.

[0062] An embodiment of this specification proposes a power module, which is used to drive a motor and an electric heater. As shown in Figure 1, the power module includes a motor control part and an electric heater control part; the motor control part includes multiple power chips for driving the motor, and the electric heater control part includes multiple power chips for driving the electric heater. The multiple power chips in the motor control part and the multiple power chips in the electric heater control part are integrated in the power module.

[0063] The power module of this embodiment integrates the power chip for controlling the motor and the power chip for controlling the electric heater into one module, and uses a single power module to realize the functions of controlling the motor and the electric heater, which is conducive to reducing the volume of the power module, and then reducing the volume of the two-in-one controller of the electric compressor and the electric heater, simplifying the production process of the two-in-one controller of the electric compressor and the electric heater. At the same time, the power module of this embodiment integrates the power chip for controlling the motor and the power chip for controlling the electric heater. It only needs to install the power module on the radiator to realize the heat dissipation of multiple power chips. There is no need to install the power chips one by one on the radiator for heat dissipation, which improves the installation efficiency of the power module and the heat dissipation efficiency.

[0064] In some embodiments, the power chip of the motor control unit includes at least one of an IGBT chip, a SiC chip, a MOSFET chip, and a GaN chip. That is, the power chip integrated into the power module of this embodiment is not limited to IGBTs, but may also include SiC (silicon carbide), MOSFET (metal-oxide-semiconductor field-effect transistor), and GaN (gallium nitride).

[0065] In some embodiments, the plurality of power chips of the electric heater control part include at least one of an IGBT chip, a SiC chip, a MOSFET chip, and a GaN chip.

[0066] In some embodiments, the power module further includes multiple temperature sensors, which are built into the power module and used to detect the temperatures of the multiple power chips of the motor control part and the multiple power chips of the electric heater control part.

[0067] In this way, by building a temperature sensor into the power module, the temperature of the power chip inside the power module can be accurately detected, reducing the risk of thermal failure of the power chip.

[0068] It is understandable that the temperature sensor and multiple power chips can be packaged together in a power module through packaging technologies such as reflow soldering, aluminum wire ultrasonic bonding and other processes.

[0069] In some embodiments, the power module further includes a copper-clad ceramic substrate, and the plurality of power chips of the motor control part and the plurality of power chips of the electric heater control part are mounted on the copper-clad ceramic substrate.

[0070] In this way, multiple power chips of the motor control part and multiple power chips of the electric heater control part are installed on the copper-clad ceramic substrate. The power chips in the copper-clad ceramic substrate and the heat dissipation surface of the copper-clad ceramic substrate are insulated. The power module can be directly installed on the heat sink during use. There is no need to add thermal insulating cloth or ceramic sheets to the outside of the power module to achieve insulation and heat conduction, which avoids the increase in thermal resistance of the module caused by adding thermal insulating cloth or ceramic sheets, is conducive to increasing the thermal conductivity efficiency of each power chip and reducing the risk of thermal failure of each power chip.

[0071] In some embodiments, the plurality of power chips of the motor control portion include a first chip unit, a second chip unit, a third chip unit, a fourth chip unit, a fifth chip unit, and a sixth chip unit.

[0072] The plurality of power chips of the electric heater control portion include a seventh chip unit, an eighth chip unit, and a ninth chip unit.

[0073] In some embodiments, each power chip is a chip including a first port, a second port, and a third port, wherein the first port is a gate; the second port is a collector; and the third port is an emitter.

[0074] In some embodiments, the power module includes at least 32 pins, which are sequentially from the first pin to the thirty-second pin.

[0075] The first port of the first chip unit is connected to the first pin of the power module, the second port of the first chip unit is respectively connected to the second port of the second chip unit, the second port of the third chip unit, the second port of the seventh chip unit and the eighteenth pin of the power module; the third port of the first chip unit is respectively connected to the second pin of the power module, the second port of the fourth chip unit and the nineteenth pin of the power module.

[0076] The first port of the second chip unit is connected to the third pin of the power module; the third port of the second chip unit is respectively connected to the fourth pin of the power module, the second port of the fifth chip unit and the twentieth pin of the power module; the first port of the third chip unit is connected to the fifth pin of the power module.

[0077] The third port of the third chip unit is respectively connected to the sixth pin of the power module, the second port of the sixth chip unit, and the twenty-first pin of the power module.

[0078] The first port of the fourth chip unit is connected to the seventh pin of the power module; the third port of the fourth chip unit is respectively connected to the eighth pin and the twenty-second pin of the power module; the first port of the fifth chip unit is connected to the ninth pin of the power module.

[0079] The third port of the fifth chip unit is connected to the tenth pin and the twenty-third pin of the power module respectively; the first port of the sixth chip unit is connected to the eleventh pin of the power module.

[0080] The third port of the sixth chip unit is connected to the twelfth pin and the twenty-fourth pin of the power module respectively; the first port of the seventh chip unit is connected to the thirteenth pin of the power module.

[0081] The emitter of the seventh chip unit is connected to the fourteenth pin and the twenty-fifth pin of the power module respectively; the first port of the eighth chip unit is connected to the fifteenth pin of the power module; and the second port of the eighth chip unit is connected to the twenty-sixth pin of the power module.

[0082] The third port of the eighth chip unit is connected to the third port of the ninth chip unit, the seventeenth pin of the power module, and the twenty-eighth pin of the power module respectively.

[0083] The first port of the ninth chip unit is connected to the sixteenth pin of the power module.

[0084] The second port of the ninth chip unit is connected to the twenty-seventh pin of the power module.

[0085] In some embodiments, the first chip unit, the second chip unit, the third chip unit, the fourth chip unit, the fifth chip unit, and the sixth chip unit all include IGBT chips, and the seventh chip unit, the eighth chip unit, and the ninth chip unit all include IGBT chips.

[0086] In some embodiments, the first chip unit is a first IGBT chip; the second chip unit is a second IGBT chip; the third chip unit is a third IGBT chip; the fourth chip unit is a fourth IGBT chip; the fifth chip unit is a fifth IGBT chip; and the sixth chip unit is a sixth IGBT chip. Referring to FIG. 1 , 1 represents the first IGBT chip, 2 represents the second IGBT chip, 3 represents the third IGBT chip, 4 represents the fourth IGBT chip, 5 represents the fifth IGBT chip, and 6 represents the sixth IGBT chip, totaling six IGBT chips, forming a three-phase full-bridge controlled motor. 7 represents the seventh IGBT chip, 8 represents the eighth IGBT chip, and 9 represents the ninth IGBT chip, totaling three IGBT chips, for controlling an electric heater.

[0087] In other embodiments, the first chip unit includes a first IGBT chip and a first FRD chip connected in anti-parallel; the second chip unit includes a second IGBT chip and a second FRD chip connected in anti-parallel; the third chip unit includes a third IGBT chip and a third FRD chip connected in anti-parallel; the fourth chip unit includes a fourth IGBT chip and a fourth FRD chip connected in anti-parallel; the fifth chip unit includes a fifth IGBT chip and a fifth FRD chip connected in anti-parallel; the sixth chip unit includes a sixth IGBT chip and a sixth FRD chip connected in anti-parallel; the seventh chip unit is a seventh IGBT chip; the eighth chip unit is an eighth IGBT chip; and the ninth chip unit is a ninth IGBT chip. Referring to FIG. 2 , 1 represents the first chip unit, 2 represents the second chip unit, 3 represents the third chip unit, 4 represents the fourth chip unit, 5 represents the fifth chip unit, and 6 represents the sixth chip unit, forming a three-phase full-bridge controlled motor. 7 represents the seventh chip unit, 8 represents the eighth chip unit, and 9 represents the ninth chip unit, which are three IGBT chips used to control the electric heater.

[0088] 1 and 2, the gate of the first IGBT chip is connected to the first pin of the power module; the collector of the first IGBT chip is respectively connected to the collector of the second IGBT chip, the collector of the third IGBT chip, the collector of the seventh IGBT chip and the eighteenth pin of the power module; the emitter of the first IGBT chip is respectively connected to the second pin of the power module, the collector of the fourth IGBT chip and the nineteenth pin of the power module; the gate of the second IGBT chip is connected to the third pin of the power module; the emitter of the second IGBT chip is respectively connected to the fourth pin of the power module, the collector of the fifth IGBT chip and the twentieth pin of the power module; the gate of the third IGBT chip is connected to the fifth pin of the power module; the emitter of the third IGBT chip is respectively connected to the sixth pin of the power module, the collector of the sixth IGBT chip and the twenty-first pin of the power module; the gate of the fourth IGBT chip is connected to the seventh pin of the power module; the emitter of the fourth IGBT chip is respectively connected to the eighth pin of the power module and The 22nd pin of the power module; the gate of the fifth IGBT chip is connected to the 9th pin of the power module; the emitter of the fifth IGBT chip is respectively connected to the 10th pin of the power module and the 23rd pin of the power module; the gate of the sixth IGBT chip is connected to the 11th pin of the power module; the emitter of the sixth IGBT chip is respectively connected to the 12th pin of the power module and the 24th pin of the power module; the gate of the seventh IGBT chip is connected to the 13th pin of the power module; the emitter of the seventh IGBT chip is respectively connected to the 14th pin of the power module and the 25th pin of the power module; the gate of the eighth IGBT chip is connected to the 15th pin of the power module; the collector of the eighth IGBT chip is connected to the 26th pin of the power module; the emitter of the eighth IGBT chip is respectively connected to the emitter and the 17th pin of the ninth IGBT chip and the 28th pin of the power module; the gate of the ninth IGBT chip is connected to the 16th pin of the power module; the collector of the ninth IGBT chip is connected to the 27th pin of the power module.

[0089] In some embodiments, the first pin is pin GUH; the second pin is pin KUH; the third pin is pin GVH; the fourth pin is pin KVH; the fifth pin is pin GWH; the sixth pin is pin KWH; the seventh pin is pin GUL; the eighth pin is pin KUL; the ninth pin is pin GVL; the tenth pin is pin KVL; the eleventh pin is pin GWL; the twelfth pin is pin KWL; the thirteenth pin is pin G1; the fourteenth pin is pin K1; the fifteenth pin is pin G2; the sixteenth pin is pin G3; the seventeenth pin is pin K23; the eighteenth pin is pin P; the nineteenth pin is pin U; ​​the twentieth pin is pin V; the twenty-first pin is pin W; the twenty-second pin is pin NU; the twenty-third pin is pin NV; the twenty-fourth pin is pin NW; the twenty-fifth pin is pin E1; the twenty-sixth pin is pin C2; the twenty-seventh pin is pin C3; and the twenty-eighth pin is pin E23.

[0090] In some embodiments, the built-in multiple temperature sensors of the power module include a first temperature sensor and a second temperature sensor; one end of the first temperature sensor is connected to the twenty-ninth pin of the power module, and the other end of the first temperature sensor is connected to the thirtieth pin of the power module; one end of the second temperature sensor is connected to the thirty-first pin of the power module; the other end of the second temperature sensor is connected to the thirty-second pin of the power module, the twenty-ninth pin is pin T1-1, the 30th pin is pin T1-2, the thirty-first pin is pin T2-1, and the thirty-second pin is pin T2-2.

[0091] 1 , 10 denotes a first temperature sensor and 11 denotes a second temperature sensor. Both the first temperature sensor 10 and the second temperature sensor 11 are built-in temperature sensors of the power module and are used to detect the temperature of the power chip in the power module.

[0092] According to an exemplary embodiment, this embodiment provides a method for manufacturing a power module, in which multiple power chips for driving a motor and multiple power chips for driving an electric heater are integrated on a copper-clad ceramic substrate by adopting a process including reflow soldering and ultrasonic bonding of aluminum wires to jointly form a power module. The multiple power chips for driving the motor constitute the motor control part of the power module, and the multiple power chips for driving the electric heater constitute the electric heater control part of the power module.

[0093] In some embodiments, a plurality of temperature sensors are packaged with a power chip in a power module by using a process including reflow soldering and aluminum wire ultrasonic bonding.

[0094] The power module disclosed herein and its manufacturing method are used in the fields of power electronics, motor drive, power semiconductors and semiconductor packaging. The power module disclosed herein overcomes the problem that the power module for controlling the motor and the power module for controlling the heater of the two-in-one controller product for automotive electric compressors and electric heaters are relatively independent. The power module disclosed herein uses power semiconductor module packaging technology, reflow soldering, aluminum wire ultrasonic bonding and other processes to package and integrate multiple IGBT chips into one module. The power module is small in size, which can further reduce the size of the controller; the power module disclosed herein uses DBC (copper-clad ceramic substrate) for heat dissipation, which increases the thermal conductivity of the IGBT and reduces the risk of thermal failure of the IGBT; the installation process of the power module disclosed herein is simple, which is conducive to simplifying the production process of the controller and improving production reliability; the power module disclosed herein has a built-in temperature sensor, which makes temperature detection more accurate and helps reduce the risk of thermal failure of the IGBT.

[0095] In this specification, the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments described later, the description is relatively simple, and the relevant parts can be referred to the partial description of the previous embodiments.

[0096] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above-described embodiments merely represent several implementation methods of the present disclosure. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the patent disclosed herein shall be determined by the appended claims.

Claims

1. A power module, characterized in that: include: The motor control section includes multiple power chips for driving the motor; The electric heater control section includes a plurality of power chips for driving the electric heater; A plurality of power chips of the motor control part and a plurality of power chips of the electric heater control part are integrated into the power module.

2. The power module according to claim 1, wherein: The power chip of the motor control part includes at least one of an IGBT chip, a SiC chip, a MOSFET chip and a GaN chip.

3. The power module according to claim 1, wherein: The multiple power chips of the electric heater control part include at least one of an IGBT chip, a SiC chip, a MOSFET chip and a GaN chip.

4. The power module according to claim 1, wherein: The plurality of power chips of the motor control part include a first chip unit, a second chip unit, a third chip unit, a fourth chip unit, a fifth chip unit, and a sixth chip unit.

5. The power module according to claim 4, characterized in that: The first chip unit, the second chip unit, the third chip unit, the fourth chip unit, the fifth chip unit, and the sixth chip unit all include IGBT chips.

6. The power module according to claim 4, characterized in that: The plurality of power chips of the electric heater control portion include a seventh chip unit, an eighth chip unit, and a ninth chip unit.

7. The power module according to claim 6, characterized in that: The seventh chip unit, the eighth chip unit, and the ninth chip unit are all IGBT chips.

8. The power module according to claim 6, characterized in that: Each of the power chips comprises a first port, a second port and a third port, wherein the first port is a gate; the second port is a collector; and the third port is an emitter.

9. The power module according to claim 8, characterized in that: The first port of the first chip unit is connected to the first pin of the power module; The second port of the first chip unit is respectively connected to the second port of the second chip unit, the second port of the third chip unit, the second port of the seventh chip unit and the eighteenth pin of the power module; The third port of the first chip unit is connected to the second pin of the power module, the second port of the fourth chip unit and the nineteenth pin of the power module respectively; The first port of the second chip unit is connected to the third pin of the power module; The third port of the second chip unit is respectively connected to the fourth pin of the power module, the second port of the fifth chip unit and the twentieth pin of the power module; The first port of the third chip unit is connected to the fifth pin of the power module; The third port of the third chip unit is respectively connected to the sixth pin of the power module, the second port of the sixth chip unit and the twenty-first pin of the power module; The first port of the fourth chip unit is connected to the seventh pin of the power module; The third port of the fourth chip unit is connected to the eighth pin of the power module and the twenty-second pin of the power module respectively; The first port of the fifth chip unit is connected to the ninth pin of the power module; The third port of the fifth chip unit is connected to the tenth pin of the power module and the twenty-third pin of the power module respectively; The first port of the sixth chip unit is connected to the eleventh pin of the power module; The third port of the sixth chip unit is connected to the twelfth pin of the power module and the twenty-fourth pin of the power module respectively.

10. The power module according to claim 9, characterized in that: The first pin is pin GUH; the second pin is pin KUH; the third pin is pin GVH; the fourth pin is pin KVH; the fifth pin is pin GWH; the sixth pin is pin KWH; the seventh pin is pin GUL; the eighth pin is pin KUL; the ninth pin is pin GVL; the tenth pin is pin KVL; the eleventh pin is pin GWL; the twelfth pin is pin KWL; the eighteenth pin is pin P; the nineteenth pin is pin U; ​​the twentieth pin is pin V; the twenty-first pin is pin W; the twenty-second pin is pin NU; the twenty-third pin is pin NV; and the twenty-fourth pin is pin NW.

11. The power module according to claim 10, characterized in that: The first port of the seventh chip unit is connected to the thirteenth pin of the power module; The transmitting stage of the seventh chip unit is respectively connected to the fourteenth pin of the power module and the twenty-fifth pin of the power module; The first port of the eighth chip unit is connected to the fifteenth pin of the power module; The second port of the eighth chip unit is connected to the twenty-sixth pin of the power module; The third port of the eighth chip unit is connected to the third port of the ninth chip unit, the seventeenth pin of the power module, and the twenty-eighth pin of the power module respectively; The first port of the ninth chip unit is connected to the sixteenth pin of the power module; The second port of the ninth chip unit is connected to the twenty-seventh pin of the power module.

12. The power module according to claim 11, characterized in that: The thirteenth pin is pin G1; the fourteenth pin is pin K1; the fifteenth pin is pin G2; the sixteenth pin is pin G3; the seventeenth pin is pin K23; the twenty-fifth pin is pin E1; the twenty-sixth pin is pin C2; the twenty-seventh pin is pin C3; and the twenty-eighth pin is pin E23.

13. The power module according to any one of claims 1 to 12, characterized in that: The power module further includes: A copper-clad ceramic substrate is provided on which the plurality of power chips of the motor control part and the plurality of power chips of the electric heater control part are mounted.

14. The power module according to any one of claims 1 to 12, characterized in that: Also includes: A plurality of temperature sensors are used to detect the temperatures of the plurality of power chips of the motor control part and the temperatures of the plurality of power chips of the electric heater control part.

15. The power module according to claim 14, characterized in that: The plurality of temperature sensors include a first temperature sensor and a second temperature sensor; One end of the first temperature sensor is connected to the twenty-ninth pin of the power module; The other end of the first temperature sensor is connected to the 30th pin of the power module; One end of the second temperature sensor is connected to the thirty-first pin of the power module; The other end of the second temperature sensor is connected to the thirty-second pin of the power module; The twenty-ninth pin is pin T1-1, the thirtieth pin is pin T1-2, the thirty-first pin is pin T2-1, and the thirty-second pin is pin T2-2.

16. A method for manufacturing a power module, characterized in that: A plurality of power chips for driving a motor and a plurality of power chips for driving an electric heater are integrated on a copper-clad ceramic substrate by adopting a process including reflow soldering and aluminum wire ultrasonic bonding to form a power module.

17. The method for manufacturing a power module according to claim 16, wherein: A plurality of temperature sensors, a plurality of power chips for driving a motor, and a plurality of power chips for driving an electric heater are packaged together in the power module by adopting a process including reflow soldering and aluminum wire ultrasonic bonding.

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