Power module, communication device, electric-motor driver, power assembly, and vehicle

Abstract

Provided in the embodiments of the present application are a power module, a communication device, an electric-motor driver, a power assembly and a vehicle. The power module comprises electronic devices. The power module can effectively shorten the length of a heat dissipation path for the heat dissipation of the electronic devices, such that the heat dissipation efficiency of the electronic devices is improved, thus ensuring that the heat generated by the electronic devices is output in a timely manner. The power module comprises a first substrate, a first heat dissipation pad, and a first electronic device. A second surface is recessed to form a first heat dissipation blind recess. The first heat dissipation pad has a first orthographic projection on a first surface, and the first heat dissipation blind recess has a second orthographic projection on the first surface, wherein the first orthographic projection and the second orthographic projection at least partially overlap.

Description

Power modules, communication equipment, motor drives, powertrains, and vehicles

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on February 26, 2024, with application number 202410210621.6 and application name “Power module, communication equipment, motor drive, powertrain and vehicle”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to technical fields such as communications and automobiles, and in particular to a power module, communications equipment, a motor driver, a powertrain, and a vehicle. Background Art

[0003] With the development of artificial intelligence (AI), fifth-generation mobile communication technology (5G), sixth-generation mobile communication technology (6G), and cloud computing, the power consumption of power modules is increasing. To ensure the reliability of power modules, the demand for heat dissipation of power modules is becoming increasingly urgent. Among them, power modules are high-frequency power conversion devices.

[0004] Figure 1 shows an example of the first structure of an existing power module. The power module includes a first base plate 101, and an electronic device 103 is soldered to a first surface 102 via a heat dissipation pad 104. A plurality of vias 105 are provided along the direction Z, extending through the entire first base plate 101. The ends of the vias 105 extend to the first surface 102 and the second surface 106 of the first base plate 101, respectively. The vias 105 are filled with resin and electroplated, and a plurality of copper blocks 107 are soldered to the second surface 106. The heat generated by the electronic device 103 is transferred to the plurality of copper blocks 107 via the heat dissipation pad 104 and the plurality of vias 105, and the heat is then conducted away by the plurality of copper blocks 107.

[0005] Along direction Z, the heat dissipation path for dissipating heat for the electronic device 103 includes a heat dissipation pad 104, a via 105, and a copper block 107, resulting in a long heat dissipation path along direction Z and low heat dissipation efficiency, making it impossible to ensure that the heat generated by the electronic device 103 is promptly discharged through the heat dissipation path.

[0006] Summary of the Invention

[0007] Embodiments of the present application provide a power module, communication equipment, motor driver, powertrain, and vehicle. The power module includes electronic devices. The power module can effectively shorten the length of the heat dissipation path for dissipating heat for the electronic devices, improve the heat dissipation efficiency of the electronic devices, and ensure that the heat generated by the electronic devices is promptly discharged.

[0008] According to a first aspect of an embodiment of the present application, there is provided a power module, comprising a first base plate, a first heat dissipation pad, and a first electronic device. The first base plate comprises a first surface and a second surface positioned opposite to each other. The first electronic device is connected to the first surface via the first heat dissipation pad. The second surface is concave to form a first heat dissipation blind groove. The accommodation cavity of the first heat dissipation blind groove is located inside the first base plate. The notch of the first heat dissipation blind groove is located on the second surface of the first base plate and extends into the first base plate to form the accommodation cavity of the first heat dissipation blind groove. The length of the accommodation cavity is less than the height of the first base plate along a direction perpendicular to the first surface. The first heat dissipation pad has a first orthographic projection on the first surface, and the first heat dissipation blind groove has a second orthographic projection on the first surface, wherein the first orthographic projection and the second orthographic projection at least partially overlap.

[0009] As shown in the adoption aspect, when the first orthographic projection and the second orthographic projection at least partially overlap, it is effectively ensured that the first heat dissipation blind groove can successfully conduct away the heat absorbed by the first heat dissipation pad, ensuring the successful heat dissipation of the first electronic device. It can be understood that part of the heat emitted by the first electronic device is dissipated through the heat dissipation pad, and the other part of the heat is conducted to the first heat dissipation blind groove, which is then conducted away by the first heat dissipation blind groove, thereby achieving timely heat dissipation of the first electronic device. Moreover, the first heat dissipation blind groove is formed by the second surface of the first base plate being concave, so the length of the heat dissipation path between the first heat dissipation blind groove and the first electronic device is effectively shortened, reducing thermal resistance and improving the heat dissipation efficiency of the first electronic device.

[0010] Based on the first aspect, in an optional implementation, the first heat dissipation blind slot has a receiving cavity, and the cavity wall of the receiving cavity includes a metal layer. In this implementation, the cavity wall of the first heat dissipation blind slot includes a metal layer, which effectively improves the heat dissipation efficiency of the first heat dissipation blind slot.

[0011] Based on the first aspect, in an optional implementation, the power module further includes a thermally conductive module, the thermally conductive module being made of a thermally conductive material, located within the accommodating cavity of the first heat dissipation blind slot, and connected to the accommodating cavity. In this implementation, heat from the first electronic device is transferred to the first thermally conductive module, thereby allowing the first thermally conductive module to dissipate heat, improving heat dissipation efficiency and achieving low thermal resistance heat conduction between the first electronic device and the first thermally conductive module.

[0012] Based on the first aspect, in an optional implementation, the first base plate and the first electronic device are located within the housing of the power module. The power module further includes a heat dissipation layer located between the thermally conductive module and the housing, with one side of the heat dissipation layer in contact with the thermally conductive module and the other side of the heat dissipation layer in contact with the housing. With this implementation, the heat dissipation layer can promptly absorb heat from the first electronic device and dissipate it through the housing, ensuring timely heat dissipation of the first electronic device.

[0013] Based on the first aspect, in an optional implementation, the first base plate includes a first region located between the first heat dissipation pad and the bottom of the first heat dissipation blind slot. A plurality of vias are provided through the first region, each via having a first opening and a second opening at each end. The first opening extends to the first heat dissipation pad, and the second opening extends to the bottom of the first heat dissipation blind slot. With this implementation, the plurality of vias can establish a heat dissipation path between the first electronic component and the first heat dissipation blind slot, thereby dissipating heat from the first electronic component.

[0014] Based on the first aspect, in an optional implementation, the power module further includes a second heat dissipation pad and a second electronic device, the second electronic device being connected to the first surface via the second heat dissipation pad, the second heat dissipation pad having a third orthographic projection on the first surface, wherein the first orthographic projection and the third orthographic projection are isolated from each other, and the second orthographic projection and the third orthographic projection at least partially overlap. With this implementation, a single first heat dissipation blind slot can simultaneously dissipate heat for multiple electronic devices, reducing the difficulty of manufacturing the power module and improving manufacturing efficiency.

[0015] Based on the first aspect, in an optional implementation, the power module further includes a second heat dissipation pad and a second electronic device, the second electronic device being connected to the first surface via the second heat dissipation pad, the second surface being concave to form a second heat dissipation blind groove, and the orthographic projection of the second heat dissipation pad on the first surface at least partially overlapping the orthographic projection of the second heat dissipation blind groove on the first surface. With this implementation, different heat dissipation blind grooves dissipate heat for different electronic devices, ensuring reliable heat dissipation and allowing the heat from each electronic device to be dissipated in a timely manner.

[0016] Based on the first aspect, in an optional implementation, the power module further includes a second base plate, a third heat dissipation pad, and a third electronic device, the third electronic device being connected to the first surface of the second base plate via the third heat dissipation pad, the second surface of the second base plate being concave to form a third heat dissipation blind groove, the orthographic projection of the third heat dissipation pad on the first surface of the second base plate at least partially overlapping the orthographic projection of the third heat dissipation blind groove on the first surface of the second base plate; the power module further includes a heat sink, the heat sink being located between the second surface of the first base plate and the second surface of the second base plate, the first boss of the heat sink being inserted into the first heat dissipation blind groove, and the second boss of the heat sink being inserted into the third heat dissipation blind groove. With this implementation, the heat sink can increase the contact area between the first heat dissipation blind groove and the third heat dissipation blind groove and the outside world. Then, when heat from each electronic device is conducted to the first heat dissipation blind groove and the third heat dissipation blind groove, the heat sink absorbs the heat from the first heat dissipation blind groove and the third heat dissipation blind groove and dissipates the heat, effectively improving heat dissipation efficiency.

[0017] Based on the first aspect, in an optional implementation, the first boss contacts the wall of the first heat dissipation blind groove, the second boss contacts the wall of the third heat dissipation blind groove, the extension direction of the first heat dissipation blind groove wall intersects the first surface of the first base plate, and the extension direction of the third heat dissipation blind groove wall intersects the first surface of the second base plate. Using this implementation, the first boss contacts the wall of the first heat dissipation blind groove, and the second boss contacts the wall of the third heat dissipation blind groove, thereby effectively improving the heat dissipation efficiency of the heat sink for various electronic devices.

[0018] Based on the first aspect, in an optional implementation, the power module further includes a first thermally conductive layer and a second thermally conductive layer, wherein the first thermally conductive layer is located between the bottom of the first blind heat dissipation slot and the first boss, and the second thermally conductive layer is located between the bottom of the third blind heat dissipation slot and the second boss. In this implementation, the thermally conductive layer effectively improves the efficiency of the heat sink in absorbing heat from the first and second electronic devices, thereby improving the heat dissipation efficiency of the power module.

[0019] A second aspect of an embodiment of the present application provides a communication device, comprising a baseband processor, a radio frequency transceiver, a power module, and an antenna connected in sequence, wherein the power module is as described in any one of the first aspects above; the communication device comprises P transmitting channels and J receiving channels, wherein P and J are any integers greater than or equal to 1, and each of the J receiving channels comprises a receiver in the radio frequency transceiver, a receiving module in the power module, and a receiving antenna in the antenna; each of the P transmitting channels comprises a transmitter in the radio frequency transceiver, a transmitting module in the power module, and a transmitting antenna in the antenna.

[0020] A third aspect of an embodiment of the present application provides a motor driver, comprising a capacitor and a power module as described in any one of the first aspects above, wherein the power module is electrically connected to the capacitor, the capacitor is used to provide voltage to the power module, and the power module is used to convert direct current into alternating current, and the alternating current is used to drive a motor.

[0021] A fourth aspect of an embodiment of the present application provides a powertrain, comprising a motor and a motor driver as described in the third aspect connected to the motor, the motor driver being used to provide alternating current to the motor, and the motor being used to convert the alternating current from the motor driver into kinetic energy.

[0022] A fifth aspect of an embodiment of the present application provides a vehicle, comprising wheels and a powertrain as described in the fourth aspect connected to the wheels, wherein the powertrain is used to provide power to the wheels to drive the wheels to move. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a diagram showing a first structural example of an existing power module;

[0024] FIG2 is a side view of a first embodiment of a power module provided in the present application;

[0025] FIG3 is a bottom view of the structure of the power module shown in FIG2;

[0026] FIG4 is a side view of a second embodiment of a power module provided in the present application;

[0027] FIG5 is a side view of a third embodiment of a power module provided in the present application;

[0028] FIG6 is a bottom view of the power module shown in FIG4;

[0029] FIG7 is a side view of a fourth embodiment of a power module provided in the present application;

[0030] FIG8 is a side view illustrating the structure of a fifth embodiment of a power module provided in the present application;

[0031] FIG9 is a diagram illustrating a second structural example of an existing power module;

[0032] FIG10 is a diagram illustrating a second structural example of an existing power module;

[0033] FIG11 is a diagram showing a third structural example of an existing power module;

[0034] FIG12 is a diagram illustrating an example of forming a heat conduction module in a power module provided by the present application;

[0035] FIG13 is a top view of a first exemplary structure of a power module provided in this application;

[0036] FIG14 is a diagram illustrating an example of heat dissipation of the power module shown in FIG13 ;

[0037] FIG15 is a structural diagram of an embodiment of a motor driver provided by the present application;

[0038] FIG16 is a structural diagram of an embodiment of a powertrain provided in this application;

[0039] FIG17 is a structural diagram of an embodiment of a vehicle provided by the present application;

[0040] FIG18 is a structural example diagram of the communication device provided in this application. DETAILED DESCRIPTION

[0041] The present application provides a power module, which includes a first base plate and an electronic device connected to the surface of the first base plate. The power module provided in the embodiment of the present application can improve the heat dissipation efficiency of the electronic device. Among them, the power module can be various devices with high heat dissipation requirements. The power module can be used to make high-frequency devices, power devices, optical communication modules, high-frequency communication transceiver components and other high-heat flux density devices. The power module can also be a switching power supply. A switching power supply, also known as a switching power supply, a switching converter or a switching circuit, is a type of power supply whose function is to convert a voltage of a certain level into a voltage or current required by the user end. The input of the switching power supply is mostly an AC power supply (such as a mains power supply) or a DC power supply, and the output is mostly a device that requires a DC power supply. The device that requires a DC power supply can be a personal computer, etc., and the switching power supply performs voltage and current conversion between the two. It is widely used in various fields such as industrial automation control, communication equipment, medical equipment, digital products, etc.

[0042] The power module provided in the embodiment of the present application can effectively improve the heat dissipation efficiency, which meets the increasing heat dissipation requirements for power modules in the context of the increasing power consumption of AI, 5G, 6G, cloud computing, supercomputing centers, servers, and routers. Figure 2 is a side view structural example diagram of the first embodiment of the power module provided by the present application. The power module shown in this embodiment includes a first base plate 201, M electronic devices, and M heat dissipation pads. M is an arbitrary integer not less than 1, and this embodiment does not limit the value of M. The example shown in Figure 2 takes M equal to 2 as an example, then the power module includes a first electronic device 210 and a second electronic device 220, and the power module also includes a first heat dissipation pad 211 and a second heat dissipation pad 221.

[0043] Specifically, the first base plate 201 may be a printed circuit board (PCB), a substrate or a substrate, etc. The first base plate 201 may also be a high thermal conductivity plate material, such as ST110G, ST115, etc., with a thermal conductivity coefficient of about 1 watt / meter degree (W / (m·K)). The first base plate 201 shown in this embodiment has a first surface 202 and a second surface 203 that are opposite to each other along direction Z. The direction Z is perpendicular to the first surface 202 of the first base plate 201, and the first surface 202 is parallel to the plane XY. The plane XY includes the direction X and the direction Y, the direction X is perpendicular to the direction Y, and the direction Z is perpendicular to the plane XY. This embodiment takes the direction Z being perpendicular to the first surface 202 as an example. In other examples, the direction Z only needs to intersect with the first surface 202, and the angle between the direction Z and the first surface 202 is not limited. It can be understood that when direction Z intersects first surface 202, first surface 202 and second surface 203 are two surfaces located opposite each other on first base plate 201. When first base plate 201 is a PCB, first base plate 201 includes one or more layers of material, with conductive traces arranged on one or both sides of each material. This embodiment does not limit the type of material; for example, the material may be a paper-based material, a glass fiber cloth-based material, a composite-based material, a ceramic-based material, a metal core-based material, etc.

[0044] The first electronic device 210 is connected to the first surface 202 of the first base plate 201 via a first heat dissipation pad 211, and the second electronic device 220 is connected to the first surface 202 of the first base plate 201 via a second heat dissipation pad 221. The first heat dissipation pad 211 and the second heat dissipation pad 221 are located at different positions on the first surface 202. Taking the first electronic device 210 as an example, the first electronic device 210 can be a power chip. The power chip can be made of silicon (Si), germanium (Ge), gallium arsenide (GaAs), indium phosphide (InP), or a wide-bandgap semiconductor. The wide-bandgap semiconductor can be silicon carbide (SiC) or gallium nitride (GaN). For example, when the first electronic device 210 is a wide-bandgap semiconductor, the power module can be developed in the direction of high power, high density, and high integration. It should be noted that this embodiment does not limit the type of the first electronic device 210. For example, the first electronic device 210 can be any type of electronic component, such as a radio frequency (RF) power amplifier, a digital signal amplifier, an analog signal amplifier, a hybrid vehicle insulated-gate bipolar transistor (IGBT) module, a metal-oxide-semiconductor field-effect transistor (MOSFET), a high-performance light-emitting diode (LED), a resistor, a capacitor, or an inductor. For the description of the second electronic device 220, please refer to the description of the first electronic device 210, and the details are not repeated here. Taking the first heat dissipation pad 211 as an example, the first heat dissipation pad 211 can solder the first electronic device 210 to the first surface 202 of the first base plate 201, and the first heat dissipation pad 211 can also dissipate heat for the first electronic device 210, thereby improving the heat dissipation efficiency of the first electronic device 210, reducing the operating temperature of the first electronic device 210, and improving the reliability and stability of the first electronic device 210. For the description of the second heat dissipation pad 221 , please refer to the description of the first heat dissipation pad 211 , and detailed description is omitted here.

[0045] Continuing with the example of the first electronic device 210, to improve the heat dissipation efficiency of the first electronic device 210, the second surface 203 of the first base plate 201 shown in this embodiment is recessed to form a first heat dissipation blind slot 231. The accommodation cavity of the first heat dissipation blind slot 231 is located within the first base plate 201. The notch of the first heat dissipation blind slot 231 is located on the second surface 203 of the first base plate 201 and extends into the first base plate 201 to form the accommodation cavity of the first heat dissipation blind slot 231. In addition, along the direction Z, the cavity length of the accommodation cavity is less than the height of the first base plate 201. That is, along the direction Z, the first heat dissipation blind slot 231 does not penetrate the first base plate 201. In this embodiment, the first heat dissipation pad 211 has a first orthographic projection on the first surface 202, and the first heat dissipation blind slot 231 has a second orthographic projection on the first surface 202. To dissipate heat for the first electronic device 210, the first orthographic projection and the second orthographic projection of the first heat dissipation blind slot 231 at least partially overlap. Specifically, the first orthographic projection refers to the orthographic projection formed on the first surface 202 by multiple parallel projection lines irradiating the first heat dissipation pad 211. Each projection line is perpendicular to the first surface 202. Similarly, the second orthographic projection refers to the orthographic projection formed on the first surface 202 by multiple parallel projection lines irradiating the first heat dissipation blind groove 231. The first heat dissipation pad 211 absorbs heat from the first electronic device 210. When the first orthographic projection and the second orthographic projection at least partially overlap, the first heat dissipation blind groove 231 can successfully conduct the heat absorbed by the first heat dissipation pad 211, ensuring successful heat dissipation of the first electronic device 210.

[0046] The first blind heat sink slot 231 shown in this embodiment is a metalized blind heat sink slot. Specifically, after the first blind heat sink slot 231 is formed, a metal layer 232 is plated on the cavity wall of the first blind heat sink slot 231. This metal layer 232 can be formed by electroplating, but the specific method is not limited thereto. For example, this metal layer 232 can also be formed by chemical plating or vacuum plating. This metal layer 232 can effectively improve the heat dissipation efficiency of the first electronic device 210.

[0047] The first base plate 201 shown in this embodiment includes a first area, which is located between the first heat dissipation pad 221 and the bottom of the first heat dissipation blind groove 231 along the direction Z. The first area is provided with a plurality of through-vias 233 along the direction Z. Each through-via 233 connects the first heat dissipation pad 221 and the bottom of the first heat dissipation blind groove 231, and the through-via 233 passes through the first area along the direction Z. Specifically, the two ends of the through-via 233 have a first opening and a second opening along the direction Z. The first opening extends to the first heat dissipation pad 221. The second opening extends to the bottom of the first heat dissipation blind groove 231. Then, the through-via 233 realizes the conduction of the heat dissipation path along the direction Z between the first heat dissipation pad 221 and the first heat dissipation blind groove 231. Part of the heat generated by the first electronic device 210 is dissipated through the heat dissipation pad 221, and the remaining heat is conducted to the first heat dissipation blind groove 231 through multiple vias 233. This heat is then conducted away from the first heat dissipation blind groove 231, thereby achieving heat dissipation for the first electronic device 210. The first heat dissipation blind groove 231 shown in this embodiment is formed by being recessed into the second surface 203 of the first base plate 201. This effectively shortens the heat dissipation path length along direction Z between the first heat dissipation blind groove 231 and the first electronic device 210, reduces thermal resistance, and improves the efficiency of heat dissipation for the first electronic device 210. Furthermore, the metal layer 232 of the first heat dissipation blind groove 231 has good thermal conductivity. Therefore, when the heat generated by the first electronic device 210 is transferred to the first heat dissipation blind groove 231, the heat can be dissipated through the metal layer 232, thereby improving heat dissipation efficiency. This embodiment does not impose any restrictions on the depth of the via hole 233 along the Z direction, as long as the via hole 233 can achieve continuity in the heat dissipation path between the first heat dissipation pad 221 and the first heat dissipation blind slot 231. For example, the depth of the via hole 233 along the Z direction is less than the thickness of the first base plate 201. To ensure the mechanical strength of the first base plate 201 and the heat dissipation efficiency of the first electronic device 210, the depth of the via hole 233 along the Z direction is ≥ 1 / 2 of the board thickness, where the board thickness refers to the thickness of the first base plate 201 along the Z direction.

[0048] Figure 3 is a bottom-up structural diagram of the power module shown in Figure 2 . The signal pin 301 of the first electronic device 210 extends from the second surface 202 of the first base plate 201. The signal pin 301 is used to connect the circuits of the first electronic device 210 and transmit signals. The position of the first heat dissipation blind slot 231 on the second surface 202 shown in this embodiment is different from the position of the signal pin 301 on the second surface. That is, the first heat dissipation blind slot 231 on the second surface 202 avoids the position of the signal pin 301 on the second surface. Therefore, the orthographic projection of the first heat dissipation blind slot 231 on the first surface 202 is separated from the orthographic projection of the signal pin 301 on the first surface 202. It should be noted that in other examples, the position of the first heat dissipation blind slot 231 on the second surface 202 may not avoid the position of the signal pin 301, and this is not limited to this specific embodiment. For the description of the structure of the second heat dissipation blind slot 241 used to dissipate heat for the second electronic device 220, please refer to the description of the structure of the first heat dissipation blind slot 231 used to dissipate heat for the first electronic device 210, and the details are not repeated here.

[0049] This embodiment does not limit how the heat extracted from the first heat dissipation blind slot 231 is dissipated from the power module. For example, the power module can reliably dissipate the heat extracted from the first heat dissipation blind slot 231 through self-cooling, air cooling, or liquid cooling. Self-cooling means that the heat from the first electronic device 210 in the first heat dissipation blind slot 231 is dissipated through the natural circulation of the surrounding cooling medium. Air cooling means that the power module includes a fan (also called a blower) that can increase the rate of air flow through the first heat dissipation blind slot 231 per unit time to achieve heat exchange between the inside of the power module and the external air, thereby dissipating the heat in the first heat dissipation blind slot 231. Liquid cooling means that the first heat dissipation blind slot 231 is connected to a liquid cooling pipe, and liquid cooling flows in the liquid cooling pipe. The flowing liquid cooling can remove the heat from the first heat dissipation blind slot 231. It should be understood that this embodiment does not limit how the heat in the first heat dissipation blind slot 231 is dissipated.

[0050] FIG4 is a side view of the structure of the second embodiment of the power module provided by the present application. The power module shown in this embodiment includes a first base plate 401, a first electronic device 402, a second electronic device 403, a first heat dissipation pad 431, a second heat dissipation pad 432, a first heat dissipation blind groove 404 and a second heat dissipation blind groove 405. For detailed description, please refer to the corresponding description of FIG2 and FIG3, and the details are not repeated here. The power module shown in this embodiment also includes a first heat conduction module 411 and a second heat conduction module 412. Among them, the first heat conduction module 411 is located in the accommodating cavity of the first heat dissipation blind groove 404, and the second heat conduction module 412 is located in the accommodating cavity of the second heat dissipation blind groove 405. Taking the first heat conduction module 411 as an example, in order to achieve a reliable connection between the first heat conduction module 411 and the first heat dissipation blind groove 404, so as to avoid the first heat conduction module 411 from detaching from the first heat dissipation blind groove 404 during the subsequent use of the power module, a tin sheet 421 is prefabricated on the bottom surface of the first heat dissipation blind groove 404. As shown in Figure 5, Figure 5 is a side view of the third embodiment of the power module provided by the present application. In this embodiment, a tin sheet 501 can also be prefabricated on the wall surface of the cavity of the first heat dissipation blind slot 404. In this case, all gaps between the first heat dissipation blind slot 404 and the first heat conduction module 411 are provided with tin sheets 501. In this embodiment, the position and area of ​​the prefabricated tin sheet are not limited, as long as the prefabricated tin sheet is connected to the first heat dissipation blind slot 404 and the first heat conduction module 411 respectively. Subsequently, the first heat conduction module 411 is soldered to the first heat dissipation blind slot 404 by reflow soldering. The prefabricated tin sheet is heated and melted to form liquid solder paste that fills the gap between the first heat conduction module 411 and the first heat dissipation blind slot 404. In this embodiment, the connection between the first heat conduction module 411 and the first heat dissipation blind slot 404 is achieved by welding, but this is not limited to this. For example, the first heat conduction module 411 and the first heat dissipation blind slot 404 can also be reliably connected by any other means, such as bonding, screwing, snapping, or pressing. This embodiment does not limit the material of the first heat-conducting module 411, as long as the first heat-conducting module 411 is made of a high-thermal-conducting material. For example, the first heat-conducting module 411 can be made of a high-thermal-conducting material such as metal, ceramic, or composite material. If the first heat-conducting module 411 is made of ceramic material, then a thermally conductive gel is applied to the bottom surface of the first heat-dissipating blind groove 404, and the thermally conductive gel is located between the bottom of the first heat-dissipating blind groove 404 and the first heat-conducting module 411 made of ceramic. Through reflow soldering, the thermally conductive gel is cured by heat, and the cured thermally conductive gel bonds the first heat-conducting module 411 made of ceramic to the interior of the accommodating cavity of the first heat-dissipating blind groove 404.

[0051] As shown in Figures 4 and 6, Figure 6 is an example diagram of the bottom-up structure of the power module shown in Figure 4. A tin block 601 is prefabricated on the second surface of the first base plate 401, near the notch of the first heat dissipation blind slot 404. This embodiment does not limit the number of tin blocks 601, as long as multiple tin blocks 601 are on the second surface of the first base plate 401, near the notch of the first heat dissipation blind slot 404. For example, the multiple tin blocks 601 shown in this example surround the notch of the first heat dissipation blind slot 404. Using the structure shown in this example, when the power module is reflow soldered, the tin block 601 is heated and melted to form liquid solder paste, which extends to the first heat dissipation blind slot 404. The liquid solder paste can flow along the groove wall of the first heat dissipation blind slot 404 to between the first heat dissipation blind slot 404 and the first heat conduction module 411, thereby achieving welding between the first heat dissipation blind slot 404 and the first heat conduction module 411.

[0052] In the examples shown in Figures 4 to 6, because solder paste is present between the first heat dissipation blind slot 404 and the first heat conduction module 411, the solder paste has thermal conductivity. As a result, a portion of the heat emitted by the first electronic device 402 is conducted through the solder paste, while the remaining portion is conducted to the first heat conduction module 411. This allows the first heat conduction module 411 to conduct heat, improving heat dissipation efficiency and achieving low thermal resistance heat conduction between the first electronic device 402 and the first heat conduction module 411. For the description of the second heat dissipation blind slot 405 and the connection between the second heat dissipation blind slot 405 and the second electronic device 403 shown in this embodiment, please refer to the description of the connection between the first heat dissipation blind slot 404 and the first heat dissipation blind slot 404 and the first electronic device 402, and the details are not repeated here.

[0053] Figure 7 is a side view of the structure of the fourth embodiment of the power module provided in this application. The power module shown in this embodiment includes a housing 700, in which a first base plate 701, a first electronic device 702, a second electronic device 703, a first heat dissipation blind groove 704, a second heat dissipation blind groove 705, a first heat dissipation pad 721, a second heat dissipation pad 722, a first heat conduction module 706, and a second heat conduction module 707 are encapsulated. For the specific description of the first base plate 701, the first electronic device 702, the second electronic device 703, the first heat dissipation blind groove 704, the second heat dissipation blind groove 705, the first heat dissipation pad 721, the second heat dissipation pad 722, the first heat conduction module 706, and the second heat conduction module 707, please refer to Figures 4 to 6, and no further details will be given. The power module shown in this embodiment also includes a first heat dissipation layer 711 and a second heat dissipation layer 712. Along the direction Z, the first heat dissipation layer 711 is located between the first heat-conducting module 706 and the housing 700, and the second heat dissipation layer 712 is located between the second heat-conducting module 707 and the housing 700. For example, one side of the first heat dissipation layer 711 shown in this embodiment is in contact with the first heat-conducting module 706, and the other side of the first heat dissipation layer 711 is in contact with the housing 700. Taking the first heat dissipation layer 711 as an example, the first heat dissipation layer 711 is made of a thermally conductive material, so that the heat of the first electronic device 702 is dissipated from the housing 700 through the first heat dissipation blind groove 704, the first heat-conducting module 706 and the first heat dissipation layer 711, thereby effectively improving the heat dissipation efficiency. This embodiment does not limit the specific material of the first heat dissipation layer 711. For example, the first heat dissipation layer 711 can be made of a thermal pad, thermal gel, thermal grease, etc. Thermal pads (also known as thermal conductive silicone sheets, thermal conductive silicone pads, thermal conductive silicone pads, etc.) are high-performance gap-filling thermal conductive materials with good viscosity, flexibility, good compression properties, and excellent thermal conductivity. Thermal gel (also known as heat sink gel, processor gel, thermal adhesive, thermal conductive silicone rubber, etc.) is a gel-like silicone-based thermal conductive material. Thermal grease (also known as heat dissipation paste, thermal paste) is a highly thermally conductive insulating silicone material.

[0054] The above example takes the example that the number of heat dissipation blind slots included in the power module is equal to the number of electronic devices, that is, one heat dissipation blind slot is only used to dissipate heat for one electronic device. The heat dissipation blind slot shown in this embodiment is used to dissipate heat for at least two electronic devices. Figure 8 is an example diagram of the side structure of the fifth embodiment of the power module provided in this application. The power module shown in this embodiment includes a housing 800, which encapsulates a first base plate 801, a first electronic device 802, a second electronic device 803, a first heat dissipation blind slot 804, a first heat dissipation pad 811, a second heat dissipation pad 812 and a first heat conduction module 805. For the description of the housing 800, the first electronic device 802 and the second electronic device 803 shown in this embodiment, please refer to any embodiment shown in Figures 2 to 7, and the details will not be repeated. The difference between this embodiment and that shown in Figures 4 to 6 is that the first heat dissipation blind slot 804 shown in this embodiment is used to dissipate heat for multiple electronic devices (for example, the first electronic device 802 and the second electronic device 803) at the same time. Specifically, the first heat dissipation pad 811 for soldering the first electronic device 802 has a first orthographic projection on the first surface of the first base plate 801. The first heat dissipation blind groove 804 has a second orthographic projection on the first surface of the first base plate 801. The second heat dissipation pad 812 for soldering the second electronic device 803 has a third orthographic projection on the first surface of the first base plate 801. The first orthographic projection and the third orthographic projection are isolated from each other, and the first orthographic projection and the second orthographic projection at least partially overlap, and the third orthographic projection and the second orthographic projection at least partially overlap. For descriptions of the first orthographic projection, the second orthographic projection, and the third orthographic projection, please refer to the corresponding description of FIG. 2 , and details are not repeated here. Specifically, the first base plate 801 includes a first region and a second region. Along direction Z, the first region is located between the first heat dissipation pad 811 and the first heat dissipation blind groove 804. The second region is located between the second heat dissipation pad 812 and the first heat dissipation blind groove 804. For descriptions of the first heat dissipation pad 811 and the second heat dissipation pad 812, please refer to the corresponding description of FIG. 2 , and details are not repeated here. The first area is provided with a plurality of first vias 821 along the direction Z. The second area is provided with a plurality of second vias 822 along the direction Z. For the description of the first vias 821 and the second vias 822, please refer to the corresponding description of Figure 2 and will not be described in detail. The first via 821 connects the first surface of the first base plate 801 and the bottom of the first heat dissipation blind groove 804, and the first via 821 passes through the first area along the direction Z. The first via 821 realizes the conduction of the heat dissipation path between the first heat dissipation pad 811 and the first heat dissipation blind groove 804. Similarly, the second via 822 connects the first surface of the first base plate 801 and the bottom of the first heat dissipation blind groove 804, and the second via 822 passes through the second area along the direction Z. The second via 822 realizes the conduction of the heat dissipation path between the second heat dissipation pad 812 and the first heat dissipation blind groove 804.Then, part of the heat emitted by the first electronic device 802 and the second electronic device 803 is dissipated through the first heat dissipation pad 811 and the second heat dissipation pad 812, and the other part of the heat is conducted to the first heat dissipation blind groove 804 through multiple first vias 821 and the second vias 822. The heat is conducted by the first heat dissipation blind groove 804, thereby achieving the same first heat dissipation blind groove 804 to dissipate heat for the first electronic device 802 and the second electronic device 803 at the same time. For the description of the first heat dissipation blind groove 804 dissipating heat for the first electronic device 802 and the second electronic device 803 at the same time, please refer to the description of the first heat dissipation blind groove dissipating heat for the first electronic device corresponding to Figure 2, and the details will not be repeated. In this embodiment, in order to improve the heat dissipation efficiency, the first heat dissipation blind groove 804 also includes a first heat conduction module 805. For the description of the first heat conduction module 805 and the description of the first heat conduction module 805 improving the heat dissipation efficiency, please refer to the corresponding description of Figures 4 to 6, and the details will not be repeated. The power module shown in this embodiment also includes a first heat dissipation layer 831. Along direction Z, the first heat dissipation layer 831 is located between the first heat conduction module 805 and the housing 800. For the description of the first heat dissipation layer 831 and how it improves heat dissipation efficiency, please refer to the description of the first heat dissipation layer corresponding to FIG.

[0055] To better understand the beneficial effects of the power module provided in the embodiments of the present application, the following description is provided in conjunction with various existing solutions:

[0056] Figure 9 illustrates a second structural example of a conventional power module. The first surface 911 of the conventional first base plate 900 includes an electronic device 901. Multiple vias 902 are provided along the Z direction, extending through the entire first base plate 900 and extending to the second surface 912 of the first base plate 900. In the example shown in Figure 9, vias 902 dissipate heat from the electronic device 901. However, conventional vias 902 extend along the Z direction, extending the entire first base plate 900. Consequently, the length of vias 902 along the Z direction is almost equal to the height of the first base plate 900. This results in a long heat dissipation path along the Z direction between the electronic device 901 and the second surface 912, resulting in poor heat dissipation. In contrast, the present embodiment employs a recessed heat dissipation blind groove in the first base plate, shortening the length of the vias along the Z direction between the electronic device and the blind groove. This, in turn, shortens the heat dissipation path along the Z direction for dissipating heat from the electronic device, improving heat dissipation efficiency. Because the power module shown in this embodiment effectively shortens the heat dissipation path length along direction Z for dissipating heat from the electronic device, it effectively reduces the temperature of the electronic device during operation, ensuring timely dissipation of the operating temperature of the electronic device. In the example shown in FIG9 , to improve heat dissipation efficiency, solder paste 921 can be formed near the opening of the via 902 on the second surface 912 by printing tin through a stencil. The stencil paste 921 flows along the wall of the via 902 to the first surface 911. The thermal conductivity of the stencil paste can improve the efficiency of heat dissipation from the electronic device 901 through the via 902. However, when printing tin through the stencil, the stencil paste can flow to the bright copper area of ​​the first surface 911, affecting the tin printing of the first base plate 900 and thus the layout of other electronic devices on the first surface 911, making it impossible to achieve a high-density layout of electronic devices on the first surface 911. However, as shown in the embodiments of the present application, such as those shown in Figures 4 and 6, even if the tin block 601 becomes liquid tin paste at high temperature, the tin paste flows to the first heat dissipation blind groove 404. However, the first heat dissipation blind groove 404 and the first surface are isolated (i.e., not connected to each other). Therefore, due to the obstruction of the first heat dissipation blind groove 404, the tin paste cannot flow to the first surface, thereby not affecting the layout of other electronic devices on the first surface, thereby helping to achieve a high-density layout of electronic devices.

[0057] Figure 10 illustrates a second structural example of an existing power module. The power module includes a first base plate 1001. An electronic device 1002 is connected to the first surface of the first base plate 1001, and a heat sink 1003 is connected to the second surface of the first base plate 1001. The electronic device 1002 is soldered to the first surface of the first base plate 1001 via a heat dissipation pad 1004. The first base plate 1001 includes a plurality of vias 1005 located between the heat dissipation pad 1004 and the heat sink 1003. Heat generated by the electronic device 1002 is sequentially transferred through the heat dissipation pad 1004, the vias 1005, and the heat sink 1003, and then dissipated through the heat sink 1003. However, the contact area between the heat sink 1003 and the second surface of the first base plate 1001 is very large, making it difficult to achieve a high-density layout of the electronic devices on the first base plate 1001. The heat sink 1003 is soldered to the second surface of the first base plate 1001 during the reflow soldering process. During the reflow soldering process, flux helps the solder wet and connect to the heat sink 1003. However, due to the blocking effect of heat sink 1003, the flux has no escape path for volatilization, preventing the gases generated by the volatilized flux from being discharged smoothly. Consequently, the volatilized gases from the flux increase the void ratio of the solder, reducing heat dissipation efficiency. In the power module shown in this embodiment, the first heat dissipation blind groove for dissipating heat for the first electronic component is recessed into the second surface of the first base plate, and the first thermally conductive module is directly embedded within the accommodating cavity of the first heat dissipation blind groove. Therefore, the first heat dissipation blind groove does not occupy the area of ​​the second surface of the first base plate, and the first heat dissipation blind groove does not affect the high-density layout of electronic components on the first base plate. Furthermore, the provision of the first heat dissipation blind groove shown in this embodiment effectively suppresses the increase in the overall height of the power module in the Z direction to achieve heat dissipation, thereby improving the integration of the power module. The first heat dissipation blind groove does not block the escape path for the flux, improving heat dissipation efficiency, reducing the void ratio of the first base plate, and enhancing reliability.

[0058] Figure 11 shows a third structural example of an existing power module. The existing power module shown in Figure 11 includes a first base plate 1100. The first surface 1111 of the existing first base plate 1100 includes an electronic device 1101. To dissipate heat from the electronic device 1101, a thermally conductive module 1102 (e.g., a copper block) is placed on the first surface 1111. The thermally conductive module 1102 is then pressed together with the first base plate 1100, so that the thermally conductive module 1102 is pressed into the interior of the first base plate 1100 via the first surface 1111. The electronic device 1101 then dissipates heat via the thermally conductive module 1102. However, pressing the thermally conductive module 1102 into the first base plate 1100 through the pressing process increases the processing cost of the first base plate, resulting in low manufacturing efficiency. Furthermore, the interface where the thermally conductive module 1102 contacts the dielectric layer of the first base plate 1100 is susceptible to pressure and delamination, reducing the reliability of the first base plate. In the power module shown in the embodiment of the present application, the first heat conduction module is directly connected to the preset accommodation cavity of the first heat dissipation blind groove, which reduces the complexity of the processing technology of the first base plate, thereby reducing processing success and improving processing efficiency.

[0059] Figure 12 is an example diagram of the formation of a heat conduction module in the power module provided in this application. The heat conduction module shown in Figure 12 is different from the heat conduction module of the embodiment shown in Figures 4 to 6. In the embodiments shown in Figures 4 to 6, the tin block is used to connect the first heat conduction module to the first heat dissipation blind groove, while in the embodiment shown in Figure 12, the heat conduction module is directly formed by the tin block. Specifically, the power module shown in this embodiment includes a first base plate 1201, a first electronic device 1202, a second electronic device 1203, a first heat dissipation pad 1231, a second heat dissipation pad 1232, a first heat dissipation blind groove 1204, and a second heat dissipation blind groove 1205. For a detailed description of the first base plate 1201, the first electronic device 1202, the second electronic device 1203, the first heat dissipation pad 1231, the second heat dissipation pad 1232, the first heat dissipation blind groove 1204, and the second heat dissipation blind groove 1205, please refer to the corresponding description of Figure 2, and no further details will be given. Taking the first blind groove 1204 as an example, prefabricated tin blocks 1211 are surface-mounted on the second surface of the first base plate 1201, near the opening of the first blind groove 1204. For example, as shown in FIG6 , prefabricated tin blocks can be surface-mounted around the opening of the first blind groove 1204 on the second surface of the first base plate 1201. This embodiment does not limit the number of tin blocks 1211. As long as the tin blocks 1211 are close to the opening of the first blind groove 1204, the tin blocks 1211 are liquid solder paste during the reflow soldering process. The solder paste flows along the groove wall of the first blind groove 1204 and fills the receiving cavity of the first blind groove 1204, thereby forming the first heat conduction module 1221 in the receiving cavity. Similarly, on the second surface of the first base plate 1201, near the position of the notch of the second blind groove 1205, a prefabricated tin block 1212 is surface-mounted to ensure that during the reflow soldering process, the tin block 1212 is in liquid solder paste. The solder paste will flow along the groove wall of the second blind groove 1205 and fill the accommodating cavity of the second blind groove 1205 to form a second heat-conducting module 1222 in the accommodating cavity. For the first heat-conducting module 1221 and the second heat-conducting module 1222 formed by solder paste, please refer to Figures 4 to 6 for an explanation of the heat dissipation of electronic devices, and no further details will be given. The first heat-conducting module 1221 shown in this embodiment may include a first heat dissipation layer between the housing, and the second heat-conducting module 1222 may include a second heat dissipation layer between the housing. For an explanation of the first heat dissipation layer and the second heat dissipation layer, please refer to the corresponding explanation in Figure 7, and no further details will be given. In the embodiment shown in Figure 12, a heat dissipation blind groove is used only for heat dissipation of an electronic device as an example. The heat dissipation blind slot shown in this embodiment can dissipate heat for at least two electronic devices. For detailed description, please refer to the corresponding description of Figure 8, and detailed description is omitted here.

[0060] Figure 13 is an example diagram of the first top view structure of the power module provided in this application. The power module shown in this embodiment includes a first base plate 1310 and a second base plate 1320. The first surface of the first base plate 1310 includes a first electronic device 1311 and a second electronic device 1312, and the first surface of the second base plate 1320 includes a third electronic device 1321 and a fourth electronic device 1322. The second surface of the first base plate 1310 is recessed with a first heat dissipation blind groove 1313, and the second surface of the second base plate 1320 is recessed with a third heat dissipation blind groove 1323. For the description of the first base plate 1310, the second base plate 1320, the first electronic device 1311, the second electronic device 1312, the third electronic device 1321, the fourth electronic device 1322, the first heat dissipation blind groove 1313 and the third heat dissipation blind groove 1323, please refer to the above embodiment and will not be repeated in detail. This embodiment takes a first heat dissipation blind groove 1313, which dissipates heat for multiple electronic devices (i.e., the first electronic device 1311 and the second electronic device 1312 shown in this embodiment) at the same time, and a third heat dissipation blind groove 1323, which dissipates heat for multiple electronic devices (i.e., the third electronic device 1321 and the fourth electronic device 1322 shown in this embodiment) at the same time as an example. For specific description, please refer to the corresponding description of Figure 8, and the details are not repeated here. It should be clear that this embodiment does not limit the number of electronic devices that can achieve heat dissipation by a first heat dissipation blind groove. The power module shown in this embodiment also includes a heat sink 1330. The heat sink 1330 is located between the second surface of the first base plate 1310 and the second surface of the second base plate 1320. The heat sink 1330 extends in the direction of the first base plate 1310 to form a first boss 1331. The heat sink 1330 extends in the direction of the second base plate 1320 to form a second boss 1332. The first boss 1331 is inserted into the first heat dissipation blind groove 1313, and the second boss 1332 is inserted into the third heat dissipation blind groove 1323. In this embodiment, the heat sink 1330 is made of metal, for example, aluminum, copper, or other metal. The heat sink 1330 is used to increase the contact area between the first heat dissipation blind groove 1313 and the third heat dissipation blind groove 1323 and the outside world. Therefore, when heat from various electronic components is conducted to the first heat dissipation blind groove 1313 and the third heat dissipation blind groove 1323, the heat sink 1330 absorbs the heat from the first heat dissipation blind groove 1313 and the third heat dissipation blind groove 1323 and dissipates the heat. In order to ensure the heat dissipation efficiency of the radiator 1330 for each electronic device, the first boss 1331 contacts the groove wall of the first heat dissipation blind groove 1313, and the second boss 1332 contacts the groove wall of the third heat dissipation blind groove 1323. The extension direction of the groove wall of the first heat dissipation blind groove 1313 intersects with the first surface of the first base plate 1310, and the extension direction of the groove wall of the third heat dissipation blind groove 1323 intersects with the first surface of the second base plate 1320.For example, as shown in FIG13 , the groove wall of the first heat dissipation blind groove 1313 extends along the X direction. It should be noted that this embodiment takes the groove wall of the first heat dissipation blind groove 1313 extending along the X direction as an example. In other examples, the extension direction of the groove wall of the first heat dissipation blind groove 1313 may have a certain angle with the X direction, which is not specifically limited. For the description of the groove wall of the third heat dissipation blind groove 1323, please refer to the description of the groove wall of the first heat dissipation blind groove 1313, and the details are not repeated here. In order to further improve the heat dissipation efficiency of the heat sink 1330 for each electronic device, the power module also includes a first heat conducting layer 1341 and a second heat conducting layer 1342. The first heat conducting layer 1341 is located between the bottom of the first heat dissipation blind groove 1313 and the first boss 1331, and the second heat conducting layer 1342 is located between the bottom of the third heat dissipation blind groove 1323 and the second boss 1332. The first heat-conducting layer 1341 can then conduct heat from the first electronic device 1311 and the second electronic device 1312 to the first boss 1331, thereby improving the efficiency of the heat sink 1330 in absorbing heat from the first electronic device 1311 and the second electronic device 1312. Similarly, the second heat-conducting layer 1342 can conduct heat from the third electronic device 1321 and the fourth electronic device 1322 to the second boss 1332, thereby improving the efficiency of the heat sink 1330 in absorbing heat from the third electronic device 1321 and the fourth electronic device 1322.

[0061] This embodiment does not limit the method for connecting the heat sink 1330 to the first base plate 1310 and the second base plate 1320. For example, screws 1350 can be inserted through the first base plate 1310, the heat sink 1330, and the second base plate 1320 to securely connect the first base plate 1310, the heat sink 1330, and the second base plate 1320. This ensures that the power module forms an integrated heat dissipation assembly and improves the reliability of the power module structure. It should be noted that this embodiment does not limit the description of the connection method between the first base plate 1310, the heat sink 1330, and the second base plate 1320. For example, the connection can be achieved through any method such as welding, bonding, or snap fastening. This embodiment shows that the distance between the first base plate 1310 and the second base plate 1320 can be controlled by the width of the heat sink 1330 along the X direction. This allows other electronic components to be arranged on the second surface of the first base plate 1310 and the second base plate 1320, thereby increasing the layout density of electronic components on the power module and achieving a high-density layout of electronic components. Optionally, the heat sink 1330 shown in this embodiment may include heat dissipation teeth to improve the efficiency of heat dissipation for electronic devices.

[0062] FIG14 is an example diagram of heat dissipation of the power module shown in FIG13 . For an explanation of the specific structure of the power module shown in FIG14 , please refer to FIG13 , and detailed description is omitted here. The end 1401 of the radiator 1330 is connected to the cooling device 1402. This embodiment does not limit the position of the end 1401 of the radiator 1330, as long as the position of the end 1401 of the radiator 1330 can avoid the first base plate 1310 and the second base plate 1320. As shown in FIG13 , the radiator 1330 absorbs the heat of the electronic components included in the power module, and the cooling device 1402 can dissipate the heat absorbed by the radiator 1330. This embodiment does not limit the type of the cooling device 1402. For example, the cooling device 1402 can dissipate heat by air cooling or liquid cooling. This embodiment takes the cooling device 1402 dissipating heat by liquid cooling as an example. Then, the cooling device 1402 includes a liquid cooling tube inside, and liquid cooling flows inside the liquid cooling tube. The flowing liquid cooling can take away the heat absorbed by the radiator 1330, so as to achieve high-efficiency heat dissipation of the heat absorbed by the radiator 1330.

[0063] The present application also provides a motor driver. FIG15 is a diagram illustrating a structure of an embodiment of the motor driver provided by the present application. The motor driver 1500 includes a capacitor 1501 and at least one power module 1502 as described in any of the above embodiments. The power module 1502 is electrically connected to the capacitor 1501. The capacitor 1501 is used to provide voltage to the power module 1502. The motor driver 1500 is used to invert the direct current output by the power battery pack into alternating current, which is used to drive the motor.

[0064] By adopting the motor driver shown in this embodiment, the heat dissipation efficiency of the power module 1502 is effectively improved, thereby increasing the service life of the motor driver.

[0065] The present application also provides a powertrain. FIG16 is a diagram illustrating an exemplary embodiment of the powertrain provided herein. The powertrain 1600 includes a motor 1601 and a motor driver 1602 connected to the motor 1601. The motor driver 1602 is shown in the embodiment corresponding to FIG15 and is not described in detail here. The motor driver 1602 is configured to provide alternating current (AC) to the motor 1601, and the motor 1601 is configured to convert the AC power from the motor driver 1602 into kinetic energy.

[0066] The present application also provides a vehicle. FIG17 is a structural diagram of an embodiment of a vehicle provided by the present application. In the embodiment of the present application, the vehicle can be an electric vehicle (EV), a pure electric vehicle (PEV) or a battery electric vehicle (BEV), a hybrid vehicle (HEV), a range-extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV), a new energy vehicle, etc.

[0067] In one embodiment, vehicle 1700 is configured for a fully or partially autonomous driving mode. For example, vehicle 1700 can control itself while in autonomous driving mode, and can determine the current state of the vehicle and its surroundings through human operation, determine the possible behavior of at least one other vehicle in the surrounding environment, and determine the confidence level corresponding to the likelihood of the other vehicle executing the possible behavior, and control vehicle 1700 based on the determined information. When vehicle 1700 is in autonomous driving mode, vehicle 1700 can be set to operate without human interaction. Vehicle 1700 may include various systems, each of which may include multiple components. In addition, each system and component of vehicle 1700 may be interconnected by wire or wirelessly.

[0068] The vehicle shown in this embodiment includes a sensor system 1703, which may include several sensors that sense information about the environment surrounding vehicle 1700. For example, sensor system 1703 may include a positioning system (which may be a global positioning system (GPS) system, the Beidou system, or other positioning systems), an inertial measurement unit (IMU), radar, a laser rangefinder, and a camera. Sensor system 1703 may also include sensors for the internal systems of the monitored vehicle 1700 (e.g., an in-vehicle air quality monitor, a fuel gauge, an oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their corresponding characteristics (position, shape, direction, speed, etc.). This detection and recognition is a key function for the safe operation of autonomous vehicle 1700. The positioning system can be used to estimate the geographic location of vehicle 1700. The IMU is used to sense changes in the position and orientation of vehicle 1700 based on inertial acceleration. In one embodiment, the IMU may be a combination of an accelerometer and a gyroscope. Radar can use radio signals to sense objects within the environment surrounding vehicle 1700. In some embodiments, in addition to sensing objects, radar can also be used to sense the speed and / or direction of travel of an object. This embodiment does not limit the specific type of radar; for example, the radar can be a millimeter-wave radar or a lidar. A laser rangefinder can use lasers to sense objects in the environment in which vehicle 1700 is located. In some embodiments, the laser rangefinder may include one or more laser sources, a laser scanner, and one or more detectors, among other system components. A camera can be used to capture multiple images of the surrounding environment of vehicle 1700. The camera can be a still camera, a video camera, a monocular / binocular camera, or an infrared imager.

[0069] The vehicle 1700 also includes an advanced driving assistance system (ADAS) 1701. ADAS1701 senses the surrounding environment at any time while the vehicle is driving, collects data, identifies static and dynamic objects, and combines navigation map data to perform systematic calculations and analysis, thereby allowing the driver to be aware of possible dangers in advance, effectively increasing the comfort and safety of vehicle driving. For example, ADAS1701 can control the vehicle through data obtained by the sensing system 1703. For another example, ADAS1701 can control the vehicle through vehicle computer data, where the vehicle computer data can be the main data on the vehicle dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed information, steering wheel angle information, or vehicle body posture data, etc.

[0070] Vehicle 1700 interacts with external sensors, other vehicles, other computer systems, or users via peripheral devices 1702. Peripheral devices 1702 may include a wireless communication system, an onboard computer, a microphone, and / or speakers. In some embodiments, peripheral devices 1702 provide a means for the user of vehicle 1700 to interact with a user interface. For example, the onboard computer may provide information to the user of vehicle 1700. The user interface may also operate the onboard computer to receive user input. The onboard computer may be operated via a touch screen. In other cases, peripheral devices 1702 may provide a means for vehicle 1700 to communicate with other devices located within the vehicle. For example, a microphone may receive audio (e.g., voice commands or other audio input) from the user of vehicle 1700. Similarly, a speaker may output audio to the user of vehicle 1700.

[0071] A wireless communication system can communicate wirelessly with one or more devices directly or via a communication network. For example, a wireless communication system can use third-generation mobile communication technology (3rd-generation, 3G) cellular communication, such as code division multiple access (CDMA), global system for mobile communications (GSM), general packet radio service (GPRS). A wireless communication system can use fourth-generation mobile communication technology (4G) cellular communication, such as long term evolution (LTE). A wireless communication system can also use fifth-generation mobile communication technology (5G) cellular communication, sixth-generation mobile communication standards (6G). A wireless communication system can communicate using a wireless local area network (WLAN). In some embodiments, a wireless communication system can communicate directly with a device using an infrared link, Bluetooth, or ZigBee. The wireless communication system may also utilize various vehicle communication systems. For example, the wireless communication system may include one or more dedicated short range communications (DSRC) devices that may include public and / or private data communications between vehicles and / or roadside stations.

[0072] Some or all functions of vehicle 1700 are controlled by computer system 1704. Computer system 1704 can control functions of vehicle 1700 based on input received from various systems (e.g., sensing system 1703, ADAS 1701, peripheral devices 1702) and from a user interface. Computer system 1704 may include at least one processor that executes instructions stored in a non-transitory computer-readable medium such as a memory. Computer system 1704 may also be multiple computing devices that control individual components or subsystems of vehicle 1700 in a distributed manner.

[0073] This embodiment does not limit the type of processor. For example, the processor may be one or more field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), system-on-chips (SoCs), central processor units (CPUs), network processors (NPs), digital signal processors (DSPs), microcontrollers (MCUs), programmable logic devices (PLDs), or other integrated chips, or any combination of the above chips or processors. The processor may be located inside the vehicle, or the processor may be located remotely from the vehicle and communicate wirelessly with the vehicle.

[0074] In some embodiments, the memory may contain instructions (e.g., program logic) that are executable by the processor to perform various functions of the vehicle 1700. In addition to instructions, the memory may also store data such as map data, route information, the vehicle's location, direction, speed, and other vehicle data. The information stored in the memory may be used by the vehicle 1700 and the computer system 1704 during operation of the vehicle 1700 in autonomous, semi-autonomous, and / or manual modes.

[0075] Vehicle 1700 shown in this embodiment also includes a powertrain 1705 connected to computer system 1704 and wheels 1706 connected to powertrain 1705. The structure of powertrain 1705 is described in detail in the corresponding embodiment of FIG16 . Powertrain 1705 is used to provide power to wheels 1706, driving them to perform movements such as forward movement, backward movement, and turning.

[0076] An embodiment of the present application also provides a communication device, and Figure 18 is a structural example diagram of the communication device provided by the present application. For the description of the device type of the communication device 1800 shown in this embodiment, please refer to the above embodiment, and no further details are given. In this embodiment, the communication device 1800 is taken as a base station as an example. The communication device 1800 includes a baseband processor 1801, a radio frequency transceiver 1802, a power module 1803 and an antenna 1804 connected in sequence. The communication device 1800 also includes a processor 1805 connected to the baseband processor 1801, the radio frequency transceiver 1802 and the power module 1803, respectively. For the description of the structure of the power module 1803 shown in this embodiment, please refer to any of the above embodiments, and no further details are given.

[0077] The communication device 1800 includes P transmit channels and J receive channels, where P is any integer greater than or equal to 1, and J is any integer greater than or equal to 1. Each of the J receive channels includes a receiver in the RF transceiver 1802, a receive module in the power module 1803, and a receive antenna in the antenna 1804. Each of the P transmit channels includes a transmitter in the power module 1803, a transmit module in the power module 1803, and a transmit antenna in the antenna 1804. Each transmit channel includes at least one switch module. The switch module can be connected between a transmitter and a transmit module, and / or between a transmit module and a transmit antenna, and is used to turn the transmit channel on or off. The receive channel includes at least one switch module. The switch module can be connected between a receiver and a receive module, and / or between a receive module and a receive antenna, and is used to turn the receive channel on or off. The communication device 1800 shown in this example includes a processor 1805 configured to enable at least one transmit channel among the P transmit channels, and the processor 1805 is further configured to enable at least one receive channel among the J receive channels.

[0078] When the processor 1805 turns on the transmit channel, the baseband processor 1801 sends a first digital signal to the transmit channel. The transmitter in the RF transceiver 1802 is used to convert the first digital signal into a first RF signal and send the first RF signal to the transmit module in the power module 1803. The transmit module processes the first RF signal to obtain a processed first RF signal. The transmit module may include a switch, a filter, a power amplifier (PA), a low noise amplifier (LNA), an antenna tuner, or a phase shifter. For example, when the transmit module includes a filter, the filter's processing of the first RF signal refers to filtering the first RF signal. For another example, when the transmit module includes a PA, the PA's processing of the first RF signal refers to amplifying the power of the first RF signal. The transmit module sends the processed first RF signal to a transmit antenna, which is used to transmit the processed first RF signal.

[0079] When processor 1805 turns on the receiving channel, the receiving antenna receives the second RF signal, the receiving module in power module 1803 processes the second RF signal to obtain a processed second RF signal, and sends the processed second RF signal to the receiver in RF transceiver 1802. For a description of the components included in the receiver and how the second RF signal is processed, please refer to the description of the components included in the transmitter and how the first RF signal is processed, and the details are not repeated here. The receiver in RF transceiver 1802 is used to convert the processed second RF signal into a second digital signal and send the second digital signal to baseband processor 1801, which performs digital processing on the second digital signal.

[0080] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A power module, characterized in that: The invention comprises a first base plate, a first heat dissipation pad and a first electronic device, wherein the first base plate comprises a first surface and a second surface positioned opposite to each other, the first electronic device is connected to the first surface via the first heat dissipation pad, the second surface is concave to form a first heat dissipation blind groove, the first heat dissipation pad has a first orthographic projection on the first surface, and the first heat dissipation blind groove has a second orthographic projection on the first surface, wherein the first orthographic projection and the second orthographic projection at least partially overlap.

2. The power module according to claim 1, wherein: The first blind heat dissipation groove has an accommodating cavity, and a cavity wall of the accommodating cavity includes a metal layer.

3. The power module according to claim 1 or 2, characterized in that: The power module further includes a heat-conducting module, which is made of a heat-conducting material. The heat-conducting module is located in the accommodating cavity of the first heat dissipation blind groove, and the heat-conducting module is connected to the accommodating cavity.

4. The power module according to claim 2 or 3, characterized in that: The first base plate and the first electronic device are located inside the housing of the power module. The power module also includes a heat dissipation layer, which is located between the thermal conductive module and the housing. One side of the heat dissipation layer is in contact with the thermal conductive module, and the other side of the heat dissipation layer is in contact with the housing.

5. The power module according to any one of claims 1 to 4, characterized in that: The first base plate includes a first area, which is located between the first heat dissipation pad and the bottom of the first heat dissipation blind groove. A plurality of vias are arranged through the first area, and the two ends of the vias have a first opening and a second opening. The first opening extends to the first heat dissipation pad, and the second opening extends to the bottom of the first heat dissipation blind groove.

6. The power module according to any one of claims 1 to 5, characterized in that: The power module also includes a second heat dissipation pad and a second electronic device, the second electronic device is connected to the first surface through the second heat dissipation pad, and the second heat dissipation pad has a third orthographic projection on the first surface, wherein the first orthographic projection and the third orthographic projection are isolated from each other, and the second orthographic projection and the third orthographic projection at least partially overlap.

7. The power module according to any one of claims 1 to 5, characterized in that: The power module also includes a second heat dissipation pad and a second electronic device, the second electronic device is connected to the first surface through the second heat dissipation pad, the second surface is concave to form a second heat dissipation blind groove, and the orthographic projection of the second heat dissipation pad on the first surface and the orthographic projection of the second heat dissipation blind groove on the first surface at least partially overlap.

8. The power module according to any one of claims 1 to 7, characterized in that: The power module further includes a second base plate, a third heat dissipation pad, and a third electronic device, wherein the third electronic device is connected to the first surface of the second base plate via the third heat dissipation pad, the second surface of the second base plate is concave to form a third heat dissipation blind groove, and the orthographic projection of the third heat dissipation pad on the first surface of the second base plate at least partially overlaps with the orthographic projection of the third heat dissipation blind groove on the first surface of the second base plate; The power module further includes a heat sink located between the second surface of the first base plate and the second surface of the second base plate, with a first boss of the heat sink inserted into the first heat dissipation blind groove and a second boss of the heat sink inserted into the third heat dissipation blind groove.

9. The power module according to claim 8, characterized in that: The first boss contacts the groove wall of the first heat dissipation blind groove, the second boss contacts the groove wall of the third heat dissipation blind groove, the extension direction of the groove wall of the first heat dissipation blind groove intersects with the first surface of the first base plate, and the extension direction of the groove wall of the third heat dissipation blind groove intersects with the first surface of the second base plate.

10. The power module according to claim 9, characterized in that: The power module further includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is located between the bottom of the first blind heat dissipation groove and the first boss. The second heat conducting layer is located between the bottom of the third blind heat dissipation groove and the second boss.

11. A communication device, characterized in that: comprising a baseband processor, a radio frequency transceiver, a power module and an antenna connected in sequence, wherein the power module is as claimed in any one of claims 1 to 10; The communication device includes P transmitting channels and J receiving channels, where P and J are any integers greater than or equal to 1, and each of the J receiving channels includes a receiver in the radio frequency transceiver, a receiving module in the power module, and a receiving antenna in the antenna; Among the P transmission channels, each transmission channel includes a transmitter in the radio frequency transceiver, a transmission module in the power module, and a transmission antenna in the antenna.

12. A motor driver, characterized in that: It comprises a capacitor and at least one power module according to any one of claims 1 to 10, wherein the power module is electrically connected to the capacitor, the capacitor is used to provide voltage to the power module, the power module is used to convert direct current into alternating current, and the alternating current is used to drive a motor.

13. A powertrain, characterized in that: The invention comprises a motor and a motor driver according to claim 12 connected to the motor, wherein the motor driver is used to provide alternating current to the motor, and the motor is used to convert the alternating current from the motor driver into kinetic energy.

14. A vehicle, characterized in that: The vehicle comprises a wheel and a power assembly as claimed in claim 13 connected to the wheel, wherein the power assembly is used to provide power to the wheel to drive the wheel to move.

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