Resistance matching structure, chip, optical device, and optical module

Abstract

A resistance matching structure, a chip, an optical device, and an optical module, relating to the technical field of electronics. The resistance matching structure comprises a plurality of strip-shaped resistors and a conductive structure. The end of each strip-shaped resistor close to the conductive structure is connected to the conductive structure, the end of the strip-shaped resistor distant from the conductive structure is used for being connected to a strip-shaped conductor, and the plurality of strip-shaped resistors are collectively connected to the plurality of strip-shaped conductors. At least one resistor pair is present in the plurality of strip-shaped resistors, each resistor pair comprises two strip-shaped resistors which are adjacent and mutually inductive, and the strip-shaped conductors used for being connected to the two strip-shaped resistors have different potentials. In order to achieve resistance matching, the total impedance of the plurality of strip-shaped resistors is equal to the total characteristic impedance of the plurality of strip-shaped conductors. The present application can solve the problem of optical signal degradation caused by a reflected electrical signal in a modulator affecting a modulated optical signal. The present application is used for resistance matching.

Description

Resistor matching structures, chips, optical devices and optical modules

[0001] This application claims priority to Chinese patent application filed on March 1, 2024, with application number 202410239955.6, entitled “Resistor matching structure, chip, optical device and optical module”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a resistance matching structure, a chip, an optical device, and an optical module. Background Art

[0003] A modulator is a common component in optical modules. It can modulate light into optical signals based on electrical signals.

[0004] The modulator includes: an optical waveguide and a plurality of strip electrodes. The optical waveguide is located in the electric field formed between the plurality of strip electrodes. When an electrical signal is transmitted in the plurality of strip electrodes, the light transmitted in the optical waveguide can be modulated into an optical signal by the electrical signal transmitted in the strip electrodes. In addition, the modulator also includes a terminal resistor (a resistance matching structure) used to match the characteristic impedance of the electrodes in the modulator. The terminal resistor is connected to one end (called the terminal) of the electrical signal transmission direction in the plurality of strip electrodes. The terminal resistor is used to terminate the electrical signal transmitted in the electrode to prevent the degradation of the optical signal caused by the reflection of the electrical signal. In order to better reduce reflections, the total impedance of the terminal resistor should be equal to the total characteristic impedance of the plurality of strip electrodes at each frequency.

[0005] However, due to the impedance mismatch problem at high frequencies in the current terminal resistor design, the high-frequency electrical signal transmitted from the strip electrode to the terminal resistor will be reflected in the terminal resistor. The reflected electrical signal will affect the modulated optical signal, causing optical signal degradation. Summary of the Invention

[0006] The present application provides a resistance matching structure, chip, optical device and optical module, which can solve the problem that the reflected electrical signal in the modulator affects the modulated optical signal and causes optical signal degradation.

[0007] In a first aspect, the present application provides a resistance matching structure comprising a plurality of strip resistors and a conductive structure; wherein the ends of the strip resistors proximal to the conductive structure are connected to the conductive structure, and the ends of the strip resistors distal to the conductive structure are connected to strip conductors, and the plurality of strip resistors are used to connect multiple strip conductors; the plurality of strip resistors include at least one resistor pair, each resistor pair comprising two adjacent strip resistors capable of mutual induction, and the strip conductors connected by the two strip resistors have different potentials. To achieve resistance matching, the total impedance of the plurality of strip resistors is equal to the total characteristic impedance of the plurality of strip conductors.

[0008] For each resistor pair, since the strip conductors connected to the two strip resistors in the resistor pair have different potentials, the directions of the currents in the two strip resistors are opposite. Because the two strip resistors are adjacent and can be mutually inductive, when the directions of the currents in the two strip resistors 301 are opposite, the inductances on the two strip resistors will at least partially offset each other (in this application, the inductance of multiple strip resistors is offset to zero as an example, of course, the inductance of the multiple strip resistors may not be offset to zero). In this way, the total equivalent inductance of the resistance matching structure is reduced, and the degree of reflection of the electrical signal by the resistance matching structure at high frequency is reduced. When the resistance matching structure provided in the present application is used in a modulator, it is possible to reduce the influence of the reflection of the high-frequency electrical signal on the optical signal modulated by the modulator, thereby improving the quality of the optical signal. In this way, when the size of each strip resistor remains unchanged, the present application can double the maximum withstand current of the resistance matching structure, and the strip resistor is less likely to be burned.

[0009] It will be appreciated that, for each resistor pair in the plurality of strip resistors, this application uses the example of two strip resistors 301 in the resistor pair being arranged in parallel. Of course, the two strip resistors may not be arranged in parallel, or the two strip resistors in some resistor pairs may be arranged in parallel while the two strip resistors in other resistor pairs may not be arranged in parallel. This application does not limit this. The arrangement of the strip resistors in different resistor pairs may be the same or different.

[0010] For each resistor pair among the plurality of strip resistors, both strip resistors in the resistor pair are linear, spiral, or in other shapes. The shapes of the strip resistors in different resistor pairs may be the same or different. When the two strip resistors in a resistor pair are arranged in parallel and each strip resistor is spiral, the inductance of the two strip resistors can be more effectively offset.

[0011] For each resistor pair among the plurality of strip resistors, the structures of various parts of each strip resistor in the resistor pair are the same or different. For example, in each resistor pair, each of the two strip resistors includes: a plurality of first structures and at least one second structure, with each two adjacent first structures connected by a second structure; the resistivity of the first structure is greater than the resistivity of the second structure; the first structures in the two strip resistors correspond one-to-one, and the second structures in the two strip resistors also correspond one-to-one; for any one of the first and second structures, the arrangement direction of the structure and the corresponding structure is perpendicular to the extension direction of the position of the structure in the strip resistor where the structure is located; and in this arrangement direction, the spacing between the two corresponding first structures is greater than the spacing between the two corresponding second structures.

[0012] In the arrangement direction of any structure in the first structure and the second structure and the corresponding structure, the spacing between the corresponding two first structures is greater than the spacing between the corresponding two second structures. Therefore, the capacitance formed by the corresponding second structure is greater than the capacitance formed by the corresponding first structure. Compared with the resistance matching structure without the second structure, the capacitance between the strip resistors in the resistance pair increases. The greater the capacitance between the strip resistors in the resistance pair, the better the effect of the mutual inductance effect of the strip resistors in the resistance pair to reduce the reflection of the high-frequency electrical signal. Therefore, the resistance matching structure can enhance the effect of reducing the reflection of the high-frequency electrical signal. In addition, the conductive structure is not directly connected to the strip conductor, and therefore, it can also form a capacitive compensation effect, which is beneficial to enhancing the effect of reducing the reflection of the high-frequency electrical signal.

[0013] Optionally, the multiple strip resistors are arranged in sequence, and the number of the strip resistors is an even number greater than 2; the strip conductors used to be connected by the 2nth strip resistor and the 2n+1th strip resistor among the multiple strip resistors have the same potential, n≥1, and the strip conductors used to be connected by the first strip resistor and the last strip resistor among the multiple strip resistors have the same potential; the 2m+1th strip resistor and the 2m+2th strip resistor among the multiple strip resistors constitute the resistor pair, m≥0.

[0014] Optionally, the multiple strip resistors are arranged in sequence, and the number of the strip resistors is greater than 2; adjacent strip resistors among the multiple strip resistors are used to connect strip conductors with different potentials, and the first strip resistor and the last strip resistor among the multiple strip resistors are used to connect strip conductors with the same potential; every two adjacent strip resistors among the multiple strip resistors constitute the resistor pair.

[0015] As can be seen from the above description, the strip resistors in different resistor pairs can be independent of each other, or different resistor pairs can share a single strip resistor. When the strip resistors in different resistor pairs are independent of each other, the two strip resistors in each resistor pair can have the same resistance value. In this case, the resistance values ​​of the strip resistors can all be the same. When different resistor pairs share a single strip resistor, the resistance values ​​of the individual strip resistors can also be reasonably designed based on the requirements of inductance cancellation and impedance matching.

[0016] In any resistance matching structure provided in the present application, the resistivity of at least one strip resistor among the multiple strip resistors is greater than or equal to the resistivity of the conductive structure. In the present application, the resistivity of each strip resistor is greater than the resistivity of the conductive structure as an example.

[0017] In any resistance matching structure provided in the present application, the resistivity of at least one of the plurality of strip resistors is greater than the resistivity of the strip conductor. In the present application, the resistivity of each strip resistor is taken as an example to be greater than the resistivity of the strip conductor.

[0018] In any resistance matching structure provided in this application, the resistivity of the strip conductor is equal to the resistivity of the conductive structure. Of course, the resistivity of the strip conductor may also be different from the resistivity of the conductive structure, which is not limited in this application.

[0019] In this application, the strip conductor and the conductive structure are made of the same material, and the resistivity of the strip conductor is equal to the resistivity of the conductive structure. In addition, the strip resistors are made of the same material, and the resistivity of these strip resistors is greater than the resistivity of the conductive structure.

[0020] Optionally, the resistance matching structure provided by the present application further includes: a strip conductor. On this basis, the resistance matching structure may further include an optical waveguide; the optical waveguide is located in the electric field formed between the plurality of strip conductors. Furthermore, in the case where the resistance matching structure provided by the present application includes a strip conductor and an optical waveguide, the resistance matching structure may be a modulator. In this case, if the resistivity of the plurality of strip resistors is greater than the resistivity of the strip conductor, and the strip conductor is used to connect the driver of the modulator, then the conductive structure may be connected to the power supply connected to the driver. It can be seen that the resistance matching structure provided by the present application supports modulators and drivers that adopt an open-drain drive architecture. In the related art, when the reflection of high-frequency electrical signals is aggravated, if the modulator and driver adopt an open-drain drive architecture, then the reflection of high-frequency electrical signals will further aggravate the degradation of the quality of the optical signal. However, in the present application, even if the modulator and driver adopt an open-drain drive architecture, then if the resistance matching structure can reduce the inductance in the resistor, the reflection of the electrical signal by the resistance matching structure can be reduced, thereby alleviating the degradation of the optical signal.

[0021] The strip resistor can be in contact with the strip conductor, and the strip resistor can also be connected to the strip conductor through other structures. For example, the resistance matching structure also includes: multiple connecting electrodes, the multiple connecting electrodes correspond one-to-one to the multiple strip conductors, and the strip conductors are connected to the strip resistors through the corresponding connecting electrodes.

[0022] In a second aspect, based on the resistance matching structure provided in the present application, the present application further provides a chip, which includes a substrate and a resistance matching structure as described in any one of the designs in the first aspect, located on the substrate.

[0023] The resistance matching structure provided in this application can be used in a modulator or a detector. The chip may include one or more resistance matching structures, and the multiple resistance matching structures may all be used in the modulator; or all be used in the detector; or some resistance matching structures may be used in the modulator and others in the detector.

[0024] In a third aspect, the present application further provides an optical device comprising: a connection structure and the chip provided in the second aspect; the connection structure is configured to connect the chip to at least one component external to the optical device. The connection structure may be a pin, a connector, a lead, a solder ball, or the like. The optical device may be a modulator or a detector, or may include both a modulator and a detector.

[0025] In a fourth aspect, the present application further provides an optical module, which includes: an electrical device and the optical device provided in the third aspect.

[0026] The effects of the second to fourth aspects mentioned above can refer to the effects of the corresponding contents in the first aspect, and this application will not go into details here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a schematic diagram of a modulator provided by the related art;

[0028] FIG2 is a schematic diagram of another modulator provided by the related art;

[0029] FIG3 is a schematic diagram of a resistance matching structure provided in an embodiment of the present application;

[0030] FIG4 is a schematic diagram of a modulator provided in an embodiment of the present application;

[0031] FIG5 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0032] FIG6 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0033] FIG7 is a schematic diagram of a first structure and a second structure of a strip resistor provided in an embodiment of the present application;

[0034] FIG8 is a schematic diagram of a first structure and a second structure of another strip resistor provided in an embodiment of the present application;

[0035] FIG9 is a schematic diagram of a first structure and a second structure of another strip resistor provided in an embodiment of the present application;

[0036] FIG10 is a schematic diagram showing the relationship between a strip conductor, a conductive structure, and a strip resistor provided in an embodiment of the present application;

[0037] FIG11 is a schematic diagram showing the relationship between an optical waveguide, a strip conductor, a conductive structure, and a strip resistor provided in an embodiment of the present application;

[0038] FIG12 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0039] FIG13 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0040] FIG14 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0041] FIG15 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0042] FIG16 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0043] FIG17 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0044] FIG18 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0045] FIG19 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0046] FIG20 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0047] FIG21 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0048] FIG22 is a schematic diagram of another resistance matching structure provided in an embodiment of the present application;

[0049] FIG23 is a schematic diagram of an optical module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0050] With the continuous emergence and popularization of emerging services such as cloud computing, big data, artificial intelligence, and fifth-generation mobile communication technology (5G) wireless communications, the data transmission volume of communication systems has increased rapidly, placing increasingly high demands on the bandwidth of optical communication equipment. A typical optical communication system consists of three major components: a transmitter, a transmission medium, and a receiver. The transmitter is responsible for converting the electrical signal to be transmitted into an optical signal. The optical signal propagates through a transmission medium such as optical fiber, and is then received by the receiver and converted into an electrical signal that can be processed by an electronic chip, thus completing the signal transmission process.

[0051] The modulator (electro-optical modulator) in a transmitter is responsible for the electro-optical conversion from electrical signals to optical signals. It is the core optical chip component at the transmitter end of an optical communication system and the primary factor affecting the bandwidth of the optical communication system. Further improving the modulation performance of the modulator plays a crucial role in improving the performance of the entire optical communication system and is of great practical significance.

[0052] For example, the modulator includes a traveling-wave electrode (TWE) and an optical waveguide (such as the optical waveguide in a Mach-Zehnder (MZ) interferometer). The laser light emitted by the laser is transmitted to the optical waveguide and modulated into an optical signal output under the action of the electrical signal on the traveling-wave electrode in the optical waveguide. In order to improve the bandwidth of the modulator and enhance the quality of the optical signal modulated by the modulator, after the electrical signal is transmitted through the traveling-wave electrode and modulates the optical signal in the optical waveguide at the same time, an impedance matching structure (such as the terminal resistor in Figure 1) needs to be connected to the terminal of the traveling-wave electrode (that is, in the transmission direction of the electrical signal in the traveling-wave electrode) so that the electrical signal can be consumed at the end of the traveling-wave electrode.

[0053] However, due to the impedance mismatch problem caused by the current terminal resistor design at high frequencies (high-frequency electrical signals), the electrical signal in the terminal resistor will be reflected back to the traveling wave electrode, causing the electrical signal to propagate in the reverse direction and interact with the light in the optical waveguide in the modulator again, which will cause the optical signal modulated by the modulator to degrade.

[0054] The modulator in the related art is shown in Figure 1 or Figure 2, wherein S1 and S2 are both sub-electrodes of the traveling wave electrode, and S1 and S2 have different electric potentials, and the optical waveguides are all optical waveguides in the MZ interferometer. In Figure 1, the right end of the electrode S2 is connected to a terminal resistor, and the terminal resistor is also connected to the sub-electrode S1; and the total impedance of the terminal resistor is equal to the total characteristic impedance of the traveling wave electrode, for example, the total impedance of the terminal resistor and the total characteristic impedance of the traveling wave electrode are both 50 ohms. In Figure 2, the terminal of the traveling wave electrode is connected to two terminal resistors, and the two terminal resistors are respectively connected to the two sub-electrodes S1 of the traveling wave electrode; and the total impedance of the terminal resistor is equal to the total characteristic impedance of the traveling wave electrode, for example, the total impedance of the terminal resistor and the total characteristic impedance of the traveling wave electrode are both 50 ohms. In this case, the impedance of the two terminal resistors in Figure 2 can both be 100 ohms.

[0055] However, the terminal resistor also needs to carry a certain amount of current, so it needs to have a large cross-sectional area to prevent it from burning out due to excessive current density. However, in order to achieve impedance matching, the terminal resistor needs to maintain a fixed resistance value. Therefore, when the cross-sectional area of ​​the terminal resistor increases, the length of the terminal resistor also increases. In this way, the terminal resistor is not only manifested as a resistance, but also as an inductor. The reactance value of the inductor increases with the frequency of the electrical signal, so the total impedance of the terminal resistor may be greater than the total characteristic impedance of the traveling wave electrode. In addition, because the reactance value of the inductor increases with the frequency of the electrical signal, the reflection of high-frequency electrical signals is aggravated, further causing optical signal degradation.

[0056] An embodiment of the present application provides a resistance matching structure, which can reduce the inductance in the resistor and reduce the reflection of the electrical signal by the resistor. For example, Figure 3 is a schematic diagram of a resistance matching structure provided by an embodiment of the present application. As shown in Figure 3, the resistance matching structure includes: a plurality of strip resistors 301 and a conductive structure 302. Among them, the ends of the strip resistors 301 close to the conductive structure 302 are all connected to the conductive structure 302, and the ends of the strip resistors 301 away from the conductive structure 302 are used to connect the strip conductors; in Figure 3, the strip conductors connected to the strip resistors 301 are taken as the sub-electrodes (two S1 and one S2) of the traveling wave electrode as an example. Multiple strip resistors 301 are used to connect multiple strip conductors in common, and the number of strip resistors is usually greater than or equal to the number of strip conductors. Some of the multiple strip conductors can be grounded, or multiple strip conductors can be not grounded.

[0057] The total impedance of the multiple strip resistors 301 is equal to the total characteristic impedance of the strip conductors that the multiple strip resistors 301 are used to connect, so as to achieve impedance matching. For example, assuming that the total characteristic impedance of the sub-electrodes (two S1 and one S2) of the traveling wave electrode in Figure 3 is 50 ohms, then the total impedance of the four strip resistors 301 in Figure 3 is also 50 ohms. It is understandable that due to the existence of manufacturing errors, the total impedance of the multiple strip resistors 301 may also have a certain deviation from the total characteristic impedance of the strip conductors that the multiple strip resistors 301 are used to connect. In this case, the total impedance of the multiple strip resistors 301 is approximately equal to the total characteristic impedance of the strip conductors that the multiple strip resistors 301 are used to connect.

[0058] There is at least one resistor pair among the multiple strip resistors 301, and each resistor pair includes two adjacent strip resistors 301 that are capable of mutual induction, and the strip conductors used to connect the two strip resistors 301 have different potentials. For example, the multiple strip resistors 301 are arranged in sequence (such as the conductive structure 302 in Figure 3 is strip-shaped, and the multiple strip resistors 301 are arranged in sequence along the length direction of the conductive structure 302 (the up and down direction in Figure 3)). The conductive structure 302 in the embodiment of the present application may also not be strip-shaped. For example, the conductive structure 302 is rectangular, circular, diamond-shaped or an irregular shape; the first strip resistor 301 and the second strip resistor 301 from the top to the bottom of the four strip resistors 301 are a resistor pair, and the third strip resistor 301 and the fourth strip resistor 301 are another resistor pair. The sub-electrodes of the traveling wave electrode connected to the first strip resistor 301 and the second strip resistor 301 have different potentials, and the first strip resistor 301 and the second strip resistor 301 are adjacent and capable of mutual induction. The sub-electrodes of the traveling wave electrode connected to the third strip resistor 301 and the fourth strip resistor 301 have different potentials, and the third strip resistor 301 and the fourth strip resistor 301 are adjacent and can be mutually inductive. It is understandable that the multiple strip resistors 301 may also include some of the multiple resistor pairs shown in Figure 3, for example, the first strip resistor 301 and the second strip resistor 301 form one resistor pair, or the third strip resistor 301 and the fourth strip resistor 301 form another resistor pair.

[0059] For each resistor pair, since the strip conductors connected to the two strip resistors 301 in the resistor pair have different potentials, the directions of the currents in the two strip resistors 301 are opposite. Since the two strip resistors 301 are adjacent and can be mutually inductive, when the directions of the currents in the two strip resistors 301 are opposite, the inductances on the two strip resistors 301 will at least partially offset each other (in this application, the inductance of multiple strip resistors is offset to zero as an example, of course, the inductance of the multiple strip resistors may not be offset to zero). In this way, the total equivalent inductance of the resistance matching structure is reduced, and the degree of reflection of the electrical signal by the resistance matching structure at high frequency is reduced. When the resistance matching structure provided in the embodiment of the present application is used in a modulator, it can reduce the reflection of the high-frequency electrical signal, reduce the impact on the optical signal modulated by the modulator, and improve the quality of the optical signal. According to simulation, the present application can optimize the reflection of a 150 GHz high-frequency electrical signal by about 14 decibels (dB), which is equivalent to reducing the reflection of a 150 GHz high-frequency electrical signal by more than 90%. In this way, under the condition that the size of each strip resistor remains unchanged, the embodiment of the present application can double the maximum withstand current of the resistor matching structure, and the strip resistor is less likely to be burned.

[0060] For example, when the resistor matching structure shown in FIG3 is used in a modulator, the structure of the modulator can be shown in FIG4. In FIG4, the strip resistor 301 acts as a terminal resistor in the modulator. Due to the presence of the resistor pair, the total equivalent inductance of the terminal resistor can be reduced, reducing the degree of reflection of the electrical signal in the traveling wave electrode at high frequencies caused by the terminal resistor, thereby reducing the impact of the reflection of the high-frequency electrical signal on the optical signal modulated by the modulator.

[0061] It is understood that for each resistor pair in the plurality of strip resistors 301, FIG3 illustrates an example in which two strip resistors 301 in a resistor pair are arranged in parallel, e.g., the two strip resistors 301 are parallel to each other. Of course, the two strip resistors 301 may not be arranged in parallel, or the two strip resistors in some resistor pairs may be arranged in parallel while the two strip resistors in other resistor pairs may not be arranged in parallel. This is not limited in the present embodiment. The arrangement of the strip resistors in different resistor pairs may be the same or different.

[0062] For each resistor pair in the plurality of strip resistors 301, FIG3 takes the case where the two strip resistors 301 in the resistor pair are both in a straight line as an example. Alternatively, the two strip resistors may also be in other shapes. For example, in a spiral shape as shown in FIG5 . FIG3 and FIG5 take the case where the shapes of the strip resistors in different resistor pairs are the same as an example. Of course, the shapes of the strip resistors in different resistor pairs may also be different. The inductance cancellation effect on the side where the two strip resistors 301 in the resistor pair are away from each other is poor. When the two strip resistors 301 in the resistor pair are arranged in parallel, and each strip resistor is in a spiral shape, some areas of the strip resistors have parts on both sides close to the other strip resistor. Therefore, the effect of the inductance canceling each other on both sides of the area is better. Therefore, compared to the case where the strip resistors 301 are in a straight line, the case where the strip resistors 301 are in a spiral shape will make the inductance of the two strip resistors cancel each other better.

[0063] For each resistor pair in the plurality of strip resistors 301 , FIG3 takes the example of the same structure of each portion in each strip resistor 301 in the resistor pair. Optionally, the structure of each portion in the strip resistor may also be different.

[0064] For example, in each resistor pair, as shown in FIG6 , each strip resistor 301 in the two strip resistors includes: a plurality of first structures 3011, and at least one second structure 3012, and every two adjacent first structures 3011 are connected by a second structure 3012; the resistivity of the first structure 3011 is greater than the resistivity of the second structure 3012; the first structures 3011 in the two strip resistors correspond one-to-one, and the second structures 3012 in the two strip resistors also correspond one-to-one; for any one of the first structures 3011 and the second structures 3012, the arrangement direction of the any one structure and the corresponding structure (such as the up-down direction in FIG6 ) is perpendicular to the extension direction of the position of the any one structure in the strip resistor 301 where the any one structure is located (such as the left-right direction in FIG6 ); in this arrangement direction, the spacing between the two corresponding first structures 3011 is greater than the spacing between the two corresponding second structures 3012.

[0065] Adjacent first structures 3011 in the plurality of first structures 3011 may be arranged in a disconnected manner. In this case, the structure of the strip resistor 301 is shown in FIG. 7 . FIG. 6 shows a top view of the strip resistor 301 shown in FIG. 7 .

[0066] Alternatively, multiple first structures 3011 can also be connected as a whole, and, on this basis, adjacent first structures 3011 are also connected through a second structure 3012. For example, the structure of the strip resistor 301 in the resistor pair is shown in Figure 8, and Figure 6 shows a top view of the strip resistor 301 shown in Figure 8. It can be seen from Figures 6 and 8 that multiple first structures 3011 can also be connected as a whole (such as the black part in Figure 7), which is in the shape of a strip and has two end faces in its length direction, and a side surface connecting the two end faces. The second structure 3012 is superimposed on the side surface of this whole. In Figure 8, the second structure 3012 is superimposed on the side surface of this whole as an example. Optionally, as shown in Figure 9, a part of the second structure 3012 close to this whole can also be embedded in the side surface, and the embodiments of the present application are not limited to this.

[0067] For example, in the embodiment of the present application, the material of the second structure 3012 may be a metal material, and the material of the first structure 3011 may be a nickel-chromium alloy (NiCr), titanium nitride (TiN), or the like.

[0068] The first structures of the two strip resistors in each resistor pair correspond one to one, and the second structures also correspond one to one, and the first structures corresponding to each other form a capacitor, and the second structures corresponding to each other form a capacitor. For example, the two strip resistors in each resistor pair in FIG6 include four first structures 3011 and three second structures 3012; in the first resistor pair from top to bottom, the first first structure 3011 from left to right in the first strip resistor 301 from top to bottom forms a capacitor with the first first structure 3011 from left to right in the second strip resistor 301 from top to bottom; the second first structure 3011 from left to right in the first strip resistor 301 from top to bottom forms a capacitor with the second first structure 3011 from left to right in the second strip resistor 301 from top to bottom. The second first structure 3011 from left to right in the strip resistor 301 forms a capacitor; the third first structure 3011 from left to right in the first strip resistor 301 from top to bottom and the third first structure 3011 from left to right in the second strip resistor 301 from top to bottom form a capacitor; the fourth first structure 3011 from left to right in the first strip resistor 301 from top to bottom and the fourth first structure 3011 from left to right in the second strip resistor 301 from top to bottom form a capacitor. In the first resistor pair counted from top to bottom, the first second structure 3012 counted from left to right in the first strip resistor 301 counted from top to bottom forms a capacitor with the first second structure 3012 counted from left to right in the second strip resistor 301 counted from top to bottom; the second second structure 3012 counted from left to right in the first strip resistor 301 counted from top to bottom forms a capacitor with the second second structure 3012 counted from left to right in the second strip resistor 301 counted from top to bottom; the third second structure 3012 counted from left to right in the first strip resistor 301 counted from top to bottom forms a capacitor with the third second structure 3012 counted from left to right in the second strip resistor 301 counted from top to bottom.

[0069] In the arrangement direction of any structure of the first structure 3011 and the second structure 3012 and the corresponding structure, the spacing between the corresponding two first structures 3011 is greater than the spacing between the corresponding two second structures 3012. Therefore, the capacitance formed by the corresponding second structure 3012 is greater than the capacitance formed by the corresponding first structure 3011. Compared with the resistance matching structure shown in Figure 3, the resistance matching structure shown in Figure 6 adds a second structure 3012 to the strip resistor 301. Therefore, the capacitance between the strip resistors in the resistance pair of Figure 6 is greater than the capacitance between the strip resistors in the resistance pair of Figure 3. The greater the capacitance between the strip resistors in the resistance pair, the better the effect of the mutual inductance effect of the strip resistors in the resistance pair to reduce the reflection of high-frequency electrical signals. Therefore, compared with the resistance matching structure shown in Figure 3, the resistance matching structure shown in Figure 6 can improve the effect of reducing the reflection of high-frequency electrical signals. In addition, the conductive structure is not directly connected to the strip conductor, and therefore, it can also form a capacitive compensation effect, which is conducive to improving the effect of reducing the reflection of high-frequency electrical signals. It can be seen that the resistance matching structure shown in Figure 3 reduces the reflection of high-frequency electrical signals through the mutual inductance effect of the resistors in the strip resistors. At this time, the overall resistance matching structure is inductive. The resistance matching structure shown in Figure 6 can use capacitance to compensate for inductance under the action of capacitance, thereby improving the effect of reducing the reflection of high-frequency electrical signals.

[0070] When the strip resistor in the resistance matching structure shown in FIG6 includes multiple second structures 3012, it is equivalent to introducing multiple series-connected inductor-capacitor (LC) circuits into the resistance matching structure (adjacent first and second structures are equivalent to a single LC circuit). This can more flexibly improve the effect of reducing reflections of high-frequency electrical signals over a wider frequency range. In the embodiments of the present application, the dimensions of each first structure and each second structure can be flexibly designed, and therefore, the values ​​of each LC circuit can also be flexibly designed.

[0071] In any resistance matching structure provided in the embodiments of the present application, the resistivity of at least one strip resistor 301 among the multiple strip resistors 301 is greater than or equal to the resistivity of the conductive structure 302. In the embodiments of the present application, the resistivity of each strip resistor 301 is taken as an example to be greater than the resistivity of the conductive structure 302.

[0072] In any of the resistor matching structures provided in the embodiments of the present application, the resistivity of at least one of the multiple strip resistors is greater than the resistivity of the strip conductor. In the embodiments of the present application, the resistivity of each strip resistor 301 is taken as an example to be greater than the resistivity of the strip conductor. The strip conductor can be made of a metal or metal alloy, such as gold, copper, or aluminum. The material of the strip resistor 301 can be nickel-chromium alloy (NiCr), titanium nitride (TiN), or the like.

[0073] In any resistance matching structure provided in the embodiments of the present application, the resistivity of the strip conductor is equal to the resistivity of the conductive structure 302. Of course, the resistivity of the strip conductor may also be different from the resistivity of the conductive structure 302, which is not limited in the embodiments of the present application.

[0074] In the embodiment of the present application, the strip conductor and the conductive structure 302 are made of the same material, and the resistivity of the strip conductor is equal to the resistivity of the conductive structure 302. Furthermore, the strip resistors 301 are made of the same material, and the resistivity of these strip resistors 301 is greater than the resistivity of the conductive structure 302. In this case, the strip conductor and the conductive structure 302 can be prepared simultaneously. For example, a resistor material layer is first prepared and patterned to obtain the strip resistor 301; then, a conductor layer is formed and patterned to obtain the strip conductor and the conductive structure 302. For another example, a conductor layer is first formed and patterned to obtain the strip conductor and the conductive structure 302; then, a resistor material layer is prepared and patterned to obtain the strip resistor 301. Compared to the resistor matching structure in the related art, the resistor network matching structure provided in the embodiment of the present application does not incur any additional cost in process implementation and performance indicators.

[0075] Figure 10 illustrates an example where both the strip conductor and the conductive structure 302 are in contact with the strip resistor 301. It is understood that the strip conductor and the conductive structure 302 can also be in contact with the strip resistor 301 through vias in the insulating layer. In this case, the strip resistor 301 is located on one side of the insulating layer, while the strip conductor and the conductive structure 302 are located on the other side. During the fabrication process, an insulating layer can be formed between the strip resistor 301 and the conductive structure 302.

[0076] Optionally, the resistance matching structure provided in the embodiment of the present application also includes: a strip conductor. On this basis, the resistance matching structure may also include an optical waveguide (as shown in FIG4 ); the optical waveguide is located in the electric field formed between a plurality of strip conductors. The resistance matching structure may also include a dielectric layer of the optical waveguide, and the optical waveguide is wrapped by the dielectric layer. For example, as shown in FIG11 , the upper and lower layers of the optical waveguide are both dielectric layers, and the strip conductors, conductive structures, and strip resistors may be located outside the dielectric layer. The optical waveguide, dielectric layer, strip conductor, conductive structure, and strip resistor in the resistance matching structure are all located on the substrate. The material of the optical waveguide may be any material that can conduct light, such as lithium niobate, silicon, indium phosphide, and the like.

[0077] Furthermore, in the case where the resistance matching structure provided in the embodiment of the present application includes a strip conductor and an optical waveguide, the resistance matching structure can be a modulator. At this time, if the resistivity of the multiple strip resistors is greater than the resistivity of the strip conductor, and the strip conductor is used to connect the driver of the modulator, then the conductive structure can be connected to the power supply connected to the driver. For example, based on Figure 4, as shown in Figure 12, the conductive structure 302 is connected to the power supply connected to the driver via a connecting structure 303 (the driver and the power supply are not shown in Figure 12). It can be seen that the resistance matching structure provided in the embodiment of the present application supports a modulator and driver using an open-drain drive architecture. In the related art, when the reflection of the high-frequency electrical signal is aggravated, if the modulator and the driver adopt an open-drain drive architecture, the reflection of the high-frequency electrical signal will further aggravate the degradation of the optical signal quality. However, in the embodiment of the present application, even if the modulator and the driver adopt an open-drain drive architecture, then when the resistance matching structure can reduce the inductance of the resistance matching structure, the reflection of the electrical signal by the resistance matching structure can be reduced, thereby alleviating the degradation of the optical signal.

[0078] In addition, in the aforementioned embodiment, the strip resistor 301 is in contact with the strip conductor as an example. Optionally, the strip resistor 301 can also be connected to the strip conductor through other structures. For example, as shown in Figure 13, the resistance matching structure also includes: multiple connecting electrodes 304, which correspond one-to-one to multiple strip conductors, and each strip conductor is connected to the strip resistor 301 through the corresponding connecting electrode 304.

[0079] The connecting electrode 304 can contact the corresponding strip conductor, for example, by flip-chip bonding. Alternatively, the connecting electrode 304 can be connected to the corresponding strip conductor through other structures, such as the example shown in FIG13 where the connecting electrode 304 can be connected to the corresponding strip conductor through wire bonding.

[0080] Optionally, the plurality of connection electrodes 304 may not correspond one-to-one to the plurality of strip conductors, but may correspond one-to-one to the plurality of strip resistors 301 , and each strip resistor 301 is connected to the strip conductor via the corresponding connection electrode 304 .

[0081] Furthermore, as shown in FIG14 , the strip conductor can be provided on one substrate, and the connecting electrode 304, the strip resistor 301, and the conductive structure 302 can be provided on another substrate. Alternatively, as shown in FIG15 , the strip conductor, the connecting electrode 304, the strip resistor 301, and the conductive structure 302 can be provided on the same substrate. In comparison, the structure shown in FIG15 will result in a lower yield due to the higher difficulty in manufacturing the strip resistor (large manufacturing error in the resistance value); whereas in the structure shown in FIG14 , since the substrate on which the strip conductor is located does not include the strip resistor, the preparation yield of the structure on the substrate is higher. In this way, the strip resistor will not affect the manufacturing yield of the structure on the substrate on which the strip conductor is located.

[0082] Optionally, the resistance matching structure provided in the embodiments of the present application may not include a strip conductor. For example, the resistance matching structure provided in the embodiments of the present application includes a connecting electrode 304, a strip resistor 301, and a conductive structure 302, i.e., the structure on the right substrate in FIG14 . This resistance matching structure may also not include the connecting electrode 304, and this embodiment of the present application is not limited to this.

[0083] Furthermore, in the above embodiment, the resistance matching structure includes four strip resistors connected to three strip conductors. The strip resistors and the strip conductors connected thereto in the resistance matching structure may also be different from those in the above embodiment.

[0084] Optionally, the multiple strip resistors 301 in the embodiment of the present application can be arranged in sequence (for example, the conductive structure 302 can be strip-shaped, and the multiple strip resistors 301 in the resistance matching structure are arranged in sequence along the length direction of the conductive structure 302). The multiple strip resistors 301 include an even number of strip resistors 301, and the even number is greater than 2. The strip conductors used to connect the 2nth strip resistor 301 and the 2n+1th strip resistor 301 in the multiple strip resistors 301 have the same potential, n ≥ 1, and the strip conductors used to connect the first strip resistor and the last strip resistor in the multiple strip resistors have the same potential; the 2m+1th strip resistor and the 2m+2th strip resistor in the multiple strip resistors form a resistor pair, m ≥ 0.

[0085] For example, when the multiple strip resistors 301 include four strip resistors 301, as shown in Figure 3, the strip conductors used to connect the second strip resistor 301 and the third strip resistor 301 among the four strip resistors 301 have the same potential, and the strip conductors used to connect the first strip resistor and the last strip resistor among the four strip resistors 301 have the same potential; the first strip resistor and the second strip resistor among the four strip resistors 301 form a resistor pair, and the third strip resistor and the fourth strip resistor among the four strip resistors 301 form a resistor pair.

[0086] For another example, when the multiple strip resistors 301 include six strip resistors 301, as shown in Figure 16, the strip conductor (S2) connected by the second strip resistor 301 and the third strip resistor 301 among the six strip resistors 301 has the same potential, the strip conductor (S3) connected by the fourth strip resistor 301 and the fifth strip resistor 301 among the six strip resistors 301 has the same potential, and the strip conductor (the first S1 from the top to the bottom) connected by the first strip resistor among the six strip resistors 301 and the strip conductor (the second S1 from the top to the bottom) connected by the last strip resistor have the same potential; the first strip resistor and the second strip resistor among the six strip resistors 301 form a resistor pair, the third strip resistor and the fourth strip resistor among the six strip resistors 301 form a resistor pair, and the fifth strip resistor and the sixth strip resistor among the six strip resistors 301 form a resistor pair. In this case, the six strip resistors are connected to four strip conductors in total, and these four strip conductors can be called differential electrodes.

[0087] For another example, when the multiple strip resistors 301 include eight strip resistors 301, as shown in Figure 17, the strip conductor (S2) used to be connected by the second strip resistor 301 and the third strip resistor 301 among the eight strip resistors 301 has the same electric potential, the strip conductor (the second S1 from the top) used to be connected by the fourth strip resistor 301 and the fifth strip resistor 301 among the eight strip resistors 301 has the same electric potential, the strip conductor (S3) used to be connected by the sixth strip resistor 301 and the seventh strip resistor 301 among the eight strip resistors 301 has the same electric potential, and the strip conductor (the first S1 from the top) used to be connected by the first strip resistor among the eight strip resistors 301 and the strip conductor (the third S1 from the top) used to be connected by the last strip resistor has the same electric potential. The first strip resistor and the second strip resistor among the eight strip resistors 301 form a resistor pair, the third strip resistor and the fourth strip resistor among the eight strip resistors 301 form a resistor pair, the fifth strip resistor and the sixth strip resistor among the eight strip resistors 301 form a resistor pair, and the seventh strip resistor and the eighth strip resistor among the eight strip resistors 301 form a resistor pair.

[0088] In addition, when the plurality of strip resistors 301 include two strip resistors 301 , as shown in FIG18 , the strip conductors ( S1 and S2 ) connected to the two strip resistors 301 have different potentials, and the two strip resistors 301 form a resistor pair.

[0089] Alternatively, the plurality of strip resistors 301 in the embodiment of the present application may be arranged sequentially (for example, the conductive structure 302 may be strip-shaped, and the plurality of strip resistors 301 in the resistance matching structure may be arranged sequentially along the length direction of the conductive structure 302). The number of strip resistors 301 is greater than 2. Adjacent strip resistors 301 in the plurality of strip resistors 301 are used to connect strip conductors having different potentials, and the first strip resistor 301 and the last strip resistor 301 in the plurality of strip resistors 301 are used to connect strip conductors having the same potential; and each two adjacent strip resistors 301 in the plurality of strip resistors 301 form a resistor pair.

[0090] For example, when the multiple strip resistors 301 include three strip resistors 301, as shown in Figure 19, the strip conductors used to connect the first strip resistor 301 and the second strip resistor 301 among the three strip resistors 301 have different potentials, the strip conductors used to connect the second strip resistor 301 and the third strip resistor 301 among the three strip resistors 301 have different potentials, and the strip conductors used to connect the first strip resistor and the last strip resistor among the three strip resistors 301 have the same potential; the first strip resistor and the second strip resistor among the three strip resistors 301 form a resistor pair, and the second strip resistor and the third strip resistor among the three strip resistors 301 form a resistor pair.

[0091] For another example, when the plurality of strip resistors 301 includes four strip resistors 301, as shown in FIG20 , the strip conductors connected to the first strip resistor 301 and the second strip resistor 301 among the four strip resistors 301 have different potentials, the strip conductors connected to the second strip resistor 301 and the third strip resistor 301 among the four strip resistors 301 have different potentials, and the strip conductors connected to the third strip resistor 301 and the fourth strip resistor 301 among the four strip resistors 301 have different potentials. The strip conductor connected to the first strip resistor (the first S1 from the top) and the strip conductor connected to the last strip resistor (the second S1 from the top) among the four strip resistors 301 have the same potential. The first and second strip resistors of the four strip resistors 301 form a resistor pair, the second and third strip resistors of the four strip resistors 301 form a resistor pair, and the third and fourth strip resistors of the four strip resistors 301 form a resistor pair.

[0092] For another example, when the plurality of strip resistors 301 includes five strip resistors 301, as shown in FIG21 , the strip conductors connected to the first strip resistor 301 and the second strip resistor 301 among the five strip resistors 301 have different potentials, the strip conductors connected to the second strip resistor 301 and the third strip resistor 301 among the five strip resistors 301 have different potentials, the strip conductors connected to the third strip resistor 301 and the fourth strip resistor 301 among the five strip resistors 301 have different potentials, and the strip conductors connected to the fourth strip resistor 301 and the fifth strip resistor 301 among the five strip resistors 301 have different potentials. The strip conductor connected to the first strip resistor (the first S1 from the top) and the strip conductor connected to the last strip resistor (the third S1 from the top) among the five strip resistors 301 have the same potential. The first strip resistor and the second strip resistor among the five strip resistors 301 form a resistor pair, the second strip resistor and the third strip resistor among the five strip resistors 301 form a resistor pair, the third strip resistor and the fourth strip resistor among the five strip resistors 301 form a resistor pair, and the fourth strip resistor and the fifth strip resistor among the five strip resistors 301 form a resistor pair.

[0093] As described above, the strip resistors in different resistor pairs can be independent of each other (as shown in Figures 3, 16, and 17), or different resistor pairs can share a strip resistor (as shown in Figures 19, 20, and 21). When the strip resistors in different resistor pairs are independent of each other, the resistance values ​​of the two strip resistors in each resistor pair can be the same. In this case, the resistance values ​​of the strip resistors can be the same. For example, assuming that the total characteristic impedance of the multiple strip conductors in Figure 3 is 50 ohms, then the total impedance of the resistor matching structure is 50 ohms, and the resistance value of each strip resistor can be 50 ohms. When different resistor pairs share a strip resistor, the resistance value of each strip resistor can also be reasonably designed based on the requirements of inductance cancellation and impedance matching. For example, in Figure 19, the three strip resistors from top to bottom have the same length, a width ratio of 1:2:1, and a resistance ratio of 2:1:2. If the total characteristic impedance of the multiple strip conductors is 50 ohms, then the resistance values ​​of the three strip resistors are 50 ohms, 25 ohms, and 50 ohms, respectively. When different resistor pairs share a strip resistor, the width of the strip conductor connected to the shared strip resistor can be smaller than the width of the strip conductor connected to the unshared strip resistor, and the width of the strip conductor connected to the shared strip resistor can also be greater than or equal to the width of the strip conductor connected to the unshared strip resistor.

[0094] In addition, the aforementioned embodiments all assume that the resistivity of the plurality of strip resistors 301 is the same. Optionally, the resistivity of the plurality of strip resistors 301 may be different. For example, based on FIG. 19 , as shown in FIG. 22 , the material of the second strip resistor 301 from the top may be the same as that of the conductive structure 302.

[0095] In the aforementioned embodiments, the transmission direction of the electrical signal in the strip conductor is taken as the direction from left to right in the accompanying drawings. Optionally, the transmission direction of the electrical signal in the strip conductor can also be the direction from right to left in the accompanying drawings. In this case, the resistance matching structure is not used in the modulator, but can be used in the detector. When the resistance matching structure is used in the detector, the number of the above-mentioned strip conductors can be two or three. In addition, the strip conductors in the embodiments of the present application may not be sub-electrodes of the traveling wave electrode. For example, the strip conductors are transmission lines (such as high-speed signal lines on substrates such as ceramic substrates, organic substrates, and printed circuit boards (PCBs)). The embodiments of the present application do not limit this.

[0096] Based on the resistance matching structure provided in the embodiments of the present application, the embodiments of the present application also provide a chip. The chip includes a substrate and a resistance matching structure as described in any embodiment of the present application, located on the substrate. For example, the chip may include the substrate on the right side of FIG. 14 , and strip resistors 301, conductive structures 302, and connecting electrodes 304 disposed thereon. For another example, the chip may be as shown in FIG. 15 .

[0097] The resistance matching structure provided in the embodiments of the present application can be used in a modulator or a detector. The chip may include one or more resistance matching structures, and the multiple resistance matching structures may all be used in the modulator; or all be used in the detector; or some resistance matching structures may be used in the modulator and others in the detector.

[0098] The present application also provides an optical device, comprising: a connection structure and a chip provided in the present application; the connection structure is used to connect the chip to at least one component outside the optical device. The connection structure may be a pin, a connector, a lead, a solder ball, etc. The optical device may be a modulator or a detector, etc. Alternatively, the optical device may include both a modulator and a detector, etc.

[0099] An embodiment of the present application further provides an optical module, which includes: an electrical device and an optical device as provided in the embodiment of the present application.

[0100] For example, as shown in Figure 23, the optical module includes: a signal processing unit 01, a driver 02, a modulator 03, a laser 04, a detector 05, and a transimpedance amplifier 06. Among them, the signal processing unit 01, the driver 02, and the transimpedance amplifier 06 are all electrical devices, and the modulator 03, the laser 04, and the detector 05 are all optical devices. Among them, the modulator 03 and the detector 05 can both be optical devices provided in the embodiment of the present application, and the modulator 03 and the detector 05 can be an optical device provided in the embodiment of the present application.

[0101] Signal processing unit 01 processes the input electrical signal and transmits the processed electrical signal to driver 02 for amplification. Driver 02 inputs a drive signal (an electrical signal) to modulator 03 based on the received electrical signal. Laser 04 inputs light to modulate into modulator 03. Modulator 03 modulates the light input from laser 04 based on the drive signal to generate an optical signal, which it then outputs, for example, to an optical fiber.

[0102] The detector 05 can convert the received light signal into a current signal and transmit the current signal to the transimpedance amplifier 06. The transimpedance amplifier 06 is used to convert the received current signal into a voltage signal and transmit it to the signal processing unit 01 for processing, and output the processed electrical signal.

[0103] The main application scenarios of the optical module provided in the embodiment of the present application can be high-speed coherent optical transmission, metropolitan area optical communication, short-distance interconnection system, etc. The optical module can be pluggable or non-pluggable, which is not limited in the embodiment of the present application.

[0104] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "at least one" refers to one or more, and "a plurality" refers to two or more, unless otherwise expressly defined.

[0105] The various different types of embodiments provided in the embodiments of this application can be referenced with each other, and the embodiments of this application are not limited thereto. In the corresponding embodiments provided in this application, it should be understood that the disclosed resistance matching structure, chip, optical device, optical module, etc. can be implemented through other configurations. In the corresponding embodiments provided in this application, it should be understood that the disclosed structure can be implemented through other configurations. For example, the embodiments described above are merely illustrative.

[0106] The above are merely optional embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and such modifications or substitutions should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A resistance matching structure, characterized in that: include: multiple strip-shaped resistors and conductive structures; The ends of the strip resistors close to the conductive structure are connected to the conductive structure, and the ends of the strip resistors away from the conductive structure are used to connect to the strip conductors. The multiple strip resistors are used to connect multiple strip conductors; the total impedance of the multiple strip resistors is equal to the total characteristic impedance of the multiple strip conductors; There is at least one resistor pair among the plurality of strip resistors. Each resistor pair includes two adjacent strip resistors capable of mutual induction. The strip conductors connected by the two strip resistors have different potentials.

2. The resistance matching structure according to claim 1, wherein: The two strip resistors are arranged in parallel.

3. The resistance matching structure according to claim 1 or 2, characterized in that: The two strip resistors are spiral-shaped.

4. The resistance matching structure according to any one of claims 1 to 3, characterized in that: Each of the two strip resistors includes: a plurality of first structures and at least one second structure, and every two adjacent first structures are connected by a second structure; the resistivity of the first structure is greater than the resistivity of the second structure; The first structures in the two strip resistors correspond one-to-one, and the second structures in the two strip resistors also correspond one-to-one; for any one of the first structures and the second structures, the arrangement direction of the any one structure and the corresponding structure is perpendicular to the extension direction of the position of the any one structure in the strip resistor where the any one structure is located; in the arrangement direction, the spacing between the corresponding two first structures is greater than the spacing between the corresponding two second structures.

5. The resistance matching structure according to any one of claims 1 to 4, characterized in that: The plurality of strip resistors are arranged in sequence, and the number of the strip resistors is an even number greater than 2; The strip conductors connected to the 2nth strip resistor and the 2n+1th strip resistor among the plurality of strip resistors have the same potential, n≥1, and the strip conductors connected to the first strip resistor and the last strip resistor among the plurality of strip resistors have the same potential; The 2m+1th strip resistor and the 2m+2th strip resistor among the plurality of strip resistors form the resistor pair, where m≥0.

6. The resistance matching structure according to any one of claims 1 to 4, characterized in that: The plurality of strip resistors are arranged in sequence, and the number of the strip resistors is greater than 2; The strip conductors connected to adjacent strip resistors in the plurality of strip resistors have different potentials, and the strip conductors connected to the first strip resistor and the last strip resistor in the plurality of strip resistors have the same potential; Every two adjacent strip-shaped resistors in the plurality of strip-shaped resistors form a resistor pair.

7. The resistance matching structure according to any one of claims 1 to 6, characterized in that: The two strip resistors offset at least part of each other's inductance, and the inductances of the multiple strip resistors are offset to zero.

8. The resistance matching structure according to any one of claims 1 to 7, characterized in that: The resistivity of at least one strip resistor among the plurality of strip resistors is greater than the resistivity of the conductive structure.

9. The resistance matching structure according to any one of claims 1 to 8, characterized in that: The resistivity of at least one strip resistor among the plurality of strip resistors is greater than the resistivity of the strip conductor.

10. The resistance matching structure according to any one of claims 1 to 9, characterized in that: The resistivity of the strip conductor is equal to the resistivity of the conductive structure.

11. The resistance matching structure according to any one of claims 1 to 10, characterized in that: The resistance matching structure further includes: the strip conductor.

12. The resistance matching structure according to claim 11, wherein: The resistance matching structure further includes: an optical waveguide; the optical waveguide is located in the electric field formed between the plurality of strip conductors.

13. The resistance matching structure according to claim 12, wherein: The resistivity of the plurality of strip resistors is greater than the resistivity of the strip conductor; the resistance matching structure is a modulator, the strip conductor is used to connect to a driver, and the conductive structure is connected to a power source connected to the driver.

14. The resistance matching structure according to any one of claims 1 to 13, characterized in that: The resistance matching structure further includes: a plurality of connecting electrodes, the plurality of connecting electrodes corresponding to the plurality of strip conductors one-to-one, and the strip conductors are connected to the strip resistors through the corresponding connecting electrodes.

15. A chip, characterized in that: The invention comprises a substrate, and a resistance matching structure according to any one of claims 1 to 14 located on the substrate.

16. An optical device, characterized in that: include: A connection structure, and a chip according to claim 15; The connection structure is used to connect the chip to at least one component outside the optical device.

17. An optical module, characterized in that: include: An electrical device and an optical device as claimed in claim 16.

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