Mounting head and component mounting device

Abstract

This mounting head comprises: a plurality of shafts to which component suction nozzles are connected and which are aligned in a first direction intersecting a lifting / lowering direction; a shaft holding part that holds the plurality of shafts such that the plurality of shafts can each be lifted and lowered; a manifold that has an air flow passage through which air to be supplied to the component suction nozzles flows; and a plurality of flow rate sensors. The air flow passage is provided with terminal flow passages. The terminal flow passages are provided in a plurality so as to correspond to the plurality of component suction nozzles, and are each connected to the corresponding component suction nozzle. The flow rate sensors are individually connected to the terminal flow passages so as to measure the flow rate of air in the terminal flow passages. The manifold is disposed on a lateral side separated from the shaft holding part in a second direction intersecting the lifting / lowering direction and the first direction.

Description

Mounting head and component mounting device

[0001] The present disclosure relates to a mounting head and a component mounting apparatus including the same.

[0002] 2. Description of the Related Art Conventionally, there has been known a component mounting apparatus in which a component is held by a nozzle of a mounting head and mounted on a board (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2008-103412

[0004] In the mounting head of Patent Document 1, a manifold incorporating a portion of the air flow path that supplies air to the nozzle is located near an elevation mechanism that raises and lowers the nozzle in the Z-axis direction. The manifold is equipped with a valve that switches between positive and negative pressure air and a flow sensor that measures the flow rate of air flowing through the air flow path. If the distance between the nozzle and the manifold is long, the responsiveness of the switch between positive and negative pressure air decreases.

[0005] An object of the present disclosure is to solve the above-mentioned problems and to provide a mounting head with improved air switching responsiveness and a component mounting device equipped with the same.

[0006] To achieve the above object, the mounting head of the present disclosure includes a plurality of shafts to which component suction nozzles are connected and which are arranged side by side in a first direction intersecting a lifting direction, a shaft holder for holding the plurality of shafts so that they can be lifted and lowered, a manifold having an air flow path through which air flows to the component suction nozzles, a plurality of valve devices attached to the manifold and including first and second valves for switching the air supplied to the suction nozzles, and a plurality of flow sensors. The air flow path includes a positive pressure flow path connected to a positive pressure source, a negative pressure flow path connected to a negative pressure source, a plurality of terminal flow paths provided corresponding to the plurality of component suction nozzles and connected to the corresponding component suction nozzles, a plurality of positive pressure inlet flow paths individually connecting the plurality of first valves to the positive pressure flow path, a plurality of connection flow paths provided corresponding to the plurality of valve devices and communicating the first valves with the second valves, and a plurality of negative pressure inlet flow paths individually connecting the plurality of second valves to the negative pressure flow path. The flow rate sensors are individually connected to the terminal flow paths to measure the flow rate of air in the terminal flow paths, and the manifold is disposed laterally away from the shaft holding portion in the lifting direction and in a second direction intersecting the first direction.

[0007] The component mounting device of the present disclosure also includes the above-described mounting head, a component supply unit that supplies components to the component suction nozzle of the mounting head, and a board transport mechanism that transports the board on which the components are to be mounted by the mounting head.

[0008] According to the present disclosure, it is possible to provide a mounting head with improved air switching responsiveness and a component mounting device including the same.

[0009] Schematic plan view of a component mounting device according to an embodiment. Perspective view of a mounting head according to an embodiment. Perspective view of a mounting head according to an embodiment. Schematic side view of a mounting head according to an embodiment. Schematic perspective view of a mounting head according to an embodiment. Schematic side view of a first nozzle unit and a second nozzle unit according to an embodiment. Schematic plan view showing a component suction nozzle at the bottom of the mounting head according to an embodiment. Schematic plan view showing a lift motor at the top of the mounting head according to an embodiment. Schematic sectional view showing a peripheral configuration of a manifold according to an embodiment. Schematic front view showing a state in which a connecting member is attached to the mounting head according to an embodiment. Schematic side view showing a state in which a connecting member is attached to the mounting head according to an embodiment. Schematic perspective view showing a manifold according to an embodiment and its peripheral configuration. Schematic perspective view of a manifold according to an embodiment. Schematic perspective view of a manifold according to an embodiment.

[0010] A mounting head according to a first aspect of the present disclosure includes a plurality of shafts connected to component suction nozzles and arranged side by side in a first direction intersecting a lifting direction, a shaft holder for holding each of the shafts so that the shafts can be lifted and lowered, a manifold having an air flow path through which air flows to the component suction nozzles, a plurality of valve devices attached to the manifold and corresponding to the component suction nozzles, each including a first valve and a second valve for switching the air supplied to the suction nozzles, and a plurality of flow sensors. The air flow path includes a positive pressure flow path connected to a positive pressure source, a negative pressure flow path connected to a negative pressure source, a plurality of terminal flow paths provided corresponding to the plurality of component suction nozzles and connected to the corresponding component suction nozzles, a plurality of positive pressure inlet flow paths individually connecting the plurality of first valves to the positive pressure flow path, a plurality of connection flow paths provided corresponding to the plurality of valve devices and communicating the first valves with the second valves, and a plurality of negative pressure inlet flow paths individually connecting the plurality of second valves to the negative pressure flow path. The flow rate sensors are individually connected to the terminal flow paths to measure the flow rate of air in the terminal flow paths, and the manifold is disposed laterally away from the shaft holding portion in the lifting direction and in a second direction intersecting the first direction.

[0011] According to the mounting head of the first aspect, the manifold equipped with a valve for switching between positive and negative air pressure is positioned opposite the shaft, thereby shortening the distance from the valve to the component suction nozzle, thereby reducing air resistance in the air flow path from the valve to the component suction nozzle and improving the responsiveness of switching between positive and negative air pressure.

[0012] According to a second aspect of the present disclosure, in the mounting head of the first aspect, the manifold includes a first main surface and a second main surface, the first valve and the second valve are attached to the first main surface, the flow sensor is connected to the terminal flow path from the second main surface, and the second main surface faces the plurality of shafts.

[0013] According to a third aspect of the present disclosure, the mounting head of the second aspect has a substrate having the plurality of flow sensors, and the flow sensors and the terminal flow path are connected with the substrate attached to the second main surface of the manifold.

[0014] According to a fourth aspect of the present disclosure, in the mounting head of the third aspect, the second main surface of the manifold has a recess for avoiding interference with components attached to the board.

[0015] According to a fifth aspect of the present disclosure, in the mounting head of any one of the first to fourth aspects, the component suction nozzle is connected to the terminal flow path via an air filter, and the air filter is housed in the manifold.

[0016] According to a sixth aspect of the present disclosure, in a mounting head of any one of the first to fifth aspects, a plurality of shafts are arranged in two rows spaced apart in the lifting direction and in a second direction intersecting the first direction, and two manifolds are arranged on one side and the other side of the second direction so as to face the shafts in each row.

[0017] According to a seventh aspect of the present disclosure, in the mounting head of any one of the first to sixth aspects, the manifold is attached to the shaft holding portion.

[0018] According to an eighth aspect of the present disclosure, in the mounting head of any one of the first to seventh aspects, the flow sensor is a branch-type flow sensor.

[0019] A component mounting device of a ninth aspect of the present disclosure includes a mounting head of any one of the first to eighth aspects, a component supply unit that supplies components to the component suction nozzle of the mounting head, and a substrate transport mechanism that transports a substrate on which components are mounted by the mounting head.

[0020] (Embodiments) Exemplary embodiments of a mounting head and a component mounting device according to the present disclosure will be described below with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present disclosure. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the mounting head and the component mounting device.

[0021] In the following description, the two axes that are orthogonal to each other in the horizontal plane are defined as the X-axis direction in the substrate transport direction and the Y-axis direction that is orthogonal to the substrate transport direction, and the height direction that is orthogonal to the horizontal plane is defined as the Z-axis direction.

[0022] (Component Mounting Apparatus) First, the configuration of a component mounting apparatus 2 will be described with reference to Fig. 1. Fig. 1 is a schematic plan view showing a component mounting apparatus 2 according to an embodiment.

[0023] The component mounting device 2 has a function of performing a component mounting operation of mounting components (electronic components) such as dies and IC chips supplied from the component supply units 4 and 6 onto the substrates W1 and W2. The component mounting device 2 constitutes a component mounting system that mounts components onto the substrates W1 and W2.

[0024] The component mounting apparatus 2 of this embodiment has the function of processing two boards W1 and W2 in parallel using two component supply units 4 and 6 and two mounting heads 26 A and 26 B. The component mounting apparatus 2 is not limited to processing multiple boards in parallel, and may also be used to process only one board individually.

[0025] Board transport mechanisms 10 and 12 are arranged along the X-axis direction at the center of base 8. Board transport mechanisms 10 and 12 each transport boards W1 and W2 carried in from upstream in the X-axis direction and position them at a predetermined mounting work position. Board transport mechanisms 10 and 12 each carry out boards W1 and W2 downstream after component mounting work has been completed. Board transport mechanisms 10 and 12 may be, for example, conveyors equipped with transport rollers and a drive motor, or may be a combination of a slider and an electric actuator.

[0026] Component supply units 4 and 6 are arranged on both sides of the board transport mechanisms 10 and 12 in the Y-axis direction. Each of the component supply units 4 and 6 has a plurality of tape feeders 14 and 16 arranged side by side along the X-axis direction. The tape feeders 14 and 16 are attached to carriages 15 and 17, respectively, and feed a carrier tape containing components by pitch feeding to sequentially supply the components to predetermined component supply positions.

[0027] 1, Y-axis beams 18 and 20 equipped with Y-axis linear drive mechanisms are arranged along the Y-axis on both sides of the base 8 in the X-axis direction. The Y-axis beams 18 and 20 are equipped with linear rails extending in the Y-axis direction, and X-axis beams 22 and 24 are engaged therewith so as to be able to slide freely in the Y-axis direction.

[0028] The X-axis beams 22 and 24 are each equipped with a moving table 22T, 24T that moves along a linear rail (not shown) extending in the X-axis direction, and an X-axis linear drive mechanism (not shown) that moves the moving table 22T, 24T along the linear rail. Mounting heads 26A, 26B are attached to the moving tables 22T, 24T. The mounting heads 26A, 26B are detachable from the moving tables 22T, 24T.

[0029] The first mounting head 26A engaged with the X-axis beam 22 is a head that picks up components supplied from the component supply unit 4 and mounts them on the boards W1 and W2. The second mounting head 26B engaged with the X-axis beam 24 is a head that picks up components supplied from the component supply unit 6 and mounts them on the boards W2 and W1.

[0030] The Y-axis beams 18 and 20 and the X-axis beams 22 and 24 constitute a head moving mechanism that moves the mounting heads 26A and 26B within the XY plane.

[0031] Component recognition cameras 28, 30 are provided between the component supply units 4, 6 and the board transport mechanisms 10, 12, respectively. Mounting heads 26A, 26B that have picked up components from the component supply units 4, 6 move above the component recognition cameras 28, 30, thereby acquiring images of the components held by mounting heads 26A, 26B. The acquired images are subjected to recognition processing to detect any misalignment of the components while they are held by mounting heads 26A, 26B.

[0032] Mounting heads 26A and 26B are respectively equipped with head cameras 32 and 34 that move integrally. The head cameras 32 and 34 are attached to the mounting heads 26A and 26B with their imaging optical axes facing downward, and capture images of the boards W1 and W2 facing downward from above the boards W1 and W2. The captured images are processed to detect misalignment of the boards W1 and W2, i.e., misalignment of the mounting points. Then, based on the detection results of the component misalignment and the mounting point misalignment, position correction is performed during component mounting. The position correction includes rotational alignment, which aligns the rotational position of the component around the θ axis in the correct direction.

[0033] The component mounting apparatus 2 further includes a main body control unit 36. The main body control unit 36 ​​is a control unit that controls each component of the component mounting apparatus 2. The main body control unit 36 ​​is configured, for example, by a microcomputer that includes a processor and a memory that stores a computer program executed by the processor.

[0034] (Mounting Head) Next, the detailed configuration of the mounting heads 26A and 26B will be described with reference to Figure 2 and subsequent drawings. Because the two mounting heads 26A and 26B have the same structure, in the following description they will be collectively referred to as "mounting head 26," and only one mounting head 26 will be described.

[0035] 2 and 3 are perspective views of the mounting head 26. Fig. 4 is a schematic side view of the mounting head 26, and Fig. 5 is a schematic perspective view of the mounting head 26.

[0036] 2 to 5, the mounting head 26 is provided with a head cover 38 that covers the top of the mounting head 26. A main board 39 for controlling the entire mounting head 26 is disposed inside the head cover 38. The main board 39 is electrically connected to the main body control unit 36 ​​shown in FIG. 1, and is also referred to as the "head control unit."

[0037] The mounting head 26 further includes a first nozzle unit 40 and a second nozzle unit 50 as units for picking up components.

[0038] Each of the nozzle units 40 and 50 is a unit that is configured with a plurality of component suction nozzles and a drive mechanism for driving the nozzles. The first nozzle unit 40 has a plurality of component suction nozzles 41 (41A to 41H) arranged along the X-axis direction, and the second nozzle unit 50 has a plurality of component suction nozzles 51 (51A to 51H) arranged along the X-axis direction.

[0039] In this embodiment, the component suction nozzle 41 has eight component suction nozzles 41A to 41H, and the component suction nozzle 51 has eight component suction nozzles 51A to 51H. The number of component suction nozzles 41, 51 in each nozzle unit 40, 50 is not limited to eight, and may be any number.

[0040] The first nozzle unit 40 and the second nozzle unit 50 are arranged in the Y-axis direction, which is perpendicular to the X-axis direction, to form two rows of nozzle units. Each mounting head 26 is equipped with 8 nozzles x 2 rows = a total of 16 component suction nozzles 41, 51. Note that the nozzle units 40, 50 are not limited to being arranged in two rows, and may be arranged in only one row, for example.

[0041] The other components of the nozzle units 40, 50 also have a corresponding number of component suction nozzles 41, 51, and will be represented in the same manner as "XX (XXA to XXH)" in the following explanations and drawings.

[0042] FIG. 6 is a schematic side view of the first nozzle unit 40 and the second nozzle unit 50. As shown in FIG.

[0043] The first nozzle unit 40 has a plurality of shafts 45 (45A to 45H), a plurality of pulleys 46 (46A to 46H), and a plurality of air connection parts 47 (47A to 47H) as a drive mechanism for driving the plurality of component suction nozzles 41.

[0044] The mounting head 26 further includes a motor unit 60 in addition to the first nozzle unit 40 and the second nozzle unit 50. The motor unit 60 includes a plurality of lift motors 42 (42A to 42H) and a plurality of output shafts 43 (43A to 43H), a plurality of lift motors 52 (52A to 52H) and a plurality of output shafts 53 (53A to 53H), and brackets 63 and 64, which will be described later.

[0045] The lifting motor 42 is a linear motor that raises and lowers the output shaft 43 in the Z-axis direction (arrow Z1). Offset blocks 44 (44A to 44H) are connected to the lower end of the output shaft 43. The offset blocks 44 are blocks that offset the positions of the output shaft 43 and the shaft 45 in the horizontal direction. The output shaft 43 is connected to the upper surface of the offset block 44, and the shaft 45 is connected to the lower surface of the offset block 44.

[0046] The shaft 45 is a shaft for raising and lowering the component suction nozzle 41 and is connected to the component suction nozzle 41. When the output shaft 43 and the shaft 45 rise and fall together (arrow Z1), the component suction nozzle 41 attached to the lower end of the shaft 45 rises and falls (arrow Z2).

[0047] A pulley 46 is attached to the middle of the shaft 45. Each pulley 46 is engaged with a belt connected to a rotary motor 100 shown in FIG. 5 , and when the rotary motor 100 rotates the belt, the pulleys 46 rotate together around the Z-axis direction. Accordingly, the shafts 45 and the component suction nozzles 41 rotate together. Note that any structure may be used for transmitting power to the pulleys 46 via the belt, and for example, the structure described in Japanese Patent No. 4,894,841 may be used.

[0048] The air connection part 47 is a connecting member for supplying air to the suction holes 48 (48A to 48H) of the component suction nozzle 41. The air connection part 47 is connected to a connection hose 72 (72A to 72H) shown in FIG.

[0049] Similarly, the second nozzle unit 50 has a plurality of shafts 55 (55A to 55H), a plurality of pulleys 56 (56A to 56H), and a plurality of air connections 57 (57A to 57H) as a drive mechanism for driving the plurality of component suction nozzles 51. An offset block 54 (54A to 54H) is provided between the shaft 55 and the output shaft 53.

[0050] As the output shaft 53 and shaft 55 move up and down together (arrow Z3), the component suction nozzles 51 connected to the shaft 55 move up and down together (arrow Z4). Suction holes 58 (58A-58H) are provided at the lower end of the component suction nozzle 51, and air is supplied to the suction holes 58 via an air connection 57. Connection hoses 82 (82A-82H) shown in FIG. 4 are connected to the air connection 57. Each pulley 56 attached to the middle of the shaft 55 engages with a belt connected to a rotary motor 102 shown in FIG. 5. When the rotary motor 102 rotates the pulleys 56, the shafts 55 and the component suction nozzles 51 rotate together about the Z-axis.

[0051] The offset block 44 offsets the position of the shaft 45 in the Y-axis direction relative to the lift motor 42 and the output shaft 43 away from the second nozzle unit 50 (arrow Y1). The offset block 54 offsets the position of the shaft 55 in the Y-axis direction relative to the lift motor 52 and the output shaft 53 away from the first nozzle unit 40 (arrow Y2).

[0052] 7 is a schematic plan view showing the component suction nozzles 41 and 51 at the bottom of the mounting head 26, and FIG. 8 is a schematic plan view showing the lift motors 42 and 52 at the top of the mounting head 26.

[0053] 7, a guide block 37 is provided between the component suction nozzles 41 and 51. The guide block 37 is a block for guiding the lifting and lowering of the component suction nozzles 41 and 51. The guide block 37 has a first surface 37A that engages the component suction nozzles 41 and a second surface 37B that engages the component suction nozzles 51. The first surface 37A and the second surface 37B are provided with grooves (not shown) that position the component suction nozzles 41 and 51 horizontally so that they can be lifted and lowered.

[0054] The pitch between component suction nozzles 41 and 51 in the Y-axis direction is D1, and the pitch in the X-axis direction is D2. Due to the presence of guide block 37, it is necessary to ensure that pitch D1 in the Y-axis direction is at least a certain length.

[0055] 6 , the first bracket 63 is a member that holds the plurality of lift motors 42 and the plurality of lift motors 52 at a first height position. The second bracket 64 is a member that holds the plurality of lift motors 42 and the plurality of lift motors 52 at a second height position that is lower than the first height position. The two brackets 63, 64 are also used as members for attaching a support frame 90, which will be described later.

[0056] The mounting head 26 further includes a shaft holder 66 that holds the shafts 45 and 55 so that they can be raised and lowered. The configuration of the shaft holder 66 will be described later.

[0057] As shown in FIG. 4, the mounting head 26 includes, as components related to the first nozzle unit 40, a manifold 70, connection hoses 72 (72A to 72H), valves 74 (74A to 74H), and valves 76 (76A to 76H).

[0058] The manifold 70 is a member for supplying air to the component suction nozzles 41. The manifold 70 has multiple internal flow paths for the air to flow through, and is equipped with multiple valves 74, 76 of two types that communicate with the internal flow paths.

[0059] The valves 74 and 76 are components for switching the communication state between the internal flow paths of the manifold 70 to switch the type of air supplied to the component suction nozzles 41. A pair of one valve 74 and one valve 76 constitutes one valve device 69. The valve 74 is located downstream, and the valve 76 is located upstream. One valve device 69 is provided for each shaft 45, in other words, for each component suction nozzle 41.

[0060] In this embodiment, the manifold 70 allows three types of air to flow: positive pressure air, negative pressure air, and atmospheric pressure air. By opening and closing the valves 74 and 76, it is possible to selectively supply one of the three types of air to the component suction nozzle 41. The valves 74 and 76 are, for example, solenoid valves, and more specifically, three-port solenoid valves.

[0061] Similarly, for the second nozzle unit 50, the mounting head 26 includes a manifold 80, connection hoses 82 (82A to 82H), valves 84 (84A to 84H), and valves 86 (86A to 86H).

[0062] FIG. 9 is a schematic vertical cross-sectional view showing the peripheral configuration of the manifolds 70 and 80. As shown in FIG.

[0063] 9, manifold 70 has a plurality of air flow paths 71 therein, and valves 74, 76 are attached so as to communicate with air flow paths 71. Each of valves 74 is electrically connected to I / O board 73 via connectors 75 (75A to 75H) and wiring (not shown). Each of valves 76 is also electrically connected to I / O board 73 via connectors 77 (77A to 77H) and wiring (not shown).

[0064] A sensor board 78 is also electrically connected to the I / O board 73. The sensor board 78 is a board on which a flow sensor is mounted for measuring the flow rate of air flowing through the internal flow passages of the manifold 70. The sensor board 78 is attached to the manifold 70, and in particular, to the second main surface 70B opposite to the first main surface 70A on which the valves 74 and 76 are attached.

[0065] The I / O board 73 is fixed to the upper surface (third surface) of the manifold 70 via a fixing member 79 .

[0066] Similar to manifold 70, manifold 80 has a plurality of air flow paths 81, and valves 84, 86 are attached so as to communicate with air flow paths 81. Valves 84 (second valves) are each electrically connected to I / O board 83 via connectors 85 (85A to 85H) and wiring (not shown), and valves 86 (first valves) are each electrically connected to I / O board 83 via connectors 87 (87A to 87H) and wiring (not shown).

[0067] The I / O board 83 is fixed to the upper surface of the manifold 80 via a fixing member 89. The I / O board 83 is further electrically connected to a sensor board 88 on which a flow rate sensor is mounted.

[0068] The I / O board 73 is electrically connected to the main board 39 shown in Figures 2 and 3 via wiring (not shown). The I / O board 83 is not connected to the main board 39, but is electrically connected to the I / O board 73 via wiring (not shown).

[0069] According to the above configuration, the wiring (16 wirings in total) of the valves 74, 76 and the wiring (1 wirings in total) of the sensor board 78 are collected and connected to the I / O board 73, and the wiring (16 wirings in total) of the valves 84, 86 and the wiring (1 wirings in total) of the sensor board 88 are collected and connected to the I / O board 83. In this state, by connecting the I / O board 83 to the I / O board 73 and connecting the I / O board 73 to the main board 39, the main board 39 can control the opening and closing of all the valves 74, 76, 84, 86 and obtain the measured values ​​of the flow rate sensors on the sensor boards 78, 88.

[0070] Furthermore, when performing maintenance on the valves 74, 76, 84, 86 or the sensor boards 78, 88, etc., it is sufficient to individually plug and unplug the wires between the I / O board 73 and the connectors 75, 77 and the wires between the I / O board 83 and the connectors 85, 87. Therefore, compared to when the wires are directly connected to the main board 39, there is no need to plug and unplug unrelated wires or remove components such as the head cover 38, improving workability during maintenance.

[0071] In this embodiment, communication on each line is performed by serial communication.

[0072] Returning to FIG. 4, the mounting head 26 further includes a support frame 90 .

[0073] The support frame 90 is a frame for supporting the components of the mounting head 26, including the nozzle units 40 and 50. The support frame 90 is fixed to the moving table 22T or 24T (see also FIGS. 1 and 4) with bolts or a clamp mechanism. The support frame 90 of this embodiment supports the components of the mounting head 26, including the nozzle units 40 and 50, in a cantilever manner on one side in the Y-axis direction via attachment members 92, 94, and 96, which will be described later.

[0074] The support frame 90 has three types of mounting members: a first mounting member 92 , a second mounting member 94 , and a third mounting member 96 .

[0075] All three types of mounting members 92, 94, 96 are provided to protrude from the support frame 90 to one side in the Y-axis direction. The mounting members 92, 94, 96 may also be referred to as "support posts" as they cantilever the components of the mounting head 26, including the nozzle units 40 and 50.

[0076] The first mounting member 92 is attached to the first bracket 63 of the motor unit 60, the second mounting member 94 is attached to the second bracket 64 of the motor unit 60, and the third mounting member 96 is attached to the second blocks 106, 108 described later.

[0077] With this structure, high rigidity can be achieved by supporting the box-shaped motor unit 60 and the shaft holder 66 in a cantilevered manner by the mounting members 92, 94, and 96. This eliminates the need to provide high rigidity to the multiple lift motors 42, 52 themselves (FIG. 6), and eliminates the need to add members (such as rigid plates) to the lift motors 42, 52 to maintain high rigidity, leading to a reduction in the weight and size of the mounting head 26.

[0078] As shown in FIG. 5, the mounting head 26 further includes rotation motors 100 and 102 .

[0079] Rotary motors 100 and 102 are motors for rotating shafts 45 and 55, respectively, shown in Fig. 6 etc. Rotary motor 100 rotates multiple shafts 45 in synchronization via a belt and pulley 46 (not shown), and rotary motor 102 rotates multiple shafts 55 in synchronization via another belt and pulley 56 (not shown).

[0080] As shown in FIG. 5, two rotary motors 100 , 102 are supported by second blocks 106 , 108 of the shaft holder 66 .

[0081] The shaft holding portion 66 includes a first block 104, a shaft case 105 (FIGS. 6 and 9), and second blocks 106 and 108.

[0082] The first block 104 is a block that holds the shafts 45, 55 shown in FIG. 6 and other figures so that they can be inserted therethrough. The first block 104 holds a plurality of shaft cases 105, through which the shafts 45, 55 are individually inserted. The shaft cases 105 are cylindrical members that extend vertically, and a rotor 105A having a spline structure that guides the shafts 45, 55 in the Z-axis direction is built into the shaft case 105 (see FIG. 9 ). The rotor 105A is mounted within the shaft case 105 in a state that allows it to rotate about the Z-axis direction. Therefore, the shaft holder 66 supports the shafts 45, 55 so that they can move in the Z-axis direction and rotate about the Z-axis direction.

[0083] The second blocks 106 and 108 are blocks for supporting the rotary motors 100 and 102, respectively. The second blocks 106 and 108 are disposed outward in the X-axis direction relative to the first block 104. A third mounting member 96, which protrudes from the support frame 90, is attached to the second blocks 106 and 108.

[0084] As shown in FIG. 5, the mounting head 26 further includes connecting members 110 and 112 .

[0085] The connecting members 110 and 112 are members that connect the motor unit 60 and the shaft holding portion 66 to each other. The connecting members 110 and 112 extend in the Z-axis direction so as to connect the motor unit 60 and the shaft holding portion 66 that are separated from each other in the Z-axis direction.

[0086] By providing the connecting members 110 and 112, as will be described later, it is possible to suppress bending of the tip end of the mounting head 26 that occurs when multiple shafts 45 or multiple shafts 55 are lowered simultaneously, leading to improved mounting accuracy. The connecting members 110 and 112 may also be called "suspenders."

[0087] In this embodiment, the upper ends of the connecting members 110 , 112 are attached to the second bracket 64 of the motor unit 60 , and the lower ends of the connecting members 110 , 112 are attached to the second blocks 106 , 108 of the shaft holding portion 66 .

[0088] As shown in FIG. 4, the motor unit 60 is provided with cooling fans 114 and 116 .

[0089] The cooling fans 114, 116 are fans for cooling the lift motors 42, 52, which are heat-generating elements, and are provided in positions where they blow air onto the lift motors 42, 62 that house the lift motors 42, 52. In this embodiment, the cooling fans 114, 116 are fixed between the first bracket 63 and the second bracket 64 of the motor unit 60.

[0090] As shown in Figure 8, cooling fan 114 and cooling fan 116 are positioned opposite each other in the Y-axis direction, with cooling fan 114 positioned to blow air in the +Y direction toward lift motor 42, and cooling fan 116 positioned to blow air in the -Y direction toward lift motor 52.

[0091] By arranging the two cooling fans 114, 116 opposite each other, the lift motors 42, 52 of the nozzle units 40, 50 can be efficiently cooled even when the nozzle units 40, 50 are arranged in two rows in the Y-axis direction. Furthermore, when the airflows blown out from the two cooling fans 114, 116 collide with each other, the airflow also flows outward along the X-axis direction, which is perpendicular to the Y-axis direction. This makes it possible to efficiently cool not only the lift motors 42, 52 in the center in the X-axis direction, but also the lift motors 42, 52 at both ends in the X-axis direction.

[0092] 9, mounting head 26 further includes manifold mounting members 200 for mounting manifold 70 to first block 104, and manifold mounting members 202 for mounting manifold 80 to first block 104. At least two manifold mounting members 200, 202 are provided at different height positions, and manifolds 70, 80 are mounted to first block 104 via fixing means such as screws (not shown).

[0093] Next, reference is made to Figures 10 and 11. Figures 10 and 11 are a front view and a side view showing the state in which the connecting members 110 and 112 are attached to the mounting head 26.

[0094] 10 and 11 , the cooling fan 114 is fixed to the brackets 63, 64 by a fan fixing device 115. The fan fixing device 115 fixes the upper part of the cooling fan 114 to the first bracket 63 and the lower part of the cooling fan 114 to the second bracket 64 via fixing means such as screws (not shown).

[0095] (Manifold) Next, the peripheral configuration of the manifolds 70, 80 will be described with reference to Figure 12 and subsequent drawings. Note that, since the manifold 70 and the manifold 80 and their peripheral configurations have the same structure, the following description will mainly illustrate and describe the manifold 70 and its peripheral configuration.

[0096] 12 and 13 are perspective views showing the manifold 70 and its surrounding structure, respectively, and FIGS. 14 and 15 are perspective views showing the manifold 70 alone.

[0097] 12 and 13 , the manifold 70 has three surfaces: a first main surface 70A (first side surface), a second main surface 70B (second side surface), and a third surface 70C (top surface). The first main surface 70A is a surface for attaching the valves 74 and 76, the second main surface 70B is a surface for attaching the sensor substrate 78, and the third surface 70C is a surface for attaching a fixing member 79 ( FIG. 13 ) that fixes the I / O substrate 73.

[0098] 12 and 13 , the I / O board 73 is housed in a board housing box 154. A fixing member 79 shown in FIG. 13 fixes the board housing box 154 to the third surface 70C of the manifold 70, thereby fixing the I / O board 73 to the manifold 70.

[0099] As shown in Fig. 14, a plurality of ports are provided on the first main surface 70A of the manifold 70 to connect the air flow path 71 of the manifold 70 to the valves 74, 76 (not shown). In the example shown in Fig. 14, six rows of ports are provided vertically, including ports 160 (160A to 160H), ports 162 (162A to 162H), ports 164 (164A to 164H), ports 166 (166A to 166H), ports 168 (168A to 168H), and port 170. The ports 170 are, for example, grooves arranged on the first main surface 70A of the manifold 70.

[0100] The manifold 70 further incorporates a negative pressure flow path 172 and a positive pressure flow path 174 as air flow paths 71. The negative pressure flow path 172 is connected to a negative pressure source 212 via ports V1 and V2 and a connecting member (not shown). The positive pressure flow path 174 is connected to a positive pressure source 214 via port P1 and a connecting member (not shown). The negative pressure source 212 is, for example, a vacuum pump, and the positive pressure source 214 is, for example, an air compressor.

[0101] 15, the second main surface 70B of the manifold 70 is provided with a plurality of ports for connecting the air flow paths 71 of the manifold 70 to the flow rate sensors of the sensor substrate 78 (not shown). The second main surface 70B of the manifold 70 also has a step 70Ba at its upper portion that is recessed toward the first main surface 70A. Therefore, other components can be placed in the space above the step 70Ba, and the thickness of the component mounting device 2 in the Y-axis direction can be reduced.

[0102] 15 , ports 176 (176A to 176H) for communicating with the flow sensors of the sensor substrate 78 and recesses 178 (178A to 178H) different from the ports 176 are alternately provided on the second main surface 70B. The recesses 178 are shaped to accommodate components (e.g., resistor components) different from the flow sensors mounted on the sensor substrate 78, and do not communicate with the air flow path 71. The second main surface 70B of the manifold 70 has recesses 178 below the step 70Ba that accommodate components attached to the sensor substrate 78. The recesses 178 prevent interference with the components attached to the sensor substrate 78, allowing the thickness of the integrated manifold 70 and sensor substrate 78 in the Y-axis direction to be reduced.

[0103] Fig. 16 is a perspective view of the sensor board 78. Figs. 17 and 18 are vertical cross-sectional views for explaining a method of attaching the sensor board 78 to the manifold 70.

[0104] As shown in FIG. 16, the sensor board 78 includes a board main body 180 , a plurality of flow sensors 182 ( 182 A to 182 H), an I / O chip 183 , a connector 222 , and an integrated circuit 224 .

[0105] The board main body 180 is a plate-shaped board on which a flow sensor 182 and other electrical components are mounted. The flow sensor 182 is a component for measuring the flow rate of air flowing through the terminal flow paths 161 (161A to 161H) in the air flow path 71 of the manifold 70. The multiple flow sensors 182 are arranged in a row with spaces between them, and are inserted into each of the multiple ports 176 of the manifold 70 shown in FIG.

[0106] The I / O chip 183 is a chip electrically connected to each of the plurality of flow sensors 182. The I / O chip 183 is electrically connected to each of the flow sensors 182 through wiring formed on the substrate main body 180. The I / O chip 183 is connected to the I / O substrate 73 (FIG. 12) through wiring (not shown).

[0107] As shown in FIG. 17 , the flow sensor 182 of this embodiment has two connection portions 184, and the port 176 of the manifold 70 also has two corresponding recesses 177. The two recesses 177 are connected to the terminal flow path 161 by branch flow paths 179. One branch flow path 179 is formed downstream of the other branch flow path 179. The two connection portions 184 are convex, and a sealant 185 is disposed around the bottom of each connection portion 184. The sealant 185 is, for example, an O-ring. The opening diameter of the recess 177 is larger than the diameter of the connection portion 184, allowing the flow sensor 182 to be mounted on the substrate main body 180 even if the positions of the multiple connection portions 184 of the flow sensor 182 and the multiple recesses 177 of the port 176 of the manifold 70 are slightly misaligned. Furthermore, by providing the seal surface 177 a on the side surface of the manifold 70 that extends continuously from the recess 177 rather than inside the recess 177, the tolerance for misalignment is increased. This makes it possible to reduce the assembly precision required of the sensor substrate 78, thereby reducing manufacturing costs and improving workability during assembly of the mounting head 26. With the two connection portions 184 inserted into the two recesses 177, the substrate main body 180 is fixed to the second main surface 70B of the manifold 70 using fixing members such as screws (not shown), thereby fixing the flow sensor 182 in a state connected to the terminal flow path 161. The connection portion 184 has a hole 187 therein that communicates with the flow sensor 182, and the flow sensor 182 is a branch-type sensor that detects the flow rate based on the differential pressure of air flowing in from the recess 177 of the port 176 through the hole 187 of the connection portion 184.

[0108] As shown in FIG. 18 , a sensor board 78 is attached to the manifold 70, and a flow rate sensor 182 is connected to the terminal flow path 161 of the air flow path 71 of the manifold 70, making it possible to measure the flow rate of air flowing through the terminal flow path 161 with the flow rate sensor 182.

[0109] (Air Flow Channel) Next, the air flow channel 71 of the manifold 70 will be described with reference to FIGS. 19 and 20. FIG.

[0110] FIG. 19 is a vertical cross-sectional view of the air flow path 71 of the manifold 70, and FIG. 20 is a diagram showing the connection relationship of the air flow path Ap of the mounting head 26.

[0111] 20 , the mounting head 26 includes a negative pressure source 212, a positive pressure source 214, and an air flow path Ap that is open to the atmosphere and through which air flows. The air flow path 71 is a flow path in the air flow path Ap that is disposed within the manifold 70. The air flow path Ap includes a negative pressure flow path Ap1 that connects the negative pressure source 212 and the valve 74, a positive pressure flow path Ap2 that connects the positive pressure source 214 and the valve 76 (first valve), a connection flow path 167 that connects the valve 74 and the valve 76, a terminal flow path Ap3 that connects the valve 74 (second valve) and the component suction nozzle 41, and a port 170 that is open to the atmosphere.

[0112] As shown in FIG. 19, port 160 is labeled (A), port 162 is labeled (B), port 164 is labeled (C), port 166 is labeled (D), port 168 is labeled (E), and port 170 is labeled (F).

[0113] 19, the air flow path 71 in the manifold 70 has, in addition to a negative pressure flow path 172 and a positive pressure flow path 174, terminal flow paths 161 (161A-161H), negative pressure intake flow paths 163 (163A-163H), connecting flow paths 167 (167A-167H), and positive pressure intake flow paths 175 (175A-175H). The negative pressure flow path 172 and the negative pressure intake flow path 163 are part of the negative pressure flow path Ap1, and are flow paths formed within the manifold 70. The positive pressure flow path 174 and the positive pressure intake flow path 175 are part of the positive pressure flow path Ap2, and are flow paths formed within the manifold 70. The end P2 of the positive pressure flow path 174 is plugged with a plug.

[0114] The port 160 is the most upstream end of the terminal flow passage 161 and is a connection port that connects the terminal flow passage 161 to the valve 74. The terminal flow passage 161 communicates with the connection part 186 of the manifold 70. The terminal flow passage Ap3 is a flow passage that runs from the valve 74 to the component suction nozzle 41. The terminal flow passage 161, which is the upstream part of the terminal flow passage Ap3, is formed inside the manifold 70, and the port 160 is the starting point of the terminal flow passage 161.

[0115] An air filter 188 is disposed between the terminal flow passage 161 and the connecting portion 186. The connecting portion 186 is connected to the connecting hose 72 (FIG. 4), and air flowing through the terminal flow passage 161 is supplied to the component suction nozzle 41. In this manner, the terminal flow passage Ap3 includes the terminal flow passage 161 and the connecting hose 72.

[0116] Ports 162(B) and 164(C) both communicate with port 160(A) via valve 74. Port 162 communicates with negative pressure flow path 172 via negative pressure inlet flow path 163, and negative pressure air is supplied to port 162. Negative pressure inlet flow path 163 is a flow path for drawing the negative pressure supplied to negative pressure flow path 172 into valve 74, and is connected at one end to port 162 and at the other end to negative pressure flow path 172. Port 164 communicates with upper port 166 via connecting flow path 167. Connecting flow path 167 is a flow path for connecting two valves 74 and 76 that constitute valve device 69 to each other, and is connected at one end to port 164 and the other end to port 166(D).

[0117] Ports 168(E) and 170(F) both communicate with port 166(D) via valve 76. Port 168 communicates with positive pressure flow path 174 via positive pressure inlet flow path 175, and positive pressure air is supplied to port 168. Positive pressure inlet flow path 175 is a flow path for drawing the positive pressure supplied to positive pressure flow path 174 into valve 76, and one end is connected to port 168 and the other end is connected to positive pressure flow path 174. Port 170 is a groove formed in the first main surface 70A in the X-axis direction, and is open to the atmosphere.

[0118] 20 , the valve 74 switches between connecting the port 160(A) to the port 162(B) and connecting it to the port 164(C). When the port 160(A) is connected to the port 162(B), negative pressure air is supplied from the negative pressure source 212, one of the air supply sources, to the component suction nozzle 41 connected to the end of the terminal flow path 161 via the port 162(B) and the negative pressure intake flow path 163. When the port 160(A) is connected to the port 164(C), air upstream of the valve 74 is supplied to the component suction nozzle 41 via the port 164(C), the connecting flow path 167, and the port 166(D).

[0119] The valve 76 switches between connecting the port 166(D) to the port 168(E) and connecting it to the port 170(F). When the port 166(D) is connected to the port 168(E), positive pressure air is supplied from the positive pressure source 214, one of the air supply sources, to the downstream side of the port 166(D) via the port 168(E) and the positive pressure intake flow path 175. When the port 166(D) is connected to the port 170(F), the air pressure in the connecting flow path 167, the terminal flow path 161, and the component suction nozzle 41 downstream of the port 166(D) becomes atmospheric pressure via the port 170(F), which is open to atmospheric pressure.

[0120] According to the above configuration, (1) when both the valves 74 and 76 are OFF, the valve 74 connects port 160(A) to port 162(B), so that negative pressure air is supplied to the component suction nozzle 41, and air is sucked into the component suction nozzle 41. (2) When both the valves 74 and 76 are ON, the valve 74 connects port 160(A) to port 164(C), and the valve 76 connects port 166(D) to port 168(E), so that positive pressure air is supplied to the component suction nozzle 41, and air is ejected from the component suction nozzle 41. (3) When the valve 74 is ON and the valve 76 is OFF, the valve 74 connects port 160(A) to port 164(C), and the valve 76 connects port 166(D) to port 170(F), so that the component suction nozzle 41 is open to the atmosphere, and the air pressure inside it becomes atmospheric pressure.

[0121] In this way, by switching the connection state between the ports through the operation of the two valves 74, 76, it is possible to supply (connect) one type of air selected from three types of air: negative pressure air, positive pressure air, and atmospheric pressure air to each of the multiple component suction nozzles 41.

[0122] 12 and 13 , in the manifold 70, the valves 74 and 76 are attached to the first main surface 70A, the sensor board 78 is attached to the second main surface 70B, and the I / O board 73 is attached to the third surface 70C. By using each surface of the manifold 70 to attach each component in this way, the space around the manifold 70 can be used effectively, leading to a reduction in the size of the mounting head 26.

[0123] Furthermore, by arranging the I / O board 73 above the valves 74, 76 and the sensor board 78, and by arranging the main board 39 above the I / O board 73, the main board 39, I / O board 73, valves 74, 76, and sensor board 78 are located in that order from top to bottom. This allows for easy attachment and detachment of each wire.

[0124] FIG. 21 is a block diagram showing a control system in a component mounting apparatus 2 including two mounting heads 26A and 26B.

[0125] 21 , the main body control unit 36 ​​is electrically connected to the main board 39 (head control unit) of each of the two mounting heads 26A and 26B via a communication cable. In each of the mounting heads 26A and 26B, the main board 39 is electrically connected to an I / O board 73 (first I / O control unit), lift motors 42 and 52 (Z-axis drive units), and rotary motors 100 and 102.

[0126] The main board 39 is connected to the I / O board 73 via a serial communication cable 311 (first serial communication wiring), and the I / O board 73 is further electrically connected to the I / O board 83 (second I / O control unit) via a serial communication cable 313 (third serial communication wiring). As a result, the main board 39 is connected in a state where it can communicate with the I / O boards 73 and 83 via serial communication.

[0127] The I / O board 73 is further electrically connected to the sensor board 78 via a communication cable 312 for serial communication (second serial communication wiring). As described above, the sensor board 78 has an I / O chip 183 connected to each of the flow sensors 182A to 182H, and is connected to the I / O chip 183. This makes it possible to connect the I / O board 73 and the sensor board 78 with a single communication cable 312.

[0128] The I / O board 73 is further electrically connected to a plurality of valves 74A to 74H and a plurality of valves 76A to 76H. The I / O board 73 is connected to each of the valves 74A to 74H and 76A to 76H by a single cable.

[0129] Similarly, the I / O board 83 is electrically connected to the sensor board 88 via a single communication cable 314 for serial communication (fourth serial communication wiring), and is further electrically connected to a plurality of valves 84A to 84H and a plurality of valves 86A to 86H via individually provided cables.

[0130] In this way, I / O boards 73 and 83 are provided, and flow sensors 182A to 182H, valves 74A to 74H, and valves 76A to 76H are collectively connected to I / O board 73, and flow sensors 192A to 192H, valves 84A to 84H, and valves 86A to 86H are collectively connected to I / O board 83. Furthermore, I / O board 83 is connected to I / O board 73, and I / O board 73 is connected to main board 39. Also, flow sensors 182A to 182H are collectively mounted on a single sensor board 78, and sensor board 78 and I / O board 73 are connected by wiring for serial communication. Similarly, flow sensors 192A to 192H are collectively mounted on a single sensor board 88, and sensor board 88 and I / O board 83 are connected by wiring for serial communication.

[0131] According to the above configuration, the internal wiring of the mounting head 26 is simplified, and therefore the weight of the mounting head 26 can be reduced.

[0132] Furthermore, when performing maintenance on the valves 74, 76, 84, 86 or the flow rate sensors 182, 192, it is only necessary to remove the wiring between the relevant component and the I / O boards 73, 83, without removing the wiring to the upstream main board 39. This eliminates the need to remove other unrelated wiring or remove the head cover 38 that covers the main board 39, improving the ease of maintenance work.

[0133] (Effects) As described above, the mounting head 26 of this embodiment comprises: a plurality of shafts 45 to which the component suction nozzles 41 are connected and which are arranged side by side in the X-axis direction that intersects the lifting and lowering direction; a shaft holding portion 66 that holds each of the plurality of shafts 45 so that they can be raised and lowered; a manifold 70 having an air flow path 71 through which air flows to be supplied to the component suction nozzles 41; a plurality of valve devices 69 attached to the manifold 70 and including a valve 76 (first valve) and a valve 74 (second valve) that switch the air supplied to the component suction nozzles 41, and provided corresponding to the component suction nozzles 41; and a plurality of flow rate sensors 182. The air flow path 71 includes a positive pressure flow path 174 connected to the positive pressure source 214, a negative pressure flow path 172 connected to the negative pressure source 212, a plurality of terminal flow paths 161 provided corresponding to the plurality of component suction nozzles 41 and connected to the corresponding component suction nozzles 41, a plurality of positive pressure inlet flow paths 175 individually connecting the plurality of valves 76 to the positive pressure flow path 174, a plurality of connection flow paths 167 provided corresponding to the plurality of valve devices 69 and connecting the valves 76 to the valves 74, and a plurality of negative pressure inlet flow paths 163 individually connecting the plurality of valves 74 to the negative pressure flow path 172. The flow rate sensors 182 are individually connected to the terminal flow paths 161 to measure the air flow rate in the terminal flow paths 161, and the manifold 70 is disposed to the side of the shaft holder 66, spaced apart in the lifting / lowering direction and in the Y-axis direction intersecting the X-axis direction.

[0134] With this configuration, the manifold 70, which is fitted with the valves 74, 76 that switch between positive and negative air pressures, is positioned opposite the shaft, thereby shortening the distance from the valves 74, 76 to the component suction nozzle 41. This reduces air resistance in the air flow path from the valves 74, 76 to the component suction nozzle 41, improving responsiveness when switching between positive and negative air pressures. Furthermore, because the flow rate sensor 182 is individually connected to the terminal flow path 161, the flow rate sensor 182 can be positioned closer to the component suction nozzle 41 than in the past, improving the accuracy of air flow rate detection.

[0135] Furthermore, in the past, two manifolds corresponding to two types of valves were sometimes attached to the mounting head 26, but according to the mounting head 26 of this embodiment, two types of valves are attached to one manifold, so the overall size of the manifold can be reduced, and as a result, the mounting head 26 can also be reduced in size.

[0136] In the mounting head 26 of the embodiment, the manifold 70 includes a first main surface 70A and a second main surface 70B. The valves 76 and 74 are attached to the first main surface 70A, the flow rate sensor 182 is connected to the terminal flow path 161 from the second main surface 70B side, and the second main surface 70B and the multiple shafts 45 face each other.

[0137] This configuration contributes to space savings by using the first and second principal surfaces 70A and 70B, which are the two opposing surfaces of the manifold 70. Furthermore, because the manifold 70 to which the flow sensor 182 is attached is located near the shaft, the flow sensor 182 can be located closer to the component suction nozzle 41 than in the past, thereby improving the accuracy of air flow detection.

[0138] In addition, the mounting head 26 of the embodiment has a sensor board 78 having a plurality of flow sensors 182, and the flow sensors 182 and the terminal flow path 161 are connected with the sensor board 78 attached to the second main surface 70B of the manifold 70.

[0139] This configuration makes it easy to attach the flow sensor 182 to the manifold 70.

[0140] In the mounting head 26 of this embodiment, the component suction nozzle 41 is connected to the terminal flow path 161 via an air filter 188, which is housed within the manifold 70. Because the air filter 188 is housed within the manifold 70, the mounting head 26 can be made smaller.

[0141] Furthermore, in the mounting head 26 of this embodiment, the shafts 45 are arranged in two rows spaced apart in the lifting / lowering direction (Z-axis direction) and in the Y-axis direction, which intersects with the X-axis direction. Two manifolds 70, 80 are arranged on one side and the other side in the Y-axis direction, facing the shafts 45 in each row. This improves the responsiveness of air switching to each of the component suction nozzles 41 connected to the shafts 45 arranged in two rows.

[0142] As described above, the component mounting device 2 of the embodiment includes a mounting head 26, a component supply unit 4 that supplies components to the component suction nozzle 41 of the mounting head 26, and a substrate transport mechanism 10 that transports the substrate W1 on which the components are mounted by the mounting head 26.

[0143] With this configuration, a lightweight and compact mounting head 26 is used, which allows the mounting head 26 to move faster and suppresses vibrations associated with the movement of the mounting head 26, thereby realizing a highly productive and highly accurate component mounting device 2.

[0144] In the mounting head 26 of the embodiment, a sensor substrate 78 on which a connector 222 or an integrated circuit 224 is arranged is attached to the second main surface 70B of the manifold 70. The connector 222 or the integrated circuit 224 is located above a step 70Ba on the second main surface 70B.

[0145] With this configuration, by placing large components such as a connector 222 or an integrated circuit 224 mounted on the sensor board 78 in the recessed portion at the top of the manifold 70, the thickness of the integrated manifold 70 and sensor board 78 in the Y-axis direction can be reduced, and the mounting head 26 can be made smaller.

[0146] In addition, the mounting head 26 of the embodiment further includes a plurality of lifting motors 42 that are provided corresponding to each of the plurality of shafts 45 and raise and lower the shafts, and cooling fans 114, 116 that blow air along the Y-axis direction onto the plurality of lifting motors 42.

[0147] Since the manifold 70 is not positioned near the lift motor 42, which is the lifting mechanism, as in the conventional case, the cooling fans 114, 116 can be positioned near the lift motor 42, thereby improving the cooling efficiency of the lift motor 42.

[0148] Furthermore, in the mounting head 26 of the embodiment, the manifold 70 has a first main surface 70A on which the valves 74, 76 are attached, a second main surface 70B on which the flow sensor 182 is attached, and a third surface 70C on which the I / O board 73 is attached. With this configuration, each surface of the manifold 70 can be used to attach the valves 74, 76, the flow sensor 182, and the I / O board 73, leading to space savings.

[0149] The mounting head 26 of this embodiment also includes two valves: an upstream valve 76 and a downstream valve 74. With this configuration, the two valves 74 and 76 make it possible to selectively supply air to the component suction nozzle 41 from one of three air supply sources, for example.

[0150] (Others) Although the present disclosure has been described above using the above-mentioned embodiments, the present disclosure is not limited to the above-mentioned embodiments.

[0151] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such variations and modifications should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they depart therefrom. Furthermore, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0152] The present disclosure is applicable to any mounting head and component mounting device including the same.

[0153] 2 Component mounting device 4, 6 Component supply unit 8 Base 10, 12 Board transport mechanism 14 Tape feeder 15 Cart 16 Tape feeder 17 Cart 18, 20 Y-axis beam 22, 24 X-axis beam 26, 26A, 26B Mounting head 28, 30 Component recognition camera 32, 34 Head camera 36 Main body control unit 37 Guide block 37A First surface 37B Second surface 38 Head cover 39 Main board 40 First nozzle unit 41, 41A-41H Component suction nozzle 42, 42A-42H Lifting motor 43, 43A-43H Output shaft 44 First offset block 45, 45A-45H Shaft 46, 46A-46H Pulley 47, 47A-47H Air connection unit 48, 48A-48H Suction hole 50 Second nozzle unit 51, 51A-51H Component suction nozzle 52, 52A-52H Lifting motor 53, 53A-53H Output shaft 54 ​​Second offset block 55, 55A-55H Shaft 56, 56A-56H Pulley 57, 57A-57H Air connection part 58, 58A-58H Suction hole 60 Motor unit 62 Lifting motor 63 First bracket 64 Second bracket 66 Shaft holding part 69 Valve device 70 Manifold 70A First main surface 70B Second main surface 70Ba Step 70C Third surface 71 Air flow path 72, 72A-72H Connection hose 73 I / O board 74, 74A-74H Valve (second valve) 75, 75A-75H Connector 76, 76A-76H Valve (first valve) 77, 77A-77H Connector 78 Sensor board 79 Fixing member 80 Manifold 81 Air flow path 82, 82A-82G, 82H Connection hose 83 I / O board 84, 84A-84H Valve (second valve) 85, 85A-85H Connector 86, 86A-86H Valve (first valve) 87, 87A-87H Connector 88 Sensor board 89 Fixing member 90 Support frame 92 First mounting member 94 Second mounting member 96 Third mounting member 100, 102 Rotation motor 104 First block 105 Shaft case 105A Rotating body 106, 108 Second block 110, 112 Connecting member 114 Cooling fan 115 Fan fixing tool 116 Cooling fan154 Substrate storage box 160, 160A-160H Port 161, 161A-161H Terminal flow path 162, 162A-162H Port 163, 163A-163H Negative pressure intake flow path 164, 164A-164H Port 166, 166A-166H Port 167, 167A-167H Connection flow path 168, 168A-168H Port 170 Port 172 Negative pressure flow path 174 Positive pressure flow path 175, 175A-175H Positive pressure intake flow path 176, 176A-176H Port 177 Recess 177a Sealing surface 178, 178A-178H Recess 179 Branch flow path 180 Substrate main body 182, 182A-182H Flow sensor 183 I / O chip 184 Connection part 185 Sealing material 186 Connection part 187 Hole 188 Air filter 192, 192A-192H Flow sensor 200, 202 Manifold mounting member 212 Negative pressure source 214 Positive pressure source 222 Connector 224 Integrated circuit 311, 312, 313, 314 Communication cable A, B, C, D, E, F Port Ap Air flow path W1, W2 Board

Claims

a plurality of valve devices attached to the manifold and corresponding to the component suction nozzles, each valve including a first valve and a second valve for switching the air supplied to the component suction nozzle; and a plurality of flow sensors, wherein the air flow path comprises: a positive pressure flow path connected to a positive pressure source; a negative pressure flow path connected to a negative pressure source; a plurality of terminal flow paths provided corresponding to the component suction nozzles and connected to the corresponding component suction nozzles; a plurality of positive pressure inlet flow paths individually connecting the plurality of first valves to the positive pressure flow path; a plurality of connecting flow paths provided corresponding to the plurality of valve devices and communicating the first valve with the second valve; and a plurality of negative pressure inlet flow paths individually connecting the plurality of second valves to the negative pressure flow path, wherein the flow sensors are individually connected to the terminal flow paths and measure the flow rate of air in the terminal flow paths, the manifold is disposed laterally away from the shaft holding portion in the lifting direction and in a second direction intersecting the first direction.

2. A mounting head according to claim 1, wherein the manifold has a first main surface and a second main surface, the first valve and the second valve are attached to the first main surface, the flow sensor is connected to the terminal flow path from the second main surface side, and the second main surface and the multiple shafts face each other.

3. The mounting head according to claim 2, further comprising a substrate having the plurality of flow sensors, the flow sensors being connected to the terminal flow passages with the substrate attached to the second main surface of the manifold.

4. The mounting head according to claim 3, wherein the second main surface of the manifold has a recess for avoiding interference with components attached to the board.

5. A mounting head according to any one of claims 1 to 4, wherein the component suction nozzle is connected to the terminal flow path via an air filter, and the air filter is housed within the manifold.

6. A mounting head according to any one of claims 1 to 5, wherein a plurality of the shafts are arranged in two rows spaced apart in the second direction, and two of the manifolds are arranged on one side and the other side in the second direction so as to face the shafts in each row.

7. The mounting head according to any one of claims 1 to 6, wherein the manifold is attached to the shaft holding portion.

8. The mounting head according to any one of claims 1 to 7, wherein the flow rate sensor is a branch flow rate sensor.

9. A component mounting device comprising: the mounting head according to any one of claims 1 to 8; a component supply unit that supplies components to the component suction nozzle of the mounting head; and a board transport mechanism that transports a board on which components are to be mounted by the mounting head.

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