Inspection device and inspection method

Abstract

This inspection device inspects a shell structure in which a section where electrical conduction is established between a conductive portion of a substrate and a jig contact portion is sealed. The inspection device comprises: a housing; a probe that contacts an electrode of the jig in electrical conduction with the contact portion, inside the housing; a temperature adjustment medium circulation unit that supplies and discharges a temperature adjustment medium into and out of the housing; and a control unit. The control unit controls: (A) a step for placing the shell structure with the probe and the electrode being in contact with each other; (B) a step for adjusting the temperature of the shell structure by supplying the temperature adjustment medium from the temperature adjustment medium circulation unit and immersing at least a portion of the shell structure in the temperature adjustment medium; and (C) a step for inspecting the substrate of the shell structure via the probe.

Description

Inspection device and inspection method

[0001] The present disclosure relates to an inspection apparatus and an inspection method.

[0002] Patent Document 1 discloses a manufacturing method for forming a shell structure by stacking and bonding a substrate and a jig (contact substrate). The shell structure formed in this way can suppress the stylus pressure applied to the substrate from the probe of the inspection device, and also suppresses oxidation of the conductive part of the substrate by sealing the contact part of the jig.

[0003] To inspect this type of shell structure, for example, the shell structure is transported into the housing of an inspection device, and the probes are brought into contact with the electrodes of a jig. The inspection device then transmits electrical signals from the probes to the electrodes of the jig, transmitting the electrical signals to the conductive parts of the substrate via the electrodes and contact parts of the jig, thereby inspecting the electrical characteristics of each semiconductor device connected to the conductive parts. Furthermore, the inspection device performs inspections while adjusting the temperature of the substrate to a target temperature, thereby inspecting whether each semiconductor device satisfies the temperature conditions.

[0004] JP 2023-95494 A

[0005] The present disclosure provides a technique that enables stable inspection of a substrate while efficiently adjusting the temperature of the substrate.

[0006] According to one aspect of the present disclosure, there is provided an inspection device for inspecting a shell structure in which a portion where a conductive portion of a substrate and a contact portion of a jig are electrically connected is sealed, the inspection device including a housing, a probe that contacts an electrode of the jig that is electrically connected to the contact portion inside the housing, a temperature adjustment medium circulation unit that supplies and discharges a temperature adjustment medium into the housing, and a control unit, wherein the control unit controls: (A) a step of transporting the shell structure into the housing and placing the shell structure with the probe and the electrode in contact; (B) after step (A), a step of supplying the temperature adjustment medium from the temperature adjustment medium circulation unit into the housing and adjusting the temperature of the shell structure by immersing at least a portion of the shell structure in the temperature adjustment medium; and (C) after step (B), a step of inspecting the substrate of the shell structure via the probe.

[0007] According to one aspect, the temperature of the substrate can be efficiently adjusted while the substrate can be stably inspected.

[0008] FIG. 1 is a side cross-sectional view before the formation of the shell structure; FIG. 2 is a side cross-sectional view after the formation of the shell structure; FIG. 3 is a side cross-sectional view enlarging a portion of the shell structure; FIG. 4 is a plan view schematically showing the overall configuration of an inspection system; FIG. 5 is a side cross-sectional view schematically showing an inspection device according to a first embodiment; FIG. 6 is a side cross-sectional view showing an inspection state of the shell structure by the inspection device; FIG. 7 is a flowchart showing an inspection method for the inspection device; FIG. 8 is a side cross-sectional view schematically showing an inspection device according to a second embodiment; and FIG. 9 is a side view schematically showing an inspection device according to a third embodiment.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0010] To facilitate understanding of the inspection device 60 according to the present disclosure, a shell structure 100 created during inspection will first be described with reference to Figures 1 and 2. Figure 1A is a side cross-sectional view of the shell structure 100 before it is formed. Figure 1B is a side cross-sectional view of the shell structure 100 after it is formed. Figure 2 is a side cross-sectional view of an enlarged portion of the shell structure 100.

[0011] The shell structure 100 is a structure that is created for the purpose of inspecting the substrate W and is disassembled after the inspection of the substrate W. The shell structure 100 is formed by stacking and bonding the substrate W to be inspected and a contact jig 110.

[0012] The substrate W to be inspected may be a wafer on which a plurality of semiconductor devices, which are devices under test (DUTs), are arranged in a matrix. For example, the substrate W may be formed of silicon or a compound semiconductor (SiC, GaAs, SiC, GaN, InP, etc.). The substrate W is not limited to a wafer, and may also be a carrier having semiconductor devices, a glass substrate, a single chip, an electronic circuit board, etc. The semiconductor devices on the substrate W may also be back-illuminated imaging devices in which light is incident from the surface opposite the wiring layer.

[0013] The substrate W includes a plate-shaped substrate body Wm and multiple conductive portions Wc. The substrate body Wm is circular in plan view and has multiple semiconductor devices inside. The diameter of the substrate body Wm is set to, for example, 30 cm. The substrate body Wm has one surface Ws1 facing the contact jig 110 and another surface Ws2 on the opposite side. Note that while FIG. 1A depicts the one surface Ws1 and the other surface Ws2 as flat, the one surface Ws1 and the other surface Ws2 may have irregularities depending on the semiconductor devices. The substrate body Wm may also be formed in other shapes, such as a square in plan view.

[0014] The plurality of conductive portions Wc are formed on one surface Ws1 of the substrate body Wm and are electrically connected to appropriate semiconductor devices on the substrate body Wm. Examples of the conductive portions Wc include electrode pads and metal bumps of the semiconductor devices. While FIG. 1A illustrates an example in which each conductive portion Wc is embedded within the substrate body Wm, each conductive portion Wc may protrude from one surface Ws1 of the substrate W.

[0015] Each of the conductive portions Wc is made of a conductive metal material such as aluminum (Al), copper (Cu), etc. The conductive portions Wc are arranged side by side at intervals of, for example, 10 μm or less.

[0016] On the other hand, the contact jig 110 is releasably bonded to the substrate W. The contact jig 110 includes a jig body 111, a plurality of contact portions 112, and a plurality of electrode pads 113.

[0017] The jig body 111 is formed in a circular shape with approximately the same diameter as the substrate body Wm, and has a portion at its outer periphery 111o that is bonded to the substrate body Wm. The jig body 111 insulates adjacent contact portions 112 from each other and adjacent electrode pads 113 from each other. The jig body 111 may have a shape different from that of the substrate W, and may be formed, for example, in a circular shape with a larger diameter than the substrate W, or in a polygonal shape such as a square.

[0018] The jig body 111 has a recess 111c inside the annular outer circumferential portion 111o. The recess 111c is formed on one surface 111s1 of the jig body 111. Inside the recess 111c, a group of multiple contact portions 112 is formed corresponding to each conductive portion Wc of the semiconductor device of the substrate W. A plurality of pillars 114 protruding from the recess 111c are provided between each group of contact portions 112. When the contact jig 110 and the substrate W are joined together, each pillar 114 contacts the substrate body Wm to maintain the depth of the recess 111c.

[0019] The jig body 111 is made of a material having, for example, a thermal expansion coefficient equivalent to that of the substrate body Wm in order to prevent misalignment between the substrate W and the contact jig 110 due to temperature changes in the shell structure 100. As an example, the jig body 111 may be made of a contact substrate made of the same material as the substrate body Wm. Alternatively, the jig body 111 may be made of a glass substrate having a thermal expansion coefficient equivalent to that of the substrate W, or a substrate in which a semiconductor substrate and a glass substrate are laminated.

[0020] The plurality of contact portions 112 are portions that come into contact with and are electrically connected to the respective conductive portions Wc when the substrate W is joined to the contact jig 110. For this reason, each contact portion 112 is formed at a position that can face each conductive portion Wc of the substrate W. The jig body 111 also has a needle pressure adjustment portion 115 that is elastically deformable in response to contact between each contact portion 112 and each conductive portion Wc.

[0021] FIG. 2 is an enlarged cross-sectional view showing the contact portions 112 and the needle pressure adjusting portions 115 of the contact jig 110. For example, a needle pressure adjusting portion 115 is provided for each of the contact portions 112. The needle pressure adjusting portion 115 includes a hollow 116 formed inside the jig body 111, a bridge portion 117 covering the hollow 116 on the bottom side of the recess 111c, and a protrusion 118 protruding from the middle of the bridge portion 117. The bridge portion 117 is elastically deformable in the thickness direction of the jig body 111 because the hollow 116 is located on the opposite side of the protrusion 118. Note that the needle pressure adjusting portion 115 may adjust the needle pressure of the multiple contact portions 112 in an integrated manner. For example, the needle pressure adjusting portion 115 may have a series of hollows 116 and bridge portions 117 extending across the multiple contact portions 112.

[0022] The contact portions 112 are formed on the bottom surface of the recesses 111c as a metal film (e.g., copper foil or aluminum foil) that is continuous with the surfaces of the bridge portions 117 and the protrusions 118. The contact portions 112 cover the protruding ends of the protrusions 118, thereby protruding from the bottom surface of the recesses 111c and being able to directly contact the conductive portions We of the substrate W. When the contact jig 110 and the substrate W are not bonded, each contact portion 112 is aligned with the opening of the recess 111c or protrudes slightly beyond the opening of the recess 111c. When the contact portions 112 are in contact with the conductive portions We of the substrate W, the bridge portions 117 bend appropriately, allowing the needle pressure adjustment portion 115 to reduce the needle pressure applied from the protrusions 118 to the conductive portions We while maintaining contact of the contact portions 112.

[0023] Inside the contact jig 110, a plurality of wirings 119 are provided, avoiding the hollow 116, to electrically connect each of the plurality of contact portions 112 to each of the plurality of electrode pads 113. As shown in Fig. 1, the wirings 119 extend in the jig body 111 without contacting each other and widen in the plate surface direction from the contact portions 112 to the electrode pads 113 while bending or curving.

[0024] A plurality of electrode pads 113 are formed on the other surface 111s2 of the jig body 111. The electrode pads 113 are formed with an area larger than the area of ​​the conductive portions Wc. Furthermore, the spacing between the electrode pads 113 is set larger than the spacing between the conductive portions Wc of the substrate W. Even if the area and spacing of the electrode pads 113 are larger than the conductive portions Wc, the configuration of the contact portions 112 and the wiring 119 described above allows stable electrical conduction between the conductive portions Wc and the electrode pads 113. For example, the spacing between the electrode pads 113 can be set to 50 μm to 500 μm. The electrode pads 113 are formed of a metal material such as Al or Cu. The metal material of the electrode pads 113 may be plated with gold (Au) or the like.

[0025] A bonding portion 120 is formed on the outer circumferential portion 111o of one surface 111s1 of the contact jig 110. The outer circumferential portion 111o protrudes from the bottom surface of the recess 111c and forms a ring-shaped circumferential portion, and the bonding portion 120 covers the entire protruding end surface of the outer circumferential portion 111o. The bonding portion 120 may be formed of an adhesive, or may be a modified layer obtained by modifying the surface of the jig body 111.

[0026] One surface 111s1 of the contact jig 110 is joined to one surface Ws1 of the substrate W via the joining portion 120, thereby forming a sealed internal space 101 in the recess 111c. Contact portions of the conductive portions Wc and the contact portions 112 are formed in the internal space 101. By joining the substrate W and the contact jig 110 in a reduced pressure atmosphere, the internal space 101 can be maintained in a reduced pressure atmosphere. Therefore, the shell structure 100 can prevent oxidation of the conductive portions Wc by exposing them to the atmosphere. Alternatively, the shell structure 100 may join the substrate W and the contact jig 110 in an inert gas atmosphere. This allows the shell structure 100 to maintain the internal space 101 in an inert gas atmosphere.

[0027] The contact jig 110 may also have a detection sensor (not shown) that detects an index for determining the bonding state between the substrate W and the contact jig 110. Examples of the index for determining the bonding state include the pressure (needle pressure) applied to the substrate W from the contact portion 112 of the contact jig 110, the internal pressure (vacuum degree) of the sealed internal space 101, etc.

[0028] Shell structure 100 formed during inspection is basically configured as described above, and inspection system 1 that forms and inspects shell structure 100 will be described below with reference to Fig. 3. Fig. 3 is a plan view that schematically shows the overall configuration of inspection system 1.

[0029] The inspection system 1 stocks a plurality of contact jigs 110 therein, and transports the substrate W to each location in the inspection system 1 while forming a shell structure 100, inspecting it, and dismantling the shell structure 100 after the inspection. The inspection system 1 includes a transport module 10, a reduction treatment device (plasma treatment device) 20, a position adjustment device 25, an adhesive application device 30, a bonding device 40, a shell structure determination device 50, an inspection device 60, a peeling pre-treatment device 70, a peeling device 75, a jig cleaning device 80, and a substrate cleaning device 85. The inspection system 1 also includes a controller 90 that controls the operation of each device.

[0030] The transport module 10 transports the substrate W through three regions: a formation region 11 where the shell structure 100 is formed, an inspection region 12 where the substrate W is inspected, and a disassembly region 13 where the shell structure 100 is disassembled. The formation region 11, the inspection region 12, and the disassembly region 13 each extend linearly. The transport module 10 connects the formation region 11 and the inspection region 12 orthogonally and also connects the inspection region 12 and the disassembly region 13 orthogonally, thereby forming a generally C-shape as a whole. The formation region 11, the inspection region 12, and the disassembly region 13 are not necessarily contiguous with each other, and some or all of them may be located at separate positions.

[0031] Each region of the transport module 10 includes a linearly extending transport frame 14 and a transport device (not shown) that moves along the longitudinal direction of the transport frame 14. The transport frame 14 may be formed on a flat road surface or may have guide rails, depending on the transport mechanism of the transport device. The transport device transports the substrate W to a position opposite each device by moving on the transport frame 14 while supporting the substrate W with an arm (not shown). Furthermore, the transport device loads and unloads the substrate W between each device by moving the arm back and forth at the opposite positions of the devices.

[0032] To form the shell structure 100, the formation area 11 is connected to a reduction treatment device 20, a position adjustment device 25, an adhesive application device 30, a bonding device 40, and a shell structure determination device 50 in this order from the upstream side to the downstream side in the transport direction of the substrate W. In the formation area 11, for example, each device is installed on either side of a transport frame 14.

[0033] Furthermore, the transfer module 10 can depressurize the formation region 11 to a vacuum atmosphere, while maintaining the inspection region 12 and disassembly region 13 in an air atmosphere. This allows the internal space 101 of the shell structure 100 to be easily placed in a vacuum atmosphere (oxygen-free state) when the shell structure 100 is formed in the formation region 11, thereby preventing re-oxidation of the conductive portion Wc of the reduced substrate W. Note that the inspection system 1 does not place the formation region 11 in a vacuum atmosphere, but instead places nitrogen (N ２) gas to create an inert gas atmosphere, thereby suppressing oxidation of the conductive portion Wc of the substrate W. In the inspection system 1, the region to be evacuated to a vacuum atmosphere is not limited to the formation region 11, and the vacuum atmosphere may be created over the formation region 11, the inspection region 12, and the disassembly region 13, for example.

[0034] The formation region 11 of the transfer module 10 forms a space sealed from the outside, and is equipped with load lock modules 15 at each of the entrance and exit of the formation region 11. For example, the transfer module 10 forms a sealed space over the entire length of the formation region 11 by side panels and a ceiling panel covering the transfer frame 14. When the entrance load lock module 15 receives a substrate W transferred from the outside, it depressurizes the atmosphere from atmospheric to vacuum, and then the substrate W is removed by a transfer device inside the formation region 11. When the exit load lock module 15 receives a substrate W (shell structure 100) by a transfer device inside the formation region 11, it increases the pressure from vacuum to atmospheric, and then the substrate W is removed by a transfer device inside the inspection region 12.

[0035] On the other hand, inspection area 12 is connected only to inspection device 60. The transport device in inspection area 12 carries in shell structure 100 formed in formation area 11 and transports it to inspection device 60, and also transports shell structure 100 after inspection in inspection device 60 to disassembly area 13.

[0036] The dismantling area 13 is connected to a pre-peeling treatment device 70, a peeling device 75, a jig cleaning device 80, and a substrate cleaning device 85 in this order from upstream to downstream in the transport direction of the substrate W in order to dismantle the shell structure 100. A buffer unit 16 is provided upstream of the dismantling area 13 (or downstream or upstream of the inspection area 12) to temporarily place the shell structure 100 in the inspection area 12. In the dismantling area 13, each device is also installed on both sides of the transport frame 14, for example.

[0037] The reduction treatment device 20 installed in the formation region 11 plasma-treats the substrate W to remove an oxide film formed on the surface of the conductive portion We of the substrate W before forming the shell structure 100. To this end, the substrate W is loaded into the reduction treatment device 20 with one side Ws1 facing upward (vertically facing upward). The reduction treatment device 20 may be a known device, and may, for example, supply an etching gas to generate plasma to etch the surface of the aluminum conductive portion We. The type of etching gas may be selected appropriately depending on the material of the conductive portion We, and may be, for example, a hydrogen-containing gas, a chlorine-containing gas, or the like. Preferably, the etching gas is hydrogen gas, which does not require detoxification and does not corrode the device. After the oxide film is removed, the substrate W moves through the vacuum atmosphere in the formation region 11, preventing re-oxidation and forming the shell structure 100.

[0038] The position adjustment device 25 receives the substrate W from which the oxide film has been removed by the transport module 10, detects the positional deviation and circumferential orientation (posture) of the substrate W, and adjusts the positional deviation and posture of the substrate W in cooperation with the transport device in the formation region 11. In addition, the position adjustment device 25 inverts the substrate W, one side Ws1 of which faces upward, so that the one side Ws1 faces downward in order to bond the substrate W to the contact jig 110 in the bonding device 40. The transport device in the formation region 11 unloads the substrate W with the one side Ws1 facing downward and transports it to the bonding device 40.

[0039] The adhesive application device 30 receives the contact jig 110 transported by the transport device in the formation region 11, and applies an adhesive to the surface of the outer circumferential portion 111o of the contact jig 110 to form a bonded portion 120 (see FIG. 1A ). In this embodiment, a UV-curable resin is used as the adhesive. The adhesive application device 30 has, for example, a nozzle (not shown) for applying the adhesive, and forms the bonded portion 120 around the entire circumferential circumference of the protruding end face of the outer circumferential portion 111o. The transport device in the formation region 11 carries out the contact jig 110 on which the bonded portion 120 has been formed, and transports it to the bonding device 40.

[0040] The bonding device 40 bonds the substrate W and the contact jig 110 inside the processing chamber. The bonding device 40 holds, for example, one side Ws1 of the substrate W facing downward using an upper chuck (not shown) and one side 111s1 of the contact jig 110 facing upward using a lower chuck (not shown). The bonding device 40 then adjusts the horizontal positions of the substrate W and the contact jig 110, raises the lower chuck, and brings the bonding portion 120 of the outer periphery 111o of the contact jig 110 into contact with the outer periphery of the substrate W. Furthermore, the bonding device 40 irradiates UV light from a UV irradiation device (not shown) onto the bonding portion 120 to bond the substrate W and the contact jig 110 together, thereby forming a shell structure 100 (see also FIG. 1B ). The transport device in the formation region 11 unloads the shell structure 100 and transports it to the shell structure determination device 50.

[0041] The shell structure determination device 50 houses the shell structure 100 and connects an inspection device (not shown) to the connector of the detection sensor of the contact jig 110. The shell structure determination device 50 operates the inspection device (not shown) to measure the needle pressure of the shell structure 100 and the pressure in the internal space via the detection sensor, and transmits the measurement information to a determination unit (not shown). The determination unit determines the bonding state of the shell structure 100 based on the acquired measurement information. The determination unit may be provided in the controller 90 instead of in the shell structure determination device 50.

[0042] For example, the determination unit stores in advance a needle pressure allowable range for comparing needle pressures of the shell structure 100 and a spatial pressure allowable range for comparing spatial pressures of the shell structure 100. The determination unit compares measurement information of each needle pressure of the detection sensor with the needle pressure allowable range, and determines that the bonding state is abnormal if each needle pressure is outside the needle pressure allowable range, and determines that the bonding state is normal if each needle pressure is within the needle pressure allowable range. Alternatively, the determination unit compares measurement information of the spatial pressure of the detection sensor with the spatial pressure allowable range, and determines that the bonding state is abnormal if the spatial pressure is outside the spatial pressure allowable range, and determines that the bonding state is normal if the spatial pressure is within the spatial pressure allowable range.

[0043] When the inspection system 1 determines that there is an abnormality in the bonding state of the shell structure 100, it does not perform inspection using the inspection device 60, but instead transports the shell structure 100 to the disassembly area 13 to disassemble it, and returns the disassembled substrates W to the formation area 11 to reform the shell structure 100. This allows the inspection system 1 to stably inspect the substrates W by preventing abnormalities in the electrical characteristics of the substrates W that may occur due to an abnormality in the bonding state.

[0044] In the inspection area 12 of the inspection system 1, the shell structure 100 formed in the formation area 11 is transported by a transport device, and the substrate W of the shell structure 100 is inspected by an inspection device 60 installed in the inspection area 12. The configuration of this inspection device 60 will be described in detail later. After the inspection by the inspection device 60, the shell structure 100 is transported to the disassembly area 13 by the transport device of the inspection area 12.

[0045] When the shell structure 100 is transported by the transport device in the dismantling area 13, the pre-peeling treatment device 70 in the dismantling area 13 performs pre-treatment for dismantling on the shell structure 100. For example, the pre-peeling treatment device 70 may be a hot plate device that heats the shell structure 100 to a target temperature. This target temperature is a temperature that can reduce the adhesive strength of the adhesive (UV curing resin) in the bonding portion 120. This brings the bonding portion 120, which bonds the substrate W and contact jig 110 of the shell structure 100, into a state where it can be easily peeled off.

[0046] The shell structure 100 of the pre-peeling treatment device 70 is transported by the transport device in the disassembly area 13, and the peeling device 75 in the disassembly area 13 peels off the substrate W and the contact jig 110. For example, this peeling device 75 may be a device that advances a blade into the bonding portion 120 from the side of the shell structure 100 and pulls the substrate W upward relative to the contact jig 110. This allows the substrate W to be smoothly peeled off from the contact jig 110.

[0047] The jig cleaning device 80 in the disassembly area 13 receives the contact jigs 110 that have been peeled off by the peeling device 75 and performs a process of removing the adhesive (bonded portions 120) adhering to the contact jigs 110. After removing the adhesive from the contact jigs 110, the inspection system 1 transports the contact jigs 110 to the adhesive application device 30, thereby allowing the contact jigs 110 to be reused for inspecting substrates W. Note that the inspection system 1 may have a storage module (not shown) that stores a plurality of contact jigs 110, and the contact jigs 110 from the jig cleaning device 80 may be stored in the storage module and then transported from the storage module to the adhesive application device 30.

[0048] The substrate cleaning device 85 in the disassembly area 13 transports the substrate W that has been peeled off in the peeling device 75 and performs a process of removing the adhesive (bonded portion 120) adhering to the substrate W. After removing the adhesive from the substrate W, the inspection system 1 transports the substrate W downstream of the disassembly area 13, thereby unloading the substrate W from the transport module 10 and storing the substrate W in a carrier such as a FOUP.

[0049] The controller 90 of the inspection system 1 is a computer including a processor, memory, input / output interface, communication interface, etc. (not shown). The processor is one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a circuit made up of a plurality of discrete semiconductors, etc., and executes and processes programs stored in memory. The memory includes a main storage device made up of a semiconductor memory, etc., and an auxiliary storage device made up of a disk, a drive, a semiconductor memory (flash memory), etc.

[0050] The controller 90 of the inspection system 1 controls the operation of the transport module 10 and each device, sequentially transports a plurality of substrates W to form a shell structure 100, and controls the inspection device 60 to sequentially inspect the substrates W in the shell structure 100. The controller 90 also controls the sequential peeling of the inspected shell structure 100 into the substrates W and the contact jig 110, and the removal of the substrates W.

[0051] Next, the inspection device 60 installed in the inspection area 12 of the inspection system 1 will be described with reference to Fig. 4. Fig. 4 is a side cross-sectional view that schematically shows the inspection device 60 according to the first embodiment. Fig. 5 is a side cross-sectional view that shows the inspection state of the shell structure 100 of the inspection device.

[0052] The inspection device 60 according to the embodiment inspects the electrical characteristics of the substrate W of the shell structure 100 while immersing the shell structure 100 in a liquid to adjust the temperature of the shell structure 100. Specifically, the inspection device 60 includes a housing 61, a probe card 62, a temperature adjustment medium circulating unit 63, a suction unit 64, and a heating unit 65. The inspection device 60 also includes a control unit 69 that communicates information with a controller 90 and controls each component of the inspection device 60.

[0053] The housing 61 is formed, for example, in a substantially cylindrical or rectangular tubular shape having a ceiling wall 611, a bottom wall 612, and a side wall 613. The ceiling wall 611, the bottom wall 612, and the side wall 613 are integrally continuous with one another. The space enclosed by the ceiling wall 611, the bottom wall 612, and the side wall 613 constitutes an inspection space 61s in which the shell structure 100 is housed and inspected. The inspection space 61s can store a temperature adjustment medium (liquid) supplied by a temperature adjustment medium circulating unit 63. The housing 61 may be configured to have improved insulation against the outside by forming an insulating space within the walls, such as the ceiling wall 611, the bottom wall 612, and the side wall 613.

[0054] A transfer port (not shown) is provided in the side wall 613 of the housing 61, through which a transfer device of the inspection region 12 transfers the shell structure 100 into and out of the inspection space 61s. The transfer port is opened and closed by a gate valve (not shown). When closed, the gate valve liquid-tightly seals the housing 61, thereby preventing leakage of the liquid supplied to the inspection space 61s.

[0055] A pogo frame 614 is provided on a bottom wall 612, which is the vertically lower side of the housing 61, for supporting a plurality of probes 622 provided on the probe card 62 in an inserted state. The pogo frame 614 constitutes a mounting portion on which the shell structure 100 carried into the housing 61 is mounted. The housing 61 also has an annular sealing member 615, such as an O-ring, that surrounds the outer periphery of the pogo frame 614. The sealing member 615 accommodates each of the probes 622 in its entirety.

[0056] The probe card 62 is set in a tester 66 vertically below the housing 61, thereby constituting part of an inspection mechanism that inspects the substrate W of the shell structure 100. The tester 66 supplies power to the substrate W and transmits and receives signals via the probe card 62. The probe card 62 includes a main body 621, a plurality of probes 622 protruding from the upper surface of the main body 621, and an annular sealing member 623 such as an O-ring that surrounds the entirety of each probe 622.

[0057] The main body 621 is electrically connected to the motherboard of the tester 66 through an interface (not shown). Each probe 622 protrudes from the top surface of the main body 621 and is inserted into each of a plurality of holes provided in the pogo frame 614. The pogo frame 614 supports the vertical protruding posture of each probe 622. The protruding end of each probe 622 protrudes slightly from the top surface of the bottom wall 612 (pogo frame 614) of the housing 61. By maintaining linearity, each probe 622 can stably contact the electrode pad 113 of the shell structure 100 (contact jig 110) placed on it.

[0058] The temperature adjustment medium circulating unit 63 is provided with a supply mechanism 631 and a discharge mechanism 636, which are connected to the housing 61, and supplies and discharges a liquid temperature adjustment medium to and from the testing space 61s of the housing 61. The temperature adjustment medium supplied to the housing 61 is not particularly limited, but examples thereof include water, Fluorinert (registered trademark), and Galden (registered trademark). Hereinafter, the temperature adjustment medium may also be simply referred to as liquid.

[0059] The supply mechanism 631 includes one or more common pipes 632 connected to the housing 61, a high-temperature chiller unit 633 that supplies high-temperature liquid to the common pipes 632, and a low-temperature chiller unit 634 that supplies low-temperature liquid to the common pipes 632. The supply mechanism 631 also includes a switching unit 635 that connects the common pipes 632, the high-temperature pipes 633a of the high-temperature chiller unit 633, and the low-temperature pipes 634a of the low-temperature chiller unit 634, respectively, and is capable of switching the flow paths therein.

[0060] The common pipe 632 is connected to the side wall 613 of the housing 61, and allows the liquid to flow into the housing 61. The common pipe 632 may be equipped with a pump or the like (not shown). In order to suppress turbulence of the liquid within the housing 61, the common pipe 632 may be connected to the bottom wall 612 of the housing 61, and allow the liquid to flow in from the bottom wall 612 side.

[0061] The high-temperature chiller unit 633 includes a heating device 633b, an on-off valve 633c, a pump 633d, a tank 633e, and the like, which are attached to the high-temperature pipe 633a. The heating device 633b is a heater wire, a heat pump, or the like, and raises the temperature of the liquid in the high-temperature pipe 633a to a preset target temperature. While the heating device 633b is attached to the high-temperature pipe 633a in the embodiment, the high-temperature chiller unit 633 may also include the heating device 633b in the tank 633e to heat the liquid in the tank 633e. The on-off valve 633c opens and closes the flow path of the high-temperature pipe 633a. The pump 633d pressure-feeds the liquid stored in the tank 633e to the downstream side (the switching unit 635 side) of the high-temperature pipe 633a. The configuration of the high-temperature chiller unit 633 is not limited to the above, and may include, for example, a flow rate controller.

[0062] The low-temperature chiller unit 634 is configured in substantially the same manner as the high-temperature chiller unit 633, and includes a refrigeration device 634b, an on-off valve 634c, a pump 634d, a tank 634e, and the like, installed in the low-temperature pipe 634a. The refrigeration device 634b includes a heat exchanger or the like, and lowers the temperature of the liquid in the high-temperature pipe 633a to a preset target temperature. The on-off valve 634c opens and closes the flow path of the low-temperature pipe 634a. The pump 634d pressure-feeds the liquid stored in the tank 634e to the downstream side (the switching unit 635 side) of the low-temperature pipe 634a. The configuration of the low-temperature chiller unit 634 is not limited to the above, and may include, for example, a flow rate controller or the like.

[0063] The switching unit 635 may be a three-way switching valve or the like, and selectively allows the high-temperature liquid in the high-temperature pipe 633a and the low-temperature liquid in the low-temperature pipe 634a to flow into the common pipe 632. Alternatively, the switching unit 635 may be configured to be able to adjust the opening degree of the flow path of the high-temperature pipe 633a and the flow path of the low-temperature pipe 634a, respectively, and may mix the high-temperature liquid in the high-temperature pipe 633a and the low-temperature liquid in the low-temperature pipe 634a and allow them to flow into the common pipe 632. The supply mechanism 631 may be configured, for example, to include a temperature sensor (not shown) in the flow path of the common pipe 632 (or in the housing 61), and adjust the temperature of the liquid supplied to the housing 61 based on the temperature of the liquid detected by the temperature sensor.

[0064] The discharge mechanism 636 of the temperature adjustment medium circulating unit 63 includes a discharge pipe 636a connected to the bottom wall 612 of the housing 61, an adjustment valve 636b that opens and closes the flow path of the discharge pipe 636a and adjusts the degree of opening of the flow path, and a pump 636c. The discharge mechanism 636 also includes a switching unit 636d that selectively circulates the liquid in the discharge pipe 636a to the high-temperature chiller unit 633 and the low-temperature chiller unit 634.

[0065] The discharge pipe 636a has a common pipe upstream of the switching unit 636d, and a branch pipe downstream of the switching unit 636d that branches off into a high-temperature liquid and a low-temperature liquid. The temperature adjustment medium circulating unit 63 forms a circulation circuit that circulates the high-temperature liquid discharged from the housing 61 to the high-temperature chiller unit 633 and the low-temperature liquid discharged from the housing 61 to the low-temperature chiller unit 634. The temperature adjustment medium circulating unit 63 may discharge the liquid from the housing 61 without circulating it. For example, when adjusting the temperature by mixing the liquid from the high-temperature chiller unit 633 and the liquid from the low-temperature chiller unit 634, the liquid may be discharged.

[0066] The temperature adjustment medium circulating unit 63 having the above-described supply mechanism 631 and discharge mechanism 636 can store liquid in the testing space 61s of the housing 61 by closing the adjustment valve 636b while supplying liquid from the supply mechanism 631. Conversely, the temperature adjustment medium circulating unit 63 can discharge the liquid stored in the testing space 61s of the housing 61 by stopping the supply of liquid from the supply mechanism 631 while opening the adjustment valve 636b. Alternatively, the temperature adjustment medium circulating unit 63 can circulate the liquid in the housing 61 while storing a certain amount of liquid in the housing 61 by adjusting the opening degree of the adjustment valve 636b while supplying liquid from the supply mechanism 631.

[0067] 5, the temperature adjustment medium circulating unit 63 immerses the entire exposed portion of the shell structure 100 in the liquid within the housing 61. This allows the temperature adjustment medium circulating unit 63 to efficiently adjust the temperature of the shell structure 100. The inspection device 60 inspects the substrate W while the shell structure 100 is immersed in the liquid. Note that the temperature adjustment medium circulating unit 63 is not limited to immersing the entire exposed portion of the shell structure 100 in the liquid, and may adjust the amount of liquid supplied so that the other surface Ws2 of the substrate W is not immersed in the liquid, for example.

[0068] 4 , the suction unit 64 of the inspection device 60 has the function of sealing the contact points between each electrode pad 113 of the contact jig 110 and each probe 622 by sucking the shell structure 100 carried into the housing 61 toward the base side of each probe 622. This suction unit 64 includes a suction hole 641 formed in the bottom wall 612 (pogo frame 614) of the housing 61, a suction tube 642 connected to the suction hole 641, and a suction mechanism 643 provided in the suction tube 642.

[0069] The suction holes 641 are provided inside the seal member 615, and by sucking the contact jig 110 as the shell structure 100 is placed, a space sealed by the shell structure 100 and the seal member 615 is formed. In this way, the seal member 615 prevents liquid from entering the contact points between the electrode pads 113 of the contact jig 110 and each probe 622. Note that the suction holes 641 may utilize holes of a plurality of lift pins 616 that receive and transfer the shell structure 100 to and from a transport device in the inspection area 12, for example.

[0070] The suction mechanism 643 is provided outside the housing 61, and generates a suction force in the suction hole 641 through the suction pipe 642 under the control of the control unit 69. This suction mechanism 643 may be configured by appropriately combining a pressure control (APC) valve, a turbomolecular pump that sucks in a processing gas, a vacuum pump, etc. Note that the suction unit 64 may be configured to supply gas to the shell structure 100 side (the previously sealed space) through the suction pipe 642 and the suction hole 641 when the suction of the shell structure 100 is released, thereby promoting separation of the shell structure 100 and the sealing member 615.

[0071] The temperature raising unit 65 of the inspection device 60 is provided inside or outside the housing 61 and has the function of raising the temperature of the substrate W in the shell structure 100. For example, the temperature raising unit 65 is installed on the ceiling wall 611 and may be an LED device 651 that emits irradiation light. The LED device 651 emits irradiation light to the substrate W to finely adjust (raise) the temperature of the substrate W. Note that the device that finely adjusts the temperature of the substrate W is not limited to the LED device 651, and a halogen lamp or the like that easily transmits temperature may also be used.

[0072] Furthermore, the LED device 651 may be configured to detect the in-plane temperature distribution of the substrate W using a temperature sensor (not shown) during inspection of the shell structure 100 (substrate W), and if a difference occurs in this in-plane temperature distribution, to partially heat the low-temperature portion of the substrate W. In other words, the LED device 651 preferably has a partitioned irradiation section that irradiates a portion of the substrate W with irradiation light to heat it. This allows the LED device 651 to easily homogenize the in-plane temperature distribution of the substrate W. The temperature raising section 65 is not limited to a device that irradiates the substrate W with light to heat it, and may be configured to adjust the temperature of the substrate W by using a heater or the like to raise the temperature of the liquid supplied to the housing 61. In this case, the temperature raising section 65 may be provided on the bottom wall 612, the side wall 613, or the like, to heat the entire liquid in the housing 61.

[0073] Similar to the controller 90, a computer having a processor, a memory, an input / output interface, a communication interface, etc. is applied to the control unit 69 of the inspection apparatus 60. The control unit 69 controls each component of the inspection apparatus 60 to immerse the shell structure 100 in the liquid and inspect the substrate W of the shell structure 100. The controller 90 may also function as the control unit 69 of the inspection apparatus 60.

[0074] The inspection device 60 according to the embodiment is basically configured as described above, and its operation will be described below with reference to Fig. 6. Fig. 6 is a flowchart showing the inspection method of the inspection device 60.

[0075] The control unit 69 of the inspection device 60 controls steps S101 to S107 in FIG. 6 to execute the inspection method for inspecting the shell structure 100.

[0076] Based on a command from the controller 90, the inspection device 60 cooperates with the transport device in the inspection region 12 to transport the shell structure 100 held by the transport device into the inspection space 61s of the housing 61 and place the shell structure 100 at a placement position within the housing 61 (step S101). Note that the shell structure 100 is in an adjusted posture before being transported into the housing 61 by the transport device in the inspection region 12. For example, the inspection system 1 has an alignment function in the load lock module 15 on the exit side that adjusts the posture of the shell structure 100. The transport device in the inspection region 12 can hold the posture of the shell structure 100 adjusted when removing the substrate W from the load lock module 15. Note that the inspection system 1 may also include a dedicated aligner device (not shown) in the inspection region 12.

[0077] When the shell structure 100 is placed in the placement position by the lowering of the lift pins 616, the probes 622 protruding from the pogo frame 614 of the housing 61 come into contact with the electrode pads 113 of the contact jig 110. Since the posture of the shell structure 100 is adjusted in advance, the electrode pads 113 and the probes 622 can be brought into stable contact with each other.

[0078] As described above, each electrode pad 113 of the contact jig 110 of the shell structure 100 has an area larger than the conductive portion Wc of the substrate W. Therefore, even if the position of the shell structure 100 is slightly shifted, it is possible to easily maintain the opposing state between each probe 622 of the inspection device 60 and each electrode pad 113. Therefore, the alignment function of the exit-side load lock module 15 may be limited to roughly adjusting the attitude of the shell structure 100. As a result, the time required to adjust the attitude of the shell structure 100 can be shortened, and the inspection of the substrate W can be performed efficiently.

[0079] Next, the inspection device 60 operates the suction unit 64 to suck the shell structure 100, thereby airtightly sealing the shell structure 100, the bottom wall 612, and the seal member 615 (step S102). This suction by the suction unit 64 brings each of the electrode pads 113 into contact with each of the probes 622 with an appropriate needle pressure, enabling stable transmission and reception of electrical signals with the probe card 62. Furthermore, the suction by the suction unit 64 seals the shell structure 100 and the bottom wall 612 of the housing 61 via the seal member 615. This prevents liquid from seeping into the contact points between the electrode pads 113 and the probes 622, even if liquid is supplied into the housing 61.

[0080] After the inspection device 60 adsorbs the shell structure 100, it operates the temperature adjustment medium circulating unit 63 to supply a liquid, which is a temperature adjustment medium, to the inspection space 61s of the housing 61 (step S103). At this time, the temperature adjustment medium circulating unit 63 blocks the outflow of liquid from the housing 61 by closing the adjustment valve 636b of the discharge mechanism 636. The temperature adjustment medium circulating unit 63 also causes the liquid, adjusted to a target temperature by the supply mechanism 631, to flow into the housing 61. For example, when the temperature of the shell structure 100 is to be increased to a first temperature (e.g., 80°C), the high-temperature chiller unit 633 heats the liquid to the first temperature and supplies the liquid to the housing 61. Alternatively, when the temperature of the shell structure 100 is to be decreased to a second temperature (e.g., -20°C), the low-temperature chiller unit 634 cools the liquid to the second temperature and supplies the liquid to the housing 61. This allows the temperature of the shell structure 100 immersed in the liquid to be efficiently adjusted to the target temperature. If the temperature of the temperature adjusting medium becomes low when it flows into the housing 61 , the inspection device 60 may finely adjust the temperature of the shell structure 100 by the heating unit 65 .

[0081] Then, the inspection device 60 inspects the electrical characteristics of the substrate W of the shell structure 100 while the shell structure 100 is immersed in the liquid and the temperature is adjusted (step S104). In this inspection, the inspection device 60 outputs an electrical signal from the probe card 62 to the shell structure 100 via each probe 622. The shell structure 100 transmits the electrical signal to each conductive portion Wc of the substrate W through each wiring 119 and each contact portion 112 of the contact jig 110. The shell structure 100 also transmits the electrical signal output from each conductive portion Wc of the substrate W to each probe 622 through each contact portion 112 and each wiring 119. This allows the inspection device 60 to perform an inspection while the temperature of the substrate W is adjusted to a target temperature, and to appropriately determine whether the substrate W is good or bad at that temperature.

[0082] After the inspection of the substrate W, the inspection device 60 operates the temperature adjustment medium circulating part 63 to discharge the liquid stored in the housing 61 (step S105). That is, the inspection device 60 opens the adjustment valve 636b of the discharge mechanism 636 to discharge all of the liquid in the inspection space 61s.

[0083] Next, the inspection device 60 releases the suction of the shell structure 100 by the suction unit 64, thereby making the shell structure 100 ready to be carried out of the housing 61 (step S106). As described above, by discharging the liquid before releasing the suction, even when the suction is released, it is possible to prevent the electrode pads 113 and the probes 622 from coming into contact with the liquid.

[0084] Finally, based on instructions from the controller 90, the control unit 69 cooperates with the transport device in the inspection area 12 to transfer the shell structure 100 to the transport device and transport the shell structure 100 out of the inspection space 61s of the housing 61 (step S108).

[0085] As described above, the inspection device 60 according to the embodiment can efficiently adjust the temperature by immersing the shell structure 100 in liquid and adjusting the temperature of the shell structure 100 (substrate W). In particular, because the liquid directly contacts the substrate W to adjust the temperature, the speed of temperature change can be accelerated and the in-plane temperature distribution of the substrate W can be made more uniform. Furthermore, by separately providing the high-temperature chiller unit 633 and the low-temperature chiller unit 634, the inspection device 60 can easily switch between flowing a high-temperature liquid and a low-temperature refrigerant. The inspection device 60 can be made smaller because it does not require a chuck that adsorbs the shell structure 100 or a temperature module.

[0086] Moreover, because the shell structure 100 has a sealed outer periphery, the conductive portions Wc (semiconductor devices) of the substrate W are not contaminated by liquid, and the temperature of the substrate W can be stably adjusted. As described above, the contact jig 110 of the shell structure 100 has large electrode pads 113 spaced widely apart, which allows for lower alignment precision. This eliminates the need for the inspection device 60 to include a precise posture adjustment mechanism, thereby reducing costs.

[0087] Furthermore, by continuing the immersion in liquid even during inspection of the shell structure 100, the inspection device 60 can effectively dissipate heat even if the substrate W generates heat due to the power supply during inspection. For example, when the inspection device 60 inspects the electrical characteristics of the substrate W while adjusting the temperature of the shell structure 100 using low-temperature liquid supplied by the low-temperature chiller unit 634, heat may be generated in the substrate W. The heat generated by the substrate W causes the liquid around the shell structure 100 to boil. However, the liquid immersing the shell structure 100 allows the vaporized gas to escape upward without remaining on the substrate W. This allows the liquid to circulate around the shell structure 100, enabling efficient boil-cooling of the shell structure 100. Note that boil-cooling can also dissipate heat by a similar effect in the high-temperature liquid supplied by the high-temperature chiller unit 633.

[0088] The inspection device 60 according to the embodiment is not limited to the above configuration and may take various modified forms. For example, the inspection device 60 may have a fixing mechanism that mechanically fixes the shell structure 100 transported to the housing 61. The inspection device 60 may be configured without the suction unit 64 by having the fixing mechanism fix the shell structure 100 in a liquid-tight manner.

[0089] In the above embodiment, the temperature adjustment medium circulating unit 63 is configured to include both the high-temperature chiller unit 633 and the low-temperature chiller unit 634. However, this is not limiting, and the temperature adjustment medium circulating unit 63 may be configured to include either the high-temperature chiller unit 633 or the low-temperature chiller unit 634. In short, the supply mechanism 631 may adjust the temperature of the liquid using a single device equipped with a heat exchanger, a heater, etc.

[0090] In the above embodiment, the electrode pads 113 of the shell structure 100 are larger in both area and spacing than the conductive portions Wc. However, the electrode pads 113 may have an area similar to that of the conductive portions Wc but with a spacing larger than that of the conductive portions Wc, or conversely, the electrode pads 113 may have an area larger than that of the conductive portions Wc but with a spacing similar to that of the conductive portions Wc. Alternatively, the area and spacing of the electrode pads 113 may be the same as that of the conductive portions Wc.

[0091] 7 is a side cross-sectional view schematically illustrating an inspection device 60A according to the second embodiment. The inspection device 60A according to the second embodiment differs from the inspection device 60A according to the first embodiment in that the shell structure 100 is held on a ceiling wall 611 (pogo frame 614) on the vertically upper side of the housing 61, and the substrate W is immersed in liquid.

[0092] Specifically, the inspection device 60A has a probe card 62 (each probe 622) and a suction unit 64 mounted on a ceiling wall 611. The probe card 62 has each probe 622 protruding vertically downward from the main body 621. The ceiling wall 611 also has a seal member 615 around each probe 622. The suction unit 64 has suction holes 641 in a pogo frame 614 of the ceiling wall 611, and holds the shell structure 100 against the ceiling wall 611 by sucking the shell structure 100. As a result, the shell structure 100 is in a state in which the contact jig 110 is arranged on the upper side and the substrate W is arranged on the lower side.

[0093] The temperature adjustment medium circulating unit 63 supplies a liquid, which is a temperature adjustment medium, to the housing 61, so that, for example, the substrate W of the shell structure 100 is immersed in the liquid. Even in this state, the inspection device 60A can efficiently and uniformly adjust the temperature of the substrate W by using the supplied liquid. In other words, the inspection devices 60, 60A are not limited to a configuration in which the entire shell structure 100 exposed to the inspection space 61s is immersed in the liquid, and may be a configuration in which only a portion of the shell structure 100 is immersed in the liquid.

[0094] The inspection device 60A can stably inspect the electrical characteristics of the substrate W of the liquid-immersed shell structure 100 using the tester 66 and the probe card 62. In particular, the inspection device 60A is configured to hold the shell structure 100 upward so that liquid does not reach the contact points between the electrode pads 113 and the probes 622. This allows the inspection device 60A to more reliably avoid problems such as wetting the probes 622 when the shell structure 100 is transported, etc. Note that the inspection device 60A may adjust the temperature of the shell structure 100 while the inspection space 61s of the housing 61 is entirely filled with liquid.

[0095] FIG. 8 is a side view schematically illustrating an inspection device 60B according to a third embodiment. The inspection device 60B according to the third embodiment differs from the inspection devices 60 and 60A in that it includes multiple inspection units 67, each including a housing 61, a probe card 62, a temperature control medium circulating unit 63, a suction unit 64, a heating unit 65, and a tester 66. For example, the inspection device 60B includes multiple inspection units 67 arranged in four horizontal rows and three vertical rows. In other words, the multiple inspection units 67 are stacked vertically in multiple rows to form a multi-tiered structure. Furthermore, the inspection device 60B includes a transport device 68 that transports the shell structure 100 to a target inspection unit 67 among the multiple inspection units 67. The transport device 68 may be the transport device for the inspection area 12.

[0096] The temperature adjustment medium circulation unit 63, which circulates the liquid temperature adjustment medium, may have a common pipe and chiller connected to each of the inspection units 67, and may be configured to selectively supply and discharge the temperature adjustment medium to each inspection unit 67 by opening and closing a valve in the pipe. The same applies to the suction unit 64.

[0097] The inspection device 60B configured in this manner can simultaneously adjust the temperature and inspect a plurality of shell structures 100 by transporting the shell structures 100 to each of the plurality of inspection units 67. In particular, the housing 61 of the inspection unit 67 can be made as small as possible by not installing a chuck, a prober device, or the like, as described above, and the footprint of the inspection device 60B can be made as small as possible even when it is equipped with a plurality of inspection units 67.

[0098] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0099] A first aspect of the present disclosure is an inspection device 60, 60A, 60B for inspecting a shell structure 100 in which a portion where a conductive portion Wc of a substrate W and a contact portion 112 of a jig (contact jig 110) are electrically connected is sealed, the inspection device including a housing 61, a probe 622 that contacts an electrode (electrode pad 113) of the jig that is electrically connected to the contact portion 112 inside the housing 61, a temperature adjustment medium circulating unit 63 that supplies and discharges a temperature adjustment medium into the housing 61, and a control unit 69, wherein the control unit 69 performs the following functions: (A) The control unit controls the steps of: (B) carrying the shell structure 100 into the housing 61 and placing the shell structure 100 with the probe 622 in contact with the electrode; (B) after steps (A), supplying a temperature adjustment medium from the temperature adjustment medium circulation section 63 into the housing 61 and adjusting the temperature of the shell structure 100 by immersing at least a portion of the shell structure 100 in the temperature adjustment medium; and (C) inspecting the substrate W of the shell structure 100 via the probe 622 while performing step (B).

[0100] As described above, the inspection devices 60, 60A, and 60B can efficiently adjust the temperature of the substrate W by supplying a temperature adjustment medium to the inside of the housing through the temperature adjustment medium circulating unit and immersing the shell structure in the temperature adjustment medium. Moreover, the inspection devices 60, 60A, and 60B can stably inspect the temperature-adjusted substrate W by immersing the shell structure 100 in the temperature adjustment medium while the probes are in contact with the electrodes (electrode pads 113) of the shell structure 100. This allows the inspection devices 60, 60A, and 60B to inspect the substrate W efficiently and accurately.

[0101] Furthermore, the base side of the probe 622 has a suction unit 64 that sucks the shell structure 100, and the control unit 69 sucks the shell structure 100 by the suction unit 64 as step (D) between steps (A) and (B), and also continues step (D) in steps (B) and (C). This allows the inspection devices 60, 60A, 60B to stably maintain a conductive state between the shell structure 100 and each probe 622.

[0102] The housing 61 also has a seal member 615 that liquid-tightly seals the outer periphery of the surface of the jig (contact jig 110) that has the electrodes when the probes 622 are in contact with the electrodes (electrode pads 113). The seal member 615 enables the inspection devices 60, 60A, 60B to liquid-tightly close the contact points between the probes 622 and the electrodes, enabling more stable inspection of the substrate W.

[0103] Furthermore, the housing 61 has a probe 622 and a suction unit 64 on the vertically lower side of the housing 61, and in step (D), the shell structure 100 is placed on the vertically lower side inside the housing 61 in step (A), and the shell structure 100 is sucked by the suction unit 64. This allows the inspection devices 60 and 60B to easily immerse the shell structure 100 placed on the vertically lower side of the housing 61 in liquid and inspect it.

[0104] Furthermore, the housing 61 has a probe 622 and a suction unit 64 on the vertically upper side of the housing 61, and in step (D), the shell structure 100 is sucked by the suction unit 64 in a state in which the shell structure 100 is placed on the vertically upper side inside the housing 61 in step (A). Even in this case, the inspection device 60A can immerse the shell structure 100 in liquid, and can more reliably prevent the probe 622 from getting wet.

[0105] The temperature adjustment medium circulation unit 63 also includes a high-temperature chiller unit 633 that supplies the temperature adjustment medium adjusted to a first temperature to the housing 61, and a low-temperature chiller unit 634 that supplies the temperature adjustment medium adjusted to a second temperature lower than the first temperature to the housing 61. This enables the inspection devices 60, 60A, 60B to inspect the substrates W adjusted to an appropriate temperature within a wide temperature range.

[0106] Furthermore, in step (B), the control unit 69 selects either the temperature adjustment medium at the first temperature or the temperature adjustment medium at the second temperature and supplies it to the housing 61. This allows the inspection devices 60, 60A, 60B to adjust the temperature of the shell structure 100 in a shorter time.

[0107] Furthermore, in step (B), the control unit 69 mixes both the temperature adjustment medium at the first temperature and the temperature adjustment medium at the second temperature and supplies the mixture to the housing 61. This allows the inspection devices 60, 60A, 60B to easily adjust the temperature of the shell structure 100 to various temperatures.

[0108] Furthermore, the temperature adjustment medium circulation unit 63 includes a discharge mechanism 636 that discharges the temperature adjustment medium supplied to the housing 61, and the control unit 69 supplies the temperature adjustment medium to the housing 61 in a state in which the discharge mechanism 636 is regulated from discharging the temperature adjustment medium in the step (B), or supplies the temperature adjustment medium to the housing 61 while discharging the temperature adjustment medium with the discharge mechanism 636. This allows the inspection device 60 to easily immerse the substrate W in the temperature adjustment medium inside the housing 61 and perform temperature adjustment.

[0109] Furthermore, the temperature adjustment medium circulation unit 63 has a circulation circuit that circulates the temperature adjustment medium discharged by the discharge mechanism 636 and supplies it again to the housing 61. This allows the inspection devices 60, 60A, 60B to reduce waste of temperature adjustment medium, thereby reducing operating costs.

[0110] Furthermore, in steps (B) and (C), the entire exposed shell structure 100 inside the housing 61 is immersed in the temperature adjustment medium, which allows the inspection devices 60, 60A, and 60B to adjust the temperature of the shell structure 100 more efficiently and uniformly.

[0111] Furthermore, the housing 61 includes a heating unit 65 that heats the shell structure 100 or the temperature adjustment medium. This allows the inspection devices 60, 60A, and 60B to finely adjust the temperature of the shell structure 100 using the housing 61, even if the temperature of the housing 61 drops due to the supply of the temperature adjustment medium.

[0112] In step (C), the heat generated by the substrate W during inspection is cooled by boiling, thereby enabling the inspection devices 60, 60A, 60B to smoothly reduce the temperature of the substrate W during inspection, and to perform the inspection stably.

[0113] Furthermore, the electrodes (electrode pads 113) of the shell structure 100 have an area larger than the conductive portions Wc of the substrate W. This allows the inspection devices 60, 60A, and 60B to easily establish contact between the electrodes and the probes 622 even if the position of the shell structure 100 is roughly adjusted when the shell structure 100 is placed on the housing 61.

[0114] Furthermore, the spacing between adjacent electrodes (electrode pads 113) in the shell structure 100 is greater than the spacing between adjacent conductive portions Wc, which allows the inspection devices 60, 60A, and 60B to more easily bring the electrodes (electrode pads 113) into contact with the probes 622.

[0115] The inspection device 60B also has a plurality of inspection units 67 each having a housing 61, a probe 622, and a temperature adjustment medium circulating unit 63, and a transport device 68 capable of transporting the shell structure 100 to each of the plurality of inspection units 67. This allows the inspection device 60B to efficiently inspect a plurality of shell structures 100 (substrates W).

[0116] The inspection units 67 are formed in a multi-tier structure in which they are stacked in multiple tiers in the vertical direction, thereby enabling the inspection device 60B to efficiently inspect the shell structures 100 while improving the footprint of the inspection area 12.

[0117] A second aspect of the present disclosure is an inspection method for inspecting a shell structure 100 in which a portion where electrical continuity is established between the conductive portion Wc of the substrate W and the contact portion 112 of a jig (contact jig 110) is sealed, the inspection method comprising the steps of: (A) carrying the shell structure 100 into a housing 61 and placing the shell structure 100 in a state where a probe 622 provided inside the housing 61 is in contact with an electrode (electrode pad 113) of the jig that is in electrical continuity with the contact portion 112 of the shell structure 100; (B) after step (A), supplying a temperature adjustment medium from a temperature adjustment medium circulation portion 63 into the housing 61 and adjusting the temperature of the shell structure 100 by immersing at least a portion of the shell structure 100 in the temperature adjustment medium; and (C) inspecting the substrate W of the shell structure 100 via the probe 622 while performing step (B). Even in this case, the inspection method can stably inspect the substrate while efficiently adjusting the temperature of the substrate.

[0118] The inspection apparatuses 60, 60A, 60B, and inspection methods according to the presently disclosed embodiments are illustrative in all respects and not restrictive. The embodiments may be modified and improved in various ways without departing from the spirit and scope of the appended claims. The features described in the above embodiments may be configured differently and may be combined within a consistent range.

[0119] This application claims priority from Japanese Patent Application No. 2024-026789, filed on February 26, 2024, with the Japan Patent Office, the entire contents of which are incorporated herein by reference.

[0120] 60 Inspection device 61 Housing 622 Probe 63 Temperature adjustment medium circulation section 69 Control section 100 Shell structure 110 Contact jig 112 Contact section 113 Electrode pad W Substrate Wc Conduction section

Claims

1. An inspection device for inspecting a shell structure in which a portion where a conductive portion of a substrate and a contact portion of a jig are electrically connected is sealed, comprising: a housing; a probe that contacts an electrode of the jig that is electrically connected to the contact portion inside the housing; a temperature adjustment medium circulation unit that supplies and discharges a temperature adjustment medium into the housing; and a control unit, wherein the control unit controls: (A) a step of carrying the shell structure into the housing and placing the shell structure with the probe and the electrode in contact; (B) after step (A), a step of supplying the temperature adjustment medium from the temperature adjustment medium circulation unit into the housing and adjusting the temperature of the shell structure by immersing at least a portion of the shell structure in the temperature adjustment medium; and (C) a step of inspecting the substrate of the shell structure via the probe while performing step (B).

2. The inspection device according to claim 1, further comprising a suction unit on the base side of the probe that sucks the shell structure, and wherein the control unit sucks the shell structure using the suction unit as step (D) between step (A) and step (B), and also continues step (D) in step (B) and step (C).

3. The inspection device according to claim 2, wherein the housing has a sealing member that liquid-tightly seals the outer periphery of the surface of the jig that has the electrodes when the probes and the electrodes are in contact.

4. The inspection device according to claim 2, wherein the housing has the probe and the suction unit on the vertically lower side of the housing, and in step (D), the shell structure is placed on the vertically lower side inside the housing in step (A), and the shell structure is sucked in by the suction unit.

5. The inspection device according to claim 2, wherein the housing has the probe and the suction unit on the vertically upper side of the housing, and in step (D), the shell structure is sucked by the suction unit while the shell structure is placed vertically upper inside the housing in step (A).

6. An inspection device as described in any one of claims 1 to 5, wherein the temperature adjustment medium circulation unit comprises a high-temperature chiller unit that supplies the temperature adjustment medium adjusted to a first temperature to the housing, and a low-temperature chiller unit that supplies the temperature adjustment medium adjusted to a second temperature lower than the first temperature to the housing.

7. The inspection device according to claim 6, wherein in step (B), the control unit selects either the temperature adjustment medium at the first temperature or the temperature adjustment medium at the second temperature and supplies it to the housing.

8. The inspection device according to claim 6, wherein in step (B), the control unit mixes both the temperature adjustment medium at the first temperature and the temperature adjustment medium at the second temperature and supplies the mixed mixture to the housing.

9. An inspection device as claimed in any one of claims 1 to 5, wherein the temperature adjustment medium circulation unit is provided with a discharge mechanism that discharges the temperature adjustment medium supplied to the housing, and the control unit, in step (B), supplies the temperature adjustment medium to the housing while regulating the discharge of the temperature adjustment medium by the discharge mechanism, or supplies the temperature adjustment medium to the housing while discharging the temperature adjustment medium by the discharge mechanism.

10. The inspection device according to claim 9, wherein the temperature adjustment medium circulation section has a circulation circuit that circulates the temperature adjustment medium discharged by the discharge mechanism and supplies it again to the housing.

11. An inspection device according to any one of claims 1 to 5, wherein in steps (B) and (C), the entire shell structure exposed inside the housing is immersed in the temperature adjustment medium.

12. The inspection device according to any one of claims 1 to 5, wherein the housing is provided with a heating section that heats the shell structure or the temperature adjustment medium.

13. An inspection device according to any one of claims 1 to 5, wherein in step (C), boiling cooling is performed to cool down the heat generated by the substrate during inspection.

14. The inspection device according to any one of claims 1 to 5, wherein the electrode of the shell structure has an area larger than that of the conductive portion of the substrate.

15. The inspection device according to claim 14, wherein the spacing between adjacent electrodes in the shell structure is greater than the spacing between adjacent conductive portions.

16. An inspection device according to any one of claims 1 to 5, comprising a plurality of inspection sections each having the housing, the probe, and the temperature adjustment medium circulating section, and comprising a transport device capable of transporting the shell structure to each of the plurality of inspection sections.

17. The inspection device according to claim 16, wherein the plurality of inspection units are formed in a multi-stage structure in which multiple stages are stacked in the vertical direction.

18. An inspection method for inspecting a shell structure in which a portion where a conductive portion of a substrate and a contact portion of a jig are electrically connected is sealed, comprising: (A) a step of carrying the shell structure into a housing and placing the shell structure in a state where a probe provided inside the housing is in contact with an electrode of the jig that is electrically connected to the contact portion of the shell structure; (B) a step of supplying a temperature adjustment medium from a temperature adjustment medium circulation portion into the housing after the step (A) and adjusting the temperature of the shell structure by immersing at least a portion of the shell structure in the temperature adjustment medium; and (C) a step of inspecting the substrate of the shell structure via the probe while performing the step (B).

Images