Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device

Abstract

Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition contains an elastomer (A), a thermosetting compound (B), and a radical polymerization initiator (C). The elastomer (A) includes a polymer block (a1) including a conjugated diene compound unit and a styrene compound unit having a radical reactive group. The thermosetting compound (B) contains a resin (E) having two or more vinylbenzyl groups at terminals. The content of the elastomer (A) is 0.5-30 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition. The mass ratio ((A) / (E)) of the elastomer (A) to the resin (E) having two or more vinylbenzyl groups at terminals is 0.01-1.1.