Refrigerator and method for controlling same

Abstract

A refrigerator according to an embodiment comprises: a storage chamber; a cooling sink; a thermoelectric element that includes a cooling layer in contact with the cooling sink and cools the cooling sink by cooling the cooling layer on the basis of an applied voltage pulse; a cooling fan that can be controlled to generate airflow from the storage chamber to the cooling sink so that the air is cooled in the cooling sink; a cooling duct that covers the cooling sink and the cooling fan, guides the airflow from the storage chamber to the cooling sink, and accommodates defrost water that is generated as water frozen in the cooling sink melts; a temperature sensor for detecting the temperature of the cooling sink; and a processor which controls the cooling fan in order to evaporate the defrost water accommodated in the cooling duct, and which performs anti-icing control that includes regulating the duty ratio of the voltage pulse, on the basis of the temperature of the cooling sink detected by the temperature sensor, so that the defrost water accommodated in the cooling duct does not freeze.

Description

Refrigerator and refrigerator control method

[0001] The disclosed invention relates to a refrigerator, and more particularly to a refrigerator having a thermoelectric element for cooling a storage compartment.

[0002] A refrigerator is a home appliance that has a main body having a storage compartment and a cold air supply device that supplies cold air to the storage compartment to keep food fresh.

[0003] A thermoelectric cooling device that generates heat and cooling through the Peltier effect can be used as a cooling device in a refrigerator. The thermoelectric cooling device may include a thermoelectric element. The thermoelectric element has a heating layer formed on one side and a cooling layer formed on the opposite side. When current is applied to the thermoelectric element, heat generation occurs in the heating layer and heat absorption occurs in the cooling layer.

[0004] A thermoelectric cooling device may be equipped with a heat sink, a cooling sink, a heat sink fan, a cooling fan, a heat sink duct, and a cooling duct to increase the efficiency of cooling a storage room through the thermoelectric cooling device.

[0005] The disclosed invention provides a refrigerator including a thermoelectric cooling device using a thermoelectric element and a control method thereof.

[0006] The disclosed invention provides a refrigerator and a control method thereof capable of removing defrost water contained in a cooling duct by defrosting a cooling sink included in a thermoelectric cooling device and preventing freezing of the defrost water.

[0007] The disclosed invention provides a refrigerator and a control method thereof capable of preventing water overflow in a cooling duct.

[0008] According to one embodiment, a refrigerator may include: a storage compartment; a cooling sink; a cooling layer in contact with the cooling sink, the cooling layer being cooled based on an applied voltage pulse to cool the cooling sink; a cooling fan controllable to generate an air flow from the storage compartment to the cooling sink so as to cool the cooling sink; a cooling duct covering the cooling sink and the cooling fan, guiding the air flow from the storage compartment to the cooling sink, and receiving defrost water generated when frozen water in the cooling sink is defrosted; a temperature sensor detecting a temperature of the cooling sink; and a processor performing an anti-icing control including controlling the cooling fan to evaporate the defrost water received in the cooling duct and adjusting a duty ratio of the voltage pulse based on a temperature of the cooling sink detected by the temperature sensor so as to prevent the defrost water received in the cooling duct from freezing.

[0009] In a control method of a refrigerator, comprising a storage compartment, a cooling sink, a cooling layer in contact with the cooling sink, a thermoelectric element cooling the cooling layer based on an applied voltage pulse to cool the cooling sink, a cooling fan controllable to generate an air flow from the storage compartment to the cooling sink so as to cool in the cooling sink, a cooling duct covering the cooling sink and the cooling fan, guiding the air flow from the storage compartment to the cooling sink, and receiving defrost water generated when frozen water in the cooling sink is defrosted, a temperature sensor detecting a temperature of the cooling sink, and a processor, the control method according to one embodiment may include: controlling the cooling fan by the processor to evaporate the defrost water received in the cooling duct; and performing an anti-freezing control including adjusting a duty ratio of the voltage pulse based on a temperature of the cooling sink detected by the temperature sensor so as not to freeze the defrost water received in the cooling duct.

[0010] The disclosed refrigerator and its control method can increase the cooling efficiency of a storage room by using a thermoelectric cooling device.

[0011] The disclosed refrigerator and its control method can prevent performance damage of a thermoelectric cooling device by removing defrost water generated by defrosting a cooling sink of the thermoelectric cooling device.

[0012] The disclosed refrigerator and its control method can prevent freezing of the defrost water contained in the cooling duct.

[0013] The disclosed refrigerator and its control method can prevent water overflow in a cooling duct.

[0014] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0015] Figure 1 illustrates a refrigerator according to one embodiment.

[0016] Figure 2 illustrates the doors of a refrigerator in an open state according to one embodiment.

[0017] FIG. 3 is a drawing of the upper part of a storage compartment of a refrigerator according to one embodiment, viewed from below.

[0018] Figure 4 is a schematic cross-sectional side view of a refrigerator according to one embodiment.

[0019] Figure 5 is a cross-sectional view taken along line II of Figure 2.

[0020] Figure 6 is an exploded view of a heat dissipation fan and a thermoelectric module according to one embodiment.

[0021] Figure 7 illustrates a heat sink according to one embodiment.

[0022] Figure 8 illustrates a cooling sink according to one embodiment.

[0023] Figure 9 illustrates a state in which a cooling duct cover and a cooling duct body are separated from the upper wall of the main body according to one embodiment.

[0024] FIG. 10 is an exploded view of a cooling duct body and a cooling duct cover viewed from below according to one embodiment.

[0025] Figure 11 is an exploded view from above of a cooling duct body and a cooling duct cover according to one embodiment.

[0026] Fig. 12 is a control block diagram of a refrigerator according to one embodiment.

[0027] Fig. 13 is a flowchart briefly explaining a method for controlling a refrigerator according to one embodiment.

[0028] Fig. 14 is a flowchart detailing a method for controlling a refrigerator according to one embodiment.

[0029] Figure 15 is a flowchart illustrating a method for temporarily suspending the anti-icing control of the water level described in Figure 13.

[0030] Fig. 16 is a flowchart for further explanation regarding the control of the cooling fan in the evaporation operation of the water described in Fig. 13.

[0031] Fig. 17 is a flowchart illustrating a specific embodiment of the control method of the refrigerator described in Fig. 14.

[0032] It should be understood that the various embodiments and terms used in this document are not intended to limit the technical features described in this document to specific embodiments, but rather to encompass various modifications, equivalents, or alternatives of the embodiments.

[0033] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0034] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0035] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0036] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0037] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0038] The terms "include" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but do not exclude the possibility of the additional presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0039] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0040] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0041] The terms "front", "back", "left", "right", "upper", "lower", etc. used in the following description are defined based on the drawing, but the shape and position of each component are not limited by the above terms. For example, the front side can be defined as the +X side, and the rear side can be defined as the -X side. For example, based on the drawing, the right side can be defined as the +Y side, and the left side can be defined as the -Y side. For example, based on the drawing, the upper side can be defined as the +Z side, and the lower side can be defined as the -Z side.

[0042] Additionally, terms such as "~part", "~device", "~block", "~absence", and "~module" may refer to a unit that processes at least one function or operation. For example, the terms may refer to at least one piece of hardware such as an FPGA (field-programmable gate array) / ASIC (application specific integrated circuit), at least one piece of software stored in memory, or at least one process processed by a processor.

[0043] Hereinafter, an embodiment of the disclosed invention will be described in detail with reference to the attached drawings. The same reference numbers or symbols used in the attached drawings may represent parts or components that perform substantially the same functions.

[0044] A refrigerator according to one embodiment may include a body.

[0045] The body may include insulation. The insulation may insulate the interior and exterior of the storage compartment so that the temperature inside the storage compartment can be maintained at a set temperature without being affected by the external environment of the storage compartment. In one embodiment, the insulation may include a foam insulation, such as polyurethane foam. In another embodiment, the insulation may additionally include a vacuum insulation in addition to the foam insulation, or the insulation may consist solely of the vacuum insulation instead of the foam insulation.

[0046] A storage room can store various items such as food, medicine, and cosmetics, and the storage room can be formed so that at least one side is open for taking items in and out.

[0047] A refrigerator may include one or more storage compartments. When a refrigerator has two or more storage compartments, each compartment may have a different purpose and be maintained at different temperatures. To achieve this, each storage compartment may be separated from the others by a partition wall containing insulation.

[0048] The storage room may be provided to be maintained at an appropriate temperature range depending on the intended use, and may include a "refrigerator," a "freezer," or a "variable temperature room," which are distinguished according to the intended use and / or temperature range. The refrigerator room may be maintained at a temperature appropriate for refrigerating items, and the freezer room may be maintained at a temperature appropriate for freezing items. "Refrigeration" may mean cooling items to a temperature that does not freeze them, and for example, a refrigerator room may be maintained at a temperature ranging from 0 degrees Celsius to +7 degrees Celsius. "Freezing" may mean cooling items to freeze them or keep them in a frozen state, and for example, a freezer room may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius. The variable temperature room may be used as either a refrigerator room or a freezer room, at the user's option or not.

[0049] In addition to names such as "refrigerator," "freezer," and "variable temperature room," a storage room may also be called by various other names such as "vegetable room," "fresh room," "cooling room," and "ice room." The terms "refrigerator," "freezer," and "variable temperature room" used hereinafter should be understood to encompass storage rooms having corresponding uses and temperature ranges.

[0050] According to one embodiment, the refrigerator may include at least one door configured to open and close an open side of a storage compartment. The door may be configured to open and close one or more storage compartments, or a single door may be configured to open and close multiple storage compartments. The door may be installed on the front of the main body in a pivotal or sliding manner.

[0051] The door may be configured to seal the storage compartment when the door is closed. The door may include insulation, similar to the body, to insulate the storage compartment when the door is closed.

[0052] According to one embodiment, the door may include a door outer panel forming the front of the door, a door inner panel forming the back of the door and facing the storage compartment, an upper cap, a lower cap, and door insulation provided on the interior of these.

[0053] The door inner panel may be provided with a gasket that seals the storage compartment by contacting the front of the body when the door is closed. The door inner panel may include a dyke that protrudes rearward to accommodate a door basket for storing items.

[0054] In one embodiment, the door may include a door body and a front panel detachably coupled to the front side of the door body and forming the front of the door. The door body may include a door outer panel forming the front of the door body, a door inner panel forming the rear of the door body and facing the storage compartment, an upper cap, a lower cap, and door insulation provided inside these.

[0055] Depending on the arrangement of the door and storage compartment, refrigerators can be classified into French door type, side-by-side type, bottom mounted freezer (BMF), top mounted freezer (TMF), or single-door refrigerator.

[0056] According to one embodiment, the refrigerator may include a cold air supply device configured to supply cold air to the storage compartment.

[0057] The cold air supply device may include a system of machines, devices, electronic devices and / or combinations thereof that can generate cold air and guide the cold air to cool the storage room.

[0058] In one embodiment, the cold air supply device can generate cold air through a refrigeration cycle that includes the processes of compression, condensation, expansion, and evaporation of a refrigerant. To this end, the cold air supply device can include a refrigeration cycle device having a compressor, a condenser, an expansion device, and an evaporator capable of driving the refrigeration cycle. In one embodiment, the cold air supply device can include a semiconductor, such as a thermoelectric element. The thermoelectric element can cool a storage compartment by generating heat and cooling through the Peltier effect.

[0059] According to one embodiment, the refrigerator may include a machine room in which at least some components belonging to the cold air supply device are arranged.

[0060] The machine room may be designed to be partitioned and insulated from the storage room to prevent heat generated by components placed within the machine room from being transferred to the storage room. The interior of the machine room may be configured to be connected to the exterior of the main body to dissipate heat from components placed within the machine room.

[0061] In one embodiment, the refrigerator may include a dispenser provided on the door to provide water and / or ice. The dispenser may be provided on the door so that it is accessible to a user without having to open the door.

[0062] In one embodiment, a refrigerator may include an ice-making device configured to produce ice. The ice-making device may include an ice-making tray configured to store water, an ice-separating device configured to separate ice from the ice-making tray, and an ice bucket configured to store ice produced in the ice-making tray.

[0063] According to one embodiment, the refrigerator may include a control unit for controlling the refrigerator.

[0064] The control unit may include a memory that stores or memorizes a program and / or data for controlling the refrigerator, and a processor that outputs a control signal for controlling a cold air supply device, etc. according to the program and / or data memorized in the memory.

[0065] Memory stores or records various information, data, commands, programs, etc. necessary for the operation of the refrigerator. Memory can store temporary data generated during the generation of control signals for controlling components within the refrigerator. Memory may include at least one of volatile memory and non-volatile memory, or a combination thereof.

[0066] The processor controls the overall operation of the refrigerator. The processor can control the components of the refrigerator by executing programs stored in memory. The processor may include a separate NPU that performs the operations of an artificial intelligence model. The processor may also include a central processing unit (CPU), a graphics processing unit (GPU), or the like. The processor may generate control signals to control the operation of the cooling system. For example, the processor may receive temperature information about the storage compartment from a temperature sensor and generate a cooling control signal to control the operation of the cooling system based on the temperature information.

[0067] Additionally, the processor may process user input of the user interface and control the operation of the user interface based on programs and / or data stored / stored in the memory. The user interface may be provided using an input interface and an output interface. The processor may receive user input from the user interface. Additionally, the processor may transmit display control signals and image data to the user interface for displaying an image on the user interface in response to the user input.

[0068] The processor and memory may be provided as a single unit or separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one subprocessor. The memory may include one or more memories.

[0069] In one embodiment, a refrigerator may include a processor and memory that control all components within the refrigerator, and may include multiple processors and multiple memories that individually control the components within the refrigerator. For example, the refrigerator may include a processor and memory that control the operation of a cooling device based on the output of a temperature sensor. Additionally, the refrigerator may separately include a processor and memory that control the operation of a user interface based on user input.

[0070] The communication module can communicate with external devices, such as servers, mobile devices, and other home appliances, via a nearby access point (AP). The AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected. The refrigerator or user device can then connect to the server via the WAN.

[0071] The input interface may include keys, a touchscreen, a microphone, etc. The input interface may receive user input and transmit it to the processor.

[0072] The output interface may include a display, a speaker, etc. The output interface may output various notifications, messages, information, etc. generated by the processor.

[0073] The operating principle and embodiments of the present disclosure are described below with reference to the attached drawings.

[0074] FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure. FIG. 2 is a drawing illustrating a state in which a door of a refrigerator according to one embodiment of the present disclosure is opened. FIG. 3 is a drawing illustrating the upper portion of a storage compartment of a refrigerator according to one embodiment of the present disclosure as viewed from below. FIG. 4 is a schematic side cross-sectional view of a refrigerator according to one embodiment of the present disclosure. FIG. 5 is a cross-sectional view taken along line II of FIG. 2.

[0075] Referring to FIGS. 1 to 5, a refrigerator (1) may include a main body (100), storage compartments (11, 12, 13) formed inside the main body (100), and doors (21, 22, 23, 24) provided to open and close the storage compartments (11, 12, 13). The main body (100) may include an upper wall (110), a lower wall (120), a left wall (130), a right wall (140), and a rear wall (150). The upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may form an upper surface, a lower surface, a left surface, a right surface, and a rear wall of the main body (100), respectively.

[0076] Each of the upper wall (110), lower wall (120), left wall (130), right wall (140), and rear wall (150) may include an insulating material (190). For example, an insulating material (190) may be provided inside the upper wall (110). A storage room (11, 12, 13) may be formed by the upper wall (110), lower wall (120), left wall (130), right wall (140), and rear wall (150).

[0077] The storage compartments (11, 12, 13) can accommodate items. The storage compartments (11, 12, 13) can be formed to have an open front side so that items can be put in or taken out. The main body (100) can include a horizontal partition wall (160) that divides the first storage compartment (11) from the second storage compartment (12) and the third storage compartment (13), and a vertical partition wall (161) that divides the second storage compartment (12) from the third storage compartment (13). The first storage compartment (11) can be provided at the upper portion of the main body (100), and the second storage compartment (12) and the third storage compartment (13) can be provided at the lower portion of the main body (100). The first storage compartment (11) can be a refrigerator compartment. The second storage compartment (12) can be a freezer compartment. The third storage compartment (13) can be a variable temperature compartment.

[0078] Doors (21, 22, 23, 24) can open and close storage rooms (11, 12, 13). The first door (21) and the second door (22) can open and close the first storage room (11), the third door (23) can open and close the second storage room (12), and the fourth door (24) can open and close the third storage room (13). The doors (21, 22, 23, 24) can be rotatably coupled to the main body (100).

[0079] The doors (21, 22, 23, 24) may be rotatably coupled to the main body (100) by hinges. For example, the first door (21) and the second door (22) may be rotatably coupled to the main body (100) by a hinge (31) provided on the upper portion of the main body (100) and a hinge provided in the middle of the main body (100), respectively. The hinge (31) may include a hinge pin that protrudes vertically to form a rotational axis of the door. The hinge (31) may be covered by a top cover (300) provided to cover the upper front portion of the main body (100).

[0080] A rotating bar (40) may be provided on either the first door (21) or the second door (22) to cover the gap formed between the first door (21) and the second door (22) when the first door (21) and the second door (22) are closed. The rotating bar (40) may be provided rotatably on either the first door (21) or the second door (22). The rotating bar (40) may have a rod shape that is formed long in a vertical direction. The rotating bar (40) may also be referred to as a pillar, a mullion, or the like.

[0081] A guide protrusion (46) may be provided at the top of the rotating bar (40), and a rotation guide (119) that guides the rotation of the guide protrusion (46) may be provided at the top of the main body (100).

[0082] The doors (21, 22, 23, 24) may include a gasket (51). The gasket (51) may be pressed against the front of the body (100) when the doors (21, 22, 23, 24) are closed. The doors (21, 22, 23, 24) may include a ditch (52) that protrudes rearward. A door shelf (53) capable of storing items may be mounted on the ditch (52). A rotating bar (40) may be rotatably installed on the ditch (52).

[0083] Although the number and arrangement of storage compartments and the number and arrangement of doors have been described above, there is no limitation on the number and arrangement of storage compartments and the number and arrangement of doors of a refrigerator according to one embodiment of the present disclosure.

[0084] A refrigerator (1) may include a refrigeration cycle device to cool a storage compartment through a refrigeration cycle. The refrigeration cycle device may include a compressor (2) that compresses a refrigerant, a condenser that condenses the refrigerant, an expansion valve that expands the refrigerant condensed by the condenser, and an evaporator (3) that is installed at the rear of the storage compartment (20) and cools the surrounding air. The condenser and the evaporator (3) may be referred to as a heat exchanger. The evaporator (3) may be arranged outside the storage compartment (11, 12, 13). For example, the evaporator (3) may be installed at the rear of the storage compartment (12, 13).

[0085] The refrigerator (1) may include a first temperature sensor (111) for detecting the temperature of the evaporator (3). The first temperature sensor (111) may measure the temperature of the evaporator (3). The temperature of the evaporator (3) may indicate the temperature of the air surrounding the evaporator (3) and / or the surface temperature of the evaporator (3). The first temperature sensor (111) may be provided in the evaporator (3). The first temperature sensor (111) may also be provided in the evaporator ducts (60, 70).

[0086] The evaporator (3) can generate cold air supplied to the storage chamber (11, 12, 13). The compressor (2) can supply refrigerant to the evaporator (3). The refrigerant flowing inside the evaporator (3) can exchange heat with the surrounding air of the evaporator (3). Since the refrigerant flowing inside the evaporator (3) absorbs heat from the surrounding air, the surrounding air that has exchanged heat with the refrigerant can be cooled. The cooled air can be supplied to the storage chamber (11, 12, 13) according to the operation of the evaporator fan (80).

[0087] The refrigerator (1) may include evaporator ducts (60, 70) that guide cold air generated in the evaporator (3) to storage chambers (11, 12, 13). The first evaporator duct (60) may be provided at the rear side of the second storage chamber (12) and the third storage chamber (13). The second evaporator duct (70) may be provided at the rear side of the first storage chamber (11).

[0088] When the evaporator fan (80) operates, cold air generated in the evaporator (3) can be sucked into the interior of the first evaporator duct (60). The cold air sucked into the interior of the first evaporator duct (60) can be discharged to the second storage chamber (12) or the third storage chamber (13) through a cold air discharge port (not shown) formed on the front.

[0089] Additionally, a damper (61) for opening or closing the first evaporator duct (60) may be provided in the first evaporator duct (60). When the damper (61) is opened, the first evaporator duct (60) is opened, and cold air inside the first evaporator duct (60) can be supplied to the second evaporator duct (70). The cold air sucked into the inside of the first evaporator duct (60) can be guided to the internal passage (78) of the second evaporator duct (70).

[0090] A connecting duct (90) may be provided between the first evaporator duct (60) and the second evaporator duct (70) to connect the first evaporator duct (60) and the second evaporator duct (70).

[0091] Cold air introduced into the internal passage (78) of the second evaporator duct (70) can be supplied to the first storage chamber (11) through the cold air discharge port (72) formed on the front of the second evaporator duct (70).

[0092] Alternatively, the first evaporator duct (60) and the second evaporator duct (70) may not be connected. In this case, the cold air generated in the evaporator (3) may be supplied directly to the second evaporator duct (70) without passing through the first evaporator duct (60).

[0093] Although it is described that there is one evaporator (3), it is not limited thereto. For example, a separate evaporator (3) for supplying cold air to the second evaporator duct (70) may be provided at the rear of the first storage chamber (11).

[0094] Referring to FIG. 4, the first storage chamber (11) and the evaporator (3) can be connected through a return duct (73). For example, the return duct (73) can penetrate the upper side of the rear wall (150) and the lower side of the rear wall (150). The upper side of the rear wall (150) can form the rear side of the first storage chamber (11). The lower side of the rear wall (150) can form a space where the evaporator (3) is located. Air inside the first storage chamber (11) can move to the evaporator (3) through the return duct (73). Moisture inside the first storage chamber (11) can move to the evaporator (3) through the return duct (73) and be condensed in the evaporator (3). One or more return ducts (73) can be provided.

[0095] The refrigerator (1) may include a thermoelectric cooling device (400) capable of cooling the first storage compartment (11). The thermoelectric cooling device (400) may be provided on the upper side of the first storage compartment (11). The thermoelectric cooling device (400) may be provided on the upper wall (110) of the main body (100).

[0096] The thermoelectric cooling device (400) may include a thermoelectric element (530). The thermoelectric element (530) may convert thermal energy into electrical energy using the thermoelectric effect. In addition, the thermoelectric element (530) may convert electrical energy into thermal energy. The thermoelectric element (530) may be a semiconductor element. The thermoelectric element (530) may be referred to by various terms, such as a thermoelectric semiconductor element or a Peltier element. The thermoelectric element (530) may be provided on the upper wall (110).

[0097] The thermoelectric element (530) includes a heating layer (531) and a cooling layer (532). When voltage and / or current is applied to the thermoelectric element (530), a heating action may occur in the heating layer (531) and a heat absorption action may occur in the cooling layer (532). The thermoelectric element (530) may have a thin hexahedral shape. The heating layer (531) may be provided on one surface of the thermoelectric element (530) and the cooling layer (532) may be provided on the opposite surface.

[0098] The heating layer (531) may face above the thermoelectric element (530) and the cooling layer (532) may face below the thermoelectric element (530). The heating layer (531) may face the outside of the main body (100) and the cooling layer (532) may face the inside of the first storage chamber (11). Air that has been warmed through heat exchange with the heating layer (531) may be discharged to the outside of the main body (100), and air that has been cooled through heat exchange with the cooling layer (532) may be supplied to the first storage chamber (11).

[0099] The thermoelectric cooling device (400) may include a heat sink (520). The heat sink (520) may be located outside the main body (100). The heat sink (520) may contact the heat-generating layer (531) to absorb heat from the heat-generating layer (531) and release heat to the outside of the main body (100). The heat sink (520) may efficiently exchange heat between the heat-generating layer (531) and the external air of the main body (100). The heat sink (520) may be referred to by various terms such as a hot sink, a heat-radiating heat sink, or a hot heat sink.

[0100] The heat sink (520) may include a heat sink base (521) that contacts the heat-generating layer (531) and a plurality of heat sink fins (525) that protrude from the heat sink base (521) to expand the heat transfer area. The plurality of heat sink fins (525) may protrude upward from the heat sink base (521). The heat sink (520) may be formed of a metal material with good thermal conductivity. For example, the heat sink (520) may be formed of aluminum or copper.

[0101] The thermoelectric cooling device (400) may include a cooling sink (570). The cooling sink (570) may be located inside the first storage chamber (11). The cooling sink (570) may absorb heat from the first storage chamber (11) and transfer it to the cooling layer (532) of the thermoelectric element (530). Therefore, the first storage chamber (11) may be cooled. Heat exchange between the cooling layer (532) and the internal air of the first storage chamber (11) may be efficiently performed by the cooling sink (570). The cooling sink (570) may be referred to by various terms such as a cold sink, a cooling sink, a cooling heat sink, a cold heat sink, and a cooling heat sink.

[0102] The cooling sink (570) may include a cooling sink base (571) that contacts the cooling layer (532) and a plurality of cooling fins (575) that protrude from the cooling sink base (571) to expand the heat transfer area. The plurality of cooling fins (525) may protrude downward from the cooling sink base (571). The cooling sink base (571) and the plurality of cooling fins (575) may be formed integrally. The cooling sink (570) may be formed of a metal material with good thermal conductivity. For example, the cooling sink (570) may be formed of aluminum or copper.

[0103] Due to the presence of the heat sink (520) and the cooling sink (570), the heat generation action of the heating layer (531) and the heat absorption action of the cooling layer (532) can occur smoothly.

[0104] The thermoelectric cooling device (400) may include a heat dissipation fan (600) that blows air toward the heat dissipation sink (520). By the operation of the heat dissipation fan (600), heat exchange between the heat dissipation sink (520) and the external air of the main body (100) can be efficiently achieved.

[0105] The heat dissipation fan (600) may be positioned in the horizontal direction of the heat dissipation sink (520). It may be provided on the outside of the main body (100) of the heat dissipation fan (600). The heat dissipation fan (600) may be provided on the upper side of the upper wall (110). The heat dissipation fan (600) may be a centrifugal fan that sucks in air in the axial direction and discharges it in the radial directions. The centrifugal fan may include a blower fan. The rotation axis (610) of the heat dissipation fan (600) may be arranged perpendicular to the upper surface of the upper wall (110).

[0106] The thermoelectric cooling device (400) may include a heat dissipation duct (700) provided to guide air flowing by a heat dissipation fan (600). The heat dissipation duct (700) may be arranged on the upper side of the main body (100). The heat dissipation fan (600) may be located inside the heat dissipation duct (700). The heat dissipation sink (520) may be located inside the heat dissipation duct (700). The heat dissipation duct (700) may be provided on the upper surface of the upper wall (110).

[0107] The heat dissipation duct (700) can guide air outside the main body (100) to the heat dissipation sink (520). Air that has exchanged heat with the heat dissipation sink (520) can be discharged to the outside of the main body (100) through the heat dissipation duct (700). The heat dissipation duct (700) can include an outside air intake port (751) for drawing air outside the main body (100) into the inside of the heat dissipation duct (700), and an outside air discharge port (782) for discharging air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100).

[0108] The thermoelectric cooling device (400) may include a cooling fan (800) that blows air toward the cooling sink (570). By the operation of the cooling fan (800), heat exchange between the cooling sink (570) and the air inside the first storage chamber (11) can be efficiently achieved.

[0109] The cooling fan (800) may be positioned horizontally with respect to the cooling sink (570). The cooling fan (800) may be installed inside the first storage chamber (11). The cooling fan (800) may be installed on the lower side of the upper wall (110). The cooling fan (800) may be a centrifugal fan that sucks in air in the axial direction and discharges it in the radial directions. The rotation axis (810) of the cooling fan (800) may be arranged vertically with respect to the lower surface of the upper wall (110).

[0110] The thermoelectric cooling device (400) may include a second temperature sensor (112) that detects the temperature of air cooled by the cooling fan (800). The second temperature sensor (112) may detect the temperature of the cooling sink (570). The temperature of the cooling sink (570) may indicate the temperature of the air surrounding the cooling sink (570) and / or the surface temperature of the cooling sink (570). The second temperature sensor (112) may be provided in the cooling sink (570). The second temperature sensor (112) may also be provided in the cooling duct (900).

[0111] The thermoelectric cooling device (400) may include a cooling duct (900) configured to guide air flowing by a cooling fan (800). The cooling fan (800) may be positioned inside the cooling duct (900). The cooling sink (570) may be positioned inside the cooling duct (900). The cooling duct (900) may be provided on the lower surface of the upper wall (110).

[0112] The cooling duct (700) can guide air sucked from inside the first storage chamber (11) to the cooling sink (570). Air that has exchanged heat with the cooling sink (570) can be discharged back into the first storage chamber (11) through the cooling duct (900). The cooling duct (900) can include an intake port (991) for sucking air inside the first storage chamber (11) into the cooling duct (900), and an exhaust port (992) for discharging air that has exchanged heat with the cooling sink (570) into the first storage chamber (11).

[0113] The disclosed refrigerator (1) can supply cold air to the first storage compartment (11) using various methods. The refrigerator (1) can operate at least one of a thermoelectric cooling device (400) and a refrigeration cycle device to cool the first storage compartment (11). For example, the refrigerator (1) can provide a first method of supplying only cold air generated by the thermoelectric cooling device (400), a second method of supplying only cold air generated by the refrigeration cycle device, and a third method of supplying both cold air generated by the thermoelectric cooling device (400) and cold air generated by the refrigeration cycle device.

[0114] The refrigerator (1) can supply cold air to the first storage compartment (11) in an appropriate manner depending on external and internal conditions. For example, the refrigerator (1) can cool the first storage compartment (11) in one of the methods depending on the room temperature in which the refrigerator (1) is installed. If the room temperature is relatively high and cooling by a refrigeration cycle is more effective than cooling by a thermoelectric cooling device (400), the refrigerator (1) can cool the first storage compartment (11) only with cold air generated by the refrigeration cycle device. If the room temperature is relatively low and cooling performance can be sufficiently achieved only with cooling by a thermoelectric cooling device (400), the refrigerator (1) can cool the first storage compartment (11) only with cold air generated by the thermoelectric cooling device (400).

[0115] The refrigerator (1) may operate only the thermoelectric cooling device (400) when noise reduction is required. When rapid cooling of the first storage compartment (11) is required, the refrigerator (1) may simultaneously supply cold air generated through the thermoelectric cooling device (400) and cold air generated through the refrigeration cycle device to the first storage compartment (11).

[0116] The refrigerator (1) has been described as including a thermoelectric cooling device (400) and a refrigeration cycle device, but is not limited thereto. The refrigerator (1) may include only one of the thermoelectric cooling device (400) and the refrigeration cycle device.

[0117] Although the thermoelectric cooling device (400) is described as being installed on the upper wall (110) of the main body (100), the location of the thermoelectric cooling device (400) is not limited thereto. According to various embodiments, the thermoelectric cooling device (400) may be installed on at least one of the upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150).

[0118] Figure 6 is an exploded view of a heat dissipation fan and a thermoelectric module according to one embodiment.

[0119] Referring to FIG. 6, a thermoelectric cooling device (400) may include a thermoelectric module (500). The thermoelectric module (500) may include a heat sink (520), a thermoelectric element (530), a module plate (550), and a cooling sink (570). The heat sink (520), the thermoelectric element (530), and the cooling sink (570) may be assembled or formed as one piece.

[0120] The module plate (550) can serve as a frame of the thermoelectric module (500). The module plate (550) can be formed of a resin material having low thermal conductivity. The module plate (550) can maintain a gap between the heat sink (520) and the cooling sink (570) and support the heat sink (520) and the cooling sink (570). The module plate (550) can be formed integrally with the fan case (650). However, the module plate (550) can also be provided separately from the fan case (650).

[0121] The module plate (550) may include a heat sink support (552) that supports the heat sink (520).

[0122] The module plate (550) may include a module plate opening (551). The thermoelectric element (530) may be positioned inside the module plate opening (551). The vertical length of the module plate opening (551) may be greater than the vertical length of the thermoelectric element (530), and the thermoelectric element (530) may be positioned on the upper side of the module plate opening (551). Typically, the heat generation amount of the thermoelectric element (530) is higher than the heat absorption amount, so positioning the thermoelectric element (530) on the upper side of the module plate opening (551) is advantageous for heat dissipation of the heating layer (531).

[0123] The cooling sink (570) may include a cooling conductive member (574) protruding from the cooling sink base (571). The cooling conductive member (574) may be in contact with the cooling layer (532) of the thermoelectric element (530).

[0124] The thermoelectric module (500) may include a module plate (550) and an element insulation material (540) that insulates the thermoelectric element (530). The element insulation material (540) may be placed in the module plate opening (551) to prevent a side of the thermoelectric element (530) from contacting the module plate (550). The element insulation material (540) includes an element insulation opening (541), and the thermoelectric element (530) may be accommodated in the element insulation opening (541).

[0125] The thermoelectric module (500) may include a sink insulation (580) provided between the module plate (550) and the cooling sink (570). The sink insulation (580) may prevent heat from being transferred between the heat sink (520) and the cooling sink (570) through the module plate (550). The sink insulation (580) may include a sink insulation opening (581).

[0126] The sink insulation (580) may be omitted. If the sink insulation (580) is omitted, the heat sink (520) may be supported on the upper surface of the module plate (550) and the cooling sink (570) may be supported on the lower surface of the module plate (550).

[0127] A heat dissipation fan (600) can be installed in a fan case (650). The fan case (650) can form a path for air flowing by the heat dissipation fan (600). The fan case (650) can be formed integrally with the module plate (550) or provided separately.

[0128] The fan case (650) may include a case bottom (650) on which a heat dissipation fan (600) is rotatably installed, and a case scroll part (670) extending upward from the edge of the case bottom (650) to guide air blown from the heat dissipation fan (600) toward a heat dissipation sink (520). The heat dissipation fan (600) is a centrifugal fan, and may be installed on the case bottom (650) so that the rotation axis (610) is perpendicular to the case bottom (650). In addition, the heat dissipation sink (520) may be positioned in one radial direction of the heat dissipation fan (600). With this structure, the overall vertical length of the thermoelectric cooling device (400) can be made compact.

[0129] The case scroll portion (670) may be formed to surround the heat dissipation fan (600). The case scroll portion (670) may have a scroll portion opening (673) open toward the heat dissipation sink (520). The case scroll portion (670) may include a downstream end (671) along the rotational direction (R) of the heat dissipation fan (600) and an upstream end (672) along the rotational direction (R).

[0130] The fan case (650) may include a case guide (680) provided to guide air flowing from the heat dissipation fan (600) to the area around the downstream end (671) of the case scroll section (670).

[0131] Figure 7 illustrates a heat sink according to one embodiment.

[0132] Referring to FIG. 7, a plurality of heat dissipation fins (525) may protrude from the upper surface (522) of the heat dissipation sink base (521). The plurality of heat dissipation fins (525) may protrude in a first direction (526) perpendicular to the upper surface (522) of the heat dissipation sink base (521).

[0133] A plurality of heat dissipation fins (525) may be formed to extend in a second direction (527) parallel to the upper surface (522) of the heat dissipation sink base (521). The second direction (527) may be perpendicular to the first direction (526). A first heat dissipation channel (528) may be formed between two adjacent heat dissipation fins (525). The first heat dissipation channel (528) may extend in the second direction (527) like the plurality of heat dissipation fins (525).

[0134] A second heat dissipation channel (529) having a different width from the first heat dissipation channel (528) may be formed between two specific heat dissipation fins (525) among the plurality of heat dissipation fins (525). The width of the second heat dissipation channel (529) may be greater than the width of the first heat dissipation channel (528).

[0135] The air flowing by the operation of the heat dissipation fan (600) can pass through the heat dissipation channel (528, 529) and exchange heat with a plurality of heat dissipation fins (525). The air current (A) flowing by the operation of the heat dissipation fan (600) can pass through the heat dissipation channel (528, 529) in a direction parallel to the second direction (527).

[0136] Figure 8 illustrates a cooling sink according to one embodiment.

[0137] Referring to FIG. 8, a plurality of cooling fins (575) may protrude from the lower surface (572) of the cooling sink base (571). The plurality of cooling fins (575) may protrude in a first direction (576) perpendicular to the lower surface (572) of the cooling sink base (571).

[0138] A plurality of cooling fins (575) may be formed to extend in a second direction (577) parallel to the lower surface (572) of the cooling sink base (571). The second direction (577) may be perpendicular to the first direction (576). A first cooling channel (578) may be formed between two adjacent cooling fins (575).

[0139] A second cooling channel (579) having a different width from the first cooling channel (578) may be formed between two specific cooling fins (575) among the plurality of cooling fins (575). The width of the second cooling channel (579) may be greater than the width of the first cooling channel (578).

[0140] The air flowing by the operation of the cooling fan (800) can pass through the cooling channels (578, 579) and exchange heat with a plurality of cooling fins (575). The air flow (B) flowing by the operation of the cooling fan (800) can pass through the cooling channels (578, 579) in a direction parallel to the second direction (577).

[0141] Fig. 9 illustrates a state in which a cooling duct cover and a cooling duct body according to one embodiment are separated from the upper wall of the main body. Fig. 10 is an exploded view of a cooling duct body and a cooling duct cover according to one embodiment, viewed from below. Fig. 11 is an exploded view of a cooling duct body and a cooling duct cover according to one embodiment, viewed from above.

[0142] Referring to FIGS. 9, 10, and 11, the refrigerator (1) may include a cooling duct (900) that guides cooled air through heat exchange with a cooling sink (570) to a first storage chamber (11). The cooling duct (900) may be located on the upper side of the first storage chamber (11). The cooling duct (900) may be provided on the lower surface of the upper wall (110).

[0143] The cooling duct (900) may include a cooling duct body (910) coupled to the upper wall (110) of the main body (100) and a cooling duct cover (940) coupled to the lower portion of the cooling duct body (910). A cooling space (990) may be formed by the cooling duct body (910) and the cooling duct cover (940). A cooling sink (570) may be placed in the cooling space (990).

[0144] The cooling duct (900) can be coupled to the connecting frame (210). An elastic coupling protrusion (950) protruding upward can be formed on the cooling duct cover (940). A coupling protrusion through-hole (913) through which the elastic coupling protrusion (950) passes can be formed on the cooling duct body (910). The elastic coupling protrusion (950) can be coupled to the connecting frame (210) by penetrating the coupling protrusion through-hole (913).

[0145] The cooling duct (900) can be connected to the connecting frame (210) via a separate cooling duct connecting member (901). The cooling duct connecting member (901) may be a screw. A connecting hole (951) into which the cooling duct connecting member (901) is connected may be formed in the cooling duct cover (940). A connecting hole (912) into which the cooling duct connecting member (901) is connected may be formed in the cooling duct body (910).

[0146] An example in which the cooling duct (900) is coupled to the connecting frame (210) has been described, but is not limited thereto. For example, the cooling duct (900) may be coupled to the upper wall (110) rather than the connecting frame (210).

[0147] The cooling duct body (910) may include a sink passage hole (911) through which a cooling sink (570) passes. The cooling sink (570) may pass through the sink passage hole (911) and be placed in a cooling space (990). The cooling duct body (910) may include a fan installation portion (920) protruding upward. A fan accommodation space (921) in which a cooling fan (800) is accommodated may be formed on the bottom surface of the fan installation portion (920).

[0148] The cooling fan (800) is a centrifugal fan and is installed on the bottom surface of the fan installation portion (920) of the cooling duct body (910), and the rotation axis (810) of the cooling fan (800) can be perpendicular to the bottom surface of the fan installation portion (920). A cooling sink (570) can be positioned in one radial direction of the cooling fan (800). With this structure, the vertical length of the cooling duct (900) can be made compact.

[0149] An intake port (991) may be formed on the bottom (941) of the cooling duct cover (940). Air from the first storage chamber (11) may be sucked into the interior of the cooling duct (900) through the intake port (991). The intake port (991) may be formed below the cooling fan (800). The cooling duct (900) may include an exhaust port (992). Air that has exchanged heat with the cooling sink (570) may be discharged into the first storage chamber (11) through the exhaust port (992). The exhaust port (992) may be formed at the front portion of the cooling duct (900). The exhaust port (992) may be formed between the front portion of the cooling duct body (910) and the front portion of the cooling duct cover (940). The exhaust outlet (992) can be formed long along the left and right length direction of the cooling duct (900).

[0150] Since the air exhaust port (992) is formed at the front of the cooling duct (900), the air discharged through the air exhaust port (992) can be blown to the front of the first storage chamber (11). Accordingly, an air curtain can be formed in which the air flows vertically downward in the front of the first storage chamber (11) by the air discharged through the air exhaust port (992).

[0151] The air outlet (992) may be positioned closer to the front of the first storage chamber (11). Compared to the illustrated embodiment, the cooling duct (900) itself may be positioned closer to the front of the first storage chamber (11), or the cooling duct (900) may be formed with a longer length in the front-to-rear direction so that the air outlet (992) may be positioned closer to the front of the first storage chamber (11). Through this structure, the air curtain can be formed more efficiently.

[0152] Frost generated on the surface of the cooling sink (570) may melt and generate defrost water. The defrost water may fall from the cooling sink (570) to the bottom (941) of the cooling duct cover (940). The cooling duct (900) may accommodate the defrost water generated as the cooling sink (570) defrosts. In other words, the cooling duct (900) may store the defrost water.

[0153] The cooling duct cover (940) may include a defrost water guide (980) protruding from the bottom (941) of the cooling duct cover (940). The defrost water guide (980) may be formed to extend in the front-back direction. The defrost water guide (980) may contain the defrost water. The defrost water guide (980) may form a space having an area corresponding to the area of ​​the cooling sink (570). A gap may be formed between the defrost water guide (980) and the cooling sink (570).

[0154] Fig. 12 is a control block diagram of a refrigerator according to one embodiment.

[0155] Referring to FIG. 12, a refrigerator (1) according to one embodiment may include a compressor (2), a door sensor (25), an evaporator fan (80), a first temperature sensor (111), a second temperature sensor (112), a thermoelectric element (530), a heat dissipation fan (600), a cooling fan (800), and a control unit (1000). The control unit (1000) is electrically connected to various electronic components of the refrigerator (1) and may control each electronic component.

[0156] The control unit (1000) may include at least one processor (1020) that controls the operation of the refrigerator (1) and at least one memory (1010) that stores programs, software, instructions and / or data for controlling the operation of the refrigerator (1).

[0157] The memory (1010) can store various programs, software, instructions, and / or data required for the operation of the refrigerator (1). Depending on the purpose of data storage, the memory (1010) may be implemented in the form of memory embedded in the refrigerator (1) or may be implemented in the form of memory that can be attached or detached to the refrigerator (1).

[0158] For example, data for operating a refrigerator (1) can be stored in a memory embedded in the refrigerator (1). Data for expanding functions of the refrigerator (1) can be stored in a memory that can be inserted into the refrigerator (1).

[0159] The memory embedded in the refrigerator (1) may include at least one of volatile memory and non-volatile memory. For example, the volatile memory may include dynamic RAM (DRAM), static RAM (SRAM), and / or synchronous dynamic RAM (SDRAM). The non-volatile memory may include one-time programmable ROM (OTPROM), programmable ROM (PROM), erasable and programmable ROM (EPROM), electrically erasable and programmable ROM (EEPROM), mask ROM, flash ROM, flash memory, a hard drive, and / or a solid state drive.

[0160] Memory that can be inserted into the refrigerator (1) may include memory cards such as CF (compact flash), SD (secure digital), Micro-SD (micro secure digital), Mini-SD (mini secure digital), xD (extreme digital), and MMC (multi-media card). In addition, a USB memory device that can be connected to a USB port may also be inserted into the refrigerator (1).

[0161] The processor (1020) can control the operation of the refrigerator (1). The processor (1020) can control various components of the refrigerator (1). For example, the processor (1020) can control the compressor (2), the door sensor (25), the evaporator fan (80), the first temperature sensor (111), the second temperature sensor (112), the thermoelectric element (530), the heat dissipation fan (600), and the cooling fan (800).

[0162] The processor (1020) can perform various operations of the refrigerator (1) by processing programs, software, instructions and / or data stored in the memory (1010).

[0163] The processor (1020) may include at least one of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an APU (Accelerated Processing Unit), a MIC (Many Integrated Core), a DSP (Digital Signal Processor), an NPU (Neural Processing Unit), a hardware accelerator, and a machine learning accelerator.

[0164] The compressor (2) can compress the refrigerant and supply the compressed refrigerant to a heat exchanger (e.g., a condenser and an evaporator (3)). The processor (1020) can control the compressor (2) to adjust the temperature of the cold air generated in the evaporator (3). The processor (1020) can control the compressor (2) to maintain the temperature of the storage chamber (11, 12, 13) at a target temperature. The processor (1020) can adjust the operating frequency of the compressor (2). The processor (1020) can control the on-off of the compressor (2).

[0165] The door sensor (25) can detect the opening and / or closing of the doors (21, 22, 23, 24). The door sensor (25) can be provided for each of a plurality of doors. The door sensor (25) can transmit an open signal corresponding to the opening of the door (25) to the processor (1020). The door sensor (25) can transmit a close signal corresponding to the closing of the doors (21, 22, 23, 24) to the processor (1020). The processor (1020) can identify the opening and closing of the door (30) based on the signals transmitted from the doors (21, 22, 23, 24).

[0166] The evaporator fan (80) causes air to flow. The evaporator fan (80) can move air cooled by the evaporator (3) to the storage chamber (11, 12, 13). The processor (1020) can control the rotation speed of the evaporator fan (80). The processor (1020) can control the input voltage of the evaporator fan (80) to control the rotation speed of the evaporator fan (80). When the input voltage of the evaporator fan (80) increases, the rotation speed of the evaporator fan (80) can increase. When the rotation speed of the evaporator fan (80) increases, the flow rate of air flowing into the storage chamber (11, 12, 13) can increase. Conversely, when the rotation speed of the evaporator fan (80) decreases, the flow rate of air flowing into the storage chamber (11, 12, 13) can decrease.

[0167] The first temperature sensor (111) can detect the temperature of the evaporator (3). The first temperature sensor (111) can transmit an electrical signal, data, and / or information corresponding to the temperature of the evaporator (3) to the control unit (1000). The processor (1020) can identify the temperature of the evaporator (3) based on the electrical signal, data, and / or information transmitted from the first temperature sensor (111).

[0168] The second temperature sensor (112) can detect the temperature of the cooling sink (570). The second temperature sensor (112) can transmit an electrical signal, data, and / or information corresponding to the temperature of the cooling sink (570) to the control unit (1000). The processor (1020) can identify the temperature of the cooling sink (570) based on the electrical signal, data, and / or information transmitted from the second temperature sensor (112).

[0169] In addition to the sensors illustrated, the refrigerator (1) may include various sensors. For example, the refrigerator (1) may include a third temperature sensor that detects the temperature of the heat sink (520). The refrigerator (1) may include a fourth temperature sensor that detects the temperature of the storage compartments (11, 12, 13). In addition, the refrigerator (1) may include a humidity sensor that detects the humidity of the first storage compartment (11).

[0170] The thermoelectric element (530) may be controlled by the processor (1020). The processor (1020) may control the on / off of the thermoelectric element (530). Turning the thermoelectric element (530) on may indicate supplying power to the thermoelectric element (530). Turning the thermoelectric element (530) off may indicate stopping the supply of power to the thermoelectric element (530). The processor (1020) may adjust at least one of the voltage and current applied to the thermoelectric element (530).

[0171] When power is supplied to the thermoelectric element (530), a heat generating action may occur in the heating layer (531) and a heat absorbing action may occur in the cooling layer (532). Air may be heated by a heat sink (520) in contact with the heating layer (531). The air heated by the heat sink (520) may be discharged to the outside of the main body (100). The air may be cooled by a cooling sink (570) in contact with the cooling layer (532). The air cooled by the cooling sink (570) may be supplied to the first storage chamber (11).

[0172] The processor (1020) can adjust the duty ratio of the voltage pulse applied to the thermoelectric element (530). The voltage pulse can be applied to the thermoelectric element (530) at predetermined cycles. During one cycle, the voltage pulse has an on-duty and an off-duty. The duty ratio can represent the ratio of the on-duty within one cycle. An increase in the duty ratio of the on-duty and off-duty voltage pulses indicates an increase in the on-duty of the voltage pulse. When the duty ratio of the voltage pulse applied to the thermoelectric element (530) increases, the cooling performance of the thermoelectric element (530) can increase. When the cooling performance of the thermoelectric element (530) increases, the temperature of the first storage chamber (11) can decrease. When the duty ratio of the voltage pulse applied to the thermoelectric element (530) decreases, the cooling performance of the thermoelectric element (530) can decrease. If the cooling performance of the thermoelectric element (530) decreases, the temperature of the first storage chamber (11) may increase.

[0173] The heat dissipation fan (600) can supply air from outside the main body (100) to the heat dissipation sink (520) and discharge the air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100). Depending on the operation of the heat dissipation fan (600), the air that has exchanged heat with the heat dissipation sink (520) can move quickly, and the heat dissipation performance of the heat dissipation sink (520) can increase.

[0174] The cooling fan (800) can suck in air inside the first storage chamber (11) and supply it to the cooling sink (570), and discharge the air that has exchanged heat with the cooling sink (570) into the first storage chamber (11). Depending on the operation of the cooling fan (800), the air that has exchanged heat with the cooling sink (570) can move quickly, and the first storage chamber (11) can be quickly cooled.

[0175] The processor (1020) can control the on-off of the heat dissipation fan (600) and the cooling fan (800), respectively. The heat dissipation fan (600) and the cooling fan (800) can be controlled independently. The processor (1020) can adjust the rotation speed of the heat dissipation fan (600) and the cooling fan (800), respectively. The processor (1020) can adjust the input voltage of the heat dissipation fan (600) and the cooling fan (800), respectively, to adjust the rotation speed of the heat dissipation fan (600) and the cooling fan (800), respectively. When the input voltage of the heat dissipation fan (600) and the cooling fan (800) increases, the rotation speed of the heat dissipation fan (600) and the cooling fan (800) can increase. When the input voltage of the heat dissipation fan (600) and the cooling fan (800) decreases, the rotation speed of the heat dissipation fan (600) and the cooling fan (800) can decrease. The heat dissipation fan (600) and cooling fan (800) may include a brushless DC motor.

[0176] The operation of the thermoelectric element (530) and the respective operations of the cooling fan (800) and the heat dissipation fan (600) may or may not be linked. For example, the processor (1020) may operate the cooling fan (800) and the heat dissipation fan (600) simultaneously with the operation of the thermoelectric element (530). The processor (1020) may operate the cooling fan (800) and the heat dissipation fan (600) after operating the thermoelectric element (530). The processor (1020) may also operate the cooling fan (800) and the heat dissipation fan (600) after operating the thermoelectric element (530).

[0177] The processor (1020) can stop the operation of the cooling fan (800) and the heat dissipation fan (600) at the same time as the operation of the thermoelectric element (530) is stopped. The processor (1020) can stop the operation of the cooling fan (800) and the heat dissipation fan (600) after stopping the operation of the thermoelectric element (530). The processor (1020) can also stop the operation of the cooling fan (800) and the heat dissipation fan (600) after stopping the operation of the thermoelectric element (530). In addition, when defrosting of the cooling sink (570) is required, the processor (1020) can stop the operation of the thermoelectric element (530) and operate the cooling fan (800).

[0178] When the thermoelectric element (530) stops operating, the cooling fan (800) may stop operating for a predetermined drying time. This is to dry the cooling fan (800).

[0179] In addition, the processor (1020) can control the operation of each of the heat dissipation fan (600) and the cooling fan (800) based on the operating status of the compressor (2). For example, the processor (1020) can stop the operation of each of the heat dissipation fan (600) and the cooling fan (800) or reduce the rotation speed of each of the heat dissipation fan (600) and the cooling fan (800) based on the operation of the compressor (2) being stopped.

[0180] The processor (1020) may stop the operation of the compressor (2) based on the completion of cooling of the first storage chamber (11) or the occurrence of an error in the refrigeration cycle device. For example, the processor (1020) may determine the completion of cooling of the first storage chamber (11) based on the temperature of the first storage chamber (11) reaching a predetermined target temperature. In addition, the processor (1020) may determine that an error in the refrigeration cycle device has occurred in the event of a failure of the compressor (2), a failure of the expansion valve, and / or a failure of the first temperature sensor (111).

[0181] The refrigerator (1) can reduce noise by stopping the operation of each of the heat dissipation fan (600) and the cooling fan (800) while the operation of the compressor (2) is stopped or by reducing the rotation speed of each of the heat dissipation fan (600) and the cooling fan (800).

[0182] As described above, the refrigerator (1) can operate at least one of the thermoelectric cooling device (400) and the refrigeration cycle device to cool the first storage compartment (11). For example, the processor (1020) can cool the first storage compartment (11) using the thermoelectric cooling device (400) by turning off the compressor (2) and turning on the thermoelectric element (530). The processor (1020) can cool the first storage compartment (11) using the refrigeration cycle device by turning on the compressor (2) and turning off the thermoelectric element (530). The processor (1020) can cool the first storage compartment (11) using both the thermoelectric cooling device (400) and the refrigeration cycle device by turning on both the compressor (2) and the thermoelectric element (530).

[0183] When the thermoelectric cooling device (400) operates to cool the first storage chamber (11), frost may form on the surface of the cooling sink (570). If frost forms on the cooling sink (570), the heat exchange efficiency between the cooling sink (570) and the air decreases, and the cooling performance of the thermoelectric cooling device (400) decreases. Therefore, in order to prevent a decrease in the cooling performance of the thermoelectric cooling device (400), it is necessary to perform a defrosting operation of the cooling sink (570).

[0184] The processor (1020) may perform a defrosting operation of the cooling sink (570) based on satisfaction of a predetermined defrosting condition. For example, the processor (1020) may perform a defrosting operation of the cooling sink (570) based on the temperature of the cooling sink (570) being lower than or equal to a predetermined freezing temperature. In addition, the processor (1020) may perform a defrosting operation of the cooling sink (570) at predetermined time intervals. The defrosting conditions of the cooling sink (570) are not limited to those exemplified. Depending on the design, various defrosting conditions of the cooling sink (570) may be provided.

[0185] The processor (1020) can perform a defrosting operation of the cooling sink (570) by stopping the operation of the thermoelectric element (530). Stopping the operation of the thermoelectric element (530) may indicate stopping the supply of power to the thermoelectric element (530). In addition, the processor (1020) can perform a defrosting operation of the cooling sink (570) by stopping the operation of the thermoelectric element (530) and operating the heat dissipation fan (600) and the cooling fan (800).

[0186] The processor (1020) may terminate the defrosting operation of the cooling sink (570) based on satisfaction of a predetermined defrosting termination condition. For example, the processor (1020) may terminate the defrosting operation of the cooling sink (570) based on the temperature of the cooling sink (570) being higher than or equal to the melting point of ice. The processor (1020) may operate (i.e., turn on) the thermoelectric element (530) based on determining termination of the defrosting operation. The defrosting termination condition of the cooling sink (570) is not limited to the exemplified conditions. Depending on the design, various defrosting termination conditions of the cooling sink (570) may be provided.

[0187] When the operation of the thermoelectric element (530) is stopped, the temperature of the cooling sink (570) increases, which may cause the frost to melt. The defrost water generated by the melted frost may be stored in the cooling duct (900). The processor (1020) may operate the cooling fan (800) to evaporate the defrost water stored in the cooling duct (900) according to the defrosting of the cooling sink (570).

[0188] When the cooling fan (800) operates, the defrost water may evaporate. The refrigerator (1) can remove the defrost water by evaporating the defrost water stored in the cooling duct (900). The defrost water evaporated in the cooling duct (900) can flow into the first storage chamber (11). The evaporated defrost water can move to the evaporator (3) through the first storage chamber (11) and the return duct (73). The evaporated defrost water can be condensed in the evaporator (3) and discharged to the machine room. The defrost water discharged to the machine room can be evaporated again in the machine room and discharged to the outside.

[0189] To prevent the evaporated water from being sucked back into the cooling duct (900) and to move it more quickly to the evaporator (3), the operation of the cooling fan (800) may be temporarily stopped. The evaporated water may be moved to the evaporator (3) according to the operation of the evaporator fan (80). For example, the processor (1020) may temporarily stop the operation of the cooling fan (800) so that the moisture in the first storage chamber (11) moves to the evaporator (3) through the return duct (73) according to the operation of the evaporator fan (80) based on the elapse of a predetermined evaporation time of the defrost water.

[0190] Meanwhile, if the doors (21, 22, 23, 24) are open for a long period of time, external moisture may flow into the storage compartment (11, 12, 13). The external moisture may condense in the cooling sink (570) and be stored in the cooling duct (900), which may cause overflow of the cooling duct (900). The processor (1020) of the refrigerator (1) may stop the operation of the thermoelectric element (530) and the cooling fan (800) to prevent overflow of the cooling duct (900) based on the fact that the doors (21, 22, 23, 24) of the refrigerator (1) are opened for a predetermined threshold time (e.g., 10 minutes). By stopping the operation of the thermoelectric element (530) and the cooling fan (800), external moisture may be prevented from condensing in the cooling sink (570).

[0191] When an error occurs in the refrigeration cycle device and the operation of the compressor (2) is stopped, the defrost water cannot be condensed in the evaporator (3). If the evaporated defrost water is not condensed in the evaporator (3), the defrost water may flow back into the first storage chamber (11) and be received again in the cooling duct (900). That is, even when an error occurs in the refrigeration cycle device, water overflow in the cooling duct (900) may occur. When an error occurs in the refrigeration cycle device, the processor (1020) may stop the operation of the thermoelectric element (530) and the cooling fan (800).

[0192] When the thermoelectric element (530) operates and the air is cooled in the cooling sink (570), freezing of the defrost water contained in the cooling duct (900) may occur. If the defrost water freezes, air cannot move smoothly within the cooling duct (900), so it is necessary to prevent freezing of the defrost water.

[0193] The processor (1020) can perform freezing prevention control of the defrost water by adjusting the duty ratio of the voltage pulse applied to the thermoelectric element (530) based on the temperature of the cooling sink (570). The processor (1020) can determine the duty ratio of the voltage pulse applied to the thermoelectric element (530) based on the temperature of the cooling sink (570) at predetermined time intervals (e.g., 10 minutes) so that the temperature of the cooling sink (570) is maintained within a predetermined temperature range for freezing prevention of the defrost water.

[0194] For example, the processor (1020) may decrease the duty cycle of the voltage pulse based on the temperature of the cooling sink (570) being lower than or equal to a first threshold temperature (e.g., -1.5 degrees Celsius). The processor (1020) may increase the duty cycle of the voltage pulse based on the temperature of the cooling sink (570) being higher than or equal to a second threshold temperature (e.g., 0.5 degrees Celsius) that is higher than the first threshold temperature. The processor (1020) may maintain the duty cycle of the voltage pulse based on the temperature of the cooling sink (570) being higher than the first threshold temperature and lower than the second threshold temperature.

[0195] In addition, the processor (1020) may temporarily suspend the anti-freezing control of the thermoelectric element (530) based on the satisfaction of the priority operation condition of the thermoelectric element (530). The priority operation condition of the thermoelectric element (530) may be to increase the cooling performance of the thermoelectric element (530). For example, when the operation mode of the refrigerator (1) is set to the power cooling mode, when the operation mode of the refrigerator (1) is set to the test mode to forcibly start the thermoelectric element (530), or when the external temperature of the refrigerator (1) is higher than or equal to a predetermined limit temperature, the priority operation condition of the thermoelectric element (530) may be determined to be satisfied. The priority operation condition of the thermoelectric element (530) is not limited to the examples. Depending on the design, various priority operation conditions of the thermoelectric element (530) may be provided.

[0196] In this way, the disclosed refrigerator (1) can remove defrost water by evaporating the defrost water contained in the cooling duct (900). That is, the refrigerator (1) does not require a complex structure for removing the defrost water generated in the cooling sink (570). In addition, the refrigerator (1) can prevent the performance of the thermoelectric cooling device (400) from deteriorating by preventing the freezing of the defrost water contained in the cooling duct (900) and the overflow of the cooling duct (900).

[0197] Fig. 13 is a flowchart briefly explaining a method for controlling a refrigerator according to one embodiment.

[0198] Referring to FIG. 13, the processor (1020) of the refrigerator (1) can perform a defrosting operation of the cooling sink (570) (1301). The processor (1020) can perform the defrosting operation of the cooling sink (570) based on satisfaction of a predetermined defrosting condition. For example, the processor (1020) can perform the defrosting operation of the cooling sink (570) based on the temperature of the cooling sink (570) being lower than or equal to a predetermined freezing temperature. In addition, the processor (1020) can perform the defrosting operation of the cooling sink (570) at predetermined time intervals.

[0199] The processor (1020) can perform a defrosting operation of the cooling sink (570) by stopping (i.e., turning off) the operation of the thermoelectric element (530). In addition, the processor (1020) can perform a defrosting operation of the cooling sink (570) by stopping the operation of the thermoelectric element (530) and operating the heat dissipation fan (600) and the cooling fan (800). When the operation of the thermoelectric element (530) is stopped, the temperature of the cooling sink (570) increases, causing the frost to melt. The defrost water generated by the melted frost can be accommodated in the cooling duct (900).

[0200] The processor (1020) can perform an evaporation operation of the defrost water to remove the defrost water received in the cooling duct (900) (1302). The processor (1020) can operate the cooling fan (800) to evaporate the defrost water received in the cooling duct (900). If the cooling fan (800) operates during the defrosting operation of the cooling sink (570), the defrosting of the cooling sink (570) and the evaporation of the defrost water can be performed simultaneously. If the cooling fan (800) does not operate during the defrosting operation of the cooling sink (570), the evaporation operation of the defrost water can be performed after the defrosting operation of the cooling sink (570) is completed.

[0201] The defrost water evaporated in the cooling duct (900) can flow into the first storage chamber (11). The evaporated defrost water can move to the evaporator (3) through the first storage chamber (11) and the return duct (73). The evaporated defrost water can be condensed in the evaporator (3) and discharged to the machine room. The defrost water discharged to the machine room can be evaporated again in the machine room and discharged to the outside.

[0202] To prevent freezing of the defrost water contained in the cooling duct (900), the processor (1020) can perform freezing prevention control of the defrost water (1303). When the thermoelectric element (530) operates and the air is cooled in the cooling sink (570), freezing of the defrost water contained in the cooling duct (900) may occur. If the defrost water freezes, air cannot move smoothly within the cooling duct (900), so it is necessary to prevent freezing of the defrost water.

[0203] The processor (1020) can perform freezing prevention control of the defrost water by adjusting the duty ratio of the voltage pulse applied to the thermoelectric element (530) based on the temperature of the cooling sink (570). The processor (1020) can determine the duty ratio of the voltage pulse applied to the thermoelectric element (530) based on the temperature of the cooling sink (570) at predetermined time intervals (e.g., 10 minutes) so that the temperature of the cooling sink (570) is maintained within a predetermined temperature range for freezing prevention of the defrost water.

[0204] Fig. 14 is a flowchart detailing a method for controlling a refrigerator according to one embodiment.

[0205] Referring to FIG. 14, the processor (1020) of the refrigerator (1) can operate the cooling fan (800) of the thermoelectric cooling device (400) to evaporate the water contained in the cooling duct (900) (1401).

[0206] The processor (1020) can determine whether the overflow condition of the cooling duct (900) is satisfied (1402). For example, the processor (1020) can determine that the overflow condition of the cooling duct (900) is satisfied based on the doors (21, 22, 23, 24) of the refrigerator (1) being opened continuously for a predetermined threshold time. In addition, the processor (1020) can determine that the overflow condition of the cooling duct (900) is satisfied based on the occurrence of an error in the refrigeration cycle device (e.g., a failure of the compressor (2)). The processor (1020) can stop the operation of the thermoelectric element (530) and the cooling fan (800) based on the satisfaction of the overflow condition of the cooling duct (900) (1403). If the overflow condition of the cooling duct (900) is not satisfied, freezing prevention control of the defrost water can be performed.

[0207] The processor (1020) can detect the temperature of the cooling sink (570) by controlling the second temperature sensor (112) (1404). The temperature of the cooling sink (570) can be detected at predetermined time intervals (e.g., 10 minutes).

[0208] The processor (1020) can identify whether the temperature of the cooling sink (570) is higher than a first threshold temperature (e.g., -1.5 degrees Celsius) (1405). The processor (1020) can reduce the duty cycle of the voltage pulse based on whether the temperature of the cooling sink (570) is lower than or equal to the first threshold temperature (1406).

[0209] If the temperature of the cooling sink (570) is higher than the first threshold temperature, the processor (1020) can identify whether the temperature of the cooling sink (570) is lower than the second threshold temperature (e.g., 0.5 degrees Celsius) (1407). The first threshold temperature can be set lower than the second threshold temperature. The processor (1020) can increase the duty ratio of the voltage pulse based on whether the temperature of the cooling sink (570) is higher than or equal to the second threshold temperature (1408).

[0210] The processor (1020) can maintain the duty ratio of the voltage pulse applied to the thermoelectric element (530) based on the temperature of the cooling sink (570) being higher than the first threshold temperature and lower than the second threshold temperature (1409).

[0211] Figure 15 is a flowchart illustrating a method for temporarily suspending the anti-icing control of the water level described in Figure 13.

[0212] Referring to FIG. 15, the processor (1020) of the refrigerator (1) can determine whether the priority operation condition of the thermoelectric element (530) is satisfied (1501) while performing the freezing prevention control of the defrost water (1303). The processor (1020) can temporarily suspend the freezing prevention control of the defrost water based on whether the priority operation condition of the thermoelectric element (530) is satisfied (1502). If the priority operation condition of the thermoelectric element (530) is not satisfied or the priority operation condition is released, the processor (1020) can continue to perform the freezing prevention control of the defrost water.

[0213] The priority operating condition of the thermoelectric element (530) may be to increase the cooling performance of the thermoelectric element (530). For example, when the operation mode of the refrigerator (1) is set to the power cooling mode, when the operation mode of the refrigerator (1) is set to the test mode to forcibly start the thermoelectric element (530), or when the external temperature of the refrigerator (1) is higher than or equal to a predetermined limit temperature, the priority operating condition of the thermoelectric element (530) may be determined to be satisfied. The priority operating condition of the thermoelectric element (530) is not limited to the examples. Depending on the design, various priority operating conditions of the thermoelectric element (530) may be provided.

[0214] Fig. 16 is a flowchart for further explanation regarding the control of the cooling fan in the evaporation operation of the water described in Fig. 13.

[0215] Referring to FIG. 16, the processor (1020) of the refrigerator (1) can operate the cooling fan (800) of the thermoelectric cooling device (400) to evaporate the defrost water received in the cooling duct (900) (1601). The processor (1020) can count the time for which the cooling fan (800) operates to evaporate the defrost water of the cooling duct (900) (1602). For example, if the cooling fan (800) operates during the defrosting operation of the cooling sink (570), the operating time of the cooling fan (800) can be counted from the time when the defrosting operation of the cooling sink (570) is started. If the cooling fan (800) does not operate during the defrosting operation of the cooling sink (570), the operating time of the cooling fan (900) can be counted from the time when the cooling fan (800) starts operating after the defrosting operation of the cooling sink (570) is finished.

[0216] The processor (1020) may temporarily stop the operation of the cooling fan (800) based on the elapse of a predetermined evaporation time of the defrost water after the operation of the cooling fan (800) for evaporating the defrost water has started (1603). The operation of the cooling fan (800) may be temporarily stopped to prevent the evaporated defrost water from being sucked back into the cooling duct (900) and to move it more quickly to the evaporator (3). The evaporated defrost water may move to the evaporator (3) according to the operation of the evaporator fan (80). For example, the processor (1020) may temporarily stop the operation of the cooling fan (800) according to the operation of the evaporator fan (80) so that the moisture in the first storage chamber (11) moves to the evaporator (3) through the return duct (73).

[0217] Fig. 17 is a flowchart illustrating a specific embodiment of the control method of the refrigerator described in Fig. 14.

[0218] Referring to FIG. 17, the processor (1020) of the refrigerator (1) can identify whether an error has occurred in the refrigeration cycle device (1701). If an error has occurred in the refrigeration cycle device, the processor (1020) can turn off the thermoelectric element (530) (1702). If the refrigeration cycle device is operating normally, the processor (1020) can identify whether the door (21, 22) of the refrigerator compartment (11) has been open for 10 minutes or more (1703). If the door (21, 22) of the refrigerator compartment (11) has been open for 10 minutes or more, the processor (1020) can turn off the thermoelectric element (530) (1702).

[0219] When the refrigeration cycle device is operating normally and the door (21, 22) of the refrigerator (11) has not been opened for more than 10 minutes, the processor (1020) can identify whether the temperature of the cooling sink (570) is 0.5 degrees Celsius or higher (1704). When the temperature of the cooling sink (570) is 0.5 degrees Celsius or higher, the processor (1020) can reduce the off-duty of the voltage pulse applied to the thermoelectric element (530) by 4% (1705). When the off-duty of the voltage pulse is reduced, the cooling performance of the thermoelectric element (530) can be increased.

[0220] The order of determining whether a refrigeration cycle device is in error and whether the door is open is not limited to the example provided. The presence of an error in the refrigeration cycle device and the presence of a door open can be determined independently.

[0221] If the temperature of the cooling sink (570) is lower than 0.5 degrees Celsius, the processor (1020) can identify whether the temperature of the cooling sink (570) is lower than or equal to -1.5 degrees Celsius (1706). If the temperature of the cooling sink (570) is lower than or equal to -1.5 degrees Celsius, the processor (1020) can increase the off-duty of the voltage pulse applied to the thermoelectric element (530) by 2% (1707). If the off-duty of the voltage pulse increases, the cooling performance of the thermoelectric element (530) can decrease.

[0222] When the temperature of the cooling sink (570) is higher than -1.5 degrees Celsius and lower than 0.5 degrees Celsius, the processor (1020) can maintain the duty ratio of the voltage pulse applied to the thermoelectric element (530) (1708).

[0223] According to one embodiment, a refrigerator may include: a storage compartment; a cooling sink; a cooling layer in contact with the cooling sink, the cooling layer being cooled based on an applied voltage pulse to cool the cooling sink; a cooling fan controllable to generate an air flow from the storage compartment to the cooling sink so as to cool the cooling sink; a cooling duct covering the cooling sink and the cooling fan, guiding the air flow from the storage compartment to the cooling sink, and receiving defrost water generated when frozen water in the cooling sink is defrosted; a temperature sensor detecting a temperature of the cooling sink; and a processor performing an anti-icing control including controlling the cooling fan to evaporate the defrost water received in the cooling duct and adjusting a duty ratio of the voltage pulse based on a temperature of the cooling sink detected by the temperature sensor so as to prevent the defrost water received in the cooling duct from freezing.

[0224] The processor can determine the duty ratio based on the temperature of the cooling sink detected by the temperature sensor at time intervals so that the temperature of the cooling sink detected by the temperature sensor is maintained within a temperature range that prevents freezing of the water contained in the cooling duct.

[0225] The processor may decrease the duty ratio based on whether the temperature of the cooling sink detected by the temperature sensor is lower than or equal to a first threshold temperature. The processor may increase the duty ratio based on whether the temperature of the cooling sink detected by the temperature sensor is higher than or equal to a second threshold temperature that is higher than the first threshold temperature.

[0226] The processor may maintain the duty ratio based on the temperature of the cooling sink detected by the temperature sensor being higher than a first threshold temperature and lower than a second threshold temperature. The first threshold temperature may be lower than the second threshold temperature.

[0227] The processor can control the cooling fan to not generate the air flow and not apply the voltage pulse to the thermoelectric element so that the defrost water contained in the cooling duct does not overflow the cooling duct based on the door of the refrigerator being opened for a critical period of time.

[0228] The refrigerator may further include an evaporator disposed outside the storage compartment and cooling air supplied to the storage compartment; and a compressor supplying refrigerant to the evaporator. The processor may control the cooling fan to not generate the air flow without applying the voltage pulse to the thermoelectric element based on the fact that refrigerant is not supplied to the evaporator by the compressor.

[0229] The refrigerator may further include an evaporator disposed outside the storage room and cooling air supplied to the storage room; and a return duct guiding air to be cooled from the storage room to the evaporator.

[0230] The refrigerator may further include an evaporator fan that moves air cooled by the evaporator to the storage compartment. The processor may temporarily control the cooling fan to not generate the air flow so that moisture in the storage compartment moves to the evaporator through the return duct by the operation of the evaporator fan, based on the elapsed evaporation time for evaporation of the defrost water after the cooling fan is controlled to generate the air flow.

[0231] The above processor can temporarily suspend the anti-icing control based on the satisfaction of the priority operating condition of the thermoelectric element.

[0232] In a control method of a refrigerator, comprising a storage compartment, a cooling sink, a cooling layer in contact with the cooling sink, a thermoelectric element cooling the cooling layer based on an applied voltage pulse to cool the cooling sink, a cooling fan controllable to generate an air flow from the storage compartment to the cooling sink so as to cool in the cooling sink, a cooling duct covering the cooling sink and the cooling fan, guiding the air flow from the storage compartment to the cooling sink, and receiving defrost water generated when frozen water in the cooling sink is defrosted, a temperature sensor detecting a temperature of the cooling sink, and a processor, the control method according to one embodiment of the present invention may include: controlling the cooling fan by the processor to evaporate the defrost water received in the cooling duct; and performing an anti-freezing control including adjusting a duty ratio of the voltage pulse based on a temperature of the cooling sink detected by the temperature sensor so as to prevent the defrost water received in the cooling duct from freezing.

[0233] Performing the above anti-freezing control may include determining the duty ratio based on the temperature of the cooling sink detected by the temperature sensor at time intervals so that the temperature of the cooling sink detected by the temperature sensor is maintained within a temperature range that prevents freezing of the defrost water received in the cooling duct.

[0234] Performing the above anti-icing control may include reducing the duty ratio based on whether the temperature of the cooling sink detected by the temperature sensor is lower than or equal to a first threshold temperature; and increasing the duty ratio based on whether the temperature of the cooling sink detected by the temperature sensor is higher than or equal to a second threshold temperature that is higher than the first threshold temperature.

[0235] Performing the above anti-icing control may include maintaining the duty ratio based on the temperature of the cooling sink detected by the temperature sensor being higher than a first threshold temperature and lower than a second threshold temperature. The first threshold temperature may be lower than the second threshold temperature.

[0236] The control method may further include controlling the cooling fan not to generate the air flow and not to apply the voltage pulse to the thermoelectric element so that the defrost water received in the cooling duct does not overflow the cooling duct, based on the door of the refrigerator being opened for a critical time, by the processor.

[0237] The refrigerator may include an evaporator disposed outside the storage compartment and configured to cool air supplied to the storage compartment, and a compressor configured to supply refrigerant to the evaporator. The control method may further include: controlling the cooling fan by the processor so as not to generate the air flow without applying the voltage pulse to the thermoelectric element, based on the fact that refrigerant is not supplied to the evaporator by the compressor.

[0238] The refrigerator may include an evaporator that generates cold air, an evaporator fan that moves the cold air generated in the evaporator to the storage compartment, and a return duct that guides air in the storage compartment to the evaporator. Controlling the operation of the cooling fan may include temporarily stopping the operation of the cooling fan based on the elapse of a predetermined evaporation time of the defrost water after the start of operation of the cooling fan to evaporate the defrost water, so that moisture in the storage compartment moves to the evaporator through the return duct according to the operation of the evaporator fan.

[0239] The above control method may further include temporarily stopping the freezing prevention control of the water heater based on satisfaction of the priority operation condition of the thermoelectric element.

[0240] The disclosed refrigerator and its control method can increase the cooling efficiency of a storage room by using a thermoelectric cooling device.

[0241] The disclosed refrigerator and its control method can prevent performance damage of a thermoelectric cooling device by removing defrost water generated by defrosting a cooling sink of the thermoelectric cooling device.

[0242] The disclosed refrigerator and its control method can prevent freezing of the defrost water contained in the cooling duct.

[0243] The disclosed refrigerator and its control method can prevent water overflow in a cooling duct.

[0244] Meanwhile, the disclosed embodiments may be implemented in the form of a storage medium storing computer-executable instructions. The instructions may be stored in the form of program code, and when executed by a processor, may generate program modules to perform the operations of the disclosed embodiments.

[0245] A device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory storage medium" simply means a tangible device that does not contain signals (e.g., electromagnetic waves). This term does not distinguish between cases where data is permanently stored in the storage medium and cases where data is temporarily stored. For example, a "non-transitory storage medium" may include a buffer in which data is temporarily stored.

[0246] The methods according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product (e.g., a downloadable app) may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0247] The disclosed embodiments have been described with reference to the attached drawings as described above. Those skilled in the art will understand that the present invention can be implemented in forms other than the disclosed embodiments without altering the technical spirit or essential features of the present invention. The disclosed embodiments are illustrative and should not be construed as limiting.

Claims

1. Storage room; cooling sink; A thermoelectric element comprising a cooling layer in contact with the cooling sink, and cooling the cooling layer based on an applied voltage pulse to cool the cooling sink; A controllable cooling fan that generates airflow from the storage chamber to the cooling sink to cool the cooling sink; A cooling duct that covers the cooling sink and the cooling fan, guides the air flow from the storage room to the cooling sink, and receives the defrost water generated when frozen water in the cooling sink is defrosted; A temperature sensor that detects the temperature of the cooling sink; and Controlling the cooling fan to evaporate the water contained in the cooling duct; A refrigerator comprising a processor that performs anti-freezing control, including adjusting the duty ratio of the voltage pulse based on the temperature of the cooling sink detected by the temperature sensor, so as to prevent the defrost water contained in the cooling dent from freezing.

2. In paragraph 1, The above processor A refrigerator that determines the duty ratio based on the temperature of the cooling sink detected by the temperature sensor at time intervals so that the temperature of the cooling sink detected by the temperature sensor is maintained within a temperature range that prevents freezing of the defrost water contained in the cooling duct.

3. In paragraph 1, The above processor Reducing the duty ratio based on the temperature of the cooling sink detected by the temperature sensor being lower than or equal to the first threshold temperature, A refrigerator that increases the duty ratio based on the temperature of the cooling sink detected by the temperature sensor being higher than or equal to a second threshold temperature that is higher than the first threshold temperature.

4. In paragraph 1, The above processor The duty ratio is maintained based on the temperature of the cooling sink detected by the temperature sensor being higher than the first threshold temperature and lower than the second threshold temperature, A refrigerator wherein the first critical temperature is lower than the second critical temperature.

5. In paragraph 1, The above processor A refrigerator that controls the cooling fan so as not to generate the air flow and not to apply the voltage pulse to the thermoelectric element so as to prevent the defrost water contained in the cooling duct from overflowing the cooling duct based on the door of the refrigerator being opened for a critical period of time.

6. In paragraph 1, An evaporator disposed outside the storage room and cooling the air supplied to the storage room; and Further comprising a compressor for supplying refrigerant to the above evaporator; The above processor A refrigerator that controls the cooling fan so as not to generate the air flow without applying the voltage pulse to the thermoelectric element based on the fact that the refrigerant is not supplied to the evaporator by the compressor.

7. In paragraph 1, An evaporator disposed outside the storage room and cooling the air supplied to the storage room; and A refrigerator further comprising a return duct for guiding air to be cooled from the storage chamber to the evaporator.

8. In paragraph 7, Further comprising an evaporator fan for moving air cooled by the evaporator to the storage room; The above processor A refrigerator in which the cooling fan is temporarily controlled not to generate the air flow so that moisture in the storage compartment moves to the evaporator through the return duct by the operation of the evaporator fan based on the elapsed evaporation time for evaporation of the water after the cooling fan is controlled to generate the air flow.

9. In paragraph 1, The above processor A refrigerator that temporarily suspends the anti-freezing control based on the satisfaction of the priority operation condition of the thermoelectric element.

10. A method for controlling a refrigerator, comprising: a storage room, a cooling sink, a cooling layer in contact with the cooling sink, a thermoelectric element cooling the cooling layer based on an applied voltage pulse to cool the cooling sink, a cooling fan controllable to generate air flow from the storage room to the cooling sink so as to cool in the cooling sink, a cooling duct covering the cooling sink and the cooling fan, guiding the air flow from the storage room to the cooling sink, and receiving defrost water generated as frozen water in the cooling sink is defrosted, a temperature sensor detecting the temperature of the cooling sink, and a processor, By the above processor, the cooling fan is controlled to evaporate the water contained in the cooling duct; A method for controlling a refrigerator, comprising: performing anti-freezing control, including adjusting the duty ratio of the voltage pulse based on the temperature of the cooling sink detected by the temperature sensor, so as to prevent the defrost water contained in the cooling dent from freezing by the processor.

11. In paragraph 10, Performing the above anti-icing control A control method for a refrigerator, comprising: determining the duty ratio based on the temperature of the cooling sink detected by the temperature sensor at time intervals so that the temperature of the cooling sink detected by the temperature sensor is maintained within a temperature range that prevents freezing of the defrost water contained in the cooling duct.

12. In paragraph 10, Performing the above anti-icing control Reducing the duty ratio based on the temperature of the cooling sink detected by the temperature sensor being lower than or equal to a first threshold temperature; A control method for a refrigerator, comprising: increasing the duty ratio based on the temperature of the cooling sink detected by the temperature sensor being higher than or equal to a second threshold temperature that is higher than the first threshold temperature.

13. In paragraph 10, Performing the above anti-icing control Maintaining the duty ratio based on the temperature of the cooling sink detected by the temperature sensor being higher than the first threshold temperature and lower than the second threshold temperature; A method for controlling a refrigerator, wherein the first critical temperature is lower than the second critical temperature.

14. In paragraph 10, A method for controlling a refrigerator, further comprising: controlling the cooling fan by the processor not to apply the voltage pulse to the thermoelectric element and not to generate the air flow so that the defrost water received in the cooling duct does not overflow the cooling duct based on the door of the refrigerator being opened for a critical time; 15. In paragraph 10, The refrigerator includes an evaporator that is placed outside the storage room and cools air supplied to the storage room, and a compressor that supplies refrigerant to the evaporator. A method of controlling a refrigerator, further comprising: controlling the cooling fan so as not to generate the air flow without applying the voltage pulse to the thermoelectric element, based on the fact that the refrigerant is not supplied to the evaporator by the compressor;

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