Optical module

Abstract

The present application discloses an optical module, comprising a housing and a circuit board assembly arranged in the housing. The circuit board assembly comprises a circuit board body, at least one component, and a reinforcing structural member. The circuit board body is provided with a first surface and a second surface opposite to the first surface. The component is arranged on the first surface, the reinforcing structural member is arranged on the first surface or the second surface, and the orthographic projection of the reinforcing structural member on the first surface completely covers the orthographic projection of the component on the first surface. When the circuit board assembly is under stress, the reinforcing structural member can be used for enhancing the strength of an area surrounding the component, thereby avoiding influences such as cracking and failure of a part of the component due to being under stress.

Description

optical modules

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 20, 2024, with application number 202420538251.4 and invention name “Optical Module”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The utility model relates to the technical field of printed circuit board design, in particular to an optical module with a reinforcement structure. Background Art

[0003] PCB is a printed circuit board that is made by combining and dividing important raw materials such as prepreg and copper foil, and undergoing various other processing processes. It is an important carrier for supporting and connecting components. PCBA is a finished circuit board that is produced by performing processes such as SMT (Surface Mounted Technology) and DIP (Dual In-line Package) on the surface of the PCB board to attach components.

[0004] The PCBA is the core component of the optical module. Its assembly process and heat dissipation process have a significant impact on the overall performance of the optical module. The stress exerted on the PCBA in the module housing can cause the board to warp and deform, resulting in abnormal light output from the module. What's worse, the large bending stress can cause electronic or optical components to crack, resulting in product failure. At the same time, the heat dissipation design also has a significant impact on the performance of the optical module. If the heat dissipation is not good, the overall power consumption of the module will be high, and the performance of the DSP chip will be affected. Utility Model Content

[0005] The purpose of the utility model is to provide an optical module to reduce the impact of stress on main components of a circuit board.

[0006] In order to achieve one of the purposes of the above-mentioned utility model, one embodiment of the present utility model provides an optical module, including a shell and a circuit board assembly arranged in the shell, the circuit board assembly including a circuit board body, at least one component and a reinforcing structure, the circuit board body having a first surface and a second surface opposite to the first surface, the component is arranged on the first surface, the reinforcing structure is arranged on the first surface or the second surface, and the orthographic projection of the reinforcing structure on the first surface completely covers the orthographic projection of the component on the first surface.

[0007] As a further improvement of an embodiment of the present invention, a side of the reinforcing structural member facing the circuit board body is provided with an avoidance space, the avoidance space is used to accommodate the components, at least two sides of the avoidance space are used to connect and fix the circuit board body, and the area of ​​the avoidance space projected on the first surface is smaller than the area of ​​the connection and fixing part of the reinforcing structural member and the circuit board body projected on the first surface.

[0008] As a further improvement of an embodiment of the present invention, the avoidance space passes through a portion of the circumferential side surface of the reinforcing structural component in a direction parallel to the first surface.

[0009] As a further improvement of an embodiment of the present invention, the reinforcing structure is provided on the first surface, the first surface includes a plurality of first device mounting areas and a first connection area connected to the reinforcing structure, the first device mounting areas are used to place components, and part of the first device mounting areas fall within the first connection area;

[0010] A heat dissipation device is provided on a side of the reinforcing structure away from the first surface. The heat dissipation device is thermally connected to the reinforcing structure. Some components provided in the first component mounting area are thermally connected to the reinforcing structure.

[0011] As a further improvement of one embodiment of the present invention, the reinforcing structural member is arranged on the second surface, the second surface includes a plurality of second device mounting areas and a second connection area connected to the reinforcing structural member, the second device mounting area is used to set other components, the second connection area is arranged corresponding to some components arranged on the first surface, and the second connection area is set as a copper surface.

[0012] As a further improvement of one embodiment of the present invention, a plurality of copper-filled heat dissipation vias are provided on the copper surface, and the copper-filled heat dissipation vias pass through the copper surface and the first surface, and the heat generated by the components on the first surface is conducted to the reinforcing structural member through the copper-filled heat dissipation vias.

[0013] As a further improvement of an embodiment of the present invention, a heat dissipation adhesive layer is provided at the connection between the reinforcing structural member and the circuit board body.

[0014] As a further improvement of an embodiment of the present invention, the components include a driver, a transimpedance amplifier and a DSP chip.

[0015] As a further improvement of an embodiment of the present invention, heat dissipation material is filled between the reinforcing structural member and the shell, and the reinforcing structural member is made of metal.

[0016] As a further improvement of an embodiment of the present invention, the housing includes an upper shell and a base connected to each other, and the first surface of the circuit board body is arranged toward the upper shell;

[0017] When the reinforcing structure is disposed on the second surface, the heat dissipation material is filled between the reinforcing structure and the base.

[0018] The beneficial effect of the present invention is that a reinforcing structure is provided on the first surface or the second surface of the circuit board body, and the orthographic projection of the reinforcing structure on the first surface completely covers the orthographic projection of the components on the first surface. When the circuit board assembly is subjected to stress, the reinforcing structure can be used to enhance the strength of the area around the components, thereby avoiding the effects of cracking and failure of some components due to the stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG1 is a schematic diagram of the first surface structure of a circuit board assembly in one embodiment of the present invention;

[0020] FIG2 is a schematic diagram of the second surface structure of the circuit board assembly in one embodiment of the present invention;

[0021] FIG3 is a schematic structural diagram of a reinforcing structural member in one embodiment of the present invention. DETAILED DESCRIPTION

[0022] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0023] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0024] The utility model provides an optical module, which includes a housing and a circuit board assembly arranged in the housing. The circuit board assembly includes a circuit board body, at least one component and a reinforcing structure. The circuit board body has a first surface and a second surface opposite to the first surface. The component is arranged on the first surface, and the reinforcing structure is arranged on the first surface or the second surface, and the orthographic projection of the reinforcing structure on the first surface completely covers the orthographic projection of the component on the first surface.

[0025] As shown in FIG. 1 to FIG. 3 , this embodiment provides a circuit board assembly, including a circuit board body 100 , a plurality of components 200 , and a reinforcing structure 300 .

[0026] The circuit board body 100 has a first surface 110 and a second surface 120 opposite to the first surface.

[0027] The component 200 is disposed on the first surface 110 .

[0028] Of course, corresponding components 200 may also be provided on the second surface 120 according to actual product manufacturing requirements.

[0029] Specifically, the components 200 in this embodiment include but are not limited to a driver, a transimpedance amplifier, and a DSP chip.

[0030] More specifically, major working components such as a driver, a transimpedance amplifier, and a DSP chip are all disposed on the first surface 110 .

[0031] The reinforcing structure 300 is disposed on the first surface 110 or the second surface 120, and the orthographic projection of the reinforcing structure 300 on the first surface 110 completely covers the orthographic projection of the component 200 on the first surface 110. In other words, when the reinforcing structure 300 is disposed on the first surface 110, the reinforcing structure 300 can completely cover the component 200. When the reinforcing structure 300 is disposed on the second surface 120, the orthographic projection of the component 200 on the first surface 110 is the first projection, and the orthographic projection of the reinforcing structure 300 on the first surface 110 is the second projection, i.e., the outer contour of the first projection is completely within the outer contour of the second projection. When the circuit board assembly is subjected to stress, the reinforcing structure 300 can be used to strengthen the area surrounding the component 200, preventing stress-induced cracking and failure of the component 200.

[0032] In a specific embodiment of the present invention, the orthographic projection of the reinforcing structure 300 on the first surface 110 is a rectangular structure.

[0033] Of course, the present invention does not impose any specific restrictions on the specific structure and projection area of ​​the orthographic projection of the reinforcing structural member 300 on the first surface 110 , and can be specifically adjusted according to the number of components 200 to be covered and the location of the components 200 to be installed.

[0034] Specifically, a side of the reinforcing member 300 facing the circuit board body 100 is provided with an escape space 310 for accommodating components 200. The escape space 310 can be specifically designed based on whether components 200 are mounted at the actual location, as well as the size and number of the mounted components 200. When the reinforcing member 300 is disposed on the first or second surface, if a component 200 is mounted at the location where the reinforcing member 300 is disposed, the escape space 310 can be fully accommodated.

[0035] More specifically, at least two sides of the avoidance space 310 are used to connect and fix the circuit board body 100, and the area of ​​the avoidance space 310 projected on the first surface 110 is smaller than the area of ​​the connection and fixing part between the reinforcing structure 300 and the circuit board body 100 projected on the first surface 110.

[0036] The reinforcing member 300 includes a first surface 320 connected to the circuit board body 100, a second surface 330 opposite the first surface 320, and a peripheral side surface 340 connecting the first and second surfaces. Specifically, when a component 200 is mounted on the reinforcing member 300, the first surface 320 is parallel to and close to the surface where the component 200 connects to the circuit board body 100, the second surface 330 is parallel to and close to the side of the component 200 that faces away from the surface where the component 200 connects to the circuit board body 100, and the peripheral side surface 340 surrounds the component 200.

[0037] More specifically, the escape space 310 extends through a portion of the circumferential side surface 340 of the reinforcing structural member 300 in a direction parallel to the first surface 110. With reference to FIG3 , the escape space 310 extends through a portion of the circumferential side surface 340 of at least one end of the reinforcing structural member 300 in a direction parallel to the width of the reinforcing structural member 300. That is, the escape space 310 may extend through a portion of the circumferential side surface 340 of one end of the reinforcing structural member 300 in a direction parallel to the width of the reinforcing structural member 300, or may extend through portions of the circumferential side surface 340 of opposite ends of the reinforcing structural member 300 in a direction parallel to the width of the reinforcing structural member 300. This prevents the thin side walls of the reinforcing structural member 300 along the length of the escape space 310 from affecting the adhesion between the reinforcing structural member 300 and the circuit board body 100, while also facilitating the processing and forming of the reinforcing structural member 300.

[0038] Of course, the escape space 310 may also extend through a portion of the peripheral side surface 340 of at least one end of the reinforcing structure 300 in a direction parallel to the length of the reinforcing structure 300, or extend through the peripheral side surface 340 of the reinforcing structure 300 in other directions. The present invention is not limited to this. The size and position of the escape space 310 are related to the relative position between the reinforcing structure 300 and the component 200, as well as the shape and size of the component 200.

[0039] In a specific embodiment of the present invention, the avoidance space 310 is configured as a rectangular parallelepiped structure.

[0040] Of course, the present invention does not impose any specific restrictions on the specific structure and size of the avoidance space 310 and the number of the avoidance spaces 310 provided on the reinforcing structure 300 , and can be specifically adjusted according to the number and size of the components 200 actually required to be accommodated.

[0041] The reinforcing structure 300 is made of metal. The present invention does not impose any restrictions on the specific material of the reinforcing structure 300, and it can be made of tungsten copper or other metal materials with high strength, adhesiveness and high thermal conductivity.

[0042] For example, component 200 primarily includes a driver and a transimpedance amplifier disposed on first surface 110. Because the driver and transimpedance amplifier are the primary operating components of the circuit board, when the circuit board is subjected to stress, the stress is high in the areas where the driver and transimpedance amplifier are located and in their surrounding areas. Therefore, the orthographic projection of the designed reinforcement structure 300 on first surface 110 only needs to cover both the driver and transimpedance amplifier.

[0043] Specifically, the reinforcing structure 300 is arranged on the second surface 120, and the orthographic outer contours of the driver and the transimpedance amplifier on the first surface 110 respectively fall completely within the orthographic outer contours of the reinforcing structure 300 on the first surface 110. The reinforcing structure 300 can support and reinforce the components 200 (driver and transimpedance amplifier) ​​and their surrounding areas, and can reduce the impact of stress in this area.

[0044] Of course, the reinforcing structure 300 may also be disposed on the first surface 110 so as to completely cover the driver and the transimpedance amplifier and their surrounding areas, and a corresponding avoidance space 310 is provided at the position covering the driver and the transimpedance amplifier.

[0045] Of course, when the reinforcing structural member 300 is set on the second surface 120, it is also necessary to consider whether other components are mounted in the second surface position area relative to the covering driver and transimpedance amplifier. If so, a corresponding avoidance space 310 must be designed to prevent interference with the components 200 mounted at the corresponding position; if not, the reinforcing structural member 300 can be directly designed as a rectangular structure.

[0046] In one embodiment, a reinforcing structure 300 is disposed on the first surface 110. The first surface 110 includes a plurality of first device mounting areas 111 (dashed areas in FIG. 1 ) and a first connection area connected to the reinforcing structure 300. The first device mounting areas 111 are used to mount components 200. A portion of the first device mounting areas 111 falls within the first connection area. In other words, the orthographic projection of the components 200 mounted in this portion of the first device mounting area 111 on the first surface 110 completely falls within the orthographic projection of the reinforcing structure 300 on the first surface 110. The reinforcing structure 300 can enhance stress around this portion of the first device mounting area 111. Specifically, corresponding avoidance spaces 310 are provided on the reinforcing structure 300 for the components 200 mounted within this portion of the first device mounting area 111, ensuring that the reinforcing structure 300 does not interfere with the components 200 mounted within this portion of the first device mounting area 111.

[0047] A heat sink is also provided on a side of the reinforcing structure 300 away from the first surface 110. The heat sink is thermally connected to the reinforcing structure 300. The components 200 located in the portion of the first component mounting area that falls within the first connection area are thermally connected to the reinforcing structure 300. In this way, heat generated by the components 200 located in the portion of the first component mounting area can be transferred to the heat sink via the reinforcing structure 300.

[0048] In another embodiment, a reinforcing structure 300 is disposed on the second surface 120. The second surface 120 includes a plurality of second component mounting areas 121 and a second connection area 122 (dashed area in FIG2 ) connected to the reinforcing structure 300. The second component mounting areas 121 are used to mount other components, and the second connection areas 122 are disposed corresponding to areas on the first surface 110 where some components are located. In other words, the second connection areas 122 are disposed corresponding to some components disposed on the first surface 110. The reinforcing structure 300 disposed in the second connection areas 122 is used to enhance the strength of the area surrounding the components at the corresponding locations on the first surface 110.

[0049] In this embodiment, a portion of the second device mounting area 121 may fall within the second connection area 122. In this case, a clearance space is provided for the reinforcement structure 300 disposed in the second connection area 122, such that the clearance space can accommodate a portion of the components in the second device mounting area 121. Alternatively, no components may be disposed in the second connection area 122, in which case the reinforcement structure 300 disposed in the second connection area 122 may be a complete rectangular parallelepiped structure, without the need for a clearance space.

[0050] Specifically, the second connection area 122 is configured as a copper surface. Generally, the second surface 120 of the circuit board body is covered with a layer of ink, that is, the second connection area 122 where the second surface 120 is connected to the reinforcing structure 300 is etched to expose the copper surface.

[0051] More specifically, a plurality of copper-filled heat dissipation vias are provided on the copper surface in an area corresponding to the location of the components 200 on the first surface 110. These copper-filled heat dissipation vias penetrate the copper surface and the first surface 110. Heat generated by the components 200 on the first surface 110 during operation can be conducted to the reinforcement structure 300 through these copper-filled heat dissipation vias. In other words, if it is necessary to enhance the strength of the area surrounding the driver and transimpedance amplifier disposed on the first surface 110, a reinforcement structure 300 is provided on the second surface 120 at locations corresponding to the driver and transimpedance amplifier, and a plurality of copper-filled heat dissipation vias are provided at locations corresponding to the driver and transimpedance amplifier, so that heat generated by the driver and transimpedance amplifier can be transferred to the reinforcement structure 300 through the copper-filled heat dissipation vias.

[0052] Of course, in this embodiment, a heat dissipation device may also be provided on a side of the reinforcing structure 300 away from the copper surface to further facilitate heat dissipation of the component 200 .

[0053] A heat dissipation adhesive layer is provided at the connection between the reinforcing structural member 300 and the circuit board body 100 , which can further transfer the heat generated by the components on the circuit board body 100 to the reinforcing structural member 300 .

[0054] In a specific embodiment of the present invention, the reinforcing structural member 300 and the copper surface are fixedly bonded via the heat dissipation adhesive layer.

[0055] The present invention does not limit the specific material of the heat dissipation adhesive layer, including but not limited to silver adhesive and other adhesive materials with non-volatile, aging-resistant, high bonding strength and high thermal conductivity.

[0056] Furthermore, heat dissipation material is filled between the reinforcing member 300 and the housing. This allows heat generated by the components 200 to be transferred to the housing of the optical module through the reinforcing member 300 and the heat dissipation material, thereby transferring the heat to the outside air and improving the heat dissipation performance of the optical module. Furthermore, when a heat dissipation device is provided on the side of the reinforcing member 300 that is away from the circuit board body, the heat dissipation material is filled between the heat dissipation device and the housing.

[0057] Of course, the heat dissipation materials in the present invention include but are not limited to thermally conductive colloid materials, thermally conductive pads, thermally conductive silicone grease, and the like.

[0058] Specifically, the housing includes an upper shell and a base connected to each other, wherein the upper shell and the base are connected to form a space for accommodating the circuit board assembly. The first surface 110 of the circuit board body is arranged toward the upper shell.

[0059] Generally, since the base of the optical module can play a role in heat dissipation, the reinforcing structural member 300 is arranged on the second surface 120, and the heat dissipation material is filled between the reinforcing structural member 300 and the base. The heat generated by the components 200 on the first surface 110 can be transferred to the reinforcing structural member 300 through the copper-filled heat dissipation through-holes, and then the heat is transferred to the base of the optical module by the heat dissipation material to further improve its heat dissipation performance.

[0060] In summary, the present invention provides a reinforcing structure on the first or second surface of the circuit board body, and ensures that the orthographic projection of the reinforcing structure on the first surface completely covers the orthographic projection of the components on the first surface. When the circuit board assembly is subjected to stress, the reinforcing structure can be used to enhance the strength of the area surrounding the components, thereby preventing some components from cracking or failing due to the stress.

[0061] It should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation method can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0062] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. An optical module, characterized in that: It includes a shell and a circuit board assembly arranged in the shell, the circuit board assembly includes a circuit board body, at least one component and a reinforcing structure, the circuit board body has a first surface and a second surface opposite to the first surface, the component is arranged on the first surface, the reinforcing structure is arranged on the first surface or the second surface, and the orthographic projection of the reinforcing structure on the first surface completely covers the orthographic projection of the component on the first surface.

2. The optical module according to claim 1, wherein: A side of the reinforcing structure facing the circuit board body is provided with an escape space, the escape space is used to accommodate the components, at least two sides of the escape space are used to connect and fix the circuit board body, and the area of ​​the escape space projected on the first surface is smaller than the area of ​​the connection and fixing portion of the reinforcing structure and the circuit board body projected on the first surface.

3. The optical module according to claim 2, wherein: The avoidance space passes through a portion of the circumferential side surface of the reinforcing structural component in a direction parallel to the first surface.

4. The optical module according to claim 3, wherein: The reinforcing structure is provided on the first surface, the first surface including a plurality of first device mounting areas and a first connection area connected to the reinforcing structure, the first device mounting areas being used to place components, and a portion of the first device mounting areas falling within the first connection area; A heat dissipation device is provided on a side of the reinforcing structure away from the first surface. The heat dissipation device is thermally connected to the reinforcing structure. Some components provided in the first component mounting area are thermally connected to the reinforcing structure.

5. The optical module according to claim 1, wherein: The reinforcing structure is arranged on the second surface, and the second surface includes multiple second device mounting areas and a second connection area connected to the reinforcing structure. The second device mounting area is used to set other components. The second connection area is arranged corresponding to some components arranged on the first surface, and the second connection area is set as a copper surface.

6. The optical module according to claim 5, characterized in that A plurality of copper-filled heat dissipation through-holes are provided on the copper surface. The copper-filled heat dissipation through-holes penetrate the copper surface and the first surface. Heat generated by components on the first surface is conducted to the reinforcing structural member through the copper-filled heat dissipation through-holes.

7. The optical module according to claim 1, wherein: A heat dissipation adhesive layer is provided at the connection between the reinforcing structural member and the circuit board body.

8. The optical module according to claim 1, wherein: The components include a driver, a transimpedance amplifier and a DSP chip.

9. The optical module according to claim 1, wherein: Heat dissipation material is filled between the reinforcement structure and the shell, and the reinforcement structure is made of metal.

10. The optical module according to claim 9, wherein: The housing comprises an upper shell and a base connected to each other, and the first surface of the circuit board body is arranged toward the upper shell; When the reinforcing structure is disposed on the second surface, the heat dissipation material is filled between the reinforcing structure and the base.

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