Method for producing a camera, and camera for a motor vehicle

Abstract

The invention relates to a method (600) for producing a camera (100), the camera (100) comprising: an objective (101) having an objective housing (102) and at least one optical lens (103); a camera housing (111) having at least two pins (106-1, 106-2) protruding in a direction away from the objective (103); and a circuit board (107) with an imager module (108) fastened thereon, the circuit board (107) being connected to the camera housing (111) by means of the pins (106-1, 106-2), and the method comprising the steps of: providing (601) the camera housing (111); fastening (602) the imager module (108) on the circuit board (107), the imager module (108) comprising an image sensor; measuring (603) an active area (201) of the image sensor fastened on the circuit board (107), by means of an image recognition method; determining (605) positions of at least two receiving openings (109-1, 109-2) to be introduced, according to the pins (106-1, 106-2) of the camera housing (111), into the circuit board (107), taking into account the measured active area (201) of the image sensor; introducing (606) the at least two receiving openings (109-1, 109-2) into the circuit board (107) at the determined positions; inserting (607) the pins (106-1, 106-2) of the camera housing (111) into the receiving openings (109-1, 109-2) of the circuit board (107); and fastening (608) the circuit board (107) to the camera housing (111).

Description

[0001] Description

[0002] title

[0003] Procedure for a camera and camera for a

[0004] The present invention relates to a method for producing a camera and a camera for a motor vehicle according to the independent claims.

[0005] State of the art

[0006] DE 10 2021 212 985 A1 discloses a method for producing a camera, comprising the steps of: assembling a circuit carrier and a metal frame on a surface of the circuit carrier carrying an image sensor to provide a circuit carrier arrangement; optically measuring the circuit carrier arrangement to determine a position of the image sensor on the circuit carrier; inserting a lens with a lens housing into a camera housing, wherein the camera housing has a camera housing collar extending into an interior of the camera housing with a compression element arranged on a side facing the image sensor; and attaching the lens housing to the camera housing; optically measuring the lens attached to the camera housing to determine a focus and an image plane tilt of the lens;Compressing the compression element as a function of the optical measurement of the circuit carrier assembly and the optical measurement of the lens attached to the camera housing to adjust the alignment of the lens to the circuit carrier assembly to be arranged on the camera housing along a coordinate axis and along two rotational axes; arranging the circuit carrier assembly on the camera housing and aligning it along two further coordinate axes and a further rotational axis; and connecting the circuit carrier assembly and the camera housing. Disclosure of the invention;

[0007] The present invention is based on a method for manufacturing a camera. The camera to be manufactured comprises a lens with a lens housing and at least one optical lens, a camera housing with at least two pins extending in a direction facing away from the lens, and a circuit board with an imager module attached or attachable thereto. The circuit board is connected or connectable to the camera housing by means of the pins.

[0008] The method comprises the following steps: providing the camera housing; attaching the imager module to a circuit board, wherein the imager module comprises an image sensor; measuring an active area of ​​the image sensor attached to the circuit board by means of an image recognition method; determining positions of at least two receiving openings to be introduced in the circuit board corresponding to the pins of the camera housing, taking into account the measured active area of ​​the image sensor; introducing the at least two receiving openings into the circuit board at the determined positions; inserting the pins of the camera housing into the receiving openings of the circuit board; and attaching the circuit board to the camera housing.

[0009] A camera produced by the method is particularly suitable for use in a motor vehicle.

[0010] The imager module can be attached to the circuit board, particularly by soldering.

[0011] During the production of printed circuit boards, several printed circuit boards can be manufactured simultaneously as a panel and then singulated. The measurement of the active area of ​​the image sensor attached to the circuit board using the image recognition method can take place directly before, during or after singulating several printed circuit boards. For example, the image sensor can be illuminated with a light source. The light source is particularly matched with regard to the wavelength and direction of the light emitted from the light source onto the image sensor. Images are captured by the illuminated image sensor. Clear features of the image sensor can be captured in this process. The light source can be matched to the image sensor in such a way that clear features can be captured, for example, under a protective film, a glass lid, or something similar that is located on the image sensor.

[0012] The receiving openings are to be understood in particular as receiving holes. The determination and introduction of the receiving openings taking into account the measured active area of ​​the image sensor can, in other words, be understood as adaptive introduction of the receiving openings. The receiving openings can, for example, be cut into the circuit board. The introduction of the receiving openings into the circuit board can, in particular, be combined with the singulation of multiple circuit boards from a single panel. The introduction of the receiving openings into the circuit board can take place during the singulation of multiple circuit boards from a single panel. With such a combination, the position and orientation of the outer contours of the circuit board can also be advantageously adapted.

[0013] The camera housing can have two or more pins. In particular, the camera housing has two pins. In particular, the camera housing has four pins. In particular, the number of receiving openings is provided in the circuit board equal to the number of pins in the camera housing of the camera to be manufactured. Inserting the pins of the camera housing into the receiving openings of the circuit board serves, in particular, to connect the camera housing to the circuit board.

[0014] The advantage of the invention lies in particular in the sequence of the steps of the method.

[0015] If the process were designed differently, for example by attaching the imager module to a circuit board with pre-drilled mounting holes, a certain tolerance chain could result in a lateral position of the active surface of the image sensor in the camera housing being subject to a certain tolerance along a first axis (x-direction) and along a second axis (y-direction). As a result, concentricity of the active surface in the camera housing and thus concentricity of the lens aligned with it in the camera housing could not be guaranteed, or could not be guaranteed ideally. The tolerance chain could also result in a rotation of the active surface of the image sensor relative to the reference edges of the camera housing (roll angle).In this case, the tolerance chain would be influenced by the alignment of the active surface of the image sensor to the imager module, a possible floating of the imager module on solder balls when soldering the imager module to the circuit board, the positions of the pre-drilled mounting holes to a position of a solder pad, a centering of the pre-drilled mounting holes around the pins of the camera housing, and a position of the pins to a lens side of the camera housing.

[0016] In the method presented here, it is advantageous that the imager module is mounted on the circuit board before the at least two mounting openings are adaptively introduced into the circuit board. During the final mounting of the circuit board to the camera housing, the circuit board can align itself almost perfectly via the adaptively introduced mounting openings in the camera housing. This allows the active surface of the image sensor to be positioned almost perfectly in the camera housing. A significantly reduced tolerance chain for the concentricity of the lens in the camera housing and a significantly reduced tolerance chain for the roll angle can be achieved.

[0017] In an advantageous embodiment, when measuring the active area, an orientation of the active area along a first axis (x-axis, image vertical), an orientation of the active area along a second axis (y-axis, image horizontal), and a rotation angle of the active area about a third axis (y-axis) are determined. In other words, the rotation angle of the active area is a rotation of the active area relative to a reference edge of the circuit board. The rotation angle is spanned by the reference edge of the circuit board and an edge of the active area.

[0018] The advantage of this embodiment is that the measurement results thus obtained enable the determination of the positions of the receiving openings to be introduced into the circuit board so well that the manufactured camera exhibits particularly good concentricity and a particularly low roll angle. In an advantageous embodiment, the method comprises the following further step: determining the positions of the at least two pins relative to at least one edge of the camera housing using an image recognition method. The determined positions of the at least two pins are taken into account when determining the positions of the receiving openings in the circuit board.

[0019] The positions of the at least two pins can be determined, for example, by clamping the camera housing against a reference surface and using the image recognition method to measure the positions of the at least two pins relative to reference marks on the reference surface in a single image. For the measurement, the camera housing can be illuminated with a light source. The light source is tuned, in particular, with regard to a wavelength and a direction of light emitted from the light source onto the camera housing. Images of the illuminated camera housing are captured. Features of the camera housing can be captured in this process. The light source can be tuned to the camera housing in such a way that clear features of the camera housing can be captured. The positions of the pins can be derived from detected circle centers of the pins.

[0020] This step is particularly advantageous if a circuit board has previously been assigned to a specific camera housing during a camera production process. The advantage of this design is that the position of the pins relative to a lens side of the camera housing is eliminated or significantly reduced as a potential source of error in the tolerance chain. This allows for significantly improved concentricity and an even lower roll angle for the manufactured camera.

[0021] In an advantageous embodiment, a rectangle spanned by the at least two pins is determined in a plane of the at least two pins. In this case, an orientation of the rectangle along a first axis (x-axis), an orientation of the rectangle along a second axis (y-axis), and a rotation angle of the rectangle about a third axis (z-axis) are determined. In other words, the rotation angle of the rectangle is a rotation of the rectangle relative to a reference edge of the camera housing. The rotation angle is spanned by the reference edge of the camera housing and an edge of the rectangle.

[0022] The advantage of this design is that the measurement results obtained in this way enable the positions of the receiving openings to be made in the circuit board to be determined even better, so that the manufactured camera has even better concentricity and an even smaller roll angle.

[0023] In an advantageous embodiment, it is provided that the introduction of the at least two receiving openings into the circuit board is carried out by means of laser cutting.

[0024] The advantage of this design is that the apertures can be positioned very precisely, and their diameter can also be adjusted very precisely. The accuracy of the cutting process can be around 150 μm, for example. The accuracy can be even better under certain circumstances. This, in turn, leads to improved concentricity and a low roll angle of the camera being manufactured.

[0025] In an advantageous embodiment, it is provided that the fastening of the circuit board to the camera housing takes place by means of a caulking process or by means of a soldering process.

[0026] The caulking process allows the circuit board to align itself to the pins in the camera housing via the adaptively created receiving openings and to position itself almost ideally in an advantageous manner.

[0027] During the soldering process, the adaptively created openings for the solder joints can advantageously be minimized. This leads to a more robust solder joint design.

[0028] In an advantageous embodiment, the method comprises the following further steps: inserting the lens into the camera housing; optically aligning the lens to the image sensor; and fastening the lens in the camera housing.

[0029] Thus, a camera with very good optical properties, in particular very good concentricity and a very small roll angle, can be advantageously manufactured.

[0030] The invention further relates to a camera for a motor vehicle. The camera comprises a lens with a lens housing and at least one optical lens; a camera housing with at least two pins extending in a direction facing away from the lens; and a circuit board with an imager module mounted thereon, wherein the imager module comprises an image sensor, wherein the circuit board is connected to the camera housing by means of the pins, wherein the pins are inserted into at least two receiving openings in the circuit board; and wherein positions of the receiving openings in the circuit board are adapted to an active area of ​​the image sensor.

[0031] In particular, a camera is presented here which was manufactured using the process described above.

[0032] The camera may further include a housing cover. The housing cover may be connected to the camera body on a side of the camera body facing away from the lens. The camera body and the housing cover may be connected to each other in such a way that the camera is protected from the ingress of media from the camera's environment. The camera body and the housing cover may be connected to each other by a material fit or a form fit.

[0033] The camera described here can, in particular, also have an electrical connector designed to electrically connect the circuit board. The circuit board is designed, in particular, to accommodate the image sensor. The circuit board can accommodate further components, such as a camera connector, as well as other electronic components. It is understood that the features mentioned above and those to be explained below can be used not only in the respective combinations specified, but also in other combinations or on their own, without departing from the scope of the present invention.

[0034] Drawings

[0035] Embodiments of the present invention are explained in more detail below with reference to the accompanying drawings. Like reference numerals in the figures denote like or equivalent elements. They show:

[0036] Figure 1 shows an embodiment of a camera;

[0037] Figure 2 shows an example of measuring an active area of ​​an image sensor; Figure 3 shows an example of determining the positions of at least two pins of a camera housing;

[0038] Figure 4 shows an example of a printed circuit board in which two receiving openings have been introduced;

[0039] Figure 5 shows a top view of a camera to be manufactured, in which the pins of the camera housing are inserted into the receiving openings of the circuit board; Figure 6 shows an embodiment of a method for manufacturing a camera.

[0040] Figure 1 shows an example of a camera 100 for a motor vehicle. The camera 100 comprises the lens 101, which in turn has a lens housing 102 and at least one optical lens 103. The camera 100 further comprises the camera housing 111 with at least two pins 106-1 and 106-2 projecting in a direction facing away from the lens 103. In addition, the camera 100 comprises the circuit board 107 with an imager module 108 fastened thereon, wherein the imager module comprises an image sensor and wherein the circuit board 107 is connected to the camera housing 111 by means of the pins 106-1 and 106-2. For this purpose, the pins are introduced into at least two receiving openings 109-1 and 109-2 of the circuit board 107.

[0041] In the exemplary embodiment shown here, the lens 101 is inserted into the camera housing 111 and optically aligned with the image sensor. Furthermore, the lens 101 is fastened in the camera housing 111. An adhesive point 105 can be formed for this purpose, for example. If, in a method for manufacturing the camera 100, the imager module 108 were to be fastened to a circuit board 107 with pre-drilled receiving openings 109-1 and 109-2, a lateral position of the active surface of the image sensor in the camera housing 111 could be subject to a certain tolerance along a first axis (x-axis) and along a second axis (y-axis). As a result, the concentricity of the lens 101 in the camera housing 111, marked by the lines 110, could not be guaranteed or could not be ideally guaranteed. A rotation of the active surface of the image sensor relative to reference edges of the camera housing 111 (roll angle) could also occur.

[0042] In order to significantly reduce both a tolerance chain for the concentricity of the lens 101 in the camera housing 111 and a tolerance chain for the roll angle, the method 600 presented here and shown schematically in Figure 6 can be used to manufacture the camera 100. Figures 2 to 5 illustrate individual method steps of the method 600 more clearly. In a camera 100 manufactured using this method 600, in particular, the positions of the receiving openings 109-1 and 109-2 in the circuit board 107 are adapted to an active area of ​​the image sensor.

[0043] In method 600, the camera housing 101 is provided in a first step 601. In step 602, the imager module 108 is mounted on the circuit board 107. The imager module 108 comprises the image sensor. In step 603, an active area of ​​the image sensor mounted on the circuit board 107 is measured using an image recognition method. Subsequently, in step 605, the positions of the at least two receiving openings 109-1 and 109-2, which are to be introduced in the circuit board 107 corresponding to the pins 106-1 and 106-2 of the camera housing 111, are determined taking into account the measured active area of ​​the image sensor. In other words, an ideal position of the at least two receiving openings 109-1 and 109-2 is calculated taking into account the measurement data of the active area of ​​the image sensor.The positions of the at least two receiving openings 109-1 and 109-2 in the circuit board 107 can advantageously be adapted to the active area of ​​the image sensor. In a next step 606, the at least two receiving openings 109-1 and 109-2 are introduced into the circuit board 107 at the previously determined positions. The positions of the at least two receiving openings 109-1 and 109-2 in the circuit board 107 are thus particularly advantageously adapted to the active area of ​​the image sensor. In step 607, the pins 106-1 and 106-2 of the camera housing 111 are then inserted into the corresponding receiving openings 109-1 and 109-2 of the circuit board 107. In step 608, the circuit board 107 is fastened to the camera housing 111. The fastening 608 can be carried out, for example, by means of a caulking process or by means of a soldering process.

[0044] Optionally, the method 600 may include the further steps of inserting 609 the lens 101 into the camera housing 111; optically aligning 610 the lens 101 to the image sensor; and securing 611 the lens 101 in the camera housing 111.

[0045] Figure 2 illustrates step 603 of measuring an active area 201 of the image sensor. It shows, by way of example, how an alignment 202 of the active area 201 along a first axis (y-axis), an alignment 203 of the active area 201 along a second axis (y-axis), and a rotation angle 204 of the active area 201 along a third axis (z-axis) are determined. In other words, the rotation angle 204 of the active area 201 is a rotation of the active area 201 relative to a reference edge, marked by arrow 205, of the circuit board 107. The rotation angle 204 is spanned by the reference edge 205 of the circuit board 107 and an edge of the active area 201, which is marked by arrow 206.

[0046] Figure 3 shows an example of the determination 604 of positions of at least two pins 106-1 and 106-2 of the camera housing 111. The method 600 can optionally include this step 604. The positions of the at least two pins 106-1 and 106-2 are determined with respect to at least one housing edge, marked by the arrow 304, of the camera housing 111 using an image recognition method. In this case, the determined positions of the at least two pins 106-1 and 106-2 are taken into account when determining 605 the positions of the receiving openings 109-1 and 109-2 in the circuit board 107. In the exemplary embodiment of step 604 shown here, a rectangle 305 defined by the at least two pins 106-1 and 106-2 is determined in a plane of the at least two pins 106-1 and 106-2.An orientation 301 of the rectangle 305 along a first axis (x-axis), an orientation 302 of the rectangle 305 along a second axis (y-axis), and a rotation angle 303 of the rectangle 305 about a third axis (z-axis) are determined. In other words, the rotation angle 303 of the rectangle 305 is a rotation of the rectangle 305 relative to a reference edge, marked by arrow 304, of the camera housing 111. The rotation angle 303 is defined by the reference edge 304 of the camera housing 111 and an edge, marked by arrow 306, of the rectangle 305.

[0047] Figure 4 shows, by way of example, a printed circuit board 111 after a step 606, in which two receiving openings 109-1 and 109-2 have been introduced. The positions of the receiving openings 109-1 and 109-2 were previously determined in a step 605. For this purpose, the measurement results of the active area 201 according to a step 603 were taken into account. Optionally, the positions of the at least two pins 106-1 and 106-2 of the camera housing 111, as determined in a step 604, can also have been taken into account when determining 605 the positions of the receiving openings 109-1 and 109-2. Accordingly, the rectangle 305 from the previously optional step 604 is still indicated. The introduction 606 of the at least two receiving openings 109-1 and 109-2 can, for example, have been carried out by means of laser cutting.

[0048] Figure 5 shows a top view of a camera 100 to be manufactured, in which the pins 106-1 and 106-2 of the camera housing 111 are inserted into the receiving openings 109-1 and 109-2 of the circuit board 107. The pins 106-1 and 106-2 and the receiving openings 109-1 and 109-2 are not actually visible in this view and are therefore only indicated. The rectangle 305 from a previously optional step 604 is also still indicated.

Claims

Claims 1. A method (600) for producing a camera (100), wherein the camera (100) comprises a lens (101) with a lens housing (102) and at least one optical lens (103), a camera housing (111) with at least two pins (106-1, 106-2) projecting in a direction facing away from the lens (103), and a circuit board (107) with an imager module (108) mounted thereon, wherein the circuit board (107) is connected to the camera housing (111) by means of the pins (106-1, 106-2); wherein the method comprises the steps: • Providing (601) the camera housing (111); • Mounting (602) the imager module (108) on the circuit board (107), the imager module (108) comprising an image sensor; • Measuring (603) an active area (201) of the image sensor mounted on the circuit board (107) by means of an image recognition method; • Determining (605) positions of at least two receiving openings (109-1, 109-2) to be introduced in the circuit board (107) corresponding to the pins (106-1, 106-2) of the camera housing (111), taking into account the measured active area (201) of the image sensor; • introducing (606) the at least two receiving openings (109-1, 109-2) into the circuit board (107) at the determined positions; • Inserting (607) the pins (106-1, 106-2) of the camera housing (111) into the receiving openings (109-1, 109-2) of the circuit board (107); and • Attach (608) the circuit board (107) to the camera housing (111).

2. Method (600) according to claim 1, wherein during the measurement (603) of the active surface (201) an orientation (202) of the active surface (201) along a first axis (x), an orientation of the active surface (201) along a second axis (y) and a rotation angle (204) of the active surface (201) about a third axis (z) are determined.

3. Method (600) according to claim 1 or 2, comprising the further step of determining (604) positions of the at least two pins (106-1, 106-2) with respect to at least one housing edge (304) of the camera housing (111) by means of an image recognition method; and wherein the determined positions of the at least two pins (106-1, 106-2) are taken into account when determining (605) the positions of the receiving openings (109-1, 109-2) in the circuit board (107).

4. The method (600) according to claim 3, wherein a rectangle (305) spanned by the at least two pins (106-1, 106-2) is determined in a plane of the at least two pins (106-1, 106-2); and wherein an orientation (301) of the rectangle (305) along a first axis (x), an orientation (302) of the rectangle (305) along a second axis (y), and a rotation angle (303) of the rectangle (305) about a third axis (z) are determined.

5. Method (600) according to one of the preceding claims, wherein the introduction (606) of the at least two receiving openings (109-1, 109-2) into the circuit board (107) is carried out by means of laser cutting.

6. Method (600) according to one of the preceding claims, wherein the fastening (608) of the circuit board (107) to the camera housing (111) is carried out by means of a caulking process or by means of a soldering process.

7. Method (600) according to one of the preceding claims, wherein the method (600) comprises the further steps • inserting (609) the lens (101) into the camera body (111); • optically aligning (610) the lens (101) to the image sensor; and • fastening (611) the lens (101) in the camera housing (111).

8. Camera (100) for a motor vehicle comprising: • a lens (101) with a lens housing (102) and a few Stens of an optical lens (103); • a camera housing (111) with at least two pins (106-1, 106-2) projecting in a direction away from the lens (103); and • a circuit board (107) with an imager module (108) mounted thereon, wherein the imager module (108) comprises an image sensor, wherein the circuit board (107) is connected to the camera housing (111) by means of the pins (106-1, 106-2), wherein the pins (106-1, 106-2) are inserted into at least two receiving openings (109-1, 109-2) of the circuit board (107); and wherein positions of the receiving openings (109-1, 109-2) in the circuit board (107) are adapted to an active area (201) of the image sensor.

Images