Optical module cold plate-based liquid cooling assembly and network switching device

Abstract

The present disclosure relates to the technical field of heat dissipation in network devices, and provides an optical module cold plate-based liquid cooling assembly and a network switching device. The optical module cold plate-based liquid cooling assembly comprises: a cold plate main body extending in a first direction and comprising a first side and a second side which are opposite one another; a plurality of floating heat conduction blocks connected to the first side of the cold plate main body and floating in a second direction perpendicular to the first direction, the floating heat conduction blocks being arranged spaced apart in the first direction and configured to come into contact with optical modules sequentially arranged in the first direction; a heat conduction pad, which is arranged between the cold plate main body and the floating heat conduction blocks, and comes into contact with the cold plate main body and the floating heat conduction blocks; and at least one liquid cooling tube arranged on the second side of the cold plate main body. The optical module cold plate-based liquid cooling assembly of the present disclosure closely contacts with the optical modules inserted into connectors of a network switching device, and is capable of smoothly and promptly exporting heat generated during the operation of the optical modules, resulting in high heat dissipation efficiency and a good heat dissipation effect.

Description

[0001] Optical Module Cold Plate Liquid Cooling Assembly and Network Switching Device TECHNICAL FIELD The present disclosure relates to the field of network device heat dissipation technology, and more particularly to an optical module cold plate liquid cooling assembly and network switching device. Background: Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversion and are critical components of 4G / 5G communication equipment and data centers. With the continuous increase in communication speeds and loads, the power consumption and number of installed optical modules are also increasing, making heat dissipation of optical modules particularly important. In related art, air cooling is commonly used to dissipate heat from optical modules. This is achieved by installing the optical module in an optical module connector and creating a window at the top of the connector, allowing the optical module to partially contact a heat sink. Heat is transferred from the optical module to the heat sink's fins, where air flow across the fins dissipates the heat to the external environment. However, air cooling of optical modules suffers from low heat dissipation efficiency and poor heat dissipation effectiveness. SUMMARY OF THE INVENTION The present disclosure provides an optical module cold plate liquid cooling assembly and a network switching device. The optical module cold plate liquid cooling assembly closely contacts an optical module inserted into a connector of the network switching device, thereby smoothly and promptly dissipating heat generated by the optical module during operation, achieving high heat dissipation efficiency and excellent heat dissipation effect. One aspect of the present disclosure provides an optical module cold plate liquid cooling assembly, comprising: a cold plate main body extending along a first direction, comprising a first case and a second case 1 opposite to each other; a plurality of floating heat conductive blocks connected to the first case of the cold plate main body and capable of floating along a second direction perpendicular to the first direction; each floating heat conductive block is arranged at intervals along the first direction and is used to contact each optical module arranged sequentially along the first direction; a thermal pad is arranged between the cold plate main body and the floating heat conductive blocks, and is in contact with the cold plate main body and the floating heat conductive blocks; at least one liquid cooling pipe is arranged on the second case 1 of the cold plate main body. The optical module cold plate liquid cooling assembly provided by the present disclosure comprises a cold plate main body, a plurality of floating heat conductive blocks, a thermal pad and at least one liquid cooling pipe, the cold plate main body extending along the first direction, each floating heat conductive block is arranged on the first case of the cold plate main body and is arranged at intervals along the first direction, the thermal pad is attached between the floating heat conductive blocks and the cold plate main body, and the liquid cooling pipe is arranged on the second case 1 of the cold plate main body. With each floating thermal block in contact with each optical module, heat generated by the optical module is transferred to the cold plate through the floating block and thermal pad. The heat is then carried away by the coolant in the liquid cooling tube, dissipating heat from the optical module. The floating block floats in a second direction perpendicular to the first direction, and the thermal pad deforms with the movement of the floating block, maintaining a tight fit with the floating block and the cold plate. This ensures that the floating block maintains close contact with the optical module while maintaining liquid cooling for optical module heat dissipation. This reduces the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical module, improving heat dissipation efficiency and effectiveness.In one possible embodiment, the optical module cold plate liquid cooling assembly further includes an elastic member connected between each floating thermally conductive block and the cold plate body, capable of extending and contracting in a second direction. By disposing the elastic member between the floating thermally conductive block and the cold plate body, the elastic member drives the floating thermally conductive block to float in the second direction. The elastic member has a strong elastic force and strong elastic deformation capability, reliably driving the floating thermally conductive block to move and increasing the pressure between the floating thermally conductive block and the optical module, ensuring close contact between the floating thermally conductive block and the optical module. In one possible embodiment, two elastic members are connected between the floating thermally conductive block and the cold plate body, one at each end of the floating thermally conductive block, with a thermal pad located between the two elastic members. By connecting the two elastic members at each end of the floating thermally conductive block, the elastic force exerted by the elastic members on the floating thermally conductive block is strong and balanced, ensuring good contact between the floating thermally conductive block and the cold plate body. Furthermore, by placing the thermal pad between the two elastic members, the thermal pad can be ensured to occupy sufficient space and to conform to the main body of the floating heat conductive block, thereby improving the thermal pad's thermal conductivity and effectiveness. In one possible embodiment, the cold plate body includes: a main support plate extending in a first direction; a floating heat conductive block located on a first side of the support plate; and a liquid cooling tube located on a second side of the main support plate; a stopper assembly connected to an outer side of the main support plate and, together with the main support plate, forming a floating groove; the floating groove is located on two sides of the main support plate, with the notches of the two floating grooves facing each other, and the ends of the floating heat conductive block are inserted into the two floating grooves. By arranging the stopper assembly and the main support plate together to form the cold plate body, the floating groove formed between the two forms a mounting base for the floating heat conductive block, thereby securing the floating heat conductive block to the cold plate body and limiting its travel range. Furthermore, this facilitates the processing and design of the main support plate and the assembly of the liquid cooling plate, reducing costs for processing and assembly of the liquid cooling plate. In one possible embodiment, the stopper assembly includes stoppers connected to two opposing sides of the main support plate, with the second side of the main support plate exposed. By providing the stoppers on two opposing sides of the main support plate, the two stoppers and the main support plate together form two floating grooves to secure and position the floating heat conductive blocks. Furthermore, exposing the second side of the main support plate facilitates the installation of the liquid cooling pipes, resulting in a short heat conduction path and high heat conduction efficiency for the entire liquid cooling assembly. In one possible embodiment, the stopper includes a main body and a stopper portion, the main body being connected to the main support plate, and the stopper portion being positioned at the end of the floating heat conductive block. In another possible embodiment, multiple stoppers are spaced apart along the first direction, each stopper retaining at least one floating heat conductive block. In a possible implementation, there is one liquid cooling tube, and the liquid cooling tube passes through both ends of the cold plate body along the first direction.In one possible embodiment, the liquid cooling pipe extends from one end of the cold plate body along a wavy line to the other end of the liquid cold plate. Another aspect of the present disclosure provides a network switching device, comprising: at least one board; at least one connector group, each connector group comprising multiple connectors arranged sequentially along a first direction, each connector electrically connected to the board; wherein each connector in the at least one connector group has a contact window located at the mounting edge of the connector group; and at least one optical module cold plate liquid cooling assembly as described above, the optical module cold plate liquid cooling assembly being located at the mounting edge 1 of the connector group, and each floating thermal conductive block of the optical module cold plate liquid cooling assembly being configured to pass through the contact window and contact an optical module inserted into the connector. The network switching device provided by the present disclosure comprises at least one board, at least one connector group, and at least one optical module cold plate liquid cooling assembly. The connectors in the connector group are arranged sequentially along the first direction and electrically connected to the board; each connector in the at least one connector group has a contact window at the mounting edge; and the optical module cold plate liquid cooling assembly is located at the mounting edge 1 of the connector group. The optical module cold plate liquid cooling assembly includes a cold plate body, multiple floating thermally conductive blocks, a thermal pad, and at least one liquid cooling tube. The cold plate body extends along a first direction. The floating thermally conductive blocks are disposed on a first side of the cold plate body and spaced apart along the first direction. The thermal pad is positioned between the floating thermally conductive blocks and the cold plate body, and the liquid cooling tube is positioned on a second side of the cold plate body. Each floating thermally conductive block contacts the optical module through the contact windows of the connectors. Heat generated by the optical module is transferred to the cold plate body via the floating thermally conductive blocks and the thermal pads, where it is removed by coolant in the liquid cooling tube, dissipating heat from the optical module. The floating thermally conductive blocks can float in a second direction perpendicular to the first direction, and the thermal pad can deform with the movement of the floating thermally conductive blocks, maintaining a tight fit with the floating thermally conductive blocks and the cold plate body. This ensures that the floating thermally conductive blocks maintain close contact with the optical module while dissipating heat from the optical module through liquid cooling. This reduces the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical module, improving heat dissipation efficiency and effectiveness. In one possible implementation, at least two connector groups are spaced apart along a second direction perpendicular to the first direction. Each connector in each connector group has a contact window, and each connector group is correspondingly provided with an optical module cold plate liquid cooling assembly. When at least two connector groups are spaced apart along the second direction, each connector group is provided with an optical module cold plate liquid cooling assembly, and each connector in each connector group is provided with a contact window. The liquid cooling assembly passes through the contact windows of each connector in the corresponding connector group and contacts the optical modules inserted into each connector. This allows for timely and rapid heat removal from all optical modules, achieving effective heat dissipation for each optical module.In one possible implementation, there is one board, and the connector group includes two inner connector groups and two outer connector groups. The two inner connector groups are connected to two outer surfaces of the board, respectively, while the two outer connector groups are located on the sides of the two inner connector groups facing away from the board. Both outer connector groups are electrically connected to the board. There are four optical module cold plate liquid cooling assemblies, each of which is located at a mounting side of a connector group. By electrically connecting four connector groups to a single board, the optoelectronic connection module has a larger number of connectors, allowing for a greater number of optical modules to be plugged in, thereby increasing the module's capacity and transmission power. Furthermore, since only one board is used, the module's control is simplified, resulting in higher signal transmission efficiency. In one possible implementation, each connector group installation case faces away from the board. The optical module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies. The two inner liquid cooling assemblies are located between the inner connector group and the outer connector group in each case, and the inner liquid cooling plates are configured to contact the optical modules inserted into the inner connector groups. The two outer liquid cooling assemblies are located in the case where the outer connector group faces away from the board, and the outer liquid cooling assemblies are configured to contact the optical modules inserted into the outer connector groups. By using the case where each connector group faces away from the board as the connector group installation case, each connector's contact window is located in the case where the connector group faces away from the board, and each liquid cooling assembly is installed in the case where the corresponding connector group faces away from the board, the board will not interfere with the connector's contact window or the installation space for the liquid cooling assembly, ensuring stable contact between the liquid cooling assembly and the optical module inserted into the connector. Furthermore, two inner liquid cooling assemblies are sandwiched between the inner connector group and the outer connector group in each example, while two outer liquid cooling assemblies are located on opposite sides of the outer connector group in each example. Each liquid cooling assembly generates pressure toward the board, ensuring reliable contact between the liquid cooling assembly and the optical module inserted into the connector group. The pressure generated by the liquid cooling assemblies in the two examples is balanced, ensuring balanced force across the entire optoelectronic connection module. In one possible embodiment, each connector in the outer connector group has a bracket that extends toward and connects to the board, and the outer liquid cooling assembly covers at least a portion of the bracket. Each connector in the outer connector group is connected to the board via the bracket, which increases the surface area of ​​each connector in the outer connector group. By having the outer liquid cooling assembly cover at least a portion of the bracket, the outer liquid cooling assembly has a larger heat conduction area, resulting in higher heat dissipation efficiency and better heat dissipation. Furthermore, the contact area between the outer liquid cooling component and the outer connector group is larger, and the outer liquid cooling component exerts greater pressure on the outer connector group, which can improve the overall stability and reliability of the optoelectronic connection module.In addition to the technical problems solved by the embodiments of the present disclosure, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems solved by the network switching device provided by the embodiments of the present disclosure, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the detailed description. BRIEF DESCRIPTION OF THE DRAWINGS To more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below represent some embodiments of the present disclosure. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. Figure 1 is a schematic structural diagram of a network switching device according to an embodiment of the present disclosure; Figure 2 is an exploded structural diagram of the network switching device in Figure 1; Figure 3 is a partial structural diagram of the network switching device in Figure 1; Figure 4 is a schematic structural diagram of an optoelectronic connection module according to an embodiment of the present disclosure; Figure 5 is a schematic structural diagram of the optoelectronic connection module according to an embodiment of the present disclosure with the mounting bracket removed; Figure 6 is an exploded structural diagram of the optoelectronic connection module in Figure 5 from one perspective; Figure 7 is an exploded structural diagram of the optoelectronic connection module in Figure 5 from another perspective; Figure 8 is a schematic structural diagram of an outer liquid cooling assembly according to an embodiment of the present disclosure from one perspective; Figure 9 is a schematic structural diagram of the outer liquid cooling assembly in Figure 8 from another perspective; Figure 10 is a partial cross-sectional structural diagram of the outer liquid cooling assembly in Figure 8; Figure 11 is a schematic structural diagram of an inner liquid cooling assembly according to an embodiment of the present disclosure from one perspective; Figure 12 is a schematic structural diagram of the inner liquid cooling assembly in Figure 11 from another perspective; Figure 13 is a partial cross-sectional structural diagram of the inner liquid cooling assembly in Figure 11. Explanation of Figure Symbols:

[0002] ]0-Network switching equipment;

[0003] 100-chassis;

[0004] 110-installation port;

[0005] 200 - optoelectronic connection module;

[0006] 210 - Board; 220 - Connector assembly; 220a - Inner connector assembly; 220b - Outer connector assembly; 230 - Liquid cooling assembly; 230a - Inner liquid cooling assembly; 230b - Outer liquid cooling assembly; 240 - Mounting rack;

[0007] 221 - Connector; 231 - Liquid cooling tube; 232 - Cold plate body; 233 - Floating heat conducting block; 234 - Thermal pad; 235 - Elastic member; 241 - Main frame; 242 - Front frame;

[0008] 2211 - Contact window; 2212 - Bracket; 2321 - Main support plate; 2322 - Stop assembly; 2322a - Stop member; 2323 - Floating groove; 2421 - Grip;

[0009] 23221 - Main body; 23222 - Stopper;

[0010] 300 - control module;

[0011] 310 - control board; 320 - baseboard management controller; 330 - bus;

[0012] 400 - heat dissipation module;

[0013] 410 - Fan. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The terms used in the embodiments of this disclosure are intended only to explain the specific embodiments of this disclosure and are not intended to limit this disclosure. An optical module, consisting of optoelectronic components, functional circuits, and optical interfaces, is a device that performs photoelectric and electro-optical conversion. An optical module includes a transmitter and a receiver. The transmitter converts electrical signals into optical signals, which are then transmitted via optical fibers. The receiver then converts the optical signals back into electrical signals. As described in related art, air cooling is currently commonly used to dissipate heat from optical modules. A window is provided at the top of the optical module connector on the switch, allowing the optical module inserted into the optical module connector to partially contact the heat sink. This allows heat from the optical module to be transferred to the heat sink's fins, where air flowing over the fins dissipates the heat to the ambient air. However, with the increasing power consumption and number of optical modules installed, air cooling, whose overall thermal resistance is approaching its limit, is gradually failing to meet the heat dissipation requirements of optical modules. Furthermore, because the optical module and the heat sink are fixedly mated and have a small contact area, the thermal resistance between the optical module and the heat sink is high, resulting in temperature rise. Furthermore, when there are a large number of optical modules and the installation space is relatively compact, especially when optical modules are arranged in multiple rows, the installation space for the heat sink is limited, resulting in low heat dissipation efficiency and poor heat dissipation. In view of this, embodiments of the present disclosure provide an optical module cold plate liquid cooling assembly and a network switching device. The optical module cold plate liquid cooling assembly includes a cold plate body, multiple floating heat conductive blocks, a thermal pad, and at least one liquid cooling tube. The cold plate body extends along a first direction. The floating heat conductive blocks are disposed on a first side of the cold plate body and spaced apart along the first direction. The thermal pad is affixed between the floating heat conductive blocks and the cold plate body. The liquid cooling tube is disposed on a second side of the cold plate body. With each floating thermal block in contact with each optical module, heat generated by the optical module is transferred to the cold plate body via the floating thermal block and thermal pad. The heat is then carried away by the coolant in the liquid cooling tube, dissipating heat from the optical module. The floating thermal block can float in a second direction perpendicular to the first direction, and the thermal pad can deform with the movement of the floating thermal block, maintaining a tight fit with the floating thermal block and the cold plate body. This ensures that the floating thermal block maintains close contact with the optical module while utilizing liquid cooling to dissipate heat from the optical module. This reduces the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical module, improving heat dissipation efficiency and effectiveness. To further clarify the objectives, technical solutions, and advantages of the embodiments of the present disclosure, the technical solutions of the embodiments of the present disclosure will be described below in detail, in conjunction with the accompanying drawings. It should be noted that the described embodiments represent only a portion of the embodiments of the present disclosure, and are not exhaustive.All other embodiments devised by persons of ordinary skill in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure. The embodiments of this disclosure provide a network switching device, which can be any type of switch, such as an access layer switch, an aggregation layer switch, or a core layer switch. For example, the network switching device can be a switch with a height of 4U. U represents a unit of external dimensions, with 1U equal to 4.445 centimeters and 4U equal to 17.78 centimeters. Furthermore, the network switching device of the embodiments of this disclosure can be applied to any scenario requiring a network system, such as a data center. The following describes the network switching device and optical module cold plate liquid cooling assembly of the embodiments of this disclosure in detail, taking the aggregation layer switch used in a data center as an example. Figure 1 is a schematic structural diagram of the network switching device provided by the embodiments of this disclosure. Figure 2 is an exploded structural diagram of the network switching device in Figure 1. Figure 3 is a partial structural diagram of the network switching device in Figure 1. As shown in Figures 1 and 2, the network switching device 10 of the embodiments of this disclosure can include a chassis 100 and an optical / electrical connection module 200. The chassis 100 serves as the mounting base, upon which all other components of the network switching device 10 can be installed. This allows the network switching device 10 to be assembled into a single unit, facilitating its movement and placement within a data center. The optical / electrical connection module 200 is mounted within the chassis 100. This module is used to connect an optical module (not shown) to the network switching device 10, enabling data transmission between the network switching device 10 and other network devices (such as servers or transceivers). The optical / electrical connection module 200 comprises at least one board 210 and several connectors 221, each located on the surface of the board 210. The connectors 221 are designed to connect to the optical modules, enabling them to connect to the network switching device 10. The board 210 serves as a support for the connectors 221, securing them and providing electrical signals to them. The end of the connector 221 facing the outside of the chassis 100 serves as an interface end. The optical module is inserted into the interface end of the connector 221 to establish an electrical connection between the optical module and the optoelectronic connection module 200. The board 210 may be provided with a chip and provided with electrical channels. The electrical channels are electrically connected to the chip, and each connector 221 provided on the board 210 is electrically connected to the electrical channels. In this way, signals can be transmitted between the chip and each connector 221 via the electrical channels.When the optical module is inserted into the connector 221, signals can be transmitted between the optical module and the optoelectronic connection module 200. Exemplarily, the optoelectronic connection module 200 may include a board 210, with the multiple connectors 221 disposed on the board 210, and electrical channels connected to the multiple connectors 221 arranged on the board 210. Alternatively, the optoelectronic connection module 200 may include two or more boards 210, with the multiple connectors 221 disposed on each board 210, and electrical channels connected to each connector 221 arranged on the corresponding board 210. The board 210 may be a printed circuit board (PCB), which may include a metal conductive layer that forms an electrical channel connecting the chip and the connector 221. The metal conductive layer includes, but is not limited to, conductive materials such as copper, aluminum, copper alloy, and aluminum alloy, and this embodiment does not impose specific limitations on this. As shown in FIG2 , in this embodiment, the optical / electrical connection module 200 can be configured as a removable switch module (RSM). The entire optical / electrical connection module 200 can be removably mounted on the chassis 100 as a standalone module. With this configuration, the network switching device 10 can be designed with a universal chassis 100 that accommodates different types of optical / electrical connection modules 200. This allows the network switching device 10 to be replaced with different optical / electrical connection modules 200 based on different application scenarios without the need to design and produce additional chassis 100, thereby reducing the design, production, and testing costs of the chassis 100. The different types of optical / electrical connection modules 200 may refer to modules 200 having different numbers and models of connectors 221, and different optical / electrical connection modules 200 may have different transmission powers. One end of the chassis 100 may be open, forming the mounting opening 110 for the optical / electrical connection module 200. The optical / electrical connection module 200 can be installed within the chassis 100 through the mounting opening 110. The interface ends of the connectors 221 on the optical / electrical connection module 200 are exposed outside the chassis 100, facilitating plugging of the optical module with the interface ends of the connectors 221. For example, if the chassis 100 is a rectangular parallelepiped, the mounting opening 110 of the chassis 100 can be located at one end of the chassis 100 in its longitudinal direction, and the optical / electrical connection module 200 can be installed at one end of the chassis 100 in its longitudinal direction. As shown in FIG. 3 , the network switching device 10 may further include a control module 300, which can be disposed within the chassis 100.The optical / electrical connection module 200 can be electrically connected to the control module 300 so that the control module 300 can control the operation of the optical / electrical connection module 200. The board 210 of the optical / electrical connection module 200 can be electrically connected to the control module 300, enabling signal transmission between the control module 300 and each connector 221 via the board 210. The control module 300 can include a control board 310, a baseboard management controller (BMC) 320, a bus 330, and other components disposed on the control board 310. The control board 310 can be, for example, a printed circuit board. Furthermore, the network switching device 10 can also include a heat dissipation module 400. The heat dissipation module 400 is primarily used to dissipate heat from heat-generating components within the chassis 100, and can also be used to dissipate heat from the optical / electrical connection module 200 to ensure normal operation of the network switching device 10. Exemplarily, the heat dissipation module 400 can include at least one fan 410. For example, as shown in FIG. 3 , the heat dissipation module 400 includes three fans 410. The high-speed rotation of the fan 410 dissipates heat from the network switching device 10 to the external environment in a timely and effective manner. The heat dissipation module 400 can be positioned near the edge of the chassis 100, or in other words, at the edge of the chassis 100. This facilitates communication between the heat dissipation module 400 and the external environment, dissipating heat from the network switching device 10. Furthermore, since the heat dissipation module 400 is located at the edge of the chassis 100, a larger space can be left inside the chassis 100, facilitating the layout of the chassis 100. For example, the heat dissipation module 400 can be positioned opposite the optoelectronic connection module 200, with the heat dissipation module 400 and the optoelectronic connection module 200 located at opposite ends of the chassis 100. Figure 4 is a schematic diagram of the structure of an optoelectronic connection module provided in an embodiment of the present disclosure. As shown in Figure 4, in the optoelectronic connection module 200 of this embodiment, the connectors 221 are arranged in a regular pattern in the form of connector groups 220. The optoelectronic connection module 200 includes at least one connector group 220. Each connector group 220 includes multiple connectors 221 arranged sequentially along a first direction (the Y direction in the figure). Each connector 221 is electrically connected to the board 210. When the optoelectronic connection module 200 includes two or more connector groups 220, the connector groups 220 are arranged at intervals along a second direction (the Z direction in the figure), which is perpendicular to the first direction.Taking the example of an optoelectronic connection module 200 installed at one end of the chassis 100 in the longitudinal direction, the first direction in which the connectors 221 in each connector group 220 are sequentially arranged can be the width direction of the chassis 100, and the second direction in which the connector groups 220 are alternately arranged can be the height direction of the chassis 100. When multiple connector groups 220 are spaced apart along the second direction in the optoelectronic connection module 200, the optoelectronic connection module 200 can include only one board 210, with all connector groups 220 connected to this board 210. Alternatively, the optoelectronic connection module 200 can include two or more board 210, with all connector groups 220 connected to different board 210. Continuing with FIG. 4 , to form the optoelectronic connection module 200 as an independent, detachable module, the optoelectronic connection module 200 can further include a mounting bracket 240. The aforementioned board 210 can be fixedly connected to the mounting bracket 240. The board 210, the connectors 221 on the board 210, and the mounting bracket 240 are assembled together to form the optoelectronic connection module 200. The mounting bracket 240 allows the optical / electrical connection module 200 to be assembled into a standalone structure. In particular, when the optical / electrical connection module 200 includes multiple boards 210, the mounting bracket 240 can assemble the boards 210 into a single unit. Furthermore, the mounting bracket 240 can be used to assemble the optical / electrical connection module 200 with the chassis 100. In other words, by connecting the mounting bracket 240 to the mounting opening 110 of the chassis 100, the optical / electrical connection module 200 can be mounted on the chassis 100 to form the network switching device 10. For example, the mounting bracket 240 can be provided with a gripping portion 2421, which, for example, extends from a surface of the optical / electrical connection module 200 facing away from the interior of the chassis 100. An operator can grasp the gripping portion 2421 on the mounting bracket 240 to move the optical / electrical connection module 200, facilitating installation and removal of the optical / electrical connection module 200 from the chassis 100. For example, the mounting frame 240 may include a main frame 241 and a front frame 242. The main frame 241 may be positioned corresponding to the board 210, and the board 210 may be fixedly connected to the main frame 241. When the optoelectronic connection module 200 includes multiple boards 210, the main frame 241 secures the multiple boards 210 together to form a monolithic structure. The front frame 242 may be connected to a side of the main frame 241 facing away from the interior of the chassis 100 and exposed within the mounting opening 110 of the chassis 100. The interface end of each connector 221 may extend beyond the front end of the board 210 and be received within a mounting slot (not shown) formed in the front frame 242.The front frame 242 can be positioned at the front end of the board 210 to protect it. The front frame 242 surrounds the periphery of the interface ends of each connector 221, shielding and protecting them and enhancing the appearance of the optoelectronic connection module 200. The grip 2421 can be provided on the front frame 242. Figure 5 illustrates the structure of the optoelectronic connection module, excluding the mounting bracket, according to an embodiment of the present disclosure. Figure 6 illustrates an exploded structural view of the optoelectronic connection module in Figure 5 from one perspective. Figure 7 illustrates an exploded structural view of the optoelectronic connection module in Figure 5 from another perspective. As shown in Figure 5, to maintain a suitable operating temperature for the optical module, in addition to the heat dissipation module 400 installed in the chassis 100, this embodiment also utilizes liquid cooling to dissipate heat from the optical module, thereby removing heat generated by the module and maintaining its operating temperature within a suitable range. Liquid cooling is used to dissipate heat from the optical module. When the optical module is inserted into the connector 221 of the optoelectronic connection module 200, coolant is used to remove heat generated by the optical module, thereby dissipating heat and reducing the temperature of the optical module. Specifically, the optoelectronic connection module 200 also includes at least one optical module cold plate liquid cooling assembly (hereinafter referred to as the liquid cooling assembly). The liquid cooling assembly 230 is provided in correspondence with the connector group 220 and dissipates heat from each connector 221 in the corresponding connector group 220. For the connector group 220 equipped with the liquid cooling assembly 230, when the optical module is inserted into the connector 221 of the connector group 220, the liquid cooling assembly 230 can contact the optical module. Heat generated by the optical module is transferred to the liquid cooling assembly 230 and removed by the coolant flowing in the liquid cooling assembly 230, thereby dissipating heat from the optical module. The liquid cooling assembly 230 is provided in a direction extending along the connector group 220 and can extend along the direction of extension of the connector group 220. When the connectors 221 in the connector group 220 are arranged sequentially along the first direction, the connector group 220 extends in the first direction. In this case, the liquid cooling assembly 230 can also extend in the first direction. For example, if the optoelectronic connection module 200 is disposed at one end of the chassis 100 in the longitudinal direction, when the connector group 220 extends in the width direction of the chassis 100, the liquid cooling assembly 230 can also extend in the width direction of the chassis 100. Furthermore, the liquid cooling assembly 230 can be disposed at one end of the connector group 220 in the height direction of the chassis 100.It should be noted that to reserve sufficient installation space for the liquid cooling assembly 230 and ensure that the liquid cooling assembly 230 can be installed in one side of the connector assembly 220, in this embodiment, the connector 221 can be mounted on the board 210 along the board surface of the board 210. In other words, the extension direction of the connector 221 can be parallel to the board surface of the board 210, and the insertion and removal direction of the optical module is parallel to the board surface of the board 210. In this way, the board 210 does not limit the space on both sides of the connector assembly 220, and the side of the connector assembly 220 has sufficient space to install the liquid cooling assembly 230. For ease of description, this embodiment defines the side where the liquid cooling assembly 230 is located as the installation side of the connector assembly 220. As shown in FIG6 or FIG7 , for a connector group 220 equipped with a liquid cooling assembly 230, each connector 221 in the connector group 220 may have a contact window 2211, located on the mounting surface of the connector group 220, to ensure that the liquid cooling assembly 230 can contact the optical module inserted into the connector 221. The contact window 2211 is located on the mounting surface of the connector group 220. The liquid cooling assembly 230 passes through the contact window 2211 of each connector 221 and contacts the optical module inserted into the connector 221. When the optoelectronic connection module 200 has multiple connector groups 220, a liquid cooling assembly 230 may be provided for each connector group 220, with each liquid cooling assembly 230 contacting the optical module inserted into each connector group 220. In this way, all optical modules inserted into the optoelectronic connection module 200 are directly in contact with the liquid cooling assembly 230, which can promptly and quickly remove heat from the optical modules and provide effective heat dissipation for each optical module. Specifically, when two or more connector groups 220 are spaced apart along the second direction in the optoelectronic connection module 200, a liquid cooling assembly 230 is provided on the mounting surface of each connector group 220. Each connector 221 in each connector group 220 has a contact window 2211 located on the mounting surface of the connector group 220. The liquid cooling assembly 230 passes through the contact window 2211 of each connector 221 and contacts the optical module inserted into each connector 221. Continuing with FIG. 6 or FIG. 7 , in a specific embodiment, the optoelectronic connection module 200 may include one board 210 and four connector groups 220.The four connector groups 220 may include two inner connector groups 220a and two outer connector groups 220b. The two inner connector groups 220a are connected to two surfaces of the board 210, respectively. The two outer connector groups 220b are located on one side of the inner connector groups 220a facing away from the board 210. Both outer connector groups 220b are electrically connected to the board 210. By electrically connecting four connector groups 220 to a single board 210, a larger number of connectors 221 can be provided in the optoelectronic connection module 200. This allows for a greater number of optical modules to be plugged into the optoelectronic connection module 200, thereby increasing the capacity and transmission power of the optoelectronic connection module 200. Furthermore, since only one board 210 is provided, control of the optoelectronic connection module 200 by the control module 300 only needs to be electrically connected to the board 210. This simplifies the control method and improves signal transmission efficiency. Because the outer connector assembly 220b is located in a position opposite the inner connector assembly 220a from the board 210, to achieve connection between the outer connector assembly 220b and the board 210, the outer connector assembly 220b can be connected to the board 210 via a bracket 2212. Each connector 221 in the outer connector assembly 220b has a bracket 2212. The bracket 2212 of each connector 221 extends toward the board 210, and the connector 221 is connected to the board 210 by means of the bracket 2212. Since the end of the connector 221 extending outward from the board 210 is its interface end, to prevent the bracket 2212 from obstructing the interface end of the connector 221, the bracket 2212 can be connected to the end of the connector 221 facing the board 210. In this case, when a liquid cooling assembly 230 is provided between the outer connector group 220b and the inner connector group 220a, the liquid cooling assembly 230 can be positioned at the front end of the bracket 2212 of each connector 221 in the outer connector group 220b, so that the liquid cooling assembly 230 corresponds to the main portion of the connector 221, ensuring contact between the liquid cooling assembly 230 and the optical module inserted into the connector 221. The number of liquid cooling assemblies 230 corresponding to the connector group 220 can be four. Each liquid cooling assembly 230 is positioned at the mounting point 1 of each connector group 220, and the liquid cooling assembly 230 can be in close contact with the corresponding connector group 220, so that the liquid cooling assembly 230 can contact the optical module inserted into each connector 221 of the connector group 220.For a single connector set 220 of a board 210, a gap exists between the outer connector set 220b and the inner connector set 220a to facilitate installation of the liquid cooling assembly 230 between the outer connector set 220b and the inner connector set 220a. In some examples, each connector set 220 can be installed in a position where the connector set 220 faces away from the board 210. In other words, the contact windows 2211 on the connectors 221 in each connector set 220 are located in the position where the connector set 220 faces away from the board 210. The contact windows 2211 on the connectors 221 of the two inner connector sets 220a face away from each other and are both located in the position where the connector set 220 faces away from the board 210. In this way, the liquid cooling assemblies 230 corresponding to the two inner connector groups 220a can be installed on both sides of the board 210. The board 210 does not interfere with the liquid cooling assemblies 230, and sufficient space can be reserved between the inner connector group 220a and the outer connector group 220b in the same example for the liquid cooling assemblies 230. Furthermore, the board 210 does not interfere with the contact windows 2211 on the connectors 221 of the inner connector group 220a. The contact windows 2211 are fully exposed on the side of the connector 221 facing away from the board 210, ensuring stable contact between the liquid cooling assemblies 230 and the optical module inserted into the connector 221. The contact windows 2211 on the connectors 221 of the two outer connector groups 220b face away from each other. The contact windows 2211 on the connectors 221 of the outer connector group 220b face the same direction as the contact windows 2211 on the connector 221 of the inner connector group 220a in the same embodiment. Thus, the liquid cooling assembly 230 corresponding to the two outer connector groups 220b can be installed in each embodiment, where the outer connector group 220b faces away from the board 210. For ease of explanation, in this embodiment, the liquid cooling assembly 230 corresponding to the inner connector group 220a is defined as the inner liquid cooling assembly 230a. The inner liquid cooling assembly 230a is located between the inner connector group 220a and the outer connector group 220b in the same embodiment. The liquid cooling assembly 230 corresponding to the outer connector group 220b is defined as an outer liquid cooling assembly 230b. This outer liquid cooling assembly 230b is located on one side of the outer connector group 220b, facing away from the inner connector group 220a of the same side. In this arrangement, the two inner liquid cooling assemblies 230a are sandwiched between the inner connector group 220a and the outer connector group 220b of each side, and the two outer liquid cooling assemblies 230b are located on opposite sides of the outer connector group 220b of each side.The inner liquid-cooling assembly 230a can be clamped between the inner connector assembly 220a and the outer connector assembly 220b of the same example, while the outer liquid-cooling assembly 230b can be in close contact with the outer connector assembly 220b. Both the inner liquid-cooling assembly 230a and the outer liquid-cooling assembly 230b of the same example generate pressure toward the board 210, ensuring reliable contact between the liquid-cooling assembly 230 and the optical module inserted into the corresponding connector assembly 220. Furthermore, the pressure generated by the two liquid-cooling assemblies 230 is balanced, ensuring force balance across the entire optoelectronic connection module 200 and improving its stability and reliability. When the connectors 221 in the outer connector assembly 220b are connected to the board 210 via the brackets 2212, the outer liquid-cooling assembly 230b can cover at least a portion of the brackets 2212. Because the bracket 2212 is an additional component of the connector 221, it increases the surface area of ​​each connector 221 in the outer connector group 220b. Consequently, the outer liquid-cooling assembly 230b can be larger than the inner liquid-cooling assembly 230a. This provides a larger heat-conducting area for the outer liquid-cooling assembly 230b, resulting in higher heat dissipation efficiency and effectiveness. Furthermore, the outer liquid-cooling assembly 230b, located in the outermost layer, has a larger contact area with the outer connector group 220b, exerting greater pressure on the outer connector group 220b. This allows for closer contact between the outer liquid-cooling assembly 230b and the optical module inserted into the connector 221, resulting in greater overall stability and reliability for the optoelectronic connection module 200. The following describes the liquid-cooling assembly 230 in the optoelectronic connection module 200 in detail. Figure 8 is a schematic structural diagram of the outer liquid-cooling assembly according to an embodiment of the present disclosure from one perspective. Figure 9 is a schematic structural diagram of the outer liquid cooling assembly in Figure 8 from another perspective. Figure 10 is a partial cross-sectional structural diagram of the outer liquid cooling assembly in Figure 8. As shown in Figures 8 and 9, the outer liquid cooling assembly 230b includes a liquid cooling plate and at least one liquid cooling tube 231. One surface of the liquid cooling plate faces the corresponding outer connector group 220b and is configured to contact the optical modules inserted into the connectors 221 in the outer connector group 220b. Liquid cooling tubes 231 are provided on the other surface of the liquid cooling plate to provide space for the flow of coolant. Heat generated by the optical module is transferred to the liquid cooling plate, which then transfers the heat to the liquid cooling tubes 231. The coolant in the liquid cooling tubes 231 exchanges heat with the liquid cooling plate, absorbing the heat and dissipating heat from the optical module.As shown in Figure 9 , in some embodiments, the outer liquid-cooling assembly 230b may include a liquid-cooling tube 231. This liquid-cooling tube 231 may extend along the first direction of extension of the liquid-cooling plate and pass through both ends of the liquid-cooling plate. This allows the liquid-cooling tube 231 to pass through all regions along the extension direction of the liquid-cooling plate, allowing heat from each region of the liquid-cooling plate to be quickly transferred to the liquid-cooling tube 231. This improves the heat dissipation efficiency of the liquid-cooling assembly 230 and ensures uniform heat dissipation within the liquid-cooling assembly 230. For example, the liquid-cooling tube 231 may extend along a wavy line from one end of the liquid-cooling plate to the other end of the liquid-cooling plate in the first direction of extension. This allows the liquid-cooling tube 231 to extend further along the liquid-cooling plate and evenly cover the center and edges of the liquid-cooling plate. This results in higher and more uniform heat transfer between the liquid-cooling plate and the liquid-cooling tube 231, improving the heat dissipation efficiency and effectiveness of the outer liquid-cooling assembly 230b. In other embodiments, the outer liquid-cooling assembly 230b may include two or more liquid-cooling tubes 231. Each liquid-cooling tube 231 may be arranged sequentially so that all liquid-cooling tubes 231 cover all areas along the first direction of extension of the liquid-cooling plate, ensuring heat dissipation of the outer liquid-cooling assembly 230b. As shown in FIG10 , the liquid-cooling plate includes a cold plate body 232, multiple floating heat-conducting blocks 233, and thermal pads 234. The cold plate body 232 is the main support structure of the liquid-cooling plate. It extends along the first direction, i.e., the direction of extension of the connector assembly 220. The two sides of the cold plate body 232 in the thickness direction are respectively a first side and a second side. The multiple floating heat-conducting blocks 233 are all arranged on the first side of the cold plate body 232, and the floating heat-conducting blocks 233 are spaced apart along the first direction. Each floating thermal block 233 corresponds to a connector 221 in the connector assembly 220. The floating thermal block 233 is designed to pass through the contact window 2211 of the connector 221 and contact the optical module inserted into the connector 221. A thermal pad 234 is disposed between the cold plate body 232 and the floating thermal block 233. Two surfaces of the thermal pad 234 contact the cold plate body 232 and the floating thermal block 233, respectively. The liquid cooling tube 231 is disposed on the second side of the cold plate body 232. The floating thermal block 233 can float in a second direction, perpendicular to the first direction, which can be the thickness direction of the liquid cold plate. The thermal pad 234, disposed between the floating thermal block 233 and the cold plate body 232, is elastic and deforms with the movement of the floating thermal block 233, ensuring that both sides of the thermal pad 234 remain in close contact with the cold plate body 232 and the floating thermal block 233.This configuration creates significant pressure between the floating thermal block 233 and the optical module inserted into the connector 221, ensuring close contact between the floating thermal block 233 and the optical module. This reduces the thermal resistance between the liquid cooling plate and the optical module, improving the heat dissipation efficiency and effectiveness of the liquid cooling assembly 230. Furthermore, because the floating thermal block 233 can float up and down, the liquid cooling plate can accommodate optical modules of varying models and sizes, expanding the application range of the liquid cooling assembly 230 and enhancing its versatility. Furthermore, by disposing a compressible thermal pad 234 between the floating thermal block 233 and the cold plate body 232, the floating thermal block 233, the thermal pad 234, and the cold plate body 232 are in close contact, forming a stable and reliable heat conduction path. This ensures that heat generated by the optical module is sequentially conducted through the floating thermal block 233 and the thermal pad 234 to the cold plate body 232, and then from the cold plate body 232 to the liquid cooling tube 231, where it is ultimately removed by the coolant within the liquid cooling tube 231. By ensuring that the floating thermal block 233 is in contact with the optical module within the connector 221 and that the thermal pad 234 is positioned between the cold plate body 232 and the floating thermal block 233, the floating thermal block 233 has a high structural strength. Even if the optical module is repeatedly plugged in and out over a long period of time, the floating thermal block 233 will not be affected, ensuring stable and reliable contact between the floating thermal block 233 and the optical module. Furthermore, the cold plate body 232 and the floating heat conducting blocks 233 enclose the thermal pad 234, protecting it and extending its service life. In one embodiment, the liquid cold plate may include a single, integral thermal pad 234, with all floating heat conducting blocks 233 in contact with it. The movement of each floating heat conducting block 233 causes deformation of the corresponding portion of the thermal pad 234. In another embodiment, the liquid cold plate may include multiple thermal pads 234, each corresponding to a floating heat conducting block 233, with a thermal pad 234 positioned between each floating heat conducting block 233 and the cold plate body 232. In this embodiment, the cold plate body 232 and the floating heat conducting blocks 233 may be metal components to ensure the thermal conductivity of the cold plate body 232 and the floating heat conducting blocks 233, while also meeting the overall structural strength requirements of the liquid cold plate and ensuring its reliability. For example, the cold plate body 232 can be made of a metal material such as aluminum, aluminum alloy, titanium, titanium alloy, or alloy steel. The floating heat conductive block 233 can be made of a metal material such as copper or aluminum. The floating heat conductive block 233 can be, for example, a copper plate, which can improve the thermal conductivity of the floating heat conductive block 233.The liquid cooling tube 231 can also be made of a metal material to improve the heat transfer efficiency between the cold plate body 232 and the liquid cooling tube 231. The liquid cooling tube 231 also has high structural strength and good reliability. For example, the liquid cooling tube 231 can be a metal tube such as a copper tube or an aluminum tube. Since the thermal pad 234 needs to be elastic and compressible, it can be a flexible pad made of a flexible material. For example, the material used to make the thermal pad 234 can be polyamide (PA) or polypropylene (PP). Continuing with FIG10 , in addition to providing the thermal pad 234 between the floating heat conductive blocks 233 and the cold plate body 232, the liquid cold plate can also include an elastic member 235 connected between each floating heat conductive block 233 and the cold plate body 232. The elastic member 235 can extend and retract along the aforementioned second direction to drive the floating heat conductive block 233 to float along the second direction. The elastic member 235 has a high elastic force and strong elastic deformation capability. Using the elastic member 235 as the primary driving structure can reliably drive the floating heat conductive block 233 to float. Furthermore, the elastic force of the elastic member 235 acts on the optical module through the floating heat conductive block 233, increasing the pressure between the floating heat conductive block 233 and the optical module, ensuring close contact between the floating heat conductive block 233 and the optical module, reducing the contact thermal resistance between the floating heat conductive block 233 and the optical module, and improving the heat dissipation efficiency and effectiveness of the liquid cooling assembly 230. In some examples, two elastic members 235 can be connected between the floating heat conductive block 233 and the cold plate body 232, with the two elastic members 235 located at either end of the floating heat conductive block 233. In this way, the two elastic members 235 can exert a strong elastic force on the floating thermal block 233, increasing the pressure between the floating thermal block 233 and the optical module, ensuring close contact between the floating thermal block 233 and the optical module. Furthermore, the two elastic members 235 exert pressure on both ends of the floating thermal block 233, ensuring the balance of the floating thermal block 233 and good contact between the floating thermal block 233 and the optical module. In this case, the thermal pad 234 can be placed between the two elastic members 235. The large space between the two elastic members 235 at both ends of the floating thermal block 233 allows sufficient space for the thermal pad 234, ensuring that the thermal pad 234 has sufficient surface area. Furthermore, the thermal pad 234 is in close contact with the main body of the floating thermal block 233. This allows the thermal pad 234 to quickly and completely transfer heat from the floating thermal block 233 to the cold plate body 232.Continuing with FIG. 10 , in some embodiments, the cold plate body 232 may include a main support plate 2321 and a stopper assembly 2322. The main support plate 2321 is the main structure of the cold plate body 232 and may extend along the aforementioned first direction. The floating heat conductive block 233 is located on a first side of the main support plate 2321, and the liquid cooling tube 231 is located on a second side of the main support plate 2321. The stopper assembly 2322 is connected to the outer side of the main support plate 2321. The stopper assembly 2322 and the main support plate 2321 together form a floating groove 2323. The floating groove 2323 may be located on both sides of the main support plate 2321, with the notches of the two floating grooves 2323 facing each other. The ends of the floating heat conductive block 233 are inserted into the two floating grooves 2323 to limit the movement of the floating heat conductive block 233. The stopper assembly 2322 and the main support plate 2321 together form the cold plate body 232. The floating groove 2323 formed between the two forms a mounting base for the floating heat conductive block 233, securing the floating heat conductive block 233 to the cold plate body 232 and limiting its travel range. This allows the main support plate 2321 to be generally flat, facilitating its production and processing. This also facilitates assembly of the liquid cold plate and reduces costs associated with its processing and assembly. The stopper assembly 2322 may include stoppers 2322a connected to two opposing sides of the main support plate 2321. The stopper assembly 2322 does not cover the second side of the main support plate 2321, leaving it exposed. In this way, the two stoppers 2322a and the main support plate 2321 together form two floating grooves 2323, allowing the ends of the floating heat conductive block 233 to be inserted into the two floating grooves 2323. This also facilitates installation of the liquid cooling tube 231 on the second side of the main support plate 2321, shortens the overall heat conduction path of the liquid cooling assembly 230, and improves heat conduction efficiency. For example, taking a single stopper 2322a on the main support plate 2321 as an example, multiple stoppers 2322a can be spaced apart along the first direction in which the main support plate 2321 extends (see FIG8 ), with each stopper 2322a corresponding to at least one floating heat conductive block 233. Multiple stoppers 2322a can be provided along the first direction in which the main support plate 2321 extends to support and secure all floating heat conductive blocks 233, with one stopper 2322a corresponding to only some of the floating heat conductive blocks 233. In this way, it is convenient to assemble the floating heat-conducting blocks 233 and the stoppers 2322a on the main support plate 2321, and it is convenient to disassemble and replace each floating heat-conducting block 233.Referring to Figure 10 , the stopper 2322a may include a main body 23221 and a stopper 23222. The main body 23221 is the main structure of the stopper 2322a, and the stopper 2322a is connected to the main support plate 2321 via the main body 23221. The stopper 23222 may be located at the end of the main body 23221, with a gap between the stopper 23222 and the main support plate 2321. The stopper 23222, the main body 23221, and the main support plate 2321 collectively form a floating groove 2323. The stopper 23222 is preferably located at the end of the floating heat conductive block 233. As for the outer liquid-cooling assembly 230b, due to the larger area, specifically the width, of the liquid cooling plate of the outer liquid-cooling assembly 230b, the side of the main support plate 2321 facing the board 210 can extend beyond the floating heat conductive block 233. In this case, the stopper 2322a located on the side of the main support plate 2321 facing away from the board 210 can be connected to the outer wall of the main support plate 2321. The main body 23221 of the stopper 2322a extends along the outer wall of the main support plate 2321, and the stopper 23222 of the stopper 2322a can be perpendicular to the main body 23221. A stopper 2322a located on the main support plate 2321 facing the board 210 can be connected to the surface of the main support plate 2321. The main body 23221 of the stopper 2322a extends along the surface of the main support plate 2321, and the stopper 23222 of the stopper 2322a can be parallel to the main body 23221. Figure 11 is a schematic structural diagram of the inner liquid cooling assembly provided by an embodiment of the present disclosure from one perspective. Figure 12 is a schematic structural diagram of the inner liquid cooling assembly in Figure 11 from another perspective. Figure 13 is a partial cross-sectional structural diagram of the inner liquid cooling assembly in Figure 11. As shown in Figures 11 and 12, similar to the outer liquid cooling assembly 230b, the inner liquid cooling assembly 230a can also include a liquid cooling plate and at least one liquid cooling tube 231. One surface of the liquid cooling plate faces the corresponding inner connector assembly 220a. This surface of the liquid cooling plate is configured to contact the optical modules inserted into the connectors 221 of the inner connector assembly 220a. A liquid cooling tube 231 is disposed on another surface of the liquid cooling plate, providing a flow space for the coolant. As shown in Figure 13 , similar to the liquid cooling plate of the outer liquid cooling assembly 230b, the liquid cooling plate of the inner liquid cooling assembly 230a also includes a cold plate body 232, a plurality of floating heat conductive blocks 233, and a thermal pad 234. The plurality of floating heat conductive blocks 233 are disposed on the first side of the cold plate body 232, and the floating heat conductive blocks 233 are spaced apart along the first direction.Each floating thermal block 233 corresponds to a connector 221 in the connector assembly 220. The floating thermal block 233 is designed to pass through the contact window 2211 of the connector 221 and contact the optical module inserted into the connector 221. A thermal pad 234 is disposed between the cold plate body 232 and the floating thermal block 233. Two surfaces of the thermal pad 234 contact the cold plate body 232 and the floating thermal block 233, respectively. The liquid cooling tube 231 is disposed on the second side of the cold plate body 232. The floating thermal block 233 can float in a second direction. The thermal pad 234, disposed between the floating thermal block 233 and the cold plate body 232, is elastic and deforms with the movement of the floating thermal block 233, ensuring that both sides of the thermal pad 234 remain in close contact with the cold plate body 232 and the floating thermal block 233. Furthermore, the liquid cooling plate of the inner liquid cooling assembly 230a may also include an elastic member 235 connected between each floating heat conductive block 233 and the cold plate body 232. For example, two elastic members 235 may be connected between the floating heat conductive block 233 and the cold plate body 232, with the two elastic members 235 located at either end of the floating heat conductive block 233. A thermal pad 234 may be disposed between the two elastic members 235. This description will not be repeated here. Furthermore, referring again to FIG. 13 , similar to the cold plate body 232 of the outer liquid cooling assembly 230b, the cold plate body 232 of the inner liquid cooling assembly 230a may also include a main support plate 2321 and a stopper assembly 2322. The stopper assembly 2322 is connected to the outer edge of the main support plate 2321, and the stopper assembly 2322 and the main support plate 2321 together form a floating groove 2323. The stopper assembly 2322 may include two stoppers 2322a connected to opposite sides of the main support plate 2321, with the second side of the main support plate 2321 exposed. For example, a single stopper 2322a on the main support plate 2321 may be spaced apart along the first direction of extension of the main support plate 2321 (see FIG11 ), with each stopper 2322a corresponding to at least one floating heat conductive block 233. The stopper 2322a may include a main body 23221 and a stopper 23222 connected to each other. The stopper 23222, the main body 23221, and the main support plate 2321 collectively define a floating groove 2323. The stopper 23222 is preferably located at the end of the floating heat conductive block 233. Unlike the outer liquid cooling assembly 230b, since the liquid cooling plate of the inner liquid cooling assembly 230a has a smaller area, specifically a smaller width, the width of the main support plate 2321 and the width of the floating heat conducting block 233 can be roughly the same.In this case, the stoppers 2322a on both sides of the main support plate 2321 can be connected to the side walls of the main support plate 2321. The main bodies 23221 of the two stoppers 2322a can extend along the corresponding side walls of the main support plate 2321, and the stopper portions 23222 of the two stoppers 2322a can be perpendicular to the main bodies 23221. In the description of the embodiments of the present disclosure, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present disclosure based on specific circumstances. The terms "first," "second," "third," "fourth," and so on (if any) in the description and claims of the embodiments of the present disclosure and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "including," "comprising," and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units need not be limited to the steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to the process, method, product, or apparatus. Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the embodiments of the present disclosure, and are not intended to limit them. Although the embodiments of the present disclosure have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features therein may be replaced with equivalents. Such modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the embodiments of the present disclosure.

Claims

Claims 1. An optical module cold plate liquid cooling assembly, comprising: A cold plate body extending along a first direction and comprising a first portion and a second portion opposite to each other; a plurality of floating heat conductive blocks connected to the first portion of the cold plate body and capable of floating in a second direction perpendicular to the first direction; the floating heat conductive blocks being spaced apart along the first direction and configured to contact optical modules sequentially arranged along the first direction; a thermal pad being disposed between the cold plate body and the floating heat conductive blocks and in contact with the cold plate body and the floating heat conductive blocks; At least one liquid cooling tube is provided on the second side of the cold plate body.

2. The optical module cold plate liquid cooling assembly according to claim 1, wherein: Also includes: The elastic member is connected between each of the floating heat-conducting blocks and the cold plate body and can be stretched and retracted along the second direction.

3. The optical module cold plate liquid cooling assembly according to claim 2, wherein: Two elastic members are connected between the floating heat-conducting block and the cold plate body. The two elastic members are respectively located at two ends of the floating heat-conducting block, and the thermal pad is located between the two elastic members.

4. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, wherein: The cold plate body includes: a main support plate extending along the first direction; the floating heat conductive block is located on the first side of the support plate, and the liquid cooling tube is located on the second side of the main support plate; a stopper assembly is connected to the outer side of the main support plate and together with the main support plate forms a floating groove; the floating groove is located on both sides of the main support plate and the notches of the floating groove are opposite to each other, and the two ends of the floating heat conductive block are inserted into the floating grooves on both sides.

5. The optical module cold plate liquid cooling assembly according to claim 4, wherein: The stop assembly includes stoppers connected to two opposite sides of the main support plate, and the second side of the main support plate is exposed to the outside.

6. The optical module cold plate liquid cooling assembly according to claim 5, wherein: The stopper includes a main body and a stopper connected to each other, the main body is connected to the main support plate, and the stopper is disposed at an end of the floating heat conductive block.

7. The optical module cold plate liquid cooling assembly according to claim 5, wherein: A plurality of stoppers are arranged at intervals along the first direction, and each stopper stops at least one floating heat conductive block.

8. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, wherein: The number of the liquid cooling pipe is one, and the liquid cooling pipe passes through both ends of the cold plate body along the first direction.

9. The optical module cold plate liquid cooling assembly according to claim 8, wherein: The liquid cooling pipe extends from one end of the cold plate body along a wavy line to the other end of the liquid cooling plate.

10. A network switching device, comprising: At least one board; At least one connector group, each connector group including a plurality of connectors sequentially arranged along a first direction, each connector being electrically connected to the board; wherein each connector in at least one connector group has a contact window, and the contact window is located at a mounting portion 1 of the connector group; At least one optical module cold plate liquid cooling assembly according to any one of claims 1 to 9, wherein the optical module cold plate liquid cooling assembly is arranged at the mounting portion 1 of the connector assembly, and each floating heat conductive block of the optical module cold plate liquid cooling assembly is used to pass through the contact window and contact the optical module inserted in the connector.

11. The network switching device according to claim 10, wherein: At least two connector groups are spaced apart along a second direction perpendicular to the first direction. Each connector in each connector group has a contact window. Each connector group is correspondingly provided with one optical module cold plate liquid cooling assembly.

12. The network switching device according to claim 11, wherein: There is one board, and the connector group includes two inner connector groups and two outer connector groups. The two inner connector groups are respectively connected to two surfaces of the board, and the two outer connector groups are respectively located on one side of the two inner connector groups facing away from the board, and both outer connector groups are electrically connected to the board. There are four optical module cold plate liquid cooling assemblies, and each optical module cold plate liquid cooling assembly is respectively arranged on an installation side of each connector group.

13. The network switching device according to claim 12, wherein: The installation examples of each of the connector groups are each example 1 in which the connector group is away from the board, and the optical module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies; the two inner liquid cooling assemblies are respectively located between the inner connector group and the outer connector group in each example, and the inner liquid cooling plate is used to contact the optical module inserted in the inner connector group; the two outer liquid cooling assemblies are respectively located in the example J in which the outer connector group is away from the board, and the outer liquid cooling assembly is used to contact the optical module inserted in the outer connector group.

14. The network switching device according to claim 13, wherein: Each connector of the outer layer connector group has a bracket, the bracket extends toward the board and is connected to the board, and the outer layer liquid cooling component covers at least a portion of said support.

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