Power management integrated circuit

Abstract

An embodiment of the present invention is to provide a power management integrated circuit comprising: a sensing unit which supplies, to a temperature sensor, a bias current for turning on the temperature sensor included in an external driving component, and which receives a sensing voltage detected from the temperature sensor by means of the bias current and detects a temperature value; and a power supply unit, which adjusts, on the basis of the temperature value detected by the sensing unit, a driving voltage for driving a core included in the external driving component, wherein the driving voltage varies according to the temperature value.

Description

Power management integrated circuit

[0001] The present invention relates to a power management integrated circuit.

[0002] Display devices contain power management circuitry. Power management circuitry is also known as a power management integrated circuit (PMIC), abbreviated as PMI.

[0003] Power management integrated circuits (PMICs) primarily function by converting system power supplied from commercial power sources or batteries to suit the characteristics of components within a display device. For example, if the system power voltage differs from the operating voltage of the components, the PMIC converts the system power voltage and then supplies it to each component.

[0004] Figure 1 is a diagram showing the configuration of a conventional power management integrated circuit and an external driving device.

[0005] The power management integrated circuit (10) primarily performs the function of converting and supplying system power supplied from a commercial power source or battery, etc., to suit the characteristics of the driving component. Specifically, the power management integrated circuit (10) can manage the power supplied to the external driving component (20).

[0006] The external drive component (20) may be a system on chip (SoC) or another application. The system on chip includes a processor for controlling connected semiconductor devices. The processor of the system on chip can control the operation of the semiconductor devices by performing calculations and transmitting and receiving signals.

[0007] Referring to FIG. 1, a power management integrated circuit (10) includes a power supply unit (11), and an external driving component (20) may include a core (22). The power supply unit (11) may play a role in converting an input voltage into a desired output voltage. The core (21) may perform operations necessary for the external driving component (20) or the system-on-chip to operate as a processor within the final product.

[0008] At this time, the power supply unit (11) of the power management integrated circuit (10) supplies a driving voltage (V) to drive the core (21) of the external driving component (20). CORE ) outputs a constant driving voltage (V) regardless of the heat generation level within the product. CORE ) has a problem printing.

[0009] Recently, the driving voltage (V) has been increased depending on the level of heat generation within the product. CORE ) Research is continuously being conducted to control it.

[0010] One embodiment of the present invention provides a power management integrated circuit capable of controlling a driving voltage according to a heat generation level.

[0011] One embodiment of the present invention for achieving the above-described technical task is to provide a power management integrated circuit including a sensing unit that supplies a bias current for turning on a temperature sensor included in an external driving component to the temperature sensor, receives a sensing voltage detected from the temperature sensor by the bias current to detect a temperature value, and a power supply unit that adjusts a driving voltage for driving a core included in the external driving component based on the temperature value detected by the sensing unit, wherein the driving voltage varies according to the temperature value.

[0012] Another embodiment of the present invention provides a power management integrated circuit including: a temperature sensor that outputs a sensing voltage corresponding to a bias current; a sensing unit that supplies a bias current for turning on the temperature sensor to the temperature sensor and receives a sensing voltage detected from the temperature sensor by the bias current to detect a temperature value; and a power supply unit that adjusts a driving voltage for driving a core included in an external driving component based on the temperature value detected by the sensing unit, wherein the driving voltage varies according to the temperature value.

[0013] A power management integrated circuit according to one embodiment of the present invention includes a sensing unit, thereby allowing the driving voltage to be adjusted according to the heat generation level.

[0014] In addition to the effects mentioned above, other features and advantages of the present invention are described below or may be clearly understood by those skilled in the art to which the present invention pertains from such description and explanation.

[0015] Figure 1 is a drawing showing the configuration of a power management integrated circuit and external driving components according to a comparative example.

[0016] FIG. 2 is a drawing showing the configuration of a power management integrated circuit and an external driving component according to one embodiment of the present invention.

[0017] FIG. 3 is a drawing showing a part of the configuration of a power management integrated circuit and an external driving component according to one embodiment of the present invention.

[0018] Figure 4 is a graph showing the relationship between temperature and sensing voltage.

[0019] FIG. 5 is a drawing showing the configuration of a power management integrated circuit and an external driving component according to another embodiment of the present invention.

[0020] FIG. 6 is a drawing showing the configuration of a power management integrated circuit and an external driving component according to another embodiment of the present invention.

[0021] Figure 7 is a configuration diagram of a display device according to one embodiment of the present invention.

[0022] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided solely to ensure that the disclosure of the present invention is complete and to inform those skilled in the art of the scope of the invention.

[0023] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are merely illustrative, and the present invention is not limited to the details depicted in the drawings. Throughout the specification, identical components may be designated by identical reference numerals. Furthermore, in describing the present invention, if a detailed description of a related known technology is deemed to unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

[0024] In this specification, when the words "include," "have," and "consist of" are used, other parts may be added, unless the expression "only" is used. When a component is expressed in the singular, the plural is included unless otherwise explicitly stated.

[0025] When interpreting a component, it is interpreted as including the error range even if there is no separate explicit description.

[0026] For example, when the positional relationship between two parts is described as ‘on top of’, ‘upper part of’, ‘lower part of’, ‘next to’, etc., one or more other parts may be located between the two parts unless the expression ‘right away’ or ‘directly’ is used.

[0027] Spatially relative terms such as "below," "beneath," "lower," "above," and "upper" can be used to easily describe the relationship between one element or component and other elements or components, as illustrated in the drawings. Spatially relative terms should be understood to include different orientations of the elements during use or operation in addition to the orientations depicted in the drawings. For example, if an element depicted in the drawings were flipped over, an element described as "below" or "beneath" another element could end up being placed "above" the other element. Thus, the exemplary term "below" can include both the above and below directions. Similarly, the exemplary term "above" or "above" can include both the above and below directions.

[0028] When describing a temporal relationship, for example, when the temporal order is described as 'after', 'following', 'next to', 'before', etc., it can also include cases where it is not continuous, as long as the expression 'immediately' or 'directly' is not used.

[0029] While terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a "first" component referred to below may also be a "second" component within the technical scope of the present invention.

[0030] The term "at least one" should be understood to include all possible combinations of one or more associated items. For example, "at least one of the first, second, and third items" can mean any combination of items that can be represented by two or more of the first, second, and third items, as well as each of the first, second, and third items.

[0031] The features of each of the various embodiments of the present invention can be partially or wholly combined or combined with each other, and various technical connections and operations are possible, and each embodiment can be implemented independently of each other or implemented together in a related relationship.

[0032] In adding reference numerals to components of each drawing describing embodiments of the present invention, the same components may have the same numerals as much as possible even if they are shown in different drawings.

[0033] FIG. 2 is a drawing showing the configuration of a power management integrated circuit (100) and an external driving component (200) according to one embodiment of the present invention. FIG. 3 is a drawing showing a part of the configuration of a power management integrated circuit (100) and an external driving component (200) according to one embodiment of the present invention.

[0034] In the description of the power management integrated circuit (100) and the external driving component (200), any description that overlaps with the description of the power management integrated circuit (10) and the external driving component (20) of FIG. 1 is omitted.

[0035] According to one embodiment of the present invention, a power management integrated circuit (100) may include a power supply unit (110), a first interface (120), and a sensing unit (130). An external driving component (200) may include a core (210), a second interface (220), and a temperature sensor (230).

[0036] The components of the power management integrated circuit (100) and the external driving component (200) are described in detail below.

[0037] According to one embodiment of the present invention, the power supply unit (110) may serve to convert the input voltage into a desired output voltage. Specifically, the driving voltage (V) for driving the core (210) of the external driving component (200) CORE ) can be printed.

[0038] According to one embodiment of the present invention, the power supply unit (110) may include a reference voltage source (111), an amplifier (112), a transistor (113), and a voltage divider circuit (114).

[0039] The reference voltage source (111) is a reference voltage (V) that varies according to the temperature value input from the sensing unit (130). REF ) can be printed.

[0040] The amplifier (112) is a reference voltage (V REF ) and feedback voltage (V FEED ) are compared, the difference is amplified, and the amplification result is output to the gate terminal of the transistor (113). Specifically, the first input terminal of the amplifier (112) is connected to a reference voltage (V REF ) is input, and a feedback voltage (V) is applied to the second input terminal of the amplifier (112). FEED ) is input, and the reference voltage (V) is input to the output terminal of the amplifier (112). REF ) and feedback voltage (V FEED ) is output as an amplified value of the difference.

[0041] The transistor (113) includes a first end, a second end, and a third end. The first end of the transistor (113) is connected to the output terminal of the amplifier (112), the second end of the transistor (113) is connected to a power supply voltage (Vcc) application node to which the power supply voltage (Vcc) is applied, and the third end of the transistor (113) is connected to a voltage divider circuit (114).

[0042] According to one embodiment of the present invention, when a voltage output from an amplifier (112) is applied to a first terminal of a transistor (113), the transistor (113) is turned on, causing a current due to the power supply voltage (Vcc) to flow through the transistor (113) to a voltage divider circuit (114).

[0043] The voltage divider circuit (114) divides the power supply voltage (Vcc) using a resistor string in which multiple resistors are connected in series to generate a driving voltage (V CORE ) and feedback voltage (V FEED ) outputs the driving voltage (V CORE ) may be lower than the voltage level of the power supply voltage (Vcc). One end of the resistor string included in the voltage dividing circuit (114) is connected to the third end of the transistor (113), and the other end of the resistor string is connected to the ground terminal. The driving voltage (V) is supplied from a tap connected to one of the nodes between the resistors constituting the resistor string. CORE ) is output, and the feedback voltage (V) is fed from the tap connected to the other one of the nodes between the resistors. FEED ) is printed.

[0044] According to one embodiment of the present invention, the amplifier (112) receives a reference voltage (V REF ) and the feedback voltage (V) fed back from the voltage divider circuit (114) FEED ) and amplifies the difference in driving voltage (V) based on the result. CORE ) can be adjusted so that the driving voltage (V CORE ) enables precise control.

[0045] According to one embodiment of the present invention, the driving voltage (V CORE ) is output through the first terminal (115) of the power supply unit (110) and transmitted to the core (210) through the third terminal (211) of the core (210).

[0046] According to one embodiment of the present invention, the driving voltage (V CORE) may vary depending on the temperature value detected by the sensing unit (130). Specifically, the power supply unit (110) supplies a driving voltage (V) for driving the core (210) based on the temperature value detected by the sensing unit (130). CORE ) can be printed.

[0047] According to one embodiment of the present invention, the sensing unit (130) supplies a bias current (I) to turn on the temperature sensor (230). B ) is supplied to the temperature sensor (230), and the bias current (I B ) and the sensing voltage (V) detected from the temperature sensor (230) BE ) is received, the sensing voltage (V BE ) can be output to the power supply unit (110).

[0048] According to one embodiment of the present invention, the sensing unit (130) may include a current source (131), an ADC (132, Analog to Digital Converter) and a digital processing circuit (133).

[0049] The current source (131) outputs the bias current (I) to the temperature sensor (230). B ) is provided. The current source (131) provides a bias current (I B ) may require a high potential power supply voltage (VDD) to output the signal.

[0050] Bias current (I B ) can be transmitted to the temperature sensor (230) via the second terminal (134) of the sensing unit (130) and the fourth terminal (232) of the temperature sensor (230).

[0051] ADC (132) senses the voltage (V) output from the temperature sensor (230) BE ) can be converted into a digital value. The sensing voltage (V BE ) can be transmitted to the ADC (132) via the fourth terminal (232) and the second terminal (134).

[0052] The digital processing circuit (133) can output a temperature value converted into a digital value by the ADC (132) to the power supply unit (110).

[0053] According to one embodiment of the present invention, the sensing voltage (V) output from the temperature sensor (230) BE ) may change as the temperature value changes.

[0054] According to one embodiment of the present invention, the core (210) can perform operations necessary for the external driving component (200) to operate as a processor within the final product. The core (210) receives the driving voltage (V) output from the power supply unit (110). CORE ) can be operated through.

[0055] According to one embodiment of the present invention, the power supply unit (110) and the core (210) can be connected via the first terminal (115) and the third terminal (211). As a result, the power management integrated circuit (100) and the external driving component (200) can be connected.

[0056] According to one embodiment of the present invention, the temperature sensor (230) senses the bias current (I) output from the sensing unit (130). B ) corresponding to the sensing voltage (V BE ) can be output to the sensing unit (130). The sensing voltage (V BE ) may also be named Base-Emitter Voltage.

[0057] According to one embodiment of the present invention, the temperature sensor (230) may include any one of a thermal diode, a bipolar junction transistor (BJT), and a metal-oxide-semiconductor field effect transistor (MOSFET). FIG. 3 illustrates that the temperature sensor (230) includes a thermal diode (231). For example, the temperature sensor (230) may correspond to the thermal diode (231).

[0058] According to one embodiment of the present invention, the sensing unit (130) and the temperature sensor (230) can be connected via the second terminal (134) and the fourth terminal (232). As a result, the power management integrated circuit (100) and the external driving component (200) can be connected.

[0059] According to one embodiment of the present invention, the power management integrated circuit (100) may include a first interface (120), and the external driving component (200) may include a second interface (220).

[0060] The first and second interfaces (120, 220) can be used as channels through which temperature information corresponding to temperature values ​​are transmitted, respectively. For example, when an external driving component (200) requests temperature information from a power management integrated circuit (100), the power management integrated circuit (100) can provide temperature information corresponding to the temperature value to the external driving component (200). However, even if the external driving component (200) does not separately request temperature information, when the temperature value detected by the sensing unit (130) is higher than a preset reference value, temperature information corresponding to the temperature value can be provided to the external driving component (200).

[0061] Figure 4 shows the temperature and sensing voltage (V) of the temperature sensor (230). BE ) is a graph showing the relationship. Specifically, the sensing voltage (V BE) depends on the temperature of the temperature sensor (230). As shown in the graph, as the temperature of the temperature sensor (230) increases, the sensing voltage (V BE ) decreases. According to one embodiment of the present invention, the sensing voltage (V BE ) can have separate code information.

[0062] According to one embodiment of the present invention, the sensing unit (130) may further include a diode detection unit (135) that detects whether a temperature sensor (230) is provided in the external driving component (200).

[0063] The diode detection unit (135) detects the bias current (I) output from the sensing unit (130). B ) is obtained from the external driving component (200). BE ) is the bias current (I B ) is the same as the high-potential power supply voltage (VDD) for supplying the external drive component (200), it can be determined that the temperature sensor (230) is not provided in the external drive component (200).

[0064] For example, the diode detection unit (135) detects the bias current (I) output from the sensing unit (130). B ) is obtained from the external driving component (200). BE ) is the bias current (I B ) is lower than the high-potential power supply voltage (VDD) for supplying the external driving component (200), it can be determined that a temperature sensor (230) is provided in the external driving component (200).

[0065] According to one embodiment of the present invention, the sensing unit (130) stores the voltage value and bias current (I) stored in the power management integrated circuit (100). B ) is detected from the temperature sensor (230) by the sensing voltage (V BE) may further include a control unit (136) that controls the voltage offset value by comparing the voltage values. At this time, the voltage value stored in the power management integrated circuit (100) may be a voltage value corresponding to an ideal temperature value that takes into account the difference in the characteristics of the element.

[0066] Specifically, the control unit (136) of the sensing unit (130) senses the voltage value stored in the power management integrated circuit (100) and the sensing voltage (V) sensed by the temperature sensor (230) in the external driving component (200). BE ) can be compared to calculate an offset value and compensate for that offset value.

[0067] FIG. 5 is a drawing showing the configuration of a power management integrated circuit (300) and an external driving component (200) according to another embodiment of the present invention.

[0068] Referring to FIG. 5, a power management integrated circuit (300) according to one embodiment of the present invention may include a power supply unit (310), a first interface (320), a sensing unit (330), and a temperature sensor (340).

[0069] The power supply unit (310), the first interface (320), and the sensing unit (330) of the power management integrated circuit (300) correspond to the power supply unit (110), the first interface (120), and the sensing unit (130) illustrated in FIG. 2.

[0070] The description of the temperature sensor (340) of the power management integrated circuit (300) overlaps with the description of the temperature sensor (230) illustrated in FIG. 2, except that the temperature sensor (340) of the power management integrated circuit (300) is provided in the power management integrated circuit (300).

[0071] Specifically, the temperature sensor (340) is a bias current (I B ) corresponding to the sensing voltage (V BE ) outputs, and the sensing unit (330) outputs a bias current (I) to turn on the temperature sensor (340). B ) is supplied to the temperature sensor (340), and the bias current (I B) is detected from the temperature sensor (340) by the sensing voltage (V BE ) can be received to detect the temperature value.

[0072] As shown in Fig. 5, when the external driving component (200) does not have a temperature sensor and the power management integrated circuit (300) has a temperature sensor (340), the sensing voltage (V) detected from the temperature sensor (340) BE ) can be regarded as the temperature value detected by receiving the external driving component (200).

[0073] FIG. 6 is a drawing showing the configuration of a power management integrated circuit (300) and an external driving component (200) according to another embodiment of the present invention.

[0074] FIG. 6 shows that, compared to FIG. 5, the external driving component (200) may include a temperature sensor (230).

[0075] According to one embodiment of the present invention, when the power management integrated circuit (300) and the external driving component (200) each include a temperature sensor (340, 230), the temperature sensor (340) provided in the power management integrated circuit (300) can be deactivated.

[0076] The remote temperature sensing method of the present invention is described in detail below.

[0077] According to one embodiment of the present invention, a remote temperature sensing method is provided in which a sensing unit (130) of a power management integrated circuit (100) applies a bias current (I) to a temperature sensor (230) of an external driving component (200). B ), the sensing unit (130) provides a bias current (I) from the temperature sensor (230). B ) corresponding to the sensing voltage (V BE ) receiving step, the sensing unit (130) senses the sensing voltage (V BE) to the power supply unit (110) of the power management integrated circuit (100) and the power supply unit (110) supplies a driving voltage (V) for driving the core (210) of the external driving component (200) based on the temperature value detected by the sensing unit (130). CORE ) may include a step of outputting the result.

[0078] Figure 7 is a configuration diagram of a display device (1000) according to one embodiment of the present invention.

[0079] Referring to FIG. 7, the display device (1000) may include a display driving device (410, 420, 430, 440, and 460) and a display panel (450).

[0080] A plurality of data lines (DL) and a plurality of gate lines (GL) may be arranged on the display panel (450), and a plurality of pixels (P) connected to the data lines (DL) and the gate lines (GL) may be arranged.

[0081] The display driving device (410, 420, 430, 440 and 460) is a device that generates signals for displaying an image on a display panel (450), and a host (410), a data driving device (420), a gate driving device (430), a data processing device (440) and a power management device (460) may correspond to the display driving device (410, 420, 430, 440 and 460).

[0082] The gate driving device (430) can supply a gate driving signal of a turn-on voltage or a turn-off voltage to the gate line (GL). When the gate driving signal of the turn-on voltage is supplied to the pixel (P), the pixel (P) is connected to the data line (DL). And, when the gate driving signal of the turn-off voltage is supplied to the pixel (P), the connection between the pixel (P) and the data line (DL) is released. The gate driving device (430) may be referred to as a gate driver.

[0083] The data driving device (420) can supply a data voltage (Vp) to a pixel (P) via a data line (DL). The data voltage (Vp) supplied to the data line (DL) can be supplied to the pixel (P) according to a gate driving signal. The data driving device (420) can be referred to as a source driver.

[0084] The data processing device (440) can supply control signals to the gate driving device (430) and the data driving device (420), and transmit image data (IMG) to the data driving device (420). For example, the data processing device (440) can transmit a gate control signal (GCS) to the gate driving device (430) to initiate scanning. In addition, the data processing device (440) can transmit a data control signal (DCS) to control the data driving device (420) to supply a data voltage (Vp) to each pixel (P). The data processing device (440) can be referred to as a timing controller.

[0085] The host (410) can generate image data (IMG) and transmit it to the data processing device (440). According to one embodiment of the present invention, the host (410) illustrated in FIG. 7 can include an external driving component (200) according to the present invention.

[0086] The power management device (460) can provide voltage (power) to each component within the display device. For example, the power management device (460) can supply a common electrode voltage (VCOM) to the display panel (450). In addition, the power management device (460) can supply a gate low voltage (VGL) and a gate high voltage (VGH) to the gate driver (430), and supply a driving voltage (AVDD) to the data driver (420).

[0087] According to one embodiment of the present invention, the power management device (460) illustrated in FIG. 7 may include a power management integrated circuit (100) according to the present invention.

[0088] Meanwhile, the power management device (460) according to one embodiment of the present invention may supply a plurality of voltages to the display panel (450), the gate driving device (430), and the data driving device (420) during the driving section of each frame, and may reduce or block the supply of the plurality of voltages to some or all of the non-driving section of each frame, or supply the aforementioned plurality of voltages in a low current mode. Here, the non-driving section may be understood as a state in which the image data (IMG) is continuously displayed on the display panel (450), but the display driving devices (410, 420, 430, 440, and 460) that contribute to the display of the image data (IMG) are minimally driven or not driven. In this way, the power management device (460) may minimize the amount of power consumption during the non-driving section.

[0089] The present invention described above is not limited to the aforementioned embodiments and the attached drawings, and it will be apparent to those skilled in the art that various substitutions, modifications, and changes are possible without departing from the technical scope of the present invention. Therefore, the scope of the present invention is indicated by the following claims, and all changes or modified forms derived from the meaning, scope, and equivalent concepts of the claims should be interpreted as being included within the scope of the present invention.

Claims

1. A sensing unit that supplies a bias current to the temperature sensor included in the external driving component to turn on the temperature sensor, and receives a sensing voltage detected from the temperature sensor by the bias current to detect a temperature value; and A power supply unit that controls a driving voltage for driving a core included in the external driving component based on a temperature value detected by the sensing unit, A power management integrated circuit in which the above driving voltage varies depending on the above temperature value.

2. In paragraph 1, The above sensing unit, A current source that outputs the above bias current; An ADC that converts the sensing voltage output from the above temperature sensor into a digital value; and A power management integrated circuit comprising a digital processing circuit that provides a temperature value corresponding to the digital value to the power supply unit.

3. In paragraph 1, The above power supply unit includes a reference voltage source that outputs a reference voltage that varies according to the temperature value, A power management integrated circuit in which the driving voltage output from the power supply unit varies according to the reference voltage.

4. In paragraph 1, Includes a first interface connected to the external driving component and terminal, The above external driving component includes a second interface connected to the first interface, A power management integrated circuit in which temperature information corresponding to the above temperature value is transmitted to the external driving component through the first and second interfaces.

5. In paragraph 1, A power management integrated circuit, wherein the temperature sensor comprises one of a thermal diode, a bipolar junction transistor (BJT), and a metal-oxide-semiconductor field effect transistor (MOSFET).

6. In paragraph 1, The above sensing unit further includes a diode detection unit that detects whether the external driving component is equipped with a temperature sensor, A power management integrated circuit, wherein the diode detection unit determines that a temperature sensor is provided in the external driving component when the sensing voltage obtained from the external driving component according to the bias current output from the sensing unit is lower than the high-potential power supply voltage for supplying the bias current.

7. In paragraph 1, The above sensing unit is connected to the temperature sensor of the external driving component through a terminal, The power supply unit is a power management integrated circuit connected to the core and terminal of the external driving component.

8. In paragraph 1, A power management integrated circuit, wherein the sensing unit further includes a control unit that controls a voltage offset value by comparing a voltage value stored in the power management integrated circuit with a sensing voltage detected from the temperature sensor by the bias current.

9. A temperature sensor that outputs a sensing voltage corresponding to the bias current; A sensing unit that supplies a bias current to the temperature sensor to turn on the temperature sensor and receives a sensing voltage detected from the temperature sensor by the bias current to detect a temperature value; and It includes a power supply unit that controls the driving voltage for driving the core included in the external driving component based on the temperature value detected by the sensing unit, A power management integrated circuit in which the above driving voltage varies depending on the above temperature value.

10. In paragraph 9, A power management integrated circuit, wherein the temperature sensor included in the power management integrated circuit is deactivated when the external driving component includes a temperature sensor that corresponds to the bias current supplied by the sensing unit and outputs a sensing voltage that is the same as or different from the sensing voltage.

11. In paragraph 9, The above sensing unit, A current source that outputs the above bias current; An ADC that converts the sensing voltage output from the above temperature sensor into a digital value; and A power management integrated circuit comprising a digital processing circuit that provides a temperature value corresponding to the digital value to the power supply unit.

12. In paragraph 9, The above power supply unit includes a reference voltage source that outputs a reference voltage that varies according to the temperature value, A power management integrated circuit in which the driving voltage output from the power supply unit varies according to the reference voltage.

13. In paragraph 9, Includes a first interface connected to the external driving component and terminal, The above external driving component includes a second interface connected to the first interface, A power management integrated circuit in which temperature information corresponding to the above temperature value is transmitted to the external driving component through the first and second interfaces.

14. In paragraph 9, A power management integrated circuit, wherein the temperature sensor comprises one of a thermal diode, a bipolar junction transistor (BJT), and a metal-oxide-semiconductor field effect transistor (MOSFET).

15. In paragraph 9, The power supply unit is a power management integrated circuit connected to the core and terminal of the external driving component.

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