Display substrate and manufacturing method therefor, and display apparatus

Abstract

A display substrate and a manufacturing method therefor, and a display apparatus, relating to the technical field of display. The display substrate comprises: a base substrate comprising a display area and a non-display area, the display area comprising a plurality of sub-pixels, and the plurality of sub-pixels including sub-pixels of a plurality of colors; a pixel defining layer arranged on one side of the base substrate and used for defining an opening for the sub-pixels; a light-emitting device arranged at the opening and comprising a first electrode, a light-emitting layer and a second electrode which are sequentially stacked, the first electrode being located between the pixel defining layer and the base substrate, and the light-emitting layer being located on the side of the first electrode and the pixel defining layer facing away from the base substrate; and a plurality of packaging patterns located on different sub-pixels, the packaging patterns being located on the side of the second electrode facing away from the base substrate, and the packaging patterns on the sub-pixels of different colors being arranged in different layers and spaced apart from each other.

Description

Display substrate and manufacturing method thereof, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a preparation method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) displays are self-luminous displays that are increasingly being used in various high-performance display applications due to their advantages, including thinness, high brightness, low power consumption, wide viewing angle, fast response speed, and high contrast. However, OLED displays are susceptible to corrosion from water and oxygen, resulting in display defects such as bright and dark spots, which also shortens their lifespan. Therefore, the reliability of OLED display packaging is crucial.

[0003] Overview

[0004] The present disclosure provides a display substrate, comprising:

[0005] A base substrate, comprising a display area and a non-display area, wherein the display area comprises a plurality of sub-pixels, and the plurality of sub-pixels comprises sub-pixels of multiple colors;

[0006] A pixel defining layer, disposed on one side of the base substrate, for defining openings of the sub-pixels;

[0007] a light-emitting device, disposed at the opening, comprising a first electrode, a light-emitting layer, and a second electrode stacked in sequence, wherein the first electrode is located between the pixel defining layer and the base substrate, and the light-emitting layer is located on a side of the first electrode and the pixel defining layer away from the base substrate; and

[0008] A plurality of encapsulation patterns are located in different sub-pixels, wherein the encapsulation patterns are located on a side of the second electrode away from the base substrate, and the encapsulation patterns of sub-pixels of different colors are arranged in different layers and are separated from each other.

[0009] In some embodiments, the display substrate further includes an isolation column, wherein the isolation column includes:

[0010] a column disposed on the pixel defining layer at a side facing away from the base substrate, wherein the orthographic projection of the column on the base substrate is within the orthographic projection range of the pixel defining layer on the base substrate; and

[0011] One or more composite layers are arranged on the side of the column away from the base substrate. The multiple composite layers are stacked, and the composite layers include a light-emitting layer, a second electrode and a packaging pattern stacked in sequence on the side of the column away from the base substrate.

[0012] In some embodiments, the two adjacent openings in the display area are a first opening and a second opening, and the isolation column includes:

[0013] a first spacer column located between the first opening and the second opening, the first spacer column comprising two composite layers, namely a first composite layer and a second composite layer; in an orthographic projection on the base substrate, the first composite layer is disposed proximate to the first opening, and the second composite layer is disposed proximate to the second opening; edges of the first composite layer and the second composite layer that are close to each other overlap, and within the overlapping region, the second composite layer is located on a side of the first composite layer facing away from the base substrate;

[0014] The light-emitting layer in the first composite layer is arranged on the same layer as the light-emitting layer in the first opening, and the light-emitting layer in the second composite layer is arranged on the same layer as the light-emitting layer in the second opening. The light-emitting layer in the first opening and the light-emitting layer in the second opening are used to emit light of different colors.

[0015] In some embodiments, the overlapping region is substantially centrally disposed between the first opening and the second opening in an orthographic projection on the base substrate.

[0016] In some embodiments, the opening in the display area close to the non-display area is a third opening, and the isolation column includes:

[0017] The second isolation column is located between the third opening and the non-display area. The second isolation column includes a composite layer, which is a third composite layer. The light-emitting layer in the third composite layer is arranged in the same layer as the light-emitting layer in the third opening.

[0018] In some embodiments, the column, the light-emitting layer located on the side of the column facing away from the base substrate, and the end surface of the second electrode facing the sub-pixel opening where the light-emitting layer is located are all covered by the encapsulation pattern.

[0019] In some embodiments, the column includes a first sub-column and a second sub-column, the second sub-column is located between the first sub-column and the composite layer, an orthographic projection outline of the first sub-column on the substrate is retracted inward in a direction away from the opening relative to an orthographic projection outline of the second sub-column on the substrate, and the pixel defining layer, the first sub-column, and the second sub-column form a first groove with a notch facing the opening;

[0020] The light-emitting layer, the second electrode and the packaging pattern all extend from the opening into the first groove, and in the first groove, the second electrode is spaced between the light-emitting layer and the first sub-column.

[0021] In some embodiments, for the same sub-pixel, the orthographic projection outer contour of the light-emitting layer on the base substrate, the orthographic projection outer contour of the second electrode on the base substrate, and the orthographic projection outer contour of the packaging pattern on the base substrate substantially overlap.

[0022] In some embodiments, the second electrodes of sub-pixels of different colors are in different layers and are spaced apart from each other.

[0023] In some embodiments, the non-display area includes a first retaining wall and a second retaining wall that are separated from each other, the first retaining wall is located between the display area and the second retaining wall, and the display substrate further includes:

[0024] a first organic encapsulation layer, disposed on a side of the encapsulation pattern facing away from the base substrate, wherein an edge of the first organic encapsulation layer is located between the display area and the first retaining wall and is disposed close to the first retaining wall, and an orthographic projection of the first organic encapsulation layer on the base substrate covers the entire display area and a first portion of the non-display area close to the display area; and

[0025] A first inorganic encapsulation layer is arranged on a side of the first organic encapsulation layer facing away from the base substrate, an edge of the first inorganic encapsulation layer is located between the first retaining wall and the second retaining wall, and is arranged close to the second retaining wall, and the first inorganic encapsulation layer is projected on the base substrate to cover the entire display area and a second portion of the non-display area close to the display area.

[0026] In some embodiments, the display substrate further comprises:

[0027] A second inorganic encapsulation layer is arranged between the encapsulation pattern and the first organic encapsulation layer, the edge of the second inorganic encapsulation layer is located between the first retaining wall and the second retaining wall, and is arranged close to the second retaining wall. The second inorganic encapsulation layer is projected on the base substrate to cover the entire display area and a third part of the non-display area close to the display area.

[0028] The present disclosure provides a display substrate, comprising:

[0029] A base substrate comprising a display area and a non-display area, wherein the display area comprises a plurality of sub-pixels;

[0030] a pixel defining layer, located on one side of the base substrate, for defining an opening of the sub-pixel, wherein the opening is used for arranging a light-emitting device;

[0031] Isolation columns are provided on a side of the pixel defining layer away from the base substrate, the isolation columns comprising a first isolation column and a second isolation column, the first isolation column being located between two adjacent openings, and the second isolation column being located between the opening close to the non-display area and the non-display area;

[0032] Wherein, the orthographic projection size of the second isolation column on the base substrate is larger than the orthographic projection size of the first isolation column on the base substrate; and / or,

[0033] The thickness of the second spacer is greater than the thickness of the first spacer; and / or,

[0034] One or more second grooves are provided in the second isolation column, the notches of the second grooves are facing away from the base substrate, and the plurality of second grooves are arranged along a first direction, which is a direction from the display area to the non-display area.

[0035] In some embodiments, a size of an orthographic projection of the second spacer pillar on the base substrate is greater than or equal to three times a size of an orthographic projection of the first spacer pillar on the base substrate.

[0036] In some embodiments, the thickness of the second spacer is greater than or equal to 1.5 times the thickness of the first spacer, and less than or equal to 5 times the thickness of the first spacer.

[0037] In some embodiments, a depth of the second groove is greater than or equal to 1.5 times the thickness of the first isolation column and less than the sum of the thicknesses of the second isolation column and the pixel defining layer.

[0038] In some embodiments, the longitudinal cross-sectional shape of the second groove includes at least one of the following: a polygon and a polygon with rounded corners, and the polygon includes at least one of the following: a rectangle, a regular trapezoid, and an inverted trapezoid.

[0039] In some embodiments, the display substrate further comprises:

[0040] an encapsulation layer, disposed on a side of the isolation column away from the base substrate;

[0041] a first light-shielding layer, disposed on a side of the encapsulation layer facing away from the base substrate, wherein an orthographic projection of the first light-shielding layer on the base substrate is located within a range of an orthographic projection of the pixel defining layer on the base substrate;

[0042] a first low-fold layer, disposed on a side of the first light-shielding layer facing away from the base substrate, wherein an orthographic projection of the first low-fold layer on the base substrate is within a range of an orthographic projection of the pixel defining layer on the base substrate;

[0043] a first color filter layer, disposed on a side of the encapsulation layer and the first low-fold layer facing away from the base substrate, comprising a plurality of first color filter patterns, wherein different first color filter patterns cover different openings in an orthographic projection on the base substrate, and the first color filter patterns also cover a side of the first low-fold layer facing the opening; and

[0044] A first high-fold layer is provided on a side of the first color filter layer and the first low-fold layer away from the base substrate;

[0045] The refractive index of the first color filter pattern is greater than that of the first low-fold layer and less than that of the first high-fold layer. The interface between the first low-fold layer and the first color filter pattern can cause total reflection of incident light.

[0046] In some embodiments, the isolation column includes a third inorganic encapsulation layer, the third inorganic encapsulation layer is arranged in the isolation column away from the base substrate, and the third inorganic encapsulation layer covers the light emitting device;

[0047] The display substrate further includes:

[0048] A second low-fold layer is provided on a side of the isolation column away from the base substrate;

[0049] a second organic encapsulation layer, disposed on a side of the second low-fold layer and the third inorganic encapsulation layer away from the base substrate; and

[0050] a fourth inorganic encapsulation layer, disposed on a side of the second organic encapsulation layer facing away from the base substrate;

[0051] The refractive index of the second low-fold layer is smaller than that of the second organic encapsulation layer and the third inorganic encapsulation layer, and the refractive index of the second organic encapsulation layer is greater than that of the fourth inorganic encapsulation layer. The interface between the second low-fold layer and the second organic encapsulation layer can cause total reflection of incident light.

[0052] In some embodiments, a slope angle of a side surface of the isolation column toward the opening is greater than or equal to 55° and less than or equal to 75°.

[0053] In some embodiments, the display substrate further comprises:

[0054] a second light-shielding layer, disposed on a side of the fourth inorganic encapsulation layer facing away from the base substrate, wherein an orthographic projection of the second light-shielding layer on the base substrate is within a range of an orthographic projection of the pixel defining layer on the base substrate; and

[0055] The second color filter layer is arranged on a side of the fourth inorganic encapsulation layer away from the base substrate, and includes a plurality of second color filter patterns. In the orthographic projection on the base substrate, different second color filter patterns cover different openings.

[0056] In some embodiments, the second isolation column is a closed structure surrounding the display area.

[0057] The present disclosure provides a display device, comprising:

[0058] The display substrate according to any one of the preceding claims; and

[0059] The driving circuit is connected to the display substrate and is used to provide a driving signal to the display substrate.

[0060] The present disclosure provides a method for preparing a display substrate, comprising:

[0061] Providing a base substrate, the base substrate comprising a display area and a non-display area, the display area comprising a plurality of sub-pixels, and the plurality of sub-pixels comprising a first color sub-pixel;

[0062] forming a plurality of first electrodes on one side of the base substrate, the plurality of first electrodes including a first electrode of a first color sub-pixel;

[0063] forming a pixel defining layer on a side of the first electrode facing away from the base substrate, the pixel defining layer being used to define an opening of the sub-pixel, and an orthographic projection outline of the first electrode on the base substrate being outwardly extended relative to an orthographic projection outline of the opening on the base substrate;

[0064] forming a first photoresist layer on a side of the first electrode and the pixel defining layer facing away from the base substrate;

[0065] exposing and developing the first photoresist layer using a first mask to form a first photoresist pattern, wherein the first photoresist pattern has a first hollow hole, and the first hollow hole is used to expose the first color sub-pixel;

[0066] Using the first photoresist pattern as a mask, sequentially forming a first light-emitting material, a second electrode material, and an encapsulation material on a side of the first photoresist pattern and the first color sub-pixel facing away from the base substrate;

[0067] The first photoresist pattern and the first light-emitting material, second electrode material and packaging material located on the side of the first photoresist pattern away from the substrate are removed. The remaining first light-emitting material is the light-emitting layer of the first color sub-pixel, the remaining second electrode material is the second electrode of the first color sub-pixel, and the remaining packaging material is the packaging pattern of the first color sub-pixel. The first electrode, light-emitting layer and second electrode of the first color sub-pixel constitute the light-emitting device of the first color sub-pixel.

[0068] In some embodiments, the plurality of sub-pixels further include a second color sub-pixel, the plurality of first electrodes include a first electrode of the second color sub-pixel, and after removing the first photoresist pattern and the first light-emitting material, the second electrode material, and the encapsulation material located on a side of the first photoresist pattern facing away from the base substrate, the method further includes:

[0069] forming a second photoresist layer on a side of the first electrode, the pixel defining layer, and the encapsulation pattern of the first color sub-pixel facing away from the base substrate;

[0070] exposing and developing the second photoresist layer using a second mask to form a second photoresist pattern, wherein the second photoresist pattern has a second hollow hole, and the second hollow hole is used to expose the second color sub-pixel;

[0071] Using the second photoresist pattern as a mask, sequentially forming a second light-emitting material, a second electrode material, and an encapsulation material on a side of the second photoresist pattern and the second color sub-pixel facing away from the base substrate;

[0072] The second photoresist pattern and the second light-emitting material, second electrode material and packaging material located on the side of the second photoresist pattern away from the substrate are removed. The remaining second light-emitting material is the light-emitting layer of the second color sub-pixel, the remaining second electrode material is the second electrode of the second color sub-pixel, and the remaining packaging material is the packaging pattern of the second color sub-pixel. The first electrode, light-emitting layer and second electrode of the second color sub-pixel constitute the light-emitting device of the second color sub-pixel.

[0073] In some embodiments, the plurality of sub-pixels further include a third color sub-pixel, the plurality of first electrodes include a first electrode of the third color sub-pixel, and after the step of removing the second photoresist pattern and the second light-emitting material, the second electrode material, and the encapsulation material located on a side of the second photoresist pattern facing away from the base substrate, the method further includes:

[0074] forming a third photoresist layer on a side of the first electrode, the pixel defining layer, the encapsulation pattern of the first color sub-pixel, and the encapsulation pattern of the second color sub-pixel away from the base substrate;

[0075] exposing and developing the third photoresist layer using a third mask to form a third photoresist pattern, wherein the third photoresist pattern has a third hollow hole, and the third hollow hole is used to expose the third color sub-pixel;

[0076] Using the third photoresist pattern as a mask, sequentially forming a third light-emitting material, a second electrode material, and an encapsulation material on a side of the third photoresist pattern and the third color sub-pixel facing away from the base substrate;

[0077] The third photoresist pattern and the third light-emitting material, second electrode material and packaging material located on the side of the third photoresist pattern away from the substrate are removed. The remaining third light-emitting material is the light-emitting layer of the third color sub-pixel, the remaining second electrode material is the second electrode of the third color sub-pixel, and the remaining packaging material is the packaging pattern of the third color sub-pixel. The first electrode, light-emitting layer and second electrode of the third color sub-pixel constitute the light-emitting device of the third color sub-pixel.

[0078] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below.

[0079] BRIEF DESCRIPTION OF THE DRAWINGS

[0080] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for use in the embodiments or related technology descriptions. Obviously, the drawings described below are some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. It should be noted that the scales in the drawings are for illustration only and do not represent the actual scale.

[0081] FIG1 exemplarily shows a schematic cross-sectional structure diagram of a first display substrate;

[0082] FIG2 exemplarily shows a schematic cross-sectional structure diagram of a second display substrate;

[0083] FIG3 exemplarily shows a schematic cross-sectional structure diagram of a third display substrate;

[0084] FIG4 exemplarily shows a schematic cross-sectional structure diagram of a fourth display substrate;

[0085] FIG5 exemplarily shows a schematic cross-sectional structure diagram of several second spacer columns;

[0086] FIG6 exemplarily shows a schematic cross-sectional structure diagram of a fifth display substrate;

[0087] FIG7 exemplarily shows a schematic cross-sectional structure diagram of a display substrate in the related art;

[0088] FIG8 shows a display defect in the related art in which a circle of light is visible around a display substrate;

[0089] FIG9 exemplarily shows a schematic diagram of the size relationship in a fifth display substrate;

[0090] FIG10 exemplarily shows a schematic cross-sectional structure diagram of a sixth display substrate;

[0091] FIG11 exemplarily shows a schematic cross-sectional structure diagram of a seventh display substrate;

[0092] FIG12 exemplarily shows a schematic diagram of the dimensional relationship of a seventh display substrate;

[0093] FIG13 exemplarily shows a schematic diagram of a planar structure of a display substrate;

[0094] FIG14 exemplarily shows a schematic cross-sectional structure diagram of a display substrate after the first electrode is prepared;

[0095] FIG15 exemplarily shows a schematic cross-sectional structure diagram of a display substrate after the first photoresist layer is prepared;

[0096] FIG16 exemplarily shows a schematic cross-sectional structure diagram of a display substrate after the first photoresist pattern is prepared;

[0097] FIG17 exemplarily shows a schematic cross-sectional structure of a display substrate on which a first light-emitting material, a second electrode material, and an encapsulation material are prepared on a first photoresist pattern;

[0098] FIG18 exemplarily shows a schematic cross-sectional structure diagram of a display substrate after the first color sub-pixel is fabricated;

[0099] FIG19 a exemplarily shows a schematic cross-sectional structure of a display substrate on which a first light-emitting material, a second electrode material, and an encapsulation material are prepared on a second photoresist pattern;

[0100] FIG19 b exemplarily shows a schematic cross-sectional structure diagram of a display substrate after the second color sub-pixel is fabricated;

[0101] FIG20 a exemplarily shows a schematic cross-sectional structure of a display substrate on which a first light-emitting material, a second electrode material, and an encapsulation material are prepared on a third photoresist pattern;

[0102] FIG20 b exemplarily shows a schematic cross-sectional structure diagram of a display substrate after the third color sub-pixel is prepared.

[0103] Detailed description

[0104] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0105] The present disclosure provides a display substrate, as shown in FIG1 , comprising: a base substrate 10, comprising a display area AA and a non-display area NA, wherein the display area AA comprises a plurality of sub-pixels P, and the plurality of sub-pixels P comprises sub-pixels P of multiple colors, such as a red sub-pixel PR, a green sub-pixel PG, and a blue sub-pixel PB.

[0106] As shown in Figure 1, the display substrate also includes: a pixel defining layer PDL, which is arranged on one side of the base substrate 10 and is used to define an opening OP of the sub-pixel P; a light-emitting device LD, which is arranged at the opening OP position and includes a first electrode 11, a light-emitting layer EL and a second electrode 12 stacked in sequence, the first electrode 11 is located between the pixel defining layer PDL and the base substrate 10, and the light-emitting layer EL is located on the side of the first electrode 11 and the pixel defining layer PDL away from the base substrate 10; and a plurality of packaging patterns 13 located in different sub-pixels P, the packaging patterns 13 are located on the side of the second electrode 12 away from the base substrate 10, and the packaging patterns 13 of sub-pixels P of different colors are in different layers and are separated from each other.

[0107] Exemplarily, the light emitting devices LD in different color sub-pixels P emit different colors. For example, the light emitting device LD in the red sub-pixel PR can emit red light, the light emitting device LD in the green sub-pixel PG can emit green light, and the light emitting device LD in the blue sub-pixel PB can emit blue light.

[0108] As shown in Figure 1, the encapsulation pattern 13 of different color sub-pixels P can be, for example, the encapsulation pattern 13 of the red sub-pixel PR and the encapsulation pattern 13 of the green sub-pixel PG, or the encapsulation pattern 13 of the green sub-pixel PG and the encapsulation pattern 13 of the blue sub-pixel PB, or the encapsulation pattern 13 of the blue sub-pixel PB and the encapsulation pattern 13 of the red sub-pixel PR.

[0109] In this disclosure, "different layers" refers to two (or more) structures formed by different patterning processes, and their materials can be the same or different, and their film thicknesses can be the same or different. "Separated from each other" refers to two (or more) structures that are not in contact with each other, for example, there is another film layer between the separated structures.

[0110] As shown in FIG1 , the encapsulation pattern 13 of the red sub-pixel PR and the encapsulation pattern 13 of the green sub-pixel PG are arranged in different layers, with the light-emitting layer EL and the second electrode 12 interposed therebetween. The encapsulation pattern 13 of the green sub-pixel PG and the encapsulation pattern 13 of the blue sub-pixel PB are arranged in different layers, with the light-emitting layer EL and the second electrode 12 interposed therebetween. Similarly, the encapsulation pattern 13 of the blue sub-pixel PB and the encapsulation pattern 13 of the red sub-pixel PR are arranged in different layers, with the light-emitting layer EL and its second electrode 12 interposed therebetween (not shown in FIG1 ).

[0111] The display substrate provided by the present disclosure has packaging patterns 13 of sub-pixels P of different colors that are arranged in different layers and separated from each other, so that the packaging patterns 13 of sub-pixels P of different colors can be designed independently, which is beneficial to improving the packaging performance of the display substrate and enhancing the display effect and life of the display substrate.

[0112] For example, as shown in FIG1 , the orthographic projections of the encapsulation patterns 13 of two adjacent sub-pixels P of different colors on the base substrate 10 overlap. Thus, by arranging the encapsulation patterns 13 that overlap or overlap each other, the encapsulation performance of the display substrate can be improved.

[0113] For example, as shown in FIG1 , the orthographic projections of the encapsulation pattern 13 of the red sub-pixel PR and the encapsulation pattern 13 of the green sub-pixel PG on the base substrate 10 overlap, and the orthographic projections of the encapsulation pattern 13 of the green sub-pixel PG and the encapsulation pattern 13 of the blue sub-pixel PB on the base substrate 10 overlap. Similarly, the orthographic projections of the encapsulation pattern 13 of the blue sub-pixel PB and the encapsulation pattern 13 of the red sub-pixel PR on the base substrate 10 may also overlap (not shown in FIG1 ).

[0114] Exemplarily, as shown in FIG1 , the encapsulation patterns 13 of sub-pixels of the same color are disposed in the same layer. For example, the encapsulation patterns 13 of all red sub-pixels PR are disposed in the same layer and made of the same material, the encapsulation patterns 13 of all green sub-pixels PG are disposed in the same layer and made of the same material, and the encapsulation patterns 13 of all blue sub-pixels PB are disposed in the same layer and made of the same material.

[0115] For example, as shown in FIG. 1 , the encapsulation pattern 13 located in the same sub-pixel P may be a continuous, uninterrupted, integrated structure, so that the encapsulation pattern 13 can completely cover the light-emitting layer EL thereunder to prevent water and oxygen from intruding.

[0116] In some embodiments, as shown in FIG1 , the second electrodes 12 of different color sub-pixels P are disposed in different layers and are separated from each other. In this way, the second electrodes 12 of different color sub-pixels P can be independently designed, which helps reduce signal interference between different color sub-pixels P and improves the display effect of the display substrate.

[0117] For example, as shown in FIG1 , the second electrode 12 of the red sub-pixel PR and the second electrode 12 of the green sub-pixel PG are arranged in different layers and are separated from each other, and the second electrode 12 of the green sub-pixel PG and the second electrode 12 of the blue sub-pixel PB are arranged in different layers and are separated from each other. Similarly, the second electrode 12 of the blue sub-pixel PB and the second electrode 12 of the red sub-pixel PR are arranged in different layers and are separated from each other (not shown in FIG1 ).

[0118] Exemplarily, as shown in FIG1 , the orthographic projections of the second electrodes 12 of two adjacent sub-pixels P with different colors on the base substrate 10 overlap.

[0119] For example, as shown in FIG1 , the orthographic projections of the second electrode 12 of the red sub-pixel PR and the second electrode 12 of the green sub-pixel PG on the base substrate 10 overlap, and the orthographic projections of the second electrode 12 of the green sub-pixel PG and the second electrode 12 of the blue sub-pixel PB on the base substrate 10 overlap. Similarly, the orthographic projections of the second electrode 12 of the blue sub-pixel PB and the second electrode 12 of the red sub-pixel PR on the base substrate 10 may also overlap (not shown in FIG1 ).

[0120] Exemplarily, as shown in FIG1 , the second electrodes 12 of sub-pixels of the same color are disposed in the same layer. For example, the second electrodes 12 of all red sub-pixels PR are disposed in the same layer and made of the same material, the second electrodes 12 of all green sub-pixels PG are disposed in the same layer and made of the same material, and the second electrodes 12 of all blue sub-pixels PB are disposed in the same layer and made of the same material.

[0121] In some embodiments, as shown in FIG. 1 , light-emitting layers EL of sub-pixels P of different colors are arranged in different layers and are separated from each other.

[0122] For example, as shown in FIG1 , the light-emitting layer EL of the red sub-pixel PR and the light-emitting layer EL of the green sub-pixel PG are arranged in different layers and are separated from each other, and the light-emitting layer EL of the green sub-pixel PG and the light-emitting layer EL of the blue sub-pixel PB are arranged in different layers and are separated from each other. Similarly, the light-emitting layer EL of the blue sub-pixel PB and the light-emitting layer EL of the red sub-pixel PR are arranged in different layers and are separated from each other (not shown in FIG1 ).

[0123] Illustratively, the orthographic projections of the light-emitting layers EL of two adjacent sub-pixels P of different colors on the substrate 10 overlap. For example, as shown in FIG1 , the orthographic projections of the light-emitting layers EL of the red sub-pixel PR and the light-emitting layer EL of the green sub-pixel PG on the substrate 10 overlap, and the orthographic projections of the light-emitting layers EL of the green sub-pixel PG and the light-emitting layer EL of the blue sub-pixel PB on the substrate 10 overlap. Similarly, the orthographic projections of the light-emitting layers EL of the blue sub-pixel PB and the light-emitting layer EL of the red sub-pixel PR on the substrate 10 may also overlap (not shown in FIG1 ).

[0124] Exemplarily, as shown in FIG1 , the light-emitting layers EL of sub-pixels of the same color are disposed in the same layer. For example, the light-emitting layers EL of all red sub-pixels PR are disposed in the same layer and made of the same material, the light-emitting layers EL of all green sub-pixels PG are disposed in the same layer and made of the same material, and the light-emitting layers EL of all blue sub-pixels PB are disposed in the same layer and made of the same material.

[0125] Exemplarily, the encapsulation patterns 13 of sub-pixels P of different colors may be made of the same material, the second electrodes 12 of sub-pixels P of different colors may be made of the same material, and the light-emitting layers EL of sub-pixels P of different colors may be made of different materials.

[0126] In some embodiments, as shown in FIG1 , for the same sub-pixel P (such as a red sub-pixel PR, a green sub-pixel PG, or a blue sub-pixel PB), the outer contour of the light-emitting layer EL projected on the base substrate 10, the outer contour of the second electrode 12 projected on the base substrate 10, and the outer contour of the packaging pattern 13 projected on the base substrate 10 roughly coincide.

[0127] The display substrate provided in this embodiment can be formed using, for example, a photolithography process. The light-emitting layer EL, second electrode 12, and encapsulation pattern 13 within the same sub-pixel P can be simultaneously formed using a single masking process, thereby aligning the edges of the light-emitting layer EL, second electrode 12, and encapsulation pattern 13 within the same sub-pixel P on the pixel definition layer PDL. Furthermore, compared to conventional processes that use a fine metal mask to evaporate the light-emitting material, the use of photolithography to form the light-emitting layer EL can reduce the width of the pixel definition layer PDL between two adjacent openings OP, thereby increasing the pixel density of the display substrate.

[0128] Exemplarily, the minimum size of the orthographic projection of the pixel defining layer PDL located between two adjacent openings OP on the base substrate 10 is less than 19 micrometers and greater than or equal to 8 micrometers.

[0129] In some embodiments, as shown in Figure 1, the display substrate also includes an isolation column 14, the isolation column 14 includes: a column ZT arranged on the side of the pixel defining layer PDL away from the base substrate 10, the orthographic projection of the column ZT on the base substrate 10 is located within the orthographic projection range of the pixel defining layer PDL on the base substrate 10, and one or more composite layers FL arranged on the side of the column ZT away from the base substrate 10, the multiple composite layers FL are stacked, and the composite layer FL includes a light-emitting layer EL, a second electrode 12 and an encapsulation pattern 13 stacked in sequence on the side of the column ZT away from the base substrate 10.

[0130] In this embodiment, as shown in FIG. 1 , by disposing the light-emitting layer EL on the pillar ZT, the height of the isolation pillar 14 is increased, and cross-color interference between two adjacent sub-pixels P is reduced.

[0131] In some embodiments, as shown in FIG1 , two adjacent openings OP in the display area AA are a first opening OP1 and a second opening OP2, and the isolation column 14 includes: a first isolation column 141, located between the first opening OP1 and the second opening OP2, the first isolation column 141 includes two composite layers FL, the two composite layers FL are a first composite layer FL1 and a second composite layer FL2, and in an orthographic projection on the base substrate 10, the first composite layer FL1 is disposed close to the first opening OP1, and the second composite layer FL2 is disposed close to the second opening OP2, and the edges of the first composite layer FL1 and the second composite layer FL2 that are close to each other overlap, and in the overlapping area OL, the second composite layer FL2 is located on the side of the first composite layer FL1 that is away from the base substrate 10.

[0132] As shown in FIG. 1 , in the orthographic projection on the base substrate 10 , the edge regions of the first composite layer FL1 and the second composite layer FL2 overlap with the edge regions of the second composite layer FL2 and the first composite layer FL1 in the overlapping region OL.

[0133] Exemplarily, as shown in FIG. 1 , the orthographic projection of the overlapping region OL on the base substrate 10 is located within the orthographic projection range of the pixel defining layer PDL on the base substrate 10 .

[0134] Exemplarily, the ratio of the orthographic projection size of the overlapping region OL on the base substrate 10 to the orthographic projection size of the pixel defining layer PDL on the base substrate 10 is less than or equal to one half.

[0135] Exemplarily, as shown in FIG. 1 , in an orthographic projection on the base substrate 10 , the overlapping region OL is substantially centrally disposed between the first opening OP1 and the second opening OP2 .

[0136] As shown in Figure 1, the light-emitting layer EL in the first composite layer FL1 and the light-emitting layer EL in the first opening OP1 are arranged on the same layer, and the light-emitting layer EL in the second composite layer FL2 and the light-emitting layer EL in the second opening OP2 are arranged on the same layer. The light-emitting layer EL in the first opening OP1 and the light-emitting layer EL in the second opening OP2 are used to emit light of different colors.

[0137] Exemplarily, as shown in Figure 1, if the first opening OP1 is the opening OP of the red sub-pixel PR, and the second opening OP2 is the opening OP of the green sub-pixel PG, the light-emitting layer EL in the first composite layer FL1 is arranged on the same layer and made of the same material as the light-emitting layer EL at the opening OP of the red sub-pixel PR, the second electrode 12 in the first composite layer FL1 is arranged on the same layer and made of the same material as the second electrode 12 at the opening OP of the red sub-pixel PR, the first composite layer FL1 and the packaging pattern 13 are arranged on the same layer and made of the same material as the packaging pattern 13 at the opening OP of the red sub-pixel PR, the light-emitting layer EL in the second composite layer FL2 is arranged on the same layer and made of the same material as the light-emitting layer EL at the opening OP of the green sub-pixel PG, the second electrode 12 in the second composite layer FL2 is arranged on the same layer and made of the same material as the second electrode 12 at the opening OP of the green sub-pixel PG, and the packaging pattern 13 in the second composite layer FL2 is arranged on the same layer and made of the same material as the packaging pattern 13 at the opening OP of the green sub-pixel PG.

[0138] In some embodiments, as shown in FIG1 , the opening OP in the display area AA near the non-display area NA is a third opening OP3, and the isolation column 14 includes: a second isolation column 142, located between the third opening OP3 and the non-display area NA, the second isolation column 142 includes a composite layer FL, the composite layer FL is a third composite layer FL3, and the light-emitting layer EL in the third composite layer FL3 is arranged on the same layer as the light-emitting layer EL in the third opening OP3.

[0139] Exemplarily, as shown in Figure 1, the third opening OP3 is the opening OP of the blue sub-pixel PB, the light-emitting layer EL in the third composite layer FL3 is arranged on the same layer and made of the same material as the light-emitting layer EL at the opening OP of the blue sub-pixel PB, the second electrode 12 in the third composite layer FL3 is arranged on the same layer and made of the same material as the second electrode 12 at the opening OP of the blue sub-pixel PB, and the packaging pattern 13 in the third composite layer FL3 is arranged on the same layer and made of the same material as the packaging pattern 13 at the opening OP of the blue sub-pixel PB.

[0140] As shown in FIG. 1 , the first spacer 141 is located inside the display area AA, and the second spacer 142 is located at the boundary between the display area AA and the non-display area NA.

[0141] In some embodiments, as shown in FIG. 1 , the column ZT, the light-emitting layer EL on the side of the column ZT facing away from the base substrate 10 , and the end surface of the second electrode 12 facing the opening OP of the sub-pixel P where the light-emitting layer EL is located are all covered by the encapsulation pattern 13 .

[0142] Exemplarily, as shown in Figure 1, the light-emitting layer EL located in the same sub-pixel P is divided into two parts by the column ZT, namely the edge light-emitting pattern EL2 and the center light-emitting pattern EL1. The edge light-emitting pattern EL2 is located on the side of the column ZT away from the base substrate 10. The edge light-emitting pattern EL2 is arranged around the periphery of the center light-emitting pattern EL1. The edge light-emitting pattern EL2 and the center light-emitting pattern EL1 are disconnected at the edge of the column ZT, and the edge light-emitting pattern EL2 has an end face facing the opening OP of the sub-pixel P where it is located.

[0143] Exemplarily, as shown in FIG1 , the second electrode 12 located in the same sub-pixel P is divided into two parts by the column ZT, namely an edge electrode pattern 122 and a central electrode pattern 121. The edge electrode pattern 122 is located on the side of the column ZT away from the base substrate 10. The edge electrode pattern 122 is arranged around the periphery of the central electrode pattern 121. The edge electrode pattern 122 and the central electrode pattern 121 are disconnected at the edge of the column ZT, and the edge electrode pattern 122 has an end face facing the opening OP of the sub-pixel P where it is located.

[0144] As shown in Figure 1, the red sub-pixel PR, the end surface of the column ZT located outside the opening OP of the red sub-pixel PR facing the opening OP of the red sub-pixel PR, the end surface of the edge light-emitting pattern EL2 located in the red sub-pixel PR facing the opening OP of the red sub-pixel PR, and the end surface of the edge electrode pattern 122 located in the red sub-pixel PR facing the opening OP of the red sub-pixel PR are all covered by the packaging pattern 13 located in the red sub-pixel PR.

[0145] As shown in Figure 1, the end face of the column ZT located outside the opening OP of the green sub-pixel PG facing the opening OP of the green sub-pixel PG, the end face of the edge light-emitting pattern EL2 located at the green sub-pixel PG facing the opening OP of the green sub-pixel PG, and the end face of the edge electrode pattern 122 located at the green sub-pixel PG facing the opening OP of the green sub-pixel PG are all covered by the packaging pattern 13 located at the green sub-pixel PG.

[0146] As shown in Figure 1, the blue sub-pixel PB, the end surface of the column ZT located outside the opening OP of the blue sub-pixel PB facing the opening OP of the blue sub-pixel PB, the end surface of the edge light-emitting pattern EL2 located in the blue sub-pixel PB facing the opening OP of the blue sub-pixel PB, and the end surface of the edge electrode pattern 122 located in the blue sub-pixel PB facing the opening OP of the blue sub-pixel PB are all covered by the packaging pattern 13 located in the blue sub-pixel PB.

[0147] In some embodiments, as shown in Figure 1, the column ZT includes a first sub-column ZT1 and a second sub-column ZT2, the second sub-column ZT2 is located between the first sub-column ZT1 and the composite layer FL, the orthographic projection outline of the first sub-column ZT1 on the base substrate 10 is retracted inward in a direction away from the opening OP relative to the orthographic projection outline of the second sub-column ZT2 on the base substrate 10, and the pixel defining layer PDL, the first sub-column ZT1 and the second sub-column ZT2 form a first groove AC1 with a notch facing the opening OP.

[0148] As shown in Figure 1, the central light-emitting pattern EL1, the central electrode pattern 121 and the packaging pattern 13 all extend from the opening OP into the first groove AC1, and in the first groove AC1, the central electrode pattern 121 is spaced between the central light-emitting pattern EL1 and the first sub-column ZT1 to prevent contact between the light-emitting layer EL and the first sub-column ZT1, thereby avoiding the formation of a water and oxygen intrusion path.

[0149] In some embodiments, as shown in FIG. 1 , the non-display area NA includes a first retaining wall DAM1 and a second retaining wall DAM2 that are spaced apart from each other, and the first retaining wall DAM1 is located between the display area AA and the second retaining wall DAM2 .

[0150] In some embodiments, as shown in FIG1 , the display substrate further includes: a first organic encapsulation layer 15 , which is disposed on a side of the encapsulation pattern 13 facing away from the base substrate 10 ; an edge of the first organic encapsulation layer 15 is located between the display area AA and the first retaining wall DAM1 , and is disposed close to the first retaining wall DAM1 ; the first organic encapsulation layer 15 is projected onto the base substrate 10 to cover the entire display area AA and a first portion of the non-display area NA close to the display area AA.

[0151] Exemplarily, as shown in FIG1 , the first organic encapsulation layer 15 ends at the first barrier wall DAM1 , and the first partial area is, for example, the non-display area NA located on a side of the first barrier wall DAM1 close to the display area AA.

[0152] In some embodiments, as shown in Figure 1, the display substrate further includes: a first inorganic encapsulation layer 16, which is arranged on the side of the first organic encapsulation layer 15 away from the base substrate 10, the edge of the first inorganic encapsulation layer 16 is located between the first retaining wall DAM1 and the second retaining wall DAM2, and is arranged close to the second retaining wall DAM2, and the first inorganic encapsulation layer 16 is projected on the base substrate 10 to cover the entire display area AA and a second portion of the non-display area NA close to the display area AA.

[0153] For example, as shown in FIG1 , the first inorganic encapsulation layer 16 ends at the second retaining wall DAM2 , and the second partial area is, for example, the non-display area NA located on a side of the second retaining wall DAM2 close to the display area AA.

[0154] In some embodiments, as shown in Figure 1, the display substrate also includes: a second inorganic encapsulation layer 17, which is arranged between the encapsulation pattern 13 and the first organic encapsulation layer 15, the edge of the second inorganic encapsulation layer 17 is located between the first retaining wall DAM1 and the second retaining wall DAM2, and is arranged close to the second retaining wall DAM2, and the second inorganic encapsulation layer 17 is projected on the base substrate 10 to cover the entire display area AA and a third portion of the non-display area NA close to the display area AA.

[0155] Exemplarily, as shown in FIG1 , the second inorganic encapsulation layer 17 ends at the second retaining wall DAM2 , and the third portion is, for example, the non-display area NA located on a side of the second retaining wall DAM2 close to the display area AA.

[0156] By adding a second inorganic encapsulation layer 17 between the encapsulation pattern 13 and the first organic encapsulation layer 15 , the side surfaces of the isolation columns 14 can be better protected to prevent water and oxygen from invading from the side surfaces of the isolation columns 14 .

[0157] For example, the light emitting device LDLD may be an organic light emitting diode (OLED), a quantum dot light emitting diode (QLED), or a micro light emitting diode (Micro LED).

[0158] The present disclosure provides a display substrate, as shown in Figures 2 to 4, which includes: a base substrate 10, including a display area AA and a non-display area NA, the display area AA including a plurality of sub-pixels P; a pixel defining layer PDL, located on one side of the base substrate 10, for defining an opening OP of the sub-pixel P, the opening OP being used to set a light-emitting device LD; and an isolation column 14, arranged on a side of the pixel defining layer PDL away from the base substrate 10, the isolation column 14 including a first isolation column 141 and a second isolation column 142, the first isolation column 141 being located between two adjacent openings OP, and the second isolation column 142 being located between the opening OP close to the non-display area NA and the non-display area NA.

[0159] The first isolation pillar 141 is different from the second isolation pillar 142 . For example, the first isolation pillar 141 and the second isolation pillar 142 have different sizes and / or structures.

[0160] Exemplarily, the orthographic projection of the isolation column 14 on the base substrate 10 is located within the orthographic projection range of the pixel defining layer PDL on the base substrate 10 .

[0161] In the display substrate provided by the present disclosure, the first isolation column 141 is located inside the display area AA, and the second isolation column 142 is located at the junction of the display area AA and the non-display area NA. By differentially designing the first isolation column 141 and the second isolation column 142, the second isolation column 142 at the junction of the display area AA and the non-display area NA plays a role in reducing the overflow of the organic encapsulation material, slowing down the leveling speed of the organic encapsulation material in the non-display area NA, shortening the extension distance or climbing width of the organic encapsulation material in the non-display area NA, thereby improving the packaging performance of the display substrate.

[0162] Illustratively, the first isolation column 141 is the first isolation column 141 described in any of the above embodiments, and the second isolation column 142 is the second isolation column 142 described in any of the above embodiments.

[0163] Exemplarily, as shown in FIG. 2 , an orthographic projection size W1 of the second spacer column 142 on the base substrate 10 is larger than an orthographic projection size W2 of the first spacer column 141 on the base substrate 10 .

[0164] Exemplarily, as shown in FIG. 2 , an orthographic projection size W1 of the second spacer column 142 on the base substrate 10 is greater than or equal to three times an orthographic projection size W2 of the first spacer column 141 on the base substrate 10 .

[0165] By widening the second spacer column 142, the leveling speed of the organic encapsulation material within the non-display area NA can be reduced. Comparing Figures 1 and 2, it can be seen that the extension distance or ramp width of the first organic encapsulation layer 15 in the display substrate shown in Figure 2 is shortened in the non-display area NA, thereby allowing the position of the first retaining wall DAM1 in the non-display area NA to move closer to the display area AA. The first retaining wall DAM1 is used to block the organic encapsulation material. While the position of the second retaining wall DAM2 in the non-display area NA remains unchanged, the distance between the extension edge of the first inorganic encapsulation layer 16, located outside the first organic encapsulation layer 15, i.e., on the side away from the base substrate 10, and the first retaining wall DAM1 is increased, significantly improving the encapsulation reliability of the display substrate. While maintaining the distance between the first retaining wall DAM1 and the second retaining wall DAM2, the position of the second retaining wall DAM2 moves closer to the display area AA along with the first retaining wall DAM1, thereby facilitating a narrower bezel for the display substrate.

[0166] The second retaining wall DAM2 is located on the side of the first retaining wall DAM1 away from the display area AA. The edge of the inorganic encapsulating material generally ends between the first retaining wall DAM1 and the second retaining wall DAM2, near the second retaining wall DAM2. The edge of the organic encapsulating material generally ends between the display area AA and the first retaining wall DAM1, near the first retaining wall DAM1.

[0167] Exemplarily, as shown in FIG. 2 , the thickness H1 of the second spacer pillar 142 is greater than the thickness H2 of the first spacer pillar 141 .

[0168] For example, as shown in FIG2 , the thickness H1 of the second spacer 142 is greater than or equal to 1.5 times the thickness H2 of the first spacer 141, and less than or equal to 5 times or 3 times the thickness H2 of the first spacer 141. Thus, the second spacer 142 can ensure that the organic encapsulation material can flow outward, allowing it to cover a portion of the non-display area NA, thereby improving the encapsulation performance of the display substrate, while also slowing the leveling speed of the organic encapsulation material, thereby shortening its extension distance, thereby also improving the encapsulation performance of the display substrate.

[0169] Exemplarily, the thickness H2 of the first isolation column 141 is, for example, 1 micrometer.

[0170] By heightening the second isolation column 142, the leveling speed of the organic encapsulation material within the non-display area NA can be reduced. Comparing Figures 1 and 2, it can be seen that the extension distance or ramp width of the first organic encapsulation layer 15 in the display substrate shown in Figure 2 is shortened in the non-display area NA, thereby allowing the position of the first retaining wall DAM1 in the non-display area NA to move closer to the display area AA. Furthermore, while the position of the second retaining wall DAM2 in the non-display area NA remains unchanged, the distance between the extension edge of the inorganic encapsulation layer 16 located on the outside of the organic encapsulation material, i.e., on the side away from the base substrate 10, and the first retaining wall DAM1 is increased, significantly improving the packaging reliability of the display substrate. While maintaining the distance between the first retaining wall DAM1 and the second retaining wall DAM2 unchanged, the position of the second retaining wall DAM2 moves closer to the display area AA along with the first retaining wall DAM1, thereby facilitating the narrowing of the display substrate's frame.

[0171] For example, as shown in FIG3 or FIG4 , one (as shown in FIG3 or FIG4 ) or multiple second grooves AC2 (as shown in FIG5 d ) are provided in the second isolation column 142 , the notch of the second groove AC2 faces away from the base substrate 10 , and the multiple second grooves AC2 are arranged along the first direction f1 , and the first direction f1 is the direction from the display area AA to the non-display area NA.

[0172] Exemplarily, the second groove AC2 may be formed by, for example, an etching process.

[0173] By providing a second groove AC2 within the second isolation column 142, the leveling speed of the organic encapsulation material within the non-display area NA can be reduced. Comparing Figures 1 and 4 , it can be seen that the extension distance or ramp width of the first organic encapsulation layer 15 in the display substrate shown in Figure 4 is shortened in the non-display area NA, thereby allowing the position of the first retaining wall DAM1 in the non-display area NA to move closer to the display area AA. Furthermore, while the position of the second retaining wall DAM2 in the non-display area NA remains unchanged, the distance between the extension edge of the inorganic encapsulation layer 16 located outside the organic encapsulation material, i.e., on the side away from the base substrate 10, and the first retaining wall DAM1 is increased, significantly improving the packaging reliability of the display substrate. While maintaining the distance between the first retaining wall DAM1 and the second retaining wall DAM2, the position of the second retaining wall DAM2 moves with the first retaining wall DAM1 toward the display area AA, thereby facilitating a narrow frame for the display substrate.

[0174] Exemplarily, as shown in FIG. 3 to FIG. 5 , in an orthographic projection on the base substrate 10 , the one or more second grooves AC2 are centrally disposed relative to the second isolation pillars 142 .

[0175] Exemplarily, the depth H3 of the second groove AC2 is greater than or equal to 1.5 times the thickness H2 of the first isolation column 141 , and less than the sum of the thicknesses of the second isolation column 142 and the pixel defining layer PDL.

[0176] For example, the second groove AC2 can be formed using an etching process, etching from the surface of the second isolation column 142 away from the base substrate 10 to the surface closer to the base substrate 10. Before the second isolation column 142 forms the encapsulation pattern 13, the second electrode 12, the light-emitting layer EL, and the column ZT are sequentially etched. The etching can be stopped before the pixel definition layer PDL, as shown in FIG3. The resulting second groove AC2 has a groove depth H3 less than or equal to the thickness H2 of the second isolation column 142. Of course, a portion of the pixel definition layer PDL can also be etched away, as shown in FIG4. The resulting second groove AC2 has a groove depth H3 less than the sum of the thickness H2 of the second isolation column 142 and the thickness of the pixel definition layer PDL. After the etching is completed, the encapsulation pattern 13 is formed, and the second isolation column 142 is obtained.

[0177] 5 , the longitudinal cross-section of the second groove AC2 includes at least one of the following shapes: a polygon and a polygon with rounded corners, and the polygon includes at least one of the following shapes: a rectangle, a regular trapezoid, and an inverted trapezoid. The longitudinal cross-section is a cross-section of the second groove AC2 perpendicular to the base substrate 10 .

[0178] As shown in FIG. 5 a , a second groove AC2 is provided in the second isolation column 142 , and the longitudinal cross-section of the second groove AC2 is a rectangle.

[0179] As shown in FIG. 5 b , a second groove AC2 is provided in the second isolation column 142 . The longitudinal cross-section of the second groove AC2 is a rectangular shape with rounded corners.

[0180] As shown in Figure 5 c, a second groove AC2 is provided in the second isolation column 142. The longitudinal cross-section of the second groove AC2 is a trapezoid, and the long side of the trapezoid is close to the base substrate 10. Of course, the long side of the trapezoid can also be away from the base substrate 10.

[0181] As shown in FIG. 5 d , two second grooves AC2 arranged along the first direction f1 are provided in the second isolation column 142 , and the longitudinal cross-section of each second groove AC2 is a rectangle.

[0182] It should be noted that the number of second grooves AC2 set in the second isolation column 142 and the longitudinal cross-sectional shape of the second groove AC2 are not limited to the above-mentioned ones. Any shape formed by etching the groove from the upper surface of the second isolation column 142 downward is within the protection scope of the present disclosure.

[0183] In some embodiments, as shown in FIG6 , the display substrate further includes: an encapsulation layer EP, which is disposed on the side of the isolation column 14 away from the base substrate 10; a first light shielding layer BM1, which is disposed on the side of the encapsulation layer EP away from the base substrate 10, and the orthographic projection of the first light shielding layer BM1 on the base substrate 10 is located within the orthographic projection range of the pixel definition layer PDL on the base substrate 10; a first low-fold layer DZ1, which is disposed on the side of the first light shielding layer BM1 away from the base substrate 10, and the orthographic projection of the first low-fold layer DZ1 on the base substrate 10 is located within the orthographic projection range of the pixel definition layer PDL on the base substrate 10. The first color filter layer CF1 is arranged on the side of the encapsulation layer EP and the first low-fold layer DZ1 facing away from the base substrate 10, and includes a plurality of first color filter patterns R1 / G1 / B1. In the orthographic projection on the base substrate 10, different first color filter patterns R1 / G1 / B1 cover different openings OP, and the first color filter patterns R1 / G1 / B1 also cover the side of the first low-fold layer DZ1 facing the opening OP; and the first high-fold layer GZ1 is arranged on the side of the first color filter layer CF1 and the first low-fold layer DZ1 facing away from the base substrate 10.

[0184] The refractive index of the first color filter pattern R1 / G1 / B1 is greater than that of the first low-fold layer DZ1 and less than that of the first high-fold layer GZ1. The interface between the first low-fold layer DZ1 and the first color filter pattern R1 / G1 / B1 can cause total reflection of incident light.

[0185] As shown in Figure 6, a portion of the light emitted by the light-emitting device LD at the opening OP is obliquely incident on the interface between the first low-fold layer DZ1 and the first color filter pattern R1 / G1 / B1, and is totally reflected at the interface. After total reflection, the lateral light is converted into forward light, thereby improving the light extraction efficiency and reducing the power consumption of the screen.

[0186] FIG7 shows a display substrate in the related art. Since the second isolation pillars 142 therein cannot effectively block the organic encapsulation material, the organic encapsulation layer 16 has a large extension distance in the non-display area NA, resulting in poor edge flatness of the formed organic encapsulation layer 16. The flatness difference is Gap1 as shown in FIG7 . The flatness difference Gap1 further causes the first color filter layer CF1 to have a flatness difference Gap2 at the corresponding position, resulting in the undesirable phenomenon of bright edges around the display area AA, as shown in FIG8 .

[0187] Using the display substrate provided by the present disclosure, as shown in FIG6 , the second isolation column 142 can effectively block the organic encapsulation material, thereby hindering the leveling of the organic encapsulation material, reducing the climbing width and epitaxial distance of the organic encapsulation material, thereby improving the flatness of the edge of the organic encapsulation layer 16, and further improving the flatness and surface height uniformity of the first color filter layer CF1, thereby alleviating the problem of brightening around the display area AA.

[0188] Exemplarily, the first color filter pattern R1 / G1 / B1 includes a first red color filter pattern R1 located in the red sub-pixel PR, a first green color filter pattern G1 located in the green sub-pixel PG, and a first blue color filter pattern B1 located in the blue sub-pixel PB.

[0189] For example, the thickness of the first color filter patterns R1 / G1 / B1 of different colors varies. By designing the thickness of the first color filter patterns R1 / G1 / B1 of different colors differently, the L-decay of different colored light after total internal reflection can be balanced with the change in viewing angle, and the color cast trajectory can also be optimized and improved.

[0190] Exemplarily, as shown in FIG9 , the side slope angle a of the first low-fold layer DZ1 toward the opening OP is greater than or equal to 55° and less than or equal to 75°.

[0191] For example, as shown in FIG9 , in the orthographic projection on the base substrate 10, the outline of the first light-shielding layer BM1 extends outward by a first distance O1 relative to the outline of the opening OP, and the outline of the first low-fold layer DZ1 extends outward by a second distance O2 relative to the outline of the opening OP, and the first distance O1 is greater than the second distance O2. In this way, the side-emitting light can be converted into forward light through total reflection as much as possible, thereby reducing the influence of the light absorption of the first light-shielding layer BM1 on the emitted light.

[0192] For sub-pixels P of different colors, the first distance O1 and the second distance O2 may be the same, or they may be designed differently according to actual color shift trajectory.

[0193] In some embodiments, as shown in FIG10 , the spacer 14 includes a third inorganic encapsulation layer 18 , which is disposed within the spacer 14 and away from the base substrate 10 . The third inorganic encapsulation layer 18 covers the light-emitting device LD. Accordingly, the display substrate further includes: a second low-fold layer DZ2 disposed on a side of the spacer 14 facing away from the base substrate 10; a second organic encapsulation layer 19 disposed on a side of the second low-fold layer DZ2 and the third inorganic encapsulation layer 18 facing away from the base substrate 10; and a fourth inorganic encapsulation layer 20 disposed on a side of the second organic encapsulation layer 19 facing away from the base substrate 10.

[0194] The refractive index of the second low-fold layer DZ2 is lower than that of the second organic encapsulation layer 19 and the third inorganic encapsulation layer 18, and the refractive index of the second organic encapsulation layer 19 is higher than that of the fourth inorganic encapsulation layer 20. The interface between the second low-fold layer DZ2 and the second organic encapsulation layer 19 can cause total reflection of incident light.

[0195] As shown in Figure 10, a portion of the light emitted by the light-emitting device LD at the opening OP is obliquely incident on the interface between the second low-fold layer DZ2 and the second organic encapsulation layer 19, and is totally reflected at the interface. After total reflection, the lateral light is converted into forward light, thereby improving the light extraction efficiency and reducing the power consumption of the screen.

[0196] Furthermore, since sidelight is converted to forward light, the flatness requirements for the second organic encapsulation layer 19 are higher from the perspectives of luminous uniformity and viewing angle, especially the flatness of the edge of the display area AA. Using the display substrate provided by the present disclosure, as shown in Figure 10, the second spacers 142 effectively block the organic encapsulation material, thereby hindering its leveling and reducing the slope width and extension distance of the organic encapsulation material. This improves the flatness of the edge of the second organic encapsulation layer 19 and enhances the edge-emitting display effect.

[0197] Exemplarily, as shown in FIG. 10 , the slope angle b of the side surface of the isolation column 14 toward the opening OP is greater than or equal to 55° and less than or equal to 75°.

[0198] As shown in FIG. 10 , the longitudinal cross-section of the spacer column 14 is a trapezoid, and the long side of the trapezoid is close to the base substrate 10 .

[0199] In some embodiments, as shown in Figure 11, the display substrate also includes: a second light-shielding layer BM2, which is arranged on the side of the fourth inorganic encapsulation layer 20 away from the base substrate 10, and the orthographic projection of the second light-shielding layer BM2 on the base substrate 10 is located within the orthographic projection range of the pixel defining layer PDL on the base substrate 10; and a second color filter layer CF2, which is arranged on the side of the fourth inorganic encapsulation layer 20 away from the base substrate 10, including a plurality of second color filter patterns R2 / G2 / B2, and in the orthographic projection on the base substrate 10, different second color filter patterns R2 / G2 / B2 cover different openings OP.

[0200] As shown in FIG11 , the second light-shielding layer BM2 and the second color filter layer CF2 form a color filter, which can replace the polarizer and improve the light extraction efficiency of the display substrate.

[0201] Exemplarily, the second color filter pattern R2 / G2 / B2 includes a second red color filter pattern R2 located in the red sub-pixel PR, a second green color filter pattern G2 located in the green sub-pixel PG, and a second blue color filter pattern B2 located in the blue sub-pixel PB.

[0202] For example, the thickness of the second color filter patterns R2 / G2 / B2 of different colors varies. By designing the thickness of the second color filter patterns R2 / G2 / B2 of different colors differently, the L-decay of different colors of light after total internal reflection can be balanced with the change in viewing angle, and the color cast trajectory can also be optimized and improved.

[0203] For example, as shown in FIG12 , in the orthographic projection on the base substrate 10, the outline of the second light-shielding layer BM2 extends outwards by a third distance G1 relative to the outline of the opening OP, and the outline of the second low-fold layer DZ2 extends outwards by a fourth distance G2 relative to the outline of the opening OP, and the third distance G1 is greater than the fourth distance G2. In this way, the side-emitting light can be converted into forward light through total reflection as much as possible, thereby reducing the influence of the light absorption of the second light-shielding layer BM2 on the emitted light.

[0204] For sub-pixels P of different colors, the third distance G1 and the fourth distance G2 may be the same, or they may be designed differently according to actual color shift trajectory.

[0205] In some embodiments, as shown in FIG. 13 , the second spacer pillars 142 are a closed structure surrounding the display area AA.

[0206] For example, the light emitting device LDLD may be an organic light emitting diode (OLED), a quantum dot light emitting diode (QLED), or a micro light emitting diode (Micro LED).

[0207] The present disclosure provides a display device, including: a display substrate as provided in any embodiment; and a driving circuit connected to the display substrate and configured to provide a driving signal to the display substrate.

[0208] Those skilled in the art will appreciate that the display device provided by the present disclosure has the advantages of the display substrate of any of the above embodiments.

[0209] The display device provided by the present disclosure can be: a display module, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a car display device, a smart watch, a fitness wristband, a personal digital assistant, or any other product or component with a display function.

[0210] The present disclosure provides a method for preparing a display substrate, comprising:

[0211] Step S01 : providing a base substrate 10 , the base substrate 10 including a display area AA and a non-display area NA, the display area AA including a plurality of sub-pixels P, and the plurality of sub-pixels P including a first color sub-pixel PR.

[0212] Step S02 : forming a plurality of first electrodes 11 on one side of the base substrate 10 , the plurality of first electrodes 11 including the first electrode 11 of the first color sub-pixel PR, to obtain a display substrate as shown in FIG. 14 .

[0213] Step S03: A pixel definition layer PDL is formed on the side of the first electrode 11 facing away from the base substrate 10. The pixel definition layer PDL is used to define the opening OP of the sub-pixel P. The orthographic projection outline of the first electrode 11 on the base substrate 10 expands outward relative to the orthographic projection outline of the opening OP on the base substrate 10.

[0214] Step S04 : forming a first photoresist layer PR1 on the side of the first electrode 11 and the pixel definition layer PDL facing away from the base substrate 10 .

[0215] For example, between step S03 and step S04, the following step may be further included: forming a pillar ZT on the side of the pixel defining layer PDL facing away from the base substrate 10. Accordingly, step S04 includes: forming a first photoresist layer on the first electrode 11, the pillar ZT, and the side of the pixel defining layer PDL facing away from the base substrate 10, thereby obtaining the display substrate shown in FIG15 .

[0216] Step S05 : using a first mask to expose and develop the first photoresist layer PR1 to form a first photoresist pattern PR1P. As shown in FIG16 , the first photoresist pattern PR1P has a first hollow hole for exposing the first color sub-pixel PR.

[0217] Step S06: Using the first photoresist pattern PR1P as a mask, a first light-emitting material 181, a second electrode material 182 and an encapsulation material 183 are sequentially formed on the first photoresist pattern PR1P and the side of the first color sub-pixel PR facing away from the base substrate 10 to obtain a display substrate as shown in FIG. 17 .

[0218] Step S07: Remove the first photoresist pattern PR1P and the first light-emitting material 181, the second electrode material 182 and the packaging material 183 located on the side of the first photoresist pattern PR1P away from the base substrate 10. The remaining first light-emitting material 181 is the light-emitting layer EL of the first color sub-pixel PR, the remaining second electrode material 182 is the second electrode 12 of the first color sub-pixel PR, and the remaining packaging material 183 is the packaging pattern 13 of the first color sub-pixel PR. The first electrode 11, the light-emitting layer EL and the second electrode 12 of the first color sub-pixel PR constitute the light-emitting device LD of the first color sub-pixel PR, and a display substrate as shown in FIG18 is obtained.

[0219] The display substrate provided in any of the above embodiments can be prepared by using the preparation method provided in the present disclosure.

[0220] The preparation method provided by the present disclosure uses a first photoresist pattern PR1P as a mask to evaporate a light-emitting material at the opening OP of the first color sub-pixel PR. Compared with the related technology using a fine metal mask, the present disclosure can reduce costs, reduce the size of the pixel definition layer PDL between the openings OP, increase the pixel density of the display substrate, and extend the life of the display substrate. It can also independently design the light-emitting devices LD of different color sub-pixels P, especially the second electrode 12 and the packaging pattern 13 in the light-emitting device LD, prevent lateral crosstalk between pixels, realize independent packaging of different sub-pixels P, improve the packaging performance of the display substrate, and prevent the large-area spread of black spots, etc.

[0221] In some embodiments, as shown in FIG14 , the plurality of sub-pixels P further include a second color sub-pixel PG, and the plurality of first electrodes 11 include the first electrode 11 of the second color sub-pixel PG. Accordingly, after step S07, the following may also be included:

[0222] Step S08 : forming a second photoresist layer PR2 on the first electrode 11 , the pixel defining layer PDL, and the encapsulation pattern 13 of the first color sub-pixel PR facing away from the base substrate 10 .

[0223] Step S09 : exposing and developing the second photoresist layer PR2 using a second mask to form a second photoresist pattern PR2P. The second photoresist pattern PR2P has a second hollow hole, and the second hollow hole is used to expose the second color sub-pixel PG.

[0224] Step S10: Using the second photoresist pattern PR2P as a mask, a first light-emitting material 181, a second electrode material 182 and an encapsulation material 183 are sequentially formed on the second photoresist pattern PR2P and the side of the second color sub-pixel PG away from the base substrate 10 to obtain a display substrate as shown in FIG19a.

[0225] Step S11: remove the second photoresist pattern PR2P and the first light-emitting material 181, the second electrode material 182 and the packaging material 183 located on the side of the second photoresist pattern PR2P away from the base substrate 10, and the remaining second light-emitting material 181 is the light-emitting layer EL of the second color sub-pixel PG, the remaining second electrode material 182 is the second electrode 12 of the second color sub-pixel PG, and the remaining packaging material 183 is the packaging pattern 13 of the second color sub-pixel PG, wherein the first electrode 11, the light-emitting layer EL and the second electrode 12 of the second color sub-pixel PG constitute the light-emitting device LD of the second color sub-pixel PG, and a display substrate as shown in Figure 19b is obtained.

[0226] In this embodiment, the second photoresist pattern PR2P is used as a mask to evaporate the light-emitting material at the opening OP of the second color sub-pixel PG.

[0227] In some embodiments, as shown in FIG14 , the plurality of sub-pixels P further include a third color sub-pixel PB, and the plurality of first electrodes 11 include the first electrode 11 of the third color sub-pixel PB. Accordingly, after step S14, the following may also be included:

[0228] Step S12 : forming a third photoresist layer PR3 on the side of the first electrode 11 , the pixel defining layer PDL, the encapsulation pattern 13 of the first color sub-pixel PR, and the encapsulation pattern 13 of the second color sub-pixel PG away from the base substrate 10 .

[0229] Step S13: using a third mask to expose and develop the third photoresist layer PR3 to form a third photoresist pattern PR3P. The third photoresist pattern PR3P has a third hollow hole, and the third hollow hole is used to expose the third color sub-pixel PB.

[0230] Step S14: Using the third photoresist pattern PR3P as a mask, a first light-emitting material 181, a second electrode material 182 and an encapsulation material 183 are sequentially formed on the side of the third photoresist pattern PR3P and the third color sub-pixel PB away from the base substrate 10 to obtain a display substrate as shown in FIG20a.

[0231] Step S15: Remove the third photoresist pattern PR3P and the first light-emitting material 181, the second electrode material 182 and the packaging material 183 located on the side of the third photoresist pattern PR3P away from the base substrate 10. The remaining third light-emitting material 181 is the light-emitting layer EL of the third color sub-pixel PB, the remaining second electrode material 182 is the second electrode 12 of the third color sub-pixel PB, and the remaining packaging material 183 is the packaging pattern 13 of the third color sub-pixel PB. The first electrode 11, the light-emitting layer EL and the second electrode 12 of the third color sub-pixel PB constitute the light-emitting device LD of the third color sub-pixel PB, and a display substrate as shown in FIG20b is obtained.

[0232] In this embodiment, the third photoresist pattern PR3P is used as a mask to evaporate the light-emitting material at the opening OP of the third color sub-pixel PB.

[0233] In the present disclosure, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0234] In the present disclosure, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on the present disclosure.

[0235] In this disclosure, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, product, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, commodity, or apparatus that includes the element.

[0236] References in this disclosure to "one embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "an example," "an example," "some examples," and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0237] In this disclosure, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any actual relationship or order between these entities or operations.

[0238] In this specification, the terms "electrically connected" and "coupled" include components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0239] In this specification, the term "same-layer arrangement" refers to a structure formed by patterning two (or more) structures using the same patterning process. The materials of these structures can be the same or different. For example, the precursor materials for forming the multiple structures arranged in the same layer can be the same, and the materials of the final structures can be the same or different.

[0240] The polygons in this specification are not in the strict sense, and may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, rounded corners, arc edges and deformations.

[0241] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0242] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0243] The use of "for" or "configured to" in this disclosure is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0244] As used in this disclosure, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0245] As used in this disclosure, "parallel", "perpendicular", "equal", and "flush" include the situations described and situations similar to the situations described, where the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, a deviation within 10° or 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, a deviation within 10° or 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, that the difference between the two being equal is less than or equal to 5% of either one. "Flush" includes absolute equality and approximate flushness, where the acceptable deviation range for approximate flushness can be, for example, that the distance between the two being flush is less than or equal to 5% of either one's size.

[0246] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0247] The present disclosure describes exemplary embodiments with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown in this disclosure, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0248] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. A display substrate, comprising: A base substrate, comprising a display area and a non-display area, wherein the display area comprises a plurality of sub-pixels, and the plurality of sub-pixels comprises sub-pixels of multiple colors; A pixel defining layer, disposed on one side of the base substrate, for defining openings of the sub-pixels; a light-emitting device, disposed at the opening, comprising a first electrode, a light-emitting layer, and a second electrode stacked in sequence, wherein the first electrode is located between the pixel defining layer and the base substrate, and the light-emitting layer is located on a side of the first electrode and the pixel defining layer facing away from the base substrate; as well as A plurality of encapsulation patterns are located in different sub-pixels, wherein the encapsulation patterns are located on a side of the second electrode away from the base substrate, and the encapsulation patterns of sub-pixels of different colors are arranged in different layers and are separated from each other.

2. The display substrate according to claim 1, wherein The display substrate further includes an isolation column, and the isolation column includes: a column disposed on the pixel defining layer at a side facing away from the base substrate, wherein the orthographic projection of the column on the base substrate is within the orthographic projection range of the pixel defining layer on the base substrate; and One or more composite layers are arranged on the side of the column away from the base substrate. The multiple composite layers are stacked, and the composite layers include a light-emitting layer, a second electrode and a packaging pattern stacked in sequence on the side of the column away from the base substrate.

3. The display substrate according to claim 2, wherein: The two adjacent openings in the display area are a first opening and a second opening, and the isolation column includes: a first spacer column located between the first opening and the second opening, the first spacer column comprising two composite layers, namely a first composite layer and a second composite layer; in an orthographic projection on the base substrate, the first composite layer is disposed proximate to the first opening, and the second composite layer is disposed proximate to the second opening; edges of the first composite layer and the second composite layer that are close to each other overlap, and within the overlapping region, the second composite layer is located on a side of the first composite layer facing away from the base substrate; The light-emitting layer in the first composite layer is arranged on the same layer as the light-emitting layer in the first opening, and the light-emitting layer in the second composite layer is arranged on the same layer as the light-emitting layer in the second opening. The light-emitting layer in the first opening and the light-emitting layer in the second opening are used to emit light of different colors.

4. The display substrate according to claim 3, wherein: In an orthographic projection on the base substrate, the overlapping region is substantially centrally disposed between the first opening and the second opening.

5. The display substrate according to claim 2, wherein: The opening in the display area close to the non-display area is a third opening, and the isolation column includes: The second isolation column is located between the third opening and the non-display area. The second isolation column includes a composite layer, which is a third composite layer. The light-emitting layer in the third composite layer is arranged in the same layer as the light-emitting layer in the third opening.

6. The display substrate according to claim 2, wherein: The column, the light-emitting layer located on the side of the column away from the base substrate, and the end surface of the second electrode facing the sub-pixel opening where the light-emitting layer is located are all covered by the packaging pattern.

7. The display substrate according to claim 6, wherein: The column includes a first sub-column and a second sub-column, the second sub-column is located between the first sub-column and the composite layer, the orthographic projection outline of the first sub-column on the substrate is retracted inward in a direction away from the opening relative to the orthographic projection outline of the second sub-column on the substrate, and the pixel defining layer, the first sub-column, and the second sub-column form a first groove with a notch facing the opening; The light-emitting layer, the second electrode and the packaging pattern all extend from the opening into the first groove, and in the first groove, the second electrode is spaced between the light-emitting layer and the first sub-column.

8. The display substrate according to any one of claims 1 to 7, wherein: For the same sub-pixel, the orthographic projection outer contour of the light-emitting layer on the base substrate, the orthographic projection outer contour of the second electrode on the base substrate, and the orthographic projection outer contour of the packaging pattern on the base substrate substantially overlap.

9. The display substrate according to any one of claims 1 to 7, wherein: The second electrodes of sub-pixels of different colors are in different layers and are separated from each other.

10. The display substrate according to claim 1, wherein: The non-display area includes a first retaining wall and a second retaining wall that are separated from each other, wherein the first retaining wall is located between the display area and the second retaining wall, and the display substrate further includes: a first organic encapsulation layer, disposed on a side of the encapsulation pattern facing away from the base substrate, wherein an edge of the first organic encapsulation layer is located between the display area and the first retaining wall and is disposed close to the first retaining wall, and an orthographic projection of the first organic encapsulation layer on the base substrate covers the entire display area and a first portion of the non-display area close to the display area; and A first inorganic encapsulation layer is arranged on a side of the first organic encapsulation layer facing away from the base substrate, an edge of the first inorganic encapsulation layer is located between the first retaining wall and the second retaining wall, and is arranged close to the second retaining wall, and the first inorganic encapsulation layer is projected on the base substrate to cover the entire display area and a second portion of the non-display area close to the display area.

11. The display substrate according to claim 10, wherein: The display substrate further includes: A second inorganic encapsulation layer is arranged between the encapsulation pattern and the first organic encapsulation layer, the edge of the second inorganic encapsulation layer is located between the first retaining wall and the second retaining wall, and is arranged close to the second retaining wall. The second inorganic encapsulation layer is projected on the base substrate to cover the entire display area and a third part of the non-display area close to the display area.

12. A display substrate, comprising: A base substrate comprising a display area and a non-display area, wherein the display area comprises a plurality of sub-pixels; a pixel defining layer, located on one side of the base substrate, for defining an opening of the sub-pixel, wherein the opening is used for arranging a light-emitting device; Isolation columns are provided on a side of the pixel defining layer away from the base substrate, the isolation columns comprising a first isolation column and a second isolation column, the first isolation column being located between two adjacent openings, and the second isolation column being located between the opening close to the non-display area and the non-display area; Wherein, the orthographic projection size of the second isolation column on the base substrate is larger than the orthographic projection size of the first isolation column on the base substrate; and / or, The thickness of the second spacer is greater than the thickness of the first spacer; and / or, One or more second grooves are provided in the second isolation column, the notches of the second grooves are facing away from the base substrate, and the plurality of second grooves are arranged along a first direction, which is a direction from the display area to the non-display area.

13. The display substrate according to claim 12, wherein: The orthographic projection size of the second isolation column on the base substrate is greater than or equal to three times the orthographic projection size of the first isolation column on the base substrate.

14. The display substrate according to claim 12, wherein: The thickness of the second isolation column is greater than or equal to 1.5 times the thickness of the first isolation column, and less than or equal to 5 times the thickness of the first isolation column.

15. The display substrate according to claim 12, wherein: A depth of the second groove is greater than or equal to 1.5 times the thickness of the first isolation column and less than the sum of the thicknesses of the second isolation column and the pixel defining layer.

16. The display substrate according to claim 12, wherein: The longitudinal cross-sectional shape of the second groove includes at least one of the following: a polygon and a polygon with rounded corners, and the polygon includes at least one of the following: a rectangle, a regular trapezoid, and an inverted trapezoid.

17. The display substrate according to claim 12, wherein: The display substrate further includes: an encapsulation layer, disposed on a side of the isolation column away from the base substrate; a first light-shielding layer, disposed on a side of the encapsulation layer facing away from the base substrate, wherein an orthographic projection of the first light-shielding layer on the base substrate is located within a range of an orthographic projection of the pixel defining layer on the base substrate; a first low-fold layer, disposed on a side of the first light-shielding layer facing away from the base substrate, wherein an orthographic projection of the first low-fold layer on the base substrate is within a range of an orthographic projection of the pixel defining layer on the base substrate; a first color filter layer, disposed on a side of the encapsulation layer and the first low-fold layer facing away from the base substrate, comprising a plurality of first color filter patterns, wherein different first color filter patterns cover different openings in an orthographic projection on the base substrate, and the first color filter patterns also cover a side of the first low-fold layer facing the opening; and A first high-fold layer is provided on a side of the first color filter layer and the first low-fold layer away from the base substrate; The refractive index of the first color filter pattern is greater than that of the first low-fold layer and less than that of the first high-fold layer. The interface between the first low-fold layer and the first color filter pattern can cause total reflection of incident light.

18. The display substrate according to claim 12, wherein: The isolation column includes a third inorganic encapsulation layer, the third inorganic encapsulation layer is arranged in the isolation column away from the base substrate, and the third inorganic encapsulation layer covers the light emitting device; The display substrate further includes: a second low-fold layer, disposed on a side of the isolation column away from the base substrate; a second organic encapsulation layer, disposed on a side of the second low-fold layer and the third inorganic encapsulation layer away from the base substrate; and a fourth inorganic encapsulation layer, disposed on a side of the second organic encapsulation layer facing away from the base substrate; The refractive index of the second low-fold layer is smaller than that of the second organic encapsulation layer and the third inorganic encapsulation layer, and the refractive index of the second organic encapsulation layer is greater than that of the fourth inorganic encapsulation layer. The interface between the second low-fold layer and the second organic encapsulation layer can cause total reflection of incident light.

19. The display substrate according to claim 18, wherein: The side slope angle of the isolation column toward the opening is greater than or equal to 55° and less than or equal to 75°.

20. The display substrate according to claim 18, wherein The display substrate further includes: a second light-shielding layer, disposed on a side of the fourth inorganic encapsulation layer facing away from the base substrate, wherein an orthographic projection of the second light-shielding layer on the base substrate is within a range of an orthographic projection of the pixel defining layer on the base substrate; and The second color filter layer is arranged on a side of the fourth inorganic encapsulation layer away from the base substrate, and includes a plurality of second color filter patterns. In the orthographic projection on the base substrate, different second color filter patterns cover different openings.

21. The display substrate according to any one of claims 12 to 20, wherein: The second isolation column is a closed structure surrounding the display area.

22. A display device comprising: The display substrate according to any one of claims 1 to 21; as well as The driving circuit is connected to the display substrate and is used to provide a driving signal to the display substrate.

23. A method for preparing a display substrate, comprising: Providing a base substrate, the base substrate comprising a display area and a non-display area, the display area comprising a plurality of sub-pixels, and the plurality of sub-pixels comprising a first color sub-pixel; forming a plurality of first electrodes on one side of the base substrate, the plurality of first electrodes including a first electrode of a first color sub-pixel; forming a pixel defining layer on a side of the first electrode facing away from the base substrate, the pixel defining layer being used to define an opening of the sub-pixel, and an orthographic projection outline of the first electrode on the base substrate being outwardly extended relative to an orthographic projection outline of the opening on the base substrate; forming a first photoresist layer on a side of the first electrode and the pixel defining layer facing away from the base substrate; exposing and developing the first photoresist layer using a first mask to form a first photoresist pattern, wherein the first photoresist pattern has a first hollow hole, and the first hollow hole is used to expose the first color sub-pixel; Using the first photoresist pattern as a mask, sequentially forming a first light-emitting material, a second electrode material, and an encapsulation material on a side of the first photoresist pattern and the first color sub-pixel facing away from the base substrate; The first photoresist pattern and the first light-emitting material, second electrode material and packaging material located on the side of the first photoresist pattern away from the substrate are removed. The remaining first light-emitting material is the light-emitting layer of the first color sub-pixel, the remaining second electrode material is the second electrode of the first color sub-pixel, and the remaining packaging material is the packaging pattern of the first color sub-pixel. The first electrode, light-emitting layer and second electrode of the first color sub-pixel constitute the light-emitting device of the first color sub-pixel.

24. The preparation method according to claim 23, wherein The plurality of sub-pixels further include a second color sub-pixel, the plurality of first electrodes include a first electrode of the second color sub-pixel, and after the step of removing the first photoresist pattern and the first light-emitting material, the second electrode material, and the packaging material located on a side of the first photoresist pattern facing away from the substrate, the method further includes: forming a second photoresist layer on a side of the first electrode, the pixel defining layer, and the encapsulation pattern of the first color sub-pixel facing away from the base substrate; exposing and developing the second photoresist layer using a second mask to form a second photoresist pattern, wherein the second photoresist pattern has a second hollow hole, and the second hollow hole is used to expose the second color sub-pixel; Using the second photoresist pattern as a mask, sequentially forming a second light-emitting material, a second electrode material, and an encapsulation material on a side of the second photoresist pattern and the second color sub-pixel facing away from the base substrate; The second photoresist pattern and the second light-emitting material, second electrode material and packaging material located on the side of the second photoresist pattern away from the substrate are removed. The remaining second light-emitting material is the light-emitting layer of the second color sub-pixel, the remaining second electrode material is the second electrode of the second color sub-pixel, and the remaining packaging material is the packaging pattern of the second color sub-pixel. The first electrode, light-emitting layer and second electrode of the second color sub-pixel constitute the light-emitting device of the second color sub-pixel.

25. The preparation method according to claim 24, wherein The plurality of sub-pixels further include a third color sub-pixel, the plurality of first electrodes include a first electrode of the third color sub-pixel, and after the step of removing the second photoresist pattern and the second light-emitting material, the second electrode material, and the packaging material located on a side of the second photoresist pattern facing away from the base substrate, the method further includes: forming a third photoresist layer on a side of the first electrode, the pixel defining layer, the encapsulation pattern of the first color sub-pixel, and the encapsulation pattern of the second color sub-pixel away from the base substrate; exposing and developing the third photoresist layer using a third mask to form a third photoresist pattern, wherein the third photoresist pattern has a third hollow hole, and the third hollow hole is used to expose the third color sub-pixel; Using the third photoresist pattern as a mask, sequentially forming a third light-emitting material, a second electrode material, and an encapsulation material on a side of the third photoresist pattern and the third color sub-pixel facing away from the base substrate; The third photoresist pattern and the third light-emitting material, second electrode material and packaging material located on the side of the third photoresist pattern away from the substrate are removed. The remaining third light-emitting material is the light-emitting layer of the third color sub-pixel, the remaining second electrode material is the second electrode of the third color sub-pixel, and the remaining packaging material is the packaging pattern of the third color sub-pixel. The first electrode, light-emitting layer and second electrode of the third color sub-pixel constitute the light-emitting device of the third color sub-pixel.

Images