Method for manufacturing a microelectromechanical component, and microelectromechanical component

Abstract

The invention relates to a method for manufacturing a microelectromechanical component (1). In the method, a first microchip (235a) having at least one first microelectromechanical component (240a) is manufactured in a wafer. Furthermore, a first protective cap or a first spacer is applied to a first side of the wafer in order to protect a first sensitive surface of the first microelectromechanical component (240a). In addition, a second microchip (235b) having at least one second microelectromechanical component (240b) is manufactured in the wafer. The second microchip (235b) is arranged separately from the first microchip (235a). Furthermore, a second protective cap or a second spacer is applied to the first side of the wafer in order to protect a second sensitive surface of the second microelectromechanical component (240b). Moreover, the wafer is placed on a base, the first and second protective caps or the first and second spacers being connected to the base. In addition, a first carrier substrate (200a) is connected to the first microchip (235a) and a second carrier substrate (200b) is connected to the second microchip (235b). Furthermore, the first microchip (235a) with the first carrier substrate (200a) is separated from the wafer and then transported to a further base (247), where it is positioned. In addition, the second microchip (235b) with the second carrier substrate (200b) is separated from the wafer and then transported to the further base (247), where it is positioned. Both the first carrier substrate (200a) and the second carrier substrate (200b) are connected to the further base (247). Furthermore, the first carrier substrate (200a) is connected to the second carrier substrate (200b) in such a way that a microelectromechanical component (1) comprising the first (235a) and second microchip (235b) is produced.

Description

[0001] Description

[0002] Method for producing a microelectromechanical component and microelectromechanical component

[0003] The invention relates to a method for producing a microelectromechanical component. Furthermore, the invention relates to a microelectromechanical component.

[0004] State of the art

[0005] It is known to manufacture a plurality of microchips within a wafer, each of which contains at least one microelectromechanical component. This presents challenges regarding the manufacturability, handling, and further processing of the microchips into a single microelectromechanical component.

[0006] Based on this, it is an object of the present invention to develop a method for producing a microelectromechanical component which addresses the challenges described above.

[0007] Disclosure of the invention

[0008] To achieve this object, a method for producing a microelectromechanical component according to claim 1 is proposed. Furthermore, a microelectromechanical component according to claim 12 is proposed.

[0009] In the method for producing a microelectromechanical component, a first microchip is first produced in a wafer, in particular a silicon wafer. The first microchip has at least one first microelectromechanical component. In a further method step, a first protective cap or alternatively a first spacer is applied to a first side of the wafer to protect a first surface of the at least one first microelectromechanical component, which surface is particularly sensitive to mechanical stress. In a further method step, a second microchip is produced in the wafer. The second microchip has at least one second microelectromechanical component and is arranged separated from the first microchip, in particular by a circumferential border. Furthermore, a second protective cap or a second spacer is applied to the first side of the wafer to protect a second,In a further method step, the wafer with the first and second microchip is arranged on a base. The first and second protective caps or alternatively the first and second spacers are connected or in contact with the base. Furthermore, a first carrier substrate, in particular made of ceramic, is connected to the first microchip. In addition, a second carrier substrate, in particular made of ceramic,connected to the second microchip. Subsequently, the first microchip is separated from the wafer with the first carrier substrate and, in a next process step, is transported together with the first carrier substrate to a further base. Furthermore, the first microchip is arranged on the further base. In this case, the first carrier substrate is connected to the further base. In a further process step, the second microchip is separated from the wafer with the second carrier substrate and then transported together with the second carrier substrate to the further base. The second microchip is then arranged on the further base, with the second carrier substrate being connected to the further base. In a further process step, the first carrier substrate is connected to the second carrier substrate in such a way that a, in particular common, microelectromechanical component is produced.which comprises the first and second microchips. The common microelectromechanical component is, in particular, a microphone, a loudspeaker, a resonator, or an inertial sensor. Consequently, in the described method, the first and second microchips are manufactured separately with the associated carrier substrates and then assembled into a common microelectromechanical component. The handling and assembly of the first and second microchips into the common microelectromechanical component takes place not at the level of the fragile first and second microelectromechanical components, but at the level of the stable carrier substrates. This simplifies the handling and further processing of the individual microchips. Furthermore, the yield in wafer production of smaller microchips is higher.

[0010] Preferably, the at least one first microelectromechanical component is at least one first movable micromirror, and the at least one second microelectromechanical component is at least one second movable micromirror. Furthermore, in this context, the first protective cap or the first spacer is applied to the first side of the wafer to protect a first mirror surface as the first surface of the at least one first micromirror that is sensitive, in particular with regard to mechanical stress. Furthermore, the second protective cap or the second spacer is applied to the first side of the wafer to protect a second mirror surface as the second surface of the at least one second micromirror that is sensitive, in particular with regard to mechanical stress.Furthermore, the first carrier substrate is bonded to the second carrier substrate in such a way that a micromirror array comprising the first and second microchips is created. This method has the additional advantage of allowing the micromirror array to achieve the largest possible optical fill factor.

[0011] Preferably, in a further method step, an electronic functional test is carried out on the first microchip and / or second microchip arranged on the base. The electronic functional test takes place before the first and / or second microchip is separated from the wafer. The electronic functional test is in particular a wafer-level test. In a further method step, the first microchip and / or the second microchip is used for the, in particular common, microelectromechanical component depending on the electronic functional test carried out. The separate construction of the first and second microchips with the respective associated carrier substrate thus enables a check before further processing to what extent the individual microchips with the carrier substrates are actually electronically functional.The non-functional microchips can therefore be filtered out before the final bonding of the first carrier substrate to the second carrier substrate, thus saving material.

[0012] Preferably, in a further method step, the first microchip arranged on the base is connected to at least one associated first control unit, in particular a first ASIC. Alternatively or additionally, the second microchip arranged on the base is connected to at least one associated second control unit, in particular a second ASIC. The respective microchip is connected to the associated control unit, in particular by means of a soldering process. The control units serve to control the respectively assigned first or second microelectromechanical component. Preferably, the first microchip is connected to the associated first control unit before the first carrier substrate, in particular made of ceramic, is connected to the first microchip.Alternatively or additionally, the second microchip is connected to the associated second control unit before the second carrier substrate is connected to the second microchip. Consequently, the control units are so-called ASICs, which are spatially arranged between the respective microchip and the associated carrier substrate.

[0013] Preferably, the first microchip and / or the second microchip are manufactured with a first symmetrical cross-section, in particular a rectangular cross-section. Furthermore, the first and / or second carrier substrate are manufactured with a second symmetrical cross-section, in particular a rectangular cross-section. In this context, the first carrier substrate is centrally connected to the first microchip and / or the second carrier substrate is centrally connected to the second microchip. This enables a space-saving construction of the, in particular common, microelectromechanical component.

[0014] Preferably, the first microchip with the first carrier substrate and / or the second microchip with the second carrier substrate are transported to the additional support by means of a tool that engages the respective carrier substrate, in particular a vacuum gripper. The carrier substrate is significantly thicker and less sensitive to handling and further assembly steps than the microchip itself. This engagement with the carrier substrate thus enables stable and secure transport to the additional support.

[0015] Preferably, the further support is designed as a template, in particular in the form of the microelectromechanical component. The first microchip is arranged with the first carrier substrate in a first template shape, associated with the first microchip with the first carrier substrate, in particular a partially bordered shape. In contrast, the second microchip with the second carrier substrate is arranged in a second template shape, associated with the second microchip with the second carrier substrate, in particular a partially bordered shape. This enables better alignment and arrangement of the microchips relative to one another.

[0016] Preferably, the first carrier substrate is joined to the second carrier substrate by means of a joining agent. The joining agent is, in particular, a thermally or UV-curable adhesive or a sintering paste. In this context, it is preferably provided that the first carrier substrate is positioned, in particular, adjusted, relative to the second carrier substrate after the application and before the curing of the joining agent. This allows inaccuracies, such as tilting, in the relative arrangement of the two carrier substrates to be subsequently corrected. Furthermore, optical image recognition is preferably provided, by means of which any necessary readjustment of the two carrier substrates to each other can be detected.

[0017] Preferably, the first microchip with the first carrier substrate and / or the second microchip with the second carrier substrate is separated from the wafer by means of, in particular, mechanical breaking out, stealth dicing, laser dicing, plasma dicing or a sacrificial layer etching process.

[0018] A further subject matter of the present invention is a microelectromechanical component, which is produced in particular according to the method described above. The microelectromechanical component has a first microchip. The first microchip in turn has at least one first microelectromechanical component. Furthermore, the microelectromechanical component has a second microchip, which in turn has at least one second microelectromechanical component. In addition, the microelectromechanical component has a first carrier substrate, in particular made of ceramic, for the first microchip and a second carrier substrate, in particular made of ceramic, for the second microchip. The first carrier substrate is connected to the second carrier substrate in such a way that a, in particular common, microelectromechanical component, comprising the first and second microchip, is created.The microelectromechanical component is in particular a microphone, a loudspeaker, a resonator or an inertial sensor.

[0019] Preferably, the first microelectromechanical component is at least one first movable micromirror, and the at least one second microelectromechanical component is at least one second movable micromirror. In this context, the first carrier substrate is connected to the second carrier substrate in such a way that a micromirror array is created as a, particularly common, microelectromechanical component. Such a micromirror array is used, in particular, to redirect incoming light beams in different directions.

[0020] Preferably, the first carrier substrate has a first, in particular integrated, through-hole plating. The second carrier substrate also has a second, in particular integrated, through-hole plating. Such a through-hole plating enables, for example, signals from the control units to be forwarded to other components, in particular other control units, spatially behind the carrier substrate.

[0021] Preferably, the first microchip and / or second microchip each has a first lateral extent. This first lateral extent extends in particular in a first main extension plane of the first and / or second microchip. Furthermore, the first carrier substrate and / or the second carrier substrate has a second lateral extent. This second lateral extent extends in particular in a second main extension plane of the first and / or second carrier substrate. The first lateral extent is greater than the second lateral extent. Thus, manufacturing tolerances of the microchips can be compensated.

[0022] Description of the drawings

[0023] Figure 1 shows a method for manufacturing a microelectromechanical component.

[0024] Figure 2a shows a first and a second microchip with protective cap in a wafer.

[0025] Figure 2b shows possibilities for separating and transporting a first and second microchip.

[0026] Figure 2c shows a microelectromechanical component in the form of a micromirror array in a template.

[0027] Description of the embodiments

[0028] Figure 1 shows a method for producing a microelectromechanical component in the form of a flowchart. In a method step 5, a first microchip is produced in a wafer, in particular a silicon wafer. The first microchip has at least one first microelectromechanical component. In a further method step 10, a first protective cap or a first spacer is applied to a first side of the wafer to protect a first surface of the at least one first microelectromechanical component, which surface is sensitive, in particular with regard to mechanical stress. In a further method step 20, a second microchip is produced in the wafer. The second microchip has at least one second microelectromechanical component. Furthermore, the second microchip is separated from the first microchip, in particular by a circumferential border.In a further method step 30, a second protective cap or a second spacer is applied to the first side of the wafer to protect a second surface of the at least one second microelectromechanical component that is sensitive, in particular with regard to mechanical stress. In a further method step 40, the wafer with the first and second microchip is arranged on a base. The first and second protective caps or the first and second spacers are connected to the base. In a further method step 60, a first carrier substrate, in particular made of ceramic, is connected to the first microchip and a second carrier substrate, in particular made of ceramic, is connected to the second microchip. In a subsequent method step 90, the first microchip is separated from the wafer and then transported with the first carrier substrate to another base.In a further method step 100, the first microchip is arranged on the further base. In this case, the first carrier substrate is connected to the further base. In a further method step 110, the second microchip is separated from the wafer with the second carrier substrate and then transported with the second carrier substrate to the further base. In a further method step 120, the second microchip is arranged on the further base. In this case, the second carrier substrate is connected to the further base. In a further method step 130, the first carrier substrate is connected to the second carrier substrate in such a way that a, in particular common, microelectromechanical component comprising the first and second microchip is produced.

[0029] Optionally, the at least one first microelectromechanical component is at least one first movable micromirror, and the at least one second microelectromechanical component is at least one second movable micromirror. Furthermore, in this context, the first protective cap or the first spacer is applied to the first side of the wafer to protect a first mirror surface as the first surface of the at least one first micromirror that is sensitive, in particular with regard to mechanical stress. Furthermore, in this context, the second protective cap or the second spacer is applied to the first side of the wafer to protect a second mirror surface as the second surface of the at least one second micromirror that is sensitive, in particular with regard to mechanical stress.Furthermore, in method step 130, the first carrier substrate is connected to the second carrier substrate such that a micromirror array comprising the first and second microchips is created. In an optional method step 70, an electronic functional test, in particular a wafer-level test, is carried out on the first microchip and / or second microchip arranged on the base. The electronic functional test takes place before the first and / or second microchips are separated from the wafer. In a method step 80, a check is carried out to determine whether the functional test has resulted in an electronically functional component. If no electronically functional component has been found, the first microchip and / or the second microchip is discarded in method step 45, and the method begins again. If, however, an electronically functional component has been found, the method continues.

[0030] In an optional method step 50, the first microchip arranged on the base is connected to an associated first control unit, in particular a first ASIC, for example by means of a soldering process. Alternatively or additionally, the second microchip arranged on the base is connected to an associated second control unit, in particular a second ASIC, for example by means of a soldering process. Method step 50 takes place before the first carrier substrate, in particular made of ceramic, is connected to the first microchip and / or before the second carrier substrate is connected to the second microchip.

[0031] Optionally, the first microchip and / or the second microchip are manufactured with a first symmetrical cross-section, in particular a rectangular cross-section. Furthermore, the first and / or second carrier substrate optionally has a second symmetrical cross-section, in particular a rectangular cross-section. In this context, the first carrier substrate is optionally centrally connected to the first microchip and / or the second carrier substrate is centrally connected to the second microchip.

[0032] Optionally, the first microchip with the first carrier substrate and / or the second microchip with the second carrier substrate are transported to the further base by means of a tool engaging the respective carrier substrate, in particular a vacuum gripper. Furthermore, the further base is optionally designed as a template, in particular in the form of the microelectromechanical component. In this context, in method step 100, the first microchip is arranged with the first carrier substrate in a first, in particular partially bordered, shape of the template associated with the first microchip with the first carrier substrate. Furthermore, in this context, in method step 120, the second microchip with the second carrier substrate is arranged in a second, in particular partially bordered, shape of the template associated with the second microchip with the second carrier substrate.

[0033] Further optionally, in method step 130, the first carrier substrate is bonded to the second carrier substrate by means of a joining agent, in particular a thermally or UV-curable adhesive or a sintering paste. In an optional method step 140 following method step 130, the first carrier substrate is positioned, in particular adjusted, relative to the second carrier substrate after the application of the joining agent and before the curing.

[0034] Optionally, the first microchip with the first carrier substrate and / or the second microchip with the second carrier substrate is separated from the wafer by means of breakout, stealth dicing, laser dicing, plasma dicing or a sacrificial layer etching process.

[0035] Figure 2a schematically shows a cross-section of a first microchip 235a having a plurality of first microelectromechanical components 240a. Furthermore, a second microchip 235b is shown having a plurality of second microelectromechanical components 240b. The first microchip 235a is connected to a first carrier substrate 200a, in particular made of ceramic, for the first microchip 235a. The second microchip 235b is connected to a second carrier substrate 200b, in particular made of ceramic, for the second microchip 235b. Both the first microchip 235a and the second microchip 235b are manufactured in a wafer 230 and arranged spaced apart from one another within the wafer 230. Two first control units 220a are arranged between the first carrier substrate 200a and the first microchip 235a. Furthermore, two second control units 220b are arranged between the second carrier substrate 200b and the second microchip 235b.

[0036] In the illustrated embodiment, the first microelectromechanical components 240a are first movable micromirrors and the second microelectromechanical components 240b are second movable micromirrors.

[0037] In this embodiment, the first carrier substrate 200a has a particularly integrated via (not shown for simplification). Furthermore, the second carrier substrate 200b optionally has a second, particularly integrated, via.

[0038] In Figure 2a, the wafer 230 is arranged on a base 255. To protect the first mirror surfaces of the first movable micromirrors, a first protective cap 250 is arranged on a first side of the wafer 230. This protective cap 250 is directly connected to the base 255. Furthermore, to protect the second mirror surfaces of the second movable micromirrors, a second spacer 245 is arranged on the first side of the wafer 230. This second spacer 245 is also directly connected to the base 255.

[0039] Figure 2b shows a schematic cross-section of how the first microchip 235a, separated from the wafer 230, with the first control units 220a and the first carrier substrate 200a, is transported further by means of a vacuum gripper 225a that vertically engages the first carrier substrate 200a. The separation from the wafer 230 was carried out by laser singulation.

[0040] Furthermore, it is shown how the second microchip 235b with the second control units 220b and the second carrier substrate 200b is broken out of the wafer 230 by mechanical force and then transported further by means of a tool 225b, in particular a gripping tool, acting horizontally on the second carrier substrate 200b. Figure 2c shows a schematic cross-section of how the first carrier substrate 200a is connected to the second carrier substrate 200b in such a way that a microelectromechanical component 1 in the form of a micromirror array, comprising the first microchip 235a and second microchip 235b, is created. Furthermore, in this embodiment, a third carrier substrate 200c is also connected to the second carrier substrate 200b. The first carrier substrate 200a is arranged on a further base 247 in the form of a template.Here, the first carrier substrate 200a is arranged in a partially bordered shape 246 of the template, which corresponds to the first carrier substrate 200a. Likewise, the second carrier substrate 200b and the third carrier substrate 200c are arranged in shapes of the template 247 corresponding to the carrier substrates. The carrier substrates 200a, 200b, and 200c are connected to one another by means of a joining agent 247. In this case, the joining agent 247 is a UV-curable adhesive. Furthermore, an alignment tool 252 is provided, which positions or adjusts the carrier substrates 200a, 200b, and 200c relative to one another after the application of the joining agent 247 and before the curing of the joining agent 247.

[0041] In the illustrated embodiment, the first microchip 235a and the second microchip 235b have a first lateral extent 254a and 254b in a first main extension plane 251 of the first microchip 235a and the second microchip 235b. Furthermore, the first carrier substrate 200a and the second carrier substrate 200b have a second lateral extent 261a and 261b in a second main extension plane 252 of the first carrier substrate 200a and the second carrier substrate 200b. The first lateral extent 254a and 254b is greater than the second lateral extent 261a and 261b.

Claims

Claims 1. A method for producing a microelectromechanical component (1), the method comprising the following method steps: - producing (5) a first microchip (235a) in a wafer (230), in particular a silicon wafer, wherein the first microchip (235a) has at least one first microelectromechanical component (240a), and - applying (10) a first protective cap (250) or a first spacer on a first side of the wafer (230) to protect a first surface of the at least one first microelectromechanical component (240a), which surface is particularly sensitive with regard to mechanical stress, and - producing (20) a second microchip (235b) in the wafer (230), wherein the second microchip (235b) has at least one second microelectromechanical component (240b), and the second microchip (235b) is separated from the first microchip (235a), in particular by a circumferential border, and - applying (30) a second protective cap or a second spacer (245) on the first side of the wafer (230) to protect a second surface of the at least one second microelectromechanical component (240b), which surface is particularly sensitive with regard to mechanical stress, and - arranging (40) the wafer with the first (235a) and second microchip (235b) on a base (255), wherein the first (250) and second protective cap or the first and second spacers (245) are connected to the base (255), and - connecting (60) a first carrier substrate (200a), in particular made of ceramic, to the first microchip (235a), and - connecting a second carrier substrate (200b), in particular made of ceramic, to the second microchip (235b), and - separating (90) the first microchip (235a) with the first carrier substrate (200a) from the wafer (230), and - transporting the first microchip (235a) with the first carrier substrate (200a) to a further base (247), and - arranging (100) the first microchip (235a) on the further base (247), wherein the first carrier substrate (200a) is connected to the further base (247), and - separating (110) the second microchip (235b) with the second carrier substrate (200b) from the wafer (230), and - transporting the second microchip (235b) with the second carrier substrate (200b) to the further base (247), and - arranging (120) the second microchip (235b) on the further base (247), wherein the second carrier substrate (200b) is connected to the further base (247), and - connecting (130) the first carrier substrate (200a) to the second carrier substrate (200b) in such a way that a, in particular common, microelectromechanical component (1) comprising the first (235a) and second microchip (235b) is produced.

2. The method according to claim 1, characterized in that the at least one first microelectromechanical component (240a) is at least one first movable micromirror, and the at least one second microelectromechanical component (240b) is at least one second movable micromirror, and wherein the first protective cap (250) or the first spacer is applied to the first side of the wafer (230) to protect a first mirror surface as the first, in particular with regard to mechanical stress, sensitive surface of the at least one first micromirror, and wherein the second protective cap or the second spacer (245) is applied to the first side of the wafer (230) to protect a second mirror surface as the second, in particular with regard to mechanical stress, sensitive surface of the at least one second micromirror,and wherein the first carrier substrate (200a) is connected to the second carrier substrate (200b) such that a micromirror array comprising the first (235a) and second microchip (235b) is produced., 3. Method according to one of claims 1 or 2, characterized in that the method comprises the following method steps: - carrying out (70) an electronic functional test, in particular a wafer-level test, on the first microchip (235a) and / or second microchip (235b) arranged on the base (255), wherein the electronic functional test takes place before the first (235a) and / or second microchip (235b) are separated from the wafer (230), and - Use of the first microchip (235a) and / or the second microchip (235b) for the, in particular common, microelectromechanical component (1) depending on the electronic functional test carried out.

4. Method according to one of claims 1 to 3, characterized in that the method comprises the following method steps: connecting (50) the first microchip (235a) arranged on the base (255) to at least one associated first control unit (220a), in particular a first ASIC, and / or the second microchip (235b) arranged on the base (255) to at least one associated second control unit (220b), in particular a second ASIC, in particular by means of a soldering process.

5. The method according to claim 4, characterized in that the connection of the first microchip (235a) to the associated first control unit (220a) takes place before the connection of the first carrier substrate (200a), in particular made of ceramic, to the first microchip (235a), and / or the connection of the second microchip (235b) to the associated second control unit (220b) takes place before the connection of the second carrier substrate (200b) to the second microchip (235b).

6. Method according to one of claims 1 to 5, characterized in that the first microchip (235a) and / or the second microchip (235b) are produced with a first symmetrical cross-section, in particular a rectangular cross-section, and the first (200a) and / or second carrier substrate (200b) has a second symmetrical cross-section, in particular a rectangular cross-section, wherein the first carrier substrate (200a) is provided with the first microchip (235a) and / or the second carrier substrate (200b) is centrally connected to the second microchip (235b).

7. Method according to one of claims 1 to 6, characterized in that the transport of the first microchip (235a) with the first carrier substrate (200a) and / or the second microchip (235b) with the second carrier substrate (200b) to the further base (247) is carried out by means of a tool (225a, 225b) engaging the respective carrier substrate (200a, 200b), in particular a vacuum gripper.

8. The method according to one of claims 1 to 7, characterized in that the further base (247) is designed as a template, in particular in the form of the microelectromechanical component (1), and the first microchip (235a) with the first carrier substrate (200a) is arranged in a first shape (246) of the template, which is associated with the first microchip (235a) with the first carrier substrate (200a), in particular a partially bordered shape, and the second microchip (235b) with the second carrier substrate (200b) is arranged in a second shape (246) of the template, which is associated with the second microchip (235b) with the second carrier substrate (200b), in particular a partially bordered shape.

9. Method according to one of claims 1 to 8, characterized in that the first carrier substrate (200a) is connected to the second carrier substrate (200b) by means of a joining agent, in particular a thermally or UV-curable adhesive or a sintering paste.

10. The method according to claim 9, characterized in that the first carrier substrate (200a) is positioned, in particular adjusted (140), relative to the second carrier substrate (200b) after the application and before the curing of the joining agent.

11. Method according to one of claims 1 to 10, characterized in that the first micro-chip (235a) with the first carrier substrate (200a) and / or the second micro-chip (235b) with the second carrier substrate (200b) by means of breaking out, stealth dicing, laser dicing, plasma di- cing or a sacrificial layer etching process from the wafer (230).

12. Microelectromechanical component (1), in particular manufactured according to a method according to one of claims 1 to 11, wherein the microelectromechanical component (1) comprises at least: - a first microchip (235a), wherein the first microchip (135a) has at least one first microelectromechanical component (240a), and - a second microchip (235b), wherein the second microchip (235b) has at least one second microelectromechanical component (240b), and - a first carrier substrate (200a), in particular made of ceramic, for the first microchip (235a), and - a second carrier substrate (200b), in particular made of ceramic, for the second microchip (235b), wherein the first carrier substrate (200a) is connected to the second carrier substrate (200b) in such a way that a, in particular common, microelectromechanical component (1) comprising the first (235a) and second microchip (235b) is formed 13. Microelectromechanical component (1) according to claim 12, characterized in that the first microelectromechanical component (240a) is at least one first movable micromirror, and the at least one second microelectromechanical component (240b) is at least one second movable micromirror, and the first carrier substrate (200a) is connected to the second carrier substrate (200b) in such a way that a micromirror array is created as a, in particular common, microelectromechanical component (1).

14. Microelectromechanical component (1) according to one of claims 12 or 13, characterized in that the first carrier substrate (200a) has a first, in particular integrated, through-plating, and the second carrier substrate (200b) has a second, in particular integrated, through-plating.

15. Microelectromechanical component (1) according to one of claims 12 to 14, characterized in that the first microchip (235a) and / or second microchip (235b) has a first lateral extent (254a, 254b), in particular in a first main extension plane (251) of the first (235a) and / or second microchip (235b), and the first carrier substrate (200a) and / or the second carrier substrate (200b) has a second lateral extent (261a, 261b), in particular in a second main extension plane (252) of the first (200a) and / or second carrier substrate (200b), and the first lateral extent (254a, 254b) is greater than the second lateral extent (261a, 261 b).

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