Circuit module

Abstract

The invention relates to a circuit module (10), comprising: a first power substrate (12), which has a first electrically conductive lamination (14); a first power switch unit (16), which is arranged on the first power substrate (12) and is connected to the first electrically conductive lamination (14); a second power substrate (18), which has a second electrically conductive lamination (20); a second power switch unit (22), which is arranged on the second power substrate (18) and is connected to the second electrically conductive lamination (20), wherein the first power substrate (12) can be arranged on a cooling structure (28) and / or a cooling medium can flow around at least part of said first power substrate, wherein the first power switch unit (16) is arranged substantially between the first power substrate (12) and the second power substrate (18), wherein the circuit module (10) is designed to dissipate heat produced at the first power switch unit (16) and / or at the second power switch unit (22) to the cooling structure (28) and / or to the cooling medium.

Description

[0001] Description

[0002] title

[0003] Circuit unit

[0004] State of the art

[0005] The present invention relates to a circuit unit and a vehicle.

[0006] Currently, there are a multitude of different solutions for the design of circuit units. Due to the increasing number of circuit units in the automotive sector and the increased efficiency requirements, the need for innovative and robust circuit unit designs is continuously growing.

[0007] Disclosure of the invention

[0008] The circuit unit according to the invention with the features of claim 1 has the advantage over the known device that the circuit unit can be adapted to individual application scenarios due to its multi-layer structure. In particular, the circuit unit can have at least two different layers or levels, which can be arranged parallel to one another. Thus, the circuit arrangements and / or the semiconductor chips can be arranged on the at least two levels depending on their functionality and load profiles, which can potentially provide different thermal paths. Thus, in particular, a heat flow between the respective functional elements can be specifically adjusted to a cooling structure or the like.Furthermore, the individual adaptability of the circuit unit by connecting and disconnecting line switch units allows for different operating scenarios to be realized without increasing the dimensions of the circuit unit. Furthermore, particularly low manufacturing costs can be achieved, since the modular design allows for increased cost-effectiveness through the use of common components. Furthermore, the commutation inductance between the main and middle branch commutation cells can be reduced by vertically integrating the additional semiconductor chips above the main conductor chips. This allows for better utilization of the heat sink, so that there should be no need to increase the cooling channel width or length.

[0009] This is achieved according to the invention in that the circuit unit comprises a first power substrate. The first power substrate has a first electrically conductive cladding. The circuit unit comprises a first power switch unit, which is arranged on the first power substrate and is connected to the first electrically conductive cladding. The circuit unit comprises a second power substrate, which has a second electrically conductive cladding.Furthermore, the circuit unit has a second power switch unit which is arranged on the second power substrate and is connected to the second electrically conductive cladding, wherein the first power substrate can be arranged on a cooling structure and / or can be at least partially surrounded by a cooling medium, wherein the first power switch unit is arranged substantially between the first power substrate and the second power substrate, wherein the circuit unit is configured to dissipate heat generated at the first power switch unit and / or the second power switch unit to the cooling structure and / or the cooling medium.

[0010] In other words, a cooling medium can flow around one side of the circuit unit, which cooling medium can in particular absorb the heat generated in the circuit unit. The circuit unit can preferably be further configured so that heat generated in the second power switch unit can be dissipated to the cooling medium via the first power substrate. Further preferably, the first power substrate as well as the second power substrate can have a plurality of switches or chips in order to be able to map different functions. The circuit unit is preferably a 3-level T-type inverter. The switches of the first power switch unit are preferably configured to form a half-bridge as T1 and T4.Further preferably, the second power switch unit can be configured to form an additional switch, which can in particular form the center branch, comprising switches T2 and T4. The first power substrate and the second power substrate can in particular be a substrate made of a ceramic material or the like. Further preferably, the first electrically conductive cladding and / or the second electrically conductive cladding can be a structured metallized layer in order to be able to conduct the electrical current. The first power switch unit preferably comprises two semiconductor chips, such as bare chips.

[0011] The subclaims show preferred developments of the invention.

[0012] Preferably, the circuit unit comprises a heat conducting element, wherein the heat conducting element is arranged between the first power substrate and the second power substrate, wherein the heat conducting element is configured to improve heat transfer between the second power switch unit and / or the cooling medium.

[0013] An advantage of this embodiment is that the heat conducting element can set a targeted heat flow between the first power substrate and the second power substrate in order to thus improve the cooling performance, in particular at the second power substrate and / or the second power switch unit.

[0014] Preferably, the circuit unit comprises a third power switch unit, wherein the third power switch unit is arranged on the first power substrate and is connected to the first electrically conductive cladding, wherein the first power switch unit and the third power switch unit are configured to form a half-bridge configuration with a phase output.

[0015] An advantage of this embodiment is that by adding a third power switch unit on the first power substrate, an application scenario of the circuit unit can be specifically adapted.

[0016] Further preferably, the circuit unit is connectable to a capacitor unit, wherein the capacitor unit is configured to provide a center point, wherein the second power switch unit is connected to the phase output and the center point, wherein the circuit unit is configured to convert a direct current at an input element into an alternating current at an output element with the capacitor unit.

[0017] An advantage of this embodiment is that a 3-level T-type inverter structure can be provided, with a particularly high cooling performance, so that the load on the circuit unit can be reduced.

[0018] Further preferably, the second power substrate has an insulation layer and a third electrically conductive lamination, wherein the insulation layer is arranged between the second electrically conductive lamination and the third electrically conductive lamination, wherein the third electrically conductive lamination is configured to form at least one signal- and / or energy-conducting connection with a component of the first power substrate and / or the second power substrate.

[0019] An advantage of this embodiment is that simpler internal module wiring and / or connection of the chips and terminals can be achieved by means of the additional lamination.

[0020] Further preferably, the first power substrate and the second power substrate are arranged at a predetermined distance from one another, wherein the predetermined distance is configured such that a plurality of electronic components can be arranged between the first power substrate and the second power substrate.

[0021] An advantage of this embodiment is that by setting the predetermined distance, in particular a heat path can be defined, since, for example, only the electronic components that bridge the predetermined distance can serve for heat conduction.

[0022] Further preferably, the circuit unit has at least one conducting element, wherein the conducting element is configured to form a signal- and / or energy-conducting connection between the first power substrate and / or the second power substrate and the first power switch unit and / or the second power switch unit.

[0023] An advantage of this embodiment is that contact can be made between the two power substrates, or in particular between the first power switch unit and / or the second power switch unit, with the aid of the conducting element. Further preferably, the conducting element is designed to form a signal- and / or energy-conducting connection between the first power substrate and / or the second power substrate with the third and / or further power switch unit.

[0024] Preferably, a plurality of power substrates can be arranged on the first power substrate and / or the second power substrate, wherein each of the plurality of power substrates has a respective power switch unit.

[0025] An advantage of this embodiment is that, despite an increasing number of power substrates and a longitudinal and / or transverse extension direction of the circuit unit, the height does not increase further, but rather only the height. Thus, the circuit unit can be adapted to the available installation space or similar.

[0026] Further preferably, a first edge of the first power substrate is spaced apart from a second edge of the second power substrate, so that contactability between the first power switch unit and the second power substrate and / or the second power switch unit is improved.

[0027] An advantage of this embodiment is that by spacing the edges, space can be created at the circuit breaker units in order to better connect the power substrates and the circuit breaker units to each other.

[0028] Further preferably, a first thermal resistance between the second circuit breaker unit and the cooling structure and / or the cooling medium is substantially greater than a second thermal resistance between the first circuit breaker unit and the cooling structure and / or the cooling medium. One advantage of this embodiment is that, based on the ratio of the thermal resistances, it was possible to determine that the circuit unit can be operated at a significantly greater total load. The ratio between the first thermal resistance and the second resistance is preferably between 2 and 2.5. "Substantially" in this context means a deviation of + / - 15%, in particular manufacturing-related tolerances.

[0029] Further preferably, the switching unit is configured to operate the first circuit breaker unit and / or the second circuit breaker unit based on an operating strategy, wherein the operating strategy is adaptable based on at least one operating limit of the first circuit breaker unit and / or the second circuit breaker unit.

[0030] An advantage of this embodiment is that, if the switching unit can be operated at full load, this operating limit can be selected depending on the maximum load temperature of the first circuit breaker unit. Preferably, the operating limit can be an electrical variable that can result in a thermal load.

[0031] Further preferably, in partial load operation of the switching unit, the operating limit can be adjusted based on the second power switch unit, so that the operating limit is a maximum load temperature of the second switch unit.

[0032] Further preferably, the center point of the first power substrate is offset from a second center point of the second power substrate by a predetermined amount.

[0033] An advantage of this embodiment is that the heat distribution within the circuit unit can be improved.

[0034] Preferably, the circuit unit can be operated as a two-level inverter, with only the power switch units being operated on the first power substrate. A further aspect of the invention relates to a vehicle having a circuit unit as described above and below.

[0035] Drawings

[0036] Embodiments of the invention are described in detail below with reference to the accompanying drawings. In the drawing:

[0037] Figures 1 to 3a show a circuit unit according to an embodiment,

[0038] Figure 3b is a circuit diagram illustrating the operation of the circuit unit according to an embodiment,

[0039] Figure 4 shows a vehicle according to an embodiment.

[0040] Embodiments of the invention

[0041] Preferably, in all figures, all elements, units and / or components are provided with the same reference numerals.

[0042] Figure 1 shows a circuit unit 10 according to one embodiment. The circuit unit 10 has a first power substrate 12, which has a first electrically conductive cladding 14. The circuit unit 10 has a first power switch unit 16, which is arranged on the first power substrate 12 and is connected to the first electrically conductive cladding 14. The circuit unit 10 has a second power substrate 18, which has a second electrically conductive cladding 20.The circuit unit 10 has a second power switch unit 22, which is arranged on the second power substrate 18 and is connected to the second electrically conductive cladding 20, wherein the first power substrate 12 can be arranged on a cooling structure 28 and / or can be at least partially surrounded by a cooling medium, wherein the first power switch unit 16 is arranged substantially between the first power substrate 12 and the second power substrate 18, wherein the circuit unit 10 is configured to dissipate heat generated at the first power switch unit 16 and / or the second power switch unit 22 to the cooling structure 28 and / or the cooling medium.

[0043] Further preferably, the circuit unit 10 has a heat conducting element 30 which is arranged between the first power substrate 12 and the second power substrate 18 in order to improve heat transfer between the second power switch unit 22 and the cooling structure 28 and / or the cooling medium.

[0044] Further preferably, the circuit unit comprises a third power switch unit 32, which is arranged on the first power substrate 12 and is in particular connected to the first conductive cladding 14. The first power switch unit 16 and the third power switch unit 32 can form a half-bridge configuration in order to be able to provide a phase output.

[0045] Further preferably, the circuit unit 10 comprises and / or is connectable to a capacitor unit 36. The capacitor unit 36 ​​can preferably provide a center point 38, wherein the second power switch unit 22 can be connected to the phase output 34 and the center point 38. The circuit unit 10 with the center point 38 and the phase output 34 can preferably provide a circuit topology of a 3-level T-type inverter.

[0046] Further preferably, the second power substrate 18 has an insulation layer 40 and a third electrically conductive cladding 42, wherein the third electrically conductive cladding 42 is connected to the first power switch unit 16 and / or the first electrically conductive cladding 14. Further preferably, the first power substrate 12 and the second power substrate 18 are arranged at a predetermined distance 44 from one another. Preferably, the circuit unit 10 has at least one conducting element 46 in order to be able to form, for example, a signal- and / or energy-conducting connection between the first power substrate 12 and / or the second power substrate 18 and the first power switch unit 16 and / or the second power switch unit 22. Further preferably, the first power substrate 12 has a first edge 48 and the second power substrate 18 has a second edge 50, which are arranged at a predetermined distance from one another.

[0047] Figure 2a shows a circuit unit 10 according to one embodiment. The circuit unit 10 is arranged on a cooling structure 28, through which, in particular, a cooling medium can flow. Thus, heat generated at the second power switch unit 22 and / or the first power switch unit 16 can be dissipated to the cooling structure 28 via the first power substrate 12. By dissipating the thermal energy from the first power switch unit 16 and the second power switch unit 22 into the cooling structure 28, the circuit unit 10 can be operated, in particular, at higher partial loads as well as at full loads.

[0048] Figure 2b shows a circuit unit 10 according to one embodiment. As can be seen in Figure 2b, a second edge 50 of the second power substrate 18 can be spaced apart from the first edge 48 of the first power substrate 12, thereby improving contactability between the first power switch unit 16 and the second power substrate 18 and / or the second power switch unit 22.

[0049] Figure 3a shows a circuit unit 10 according to one embodiment. The circuit unit 10 preferably has a first power switch unit 16 and a third power switch unit 32. More preferably, two second power switch units 22 or two second power substrates 18 are arranged on the first power substrate 12. More preferably, in particular, a first center point 52 of the first power substrate 12 can be offset from a second center point 54 of the second power substrate 18 by a predetermined amount in order to thus be able to implement the assembly of a plurality of second power substrates 18 in the circuit unit 10.

[0050] Figure 3b shows a circuit diagram to illustrate the functioning of the circuit unit 10 according to one embodiment. The circuit unit 10 preferably has a first power switch unit 16 and a third power switch unit 32, which are configured to form a half-bridge configuration with a phase output 34. More preferably, the circuit unit 10 has a capacitor unit 36 ​​and / or is connectable thereto. The capacitor unit 36 ​​is configured to provide a center point 38. More preferably, the second power switch unit 18 can be connected on a first side to the phase output 34 and on a second side to the center point 38. Thus, the circuit unit 10 can be configured to use the capacitor unit 34 to convert a direct current at an input element into an alternating current at an output element.

[0051] Figure 4 shows a vehicle 100 according to one embodiment. The vehicle 100 preferably has a circuit unit 10, as described above and below.

Claims

Claims 1. Circuit unit (10) comprising: - a first power substrate (12) having a first electrically conductive lamination (14), - a first power switch unit (16) which is arranged on the first power substrate (12) and is connected to the first electrically conductive cladding (14), - a second power substrate (18) having a second electrically conductive lamination (20), - a second power switch unit (22) which is arranged on the second power substrate (18) and is connected to the second electrically conductive cladding (20), wherein the first power substrate (12) can be arranged on a cooling structure (28) and / or a cooling medium can flow around it at least partially, wherein the first power switch unit (16) is arranged substantially between the first power substrate (12) and the second power substrate (18), wherein the circuit unit (10) is designed to dissipate heat generated at the first power switch unit (16) and / or the second power switch unit (22) to the cooling structure (28) and / or the cooling medium.

2. Circuit unit (10) according to claim 1, wherein the circuit unit (10) has a heat conducting element (30), wherein the heat conducting element (30) is arranged between the first power substrate (12) and the second power substrate (18), wherein the heat conducting element (30) is configured to improve heat transfer between the second power switch unit (22) and the cooling structure (28) and / or the cooling medium.

3. Circuit unit (10) according to one of the preceding claims, wherein the circuit unit (10) has a third power switch unit (32), wherein the third power switch unit (32) is arranged on the first power substrate (12) and is connected to the first electrically conductive cladding (14), wherein the first power switch unit (16) and the third power switch unit (32) are configured to form a half-bridge configuration with a phase output (34).

4. Circuit unit (10) according to claim 3, wherein the circuit unit (10) is connectable to a capacitor unit (36), wherein the capacitor unit (36) is configured to provide a center point (38), wherein the second power switch unit (18) is connected to the phase output (34) and the center point (38), wherein the circuit unit (10) is configured to convert a direct current at an input element into an alternating current at an output element with the capacitor unit (34).

5. Circuit unit (10) according to one of the preceding claims, wherein the second power substrate (18) has an insulation layer (40) and a third electrically conductive cladding (42), wherein the insulation layer (40) is arranged between the second electrically conductive cladding (20) and the third electrically conductive cladding (42) to form at least one signal and / or energy-conducting connection with a component of the first power substrate and / or the second power substrate.

6. Circuit unit (10) according to one of the preceding claims, wherein the first power substrate (12) and the second power substrate (18) are arranged at a predetermined distance (44) from one another, wherein the predetermined distance (44) is designed so that a plurality of electronic components can be arranged between the first power substrate (12) and the second power substrate (18).

7. Circuit unit (10) according to one of the preceding claims, wherein the circuit unit (10) has at least one conducting element (46), wherein the conducting element (46) is designed to form a signal- and / or energy-conducting Connection between the first power substrate (12) and / or the second power substrate (18) and the first power switch unit (16) and / or the second power switch unit (22).

8. Circuit unit (10) according to one of the preceding claims, wherein a plurality of power substrates can be arranged on the first power substrate (12) and / or the second power substrate (18), wherein each of the plurality of power substrates has a respective power switch unit.

9. Circuit unit (10) according to one of the preceding claims, wherein a first edge (48) of the first power substrate (12) is spaced from a second edge (50) of the second power substrate (18), so that contactability between the first power switch unit (16) and the second power substrate (18) and / or the second power switch unit (22) is improved.

10. Circuit unit (10) according to one of the preceding claims, wherein a first thermal resistance between the second power switch unit (22) and the cooling structure (28) and / or the cooling medium is substantially greater than a second thermal resistance between the first power switch unit (16) and the cooling structure (28) and / or the cooling medium.

11. Circuit unit (10) according to one of the preceding claims, wherein the circuit unit (10) is configured to operate the first circuit breaker unit (16) and / or the second circuit breaker unit (22) based on an operating strategy, wherein the operating strategy is adaptable based on at least one operating limit of the first circuit breaker unit (16) and / or the second circuit breaker unit (22).

12. Circuit unit (10) according to one of the preceding claims, wherein a first center point (52) of the first power substrate (12) is offset from a second center point (54) of the second power substrate (18) by a predetermined amount.

13. Vehicle (100) comprising a circuit unit (10) according to one of the preceding claims.

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