Lighting device and method

Abstract

The invention relates to a lighting device having: a semiconductor light source arrangement (1) arranged on a carrier (10); a set of electronics (13), arranged on the carrier (10), for operating the semiconductor light source arrangement (1); a heat sink (3) for cooling the semiconductor light source arrangement (1); an electrical connection element (4) for supplying energy to the semiconductor light source arrangement (1); a mount (2); and a cap (8). The carrier (10) is arranged in a first opening (7) in the mount (2), and the heat sink (3) forms at least one surface (30), substantially parallel to the carrier (10), in the first opening (7), on which surface the carrier is arranged. The cap (8) is arranged in the first opening (7) on the carrier (10) and has a second opening (81) which exposes the semiconductor light source arrangement (1). In addition, a first potting material (15a) is arranged between the mount (2) and the cap (8), and a second potting material (15b) is arranged between the cap (8) and the semiconductor light source arrangement (1) and / or the carrier (10).

Description

[0001] 2023PF01372 - 1 - LIGHTING DEVICE AND METHOD The present application claims priority from German patent application No. 102024108642.4 of March 26, 2024, the disclosure content of which is hereby incorporated by reference into the present application. The invention relates to a lighting device, in particular a lighting device suitable for use in motor vehicles, and a method for producing such a lighting device. BACKGROUND A lighting device is disclosed, for example, in WO 2013 / 079302A1. This document describes a lighting device / motor vehicle headlight that has a semiconductor light source arrangement, a housing, a heat sink for cooling the semiconductor light source arrangement, and an electrical connection element for supplying power to the semiconductor light source arrangement.However, known lighting systems often have the disadvantage that water penetrating the lighting system can damage the electronics for operating the semiconductor light source arrangement or lead to electrochemical migration. This is a known problem, particularly with vehicle lights such as taillights or combined taillights (RCL), fog lights, or headlights. To reduce the penetration of moisture or to protect the electronics from moisture penetration, the electronics in known lighting systems are encapsulated in a further step, for example, with a potting material, or a coating (conformal coating) is applied to the electronics.5 However, the aforementioned possibilities have in common that they are generally not sufficient to adequately protect the electronics from moisture, especially if the lighting device is to meet the requirement of passing a so-called immersion test. Accordingly, there is a need to provide a lighting device that offers an improved possibility of protecting electronics for operating a semiconductor light source arrangement in the lighting device from the penetration of moisture. Furthermore, there is a need to provide a method for producing such a lighting device. 0 SUMMARY OF THE INVENTION This need is met by the subject matter of the independent patent claims. Further developments and embodiments of the proposed principle are specified in the subclaims.The inventors propose a lighting device in which the electronics for operating a semiconductor light source arrangement in the lighting device are protected by a cap to protect them from moisture penetration. The cap is arranged on a carrier or a mounting board on which the semiconductor light source arrangement is also arranged and, together with a holder in which the carrier is arranged, and with a heat sink, which is also arranged in the holder, forms a particularly watertight intermediate space in which the electronics and the carrier are arranged. By enclosing the electronics in the intermediate space, an additional conformal coating of the electronics as a further process step after inserting the carrier into the holder can be omitted, and at the same time, mechanical protection for the electronics against external influences is achieved.A lighting device according to a first aspect comprises a semiconductor light source arrangement arranged on a carrier, electronics also arranged on the carrier for operating the semiconductor light source arrangement, a heat sink for cooling the semiconductor light source arrangement, an electrical connection element for supplying power to the semiconductor light source arrangement, a holder, and a cap. The carrier is arranged in a first recess of the holder, and the heat sink forms at least one surface in the first recess that is substantially parallel to the carrier and on which the carrier is arranged.5 The lighting device is characterized in that the cap is arranged in the first recess on the carrier and has a second recess exposing the semiconductor light source arrangement, as well as by a first encapsulation material arranged between the holder and the cap, and a second encapsulation material arranged between the cap and the semiconductor light source arrangement and / or the carrier. In particular, the cap, together with the holder, the heat sink, the electrical connection element, and the semiconductor light source, encloses a space in which the carrier and the electronics are arranged. According to some aspects, the cap is arranged with a substantially precise fit in the first recess. In particular, the first recess can substantially correspond to the size of the outer dimensions of the cap, so that the cap can be arranged with a substantially precise fit in the first recess.In particular, the cap can be designed and dimensioned such that it can be pressed into the first recess. For this purpose, the outer dimensions of the cap can be slightly larger in an undeformed state than the first recess and can be deformed such that it can be pressed into the first recess. For example, the cap can have an edge region that is designed such that it is easily deformable according to the size of the first recess and can adapt to the contour of the first recess. 0 According to some aspects, the second recess essentially corresponds to the size of the outer dimensions of the semiconductor light source.In particular, the second recess can be designed and dimensioned such that the cap, when arranged in the first recess, leaves the semiconductor light source free and is essentially flush with the outer dimensions of the semiconductor light source or is slightly spaced from the outer dimensions of the semiconductor light source. 2023PF01372 - 4 - According to some aspects, the cap, together with the holder, the heat sink, the electrical connection element, and the semiconductor light source, encloses an intermediate space in which the carrier and the electronics are arranged. The intermediate space is essentially watertight, i.e., essentially completely protected against the penetration of water, in particular through the use of the first and second potting material.Essentially waterproof can be understood in particular to mean that no or only insignificant water penetrates into the gap when the lighting device is completely immersed in water. In particular, the gap can be sealed in such a way that immersion or submersion of the electrically connected lighting device, operated with a voltage of, for example, 13.5 V, in water for, for example, at least 10 seconds does not result in a defect or the lighting device ceases operation. According to some aspects, the cap, particularly in the region of the second recess, has an inner surface tapering conically in the direction of the semiconductor light source relative to an outer surface of the semiconductor light source.The inner surface, which tapers conically toward the semiconductor light source, can provide the advantage that a second encapsulating material introduced between the cap and the semiconductor light source can flow more effectively into a gap between the cap and the semiconductor light source. This allows the gap between the cap and the semiconductor light source to be sealed more effectively, while simultaneously requiring less of the second encapsulating material to efficiently seal the gap. Using less of the second encapsulating material can, in turn, have the advantage of reducing costs, but also, in particular, reducing the risk of excess second encapsulating material flowing onto the semiconductor light source.According to some aspects, the cap has an outer surface tapering toward the semiconductor light source opposite an inner surface of the first recess of the holder. The outer surface tapering toward the semiconductor light source can provide the advantage that the cap can be inserted into the first recess in a simplified manner. According to some aspects, the cap comprises polycarbonate, polybutylene terephthalate, polyamide 6, or a comparable material, or is formed from one of these materials. It is also conceivable for the cap to be formed from the same material as the holder and, for example, from base injection molding residues (sprue) of the recycled holder material. For example, the cap can be formed from a light-absorbing or reflective material.However, it may be preferred for the cap to be made of a light-reflecting material, for example a white material, in order not to negatively influence the optical properties of the lighting device. Furthermore, the cap can have a substantially constant wall thickness, for example a wall thickness thinner than 1 mm, thinner than 0.5 mm, in particular a wall thickness of approximately 0.3 mm. According to some aspects, the first and second potting materials comprise a silicone, an acrylate, or an epoxy or are formed from such a material. In particular, the first and second potting materials can be LED compatible and meet the requirements of the automotive sector. In addition to a sealing effect, the first and second potting materials can have an adhesive effect in order to fix the cap in the holder.Preferred properties of the first and second encapsulation materials can be: • UV and thermally and mechanically stable, • UV or hygroscopic or thermally curing, "good" processable in the manufacturing process, • permanently elastic in use and during service life (due to possible pumping behavior of the enclosed air volume with respect to temperature). According to some aspects, the carrier and / or the electronics are thermally coupled to the heat sink. For example, a thermally conductive layer, in particular thermal paste, can additionally be provided between the carrier and the heat sink. This allows heat generated in the semiconductor light source arrangement and the electronics during operation of the lighting device to be dissipated to the heat sink. The heat sink can in particular be designed such that it absorbs the heat generated in the semiconductor light source arrangement and the electronics and dissipates it to the environment ora medium surrounding the heat sink. According to some aspects, the holder and / or the heat sink has at least one projection on which the carrier at least partially rests. For example, the holder can have a circumferential projection / edge in the region of the first recess, on which the carrier at least partially rests. However, this circumferential projection / edge can also be interrupted in sections, for example to ensure that excess material of a thermally conductive layer can escape when the carrier is pressed onto the thermally conductive layer. Alternatively or additionally, the heat sink can have at least one projection / bulge formed within the first recess and in the direction of the carrier, on which the carrier at least partially rests. For example, the heat sink can have a central, for example cylindrical, bulge on which the carrier at least partially rests.The at least one projection of the holder and / or the heat sink can in particular serve to provide a support surface for the carrier. If the projection / bulge is part of the heat sink, and optionally if the heat sink is made of metal, this bulge can also form a heat sink for the carrier and optionally also be used, for example, to provide an electrical connection (ground potential) for the carrier. 0 According to some aspects, the heat sink has a first heat sink section that is arranged in the first recess of the holder and that forms the at least one surface that is substantially parallel to the carrier. In addition, the heat sink has a second heat sink section that is arranged with a snug fit / precise fit between the holder and the electrical connection element.This can be achieved, for example, by injection-molded the heat sink in one step, for example as an insert, with the holder and the electrical connection element. Alternatively, the heat sink can be positioned to fit between the holder and the electrical connection element by plugging the holder and the electrical connection element together around at least the second heat sink section or gluing them to the heat sink section. According to some aspects, the electrical connection element is formed integrally with the holder, in particular as a plastic injection-molded part. According to some aspects, the heat sink is formed integrally with the holder and optionally integrally with the electrical connection element. For example, the holder can comprise the heat sink as a component and can be formed together with the holder as a plastic injection-molded part.According to some aspects, the electrical connection element has electrical contacts that are passed through an opening in the heat sink and that electrically contact the carrier or conductor tracks located on the carrier. For example, the electrical contacts can form a press fit with openings provided for this purpose in the carrier of the lighting device. According to some aspects, locking elements are arranged on the holder, which serve to form a bayonet lock with a socket of, for example, a vehicle light. For example, the socket can be designed according to a defined standard, and the locking elements can be designed such that they form a bayonet lock with the socket. According to some aspects, the carrier is designed as a mounting board.As a result, the components of the semiconductor light source arrangement can be easily mounted on a surface of the mounting board and electrically connected by conductor tracks. Alternatively, the carrier can also be designed as a lead frame, which is also referred to below as 2023PF01372 - 8 - leadframe, in order to achieve the same advantages. According to some aspects, the carrier is arranged with a clamp fit in a receptacle of the holder in the first recess or is held in another way. Advantageously, the semiconductor light source arrangement and the electronics are arranged and pre-assembled on the carrier in such a way that the carrier comprising the semiconductor light source arrangement and the electronics can be manufactured as a standalone module and subsequently incorporated into the lighting device according to the invention.The lighting device according to the invention is preferably designed as an LED light source and intended for use in motor vehicles. The lighting device according to the invention is preferably compatible with standardized holding devices and plugs or couplings provided in motor vehicles for tail lights, brake lights, indicator lights, position lights, or daytime running lights. Furthermore, a method for producing a lighting device is specified, in particular a lighting device according to the preceding aspects. The method comprises providing a holder with a heat sink arranged in a first recess in the holder and an electrical connection element connected to the holder.The method further comprises arranging a carrier with a semiconductor light source arrangement arranged thereon and electronics for operating the semiconductor light source arrangement in the first recess on a surface of the heat sink that is substantially parallel to the carrier. Furthermore, the method comprises arranging a cap in the first recess on the carrier, the cap having a second recess that exposes the semiconductor light source arrangement, and sealing an intermediate space enclosed by the heat sink, the electrical connection element, and the semiconductor light source by means of a first encapsulation material between the holder and the cap and a second encapsulation material between the cap and the semiconductor light source arrangement and / or the carrier.By enclosing and sealing the electronics in the intermediate space, an additional conformal coating of the electronics to protect them from water damage as a further process step after inserting the carrier into the holder can be eliminated, and at the same time, mechanical protection for the electronics against external influences is achieved. The step of sealing the intermediate space can be carried out in particular in such a way that the intermediate space is sealed in a substantially watertight manner. The sealing step can, for example, comprise welding or hot-staking the cap to the holder.The first potting material can be added to achieve increased sealing of the gap, can be created by welding or hot-staking by mixing different materials, or can be introduced downstream into a remaining gap between the holder and the cap. The welding or hot-staking step can primarily serve to mechanically connect the cap to the holder.0 Providing the holder can include inserting a heat sink and optionally inserting electrical connections into a mold of a plastic injection molding tool, as well as injecting plastic material around the optional electrical connections and the heat sink in the mold such that the plastic material, after solidification, forms the holder, in whose material the optional electrical connections and the heat sink are fixed.BRIEF DESCRIPTION OF THE DRAWINGS Further aspects and embodiments according to the proposed principle will become apparent with reference to the various embodiments and examples, which are described in detail in conjunction with the accompanying drawings. Figs. 1 and 2 each show a perspective view of a lighting device according to the proposed principle; Fig. 3 shows a cross-section through a lighting device according to the proposed principle; and Fig. 4 shows a further cross-section through an embodiment of a lighting device according to the proposed principle. DETAILED DESCRIPTION The following embodiments and examples show various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale.Likewise, various elements may be shown enlarged or reduced in size to emphasize individual aspects. It goes without saying that the individual aspects and features of the embodiments and examples shown in the figures can be readily combined with one another without impairing the inventive principle. Some aspects have a regular structure or shape. It should be noted that in practice, slight deviations from the ideal shape may occur without, however, contradicting the inventive concept. Furthermore, the individual figures, features, and aspects are not necessarily shown in the correct size, and the proportions between the individual elements do not necessarily have to be fundamentally correct. Some aspects and features are emphasized by being shown enlarged.However, terms such as "top," "above," "below," "below," "larger," "smaller," and the like are correctly represented in relation to the elements in the figures. Thus, it is possible to derive such relationships between the elements from the illustrations. Figures 1 to 4 schematically illustrate a lighting device 5 according to the proposed principle. 2023PF01372 - 11 - The lighting device comprises a semiconductor light source arrangement 1 arranged on a carrier 10, a heat sink 3 for cooling the semiconductor light source arrangement 1, an electrical connection element 4 comprising electrical connections 41 for supplying power to the semiconductor light source arrangement 1, and a common holder 2 for the electrical connection element 4, the carrier 10, and the heat sink 3. The lighting device is intended, for example, for use in motor vehicles to generate the brake light and tail light.The semiconductor light source arrangement 1 comprises a plurality of light-emitting diodes, which are arranged on a mounting board 10 together with electronics 13 for operating the light-emitting diodes. For example, the semiconductor light source arrangement 1 comprises three light-emitting diodes; however, the number three is to be understood here merely as an example, and the number of light-emitting diodes can also be greater or less than three. The light-emitting diodes are surrounded laterally by a silicone dam 18 and covered by a light conversion layer 19, which is laterally delimited by the silicone dam 18. The silicone dam together with the light conversion layer are also to be understood here as exemplary, and light-emitting diodes / a semiconductor light source can also be used that emit light of different wavelengths or already light of a desired wavelength, which does not require further conversion.5 The mounting board 10 serves as a common carrier 10 for the light-emitting diodes, the silicone dam, and the light conversion layer of the semiconductor light source arrangement 1, and the electronics 13, wherein the semiconductor light source arrangement 1 and the electronics in the illustrated case are arranged on one side of the mounting board 10. 0 The electronics 13 can be designed as a driver circuit, for example, as a so-called linear driver, i.e., as a linear voltage regulator. During operation, the light-emitting diodes can emit, for example, blue light, which is converted into white light by the light conversion layer. The light-emitting diodes can be protected by means of the light conversion layer, and / or a hemispherical, transparent dome (not explicitly shown) can be provided, which is arranged on the surface of the semiconductor light source and serves as primary optics and as protection for the semi-semiconductor light source.For example, only areas of the semiconductor light source can be covered with a light conversion layer,5 so that light of different colors can be emitted by the semiconductor light source, such as red (e.g., tail light, brake light), orange (e.g., indicator light), and white (e.g., headlight light, reversing light). It may also be possible to control the LEDs of the semiconductor light source independently of one another, for example, to operate several LEDs simultaneously when higher intensity light is needed (e.g., high beam / tail light) or when lower intensity light is needed (e.g., parking light / daytime running light).5 The holder 2 can be formed as a single piece, as shown in the figures, as a plastic injection-molded part and comprises a cylindrical first holder section 200 and a second holder section 201 designed as a socket, in which ends of the electrical connections 41 designed as contact pins are arranged. This second holder section 201 forms the electrical connection element 4. However, the holder 2 can also be formed from two separate plastic injection-molded parts, namely a cylindrical5 first holder section 200 and a second holder section 201, in which ends of the electrical connections 41 designed as contact pins are arranged. Here, too, the second holder section 201, or a part of the second holder section 201 designed as a socket, forms the electrical connection element 4.In all illustrated cases, the cylindrical first mounting section 200 has a first recess 7 in which the mounting board 10 and a heat sink section 31 are arranged, as well as an end face with a flat, annular disk-shaped end surface 20, which serves as a reference plane for aligning the light-emitting diodes of the semiconductor light source arrangement 1 with respect to the mounting 2 and with respect to the optical axis of the socket of a motor vehicle lamp into which the lighting device is inserted. A cap 8 is also inserted into the first recess 7, which cap encapsulates the mounting board 10 or the electronics 13 arranged thereon together with the mounting 2.The cap 8 has a second recess 81, which is designed and dimensioned such that it exposes the semiconductor light source 1 and such that the cap rests on the mounting board 10 in an area facing the mounting board 10 and adjacent to the semiconductor light source 1. The cap 8 is dimensioned in particular such that it is essentially flush with an inner surface of the first recess 7 and that it is also essentially flush with outer surfaces 17 of the semiconductor light source 1 in the area of ​​the second recess 81. The cap 8, together with the holder 2 and the heat sink 3, encloses an intermediate space 16 in which the electronics 13 is arranged on the mounting board 10. In order to ensure that the intermediate space 16 is essentially watertight, a first potting material 15a and a second potting material 15b are provided.The first encapsulation material 15a is provided between the holder 2 and the cap 8 in a region in which the cap 8 is formed opposite an inner surface of the first recess 7. The first encapsulation material 15a is intended, on the one hand, to seal any gaps that may occur between the holder 2 and the cap 8 and to provide additional mechanical stability between the holder 2 and the cap 8. The second encapsulation material 15b, on the other hand, is provided between the semiconductor light source 1 and the cap 8 in a region in which the cap 8 is formed opposite the semiconductor light source 10 on the mounting board 10. The second encapsulation material 15b is intended, on the one hand, to seal any gaps that may occur between the semiconductor light source 1 and the cap 8 and to provide additional mechanical stability between the semiconductor light source 1, the mounting board, and the cap 8.5 In the region of the second recess 81, the cap 8 has an inner surface 82 tapering conically in the direction of the semiconductor light source 1, opposite the outer surface 17 of the semiconductor light source 1. The inner surface 82 tapering conically in the direction of the semiconductor light source 1 provides the advantage that second encapsulating material 15b introduced between the cap 8 and the semiconductor light source 1 can flow more effectively into the space between the cap 8 and the semiconductor light source 1. As a result, a space between the cap 8 and the semiconductor light source 1 can be sealed in an improved manner, and at the same time, less of the second encapsulating material 15b is required to efficiently seal the space. In addition, the cap 8 has an outer surface 83 tapering conically in the direction of the semiconductor light source 1, opposite an inner surface of the first recess 7 of the holder 3.The outer surface 83, which tapers conically in the direction of the semiconductor light source 1, provides the advantage that the cap 8 can be inserted into the first recess 7 in a simplified manner. 5 kann.Furthermore, the cap 8 has a shape such that, on the one hand, the electronics 13 on the mounting board 10 finds space underneath, but the cap 8 itself does not shadow any light emitted by the semiconductor light source 1. For this purpose, the cap 8 has, in addition to the inner surface 82 tapering towards the semiconductor light source 1, an adjoining surface which also tapers conically towards the semiconductor light source 1, but which is formed with a flatter angle. This surface with a flatter angle ensures that the cap 8 does not shadow any light emitted by the semiconductor light source 1, or at least not at all. In a region of the cap 8 opposite the inner surface of the first recess 7, the latter is also stepped in the illustrated case. The reason for this is that deformability can be achieved by means of the stepped shape.a preload can be achieved when the cap 8 has been inserted into the first recess 7. However, this shape is merely exemplary and can be adapted as required. 2023PF01372 - 15 - Three locking elements 21, 22, 23 are arranged along the outer circumference of the annular disc-shaped end face 20, which protrude radially from the outer surface of the cylindrical mounting section 200 and form a bayonet lock with a correspondingly shaped counterpart of a socket of the motor vehicle lamp. To activate the bayonet lock, the lighting device is inserted into the socket of the motor vehicle lamp and then rotated clockwise or counterclockwise about the cylinder axis of the cylindrical mounting section 200. A locking element 23 has a stop to limit the aforementioned rotational movement, which stop is arranged in the socket orMounting opening of the motor vehicle light after the bayonet lock. The mounting board 10 with the semiconductor light source arrangement 1 mounted thereon is arranged within the cylindrical mounting section 200. The mounting board 105 is arranged perpendicular to the cylinder axis of the cylindrical mounting section 200. The cylindrical mounting section 200 forms a receptacle for a sealing ring 5 on its outer surface, which rests in the socket of a motor vehicle headlight after the lighting device has been mounted. The second mounting section 201 comprises a circular disk-shaped flange section, which rests on an annular disk-shaped heat sink section 32 on the side facing away from the cylindrical first mounting section 200.In the illustrated case, the flange section of the second mounting section 201 is connected to the annular disk-shaped heat sink section 32 by recesses 6 in the heat sink section 32, which are designed as undercuts. However, it is also possible to glue the mounting section 201 to the heat sink section 32 using an adhesive. The adhesive can, for example, serve as a sealing agent between the flange section of the second mounting section 201 and the annular disk-shaped heat sink section 32, as well as between the cylindrical first mounting section 200 and the annular disk-shaped heat sink section 32. If necessary, a sealing compound can be applied in the area between the second mounting section 201 and the heat sink, orIn the area of ​​the opening 300 through the heat sink 3, a third potting material (not shown) may be provided in order to seal the intermediate space 16 essentially watertight from this side as well. The second mounting section 201 also has a section designed as a socket 4, which extends parallel to the ring axis of the mounting 2 and is arranged offset parallel to this ring axis and is integrally formed on the circular disk-shaped flange section. However, it is also possible for the mounting section 201 (not shown here) to be arranged at an angle relative to the cylinder axis of the cylindrical mounting section 200. The free ends of the electrical contact pins 41 each extend into the socket 4 and serve there as electrical contacts of the lighting device and are provided for connecting a plug that can be plugged onto the socket 4.After the socket and plug are joined, this connection can be sealed. The other ends of the three electrical contact pins 41 each protrude through the opening 300 in the support surface 30 of the heat sink 3 and form, for example, a press fit with the mounting board 10 and are each connected to an electrical contact on the mounting board 10. The electrical contact pins serve to supply power to the LEDs 11. In all cases shown, the heat sink 3 has a hollow-cylindrical heat sink section 31, which is embedded in the plastic material of the holder 2 in the region of the cylindrical first holder section 200 or borders it. On its side facing the end face 20 of the cylindrical first support section 200, the hollow-cylindrically shaped heat sink section 31 has at least one flat surface 30 that is substantially parallel to the carrier.The cylinder axis of the hollow-cylindrically shaped heat sink section 31 is identical to the cylinder axis of the cylindrical first support section 201, and the substantially parallel surface 30 is arranged perpendicular to the cylinder axis of the hollow-cylindrically shaped heat sink section 31. The surface 30 of the hollow-cylindrically shaped heat sink section 31 has an opening 300 through which a second end of each of the three electrical connections 41 is passed. The second ends of the three electrical connections 41 form, for example, a press fit with the mounting board 10. Alternatively or in addition to the press fit, the second ends of the electrical connections 41 can also be connected to an electrical contact of the mounting board 10 by soldering.The heat sink 3 also has a ring-disk-shaped heat sink section 32, which is molded onto the hollow-cylindrical heat sink section 31 and whose ring axis coincides with the cylinder axis of the hollow-cylindrical heat sink section 31. Cooling fins 33 arranged along the circumference of the ring-disk-shaped heat sink section 32 are molded onto the ring-disk-shaped heat sink section 32. The cooling fins 33 are each angled 90 degrees from the ring-disk-shaped heat sink section 32 and each extend parallel to the ring axis of the ring-disk-shaped heat sink section 32. The outer edge of the ring-disk-shaped heat sink section 32 and the cooling fins 33 molded thereon protrude from the plastic material of the holder 2 or the cylindrical first holder section 200.The heat sink 3 is made of metal, for example, stainless steel sheet, and is formed as a one-piece, deep-drawn bent part. The cooling fins 33 form a recess, for example to ensure accessibility to the socket 4. 5 Furthermore, the heat sink 3 has a projection 9 in the region of the first recess 7, which extends centrally in the direction of the mounting board 10. The projection 9 can be formed integrally with the heat sink 3 or applied to the heat sink and connected to it. The mounting board 10 is arranged in the first recess 0 such that the mounting board rests at least partially on the projection 9. Furthermore, the projection 9 can also be formed in the holder 2 or the first holder section 200 in the form of a circumferential or partially interrupted edge, in order to additionally allow the mounting board 10 to rest thereon.A thermally conductive layer can be arranged between the heat sink 3 and the mounting board 10, filling the area between the heat sink 3 and the mounting board 10. The mounting board has passages 100 2023PF01372 - 18 - through which the ends of the contact pins 41 are guided to additionally secure the mounting board 10. To manufacture the lighting device, the electrical connections 41, designed as contact pins, are inserted into a mold half 5 of a plastic injection molding tool so that their ends each protrude from the mold. The heat sink 3 is also inserted into this mold half so that parts of its hollow cylindrical section 31 and its annular disk-shaped section 32 are arranged in the mold half.The mold is then closed, and plastic material is injected around the sections of the electrical connections 41 enclosed by the mold and around the parts of the heat sink sections 31, 32 arranged in the mold. Furthermore, after the plastic material has been filled in and allowed to solidify, the holder 52, and in particular its cylindrical holder section 200 and its holder section 201 designed as a socket, are formed using the mold of the plastic injection molding tool. The mounting board 10, provided with the semiconductor light source arrangement 1 and the electronics 13, is fixed to the surface 30 protruding from the plastic material of the holder 2 and the projection 9 of the heat sink 3, for example by a press fit with the second ends of the contact pins 41 on the heat sink 3 or in the holder 2. The cap 8 is then placed on orarranged above the mounting board 10, which is optionally welded or hot-stitched to the holder 2, and then the first and second potting materials 15a, 15b are applied in order to seal the intermediate space 16 inside the lighting device in a substantially watertight manner. The invention is not limited to the exemplary embodiments described in more detail above. For example, the holder 2 can be designed as a plastic injection-molded part produced by means of a multi-stage plastic injection-molding process. For example, during a first stage of the plastic injection-molding process, the electrical connections 41 can be inserted into a first injection mold and overmolded with plastic, so that during the first process stage, the holder section 201 designed as a socket with the electrical connections 41 fixed therein is formed.Subsequently, the socket-shaped mounting section 201, together with the electrical connections 41 fixed therein and the heat sink 3, could be inserted into a second injection mold and overmolded with plastic to form the complete mounting section 2 with the additional, cylindrical mounting section 200. This two-stage plastic injection molding process has the advantage that the socket-shaped mounting section 201 and the cylindrical mounting section 200 can be made of different plastic materials. The heat sink of the lighting device according to the invention can further have a heat sink section made of a phase-changing material that changes its state of aggregation when heated.The heat sink section, made of phase-change material, is completely enclosed in the plastic material of the holder, for example, and changes its state of matter from solid to liquid when heated and returns to the solid state when cooled. The holder is made of polyamide (PA), for example. Furthermore, the holder can be made of a plastic material with high thermal conductivity to support the cooling function of the heat sink.

[0002] 2023PF01372 - 20 - LIST OF REFERENCE SYMBOLS 1 Semiconductor light source assembly 5 10 Mounting board 13 Electronics 15a, 15b Potting material 16 Intermediate space 17 Outer surface 0 18 Dam 19 Conversion layer 100 Passage 2 Bracket 20 Front side 5 21, 22, 23, 34 Locking element 200, 201 Bracket section 3 Heat sink 30 Surface 31, 32, 33 Heat sink section 0 300 Passage 4 Buchse 41 Contact pin5 Sealing ring6 Recess5 7 Cutout71 Inner surface 8 Kappe81 Recess82 Inner surface0 83 Outer surface9 Projection

Claims

2023PF01372 - 21 - PATENT CLAIMS 1. Lighting device (1) comprising: a semiconductor light source arrangement (1) arranged on a carrier (10); electronics (13) arranged on the carrier (10) for operating the semiconductor light source arrangement (1); a heat sink (3) for cooling the semiconductor light source arrangement (1); an electrical connection element (4) for supplying power to the semiconductor light source arrangement (1); a holder (2); and a cap (8); wherein the carrier (10) is arranged in a first recess (7) of the holder (2), and the heat sink (3) forms at least one surface (30) in the first recess (7) that is substantially parallel to the carrier (10), on which surface the carrier (10) is arranged; wherein the cap (8) is arranged in the first recess (7) on the carrier (10) and has a second recess (81) exposing the semiconductor light source arrangement (1);and wherein a first potting material (15a) is arranged between the holder (2) and the cap (8) and a second potting material (15b) is arranged between the cap (8) and the semiconductor light source arrangement (1) and / or the carrier (10).

2. Lighting device according to claim 1, wherein the cap (8) is arranged in the first recess (7) with a substantially exact fit.

3. Lighting device according to claim 1 or 2, wherein the second recess (81) substantially corresponds to the size of the external dimensions of the semiconductor light source (1).

4. Lighting device according to one of claims 1 to 3, wherein the cap (8) together with the holder (2), the heat sink (3), the electrical connection element (4) and the semiconductor light; 2023PF01372 - 22 - source (1) encloses a substantially watertight intermediate space (16) in which the carrier (10) and the electronics (13) are arranged.5 5. Lighting device according to one of claims 1 to 4, wherein the cap (8) has an inner surface (82) tapering conically in the direction of the semiconductor light source (1) opposite an outer surface (17) of the semiconductor light source (1).0 6. Lighting device according to one of claims 1 to 5, wherein the cap (8) has an outer surface (83) tapering conically in the direction of the semiconductor light source (1) opposite an inner surface (71) of the first recess (7) of the holder (2).5 7. Lighting device according to one of claims 1 to 6, wherein the cap (8) has a substantially constant wall thickness.

8. Lighting device according to one of claims 1 to 7, wherein the first and second potting materials (15a, 15b) comprise or consist of a silicone.9.Lighting device according to one of claims 1 to 8, wherein the cap (8) comprises or consists of XY.5 10. Lighting device according to one of claims 1 to 9, wherein the holder (2) and / or the heat sink (3) has at least one projection (9) on which the carrier (10) rests at least partially.0 11. Lighting device according to one of claims 1 to 10, wherein the holder (2) and / or the heat sink (3) has at least one second recess in which the electronics (13) are arranged.5 12. Lighting device according to one of claims 1 to 11, wherein the heat sink (3) has a first heat sink section (31) which is arranged in the first recess (7) of the holder (2) and the. 2023PF01372 - 23 - forms at least one surface (30) substantially parallel to the carrier (10); and has a second heat sink portion (32) which is arranged in a snug fit between the holder (2) and the electrical connection element (4).

13. The lighting device according to one of claims 1 to 12, wherein the electrical connection element (4) is formed integrally with the holder (2). 0 14. The lighting device according to one of claims 1 to 13, wherein the heat sink (3) is formed integrally with the holder (2). 5 15. The lighting device according to one of claims 1 to 14, wherein the electrical connection element (4) has electrical contacts (41) which are passed through an opening (300) through the heat sink (3) and in particular form a press fit with the carrier (10) of the semiconductor light source arrangement (1). 0 16.Lighting device according to one of claims 1 to 15, wherein locking elements (21, 22, 23) are arranged on the holder (2), which serve to form a bayonet lock with a socket. 5 17. Lighting device according to one of claims 1 to 16, wherein the carrier (10) is designed as a mounting board.

18. Lighting device according to one of claims 1 to 17, wherein the holder (2) is designed as a plastic part, in particular a plastic injection-molded part.

19. Method for producing a lighting device, in particular a lighting device according to one of the preceding claims, comprising the steps of: providing a holder (2), a heat sink (3) arranged in a first recess (7) in the holder (2), and. 2023PF01372 - 24 - an electrical connection element (4) connected to the holder (2); arranging a carrier (10) with a semiconductor light source arrangement (1) arranged thereon and electronics (13) for operating the semiconductor light source arrangement (1), in the first recess (7) on a surface (30) of the heat sink (3) that is substantially parallel to the carrier (10); arranging a cap (8) in the first recess (7) on the carrier (10), the cap (8) having a second recess (81) that exposes the semiconductor light source arrangement (1); andsealing an intermediate space (16) enclosed by the heat sink (3), the electrical connection element (4), and the semiconductor light source (1) by means of a first encapsulating material (15a) between the holder (2) and the cap (8) and a second encapsulating material (15b) between the cap (8) and the semiconductor light source arrangement (1) and / or the carrier (10). 20.The method of claim 19, wherein the sealing step seals the gap (16) substantially watertight. 0 21. The method of claim 20, wherein the sealing step comprises welding or heat-staking the cap (8) to the holder (2). 5.

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