Component mounting method, method for optimizing mounting process, and component mounting machine

Abstract

This component mounting method comprises: a collection step in which a collection operation is executed whereby each of a plurality of mounting heads uses a plurality of suction nozzles to collect the same number of components of the same type; a setting step in which, among a plurality of unit substrates, a target substrate that serves as a target for mounting each component using the plurality of mounting heads is set; and a mounting step in which a mounting operation is executed whereby the plurality of components is mounted on a plurality of target substrates in the same mounting order, one at a time by the plurality of mounting heads.

Description

Component mounting method, method for optimizing mounting process, and component mounting machine

[0001] The present invention relates to a component mounting method, a method for optimizing a mounting process, and a component mounting machine.

[0002] Component placement machines are used in the production of product circuit boards. The component placement machine picks up components using, for example, a suction nozzle and places the components at predetermined placement positions on the circuit board. The component placement machine is equipped with a placement head that is movable within the machine and supports the suction nozzle so that it can move up and down and rotate. Patent Document 1 discloses a configuration that aims to improve the efficiency of placement processing for a multi-panel circuit board formed by arranging multiple unit boards. Patent Document 2 also discloses a configuration that aims to improve the efficiency of placement processing by using multiple placement heads.

[0003] International Publication No. 2021-001962 Japanese Patent Application Laid-Open No. 2004-186391

[0004] In the component mounting process using a component mounting machine, there is room for further efficiency improvements by improving the operating sequence and movement paths of multiple mounting heads, depending on, for example, the wiring patterns of the unit boards that make up a multi-panel board, the types of components to be mounted, and the distance between adjacent unit boards.

[0005] The present specification aims to provide a component mounting method, a method for optimizing the mounting process, and a component mounting machine that can improve the efficiency of the mounting process when performing mounting processes on multi-panel boards using multiple mounting heads.

[0006] This specification discloses a component mounting method in a component mounting machine that mounts components on a board, the component mounting machine having a plurality of mounting heads each supporting a plurality of suction nozzles that hold the components, the component mounting machine independently moving the plurality of mounting heads in a first horizontal direction and moving the plurality of mounting heads together in a second horizontal direction that intersects the first direction, and when the board is a multi-panel board formed by arranging a plurality of unit boards on which the same wiring pattern is formed in the first direction and the second direction, the component mounting method includes: a picking step in which each of the plurality of mounting heads performs a picking operation to pick up the same number of the same type of components using the plurality of suction nozzles; a setting step in which each of the plurality of mounting heads sets target boards among the plurality of unit boards on which the components are to be mounted; and a mounting step in which the plurality of mounting heads sequentially perform a mounting operation once each to mount the plurality of components on the plurality of target boards in the same mounting order.

[0007] This specification discloses a method for optimizing a mounting process in which components are mounted on a board by a component mounting machine, wherein the component mounting machine is equipped with a plurality of mounting heads, each supporting a plurality of suction nozzles that hold the components, and moves the plurality of mounting heads independently in a first direction and moves the plurality of mounting heads together in a horizontal second direction that intersects the first direction, and when the target board in the mounting process is a multi-panel board formed by arranging a plurality of unit boards, each having the same wiring pattern, in the first direction and the second direction, the method comprises the steps of: a picking step in which each of the plurality of mounting heads performs a picking operation to pick up the same number of the same type of components using the plurality of suction nozzles; a setting step in which each of the plurality of mounting heads sets target boards among the plurality of unit boards on which the components are to be mounted; and a mounting step in which the plurality of mounting heads sequentially perform a mounting operation once each to mount the plurality of components on the plurality of target boards in the same mounting order.

[0008] This specification describes a component mounting machine that comprises a plurality of mounting heads, each supporting a plurality of suction nozzles that hold components, and a control device that moves the plurality of mounting heads independently in a first horizontal direction and moves the plurality of mounting heads together in a second horizontal direction that intersects the first direction, wherein the control device performs a mounting process including: a picking step in which, when the board on which the components are to be mounted is a multi-panel board formed by arranging a plurality of unit boards, each with the same wiring pattern, in the first direction and the second direction, each of the plurality of mounting heads performs a picking operation to pick up the same number of the same type of components using the plurality of suction nozzles; a setting step in which each of the plurality of mounting heads sets a target board among the plurality of unit boards onto which the components are to be mounted; and a mounting step in which the plurality of mounting heads sequentially perform a mounting operation once each to mount the plurality of components on the plurality of target boards in the same mounting order.

[0009] This specification also discloses the technical idea of ​​changing "the component mounting method according to any one of claims 1 to 3" in claim 5 originally filed to "the component mounting method according to any one of claims 1 to 4," and the technical idea of ​​changing "the component mounting method according to any one of claims 1 to 3" in claim 6 originally filed to "the component mounting method according to any one of claims 1 to 5." This specification also discloses the technical idea of ​​changing "the component mounting method according to any one of claims 1 to 3" in claim 9 originally filed to "the component mounting method according to any one of claims 1 to 8," and the technical idea of ​​changing "the component mounting method according to any one of claims 1 to 3" in claim 10 originally filed to "the component mounting method according to any one of claims 1 to 9."

[0010] With this configuration, a plurality of mounting heads are used to perform mounting operations on a target substrate that is appropriately set from a plurality of unit substrates, thereby improving the efficiency of the mounting process for multiple substrates.

[0011] 5 is a perspective view showing a component mounting machine. FIG. 6 is a side view schematically showing a mounting head. FIG. 7 is a plan view schematically showing a component mounting machine. FIG. 8 is a flowchart showing mounting processing by the component mounting machine. FIG. 9 is a top view schematically showing a multiple board made up of a plurality of unit boards. FIG. 10 is a flowchart showing preparation processing including setting processing (steps). FIG. 11 is a diagram showing the result of a first mode of the setting processing in correspondence with FIG. 5. FIG. 12 is a diagram showing the result of a second mode of the setting processing in correspondence with FIG. 5. FIG. 13 is a diagram showing the operation timing of two mounting heads in a mounting cycle. FIG. 14 is a top view showing an example of the positions of two mounting heads in a collection cycle. FIG. 15 is a diagram showing the operation timing of two mounting heads in a collection cycle. FIG. 16 is a diagram showing an example of the movement paths of two board cameras in an imaging cycle in correspondence with FIG. 5. FIG. 17 is a diagram showing the operation timing of two board cameras in an imaging cycle. FIG. 18 is a flowchart showing optimization processing to which a method for optimizing mounting processing is applied.

[0012] 1. Overview of Component Mounting Machine 10 Component mounting machine 10 is a substrate-related operation machine that performs a predetermined substrate-related operation on board 90, and performs a mounting process to mount components on board 90 as the substrate-related operation. Component mounting machine 10 constitutes a production line together with a plurality of other substrate-related operation machines that are installed in the transport direction of board 90. Each of the plurality of substrate-related operation machines is communicably connected to host computer 5, which controls the production line as a whole.

[0013] In addition to component mounting machine 10, the substrate-related operating machines that make up the production line include a printer that prints solder on substrate 90, a reflow oven that heats substrate 90 with components mounted thereon to perform soldering, and an inspection machine that inspects whether the appearance or function of the product substrate is normal. The configuration of the production line can be appropriately added to or modified depending on, for example, the type of product substrate to be produced. Specifically, multiple production lines can be appropriately equipped with substrate-related operating machines such as a buffer device that temporarily holds substrate 90 being transported, a substrate supply device, a substrate inverting device, various inspection devices, a shield mounting device, an adhesive dispensing device, and an ultraviolet irradiation device.

[0014] 1 and 3, the component mounting machine 10 includes a board transport device 20, a component supply device 30, a head moving device 40, and a control device 85. In the following description, the horizontal direction of the component mounting machine 10 (the direction from the upper left to the lower right in FIG. 1, the left-right direction in FIG. 3) is referred to as the X direction (first direction), the horizontal direction intersecting the X direction and the front-rear direction of the component mounting machine 10 (the direction from the lower left to the upper right in FIG. 1, the up-down direction in FIG. 3) is referred to as the Y direction (second direction), and the vertical direction perpendicular to the X and Y directions (the up-down direction in FIG. 1, the front-rear direction in FIG. 3) is referred to as the Z direction.

[0015] 2-1. Substrate Transfer Device 20 The substrate transfer device 20 has a conveyor belt 21, a pair of guide rails 22, and a backup device 23. The conveyor belt 21 is an endless belt that transfers a substrate 90 placed on its upper surface. The pair of guide rails 22 extend in the transfer direction (X direction) of the substrate 90, and support the periphery of the substrate 90 transferred by the conveyor belt 21. At least one of the pair of guide rails 22 is provided on the base 11 so as to be movable in the Y direction.

[0016] The board transport device 20 sequentially transports the boards 90 in the transport direction and positions the boards 90 at predetermined positions within the machine. As shown in Fig. 2, the backup device 23 raises the backup pins 24 using the pin lifting device 25, and clamps the boards 90 positioned at the predetermined positions in the transport direction between the pair of guide rails 22. After performing the component mounting process, the board transport device 20 transports the boards 90 out of the component mounting machine 10.

[0017] 2-2. Component Supply Device 30 The component supply device 30 supplies components to be mounted on the board 90. The component supply device 30 includes feeders 31 arranged in a predetermined arrangement direction (the X direction in this embodiment). The feeders 31 are, for example, tape feeders that feed and move a carrier tape 33 (see FIG. 9 ) containing components in the Y direction to supply the components so that they can be picked up. The component supply device 30 rotatably supports a reel 32 around which the carrier tape 33 is wound.

[0018] The feeder 31 may include a stick feeder, a bulk feeder, or the like. Furthermore, the component supply device 30 may supply, for example, relatively large components arranged on a tray placed on a pallet. In the above configuration, the component supply device 30 draws a predetermined pallet from a storage device that stores multiple pallets in accordance with the mounting process and supplies the components.

[0019] 2-3. Head Moving Device 40 The head moving device 40 is an XY robot that horizontally moves a work head used for a predetermined substrate-related operation. In this embodiment, the head moving device 40 moves a mounting head 70 serving as a work head. As shown in FIG. 1 , the head moving device 40 includes an X slide 50 and a Y slide 60 that serve as moving tables to which the mounting head 70 is attached. The X slide 50 is moved in the X direction by the linear motion mechanism of the X drive device 41. The Y slide 60 supports the X slide 50 so that it can move in the X direction, and is moved in the Y direction by the linear motion mechanism of the Y drive device 46.

[0020] A mounting head 70 is replaceably fixed to the head support portion 51 (see FIG. 2) of the X-slide 50 by a clamp member (not shown). Various holding members are detachably attached to the mounting head 70. The holding members include a suction nozzle 74 that sucks and holds a component using negative pressure air, a chuck that grips the component, and a picker that holds the backup pins 24.

[0021] In this embodiment, the component mounting machine 10 includes multiple mounting heads 70. The head moving device 40 moves the multiple mounting heads 70 independently in the X direction and moves the multiple mounting heads 70 together in the Y direction. Specifically, the head moving device 40 includes multiple X slides 50 that support the respective mounting heads 70. The detailed configurations of the mounting heads 70 and the head moving device 40 will be described later.

[0022] 2, the component mounting machine 10 is equipped with a component camera 81 and a board camera 82. The component camera 81 and the board camera 82 are digital imaging devices having imaging elements such as CMOS. The component camera 81 and the board camera 82 capture images based on control signals and send image data acquired by the capture.

[0023] In this embodiment, the component camera 81 is provided on the head main body 71 of the mounting head 70. The board camera 82 is provided on the X-slide 50. With this configuration, the component camera 81 and the board camera 82 move integrally with the mounting head 70 as the X-slide 50 moves. The component camera 81 is configured to be able to capture images of a component 98 held by a suction nozzle 74 serving as a holding member from below. The board camera 82 is configured to be able to capture images of a reference mark 96 (see FIG. 5 ) attached to the board 90 from above.

[0024] In addition to the above, the component mounting machine 10 may also be equipped with a camera capable of capturing images of the components 98 held by the suction nozzles 74 from the side or above, and a camera capable of capturing images of the mounting surface of the board 90 before or after the components 98 are mounted. These cameras are used, for example, to inspect the presence and orientation of the components 98, inspect the appropriateness of the type and shape of the components 98, and inspect the appropriateness of the solder printing condition on the board 90 and the mounting condition of the components 98.

[0025] 2-5. Control Device 85 The control device 85 is primarily composed of a CPU, various memories, and control circuits. The control device 85 executes a mounting process for mounting components on the board 90. During the mounting process, the control device 85 controls the operation of the head moving device 40 based on information output from various sensors, the results of image processing, pre-stored control programs, and the like. This controls the positions and angles of the multiple suction nozzles 74 supported by the mounting head 70. The control device 85 also executes placement operations, including adding or removing backup pins 24 used by the backup device 23 to support the board 90 from below during the mounting process, and changing the position of the backup pins 24.

[0026] 3. Detailed Configuration of the Placement Head 70 As shown in FIG. 2 , the placement head 70 includes a head main body 71 that is detachably attached to the X-slide 50. The placement head 70 has a rotor 72 that is attached to the head main body 71 and is rotatable about an R-axis that extends in the vertical direction relative to the head main body 71. The rotor 72 supports multiple holders 73 arranged on a ring centered on the R-axis so that the holders 73 can move up and down and rotate about their respective central axes (Q-axes). Each of the multiple holders 73 is fitted with a suction nozzle 74 that serves as a holding member for holding a component 98. As a result, the rotor 72 supports the suction nozzles 74 via the holders 73.

[0027] The mounting head 70 has an R-axis rotation device 75 that rotates the rotor 72 about the R-axis. The R-axis rotation device 75 sets the rotor 72 at a predetermined angle about the R-axis, thereby indexing one holder 73 to an elevation position where it is raised and lowered by an elevation device 77 (described later). The mounting head 70 has a Q-axis rotation device 76 that rotates the holder 73 about the Q-axis. In this embodiment, the Q-axis rotation device 76 has a mechanism that rotates multiple holders 73 in unison, and is used to rotate the multiple holders 73. With the above configuration, when one holder 73 is set at a predetermined angle about the Q-axis, the other multiple holders 73 are also set at predetermined angles in unison.

[0028] The mounting head 70 has an elevator device 77 that raises and lowers a holder 73 among the plurality of holders 73 that has been indexed to a lift position by the rotation of the rotor 72. The elevator device 77 lowers and raises the holder 73, thereby lowering and raising the suction nozzle 74 attached to the holder 73. The mounting head 70 may be configured to have two or more lift positions and include a plurality of elevator devices that can be driven independently so as to raise and lower the holders 73 positioned at each position.

[0029] The number of holders 73 supported by the mounting head 70 configured as described above may vary depending on the type of mounting head 70. The mounting head 70 may adopt various configurations in addition to the configuration in which multiple holders 73 are supported at equal intervals in a circular ring shape as in this embodiment. For example, the mounting head 70 may adopt a configuration in which multiple holders 73 are supported arranged in a line or in a matrix.

[0030] 4. Detailed Configuration of Head Moving Device 40 4-1. Overall Structure and Driving Device of Head Moving Device 40 In this embodiment, the head moving device 40 is supported from above by a pair of columns 12 and a beam 13, as shown in FIG. 1. The pair of columns 12 are gate-shaped structures provided at the front and rear of the base 11, respectively. The beam 13 spans the pair of columns 12. The beam 13 is a strength member that supports the head moving device 40 and connects the pair of columns 12, thereby improving the rigidity of the entire machine.

[0031] As described above, head moving device 40 includes X drive device 41 (see FIG. 2) that moves X slide 50 in the X direction relative to Y slide 60, and Y drive device 46 that moves Y slide 60 in the Y direction relative to beam 13. X drive device 41 and Y drive device 46 are configured with linear motion mechanisms such as linear motors and ball screws. In this embodiment, X drive device 41 is a linear motor, and Y drive device 46 is a ball screw device.

[0032] 1, Y slide 60 has a guide block 65 slidably engaged with a pair of guide rails 47 provided on beam 13. The pair of guide rails 47 and guide block 65 function as a Y-axis guide device that guides movement of Y slide 60 in the Y direction. The Y-axis guide device is of a suspension type that supports Y slide 60 suspended from the pair of guide rails 47 so that it can move in the Y direction, and can ensure a large range of movement in the X direction.

[0033] Y drive device 46, which is a ball screw device, includes a ball screw 461 that is attached to beam 13 and extends in the Y-axis direction, a nut 462 that is threadedly engaged with ball screw 461 and is attached to Y slide 60, and a motor 463 that rotates ball screw 461. Y drive device 46 controls the power supply to motor 463 to rotate ball screw 461 by a predetermined amount in a predetermined direction, and moves Y slide 60, which is fixed to nut 462, to a predetermined position in the Y direction.

[0034] 2, the X slide 50 includes a plurality of carriages 52 movably supported along a pair of guide rails 61 provided on the Y slide 60. The pair of guide rails 61 and the carriages 52 function as an X-axis guide device that guides movement of the X slide 50 in the X direction. In this embodiment, the X drive device 41, which is a linear motor, includes a pair of stators 42, a mover 43, and a cooling device 44, as shown in FIG.

[0035] The pair of stators 42 are arranged along the X direction facing each other at a predetermined interval. Each of the pair of stators 42 includes a yoke to which multiple permanent magnets are fixed and a non-magnetic base plate that holds the yoke. The multiple permanent magnets are arranged so that the magnetic poles of two adjacent permanent magnets face in opposite directions. The mover 43 is arranged between the pair of stators 42 and is provided on the X slide 50. The mover 43 includes cores corresponding to the three phases (U, V, W) and coils wound around the cores.

[0036] The cooling device 44 cools the X drive device 41, which is a linear motor, by dissipating heat conducted by multiple heat pipes in a heat sink. The X drive device 41 generates thrust by supplying power to the coil of the mover 43. The X drive device 41 controls the power supply to the coil, thereby moving the X slide 50 fixed to the mover 43 to a predetermined position in the X direction.

[0037] 4-2. Detailed Configuration of the Head Moving Device 40 The component mounting machine 10 uses the head moving device 40 configured as described above to move the mounting head 70 horizontally. To shorten the time required for component mounting, it is conceivable to provide the mounting head 70 with multiple lifting devices 77, for example, so that the pickup operation for two components can be performed simultaneously. However, this configuration imposes various constraints, such as the requirement that the two components to be picked must be supplied at a distance roughly equal to the distance between the liftable suction nozzles 74.

[0038] Therefore, the component mounting machine 10 of this embodiment employs a suspension system that can ensure a wide range of movement in the X direction, and employs a configuration that includes multiple (two in this embodiment) mounting heads 70 that can move independently in the X direction (the conveyance direction of the board 90, the arrangement direction of the feeder 31). In the following description, when distinguishing between the upstream side and downstream side in the board conveyance direction of the multiple X slides 50 and the multiple mounting heads 70, the symbols of the components arranged on the upstream side in the board conveyance direction (upper left side in FIG. 1, left side in FIG. 3) will be appended with 'L', and the symbols of the components arranged on the downstream side in the board conveyance direction (lower right side in FIG. 1, right side in FIG. 3) will be appended with 'R'.

[0039] Head moving device 40 includes two X slides 50L, 50R that support two mounting heads 70L, 70R so that they can move independently in the X direction. Note that Y slide 60 supports each of the two X slides 50L, 50R so that they can move in the X direction, and moves the two X slides 50L, 50R together in the Y direction. In this embodiment, Y slide 60 supports each of the two X slides 50L, 50R so that they can move in the X direction in the same plane (XZ plane) perpendicular to the Y direction, using a pair of upper and lower guide rails 61 provided along the X direction.

[0040] 5. Mounting Process by Component Mounting Machine 10 5-1. Overview of Mounting Process The mounting process by the component mounting machine 10 will be described with reference to Figures 3 and 4. Here, it is assumed that the component supply device 30 is equipped with a plurality of feeders 31. In the mounting process, first, the board transport device 20 of the component mounting machine 10 executes a board 90 loading process (S11), as shown in Figure 4. As a result, the board 90 is loaded into the machine and positioned at a predetermined position within the machine.

[0041] Next, the control device 85 executes a preparation process (S12). The preparation process includes recognizing a reference mark 96 (see FIG. 5) for acquiring the position of the positioned substrate 90 and reading a barcode 97 indicating the substrate ID of the substrate 90. Specifically, the control device 85 controls the operation of the head moving device 40 to perform an imaging operation in which the substrate camera 82 is moved above an imaging target such as the reference mark 96 to capture an image. The control device 85 performs image processing on the image data acquired by the imaging operation to recognize the reference mark 96 and read the barcode 97.

[0042] The preparation process may also include processes for obtaining information such as whether or not the board 90 is warped, the state of the components 98 already mounted, and the state of the printed solder. The control device 85 controls the operation of the head moving device 40 so as to move the board camera 82 to a predetermined position according to the content of the necessary preparation process. The control device 85 also obtains the type of board 90 (normal / multiple board, etc.) by, for example, sending the board ID of the board 90 to the host computer 5, and sets the type of mounting process to be performed on the board 90.

[0043] In the PP cycle, the control device 85 executes a pickup cycle in which the pickup operation of picking up components 98 using the multiple suction nozzles 74 is repeated (S13, pickup step). At this time, the control device 85 controls the operation of the head moving device 40 in the pickup operation so as to sequentially position the mounting head 70 according to the positions of the pickable components 98. In this embodiment, in parallel with the pickup cycle, the control device 85 executes a process of recognizing the holding states of the components 98 held by the multiple suction nozzles 74 (S14, recognition step).

[0044] More specifically, when the rotor 72 rotates about the R axis as the pickup cycle is executed and the suction nozzle 74 holding the component 98 is positioned above the component camera 81, the control device 85 sends an image capture command to the component camera 81. The control device 85 processes the image data acquired by the component camera 81, and recognizes the attitude (position and angle) of the component 98 held by the suction nozzle 74.

[0045] After the picking cycle (S13) is completed, the control device 85 executes a placement cycle (S15, placement step) in which the placement operation of placing components 98 using the multiple suction nozzles 74 is repeated. In the placement operation of this placement cycle (S15), the control device 85 controls the operation of the placement head 70 so that each component 98 is placed at a placement position specified by the control program. Furthermore, based on the results of the recognition process (S14), the control device 85 controls the operation of the placement head 70 so that each component 98 assumes a predetermined orientation relative to its placement position.

[0046] The control device 85 determines whether all PP cycles have been completed based on the control program (S16). If all PP cycles have not been completed (S16: No), the control device 85 executes the PP cycles (S13-S15). If all PP cycles have been completed (S16: Yes), the control device 85 executes the unloading process of the board 90 (S17). In the unloading process of the board 90, the board transport device 20 unclamps the positioned board 90 and unloads the board 90 from the component mounting machine 10.

[0047] 5-2. Control of head moving device 40 during mounting operation In the mounting cycle (S15) of the mounting process, as described above, the mounting operation of components 98 is performed using multiple suction nozzles 74. In this embodiment, the mounting operation is performed using two mounting heads 70 to improve the efficiency of the mounting cycle of components 98. Here, as shown in FIG. 5, the substrate 90 is a multiple substrate 90A, with multiple unit substrates 91 arranged side by side in the X direction.

[0048] Here, the multiple substrate 90A is configured by arranging a plurality of unit substrates 91, each having the same wiring pattern 92, in the X and Y directions. Furthermore, in accordance with the arrangement of the plurality of unit substrates 91, a plurality of reference marks 96 are provided in a matrix along the X and Y directions on the multiple substrate 90A.

[0049] The control device 85 performs positioning operations of the suction nozzles 74 in the X direction so that the separation distance in the X direction between the suction nozzles 74 supported by each of the two mounting heads 70 is an integer multiple of the distance between a pair of adjacent unit substrates 91 in the X direction. The control device 85 then controls the two mounting heads 70 to perform the mounting operation once each in turn, in which multiple components 98 are mounted in the same mounting order on target substrates set as the mounting targets for the current PP cycle from among the multiple unit substrates 91.

[0050] In this embodiment, the target board is set in advance in the preparation process (S12). More specifically, as shown in FIG. 6 , the control device 85 captures an image of the barcode 97 on the board 90 and reads the barcode 97 by image processing the image data acquired by the image capture (S21). Based on the board ID acquired by the reading process, the control device 85 recognizes that the board 90 is a multiple board 90A and acquires board information including the arrangement of the unit boards 91 and whether or not there are any unit boards 91 on which components 98 should be skipped. The control device 85 may acquire the board information by sending the board ID to the host computer 5.

[0051] Next, the control device 85 captures an image so as to include the positions of the plurality of reference marks 96 included in the substrate information, and performs image processing on the image data acquired by the image capture to acquire the reference position of the multiple substrate 90A based on the plurality of reference marks 96, and the reference position (e.g., the origin) for each of the plurality of unit substrates 91 (S22). Details of the imaging process targeting the plurality of reference marks 96 will be described later.

[0052] Next, if the board 90 is a multiple board 90A (S23: Yes), the control device 85 executes a target board setting process (S30, setting step). Here, the above-mentioned "target board" refers to a unit board 91 that is set for placement for each PP cycle that is executed multiple times. In the target board setting process (S30), each placement head 70 is assigned to place components 98 on each of the multiple unit boards 91, so that placement processes can be efficiently executed using two placement heads 70.

[0053] Various modes can be applied to the setting process for target substrates. In this embodiment, the efficiency of the mounting process is improved by adopting the following mode of setting process. Specifically, the control device 85 is preset with operation modes for the two mounting heads 70 in the mounting process. These operation modes include an approach mode and a partition mode. As shown in FIG. 7A, the approach mode is an operation mode in which the two mounting heads 70 are brought close to each other while preventing interference and ensuring that the separation distance between them does not exceed a predetermined value. As shown in FIG. 7B, the partition mode is an operation mode in which a plurality of unit substrates 91 are virtually divided in the X direction and the mounting heads 70 that perform the mounting operation are assigned to them.

[0054] 7A and 7B, the unit substrate 91 set as the target substrate for the mounting head 70L on the left side (upstream side in the substrate transport direction) is indicated by "U1" and a diagonal line, and the unit substrate 91 set as the target substrate for the mounting head 70R on the right side (downstream side in the substrate transport direction) is indicated by a diagonal line and "U2". Note that the operation mode may be set by the control device 85 accepting an operation from an operator during a setup change for the mounting process, or may be set by a control program. The operation mode may also be set in response to a substrate ID sent to the host computer 5.

[0055] More specifically, when the operating mode is the approach mode (S31: Yes), the control device 85 sets, as target substrates (U1, U2 indicated by thick solid lines), a first unit substrate 911 (for example, the unit substrate 91 at the top left of FIG. 7A), which is one of the multiple unit substrates 91, and a second unit substrate 912 (the third unit substrate 91 from the top left to the right of FIG. 7A), which is the unit substrate 91 closest to the first unit substrate 911 in the X direction and is spaced apart from the first unit substrate 911 in the X direction by more than the minimum distance Dc at which two mounting heads 70 are allowed to approach each other, as shown in FIG. 7A (S32).

[0056] The control device 85 then sets a unit substrate 91 that has not been set as the target substrate (the second unit substrate 91 from the top left to the right in FIG. 7A) as the first unit substrate 911, and as described above as the second unit substrate 912, and sets these as target substrates (U1, U2 indicated by thick dashed lines). By repeating this process, it is possible to assign which mounting head 70 will perform the mounting operation for all unit substrates 91. In the approach mode, the travel distance of the two mounting heads 70 can be shortened depending on the relationship with the supply position of the components 98, thereby shortening the time required for the mounting process.

[0057] Here, an example is shown in which the minimum distance Dc is greater than the pitch Dp of the multiple unit substrates 91 arranged in the X direction, but less than twice the pitch Dp (Dp<Dc<2Dp). In such a case, the target substrates (U1, U2) are set with one unit substrate 91 sandwiched between them in the X direction, as shown in Figure 7A. Note that if the minimum distance Dc is smaller than the pitch Dp of the multiple unit substrates 91, the target substrates (U1, U2) are set so as to be adjacent to each other in the X direction.

[0058] 7B , when the operation mode is the partition mode (S31: No), the control device 85 divides the plurality of unit substrates 91 in the X direction into the same number of partitions 95 as the number of the plurality of mounting heads 70, and assigns a mounting head 70 that will perform a mounting operation to each of the plurality of partitions 95 to set target substrates (U1, U2) (S33). In this embodiment, the head moving device 40 is equipped with two mounting heads 70, and the plurality of unit substrates 91 are divided in the X direction into two partitions 95A, 95B.

[0059] The plurality of unit substrates 91 belonging to the left section 95A are assigned to target substrate U1 so that they can be mounted by the left mounting head 70L. Similarly, the plurality of unit substrates 91 belonging to the right section 95B are assigned to target substrate U2 so that they can be mounted by the right mounting head 70R. As described above, in the preparation process (S12), the target substrates U1 and U2 to be mounted by the two mounting heads 70 are set in advance for the plurality of unit substrates 91.

[0060] In the mounting cycle (S15), the control device 85 controls the pair of mounting heads 70L, 70R to perform the mounting operation on a pair of target substrates U1, U2 that are located as close to each other in the Y direction as possible for each of the target substrates U1, U2. As a result, the X-direction separation distance between the suction nozzles 74 supported by each of the two mounting heads 70 becomes an integer multiple of the distance between a pair of unit substrates 91 adjacent in the X direction. The control device 85 then controls the two mounting heads 70L, 70R to perform the mounting operation once each in turn for the target substrates U1, U2 that have been set as the mounting targets in the current PP cycle.

[0061] Specifically, as shown in FIG. 8 , while one of the two mounting heads 70 (e.g., the left mounting head 70L) is performing a mounting operation (AL11), the control device 85 performs a positioning operation (AR11x) of the suction nozzle 74 to a mounting position in the X direction (first direction position) corresponding to a mounting operation (AR11) performed by the other of the two mounting heads 70 (e.g., the right mounting head 70R). Then, after the mounting operation by the left mounting head 70L is completed, the control device 85 performs a positioning operation (AR11y) to a mounting position in the Y direction (second direction position) corresponding to the mounting operation by the right mounting head 70R. The positioning operations (AR11x, AR11y) to the above mounting positions include a correction amount based on the holding state of the component 98, which is the result of the recognition process (S14).

[0062] This allows for parallel execution of placement operations (at least the XY movement (AL11x, AL11y) of the left-side placement head 70L and the X movement (AR11x) of the right-side placement head 70R) using the two placement heads 70. The pair of placement operations (AL11, AR11) described above are operations for placing the same type of components 98 at the same placement positions relative to the reference positions (origins) of the respective target boards U1, U2.

[0063] The control device 85 then proceeds to the next pair of mounting operations (AL12, AR12) in accordance with the control program and performs similar control. After completing the mounting cycle for a predetermined target substrate among the plurality of unit substrates 91, the control device 85 sequentially executes the mounting cycle for another target substrate. By repeating this process, the mounting process for multiple substrate 90A is completed.

[0064] With this configuration, two placement heads 70 are used to perform placement operations on target substrates U1 and U2 that are appropriately selected from a plurality of unit substrates 91, thereby improving the efficiency of the placement process for the multiple substrate 90A. Note that in this embodiment, the operation modes of the two placement heads 70 in the placement process are set in advance. However, the operation mode may be fixed to one of them, or may be set for each placement process or type of multiple substrate 90A.

[0065] 5-3. Control of the head moving device 40 during the picking operation The control of the head moving device 40 using the two mounting heads 70 executed in the mounting cycle (S15) as described above can also be applied to the picking operation of components 98. Here, in the picking cycle (S13) of the mounting process, a picking operation of components 98 is executed using multiple suction nozzles 74. The picking operation is an operation for picking up components 98 supplied by multiple feeders 31 arranged at a predetermined interval Vs in the X direction, as shown in FIG. 9. The control device 85 executes positioning operation of the suction nozzles 74 in the X direction so that the separation distance in the X direction between the suction nozzles 74 supported by each of the two mounting heads 70 is an integer multiple (twice in FIG. 9) of the predetermined interval Vs.

[0066] Here, when the substrate 90 is a multiple substrate 90A and the two mounting heads 70 are configured to pick up multiple unit substrates 91 arranged at the same Y-axis position as target substrates U1 and U2, the control device 85 performs a picking operation in which each of the two mounting heads 70 uses multiple suction nozzles 74 to pick up the same number of components 98 of the same type in the same order. Also, the component supply device 30 is equipped with two tape feeders 31A that supply the same type of components 98 (shown with diagonal lines in FIG. 9 ) so that they can be picked up, and are spaced apart in the X-axis direction by at least the minimum distance Dc that allows the two mounting heads 70 to approach each other (see FIG. 9 ). Furthermore, the two mounting heads 70 are equipped with multiple suction nozzles 74 of the type capable of picking up the above-mentioned components 98, and the layout of the multiple suction nozzles 74 is configured to be identical to each other.

[0067] In the collection cycle (S13), while one of the two mounting heads 70 (e.g., the left mounting head 70L) is performing a collection operation (PL11), the control device 85 performs a positioning operation (PR11x) of the suction nozzle 74 to a collection position in the X direction corresponding to the collection operation (PR11) by the other of the two mounting heads 70 (e.g., the right mounting head 70R). Then, after the collection operation by the left mounting head 70L is completed, the control device 85 performs a positioning operation (PR11y) to a collection position in the Y direction corresponding to the collection operation by the right mounting head 70R. This allows the collection operations using the two mounting heads 70 (at least the XY movement (PL11x, PL11y) of the left mounting head 70L and the X movement (PR11y) of the right mounting head 70R) to be performed in parallel.

[0068] When multiple feeders 31 are installed in the component supply device 30, individual placement errors may occur in the feeders 31 due to individual differences in the feeders 31 and slots. After the feeders 31 are installed, the control device 85 can recognize the placement errors by, for example, acquiring reference marks attached to the top surfaces of the feeders 31. In the above example, the picking position corresponding to the picking operation of the right-side mounting head 70R may fall within the allowable range for the picking operation by the suction nozzle 74 of the right-side mounting head 70R, even when taking into account the placement errors of the feeders 31.

[0069] At this time, the control device 85 may position the two mounting heads 70L, 70R and perform the picking operation so that two components 98 arranged apart in the X direction can be picked up simultaneously by the two mounting heads 70L, 70R. In other words, if the positional relationship including the placement error of the pair of feeders 31 is within the allowable range, the control device 85 may simultaneously perform the picking operation of lowering the suction nozzle 74 of the right mounting head 70R without waiting for the completion of the picking operation of the left mounting head 70L.

[0070] On the other hand, even if the positional relationship between the pair of feeders 31 is not within the tolerance due to a placement error of the feeders 31, if the feeders 31 are tape feeders 31A, the control device 85 can perform an efficient picking operation by coordinating the tape feeders 31A with the placement heads 70. In detail, the control device 85 first obtains the placement error of the pair of tape feeders 31A that supply the components 98 to be picked by the two placement heads 70L, 70R.

[0071] 10, the control device 85 then adjusts the X-direction positions of the two mounting heads 70L, 70R to correct the X-direction placement error (the X-direction error of the placement error) of the pair of tape feeders 31A, and performs a positioning operation (PL11x, PL11y, PR11x, PR11y) of the suction nozzle 74 at the pick-up position. At this time, in parallel with the above positioning operation, the control device 85 feeds and moves the carrier tape 33 for each of the pair of tape feeders 31A to correct the Y-direction placement error (the Y-direction error of the placement error), thereby adjusting the Y-direction position of the supplied component 98.

[0072] In this way, when each of the two mounting heads 70 performs a pickup operation, the control device 85 corrects any positioning error in the X direction of the multiple tape feeders 31A by moving the two mounting heads 70L, 70R in the X direction from their current positions, and corrects any positioning error in the Y direction of the multiple tape feeders 31A by feeding and moving the carrier tape 33. This positions the suction nozzles 74 supported by each of the two mounting heads 70 at their respective predetermined pickup positions. This makes it possible for the two mounting heads 70L, 70R to simultaneously perform pickup operations (PL11, PR11).

[0073] The control device 85 then proceeds to the next pair of picking operations (PL12, PR12) in accordance with the control program and performs similar control. With this configuration, picking operations for picking the same type of components 98 are performed in parallel by the two mounting heads 70L, 70R, thereby improving the efficiency of the mounting process, including the picking cycle.

[0074] 5-4. Control of the head moving device 40 during imaging operation The control of the head moving device 40 using the two mounting heads 70 executed in the collection cycle (S13) and the placement cycle (S15) as described above can also be applied to imaging operations using the two board cameras 82 that move integrally with the two placement heads 70. Here, in the preparation process for placement processing (S12), as described above, images of the reference marks 96 and barcodes 97 are captured using the board cameras 82 (imaging step). In particular, as shown in FIG. 5, when the board 90 is a multiple board 90A, the number of reference marks 96 to be imaged may be greater than that of a normal board 90.

[0075] In this embodiment, in order to improve the efficiency of the imaging operation targeting the above-mentioned reference marks 96 and the like, a preparatory process is performed using two board cameras 82. As exemplified in the control of the head moving device 40 during the mounting operation, the control device 85 may divide the multiple unit boards 91 in the X direction and assign a board camera 82 that performs imaging operation to each of the multiple sections 95. Specifically, as shown in FIG. 11 , the left board camera 82L is responsible for imaging the reference mark 96 in section 95A to the left of the center in the left-right direction of the multiple board 90A. Furthermore, the right board camera 82R is responsible for imaging the reference mark in section 95B to the right of the center in the left-right direction of the multiple board 90A.

[0076] The control device 85 also sets movement paths for the two board cameras 82L, 82R as shown by the arrows in Fig. 11. Then, during the imaging operation of imaging each of the plurality of reference marks 96, while the imaging operation is being performed by one of the two board cameras 82 (for example, the left board camera 82L), the control device 85 performs a positioning operation to an X-direction position among the imaging positions corresponding to the imaging operation by the other one of the plurality of board cameras 82 (for example, the right board camera 82R).

[0077] Then, after the imaging operation by the left board camera 82L is completed, a positioning operation is performed to a Y-direction position among the imaging positions corresponding to the imaging operation by the right board camera 82R. This makes it possible to perform imaging operations using the two board cameras 82 (at least the XY movement and imaging process of the left board camera 82L and the X movement of the right board camera 82R) in parallel. Note that in the above example, if the imaging position corresponding to the imaging operation of the right board camera 82R falls within the camera field of view of the board camera 82R, the control device 85 moves the multiple board cameras 82 so that a pair of reference marks 96 spaced apart in the X direction can be simultaneously imaged by the two board cameras 82L, 82R.

[0078] Specifically, as shown in Fig. 12, the control device 85 positions the two board cameras 82L, 82R using two reference marks 96 that are located at the same position in the Y direction but spaced apart in the X direction as imaging positions (ML11xy, MR11xy). The control device 85 then images the reference marks 96 at each imaging position, completing the first imaging operation (ML11, MR11). Thereafter, the control device 85 moves the two board cameras 82L, 82R along a preset movement path, repeating the positioning and imaging (ML12, MR12, ...).

[0079] This makes it possible to efficiently capture images of the multiple reference marks 96 arranged in a matrix, thereby reducing the time required to recognize the reference marks 96. The above-described imaging operation can also be applied to processes such as reading the barcode 97, determining whether or not the board 90 is warped, the state of the components 98 already mounted, and the state of the printed solder. This reduces the time required for the preparation process (S12).

[0080] 6. Effects of the Configuration of the Embodiment According to the configuration of the embodiment, the suspension structure in which the Y slide 60 is supported below the beam 13 ensures a relatively large range of movement Mr of the X slide 50 relative to the X-direction dimension of the component mounting machine 10. Furthermore, the configuration in which multiple X slides 50 can move independently in the X direction makes it possible to vary the separation distance between multiple mounting heads 70 to accommodate various production modes.

[0081] As a result, multiple mounting heads 70 are used to perform mounting operations on an appropriately selected target substrate from multiple unit substrates 91, thereby improving the efficiency of the mounting process for multiple substrate 90A. Furthermore, similar control of head moving device 40 can improve the efficiency of the sampling operation and imaging operation. As a result, production efficiency can be improved.

[0082] 7. Modifications of the Embodiment In the embodiment, the head moving device 40 is configured to include two X slides 50, each of which moves a mounting head 70 attached thereto. However, the head moving device 40 may also be configured to include three or more X slides 50 and three or more mounting heads 70 attached thereto. Even in such a configuration, by making it possible to independently move three or more mounting heads 70 in the X direction, it is possible to apply control similar to that in the embodiment and improve production efficiency.

[0083] Furthermore, in the embodiment, the multiple mounting heads 70 are configured to be independently movable in the X direction. However, when the horizontal direction in which the multiple mounting heads 70 can be independently moved is defined as a first direction and the horizontal direction intersecting the first direction is defined as a second direction, the first direction and the second direction are not limited to the X direction and the Y direction. The aspects exemplified in the embodiment can be applied as long as the configuration includes a head moving device 40 that moves the multiple mounting heads 70 independently in the first direction and moves them together in the second direction in a predetermined coordinate system.

[0084] 8. Method for Optimizing the Placement Process In the embodiment, the component placement method applied to the placement process includes a setting step (S30) included in the preparation process (S12), a collection step (S13) included in the PP cycle, and a placement step (S15). The component placement method may further include an imaging step included in the preparation process (S12) and a recognition step (S14) included in the PP cycle. The control device 85 of the component placement machine 10 controls the operation of the head moving device 40 equipped with multiple placement heads 70 according to the component placement method described above, in order to improve the efficiency of the placement process.

[0085] As described above, the control device 85 recognizes that the board 90 is a multiple board 90A during the mounting process and controls the setting step (S30), picking step (S13), mounting step (S15), etc. to improve the efficiency. In addition, the mounting process may be optimized in advance. For example, a configuration may be adopted in which an optimization device incorporated in an external device of the component mounting machine 10, such as the host computer 5, improves the control program and changeover instruction information.

[0086] Specifically, the optimization device executes a placement process optimization process (S40) as shown in Fig. 13. The optimization device first acquires the control program to be executed and board information (S41). Then, the optimization device sets the layout of the feeders 31 so that multiple feeders 31 supplying the same type of components 98 are spaced apart in the X direction by at least the minimum spacing Dc, in order to accommodate the placement process by the component placement machine 10 (S42). The layout positions of the feeders 31 are reflected in the setup change instruction information.

[0087] Next, the optimization device sets the operation modes of the multiple placement heads 70 in the placement process, the imaging order of the multiple reference marks 96, etc. (S43). These settings are reflected in the control program and in the response when the board ID is input from the component placement machine 10. With this configuration, the placement process to be executed is optimized, and the placement operation, collection operation, and imaging operation in the placement process are made more efficient. As a result, production efficiency can be improved.

[0088] 5: Host computer, 10: Component mounting machine, 20: Board transport device, 30: Component supply device, 31: Feeder, 31A: Tape feeder, 32: Reel, 33: Carrier tape, 40: Head moving device, 70, 70L, 70R: Mounting head, 74: Suction nozzle, 81, 81L, 81R: Component camera, 82, 82L, 82R: Board camera, 85: Control device, 90: Board, 90A: Multiple board, 91: Unit board, 92: Wiring pattern, 911: First unit board, 912: Second unit board, 95, 95A, 95B: Section, 96: Reference mark, 97: Barcode, 98: Component

Claims

1. A component mounting method in a component mounting machine that mounts components on a board, wherein the component mounting machine has a plurality of mounting heads, each supporting a plurality of suction nozzles that hold the components, and moves the plurality of mounting heads independently in a first horizontal direction and moves the plurality of mounting heads together in a second horizontal direction that intersects the first direction, and when the board is a multiple-panel board formed by arranging a plurality of unit boards, each with the same wiring pattern, in both the first and second directions, the component mounting method comprises: a picking step in which each of the plurality of mounting heads performs a picking operation to pick up the same number of the same type of components using the plurality of suction nozzles; a setting step in which each of the plurality of mounting heads sets target boards among the plurality of unit boards on which to mount the components; and a mounting step in which the plurality of mounting heads each perform a mounting operation to mount the plurality of components in the same mounting order onto the plurality of target boards once.

2. The component mounting method according to claim 1, wherein the mounting step performs a positioning operation of the suction nozzle to a first direction position among mounting positions corresponding to the mounting operation by another one of the plurality of mounting heads while the mounting operation is being performed by one of the plurality of mounting heads.

3. The component mounting method according to claim 2, further comprising a recognition step of recognizing a holding state indicating the attitude of the component picked up by each of the multiple mounting heads in relation to the suction nozzle in the picking step, wherein the mounting step, while the mounting operation is being performed by one of the multiple mounting heads, performs a positioning operation of the suction nozzle to the first direction position based on the holding state corresponding to the suction nozzle of another of the multiple mounting heads, and the mounting step, after the component has been mounted by one of the multiple mounting heads, performs a positioning operation of the suction nozzle to a second direction position among the mounting positions corresponding to the mounting operation by the other of the multiple mounting heads.

4. A component mounting method as described in claim 1, wherein the setting step sets, on the target board, a first unit board which is one of the plurality of unit boards, and a second unit board which is the unit board closest to the first unit board in the first direction and spaced apart from the first unit board by more than the minimum distance at which the plurality of mounting heads are allowed to approach each other.

5. A component mounting method as claimed in any one of claims 1 to 3, wherein the setting step divides the plurality of unit boards in the first direction into sections equal in number to the number of the plurality of mounting heads, and sets the target board by assigning a mounting head that will perform the mounting operation to each of the plurality of sections.

6. A component mounting method as claimed in any one of claims 1 to 3, wherein the picking step performs a positioning operation of the suction nozzle to a first direction position among picking positions corresponding to the picking operation by another one of the plurality of mounting heads while the picking operation is being performed by one of the plurality of mounting heads.

7. A component mounting method as described in claim 6, wherein the picking operation is an operation of picking up the components supplied by a plurality of feeders arranged at a predetermined interval in the first direction, and the picking step performs a positioning operation of the suction nozzles in the first direction so that the separation distance in the first direction of the suction nozzles supported by each of the plurality of mounting heads is an integer multiple of the predetermined interval.

8. The component mounting method of claim 7, wherein the feeder is a tape feeder that feeds and moves a carrier tape containing the components in the second direction to supply the components, and the picking step comprises, when each of the plurality of mounting heads performs the picking operation, feeding and moving the carrier tape by the tape feeder so that the suction nozzle supported by each of the plurality of mounting heads is positioned at the picking position based on the positioning error of the plurality of tape feeders in the second direction and the current positions of the plurality of mounting heads in the second direction.

9. A component mounting method according to any one of claims 1 to 3, wherein the picking step simultaneously executes the picking operation by one of the plurality of mounting heads and the picking operation by another of the plurality of mounting heads.

10. A component mounting method as claimed in any one of claims 1 to 3, wherein the component mounting machine comprises a plurality of board cameras that are movable integrally with each of the plurality of mounting heads and are capable of capturing images of the board, and comprises an imaging step in which, in an imaging operation of capturing images of each of a plurality of reference marks affixed to the board, while one of the plurality of board cameras is performing the imaging operation, another of the plurality of board cameras performs a positioning operation to a first direction position among imaging positions corresponding to the imaging operation.

11. A component mounting method as described in claim 10, wherein a plurality of reference marks are provided in a matrix on the board along the first direction and the second direction, and the imaging step moves the plurality of board cameras so that a pair of the reference marks spaced apart in the first direction can be simultaneously imaged by the plurality of board cameras.

12. A method for optimizing a mounting process in which components are mounted on a board by a component mounting machine, wherein the component mounting machine is equipped with a plurality of mounting heads, each supporting a plurality of suction nozzles that hold the components, and moves the plurality of mounting heads independently in a first direction and moves the plurality of mounting heads together in a horizontal second direction that intersects the first direction, and when the target board in the mounting process is a multi-panel board formed by arranging a plurality of unit boards, each having the same wiring pattern, in both the first and second directions, a picking step in which each of the plurality of mounting heads performs a picking operation to pick up the same number of the same type of components using the plurality of suction nozzles; a setting step in which each of the plurality of mounting heads sets a target board among the plurality of unit boards on which to mount the components; and a mounting step in which each of the plurality of mounting heads sequentially performs a mounting operation to mount the plurality of components in the same mounting order on the plurality of target boards once.

13. A component placement machine comprising: a plurality of placement heads, each supporting a plurality of suction nozzles for holding components; and a control device which moves the plurality of placement heads independently in a first horizontal direction and moves the plurality of placement heads together in a second horizontal direction intersecting the first direction, wherein the control device performs a placement process including: when the board on which the components are to be placed is a multiple board formed by arranging a plurality of unit boards, each with the same wiring pattern, in the first direction and the second direction, a picking step in which each of the plurality of placement heads performs a picking operation to pick up the same number of the same type of components using the plurality of suction nozzles; a setting step in which each of the plurality of placement heads sets target boards among the plurality of unit boards on which the components are to be placed; and a placement step in which each of the plurality of placement heads sequentially performs a placement operation to place the plurality of components in the same placement order onto the plurality of target boards once.

Images