Power supply device

Abstract

The present invention provides a power supply device having a shape that enables said device to be a replacement for existing batteries.　The power supply device includes: a first substrate that has a first electrode and a storage battery; a second electrode; a second substrate that has a control unit; and a third substrate that is disposed between the first substrate and the second substrate and has a conductor part of which a portion of the peripheral edge is connected to the second electrode.

Description

power supply

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 570,393, entitled "Power Supply Apparatus," filed March 27, 2024, the disclosure of which is incorporated herein by reference in its entirety. TECHNICAL FIELD The present technology relates to power supply apparatus.

[0002] Japanese Patent Publication No. 2021-015904 (Patent Document 1) is a background art in this technical field. This publication states that "a wireless device according to an embodiment includes a substrate, a semiconductor element including a wireless circuit mounted on a first surface of the substrate, a non-conductive layer provided on the first surface of the substrate and encapsulating the semiconductor element, a first metal film provided from a surface of the non-conductive layer to at least one edge surface of the substrate and in contact with a first wiring provided on the substrate at the edge surface, a second metal film provided from the surface of the non-conductive layer to at least one edge surface of the substrate, spaced apart from the first metal film, and in contact with a second wiring provided on the substrate at the edge surface, and a secondary battery having a first electrode electrically connected to the first wiring and a second electrode electrically connected to the second wiring" (see Abstract).

[0003] Japanese Patent Publication No. 2021-015904

[0004] The above-mentioned Patent Document 1 describes a mechanism for charging a secondary battery while realizing miniaturization, but does not consider a power supply device that can be designed in a shape that can replace a conventional battery.

[0005] Therefore, an object of the present technology is to provide a power supply device that can replace a conventional battery.

[0006] In order to solve the above problems, for example, the configuration described in the claims is adopted. The present application includes a plurality of means for solving the above problems, and one example thereof is a power supply device including a first substrate having a first electrode and a storage battery, a second substrate having a second electrode and a control unit, and a third substrate disposed between the first substrate and the second substrate and having a conductor portion connected to the second electrode on at least a part of its periphery.

[0007] It is possible to provide a power supply device that can replace a conventional battery. Problems, configurations, and effects other than those described above will become apparent from the following description of the embodiments.

[0008] FIG. 1 is an example of an explanatory diagram illustrating a power supply device 20 and other components connected to a network 100. FIG. 2 is an example of a schematic diagram of the power supply device 20. FIG. 3 is an example of an explanatory diagram illustrating a connection structure 300 for the power supply device 20. FIG. 4 is an example of a schematic circuit diagram of the power supply device 20. FIG. 5 is an example of an explanatory diagram illustrating the components of the power supply device 20. FIG. 6 is an example of an external view of the power supply device 20. FIG. 7 is an example of an exploded view of the power supply device 20. FIG. 8 is another example of an exploded view of the power supply device 20. FIG. 9 is an example of an explanatory diagram illustrating holding of a photovoltaic sheet 250. FIG. 10 is an example of a schematic diagram of a power supply device 1000 according to a second embodiment. FIG. 11 is an example of an explanatory diagram illustrating a conductive connection part 1100. FIG. 12 is an example of a perspective view of the conductive connection part 1100. FIG. 13 is an example of a first explanatory diagram illustrating sealing of an internal space 1300 of the power supply device 1000. Fig. 14 is an example of a second explanatory diagram illustrating the sealing of the internal space 1300 of the power supply device 1000. Fig. 15 is an example of a third explanatory diagram illustrating the sealing of the internal space 1300 of the power supply device 1000. Fig. 16 is an example of a fourth explanatory diagram illustrating the sealing of the internal space 1300 of the power supply device 1000. Fig. 17 is an example of an explanatory diagram illustrating an overview of a power supply device 1700 according to a first modified example. Fig. 18 is an example of an explanatory diagram illustrating an overview of a power supply device 1800 according to a second modified example.

[0009] Hereinafter, embodiments will be described with reference to the drawings. In each drawing, components having the same functions may be designated by reference numerals and may not be described in detail.

[0010] 1 is an example of an explanatory diagram illustrating a power supply device 20 and the like connected to a network 100. Note that the network 100 may be a wired network or a wireless network, and may also be a connection within a single device, for example.

[0011] The power supply device 20 is a device that supplies power to the electronic device 30 etc. The power supply device 20 can be incorporated into the electronic device 30 for use, or can be connected to the electronic device 30 as an external power supply device for use.

[0012] The electronic device 30 is an electronic device that can be used indoors and outdoors. The electronic device 30 is an electronic device that uses a small, circular, flat battery, such as a button battery. The electronic device 30 may also be an electronic device that is used inside the body of a human or animal.

[0013] The electronic device 30 can be, for example, a lighting device, a speedometer, a motion sensor, a cycle computer, etc. For example, by designing the external shape of the power supply device 20 to be similar to that of a battery for the electronic device 30, such as a button battery or coin battery, it becomes easy to add additional functions to a conventional electronic device 30. The power supply device 20 can be designed with dimensions that allow it to be replaced with batteries conforming to the CR2032 or BR3032 standards, for example.

[0014] The electronic device 30 can acquire information transmitted from the power supply device 20 and transmit information to the power supply device 20. This allows the user to expand the functionality of the electronic device 30 based on the information communicated between the electronic device 30 and the power supply device 20.

[0015] The user terminal 40 can acquire information transmitted from the power supply device 20 and transmit information to the power supply device 20 via the network 100. The user terminal 40 is, for example, a smartphone 40a, a tablet 40b, a PC 40c, or the like.

[0016] This allows the user to easily understand the power storage status and usage status of the power supply device 20. Furthermore, the user can control the power supply device 20 by transmitting a control signal to the power supply device 20.

[0017] Similarly, the external terminal 50 can also acquire information transmitted from the power supply device 20 and transmit information to the power supply device 20 via the network 100. The external terminal 50 is, for example, a surveillance camera 50a, a lighting device 50b, a remote device 50c, etc.

[0018] This allows the external terminal 50 to execute a set function depending on the power storage status and usage status of the power supply device 20. For example, if the power supply device 20 is used as a security device such as a human presence sensor, the external terminal 50 can obtain information from the power supply device 20 regarding a predetermined power consumption pattern, for example, a consumption pattern corresponding to the detection of a person outdoors late at night. When the surveillance camera 50a obtains information regarding such a consumption pattern, it switches the alert level of the surveillance function to, for example, a higher level.

[0019] The transmitter 60 is a transmitter that can supply power, particularly wirelessly, to the power supply device 20. To supply power wirelessly to the power supply device 20, the transmitter 60 is preferably capable of generating and emitting electromagnetic waves in the UHF band (860 MHz to 920 MHz).

[0020] The transmitter 60 may generate and emit electromagnetic waves in a frequency band that differs from country to country; for example, microwaves of 918 MHz may be used in Japan, 915 MHz in the United States, and 868 MHz in Europe.

[0021] 2A and 2B are examples of schematic diagrams of the power supply device 20. Fig. 2A is an example of a schematic exploded view showing the boards and the like of the power supply device 20 disassembled. Fig. 2B is an example of a schematic perspective view of the power supply device 20. Fig. 2C is an example of a schematic side view of the power supply device 20.

[0022] The external shape of the power supply device 20 is circular when viewed perpendicularly to the substrate surface of the first substrate 210, the second substrate 220, or the third substrate 230 (see Figure 6, etc.), and is flat when viewed horizontally to the substrate surface of the first substrate 210, the second substrate 220, or the third substrate 230.

[0023] The power supply device 20 includes a first substrate 210, a second substrate 220, a third substrate 230, a conductive case 240, and a photovoltaic sheet 250. The third substrate 230 is disposed between the first substrate 210 and the second substrate 220.

[0024] The first substrate 210 has a first electrode 211 on its bottom surface. The first substrate 210 has a storage battery (secondary battery) 212 on the substrate surface facing the third substrate 230. The third substrate 230 has a second electrode 231 on its periphery.

[0025] The first electrode 211 and the second electrode 231 are connected to the first substrate 210 and the third substrate 230 by plating technology. In another embodiment, the first electrode 211 and the second electrode 231 may be connected to the first substrate 210 and the third substrate 230 by soldering, screwing, fitting, adhesive, etc.

[0026] It should be noted that the power supply device 20 does not necessarily have to include all of these components. For example, in another embodiment, the power supply device 20 does not necessarily have to include the conductive case 240 or the photovoltaic sheet 250.

[0027] In other words, in a simple embodiment, the power supply device 20 has a first substrate 210 having a first electrode 211 and a storage battery 212, a second electrode 231, a second substrate 220 having a control unit, and a third substrate 230 arranged between the first substrate 210 and the second substrate 220 and having a conductor portion on at least a portion of its periphery that connects to the second electrode 231.

[0028] Furthermore, in the power supply device 20, the second electrode 231 is at least one linear member that contacts a conductor portion of the third substrate 230 across the thickness or height of the third substrate 230. More specifically, the second electrode 231 is a linear member whose width corresponds to the length corresponding to the thickness of the third substrate 230. The linear member may be, for example, a ring-shaped conductive member, or may be a conductive member, such as gold-plated material, plated on the periphery of the third substrate 230 as described below.

[0029] For example, the thickness of the first substrate 210, the second substrate 220, and the third substrate 230 may be determined to be approximately 0.3 mm. The diameter of the first substrate 210 and the diameter of the second substrate 220 may be slightly smaller than the diameter of the third substrate 230, for example, by about 5%.

[0030] For example, if the thickness of the third substrate 230 is about 0.3 mm, it is possible to realize metal plating (gold plating) throughout the thickness of the third substrate 230 while realizing a reduction in the thickness of the substrate.

[0031] For example, if the diameter of the third substrate 230 is approximately 20 mm and the diameters of the first substrate 210 and the second substrate 220 are approximately 19 mm, the second electrode 231 provided on the periphery of the third substrate 230 can be more easily electrically connected to the electronic device 30.

[0032] The distance between the first substrate 210 and the third substrate 230 and the distance between the second substrate 220 and the third substrate 230 may be set to about 1.0 mm, and the thickness of the photovoltaic sheet 250 may be set to about 0.1 mm. Note that the photovoltaic sheet 250 may also be a thicker photovoltaic panel or the like.

[0033] These dimensions can be changed as needed within the range that satisfies the dimensions of the respective standards of the batteries to be replaced, thereby enabling flexible changes to the type of electronic components and storage battery 212 disposed on each of the boards 210, 220, and 230.

[0034] Furthermore, the power supply device 20 can be used as an energy harvesting device when combined with a photovoltaic sheet 250 (described below) or a second antenna 226 for space transmission type wireless power supply.

[0035] Furthermore, in a configuration in which the power supply device 20 housed in the electronic device 30 used outdoors is exposed to sunlight or the like, the frequency of battery replacement can be significantly reduced by generating and storing electricity using the photovoltaic sheet 250 described below, or the like.

[0036] Although the present specification describes an example in which there is one third substrate 230 disposed between the first substrate 210 and the second substrate 220, the power supply device 20 may include multiple third substrates 230. The power supply device 20 having multiple third substrates 230 can be formed into, for example, a cylindrical or prismatic shape that can be replaced with a dry cell battery or the like.

[0037] 3A and 3B are examples of explanatory diagrams illustrating a connection structure 300 of the power supply device 20. Fig. 3A is an example of a schematic cross-sectional view of the power supply device 20. Fig. 3B is an example of a schematic exploded view of the power supply device 20 shown in Fig. 3A.

[0038] In the embodiment of Figure 3, the power supply device 20 does not have a conductive case. In such a configuration, the photovoltaic sheet 250 is fixedly attached to the second substrate 220, for example by adhesive.

[0039] The first substrate 210 has a rechargeable storage battery 212, a storage battery holder 212a that holds the storage battery 212 on the substrate surface, a plug 320, etc., on a substrate surface facing the third substrate 230. The storage battery holder 212a is an example of a holder for the storage battery 212.

[0040] The second substrate 220 has a semiconductor chip such as a BLE SoC 221, a plug 320, etc. on the substrate surface facing the third substrate 230. The semiconductor chip and a microcomputer described below are examples of a control unit.

[0041] The third substrate 230 has an earth terminal 332 for the photovoltaic sheet 250 on the substrate surface facing the second substrate 220. The earth terminal 332 is electrically connected to the photovoltaic sheet 250.

[0042] The third substrate 230 has, on both substrate surfaces, sockets 310 that connect to the plugs 320, and in particular that receive the plugs 320. The sockets 310 and the plugs 320 form a pair to form a connection structure 300.

[0043] The connection structure 300 realizes mechanical and electrical connections between two substrates, for example, between the first substrate 210 and the third substrate 230, and between the second substrate 220 and the third substrate 230. The connection structure 300 is formed as, for example, a 10-pin connector, and is used to transmit various signals and power.

[0044] By appropriately setting the dimensions of the connection structure 300, it is possible to easily design the spacing between the substrates in the power supply device 20. The connection structure 300 disposed between the first substrate 210 and the third substrate 230 and the connection structure 300 disposed between the second substrate 220 and the third substrate 230 may be created based on different dimensional designs.

[0045] The connection structure 300a disposed between the first substrate 210 and the third substrate 230 is an example of a first connection structure. The connection structure 300b disposed between the second substrate 220 and the third substrate 230 is an example of a second connection structure.

[0046] In such an embodiment, the power supply device 20 has at least one of: at least one first connection structure 300a that electrically connects the first substrate 210 and the third substrate 230 and maintains a first distance between the first substrate 210 and the third substrate 230; or at least one second connection structure 300b that electrically connects the second substrate 220 and the third substrate 230 and maintains a second distance between the second substrate 220 and the third substrate 230.

[0047] The connection structure 300 realizes both the mechanical and electrical connections, thereby saving space compared to a configuration in which the mechanical and electrical connections are realized by separate components. The plug 320 is designed to have a smaller outer shape than the socket 310, thereby ensuring a larger board area for the first board 210 and the second board 220.

[0048] In this embodiment, in the power supply device 20, the first connection structure 300a and the second connection structure 300b are each composed of a pair of plug 320 and socket 310, the plug 320 is provided on at least one of the first substrate 210 or the second substrate 220, and the socket 310 that accommodates the plug 320 is provided on the third substrate 230.

[0049] At least one of the first substrate 210 and the second substrate 220 can be removed from the power supply device 20 by disconnecting the connection structure 300, for example by separating the socket 310 and the plug 320.

[0050] The power supply device 20 may have a fourth board that is replaceable with at least one of the first board 210 or the second board 220. The fourth board that replaces the first board 210 or the second board 220 may be a board that has a function different from that of the first board 210 or the second board 220. Additionally or alternatively, the fourth board that replaces the first board 210 or the second board 220 may also function as the first board 210 or the second board 220.

[0051] A control unit such as a microcomputer in the BLE SoC221 can, for example, recognize the type of board currently installed in the power supply device 20. A control unit such as a microcomputer in the BLE SoC221 can, for example, recognize the removal of the first board 210 or the replacement of the first board 210 with a fourth board.

[0052] A control unit such as a microcomputer in the BLE SoC 221 can change the lighting or blinking state of the indicator LED 233 depending on the type of board currently installed in the power supply device 20, for example.

[0053] Therefore, even if the first board 210 and the fourth board have similar appearances, the user can easily recognize which board is installed based on the state of the indicator LED 233.

[0054] The fourth substrate has, for example, plug 320 of connection structure 300 on one substrate surface. Therefore, plug 320 of the fourth substrate can be electrically and mechanically connected to socket 310 of third substrate 230, similar to plug 320 of first substrate 210. The fourth substrate has, on the other substrate surface, a connector, for example, a 10-pin connector, for connecting to an external input device.

[0055] As a result, after the user removes, for example, the first board 210 from the power supply device 20, the user can connect the socket 310 of the third board to the plug 320 of the fourth board, and the control unit can perform information processing such as supplying electrodes to the power supply device 20 and writing and updating information to semiconductor chips, etc., provided on the second board 220 and the third board 230.

[0056] Similarly, the user can expand or improve the functionality of the power supply device 20 by replacing the first board 210 or the second board 220 of the power supply device 20 with a fourth board. Furthermore, the user can more easily identify the cause of the malfunction in the power supply device 20 by replacing the first board 210 or the second board 220 of a malfunctioning power supply device 20 with a fourth board.

[0057] In such an embodiment, the power supply device 20 further includes a fourth board that is replaceable with the first board, and the control unit controls at least one of power supply and information processing using the fourth board that has replaced the first board.

[0058] The fourth substrate may be a substrate configured such that at least one additional fourth substrate can be provided at least either between the first substrate 210 and the third substrate 230 or between the second substrate 220 and the third substrate 230 .

[0059] Multiple such fourth substrates can be stacked on top of each other, and therefore the connection structure 300 can be of a type having only a socket 310, a type having only a plug 320, or a type having both a socket 310 and a plug 320.

[0060] The power supply device 20 may further include a sixth board that is replaceable with the third board 230. The sixth board that replaces the third board 230 may be a board that has a function different from that of the third board 230. Additionally or alternatively, the sixth board that replaces the third board 230 may also function as the third board 230. Such a sixth board has a socket 310 that is similar to the socket 310 of the connection structure 300 provided on the third board 230.

[0061] A plurality of sixth substrates, which are replaced with the third substrate 230, can be disposed between the first substrate 210 and the second substrate 220. For this reason, the sixth substrate may be classified into three types as the connection structure 300: a type having only the socket 310, a type having only the plug 320, and a type having both the socket 310 and the plug 320.

[0062] 4 is an example of a schematic circuit diagram of the power supply device 20. The connection lines shown in FIG. 4 are intended to schematically explain the connection relationships and do not limit the configuration of the power supply device 20.

[0063] 4, the first substrate 210 and the first electrode 211 are connected via a connector CN. As described above, the first electrode 211 may be provided on at least a portion of the substrate surface of the first substrate 210 by plating or the like.

[0064] The first substrate 210 has a storage battery 212, a linear regulator 213, a sensor 214, an SMT pad 215, a push switch 216, a first input section 217, a plug 320 of the connection structure 300, and the like.

[0065] These are connected to the BLE SoC 221 on the second substrate 220 via the connection structure 300 and the third substrate 230. The BLE SoC 221 on the second substrate 220 can be powered by both the storage battery 212 and the photovoltaic sheet 250.

[0066] The power supply device 20 can also be connected to another board, such as the board of the electronic device 30, by soldering, for example, via the SMT pads 215 and SMT pads 222 (described later). Software for the power supply device 20 can be written, modified, updated, etc., via the SMT pads 215 and 222.

[0067] The linear regulator 213 is used to charge the storage battery 212 using the power generated by the photovoltaic sheet 250. The sensor 214 is, for example, a temperature sensor, a humidity sensor, an illuminance sensor, a magnetic sensor, an acceleration sensor, or the like.

[0068] The sensor 214 may further include a sensor that detects a position, such as a GPS sensor that detects the position coordinates of the power supply device 20 or the electronic device 30. In such a configuration, the power supply device 20 can transmit weather information at each location to the user terminal 40, an external weather forecast server, or the like while moving together with the mobile object.

[0069] The sensor 214 may include, instead of or in addition to a GPS sensor, a laser sensor, a radar sensor, a gyro sensor, a geomagnetic sensor, an inertial measurement unit, a tire pulse sensor, a camera sensor, etc. Information detected by these sensors can be used, for example, to detect the self-position of the power supply device 20 or electronic device 30 used in a factory or the like within the factory.

[0070] The power supply device 20 is incorporated into an electronic device 30 for outdoor use that has high waterproof, dustproof, weatherproof, etc. properties, and is placed in a position exposed to sunlight, thereby significantly reducing the frequency of battery replacement compared to conventional methods, thereby improving user convenience.

[0071] An electronic device 30 used in this way may have a portion thereof open to expose the photovoltaic sheet 250 of the power supply unit 20, or may have a portion thereof made of a material that allows light to pass through to the photovoltaic sheet 250 of the power supply unit 20. An example of an electronic device 30 used outdoors is a bicycle gear switch.

[0072] By using a user trigger by the magnetic sensor, the functions of the power supply device 20 can be switched with low power consumption, so the power required for the power supply device 20 to sleep, etc. can be further reduced.

[0073] The SMT pad 215 may be used as the first electrode 211. Additionally or alternatively, the SMT pad 215 may be used as an access point to access the various functions of the power supply 20.

[0074] Functions of the power supply device 20 that can be accessed via the SMT pad 215 include, for example, VBAT, GND, SWD (write), BOOT, RESET, VHARV (for external PV cells or external PV sheets), VSTORE (for external secondary batteries), GPIO, etc.

[0075] The push switch 216 can be used, for example, as a user trigger, and can switch the functions of the power supply device 20 with low power consumption, thereby further reducing the power required for the power supply device 20 to go to sleep, etc.

[0076] The first input unit 217 is an example of a power input unit or connection unit. The first input unit 217 can be an input terminal conforming to any standard. The power supply device 20 can receive input of signals and power via the input unit 225.

[0077] The second substrate 220 has a BLE SoC 221, an SMT pad 222, a first antenna 223, a Hall sensor 224, a second input unit 225, etc. The second substrate 220 further has a connector CN for connection to a second antenna 226 for space transmission type wireless power feeding, a plug 320 of the connection structure 300, etc. The connector CN for connection to the second antenna 226 is an example of a power input unit.

[0078] The BLE SoC 221 is connected to the SMT pad 222, the first antenna 223, the Hall sensor 224, the input unit 225, etc. on the second substrate 220. The BLE SoC 221 is connected to the photovoltaic sheet 250 via a connector CN227.

[0079] The connector CN227 that connects the BLE SoC221 and the photovoltaic sheet 250 may be formed as a clip 227, as will be described with reference to Fig. 7. The clip 227 has the function of clamping the photovoltaic sheet 250 and holding the photovoltaic sheet 250 to the conductive case 240.

[0080] Use of the clip 227 can improve the connectivity between the photovoltaic sheet 250 and the earth terminal 332. Furthermore, the clip 227 can improve the robustness of the power supply device 20 against vibrations, shocks, and the like.

[0081] The BLE SoC221 is further connected to electronic components provided on the first substrate 210 and the third substrate 230 via the connection structure 300. The BLE SoC221 includes a microcomputer, a charging circuit for charging the storage battery 212, a rectifier circuit for wireless power supply and power supply from photovoltaic power generation, a communication circuit for communication, etc. The BLE SoC221 or the microcomputer is an example of a control unit.

[0082] The SMT pads 222 can be used as access points for accessing each function of the power supply device 20. Functions of the power supply device 20 that can be accessed via the SMT pads 222 include, for example, VBAT, GND, BOOT, RESET, and UART.

[0083] At least some of the functions accessible via the SMT pads 222 may be different from the functions accessible via the SMT pads 215. For example, by arranging frequently accessed functions on both the first board 210 and the second board 220 and dividing less frequently accessed functions between the first board 210 and the second board 220, the board surfaces can be used more efficiently.

[0084] The first antenna 223 is formed, for example, as a pattern on the second substrate 220, and is used for communication between the power supply device 20 and other devices, for example, Bluetooth (registered trademark) communication.

[0085] The first antenna 223 and the communication circuit are examples of a wireless communication unit, and enable communication according to, for example, the Bluetooth standard BLE 5.3. In this embodiment, the power supply device 20 further includes a wireless communication unit 223, and the control unit controls communication by the wireless communication unit 223 of information relating to at least one of the amount of stored power in the storage battery, the change in the amount of stored power over time, the power consumption, and the change in the power consumption over time.

[0086] The Hall sensor 224 is used, for example, in place of or in addition to the magnetic sensor of the sensor 214 described above, to detect the rotation, position, opening / closing, orientation, etc. of the power supply device 20. The sensor 214 and the Hall sensor 224 are examples of sensors.

[0087] In such an embodiment, the power supply device 20 further has at least one sensor, and the control unit controls communication by the wireless communication unit 223 of information regarding at least one of temperature, humidity, brightness, speed, acceleration, inclination, position coordinates, and electromagnetic waves acquired by the sensors 214 and 224.

[0088] The second input unit 225 is an example of a power input unit or connection unit. The second input unit 225 can be an input terminal conforming to any standard. The power supply device 20 can receive input of signals and power via the second input unit 225.

[0089] The power supply device 20 can be removably connected to the second antenna 226. The second antenna 226 is an example of a power receiving antenna. A connector CN that connects the second antenna 226 to the second substrate 220 is formed as a connector land on the second substrate 220, for example.

[0090] In this embodiment, the power supply device 20 further includes a power receiving antenna 226 , and the control unit controls charging of the storage battery 212 with power from the power receiving antenna 226 .

[0091] The power supply device 20 preferably has at least one of the first input unit 217 and the second input unit 225 functioning as a power input unit. In such an embodiment, in the power supply device 20, at least one of the first board 210 and the second board 220 has at least one power input unit 217, 225, and the control unit controls charging of the storage battery 212 with power from the power input units 217, 225.

[0092] The power supply device 20 may have at least one of a connector CN for connection to a second antenna 226, a first input unit 217, and a second input unit 225. In such an embodiment, in the power supply device 20, a control unit controls charging of the storage battery with power from an external PV sheet or an external linear regulator via the power input units CN, 217, and 225.

[0093] The third substrate 230 includes a second electrode 231, a booster circuit 232, an indicator LED 233, a ground terminal 332, and a socket 310 of the connection structure 300. The third substrate 230 can relay power and information between the first substrate 210 and the second substrate 220 via the socket 310.

[0094] The second electrode 231 is provided by, for example, plating on the periphery of the third substrate 230. The second electrode 231 covers at least a portion of the periphery of the third substrate 230 over its thickness.

[0095] The thickness of the third substrate 230 corresponds to the height between the upper and lower substrate surfaces of the third substrate 230. In other words, the second electrode 231 covers at least a portion of the side surface of the third substrate 230. The second electrode 231 may further at least partially cover the substrate surface of the third substrate 230.

[0096] The second electrode 231 at least partially surrounds the periphery of the third substrate 230. The second electrode 231 is connected to the storage battery 212 via a conductive portion provided on the third substrate 230.

[0097] The booster circuit 232 boosts the power supplied from the storage battery 212 to a predetermined voltage, for example, 3 V. The booster circuit 232 supplies the power of the boosted voltage to the second electrode 231 stably.

[0098] The power supply device 20 may have at least one of a first input 217 and a second input 225 that function as a connection or as both a connection and a power input. The first input 217 and the second input 225 may be input terminals of any standard. The first input 217 and the second input 225 may be formed as a socket 310 or a plug 320 of the connection structure 300.

[0099] In such an embodiment, the power supply device 20 further includes a fifth board, and at least one of the first board 210 or the second board 220 has a connection portion to which the fifth board is removably attached, and the control unit controls at least one of the supply of power from the fifth board and the transmission of information to and from the fifth board via the connection portion.

[0100] The user can easily add a fifth board with any function to the power supply unit 20, allowing the user to improve and develop the power supply unit 20 to suit the specifications of the electronic device 30 that uses the power supply unit 20 and its usage environment, etc.

[0101] In a configuration in which the control unit controls the transmission of information between the fourth board and the power supply device 20 via the connection unit, the user can easily expand the functionality of the power supply device 20 by appropriately designing the fourth board.

[0102] The connecting wire connecting the booster circuit 232 and the second electrode 231 in the embodiment of Fig. 4 is an example of a conductor portion. Similarly, the connecting wire connecting the booster circuit 232 and the conductive case 240 in the embodiment of Fig. 4 is an example of a conductor portion.

[0103] Additionally or alternatively, booster circuit 232 may provide power at a boosted voltage to conductive case 240. In such an embodiment, conductive case 240 may also function as second electrode 231.

[0104] In such an embodiment, the power supply device 20 further has a conductive case 240, the conductive case 240 and the conductor portion of the third substrate 230 are electrically connected, and at least one of the conductor portion on the side surface of the third substrate and the conductive case constitutes the second electrode 231.

[0105] The conductive case 240 may be configured so that, for example, only its peripheral surface functions as the second electrode 231. In such a configuration, the conductive case 240 may be directly connected to the second electrode 231 by, for example, soldering.

[0106] The conductive case 240 may be, for example, a resin case with metal plating on at least a portion of the surface thereof, which can reduce the influence on communication by the first antenna 223 and the like compared to a metallic conductive case 240.

[0107] The indicator LED 233 is disposed in a position that can be seen from outside the power supply device 20. The indicator LED 233 can display information regarding the operating state, charge level, etc. of the power supply device 20 to the user by changing the color of the light or by changing the lit / blinking state.

[0108] The photovoltaic sheet 250 is connected to the second substrate 220 via a connector CN 227. The photovoltaic sheet 250 is connected to the earth terminal 332 of the third substrate 230 via another connector CN.

[0109] In this embodiment, the power supply device 20 further includes a photovoltaic sheet 250 , a conductive case 240 that holds the photovoltaic sheet 250 , and a control unit that controls charging of the storage battery 212 with power from the photovoltaic sheet 250 .

[0110] 5 is an example of an explanatory diagram illustrating components of the power supply device 20. The conductor case 240 (510t) is a top view of the conductor case 240. The conductor case 240 (510b) is a bottom view of the conductor case 240. The bottom surface of the conductor case 240 is the surface that faces the second substrate 220.

[0111] The second substrate 220 (520t) is a top view of the second substrate 220. The top surface of the second substrate 220 is the surface that faces the conductive case 240. The second substrate 220 (520b) is a bottom view of the second substrate 220. The bottom surface of the second substrate 220 is the surface that faces the third substrate 230.

[0112] The second substrate 220 has a second opening 521. The earth terminal 332 passes through the second opening 521 and connects to the photovoltaic sheet 250.

[0113] In such an embodiment, the power supply device 20 further includes a photovoltaic sheet 250, the second substrate 220 has a second opening 521, and the third substrate 230 has an earth terminal 332 that is inserted into the second opening 521 and connects to the photovoltaic sheet 250.

[0114] A plurality of SMT pads 222 are provided on the top surface of the second substrate 220. The SMT pads 222 are an example of a signal input section. A plurality of electronic components are provided on the bottom surface of the second substrate 220 in addition to the BLE SoC 221, the Hall sensor 224, and the plug 320.

[0115] The third substrate 230 (530t) is a top view of the third substrate 230. The top surface of the third substrate 230 is the surface that faces the second substrate 220. The third substrate 230 (530b) is a bottom view of the third substrate 230. The bottom surface of the third substrate 230 is the surface that faces the first substrate 210.

[0116] The third substrate 230 has a first opening 531. At least one of the storage battery 212 and the storage battery holder 212a can be at least partially inserted into the first opening 531.

[0117] In such an embodiment, in the power supply device 20, the third substrate 230 has a first opening 531, and at least a portion of the storage battery 212 or the holding portion 212a of the storage battery 212 is inserted into the first opening.

[0118] By providing the third substrate 230 with the first opening 531 , it becomes possible to flexibly design the power supply device 20 with respect to the external dimensions of the storage battery 212 , in particular the height dimension of the storage battery 212 .

[0119] The first substrate 210 (540t) is a top view of the first substrate 210. The top surface of the first substrate 210 is the surface that faces the third substrate 230. The first substrate 210 (540b) is a bottom view of the first substrate 210. The bottom surface of the first substrate 210 is the surface on which the first electrode 211 is provided.

[0120] On the top surface of the first substrate 210, a linear regulator 213 and multiple electronic components are provided around the periphery of the storage battery 212. On the bottom surface of the first substrate 210, multiple SMT pads 215 are provided around the periphery of the first electrode 211. The SMT pads 215 are an example of a signal input unit.

[0121] A control unit such as a microcomputer of the BLE SoC 221 can control each function of the power supply device 20 based on a signal input from at least one of the plurality of SMT pads 215 or the plurality of SMT pads 222 .

[0122] In such an embodiment, the power supply device 20 has at least one of the first board 210 or the second board 220 having at least one signal input section 215, 222, and a control section controlling access to different functions for each signal input section 215, 222.

[0123] The power supply device 20 has a plurality of SMT pads 215 on the periphery of the first electrode 211 on the bottom surface of the first substrate 210 (540b), so the area of ​​the bottom surface of the first substrate 210 (540b) can also be efficiently used as a signal input section. In this embodiment, the power supply device 20 has the first substrate 210 having a plurality of input sections 215 on the same surface as the first electrode 211.

[0124] 6A and 6B are examples of external views of the power supply device 20. The power supply device 20 (600a) is a front view (plan view) of the power supply device 20. The power supply device 20 (600b) is a top view of the power supply device 20. The power supply device 20 (600c) is a rear view of the power supply device 20.

[0125] Power supply device 20 (600d) is a bottom view of power supply device 20. Power supply device 20 (600e) is a left side view of power supply device 20. Power supply device 20 (600f) is a right side view of power supply device 20.

[0126] Figure 7 shows an example of an exploded view of the power supply device 20. Figure 7(A) is a perspective view of the power supply device 20 similar to Figure 2(B). Figure 7(B) shows the power supply device 20 shown in Figure 7(A) with the conductor case 240 removed.

[0127] The clip 227 clamps the photovoltaic sheet 250 and holds the photovoltaic sheet 250 to the conductive case 240. The clip 227 may be electrically connected to the earth terminal 332.

[0128] Figure 7(C) shows the state of Figure 7(B) with the photovoltaic sheet 250 removed. Figure 7(D) shows the state of Figure 7(C) with the second substrate 220 removed. Figure 7(E) shows the state of Figure 7(D) with the third substrate 230 removed. Figure 7(F) shows the state of Figure 7(E) with the first substrate 210 removed. The first electrode 211 may be provided in close contact with the first substrate 210 by plating or the like.

[0129] 8A and 8B are examples of other exploded views of the power supply device 20. Fig. 8A is a perspective view of the power supply device 20 as seen from the first substrate 210 side. Fig. 8B shows the power supply device 20 shown in Fig. 8A with the first electrode 211 removed.

[0130] Fig. 8(C) shows the state of Fig. 8(B) with the first substrate 210 removed. Fig. 8(D) shows the state of Fig. 8(C) with the third substrate 230 removed. Fig. 8(E) shows the state of Fig. 8(D) with the second substrate 220 removed.

[0131] 2, 7, and 8, among the components of the power supply device 20, the components attached to the first board 210 are exposed to the outside. Similarly, the components attached to the board surface of the third board 230 that faces the first board 210 are also exposed to the outside.

[0132] This makes it easier for sensors that detect environmental parameters such as temperature and humidity, which are arranged on the substrate surface of the first substrate 210 or the substrate surface of the third substrate 230 that faces the first substrate 210, to detect more accurate values.

[0133] Similarly, as is clear from Figures 2, 7, and 8, among the components of power supply device 20, the parts attached to the board surface of second board 220 facing third board 230 and the parts attached to the board surface of third board 230 facing second board 220 are isolated from the outside by conductive case 240, second board 220, and third board 230.

[0134] As a result, the conductive case 240, the second substrate 220, and the third substrate 230 can more reliably protect the components arranged in a space isolated from the outside from external shocks, moisture, etc.

[0135] Since the conductive case 240, the second board 220, and the third board 230 can form a space isolated from the outside, the power supply device 20 can omit an additional housing member.

[0136] 9 is an example of an explanatory diagram illustrating the holding of the photovoltaic sheet 250. The conductor case 240 houses the photovoltaic sheet 250. The conductor case 240 and the second substrate 220 sandwich the photovoltaic sheet 250 and hold the photovoltaic sheet 250 in a fixed position within the conductor case 240.

[0137] In this embodiment, the power supply device 20 has a photovoltaic sheet 250 sandwiched between the conductive case 240 and the second substrate 220 having a control unit (such as a microcomputer).

[0138] The conductive case 240 has a light receiving section 900. The light receiving section 900 may be formed as an opening, or may be formed from a light-transmitting member.

[0139] The photovoltaic sheet 250 can generate electricity using light, such as sunlight, that passes through the light-receiving section 900. In one embodiment, the photovoltaic sheet 250 may be integrally and fixedly attached to the power supply device 20.

[0140] In another embodiment, the photovoltaic sheet 250 may be attached to the power supply device 20 in a manner that allows for interchangeability between, for example, a single-cell photovoltaic sheet 250 and a multi-cell photovoltaic sheet 250 .

[0141] In yet another embodiment, the power supply device 20 may include an antenna for space transmission type wireless power supply between the conductive case 240 and the second substrate 220 instead of the photovoltaic sheet 250 .

[0142] Fig. 10 is a schematic diagram of a power supply device 1000 according to the second embodiment. In the following explanation, explanations of components and functions that are common to the first embodiment of the power supply device 20 explained using Figs. 2 to 9 may be omitted.

[0143] For example, the configuration of the first to third boards 1010, 1020, and 1030 of the power supply device 1000 according to the second embodiment is at least partially common to the configuration of the first to third boards 210, 220, and 230 of the power supply device 20 according to the first embodiment, and the following mainly describes the differences between them.

[0144] The arrangement and number of boards and the types of electronic components arranged on each board described in relation to the first and second embodiments can be replaced, exchanged, or eliminated as appropriate. Furthermore, individual functional elements described in relation to the power supply units 20 and 1000 can be eliminated as appropriate, provided that this does not result in technical inconsistencies. Such a configuration can achieve space savings, weight reduction, and cost reduction.

[0145] Fig. 10A is an example of a perspective view of a power supply device 1000 according to the second embodiment, and Fig. 10B is an example of a perspective view of the power supply device 1000 with the sealing material 1310 removed.

[0146] Fig. 10C is an example of a perspective view of the power supply device 1000 shown in Fig. 10B with the auxiliary wall portion 1090 removed. Note that in the power supply device 1000 of Fig. 10A, a sealing material 1310 (described later) may be introduced into the internal space of the power supply device 1000.

[0147] FIG. 10D is an example of a perspective view of a conductor case 1040 ( 240 ) that also functions as a second electrode 1041 and has a notch 1042 .

[0148] Figure 10(E) is an example of a perspective view of a photovoltaic sheet 1050 (250). Figure 10(F) is an example of a perspective view of a double-sided tape 1060 and a conductive tape 1070. Figure 10(G) is an example of a perspective view of a substrate assembly 1080 that combines a first substrate 1010 (210), a second substrate 1020 (220), and a third substrate 1030 (230).

[0149] In the power supply device 1000, the conductor case 1040 houses a substrate assembly 1080. The substrate assembly 1080 is fixedly connected to the photovoltaic sheet 1050 via double-sided tape 1060, and is electrically connected to the photovoltaic sheet 1050 via conductive tape 1070.

[0150] The conductor case 1040 has a conductor case cutout 1042. An optional auxiliary wall 1090 is attached to the void created by the conductor case cutout 1042. The auxiliary wall 1090 may be made of a material with excellent electromagnetic wave transparency, such as resin.

[0151] The photovoltaic sheet 1050 has a photovoltaic sheet cutout 1052. In the power supply device 1000, the photovoltaic sheet cutout 1052 is positioned so as to be located near the conductor case cutout 1042.

[0152] The first substrate 1010, the second substrate 1020, and the third substrate 1030 each have a substrate cutout 1082. In the power supply device 1000, the substrate cutout 1082 is positioned so as to be located near the conductor case cutout 1042 and the photovoltaic sheet cutout 1052.

[0153] By providing the substrate cutout portion 1082, the amount of substrate copper foil included in each of the substrates 1010, 1020, and 1030 is reduced, thereby improving the antenna characteristics of the first antenna 1023.

[0154] In the power supply device 1000, the conductor case cutout 1042, photovoltaic sheet cutout 1052, and board cutout 1082 are positioned so that, for example, at least one straight line 1000L extending circumferentially from a center point 1000C of the circle that forms the outline of the power supply device 1000 passes through the range of the conductor case cutout 1042, the range of the photovoltaic sheet cutout 1052, and the range of the board cutout 1082. Note that the center point 1000C is an imaginary point for purposes of explanation, and the power supply device 1000 does not have a pattern or the like as shown in the figure.

[0155] The substrate assembly 1080 is positioned so that the first antenna 1023 ( 223 ) attached to the second substrate 1020 is located near the void created by the cutout portion 1042 .

[0156] The first antenna 1023 is positioned, for example, when viewed in a direction perpendicular to the substrate surface of the second substrate 1020, so as to extend circumferentially from the center point 1000C of the circle forming the outline of the power supply unit 1000 and overlap with a straight line 1000L that passes through the range of the conductor case cutout 1042, the range of the photovoltaic sheet cutout 1052, and the range of the substrate cutout 1082.

[0157] In such a configuration, the first antenna 1023 (223) is located near the void created by the conductor case cutout 1042 and the void created by the photovoltaic sheet cutout 1052, and there is less obstruction from the substrate copper foil, so the antenna characteristics of the first antenna 1023 are significantly improved compared to a configuration in which the first antenna 1023 (223) is located near other wall portions of the conductor case 1040.

[0158] The shapes of the conductor case cutout 1042 and the photovoltaic sheet cutout 1052 are preferably such that they do not interfere with the forbidden band area of ​​the chip antenna used as the first antenna 1023, for example.

[0159] The shapes of the conductor case cutout 1042 and the photovoltaic sheet cutout 1052 are not limited to the rounded rectangle shown in Fig. 10. The shapes of the conductor case cutout 1042 and the photovoltaic sheet cutout 1052 may be, for example, circular or elliptical.

[0160] Instead of the conductor case cutout 1042 and the photovoltaic sheet cutout 1052, the power supply device 1000 may have a plurality of openings of any shape, arranged in a mesh pattern, for example.

[0161] In addition, when the power supply device 1000 is configured not to have an antenna element such as the first antenna 1023, the conductor case 1040 and the photovoltaic sheet can be shaped so as not to have any cutouts, thereby improving robustness and power generation efficiency.

[0162] 11A and 11B are diagrams illustrating an example of a conductive connection part 1100. Fig. 11A is an example of a perspective view of a substrate assembly 1080. Fig. 11B is an example of a plan view of a third substrate 1030.

[0163] Fig. 11(C) is an example of a perspective view of the conductive connecting part 1100 in a state where it is attached to the third substrate 1030. Fig. 11(D) is an example of a partially enlarged view of Fig. 11(B).

[0164] In the power supply unit 1000, the terminals 1032 are formed as pogo pins. In the power supply unit 1000, three sockets 310 or plugs 320 (not shown) are provided on one or both sides of the first substrate 1010, the second substrate 1020, and the third substrate 1030.

[0165] The three sockets 310 or plugs 320 are arranged and distributed approximately evenly in the circumferential direction of each of the boards 1010, 1020, and 1030. This allows for more reliable connection and retention between the boards 1010, 1020, and 1030 compared to the configuration of the power supply unit 20 described above.

[0166] In the substrate assembly 1080 before it is housed in the conductive case 1040, the movable contact portion 1110 of the conductive connection part 1100 attached to the third substrate 1030 protrudes outward beyond the outer peripheral contours of the first substrate 1010, the second substrate 1020, and the third substrate 1030.

[0167] When the board assembly 1080 is housed in the conductive case 1040, the movable contact portion 1110 of the conductive connection part 1100 moves in the movement direction 1110MD1 in response to the elastic deformation of the conductive connection part 1100.

[0168] As the movable contact portion 1110 moves in the movement direction 1110MD1, the movable end portion 1120 of the conductive connection part 1100 moves in the movement direction 1110MD2 while contacting the longitudinal wall portion 1130.

[0169] When the substrate assembly 1080 is housed in the conductive case 1040, the movable contact portion 1110 comes into contact with the inner surface 1043 of the conductive case due to the pressing force based on the restoring force of the elastic deformation of the conductive connecting part 1100, electrically connecting the third substrate 1030 and the conductive case 1040.

[0170] The pressing force based on the restoring force of the elastic deformation of the conductive connection part 1100 can be set arbitrarily depending on the materials and dimensional design of the conductive connection part 1100. By setting the pressing force to be sufficiently large, it is possible to make it difficult for the connection between the movable end part 1120 of the conductive connection part 1100 and the inner peripheral surface 1043 of the conductor case to be severed (disconnected).

[0171] This makes it possible to stably maintain the electrical and mechanical connection between the conductive connection part 1100 and the conductor case 1040 against, for example, the introduction pressure of the sealing material 1310 that occurs when introducing (potting) the sealing material 1310 into the internal space 1300 of the power supply device 1000 described below, vibration of the power supply device 1000, etc.

[0172] Fig. 12 is an example of a perspective view of the conductive connection part 1100. Fig. 12(A) to Fig. 12(D) are examples of perspective views of the conductive connection part 1100 viewed from different directions. The conductive connection part 1100 is manufactured by further bending a single sheet of metal that is made by, for example, punching.

[0173] In the power supply device 1000 according to Example 2, the third substrate 1030 may be configured to be connected by contact or soldering between a conductive portion provided by plating or the like on the periphery of the third substrate 1030 and the conductor case 1040 (second electrode 1041), instead of the conductive connecting part 1100, like the second electrode 231 described in Example 1.

[0174] The above-described connection method between the third substrate 1030 and the conductive case 1040 can also be applied to the connection between the first substrate 1010 and the conductive case 1040, or the connection between the second substrate 1020 and the conductive case 1040, for example, in a variation of the power supply unit 1000 in which the third substrate 1030 is omitted (see Figures 17 and 18).

[0175] Figure 13 is an example of a first explanatory diagram illustrating the sealing of the internal space 1300 of the power supply device 1000. Figure 13(A) is a cross-sectional perspective view of the power supply device 1000 seen obliquely from above. Figure 13(B) is a cross-sectional view of the power supply device 1000 seen from the side. Figure 13(C) is a cross-sectional perspective view of the power supply device 1000 seen obliquely from below. Figure 13(D) is a cross-sectional view of the power supply device 1000 seen from the side with a sealant 1310 introduced into the internal space 1300.

[0176] The power supply device 1000 shown in Figures 13(A) to 13(C) has a gap 1301 that connects an internal space 1300 with an external space (environment). In the power supply device 1000 shown in Figures 13(A) to 13(C), air and moisture from the environment can enter the internal space 1300 through the gap 1301.

[0177] In the power supply device 1000 shown in Fig. 13(D), a sealant 1310 is introduced into the internal space 1300. In Fig. 13(D), the sealant 1310 is introduced into the internal space 1300 other than the spaces occupied by the components shown by solid lines.

[0178] The sealing material 1310 may prevent the internal space 1300 from communicating with the external space (environment) through the gap 1301 , and does not necessarily have to occupy the entire internal space 1300 .

[0179] It is better if the sealing material 1310 introduced into the internal space 1300 is a material with excellent shock absorption, heat dissipation, water resistance, weather resistance, flexibility, airtightness, and liquid tightness, as this can improve the stability and robustness of the power supply unit 1000.

[0180] In the process of introducing the sealing material 1310 into the internal space 1300, the power supply device 1000 is placed in a mold (such as a silicon mold) that corresponds to the shape of the power supply device 1000, and the sealing material 1310 is introduced into the mold.

[0181] The sealing material 1310 can be introduced not only into the interior space 1300 but also in a state adapted to the external shape of the power supply device 1000. In the power supply device 1000, the first substrate 1010 may be completely or partially housed within the conductor case 1040.

[0182] When the first substrate 1010 is partially housed in the conductive case 1040, the thickness of the power supply device 1000 is the sum of the thickness of the conductive case 1040 and the thickness of the first substrate 1010, minus the thickness of the portion of the first substrate 1010 housed in the conductive case 1040. The thickness of the first substrate 1010 includes the thickness of the first electrode 1011 and the like.

[0183] In another configuration, the first substrate 1010 may hold the conductive case 1040 on the substrate surface of the first substrate 1010 and be fixed to the conductive case 1040. In such a configuration, the diameter of the first substrate 1010 may be the same as or slightly smaller than the diameter of the circle that forms the outer contour of the conductive case 1040.

[0184] In yet another configuration, the first substrate 1010 may be fixed to the conductive case 1040 via an intermediate member disposed between the first substrate 1010 and the conductive case 1040, such as a sealing ring 1500 described in detail with reference to FIG. 15. This allows the sealing material 1310 to form the outer shape of the power supply device 1000.

[0185] Figure 14 is an example of a second explanatory diagram illustrating the sealing of the internal space 1300 of the power supply device 1000. Figure 14(A) is a cross-sectional perspective view of the power supply device 1000 seen obliquely from above. Figure 14(B) is a cross-sectional view of the power supply device 1000 seen from the side. Figure 14(C) is a cross-sectional perspective view of the power supply device 1000 seen obliquely from below. Figure 14(D) is a cross-sectional view of the power supply device 1000 seen from the side with a sealant 1310 introduced into the internal space 1300.

[0186] The power supply device 1000 shown in Fig. 14 has a configuration in which an auxiliary wall portion 1090, which is an optional member, is added to the power supply device 1000 shown in Fig. 13. The auxiliary wall portion 1090 can prevent or reduce leakage of the sealant 1310 when the sealant 1310 is filled into the internal space 1300.

[0187] In the process of introducing the sealing material 1310 using a mold described with reference to Fig. 13, after the introduction process is completed, the auxiliary wall portion 1090 may be covered with the sealing material 1310, similar to the auxiliary wall portion 1090 described with reference to Fig. 10. By using the auxiliary wall portion 1090 made of a material that is stronger and less flexible than the sealing material 1310, it is possible to compensate for the strength of the power supply device 1000, in particular the strength of the conductive case 1040 that is reduced by providing the conductive case cutout portion 1042.

[0188] 15A and 15B are examples of a third explanatory diagram illustrating the sealing of the internal space 1300 of the power supply device 1000. Fig. 15A is an example of an exploded view of the power supply device 1000 having a sealing ring 1500. Fig. 15B is a cross-sectional view of the power supply device 1000 seen from the side with the internal space 1300 sealed using the sealing ring 1500.

[0189] The substrate assembly 1080 is housed in the conductive case 1040 with the sealing ring 1500 surrounding the peripheries of the first substrate 1010 and the third substrate 1030. When the substrate assembly 1080 is housed in the conductive case 1040, the sealing ring 1500 seals the gap 1301 between the substrate assembly 1080 and the conductive case 1040.

[0190] The height H2 of the sealing ring 1500 corresponds to the length H1 between the bottom surface of the first substrate 1010 and the top surface of the third substrate 1030. The height H2 of the sealing ring 1500 can be arbitrarily designed up to, for example, the height H3 of the internal space 1300 of the conductive case 1040.

[0191] When the height H2 of the sealing ring 1500 reaches the conductive connection parts 1100, the sealing ring 1500 has holes or recesses at corresponding positions, thereby allowing the sealing ring 1500 and the conductive case 1040 to come into contact over a larger area while maintaining electrical connection between the conductive connection parts 1100 and the conductive case 1040, and therefore the substrate assembly 1080 can be more stably held within the conductive case 1040 with a larger frictional force.

[0192] 16A and 16B are examples of a fourth explanatory diagram illustrating the sealing of the internal space 1300 of the power supply device 1000. Fig. 16A is an example of an exploded view of the power supply device 1000 before it is sealed by the hot melt method.

[0193] Fig. 16(B) is an example of an explanatory diagram illustrating the sealing process of the power supply device 1000 by the hot melt method. Fig. 16(C) is a cross-sectional view, seen from the side, of the power supply device 1000 in which the internal space 1300 has been sealed by the hot melt method.

[0194] When sealing the internal space of the power supply unit 1000 using the hot melt method, after the substrate assembly 1080 is housed in the conductive case 1040, liquefied sealant 1310 is introduced into the gap 1301 between the substrate assembly 1080 and the conductive case 1040 using a sealant introduction device 1600.

[0195] By using the liquefied sealant 1310, it is possible to efficiently seal even a relatively small gap 1301. The sealant introduction device 1600 can continuously seal the gap 1301 between the periphery of the first substrate 1010 and the inner periphery of the conductor case 1040 by moving, for example, in a movement direction 1600MD of the sealant introduction device 1600 shown in FIG.

[0196] Instead of the method of sealing the internal space 1300 described with reference to FIGS. 13 to 16, the power supply device 1000 with the internal space 1300 sealed can also be produced by insert molding.

[0197] In one example of a method for sealing the internal space 1300 by insert molding, the substrate assembly 1080 is assembled to the conductive case 1040, and the conductive case 1040 and the substrate assembly 1080 are insert molded together, thereby sealing the internal space 1300. In this case, after the conductive case 1040 and the substrate assembly 1080 are assembled, the conductive case 1040 and the substrate assembly 1080 may be fixed together with an adhesive, hot melt, or the like before insert molding.

[0198] In another example of sealing the internal space 1300 using the insert molding method, it is possible to insert mold only the conductor case 1040, then assemble the substrate assembly 1080, and fill the assembly gaps with adhesive or hot melt to seal the internal space 1300.

[0199] 17A and 17B are diagrams illustrating an example of an outline of a power supply device 1700 (1000) according to a first modified example. Fig. 17A is an example of a perspective view of the power supply device 1700. Fig. 17B is an example of a perspective view of a sealant 1310 in the power supply device 1700.

[0200] Fig. 17(C) is an example of a perspective view of the conductor case 1040 (second electrode 1041) in the power supply device 1700. Fig. 17(D) is an example of a perspective view of the second substrate 1020 in the power supply device 1700. Fig. 17(E) is an example of a perspective view of the first substrate 1010 in the power supply device 1700.

[0201] A power supply device 1700 according to the first modification has, as electronic boards, a first board 1010 and a second board 1020. The first board 1010 has the conductive connection part 1100 described with reference to Figures 10 to 12, etc.

[0202] The power supply device 1700 does not have a photovoltaic sheet 1050. Accordingly, the step in the sealing material 1310 caused by the outline of the cutout 1052 in the photovoltaic sheet is eliminated.

[0203] The power supply device 1700 can charge the storage battery 212, for example, by wireless power supply. The power supply device 1700 may have another plate-shaped component having substantially the same shape as the photovoltaic sheet 1050, instead of the photovoltaic sheet 1050.

[0204] The first substrate 1010 is connected to the conductive case 1040 in the above-described manner using the conductive connection parts 1100. The conductive connection parts 1100 may also be attached to the second substrate 1020.

[0205] The first substrate 1010 is electrically and mechanically connected to the second substrate 1020 via a plug 320 provided on the first substrate 1010 and a socket 310 (not shown) provided on the second substrate 1020 .

[0206] The power supply device 1700 has at least a storage battery (secondary battery) 212, a charging circuit (not shown) for charging the storage battery 212, and a booster circuit (not shown) on the first board 1010 and the second board 1020.

[0207] The charging circuit (not shown) has the same function as the charging circuit for charging the storage battery 212 illustrated as part of the BLE SoC 221 in Fig. 4 etc. The booster circuit (not shown) has the same function as the booster circuit 232 illustrated in Fig. 4 etc.

[0208] In the power supply device 1700 shown in FIG. 17A, the first substrate 1010 and the second substrate 1020 are surrounded by a sealing material 1310 in a state where they are connected to a conductive case 1040 using a conductive connecting part 1100.

[0209] 18A and 18B are explanatory diagrams illustrating an example of an outline of a power supply device 1800 according to a second modification. Fig. 18A is an example of a perspective view of the power supply device 1800. Fig. 18B is an example of a perspective view of a sealant 1310 in the power supply device 1800.

[0210] 18C is an example of a perspective view of the conductor case 1040 (second electrode 1041) in the power supply device 1800. FIG. 18D is an example of a perspective view of the first substrate 1010 in the power supply device 1800.

[0211] A power supply device 1800 according to the second modification has, as an electronic board, a single first board 1010. The first board 1010 has the conductive connection parts 1100 described with reference to Figures 10 to 12 and the like.

[0212] The power supply device 1800 does not have a photovoltaic sheet 1050. Accordingly, the step in the sealing material 1310 caused by the outline of the cutout 1052 in the photovoltaic sheet is eliminated.

[0213] The power supply device 1800 can charge the storage battery 212, for example, by wireless power supply. The power supply device 1800 may have another plate-shaped component having substantially the same shape as the photovoltaic sheet 1050, instead of the photovoltaic sheet 1050.

[0214] The first substrate 1010 is connected to the conductive case 1040 in the above-described manner using the conductive connecting parts 1100. The first substrate 1010 has at least a storage battery (secondary battery) 212, a charging circuit (not shown) for charging the storage battery 212, and a booster circuit (not shown).

[0215] The charging circuit (not shown) has the same function as the charging circuit for charging the storage battery 212 illustrated as part of the BLE SoC 221 in Fig. 4 etc. The booster circuit (not shown) has the same function as the booster circuit 232 illustrated in Fig. 4 etc.

[0216] In a configuration in which the power supply unit 1800 is capable of optical power supply, the power supply unit 1800 has a first substrate 1010, a conductor case 1040 (second electrode 1041), and a photovoltaic sheet 1050, and the first substrate 1010 has a connection connector for the photovoltaic sheet 1050, a storage battery 212, a charging circuit for charging the storage battery 212, a booster circuit, a first electrode 1011, and a conductive connecting part 1100.

[0217] In this case, the photovoltaic sheet 1050 and the first substrate 1010 can be connected by using a pogo pin that is longer than the terminal (pogo pin) used to connect the photovoltaic sheet 1050 and the third substrate 1030 in the power supply device 1000 described using Figure 10, for example.

[0218] In a configuration in which the power supply device 1800 is capable of wireless power supply, the power supply device 1800 has a first substrate 1010 and a conductive case 1040 (second electrode 1041), and the first substrate 1010 has a portion in which a coaxial connector can be mounted, a storage battery 212, a charging circuit for wireless power supply, a booster circuit, a first electrode 1011, and a conductive connecting part 1100.

[0219] In the power supply unit 1800, the plugs 320 for connecting between the boards can be omitted, and the space created by omitting them can be used to add the above components as appropriate depending on the functions to be implemented, and the components can be integrated into a single circuit on the first board 1010.

[0220] In the power supply device 1800 shown in FIG. 18A, the first substrate 1010 is surrounded by a sealing material 1310 in a state where it is connected to a conductive case 1040 using a conductive connecting part 1100.

[0221] In a configuration in which a photovoltaic sheet 1050 is added to the power supply unit 1800, a contact prevention plate can be provided on the back side (internal space side) of the photovoltaic sheet 1050 to prevent contact between the photovoltaic sheet 1050 and other components.

[0222] It should be noted that the present application is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present technology, and are not necessarily limited to those including all of the described configurations. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace part of the configuration of each embodiment with other configurations.

[0223] Furthermore, the above-described configurations, functions, processing units, processing means, etc. may be partially or entirely implemented in hardware, for example, by designing them as integrated circuits. The above-described configurations, functions, etc. may also be implemented in software, with a processor interpreting and executing a program that implements each function. Information such as the programs, tables, and files that implement each function can be stored in a memory, a recording device such as a hard disk or SSD (Solid State Drive), or a recording medium such as an IC card, SD card, or DVD.

[0224] Furthermore, the control lines and information lines shown are those considered necessary for the explanation, and do not necessarily show all the control lines and information lines in the product. In reality, it can be considered that almost all components are interconnected. The above-mentioned embodiments disclose at least the configurations described in the claims.

[0225] REFERENCE SIGNS LIST 10...power supply device, 210...first substrate, 211...first electrode, 220...second substrate, 230...third substrate, 231...second electrode, 240...conductor case, 250...photovoltaic sheet

Claims

1. A power supply device having: a first electrode; a storage battery; a conductor portion; one or more substrates electrically connected to the first electrode, the storage battery, and the conductor portion; and a second electrode electrically connected to the one or more substrates via the conductor portion, the second electrode accommodating at least one of the one or more substrates.

2. The power supply device according to claim 1, wherein said conductor portion has a contact portion that contacts the inner peripheral surface of said second electrode that houses at least one of said one or more substrates.

3. A power supply device as described in claim 1, wherein at least one of said one or more substrates has an antenna, said second electrode has a notch, and said notch of said second electrode and said antenna are positioned so as not to overlap when viewed in a direction perpendicular to the substrate surface of said one or more substrates.

4. The power supply device according to claim 1, wherein a void space connecting the internal space of said second electrode to the outside of said second electrode is sealed with a sealing material.

5. A power supply device comprising: a first substrate having a first electrode and a storage battery; a second substrate having a second electrode and a control unit; and a third substrate disposed between the first substrate and the second substrate and having a conductor portion on at least a portion of its periphery that connects to the second electrode.

6. A power supply device according to claim 5, wherein the second electrode is at least one linear member that contacts the conductor portion of the third substrate across the thickness of the third substrate.

7. A power supply device according to claim 5, further comprising a conductor case, said conductor case and said conductor portion of said third substrate being electrically connected, and at least either said conductor portion on the side surface of said third substrate or said conductor case forming said second electrode.

8. A power supply device according to claim 7, further comprising a photovoltaic sheet, the conductive case holding the photovoltaic sheet, and the control unit controlling charging of the storage battery using power from the photovoltaic sheet.

9. A power supply device according to claim 8, wherein the photovoltaic sheet is sandwiched and held between the conductive case and the second substrate having the control unit.

10. A power supply device according to claim 5, wherein the external shape is circular when viewed perpendicularly to the surface of the first, second or third board, and flat when viewed horizontally to the surface of the first, second or third board.

11. A power supply device according to claim 5, wherein at least one of the first board and the second board has at least one signal input section, and the control section controls access to different functions for each of the signal input sections.

12. A power supply device according to claim 11, wherein the first substrate has a plurality of the signal input sections on the same surface as the first electrode.

13. A power supply device according to claim 5, further comprising a power receiving antenna, wherein the control unit controls charging of the storage battery using power from the power receiving antenna.

14. A power supply device according to claim 5, wherein at least one of the first board or the second board has at least one power input section, and the control section controls charging of the storage battery with power from the power input section.

15. A power supply device according to claim 14, wherein the control unit controls charging of the storage battery with power from an external PV sheet or an external linear regulator via the power input unit.

16. A power supply device according to claim 5, wherein the third substrate has a first opening, and at least a portion of the storage battery or a holding portion of the storage battery is inserted into the first opening.

17. A power supply device according to claim 5, further comprising a wireless communication unit, wherein the control unit controls communication by the wireless communication unit of information relating to at least one of the amount of stored power in the storage battery, changes over time in the amount of stored power, power consumption, and changes over time in the power consumption.

18. A power supply device according to claim 17, further comprising at least one sensor, wherein the control unit controls communication by the wireless communication unit of information relating to at least one of temperature, humidity, brightness, speed, acceleration, inclination, position coordinates, and electromagnetic waves acquired by the sensor.

19. A power supply device according to claim 5, further comprising a fourth board that is replaceable with the first board, and wherein the control unit controls at least one of power supply and information processing using the fourth board that has replaced the first board.

20. A power supply device according to claim 5, comprising at least one of: at least one first connection structure that electrically connects the first substrate and the third substrate and maintains a first gap between the first substrate and the third substrate; or at least one second connection structure that electrically connects the second substrate and the third substrate and maintains a second gap between the second substrate and the third substrate.

21. A power supply device according to claim 20, wherein the first connection structure and the second connection structure each comprise a pair of plug and socket, the plug being provided on at least one of the first substrate or the second substrate, and the socket accommodating the plug being provided on the third substrate.

22. A power supply device according to claim 5, further comprising a photovoltaic sheet, the second substrate having a second opening, and the third substrate having an earth terminal inserted into the second opening and connected to the photovoltaic sheet.

23. A power supply device according to claim 5, further comprising a fifth board, wherein at least one of the first board or the second board has a connection part to which the fifth board is removably attached, and the control part controls at least one of the supply of power from the fifth board and the transmission of information to and from the fifth board via the connection part.

Images