Temperature regulation system and circulation unit

The temperature adjustment system rapidly cools semiconductor wafer chucks by pre-cooling coolant in a storage tank and using heated coolant from the recovery path, addressing the slow response of traditional systems and reducing heating time and power consumption.

WO2025204402A1PCT designated stage Publication Date: 2025-10-02TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
PCT/JP2025/006404
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-28
Filing Date
2025-02-25
Publication Date
2025-10-02

AI Technical Summary

Technical Problem

Existing cooling systems for semiconductor wafer chucks take too long to achieve the required temperature during rapid cooling processes due to the time it takes for the coolant to reach the desired temperature.

Method used

A temperature adjustment system with a cooling unit that includes a refrigerator, storage tank, and a circulation unit with bypass and switching mechanisms to quickly cool the chuck by pre-cooling the coolant in the storage tank and using heated coolant from the recovery path to reduce heating time.

Benefits of technology

Enables rapid temperature adjustment of the chuck by pre-cooling the coolant, reducing heating time and power consumption, and allowing for efficient temperature control of multiple chucks with modular and separable components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The objective of the present invention is to provide a temperature regulation system that can rapidly cool a chuck. Provided is a temperature regulation system for a prober having a chuck for holding a wafer, the temperature regulation system comprising: a cooling unit having a refrigerating machine for cooling an inflowing coolant and a storage tank disposed on the coolant outflow side of the refrigerating machine and capable of storing the coolant cooled by the refrigerating machine; a supply channel for supplying the coolant cooled by the cooling unit to the chuck; a recovery channel along which the coolant flowing out from the chuck is recovered into the cooling unit; a bypass channel connecting the supply channel and the recovery channel; and a switching part, provided at a first connection part between the supply channel and the bypass channel, that switches between a first circulation channel along which the coolant cooled by the cooling unit is circulated through the supply channel, the chuck, and the recovery channel without going through the bypass channel and a second circulation channel along which the coolant cooled by the cooling unit is circulated through the supply channel, the bypass channel, and the recovery channel without going through the chuck.
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Description

Temperature control system and circulation unit

[0001] This application claims priority from Japanese Patent Application No. 2024-053139, filed on March 28, 2024, the contents of which are incorporated herein by reference.

[0002] In the semiconductor manufacturing process, semiconductor wafers are subjected to various processes to form multiple chips each containing a device. The electrical characteristics of each chip are tested, and then the chips are cut using a dicer and fixed to a lead frame or the like for assembly. The electrical characteristics are tested using a prober equipped with a tester. The prober holds the wafer on a wafer chuck and contacts probes with the electrode pads of each chip. The tester supplies power and various test signals to the chips from terminals connected to the probes, and analyzes the signals output to the chip electrodes to verify normal operation.

[0003] In recent years, wafer inspection using probers has been increasing the number of chips being tested simultaneously in order to shorten measurement time and reduce test costs. Even devices such as DRAMs (Dynamic Random Access Memory) or flash memories, which generate little heat per chip, generate more heat as the number of chips being tested simultaneously increases. Therefore, to return the increased temperature to the set point, it is necessary to cool the chuck by flowing a coolant.

[0004] Patent Document 1 discloses a cooling system that has a circulation flow path including a coolant source having a heat exchanger or the like, a supply path that supplies coolant from the coolant source to a chuck coolant path, and a recovery path that recovers coolant from the chuck coolant path to the coolant source, and that cools the chuck by circulating the coolant.

[0005] Japanese Patent Application Laid-Open No. 2007-180412

[0006] A problem arises when rapid cooling is required in the chuck because it takes time to produce the required temperature of the cooling liquid.

[0007] The present invention has been made in consideration of the above points, and an object of the present invention is to provide a temperature adjustment system that can quickly cool a chuck and a circulation unit that is suitable for use in a temperature adjustment system.

[0008] The present invention has a first aspect as follows: A temperature adjustment system for a prober having a chuck for holding a wafer, comprising: a cooling unit including a refrigerator that cools an inflowing coolant, and a storage tank that is arranged on the outlet side of the coolant relative to the refrigerator and is capable of storing the coolant cooled by the refrigerator, a supply path that supplies the coolant cooled by the cooling unit to the chuck, a recovery path that recovers the coolant discharged from the chuck to the cooling unit, a bypass path that connects the supply path and the recovery path, and a switch that is provided at a first connection between the supply path and the bypass path and switches between a first circulation path that circulates the coolant cooled by the cooling unit through the supply path, the chuck, and the recovery path without passing through the bypass path, and a second circulation path that circulates the coolant cooled by the cooling unit through the supply path, the bypass path, and the recovery path without passing through the chuck.

[0009] The present invention has the following second aspect. a cooling unit that cools the coolant that has flowed in, and a prober having a chuck, the cooling unit comprising: a portion of a supply path through which the coolant cooled by the cooling unit is supplied to the chuck; a portion of a recovery path through which the coolant flowing out of the chuck is recovered into the cooling unit; a bypass path that connects the portion of the supply path and the portion of the recovery path; a switch that is provided at a first connection between the portion of the supply path and the bypass path and switches between a first circulation path through which the coolant cooled by the cooling unit circulates through the supply path, the chuck, and the recovery path without passing through the bypass path, and a second circulation path through which the coolant cooled by the cooling unit circulates through the supply path, the bypass path, and the recovery path without passing through the chuck; a second storage tank that is located closer to the chuck than the first connection in the portion of the supply path and is capable of storing the coolant supplied through the supply path; a heating unit that heats the coolant stored in the second storage tank; and a temperature sensor that measures the temperature of the coolant stored in the second storage tank. A circulation unit comprising:

[0010] The present invention provides a temperature regulation system and a circulation unit that can quickly cool the chuck.

[0011] The present invention relates to a temperature adjustment system for a vehicle, a vehicle interior, and a vehicle body, and more particularly to a temperature adjustment system for a vehicle interior, a vehicle interior, and a vehicle body.

[0012] Hereinafter, an embodiment of a temperature control system and a circulation unit of the present invention will be described with reference to Figures 1 to 4. Note that the following embodiment shows one aspect of the present invention, does not limit the present invention, and can be modified as desired within the scope of the technical concept of the present invention. In addition, in the following drawings, the scale and number of each structure are different from the actual structure to make each configuration easier to understand.

[0013] FIG. 1 is a diagram showing a schematic configuration of a prober 10 and a temperature adjustment system 20 according to an embodiment of the present invention.

[0014] The prober 10 includes a probe card 14 having probes 12 that are brought into contact with electrodes of a chip to be tested, a tester 16, and a chuck 1. The tester 16 includes a tester main body 18 and an interface 19 that electrically connects terminals of the tester main body 18 with terminals of the probe card 14. The tester 16 supplies power and various test signals to the chip from terminals connected to the probes 12, and analyzes the signals output to the electrodes of the chip to verify that the chip is operating normally.

[0015] The chuck 1 holds the wafer W. The chuck 1 has a heater 2, a coolant flow path 3, and a chuck temperature sensor 4. The heater 2 heats the chuck 1. The chuck temperature sensor 4 detects the temperature of the chuck 1. The coolant flow path 3 is a flow path through which the coolant flows. A supply path 5 and a recovery path 6, which constitute a temperature adjustment system 20 described later, are connected to the coolant flow path 3. The supply path 5 is a flow path that supplies the coolant to the coolant flow path 3 of the chuck 1. The recovery path 6 is a flow path that recovers the coolant that has cooled the chuck 1 in the coolant flow path 3.

[0016] The coolant in this embodiment is primarily a heat medium for cooling the chuck 1. The heat medium is, for example, a liquid, and a fluorine-based liquid or the like is used as the liquid, but other liquids may also be used. The coolant may also be used, for example, when heating the chuck 1, and is not necessarily limited to a configuration in which it is used only for cooling.

[0017] [First Embodiment of Temperature Adjustment System 20] Fig. 2 is a diagram showing a schematic configuration of a temperature adjustment system 20 according to a first embodiment. The temperature adjustment system 20 adjusts the temperature of the chuck 1 in the prober 10. As shown in Fig. 2, the temperature adjustment system 20 includes a supply path 5, a recovery path 6, a cooling unit 30, a circulation unit 40, a first pipe member 61, a second pipe member 62, a third pipe member 63, a fourth pipe member 64, and a control unit CONT (see Fig. 3).

[0018] The supply path 5 is a flow path (path) that supplies the coolant cooled by the cooling unit 30 to the chuck 1. The recovery path 6 is a flow path (path) that recovers the coolant flowing out of the chuck 1 to the cooling unit 30. The supply path 5 and the recovery path 6 are not limited to being made of a single member, and may be made of multiple types of members including tubular members such as hoses, which will be described later.

[0019] The cooling unit 30 includes a refrigerator 31 , a heat exchanger 32 , a storage tank 33 , a temperature monitoring sensor 34 , a first pump 35 , a first connecting portion 36 , and a second connecting portion 37 .

[0020] The refrigerator 31 has a compressor, a heat exchanger, an expansion valve, an evaporator, etc., and cools the refrigerant gas. The compressor is equipped with an inverter, which changes the operation as needed. The heat exchanger 32 cools the coolant by exchanging heat between the refrigerant gas cooled by the refrigerator 31 and the coolant flowing in from the recovery line 6.

[0021] The storage tank 33 is disposed on the coolant outlet side relative to the refrigerator 31. The storage tank 33 is capable of storing the coolant cooled by the refrigerator 31 and the heat exchanger 32. The coolant stored in the storage tank 33 is, for example, at −60° C. The temperature monitoring sensor 34 monitors the temperature of the coolant stored in the storage tank 33. The first pump 35 is disposed on the coolant outlet side relative to the storage tank 33. The first pump 35 sends the coolant stored in the storage tank 33 through the supply path 5 toward the chuck 1.

[0022] The first connecting portion 36 can be detachably connected to one end of a first pipe member 61 through which the coolant flows in. The first pipe member 61 constitutes a part of the recovery path 6. The other end of the first pipe member 61 can be detachably connected to the circulation unit 40 (details will be described later). The second connecting portion 37 can be detachably connected to one end of a second pipe member 62 through which the coolant flows out. The second pipe member 62 constitutes a part of the supply path 5. The other end of the second pipe member 62 can be detachably connected to the circulation unit 40 (details will be described later).

[0023] The circulation unit 40 is provided so as to be separable from the prober 10 and the cooling unit 30. The circulation unit 40 can adjust the circulation path of the coolant in the temperature adjustment system 20. The circulation unit 40 is arranged closer to the prober 10 than the cooling unit 30. The circulation unit 40 has a bypass path 41, a switching unit 42, a second storage tank 43, a heating unit 44, a temperature sensor 45, a second pump 46, an adjustment path 47, an adjustment unit 48, a fifth connection unit 49, a sixth connection unit 50, a seventh connection unit 51, and an eighth connection unit 52.

[0024] The bypass path 41 connects the supply path 5 and the recovery path 6. The bypass path 41 has a check valve 53. The check valve 53 regulates the flow of coolant in the bypass path 41 from the recovery path 6 toward the supply path 5, and allows the flow of coolant from the supply path 5 toward the recovery path 6. A check valve 54 is provided in the recovery path 6 on a side closer to the chuck 1 than the connection point with the bypass path 41. The check valve 54 regulates the flow of coolant in the recovery path 6 from the cooling unit 30 toward the chuck 1, and allows the flow of coolant from the chuck 1 toward the cooling unit 30.

[0025] The switching unit 42 is provided at a first connection portion 55 between the supply path 5 and the bypass path 41. The switching unit 42 is configured as a three-way electromagnetic valve. The switching unit 42 selectively switches the coolant that flows into the supply path 5 from the cooling unit 30 between a flow toward the chuck 1 and a flow toward the bypass path 41. The switching unit 42 selectively switches between a first circulation path R1, through which the coolant cooled by the cooling unit 30 circulates through the supply path 5, the chuck 1, and the recovery path 6 without passing through the bypass path 41, and a second circulation path R2, through which the coolant cooled by the cooling unit 30 circulates through the supply path 5, the bypass path 41, and the recovery path 6 without passing through the chuck 1.

[0026] The cooling liquid circulates through the first circulation path R1, thereby cooling (adjusting the temperature) the chuck 1. The cooling liquid circulates through the second circulation path R2, thereby allowing the cooling liquid, which has been continuously cooled by the refrigerator 31 and the heat exchanger 32, to be stored in the storage tank 33.

[0027] The second storage tank 43 is disposed on a side of the supply path 5 closer to the chuck 1 than the first connection portion 55. The coolant flows into the second storage tank 43 via the supply path 5. The second storage tank 43 stores the coolant to be supplied to the chuck 1 to adjust the temperature of the chuck 1. The heating unit 44 is disposed inside the second storage tank 43 and is capable of heating the stored coolant. The temperature sensor 45 measures the temperature of the coolant stored in the second storage tank 43. In the second storage tank 43, the heating unit 44 heats the stored coolant based on the temperature of the coolant measured by the temperature sensor 45, thereby adjusting the coolant to a temperature suitable for adjusting the temperature of the chuck 1.

[0028] As described above, the chuck 1 is provided with the heater 2 and the chuck temperature sensor 4, and the chuck 1 can be adjusted to a predetermined temperature by heating the chuck 1 with the heater 2 in accordance with the temperature of the chuck 1 detected by the chuck temperature sensor 4. Meanwhile, the chuck 1 is provided with the coolant flow path 3, and the chuck 1 can be cooled by heat exchange with the coolant in the coolant flow path 3. Since cooling using the coolant has a slower response than heating using the heater 2, it is preferable from the standpoint of response when adjusting the chuck 1 to a target temperature to start heating from a temperature lower than the target temperature.

[0029] Therefore, in the second storage tank 43, when the target temperature of the chuck 1 is T (°C), the coolant is adjusted to a temperature of T-α (°C), which is lower than the target temperature T (°C). The second pump 46 sends the coolant whose temperature has been adjusted in the second storage tank 43 toward the chuck 1.

[0030] The adjustment unit 48 is arranged on the recovery path 6 closer to the chuck 1 than the second connection portion 56 between the recovery path 6 and the bypass path 41 and the check valve 54. The adjustment unit 48 is configured with a three-way electromagnetic valve. The adjustment unit 48 is connected to the second storage tank 43 via an adjustment path 47. The adjustment unit 48 selectively switches the coolant that flows in from the chuck 1 in the recovery path 6 between a flow toward the cooling unit 30 and a flow toward the second storage tank 43 via the adjustment path 47. Alternatively, the adjustment unit 48 can adjust the ratio of the flow toward the cooling unit 30 and the flow toward the second storage tank 43 via the adjustment path 47 with respect to the coolant that flows in from the chuck 1 in the recovery path 6.

[0031] The adjustment unit 48 can adjust the amount of cooling liquid flowing in from the recovery path 6 to be supplied to the second storage tank 43 via the adjustment path 47 based on the temperature to which the chuck 1 is adjusted and the measurement results of the temperature sensor 45.

[0032] As described above, when supplying coolant at a temperature of T-α (°C) from the second storage tank 43 to the chuck 1, if the temperature of the coolant flowing from the storage tank 33 into the second storage tank 43 via the supply path 5 is low, it takes a long time for the heating unit 44 to heat the coolant to a temperature of T-α (°C). For example, if the target temperature T of the chuck 1 is 30°C, the temperature of the coolant flowing from the storage tank 33 into the second storage tank 43 is -60°C, and the coolant in the second storage tank 43 is adjusted to 25°C, it is necessary to raise the temperature of the coolant by 85°C by heating with the heating unit 44.

[0033] On the other hand, the coolant flowing into the adjustment unit 48 from the recovery path 6 has been heated to a temperature of around 30°C by heat exchange in the chuck 1. Therefore, when the temperature of the heated coolant flowing in is around T (°C) and the measurement result of the temperature sensor 45 indicates that the temperature of the coolant in the second storage tank 43 is lower than T-α (°C), the adjustment unit 48 supplies the heated coolant flowing in to the second storage tank 43 via the adjustment path 47. The amount of coolant supplied to the second storage tank 43 can be adjusted based on the measurement result of the temperature sensor 45.

[0034] Specifically, when the adjustment unit 48 selects and switches the flow toward the second storage tank 43 via the adjustment path 47, or when it adjusts the proportion of the flow toward the second storage tank 43 via the adjustment path 47, the amount of coolant supplied to the second storage tank 43 can be adjusted based on the measurement results of the temperature sensor 45.

[0035] By supplying the heated cooling liquid to the second storage tank 43 via the adjustment unit 48 and the adjustment path 47, the heating time by the heating unit 44 until the cooling liquid in the second storage tank 43 is heated to T-α (°C) can be shortened, and the shortened heating time can reduce power consumption.

[0036] The fifth connecting portion 49 is detachably connectable to the other end of a first pipe member 61 that constitutes a part of the recovery path 6 through which the coolant flows into the cooling unit 30. The sixth connecting portion 50 is detachably connectable to the other end of a second pipe member 62 that constitutes a part of the supply path 5 through which the coolant flows out from the cooling unit 30. The seventh connecting portion 51 is detachably connectable to one end of a third pipe member 63 that causes the coolant to flow into the chuck 1. The third pipe member 63 constitutes a part of the supply path 5. The eighth connecting portion 52 is detachably connectable to one end of a fourth pipe member 64 through which the coolant flows out from the chuck 1. The fourth pipe member 64 constitutes a part of the recovery path 6.

[0037] The prober 10 has a third connecting portion 7 and a fourth connecting portion 8. The third connecting portion 7 can be detachably connected to the other end of the third pipe member 63. The fourth connecting portion 8 can be detachably connected to the other end of the fourth pipe member 64.

[0038] The cooling unit 30 and the circulation unit 40, which are connected by the first pipe member 61 and the second pipe member 62, can be separated by removing the first pipe member 61 and the second pipe member 62. The circulation unit 40 and the prober 10, which are connected by the third pipe member 63 and the fourth pipe member 64, can be separated by removing the third pipe member 63 and the fourth pipe member 64.

[0039] Therefore, for example, when the number of chips to be simultaneously measured on the wafer W increases and the cooling capacity of the cooling unit 30 becomes insufficient, it becomes possible to easily replace the cooling unit 30 with one having a higher cooling capacity. Furthermore, since the prober 10 and the circulation unit 40 are separable, this contributes to the miniaturization of the prober 10, and since there are no restrictions on the relative positions of the prober 10, the cooling unit 30, and the circulation unit 40, it becomes possible to install the cooling unit 30 and the circulation unit 40 in optimal positions depending on the surrounding conditions of the position where the prober 10 is installed.

[0040] [Control System of Temperature Adjustment System 20] Fig. 3 is a control block diagram of the temperature adjustment system 20. As shown in Fig. 3, the control unit CONT comprehensively controls the temperature adjustment system 20. The control unit CONT is composed of various arithmetic processing circuits including a central processing unit (CPU) not shown, and memories such as a read only memory (ROM) or a random access memory (RAM), and controls the temperature adjustment system 20 by the CPU executing a program stored in the memory.

[0041] The control unit CONT receives the temperature of the chuck 1 detected by the chuck temperature sensor 4, the temperature of the coolant stored in the storage tank 33 detected by the temperature monitoring sensor 34, and the temperature of the coolant stored in the second storage tank 43 measured by the temperature sensor 45.

[0042] The control unit CONT also controls the operation of the first pump 35 and the second pump 46. Furthermore, the control unit CONT controls the operation of the heater 2 and the adjustment unit 48 in accordance with the temperature of the chuck 1 detected by the chuck temperature sensor 4 and the temperature of the coolant stored in the second storage tank 43 measured by the temperature sensor 45. The control unit CONT also controls the operation of the refrigerator 31 and the switching unit 42 in accordance with the temperature of the coolant stored in the storage tank 33 detected by the temperature monitoring sensor 34.

[0043] The memory unit 80 stores a target temperature of the coolant stored in the storage tank 33, a target temperature T (°C) of the chuck 1, and a control constant map for feedback control of the output (W) of the heater 2 according to the target temperature T (°C). This control constant map is created, for example, by determining a control constant for each target temperature T (°C) in advance through experiments or the like. The memory unit 80 also stores values ​​such as the temperature of the coolant stored in the second storage tank 43, which is set according to the target temperature T (°C) of the chuck 1, the amount of heated coolant to be supplied to the second storage tank 43 via the adjustment unit 48 according to the measured temperature of the coolant in the second storage tank 43, and the drive amount of the adjustment unit 48.

[0044] Next, a method for adjusting the temperature of the chuck 1 in the temperature adjustment system 20 having the above configuration will be described.

[0045] In the cooling unit 30, the temperature of the coolant stored in the storage tank 33 is input to the control unit CONT from the temperature monitoring sensor 34. The control unit CONT controls the operation of the refrigerator 31 in accordance with the temperature of the coolant input from the temperature monitoring sensor 34, thereby adjusting the temperature of the coolant in the storage tank 33.

[0046] For example, before starting the temperature adjustment process for the chuck 1, the control unit CONT circulates the coolant in the storage tank 33 through the second circulation path R2 to cool it to a predetermined temperature. Specifically, the control unit CONT controls the switching unit 42 to switch the flow of the coolant that has flowed into the supply path 5 from the cooling unit 30 to the bypass path 41. As a result, the coolant circulating through the second circulation path R2 is not affected by the heat of the chuck 1, and is quickly cooled to a predetermined temperature by circulating through a flow path that is shorter than the first circulation path R1.

[0047] When the coolant in the storage tank 33 reaches a predetermined temperature, the control unit CONT controls the switching unit 42 to switch the flow of the coolant that has flowed in from the cooling unit 30 in the supply path 5 to the flow toward the chuck 1. As a result, the coolant cooled to the predetermined temperature in the storage tank 33 flows through the supply path 5 via the second pipe member 62 and the switching unit 42, and is supplied to the second storage tank 43 and stored therein.

[0048] If the cooling unit 30 does not include the storage tank 33, cooling of the coolant begins when temperature adjustment of the chuck 1 is started, which increases the time required for the coolant cooled to a predetermined temperature to be supplied to the second storage tank 43. In contrast, in this embodiment, the storage tank 33 is disposed on the coolant outlet side of the refrigerator 31, so that the coolant cooled to a predetermined temperature can be stored in the storage tank 33 in advance. Therefore, when temperature adjustment of the chuck 1 is started, the coolant cooled to a predetermined temperature can be immediately supplied to the second storage tank 43.

[0049] The control unit CONT heats the coolant using the heating unit 44 in accordance with the temperature of the coolant stored in the second storage tank 43 measured by the temperature sensor 45, and raises the temperature to T-α (°C). The coolant heated to T-α (°C) flows through the supply path 5 via the third pipe member 63 and is supplied to the coolant flow path 3 in the chuck 1. The temperature of the chuck 1 cooled by heat exchange with the coolant supplied to the coolant flow path 3 is detected by the chuck temperature sensor 4 and output to the control unit CONT. The control unit CONT heats the chuck 1 using the heater 2 in accordance with the detected temperature of the chuck 1, and raises the temperature to the target temperature T (°C).

[0050] The coolant, whose temperature has been increased by heat exchange with the chuck 1, flows through the recovery path 6 via the fourth pipe member 64 and the first pipe member 61, and is then cooled in the heat exchanger 32 and stored in the storage tank 33. That is, the coolant circulates through the first circulation path R1 to cool (adjust the temperature of) the chuck 1.

[0051] When the coolant circulates through the first circulation path R1, the control unit CONT determines, based on the temperature of the chuck 1 and the measurement result of the temperature sensor 45, that there is a large difference between the temperature of the coolant stored in the second storage tank 43 and the temperature T-α (°C) of the coolant supplied by the chuck 1, and controls the adjustment unit 48 to supply the heated coolant flowing in from the recovery path 6 to the second storage tank 43 via the adjustment path 47. The amount of heated coolant supplied to the second storage tank 43 is set to a value that will bring the coolant temperature to T-α (°C) when combined with the temperature rise of the coolant in the second storage tank 43 due to heating by the heating unit 44.

[0052] As a result, the coolant in the second storage tank 43 is heated to a temperature T-α (°C) in a short time and supplied to the chuck 1, compared to when the temperature is raised only by heating the heating unit 44 without the supply of heated coolant by the adjustment unit 48.

[0053] As described above, the cooling unit 30 and temperature adjustment system 20 of this embodiment are provided with a storage tank 33 that is arranged on the coolant outlet side of the refrigerator 31 and is capable of storing the coolant cooled by the refrigerator 31. Therefore, when temperature adjustment of the object to be cooled begins, coolant cooled to a predetermined temperature can be immediately supplied, making it possible to quickly cool the chuck 1 to be cooled.

[0054] Furthermore, in the cooling unit 30 and the temperature adjustment system 20 of this embodiment, the switching unit 42 switches between a first circulation path R1, in which the coolant circulates through the supply path 5, the chuck 1, and the recovery path 6 without passing through the bypass path 41, and a second circulation path R2, in which the coolant circulates through the supply path 5, the bypass path 41, and the recovery path 6 without passing through the chuck 1. Therefore, before the temperature adjustment process of the cooling object, the coolant is circulated through the second circulation path R2 to cool it to a predetermined temperature in advance, and then the coolant is circulated through the first circulation path R1 to adjust the temperature of the cooling object, thereby enabling the temperature adjustment process to be performed efficiently.

[0055] Furthermore, in the cooling unit 30 and temperature adjustment system 20 of this embodiment, the heated cooling liquid flowing in from the recovery path 6 is supplied to the second storage tank 43 via the adjustment path 47 by the adjustment section 48, so that the cooling liquid stored in the second storage tank 43 can be heated to a temperature T-α (°C) at which it is supplied to the chuck 1 in a short time, and power consumption can be reduced by shortening the heating time by the heating section 44.

[0056] [Second Embodiment of Temperature Adjustment System 20] Next, a second embodiment of the temperature adjustment system 20 will be described with reference to Fig. 4. In this figure, elements that are the same as the components of the first embodiment shown in Figs. 1 to 3 are given the same reference numerals, and descriptions thereof will be omitted.

[0057] In the temperature adjustment system 20 of the first embodiment described above, a configuration in which one set having a prober 10 and a circulation unit 40 that can be separated from each other is provided for one cooling unit 30 is exemplified. In this embodiment, however, a configuration in which two sets having a prober 10 and a circulation unit 40 that can be separated from each other is described.

[0058] Fig. 4 is a diagram showing a schematic configuration of a temperature adjustment system according to the second embodiment. As shown in Fig. 4, the temperature adjustment system 20 of this embodiment is provided with two groups, namely, a first group G1 including a prober 10 and a circulation unit 40, and a second group G2 including a prober 10 and a circulation unit 40. The prober 10 and the circulation unit 40 of the first group G1 are the prober 10 and the circulation unit 40 described in the first embodiment.

[0059] In the prober 10 and circulation unit 40 of the second group G2, the coolant cooled in the cooling unit 30 is supplied to the chuck 1 through the supply path 5A of the second group G2. In the prober 10 and circulation unit 40 of the second group G2, the coolant flowing out of the chuck 1 is collected in the cooling unit 30 through the collection path 6A.

[0060] The cooling unit 30 of this embodiment has a merging path 81 , a branching path 82 , a ninth connecting portion 38 , and a tenth connecting portion 39 .

[0061] The junction flow path 81 merges at one end with the recovery path 6 in the cooling unit 30. The junction flow path 81 constitutes the recovery path 6A in the second group G2. The ninth connecting part 38 is connected to the other end of the junction flow path 81. The ninth connecting part 38 is detachably connectable to one end of a fifth pipe member 65, which allows the coolant to flow in from the circulation unit 40 in the second group. The fifth pipe member 65 constitutes a part of the recovery path 6A.

[0062] One end of the branch path 82 branches off from the supply path 5 in the cooling unit 30. The branch path 82 branches off from the supply path 5 between the first pump 35 and the second connecting part 37. The branch path 82 constitutes part of the supply path 5A in the second set G2. The tenth connecting part 39 is connected to the other end of the branch path 82. The tenth connecting part 39 is detachably connectable to one end of a sixth pipe member 66 that outputs coolant to the circulation unit 40 in the second set. The sixth pipe member 66 constitutes part of the supply path 5A.

[0063] The circulation unit 40 of the second group G2 has an eleventh connecting portion 49A, a twelfth connecting portion 50A, a thirteenth connecting portion 51A, and a fourteenth connecting portion 52A.

[0064] The eleventh connecting portion 49A can be detachably connected to the other end of the fifth pipe member 65. The twelfth connecting portion 50A can be detachably connected to the other end of the sixth pipe member 66. The thirteenth connecting portion 51A can be detachably connected to one end of a seventh pipe member 67 that allows coolant to flow into the chuck 1 in the second set. The seventh pipe member 67 forms part of the supply path 5A. The fourteenth connecting portion 52A can be detachably connected to one end of an eighth pipe member 68 that allows coolant to flow out of the chuck 1 in the second set. The eighth pipe member 68 forms part of the recovery path 6A.

[0065] The prober 10 of the second group G2 has a fifteenth connecting portion 7A and a sixteenth connecting portion 8A. The fifteenth connecting portion 7A is detachably connectable to the other end of the seventh pipe member 67. The sixteenth connecting portion 8A is detachably connectable to the other end of the eighth pipe member 68. The other configurations are the same as those of the first embodiment.

[0066] In the temperature adjustment system 20 configured as described above, similarly to the first embodiment, the coolant cooled in advance to a predetermined temperature in the storage tank 33 in the cooling unit 30 is supplied to the chucks 1 of the first set G1 via the supply path 5 to adjust the temperature, and is also supplied to the chucks 1 of the second set G2 via the supply path 5A to adjust the temperature. The coolant flowing out from the chucks 1 of the first set G1 is collected in the cooling unit 30 via the recovery path 6. The coolant flowing out from the chucks 1 of the second set G2 is collected in the cooling unit 30 via the recovery path 6A. The coolant collected in the cooling unit 30 is cooled in the refrigerator 31 and the heat exchanger 32.

[0067] That is, the coolant that has been cooled to a predetermined temperature in advance in the storage tank 33 is supplied independently to each of the plurality of sets and is collected in the cooling unit 30, respectively.

[0068] In the cooling unit 30 and temperature adjustment system 20 of this embodiment, in addition to obtaining the same functions and effects as those of the first embodiment, it is possible to simultaneously adjust the temperatures of multiple chucks 1 within the range allowed for the cooling capacity of the refrigerator 31 and heat exchanger 32, thereby making it possible to reduce the size of the temperature adjustment system 20, improve the efficiency of the temperature adjustment process, and reduce the price.

[0069] Furthermore, in the cooling unit 30 and temperature adjustment system 20 of this embodiment, the cooling unit 30, the two probers 10, and the two circulation units 40 can be separated from the first pipe member 61 via the eighth pipe member 68, which contributes to miniaturizing the prober 10 and, since there are no restrictions on the relative positions of the two probers 10, the cooling unit 30, and the two circulation units 40, it becomes possible to install the cooling unit 30 and the circulation unit 40 in the optimal position depending on the surrounding conditions of the location where the prober 10 is installed.

[0070] While the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to these examples. The shapes and combinations of the components shown in the above examples are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention.

[0071] For example, in the above embodiment, a configuration in which two sets of probers 10 and circulation units 40 that can be separated from each other are provided for one cooling unit 30 is exemplified, but this configuration is not limited to this, and a configuration in which three or more sets of probers 10 and circulation units 40 are provided depending on the cooling capacity of the cooling unit 30 may also be used.

[0072] 1...chuck, 5...supply path, 6...recovery path, 7...third connection portion, 7A...fifteenth connection portion, 8...fourth connection portion, 8A...sixteenth connection portion, 10...prober, 20...temperature adjustment system, 30...cooling unit, 31...refrigerator, 33...storage tank, 36...first connection portion, 37...second connection portion, 38...ninth connection portion, 39...tenth connection portion, 40...circulation unit, 41...bypass path, 42...switching portion, 43...second storage tank, 44...heating portion, 45...temperature sensor, 47...adjustment path, 48...adjustment portion, 49...fifth connecting portion, 49A...eleventh connecting portion, 50...sixth connecting portion, 50A...twelfth connecting portion, 51...seventh connecting portion, 51A...thirteenth connecting portion, 52...eighth connecting portion, 52A...fourteenth connecting portion, 55...first connecting portion, 56...second connecting portion, 61...first pipe member, 62...second pipe member, 63...third pipe member, 64...fourth pipe member, 65...fifth pipe member, 66...sixth pipe member, 67...seventh pipe member, 68...eighth pipe member, 81...merging path, 82...branching path, R1...first circulation path, R2...second circulation path

Claims

1. A temperature adjustment system for a prober having a chuck for holding a wafer, comprising: a cooling unit having a refrigerator for cooling a cooling liquid that flows in, and a storage tank that is arranged on the outlet side of the refrigerator for the cooling liquid and is capable of storing the cooling liquid cooled by the refrigerator; a supply path that supplies the cooling liquid cooled by the cooling unit to the chuck; a recovery path that recovers the cooling liquid that flows out of the chuck to the cooling unit; a bypass path that connects the supply path and the recovery path; and a switching unit that is provided at a first connecting portion of the supply path and the bypass path and switches between a first circulation path that circulates the cooling liquid cooled by the cooling unit through the supply path, the chuck, and the recovery path without passing through the bypass path, and a second circulation path that circulates the cooling liquid cooled by the cooling unit through the supply path, the bypass path, and the recovery path without passing through the chuck.

2. The temperature adjustment system according to claim 1, comprising: a second storage tank arranged closer to the chuck than the first connection portion in the supply path and capable of storing the cooling liquid supplied through the supply path; a heating portion that heats the cooling liquid stored in the second storage tank; and a temperature sensor that measures the temperature of the cooling liquid stored in the second storage tank.

3. A temperature adjustment system as described in claim 2, further comprising an adjustment unit that is arranged on the recovery path closer to the chuck than a second connection point between the recovery path and the bypass path, and that is connected to the second storage tank via an adjustment path, and the adjustment unit adjusts the amount of the cooling liquid that flows in from the recovery path and is supplied to the second storage tank via the adjustment path based on the temperature of the chuck and the measurement results of the temperature sensor.

4. The temperature adjustment system according to claim 3, comprising: a prober having the chuck; and a circulation unit having the bypass path, the switching unit, the second storage tank, the heating unit, the temperature sensor, the adjustment unit and the adjustment path, and arranged separably from the prober and the cooling unit.

5. The temperature adjustment system according to claim 4, wherein a plurality of sets each having a prober and a circulation unit that can be separated from each other are provided, and the cooling liquid cooled by the cooling unit is supplied independently to each of the plurality of sets and is collected by each of the cooling units.

6. A cooling unit that cools the cooling liquid that has flowed in and a prober having a chuck are separably provided, respectively, with a part of a supply path through which the cooling liquid cooled by the cooling unit is supplied to the chuck, and a part of a recovery path through which the cooling liquid flowing out of the chuck is recovered into the cooling unit, a bypass path that connects the part of the supply path and the part of the recovery path, a switching unit that is provided at a first connection part between the part of the supply path and the bypass path and switches between a first circulation path through which the cooling liquid cooled by the cooling unit circulates through the supply path, the chuck, and the recovery path without passing through the bypass path, and a second circulation path through which the cooling liquid cooled by the cooling unit circulates through the supply path, the bypass path, and the recovery path without passing through the chuck, a second storage tank that is located closer to the chuck than the first connection part in the part of the supply path and is capable of storing the cooling liquid supplied through the supply path, and a heating unit that heats the cooling liquid stored in the second storage tank. a temperature sensor that measures the temperature of the cooling liquid stored in the second storage tank.

7. A circulation unit as described in claim 6, comprising an adjustment unit that is arranged closer to the chuck than a second connection between a part of the recovery path and the bypass path and is connected to the second storage tank via an adjustment path, and the adjustment unit adjusts the amount of the cooling liquid that flows in from the recovery path and is supplied to the second storage tank via the adjustment path based on the temperature of the chuck and the measurement result of the temperature sensor.

Citation Information

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