Antenna module

Abstract

The present disclosure presents an antenna module in which a radiation pattern of a first antenna substrate is formed as a cross-sectional pattern, and the radiation pattern of the first antenna substrate is connected to a terminal pattern through a connection pattern of a second antenna substrate, thereby reducing manufacturing costs of the antenna module.

Description

antenna module

[0001] The present invention relates to an antenna module comprising two or more antennas that resonate with signals of different frequency bands.

[0002] Beyond basic calling functions, mobile devices are increasingly embracing essential features like short-range communication and wireless charging. Accordingly, mobile devices are increasingly equipped with antennas for short-range communication and wireless charging.

[0003] Because mobile devices have limited mounting space, it's difficult to mount multiple independent antennas. Therefore, to minimize mounting space, antenna modules combining two or more antennas are being mounted on mobile devices. For example, mobile devices are equipped with antenna modules that combine a near-field communication (NFC) antenna and a wireless power conversion (WPC) antenna for wireless charging.

[0004] As competition among mobile terminal manufacturers has intensified recently, they are developing various technologies to reduce costs and are demanding that antenna manufacturers develop antenna modules that can maintain antenna performance while reducing costs.

[0005] The matters described in the background art above are intended to help understand the background of the invention and may include matters that are not publicly disclosed prior art.

[0006] The present invention has been proposed in consideration of the above circumstances, and aims to provide an antenna module in which the radiation pattern of a first antenna substrate is formed as a cross-sectional pattern, and the radiation pattern of the first antenna substrate is connected to a terminal pattern through a connection pattern of a second antenna substrate, thereby reducing the manufacturing cost of the antenna module.

[0007] In order to achieve the above object, an antenna module according to an embodiment of the present invention includes a first antenna substrate having a first radiation pattern resonating with a signal of a first frequency band, a first terminal pattern and a second terminal pattern spaced apart from each other, and a second antenna substrate having a second radiation pattern resonating with a signal of a second frequency band different from the first frequency band, and bonded to a first surface of the first antenna substrate, wherein a first end of the first radiation pattern is connected to the first terminal pattern, and a second end of the second radiation pattern is bonded to the second antenna substrate and connected to the second terminal pattern.

[0008] The second antenna substrate further includes a connection pattern, and a second end of the first radiation pattern can be joined to the connection pattern and connected to the second terminal pattern.

[0009] The first antenna substrate further includes a first base substrate having a first side and a second side, and the first radiation pattern may be a cross-sectional pattern disposed on the first side of the first base substrate.

[0010] The first antenna substrate may further include a first terminal pattern disposed on a first surface of the first base substrate and connected to a first end of the first radiation pattern, a second terminal pattern disposed on the first surface of the first base substrate but spaced apart from the first terminal pattern, a first bonding pattern disposed on the first surface of the first base substrate and connected to a second end of the first radiation pattern, and a second bonding pattern disposed on the first surface of the first base substrate but spaced apart from the first bonding pattern and connected to the second terminal pattern. At this time, the first bonding pattern and the second bonding pattern may be configured to be bonded to the bonding pattern of the second antenna substrate to connect the second end of the first radiation pattern to the second terminal pattern.

[0011] The first antenna substrate may be disposed on a first surface of the first base substrate and may further include a first connection pattern connecting the second terminal pattern and the second bonding pattern.

[0012] The first antenna substrate may further include a third terminal pattern disposed on a first surface of the first base substrate and spaced apart from the first terminal pattern and the second terminal pattern, a fourth terminal pattern disposed on the first surface of the first base substrate and spaced apart from the first terminal pattern to the third terminal pattern, a third bonding pattern disposed on the first surface of the first base substrate and connected to the third terminal pattern and configured to be connected to a second end of the second radiation pattern, and a fourth bonding pattern disposed on the first surface of the first base substrate and connected to the fourth terminal pattern and configured to be connected to a second end of the second radiation pattern.

[0013] The first antenna substrate may further include a second connection pattern disposed on a first surface of the first base substrate and connecting a third terminal pattern and a third bonding pattern, and a third connection pattern disposed on the first surface of the first base substrate and connecting a fourth terminal pattern and a fourth bonding pattern.

[0014] The second antenna substrate may include a second base substrate having a second radiation pattern formed thereon, a fifth bonding pattern disposed on the second base substrate and connected to a first end of the second radiation pattern, and a sixth bonding pattern disposed on the second base substrate and connected to a second end of the second radiation pattern. In this case, the fifth bonding pattern may be bonded to a third bonding pattern to connect the first end of the second radiation pattern to a third terminal pattern, and the sixth bonding pattern may be bonded to a fourth bonding pattern to connect the second end of the second radiation pattern to the fourth terminal pattern.

[0015] According to the present invention, the antenna module has the effect of reducing the manufacturing cost of the antenna module compared to a general antenna module composed of a double-sided printed circuit board by configuring the first antenna substrate as a single-sided printed circuit board.

[0016] In addition, the antenna module has the effect of simplifying the pattern of the first antenna substrate by configuring the first radiation pattern of the first antenna substrate as a cross-sectional pattern and connecting the second end of the first radiation pattern to the second terminal pattern through the fourth connection pattern of the second antenna substrate, compared to a conventional antenna module that uses a double-sided pattern in the first antenna substrate.

[0017] In addition, the antenna module has the effect of reducing the manufacturing cost compared to a conventional antenna module that uses a double-sided pattern on the first antenna substrate by simplifying the pattern of the first antenna substrate by configuring the first radiation pattern of the first antenna substrate as a cross-sectional pattern and connecting the second end of the first radiation pattern to the second terminal pattern through the fourth connection pattern of the second antenna substrate.

[0018] FIG. 1 is a drawing for explaining an antenna module according to an embodiment of the present invention.

[0019] Fig. 2 is a drawing for explaining the first antenna substrate of Fig. 1.

[0020] FIG. 3 is a drawing showing the first side of the second antenna substrate of FIG. 1.

[0021] FIG. 4 is a drawing showing the second side of the second antenna substrate of FIG. 1.

[0022] FIG. 5 is a drawing for explaining the bonding of the first antenna substrate and the second antenna substrate of FIG. 1.

[0023] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0024] These examples are provided to more fully illustrate the present invention to those skilled in the art. The following examples may be modified in various ways, and the scope of the present invention is not limited to the examples described below. Rather, these examples are provided to further faithfully and completely convey the spirit of the present invention.

[0025] The terms used herein are used to describe specific embodiments and are not intended to limit the present invention. Furthermore, the singular forms used herein may include the plural forms, unless the context clearly dictates otherwise.

[0026] In the description of the embodiments, when each layer (film), region, pattern or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad or pattern, "on" and "under" include both being formed "directly" or "indirectly" through another layer. In addition, the reference for above or below each layer is, in principle, based on the drawing.

[0027] The drawings are intended solely to facilitate understanding of the invention and should not be construed as limiting the scope of the invention. Furthermore, relative thicknesses, lengths, and sizes in the drawings may be exaggerated for convenience and clarity of explanation.

[0028] Referring to FIG. 1, an antenna module according to an embodiment of the present invention is configured to include a first antenna substrate (100) and a second antenna substrate (200).

[0029] The first antenna substrate (100) is configured to operate as an antenna resonating in a first frequency band. As an example, the first antenna substrate (100) operates as an antenna resonating in a near field communication (NFC) frequency band.

[0030] Referring to FIG. 2, the first antenna substrate (100) is configured to include a first base substrate (110), a first radiation pattern (120), a plurality of terminal patterns (132, 134, 136, 138), a plurality of bonding patterns (142, 144, 146, 148), and a plurality of connection patterns (152, 154, 156).

[0031] The first base substrate (110) is a plate-shaped substrate having a first surface and a second surface opposite the first surface. A radiation area (A) and a terminal area (B) can be defined on the first surface of the first base substrate (110).

[0032] As an example, the first base substrate (110) is a printed circuit board having a first radiation pattern (120), a plurality of terminal patterns (132, 134, 136, 138), a plurality of bonding patterns (142, 144, 146, 148), and a plurality of connection patterns (152, 154, 156) printed on the first surface.

[0033] The first radiation pattern (120) is arranged on the first surface of the first base substrate (110). The first radiation pattern (120) is arranged in the radiation area (A) of the first base substrate (110). The first radiation pattern (120) may be a loop pattern formed in a loop shape that winds on the first surface of the first base substrate (110).

[0034] The first end of the first radiation pattern (120) is connected to the first terminal pattern (132). The second end of the first radiation pattern (120) is arranged in the inner peripheral region of the loop formed by the first radiation pattern (120) and is electrically connected to the first bonding pattern (142).

[0035] In this way, the antenna module according to an embodiment of the present invention can reduce the manufacturing cost of the antenna module compared to a general antenna module composed of a double-sided printed circuit board by configuring the first antenna substrate (100) as a single-sided printed circuit board.

[0036] The first terminal pattern (132) is arranged on the first surface of the first base substrate (110). The first terminal pattern (132) is arranged in the terminal area (B) of the first base substrate (110). The first terminal pattern (132) is electrically connected to the first end of the first radiation pattern (120).

[0037] The second terminal pattern (134) is arranged on the first surface of the first base substrate (110). The second terminal pattern (134) is arranged in the terminal area (B) of the first base substrate (110), but is arranged so as to be spaced apart from the first terminal pattern (132) by a predetermined distance. The second terminal pattern (134) is electrically connected to the first end of the first connection pattern (152) to be described later.

[0038] The third terminal pattern (136) is arranged on the first surface of the first base substrate (110). The third terminal pattern (136) is arranged in the terminal area (B) of the first base substrate (110), and is arranged so as to be interposed between the first terminal pattern (132) and the second terminal pattern (134). The third terminal pattern (136) is arranged so as to be spaced apart from the first terminal pattern (132) and the second terminal pattern (134). The third terminal pattern (136) is electrically connected to the first end of the second connection pattern (154) to be described later.

[0039] The fourth terminal pattern (138) is arranged on the first surface of the first base substrate (110). The fourth terminal pattern (138) is arranged in the terminal area (B) of the first base substrate (110), but is arranged to be spaced apart from the third terminal pattern (136). The second terminal pattern (134) is arranged in the space between the third terminal pattern (136) and the fourth terminal pattern (138). The fourth terminal pattern (138) is electrically connected to the first end of the third connection pattern (156) to be described later.

[0040] The first bonding pattern (142) is arranged on the first surface of the first base substrate (110). The first bonding pattern (142) is arranged in the radiation area (A) of the first base substrate (110), and is arranged in the inner peripheral area of ​​the loop formed by the first radiation pattern (120). The first bonding pattern (142) is electrically connected to the second end of the first radiation pattern (120).

[0041] The second bonding pattern (144) is arranged on the first surface of the first base substrate (110). The first bonding pattern (142) is arranged in the terminal area (B) of the first base substrate (110) and is electrically connected to the second end of the first connection pattern (152).

[0042] The first bonding pattern (142) and the second bonding pattern (144) are patterns to which a connection pattern (the fourth connection pattern (250) to be described later) is bonded to electrically connect the second end of the first radiation pattern (120) to the second terminal pattern (134).

[0043] The third bonding pattern (146) is disposed on the first surface of the first base substrate (110), and is disposed in an area between the first bonding pattern (142) and the second bonding pattern (144). The third bonding pattern (146) is disposed in the radiation area (A) of the first base substrate (110), and is disposed in an outer peripheral area of ​​the loop formed by the first radiation pattern (120). The third bonding pattern (146) may also be disposed in the terminal area (B) of the first base substrate (110). The third bonding pattern (146) is electrically connected to the second end of the second connection pattern (154).

[0044] The fourth bonding pattern (148) is arranged on the first surface of the first base substrate (110). The fourth bonding pattern (148) is arranged in the terminal region (B) of the first base substrate (110), but is arranged to be spaced apart from the third bonding pattern (146). At this time, the second bonding pattern (144) is arranged in the spaced region between the third bonding pattern (146) and the fourth bonding pattern (148), and the second bonding pattern (144) is interposed between the third bonding pattern (146) and the fourth bonding pattern (148). The fourth bonding pattern (148) is electrically connected to the second end of the third connection pattern (156).

[0045] The third bonding pattern (146) and the fourth bonding pattern (148) are patterns for electrically connecting both ends of the radiation pattern of the second antenna substrate (200) to the third terminal pattern (136) and the fourth terminal pattern (138), respectively.

[0046] A first connection pattern (152) is disposed on a first surface of a first base substrate (110). The first connection pattern (152) is disposed in a terminal region (B) of the first base substrate (110). The first connection pattern (152) is a conductive pattern that electrically connects a second terminal pattern (134) and a second bonding pattern (144). A first end of the first connection pattern (152) is electrically connected to the second terminal pattern (134), and a second end of the first connection pattern (152) is electrically connected to the second bonding pattern (144).

[0047] The second connection pattern (154) is arranged on the first surface of the first base substrate (110). The second connection pattern (154) is arranged in the terminal region (B) of the first base substrate (110), but is arranged to be spaced apart from the first connection pattern (152). The second connection pattern (154) is a conductive pattern that electrically connects the third terminal pattern (136) and the third bonding pattern (146). The first end of the second connection pattern (154) is electrically connected to the third terminal pattern (136), and the second end of the second connection pattern (154) is electrically connected to the third bonding pattern (146).

[0048] A third connection pattern (156) is arranged on a first surface of a first base substrate (110). The third connection pattern (156) is arranged in a terminal region (B) of the first base substrate (110), and is arranged to be spaced apart from the second connection pattern (154). A first connection pattern (152) is arranged in a spaced region between the second connection pattern (154) and the third connection pattern (156), and the first connection pattern (152) is arranged to be interposed between the second connection pattern (154) and the third connection pattern (156). The third connection pattern (156) is a conductive pattern that electrically connects the fourth terminal pattern (138) and the fourth bonding pattern (148). A first end of the third connection pattern (156) is electrically connected to the fourth terminal pattern (138), and a second end of the third connection pattern (156) is electrically connected to the fourth bonding pattern (148).

[0049] The second antenna substrate (200) is configured to operate as an antenna that resonates in a second frequency band different from the first frequency band. As an example, the second antenna substrate (200) operates as an antenna that resonates in a wireless power transmission (WPC) frequency band.

[0050] Referring to FIGS. 3 and 4, the second antenna substrate (200) is configured to include a second base substrate (210), a second radiation pattern (220), a plurality of bonding patterns (230, 240), and a fourth connection pattern (250).

[0051] The second base substrate (210) is a plate-shaped substrate having a first side and a second side. As an example, the second base substrate (210) is a circular printed circuit board.

[0052] The second base substrate (210) may have a pattern area (C) and a bonding area (D) defined. The pattern area (C) is an area where the second radiation pattern (220) is formed. The bonding area (D) is an area protruding outward from the pattern area (C) and is an area that overlaps the first antenna substrate (100) when bonding the first antenna substrate (100) and the second antenna substrate (200).

[0053] The second radiation pattern (220) is formed on the first surface and the second surface of the second base substrate (210). The second radiation pattern (220) may include a loop pattern formed on the first surface of the second base substrate (210) and a loop pattern formed on the second surface of the second base substrate (210). The two loop patterns are electrically connected through a via hole to form the second radiation pattern (220) and are configured to resonate with a signal of a second frequency band. In this case, the second frequency band is, for example, a wireless power transmission (WPC) frequency band.

[0054] The fifth bonding pattern (230) is composed of two patterns formed on the first and second surfaces of the second base substrate (210). The fifth bonding pattern (230) is arranged in the bonding area (D) of the second base substrate (210), but is arranged so as to be spaced apart from the sixth bonding pattern (240). The fifth bonding pattern (230) is electrically connected to the first end of the second radiation pattern (220).

[0055] The sixth bonding pattern (240) is composed of two patterns formed on the first and second surfaces of the second base substrate (210). The sixth bonding pattern (240) is arranged in the bonding area (D) of the second base substrate (210), but is arranged so as to be spaced apart from the fifth bonding pattern (230). The sixth bonding pattern (240) is electrically connected to the second end of the second radiation pattern (220).

[0056] The fourth connection pattern (250) is composed of two patterns formed on the first and second surfaces of the second base substrate (210). The fourth connection pattern (250) can be formed as a pattern in which two spaced circular patterns are connected through a linear pattern.

[0057] The fourth connecting pattern (250) may be formed by two patterns formed on the first surface and the second surface having different shapes. The fourth connecting pattern (250) may be configured to include two circular patterns spaced apart on the first surface of the second base substrate (210) and a pattern in which circular patterns are arranged at both ends of a linear pattern on the second surface of the second base substrate (210). At this time, the circular patterns formed on the first surface and the second surface of the second base substrate (210) are arranged to overlap each other with the second base substrate (210) interposed therebetween.

[0058] Referring to FIG. 5, the second antenna substrate (200) is placed on the first surface of the first antenna substrate (100). The second antenna substrate (200) is placed so that the bonding area (D) overlaps with the first antenna substrate (100) and is bonded to the first antenna.

[0059] When the first antenna substrate (100) and the second antenna substrate (200) are bonded, the fifth bonding pattern (230) is bonded to the third bonding pattern (146) of the first antenna substrate (100). The sixth bonding pattern (240) is bonded to the fourth bonding pattern (148) of the first antenna substrate (100).

[0060] Accordingly, the first end of the second radiation pattern (220) is electrically connected to the third terminal pattern (136) through the fifth bonding pattern (230), the third bonding pattern (146), and the second connection pattern (154), and the second end of the second radiation pattern (220) is electrically connected to the fourth terminal pattern (138) through the sixth bonding pattern (240), the fourth bonding pattern (148), and the third connection pattern (156).

[0061] When the first antenna substrate (100) and the second antenna substrate (200) are bonded, the fourth connection pattern (250) is bonded to the first bonding pattern (142) and the second bonding pattern (144). The first end of the fourth connection pattern (250) is bonded to the first bonding pattern (142), and the second end of the fourth connection pattern (250) is bonded to the second bonding pattern (144).

[0062] Accordingly, the second end of the first radiation pattern (120) is electrically connected to the second terminal pattern (134) through the first bonding pattern (142), the fourth bonding pattern (148), and the second bonding pattern (144).

[0063] As described above, the antenna module according to the embodiment of the present invention configures the first radiation pattern (120) of the first antenna substrate (100) as a cross-sectional pattern, and connects the second end of the first radiation pattern (120) to the second terminal pattern (134) through the fourth connection pattern (250) of the second antenna substrate (200), thereby simplifying the pattern of the first antenna substrate (100) compared to a conventional antenna module that uses a double-sided pattern on the first antenna substrate (100).

[0064] In addition, the antenna module according to an embodiment of the present invention configures the first radiation pattern (120) of the first antenna substrate (100) as a cross-sectional pattern, and connects the second end of the first radiation pattern (120) to the second terminal pattern (134) through the fourth connection pattern (250) of the second antenna substrate (200), thereby simplifying the pattern of the first antenna substrate (100), thereby reducing the manufacturing cost compared to a conventional antenna module that uses a double-sided pattern on the first antenna substrate (100).

[0065] The above description is merely an illustrative illustration of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A first antenna substrate having a first radiation pattern resonating with a signal of a first frequency band, a first terminal pattern and a second terminal pattern spaced apart from each other; and A second antenna substrate having a second radiation pattern that resonates with a signal of a second frequency band different from the first frequency band, and comprising a second antenna substrate bonded to the first surface of the first antenna substrate, An antenna module in which a first end of the first radiation pattern is connected to the first terminal pattern, and a second end of the second radiation pattern is bonded to the second antenna substrate and connected to the second terminal pattern.

2. In paragraph 1, The second antenna substrate further includes a connection pattern, An antenna module in which the second end of the first radiation pattern is joined to the connection pattern and connected to the second terminal pattern.

3. In paragraph 1, The above first antenna substrate is, Further comprising a first base substrate having a first side and a second side, An antenna module in which the first radiation pattern is a cross-sectional pattern arranged on the first surface of the first base substrate.

4. In paragraph 3, The above first antenna substrate is, A first terminal pattern disposed on a first surface of the first base substrate and connected to a first end of the first radiation pattern; A second terminal pattern arranged on the first surface of the first base substrate but spaced apart from the first terminal pattern; A first bonding pattern disposed on a first surface of the first base substrate and connected to a second end of the first radiation pattern; and An antenna module further comprising a second bonding pattern disposed on the first surface of the first base substrate and spaced apart from the first bonding pattern, and connected to the second terminal pattern.

5. In paragraph 4, An antenna module configured such that the first bonding pattern and the second bonding pattern are bonded to a connection pattern of the second antenna substrate to connect a second end of the first radiation pattern to the second terminal pattern.

6. In paragraph 4, The above first antenna substrate is, An antenna module further comprising a first connection pattern disposed on a first surface of the first base substrate and connecting the second terminal pattern and the second bonding pattern.

7. In paragraph 4, The above first antenna substrate is, A third terminal pattern arranged on the first surface of the first base substrate, but spaced apart from the first terminal pattern and the second terminal pattern; A fourth terminal pattern arranged on the first surface of the first base substrate, but spaced apart from the first terminal pattern to the third terminal pattern; A third bonding pattern arranged on the first surface of the first base substrate and connected to the third terminal pattern and configured to be connected to the second end of the second radiation pattern; and An antenna module further comprising a fourth bonding pattern arranged on the first surface of the first base substrate and connected to the fourth terminal pattern and configured to be connected to the second end of the second radiation pattern.

8. In paragraph 7, The above first antenna substrate is, A second connection pattern arranged on the first surface of the first base substrate and connecting the third terminal pattern and the third bonding pattern; and An antenna module further comprising a third connection pattern disposed on a first surface of the first base substrate and connecting the fourth terminal pattern and the fourth bonding pattern.

9. In paragraph 7, The above second antenna substrate is, A second base substrate on which the second radiation pattern is formed; A fifth bonding pattern disposed on the second base substrate and connected to the first end of the second radiation pattern; and An antenna module comprising a sixth bonding pattern disposed on the second base substrate and connected to the second end of the second radiation pattern.

10. In paragraph 9, The fifth bonding pattern is bonded to the third bonding pattern to connect the first end of the second radiation pattern to the third terminal pattern, An antenna module in which the sixth bonding pattern is bonded to the fourth bonding pattern and connects the second end of the second radiation pattern to the fourth terminal pattern.

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