Image sensor module and camera module including same

Abstract

An image sensor module according to an embodiment of the present invention includes a first substrate; an image sensor disposed on the first substrate; and a second substrate disposed on the first substrate, wherein the second substrate includes a hole corresponding to the image sensor.

Description

Image sensor module and camera module including the same

[0001] The present invention relates to an image sensor module and a camera module including the same.

[0002] ADAS (Advanced Driving Assistance System) is an advanced driver assistance system that assists the driver in driving. It consists of sensing the situation ahead, judging the situation based on the sensed results, and controlling the vehicle's behavior based on the situation judgment. For example, ADAS sensor devices detect a vehicle ahead and recognize lanes. After the target lane, target speed, and forward target are determined, the vehicle's ESC (Electrical Stability Control), EMS (Engine Management System), and MDPS (Motor Driven Power Steering) are controlled. Representative examples of ADAS can be implemented as automatic parking systems, low-speed city driving assistance systems, and blind spot warning systems.

[0003] Sensor devices for detecting the situation ahead in ADAS include GPS sensors, laser scanners, forward radar, Lidar, etc., and the most representative one is a camera for taking pictures of the front, rear, and sides of the vehicle.

[0004] These cameras can be placed outside or inside a vehicle to detect the vehicle's surroundings. Furthermore, the cameras can be placed inside the vehicle to detect the driver and passengers. For example, the camera can photograph the driver from a position adjacent to the driver and detect the driver's health, drowsiness, and drinking status. Furthermore, the camera can photograph the passenger from a position adjacent to the passenger and detect the passenger's sleepiness, health, and other conditions, and provide the driver with information about the passenger.

[0005] When an image sensor module within a camera module uses two or more substrates, a separate sensor base component is used for wire protection and light transmission characteristic correction. However, using separate components requires precise tolerances for precise assembly, and achieving these precise tolerances requires the use of expensive tools.

[0006] The technical problem to be solved by the present invention is to provide an image sensor module and a camera module including the same.

[0007] In order to solve the above technical problem, an image sensor module according to the present embodiment includes a first substrate; an image sensor disposed on the first substrate; and a second substrate disposed on the first substrate, wherein the second substrate includes a hole corresponding to the image sensor.

[0008] The above first substrate and the above second substrate can be electrically connected through soldering.

[0009] The first substrate and the second substrate each include one side and a second side opposite the first side, and the first side of the first substrate and the second side of the second substrate facing the first side include electric pads at corresponding positions.

[0010] The first substrate and the second substrate each include one side and another side opposite the one side, and the one side of the second substrate includes a mounting portion forming a step with the hole, and a filter can be placed on the mounting portion.

[0011] The first substrate and the second substrate each include one side and a second side opposite the first side, and an electronic component may be arranged on at least one of the first side of the second substrate and the first side and the second side of the first substrate.

[0012] The above-mentioned second substrate can be connected to a connector.

[0013] The above image sensor can be wire-connected to the pad area of ​​the above surface of the first substrate.

[0014] In order to solve the above technical problem, an image sensor module according to another embodiment of the present invention includes a first substrate; a first image sensor disposed on the first substrate; a second image sensor disposed on the first substrate; and a second substrate disposed on the first substrate, wherein the second substrate includes a first hole corresponding to the first image sensor and a second hole corresponding to the second image sensor.

[0015] The above first substrate and the above second substrate can be electrically connected through soldering.

[0016] The first substrate and the second substrate each include one side and another side opposite the one side, and the one side of the second substrate includes a first mounting portion forming a step with the first hole and a second mounting portion forming a step with the second hole, and a first filter may be arranged on the first mounting portion and a second filter may be arranged on the second mounting portion.

[0017] According to this embodiment, the sensor base supporting the filter (Glass) can be deleted through the stacked structure of multiple substrates, and the FPCB connecting the multiple substrates can be deleted, which is advantageous for reducing unit cost.

[0018] Additionally, the image sensor module and camera module can be miniaturized through a multiple substrate stacking structure.

[0019] In addition, there is no need to manage tolerances for aligning the positions of sensor bases in an image sensor module in which multiple image sensors are arranged, and optical alignment can be performed only by aligning the positions of the substrate.

[0020] Figure 1 is a perspective view of a camera module according to the present embodiment.

[0021] Fig. 2 is a perspective view of an image sensor module according to the present embodiment.

[0022] Figure 3 is a drawing taken along line PP' of Figure 2.

[0023] Fig. 4 is a cross-sectional view of an image sensor module according to the present embodiment.

[0024] FIG. 5 is a drawing for explaining an image sensor module according to the present embodiment.

[0025] FIGS. 6 to 9 are drawings of an image sensor module according to another embodiment of the present invention.

[0026] FIG. 10 is an example of a vehicle having an optical system according to an embodiment of the invention.

[0027] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0028] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0029] In addition, terms (including technical and scientific terms) used in this embodiment may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which this embodiment belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0030] Additionally, the terms used in this embodiment are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0031] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0032] Additionally, in describing the components of this embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0033] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0034] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0035]

[0036] FIG. 1 is a perspective view of a camera module according to the present embodiment, FIG. 2 is a perspective view of an image sensor module according to the present embodiment, FIG. 3 is a view taken along line PP' of FIG. 2, FIG. 4 is a cross-sectional view of an image sensor module according to the present embodiment, FIG. 5 is a drawing for explaining an image sensor module according to the present embodiment, and FIGS. 6 to 9 are drawings of image sensor modules according to other embodiments of the present invention.

[0037] A camera module (1000) according to the present embodiment may include a lens module (100) and a housing (200).

[0038] The lens module (100) can be coupled to a through hole formed at one end of the housing (200). Through this structure, light passing through the lens module (100) can be incident on the image sensor. The lens module (100) can include an outermost lens and a lens holder (110) that accommodates the outermost lens. A first sealing member for airtightness can be positioned between the outermost lens and the lens holder (110). Meanwhile, a plurality of lenses can be accommodated in the lens holder (110).

[0039] The lens module (100) and the housing (200) may be bonded using an adhesive. The housing (200) may be provided with a receiving groove for receiving the adhesive. As an example, the adhesive may be epoxy. That is, the lens module (100) and the housing (200) may be bonded using epoxy. At this time, the epoxy may be cured by ultraviolet (UV) rays and heat. As an example, the optical axis alignment of the lens module (100) with respect to the image sensor may be adjusted while epoxy is applied between the lens module (100) and the housing (200), and when the adjustment of the optical axis alignment is completed, the epoxy may be pre-cured using ultraviolet rays, and then the main curing may be performed through heating.

[0040] The housing (200) forms a space inside to accommodate a plurality of substrate units and can form the exterior of the camera module. The housing (200) may have a roughly hexahedral shape and may have a stepped shape on the outside. However, the shape of the housing (200) is not limited thereto and may be provided in various forms, such as a cylindrical shape.

[0041] The housing (200) may include a first housing and a second housing. The housing (200) may include a first housing to which a lens module (100) is coupled. The housing (200) may include a second housing through which a connector passes. The first housing and the second housing may be coupled to form an internal space.

[0042] The first housing may include an EMI (Electro Magnetic Interference) shielding can made of metal. The EMI shielding can blocks electromagnetic interference noise generated outside the housing (200) from flowing into the inside, and can block electromagnetic interference noise generated inside the housing (200) from leaking out to the outside. The EMI shielding can may be grounded through a metal joining member that joins the first housing and the second housing. At this time, the grounding method may be various, and as an example, grounding may be achieved by connecting the EMI shielding can and the joining member and connecting the joining member to a ground terminal outside the camera module.

[0043] The first housing may include a through hole into which the lens module (100) is coupled. That is, the lens module (100) may be coupled to the first housing. At this time, the lens module (100) is coupled to the through hole of the first housing, and light passing through the lens module (100) through the through hole may reach the image sensor. That is, the through hole and the image sensor may overlap in the optical axis direction. Meanwhile, the shape of the through hole may be circular when viewed from above, but is not limited thereto.

[0044] The first housing may have a lower portion opposite the upper portion to which the lens module (100) is coupled. The lower portion of the first housing may be coupled to the upper portion of the second housing, and a plate may be positioned between them, for example. A sealing member may be positioned at the lower portion of the first housing. Meanwhile, a receiving groove for accommodating at least a portion of the sealing member may be positioned at the lower portion of the first housing.

[0045] The second housing may include a through hole through which the connector passes. The through hole may have a shape corresponding to that of the connector. Furthermore, the diameter of the through hole may be larger than that of the connector. For example, a sealing member may be positioned between the through hole and the connector.

[0046] A plurality of substrate units may be positioned inside the housing (200). An image sensor may be mounted on any one of the plurality of substrate units. The image sensor may be positioned so that its optical axis is aligned with that of the lens module (100). Through this structure, the image sensor can obtain light passing through the lens module (100). The image sensor can output the irradiated light as an image. The image sensor may be, for example, a CCD (charge coupled device), a MOS (metal oxide semiconductor), a CPD, or a CID. However, the type of the image sensor is not limited thereto.

[0047]

[0048] The image sensor module according to the present embodiment includes a first substrate (310), a second substrate (320), and an image sensor (400), and may include a filter (500).

[0049] An image sensor (400) may be placed on a first substrate (310). The image sensor (400) may be placed on one surface of the first substrate (310), and a connector (600) may be connected to the other surface of the first substrate (310). A pad (411) connected to the image sensor (400) and a wire (413) may be formed on one surface of the first substrate (310). The wire (413) connected to the image sensor (400) may be soldered (412) to the pad (411). The wire (413) may be made of gold (Au) or aluminum (Al). The pad (411) may be an electroless nickel immersion gold (ENIG) plated area, or an electroless nickel electroless palladium immersion gold (ENEPIG) plated area.

[0050] The second substrate (320) may be placed on the first substrate (310). The first substrate (310) and the second substrate (320) may be electrically connected through soldering. The first substrate (310) and the second substrate (320) may each include one side and a second side opposite the first side. The second substrate (320) may be placed on one side of the first substrate (310). The one side of the first substrate (310) and the second side of the second substrate (320) may be placed to face each other.

[0051] Referring to Fig. 6, the size of the first substrate (310) may be formed to be larger than that of the second substrate (320). Referring to Fig. 7, the size of the second substrate (320) may be formed to be larger than that of the first substrate (310). Depending on the number and size of electronic components arranged on each substrate, the sizes of the first substrate (310) and the second substrate (320) may be designed to be different from each other.

[0052] One surface of the first substrate (310) and the other surface of the second substrate (320) may be soldered to each other. The one surface of the first substrate (310) may include a plurality of first connection pads (313) arranged along an outer region. The other surface of the second substrate (320) may include a plurality of second connection pads (324) arranged along an outer region. The first connection pads (313) and the second connection pads (324) may be electrically connected by contacting each other. The first connection pads (313) and the second connection pads (324) may be soldered together.

[0053] Electronic components (311, 312, 322) may be arranged on at least one of one side and the other side of the first substrate (310) and one side and the other side of the second substrate (320). Power and applied signals supplied from a connector connected to the other side of the first substrate (310) may be connected to electronic components (322) arranged on the first substrate (310) and the second substrate (320) via the first connection pad (313) of the first substrate (310) and the second connection pad (324) of the second substrate (320). The electronic components may be various components such as decoupling capacitors and memories.

[0054] The second substrate (320) may include a hole (323) corresponding to the image sensor (400). The hole (323) may be formed to have a size corresponding to the image sensor (400). The hole (323) may be formed to have a size larger than the image sensor (400). The image sensor (400) disposed on the first substrate (310) may be exposed through the hole (323) of the second substrate (320).

[0055] One side of the second substrate (320) may include a mounting portion (321) forming a hole (323) and a step. A filter (500) may be placed on the mounting portion (321) of the second substrate (320). The filter (500) may be placed on one side of the second substrate (320). The filter (500) may overlap the image sensor (400) in the optical axis direction. The mounting portion (321) may be formed to be recessed from one side of the second substrate (320). The mounting portion (321) may be formed to protrude inward from the inner surface of the hole (323) of the second substrate (320). The upper surface of the mounting portion (321) may face one side of the filter (500). The inner surface of the mounting portion (321) may face the outer surface of the filter (500).

[0056] Referring to FIG. 8, according to another embodiment, the hole (323) of the second substrate (320) may be formed to have a size that forms a space apart from the image sensor (400). The hole (323) of the second substrate (320) may be formed to be spaced apart from the image sensor (400) by a distance (L). The inner surface of the hole (323) of the second substrate (320) may be formed to be spaced apart from the image sensor (400) by the distance (L). Through this, an area for connecting a wire (413) and an area for arranging electronic components may be secured in an area adjacent to the image sensor (400) on the first substrate (310).

[0057] Referring to FIG. 9, according to another embodiment, an image sensor module may include a plurality of image sensors arranged on a first substrate (310). A first image sensor (401) and a second image sensor (402) may be arranged on the first substrate (310). The second substrate (320) may include a first hole corresponding to the first image sensor (401). One surface of the second substrate (320) may include a first mounting portion forming a step with the first hole. A first filter (501) may be arranged on the first mounting portion. The second substrate (320) may include a second hole corresponding to the second image sensor (402). One surface of the second substrate (320) may include a second mounting portion forming a step with the second hole. A second filter (502) may be arranged on the second mounting portion. Although Fig. 9 illustrates a structure in which two image sensors are arranged, it is obvious that two or more image sensors can be arranged on a single substrate. In the case of a structure including an existing sensor base, tolerance management was required to align each position, but in the case of the image sensor module illustrated in Fig. 9, only the position of the second substrate (320) needs to be controlled, which is advantageous in terms of design.

[0058]

[0059] Fig. 10 is an example of a plan view of a vehicle to which a camera module or optical system according to an embodiment of the invention is applied. Referring to Fig. 10, a vehicle camera system according to an embodiment of the invention includes an image generating unit (11), a first information generating unit (12), a second information generating unit (21, 22, 23, 24, 25, 26), and a control unit (14). The image generating unit (11) may include at least one camera module (31) disposed in the vehicle, and may capture images of the front of the vehicle and / or the driver to generate a front image or an interior image of the vehicle. The image generating unit (11) may capture images of the surroundings of the vehicle in one or more directions as well as the front of the vehicle using the camera module (31), to generate an image of the surroundings of the vehicle. Here, the front image and the surrounding images may be digital images, and may include color images, black and white images, infrared images, etc. In addition, the front image and the surrounding images may include still images and moving images. The image generation unit (11) provides the driver image, the front image, and the surrounding image to the control unit (14). Next, the first information generation unit (12) may include at least one radar and / or camera placed in the vehicle, and detects the front of the vehicle to generate first detection information. Specifically, the first information generation unit (12) is placed in the vehicle, and detects the position and speed of vehicles located in front of the vehicle, the presence and position of pedestrians, etc. to generate first detection information.

[0060] By using the first detection information generated by the first information generating unit (12), the distance between the own vehicle and the vehicle in front can be controlled to be maintained at a constant level, and the stability of vehicle operation can be improved in specific preset cases, such as when the driver wants to change the driving lane of the own vehicle or when backing up. The first information generating unit (12) provides the first detection information to the control unit (14). The second information generating unit (21, 22, 23, 24, 25, 26) detects each side of the own vehicle based on the front image generated by the image generating unit (11) and the first detection information generated by the first information generating unit (12), and generates second detection information. Specifically, the second information generating unit (21, 22, 23, 24, 25, 26) may include at least one radar and / or camera disposed in the own vehicle, and may detect the position and speed of vehicles located on the side of the own vehicle or capture images. Here, the second information generation units (21, 22, 23, 24, 25, 26) can be placed at the front two corners, side mirrors, and rear center and rear two corners of the vehicle, respectively.

[0061] At least one information generating unit of these vehicle camera systems may be equipped with an optical system and a camera module having the same as described in the embodiments disclosed above, and may provide or process information acquired through the front, rear, each side or corner area of ​​the vehicle to a user to enable autonomous driving or to protect the vehicle and objects from surrounding safety.

[0062] The optical system of the camera module according to an embodiment of the invention can be installed in multiple units within a vehicle to enhance safety regulations, autonomous driving functions, and convenience. Furthermore, the optical system of the camera module is used as a component for controlling systems such as the Lane Keeping Assistance System (LKAS), Lane Departure Warning System (LDWS), and Driver Monitoring System (DMS). These vehicle camera modules can achieve stable optical performance even under ambient temperature changes and offer competitive pricing, thereby ensuring the reliability of vehicle components.

[0063] Although the embodiments of the present invention have been described with reference to the attached drawings, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential features thereof. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.

Claims

1. First substrate; An image sensor disposed on the first substrate; and Including a second substrate arranged on the first substrate, The second substrate is an image sensor module including a hole corresponding to the image sensor.

2. In paragraph 1, An image sensor module in which the first substrate and the second substrate are electrically connected through soldering.

3. In paragraph 1, The first substrate and the second substrate each include one side and a second side opposite the one side, An image sensor module comprising electric pads at positions corresponding to one side of the first substrate and the other side of the second substrate facing the one side of the first substrate.

4. In paragraph 1, The first substrate and the second substrate each include one side and a second side opposite the one side, The above-mentioned one side of the above-mentioned second substrate includes a mounting portion forming the hole and the step, An image sensor module in which a filter is placed on the above-mentioned mounting portion.

5. In paragraph 1, The first substrate and the second substrate each include one side and a second side opposite the one side, An image sensor module in which electronic components are arranged on at least one of the first surface of the second substrate, the first surface of the first substrate, and the other surface of the first substrate.

6. In paragraph 5, The above-mentioned second substrate is an image sensor module connected to a connector.

7. In paragraph 2, The image sensor is an image sensor module connected by wire to a pad area on the first surface of the first substrate.

8. First substrate; A first image sensor disposed on the first substrate; A second image sensor disposed on the first substrate; and Including a second substrate arranged on the first substrate, An image sensor module in which the second substrate includes a first hole corresponding to the first image sensor and a second hole corresponding to the second image sensor.

9. In paragraph 8, An image sensor module in which the first substrate and the second substrate are electrically connected through soldering.

10. In paragraph 8, The first substrate and the second substrate each include one side and a second side opposite the one side, The above-mentioned one side of the above-mentioned second substrate includes a first mounting portion forming a step with the above-mentioned first hole and a second mounting portion forming a step with the above-mentioned second hole, A first filter is placed in the above first fixing portion, An image sensor module in which a second filter is placed in the second mounting portion.

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