Film-forming cooling device and film-forming apparatus

Abstract

The present application belongs to the technical field of film forming. Provided are a film-forming cooling device and a film-forming apparatus. The film-forming cooling device comprises: a cooling body having an accommodating cavity, the cooling body being used for bearing a film-forming substrate and cooling material adhering to the film-forming substrate, the film-forming substrate being electrically conductive; and a magnetic component located in the accommodating cavity, the magnetic component being configured to be capable of generating a magnetic attraction force on the film-forming substrate towards the accommodating cavity. The film-forming cooling device provided in the present application can enhance the adhesion of the film-forming substrate to the surface of the cooling body.

Description

Film forming cooling device and film forming equipment

[0001] Cross-references

[0002] The present disclosure refers to Chinese Patent Application No. 202420665351.3, filed on April 2, 2024, entitled “Film Forming Cooling Device and Film Forming Equipment,” which is incorporated herein by reference in its entirety. Technical Field

[0003] The present application relates to the field of film forming technology, and in particular to a film forming cooling device and film forming equipment. Background Art

[0004] Film deposition technology is a process that forms one or more thin films on a substrate. These films can be made of metals, semiconductors, or other compound materials. Film deposition technology is widely used in optical devices, semiconductor devices, and new energy vehicles.

[0005] During the film-forming process, the temperature of the film-forming material attached to the surface of the film-forming substrate is high, which can cause wrinkles and deformation on the substrate surface. Therefore, during the film-forming process, the film-forming substrate is often cooled by attaching it to the surface of a cooling device. However, the adhesion between the cooling device surface and the film-forming substrate is weak, which affects the cooling effect of the cooling device on the film-forming substrate.

[0006] Summary of the Invention

[0007] The present application aims to solve at least one of the technical problems existing in the background art. To this end, one purpose of the present application is to provide a film forming cooling device and a film forming equipment to solve the problem of weak adhesion between the cooling device and the film forming substrate.

[0008] An embodiment of the first aspect of the present application provides a film-forming cooling device, comprising: a cooling body having a accommodating cavity, the cooling body being used to support a film-forming substrate and to cool a material attached to the film-forming substrate, the film-forming substrate being conductive; a magnetic component being located in the accommodating cavity, the magnetic component being configured to generate a magnetic attraction force toward the accommodating cavity on the film-forming substrate.

[0009] In the technical solution of the embodiment of the present application, the magnetic component is located in the accommodating cavity inside the cooling body, and generates a magnetic attraction force toward the accommodating cavity on the film-forming substrate carried on the cooling body, that is, a magnetic attraction force is applied to the film-forming substrate in the direction toward the inside of the cooling body, and then the film-forming substrate is adsorbed on the cooling body, so that the film-forming substrate and the cooling body are tightly fitted, thereby enhancing the heat transfer between the cooling body and the film-forming substrate, thereby achieving a better cooling effect on the material attached to the film-forming substrate.

[0010] In some embodiments, the magnetic component includes at least one of an electromagnetic coil or a magnet. Both electromagnetic coils and magnets can generate magnetic attraction, and electromagnetic coils or magnets can be flexibly selected to form different combinations to meet the magnetic attraction requirements of different film-forming substrates, thereby enhancing the adhesion of the film-forming substrate to the cooling body.

[0011] In some embodiments, the magnetic component includes an electromagnetic coil, which is spirally wound along the axial direction of the receiving chamber. By controlling the current flowing through the electromagnetic coil, the magnetism of the electromagnetic coil can be controlled. Furthermore, by controlling the current level, the magnetic induction intensity of the electromagnetic coil can be regulated, thereby controlling the magnetic attraction of the electromagnetic coil to the film-forming substrate.

[0012] In some embodiments, the electromagnetic coil includes at least two independent portions arranged axially along the accommodating cavity, the at least two portions comprising a first portion and a second portion adjacent to each other, the second portion being closer to an axial end of the accommodating cavity than the first portion. In this manner, the magnetic induction intensities of the at least two independent portions can be individually controlled, thereby regulating the magnetic attraction forces generated by the electromagnetic coil at the axial ends and the middle portion of the accommodating cavity, such that both the axial ends and the middle portion of the electromagnetic coil can generate a strong magnetic attraction force on the film-forming substrate.

[0013] In some embodiments, the length of the first portion is greater than the length of the second portion along the axial direction of the accommodating cavity. Thus, by adjusting the magnetic induction intensity of the second portion, the magnetic induction intensity at the end of the accommodating cavity can be enhanced, so that the edge of the cooling body along the axial direction of the accommodating cavity also has a strong magnetic attraction to the film-forming substrate, allowing the film-forming substrate carried at the edge of the cooling body to fit tightly against the cooling body.

[0014] In some embodiments, the at least two portions further include a third portion, which is located on a side of the first portion away from the second portion. That is, the third portion and the second portion are located at opposite ends of the accommodating cavity in the axial direction, respectively, while the first portion is located in the middle of the accommodating cavity in the axial direction. This allows the electromagnetic coil to generate a strong magnetic attraction force on the film-forming substrate throughout the axial direction of the accommodating cavity.

[0015] In some embodiments, the length of the first portion is greater than the length of the third portion along the axial direction of the accommodating cavity. Thus, by regulating the magnetic induction intensities of the second and third portions, the magnetic induction intensities at both ends of the accommodating cavity can be enhanced, resulting in a strong magnetic attraction force between the film-forming substrate and the two opposing edges of the cooling body along the axial direction of the accommodating cavity, further enhancing the adhesion of the film-forming substrate to the two edges of the cooling body.

[0016] In some embodiments, at least two sections are connected to different power sources. This allows the current flowing in each section to be independently controlled to adjust the magnetic induction intensity generated by each section, thereby enabling the magnetic induction intensity generated by the electromagnetic coil at different positions along the axial direction of the receiving chamber to be adjusted.

[0017] In some embodiments, the turns density at at least one end of the electromagnetic coil along the axial direction of the cavity is greater than the turns density in the middle portion. Turns density is the number of turns per unit length of the electromagnetic coil. By adjusting the turns density at different locations of the electromagnetic coil, the magnetic induction intensity at the axial ends and middle portion of the cavity can be made different while maintaining a consistent current throughout the electromagnetic coil. Furthermore, the magnetic induction intensity at at least one end of the cavity is greater than that in the middle portion, thereby reinforcing the magnetic induction intensity at at least one end of the cavity, thereby increasing the magnetic attraction at the edge of the film-forming substrate.

[0018] In some embodiments, the magnetic component includes an electromagnetic coil and a magnet. The magnet has two poles of different polarity, one located at each end of the magnet along the axial direction of the receiving cavity. At least a portion of the electromagnetic coil is spirally wound around the outer circumference of the magnet. The magnet also generates a magnetic field. The combination of the electromagnetic coil and the magnet enhances the magnetic induction strength of the magnetic component, thereby increasing the magnetic attraction of the magnetic component to the film-forming substrate.

[0019] In some embodiments, the magnetic component includes a magnet having two poles of different polarity, one located at each end of the magnet along the axial direction of the housing cavity. This allows the magnetic field lines generated by the magnet to extend along the axial direction of the housing cavity, generating a magnetic attraction force on the film-forming substrate toward the housing cavity. Furthermore, electromagnetic coils or magnets can be flexibly selected to meet the magnetic attraction required by different film-forming substrates, thereby enhancing the adhesion of the film-forming substrate to the cooling body.

[0020] In some embodiments, the cooling body is annular, and the magnetic component extends along the axial direction of the accommodating cavity. In a transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the distance between the geometric center of the magnetic component and the geometric center of the accommodating cavity to the outer diameter of the cooling body is 0 to 1 / 10. This ensures that the geometric center of the magnetic component is less offset from the geometric center of the accommodating cavity, thereby ensuring that the magnetic induction intensity generated by the magnetic component is more uniform along the circumference of the cooling body, thereby ensuring that the adsorption force on the film-forming substrate is stronger along the circumference of the cooling body.

[0021] In some embodiments, the cooling body is annular, and in a transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the thickness of the electromagnetic coil to the outer diameter of the cooling body is 1 / 50 to 1 / 4. Within this range, the thickness of the electromagnetic coil is not too large, thus avoiding occupying excessive space in the accommodating cavity and improving the problem of heat generation caused by excessive thickness of the electromagnetic coil. Furthermore, within this range, the thickness of the electromagnetic coil is not too small, so that the magnetic induction intensity generated by the electromagnetic coil is sufficiently large, thereby generating a strong magnetic attraction force on the film-forming substrate, thereby ensuring that the film-forming substrate is tightly adhered to the cooling body.

[0022] In some embodiments, the electromagnetic coil is formed by a single wire spirally wound along the axial direction of the receiving cavity. The diameter of the single wire ranges from 0.1 mm to 20 mm. Within this range, the diameter of the single wire is not too small, thereby reducing the resistance and alleviating the problem of heating caused by excessive wire resistance. Furthermore, the diameter of the single wire is not too large, thereby alleviating the problem of excessive space occupied by the receiving cavity due to the thickness of the electromagnetic coil.

[0023] In some embodiments, when the magnetic component includes an electromagnetic coil, the film-forming cooling device further includes a metal member positioned within the accommodating cavity and extending axially of the accommodating cavity, with at least a portion of the electromagnetic coil helically wound around the outer circumference of the metal member. The metal member has a high magnetic permeability and can concentrate the magnetic field in the electromagnetic coil, thereby enhancing the magnetic induction strength of the entire electromagnetic coil.

[0024] In some embodiments, the metal member is positioned within the electromagnetic coil, and the ratio of the length of the metal member to the length of the electromagnetic coil along the axial direction of the receiving cavity is between 2 / 3 and 1.1. Within this range, the length of the metal member is not too small compared to the length of the electromagnetic coil, thereby concentrating the magnetic field generated by the electromagnetic coil and significantly enhancing the magnetic induction strength of the entire electromagnetic coil.

[0025] In some embodiments, in a transverse direction perpendicular to the axial direction of the accommodation cavity, the ratio of the cross-sectional area of ​​the metal member to the area enclosed by the electromagnetic coil is 2 / 3 to 1. Within this range, the metal member occupies a larger area of ​​the area enclosed by the electromagnetic coil in the transverse direction, thereby improving the metal member's ability to concentrate the magnetic field in the electromagnetic coil and enhancing the magnetic induction strength of the entire electromagnetic coil.

[0026] In some embodiments, the relative magnetic permeability of the metal member is greater than or equal to 10. Within this range, the metal member can effectively concentrate the magnetic field in the electromagnetic coil, thereby enhancing the magnetic induction intensity of the entire electromagnetic coil.

[0027] In some embodiments, the film-forming substrate comprises at least one conductive film layer, and the film-forming cooling device further comprises: at least two conductive rollers, each in contact with the conductive film layer, and each of the at least two conductive rollers is connected to a power source for passing current through the conductive film layer. The conductive rollers can guide the transport of the film-forming substrate and, at the same time, pass current through the conductive film layer, so that the magnetic field generated by the magnetic component generates a magnetic attraction force on the current, thereby generating a magnetic attraction force on the film-forming substrate.

[0028] In some embodiments, the film-forming cooling device further comprises: at least one auxiliary roller arranged circumferentially around the cooling body, the at least one auxiliary roller abutting the film-forming substrate, and the at least one auxiliary roller having an auxiliary magnetic component therein, the auxiliary magnetic component being configured to generate a magnetic attraction force on the film-forming substrate toward the receiving chamber. The auxiliary roller can better adhere the film-forming substrate to the cooling body. Simultaneously, the auxiliary magnetic component within the auxiliary roller can also generate a magnetic field, enhancing the magnetic induction intensity around the receiving chamber and increasing the magnetic attraction force on the film-forming substrate.

[0029] In some embodiments, the film-forming cooling device further comprises a cooling circuit within the accommodating chamber, the cooling circuit being located between the inner wall of the accommodating chamber and the magnetic component. This cooling circuit is located close to both the surface of the cooling body and the magnetic component, enabling the cooling of the cooling body surface, thereby cooling the film-forming substrate and the material attached thereto, while also cooling and dissipating heat from the magnetic component, thereby alleviating the risk of damage to the magnetic component due to overheating.

[0030] In some embodiments, the cooling circuit is spirally wound around the outer periphery of the magnetic component along the axial direction of the accommodating cavity. This allows for uniform heat dissipation in the axial direction of the magnetic component, thereby improving the heat dissipation effect on the magnetic component, and uniform cooling of the cooling body in the circumferential direction, thereby improving the cooling effect on the film-forming substrate and the material attached to the film-forming substrate.

[0031] The second embodiment of the present application provides a film-forming device, which includes the film-forming cooling device of the above embodiment; a first film-forming mechanism, which is used to form a target film layer on the surface of a film-forming substrate carried by a cooling body, and the film-forming substrate carried by the cooling body is conductive. Because the cooling body has a built-in magnetic component, when an electric current is passed through the conductive film layer, the magnetic field generated by the magnetic component can generate a magnetic attraction force on the current, thereby adsorbing the film-forming substrate on the cooling body, enhancing the cooling effect of the cooling body on the film-forming substrate, reducing the probability of wrinkling or deformation of the film-forming substrate, and thus enabling the first film-forming mechanism to form a flat target film layer on the surface of the film-forming substrate, greatly improving the quality and yield of the target film layer.

[0032] In some embodiments, the film-forming substrate includes a base and a conductive film layer formed on the base, and the apparatus further includes a second film-forming mechanism for forming the conductive film layer on the base. This means that regardless of whether the base is conductive or not, the conductive film layer can be used to render the film-forming substrate conductive, thereby expanding the range of substrate options and, in turn, the applications of the film-forming apparatus.

[0033] In some embodiments, the film-forming apparatus further comprises a substrate transport mechanism for transporting the film-forming substrate to the cooling body. This allows the first film-forming mechanism to continuously form a target film layer on the film-forming substrate transported to the surface of the cooling body, while the cooling body simultaneously cools the target film layer on the film-forming substrate. This allows a high-quality target film layer to be formed on the surface of a relatively long film-forming substrate.

[0034] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0036] FIG1 is a schematic diagram of the exploded structure of a battery according to some embodiments of the present application;

[0037] FIG2 is a schematic diagram of the exploded structure of a battery cell according to some embodiments of the present application;

[0038] FIG3 is a schematic diagram of the front view of the film forming cooling device according to some embodiments of the present application;

[0039] FIG4 is a schematic diagram of the front view of the structure of a film forming cooling device including an electromagnetic coil in some embodiments of the present application;

[0040] FIG5 is a schematic diagram of the three-dimensional structure of an electromagnetic coil according to some embodiments of the present application;

[0041] FIG6 is a schematic diagram showing the principle of a film-forming cooling device generating a magnetic attraction force on a film-forming substrate according to some embodiments of the present application;

[0042] FIG7 is a side cross-sectional view of a film forming cooling device including an electromagnetic coil according to some embodiments of the present application;

[0043] FIG8 is a schematic side view of the cooling body according to some embodiments of the present application;

[0044] FIG9 is a schematic diagram of the three-dimensional structure of a film forming cooling device according to some embodiments of the present application;

[0045] FIG10 is a side cross-sectional view of a film forming cooling device including an electromagnetic coil according to some other embodiments of the present application;

[0046] FIG11 is a side cross-sectional view of a film forming cooling device including an electromagnetic coil according to some other embodiments of the present application;

[0047] FIG12 is a schematic diagram of the three-dimensional structure of a magnetic component according to some embodiments of the present application;

[0048] FIG13 is a side cross-sectional view of a film forming cooling device including a magnet according to some embodiments of the present application;

[0049] FIG14 is a schematic diagram of the three-dimensional structure of a film forming cooling device according to other embodiments of the present application;

[0050] FIG15 is a schematic diagram of the three-dimensional structure of a film forming cooling device according to some other embodiments of the present application;

[0051] FIG16 is a schematic diagram of the front structure of a film forming cooling device according to other embodiments of the present application;

[0052] FIG17 is a schematic diagram of a three-dimensional structure of a cooling circuit in some embodiments of the present application from one perspective;

[0053] FIG18 is a schematic diagram of a three-dimensional structure of a cooling circuit in some embodiments of the present application from another perspective;

[0054] FIG19 is a schematic diagram of a structure in which a cooling circuit is fixed to a connecting member in some embodiments of the present application;

[0055] FIG20 is a schematic structural diagram of a film forming device according to some embodiments of the present application. DETAILED DESCRIPTION

[0056] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0058] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0059] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0060] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0061] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0062] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0063] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0064] At present, film forming technology is widely used in optical devices, semiconductor devices or new energy vehicles.

[0065] The coating process is one of the film forming technologies, and the coating process is used as an example for explanation below.

[0066] Coating is a commonly used surface treatment process, typically using physical vapor deposition (PVD) or chemical vapor deposition (CVD) to form one or more thin films on a substrate. PVD methods include vacuum evaporation, sputtering, arc plasma plating, ion plating, and molecular beam epitaxy. CVD deposits thin films with specialized properties onto substrate surfaces through chemical reactions at high temperatures.

[0067] During the coating process, the materials used to form the thin film have a relatively high temperature. When these materials adhere to the surface of the film-forming substrate, the temperature of the surface of the film-forming substrate may increase, causing the film-forming substrate to wrinkle and deform. This may lead to problems such as empty plating lines in the subsequent coating process (i.e., the film-forming substrate is wrinkled, resulting in no film-forming material attached to the wrinkle, thereby forming a line-shaped blank area where no film-forming material is attached), deformation of the film surface of the film-forming substrate to which the film-forming material is attached, pinholes on the film surface, or damage to the film surface.

[0068] To address this issue, a cooling element is typically used to cool the substrate during the coating process. The cooling element is relatively low in temperature, and the substrate adheres to the surface, transferring heat to the cooling element. This transfers heat away from the substrate, ultimately cooling the substrate.

[0069] However, due to the weak adhesion between the film-forming substrate and the cooling component, the heat transfer effect between the cooling component and the film-forming substrate is poor, resulting in poor cooling effect of the cooling component on the film-forming substrate, and still causing the film-forming substrate to wrinkle and deform due to overheating.

[0070] In related technologies, in order to make the film-forming substrate and the cooling component fit tightly together, an insulating layer is formed on the surface of the cooling component, and by applying a bias voltage to the film-forming substrate, electrostatic adsorption occurs between the insulating layer and the film-forming substrate, thereby adsorbing the film-forming substrate on the surface of the cooling component.

[0071] However, in the above method, the problem of bias breakdown of the insulating layer is prone to occur, which in turn causes damage to the insulating layer and weakens the electrostatic adsorption ability of the insulating layer to the film-forming substrate, thereby making the adhesion effect between the film-forming substrate and the surface of the cooling component poor, resulting in poor cooling effect of the cooling component on the film-forming substrate.

[0072] Based on the above considerations, in order to solve the problem of poor fitting between the cooling component and the film-forming substrate, resulting in poor cooling effect on the film-forming substrate, a film-forming cooling device is designed. The film-forming cooling device includes a cooling body, the cooling body has a accommodating cavity, and the magnetic component is located in the accommodating cavity in the cooling body, and generates a magnetic attraction force toward the accommodating cavity on the film-forming substrate carried on the cooling body, that is, a magnetic attraction force is applied to the film-forming substrate in the direction toward the inside of the cooling body, and then the film-forming substrate is adsorbed on the cooling body, so that the film-forming substrate is closely fitted to the cooling body, thereby enhancing the heat transfer between the cooling body and the film-forming substrate, thereby achieving a better cooling effect on the material attached to the film-forming substrate.

[0073] The film-forming cooling device disclosed in the embodiments of the present application can be used, but is not limited to, in the coating process in the field of new energy vehicles, semiconductor devices, or optical devices.

[0074] Taking the application of film-forming cooling devices in the field of new energy vehicles as an example, film-forming cooling devices can be used for the preparation of current collectors in batteries in the field of new energy vehicles.

[0075] Please refer to Figure 1, which is a schematic diagram of the exploded structure of a battery provided in some embodiments of the present application. The battery includes a housing 10 and a battery cell 20, with the battery cell 20 housed within the housing 10. In some embodiments, the housing 10 may include a first portion 11 and a second portion 12, which overlap each other and together define a storage space for the battery cell 20.

[0076] In a battery, there may be multiple battery cells 20 , and the multiple battery cells 20 may be connected in series, in parallel, or in mixed connection. Mixed connection means that the multiple battery cells 20 are connected in both series and in parallel.

[0077] Each battery cell 20 may be a secondary battery or a primary battery, and may also be a lithium-sulfur battery, a sodium-ion battery, or a magnesium-ion battery, but is not limited thereto. The battery cell 20 may be cylindrical, flat, rectangular, or in other shapes.

[0078] Please refer to Figure 2, which shows an exploded schematic diagram of a battery cell according to some embodiments of the present application. A battery cell 20 is the smallest unit of a battery. As shown in Figure 2, a battery cell 20 includes an end cap 21, an electrode terminal 21a, a housing 22, a cell assembly 23, and other functional components.

[0079] The cell assembly 23 consists of electrode sheets 23a and a separator. The electrode sheets 23a can include positive and negative electrode sheets. Battery cells primarily operate by the movement of metal ions between the positive and negative electrode sheets. The positive electrode sheet includes a positive current collector and a positive active material layer. The positive active material layer is coated on the surface of the positive electrode collector. The uncoated positive electrode collector protrudes from the coated positive electrode collector, and the uncoated positive electrode collector serves as the positive electrode tab. For lithium-ion batteries, for example, the positive electrode collector can be made of aluminum, and the positive electrode active material can be lithium cobalt oxide, lithium iron phosphate, ternary lithium, or lithium manganese oxide. The negative electrode sheet includes a negative current collector and a negative active material layer. The negative active material layer is coated on the surface of the negative electrode collector. The uncoated negative electrode collector protrudes from the coated negative electrode collector, and the uncoated negative electrode collector serves as the negative electrode tab. The negative electrode current collector can be made of copper, and the negative electrode active material can be carbon or silicon. To ensure high current flow without melting, multiple positive electrode tabs are stacked together, and multiple negative electrode tabs are stacked together. The separator can be made of materials such as polypropylene (PP) or polyethylene (PE).

[0080] Typically, a coating process may be used to form the current collectors (including the positive electrode collector and the negative electrode collector) of the electrode pieces (including the positive electrode pieces and the negative electrode pieces). The coating process may include but is not limited to a vacuum coating process.

[0081] For example, a coating process can be used to prepare composite current collectors. Composite current collectors are formed by combining polymer materials with metals, and include multi-metal composite foils, metal-carbon composite foils, polymer-conductive composite foils, plant fiber composite foils, and polymer-metal composite foils. Polymer-metal composite foils, in particular, can improve battery safety and increase battery specific energy density.

[0082] Polymer-metal composite foil typically forms a metal film layer on the surface of a polymer substrate. For example, the metal film layer can be formed on both the upper and lower surfaces of the polymer substrate. The polymer material can be oriented polypropylene (OPP) plastic, biaxially oriented polypropylene film (BOPP), polyimide (PI) plastic, polyethylene terephthalate (PET) plastic, cast polypropylene (CPP) plastic, or polyvinyl chloride (PVC) plastic. The metal film layer can be made of copper or aluminum, among other materials.

[0083] The above-mentioned metal film layer can be formed on the surface of the polymer substrate through a coating process.

[0084] The film-forming cooling device disclosed in the embodiment of the present application can be used in the coating process of the current collector on the pole piece, and can also be applied to the coating process of preparing any metallized thin film.

[0085] Refer to FIG3 , which is a schematic diagram of the main structure of the film forming cooling device according to some embodiments of the present application.

[0086] An embodiment of the present application provides a film-forming cooling device, including: a cooling body 100, having a accommodating cavity 30, the cooling body 100 is used to support a film-forming substrate 40, and is used to cool the material attached to the film-forming substrate 40; a magnetic component 101, located in the accommodating cavity 30, the magnetic component 101 is constructed to be able to generate a magnetic attraction force on the film-forming substrate 40 toward the accommodating cavity 30.

[0087] The direction of the magnetic attraction force may be the direction indicated by the arrow in FIG3 .

[0088] There is a magnetic field around the magnetic component 101 , which can transmit the magnetic attraction between objects and further generate magnetic attraction to the film-forming substrate 40 .

[0089] In some embodiments, the film-forming substrate 40 may contain ferromagnetic materials, such as iron, nickel, or cobalt, so that the magnetic component 101 can generate a magnetic attraction force on the film-forming substrate 40. Because magnetic fields can generate an Ampere force on electric current, in other embodiments, the film-forming substrate 40 may be conductive. Thus, when electric current flows through the film-forming substrate 40, the current is subjected to an Ampere force in the magnetic field, causing the magnetic component 101 to generate a magnetic attraction force on the film-forming substrate 40.

[0090] In some embodiments, the film-forming substrate 40 may be conductive.

[0091] For example, in some embodiments, the film-forming substrate 40 may be formed of a conductive material. For example, the conductive film layer may be a metal layer, or a conductive semiconductor layer.

[0092] In some embodiments, the film-forming substrate 40 may also include a base and a conductive film layer formed on the surface of the base to make the film-forming substrate 40 conductive. The base may be conductive or non-conductive.

[0093] The material on the film-forming substrate 40 is used to form a target film layer, that is, the cooling body 100 cools the target film layer. For example, the magnetic attraction generated by the magnetic component 101 on the film-forming substrate 40 causes the film-forming substrate 40 to be attached to the surface of the cooling body 100. The surface of the cooling body 100 has a lower temperature than that of the film-forming substrate 40, thus heat transfer occurs between the cooling body 100 and the film-forming substrate 40, lowering the temperature of the film-forming substrate 40 and, in turn, lowering the temperature of the material attached to the film-forming substrate 40.

[0094] The film forming substrate 40 covers the surface of the cooling body 100 so that the cooling body 100 can conduct heat transfer with the film forming substrate 40 to cool the material attached to the surface of the film forming substrate 40 .

[0095] In some embodiments, the film-forming substrate 40 may be disposed around at least a portion of the circumference of the accommodating cavity 30. The cooling body 100 may include sidewalls that enclose the accommodating cavity 30, and the film-forming substrate 40 may cover at least a portion of the circumferential surface of the sidewalls of the cooling body 100. In this manner, the magnetic attraction generated by the magnetic component 101 within the accommodating cavity 30 on the film-forming substrate 40 can adsorb the film-forming substrate 40 to the sidewalls of the cooling body 100.

[0096] In some embodiments, the cooling body 100 may be a cooling drum.

[0097] It can be seen that by arranging the magnetic component 101 in the accommodating cavity 30, a magnetic attraction force is applied to the film-forming substrate 40, thereby adsorbing the film-forming substrate 40 onto the cooling body 100, so that the film-forming substrate 40 and the cooling body 100 are closely attached, and the heat transfer effect between the cooling body 100 and the film-forming substrate 40 is enhanced, thereby achieving a better cooling effect on the material attached to the film-forming substrate 40. In this way, the problem of the film-forming substrate 40 being overheated due to the excessive temperature of the material on the film-forming substrate 40, which in turn causes the film-forming substrate 40 to wrinkle or deform, can be improved, and the smoothness of the target film layer formed by the material on the film-forming substrate 40 can be improved, and the probability of the target film layer being deformed, vacuumed, or burned can be reduced, thereby greatly improving the quality and rate of the target film layer.

[0098] According to some embodiments of the present application, the magnetic component 101 includes at least one of an electromagnetic coil or a magnet.

[0099] An electromagnetic coil is a coil wound by an electric conductor. When current flows through the conductor, a magnetic field is generated, which will be generated around the electromagnetic coil.

[0100] In some embodiments, the material of the electrical conductor may include a metal material, including but not limited to at least one of copper, aluminum, or silver.

[0101] In some embodiments, the electrical conductor may be a wire, and the electromagnetic coil may be formed by winding a single wire or by winding a plurality of overlapping wires.

[0102] A magnet refers to a substance or material that can generate a magnetic field. In some embodiments, the magnet may include a permanent magnet or a non-permanent magnet. A permanent magnet refers to a material with persistent magnetism. A non-permanent magnet refers to a material whose magnetic attraction gradually disappears after the external magnetic field disappears.

[0103] In some embodiments, the non-permanent magnet may be an electromagnet, which generates a magnetic field when current is passed through the electromagnet.

[0104] It is understandable that when no electricity is applied to a permanent magnet, a magnetic field exists around it.

[0105] In some embodiments, the magnetic component 101 may include only an electromagnetic coil.

[0106] In other embodiments, the magnetic component 101 may also include only magnets.

[0107] In some other embodiments, the magnetic component 101 may include both an electromagnetic coil and a magnet.

[0108] In some embodiments, the magnetic component 101 may be in contact with the inner wall of the accommodating chamber 30 , so that the magnetic attraction of the magnetic component 101 to the film-forming substrate 40 is stronger.

[0109] In other embodiments, the magnetic component 101 may not be in contact with the inner wall of the accommodating cavity 30 , that is, there is a gap between the magnetic component 101 and the inner wall of the accommodating cavity 30 to enhance heat dissipation of the magnetic component 101 .

[0110] Both electromagnetic coils and magnets can generate magnetic attraction. Electromagnetic coils or magnets can be flexibly selected to form different combinations to meet the magnetic attraction required by different film-forming substrates 40, thereby enhancing the adhesion of the film-forming substrate 40 to the cooling body 100.

[0111] Referring to Figures 4 to 7, Figure 4 is a schematic diagram of the main structure when the film-forming cooling device of some embodiments of the present application includes an electromagnetic coil; Figure 5 is a schematic diagram of the three-dimensional structure of the electromagnetic coil of some embodiments of the present application; Figure 6 is a schematic diagram of the principle of the film-forming cooling device of some embodiments of the present application generating magnetic attraction force on the film-forming substrate; Figure 7 is a side sectional view when the film-forming cooling device of some embodiments of the present application includes an electromagnetic coil.

[0112] According to some embodiments of the present application, the magnetic component 101 includes an electromagnetic coil 1011 , which is spirally wound along the axial direction of the accommodating cavity.

[0113] Referring to Figures 6 and 7 , when current is applied to electromagnetic coil 1011, a magnetic field is generated around it. Electromagnetic coil 1011 has two poles of different polarity: the north pole (north pole) and the south pole (south pole). The magnetic flux lines of the magnetic field around electromagnetic coil 1011 are oriented in the direction from the north pole to the south pole.

[0114] The electromagnetic coil 1011 is spirally wound along the axial direction of the accommodating cavity, i.e., the north and south poles of the electromagnetic coil 1011 are located at the two ends of the electromagnetic coil 1011 along the axial direction of the accommodating cavity 30. This ensures that the magnetic flux lines generated by the electromagnetic coil 1011 on the surface of the cooling body 100 are directed from one end of the axial direction of the accommodating cavity 30 to the other end. When the film-forming substrate 40 surrounds the circumference of the accommodating cavity 30, and the current flowing within the film-forming substrate 40 is transmitted in the circumferential direction of the accommodating cavity 30, this is equivalent to the current performing a cutting motion in the magnetic field, thereby causing the magnetic field to generate an Ampere force perpendicular to the axial direction of the accommodating cavity 30 on the current. The Ampere force is the magnetic attraction generated by the magnetic field on the film-forming substrate 40. Perpendicular to the accommodating cavity 30 can include a direction toward the accommodating cavity 30 or a direction away from the accommodating cavity 30. According to the left-hand rule, simply changing the direction of the current transmission can change the direction of the Ampere force, thereby causing the generated magnetic attraction to be directed toward the accommodating cavity 30.

[0115] The magnetic field around the electromagnetic coil 1011 is related to the on / off state of the current in the electromagnetic coil 1011 . When the current in the electromagnetic coil 1011 is disconnected, the magnetic field around the electromagnetic coil 1011 disappears.

[0116] The magnetic induction intensity of the electromagnetic coil 1011 is also related to the magnitude of the current passed through the electromagnetic coil 1011. The greater the current passed through the electromagnetic coil 1011, the greater the magnetic induction intensity of the electromagnetic coil 1011, and the greater the magnetic attraction force generated by the electromagnetic coil 1011 on the film-forming substrate 40.

[0117] 8 and 9 , FIG8 is a schematic side view of the cooling body of some embodiments of the present application; FIG9 is a schematic three-dimensional view of the film-forming cooling device of some embodiments of the present application.

[0118] In some embodiments, the cooling body 100 may further include a first end 100b and a second end 100c respectively connected to the two axial ends of the accommodating cavity, and the side wall 100a of the cooling body is connected between the first end 100b and the second end 100c, and surrounds the circumference of the first end 100b and the second end 100c respectively.

[0119] The electromagnetic coil 1011 is connected to the first end 100 b and the second end 100 c at both ends of the accommodating cavity 30 in the axial direction, so as to fix the electromagnetic coil 1011 in the accommodating cavity 30 .

[0120] In some embodiments, the electromagnetic coil 1011 may be connected to the first end 100 b and the second end 100 c through connectors 50 , respectively.

[0121] In some embodiments, the connector 50 may have a hollow portion, into which the ends of the electromagnetic coil 1011 are inserted from the side of the connector 50 to be secured to the connector 50. The first end 100b and the second end 100c each have a through hole, into which the connector 50 is inserted to connect with the first end 100b or the second end 100c. In this way, the two ends of the electromagnetic coil 1011 can be secured to the first end 100b and the second end 100c, respectively.

[0122] It can be seen that by controlling the on and off of the current in the electromagnetic coil 1011, the magnetism of the electromagnetic coil 1011 can be controlled. The magnitude of the current can also be controlled to adjust the magnitude of the magnetic induction intensity of the electromagnetic coil 1011, thereby achieving the control of the magnetic attraction force exerted by the electromagnetic coil 1011 on the film-forming substrate 40. In this way, the magnetic attraction force exerted on the film-forming substrate 40 can be adjusted to suit the magnitude of the magnetic attraction force required by different film-forming substrates 40, thereby enabling the film-forming substrate 40 to be tightly adsorbed to the surface of the cooling body 100.

[0123] Refer to FIG10 , which is a side cross-sectional view of a film forming cooling device according to some other embodiments of the present application including an electromagnetic coil.

[0124] According to some embodiments of the present application, the electromagnetic coil 1011 includes at least two parts that are arranged axially along the accommodating cavity and are independent of each other, and the at least two parts include an adjacent first part 101a and a second part 101b, and the second part 101b is closer to the axial end of the accommodating cavity than the first part 101a.

[0125] Mutually independent means that at least two parts are not electrically connected to each other. In other words, each part can form an independent current loop, so that the current flowing in each part can be adjusted separately, and thus the magnetic induction intensity of each part can be adjusted separately.

[0126] In some embodiments, the at least two parts can be independent of each other, such that the at least two parts are spaced apart from each other so that adjacent parts of the at least two parts do not contact each other. Thus, the outer surface of the electrical conductor wound into the electromagnetic coil 1011 can be conductive or non-conductive. For example, the electromagnetic coil 1011 can be wound using bare conductive wire. Alternatively, the electromagnetic coil 1011 can be wound using conductive wire coated with an insulating material.

[0127] In other embodiments, the at least two parts may be independent of each other, or the at least two parts may be in contact with each other, and the outer surface of the electrical conductor wound into the electromagnetic coil 1011 may be coated with an insulating material. In this way, the different parts of the electromagnetic coil 1011 can be in close contact with each other, increasing the arrangement density and thus enhancing the magnetic induction strength of the electromagnetic coil 1011.

[0128] In some embodiments, the material of at least two parts may be the same.

[0129] In other embodiments, the materials of at least two parts may be different from each other.

[0130] In some further embodiments, in at least two portions, a partial amount of material may be the same, and a partial amount of material and a remaining partial amount of material may be different.

[0131] The second part 101b is closer to the axial end of the accommodating chamber 30 than the first part 101a, that is, the first part 101a is arranged near the axial middle part of the accommodating chamber 30, and the second part 101b is arranged near the axial end of the accommodating chamber 30, so that the magnetic induction intensity of the first part 101a can be adjusted, that is, the magnetic attraction force generated on the axial middle part of the accommodating chamber 30 on the film-forming substrate 40 can be adjusted, and the magnetic induction intensity of the second part 101b can be adjusted, that is, the magnetic attraction force generated on the axial end of the accommodating chamber 30 on the film-forming substrate 40 can be adjusted.

[0132] In some embodiments, the film-forming substrate 40 surrounds the circumference of the accommodating chamber 30, and in the axial direction of the accommodating chamber, the length of the film-forming substrate 40 is not less than the length of the accommodating chamber 30. In other words, the magnetic attraction force generated by the magnetic component 101 can act on the film-forming substrate 40 entirely along the axial direction of the accommodating chamber.

[0133] In some embodiments, when the axial dimension of the electromagnetic coil 1011 is smaller than the axial dimension of the accommodating cavity 30, the magnetic induction intensity at the axial end of the accommodating cavity 30 is smaller, so that the magnetic attraction force generated at this location on the film-forming substrate 40 is smaller, which may cause the film-forming substrate 40 surrounding the axial end of the accommodating cavity 30 to be unable to fit tightly onto the cooling body 100.

[0134] In other embodiments, the size of the electromagnetic coil 1011 along the axial direction of the accommodating chamber 30 is not smaller than the size of the accommodating chamber 30, but the size of the film-forming substrate 40 along the axial direction of the accommodating chamber 30 is larger than the size of the electromagnetic coil 1011 along the axial direction of the accommodating chamber 30. That is, the edge position of the film-forming substrate 40 along the axial direction of the accommodating chamber 30 does not correspond to the end of the electromagnetic coil 1011, thereby making the magnetic attraction force at the edge position of the film-forming substrate 40 smaller than the magnetic attraction force at the middle position, thereby making it impossible for the edge position of the film-forming substrate 40 to fit tightly onto the cooling body 100. For example, when the film-forming substrate 40 also covers the surfaces of the first end 100b and the second end 100c of the cooling body 100, since the first end 100b and the second end 100c are located at the two ends of the axial direction of the accommodating chamber 30 and are not used to enclose the accommodating chamber 30, the size of the film-forming substrate 40 along the axial direction of the accommodating chamber 30 is larger than the size of the electromagnetic coil 1011 along the axial direction of the accommodating chamber 30.

[0135] Based on the above considerations, the embodiment of the present application sets the second part 101b to be closer to the axial end of the accommodating cavity than the first part 101a, so that the magnetic induction intensity at the end and the middle part of the accommodating cavity 30 can be adjusted respectively. The magnetic induction intensity at the end of the accommodating cavity 30 can be adjusted to be stronger than the magnetic induction intensity in the middle part of the accommodating cavity 30, thereby compensating for the magnetic attraction force at the end of the accommodating cavity 30.

[0136] In some embodiments, the second portion 101b may correspond to the axial end of the accommodating cavity 30. In other embodiments, the second portion 101b may also be disposed close to the axial end of the accommodating cavity 30.

[0137] It is not difficult to find that by separately regulating the magnetic induction intensities of at least two independent portions, the magnetic attraction forces generated by the electromagnetic coil 1011 at the axial ends and middle portions of the accommodating cavity 30 can be regulated. This allows the electromagnetic coil 1011 to generate strong magnetic attraction forces on the entire film-forming substrate 40 at both the axial ends and middle portions of the accommodating cavity 30. Furthermore, a uniform magnetic attraction force can be generated on the entire film-forming substrate 40, enabling the film-forming substrate 40 to be evenly attached to the surface of the cooling body 100.

[0138] According to some embodiments of the present application, in the axial direction of the accommodating cavity, the length of the first portion 101 a is greater than the length of the second portion 101 b .

[0139] Since the direction of the magnetic flux lines of the magnetic field generated by the electromagnetic coil 1011 is from one end of the electromagnetic coil 1011 in the axial direction of the accommodating chamber 30 to the other end, the longer the length of the electromagnetic coil 1011 in the axial direction of the accommodating chamber 30, the larger the size of the magnetic field generated by the electromagnetic coil 1011 in the axial direction of the accommodating chamber 30, and thus it can generate magnetic attraction on the film-forming substrate 40 within the range of the magnetic field distribution.

[0140] In the axial direction of the accommodating cavity, the length of the first portion 101a is greater than that of the second portion 101b. This allows the first portion 101a to generate a magnetic attraction force on a larger film-forming substrate 40 than the second portion 101b. In other words, the second portion 101b can generate a magnetic attraction force specifically on the film-forming substrate 40 corresponding to the axial end of the accommodating cavity 30.

[0141] In this way, the magnetic induction intensity at the end of the accommodating cavity 30 can be reinforced by adjusting the magnetic induction intensity of the second part 101b, so that the edge position of the cooling body 100 along the axial direction of the accommodating cavity 30 also has a strong magnetic attraction to the film-forming substrate 40, so that the film-forming substrate 40 supported on the edge position of the cooling body 100 can fit tightly on the cooling body 100.

[0142] Refer to FIG. 11 , which is a side cross-sectional view of a film forming cooling device according to some other embodiments of the present application including an electromagnetic coil.

[0143] According to some embodiments of the present application, the at least two parts further include a third part 101c, and the third part 101c is located on a side of the first part 101a away from the second part 101b.

[0144] That is, the third portion 101c is closer to the axial end of the accommodating cavity 30 than the first portion 101a. The second portion 101b and the third portion 101c correspond to the two axial ends of the accommodating cavity 30, respectively, thereby being able to regulate the magnetic induction intensity at the two axial ends of the accommodating cavity 30 respectively.

[0145] In some embodiments, the third portion 101 c may correspond to one axial end of the accommodating cavity 30 , and the second portion 101 b may correspond to the other axial end of the accommodating cavity 30 .

[0146] In other embodiments, the third portion 101c may also be disposed near one axial end of the accommodating cavity 30 .

[0147] The third part 101c and the second part 101b are respectively located at the two ends of the accommodating chamber 30 in the axial direction, and the first part 101a is located in the middle part of the accommodating chamber 30 in the axial direction, so that the electromagnetic coil 1011 can generate a strong magnetic attraction force on the film-forming substrate 40 in the axial direction of the entire accommodating chamber 30.

[0148] According to some embodiments of the present application, in the axial direction of the accommodating cavity, the length of the first portion 101 a is greater than the length of the third portion 101 c .

[0149] In this way, along the axial direction of the receiving chamber, the first portion 101a can generate a magnetic attraction force for a larger film-forming substrate 40 than the third portion 101c. In other words, the third portion 101c can generate a magnetic attraction force specifically for the film-forming substrate 40 corresponding to the axial end of the receiving chamber 30.

[0150] In some embodiments, in the axial direction of the accommodating cavity, the length of the first portion 101a is greater than the length of the third portion 101c, and further greater than the length of the second portion 101b.

[0151] In some embodiments, in the axial direction of the accommodating cavity, the ratio of the length of the first part 101a to the length of the accommodating cavity 30 can be 0.5 to 0.8, the ratio of the length of the second part 101b to the length of the accommodating cavity 30 can be 0.1 to 0.25, and the ratio of the length of the third part 101c to the length of the accommodating cavity 30 can be 0.1 to 0.25.

[0152] Within the above range, the magnetic attraction force generated by the second portion 101 b and the third portion 101 c on the film-forming substrate 40 corresponding to the ends of the accommodating chamber 30 in the axial direction can be reinforced.

[0153] In some embodiments, along the axial direction of the accommodating cavity, the length of the second part 101b can be equal to the length of the third part 101c, which can balance the magnetic attraction of the axial end and middle parts of the accommodating cavity 30, and then generate a uniform magnetic attraction on the entire film-forming substrate 40, so that the film-forming substrate 40 can be flatly attached to the surface of the cooling body 100.

[0154] In the above technical solution, the magnetic induction intensity at both ends of the accommodating cavity 30 can be reinforced by adjusting the magnetic induction intensity of the second part 101b and the third part 101c, so that the two relative edge positions of the cooling body 100 along the axial direction of the accommodating cavity 30 can have a strong magnetic attraction force on the film-forming substrate 40, further improving the bonding force of the film-forming substrate 40 at the two edge positions of the cooling body 100.

[0155] According to some embodiments of the present application, at least two parts are connected to different power sources.

[0156] Each of the at least two parts is connected to the positive pole and the negative pole of a different power source, so that the different power sources supply power to each part respectively, and current flows through each part.

[0157] It can be understood that the current flows in the same direction in each part, so that the direction of the magnetic field generated by the electromagnetic coil 1011 is the same, and thus the direction of the magnetic attraction generated by each part is the same, all towards the accommodating cavity 30.

[0158] In this way, the current flowing in each part can be independently controlled to regulate the magnetic induction intensity generated by each part, and then the magnetic induction intensity generated by the electromagnetic coil 1011 on the film-forming substrate 40 at different axial positions of the accommodating cavity 30 can be separately regulated.

[0159] According to some embodiments of the present application, along the axial direction of the accommodating cavity, the turn density on at least one end of the electromagnetic coil 1011 is greater than the turn density in the middle part, and the turn density is the number of turns of the electromagnetic coil 1011 per unit length.

[0160] The unit length refers to the unit length of the electromagnetic coil 1011 along the axial direction of the accommodating cavity 30. When the current flowing through the electromagnetic coil 1011 remains constant, the greater the turn density of the electromagnetic coil 1011, the denser the electromagnetic coil 1011 is wound, the greater the magnetic induction intensity generated by the electromagnetic coil 1011, and thus the greater the magnetic attraction force exerted by the electromagnetic coil 1011 on the film-forming substrate 40.

[0161] That is to say, the electromagnetic coil 1011 can be made of continuously wound electrical conductors, and the magnitude of the magnetic attraction force of the electromagnetic coil 1011 at at least one end and the middle part in the axial direction of the accommodating cavity 30 can be controlled separately by controlling the different density of the turns of the electromagnetic coil 1011 at the end and the middle part.

[0162] In some embodiments, in the axial direction of the accommodating cavity, the turn density at one end portion of the electromagnetic coil 1011 is greater than the turn density at the middle portion.

[0163] In other embodiments, in the axial direction of the accommodating cavity, the turn density at both ends of the electromagnetic coil 1011 may be greater than the turn density at the middle portion.

[0164] In some embodiments, in the axial direction of the accommodating cavity, the length of the middle portion of the electromagnetic coil 1011 may be greater than the length of the end portion of the electromagnetic coil 1011 .

[0165] In some embodiments, along the axial direction of the accommodating cavity, the ratio of the length of one end of the electromagnetic coil 1011 to the length of the accommodating cavity 30 can be 0.1 to 0.25, the ratio of the length of the other end of the electromagnetic coil 1011 to the length of the accommodating cavity 30 can be 0.1 to 0.25, and the ratio of the length of the middle part of the electromagnetic coil 1011 to the length of the accommodating cavity 30 can be 0.5 to 0.8.

[0166] In some embodiments, the lengths of the two ends of the electromagnetic coil 1011 with a relatively larger turn density may be equal.

[0167] By adjusting the turn density at different locations of the electromagnetic coil 1011, the current flowing through the entire electromagnetic coil 1011 can be kept constant, while also allowing the magnetic induction intensity at the axial ends and the middle portion of the accommodating cavity 30 to differ. Furthermore, the magnetic induction intensity at at least one axial end of the accommodating cavity 30 is greater than that at the middle portion, thereby reinforcing the magnetic induction intensity at at least one end of the accommodating cavity 30. This compensates for the magnetic attraction generated by the electromagnetic coil 1011 at the axial edge of the accommodating cavity 30 of the film-forming substrate 40, resulting in a stronger magnetic attraction at the edge of the film-forming substrate 40.

[0168] Refer to FIG12 , which is a schematic diagram of the three-dimensional structure of the magnetic component in some embodiments of the present application.

[0169] According to some embodiments of the present application, the magnetic component 101 includes an electromagnetic coil 1011 and a magnet 1012, the magnet 1012 has two poles with different polarities, and the two poles are respectively located at the two ends of the magnet 1012 along the axial direction of the accommodating cavity 30, and at least part of the electromagnetic coil 1011 is spirally coiled around the outer periphery of the magnet 1012.

[0170] The two magnetic poles with different magnetic properties are the north pole and the south pole of the magnet 1012. The two magnetic poles are located at the two ends of the magnet 1012 along the axial direction of the accommodation cavity 30, so that the magnetic flux lines of the magnetic field generated by the magnet 1012 outside the cooling body 100 point in the direction of the south pole.

[0171] The electromagnetic coil 1011 is spirally wound around the outer circumference of the magnet 1012, so that the magnetic field generated by the electromagnetic coil 1011 and the magnetic field generated by the magnet 1012 can be superimposed, thereby greatly enhancing the magnetic induction intensity.

[0172] In some embodiments, the magnet 1012 extends axially along the accommodating cavity, and the electromagnetic coil 1011 is spirally wound around the outer circumference of the magnet 1012 so that the N pole and S pole of the electromagnetic coil 1011 are respectively located at the two axial ends of the accommodating cavity, that is, the magnetic field direction of the magnetic lines of force of the magnetic field of the electromagnetic coil 1011 is the same as the magnetic field direction of the magnet 1012, further enhancing the magnetic induction intensity.

[0173] In some embodiments, along the axial direction of the accommodating cavity, the length of the magnet 1012 may be smaller than the length of the electromagnetic coil 1011 , and a portion of the electromagnetic coil 1011 is spirally wound around the outer circumference of the magnet 1012 .

[0174] In other embodiments, along the axial direction of the accommodating cavity, the length of the magnet 1012 may be equal to the length of the electromagnetic coil 1011 , and all the electromagnetic coils 1011 are spirally wound around the outer circumference of the magnet 1012 .

[0175] In some other embodiments, along the axial direction of the accommodating cavity, the length of the magnet 1012 may also be greater than the length of the electromagnetic coil 1011 , and all the electromagnetic coils 1011 are spirally wound around the outer circumference of the magnet 1012 .

[0176] It can be seen that the magnet 1012 can also generate a magnetic field. Through the cooperation of the electromagnetic coil 1011 and the magnet 1012, the magnetic induction intensity of the magnetic component 101 can be enhanced, thereby enhancing the magnetic attraction of the magnetic component 101 to the film-forming substrate 40.

[0177] Refer to FIG. 13 , which is a side cross-sectional view of a film forming cooling device according to some embodiments of the present application including a magnet.

[0178] According to some embodiments of the present application, the magnetic component may also only include the magnet 1012 , which has two poles with different polarities, and the two poles are respectively located at two ends of the magnet 1012 along the axial direction of the accommodating cavity 30 .

[0179] The magnet 1012 extends along the axial direction of the accommodating cavity, and the two poles of the magnet 1012 are respectively the N pole and the S pole. The direction of the magnetic flux lines of the magnetic field generated by the magnet 1012 on the surface of the cooling body 100 is from one end on the axial direction of the accommodating cavity to the other end. When the film-forming substrate surrounds the circumference of the accommodating cavity and the transmission direction of the current flowing in the film-forming substrate is the circumference of the accommodating cavity, the magnetic field can generate a magnetic attraction force perpendicular to the axial direction of the accommodating cavity on the current.

[0180] In some embodiments, magnet 1012 may be a permanent magnet that can generate a magnetic field without the need for power. Permanent magnets may include alloy permanent magnet materials and ferrite permanent magnet materials. Alloy permanent magnet materials may include rare earth metals, such as neodymium iron boron permanent magnet materials, samarium cobalt permanent magnet materials, or alnico permanent magnet materials. Ferrite permanent magnet materials may include materials based on iron oxide with the addition of other oxides such as magnesium oxide, aluminum oxide, or perovskite structures.

[0181] In other embodiments, the magnet 1012 may be an electromagnet that generates a magnetic field when energized. The magnetic induction intensity of the magnetic field can be adjusted based on the magnitude of the current supplied, making it easy to control the magnitude of the magnetic attraction exerted on the film-forming material. The electromagnet may be made of a steel electromagnet, a marble ferrite electromagnet, a cemented carbide electromagnet, or an aluminum graphite electromagnet.

[0182] The magnetic field lines generated by the magnet 1012 extend along the axial direction of the receiving cavity, generating a magnetic attraction force on the film-forming substrate toward the receiving cavity. Furthermore, the electromagnetic coil 1011 or the magnet 1012 can be flexibly selected as the magnetic component to meet the magnetic attraction requirements of different film-forming substrates, thereby enhancing the adhesion of the film-forming substrate to the cooling body 100.

[0183] Referring to Figure 3, according to some embodiments of the present application, the cooling body 100 is annular, the magnetic component 101 extends along the axial direction of the accommodating cavity, and in the transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the distance between the geometric center of the magnetic component 101 and the geometric center of the accommodating cavity 30 to the outer diameter of the cooling body 100 is 0 to 1 / 10.

[0184] The axial direction of the annular cooling body 100 is the axial direction of the accommodating cavity. In some embodiments, the cooling body 100 may include an annular sidewall, which encloses the accommodating cavity 30, and the axial direction of the accommodating cavity is the axial direction of the annular sidewall.

[0185] Because the magnetic field is distributed in a rotationally symmetrical annular pattern along the central axis of the magnetic component 101, when the central axis of the accommodating cavity 30 coincides with the central axis of the magnetic component 101, the magnetic field will be distributed in a symmetrical annular pattern along the circumference of the cooling body 100. When the central axis of the accommodating cavity 30 is offset from the central axis of the magnetic component 101, the magnetic field will be distributed in an asymmetrical annular pattern along the circumference of the cooling body 100.

[0186] In a transverse direction perpendicular to the axial direction of the accommodating cavity, the geometric center of the magnetic component 101 is located on the central axis of the magnetic component 101 , and the geometric center of the accommodating cavity 30 is located on the central axis of the accommodating cavity 30 .

[0187] It is understandable that the geometric center of the magnetic component 101 and the geometric center of the accommodating cavity 30 change with the change of the cross-sectional shapes of the magnetic component 101 and the accommodating cavity 30 in the axial direction perpendicular to the accommodating cavity 30 .

[0188] In some embodiments, the cross-sectional shape of the magnetic component 101 in the axial direction perpendicular to the accommodating cavity is any one of a circle, an ellipse, a rectangle, or a polygon. The geometric center of the magnetic component 101 can be, in order, the center of the circle, the center of symmetry of the ellipse, the intersection of two diagonals, and the center of gravity of the polygon. If the magnetic component 101 is an electromagnetic coil 1011, the cross-sectional shape of the magnetic component 101 in the axial direction perpendicular to the accommodating cavity can be the shape formed by the wound electromagnetic coil 1011.

[0189] In the axial direction perpendicular to the accommodating cavity, the cross-sectional shape of the accommodating cavity 30 is any one of a circle, an ellipse, a rectangle or a polygon. The geometric center of the accommodating cavity 30 can be the center of the circle, the center of symmetry of the ellipse, the intersection of two diagonals and the center of gravity of the polygon in sequence.

[0190] Based on the above considerations, in some embodiments, in a transverse direction perpendicular to the axial direction of the accommodating cavity, the distance between the geometric center of the magnetic component 101 and the geometric center of the accommodating cavity 30 is zero, so that the ratio of the distance between the geometric center of the magnetic component 101 and the geometric center of the accommodating cavity 30 to the outer diameter of the cooling body 100 is zero, that is, the geometric center of the magnetic component 101 coincides with the geometric center of the accommodating cavity 30, thereby maximizing the uniformity of the magnetic flux lines in the magnetic field along the circumference of the accommodating cavity 30. When the cross-sectional shape of the accommodating cavity 30 is circular, the magnetic flux lines in the magnetic field are evenly distributed along the circumference of the accommodating cavity 30, thereby making the magnetic induction intensity uniform in the circumference of the accommodating cavity 30, greatly improving the flatness of the circumferential surface of the film-forming substrate 40 attached to the cooling body 100.

[0191] In other embodiments, in the transverse direction perpendicular to the axial direction of the accommodating cavity, the distance between the geometric center of the magnetic component 101 and the geometric center of the accommodating cavity 30 may also be greater than 0 and less than or equal to 1 / 10 of the outer diameter of the cooling body 100. For example, the ratio of the distance between the geometric center of the magnetic component 101 and the geometric center of the accommodating cavity 30 to the outer diameter of the cooling body 100 may be 1 / 50, 1 / 30, 1 / 20 or 1 / 15, etc.

[0192] Within the above range, the geometric center of the magnetic component 101 is less offset from the geometric center of the accommodating cavity 30, so that the magnetic induction intensity generated by the magnetic component 101 along the circumference of the cooling component is more uniform, so that the adsorption force on the film-forming substrate 40 is balanced in the circumference of the cooling component, which helps the film-forming substrate 40 to fit smoothly on the circumferential surface of the cooling body 100.

[0193] According to some embodiments of the present application, the cooling body 100 is annular, and in a transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the thickness of the electromagnetic coil 1011 to the outer diameter of the cooling body 100 is 1 / 50 to 1 / 4.

[0194] It is understood that the thickness of the electromagnetic coil 1011 in a transverse direction perpendicular to the axial direction of the accommodation cavity can be the thickness of the electromagnetic coil 1011 in the transverse direction perpendicular to the axial direction of the accommodation cavity. In other words, the electromagnetic coil 1011 can be a coil formed by winding a single layer or multiple layers of wire, and has a ring shape along a transverse cross section. The coil thickness refers to the distance from the inner boundary to the outer boundary of the ring along the radial direction.

[0195] The cooling body 100 may include an annular side wall, the side wall enclosing the accommodating cavity 30 , and the outer diameter of the cooling body 100 is the outer diameter of the annular side wall.

[0196] It is worth noting that when the thickness of the electromagnetic coil 1011 is too large, the magnetic field generated by the part of the electromagnetic coil 1011 close to its geometric center has a negligible effect compared to the magnetic field generated by the part far from its geometric center. Therefore, if the thickness of the electromagnetic coil 1011 is too large, it will cause the magnetic induction intensity to fail to be enhanced while occupying too much space in the accommodating cavity 30.

[0197] Based on the above considerations, the ratio of the thickness of the electromagnetic coil 1011 to the outer diameter of the cooling body 100 is set to 1 / 50 to 1 / 4. Within this range, the thickness of the electromagnetic coil 1011 will not be too large, thus avoiding occupying too much space in the accommodating cavity 30, and can also improve the problem of the electromagnetic coil 1011 being too thick and causing heat. In addition, within this range, the thickness of the electromagnetic coil 1011 will not be too small, so that the resistance of the electromagnetic coil 1011 will not be too large. In this way, the heating problem caused by the excessive resistance of the electromagnetic coil 1011 can be improved, so that the cooling body 100 has a better cooling effect on the film-forming substrate 40. At the same time, the current in the electromagnetic coil 1011 is relatively large, so that the magnetic induction intensity generated by the electromagnetic coil 1011 is large enough to generate a large magnetic attraction force on the film-forming substrate 40, so that the film-forming substrate 40 is tightly attached to the cooling body 100.

[0198] In some embodiments, in the transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the thickness of the electromagnetic coil 1011 to the outer diameter of the cooling body 100 can be 1 / 10 to 1 / 4. Within this range, it can better balance the problem of severe heating of the electromagnetic coil 1011 due to its excessive thickness and the problem of excessive resistance of the electromagnetic coil 1011 due to its excessive thickness. While greatly improving the cooling effect of the cooling body 100 on the film-forming substrate 40, the performance of the electromagnetic coil 1011 is improved.

[0199] It can be understood that in other embodiments, in the transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the thickness of the electromagnetic coil 1011 to the outer diameter of the cooling body 100 can also be 1 / 50, 1 / 35, 1 / 20 or 1 / 15, etc., which can improve the problem of severe heating of the electromagnetic coil 1011.

[0200] According to some embodiments of the present application, the electromagnetic coil 1011 is formed by a single wire spirally wound along the axial direction of the accommodating cavity, and the diameter of the single wire can be 0.1 millimeter (mm) to 20 mm.

[0201] In some embodiments, the electromagnetic coil 1011 formed by winding a single wire can be a single-layer coil.

[0202] In other embodiments, the electromagnetic coil 1011 formed by winding a single wire may also be a multi-layer coil, for example, a double-layer, triple-layer or more-layer coil.

[0203] In some embodiments, the electromagnetic coil 1011 includes multiple turns of coils arranged in sequence, and two adjacent turns of coils can be arranged closely.

[0204] The diameter of a single wire is within the range of 0.1 mm to 20 mm. This, on the one hand, prevents the diameter of the single wire from being too small, thereby preventing the resistance from being too high, thus alleviating the problem of heating caused by excessive resistance of the wire. On the other hand, it prevents the diameter of the single wire from being too large, thereby alleviating the problem of large gaps between wires when arranged, thus wasting space. It also alleviates the problem of excessive space occupied by the thick electromagnetic coil 1011 in the accommodating cavity 30.

[0205] In some embodiments, the diameter of a single wire may be 0.1 mm, 1 mm, 5 mm, 8 mm, 10 mm, 15 mm, 18 mm, or 20 mm.

[0206] Refer to FIG14 , which is a schematic diagram of the three-dimensional structure of the film forming cooling device according to other embodiments of the present application.

[0207] According to some embodiments of the present application, when the magnetic component 101 includes an electromagnetic coil 1011, the film-forming cooling device also includes: a metal part 102, located in the accommodating cavity 30 and extending along the axial direction of the accommodating cavity, and at least part of the electromagnetic coil 1011 is spirally coiled around the outer periphery of the metal part 102.

[0208] In some embodiments, in the axial direction of the accommodating cavity, the length of the metal member 102 is smaller than the length of the electromagnetic coil 1011 , and a portion of the electromagnetic coil 1011 is spirally wound around the outer circumference of the metal member 102 .

[0209] In other embodiments, in the axial direction of the accommodating cavity, the length of the metal member 102 is equal to the length of the electromagnetic coil 1011 , and all the electromagnetic coils 1011 are spirally wound around the outer circumference of the metal member 102 .

[0210] In some other embodiments, in the axial direction of the accommodating cavity, the length of the metal member 102 is greater than the length of the electromagnetic coil 1011 , and all the electromagnetic coils 1011 are spirally wound around the outer circumference of the metal member 102 .

[0211] FIG15 is a schematic diagram of the three-dimensional structure of the film forming cooling device according to some other embodiments of the present application.

[0212] 8 and 15 , in some embodiments, the metal member 102 may also be connected to the first end 100b and the second end 100c of the cooling body 100 via the connector 50, thereby securing the metal member 102 within the accommodating cavity 30. For example, the metal member 102 may be secured to the end surface of the connector 50 facing the accommodating cavity 30.

[0213] In some embodiments, in a transverse direction along the axial direction of the accommodating cavity 30 , the cross-sectional shape of the metal member 102 may be any one of circular, elliptical, rectangular, or polygonal.

[0214] In some embodiments, in the transverse direction along the axial direction of the accommodating cavity 30 , the cross-sectional shape of the metal member 102 may be the same as the shape enclosed by the electromagnetic coil 1011 .

[0215] In some embodiments, the material of the metal member 102 may include ferromagnetic materials, nickel-iron alloys, iron-aluminum alloys, and other materials with relatively high magnetic permeability. Magnetic permeability is a physical quantity that characterizes the magnetic properties of a magnetic medium.

[0216] Since the metal member 102 has a high magnetic permeability, it can gather the magnetic field in the electromagnetic coil 1011 together, thereby enhancing the magnetic induction intensity of the entire electromagnetic coil 1011 .

[0217] According to some embodiments of the present application, the metal part 102 is located in the electromagnetic coil 1011 , and in the axial direction of the accommodating cavity, the ratio of the length of the metal part 102 to the length of the electromagnetic coil 1011 is 2 / 3 to 1.1.

[0218] The metal part 102 is located within the electromagnetic coil 1011, that is, the metal part 102 penetrates the area enclosed by the electromagnetic coil 1011 and faces the electromagnetic coil 1011 circumferentially. The metal part 102 is able to gather the magnetic field generated by the electromagnetic coil 1011 circumferentially facing it. The longer the metal part 102 is along the axial direction of the accommodating cavity, the larger the area of ​​the metal part 102 facing the electromagnetic coil 1011 circumferentially, thereby enabling the metal part 102 to gather more of the magnetic field generated by the electromagnetic coil 1011.

[0219] In some embodiments, in the axial direction of the accommodating cavity, the length of the metal member 102 may be equal to 2 / 3 of the length of the electromagnetic coil 1011 .

[0220] In other embodiments, in the axial direction of the accommodating cavity, the ratio of the length of the metal member 102 to the length of the electromagnetic coil 1011 may also be 0.8-1.

[0221] In some other embodiments, the ratio of the length of the metal member 102 to the length of the electromagnetic coil 1011 may also be greater than 1, for example, may be 1.1.

[0222] Within the above range, the length of the metal member 102 is not too small compared to the length of the electromagnetic coil 1011 , and the magnetic field generated by the electromagnetic coil 1011 can be concentrated to a greater extent, thereby greatly enhancing the magnetic induction intensity of the electromagnetic coil 1011 .

[0223] According to some embodiments of the present application, in a transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the cross-sectional area of ​​the metal member 102 to the area enclosed by the electromagnetic coil 1011 is 2 / 3 to 1.

[0224] In some embodiments, in the transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the cross-sectional area of ​​the metal part 102 to the area enclosed by the electromagnetic coil 1011 is less than 1 and greater than or equal to 2 / 3, then there is a gap between the metal part 102 and the electromagnetic coil 1011, which is beneficial to the heat dissipation of the electromagnetic coil 1011.

[0225] In other embodiments, in a transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the cross-sectional area of ​​the metal part 102 to the area enclosed by the electromagnetic coil 1011 is equal to 1, and the electromagnetic coil 1011 can be spirally wound on the outer peripheral surface of the metal part 102.

[0226] For example, in some embodiments, the ratio of the cross-sectional area of ​​the metal member 102 to the area enclosed by the electromagnetic coil 1011 may be 2 / 3, 0.75, 0.8, 0.9, or 1.

[0227] The ratio of the cross-sectional area of ​​the metal part 102 to the area enclosed by the electromagnetic coil 1011 in the transverse direction perpendicular to the axial direction of the accommodating cavity is 2 / 3 to 1, so that the area of ​​the region enclosed by the electromagnetic coil 1011 occupied by the metal part 102 in the transverse direction is large enough, thereby improving the metal part 102's ability to gather the magnetic field in the electromagnetic coil 1011 and enhancing the magnetic induction intensity of the entire electromagnetic coil 1011.

[0228] According to some embodiments of the present application, the relative magnetic permeability of the metal member 102 is greater than or equal to 10.

[0229] The relative magnetic permeability of the metal part 102 refers to the ratio of the magnetic permeability of the metal part to the magnetic permeability of the vacuum. The magnetic permeability of the vacuum refers to the ratio between the magnetic field and the electric field in the vacuum. The magnetic permeability of the vacuum is a constant with a value of 4π×10 -7 Volt·second / ampere·meter (Vs / (A·m)).

[0230] The greater the relative magnetic permeability, the stronger the response of the metal part 102 to the magnetic field, which can gather more magnetic induction lines and enhance the magnetic induction intensity in the electromagnetic coil 1011.

[0231] In some embodiments, the material of the metal member 102 may include at least one of iron, cobalt, or nickel. The relative magnetic permeabilities of iron, cobalt, and nickel are all greater than 10, and they all have strong responses to magnetic fields.

[0232] It is understandable that, in other embodiments, the material of the metal part 102 is not limited to iron, cobalt, and nickel, and only needs to satisfy that the relative magnetic permeability is greater than 10.

[0233] The relative magnetic permeability of the metal part 102 is set to be greater than or equal to 10, so that the metal part 102 can effectively gather magnetic induction lines and enhance the magnetic induction intensity in the electromagnetic coil 1011; thereby greatly enhancing the magnetic induction intensity near the entire electromagnetic coil 1011.

[0234] Refer to FIG16 , which is a schematic diagram of the main structure of the film forming cooling device according to other embodiments of the present application.

[0235] According to some embodiments of the present application, the film-forming substrate 40 has at least one conductive film layer, and the film-forming cooling device also includes: at least two conductive rollers 103, which are respectively in contact with the conductive film layer, and at least two conductive rollers 103 are respectively connected to a power source to pass current into the conductive film layer.

[0236] For the description of the conductive film layer, please refer to the above related description and will not be described in detail here.

[0237] In some embodiments, the film forming cooling device can also serve to transport the film forming substrate 40. During the process of forming a target film layer on the film forming substrate 40, the film forming substrate 40 is attached to the surface of the cooling body 100, and the cooling body 100 cools the film forming substrate 40 to ensure that the quality of the formed target film layer is high.

[0238] When the film-forming substrate 40 is long, the cooling body 100 cannot carry the entire film-forming substrate 40. Based on this, the film-forming substrate 40 can be conveyed along the surface of the cooling body 100, the film-forming substrate 40 on which the target film layer has been formed can be removed from the surface of the cooling body 100, and the film-forming substrate 40 without the target film layer can be conveyed to cover the surface of the cooling body 100 to perform the film-forming process and form the target film layer. This cycle can be repeated until all the desired target film layers are formed on the film-forming substrate 40.

[0239] The conductive rollers 103 respectively abut against the conductive film layer, that is, abut against the film-forming substrate 40 , and play a guiding role in the process of conveying the film-forming substrate 40 , so that the film-forming substrate 40 can be conveyed along a predetermined route, thereby improving the transmission efficiency.

[0240] In some embodiments, the film-forming substrate 40 surrounds a portion of the circumference of the accommodating chamber 30 , and the extending direction of the conductive roller 103 is the same as the axial direction of the accommodating chamber.

[0241] In some embodiments, at least two conductive rollers 103 are arranged at intervals, and the two outermost conductive rollers 103 of the at least two conductive rollers 103 respectively connect the positive and negative poles of the power supply to the conductive film layer to pass current into the conductive film layer. The two outermost conductive rollers 103 of the at least two conductive rollers 103 can be located upstream and downstream, respectively, in the conveying direction of the film-forming substrate 40, so that the film-forming substrate 40 sequentially passes around the surface of one of the conductive rollers 103, the surface of the cooling body 100, and the surface of the other conductive roller 103, so that the two outermost conductive rollers 103 can transmit current to the film-forming substrate 40 attached to the surface of the cooling body 100, thereby allowing the magnetic component 101 to generate a magnetic attraction force on the film-forming substrate 40 attached to the surface of the cooling body 100.

[0242] In some embodiments, there are at least two conductive rollers 103 , and the two conductive rollers 103 are respectively connected to the positive and negative poles of the same power source.

[0243] In other embodiments, the number of at least two conductive rollers 103 is greater than or equal to three, the number of power sources is equal to the number of conductive rollers 103 minus one, and the positive and negative poles of each power source are connected to adjacent conductive rollers 103. The two outermost conductive rollers 103 of the at least two spaced conductive rollers 103 are connected to different power sources, with one conductive roller 103 connected to the positive pole of one power source and the other conductive roller 103 connected to the negative pole of the other power source. The remaining conductive rollers 103 are connected to the positive pole of one power source and the negative pole of the other power source. This allows the conductive rollers 103 to connect multiple power sources in series, increasing the power source voltage, thereby increasing the current flowing into the conductive film layer and enhancing the magnetic attraction generated by the magnetic field on the conductive film layer.

[0244] The following description uses the example of three conductive rollers, each with at least two. The number of power sources can be two. Of the three conductive rollers, one of the two outermost conductive rollers is connected to the positive electrode of one power source, and the other is connected to the negative electrode of the other power source. The center conductive roller is connected to the remaining positive and negative electrodes of the two power sources, respectively. This allows the three conductive rollers to be connected in series, with the series voltage being the sum of the two power source voltages. When the two outermost conductive rollers are in contact with the conductive film layer, the series voltage is applied to the conductive film layer, thereby increasing the current flowing through the conductive film layer.

[0245] In some embodiments, the conductive roller 103 is made of a conductive material, and the outer peripheral surface of the conductive roller 103 is conductive. The conductive material may include a metal material, such as copper, silver, or aluminum.

[0246] In some embodiments, both ends of the conductive roller 103 in the extension direction are covered with insulating sleeves. Thus, when both ends of the conductive roller 103 are fixed, the conductive roller 103 is insulated from other structures, thereby improving the safety of using the conductive roller 103.

[0247] It is not difficult to find that the conductive roller 103 can guide the transmission of the film-forming substrate 40. At the same time, it can pass current into the conductive film layer, so that the magnetic field generated by the magnetic component 101 can generate magnetic attraction to the current, that is, generate magnetic attraction to the film-forming substrate 40.

[0248] Referring to Figure 16, according to some embodiments of the present application, the film forming cooling device also includes: at least one auxiliary roller 104 arranged along the circumference of the cooling body 100, at least one auxiliary roller 104 abuts against the film forming substrate 40, and at least one auxiliary roller 104 has an auxiliary magnetic component therein, and the auxiliary magnetic component is constructed to be able to generate a magnetic attraction force on the film forming substrate 40 toward the accommodating cavity 30.

[0249] The film-forming substrate 40 may be sandwiched between the auxiliary roller 104 and the surface of the cooling body 100 , thereby placing the film-forming substrate 40 flatly in contact with the surface of the cooling body 100 .

[0250] In some embodiments, the extension direction of the auxiliary roller 104 is the same as the axial direction of the accommodating cavity, thereby being able to restrict the film-forming substrate 40 in the circumferential direction of the cooling body 100 .

[0251] In some embodiments, the auxiliary magnetic component may also include either an electromagnetic coil or a magnet.

[0252] In the case where the auxiliary magnetic component is an electromagnetic coil, the electromagnetic coil may be spirally wound in a direction parallel to the axial direction of the accommodating cavity 30 .

[0253] In the case where the auxiliary magnetic component is a magnet, the north pole and the south pole of the magnet may be located at opposite ends in a direction parallel to the axial direction of the accommodation cavity 30 .

[0254] It is worth noting that regardless of whether the auxiliary magnetic component is a magnet or an electromagnetic coil, when current is passed through the auxiliary magnetic component to generate a magnetic field, the direction of the current in the auxiliary magnetic component is opposite to the direction of the current in the magnetic component 101, so that the magnetic attraction generated by the auxiliary magnetic component and the magnetic component 101 is both in the direction of the accommodating cavity 30.

[0255] In some embodiments, the auxiliary roller 104 may be made of an insulating material, such as ceramic, rubber, insulating paint, or asbestos.

[0256] The auxiliary roller 104 can better stick the film-forming substrate 40 to the cooling body 100. At the same time, the auxiliary magnetic component built into the auxiliary roller 104 can also generate a magnetic field, thereby enhancing the magnetic induction intensity around the accommodating cavity 30 and improving the magnetic attraction to the film-forming substrate 40.

[0257] According to some embodiments of the present application, the film forming cooling device further includes: a cooling circuit located in the accommodating chamber 30 , wherein the cooling circuit is located between the inner wall of the accommodating chamber 30 and the magnetic component 101 .

[0258] The film-forming substrate 40 covered on the cooling body 100 and the material attached to the surface of the film-forming substrate 40 can be cooled by the cooling circuit.

[0259] In some embodiments, the cooling circuit may be in contact with the outer peripheral surface of the magnetic component 101 and also in contact with the inner wall of the accommodating cavity 30 , thereby being able to directly transfer heat with the magnetic component 101 and the cooling body 100 .

[0260] In other embodiments, the cooling circuit may also be in contact with one of the magnetic component 101 or the inner wall of the accommodating cavity 30 .

[0261] In some other embodiments, the cooling circuit may not be in contact with the magnetic component 101 or the inner wall of the accommodating cavity 30 .

[0262] In some embodiments, the cooling circuit contains a coolant. The coolant can cool the cooling body 100, thereby allowing the cooling body 100 to absorb heat from the film-forming substrate 40 after heat transfer with the film-forming substrate 40, thereby cooling the film-forming substrate 40. The coolant can also cool the magnetic component 101, facilitating better heat dissipation from the magnetic component 101.

[0263] In some embodiments, the coolant can flow in the cooling circuit, so that the heat absorbed from the film-forming substrate 40 can be taken away in real time, so that the cooling circuit always maintains a low temperature, which has a better cooling effect on both the film-forming substrate 40 and the magnetic component 101.

[0264] In some embodiments, the cooling liquid may include at least one of water, alcohol, ethylene glycol, propylene glycol, methanol, or glycerin.

[0265] In some embodiments, the cooling circuit may include cooling pipes through which the cooling liquid circulates.

[0266] The cooling circuit is close to both the surface of the cooling body 100 and the magnetic component 101. It can not only cool the surface of the cooling body 100, and then cool the film-forming substrate 40 and the material attached to the film-forming substrate 40, but also cool the magnetic component 101, dissipate heat from the magnetic component 101, and improve the problem of damage to the magnetic component 101 due to overheating.

[0267] 17 to 18 , FIG17 is a schematic diagram of the three-dimensional structure of the cooling circuit of some embodiments of the present application from one perspective; FIG18 is a schematic diagram of the three-dimensional structure of the cooling circuit of some embodiments of the present application from another perspective.

[0268] According to some embodiments of the present application, the cooling circuit 105 is spirally wound around the outer circumference of the magnetic component 101 along the axial direction of the accommodating cavity.

[0269] In this way, the cooling circuit 105 is spiral-shaped, which can effectively increase the heat dissipation area of ​​the magnetic component 101 and the cooling body 100 .

[0270] In some embodiments, the magnetic component 101 is an electromagnetic coil 1011 , which is spirally wound along the axial direction of the accommodating cavity. The cooling circuit 105 is spirally wound around the outer circumference of the electromagnetic coil 1011 .

[0271] In some embodiments, the number of turns of the cooling circuit 105 can be the same as the number of turns of the electromagnetic coil 1011, and each turn of the cooling circuit 105 corresponds one-to-one to each turn of the electromagnetic coil 1011, that is, each turn of the cooling circuit 105 is wound on the surface of each turn of the electromagnetic coil 1011, thereby being able to better dissipate heat for the electromagnetic coil 1011.

[0272] In some embodiments, two adjacent turns of the electromagnetic coil 1011 are spaced apart from each other, and each turn of the cooling circuit 105 can also be wound between the two adjacent turns of the coil, and can also achieve contact with the electromagnetic coil 1011 .

[0273] In some embodiments, the number of turns of the cooling circuit 105 may be different from the number of turns of the electromagnetic coil 1011 , and a suitable number of turns may be selected according to different cooling requirements.

[0274] In some embodiments, in the axial direction of the accommodating cavity, the length of the cooling circuit 105 may be greater than or equal to the length of the electromagnetic coil 1011 , thereby achieving a better cooling effect on both the electromagnetic coil 1011 and the cooling body 100 .

[0275] In some embodiments, the cooling circuit 105 may be connected to the first end and the second end of the cooling body 100 via a connector 50 .

[0276] For example, referring to FIG. 19 , FIG. 19 is a schematic structural diagram of a cooling circuit 105 fixed to a connector 50 in some embodiments of the present application.

[0277] The end of the cooling circuit 105 may pass through the lateral opening of the connecting member 50 into the through hole of the connecting member 50 , so as to fix the cooling circuit 105 in the connecting member 50 .

[0278] A cooling circuit 105 is provided which is spirally wound around the outer periphery of the magnetic component 101, and can uniformly dissipate heat in the axial direction of the magnetic component 101 to enhance the heat dissipation effect of the magnetic component 101, and uniformly cool the circumferential direction of the cooling body 100 to enhance the cooling effect of the film-forming substrate 40 and the material attached to the film-forming substrate 40.

[0279] Refer to Figure 20, which is a structural schematic diagram of film forming equipment in some embodiments of the present application.

[0280] The present embodiment provides a film-forming apparatus including the film-forming cooling device of the above embodiment. The film-forming apparatus further includes a first film-forming mechanism 121 for forming a target film layer on a surface of a film-forming substrate 40 supported by a cooling body 100. The film-forming substrate 40 supported by the cooling body 100 is conductive.

[0281] In some embodiments, the target film layer can be formed on either of two opposite surfaces of the film-forming substrate 40 .

[0282] In other embodiments, the target film layer may also be formed on two opposite surfaces of the film-forming substrate 40 .

[0283] In some embodiments, the material forming the target film layer may be a conductive material, for example, a conductive semiconductor material or a metal material, and the metal material may be copper or aluminum.

[0284] In other embodiments, the material forming the target film layer may also be a non-conductive material, such as plastic, ceramic, etc.

[0285] In some embodiments, when the target film layer is formed of a metal material, the first film-forming mechanism 121 may be a vacuum coating mechanism. The vacuum coating mechanism is used to apply metal vapor to the surface of the film-forming substrate 40 under a vacuum environment. The vacuum coating mechanism can be placed in a chamber, and then a vacuum pump is used to evacuate the air in the chamber, creating a vacuum environment in the chamber so that the vacuum coating mechanism can vacuum coat the base film.

[0286] In some embodiments, the vacuum coating mechanism may be an evaporation source, which may be a metal evaporation source, such as an aluminum evaporation source, in which case the metal vapor is aluminum vapor; or a copper evaporation source, in which case the metal vapor is copper vapor.

[0287] The evaporation source may be a metal wire, or a metal block or other structure, which is not specifically limited in the embodiments of the present application.

[0288] In some embodiments, the cooling body 100 and the first film-forming mechanism 121 can be placed opposite each other, so that while the first film-forming mechanism 121 transports the material for forming the target film layer toward the film-forming substrate 40 on the cooling body 100, the cooling body 100 can cool the film-forming substrate 40, thereby ensuring that the temperature of the film-forming substrate 40 is within a normal range.

[0289] Since the cooling body 100 has a built-in magnetic component 101, when current is passed through the conductive film layer, the magnetic field generated by the magnetic component 101 can generate magnetic attraction to the current, thereby adsorbing the film-forming substrate 40 onto the cooling body 100, thereby enhancing the cooling effect of the cooling body 100 on the film-forming substrate 40, improving the problem of wrinkling or deformation of the film-forming substrate 40, and enabling the first film-forming mechanism 121 to form a smooth target film layer on the surface of the film-forming substrate 40, thereby greatly improving the quality and rate of the target film layer.

[0290] According to some embodiments of the present application, the film-forming substrate includes a base and a conductive film layer formed on the base, and the device further includes: a second film-forming mechanism for forming the conductive film layer on the base.

[0291] The substrate can be made of conductive or non-conductive materials.

[0292] In some embodiments, the substrate is non-conductive and may be made of a plastic film having relatively strong tensile strength.

[0293] In some embodiments, the plastic film may be one or more of oriented polypropylene plastic, polyimide plastic, polyethylene terephthalate plastic, cast polypropylene plastic, or polyvinyl chloride plastic, and derivatives, cross-linked products, and copolymers thereof.

[0294] In some embodiments, the conductive film layer may be a metal film layer, and the material of the metal film layer may be, for example, copper or aluminum.

[0295] It is understood that the conductive film layer is formed before the target film layer. In some embodiments, the material of the conductive film layer can be the same as that of the target film layer, and the steps of forming the conductive film layer and forming the target film layer are respectively the front and back stages of the same film forming process. The second film forming mechanism and the first film forming mechanism 121 can be the same film forming mechanism. Before the first film forming mechanism 121 forms the target film layer, a conductive film layer is first formed on the surface of the substrate covering the cooling body 100. Thereafter, under the action of the magnetic component 101, a magnetic attraction force can be generated on the conductive film layer toward the accommodating cavity 30.

[0296] In other embodiments, the material of the conductive film layer may also be different from the material of the target film layer, that is, the conductive film layer and the target film layer are formed respectively in different film forming processes, then the first film forming mechanism 121 and the second film forming structure may be different film forming mechanisms respectively.

[0297] In some embodiments, the second film forming mechanism may also be a vacuum coating mechanism. The principle of forming the conductive film layer by the second film forming mechanism can refer to the above description of forming the target film layer by the first film forming mechanism 121 .

[0298] It is worth noting that the thickness of the conductive film layer can be any thickness, as long as the thickness of the conductive film layer is sufficient to form a current in the conductive film layer.

[0299] In some embodiments, the conductive film layer is formed on only one surface of the substrate, and the target film layer can be formed on the conductive film layer surface of the film-forming substrate 40; or, the target film layer can also be formed on the other surface of the film-forming substrate 40 opposite to the conductive film layer; or, the target film layer can also be formed on the conductive film layer surface of the film-forming substrate 40 and the other surface of the film-forming substrate 40 opposite to the conductive film layer.

[0300] In other embodiments, the conductive film layer is formed on two opposite surfaces of the substrate, and the target film layer can be formed on the conductive film layer on any surface of the substrate; alternatively, the target film layer can also be formed on the conductive film layer on two opposite surfaces of the substrate.

[0301] It is not difficult to find that regardless of whether the substrate is conductive or not, the film-forming substrate 40 can be made conductive through the formed conductive film layer, which expands the selection range of substrate types and further expands the application of film-forming equipment.

[0302] 20 , according to some embodiments of the present application, the film forming apparatus further includes: a substrate transport mechanism, which is used to transport the film forming substrate 40 to the cooling body.

[0303] When the film-forming substrate 40 is long, the cooling body 100 cannot carry the entire film-forming substrate 40. Based on this, a substrate conveying mechanism can be used to convey the film-forming substrate 40 along the surface of the cooling body 100, remove the film-forming substrate 40 on which the target film layer has been formed from the surface of the cooling body 100, and convey the film-forming substrate 40 on which the target film layer has not been formed to cover the surface of the cooling body 100 to perform the film-forming process and form the target film layer. This cycle continues until all the desired target film layers are formed on the film-forming substrate 40.

[0304] In some embodiments, the substrate transport mechanism may include an unwinding roller 131 and a winding roller 132, with the film-forming substrate 40 being wound around the unwinding roller 131 and the winding roller 132 at both ends along the length direction. The unwinding roller 131 is positioned at the upstream end of the conveying direction of the film-forming substrate 40 and is used to transport the film-forming substrate 40 along the conveying direction to the surface of the cooling body. The winding roller 132 is positioned at the downstream end of the conveying direction and is used to collect the film-forming substrate 40 on which the target film layer has been formed.

[0305] In some embodiments, the film forming cooling device further includes: at least two conductive rollers 103 , each in contact with the conductive film layer, and the at least two conductive rollers 103 are respectively connected to a power source to pass current into the conductive film layer.

[0306] In some embodiments, the film forming cooling device also includes: at least one auxiliary roller 104 arranged along the circumference of the cooling body 100, at least one auxiliary roller 104 abuts against the film forming substrate 40, and at least one auxiliary roller 104 has an auxiliary magnetic component therein, and the auxiliary magnetic component is constructed to be able to generate a magnetic attraction force on the film forming substrate 40 toward the accommodating cavity 30.

[0307] A substrate conveying mechanism is provided to enable the first film forming mechanism 121 to continuously form a target film layer on the film forming substrate 40 conveyed to the surface of the cooling body. At the same time, the cooling body cools the target film layer on the film forming substrate 40, thereby being able to form a higher quality target film layer on the surface of the longer film forming substrate 40.

[0308] An embodiment of the present application provides a film-forming cooling device. Referring to Figures 3 to 5 and Figures 11 to 19, the film-forming cooling device includes: a cooling body 100 having a receiving cavity 30, the cooling body 100 is used to carry a film-forming substrate 40 and to cool the material attached to the film-forming substrate 40; a magnetic component 101, located in the receiving cavity 30, the magnetic component 101 is configured to generate a magnetic attraction force on the film-forming substrate 40 toward the receiving cavity 30. The cooling body 100 is a cold drum. The film-forming substrate 40 is pre-metallized to form a conductive film layer, and the target film layer can be formed on the conductive film layer.

[0309] The magnetic component 101 includes at least one of an electromagnetic coil 1011 or a permanent magnet.

[0310] When the magnetic component 101 includes an electromagnetic coil 1011, the electromagnetic coil 1011 is spirally wound along the axial direction of the accommodating chamber. The electromagnetic coil 1011 includes a first portion 101a, a second portion 101b, and a third portion 101c, which are arranged in sequence along the axial direction of the accommodating chamber and are independent of each other. The first portion 101a and the third portion 101c are respectively located at the two axial ends of the accommodating chamber. The first portion 101a, the second portion 101b, and the third portion 101c are connected to different power sources.

[0311] In the axial direction of the accommodating cavity, the ratio of the length of the first part 101a to the length of the accommodating cavity 30 can be 0.5~0.8, the ratio of the length of the second part 101b to the length of the accommodating cavity 30 can be 0.1~0.25, and the ratio of the length of the third part 101c to the length of the accommodating cavity 30 can be 0.1~0.25.

[0312] When the magnetic component 101 includes an electromagnetic coil 1011 and a permanent magnet, the permanent magnet has an N pole and an S pole with different polarities, which are respectively located at the two ends of the permanent magnet along the axial direction of the accommodating cavity 30, and at least part of the electromagnetic coil 1011 is spirally wound around the outer periphery of the permanent magnet.

[0313] When the magnetic component 101 only includes a permanent magnet, the permanent magnet has an N pole and an S pole with different polarities. The N pole and the S pole are respectively located at two ends of the permanent magnet along the axial direction of the accommodation cavity 30 .

[0314] The magnetic component 101 extends along the axial direction of the accommodating cavity. In the transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the distance between the geometric center of the magnetic component 101 and the geometric center of the accommodating cavity 30 to the outer diameter of the cold drum is 0 to 1 / 10.

[0315] In a transverse direction perpendicular to the axial direction of the accommodation cavity, the ratio of the thickness of the electromagnetic coil 1011 to the outer diameter of the cooling drum is 1 / 50 to 1 / 4. In some embodiments, the ratio of the thickness of the electromagnetic coil 1011 to the outer diameter of the cooling drum is 1 / 10 to 1 / 4.

[0316] The electromagnetic coil 1011 is formed by a single wire spirally wound along the axial direction of the accommodating cavity, and the diameter of the single wire can be 0.1 mm to 20 mm.

[0317] When the magnetic component 101 includes only the electromagnetic coil 1011, the film forming cooling device further includes a metal member 102 located within the accommodating cavity 30 and extending axially along the accommodating cavity, with at least a portion of the electromagnetic coil 1011 spirally wound around the outer circumference of the metal member 102. The metal member 102 is located within the electromagnetic coil 1011, and in the axial direction of the accommodating cavity, the ratio of the length of the metal member 102 to the length of the electromagnetic coil 1011 is 2 / 3 to 1.1. In a transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the cross-sectional area of ​​the metal member 102 to the area enclosed by the electromagnetic coil 1011 is 2 / 3 to 1.

[0318] The relative magnetic permeability of the metal member 102 is greater than or equal to 10. The material of the metal member 102 can be iron, cobalt, or nickel.

[0319] The film forming and cooling device also includes at least two conductive rollers 103, each in contact with the conductive film layer. The at least two conductive rollers 103 are connected to the positive and negative electrodes of a power source to supply current to the conductive film layer. Insulating sleeves are provided at both ends of the conductive rollers 103 in their extending direction.

[0320] The film-forming cooling device also includes: at least one auxiliary roller 104 arranged along the circumference of the cooling body 100, at least one auxiliary roller 104 abuts against the film-forming substrate 40, and at least one auxiliary roller 104 has an auxiliary magnetic component therein, and the auxiliary magnetic component may also include either an electromagnetic coil or a magnet, and the auxiliary magnetic component is constructed to be able to generate a magnetic attraction force on the film-forming substrate 40 toward the accommodating cavity 30.

[0321] The film forming cooling device further includes: a cooling circuit located in the accommodating chamber 30 , the cooling circuit being located between the inner wall of the accommodating chamber 30 and the magnetic component, and being spirally wound around the outer periphery of the magnetic component along the axial direction of the accommodating chamber.

[0322] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A film forming cooling device, comprising: A cooling body having a receiving cavity, the cooling body being used to carry a film-forming substrate and to cool a material attached to the film-forming substrate, the film-forming substrate being conductive; The magnetic component is located in the accommodating cavity and is configured to generate a magnetic attraction force on the film-forming substrate toward the accommodating cavity.

2. The film forming cooling device according to claim 1, wherein: The magnetic component includes at least one of an electromagnetic coil or a magnet.

3. The film forming cooling device according to claim 2, wherein: The magnetic component includes the electromagnetic coil, which is spirally wound along the axial direction of the accommodating cavity.

4. The film forming cooling device according to claim 3, wherein: The electromagnetic coil includes at least two parts that are arranged axially along the accommodating cavity and are independent of each other. The at least two parts include an adjacent first part and a second part. The second part is closer to the axial end of the accommodating cavity than the first part.

5. The film forming cooling device according to claim 4, wherein: In the axial direction of the accommodating cavity, the length of the first portion is greater than the length of the second portion.

6. The film forming cooling device according to claim 4 or 5, wherein: The at least two parts further include a third part, and the third part is located on a side of the first part away from the second part.

7. The film forming cooling device according to claim 6, wherein: In the axial direction of the accommodating cavity, the length of the first portion is greater than the length of the third portion.

8. The film forming cooling device according to any one of claims 4 to 7, wherein: The at least two parts are connected to different power sources respectively.

9. The film forming cooling device according to any one of claims 3 to 8, wherein: Along the axial direction of the accommodating cavity, the turn density on at least one end of the electromagnetic coil is greater than the turn density in the middle portion, where the turn density is the number of turns of the electromagnetic coil per unit length.

10. The film forming cooling device according to any one of claims 1 to 9, wherein: The magnetic component includes an electromagnetic coil and a magnet. The magnet has two poles with different polarities. The two poles are respectively located at two ends of the magnet along the axial direction of the accommodating cavity. At least part of the electromagnetic coil is spirally wound around the outer circumference of the magnet.

11. The film forming cooling device according to any one of claims 1 to 9, wherein: The magnetic component includes a magnet having two magnetic poles with different polarities, and the two magnetic poles are respectively located at two ends of the magnet along the axial direction of the accommodating cavity.

12. The film forming cooling device according to any one of claims 1 to 11, wherein: The cooling body is annular, the magnetic component extends along the axial direction of the accommodating cavity, and in a transverse direction perpendicular to the axial direction of the accommodating cavity, the ratio of the distance between the geometric center of the magnetic component and the geometric center of the accommodating cavity to the outer diameter of the cooling body is 0 to 1 / 10.

13. The film forming cooling device according to any one of claims 2 to 12, wherein: The cooling body is annular, and in a transverse direction perpendicular to the axial direction of the accommodating cavity, a ratio of the thickness of the electromagnetic coil to the outer diameter of the cooling body is 1 / 50 to 1 / 4.

14. The film forming cooling device according to any one of claims 2 to 13, wherein: The electromagnetic coil is formed by spirally winding a single wire along the axial direction of the accommodating cavity, and the diameter of the single wire is 0.1 mm to 20 mm.

15. The film forming cooling device according to any one of claims 2 to 14, wherein: In the case where the magnetic component includes the electromagnetic coil, the film forming cooling device further includes: The metal piece is located in the accommodating cavity and extends along the axial direction of the accommodating cavity. At least a portion of the electromagnetic coil is spirally wound around the outer periphery of the metal piece.

16. The film forming cooling device according to claim 15, wherein: The metal piece is located in the electromagnetic coil, and in the axial direction of the accommodating cavity, the ratio of the length of the metal piece to the length of the electromagnetic coil is 2 / 3 to 1.

1.

17. The film forming cooling device according to claim 15 or 16, wherein: In a transverse direction perpendicular to the axial direction of the accommodating cavity, a ratio of a cross-sectional area of ​​the metal member to an area enclosed by the electromagnetic coil is 2 / 3 to 1.

18. The film forming cooling device according to any one of claims 15 to 17, wherein: The relative magnetic permeability of the metal part is greater than or equal to 10.

19. The film forming cooling device according to any one of claims 1 to 18, wherein: The film-forming substrate has at least one conductive film layer, and the film-forming cooling device further comprises: At least two conductive rollers are respectively in contact with the conductive film layer, and the at least two conductive rollers are respectively connected to a power source to pass current into the conductive film layer.

20. The film forming cooling device according to any one of claims 1 to 18, wherein: The film forming cooling device further comprises: At least one auxiliary roller is arranged along the circumference of the cooling body, the at least one auxiliary roller abuts against the film-forming substrate, and the at least one auxiliary roller has an auxiliary magnetic component therein, and the auxiliary magnetic component is constructed to be able to generate a magnetic attraction force on the film-forming substrate toward the accommodating cavity.

21. The film forming cooling device according to any one of claims 1 to 20, wherein: Also includes: A cooling circuit is located in the accommodating cavity, and the cooling circuit is located between the inner wall of the accommodating cavity and the magnetic component.

22. The film forming cooling device according to claim 21, wherein: The cooling circuit is spirally wound around the outer circumference of the magnetic component along the axial direction of the accommodating cavity.

23. A film forming device comprising: The film forming cooling device according to any one of claims 1 to 22; The first film forming mechanism is used to form a target film layer on the surface of the film forming substrate carried on the cooling body, and the film forming substrate carried on the cooling body has conductivity.

24. The film forming apparatus according to claim 23, wherein The film-forming substrate includes a substrate and a conductive film layer formed on the substrate, and the device further includes: The second film forming mechanism is used to form the conductive film layer on the substrate.

25. The film forming apparatus according to claim 23 or 24, wherein: Also includes: A substrate transport mechanism is used to transport the film-forming substrate to the cooling body.

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