Flexible circuit board

Abstract

Disclosed in the present utility model is a flexible circuit board, which comprises a first thin-film layer, a substrate layer and a second thin-film layer, which are stacked in sequence, wherein a first conductive layer composed of a first metal wire is bonded to one surface of the substrate layer by means of a first adhesive layer, a second conductive layer composed of a second metal wire is bonded to the other surface of the substrate layer by means of a second adhesive layer, a substrate through hole is formed in a region of the substrate layer between a first wiring area and a second wiring area, a first through hole and a second through hole are respectively formed at the positions of the first thin-film layer and the second thin-film layer that correspond to the substrate through hole, a conductive column is located in the first through hole, the substrate through hole and the second through hole and connected to the first wiring area and the second wiring area, and two ends of the conductive column respectively form a first pad area on the first thin-film layer and a second pad area on the second thin-film layer. The present utility model improves the reliability of signal transmission, and by means of pressing contact and the transmission of peripheral electrical signals, application scenarios are increased and contact resistance is also reduced.

Description

Flexible circuit board TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, especially is related to a flexible circuit board. BACKGROUND

[0002] With the modern society's attention to environmental protection and energy, electric automobile appears along with it. The battery module or electric core in the power battery pack of electric automobile often uses FPC (flexible flat cable) to carry out signal transmission and state monitoring, replaces the original wiring harness scheme. However, the FPC used at present is mainly made by etching process, and the brittleness and poor bendability lead to poor reliability of signal transmission, and cannot meet the demand of press bonding connection. SUMMARY

[0003] The utility model discloses a kind of flexible circuit boards, which improves the reliability of signal transmission, also realizes through press bonding contact and peripheral electrical signal transmission, expands application scene while reducing contact resistance.

[0004] To achieve the above object, the utility model adopts the technical scheme of: a kind of flexible circuit board, including first film layer, substrate layer and second film layer which are sequentially stacked, one surface of the substrate layer is adhered with the first conductive layer formed by first metal wire through first adhesive layer, the other surface of the substrate layer is adhered with the second conductive layer formed by second metal wire through second adhesive layer, the first conductive layer has a plurality of first winding areas formed by first metal wire coiled several turns, the second conductive layer has a plurality of second winding areas formed by second metal wire coiled several turns;

[0005] The first winding area is located directly above the second winding area, the substrate layer is opened in the region between the first winding area and the second winding area with a substrate through hole, the first film layer and the second film layer are respectively opened with first through hole and second through hole in the position corresponding to substrate through hole, a conductive column is located in first through hole, substrate through hole and second through hole and is connected with first winding area, second winding area, and the both ends of the conductive column form first solder pad area and second solder pad area on the first film layer and the second film layer respectively.

[0006] The further improved scheme in the above technical solution is as follows:

[0007] 1. In the above scheme, the substrate layer includes a first substrate layer and a first substrate layer connected by adhesion.

[0008] 2. In the above scheme, it further includes a first electrode and a second electrode, the first electrode is electrically connected with the first solder pad area, and the second electrode is electrically connected with the second solder pad area.

[0009] 3. The scheme, the substrate through hole is located between the center of the first winding area and the center of the second winding area.

[0010] 4. The scheme, the first film layer and the substrate layer are connected through the first adhesive layer.

[0011] 5. The scheme, the substrate layer and the second film layer are connected through the second adhesive layer.

[0012] 6. The scheme, the first metal wire and the second metal wire are copper wire, aluminum wire or aluminum alloy wire.

[0013] Compared with the prior art, the utility model has the following advantages due to the use of the above technical scheme:

[0014] 1. The utility model discloses a flexible circuit board, which has a plurality of first winding areas formed by coiling a plurality of turns of a first metal wire on a first conductive layer, and has a plurality of second winding areas formed by coiling a plurality of turns of a second metal wire on a second conductive layer. A conductive column is located in a first through hole, a substrate through hole and a second through hole and is connected to the first winding area and the second winding area. The two ends of the conductive column form a first pad area and a second pad area on a first film layer and a second film layer respectively. Signals are transmitted simultaneously in the upper and lower layers of the circuit board, improving the reliability of signal transmission of the flexible circuit board. The flexible circuit board also realizes contact with external electrical signal transmission through compression, expands the application scenario, and reduces the contact resistance.

[0015] 2. The utility model discloses a flexible circuit board, which has a first conductive layer composed of a first metal wire on one surface of a substrate layer through a first adhesive layer, and has a second conductive layer composed of a second metal wire on the other surface of the substrate layer through a second adhesive layer. This effectively avoids the signal transmission quality decline caused by the metal wire and the substrate layer falling off, and the conductive layer composed of the metal wire improves the bending performance, thereby further improving the bending resistance and signal transmission stability of the flexible circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural exploded view of the flexible circuit board of the utility model;

[0017] Figure 2 is a structural front view of the flexible circuit board of the utility model;

[0018] Figure 3 is a sectional view of the flexible circuit board of the utility model along the direction of A-A in Figure 2;

[0019] Figure 4 is a sectional view of the flexible circuit board of the utility model along the direction of B-B in Figure 2;

[0020] Figure 5 is a structural exploded view of another embodiment of the flexible circuit board of the utility model.

[0021] In the above figures: 1, substrate layer; 101, first substrate layer; 102, first substrate layer; 2, first film layer; 3, second film layer; 4, first adhesive layer; 5, second adhesive layer; 6, first metal wire; 7, second metal wire; 8, first conductive layer; 9, second conductive layer; 10, first winding area; 11, second winding area; 12, substrate through hole; 13, first through hole; 14, second through hole; 15, conductive column; 16, first pad area; 17, second pad area. DETAILED DESCRIPTION

[0022] The patent can be further clearly understood through the specific examples given below, but they are not a limitation of the patent.

[0023] Example 1: A flexible circuit board, comprising a first film layer 2, a substrate layer 1 and a second film layer 3 stacked in turn, one surface of the substrate layer 1 is bonded with a first conductive layer 8 composed of first metal wires 6 through a first adhesive layer 4, the other surface of the substrate layer 1 is bonded with a second conductive layer 9 composed of second metal wires 7 through a second adhesive layer 5, the first conductive layer 8 has a plurality of first winding areas 10 formed by winding the first metal wires 6 a plurality of times, and the second conductive layer 9 has a plurality of second winding areas 11 formed by winding the second metal wires 7 a plurality of times;

[0024] The first winding area 10 is directly above the second winding area 11, the substrate layer 1 has a substrate through hole 12 in the area between the first winding area 10 and the second winding area 11, the first film layer 2 and the second film layer 3 respectively have a first through hole 13 and a second through hole 14 corresponding to the substrate through hole 12, a conductive column 15 is located in the first through hole 13, the substrate through hole 12 and the second through hole 14 and connected with the first winding area 10 and the second winding area 11, and the two ends of the conductive column 15 form a first pad area 16 and a second pad area 17 on the first film layer 2 and the second film layer 3 respectively.

[0025] As shown in Figure 3, the above-mentioned substrate layer 1 includes a first substrate layer 101 and a first substrate layer 102 connected by bonding;

[0026] It also includes a first electrode and a second electrode, the first electrode is electrically connected with the first pad area 16, and the second electrode is electrically connected with the second pad area 17, so as to realize electrical signal transmission with the outside (such as a battery module) through up-down pressing contact, expand the application scenario, and also reduce the contact resistance;

[0027] The above-mentioned substrate through hole 12 is located between the center of the first winding area 10 and the center of the second winding area 11;

[0028] The above-mentioned first metal wire 6 and second metal wire 7 are copper wires.

[0029] Embodiment 2: a flexible circuit board, comprising a first film layer 2, a substrate layer 1 and a second film layer 3 which are stacked in sequence, one surface of the substrate layer 1 is bonded with a first conductive layer 8 composed of first metal wires 6 through a first adhesive layer 4, the other surface of the substrate layer 1 is bonded with a second conductive layer 9 composed of second metal wires 7 through a second adhesive layer 5, the first conductive layer 8 has a plurality of first winding areas 10 formed by winding the first metal wires 6 for several turns, the second conductive layer 9 has a plurality of second winding areas 11 formed by winding the second metal wires 7 for several turns;

[0030] The first winding area 10 is directly above the second winding area 11, the substrate layer 1 is provided with a substrate through hole 12 in the area between the first winding area 10 and the second winding area 11, the first film layer 2 and the second film layer 3 are respectively provided with a first through hole 13 and a second through hole 14 at the positions corresponding to the substrate through hole 12, a conductive column 15 is located in the first through hole 13, the substrate through hole 12 and the second through hole 14 and is connected with the first winding area 10 and the second winding area 11, and the two ends of the conductive column 15 form a first pad area 16 and a second pad area 17 on the first film layer 2 and the second film layer 3 respectively.

[0031] The first film layer 2 and the substrate layer 1 are connected through the first adhesive layer 4, and the substrate layer 1 and the second film layer 3 are connected through the second adhesive layer 5.

[0032] The first metal wires 6 and the second metal wires 7 are aluminum alloy wires.

[0033] When the above flexible circuit board is used, signals are transmitted in the upper and lower layers of the circuit board at the same time, the reliability of signal transmission of the flexible circuit board is improved, the flexible circuit board is also realized to be connected with external electrical signals through pressure contact, the application scene is expanded, and the contact resistance is also reduced.

[0034] In addition, the signal transmission quality caused by the falling of the metal wires and the substrate layer is effectively avoided, the conductive layer composed of the metal wires improves the bending performance, and the folding resistance and the stability of signal transmission of the flexible circuit board are further improved.

[0035] The above embodiment is only for illustrating the technical concept and characteristics of the utility model, the purpose is to enable people skilled in the art to understand the content of the utility model and implement it, and cannot limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit and essence of the utility model shall be covered within the protection scope of the utility model.

Claims

1. A flexible circuit board, characterized in that: The invention comprises a first film layer (2), a substrate layer (1) and a second film layer (3) stacked in sequence, wherein a first conductive layer (8) composed of a first metal wire (6) is bonded to one surface of the substrate layer (1) via a first adhesive layer (4), and a second conductive layer (9) composed of a second metal wire (7) is bonded to the other surface of the substrate layer (1) via a second adhesive layer (5), the first conductive layer (8) has a plurality of first winding areas (10) formed by winding the first metal wire (6) a plurality of turns, and the second conductive layer (9) has a plurality of second winding areas (11) formed by winding the second metal wire (7) a plurality of turns; The first winding area (10) is located directly above the second winding area (11); a substrate through hole (12) is provided in the area of ​​the substrate layer (1) between the first winding area (10) and the second winding area (11); a first through hole (13) and a second through hole (14) are provided in the first film layer (2) and the second film layer (3) at positions corresponding to the substrate through hole (12); a conductive column (15) is located in the first through hole (13), the substrate through hole (12) and the second through hole (14) and is connected to the first winding area (10) and the second winding area (11); two ends of the conductive column (15) form a first pad area (16) and a second pad area (17) on the first film layer (2) and the second film layer (3), respectively.

2. The flexible circuit board according to claim 1, wherein: The substrate layer (1) comprises a first substrate layer (101) and a second substrate layer (102) that are adhesively connected.

3. The flexible circuit board according to claim 1, wherein: It also includes a first electrode and a second electrode, wherein the first electrode is electrically connected to the first pad area (16), and the second electrode is electrically connected to the second pad area (17).

4. The flexible circuit board according to claim 1, wherein: The substrate through hole (12) is located between the center of the first winding area (10) and the center of the second winding area (11).

5. The flexible circuit board according to claim 1, wherein: The first film layer (2) and the substrate layer (1) are connected via a first adhesive layer (4).

6. The flexible circuit board according to claim 1, wherein: The substrate layer (1) and the second film layer (3) are connected via a second adhesive layer (5).

7. The flexible circuit board according to claim 1, wherein: The first metal wire (6) and the second metal wire (7) are copper wires, aluminum wires or aluminum alloy wires.

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