Flexible electrical connection structure

By designing a three-layer structure and winding area on the flexible circuit board, signals can be transmitted simultaneously on the upper and lower layers, solving the problems of complex processing and poor signal reliability of existing flexible circuit boards, and improving the reliability of signal transmission and bending resistance.

WO2025213804A1PCT designated stage Publication Date: 2025-10-16CHANGZHOU FLEXCIRCUITS TECHNOLOGIES CO LTD
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Patent Information

Application Number
PCT/CN2024/137724
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-11
Filing Date
2024-12-09
Publication Date
2025-10-16

AI Technical Summary

Technical Problem

Existing flexible circuit boards are complex to manufacture, costly, and have poor signal transmission reliability, with limited connection methods, making it difficult to meet the signal transmission needs of new energy vehicles.

Method used

The flexible electrical connection structure adopts a three-layer structure, including a first thin film layer, a substrate layer, and a second thin film layer. A conductive layer is formed by bonding metal wires with an adhesive layer. A winding area and through holes are set in the substrate layer to embed pin terminals. Signal transmission is achieved by using conductive solder paste pillars.

Benefits of technology

It improves the reliability and stability of signal transmission, reduces contact resistance, expands application scenarios, and enhances the bending resistance of flexible electrical connection structures.

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    Figure CN2024137724_16102025_PF_FP_ABST
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Abstract

A flexible electrical connection structure, comprising a first thin film layer (2), a substrate layer (1), and a second thin film layer (3) which are stacked in sequence. A first conductive layer (8) formed by a first metal wire (6) is bonded to one surface of the substrate layer by means of a first adhesive layer (4), and a second conductive layer formed by a second metal wire is bonded to the other surface of the substrate layer by means of a second adhesive layer; a substrate through hole (12) is formed in an area, located between a first winding area (10) and a second winding area (11), of the substrate layer; a first through hole (13) and a second through hole (14) are respectively formed at the positions of the first thin film layer and the second thin film layer corresponding to the substrate through hole; a pin terminal (16) is embedded into the first through hole, the first winding area, the substrate through hole, the second winding area, and the second through hole; and a conductive solder paste column (15) is located between the space between the pin terminal and the first through hole, the first winding area, the substrate through hole, the second winding area and the second through hole. The present flexible electrical connection structure enables electrical signal transmission to a peripheral by means of a pin, thereby expanding the application scenario, and reducing contact resistance.
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Description

Flexible electrical connection structure TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially is related to a flexible electrical connection structure. BACKGROUND

[0002] With the global energy crisis is increasingly serious, oil price rises unceasingly, new energy vehicle is paid more and more attention by the society, and the development of new energy vehicle becomes one of the main directions of the automobile industry development in recent years, especially electric vehicle. The power source of electric vehicle mainly is power battery pack, and the power battery pack generally includes battery module and sampling circuit, in order to regular and simplify the wiring harness of sampling circuit, the flexible circuit board integrated with a large number of wiring harnesses is generally used as sampling circuit. However, the current flexible circuit board is mainly made by etching process, and the process is complex, the processing cost is high, the connection mode is single, and the reliability of signal transmission is poor. SUMMARY

[0003] The utility model discloses a kind of flexible electrical connection structure, which can transmit signals in upper and lower two layers simultaneously, improve the reliability of signal transmission, also realize through pin and peripheral electrical signal transmission, expand application scenario, and also reduce contact resistance.

[0004] To achieve the above object, the utility model adopts the technical scheme of: a kind of flexible electrical connection structure, including first film layer, substrate layer and second film layer which are sequentially stacked, one surface of the substrate layer is adhered with the first conductive layer formed by the first metal wire through the first adhesive layer, the other surface of the substrate layer is adhered with the second conductive layer formed by the second metal wire through the second adhesive layer, the first conductive layer has a plurality of first winding areas formed by the first metal wire coiled a plurality of turns, the second conductive layer has a plurality of second winding areas formed by the second metal wire coiled a plurality of turns;

[0005] The first winding area is located directly above the second winding area, the substrate layer is opened in the region between the first winding area and the second winding area A substrate through hole, the first film layer and the second film layer are opened with first through hole and second through hole respectively at the positions corresponding to the substrate through hole, a pin terminal is embedded in the first through hole, the first winding area, the substrate through hole, the second winding area and the second through hole, and a conductive solder paste column is located between the pin terminal and the first through hole, the first winding area, the substrate through hole, the second winding area and the second through hole.

[0006] The further improved scheme in the above technical solution is as follows:

[0007] 1、In the above scheme, the substrate through hole is located between the center of the first winding area and the center of the second winding area.

[0008] 2. The base material through hole has the diameter smaller than the diameter of the first through hole and the second through hole in the scheme.

[0009] 3. The number of the coil of the first winding area is 3-8 in the scheme.

[0010] 4. The number of the coil of the second winding area is 3-8 in the scheme.

[0011] 5. The first film layer, the base material layer and the second film layer are PET film, PBT film or PI film in the scheme.

[0012] 6. The first metal wire and the second metal wire are copper wire, aluminum wire or aluminum alloy wire in the scheme.

[0013] The utility model discloses the following advantages compared with the prior art due to the use of the above technical scheme:

[0014] 1. The flexible electric connection structure has a plurality of first winding areas formed by the first metal wire coiling a plurality of turns on the first conductive layer, a plurality of second winding areas formed by the second metal wire coiling a plurality of turns on the second conductive layer, and a pin terminal embedded in the first through hole, the first winding area, the base material through hole, the second winding area and the second through hole. A conductive solder paste column is located between the pin terminal and the first through hole, the first winding area, the base material through hole, the second winding area and the second through hole. Signals are transmitted simultaneously in the upper and lower layers of the circuit board, improving the reliability of signal transmission of the flexible electric connection structure. The flexible electric connection structure also realizes signal transmission with the periphery through the pin, expands the application scenario, and reduces the contact resistance.

[0015] 2. The flexible electric connection structure has a first conductive layer composed of a first metal wire adhered to one surface of the base material layer through a first adhesive layer, and a second conductive layer composed of a second metal wire adhered to the other surface of the base material layer through a second adhesive layer. This effectively avoids the signal transmission quality decline caused by the metal wire and the base material layer falling off, and the conductive layer composed of the metal wire improves the bending performance, thereby further improving the bending resistance and signal transmission stability of the flexible electric connection structure. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural exploded view of the flexible electric connection structure of the utility model;

[0017] Figure 2 is a structural front view of the flexible electric connection structure of the utility model;

[0018] Figure 3 is a cross-sectional view of the flexible electric connection structure along the A-A direction in Figure 2;

[0019] Fig. 4 is a sectional view of the flexible electric connection structure along the direction of B-B in Fig. 2.

[0020] In the above drawings: 1, base material layer; 2, first film layer; 3, second film layer; 4, first adhesive layer; 5, second adhesive layer; 6, first metal wire; 7, second metal wire; 8, first conductive layer; 9, second conductive layer; 10, first winding area; 11, second winding area; 12, base material through hole; 13, first through hole; 14, second through hole; 15, conductive solder paste column; 16, pin terminal. DETAILED DESCRIPTION

[0021] The patent can be further clearly understood through the specific embodiments given below, but they are not a limitation of the patent.

[0022] Embodiment 1: A flexible electric connection structure, comprising a first film layer 2, a base material layer 1, and a second film layer 3 stacked in sequence, one surface of the base material layer 1 is bonded with a first conductive layer 8 composed of first metal wires 6 through a first adhesive layer 4, the other surface of the base material layer 1 is bonded with a second conductive layer 9 composed of second metal wires 7 through a second adhesive layer 5, the first conductive layer 8 has a plurality of first winding areas 10 formed by winding the first metal wires 6 for several turns, and the second conductive layer 9 has a plurality of second winding areas 11 formed by winding the second metal wires 7 for several turns.

[0023] The first winding area 10 is located directly above the second winding area 11, the base material layer 1 has a base material through hole 12 in the area between the first winding area 10 and the second winding area 11, the first film layer 2 and the second film layer 3 respectively have a first through hole 13 and a second through hole 14 corresponding to the base material through hole 12, a pin terminal 16 is embedded in the first through hole 13, the first winding area 10, the base material through hole 12, the second winding area 11, and the second through hole 14, and a conductive solder paste column 15 is located between the pin terminal 16 and the first through hole 13, the first winding area 10, the base material through hole 12, the second winding area 11, and the second through hole 14.

[0024] The above-mentioned base material through hole 12 is located between the center of the first winding area 10 and the center of the second winding area 11;

[0025] As shown in Fig. 1, the diameter of the above-mentioned base material through hole 12 is smaller than the diameter of the first through hole 13 and the second through hole 14;

[0026] The above-mentioned first winding area 10 has 4 turns, and the above-mentioned second winding area 11 has 4 turns;

[0027] The above-mentioned first film layer 2, the base material layer 1, and the second film layer 3 are PET films; and the above-mentioned first metal wire 6 and the second metal wire 7 are copper wires.

[0028] Embodiment 2: A flexible electrical connection structure, comprising a first film layer 2, a substrate layer 1 and a second film layer 3 stacked in sequence, one surface of the substrate layer 1 is bonded with a first conductive layer 8 composed of first metal wires 6 through a first adhesive layer 4, the other surface of the substrate layer 1 is bonded with a second conductive layer 9 composed of second metal wires 7 through a second adhesive layer 5, the first conductive layer 8 has a plurality of first winding areas 10 formed by winding the first metal wires 6 for several turns, and the second conductive layer 9 has a plurality of second winding areas 11 formed by winding the second metal wires 7 for several turns;

[0029] The first winding area 10 is directly above the second winding area 11, the substrate layer 1 is provided with a substrate through hole 12 in the area between the first winding area 10 and the second winding area 11, the first film layer 2 and the second film layer 3 are respectively provided with a first through hole 13 and a second through hole 14 at positions corresponding to the substrate through hole 12, a pin terminal 16 is embedded in the first through hole 13, the first winding area 10, the substrate through hole 12, the second winding area 11 and the second through hole 14, and a conductive solder paste column 15 is located between the pin terminal 16 and the first through hole 13, the first winding area 10, the substrate through hole 12, the second winding area 11 and the second through hole 14.

[0030] The number of turns of the first winding area 10 is 7, and the number of turns of the second winding area 11 is 7.

[0031] The first film layer 2, the substrate layer 1 and the second film layer 3 are PI films, and the first metal wires 6 and the second metal wires 7 are aluminum alloy wires.

[0032] When the flexible electrical connection structure is used, it can transmit signals in the upper and lower layers of the circuit board at the same time, improve the reliability of signal transmission of the flexible electrical connection structure, realize the transmission of peripheral electrical signals through the pin of the flexible electrical connection structure, expand the application scenarios, and reduce the contact resistance.

[0033] In addition, it effectively avoids the signal transmission quality decline caused by the falling of the metal wires and the substrate layer, and the conductive layer composed of metal wires improves the bending performance, thereby further improving the bending resistance and signal transmission stability of the flexible electrical connection structure.

[0034] The above embodiment is only for illustrating the technical concept and characteristics of the present application, and its purpose is to enable those skilled in the art to understand the content of the present application and implement it, and it cannot limit the protection scope of the present application. Any equivalent changes or modifications made in accordance with the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A flexible electrical connection structure, characterized in that: The invention comprises a first film layer (2), a substrate layer (1), and a second film layer (3) stacked in sequence, wherein a first conductive layer (8) composed of a first metal wire (6) is bonded to one surface of the substrate layer (1) via a first adhesive layer (4), and a second conductive layer (9) composed of a second metal wire (7) is bonded to the other surface of the substrate layer (1) via a second adhesive layer (5), the first conductive layer (8) has a plurality of first winding areas (10) formed by winding the first metal wire (6) a plurality of turns, and the second conductive layer (9) has a plurality of second winding areas (11) formed by winding the second metal wire (7) a plurality of turns; The first winding area (10) is located directly above the second winding area (11); a substrate through hole (12) is provided in the area of ​​the substrate layer (1) between the first winding area (10) and the second winding area (11); a first through hole (13) and a second through hole (14) are provided in the first film layer (2) and the second film layer (3) at positions corresponding to the substrate through hole (12); a pin terminal (16) is embedded in the first through hole (13), the first winding area (10), the substrate through hole (12), the second winding area (11) and the second through hole (14); and a conductive solder paste column (15) is located between the pin terminal (16) and the first through hole (13), the first winding area (10), the substrate through hole (12), the second winding area (11) and the second through hole (14).

2. The flexible electrical connection structure according to claim 1, wherein: The substrate through hole (12) is located between the center of the first winding area (10) and the center of the second winding area (11).

3. The flexible electrical connection structure according to claim 1, wherein: The diameter of the substrate through hole (12) is smaller than the diameters of the first through hole (13) and the second through hole (14).

4. The flexible electrical connection structure according to claim 1, wherein: The number of turns of the first winding area (10) is 3 to 8.

5. The flexible electrical connection structure according to claim 1, wherein: The number of turns of the second winding area (11) is 3 to 8 turns.

6. The flexible electrical connection structure according to claim 1, wherein: The first film layer (2), the substrate layer (1), and the second film layer (3) are PET films, PBT films, or PI films.

7. The flexible electrical connection structure according to claim 1, wherein: The first metal wire (6) and the second metal wire (7) are copper wires, aluminum wires or aluminum alloy wires.

Citation Information

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